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WO2024193247A1 - 一种电路板组件及电子设备 - Google Patents

一种电路板组件及电子设备 Download PDF

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Publication number
WO2024193247A1
WO2024193247A1 PCT/CN2024/075686 CN2024075686W WO2024193247A1 WO 2024193247 A1 WO2024193247 A1 WO 2024193247A1 CN 2024075686 W CN2024075686 W CN 2024075686W WO 2024193247 A1 WO2024193247 A1 WO 2024193247A1
Authority
WO
WIPO (PCT)
Prior art keywords
circuit board
main body
board assembly
connection
protective film
Prior art date
Application number
PCT/CN2024/075686
Other languages
English (en)
French (fr)
Inventor
朱思齐
李恒
章心怡
Original Assignee
华为技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 华为技术有限公司 filed Critical 华为技术有限公司
Publication of WO2024193247A1 publication Critical patent/WO2024193247A1/zh

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Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/18—Packaging or power distribution
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure

Definitions

  • the present application relates to the technical field of electronic products, and in particular to a circuit board assembly and an electronic device.
  • Circuit boards are commonly used components in electronic devices.
  • the base of the circuit board is provided with exposed copper for electrical connection with electronic devices. Since the exposed copper is prone to rust, etc., it is usually necessary to treat the surface of the circuit board and plate the exposed copper with gold, but this method is costly.
  • the present application provides a circuit board assembly and an electronic device, which are used to protect the circuit board and reduce the cost.
  • circuit board assembly comprising:
  • a main body a surface of which is provided with a connection end
  • a connecting portion the connecting portion being mounted on the main body and being used for electrically connecting to an electrical connector
  • the main body is provided with a protective film, the protective film covers a portion of the connecting end, the connecting portion is a metal part, and the connecting portion is electrically connected to a portion of the connecting end that is not covered by the protective film.
  • connection end By providing a protective film, the connection end can be protected, reducing the possibility of rust on the connection end, which is beneficial to improving the stability of the circuit board assembly and extending the service life.
  • the connection of the connector to the connection end not covered by the protective film can reduce the impact of the protective film on the stability of the electrical connection between the connection part and the connection end.
  • the connection part can also increase the connection area between the electrical connector and the circuit board, which is beneficial to improving the stability of the electrical connection.
  • the cost of using a protective film is lower and more in line with actual use needs.
  • connection portion is electrically connected to the connection end through surface mounting technology.
  • This design allows the connector to be welded to the connection end. Compared with bonding, welding has better electrical connection performance, is more stable, and has a longer service life, which can help further improve the stability of the electrical connection.
  • the SMT process has the advantages of higher assembly density, better reliability, and lower cost. It is also convenient for automated production, which is conducive to improving production efficiency and is more in line with actual usage needs.
  • a projection area of the connecting portion is larger than a projection area of the electrical connector.
  • Such a design can reduce the relative position accuracy requirements between the connecting portion and the electrical connector, thereby helping to reduce assembly difficulty and improve processing efficiency.
  • a projection area of the connection portion is m, and 12 square millimeters ⁇ m ⁇ 30 square millimeters.
  • This approach can provide the connecting portion with a relatively sufficient connection area for connecting with the electrical connector.
  • the connecting portion includes a main body portion and a supporting portion that are connected to each other, the main body portion is used to be electrically connected to the electrical connector, the supporting portion is electrically connected to the connecting end, and there is a spacing between the main body portion and the main body portion along the thickness direction of the circuit board assembly.
  • Such a design can reduce the space occupied by the connecting part on the circuit board.
  • the position between the main body part and the main body part can be used to set up electronic devices and/or wiring, which is beneficial to save space of the circuit board assembly and better meet actual usage needs.
  • the distance between the body portion and the main body portion is n, and 0.5 mm ⁇ n ⁇ 1.5 mm.
  • Such a design can ensure that there is enough space between the main body and the body for wiring and/or setting up electronic devices, thereby improving the space utilization of the main body and better meeting actual usage requirements.
  • the connecting portion includes a plurality of the supporting portions, and the supporting portions are arranged at intervals along the circumference of the main body.
  • Such a design can improve the stability of the connection between the connecting part and the main body, thereby reducing the possibility of the connecting part tilting or falling off from the main body, which is more in line with actual usage requirements.
  • the protective film is an organic solderability protection film.
  • An organic film is formed on the surface of copper by chemical means, which has hot spots such as anti-oxidation, heat shock resistance, and corrosion resistance, and can be used to protect copper to reduce the possibility of rust on the copper surface in a normal environment.
  • the organic film can be removed by flux, so that the copper surface can be exposed to reduce the impact of the protective film on the welding of the connection end and the connection part, so that the copper surface of the connection end can be combined with the molten solder in a shorter time to form a more solid solder joint, so that the connection part and the connection end have a higher connection stability.
  • the present application also provides an electronic device, which includes the circuit board assembly described in any one of the above items.
  • the electronic device includes a screen assembly and an electrical connector, and the screen assembly is electrically connected to the connecting portion of the circuit board assembly via the electrical connector.
  • Such a design can improve the stability of the electrical connection between the screen assembly and the circuit board assembly.
  • the electrical connector is conductive foam.
  • the screen assembly can be electrically connected to the connection part through the conductive foam, and then electrically connected to the connection end of the circuit board.
  • the conductive foam can play the role of shock absorption, buffering, and pressure reduction, thereby reducing the possibility of damage to the screen assembly and the circuit board assembly, which is conducive to extending the service life of the two.
  • the conductive foam is elastic, and the restoring force generated when it is deformed can act on the circuit board and the screen assembly, thereby improving the stability of the connection between the two, which is more in line with actual usage needs.
  • the present application provides a circuit board assembly and an electronic device, wherein the circuit board assembly includes a main body and a connecting part, the connecting part is a metal part for mounting an electrical connector, the main body is provided with a protective film and a connecting end, the protective film covers part of the connecting end, and the connecting part is electrically connected to the connecting end not covered by the protective film.
  • the circuit board assembly includes a main body and a connecting part
  • the connecting part is a metal part for mounting an electrical connector
  • the main body is provided with a protective film and a connecting end
  • the protective film covers part of the connecting end
  • the connecting part is electrically connected to the connecting end not covered by the protective film.
  • FIG1 is a schematic diagram of a first embodiment of a circuit board assembly provided by the present application.
  • FIG2 is a schematic diagram of a second embodiment of a circuit board assembly provided by the present application.
  • FIG. 3 is a schematic diagram of a third embodiment of a circuit board assembly provided in the present application.
  • Circuit boards are important components of electronic devices.
  • Circuit boards include a substrate and exposed copper for electrical connection with electronic devices.
  • Each electronic device can be integrated into the circuit board to achieve electrical connection, grounding and other operations.
  • the circuit board can be treated with an electroless nickel/immersion gold (ENIG) process, and a layer of nickel alloy is wrapped on the surface of the copper to reduce the possibility of rust and other conditions on the exposed copper during use.
  • ENIG electroless nickel/immersion gold
  • the processing steps of the nickel-gold process include immersion plating electrolyte, which will dissolve nickel during the immersion process. If the dissolution reaction is not controlled, it will affect the performance of the circuit board surface treatment.
  • conductive silicone can also be installed on the surface of the circuit board to achieve the electrical connection function through conductive silicone.
  • the surface layer of the conductive silicone includes metal materials such as gold, nickel, and copper, which are used as a medium to achieve the conductive function, and the silicone body with high temperature resistance is used as an elastic material.
  • the conductive silicone can be bonded to the exposed copper of the circuit board through an adhesive such as silicone glue. When the circuit board is connected to the antenna waiting for the connection object, the silicone body can be used to provide resilience. By compression, etc.
  • the conductive silicone is deformed in a certain way, and the resilience generated by the deformation can act on the circuit board and the object to be connected, thereby improving the stability of the connection between the two.
  • the conductive material uses the elasticity of the conductive silicone to provide resilience to enable the conductive silicone to electrically connect the antenna to the object to be connected. When in use, it is used as an electromagnetic interference (EMI) shielding ground.
  • EMI electromagnetic interference
  • the conductive silicone can also play a buffering role, reducing the possibility of damage to the circuit board and electronic devices due to external impact.
  • the conductive silicone will have problems such as relaxation and aging under long-term compression.
  • the electronic devices will generate heat when working, causing the ambient temperature of the conductive silicone to increase, which is easy to aggravate the aging degree of the conductive silicone, and stress relaxation and other phenomena will occur, and then it is easy to have poor contact and other situations, which will affect the connection stability and the performance of the electronic devices connected to the circuit board.
  • the conductive silicone is installed on the circuit board by bonding. When the adhesive is aged, it will also affect the stability of the connection between the object to be connected and the circuit board, thereby affecting the antenna's signal reception and transmission, electromagnetic compatibility (EMC), electromagnetic interference and other performances.
  • EMC electromagnetic compatibility
  • an embodiment of the present application provides a circuit board assembly and an electronic device for protecting the circuit board assembly and improving the reliability of electrical connection.
  • an embodiment of the present application provides a circuit board assembly, wherein the circuit board assembly includes a main body 1 and a connecting portion 2.
  • the main body 1 may be a printed circuit board (PCB).
  • the main body 1 may have a substrate, and the substrate is provided with a connecting end 12.
  • the connecting portion 2 is mounted on the main body 1 for electrically connecting to an electrical connector 3.
  • the electrical connector 3 may be an electrical connecting auxiliary material such as conductive foam, and the connecting end 12 may be exposed copper of the circuit board assembly.
  • the main body 1 is provided with a protective film (not shown in the figure), part of the connecting end 12 is covered by the protective film, and part of the connecting end 12 is not covered by the protective film.
  • the connecting portion 2 is a metal part, and the connecting portion 2 is electrically connected to the connecting end 12 not covered by the protective film.
  • connection end 12 By providing a protective film, the connection end 12 can be protected, and the possibility of rusting of the connection end 12 can be reduced, which is beneficial to improving the stability of the circuit board assembly and extending the service life.
  • the protective film due to the poor impedance of the protective film, when the electrical connector 3 is installed on the main body 1 by bonding or other methods, the protective film will affect the stability of the electrical connection between the electrical connector 3 and the connection end 12. Therefore, in the solution provided by the embodiment of the present application, the connection part 2 is connected to the connection end 12 not covered by the protective film, which can reduce the influence of the protective film on the stability of the electrical connection between the connection part 2 and the connection end 12, and further reduce the influence of the protective film on the stability of the electrical connection between the electrical connector 3 and the circuit board assembly.
  • connection part 2 can also increase the connection area between the electrical connector 3 and the circuit board, which is beneficial to improving the stability of the electrical connection.
  • the cost of using a protective film is lower and more in line with actual use requirements.
  • the connecting portion 2 is electrically connected to the connecting end 12 through surface mounted technology (SMT).
  • SMT surface mounted technology
  • the connector can be welded to the connection end 12.
  • the welding electrical connection performance is better, more stable, and has a longer service life, which can help to further improve the stability of the electrical connection.
  • the SMT process has the advantages of high assembly density, good reliability, and low cost, and is also convenient for automated production, which is conducive to improving production efficiency and more in line with actual use needs.
  • a projection area of the connecting portion 2 is larger than a projection area of the electrical connector 3 .
  • Such a design can reduce the relative position accuracy requirement between the connecting portion 2 and the electrical connector 3, and enable the connecting portion 2 to have a sufficient area for connection with the electrical connector 3, thereby helping to reduce assembly difficulty and improve processing efficiency.
  • a projection area of the connection portion 2 is m, and 12 square millimeters ⁇ m ⁇ 30 square millimeters.
  • connection portion 2 can be 12 square millimeters, 16 square millimeters, 22 square millimeters, 26 square millimeters, 30 square millimeters, etc. This way can make the connection portion 2 have a relatively sufficient connection area for connecting with the electrical connector 3.
  • the connecting portion 2 may be a rectangular sheet structure with a length of 3 mm and a width of 4 mm, or a rectangular sheet structure with a length of 5 mm and a width of 5 mm, or a rectangular sheet structure with a length of 6 mm and a width of 5 mm.
  • the actual size and actual structure of the connecting portion 2 may be set according to actual needs.
  • the connecting portion 2 includes a main body portion 21 and a supporting portion 22 that are connected to each other, wherein the main body portion 21 is used to be electrically connected to the electrical connector 3, and the supporting portion 22 is used to be electrically connected to the connecting end 12, and along the thickness direction of the circuit board assembly, there is a spacing between the main body portion 21 and the main body portion 1.
  • Such a design can reduce the space occupied by the connecting part 2 on the circuit board.
  • the position between the main body 21 and the main body 1 can be used to set the electronic device 4 and/or the wiring 11, which is beneficial to save the space of the circuit board assembly and better meet the actual usage requirements.
  • the distance between the body portion 21 and the main body portion 1 is n, and n satisfies: 0.5 mm ⁇ n ⁇ 1.5 mm.
  • the distance between the main body 21 and the main body 1 can be 0.5 mm, 0.7 mm, 0.9 mm, 1.1 mm, 1.3 mm, 1.5 mm, etc. Through such a design, there can be enough space between the main body 1 and the main body 21 for routing the wires 11 and/or setting the electronic device 4, thereby improving the space utilization of the main body 1 and better meeting the actual use requirements.
  • the connecting portion 2 includes a plurality of supporting portions 22 , and the supporting portions 22 are arranged at intervals along the circumference of the main body portion 21 .
  • Such a design can improve the stability of the connection between the connecting portion 2 and the main body 1, thereby reducing the possibility of the connecting portion 2 tilting or falling off from the main body 1, which is more in line with actual usage requirements.
  • the protective film is an organic solderability protection film.
  • the circuit board can be surface treated by an organic solderability preservatives (OSP) process, which forms an organic film on the copper surface by chemical means.
  • the film has hot spots such as anti-oxidation, heat shock resistance, and corrosion resistance, and can be used to protect copper to reduce the possibility of rust on the copper surface in a normal environment.
  • the organic film can be removed by flux, so that the copper surface can be exposed to reduce the influence of the protective film on the welding of the connection terminal 12 and the connection part 2, so that the copper surface of the connection terminal 12 can be combined with the molten solder in a shorter time to form a more solid solder joint, so that the connection part 2 and the connection terminal 12 have a higher connection stability.
  • a protective film can be first generated on the surface of the main body 1.
  • the protective film located at the connection position between the connecting terminal 12 and the connecting part 2 can be melted, so that the connecting part 2 can directly contact and weld with the connecting terminal 12. This not only helps to reduce the impact of the protective film on the stability of the electrical connection between the connecting part 2 and the connecting terminal 12, but also when setting the protective film, all the connecting terminals 12 can be covered first.
  • the protective film in the corresponding area is melted, which can reduce the possibility of exposure of the connecting terminals 12 at other positions, thereby helping to enhance the protective effect of the protective film on the connecting terminal 12, which is more in line with actual usage requirements.
  • an embodiment of the present application further provides an electronic device, wherein the electronic device includes the circuit board assembly involved in any of the above embodiments. Since the circuit board assembly has the above technical effects, the electronic device including the circuit board assembly also has the corresponding technical effects, which will not be repeated here.
  • the electronic device may be a mobile phone, a tablet computer, a laptop computer, etc.
  • the electronic device includes a screen assembly and an electrical connector 3 , and the screen assembly is electrically connected to the connection portion 2 of the circuit board assembly through the electrical connector 3 .
  • This design can improve the stability of the electrical connection between the screen assembly and the circuit board assembly, and is more in line with actual usage needs.
  • the electrical connector 3 may be conductive foam.
  • the screen assembly can be electrically connected to the connection part 2 through the conductive foam, and then electrically connected to the connection end 12 of the circuit board.
  • the conductive foam can play the role of shock absorption, buffering, and pressure reduction, thereby reducing the possibility of damage to the screen assembly and the circuit board assembly, thereby helping to extend the service life of the two.
  • the conductive foam is elastic, and the restoring force generated when it is deformed can act on the circuit board and the screen assembly, thereby improving the stability of the connection between the two, which is more in line with actual usage requirements.
  • the embodiment of the present application provides a circuit board assembly and an electronic device, wherein the circuit board assembly includes a main body 1 and a connecting part 2, the connecting part 2 is a metal part for mounting an electrical connector 3, the main body 1 is provided with a protective film and a connecting end 12, the protective film covers a part of the connecting end 12, and the connecting part 2 is electrically connected to the connecting end 12 not covered by the protective film.
  • the circuit board assembly includes a main body 1 and a connecting part 2, the connecting part 2 is a metal part for mounting an electrical connector 3, the main body 1 is provided with a protective film and a connecting end 12, the protective film covers a part of the connecting end 12, and the connecting part 2 is electrically connected to the connecting end 12 not covered by the protective film.
  • Such a design can protect the connecting end 12 and is conducive to improving the electrical connection stability between the circuit board and the connecting end 12.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Signal Processing (AREA)
  • Power Engineering (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)

Abstract

本申请涉及一种电路板组件和电子设备，其中，电路板组件包括主体部和连接部，连接部为金属件，用于安装电连接件，主体部设置有保护膜和连接端，保护膜覆盖部分连接端，连接部与未被保护膜覆盖的连接端电性连接。通过这样的设计能够对连接端进行保护，并有利于提升电路板与连接端的电连接稳定性。

Description

一种电路板组件及电子设备
本申请要求于2023年03月23日提交中国国家知识产权局、申请号为202320729720.6、申请名称为“一种电路板组件及电子设备”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请涉及电子产品技术领域，尤其涉及一种电路板组件及电子设备。
背景技术
电路板是电子设备中常用的部件，电路板的基底设置有露铜用于与电子器件电性连接。由于露铜容易出现锈蚀等情况，因此通常需要对电路板的表面进行处理，对露铜进行镀金，然而这样的方式成本较高。
发明内容
本申请提供了一种电路板组件及电子设备，用于保护电路板并降低成本。
本申请提供了一种电路板组件，所述电路板组件包括：
主体部，所述主体部的表面设置有连接端；
连接部，所述连接部安装于所述主体部，用于与电连接件电性连接；
其中，所述主体部设置有保护膜，所述保护膜覆盖部分所述连接端，所述连接部为金属件，所述连接部与所述连接端未被所述保护膜覆盖的部分电性连接。
通过设置保护膜可以对连接端进行保护，降低连接端出现生锈等情况的可能，从而有利于提升电路板组件的稳定性，延长使用寿命。连接件与未被保护膜覆盖的连接端连接，可以降低保护膜对于连接部和连接端之间电连接稳定性的影响，而且，连接部还能够增大电连接件与电路板的连接面积，从而有利于提高电连接的稳定性，同时，相较于在连接端的表面进行镀金的方式，采用保护膜的成本较低，更加符合实际的使用需求。
在一种可能的实施方式中，所述连接部通过表面组装技术与所述连接端电性连接。
通过这样的设计可以使连接件与连接端焊接，相较于粘接的方式，焊接的电连接性能更好，而且较为稳定，使用寿命较长，能够有利于进一步提高电连接的稳定性。而且SMT工艺的组装密度较高、可靠性较好、成本较低的优点，而且还便于自动化生产，有利于提高生产效率，更加符合实际的使用需求。
在一种可能的实施方式中，沿所述电路板的厚度方向的投影中，所述连接部的投影面积大于所述电连接件的投影面积。
通过这样的设计可以降低连接部和电连接件之间的相对位置精度要求，从而有利于降低组装难度，提高加工效率。
在一种可能的实施方式中，沿所述电路板组件的厚度方向的投影中，所述连接部的投影面积为m，且12平方毫米≤m≤30平方毫米。
这样的方式可以使连接部具有较为充足的连接面积用于与电连接件连接。
在一种可能的实施方式中，所述连接部包括相互连接的本体部和支撑部，所述本体部用于与所述电连接件电性连接，所述支撑部与所述连接端电性连接，沿所述电路板组件的厚度方向，所述本体部与所述主体部之间具有间距。
通过这样的设计可以减少连接部在电路板所占用的空间，通过将本体部进行架空设计，可以使本体部与主体部之间的位置用于设置电子器件和/或走线，从而有利于节省电路板组件的空间，更加符合实际的使用需求。
在一种可能的实施方式中，沿所述电路板组件的厚度方向，所述本体部与所述主体部之间的间距为n，且0.5毫米≤n≤1.5毫米。
通过这样的设计可以使主体部和本体部之间具有足够的空间进行走线和/或设置电子器件，从而可以提升主体部的空间利用率，更加符合实际的使用需求。
在一种可能的实施方式中，所述连接部包括多个所述支撑部，各所述支撑部沿所述本体部的周向间隔设置。
通过这样的设计能够提升连接部与主体部连接的稳定性，从而降低连接部从主体部倾斜、脱落的可能，更加符合实际的使用需求。
在一种可能的实施方式中，所述保护膜为有机保焊膜。
通过化学的方式在铜的表面形成有机膜，具有防氧化、耐热冲击、耐蚀性等热点，可以用于保护铜，以降低铜的表面在常态环境中生锈的可能。而且在后续的焊接过程中，有机膜可以被助焊剂清除，从而能够露出铜表面，以降低保护膜对于连接端和连接部焊接的影响，以使连接端的铜表面能够在较短的时间内与熔融焊锡结合形成较为牢固的焊点，以使连接部与连接端具有较高的连接稳定性。
本申请还提供了一种电子设备，所述电子设备包括以上任一项所述的电路板组件。
在一种可能的实施方式中，所述电子设备包括屏幕组件和电连接件，所述屏幕组件通过电连接件与所述电路板组件的所述连接部电性连接。
通过这样的设计能够提升屏幕组件与电路板组件的电性连接的稳定性。
在一种可能的实施方式中，所述电连接件为导电泡棉。
屏幕组件可以通过导电泡棉与连接部电性连接，进而与电路板的连接端进行电性连接。导电泡棉可以起到减震、缓冲、减压等作用，从而能够降低屏幕组件和电路板组件受损的可能，从而有利于延长二者的使用寿命。而且，导电泡棉具有弹性，其发生形变时所产生的回复力能够作用于电路板和屏幕组件，从而提升二者连接的稳定性，更加符合实际的使用需求。
本申请提供了一种电路板组件和电子设备，其中，电路板组件包括主体部和连接部，连接部为金属件，用于安装电连接件，主体部设置有保护膜和连接端，保护膜覆盖部分连接端，连接部与未被保护膜覆盖的连接端电性连接。通过这样的设计能够对连接端进行保护，并有利于提升电路板与连接端的电连接稳定性。
应当理解的是，以上的一般描述和后文的细节描述仅是示例性的，并不能限制本申请。
附图说明
图1为本申请所提供的电路板组件的第一实施例的示意图；
图2为本申请所提供的电路板组件的第二实施例的示意图；
图3为本申请所提供的电路板组件的第三实施例的示意图。
附图标记：
1-主体部、11-走线、12-连接端；2-连接部、21-本体部、22-支撑部；3-电连接件；4-电子器件。
此处的附图被并入说明书中并构成本说明书的一部分，示出了符合本申请的实施例，并与说明书一起用于解释本申请的原理。
具体实施方式
为了更好的理解本申请的技术方案，下面结合附图对本申请实施例进行详细描述。
随着技术的发展，手机、平板电脑、笔记本电脑等电子设备的应用越来越广泛，电路板时电子设备中重要的组成部分，电路板包括基底和用于与电子器件电性连接的露铜，各电子器件可以集成于电路板实现电连接、接地等操作。为了对露铜进行保护，可以使用化学镍金(electroless nickel/immersion gold，ENIG)工艺对电路板进行处理，在铜的表面包裹一层镍合金，以降低露铜在使用过程中出现生锈等情况的可能。镍金工艺的处理步骤包括浸镀电解液，在沉浸过程中会溶解镍，如果不控制溶解反应会影响对于电路板表面处理的性能。因此，这样的方式不仅工艺流程复杂、处理难度较大，而且成本较高。相关技术中还可以通过在电路板表面安装导电硅胶，通过导电硅胶实现电连接功能。导电硅胶的表层包括金、镍、铜等的金属材料，作为媒介实现导电功能，具有耐高温特性的硅胶体作为弹性材料。导电硅胶可以与电路板的露铜通过硅胶胶水等粘合剂粘接。当电路板与天线等待连接对象连接时，硅胶体可以用于提供回弹力。可以通过压缩等 方式使导电硅胶发生形变，形变所产生的回弹力能够作用于电路板和待连接对象，从而提升二者连接的稳定性。导电材料利用导电硅胶的弹性，提供回弹力实现导电硅胶对天线等待连接对象进行电性连接。在使用时作为电磁干扰(electromagnetic interference，EMI)屏蔽接地使用，当具有该电路板的手机、平板电脑、笔记本电脑等电子设备收到冲击时，导电硅胶还可以起到缓冲的作用，降低电路板和电子器件因外界冲击导致损坏的可能。但是导电硅胶在长期压缩状态下会出现松弛、老化等问题，而且，电子器件在工作时会产生热量，导致导电硅胶所处的环境温度升高，容易加剧导电硅胶的老化程度，出现应力松弛等现象，进而容易出现接触不良等情况，会对于连接稳定性造成影响，影响与电路板连接的电子器件的性能。而且，导电硅胶通过粘接的方式安装于电路板，当粘合剂出现老化的等情况时，也会影响待连接对象和电路板之间连接的稳定性，从而会对于天线收发信号、电磁兼容性(electro magnetic compatibility，EMC)、电磁干扰等性能造成影响。
鉴于此，本申请实施例提供了一种电路板组件及电子设备，用于保护电路板组件并提升电连接的可靠性。
如图1所示，本申请实施例提供了一种电路板组件，其中电路板组件包括主体部1和连接部2，主体部1可以是印制电路板(printed circuit board，PCB)，主体部1可以具有基底，基底设置有连接端12，连接部2安装于主体部1，用于与电连接件3电性连接，电连接件3可以是导电泡棉等电连接辅料，连接端12可以为电路板组件的露铜。主体部1设置有保护膜(图中未示出)，部分连接端12被保护膜覆盖，部分连接端12不被保护膜覆盖。连接部2为金属件，且连接部2与未被保护膜覆盖的连接端12电性连接。
通过设置保护膜可以对连接端12进行保护，降低连接端12出现生锈等情况的可能，从而有利于提升电路板组件的稳定性，延长使用寿命。同时，由于保护膜的阻抗较差，电连接件3通过粘接等方式安装于主体部1时，保护膜会影响电连接件3与连接端12的电性连接的稳定性。因此，本申请实施例所提供的方案中，连接部2与未被保护膜覆盖的连接端12连接，可以降低保护膜对于连接部2和连接端12之间电连接稳定性的影响，进而降低保护膜对于电连接件3与电路板组件之间电性连接的稳定性的影响，而且，连接部2还能够增大电连接件3与电路板的连接面积，从而有利于提高电连接的稳定性，同时，相较于在连接端12的表面进行镀金的方式，采用保护膜的成本较低，更加符合实际的使用需求。
在一种可能的实施方式中，连接部2通过表面组装技术(surface mounted technology，SMT)与连接端12电性连接。
通过这样的设计可以使连接件与连接端12焊接，相较于粘接的方式，焊接的电连接性能更好，而且较为稳定，使用寿命较长，能够有利于进一步提高电连接的稳定性。而且SMT工艺的组装密度较高、可靠性较好、成本较低的优点，而且还便于自动化生产，有利于提高生产效率，更加符合实际的使用需求。
如图1所示，在一种可能的实施方式中，沿电路板的厚度方向的投影中，连接部2的投影面积大于电连接件3的投影面积。
通过这样的设计可以降低连接部2和电连接件3之间的相对位置精度要求，并使连接部2具有足够的面积用于与电连接件3连接，从而有利于降低组装难度，提高加工效率。
在一种可能的实施方式中，沿所述电路板的厚度方向的投影中，连接部2的投影面积为m，且12平方毫米≤m≤30平方毫米。
连接部2的投影面积可以为12平方毫米、16平方毫米、22平方毫米、26平方毫米、30平方毫米等。这样的方式可以使连接部2具有较为充足的连接面积用于与电连接件3连接。
在一种可能的实施方式中，连接部2可以为长度为3毫米，宽度为4毫米的矩形片状结构，或长度为5毫米，宽度为5毫米的矩形片状结构，或长度为6毫米，宽度为5毫米等尺寸的矩形片状结构。连接部2的实际尺寸以及实际结构可以根据实际需求进行设置。
如图2和图3所示，在一种可能的实施方式中，连接部2包括相互连接的本体部21和支撑部22，其中本体部21用于与电连接件3电性连接，支撑部22用于与连接端12电性连接，且沿电路板组件的厚度方向，本体部21和主体部1之间具有间距。
通过这样的设计可以减少连接部2在电路板所占用的空间，通过将本体部21进行架空设计，可以使本体部21与主体部1之间的位置用于设置电子器件4和/或走线11，从而有利于节省电路板组件的空间，更加符合实际的使用需求。
在一种可能的实施方式中，沿所述电路板组件的厚度方向，本体部21与主体部1之间的间距为n，且n满足：0.5毫米≤n≤1.5毫米。
本体部21与主体部1之间间距可以是0.5毫米、0.7毫米、0.9毫米、1.1毫米、1.3毫米、1.5毫米等。通过这样的设计可以使主体部1和本体部21之间具有足够的空间进行走线11和/或设置电子器件4，从而可以提升主体部1的空间利用率，更加符合实际的使用需求。
如图3所示，在一种可能的实施方式中，连接部2包括多个支撑部22，各支撑部22沿本体部21的周向间隔设置。
通过这样的设计能够提升连接部2与主体部1连接的稳定性，从而降低连接部2从主体部1倾斜、脱落的可能，更加符合实际的使用需求。
在一种可能的实施方式中，保护膜为有机保焊膜。
可以通过有机保焊膜(organic solderability preservatives，OSP)工艺对电路板进行表面处理，通过化学的方式在铜的表面形成有机膜，具有防氧化、耐热冲击、耐蚀性等热点，可以用于保护铜，以降低铜的表面在常态环境中生锈的可能。而且在后续的焊接过程中，有机膜可以被助焊剂清除，从而能够露出铜表面，以降低保护膜对于连接端12和连接部2焊接的影响，以使连接端12的铜表面能够在较短的时间内与熔融焊锡结合形成较为牢固的焊点，以使连接部2与连接端12具有较高的连接稳定性。
在加工时可以先在主体部1的表面生成保护膜，在通过SMT工艺安装，在焊接的过程中，位于连接端12与连接部2连接位置的保护膜能够被熔化，以使连接部2能够直接与连接端12接触并焊接，不仅有利于降低保护膜对于连接部2与连接端12之间的电性连接稳定性的影响，而且在设置保护膜时，可以先覆盖全部连接端12，在焊接过程中熔化对应区域的保护膜，能够降低其他位置的连接端12暴露的可能，从而有利于提升保护膜对于连接端12的保护效果，更加符合实际的使用需求。
基于以上各实施例所提供的电路板组件，本申请实施例还提供了一种电子设备，其中，电子设备包括以上任一实施例所涉及的电路板组件，由于电路板组件具有以上的技术效果，因此，包括该电路板组件的电子设备也具有相应的技术效果，此处不再赘述。
在一种可能的实施方式中，电子设备可以是手机、平板电脑、笔记本电脑等。电子设备包括屏幕组件和电连接件3，屏幕组件通过电连接件3与电路板组件的连接部2电性连接。
这样的设计能够提升屏幕组件与电路板组件电性连接的稳定性，更加符合实际的使用需求
在一种可能的实施方式中，电连接件3可以是导电泡棉。
屏幕组件可以通过导电泡棉与连接部2电性连接，进而与电路板的连接端12进行电性连接。导电泡棉可以起到减震、缓冲、减压等作用，从而能够降低屏幕组件和电路板组件受损的可能，从而有利于延长二者的使用寿命。而且，导电泡棉具有弹性，其发生形变时所产生的回复力能够作用于电路板和屏幕组件，从而提升二者连接的稳定性，更加符合实际的使用需求。
本申请实施例提供了一种电路板组件和电子设备，其中，电路板组件包括主体部1和连接部2，连接部2为金属件，用于安装电连接件3，主体部1设置有保护膜和连接端12，保护膜覆盖部分连接端12，连接部2与未被保护膜覆盖的连接端12电性连接。通过这样的设计能够对连接端12进行保护，并有利于提升电路板与连接端12的电连接稳定性。
以上所述，仅为本申请实施例的具体实施方式，但本申请实施例的保护范围并不局限于此，任何在本申请实施例揭露的技术范围内的变化或替换，都应涵盖在本申请实施例的保护范围之内。因此，本申请实施例的保护范围应以所述权利要求的保护范围为准。

Claims (11)

  1. 一种电路板组件，其特征在于，所述电路板组件包括：
    主体部(1)，所述主体部(1)的表面设置有连接端(12)；
    连接部(2)，所述连接部(2)安装于所述主体部(1)，用于与电连接件(3)电性连接；
    其中，所述主体部(1)设置有保护膜，所述保护膜覆盖部分所述连接端(12)，所述连接部(2)为金属件，所述连接部(2)与所述连接端(12)未被所述保护膜覆盖的部分电性连接。
  2. 根据权利要求1所述的电路板组件，其特征在于，所述连接部(2)通过表面组装技术与所述连接端(12)电性连接。
  3. 根据权利要求1所述的电路板组件，其特征在于，沿所述电路板的厚度方向的投影中，所述连接部(2)的投影面积大于所述电连接件(3)的投影面积。
  4. 根据权利要求1所述的电路板组件，其特征在于，沿所述电路板组件的厚度方向的投影中，所述连接部(2)的投影面积为m，且12平方毫米≤m≤30平方毫米。
  5. 根据权利要求1至4中任一项所述的电路板组件，其特征在于，所述连接部(2)包括相互连接的本体部(21)和支撑部(22)，所述本体部(21)用于与所述电连接件(3)电性连接，所述支撑部(22)与所述连接端(12)电性连接，沿所述电路板组件的厚度方向，所述本体部(21)与所述主体部(1)之间具有间距。
  6. 根据权利要求5所述的电路板组件，其特征在于，沿所述电路板组件的厚度方向，所述本体部(21)与所述主体部(1)之间的间距为n，且0.5毫米≤n≤1.5毫米。
  7. 根据权利要求5所述的电路板组件，其特征在于，所述连接部(2)包括多个所述支撑部(22)，各所述支撑部(22)沿所述本体部(21)的周向间隔设置。
  8. 根据权利要求1至4中任一项所述的电路板组件，其特征在于，所述保护膜为有机保焊膜。
  9. 一种电子设备，其特征在于，所述电子设备包括权利要求1至8中任一项所述的电路板组件。
  10. 根据权利要求9所述的电子设备，其特征在于，所述电子设备包括屏幕组件和电连接件(3)，所述屏幕组件通过电连接件(3)与所述电路板组件的所述连接部(2)电性连接。
  11. 根据权利要求9所述的电子设备，其特征在于，所述电连接件(3)为导电泡棉。
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