WO2024074782A1

WO2024074782A1 - System for the serial testing of chips located on silicon wafers for analysing an analyte

Info

Publication number: WO2024074782A1
Application number: PCT/FR2023/051526
Authority: WO
Inventors: Bertrand GAUTHERON; Loïc BLANCHARD
Original assignee: Aryballe
Priority date: 2022-10-06
Filing date: 2023-10-03
Publication date: 2024-04-11
Also published as: TW202433041A

Abstract

The invention relates to a system for the serial testing of gas (VOC) analysis chips located on silicon wafers, each of these chips comprising: - temporary receptors; - an input and an output for light energy; the system comprises a fixed frame, a test structure and a wafer/support assembly that are movable; the test structure comprises a source of light energy and an optical interface for measuring optical parameters dependent on the change in local property resulting from the receptor/analyte interaction; - a cavitary element capable of being reversibly brought into sealed contact with a chip on the wafer to define a sealed test chamber intended to receive the fluid containing the analytes for testing this chip. This system also comprises a unit for controlling the structure and the test process.

Description

CHIP SERIES TEST SYSTEM INTENDED FOR THE ANALYSIS OF AN ANALYTE AND ELABORATED ON SILICON PLATES

Technical area

5 [0001] The field of the invention is that of the industrial manufacture of chips for optronic and/or electronic devices, in particular devices for measuring and analyzing an analyte present in a fluid.

[0002] In particular, the invention aims at means making it possible to verify that these chips manufactured on an industrial scale on "wafers" are operational and free from crippling defects.0 [0003] Even more precisely, the invention concerns a serial test system of chips, on the one hand, designed for the analysis of at least analyte present in a fluid, preferably gaseous, and, on the other hand, produced on plates (“wafers”) of semi -conductor(s), preferably silicon;

* each of these plates, 5 on the one hand, comprising a plurality of these chips, and, on the other hand, being intended to be cut into individualized chips;

* each of these bullets including:

- receptors capable of interacting with the analyte present in the fluid, this interaction causing a change in local property(s); 0 - at least one energy input, preferably light or electrical;

- and at least one energy output, preferably light or electrical.

[0004] The invention also relates to a method for serial testing of these chips, implementing the system referred to in the preceding paragraph; as well as the mass manufacturing process for these chips integrating the test process. 5 [0005] The invention further relates to a method of manufacturing an optronic/electronic device for analyzing at least one analyte present in a fluid, in which a chip tested in accordance with the invention.

Prior art

[0006] The industrial manufacture of optronic or electronic chips on semi-0 conductor plates, for example in silicon, usually includes a step of testing the operation of each chip, at an early stage, that is to say on each semiconductor wafer comprising a plurality of chips. Indeed, the development of large-scale integrated circuits or chips is a delicate operation, particularly considering large-scale integrated circuits/chips, is particularly delicate due to the sensitivity of the semiconductor material to particulate contamination. Furthermore, the extreme miniaturization of these chips, combined with the high production speeds, significantly complicates the manufacturing of the circuit. Indeed, the slightest deviation from the production machine or the slightest handling error can cause faults in the production circuit. some chips produced. However, any contamination or defect leads to a malfunction of the chip or a future risk of malfunction. It is therefore crucial to detect these anomalies early, that is to say before the semiconductor wafer is cut into a series of chips, which are then assembled into complex optoelectronic or electronic devices. This early test makes it possible to continuously monitor the quality of production and above all to discriminate between faulty chips to avoid their integration into the rest of the assembly process leading to multi-component devices. Such sorting at a very early stage has obvious positive economic impacts in mass production.

[0007] Conventionally, this operational test of the chips on plates before cutting consists of subjecting them to severe operating conditions, as close as possible to those of the final environment of use, in the optronic or electronic device.

To do this, the semiconductor wafers carrying the chips which are stored in cassettes just after their manufacture, are handled by a robot ("prober") with precision to be placed one by one on a support ("chuck") of plate. A tester then executes a program to measure the plate resting on this support, by successively sending input test signals to each plate, according to a pre-established test program for each type of chip. The tester collects the output signals and interprets them to determine whether or not the chip under test is operational.

Input test signals are electronic or electrical signals part of the tester contacting the chip under test (a probe card). The high voltages used for the test and the proximity between the contact tips are known to cause dielectric breakdowns, likely to disrupt these tests.

To remedy this, it is known to use tip cards operating under gas pressure.

[0008] This is how American patent US1 1002761 B2 describes a system for testing an integrated circuit chip, this system comprising a tip card comprising, on the one hand, a pressure chamber, intended to be supplied by a compressed gas, and, on the other hand, specifically curved tips.

[0009] PCT application WO2020148227A1 relates to a tip card for testing chip wafers under a gaseous atmosphere, having a chamber into which, by means of a pipe, through an opening, either test gas is introduced for the test of chip gas sensors, i.e., protective gas for chip testing. The tip card has, in the ring laterally delimiting the chamber, channels opening into openings on the front surface of the ring facing the chip plate. These channels are connected to an annular collecting channel through which gas coming from a slot between the tip card and the chip plate, and possibly air entering the slot, are extracted, by means of a pipe. The gas supply (amount of gas per unit of time), which must form the gas atmosphere in the chamber, is chosen so as to supply less gas than is drawn off (sucked in) through the collecting channel . According to WO2020148227A1, this mode of operation of the gas supply in the chamber of the tip card has the advantageous effect that the escape of gas from the gaseous atmosphere is reliably prevented. Still according to WO2020148227A1, there is no risk of air entering the chamber and affecting the gaseous atmosphere of this chamber because the air is sucked out of the card/plate slot through the channels upstream of the channel collector before it can enter the chamber.

[0010] Point cards of the type described in US1 1002761 B2 & WO2020148227A1 nevertheless present certain limits in the case where the atmosphere of the measuring chamber includes volatile organic compounds (VOCs) which are the analytes to be measured in the optronic or electronic devices integrating the chip. Indeed, the risks of contamination of this atmosphere in these point cards are significant. Control of the gas atmosphere is approximate and unreliable in these prior techniques.

This point is very delicate given the high sensitivity of the receptors capable of interacting with the analyte present in the fluid subjected to measurement, by the final optronic or electronic devices integrating the chips. Less contamination irremediably distorts the analysis.

Furthermore, these point cards of the type described in US1 1002761 B2 & WO2020148227A1 have relatively complex structures and operations, which are handicaps on the economic level in terms of sustainability.

Finally, these point cards of the type described in US1 1002761 B2 & W02020148227A1 have the notable disadvantage of requiring the use of large volumes of gaseous fluids for the tests.

Objectives of the invention

[0011] In this context, the invention aims to satisfy at least one of the following objectives.

[0012] An objective of the invention is to provide a series test system for chips, of the type defined in paragraph [0003] above, which is adapted to chips designed for the analysis of a gaseous fluid containing VOCs.

[0013] An objective of the invention is to provide a series test system for chips, of the type defined in paragraph [0003] above, which is adapted to chips designed for the analysis of a gaseous fluid containing of VOCs and which allow very early testing of chip plates, before cutting the plates into individualized chips, and preferably just after the functionalization of the chips on the plates, by implantation of receptors capable of interacting with the analyte present in the fluid to be analyzed in final optronic or electronic devices integrating chips.

[0014] An objective of the invention is to provide a serial test system for chips, of the type defined in paragraph [0003] above, which is simple in its structure and in its operation.

[0015] An objective of the invention is to provide a serial test system for chips, of the type defined in paragraph [0003] above, which is economical per se and which makes it possible to substantially reduce the cost price of the chip production and final device manufacturing.

[0016] An objective of the invention is to provide a serial chip test system, of the type defined in paragraph [0003] above, which detects faulty chips very early and reliably, in order to eliminate them from the production circuit and to carry out the assembly of the final optronic or electronic analysis devices, with chips in perfect working order in the short term and in the long term.

[0017] An objective of the invention is to provide a serial test system for chips, of the type defined in paragraph [0003] above, which informs the chip production unit in real time of any possible deviation. of the quality of the chips produced, to allow this unit to react immediately to correct an anomaly and in doing so impact the large-scale production of these chips as little as possible.

[0018] An objective of the invention is also to provide a method for serial testing of chips implementing the system according to at least one of the above objectives, with all the inherent advantages referred to above.

[0019] An objective of the invention is also to provide a process for mass manufacturing of chips implementing the system according to at least one of the above objectives, with all the inherent advantages referred to above.

Brief description of the invention

[0020] The invention satisfies at least one of the above objectives and concerns, according to a first aspect, a chip test system, on the one hand, designed for the analysis of at least one analyte present in a fluid, preferably gaseous, and, on the other hand, produced on wafers of semiconductor(s), preferably silicon;

* each of these plates, on the one hand, comprising a plurality of these chips, and, on the other hand, being intended to be cut into individualized chips;

* each of these bullets including:

- receptors capable of interacting with the analyte present in the fluid, this interaction causing a change in local property(s);

- at least one energy input, preferably light and/or electrical;

- and at least one energy output, preferably luminous and/or electrical; characterized in that

* this system comprises a fixed frame, a test structure integral with the frame and capable of cooperating, for the test, with at least one plate resting on a support;

* the plate/support assembly, and possibly the test structure, being movable relative to the frame;

*test structure includes

- a source of energy, preferably light or electric;

- at least one optical and/or electronic interface capable of measuring at least one optical or electronic parameter depending on the change in local property resulting from the receptor/analyte(s) interaction;

- at least one cavitary element capable of being placed in sealed contact, in a reversible manner, with at least one chip of the plate to define a sealed test chamber, intended to receive the fluid containing the analyte(s) intended for the chip test;

* this system also includes at least one unit for controlling the test structure and, more generally, the test process.

[0021] The system according to the invention makes it possible to test, verify and calibrate the performances of the functionalized chips, before cutting the semiconductor wafers (e.g. silicon) into individualized and operational chips, which can be used without risk in the successive assemblies implemented for the development of final optronic and/or electronic analysis devices. This represents significant progress for the industrialization of the manufacturing of these chips and the devices that integrate them.

The system test structure according to the invention is a mechanical solution, robust and compatible with existing tip card supports.

With this test structure, contamination of the gas atmosphere to be tested is much less than with currently available test systems. The simplicity of this structure allows easy maintenance of the various components of the system.

This structure also provides sufficient flexibility that allows it to adapt to different types of chips.

The system can be implemented regardless of the type of gas containing VOCs.

Advantageously, the input and output signals usable for the test can be of electronic and/or optical nature.

The test system according to the invention also benefits from optimal compatibility with different types of industrial "probers" and industrial test control units available on the market.

This system can be configured to operate partially or fully automatically, at high industrial rates.

[0023] According to a remarkable characteristic of the invention, the tests of the chips on the semiconductor wafers can be carried out in series or in parallel, on the same semiconductor wafer or on several carrying semiconductor wafers. of fleas.

[0024] According to a first possibility specific to the invention:

* the chips are photonic chips which each comprise at least one light guide provided with at least one light input and at least one light output;

* the test structure comprises at least one coherent light source capable of emitting a coherent light beam into the light input of the light guide of the chip;

* the optical interface comprises at least one optical detector arranged opposite the light output of the light guide and capable of measuring at least one optical parameter of the light beam depending on the change in local property resulting from the receptor/analyte interaction ( s).

[0025] According to a ^second possibility specific to the invention:

* chips are electronic chips which have at least one electrical input and at least one electrical output;

* the electronic interface is capable of measuring at least one electrical parameter, preferably voltage or intensity dependent on the local property change resulting from the receptor/analyte(s) interaction.

[0026] According to a ^third possibility specific to the invention:

* the bullet points are:

O photonic chips which include at least one light input and at least one light output;

O and/or electronic chips which include at least one electrical input and at least one electrical output;

* the optical interface comprises at least one optical detector arranged opposite the light output of the light guide and capable of measuring at least one optical parameter of the light beam depending on the change in local property resulting from the receptor/analyte interaction ( s);

* the electronic interface is capable of measuring at least one electrical parameter, preferably voltage or intensity depending on the change in local property resulting from the receptor/analyte(s) interaction.

[0027] The cavity element, which makes it possible to reversibly form, by contact with a part, preferably peripheral, of each chip of the plate, a sealed test chamber, is one of the essential parts of the structure of test of the system according to the invention.

[0028] According to an advantageous method of the invention, the cavity element is provided with at least one opening for admitting, into the sealed chamber, the fluid containing the analyte or analytes and with at least one opening for evacuation of said fluid from this chamber, these fluid intake and discharge openings being connected to fluid intake and discharge conduits, respectively.

[0029] According to a preferred characteristic of the invention, the cavity element is provided with a joint contributing to the sealing (gases and liquids) of the test chamber, once contact has been established between the cavity element and the minus part of the chip.

Within the meaning of the invention, the tightness of the cavity element, and more generally of the complete fluidic assembly, can be quantified/evaluated, for example, by means of pressure and flow tests.

[0030] Concerning this jointing, in a preferred embodiment of the cavity element of the system according to the invention, it is made from an elastic material with a Shore D hardness of between 40 and 80, and preferably between 50 and 65; this material being advantageously chosen from the group comprising - ideally consisting of -: thermoplastic fluoropolymers, in particular polytetrafluoroethylene (PTFE eg Teflon®), poly(vinyl fluoride) (PVF eg Tedlar®), poly(vinylidene fluoride ) (PVDF), polychlorotrifluoroethylene (PCTFE), perfluoroalkoxy (PFA); fluorinated ethylene propylene (FEP), ethylene tetrafluoroethylene (ETFE), polyethylenechlorotrifluoroethylene (ECTFE), perfluoropolyether (PFPE), perfluorosulfonic acid (PFSA), or perfluoropolyoxetane; fluoroelastomers, in particular FKMs (ASTM 1418 standard); perfluoroelastomers, in particular FFKMs (ASTM 1418 standard); and their mixtures/alloys.

[0031] According to a ^first embodiment of the invention, the test structure comprises at least two arms:

- a first arm carrying the cavity element;

- a second arm carrying the energy source or the interface; preferably from the energy source, while the interface is carried by the first arm.

[0032] According to a ^2nd embodiment, the test structure is in one piece.

[0033] According to a remarkable arrangement of the ^1st embodiment:

• the first and second arms each comprise, relative to the frame, on the one hand, a distal region carrying at least one of the following components: cavity element, energy source, interface; and, on the other hand, a proximal region;

• the first and second arms are mounted on the frame, via their proximal region;

• and at least the first arm is movable relative to the frame.

[0034] According to another remarkable provision of the ^1st embodiment:

• the first can be moved in a three-dimensional space X,Y,Z, relative to the frame;

• the second arm can be moved in a three-dimensional space X,Y,Z, relative to the frame.

[0035] According to a preferred method of the invention which can be applied, in particular, to the ^1st and ^2nd embodiments mentioned above, the plate/support assembly is movable in a three-dimensional space X, Y, Z, compared to the test structure.

The receivers of the analytical chips of the test system according to the invention can be temporary receivers, that is to say with a limited lifespan and therefore consumable.

[0037] In another of its aspects, the invention relates to a serial test method for chips implementing the system according to the invention, in which the following recurring sequence of operations is implemented:

• we place at least one assembly consisting of a plate of semiconductor chips resting on a support, PP/S constituted by a plate of semiconductor chips resting on a support, in a position P° preliminary to the test, in look at a test structure including

- a source of energy, preferably light and/or electric;

- at least one optical and/or electronic interface capable of measuring at least one optical and/or electronic parameter depending on the change in local property resulting from the receptor/analyte(s) interaction;

- at least one cavity element capable of coming into sealed contact, by moving the plate/support assembly relative to the fixed test structure, with a chip of the plate to define a fluidic test chamber, intended to receive the fluid containing the analyte(s) intended for the chip test;

- at least one transducer of change of local property(s) caused by the interaction between the receptors and the analyte, capable of converting the change of local property(s) into a signal optical or electronic expressing this change;

* we position, along the axes X, Y, Z, the plate to be tested against the cavity element of the test structure, for each of the chips on this plate;

* we implement at least one test sequence for each of the chips, after each X,Y,Z positioning sequence;

* possibly, we identify, thanks to the test, any defective chips on each plate;

* possibly, using the test, one or more parameters of the chips on each plate are measured;

* after each test, we reposition, along the axes X, Y, Z, the assembly PP/S in its position P°.

Advantageously, the duration of each test sequence is less than or equal to 3 minutes, preferably 2 minutes and, even more preferably, 1 minute.

[0039] In another of its aspects, the invention relates to a process for mass manufacturing of chips characterized in that it essentially consists of:

* manufacture semiconductor wafers, preferably in silicon, each of these wafers comprising a plurality of chips, each comprising:

- at least one energy input, preferably light and/or electrical;

- and at least one energy output, preferably luminous and/or electrical;;

* functionalize each chip with receptors, in particular receptors capable of interacting with an analyte present in a fluid to be analyzed, this interaction causing a change in local property(ies);

* test the chips using the test method according to the invention;

* cut the tested plates into individualized chips;

* possibly separate defective chips from non-defective chips, i.e. operational chips;

* optionally, measure one or more parameters of the chips on each plate.

[0040] The operational chips obtained at the end of the above-mentioned process for mass manufacturing of chips constitute another object of the invention.

[0041] In another of its aspects, the invention relates to a method of manufacturing an optronic/electronic device for analyzing at least one analyte present in a characterized fluid comprising:

- a consumable and interchangeable sensor comprising i) a photonic chip comprising at least one fluidic measuring chamber comprising a light guide in which receptors are arranged, in particular temporary receptors, capable of interacting with the analyte(s) s) present in the fluid, the interaction causing a change in local property(s), the light guide comprising a light inlet and a light outlet, and ii) a cover comprising a suitable opening to admit fluid into the measuring chamber and to discharge fluid from the measuring chamber; - a sensor support comprising a housing in which the sensor is intended to be installed reversibly;

- a closing element cooperating with the sensor support to encapsulate the sensor;

- a transducer for change of local property(s) caused by the interaction between the receptors and the analyte(s) capable of converting this change into an electronic signal expressing this change, this transducer comprising:

* a coherent light source, on the one hand, capable of emitting a coherent light beam in the light guide of the photonic chip, and, on the other hand, positioned on the sensor cover or on the closing element;

* an optical detector arranged opposite the light outlet of the light guide and capable of measuring an optical parameter of the light beam depending on the change in local property, at the outlet of the light guide; this process essentially consisting of:

* to assemble on the cover, at least one operational chip obtained at the end of the serial manufacturing process of chips according to the invention, to produce the consumable and interchangeable sensor,

* to assemble this consumable and interchangeable sensor to the sensor support, to the closure element and to the transducer, to form the optronic/electronic device for analyzing at least one analyte present in a fluid.

The optronic/electronic analysis device manufactured by the process referred to above in § [0040] above, preferably concerns the analysis of at least one analyte which is:

* a volatile target compound or the combination of volatile target compounds, preferably a volatile organic compound (VOC) or a mixture of VOCs, which can produce an odor (electronic nose); Or

* a liquid target compound or the combination of liquid target compounds, preferably an organic liquid or a mixture of organic liquids, capable of producing a taste (electronic language).

[0043] In the particularly interesting applications of the invention, the optronic/electronic device for analyzing at least one analyte is used for the detection of gaseous fluids such as vapors of ethanol, beta-pinene, ammonia, water vapor, etc.

Description of figures

[0044] Other characteristics, details and advantages will appear on reading the detailed description below of 2 embodiments of the method according to the invention and of the chip test system according to the invention and on analysis of the appended figures, in which:

Fig. 1

[0045] [Fig. 1 ] Figure 1 is a plunging perspective view of % of a ^1st embodiment of the chip test system according to the invention.

Fig. 2

[0046] [Fig. 2] Figure 2 represents a detailed view of a part of the system of Figure 1 corresponding to the distal ends of the arms of the test structure. Fig. 3

[0047] [Fig. 3] Figure 3 represents a photographic view similar to that of Figure 2, of a variant of the ^1st embodiment of the chip test system according to the invention.

Fig. 4

[0048] [Fig. 4] Figure 4 is a partial longitudinal sectional view along the vertical section plane indicated by the line IV-IV in Figure 2.

Fig. 5

[0049] [Fig. 5] Figure 5 shows an enlarged low angle and % perspective view of the isolated cavity element.

Fig. 6

[0050] [Fig. 6] Figure 6 is a top view of a ^2nd embodiment of the chip test system according to the invention.

Fig. 7

[0051] [Fig. 7] Figure 7 is a longitudinal sectional view along the vertical section plane indicated by the line VII-VII in Figure 6.

Fig. 8

[0052] [Fig. 8] Figure 8 is a chronogram which shows the 22 superimposed signals corresponding to the 22 phase shifts A (in radians) of light waves which are measured by the transducers coupled to the olfactory receptors/biodetectors of the chip, used for verifying the tightness of the fluidic chamber defined by tight contact between the cavity element of the test structure and the chip (example 1).

Fig. 9

[0053] [Fig. 9] Figure 9 is a chronogram which shows the 22 superimposed signals corresponding to the 22 phase shifts A (in radians) of light waves which are measured by the transducers coupled to the olfactory receptors/biodetectors of the chip, tested using the system according to the invention (example 2).

Detailed description of the embodiments

[0054] In the figures, the same references, in particular those in units and those in hundreds, designate identical or similar elements.

[0055] The attached Figures 1 to 5 represent a ^first embodiment of a system 1 according to the invention, constituted by a fixed frame 2 intended to rest on the ground, by a test structure 3 placed on the frame 2 and by an assembly "plate 4 of chips 5/support 6' located in frame 2, under test structure 3.

[0056] Figures 6 and 7 illustrate a ^2nd embodiment of a system 1' according to the invention constituted by a fixed frame 2' intended to rest on the ground, by a test structure 3' arranged on the frame 2' and by a "plate 4' of chips 5/support 6'" assembly located in the frame 2', under the test structure 3'.

[0057] In this presentation, the qualifiers “horizontal”; " vertical " ; " high " ; "down" ; " superior " ; “Lower” refers to the positioning of the 2.2' fixed frame resting on a flat horizontal floor. According to the orthonormal three-dimensional coordinate system XYZ indicated in Figures 1 and 7, the horizontal plane is an XY plane and the vertical plane is an XZ plane.

[0058] In the first embodiment, the test structure 3 comprises two arms 31,32 each having a distal end region 33,34 and a proximal end region 35,36. The ^1st arm 31 and the ^2nd arm 32 are both mounted movable in the 3 directions upper 23 of the fixed frame 2.

[0059] The mobility of the arms 31, 32 relative to the support 21, 22 is made possible by an articulation, which can for example be constituted by a three-axis motorized positioner, of the type of those manufactured and marketed by the company FormFactor under the name RPP504.

The two arms 31,32 are arranged such that their respective distal end regions 33,34 are contiguous, facing each other and located on this side of the corresponding proximal end regions 35,36. The distal ends 33,34 of the arms 31, 32 are in fact arranged in the center of a cylindrical recess 24 of the fixed frame 2. The arms 31, 32 are thus aligned with a vertical plane X, Z diametrical with respect to the recess 24.

[0061] Each arm 31, 32 is thus made up of 3 segments, namely:

* a ^1st proximal segment 31.1, 32.1, on the one hand, with an axis parallel to the horizontal plane XY of the upper face 23 of the frame 2, and, on the other hand, articulated to the support 21, 22;

* a ^2nd median segment 31.2,32.2 inclined towards the bottom 25 of the recess 24;

* and a ^3rd distal segment 31.3 & 32.3, arranged near the bottom of the recess 24 and with an axis parallel to the horizontal plane XY of the upper face 23 of the frame 2.

The fixed frame 2 and the arms 31, 32 are preferably made of a clean room compatible material. It may for example be a metal such as stainless steel.

[0063] In this exemplary embodiment, the free end of the distal segment 31.3 of the ^1st arm 31 is reversibly fixed to an energy outlet block 37, while the free end of the distal segment 32.3 of the ^2nd arm 32 is reversibly secured to an energy input block 38. The energy which enters the block 38 and which leaves the block 37 is the light and/or electrical energy allowing the execution of the tests of the chips 5.

The central zone of the bottom 25 of the cylindrical recess 24 has a circular opening 26 which communicates with an alcove under the frame, not visible in the figures, and in which the assembly "chip plate 4 5/support 6" is housed. ' as well as the robot "probed for handling this assembly. This robot allows in particular the positioning, in the 3 dimensions XYZ, of this assembly, with respect to the two energy input 38 and output 37 blocks, which surmount the plate 4, on the surface of which are present 5 chips to test. [0065] The light and/or electrical energy input block 38 consists of:

* by a body 38 ¹ , secured to the free end of the distal segment 32.3 of the ^2nd arm 32, via an attachment part 38 ² , this attachment of the body 38 ¹ to the attachment part 38 ² , and from the latter to the distal segment 32.3, can be carried out for example by means of bolts 38 ¹² ;

* and by a connection 38 ³ for conveying light and/or electrical energy from a source 38 ⁴ to a point 38 ⁵ , which is intended to be connected to one of the chips 5 to be tested on plate 4.

The body 38 ¹ is preferably made of a clean room compatible material. It may for example be a metal such as stainless steel.

[0067] For photonic chips, the tip 38 ⁵ ("probe ¹ ') and the connection 38 ³ for conveying light energy from the source 38 ⁴ to the tip 38 ⁵ , are, for example, constituted by an optical fiber, eg glass.

This tip 38 ⁵ ("probe") is intended to be positioned above a photonic input of the chip 5, without contact occurring. The distance between the end of the tip and the photonic input of the chip can be, for example, of the order of 100 microns. A coherent light beam is emitted from this tip 38 ⁵ and enters through the photonic input of the chip 5 to be tested. This input is also the input of a light guide included in this chip 5.

[0068] For electronic chips, the tip 38 ⁵ is, for example, constituted by a tip ("probe") of conductive metal eg copper, and the connection 38 ³ for conveying electrical energy is then an electric wire.

This tip 38 ⁵ ("probe") is intended to come into contact with the chip to provide electrical energy which will pass through this chip.

The attachment part 38 ² is preferably made of a clean room compatible material. It may for example be a metal such as stainless steel.

[0070] The energy source 38 ⁴ is, for example, a coherent light source, for example a laser diode, such as a surface-emitting vertical cavity laser diode (or VCSEL) which is a laser diode. semiconductor emitting a laser beam perpendicular to the surface.

[0071] The light and/or electrical energy output block 37 comprises:

* a body 37 ¹ ;

* an attachment part 37 ² , of the body 37 ¹ at the free end of the distal segment 31.3 of the ^1st arm 31, the joining of the body 37 ¹ to the attachment part 37 ² , on the one hand, and the attachment of the attachment part 37 ² , to the free end of the distal segment 31.3, on the other hand, being carried out, preferably, by reversible fixing means such as, bolts 39 ¹ , of which the heads are housed in countersinks 39 ² ;

* a cavity element 37 ³ capable of being placed in sealed contact, in a reversible manner, with at least one chip 5 of the plate 4, to define a sealed test chamber 37 ⁴ , intended to receive the fluid containing the intended analyte(s) (s) for testing this chip 5;

° an admission conduit 37 ⁵ of the fluid into the test chamber 37 ⁴ and an evacuation conduit 37 ⁶ of the fluid outside this test chamber 37 ⁴ ;

* a connection part 37 ⁷ of the inlet conduit 37 ⁵ and the discharge conduit 37 ⁶ , to the cavity element 37 ³ <;

* a connection 37 ⁸ for transporting the light and/or electrical energy collected at the output of the chip 5 tested by a tip 37 ⁹ , to an optical and/or electronic interface 37 ¹⁰ capable of measuring at least one parameter optical or electronic depending on the change in local property resulting from the interaction between, on the one hand, receptors, eg temporary, contained in the chip 5 to be tested and, on the other hand, one (or more) analyte(s) contained in the test fluid.

The body 37 ¹ is preferably made of a clean room compatible material. It may for example be a metal such as stainless steel.

[0073] For photonic chips, the tip 37 ⁹ ("probe ¹ ') and the connection 37 ⁸ for conveying light energy are, for example (Figures 1 & 2), constituted by an optical fiber, eg made of glass. This tip 37 ⁹ is intended to be positioned above a photonic output of the chip 5, without contact occurring, to collect the optical output signal of the chip tested. The distance between the end of the tip and the photonic input of the chip can be, for example, of the order of 100 microns.

The connection 37 ⁸ routes the light signals carrying the information resulting from the interaction of the analyte(s) of the test fluid with the receivers, eg temporary, of the chip 5, up to the optical interface 37 ¹⁰ .

[0074] For electronic chips, the tip 37 ⁹ is, for example, constituted by a tip ("probe") of conductive metal eg copper, and the connection 37 ⁸ for conveying electrical energy is then an electric wire.

This tip 37 ⁹ ("probe") is intended to come into contact with the chip to collect the electrical output signal from the chip tested.

The attachment part 37 ² is preferably made of a clean room compatible material. It may for example be a metal such as stainless steel.

[0076] The cavity element 37 ³ is shown in more detail in Figures 4 and 5. This element has a main part 70 in the general shape of a parallelepiped. A central rib 71 of rectangular shape in section along the plane YZ, extends from the lower face 72 of the main parallelepiped part 70. This central rib 71 has the same median plane XZ of symmetry as the main parallelepiped part 70. This central rib 71 comprises an oblong recess 73 on its lower face 74. This oblong recess 73 is also symmetrical with respect to the median transverse plane XZ. The non-recessed peripheral edge 75 of the central rib 71 forms a joint which makes it possible to define the sealed test chamber 37 ⁴ , when the cavity element 37 ³ is in close contact with the area of the chip 5 to be tested including the receivers , eg temporary, capable of interacting with the analyte present in the fluid, this interaction causing a change in local property(s). This contacting is ensured by moving the assembly "plate 4 of chips 5/support G', or even by moving the arms 31, 32. [0077] The cavity element 37 ³ is, moreover, provided with an admission opening 76 ¹ and an evacuation opening 76 ² for the test fluid. These openings 76 ¹ , 76 ² are arranged in the end parts of the ceiling 77 of the oblong recess 73, along the median plane XZ. A fluid inlet bore 78 and an evacuation bore 79 of the test fluid, both with an axis parallel to the Z axis, communicate the openings 76 ¹ and 76 ² , respectively, with the inlet conduits 37 ⁵ and evacuation 37 ⁶ of the test fluid.

[0078] As appears in Figure 5, the parallelepiped main part 70 of the cavity element 37 ³ also has two passages 80,81 for bolt rods 82, allowing the connection of the cavity element 37 ³ with the connection part 37 ⁷ .

These passages 80,81, symmetrical with ^respect to the median plane These countersinks 83,84 intended to receive the nuts/washers of the bolts 82.

[0079] The ends of the inlet 37 ⁵ and evacuation 37 ⁶ conduits for the test fluid each have the shape of a flange 85.86 which is sandwiched, by tight tightening of the bolts 82, between the face upper face 87 of the cavity element 37 ³ and the lower face 88 of the connection part 37 ⁷ .

[0080] These inlet 37 ⁵ and evacuation 37 ⁶ conduits make it possible to circulate test fluid in the test chamber 37 ⁴ , formed temporarily above the chip 5 to be tested, in particular above the area of the chip 5 comprising the receptors, eg temporary, capable of reacting with the analyte(s) present in the test fluid. The arrows F1, F2 & F3 in Figure 4 show the direction of circulation of this test fluid.

[0081] The cavity element 37 ³ and the connection part 37 ⁷ are, for example, made of polytetrafluoroethylene (PTFE eg Teflon®) with Shore D hardness equal to approximately 50.

[0082] The light and/or electrical energy signals collected at the output of the chip 5 tested, by the tip 37 ⁹ , are conveyed by the transport connection 37 ⁸ to the optical and/or interface 37 ¹⁰ . electronic. This interface 37 ¹⁰ can be arranged on the distal segment 31.3 of the ^1st arm 31, as shown in FIG. 1, or even in the body 37 of the output block 37. According to another possibility, the interface 37 ¹⁰ is outside of test structure 3.

This interface 37 ¹⁰ is connected to a processing unit 37 ¹¹ of the signals collected.

[0083] The test structure 3, with all these components, is controlled by a central unit not shown in the figures.

[0084] When the chip 5 is eg a photonic chip, it can include at least one light guide having at least one light input and at least one light output. The receptors, eg temporary, capable of interacting with the analyte present in the test fluid are arranged on the surface of the photonic chip, facing the test chamber 37 ⁴ , when the cavity element 37 ³ covers in a sealed manner chip 5 to test. The interaction between the receptors and the analyte causes a local property change. Thus, when the receptors are in the presence of the analyte, at the less a local property characteristic of the environment in which the receptors are positioned is modified. For example, the local property is the optical index of the medium.

[0085] These receptors can be chosen from molecules, peptides, polymers, biomarkers, nanoparticles or carbon nanotubes. Receivers may be expendable temporary receivers. They then have a more limited lifespan than the other components of the optronic/electronic analysis device in which the chip 5 is intended to be integrated.

[0086] The light guide can be divided into a plurality of branches, each branch being divided into a reference arm and a measuring arm, in which the receivers are arranged. The reference arm and the measurement arm recombine into an interference arm.

In order to form the branches, the light guide is divided successively, starting from the light entrance. In particular, the light guide can be divided into two first row portions of identical length constituting a first stage of the light guide, then each of these first row portions is in turn divided in two to form four second row portions of identical length, constituting a second stage of the light guide. Each second row portion is in turn divided in two to form eight third row portions of identical length constituting a third stage of the light guide, then each third row portion is in turn divided in two to form sixteen fourth row portions. row of identical length constituting a fourth stage of the light guide, then each fourth row portion is in turn divided in two to form thirty-two fifth row portions of identical length constituting a fifth stage of the light guide, then each portion of fifth rank is in turn divided in two to form sixty-four portions of sixth rank constituting a sixth stage of light guide. These sixty-four portions of the sixth rank each form a branch.

These successive divisions of the light guide make it possible to increase the number of branches which will reveal the presence of the analyte. The light guide may have more or fewer branches than in the example shown. Thus, the light guide can have more or fewer stages than in the example illustrated. For example, the light guide can have five stages, the fifth stage then comprises thirty-two portions of fifth rows each forming a branch, or seven stages, the seventh floor then comprises one hundred and twenty-eight portions of seventh row each forming a branch .

The interference arm of each branch has a first end connected to the reference arm and the measuring arm, and a second end. The light output of the light guide is formed by the second end of the interference arm of each branch.

In this example, the interference arm of each branch is divided at its second end into a first sub-arm, a second sub-arm and a third sub-arm. The light output of the light guide is thus formed by all of the three sub-arms of each of the branches.

[0087] In a photonic chip, the interface 37 ¹⁰ is an optical detector capable of measuring at least one optical parameter depending on the change in local property resulting from the interaction temporary receptors/analyte(s). For example, the optical detector can measure the light intensity of the light beam at the output of connection 37 ⁸ .

[0088] In the variant of the ^1st embodiment of the chip test system according to the invention, shown in the photograph of Figure 3, the input 37 and output 38 blocks differ slightly on the structural level from this first embodiment.

The interface 37 ¹⁰ is an electronic card controlling an image sensor or digital imager (not visible in Figure 3 and corresponding to the tip 37 ⁹ of the ^1st embodiment of Figures 1 & 2). Connection 37 ⁸ connects interface 37 ¹⁰ and the image sensor or digital imager.

The arm 31 is fixed and the arm 32 is articulated, relative to the fixed frame 2. Only the assembly "plate 4 of chips 5/support 6' is movable in the directions XYZ relative to the input 37 and output blocks 38.

[0089] The ^2nd embodiment of the system 1' according to the invention shown in Figures 6 and 7 is characterized by a test structure 3', in one piece, mounted on a fixed frame 2'. In this ^2nd embodiment, the same references added with a prime' symbol designate the same parts/elements as for the ^1st embodiment.

[0090] This one-piece test structure 3' is constituted by a ring 40' fixed to the frame 2' by 4 bolts 50'. This 40' ring carries a 41' diametrical cradle.

The latter comprises from the peripheral ring 40' towards the center and symmetrically with respect to this center, a bracket 42' formed of two radial arrows 43' fixed, by their peripheral end to the ring 40' and to the frame 3 ', using one of the 50' bolts. The other 2 ends of the radial arrows 43' converge towards a bar 44' which is secured to a lower plate 45'. The two plates 45', symmetrical with respect to the center, are connected to each other by two parallel beams 46' and contained in a plane parallel to the horizontal plane XY. The two symmetrical 45' plates and the 2 parallel 46' beams form a rectangular frame. From the 4 corners of this frame extend, downwards and towards the center, four hangers 47' which converge to a base 48', to which they are fixed. This base 48' is arranged in a plane parallel to the horizontal plane XY and includes the light or electrical energy source 38 ⁴ ', the cavity element 37 ³ ' designed to define by tight contact with the plate 4' of chips 5' the test chamber 37 ⁴ ', and the optical or electronic interface 37 ¹⁰ ' (optical detector/camera). The cavity element 37 ³ ' is connected to the inlet 37 ⁵ ' and evacuation 37 ⁶ ' conduits of the test fluid.

The plate 45' located in the left part of the ring 40' serves as a support for 3 electronic cards or interfaces 37 ¹⁰ ', controlling an image sensor or digital imager (not visible in Figures 6 & 7 and corresponding to the tip 37 ⁹ of the ^1st embodiment of Figures 1 &2).

[0091] The test fluid is, for example, chosen from volatile organic compounds such as ethanol, octanal or beta-pinene.

Processes

[0092] The invention also relates to a serial test method implementing the aforementioned test system. [0093] Step T1: Placement of a PP/S assembly consisting of a plate of semiconductor chips resting on a support, facing a test structure according to the invention, in a position P° preliminary to the test .

The support is positioned outside the robot "probe/ ¹ ' for handling the PP/S assembly "plate 4 of chips 5/support G'. The operator places the plate 4 on the support 6 manually. The support 6 is pierced with a series of holes which form an integral part of a suction system making it possible to hold the plate 4 in place on this support 6. The operator activates this suction. The now fixed PP/S set is placed with regard to test structure 3.

According to a variant, it is possible to equip the "probe/ ¹ " with an automatic plate loader. In this case, the operator places a cassette containing one or more plates, in the location of the "probe/ ¹ " provided for this purpose. The "probe/ ¹ " then automatically loads the desired plate onto the support 6.

[0094] Step T2: Positioning, along the axes X, Y, Z, of the plate to be tested against the cavity element of the test structure, for each of the chips on this plate;

T 2.1: Negative position. XY of J ' en set m bl e. PP/S in _vjs _; to _: y is. d.'u does not chip. has. test :

Support 6 is motorized on 3 axes. The handling robot "probe/ ¹ " is equipped with cameras which locate marks on the chips 5 making it possible to position the PP/S assembly with respect to the test structure 3.

T2.2: Z positioning of the PP/S assembly, so that the periphery of a chip to be tested is in sealed contact with the cavity element, more precisely with , as shown in the example of Figure 5 , the peripheral border of this cavity element:

The Z heights of the test structure and the PP/S assembly are known and calibrated in the control unit which controls the position of the PP/S assembly, and therefore the distance between the PP/S assembly and structure 3 test. This control unit begins to bring the periphery of the chip 5 into tight contact with the peripheral jointing edge of the cavity element.

[0095] Step T3: Implementation of at least one test sequence on the chip in sealed contact with the cavity element of the test structure. This test sequence is carried out by implementing a circulation of fluid(s) in the sealed fluid test chamber 37 ⁴ , delimited by the cavity element 37 ³ .

This step can last between 30s and 5 minutes.

[0096] Possible step T4: Identification of defective chips

Assignment or not of a predefined defective status to the chip tested, depending on the results of step T3.

[0097] Possible step T5: Interpretation of the parameter(s) of the chip tested, measured in T3.

[0098] Step T2': Repositioning of the PP/S assembly in position P° preliminary to test T2'.1: Z positioning of the PP/S assembly:

Thanks to the motorized support 6 as in T2.2, downward movement of a sufficient distance, for example between 100 and 900 micrometers, to release PP/S and allow its subsequent positioning in XY; T 2' .2: Position does not lie. XY of..the set. PP/S .pou. r .a..return, in. position. P°:

This positioning is carried out like T2.1 using the motorized support 6.

The sequence of steps described above is repeated a number of times corresponding to the number of chips to be tested.

[0100] According to another “process” aspect of the invention, the test system that it concerns can be used during the mass production of optronic and/or electronic chips.

Examples

[0101] The test system implemented is that combining the first embodiment and the variant of this first mode described above and, respectively, in Figures 1, 2, 4 and 5, on the one hand, and in Figure 3. The "prober" robot for handling the PP/S assembly "plate 4 of chips 5/support 6" of this device is Prober SUMMIT200 equipment from FormFactor. A control unit manages the commands of this “prober” robot.

1. The operator installs a silicon plate 4 to be tested on the “chuck” support 3 of the “probe/” robot. Thanks to the control unit, the PP/S assembly then aligns opposite the test structure 3. The latter is equipped with 2 arms 31,32. The arm 32 is provided with an optical fiber 38 ³ for conveying the light energy coming from the source 38 ⁴ (Figure 2). The arm 31 is equipped with a digital imager controlled by the optical interface 37 ¹⁰ imager type (Figure 3).

2. The silicon plate 4 is made up of several hundred photonic chips 5 to be tested. Each chip 5 has a diffraction grating coupler (input) and a matrix of diffraction grating couplers (output).

3. The PP/S assembly is positioned in X/Y in front of the test structure 3, in order to have the optical fiber 38 ³ in front of the input coupler, and the imager of the optical interface 37 ¹⁰ in front of the output coupler matrix.

4. The PP/S assembly, once correctly aligned in XY, is positioned in Z, in order to seal the fluidic test chamber 37 ⁴ , defined by the contact between the jointing edge of the cavity element 37 ³ and the periphery of chip 5 to be tested.

5. Beta-pinene in gaseous form is then injected by suction into the test fluid chamber 37 ⁴ .

6. The reaction of the analytes on the transducers is monitored and recorded by the imager. In the figure (VOC graph), the different phases are visible. (Passage of air, beta-pinene, air).

Figure 3 illustrates superimposed temporal diagrams of N = 19 reflectance signals obtained on a fluid sample according to a predefined measurement protocol in which: the reactive sites 18 are exposed to a dry air environment without a fluid sample for a first reference phase PH1, they are then exposed to the fluid sample during a second analytical phase PH2 of adsorption, and they are finally exposed again to the dry air environment without fluid sample during a third final phase PH3 desorption. 7. Interpretation of the OK/NOK measurement

8. The PP/S assembly repositions itself and repeats the same test on an adjacent chip.

[0102] Beyond the manufacture of the components which are the optronic or electronic chips, the test system according to the invention is integrated, obviously, into the manufacture of optronic/electronic devices comprising the chips tested in accordance with the invention.

[0103] The optronic/electronic devices considered may be of the type comprising:

- a consumable and interchangeable sensor comprising i) a photonic chip comprising at least one fluidic measuring chamber comprising a light guide in which receptors are arranged, e.g. temporary, capable of interacting with the analyte(s) present in the fluid, the interaction causing a change in local property(s), the light guide comprising a light inlet and a light outlet, and ii) a cover, for example secured to the photonic chip, and comprising an opening adapted to admit the fluid into the measuring chamber and to discharge the fluid from the measuring chamber;

- a sensor support comprising a housing in which the sensor is intended to be installed reversibly;

* an optical detector arranged opposite the light output of the light guide and capable of measuring an optical parameter of the light beam depending on the change in local property, at the output of the light guide.

[0104] The light guide is, for example, of the type described above in paragraph [0084],

[0105] The transducer which makes it possible to convert the change in local property into an electronic signal expressing the change in local property, can be of the type comprising a coherent light source and an optical detector. The light source can for example be a laser diode (VCSEL). The light source is aligned with the light input so that the light source can emit a coherent light beam into the light guide of the photonic chip. The light beam emitted by the light source has an emission axis substantially perpendicular to the upper surface of the cover. The alignment between the light source and the light input of the light guide is thus facilitated. Alternatively, the axis of emission of the light beam could form a non-zero angle with an axis perpendicular to the upper surface of the cover. For example, the angle may be less than 5°, or even less than 1°. The optical detector is positioned facing the light output of the light guide and can measure a optical parameter of the light beam depending on the change in local property, at the exit of the light guide. For example, the optical detector can measure the light intensity of the light beam at the exit of the light guide, or the light power of the light beam at the exit from the light guide. The optical detector is positioned on the closing element.

[0106] The assembly of the operational chips sorted by the test to the test system according to the invention to the rest of the consumable and interchangeable sensor, as well as the assembly of this sensor to the rest of the optronic/electronic device for analyzing at least one analyte present in a fluid, are methods known in the technical field considered.

[0107] The analytes can be contained in a gaseous or liquid fluid.

[0108] The gaseous fluids may include volatile organic compounds, in particular odoriferous VOCs. As examples, we can mention: octanal (citrus), vanillin (vanilla), linalyl acetate (lavender).

[0109] The liquid fluids may include organic compounds, in particular organic compounds constituting flavors.

[0110] The chips 5 tested in these examples are those which are integrated into an optronic device of the type of those produced and marketed by the company Aryballe and described above in § [0104] to [0107],

[0111] In these chips, the fluid test chamber 37 ⁴ comprises, for example, 60 receptors capable of interacting with the analyte present in the fluid, this interaction causing a change in local property(s). Each receptor is an olfactory detector, for example, a biosensor designed to interact with a particular family of volatile organic compounds. In practice, each olfactory detector on each receptor may comprise a molecule, such as a peptide immobilized on a substrate or a polymer coated on a surface, complementary to the volatile organic compounds of the family associated with this olfactory detector. In this chamber 37 ⁴ , the receivers are arranged in a matrix manner on a positioning grid, that is to say they are respectively located at the center of the cells of this grid.

[0112] The transducer for changing local property(s) caused by the interaction between the receptors and the analyte(s) capable of converting this change into an electronic signal expressing this change, can operate according to a surface plasmon resonance (SPR) imaging principle configured to measure any change in refractive index due to interaction of the fluid sample with any reactive site through a plasmonic effect. The electronic signal S is a sequence of grayscale images of the olfactory receptors/biodetectors.

Alternatively, the transducer may be a Mach-Zehnder interferometer system configured to measure any change in refractive index due to interaction of the fluid sample with any reactive site through a detectable phase shift between an arm of reference of the interferometer and a detection arm on which any reactive site is placed. Such a transducer emits an electronic signal S which is a sequence of phase-shifted images of the olfactory receptors/biodetectors. In another variant, the transducer may be a nano- or micro-electromechanical system (NEMS or MEMS) configured to measure a change in resonance frequency of a vibrating membrane, on which a reactive site is arranged. The olfactory receptors/biodetectors are for example arranged on a matrix of NEMS or MEMS vibrating membranes in order to deliver an electronic signal S which is a sequence of resonance frequency shift signals of the olfactory receptors/biodetectors.

Regardless of the transducer, the general idea is

* to functionalize olfactory receptors/biodetectors (i.e. biosensors, polymers, carbon nanotubes, etc.) so that they adsorb and desorb volatile organic compounds in a differentiated manner,

* to obtain a differentiated molecular interaction response from the reactive sites,

* and to amplify the response in the form of an electronic signal S, using a physical transduction device.

In this example, there are 22 olfactory receptors/biodetectors in the system.

[0113] In the examples, the test process using the system according to the invention operates as follows:

5. Interpretation of the measurement

6. The PP/S assembly repositions itself and repeats the same test on an adjacent chip.

[0114] Example 1: Evaluation of the tightness of the test system according to the invention

[0115] The tightness of the system can be validated by a pressure test: The transducers are sensitive to the pressure to which they are subjected. The signal they transmit is a linear image of the pressure exerted on their surfaces. The signal/pressure gain being known, it is easy to determine it and thus validate the tightness of the system.

Figure 8 attached illustrates a chronogram where the 22 superimposed signals are represented [as a function of time (s)] corresponding to the 22 phase shifts A (in radians) of light waves which are measured by transducers coupled to the 22 olfactory receptors/biodetectors of the same chip, obtained according to a predefined measurement protocol.

In phase PH1, air under atmospheric pressure is circulated (1 bar). We then apply a pressure of 3 bars (PH2) in the closed system (the cavity where the transducers are located is under a pressure of 3 bars). Then the fluidic circuit restores the system to atmospheric pressure (PH3) of 1 bar.

The homogeneity of the responses during pressurization, shown in Figure 8, confirm the tightness of the test chamber defined by the system according to the invention, once contact has been established between the cavity element of the system and at least part of the chip.

[0116] Example 2: Tests of chips using the system according to the invention

[0117] In this example, the fluidic test chamber 37 ⁴ comprises 22 olfactory receptors/biodetectors.

[0118] After point 4 of § [114], air, beta-pinene in gaseous form, then air, is injected by suction into the fluidic test chamber 37 ⁴ .

[0119] The reaction of the analytes on the transducers is monitored and recorded by the imager.

[0120] In Figure 9 attached showing the chronograms (VOC graphs) where the 22 superimposed signals are represented [as a function of time in s], corresponding to the 22 phase shifts A (in radians) of the light waves, which are measured by the transducers coupled to the olfactory receptors/biodetectors of the chip tested. The different phases are visible. (Passage of air, beta-pinene, air).

[0121] The olfactory receptors/biodetectors are exposed to a dry air environment without fluid sampling during a first reference phase PH1.

[0122] They are then exposed to the fluid sample of beta-pinene during a second analytical PH2 adsorption phase, which is characterized by a homogeneous rise in plateau of the 22 angular shift signals A of the light waves.

[0123] They are finally exposed again to the dry air environment without fluid sampling during a third final PH3 desorption phase.

Claims

[Claim 1] System (1.1') for testing chips (5.5'), on the one hand, designed for the analysis of at least one analyte present in a fluid, and, on the other hand, produced on wafers (4.4') of semiconductor(s), preferably silicon;

* each of these plates (4.4'), on the one hand, comprising a plurality of these chips (5.5'), and, on the other hand, being intended to be cut into chips (5.5') individualized;

* each of these chips (5.5') comprising:

- at least one energy input, preferably light and/or electrical;

* this system (1,1') comprises a fixed frame (2,2'), a test structure (3,3') secured to the frame (2,2') and capable of cooperating, for the test, with at minus one plate (4.4') resting on a support (6.6');

* the PP/S plate (4.4')/support (6.6') assembly, and possibly the test structure (3.3'), being movable relative to the frame (2.2') );

* the test structure (3.3') includes:

- a light energy source (38 ⁴ , 38 ⁴ '), and possibly a source of electrical energy;

- at least one optical interface (37 ¹⁰ , 37 ¹⁰ '), and, optionally an electronic interface, capable of measuring at least one optical parameter and, optionally at least one electronic parameter, depending on the change in local property resulting from the interaction receptors/analyte(s);

- at least one cavity element (37 ³ , 37 ³ ') capable of being placed in sealed contact, reversibly, with at least one chip (5.5') of the plate (4.4') to define a chamber waterproof test box (37 ⁴ , 37 ⁴ '), intended to receive the fluid containing the analyte(s) intended for the test of this chip (5.5');

* this system (1,1 ') also includes at least one unit for controlling the test structure and, more generally, the test process.

[Claim 2] System (1,1 ') according to claim 1 characterized in that:

* the chips (5.5') are photonic chips which each comprise at least one light guide provided with at least one light input and at least one light output;

* the test structure (3.3') comprises at least one source (38 ⁴ , 38 ⁴ ') of coherent light capable of emitting a coherent light beam into the light input of the light guide of the chip;

* the optical interface (37 ¹⁰ , 37 ¹⁰ ') comprises at least one optical detector arranged facing the light output of the light guide and capable of measuring at least one optical parameter of the light beam depending on the resulting change in local property of the receptor/analyte(s) interaction.

[Claim 3] System (1,1 ') according to claim 1 characterized in that:

* the chips (5.5') are electronic chips which include at least one electrical input and at least one electrical output;

* the electronic interface (37 ¹⁰ , 37 ¹⁰ ') is capable of measuring at least one electrical parameter, of voltage or intensity preference depending on the local property change resulting from the receptor/analyte(s) interaction.

[Claim 4] System (1, 1 ') according to at least one of the preceding claims characterized in that the cavity element (37 ³ , 37 ³ ') is provided with at least one admission opening (76 ¹ ) in the sealed chamber (37 ⁴ ) of the fluid containing the analyte or analytes and at least one evacuation opening (76 ² ) of said fluid, outside this chamber, these admission openings (76 ¹ ) and fluid evacuation (76 ² ) being connected to fluid inlet (76 ¹ ) and evacuation (76 ² ) conduits, respectively.

[Claim 5] System (1, 1 ') according to at least one of the preceding claims characterized in that the cavity element (37 ³ , 37 ³ ') is provided with a joint (75) contributing to sealing of the test chamber (37 ⁴ , 37 ⁴ '), once contact has been established between the cavity element (37 ³ , 37 ³ ') and at least part of the chip (5.5').

[Claim 6] System (1,1 ') according to claim 5 characterized in that the jointing (75) is made from an elastic material with a Shore D hardness of between 40 and 80, and preferably between 50 and 65 ; this material being advantageously chosen from the group comprising: thermoplastic fluoropolymers, in particular polytetrafluoroethylene (PTFE e.g. Teflon®), poly(vinyl fluoride) (PVF e.g. Tedlar®), poly(vinylidene fluoride) (PVDF), polychlorotrifluoroethylene (PCTFE), perfluoroalkoxy (PFA); fluorinated ethylene propylene (FEP), ethylene tetrafluoroethylene (ETFE), polyethylenechlorotrifluoroethylene (ECTFE), perfluoropolyether (PFPE), perfluorosulfonic acid (PFSA), or perfluoropolyoxetane; fluoroelastomers, in particular FKMs (ASTM 1418 standard); perfluoroelastomers, in particular FFKMs (ASTM 1418 standard); and their mixtures/alloys.

[Claim 7] System (1,1') according to at least one of the preceding claims characterized in that the test structure (3,3') comprises at least two arms (31,32):

• a first arm (31) carrying the cavity element (37 ³ , 37 ³ ');

• a second arm (32) carrying the energy source (38 ⁴ ) or the interface (37 ¹⁰ ); preferably from the energy source (38 ⁴ ), while the interface (37 ¹⁰ ) is carried by the first arm (31).

[Claim 8] System (1,1') according to at least one of claims 1 to 6 characterized in that the test structure (3,3') is in one piece.

[Claim 9] System (1) according to claim 7 characterized

• in that the first (31) and the second (32) arm each comprises, relative to the frame (2), on the one hand, a distal region carrying at least one of the following components: cavitary element ( 37 ³ ), energy source (38 ⁴ ), interface (37 ¹⁰ ); and, on the other hand, a proximal region;

• in that the first (31) and the second (32) arm are mounted on the frame (2);

• and in that at least the first arm (31) is movable relative to the frame (2).

[Claim 10] System (1, 1 ') according to at least one of the preceding claims characterized in that the PP/S assembly plate (4,4') of chips (5,5')/support (6, 6') is movable, in a three-dimensional space X,Y,Z, relative to the test structure (3,3').

[Claim 11] Method for serial testing of chips (5.5') implementing the system (1,1') according to at least one of the preceding claims, in which the recurring sequence of operations is implemented following:

* we place at least one PP/S assembly consisting of a plate (4.4') of semiconductor chips (5.5') resting on a support (6.6'), in a position P° preliminary to test, facing a test structure (3.3') comprising

- an energy source (38 ⁴ , 38 ⁴ ') preferably light and/or electric;

- at least one optical and/or electronic interface (37 ¹⁰ , 37 ¹⁰ ') capable of measuring at least one optical and/or electronic parameter depending on the change in local property resulting from the receptor/analyte(s) interaction;

- at least one cavity element (37 ³ , 37 ³ ') capable of coming into sealed contact, by moving the PP/S plate (4.4') of chips (5.5')/support (6, 6'), relative to the test structure (3.3'), with a chip (5.5') of the plate (4.4') to define a fluidic chamber (37 ⁴ , 37 ⁴ ') of test, intended to receive the fluid containing the analyte(s) intended for the test of the chip (5.5');

- at least one transducer for changing local property(s) caused by the interaction between the receptors and the analyte, capable of converting the change in local property(s) into an optical or electronic signal expressing this change;

* the plate ⁽ 4.4') to ^be tested is positioned along the axes chips (5.5') to be tested from this plate (4.4');

* we implement at least one test sequence for each of the chips (5.5'), after each X,Y,Z positioning sequence;

* possibly, using the test, any defective chips (5.5') on each plate (4.4') are identified;

* possibly, using the test, one or more parameters of the chips (5.5') of each plate (4.4') are measured;

[Claim 12] Method for mass manufacturing of chips (5.5'), implementing the test system according to one of claims 1 to 10 or the method according to claim 1 1, characterized in that it consists essentially to:

* manufacture wafers (4.4') of semiconductor(s), preferably in silicon, each of these wafers (4.4') comprising a plurality of chips (5.5'), each comprising:

- at least one energy input (38), preferably light and/or electrical;

- and at least one energy output (37), preferably light and/or electrical;;

* functionalize each chip (5.5') with receptors capable of interacting with an analyte present in a fluid to be analyzed, this interaction causing a change in local property(s);

* test the chips (5.5') using the method according to claim 1 1;

* optionally, measure one or more parameters of the chips (5.5') using the method according to claim 1 1;

* cut the tested plates (4.4') into individualized chips (5.5');

* separate the defective chips (5.5') from the non-defective chips (5.5'), that is to say operational chips (5.5').

[Claim 13] Operational chips (5.5') obtained by the method according to claim 12.

[Claim 14] Method for manufacturing an optronic/electronic device for analyzing at least one analyte present in a fluid, in which chips tested using the test system according to one of claims 1 are used to 10 or tested by the method according to claim 1 1 or obtained by the method according to claim 12, this device comprising:

- a consumable and interchangeable sensor comprising: i) a photonic chip (5.5') comprising at least one fluidic measuring chamber comprising a light guide in which receptors capable of interacting with the analyte(s) are arranged (s) present in the fluid, the interaction causing a change in local property(ies), the light guide comprising a light inlet and a light outlet, and ii) a cover comprising an opening adapted to admit the fluid into the fluidic measuring chamber and to evacuate the fluid from this chamber;

* to assemble on the cover, at least one operational chip (5.5') according to claim 13 or obtained at the end of the process according to claim 12, to produce the consumable and interchangeable sensor,

[Claim 15] Method according to claim 14 in which the optronic/electronic analysis device concerns the analysis of at least one analyte which is:

* a volatile target compound or the combination of volatile target compounds, preferably a volatile organic compound (VOC) or a mixture of VOCs; Or

* a liquid target compound or the combination of liquid target compounds, preferably an organic liquid or a mixture of organic liquids.