WO2024055348A1

WO2024055348A1 - Conveying device for wafer cassettes

Info

Publication number: WO2024055348A1
Application number: PCT/CN2022/120668
Authority: WO
Inventors: 蒋孝恩; 张宁娜; 吴挺; 朱蓉; 陈定操
Original assignee: 台湾积体电路制造股份有限公司; 台积电(中国)有限公司
Priority date: 2022-09-14
Filing date: 2022-09-22
Publication date: 2024-03-21
Also published as: CN217983295U

Abstract

Provided in the embodiments of the present application is a conveying device for wafer cassettes. The conveying device comprises a rack and a conveying mechanism, wherein the conveying mechanism comprises two conveying units, which are arranged spaced apart in a first direction of the rack; the two conveying units perform conveying in opposite directions; each conveying unit comprises a linear module, which extends in a second direction, and a bearing module connected to the linear module; the linear module is used for driving the bearing module to move in the second direction; the bearing module comprises a first driving member and a bearing member connected to the first driving member; and the first driving member is used for driving the bearing member to rotate, and an output shaft of the first driving member is arranged in the first direction, the first direction and the second direction being configured to intersect with each other.

Description

Wafer cassette conveying device

Cross-references to related applications

This application claims priority to Chinese patent application 202222427251.0 titled "Conveying Device for Wafer Cassette" filed on September 14, 2022. The entire content of this application is incorporated herein by reference.

Technical field

The present application relates to the field of semiconductor manufacturing technology, and in particular to a transport device for a wafer box.

Background technique

Wafer refers to the silicon wafer material used to process and manufacture semiconductor chips. During the production and processing of semiconductor chips, due to the high performance requirements of semiconductor chips, wafers are generally placed in wafer boxes to prevent the wafers from being processed during processing. damaged in the process.

Moreover, due to the complexity of the wafer processing process, the finished semiconductor chip needs to be processed by multiple process modules in the production line before the final semiconductor chip can be obtained. Therefore, during the wafer processing process, the wafer box is usually transported to the corresponding wafer box through a transport device. Process module. Although the conveying devices currently on the market can complete the conveying of wafer cassettes between process modules, their conveying efficiency is low, thereby reducing the overall processing efficiency of semiconductor chips and thus affecting the chip productivity of the factory.

Therefore, a new conveying device is urgently needed to solve the above problems.

Contents of the invention

Embodiments of the present application provide a transport device for a wafer box, which can solve the technical problem of low transport efficiency of the transport device for the wafer box.

Embodiments of the present application provide a conveying device for a wafer cassette. The conveying device includes a base frame and a conveying mechanism. The conveying mechanism includes two conveying units spaced apart along the first direction of the base frame. The conveying directions of the two conveying units are opposite. Each conveying unit includes a linear module extending along the second direction and a load-bearing module connected to the linear module. The linear module is used to drive the load-bearing module to move in the second direction. The load-bearing module includes a first driving member and a The first driving member is connected to the bearing member. The first driving member is used to drive the bearing member to rotate, and the output shaft of the first driving member is arranged along the first direction; wherein the first direction and the second direction are arranged to intersect.

In some embodiments, the bearing module further includes two first positioning parts arranged oppositely, and the first positioning parts are connected to the bearing member.

In some embodiments, the load-bearing module further includes two second positioning parts arranged opposite each other. The second positioning parts are connected to the load-bearing member. The arrangement direction of the two first positioning parts is consistent with the arrangement direction of the two second positioning parts. The directions are not the same.

In some embodiments, the load-bearing module further includes a second driving member, a connecting part, a first connecting rod and a second connecting rod. The connecting part is respectively connected to the output shaft of the second driving member and a first positioning part. The first Two ends of the connecting rod are respectively hinged with the connecting part and a second positioning part, and two ends of the second connecting rod are respectively hinged with the connecting part and another second positioning part.

In some embodiments, the bearing member includes a support portion, a rotating plate and a bearing plate spaced apart along the first direction, the rotating plate is connected to the output shaft of the first driving member, and the bearing plate and the rotating plate are connected through the supporting portion.

In some embodiments, the bearing module further includes a plurality of balls arranged on the bearing member, and the plurality of balls are arranged at intervals.

In some embodiments, the carrier module further includes a sensor disposed on the carrier, and the sensor is used to detect whether the wafer cassette is placed on the carrier.

In some embodiments, the linear module includes a third driving member, a screw rod and a sliding table. The output shaft of the third driving member is connected to the screw rod. The screw rod extends along the second direction. The sliding table is threadedly connected to the screw rod to carry the load. The module is connected to the slide.

In some embodiments, the linear module further includes a shell connected to the base frame, and the screw rod is contained in the shell; the slide table includes a slide table body and a cover plate connected to the slide table body, and the cover plate is located outside the shell. , and connected to the load-bearing module.

In some embodiments, the housing includes a base with an opening and a flexible belt covering the opening. The slide body includes a fixed part and two first connecting axes respectively connected to the fixed part. The two first connecting axes extend along the second The directions are set on opposite sides of the fixed part, and there is a through hole between the first connecting shaft and the fixed part. The flexible belt passes through the two through holes in sequence, and the first connecting shaft is located outside the housing.

The wafer cassette transport device provided by the embodiment of the present application is provided with two transport units spaced apart along the first direction on the base frame, and each transport unit includes a linear module extending along the second direction and is connected to the linear module. The carrying module is driven by the linear module to move in the second direction to transport the wafer cassette; and, since the transporting directions of the two transporting units are opposite, the above two transporting units can simultaneously transport the wafer cassette. The wafer box is transported in two opposite directions, thereby improving the transport efficiency of the wafer box on the chip production line; at the same time, because the carrying module includes a first driving part and a carrying part connected to the first driving part, and the first driving part The output shaft is arranged along the first direction, so that the first driving member drives the bearing member to rotate, driving the wafer box located on the bearing member to rotate to a corresponding angle to facilitate the pick-up and placement of the wafer box.

The above description is only an overview of the technical solutions of the present application. In order to have a clearer understanding of the technical means of the present application, they can be implemented according to the content of the description, and in order to make the above and other purposes, features and advantages of the present application more obvious and understandable. , the specific implementation methods of the present application are specifically listed below.

Description of drawings

In order to explain the technical solutions of the embodiments of the present application more clearly, the drawings required to be used in the embodiments of the present application will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. Those of ordinary skill in the art can also obtain other drawings based on the drawings without exerting creative efforts.

Figure 1 is a schematic structural diagram of a transport device for a wafer box provided by an embodiment of the present application;

Figure 2 is a schematic structural diagram of a carrying module of a wafer box transport device provided by an embodiment of the present application;

Figure 3 is another structural schematic diagram of the carrying module of the wafer box transport device provided by the embodiment of the present application;

Figure 4 is another structural schematic diagram of the carrying module of the wafer box transport device provided by the embodiment of the present application;

Figure 5 is a schematic structural diagram of the bearing member of the wafer box transport device provided by the embodiment of the present application;

Figure 6 is another structural schematic diagram of the bearing member of the wafer box transport device provided by the embodiment of the present application;

Figure 7 is a schematic structural diagram of a linear module in a wafer box transport device provided by an embodiment of the present application;

FIG. 8 is an exploded view of the linear module in the wafer box transport device provided by the embodiment of the present application.

Detailed ways

The embodiments of the present application will be described in further detail below with reference to the accompanying drawings and examples. The detailed description of the following embodiments and the accompanying drawings are used to illustrate the principles of the present application, but cannot be used to limit the scope of the present application, that is, the present application is not limited to the described embodiments.

In the description of this application, it should be noted that, unless otherwise stated, "plurality" means more than two; the terms "upper", "lower", "left", "right", "inside", " The orientation or positional relationship indicated such as "outside" is only for the convenience of describing the present application and simplifying the description. It does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation of the present application. Application restrictions. Furthermore, the terms "first," "second," "third," etc. are used for descriptive purposes only and are not to be construed as indicating or implying relative importance. "Vertical" is not vertical in the strict sense, but within the allowable error range. "Parallel" is not parallel in the strict sense, but within the allowable error range.

The directional words appearing in the following description are the directions shown in the figures and do not limit the specific structure of the present application. In the description of this application, it should also be noted that, unless otherwise clearly stated and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense. For example, it can be a fixed connection or a removable connection. Detachable connection, or integral connection; it can be directly connected or indirectly connected through an intermediate medium. For those of ordinary skill in the art, the specific meanings of the above terms in this application may be understood based on specific circumstances.

FIG. 1 is a schematic structural diagram of a wafer box transport device provided by an embodiment of the present application; FIG. 2 is a schematic structural diagram of a carrying module of the wafer box transport device provided by an embodiment of the present application.

As shown in Figures 1 and 2, embodiments of the present application provide a conveying device for a wafer cassette 100. The conveying device includes a conveying mechanism 200 and a base frame 300; the conveying mechanism 200 includes spaced apart wafer cassettes arranged along the first direction of the base frame 300. Two conveying units 210. The conveying directions of the two conveying units 210 are opposite. Each conveying unit 210 includes a linear module 211 extending along the second direction and a load-bearing module 212 connected to the linear module 211. The linear module 211 is When driving the bearing module 212 to move in the second direction, the bearing module 212 includes a first driving member 213 and a bearing member 214 connected to the first driving member 213. The first driving member 213 is used to drive the bearing member 214 to rotate, and the The output shaft of a driving member 213 is arranged along the first direction; wherein the first direction and the second direction are arranged to intersect.

The base frame 300 is used to support the conveying mechanism 200 so that the conveying mechanism 200 conveys the wafer box 100 on the base frame 300; the carrying module 212 in the conveying unit 210 is used to carry the wafer box 100. Specifically, the carrying module The carrier 214 in 212 can be used to carry the wafer box 100. The carrier 214 can be a plate structure, a block structure or a combination of other structures; the linear module 211 in the transport unit 210 is used to drive the carrier module. The group 212 moves along the second direction to transport the wafer cassette 100 located in the carrier module 212 along the second direction.

It can be understood that the first direction and the second direction are arranged to intersect, that is, the angle between the first direction and the second direction may be an acute angle or a right angle, that is, the first direction and the second direction may be perpendicular to each other. ; For example, the first direction may be a vertical direction, and the second direction may be a horizontal direction. For ease of understanding, using the space rectangular coordinate system as a reference, the first direction in all embodiments of the present application is set to the direction of the X-axis, and the second direction in all embodiments of the present application is set to the direction of the Y-axis.

The first driving member 213 can be any type of rotary driving motor. Specifically, the output shaft of the first driving member 213 is arranged along the first direction and drives the bearing member 214 to rotate, so that the wafer box 100 located on the bearing member 214 can rotate at a certain angle.

In practical applications, since one side of the wafer box 100 has a lid structure, the lid structure can be opened to access the wafer boat inside the wafer box 100, and the other side opposite to the lid is a closed box body. structure, therefore, when placing the wafer box 100 on the carrier 214 or removing the wafer box 100 from the carrier 214 , it is necessary to control the robot to grasp the corresponding gripper located on the box structure of the wafer box 100 position to prevent the lid structure of the wafer box 100 from opening and causing the wafer boat or wafer inside to fall; in the chip production line, the position of the manipulator is generally fixed, that is, the manipulator only moves from a fixed angle or At this time, if the corresponding grabbing position of the wafer box 100 is offset and does not correspond to the position of the robot, it will be difficult for the robot to pick and place the wafer box 100, and even cause The wafer boat or wafer inside the wafer box 100 falls. Therefore, in order to avoid the above problems, the present application sets a first driving member 213 to be connected to the carrier 214. Before the robot grasps the wafer box 100, the first drive member 213 is connected to the carrier member 214. The driving member 213 drives the supporting member 214 to rotate, so that the corresponding grabbing position of the wafer box 100 on the supporting member 214 corresponds to the position of the robot, so that the robot can easily pick and place the wafer box 100 .

The transport device of the wafer box 100 provided by the embodiment of the present application is provided by two transport units 210 spaced apart along the first direction on the base frame 300, and each transport unit 210 includes a linear module 211 extending along the second direction and The carrying module 212 is connected to the linear module 211, so that the linear module 211 drives the carrying module 212 carrying the wafer box 100 to move in the second direction to realize the transportation of the wafer box 100; and, due to the two The conveying directions of the conveying units 210 are opposite. Therefore, the two conveying units 210 can convey the wafer box 100 in two opposite directions at the same time, thereby improving the conveying efficiency of the wafer box 100 on the chip production line; at the same time, due to the carrying module 212 includes a first driving member 213 and a bearing member 214 connected to the first driving member 213, and the output shaft of the first driving member 213 is arranged along the first direction, so that the first driving member 213 drives the bearing member 214 to rotate, driving The wafer box 100 located on the carrier 214 is rotated to the corresponding grabbing position to facilitate the picking and placing of the wafer box 100 .

Please continue to refer to FIG. 2 . In some embodiments, the load-bearing module 212 further includes two first positioning parts 215 arranged oppositely. The first positioning parts 215 are connected to the load-bearing member 214 .

The two first positioning parts 215 may be spaced apart along the second direction, and the distance between the two first positioning parts 215 may correspond to the size of the placed wafer box 100 , for example, the two first positioning parts 215 The spacing distance between them can be slightly larger than the size of the wafer box 100 to ensure that the wafer box 100 can be sandwiched between the two first positioning parts 215 and to prevent the wafer box 100 from being damaged during transportation. Larger deflections may even fall off the carrier 214 .

In this embodiment, two opposite first positioning parts 215 are connected to the carrier 214 to limit the position of the wafer box 100 placed on the carrier 214, so as to limit the position of the wafer box 100 on the carrier 214. The movement on 214 prevents the transport unit 210 from moving the position of the wafer box 100 during the process of transporting the wafer box 100, which may affect subsequent unloading operations or even cause the wafer box 100 to fall.

FIG. 3 is another structural schematic diagram of the carrying module of the transport device of the wafer cassette 100 provided by the embodiment of the present application.

As shown in Figure 3, in some embodiments, the load-bearing module 212 also includes two second positioning parts 216 arranged oppositely. The second positioning parts 216 are connected to the load-bearing member 214. The arrangement of the two first positioning parts 215 The direction is different from the arrangement direction of the two second positioning parts 216 .

The two second positioning portions 216 may be spaced apart along a third direction, the third direction may intersect the second direction, and the third direction may be perpendicular to the second direction. When the two second positioning parts 216 are spaced apart along the third direction, the two second positioning parts 216 can be spaced apart along the second direction; of course, the two second positioning parts 216 can also be spaced apart along the second direction. The two first positioning parts 215 are spaced apart along the third direction.

It can be understood that when the first direction is the direction of the X-axis and the second direction is the direction of the Y-axis, the third direction may be the direction of the Z-axis.

In this embodiment, two second positioning parts 216 are arranged oppositely, and the two second positioning parts 216 and the two first positioning parts 215 are arranged in different directions, so that the two second positioning parts 216 are arranged oppositely. After one positioning part 215 positions the wafer box 100 on the carrier plate 223, the position of the wafer box 100 on the carrier plate 223 is further fixed through two second positioning parts 216 to prevent the wafer box 100 from being damaged. Offset or dropped.

FIG. 4 is another structural schematic diagram of the carrying module of the transport device of the wafer box 100 provided by the embodiment of the present application.

As shown in Figure 4, in some embodiments, the load-bearing module 212 also includes a second driving member 217, a connecting part 218, a first connecting rod 219 and a second connecting rod 220. The connecting part 218 is connected to the second driving part 217 respectively. The output shaft is connected to a first positioning part 215. The two ends of the first connecting rod 219 are respectively hinged with the connecting part 218 and a second positioning part 216. The two ends of the second connecting rod 220 are respectively connected with the connecting part 218 and another The second positioning portion 216 is hinged.

The second driving member 217 may be a linear drive motor, for example, the second driving member 217 may be a stepper motor, or the second driving member 217 may be a hydraulic lever, a pneumatic cylinder, etc., for example, the second driving member 217 may be a piston. type hydraulic cylinder, telescopic hydraulic cylinder, etc. The output shaft of the second driving member 217 may be disposed along the second direction, and the output shaft of the second driving member 217 may also be disposed along the third direction. For ease of understanding, in all embodiments of the present application, the second driving member 217 is The output shaft is arranged along the second direction as an example to illustrate each embodiment.

Since the connecting portion 218 is respectively connected to the output shaft of the second driving member 217 and a first positioning portion 215, when the output shaft of the second driving member 217 drives the connecting portion 218 to move in the second direction, the connecting portion 218 drives it. The connected first positioning part 215 moves along the second direction, so that the first positioning part 215 can lock or loosen the wafer box 100 located on the carrying plate 223 along the second direction; due to the two ends of the first link 219 The two ends of the second connecting rod 220 are respectively hinged with the connecting part 218 and another second positioning part 216, so that the second driving member 217 drives the connecting part 218 along the When moving in the second direction, the connecting part 218 can drive the first link 219 and the second link 220 that are hinged thereto to move, so that the two second positioning parts 216 are respectively in the first link 219 and the second link 220. The wafer box 100 is moved along the third direction under the driving force of the third direction, and the wafer box 100 located on the carrying plate 223 is locked or loosened along the third direction, so that during the transportation process of the wafer box 100, through the first positioning part 215 and the two The second positioning part 216 locks the wafer box 100 to prevent the wafer box 100 from shifting or even falling. When it is necessary to pick up and place the wafer box 100, it is only necessary to control the wafer box 100 connected to the connecting part 218. The first positioning part 215 and the two second positioning parts 216 release the wafer box 100, and the wafer box 100 can be easily grasped to pick and place it.

In this embodiment, the connecting portion 218 is respectively connected to the output shaft of the second driving member 217 and a first positioning portion 215, and because both ends of the first connecting rod 219 are respectively connected to the connecting portion 218 and a second positioning portion 216 is hinged, and both ends of the second link 220 are hinged with the connecting portion 218 and the other second positioning portion 216 respectively, so that when the output shaft of the second driving member 217 drives the connecting portion 218 to move in the second direction, the connecting portion 218 The first positioning part 215, the first link 219 and the second link 220 connected thereto can be driven to move, so that the first positioning part 215 moves in the second direction to connect with the first link 219 and the second link respectively. The two connected second positioning parts 216 move along the third direction, thereby locking or loosening the wafer box 100 located on the carrier plate 223 through one first positioning part 215 and two second positioning parts 216, while ensuring While the wafer box 100 will not shift or fall during transportation, the wafer box 100 can be easily picked up and placed on the carrier plate 223, thus saving time in picking up and placing the wafer box 100. Improved wafer processing efficiency.

FIG. 5 is a schematic structural diagram of the bearing member of the transport device of the wafer cassette 100 provided by the embodiment of the present application.

As shown in Figure 5, in some embodiments, the bearing member 214 includes a support portion 221, a rotating plate 222 and a bearing plate 223 spaced apart along the first direction. The rotating plate 222 is connected to the output shaft of the first driving member 213, The bearing plate 223 and the rotating plate 222 are connected through the supporting part 221 .

The carrying plate 223 can be used to carry the wafer cassette 100 that needs to be transported. The carrying plate 223 and the rotating plate 222 are connected through the supporting part 221. Since the rotating plate 222 is connected to the output shaft of the first driving member 213, the first driving member 213 Driven by the output shaft, the rotating plate 222 can rotate synchronously, and drive the bearing plate 223 to also rotate together.

The rotating plate 222 and the bearing plate 223 are spaced apart along the first direction. The distance between the rotating plate 222 and the bearing plate 223 can be determined according to the actual situation. The support portion 221 can be located between the rotating plate 222 and the bearing plate 223, so that This saves space for accommodating the support part 221 to a certain extent. Of course, the support part 221 can also be located outside the rotating plate 222 and the load-bearing plate 223, which is not specifically limited here.

In this embodiment, the bearing member 214 includes a support portion 221, a rotating plate 222 and a bearing plate 223 spaced apart along the first direction. The rotating plate 222 and the bearing plate 223 are connected through the supporting portion 221, and the rotating plate 222 and the third bearing plate 222 are connected to each other through the supporting portion 221. The output shaft of a driving member 213 is connected, so that when the output shaft of the first driving member 213 drives the rotating plate 222 to rotate, the bearing plate 223 also rotates accordingly, so that the corresponding gripper of the wafer box 100 located on the bearing plate 223 The picking position corresponds to the position of the robot, so that the robot can easily pick and place the wafer box 100 .

In some embodiments, the carrier module 212 further includes a first shell, and the carrier 214 is received in the first shell, so that the carrier 214 is relatively sealed from the external environment during the process of transporting the wafer box 100, that is, in a dust-free state. state to improve the service life of the bearing member 214 to a certain extent; the first housing has two opposite first openings along the first direction to expose the side of the rotating plate 222 away from the bearing plate 223 and the bearing plate 223 away from the rotation. One side of the plate 222 , the side where the rotating plate 222 is away from the carrying plate 223 , can be connected to the output shaft of the first driving member 213 , and the side where the carrying plate 223 is away from the rotating plate 222 can be used to place the wafer box 100 .

In some embodiments, the load-bearing module 212 also includes a second housing, and the first driving member 213 is received in the second housing, so that the first driving member 213 is relatively sealed from the external environment, and the first driving member 213 is improved to a certain extent. The service life of the component 213; the second housing has a second opening on the side close to the first housing along the first direction, so that the output shaft of the first driving component 213 can be connected to the bearing component 214.

FIG. 6 is another structural schematic diagram of the carrier of the transport device of the wafer cassette 100 provided by the embodiment of the present application.

As shown in FIG. 6 , in some embodiments, the bearing module 212 further includes a plurality of balls 224 disposed on the bearing 214 , and the plurality of balls 224 are arranged at intervals.

In the carrying module 212, since the wafer box 100 is directly placed on the carrying member 214, during the transportation process of the wafer box 100, due to inertia, a certain sliding friction will occur between the wafer box 100 and the carrying member 214. loss. Therefore, in this embodiment, multiple balls 224 are provided on the carrier 214 to support the wafer box 100 through the multiple balls 224 to avoid direct contact between the wafer box 100 and the carrier 214, so that the carrier 214 does not Affected by the friction between the ball 224 and the wafer box 100, the service life of the bearing 214 is improved to a certain extent; at the same time, because the contact area between the ball 224 and the wafer box 100 is small, the friction loss generated is Correspondingly less, and the rolling of the balls 224 can also change the sliding friction between the wafer box 100 and the carrying module 212 into rolling friction to further reduce the friction loss suffered by the wafer box 100, thereby improving the crystal quality. The service life of the round box 100; and, because multiple roller needles are arranged at intervals on the bearing member 214, the pressure of the wafer box 100 on each ball 224 can be dispersed to a certain extent, thereby improving the service life of the ball 224.

It can be understood that when the wafer box 100 is placed on the carrier 214, a certain amount of tiny particles may be generated due to friction between the two. Due to the pressure of the wafer box 100 on the carrier 214 and the pressure of the wafer box 100 Due to the tendency of movement relative to the carrier 214 due to inertia during transportation, the tiny particles may scratch the wafer box 100 or the carrier 214, thus affecting the service life of the wafer box 100 or the carrier 214. Therefore, In this embodiment, by arranging a plurality of balls 224 on the carrier 214, while avoiding direct contact between the wafer box 100 and the carrier 214, the number of tiny particles generated during the transportation of the wafer box 100 can be effectively reduced. The service life of the wafer box 100 and the carrier 214 is improved to a certain extent.

Please continue to refer to FIG. 6 . In some embodiments, the carrier module 212 further includes a sensor 225 disposed on the carrier 214 . The sensor 225 is used to detect whether the wafer box 100 is placed on the carrier 214 .

The sensor 225 may be an infrared sensor, an electromagnetic sensor, an ultrasonic sensor, a pressure sensor, a microwave sensor 225, or any other sensing device that can detect whether the wafer cassette 100 is placed on the carrier 214.

In order to prevent the wafer production rate from being reduced due to the empty load of the carrying module 212, a sensor 225 is provided on the carrying member 214 of the carrying module 212, and the sensor 225 is used to sense whether the wafer box 100 is placed on the carrying member 214. , when there is no wafer box 100 placed on the carrier 214, the linear module 211 stops driving the unloaded carrier module 212 to avoid wasting resources and thereby reducing wafer productivity.

FIG. 7 is a schematic structural diagram of the linear module in the conveying device of the wafer box 100 provided by the embodiment of the present application.

As shown in Figure 7, in some embodiments, the linear module 211 includes a third driving member 226, a screw rod 227 and a sliding table 228. The output shaft of the third driving member 226 is connected to the screw rod 227, and the screw rod 227 is connected along the third driving member 227. Extending in two directions, the sliding table 228 is threadedly connected to the screw rod 227, and the load-bearing module 212 is connected to the sliding table 228.

The third driving member 226 may be a driving motor. The output shaft of the third driving member 226 is connected to the screw rod 227 for driving the screw rod 227 to rotate. The screw rod 227 extends along the second direction, and the sliding table 228 and the screw rod 227 are threaded. connection, the load-bearing module 212 is connected to the sliding table 228, so that when the output shaft of the third driving member 226 drives the screw rod 227 to rotate, due to the threaded cooperation between the sliding table 228 and the screw rod 227, the sliding table 228 moves along the second direction, thereby driving the carrying module 212 to move in the second direction, thereby realizing the transportation of the wafer box 100 located on the rental module in the second direction.

FIG. 8 is an exploded view of the linear module in the conveying device of the wafer box 100 provided by the embodiment of the present application.

As shown in Figures 7 and 8, in some embodiments, the linear module 211 also includes a housing 229 connected to the base frame 300, and the screw rod 227 is received in the housing 229; the slide 228 includes a slide body 230 and The cover plate 231 is connected to the slide main body 230 . The cover plate 231 is located outside the housing 229 and is connected to the carrying module 212 .

In this embodiment, the screw is accommodated in the housing 229 and is threadedly connected to the screw through the slide body 230. The slide body 230 is connected to the cover plate 231 located outside the housing 229, so that the load bearing is connected through the cover plate 231. The module 212 realizes the movement of the load-bearing module 212 in the second direction. At the same time, by isolating the screw from the external environment, the loss of the screw during operation can be reduced to a certain extent and the efficiency of the screw can be improved. service life.

It can be understood that the third driving member 226 can also be accommodated in the housing 229, thereby reducing the loss caused by the operation of the third driving member 226 to a certain extent and increasing the service life of the third driving member 226.

Please continue to refer to FIG. 8 . In some embodiments, the housing 229 includes a base 232 with an opening and a flexible belt 233 covering the opening. The slide body 230 includes a fixing part 234 and two first fixing parts 234 respectively connected to the fixing part 234 . The connecting shaft 235, the two first connecting shafts 235 are arranged on opposite sides of the fixed part 234 along the second direction, and there is a through hole (not labeled in the figure) between the first connecting shaft 235 and the fixed part 234, the flexible belt 233 is Passing through the two through holes, the first connecting shaft 235 is located outside the housing 229 .

The flexible belt 233 can be a flexible steel belt, an aluminum belt, or other metal flexible belt 233. The flexible belt 233 can also be made of other materials. A flexible belt 233 is used at the opening of the housing 229 to keep the housing 229 sealed, thereby isolating the screw rod 227 from the external environment and improving the service life of the screw rod 227 to a certain extent.

Since the flexible belt 233 passes through the two through holes between the fixed part 234 of the slide body 230 and the two first connecting shafts 235 in sequence, at this time, the cover 231 connected to the slide body 230 is located away from the flexible belt 233. On one side of the table main body 230, the cover plate 231 is connected to the load-bearing module 212. When the linear module 211 drives the load-bearing module 212, the third driving member 226 drives the screw rod 227 to rotate and drives the slide table main body 230 to move along the second direction, and drives the load-bearing module 212 connected to the cover 231 to move in the second direction. During this process, the flexible belt 233 is always located between the slide body 230 and the cover 231, thereby ensuring that the housing 229 is always in the The sealed state prevents the screw in the housing 229 and the slide main body 230 from contacting the external environment.

When the flexible belt 233 passes through the two through holes in sequence, the first connecting shaft 235 is located outside the housing 229 , that is, the first connecting shaft 235 is located on the side of the flexible belt 233 away from the fixed part 234 , so that the first connecting shaft 235 passes through the two first connecting shafts 235 . The connecting shaft 235 can fix the flexible belt 233 so that it is always located between the cover plate 231 and the sliding table body 230. Compared with directly fixing the flexible belt 233 through the cover plate 231, since the first connecting shaft 235 and the flexible belt 233 The contact area is smaller, so the friction loss generated is also smaller, thereby increasing the service life of the flexible belt 233 to a certain extent.

The first connecting shaft 235 can be set as a rolling shaft. During the process of transporting the load-bearing module 212 through the linear module 211, the rolling first connecting shaft 235 can further reduce the friction between it and the flexible belt 233, thereby improving the performance of the first connecting shaft 235. The service life of a connecting shaft 235 and the flexible belt 233.

In this embodiment, the opening of the base 232 is covered by the flexible belt 233, the fixing part 234 of the slide body 230 is arranged inside the housing 229, and two passages are formed between the two first connecting shafts 235 and the fixing part 234. holes, and pass the flexible belt 233 through the two through holes in sequence, thereby fixing the flexible belt 233 between the first connecting shaft 235 and the fixed part 234, so that it can always maintain the housing 229 during the movement of the slide body 230. seal, thereby improving the service life of the fixing part 234 of the screw rod 227 and the slide main body 230; and, compared with directly fixing the flexible belt 233 through the cover plate 231, fixing the flexible belt 233 through the first connecting shaft 235 can effectively reduce the The friction loss suffered by the flexible belt 233 increases the service life of the flexible belt 233 .

Please continue to refer to FIG. 8 . In some embodiments, the slide body 230 further includes two second connecting shafts 236 disposed between the two first connecting shafts 235 and connected to the fixed part 234 . The second connecting shafts 236 are located at The interior of the housing 229, that is, the flexible belt 233 passes through one through hole and then passes through the upper sides of the two second connecting shafts 236 into the second through hole, thereby preventing the flexible belt 233 from passing through the second connecting shaft 236. The two through holes are in contact with the fixed part 234, which reduces the friction loss suffered by the flexible belt 233 and increases the service life of the flexible belt 233.

Please continue to refer to Figure 8. In some embodiments, the linear module 211 also includes a slide rail 237 disposed in the base 232. The slide rail 237 extends along the second direction, and the slide table body 230 is connected to the slide block on the slide rail 237. , so that when the slide table body 230 moves in the second direction, the slide blocks on the slide rails 237 can support the slide table body 230 to improve the stability of the wafer box 100 during transportation.

The transport device of the wafer box 100 provided by the embodiment of the present application is provided by two transport units 210 spaced apart along the first direction on the base frame 300, and each transport unit 210 includes a linear module 211 extending along the second direction and The carrying module 212 is connected to the linear module 211, so that the linear module 211 drives the carrying module 212 carrying the wafer box 100 to move in the second direction to realize the transportation of the wafer box 100; and, due to the two The conveying directions of the conveying units 210 are opposite. Therefore, the two conveying units 210 can convey the wafer box 100 in two opposite directions at the same time, thereby improving the conveying efficiency of the wafer box 100 on the chip production line; at the same time, due to the carrying module 212 includes a first driving member 213 and a bearing member 214 connected to the first driving member 213, and the output shaft of the first driving member 213 is arranged along the first direction, so that the first driving member 213 drives the bearing member 214 to rotate, so that The wafer box 100 located on the carrier 214 can be rotated to a corresponding grabbing position to facilitate the picking and placing of the wafer box 100 .

While the present application has been described with reference to preferred embodiments, various modifications may be made and equivalents may be substituted for components thereof without departing from the scope of the application. In particular, as long as there is no structural conflict, the technical features mentioned in the various embodiments can be combined in any way. The application is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

Claims

A conveying device for wafer boxes, including:

base frame;

A conveying mechanism includes two conveying units spaced apart along the first direction of the base frame. The conveying directions of the two conveying units are opposite. Each conveying unit includes a linear module extending along the second direction and a linear module extending along the second direction. The linear module is connected to a load-bearing module. The linear module is used to drive the load-bearing module to move in the second direction. The load-bearing module includes a first driving member and a first driving member. A bearing member, the first driving member is used to drive the bearing member to rotate, and the output shaft of the first driving member is arranged along the first direction; wherein the first direction and the second direction are arranged to intersect.
The conveying device according to claim 1, wherein the bearing module further includes two first positioning parts arranged oppositely, and the first positioning parts are connected to the bearing member.
The conveyor device according to claim 2, wherein the load-bearing module further includes two second positioning parts arranged oppositely, the second positioning parts are connected to the load-bearing member, and the two first positioning parts The arrangement direction is different from the arrangement direction of the two second positioning parts.
The conveying device according to claim 3, wherein the load-bearing module further includes a second driving part, a connecting part, a first connecting rod and a second connecting rod, and the connecting part is connected to the output shaft of the second driving part respectively. And connected to a first positioning part, the two ends of the first connecting rod are respectively hinged with the connecting part and a second positioning part, and the two ends of the second connecting rod are respectively connected with the connecting part and another One of the second positioning parts is hinged.
The conveying device according to claim 1, wherein the bearing member includes a support portion, a rotating plate and a bearing plate spaced apart along the first direction, and the rotating plate is connected to the output shaft of the first driving member, The bearing plate and the rotating plate are connected through the supporting part.
The conveying device according to any one of claims 1 to 5, wherein the bearing module further includes a plurality of balls arranged on the bearing member, and the plurality of balls are arranged at intervals.
The conveying device according to any one of claims 1 to 5, wherein the carrying module further includes a sensor provided on the carrying member, the sensor is used to detect whether the wafer box is placed on on the carrier.
The conveying device according to any one of claims 1 to 5, wherein the linear module includes a third driving member, a screw rod and a sliding table, and the output shaft of the third driving member is connected to the screw rod. , the screw rod extends along the second direction, the slide table is threadedly connected to the screw rod, and the load-bearing module is connected to the slide table.
The conveying device according to claim 8, wherein the linear module further includes a housing connected to the base frame, and the screw rod is accommodated in the housing; the slide includes a slide body and a A cover plate is connected to the main body of the slide table. The cover plate is located outside the housing and connected to the load-bearing module.
The conveying device according to claim 9, wherein the housing includes a base with an opening and a flexible belt covering the opening, and the slide body includes a fixing part and two fixing parts respectively connected to the fixing part. A first connecting shaft, the two first connecting shafts are arranged on opposite sides of the fixed part along the second direction, and there is a through hole between the first connecting shaft and the fixed part, the The flexible belt passes through the two through holes in sequence, and the first connecting shaft is located outside the housing.