TW202006859A - A wafer box transporting device and wafer box transporting device equipment - Google Patents

Abstract

A wafer box transporting device comprise a main body, a control module, a door frame and a door body module. The main body has a containing space for installing an air suction and exhaust module. The main body has a plate with a plurality of prepared hole for installing a plurality of gas assist assembly. The air suction and exhaust module, the gas assist assembly and control module is used for exchanging air inside of the wafer box. The door frame and the door body module is used for opening a door of the wafer box. An air curtain module is installed on the door frame. The air curtain module can be controlled form an air curtain at the front of opening wafer box.

Description

Wafer box carrying device and wafer box carrying equipment

The invention relates to a carrying device and a carrying device, in particular to a wafer box carrying device and a wafer box carrying device for conveying a wafer box.

Most existing devices for transferring wafer cassettes only have a single function, for example, a workstation for temporarily storing wafer cassettes, or a workstation for inflating the inside of the wafer cassette. Due to the limited space of the plant, how to enable a single workstation to support or perform a variety of different operations has become the demand of relevant manufacturers. For this reason, the present inventor has devoted himself to study and cooperate with the application of theory, and proposes a reasonable design and effectively improves the above problems.

The main purpose of the present invention is to provide a wafer cassette carrying device and a wafer cassette carrying equipment, to improve the existing technology, the wafer cassette workstation cannot support or perform a variety of different operations at the same time according to the needs of the manufacturer problem.

In order to achieve the above object, the present invention provides a wafer box carrying device, which includes: a machine body, a control module, a door frame structure, and a door module. The main body of the machine includes a disc body, the disc body includes a plurality of reserved grooves, and the disc body is used to provide a wafer box setting; each reserved groove is used to set a gas-assisted component; the machine body has a first The accommodating space and a second accommodating space; the second accommodating space is used to provide an accommodating and exhausting module accommodating. Gas exchange is performed inside the wafer box on the machine body. The control module is arranged in the machine body and correspondingly located in the first accommodating space. The door frame structure is disposed on the machine body, and the door frame structure includes a communication port. The side of the door frame structure away from the disc body can provide a blower module setting; the control module can be electrically connected to the blower module to control the blower module to blow a predetermined gas to the communication port. The door module includes a driving mechanism and a movable door. The driving mechanism is installed on the machine body. The movable door is connected to the driving mechanism. The control module can control the driving mechanism to operate so that the movable door can cover the communication port or not. The movable door is provided with a door opening module. The door opening module can be driven by the driving mechanism to interconnect with the lid of the wafer box provided on the machine body. Wherein, when the control module controls the driving mechanism, and the door opening module of the movable door and the wafer box provided on the machine body are connected to each other, the control module can control the driving mechanism to actuate, so that the movable door and its interconnection The lid of the wafer box leaves the communication port together, so that the inside of the wafer box can communicate with the outside through the communication port. Wherein, when the door frame structure is provided with an air blowing module, and the control module controls the movable door and the wafer box provided on the machine body to be connected to each other, the control module can control the operation of the air blowing module to facilitate the communication port The area forms an airflow that flows in the direction of the machine body.

In order to achieve the above object, the present invention also provides a wafer box carrying equipment, which includes: a wafer box carrying device and an auxiliary device. The wafer box carrying device includes: a machine body, a control module, a door frame structure and a door module. The main body of the machine includes a disc body, the disc body includes a plurality of reserved grooves, and the disc body is used to carry a wafer box; the main body of the machine body has a first accommodating space and a second accommodating space. The control module is arranged in the machine body, and the control module is correspondingly located in the first accommodating space. The door frame structure is disposed on the machine body, and the door frame structure includes a communication port. The door module includes a driving mechanism and a movable door. The driving mechanism is installed on the machine body. The movable door is connected to the driving mechanism. The control module can control the driving mechanism to operate so that the movable door can cover the communication port or not. The movable door is provided with a door opening module. The door opening module can be driven by the driving mechanism to interconnect with the lid of the wafer box provided on the machine body. The auxiliary device includes: an air blowing module, a plurality of gas auxiliary components and an exhaust and exhaust module. The air blowing module is detachably arranged on the side of the door frame structure away from the disc body; the air blowing module is electrically connected to the control module, and the control module can control the air blowing module to blow a predetermined gas to the communication port. The multiple gas auxiliary components are correspondingly disposed in the multiple reserved grooves. The exhausting and exhausting module is detachably installed in the machine body, and the exhausting and exhausting module is correspondingly located in the second accommodating space. The exhausting and exhausting module is connected to a plurality of gas auxiliary components, and the exhausting and exhausting module can be Controlling so that at least one gas auxiliary component performs gas exchange operation inside the wafer cassette provided on the machine body. Wherein, when the control module controls the driving mechanism, and the door opening module of the movable door and the wafer box provided on the machine body are connected to each other, the control module can control the driving mechanism to actuate, so that the movable door and its interconnection The lid of the wafer box leaves the communication port together, so that the inside of the wafer box can communicate with the outside through the communication port. When the control module controls the movable door and the wafer box provided on the machine body to be connected to each other, the control module can control the operation of the blower module to form an air flow flowing in the direction of the machine body in the area of the communication port .

The beneficial effect of the present invention may be that the disk body of the wafer cassette carrying device of the present invention is provided with a plurality of reserved grooves and second accommodating spaces. Therefore, the relevant manufacturer of the wafer cassette carrying device can be based on the relevant user Need, and additional gas auxiliary components and exhaust modules are added to the plurality of reserved grooves and the second accommodating space, so that the wafer box carrying device can not only use the door module to open the wafer box Cover to allow relevant personnel or equipment to pick up and place the wafers in the wafer box. The wafer box carrying device can also use the cooperation of the gas auxiliary components and the exhaust module to control the inside of the wafer box. Perform gas exchange operations. The wafer box carrying equipment of the present invention can not only open the lid of the wafer box, so that relevant personnel or equipment can pick up and place the wafers set in the wafer box, and can also perform gas exchange operations inside the wafer box .

In order to further understand the features and technical contents of the present invention, please refer to the following detailed description and drawings of the present invention. However, the drawings are provided for reference and explanation only, and are not intended to limit the present invention.

100‧‧‧ Wafer box carrying equipment

10‧‧‧wafer box carrying device

11‧‧‧ machine body

111‧‧‧Disc

1111‧‧‧reserved groove

1112‧‧‧Connecting groove

112‧‧‧Housing

113‧‧‧Partition

114‧‧‧Fixed components

1141‧‧‧Snap-in structure

115‧‧‧Auxiliary positioning component

116‧‧‧Detection module

117‧‧‧detection module

12‧‧‧Control module

13‧‧‧ door frame structure

13A‧‧‧Connecting port

14‧‧‧door module

141‧‧‧Drive mechanism

142‧‧‧Activity gate

15‧‧‧door opening module

151‧‧‧Snap-in components

1511‧‧‧Fixed parts

1512‧‧‧ linkage mechanism

152‧‧‧Adsorption module

1521‧‧‧Adsorption disk

1522‧‧‧Air nozzle

16‧‧‧sliding module

17‧‧‧Counter

171‧‧‧ Launch unit

172‧‧‧Receiving unit

20‧‧‧Auxiliary device

21‧‧‧Blowing module

211‧‧‧Blowhole plate

22‧‧‧gas auxiliary components

221‧‧‧Fixed seat

222‧‧‧ nozzle

23‧‧‧Exhaust module

F‧‧‧wafer box

F1‧‧‧Body

F11‧‧‧Base

F111‧‧‧Blowhole

F112‧‧‧Snap hole

F1a‧‧‧Internal

F2‧‧‧cover

F21‧‧‧Fixed hole

F22‧‧‧Blowhole

SP1‧‧‧ First accommodation space

SP2‧‧‧Second storage space

FIG. 1 is a schematic diagram of the wafer cassette carrying equipment of the present invention.

FIG. 2 is a partially exploded schematic view of the wafer box carrying equipment of the present invention.

FIG. 3 is a partially enlarged schematic view of the wafer box carrying equipment of the present invention.

FIG. 4 is a partially exploded schematic view of the wafer box carrying equipment of the present invention.

FIG. 5 is a schematic diagram of another perspective of the wafer cassette carrying device of the present invention.

FIG. 6 is another partially exploded schematic view of the wafer box carrying equipment of the present invention.

7 is a schematic diagram of a wafer cassette.

8 is a schematic diagram of a wafer cassette carrying device of the present invention provided with a wafer cassette.

9 is a schematic diagram of the operation of the wafer cassette carrying equipment of the present invention provided with a wafer cassette.

10 is a schematic diagram of the gas flow inside the wafer box provided on the wafer box carrying device of the present invention.

The following is a description of the embodiments of the wafer cassette carrying device and wafer cassette carrying device of the present invention by specific specific examples. Those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification. The present invention can also be implemented or applied by other different specific examples. Various details in this specification can also be based on different viewpoints and applications, and various modifications and changes can be made without departing from the spirit of the present invention. In addition, the drawings of the present invention are only for simple description, and are not depicted according to actual sizes, that is, the actual sizes of related components are not reflected, and will be described first. The following embodiments further describe the viewpoint of the present invention in detail, but do not limit the scope of the present invention by any viewpoint. In the following description, if you are instructed to refer to a specific drawing or as shown in a specific drawing, it is only used to emphasize in the subsequent description, most of the related content mentioned in this specific drawing, However, it does not limit that only specific patterns can be referred to in the subsequent description.

Please refer to FIG. 1 to FIG. 4 together, which are schematic diagrams of the wafer box carrying equipment of the present invention. The wafer box carrying equipment 100 includes a wafer box carrying device 10 and an auxiliary device 20. The wafer box carrying device 10 includes a machine body 11, a control module 12, a door frame structure 13 and a door module 14. The auxiliary device 20 includes an air blowing module 21, a plurality of gas auxiliary components 22 and an exhaust and exhaust module 23.

The machine body 11 is provided with a plate 111 and a casing 112. The housing 112 is detachably provided on the machine body 11. A partition 113 is provided in the machine body 11. The partition 113 and the housing 112 can correspond to a first accommodating space SP1 and a second accommodating space SP2 formed in the machine body 11. The control module 12 is fixedly disposed on one side of the partition 113, and the control module 12 is correspondingly located in the first accommodating space SP1. An exhaust module 23 is provided on the other side of the partition 113, and the exhaust module 23 is correspondingly located in the second accommodating space SP2. In practical applications, the exhaust and exhaust module 23 may be electrically connected to the control module 12 through related electrical connections, electrical connectors, etc., and the control module 12 can control the exhaust and exhaust module accordingly. 23 action.

The disc body 111 has a plurality of reserved grooves 1111, and a plurality of gas auxiliary components 22 are detachably disposed in the plurality of reserved grooves 1111. Each gas auxiliary component 22 may include a fixed base 221 and a nozzle 222. The fixed base 221 can be fixedly disposed on the machine body 11 and correspondingly located in the reserved groove 1111. The nozzle 222 is fixedly disposed in the fixed base 221. In addition, a part of the nozzle 222 may protrude from the disk 111. The plurality of gas auxiliary components 22 are connected to the exhaust module 23 through a plurality of tubes (not shown). When the wafer cassette F is disposed on the disc body 111, the plurality of nozzles 222 can be correspondingly connected to the plurality of air holes F111 (as shown in FIG. 6) of the wafer cassette F, and the exhaust module 23 can pass through at least A nozzle 222 draws out the gas in the wafer box F, and sends at least one predetermined gas (such as clean gas such as XCDA, CDA or inert gas) into the wafer box F through at least one nozzle 222. As shown in FIG. 7, the wafer cassette F described in this embodiment includes a body F1 and a cover F2. A space is formed in the body F1. The cover F2 is detachably disposed on one side of the body F1. A base F11 is provided at the bottom, and the base F11 is used to fix the body F1 on the plate 111.

In the diagram of this embodiment, the disk body 111 has six reserved grooves 1111 as an example, but the number and installation position thereof may vary according to the wafer box F of different sizes and forms. In a specific application, the exhaust and exhaust module 23 may be equipped with two or four gas auxiliary components 22 according to the number of the air holes F111 of the wafer box F to perform gas exchange operations inside the wafer box F.

It is worth mentioning that the disc body 111 may also have a plurality of communication grooves 1112, the plurality of communication grooves 1112 and the plurality of reserved grooves 1111 communicate with each other, and the tube body connecting the plurality of gas auxiliary components 22 (not shown) ) Can be correspondingly disposed in a plurality of communication grooves 1112. Of course, in different applications, the tube body connecting the plurality of gas auxiliary components 22 may be hidden in the machine body 11, and the plate body 111 is not provided with the communication groove 1112.

In order to effectively fix the wafer cassette F disposed on the disk body 111, the disk body 111 may be provided with a fixing component 114, a plurality of auxiliary positioning components 115, and a variety of different detection components 116, 117. The fixing component 114 may be substantially disposed at the central position of the disc body 111, and the fixing component 114 may have an engaging structure 1141, and the engaging structure 1141 can be controlled by the control module 12 to move up and down relative to the disc body 111. When the wafer cassette F is fixedly installed on the disc body 111, the engaging structure 1141 can be controlled to be raised, and correspondingly enter the engaging hole F112 (as shown in FIG. 6) corresponding to the wafer cassette F, and then control the mold The group 12 can further control the rotation of the engagement structure 1141, so that the engagement structure 1141 and the wafer cassette F are engaged with each other.

The plurality of auxiliary positioning components 115 may be positioning posts protruding from the disc body 111, and they may be used to engage with corresponding holes of the wafer cassette F. The detection component 116 can read the data stored in the corresponding components on the wafer cassette F in a wireless manner. For example, the detection component 116 can use RFID technology to read the phases set on the wafer cassette F The data stored in the corresponding component (such as an electronic tag). The detection component 117 may be used to detect whether a wafer cassette F is provided on the disc body 111, and the detection component 117 may also be used to detect the type of wafer cassette F disposed on the disc body 111; The group 12 may be based on the detection results of the detection components 116 and 117 and correspondingly control the actions of the exhaust module 23 and the door module 14.

The door frame structure 13 is disposed on the machine body 11, and the door frame structure 13 is corresponding to one side of the plate 111. The door frame structure 13 includes a communication port 13A. The diameter of the communication port 13A is larger than the lid F2 of the wafer cassette F. The side of the door frame structure 13 away from the disc body 111 can be provided with an air blowing module 21, and the air blowing module 21 is detachably provided on the door frame structure 13. The blowing module 21 can be controlled by the control module 12 to blow a predetermined gas (such as clean gas or inert gas such as XCDA, CDA, etc.) in the direction of the machine body 11, so that the communication port 13A is away from the disk On one side of the body 111, an air curtain flowing in the direction of the machine body 11 is formed. In a specific application, the blower module 21 may have at least one blower plate 211. The gas input into the blower module 21 will pass through the blower plate 211 and be evenly discharged from the blower module 21.

Please refer to FIG. 4 to FIG. 6 together. The door module 14 is disposed on the machine body 11. The door module 14 includes a driving mechanism 141 and a movable door 142. The driving mechanism 141 is disposed on the machine body 11, and the movable door 142 is connected to the driving mechanism 141. The driving mechanism 141 is electrically connected to the control module 12. The control module 12 can control the driving mechanism 141 to operate so that the movable door 142 covers the communication port 13A or does not cover the communication port 13A. Specifically, the movable door 142 and the blower module 21 are disposed on the side of the machine body 11 opposite to the plate 111, and the movable door 142 can be driven by the driving mechanism 141 to move relative to the machine body 11 According to this, the movable door 142 can be moved from the position where the communication port 13A is blocked to a position where the communication port 13A is not blocked, or from a position where the communication port 13A is not blocked to a position where the communication port 13A is blocked. In this embodiment, when the movable door 142 is driven in a state of covering the communication port 13A, the movable door 142 will move away from the door frame structure 13 and correspondingly stored under the communication port 13A as an example, but Not limited to this, the movement mode and position of the movable door 142 may be changed according to needs. The manner in which the driving mechanism 141 is connected to the movable door 142 is not limited here.

As shown in FIGS. 5 to 7, the movable door 142 is provided with a door opening module 15. The door opening module 15 can be driven by the driving mechanism 141 to connect with the cover F2 of the wafer cassette F provided on the machine body 11 . Specifically, the door opening module 15 includes an engaging component 151 and two suction components 152. The engaging assembly 151 includes two fixing members 1511 and a linking mechanism 1512. One end of each fixing member 1511 is exposed to one side of the movable door 142. The linking mechanism 1512 and the two fixing members 1511 are connected to each other, and the linking mechanism 1512 can receive The control module 12 controls to drive the two fixing members 1511 to operate, so that the two fixing members 1511 and the fixing holes F21 of the cover F2 of the wafer cassette F are engaged with each other. After the two fixing members 1511 and the fixing hole F21 of the cover F2 are engaged with each other, the control module 12 may control the driving mechanism 141 to move the movable door 142 and the cover F2 away from the door frame structure 13 Movement, so that the inside F1a of the wafer cassette F can communicate with the outside through the communication port 13A, whereby related equipment or personnel can take out the wafer in the wafer cassette F through the communication port 13A, or set the wafer in Wafer box F.

In a specific embodiment, as shown in FIG. 4, the machine body 11 may also be provided with a sliding module 16, the disc body 111 and the sliding module 16 are connected to each other, and the sliding module 16 can be controlled by the control module 12. The disc body 111 is moved toward the communication port 13A, or the disc body 111 is moved away from the communication port 13A. In practical applications, the sliding module 16 may be, for example, a wire rail and a slider. In a specific implementation, the control module 12 may be based on the detection results of the detection components 116 and 117, and when the wafer cassette F is stably disposed on the tray body 111, control the tray body 111 to communicate with the door frame structure 13 Port 13A moves.

The specific implementation of the control module 12 controlling the door opening module 15 to use the movable door 142 to drive the lid F2 of the wafer cassette F may be that the control module 12 first controls the sliding module 16 so that the tray 111 drives the wafer cassette F moves relative to the machine body 11 so that the cover F2 of the wafer cassette F can be attached to the side of the movable door 142 correspondingly. Then, the control module 12 uses a related detector (not shown) provided on the movable door 142 to control the linkage mechanism 1512 to operate when confirming that the cover F2 is indeed attached to one side of the movable door 142, thereby causing The two fixing members 1511 and the cover F2 are fixed to each other.

In different applications, the movable door 142 can also cooperate with the driving mechanism 141, and the driving mechanism 141 can be controlled by the control module 12, so that the movable door 142 moves in the direction of the cover F2 and is attached to the crystal The cover F2 of the round box F; in other words, in different embodiments, the machine body 11 may not be provided with the sliding module 16, and the movable door 142 may be controlled by the driving mechanism 141 relative to the machine body 11 Move toward or away from the wafer cassette F.

The two suction components 152 may be connected to the exhaust and exhaust module 23, or may be independently connected to another exhaust and exhaust module, which is not limited herein. Each adsorption component 152 may include an adsorption disk body 1521 and an air nozzle 1522. The adsorption disk body 1521 is used to adsorb to the cover body F2. The air nozzle 1522 is disposed in the adsorption disk body 1521, and a portion of the air nozzle 1522 may be exposed to吸盘体1521。 Suction disk 1521. Each exhaust module 23 can cooperate with the gas nozzle 1522 to inhale gas through the gas nozzle 1522 or discharge gas through the gas nozzle 1522.

As shown in FIGS. 5, 6, and 8 to 10, the movable door 142 may also be provided with a counter 17. When the movable door 142 and the wafer cassette F provided on the machine body 11 are connected to each other, and the movable door 142 drives the lid F2 of the wafer cassette F to move together, the counter 17 can be controlled by the control module 12 to calculate the The number of wafers in wafer cassette F. The method of counting the wafers in the wafer cassette F by the counter 17 may be, for example, optical detection, image capture, and image analysis, which are not limited herein.

For example, the counter 17 may include a transmitting unit 171 and a receiving unit 172. The transmitting unit 171 is pivotally connected to the movable door 142, and the receiving unit 172 is pivotally connected to the movable door 142. The transmitting unit 171 may be, for example, a member emitting infrared rays, and the receiving unit 172 may be a member corresponding to receiving infrared rays. Before the movable door 142 and the wafer box F provided on the machine body 11 are connected to each other, and the movable door 142 drives the lid F2 of the wafer box F to move together, the control module 12 can first control the transmitting unit 171 and the receiving unit 172 rotates relative to the movable door 142, so that the transmitting unit 171 and the receiving unit 172 extend into the wafer cassette F, and the transmitting unit 171 and the receiving unit 172 can be arranged substantially facing each other, so that the transmitting unit 171 and the receiving unit The units 172 can cooperate with each other, and as the movable door 142 moves relative to the wafer cassette F, the number of wafers disposed in the wafer cassette F is calculated accordingly.

As shown in FIGS. 2, 3 and 10, when the movable door 142 takes the cover F2 away from the wafer cassette F, the inside of the wafer cassette F will be able to communicate with the outside. At this time, the control module 12 can control the exhaust module 23 and cooperate with the gas auxiliary component 22 to perform gas exchange operation inside the wafer box F, and the control module 12 can also control the exhaust module 23 at the same time. Cooperate with the air blowing module 21 to form an air curtain outside the wafer box F, thereby effectively preventing external dirt from entering the wafer box F.

When the related equipment or personnel no longer need to pick up and place the wafers in the wafer cassette F, the control module 12 can control the driving mechanism 141 so that the movable door 142 can drive the cover body F2 and set the cover body F2 back to the crystal On the round box F; then, the control module 12 can control the exhaust module 23 to use the gas auxiliary component 22 and the two adsorption components 152 to perform gas exchange operations inside the wafer box F, for example, two Each adsorption component 152 may be used to charge clean gas such as XCDA, CDA or inert gas into the wafer box F, and at least one gas auxiliary component 22 may be used to charge the gas in the wafer box F outward discharge. When the movable door 142 and the cover F2 are fixed to each other, the air nozzles 1522 of the two suction components 152 may correspond to the air holes F22 of the cover F2 to communicate with each other, so that the exhaust module 23 can pass through the air nozzle 1522 to The predetermined gas is sent into the wafer cassette F.

Please refer to FIG. 2, FIG. 4 and FIG. 6 together, which also show schematic diagrams of the wafer cassette carrying device of the present invention. In the following, only some components of the wafer cassette carrying device 10 will be emphasized, and the rest of the unexplained parts are the same as those in the previous embodiment and will not be described in detail.

As shown in FIG. 2, the wafer body carrying device 10 of the present invention is provided with a partition 113 in the machine body 11, a control module 12 is provided on one side of the partition 113, and the other of the partition 113 may be based on According to the requirements of relevant manufacturers, the exhaust module 23 of the aforementioned auxiliary device 20 is provided. In other words, the machine body 11 of the wafer cassette carrying device 10 has a space reserved for the relevant manufacturer to install the exhaust module 23 (ie, the second accommodating space SP2 referred to in the foregoing embodiment), and the wafer The manufacturer of the cassette carrier device 10 may or may not install the exhaust module 23 in the machine body 11 according to the needs of the purchaser of the wafer cassette carrier device 10.

As shown in FIG. 4, the disk body 111 of the wafer cassette carrying device 10 of the present invention may have a plurality of reserved grooves 1111, and the plurality of reserved grooves 1111 may be provided with multiple gases according to the needs of related manufacturers. Auxiliary components 22. The disc body 111 may also have a plurality of communication grooves 1112, the plurality of communication grooves 1112 and the plurality of reserved grooves 1111 are connected to each other, and the plurality of communication grooves 1112 can be used to provide a pipeline connecting the plurality of gas auxiliary components 22. In other words, the disc body 111 provided on the machine body 11 of the wafer cassette carrying device 10 has a plurality of reserved grooves 1111 reserved for the relevant manufacturers to install and install the gas assist assembly 22, and the production of the wafer cassette carrying device 10 The manufacturer may or may not install a plurality of gas-assist components 22 on the tray 111 according to the needs of the purchaser of the wafer cassette carrier device 10.

As shown in FIG. 6, the door frame structure 13 of the wafer cassette carrying device 10 of the present invention may be provided with a blower module 21 according to requirements, that is, the side of the door frame structure 13 opposite to the tray 111 is reserved for use. In order to install the relevant structure and components of the blower module 21, the manufacturer of the wafer box carrying device 10 may install the blower on the door frame structure 13 or not according to the needs of the buyer of the wafer box carrying device 10 Module 21.

As described above, the wafer box carrying device 10 of the present invention has a reserved space in the machine body 11, and a plurality of reserved grooves 1111 are reserved on the tray 111, and the door frame structure 13 Relevant structures and components for installing the blower module 21 are also reserved. Therefore, the manufacturer of the wafer box carrying device 10 can install additional extraction on the wafer box carrying device 10 according to the needs of the purchaser. The gas module 23, the gas auxiliary component 22 and the blowing module 21. When the wafer cassette carrying device 10 is not provided with a plurality of gas auxiliary components 22, the exhaust module 23 and the blowing module 21, the wafer cassette carrying device 10 may use the tray 111 and the door frame structure 13 3. The door opening module 15 cooperates with each other to support the wafer box F, and can open the lid F2 of the wafer box F, so that related equipment or personnel can pick up and place the wafers in the wafer box F.

In the case where the wafer box carrying device 10 is provided with a plurality of gas auxiliary components 22, exhausting and exhausting modules 23, and blowing modules 21, the wafer box carrying device 10 can reach and carry the wafer box F except for In addition to the function of the cover F2 of the wafer cassette F, the wafer cassette carrying device 10 can also perform gas exchange operations inside the wafer cassette F, and the wafer cassette carrying device 10 can also utilize the blowing module 21 to avoid crystals. Dirt on the outside of the round box F easily enters the wafer box F.

The above are only the preferred and feasible embodiments of the present invention, and do not limit the patent scope of the present invention. Therefore, equivalent technical changes made by using the description and drawings of the present invention are included in the protection scope of the present invention. .

10‧‧‧wafer box carrying device

11‧‧‧ machine body

111‧‧‧Disc

112‧‧‧Housing

113‧‧‧Partition

12‧‧‧Control module

13‧‧‧ door frame structure

13A‧‧‧Connecting port

142‧‧‧Activity gate

20‧‧‧Auxiliary device

21‧‧‧Blowing module

23‧‧‧Exhaust module

Claims (10)

A wafer box carrying device includes: a machine body including a tray body, the tray body including a plurality of reserved grooves, the tray body is used to provide a wafer box setting; The reserved groove is used to set a gas auxiliary component; the machine body has a first accommodating space and a second accommodating space; the second accommodating space is used to provide an exhaust module accommodation The exhaust module is used to connect with the gas auxiliary component to perform gas exchange operation on the inside of the wafer box provided on the machine body through the gas auxiliary component; a control module Group, which is arranged in the machine body and correspondingly located in the first accommodating space; a door frame structure, which is arranged in the machine body, and the door frame structure includes a communication port; the door frame A side of the structure away from the plate body can provide a blower module; the control module can be electrically connected to the blower module to control the blower module to blow a Predetermined gas; a door module, which includes a driving mechanism and a movable door, the driving mechanism is provided on the machine body, the movable door is connected with the driving mechanism, the control module can control the The driving mechanism is actuated to make the movable door cover the communication port or not, and the movable door is provided with a door opening module which can be driven by the driving mechanism to The lids of the wafer boxes provided on the machine body are connected to each other; wherein, when the control module controls the driving mechanism, the door opening module of the movable door and the When the wafer cassettes on the machine body are connected to each other, the control module can control the driving mechanism to operate so that the movable door and the lid body connected to the wafer cassette with each other leave the gate together The communication port, so that the inside of the wafer box can communicate with the outside through the communication port; wherein, when the door frame structure is provided with the blowing module, and the control module controls the movable door When connected to the wafer box provided on the machine body, the control module can control the operation of the blower module to form a direction toward the machine body in the area of the communication port Flowing airflow. The wafer cassette carrying device according to claim 1, wherein the wafer cassette carrying device further includes a plurality of the gas auxiliary components, and each of the gas auxiliary components can be detachably provided in a plurality of the reserved In the groove, each of the gas auxiliary components includes a fixed seat and a nozzle, the fixed seat can be fixedly arranged in the reserved groove, the nozzle is arranged in the fixed seat, and the nozzle can be The wafer boxes provided on the tray body are fixed to each other, and the nozzle can cooperate with the exhaust module to perform gas exchange in the wafer box; the machine body is provided with a A sliding module, the sliding module and the disc body are connected to each other, the sliding module can be controlled by the control module, and the disc body is driven to move closer to the communication port, or is driven The disc body moves away from the communication port. The wafer box carrying device according to claim 1, wherein the movable door is provided with a counter; when the movable door and the wafer box provided on the machine body are connected to each other, and the movable When the door drives the lid of the wafer cassette to move together, the counter can be controlled by the control module to count the number of wafers set in the wafer cassette. The wafer cassette carrying device according to claim 3, wherein the counter includes a transmitting unit and a receiving unit, the transmitting unit is pivotally connected to the movable door, and the receiving unit is pivotally connected to the movable door ; When the movable door and the wafer box provided on the machine body are connected to each other, and the movable door drives the lid of the wafer box to move together, the control module can control the The transmitting unit and the receiving unit rotate relative to the movable door, so that the transmitting unit and the receiving unit are arranged to face each other, and the transmitting unit and the receiving unit facing each other can follow Move the movable door to calculate the number of wafers set in the wafer cassette. The wafer box carrying device according to claim 1, wherein the door opening module includes at least two clamping components and at least two suction components, and the two clamping components can be controlled by the control module , And interlock with the lid of the wafer box provided on the machine body; each of the suction components is connected to the exhaust and exhaust module; two of the clamping components and the wafer box When the cover bodies are engaged with each other, the control module can control the exhaust and exhaust module to perform gas exchange operation on the wafer box; the machine body is provided with a partition plate, and the partition plates are opposite to each other. The side surfaces are the first accommodating space and the second accommodating space, respectively, and the control module is fixedly disposed on one side of the partition; the other side of the partition is used to provide the extraction The air module is fixed; the machine body is further provided with a casing under the plate body, the casing is detachably provided on the machine body, and the casing is detached from the machine body At this time, the partition and the control module can be exposed to the machine body. A wafer box carrying equipment, comprising: a wafer box carrying device, comprising: a machine body, which includes a tray body, the tray body includes a plurality of reserved grooves, the tray body is used for Carrying a wafer box; the machine body has a first accommodating space and a second accommodating space; a control module is arranged in the machine body, and the control module is correspondingly located in the In the first accommodating space; a door frame structure, which is arranged on the machine body, and the door frame structure includes a communication port; and a door module, which includes a driving mechanism and a movable door, the driving The mechanism is installed on the machine body, the movable door is connected with the driving mechanism, and the control module can control the driving mechanism to operate so that the movable door can cover the communication port or not. The communication port; the movable door is provided with a door opening module, the door opening module can be driven by the driving mechanism to interconnect with the lid of the wafer box provided on the machine body; and An auxiliary device comprising: an air blowing module, which is detachably provided on the side of the door frame structure away from the plate body; the air blowing module is electrically connected to the control module, the control The module can control the blowing module to blow a predetermined gas to the communication port; a plurality of gas auxiliary components, which are correspondingly arranged in the plurality of reserved grooves; and a pumping and exhausting module, which is detachable Is installed in the machine body, and the exhausting and exhausting module is correspondingly located in the second accommodating space, the exhausting and exhausting module is connected to a plurality of the gas auxiliary components, and the exhausting The gas module can be controlled so that at least one of the gas auxiliary components performs gas exchange operation inside the wafer box provided on the machine body; wherein, when the control module controls the driving mechanism, When the door opening module of the movable door and the wafer box provided on the machine body are connected to each other, the control module can control the driving mechanism to operate so that the movable door And the lid body interconnecting the wafer cassette with it, leaving the communication port together so that the inside of the wafer cassette can communicate with the outside through the communication port; wherein, when the control module controls the When the movable door and the wafer box provided on the machine body are connected to each other, the control module can control the actuation of the blower module so that the area of the communication port is formed toward the machine Airflow flowing in the direction of the body. The wafer cassette carrying device according to claim 6, wherein the wafer cassette carrying device further includes a plurality of the gas auxiliary components, and each of the gas auxiliary components can be detachably provided in a plurality of the reserved In the groove, each of the gas auxiliary components includes a fixed seat and a suction cup; the machine body is provided with a sliding module, the sliding module and the disc body are connected to each other, and the sliding module can be used by The control module controls and drives the disk body to move toward the communication port, or drives the disk body to move away from the communication port. The wafer box carrying equipment according to claim 6, wherein the movable door is provided with a counter; when the movable door and the wafer box provided on the machine body are connected to each other, and the movable When the door drives the lid of the wafer cassette to move together, the counter can be controlled by the control module to count the number of wafers set in the wafer cassette. The wafer cassette carrying device according to claim 8, wherein the counter includes a transmitting unit and a receiving unit, the transmitting unit is pivotally connected to the movable door, and the receiving unit is pivotally connected to the movable door ; When the movable door and the wafer box provided on the machine body are connected to each other, and the movable door drives the lid of the wafer box to move together, the control module can control the The transmitting unit and the receiving unit rotate relative to the movable door, so that the transmitting unit and the receiving unit are arranged to face each other, and the transmitting unit and the receiving unit facing each other can follow Move the movable door to calculate the number of wafers set in the wafer cassette. The wafer box carrying equipment according to claim 9, wherein the door opening module includes at least two snap-in components and at least two suction components, and the two snap-in components can be controlled by the control module , And interlock with the lid of the wafer box provided on the machine body; each of the suction components is connected to the exhaust and exhaust module; two of the clamping components and the wafer box When the cover bodies are engaged with each other, the control module can control the exhaust and exhaust module to perform gas exchange operation on the wafer box; the machine body is provided with a partition plate, and the partition plates are opposite to each other. The sides are the first accommodating space and the second accommodating space, respectively, and the control module is fixedly arranged on one side of the partition; the other side of the partition is used to provide the extraction The air module is fixed; the machine body is further provided with a casing under the plate body, the casing is detachably provided on the machine body, and the casing is detached from the machine body At this time, the partition and the control module can be exposed to the machine body.

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