WO2023190191A1 - Epoxy resin composition, sealing material, and image display device - Google Patents
Epoxy resin composition, sealing material, and image display device Download PDFInfo
- Publication number
- WO2023190191A1 WO2023190191A1 PCT/JP2023/011893 JP2023011893W WO2023190191A1 WO 2023190191 A1 WO2023190191 A1 WO 2023190191A1 JP 2023011893 W JP2023011893 W JP 2023011893W WO 2023190191 A1 WO2023190191 A1 WO 2023190191A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- epoxy resin
- mass
- parts
- styrene
- group
- Prior art date
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- 239000003822 epoxy resin Substances 0.000 title claims abstract description 151
- 229920000647 polyepoxide Polymers 0.000 title claims abstract description 151
- 239000000203 mixture Substances 0.000 title claims abstract description 48
- 239000003566 sealing material Substances 0.000 title claims description 18
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 claims abstract description 132
- 229920002367 Polyisobutene Polymers 0.000 claims abstract description 43
- 238000002156 mixing Methods 0.000 claims abstract description 35
- 150000001336 alkenes Chemical class 0.000 claims abstract description 18
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 claims abstract description 18
- 239000004034 viscosity adjusting agent Substances 0.000 claims description 57
- 230000003287 optical effect Effects 0.000 claims description 12
- 230000035699 permeability Effects 0.000 description 47
- 125000002723 alicyclic group Chemical group 0.000 description 30
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 27
- 125000003118 aryl group Chemical group 0.000 description 21
- 239000003505 polymerization initiator Substances 0.000 description 21
- -1 and Chemical compound 0.000 description 16
- 239000003795 chemical substances by application Substances 0.000 description 15
- 229920005989 resin Polymers 0.000 description 15
- 239000011347 resin Substances 0.000 description 15
- 239000004593 Epoxy Substances 0.000 description 13
- 125000004432 carbon atom Chemical group C* 0.000 description 11
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical group C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 9
- 239000000126 substance Substances 0.000 description 9
- 238000010538 cationic polymerization reaction Methods 0.000 description 8
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 8
- 229920003986 novolac Polymers 0.000 description 8
- 239000006087 Silane Coupling Agent Substances 0.000 description 7
- 125000001931 aliphatic group Chemical group 0.000 description 7
- 239000011248 coating agent Substances 0.000 description 7
- 238000000576 coating method Methods 0.000 description 7
- 125000003700 epoxy group Chemical group 0.000 description 7
- 239000007787 solid Substances 0.000 description 7
- 239000002966 varnish Substances 0.000 description 7
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 6
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 6
- 239000000945 filler Substances 0.000 description 6
- 229910000077 silane Inorganic materials 0.000 description 6
- 229930185605 Bisphenol Natural products 0.000 description 5
- 239000000654 additive Substances 0.000 description 5
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 5
- 229920002799 BoPET Polymers 0.000 description 4
- 239000004844 aliphatic epoxy resin Substances 0.000 description 4
- 125000000217 alkyl group Chemical group 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- 239000003208 petroleum Substances 0.000 description 4
- YXALYBMHAYZKAP-UHFFFAOYSA-N 7-oxabicyclo[4.1.0]heptan-4-ylmethyl 7-oxabicyclo[4.1.0]heptane-4-carboxylate Chemical compound C1CC2OC2CC1C(=O)OCC1CC2OC2CC1 YXALYBMHAYZKAP-UHFFFAOYSA-N 0.000 description 3
- 235000010290 biphenyl Nutrition 0.000 description 3
- 239000004305 biphenyl Substances 0.000 description 3
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 3
- 238000011156 evaluation Methods 0.000 description 3
- 125000003709 fluoroalkyl group Chemical group 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 150000002430 hydrocarbons Chemical group 0.000 description 3
- 125000005647 linker group Chemical group 0.000 description 3
- 125000004430 oxygen atom Chemical group O* 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- 229920001296 polysiloxane Polymers 0.000 description 3
- 239000000565 sealant Substances 0.000 description 3
- 239000000377 silicon dioxide Substances 0.000 description 3
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 description 2
- ROGIWVXWXZRRMZ-UHFFFAOYSA-N 2-methylbuta-1,3-diene;styrene Chemical group CC(=C)C=C.C=CC1=CC=CC=C1 ROGIWVXWXZRRMZ-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 description 2
- 239000004793 Polystyrene Substances 0.000 description 2
- 241000705989 Tetrax Species 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 125000004429 atom Chemical group 0.000 description 2
- 230000001588 bifunctional effect Effects 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- 239000004842 bisphenol F epoxy resin Substances 0.000 description 2
- 239000011353 cycloaliphatic epoxy resin Substances 0.000 description 2
- 229920000359 diblock copolymer Polymers 0.000 description 2
- USIUVYZYUHIAEV-UHFFFAOYSA-N diphenyl ether Chemical compound C=1C=CC=CC=1OC1=CC=CC=C1 USIUVYZYUHIAEV-UHFFFAOYSA-N 0.000 description 2
- 229910052731 fluorine Inorganic materials 0.000 description 2
- 238000005227 gel permeation chromatography Methods 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- 238000006116 polymerization reaction Methods 0.000 description 2
- 229920002223 polystyrene Polymers 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 125000001424 substituent group Chemical group 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- HCNHNBLSNVSJTJ-UHFFFAOYSA-N 1,1-Bis(4-hydroxyphenyl)ethane Chemical compound C=1C=C(O)C=CC=1C(C)C1=CC=C(O)C=C1 HCNHNBLSNVSJTJ-UHFFFAOYSA-N 0.000 description 1
- UWFRVQVNYNPBEF-UHFFFAOYSA-N 1-(2,4-dimethylphenyl)propan-1-one Chemical compound CCC(=O)C1=CC=C(C)C=C1C UWFRVQVNYNPBEF-UHFFFAOYSA-N 0.000 description 1
- KJCVRFUGPWSIIH-UHFFFAOYSA-N 1-naphthol Chemical compound C1=CC=C2C(O)=CC=CC2=C1 KJCVRFUGPWSIIH-UHFFFAOYSA-N 0.000 description 1
- HDPLHDGYGLENEI-UHFFFAOYSA-N 2-[1-(oxiran-2-ylmethoxy)propan-2-yloxymethyl]oxirane Chemical compound C1OC1COC(C)COCC1CO1 HDPLHDGYGLENEI-UHFFFAOYSA-N 0.000 description 1
- FVCHRIQAIOHAIC-UHFFFAOYSA-N 2-[1-[1-[1-(oxiran-2-ylmethoxy)propan-2-yloxy]propan-2-yloxy]propan-2-yloxymethyl]oxirane Chemical compound C1OC1COC(C)COC(C)COC(C)COCC1CO1 FVCHRIQAIOHAIC-UHFFFAOYSA-N 0.000 description 1
- SEFYJVFBMNOLBK-UHFFFAOYSA-N 2-[2-[2-(oxiran-2-ylmethoxy)ethoxy]ethoxymethyl]oxirane Chemical compound C1OC1COCCOCCOCC1CO1 SEFYJVFBMNOLBK-UHFFFAOYSA-N 0.000 description 1
- SHKUUQIDMUMQQK-UHFFFAOYSA-N 2-[4-(oxiran-2-ylmethoxy)butoxymethyl]oxirane Chemical compound C1OC1COCCCCOCC1CO1 SHKUUQIDMUMQQK-UHFFFAOYSA-N 0.000 description 1
- WTYYGFLRBWMFRY-UHFFFAOYSA-N 2-[6-(oxiran-2-ylmethoxy)hexoxymethyl]oxirane Chemical compound C1OC1COCCCCCCOCC1CO1 WTYYGFLRBWMFRY-UHFFFAOYSA-N 0.000 description 1
- KUAUJXBLDYVELT-UHFFFAOYSA-N 2-[[2,2-dimethyl-3-(oxiran-2-ylmethoxy)propoxy]methyl]oxirane Chemical compound C1OC1COCC(C)(C)COCC1CO1 KUAUJXBLDYVELT-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical compound C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 1
- RRXFVFZYPPCDAW-UHFFFAOYSA-N 4-(7-oxabicyclo[4.1.0]heptan-4-ylmethoxymethyl)-7-oxabicyclo[4.1.0]heptane Chemical compound C1CC2OC2CC1COCC1CC2OC2CC1 RRXFVFZYPPCDAW-UHFFFAOYSA-N 0.000 description 1
- ZLPMHOSKRYECTK-UHFFFAOYSA-N 4-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]-7-oxabicyclo[4.1.0]heptane Chemical compound C1CC2OC2CC1CCC1CC2OC2CC1 ZLPMHOSKRYECTK-UHFFFAOYSA-N 0.000 description 1
- HVMHLMJYHBAOPL-UHFFFAOYSA-N 4-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)propan-2-yl]-7-oxabicyclo[4.1.0]heptane Chemical compound C1CC2OC2CC1C(C)(C)C1CC2OC2CC1 HVMHLMJYHBAOPL-UHFFFAOYSA-N 0.000 description 1
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 1
- LCFVJGUPQDGYKZ-UHFFFAOYSA-N Bisphenol A diglycidyl ether Chemical class C=1C=C(OCC2OC2)C=CC=1C(C)(C)C(C=C1)=CC=C1OCC1CO1 LCFVJGUPQDGYKZ-UHFFFAOYSA-N 0.000 description 1
- RWSOTUBLDIXVET-UHFFFAOYSA-N Dihydrogen sulfide Chemical class S RWSOTUBLDIXVET-UHFFFAOYSA-N 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 1
- NIYNIOYNNFXGFN-UHFFFAOYSA-N [4-(hydroxymethyl)cyclohexyl]methanol;7-oxabicyclo[4.1.0]heptane-4-carboxylic acid Chemical compound OCC1CCC(CO)CC1.C1C(C(=O)O)CCC2OC21.C1C(C(=O)O)CCC2OC21 NIYNIOYNNFXGFN-UHFFFAOYSA-N 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- 125000004018 acid anhydride group Chemical group 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 125000002947 alkylene group Chemical group 0.000 description 1
- XYLMUPLGERFSHI-UHFFFAOYSA-N alpha-Methylstyrene Chemical compound CC(=C)C1=CC=CC=C1 XYLMUPLGERFSHI-UHFFFAOYSA-N 0.000 description 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 125000003368 amide group Chemical group 0.000 description 1
- 239000003242 anti bacterial agent Substances 0.000 description 1
- 230000003712 anti-aging effect Effects 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- XFUOBHWPTSIEOV-UHFFFAOYSA-N bis(oxiran-2-ylmethyl) cyclohexane-1,2-dicarboxylate Chemical compound C1CCCC(C(=O)OCC2OC2)C1C(=O)OCC1CO1 XFUOBHWPTSIEOV-UHFFFAOYSA-N 0.000 description 1
- 239000004841 bisphenol A epoxy resin Substances 0.000 description 1
- XUCHXOAWJMEFLF-UHFFFAOYSA-N bisphenol F diglycidyl ether Chemical class C1OC1COC(C=C1)=CC=C1CC(C=C1)=CC=C1OCC1CO1 XUCHXOAWJMEFLF-UHFFFAOYSA-N 0.000 description 1
- 229920001400 block copolymer Polymers 0.000 description 1
- 125000005569 butenylene group Chemical group 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 125000005587 carbonate group Chemical group 0.000 description 1
- 125000002915 carbonyl group Chemical group [*:2]C([*:1])=O 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 150000001768 cations Chemical class 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 238000010227 cup method (microbiological evaluation) Methods 0.000 description 1
- 150000001934 cyclohexanes Chemical class 0.000 description 1
- ZWAJLVLEBYIOTI-UHFFFAOYSA-N cyclohexene oxide Chemical group C1CCCC2OC21 ZWAJLVLEBYIOTI-UHFFFAOYSA-N 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 239000012954 diazonium Substances 0.000 description 1
- 150000001989 diazonium salts Chemical class 0.000 description 1
- 238000007865 diluting Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 125000004185 ester group Chemical group 0.000 description 1
- 125000001033 ether group Chemical group 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 125000000816 ethylene group Chemical group [H]C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 125000001153 fluoro group Chemical group F* 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 125000002541 furyl group Chemical group 0.000 description 1
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 1
- XMBWDFGMSWQBCA-UHFFFAOYSA-N hydrogen iodide Chemical class I XMBWDFGMSWQBCA-UHFFFAOYSA-N 0.000 description 1
- 238000005984 hydrogenation reaction Methods 0.000 description 1
- 150000004679 hydroxides Chemical class 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 1
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 description 1
- 239000000347 magnesium hydroxide Substances 0.000 description 1
- 229910001862 magnesium hydroxide Inorganic materials 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 125000001570 methylene group Chemical group [H]C([H])([*:1])[*:2] 0.000 description 1
- 125000001624 naphthyl group Chemical group 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 125000000962 organic group Chemical group 0.000 description 1
- 125000001147 pentyl group Chemical group C(CCCC)* 0.000 description 1
- 125000005004 perfluoroethyl group Chemical group FC(F)(F)C(F)(F)* 0.000 description 1
- 125000005009 perfluoropropyl group Chemical group FC(C(C(F)(F)F)(F)F)(F)* 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 150000004714 phosphonium salts Chemical class 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 239000003755 preservative agent Substances 0.000 description 1
- 125000006410 propenylene group Chemical group 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- 238000010926 purge Methods 0.000 description 1
- 150000003242 quaternary ammonium salts Chemical class 0.000 description 1
- 230000001846 repelling effect Effects 0.000 description 1
- 239000011342 resin composition Substances 0.000 description 1
- 150000004756 silanes Chemical class 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 125000004434 sulfur atom Chemical group 0.000 description 1
- 150000003505 terpenes Chemical class 0.000 description 1
- 235000007586 terpenes Nutrition 0.000 description 1
- 125000000383 tetramethylene group Chemical group [H]C([H])([*:1])C([H])([H])C([H])([H])C([H])([H])[*:2] 0.000 description 1
- 125000001544 thienyl group Chemical group 0.000 description 1
- 125000000101 thioether group Chemical group 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- JXUKBNICSRJFAP-UHFFFAOYSA-N triethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CCO[Si](OCC)(OCC)CCCOCC1CO1 JXUKBNICSRJFAP-UHFFFAOYSA-N 0.000 description 1
- 125000002023 trifluoromethyl group Chemical group FC(F)(F)* 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
- 125000003258 trimethylene group Chemical group [H]C([H])([*:2])C([H])([H])C([H])([H])[*:1] 0.000 description 1
- 229930195735 unsaturated hydrocarbon Natural products 0.000 description 1
- PAPBSGBWRJIAAV-UHFFFAOYSA-N ε-Caprolactone Chemical compound O=C1CCCCCO1 PAPBSGBWRJIAAV-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
- C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
- C08L23/18—Homopolymers or copolymers of hydrocarbons having four or more carbon atoms
- C08L23/20—Homopolymers or copolymers of hydrocarbons having four or more carbon atoms having four to nine carbon atoms
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L25/00—Compositions of, homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Compositions of derivatives of such polymers
- C08L25/02—Homopolymers or copolymers of hydrocarbons
- C08L25/04—Homopolymers or copolymers of styrene
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L53/00—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
- C08L53/02—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers of vinyl-aromatic monomers and conjugated dienes
- C08L53/025—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers of vinyl-aromatic monomers and conjugated dienes modified
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
- C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
Definitions
- the present invention relates to an epoxy resin composition, a sealing material, and an image display device.
- organic EL displays for example, have been known as image display devices equipped with optical elements.
- the optical element is sealed with a sealant in order to prevent the optical element from deteriorating due to moisture in the atmosphere.
- thermosetting resin composition containing a thermosetting resin (epoxy resin) has been proposed (see, for example, Patent Document 1). .
- sealing materials are required to have even lower moisture permeability.
- the present invention provides an epoxy resin composition with excellent compatibility and low moisture permeability, a sealant containing a cured product of the epoxy resin composition, and an image display device equipped with the sealant.
- the present invention [1] includes an epoxy resin, a styrene-based viscosity modifier, polyisobutylene, and a compatibilizer, and the compatibilizer has a diblock structure containing a styrene-derived structure and an olefin-derived structure.
- the blending ratio of the compatibilizer is 30 parts by mass or more and 120 parts by mass or less with respect to 100 parts by mass of polyisobutylene, and the blending ratio of the compatibilizer is 100 parts by mass of a styrene-based viscosity modifier.
- the amount of the epoxy resin composition is 80 parts by mass or more and 350 parts by mass or less.
- the present invention [2] includes a sealing material containing a cured product of the epoxy resin composition described in the above [1].
- the present invention [3] includes an image display device including an optical element and the sealing material according to the above [2] that seals the optical element.
- the epoxy resin composition of the present invention contains polyisobutylene. Therefore, it has excellent low moisture permeability.
- This epoxy resin composition also contains a compatibilizer (a compatibilizer having a diblock structure containing a styrene-derived structure and an olefin-derived structure) in a predetermined ratio for each of the polyisobutylene and the styrene-based viscosity modifier. agent). Therefore, it has excellent compatibility.
- a compatibilizer a compatibilizer having a diblock structure containing a styrene-derived structure and an olefin-derived structure
- the sealing material of the present invention includes a cured product of the epoxy resin composition of the present invention. Therefore, it has excellent compatibility.
- the image display device of the present invention includes an optical element and the sealing material of the present invention that seals the optical element. Therefore, it has excellent low moisture permeability.
- the epoxy resin composition includes an epoxy resin, a styrene-based viscosity modifier, polyisobutylene, and a compatibilizer.
- Epoxy resin examples include aliphatic epoxy resins, alicyclic epoxy resins, and aromatic epoxy resins.
- An aliphatic epoxy resin is a curable resin that has an epoxy group and no aliphatic ring (alicyclic skeleton) or aromatic ring.
- aliphatic epoxy resins include ethylene glycol diglycidyl ether, diethylene glycol diglycidyl ether, propylene glycol diglycidyl ether, tripropylene glycol diglycidyl ether, neopentyl glycol diglycidyl ether, 1,4-butanediol diglycidyl ether, and , 1,6-hexanediol diglycidyl ether.
- Alicyclic epoxy resin is a curable resin that has an epoxy group and an aliphatic ring (alicyclic skeleton) and does not have an aromatic ring.
- alicyclic epoxy resins examples include glycidyl group-containing alicyclic epoxy resins, glycidyl ether group-containing alicyclic epoxy resins, and epoxycyclo structure-containing epoxy resins.
- a glycidyl group-containing alicyclic epoxy resin has, for example, a glycidyl group bonded to an aliphatic ring.
- Such a glycidyl group-containing alicyclic epoxy resin is represented by the following general formula (1), for example.
- R1 represents a monovalent organic group
- n represents the degree of polymerization.
- a substituent such as an alkyl group may be bonded to the carbon atom constituting the cyclohexane ring.
- the glycidyl group-containing alicyclic epoxy resin represented by the above general formula (1) includes 1,2-epoxy-4-(2-oxiranyl) of 2,2-bis(hydroxymethyl)-1-butanol. ) cyclohexane adducts.
- a commercially available product can also be used as the glycidyl group-containing alicyclic epoxy resin represented by the above general formula (1).
- a commercially available glycidyl group-containing alicyclic epoxy resin represented by the above general formula (1) for example, EHPE3150 (epoxy equivalent: 170 to 190 g/eq., manufactured by Daicel Corporation) can be mentioned.
- a glycidyl ether group-containing alicyclic epoxy resin has a glycidyl ether unit bonded to an aliphatic ring.
- the glycidyl ether group-containing cycloaliphatic epoxy resin is a polyglycidyl ether-containing cycloaliphatic epoxy resin having a plurality of glycidyl ether units bonded to an aliphatic ring.
- Examples of the glycidyl ether-containing alicyclic epoxy resin include bifunctional glycidyl ether-containing alicyclic epoxy resins.
- Examples of the bifunctional glycidyl ether-containing alicyclic epoxy resin include hydrogenated bisphenol A diglycidyl ether, hydrogenated bisphenol F diglycidyl ether, and hexahydrophthalic acid diglycidyl ester.
- Epoxy resin containing epoxy cyclo structure An epoxy cyclo structure-containing epoxy resin has an epoxy cyclo structure that has an epoxy group composed of two adjacent carbon atoms forming an aliphatic ring and one oxygen atom bonded to those two carbon atoms. .
- epoxy cyclo structure-containing epoxy resins examples include epoxy cyclohexane structure-containing epoxy resins (hereinafter referred to as ECH structure-containing epoxy resins).
- ECH structure-containing epoxy resins include, for example, epoxy resins containing one ECH structure shown in the following chemical formula (2), epoxy resins containing one ECH structure shown in the following chemical formula (3), and the following general formula (4). ) and modified products thereof.
- X represents a linking group (a divalent group having one or more atoms).
- R2 represents one atom or substituent selected from the group consisting of a hydrogen atom, a fluorine atom, an alkyl group, a fluoroalkyl group, an aryl group, a furyl group, and a thienyl group.
- the two R2's in formula (4) may be the same or different.
- the epoxy resin containing the two ECH structures shown in the above general formula (4) (hereinafter referred to as the ECH structure-containing epoxy resin shown in the general formula (4)) has an ECH structure (epoxycyclohexyl group) in the molecule. It has two epoxycyclohexyl groups at both ends and is bonded via a linking group. Note that the epoxycyclohexyl group is a functional group that includes a cyclohexane ring, an epoxy group composed of two adjacent carbon atoms forming the cyclohexane ring, and one oxygen atom bonded to these two carbon atoms. It is.
- alkyl group represented by R2 in the above general formula (4) examples include linear or branched alkyl groups having 1 to 6 carbon atoms (for example, methyl group, ethyl group, propyl group, butyl group, pentyl group, hexyl group, etc.).
- Examples of the fluoroalkyl group represented by R2 in the above general formula (4) include linear or branched fluoroalkyl groups having 1 to 6 carbon atoms (e.g., perfluoromethyl group, perfluoroethyl group, perfluoropropyl group). etc.).
- Examples of the aryl group represented by R2 in the above general formula (4) include aryl groups having 6 to 18 carbon atoms (eg, phenyl group, naphthyl group, etc.).
- Examples of the linking group represented by X in the above general formula (4) include oxygen atom, sulfur atom, divalent hydrocarbon group, polyoxyalkylene group, carbonyl group, ether group, thioether group, ester group, carbonate group, Examples include an amide group and a group in which these are linked.
- divalent hydrocarbon groups examples include linear or branched alkylene groups having 1 to 20 carbon atoms (e.g., methylene group, methylmethylene group, dimethylmethylene group, ethylene group, propylene group, trimethylene group, butylene group). ), linear or branched unsaturated hydrocarbon groups having 1 to 20 carbon atoms (eg, propenylene group, methylpropenylene group, butenylene group, etc.).
- polyoxyalkylene group examples include linear or branched polyoxyalkylene groups having 1 to 120 carbon atoms (eg, polyoxyethylene group, polyoxypropylene group, etc.).
- the ECH structure-containing epoxy resin represented by general formula (4) includes bis(3,4-epoxycyclohexylmethyl)ether, 1,2-bis(3,4-epoxycyclohexan-1-yl)ethane, , 2,2-bis(3,4-epoxycyclohexan-1-yl)propane, 3,4-epoxycyclohexylmethyl(3,4-epoxy)cyclohexanecarboxylate, and ⁇ -caprolactone modified 3',4'- Examples include epoxycyclohexylmethyl 3,4-epoxycyclohexanecarboxylate, and preferably 3,4-epoxycyclohexylmethyl (3,4-epoxy)cyclohexanecarboxylate.
- ECH structure-containing epoxy resin represented by the above general formula (4) examples include Celloxide 8010, Celloxide 2021P (epoxy equivalent: 128 to 145 g/eq.), and Celloxide 2081 (manufactured by Daicel Corporation). .
- the alicyclic epoxy resin includes an epoxy cyclo structure-containing epoxy resin. More preferred examples of the alicyclic epoxy resin include ECH structure-containing epoxy resins represented by the above general formula (4).
- the weight average molecular weight of the alicyclic epoxy resin is, for example, 200 or more, for example, 1000 or less, and preferably 500 or less.
- the weight average molecular weight (Mw) can be determined by gel permeation chromatography (GPC) using polystyrene as a standard substance (the same applies hereinafter).
- the epoxy equivalent in the alicyclic epoxy resin is, for example, 90 g/eq. Above, preferably 100g/eq. Above, for example, 250g/eq. Below, preferably 190g/eq. It is as follows.
- the epoxy equivalent can be measured in accordance with JIS K7236:2001 (the same applies hereinafter).
- Aromatic epoxy resin is a curable resin that has an epoxy group and an aromatic ring, but does not have an aliphatic ring (alicyclic skeleton).
- aromatic epoxy resins examples include bisphenol type epoxy resins, diphenyl ether type epoxy resins, novolac type epoxy resins (e.g., phenol novolak type, cresol novolak type, biphenyl novolac type, bisphenol novolac type, naphthol novolak type, trisphenol novolak type) type, dicyclopentadiene novolac type), biphenyl type epoxy resin, and naphthalene type epoxy resin.
- Preferable aromatic epoxy resins include bisphenol-type epoxy resins and biphenyl-type epoxy resins.
- bisphenol epoxy resins include bisphenol A epoxy resin, bisphenol F epoxy resin, bisphenol E epoxy resin, bisphenol S epoxy resin, and bisphenol AD epoxy resin.
- the bisphenol epoxy resin includes a bisphenol F epoxy resin.
- the aromatic epoxy resin may be solid at room temperature or liquid at room temperature.
- the aromatic epoxy resin is preferably solid at room temperature. Note that “solid at room temperature” refers to a solid state that does not have fluidity at room temperature (23°C), and “liquid at room temperature” refers to a liquid state that has fluidity at room temperature (23°C). .
- the weight average molecular weight (Mw) of the aromatic epoxy resin is, for example, 1,000 or more, preferably 3,000 or more, and, for example, 10,000 or less, preferably 8,000 or less.
- the epoxy equivalent in the aromatic epoxy resin is, for example, 1000 g/eq. Above, preferably 5000g/eq. Above, more preferably 8000g/eq. Above, for example, 12000g/eq. It is as follows.
- the epoxy resin include alicyclic epoxy resins and aromatic epoxy resins.
- Epoxy resins can be used alone or in combination of two or more.
- an alicyclic epoxy resin and an aromatic epoxy resin are used together as the epoxy resin.
- the blending ratio of the alicyclic epoxy resin should be one with low moisture permeability based on 100 parts by mass of the total amount of the alicyclic epoxy resin and the aromatic epoxy resin. From the viewpoint of improving low moisture permeability, for example, 20 parts by mass or more, preferably 30 parts by mass or more, more preferably 35 parts by mass or more, and from the viewpoint of improving low moisture permeability, for example, 60 parts by mass or less, preferably, It is 48 parts by mass or less.
- the blending ratio of the aromatic epoxy resin is, for example, 40 parts by mass or more, preferably 52 parts by mass, from the viewpoint of improving low moisture permeability, with respect to 100 parts by mass of the total amount of the alicyclic epoxy resin and the aromatic epoxy resin.
- the amount is, for example, 80 parts by mass or less, preferably 70 parts by mass or less, and more preferably 65 parts by mass or less.
- the blending ratio of the epoxy resin is, for example, 30 parts by mass or more, preferably 30 parts by mass or more, based on the total amount of the epoxy resin, styrene viscosity modifier, polyisobutylene, and compatibilizer, from the viewpoint of improving low moisture permeability. , 40 parts by mass or more, and, from the viewpoint of improving low moisture permeability, for example, 70 parts by mass or less, preferably 63 parts by mass or less, more preferably 58 parts by mass or less.
- the styrenic viscosity modifier is a component that imparts adhesive strength to the epoxy resin composition.
- styrenic viscosity modifiers examples include styrene polymers, ⁇ -methylstyrene polymers, and styrene- ⁇ -styrene copolymers.
- a commercially available styrene-based viscosity modifier can also be used.
- Commercially available styrene-based viscosity modifiers include, for example, the FTR series (eg, FTR-8120, FTR-8100, manufactured by Mitsui Chemicals, Inc.).
- the weight average molecular weight (Mw) of the styrene-based viscosity modifier is, for example, 1000 or more, preferably 1200 or more, more preferably 1300 or more, from the viewpoint of improving low moisture permeability. , for example, 2000 or less, preferably 1500 or less.
- the styrenic viscosity modifiers can be used alone or in combination of two or more.
- the blending ratio of the styrene-based viscosity modifier is, for example, 5 parts by mass or more, preferably 10 parts by mass or more, from the viewpoint of improving low moisture permeability, with respect to 100 parts by mass of the epoxy resin. From this point of view, the amount is, for example, 20 parts by mass or less, preferably 15 parts by mass or less.
- the blending ratio of the styrene-based viscosity modifier is, for example, 1.0% with respect to 100 parts by mass of the total amount of the epoxy resin, styrene-based viscosity modifier, polyisobutylene, and compatibilizer from the viewpoint of improving low moisture permeability.
- the content is 0 parts by mass or more, preferably 5.0 parts by mass, and, from the viewpoint of improving low moisture permeability, for example, 10 parts by mass or less, preferably 7.8 parts by mass or less.
- Polyisobutylene is a component that imparts low moisture permeability to the epoxy resin composition.
- the weight average molecular weight of polyisobutylene is, for example, 10,000 or more, preferably 30,000 or more, more preferably 45,000 or more, from the viewpoint of improving low moisture permeability, and, for example, 100,000 or less from the viewpoint of improving low moisture permeability. , preferably 70,000 or less, more preferably 50,000 or less.
- the blending ratio of polyisobutylene is, for example, 15 parts by mass or more, preferably 25 parts by mass or more, more preferably 35 parts by mass or more, based on 100 parts by mass of the epoxy resin. , from the viewpoint of improving low moisture permeability, for example, 50 parts by mass or less.
- the blending ratio of polyisobutylene is, for example, 100 parts by mass or more, preferably 120 parts by mass or more, more preferably 200 parts by mass or more, from the viewpoint of improving low moisture permeability, with respect to 100 parts by mass of the styrene-based viscosity modifier.
- the content is at least 250 parts by mass, more preferably at least 250 parts by mass, and from the viewpoint of improving low moisture permeability, for example, at most 600 parts by mass, preferably at most 450 parts by mass, more preferably at most 350 parts by mass.
- the blending ratio of polyisobutylene is, for example, 10 parts by mass or more with respect to 100 parts by mass of the total amount of the epoxy resin, styrene-based viscosity modifier, polyisobutylene, and compatibilizer.
- the amount is 15 parts by mass or more, and from the viewpoint of improving low moisture permeability, it is, for example, 40 parts by mass or less, preferably 30 parts by mass or less, and more preferably 25 parts by mass or less.
- the compatibilizer is a component for improving compatibility (specifically, compatibility between the styrene viscosity modifier (epoxy resin) and polyisobutylene).
- the compatibilizer has a diblock structure including a styrene-derived structure and an olefin-derived structure. If the compatibilizer has a diblock structure containing a styrene-derived structure and an olefin-derived structure, the compatibility between the styrene-based viscosity modifier (epoxy resin) and polyisobutylene can be improved.
- a compatibilizer is a hydrogenated styrene-isoprene diblock copolymer represented by the following formula (5).
- l and m indicate the degree of polymerization.
- the proportion of units having a styrene-derived structure is, for example, 30 mol% or more, preferably 40 mol%, based on the total amount of units having a styrene-derived structure and units having an olefin-derived structure. For example, it is 70 mol% or less, preferably 60 mol% or less.
- the proportion of units having an olefin-derived structure is, for example, 30 mol% or more, preferably 40 mol% or more, with respect to the total amount of units having a styrene-derived structure and olefin-derived structures, and , for example, 70 mol% or less, preferably 60 mol% or less.
- the proportion of units having a styrene-derived structure and the proportion of units having an olefin-derived structure are the same.
- the proportion of units having a styrene-derived structure is 50 mol% with respect to the total amount of units having a styrene-derived structure and units having an olefin-derived structure.
- the proportion is 50 mol%.
- the proportion of units having a structure derived from styrene in the compatibilizer is preferably 0.5 or more and 10 or less with respect to the molecular chain of the styrene-based viscosity modifier.
- a commercially available product can also be used as the compatibilizer.
- Examples of commercially available compatibilizers include Septon 1020 (manufactured by Kuraray Co., Ltd.).
- the compatibilizers can be used alone or in combination of two or more.
- the compounding ratio of the compatibilizer is 30 parts by mass or more, preferably 40 parts by mass or more, and 120 parts by mass or less, preferably 90 parts by mass or less, more preferably 70 parts by mass or less, based on 100 parts by mass of polyisobutylene. Parts by mass or less.
- compatibility specifically, compatibility between the styrene viscosity modifier (epoxy resin) and polyisobutylene
- low moisture permeability can be improved.
- the blending ratio of the compatibilizer to 100 parts by mass of polyisobutylene is below the above upper limit, low moisture permeability can be improved.
- the blending ratio of the compatibilizer is 80 parts by mass or more, preferably 120 parts by mass or more, and 350 parts by mass or less, preferably 250 parts by mass or less, with respect to 100 parts by mass of the styrene-based viscosity modifier. More preferably, it is 200 parts by mass or less.
- the blending ratio of the compatibilizer to 100 parts by mass of the styrene-based viscosity modifier is at least the above lower limit, low moisture permeability can be improved.
- the blending ratio of the compatibilizer to 100 parts by mass of the styrene-based viscosity modifier is less than the above-mentioned lower limit, the low moisture permeability will decrease.
- the compatibility specifically, the compatibility between the styrene-based viscosity modifier (epoxy resin) and polyisobutylene) ) and can improve low moisture permeability.
- the blending ratio of the compatibilizer is, for example, 5 parts by mass or more, preferably 8 parts by mass or more, with respect to 100 parts by mass of the total amount of the epoxy resin, styrene-based viscosity modifier, polyisobutylene, and compatibilizer. Further, for example, the amount is 25 parts by mass or less, preferably 20 parts by mass or less, more preferably 15 parts by mass or less, and even more preferably 12 parts by mass or less.
- the epoxy resin composition can contain additives in appropriate proportions, if necessary.
- Additives include, for example, polymerization initiators, other viscosity modifiers, leveling agents, silane coupling agents, fillers, sensitizers, antioxidants, antiaging agents, plasticizers, ultraviolet absorbers, preservatives, and , antibacterial agents.
- the additives can be used alone or in combination of two or more.
- polymerization initiator examples include thermal cationic polymerization initiators and photocationic polymerization initiators.
- the polymerization initiator is a thermal cationic polymerization initiator.
- a thermal cationic polymerization initiator is a thermal acid generator that generates an acid (cation) when heated.
- thermal cationic polymerization initiator a known thermal cationic polymerization initiator can be used.
- thermal cationic polymerization initiators include sulfonium salts having counteranions such as AsF 6- , SbF 6- , PF 6- , BF 4- , B(C 6 F 5 ) 4 - , CF 3 SO 3 - , etc.
- examples include phosphonium salts, quaternary ammonium salts, diazonium salts, and iodonium salts.
- the polymerization initiators can be used alone or in combination of two or more types.
- the blending ratio of the polymerization initiator is, for example, 1 part by mass or more, preferably 2 parts by mass or more, and, for example, 5 parts by mass or less, based on 100 parts by mass of the epoxy resin.
- the blending ratio of the polymerization initiator is, for example, 0.1 part by mass or more, preferably 0.5 parts by mass, based on 100 parts by mass of the total amount of the epoxy resin, styrene viscosity modifier, polyisobutylene, and compatibilizer.
- the amount is not less than 5.0 parts by mass, preferably not more than 2.0 parts by mass.
- Other viscosity modifiers are viscosity modifiers other than the above-mentioned styrene-based viscosity modifiers.
- other viscosity modifiers include, for example, petroleum resins, terpene resins, phenol resins, and rosin resins.
- Other viscosity modifiers preferably include petroleum resins.
- Viscosity modifiers Commercially available products can also be used as other viscosity modifiers.
- Other commercially available viscosity modifiers include, for example, QTN-1500 (petroleum resin, manufactured by Nippon Zeon Co., Ltd.).
- the blending ratio of other viscosity modifiers is, for example, 10 parts by mass or more, preferably 15 parts by mass or more, with respect to 100 parts by mass of the total amount of the epoxy resin, styrene viscosity modifier, polyisobutylene, and compatibilizer. Further, it is, for example, 30 parts by mass or less, preferably 20 parts by mass or less.
- the leveling agent is a component for improving the flatness of the sealing material obtained using the epoxy resin composition.
- the leveling agent examples include silicone leveling agents, acrylic leveling agents, and fluorine leveling agents.
- the leveling agent is a silicone leveling agent.
- the leveling agents can be used alone or in combination of two or more.
- the blending ratio of the leveling agent is, for example, 0.1 part by mass or more, or, for example, 1.0 part by mass with respect to 100 parts by mass of the total amount of the epoxy resin, styrene-based viscosity modifier, polyisobutylene, and compatibilizer.
- the amount is preferably 0.5 parts by mass or less.
- silane coupling agent examples include a silane compound having an epoxy group, a silane compound having a carboxyl group, a silane compound having a methacryloyl group, a silane compound having an acid anhydride group, and a silane compound having an isocyanate group.
- silane coupling agent examples include silane compounds having an epoxy group.
- the silane coupling agents can be used alone or in combination of two or more.
- the blending ratio of the silane coupling agent is, for example, 0.1 part by mass or more, preferably 0.5 part by mass, based on 100 parts by mass of the epoxy resin, styrene viscosity modifier, polyisobutylene, and compatibilizer. parts or more, and for example, 3.0 parts by mass or less, preferably 1.0 parts by mass or less.
- fillers include silica, alumina, oxides (eg, titanium oxide, magnesium oxide), and hydroxides (eg, aluminum hydroxide, magnesium hydroxide).
- the filler includes silica.
- the fillers can be used alone or in combination of two or more.
- the blending ratio of the filler is, for example, 5 parts by mass or more, preferably 10 parts by mass or more, based on 100 parts by mass of the total amount of the epoxy resin, styrene viscosity modifier, polyisobutylene, and compatibilizer. It is 50 parts by mass or less, preferably 30 parts by mass or less.
- an epoxy resin composition To prepare an epoxy resin composition, an epoxy resin, a styrene-based viscosity modifier, polyisobutylene, a compatibilizer, and optional additives are mixed. In particular, when blending a polymerization initiator, the polymerization initiator is blended after components other than the polymerization initiator are blended. In this way, an epoxy resin composition is prepared.
- the epoxy resin composition can be diluted with a known organic solvent. That is, the epoxy resin composition can be prepared as an epoxy resin composition varnish.
- the solid content concentration of the varnish of the epoxy resin composition is, for example, 10% by mass or more, or, for example, 50% by mass. It is as follows.
- Such an epoxy resin composition has excellent compatibility (specifically, compatibility between the styrene viscosity modifier (epoxy resin) and polyisobutylene) and low moisture permeability. Therefore, it can be suitably used as a sealing material for sealing an optical element.
- the sealing material includes a cured product of the above-mentioned epoxy resin composition.
- the epoxy resin composition contains a thermal cationic polymerization initiator
- the epoxy resin composition is cured by heating the epoxy resin composition.
- the curing temperature is, for example, 60°C or higher and, for example, 100°C or lower.
- the heating time is, for example, 1 minute or more and, for example, 60 minutes or less.
- the cured product of the epoxy resin composition preferably has transparency.
- the total light transmittance (according to JIS K 7361-1) of the cured product of the epoxy resin composition is, for example, 80% or more, preferably 85% or more, more preferably 90% or more, or , for example, 100% or less.
- the sealing material contains the cured product of the above-mentioned epoxy resin composition, it has excellent low moisture permeability.
- the image display device includes an optical element and the sealing material that seals the optical element. Since the image display device includes the above sealing material, it has excellent low moisture permeability.
- the epoxy resin composition includes polyisobutylene. Therefore, it has excellent low moisture permeability.
- This epoxy resin composition also contains a compatibilizer (a compatibilizer having a diblock structure containing a styrene-derived structure and an olefin-derived structure) in a predetermined ratio for each of the polyisobutylene and the styrene-based viscosity modifier. agent). Therefore, it has excellent compatibility.
- a compatibilizer a compatibilizer having a diblock structure containing a styrene-derived structure and an olefin-derived structure
- the compatibilizer has a structure similar to a styrenic viscosity modifier and a structure similar to polyisobutylene. Specifically, the compatibilizer has both a styrene-derived structure similar to a styrene-based viscosity modifier and an olefin-derived structure similar to polyisobutylene.
- the compatibilizer has a diblock structure in which the styrene-derived structure and the olefin-derived structure are combined.
- the compatibilizer contains a styrene-derived structure and an olefin-derived structure, but they do not have a diblock structure, for example, a block combination consisting of a styrene-derived structure - an olefin-derived structure - a styrene-derived structure
- a diblock structure for example, a block combination consisting of a styrene-derived structure - an olefin-derived structure - a styrene-derived structure
- the distance between the styrene-derived structures at both ends is limited by chemical bonds, so compatibility will not improve unless the styrene-based viscosity modifier is adjacent to both ends.
- the compatibilizer in this epoxy resin composition has a structure derived from styrene at one end and a structure derived from olefin at the other end, the compatibility can be reliably improved.
- the sealing material contains the cured product of the above-mentioned epoxy resin composition, it has excellent low moisture permeability.
- CEL2021P 3,4-epoxycyclohexylmethyl (3,4-epoxy)cyclohexanecarboxylate, ECH structure-containing epoxy resin shown in the above general formula (4), trade name "Celoxide 2021P", molecular weight: 252.3, epoxy equivalent :128-145g/eq.
- Daicel Corporation jER-4005P bisphenol F type epoxy resin solid at room temperature, weight average molecular weight 7582, epoxy equivalent 10000 g/eq.
- CXC-1733 Thermal cationic polymerization initiator, Kusumoto Kasei Co., Ltd. QTN-1500: Other viscosity modifiers, petroleum resin, Nippon Zeon Co., Ltd. BYK-302: Silicone leveling agent , KBM-403 manufactured by Bick Chemie: 3-glycidoxypropyltriethoxysilane, X12-967C manufactured by Shin-Etsu Chemical Co., Ltd.: Silane coupling agent with acid anhydride, KBM-4803 manufactured by Shin-Etsu Chemical Co., Ltd.: epoxy group Silane compound, EP4088L manufactured by Shin-Etsu Chemical Co., Ltd.: Epoxy resin having a dicyclopentadiene skeleton, SC-2050MB manufactured by ADEKA: Filler, silica, manufactured by Admatex Co., Ltd.
- Epoxy resin compositions were prepared by blending each component based on the formulations listed in Tables 1 to 3. Specifically, first, components other than the polymerization initiator were mixed into a flask. Next, 50 parts by mass of methyl ethyl ketone and 50 parts by mass of toluene were added and dissolved with stirring at room temperature. Then, a polymerization initiator was added and stirred at room temperature. In this way, a varnish of an epoxy resin composition was prepared.
- the epoxy resin composition, sealing material, and image display device of the present invention can be suitably used, for example, in the production of organic EL displays.
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Abstract
This epoxy resin composition comprises an epoxy resin, a styrene-based viscosity adjuster, polyisobutylene and a compatibilizer. The compatibilizer has a diblock structure containing a styrene-derived structure and an olefin-derived structure. The mixing ratio of the compatibilizer is 30-120 parts by mass with respect to 100 parts by mass of the polyisobutylene. The mixing ratio of the compatibilizer is 80-350 parts by mass with respect to 100 parts by mass of the styrene-based viscosity adjuster.
Description
本発明は、エポキシ樹脂組成物、封止材および画像表示装置に関する。
The present invention relates to an epoxy resin composition, a sealing material, and an image display device.
近年、光学素子を備える画像表示装置として、例えば、有機ＥＬディスプレイが知られている。このような画像表示装置では、光学素子が大気中の水分などにより劣化することを抑制するために、光学素子が封止材によって封止されている。
In recent years, organic EL displays, for example, have been known as image display devices equipped with optical elements. In such an image display device, the optical element is sealed with a sealant in order to prevent the optical element from deteriorating due to moisture in the atmosphere.
このような封止材を形成するための封止用組成物として、例えば、熱硬化型樹脂（エポキシ樹脂）を含む熱硬化型樹脂組成物が提案されている（例えば、特許文献１参照。）。
As a sealing composition for forming such a sealing material, for example, a thermosetting resin composition containing a thermosetting resin (epoxy resin) has been proposed (see, for example, Patent Document 1). .
一方、封止材には、より一層、低透湿性が要求される。
On the other hand, sealing materials are required to have even lower moisture permeability.
低透湿性を向上させるために、低透湿性を有するポリイソブレンを樹脂に配合することも検討されるが、とりわけ、樹脂がエポキシ樹脂である場合には、エポキシ樹脂とポリイソブチレンとは相溶性が低いため、均一な混合液を得ることができないという不具合がある。
In order to improve the low moisture permeability, blending polyisobrene with low moisture permeability into the resin is considered, but especially when the resin is an epoxy resin, the compatibility between the epoxy resin and polyisobutylene is low. Therefore, there is a problem that a uniform liquid mixture cannot be obtained.
本発明は、相溶性および低透湿性に優れるエポキシ樹脂組成物、そのエポキシ樹脂組成物の硬化物を含む封止材、および、その封止材を備える画像表示装置を提供する。
The present invention provides an epoxy resin composition with excellent compatibility and low moisture permeability, a sealant containing a cured product of the epoxy resin composition, and an image display device equipped with the sealant.
本発明［１］は、エポキシ樹脂と、スチレン系粘度調整剤と、ポリイソブチレンと、相溶化剤とを含み、前記相溶化剤は、スチレン由来の構造とオレフィン由来の構造とを含むジブロック構造を有し、前記相溶化剤の配合割合は、ポリイソブチレン１００質量部に対して、３０質量部以上１２０質量部以下であり、前記相溶化剤の配合割合は、スチレン系粘度調整剤１００質量部に対して、８０質量部以上３５０質量部以下である、エポキシ樹脂組成物である。
The present invention [1] includes an epoxy resin, a styrene-based viscosity modifier, polyisobutylene, and a compatibilizer, and the compatibilizer has a diblock structure containing a styrene-derived structure and an olefin-derived structure. The blending ratio of the compatibilizer is 30 parts by mass or more and 120 parts by mass or less with respect to 100 parts by mass of polyisobutylene, and the blending ratio of the compatibilizer is 100 parts by mass of a styrene-based viscosity modifier. The amount of the epoxy resin composition is 80 parts by mass or more and 350 parts by mass or less.
本発明［２］は、上記［１］に記載のエポキシ樹脂組成物の硬化物を含む、封止材を含んでいる。
The present invention [2] includes a sealing material containing a cured product of the epoxy resin composition described in the above [1].
本発明［３］は、光学素子と、前記光学素子を封止する上記［２］に記載の封止材とを備える、画像表示装置を含んでいる。
The present invention [3] includes an image display device including an optical element and the sealing material according to the above [2] that seals the optical element.
本発明のエポキシ樹脂組成物は、ポリイソブチレンを含む。そのため、低透湿性に優れる。
The epoxy resin composition of the present invention contains polyisobutylene. Therefore, it has excellent low moisture permeability.
また、このエポキシ樹脂組成物は、ポリイソブチレンおよびスチレン系粘度調整剤のそれぞれに対して、所定の割合の相溶化剤（スチレン由来の構造とオレフィン由来の構造とを含むジブロック構造を有する相溶化剤）を含む。そのため、相溶性に優れる。
This epoxy resin composition also contains a compatibilizer (a compatibilizer having a diblock structure containing a styrene-derived structure and an olefin-derived structure) in a predetermined ratio for each of the polyisobutylene and the styrene-based viscosity modifier. agent). Therefore, it has excellent compatibility.
本発明の封止材は、本発明のエポキシ樹脂組成物の硬化物を含む。そのため、相溶性に優れる。
The sealing material of the present invention includes a cured product of the epoxy resin composition of the present invention. Therefore, it has excellent compatibility.
本発明の画像表示装置は、光学素子と、光学素子を封止する本発明の封止材とを備える。そのため、低透湿性に優れる。
The image display device of the present invention includes an optical element and the sealing material of the present invention that seals the optical element. Therefore, it has excellent low moisture permeability.
エポキシ樹脂組成物は、エポキシ樹脂と、スチレン系粘度調整剤と、ポリイソブチレンと、相溶化剤とを含む。
The epoxy resin composition includes an epoxy resin, a styrene-based viscosity modifier, polyisobutylene, and a compatibilizer.
＜エポキシ樹脂＞
エポキシ樹脂としては、例えば、脂肪族エポキシ樹脂、脂環式エポキシ樹脂、および、芳香族エポキシ樹脂が挙げられる。 <Epoxy resin>
Examples of epoxy resins include aliphatic epoxy resins, alicyclic epoxy resins, and aromatic epoxy resins.
エポキシ樹脂としては、例えば、脂肪族エポキシ樹脂、脂環式エポキシ樹脂、および、芳香族エポキシ樹脂が挙げられる。 <Epoxy resin>
Examples of epoxy resins include aliphatic epoxy resins, alicyclic epoxy resins, and aromatic epoxy resins.
［脂肪族エポキシ樹脂］
脂肪族エポキシ樹脂は、エポキシ基を有し、脂肪族環（脂環骨格）および芳香族環を有しない硬化性樹脂である。 [Aliphatic epoxy resin]
An aliphatic epoxy resin is a curable resin that has an epoxy group and no aliphatic ring (alicyclic skeleton) or aromatic ring.
脂肪族エポキシ樹脂は、エポキシ基を有し、脂肪族環（脂環骨格）および芳香族環を有しない硬化性樹脂である。 [Aliphatic epoxy resin]
An aliphatic epoxy resin is a curable resin that has an epoxy group and no aliphatic ring (alicyclic skeleton) or aromatic ring.
脂肪族エポキシ樹脂として、例えば、エチレングリコールジグリシジルエーテル、ジエチレングリコールジグリシジルエーテル、プロピレングリコールジグリシジルエーテル、トリプロピレングリコールジグリシジルエーテル、ネオペンチルグリコールジグリシジルエーテル、１，４－ブタンジオールジグリシジルエーテル、および、１，６－ヘキサンジオールジグリシジルエーテルが挙げられる。
Examples of aliphatic epoxy resins include ethylene glycol diglycidyl ether, diethylene glycol diglycidyl ether, propylene glycol diglycidyl ether, tripropylene glycol diglycidyl ether, neopentyl glycol diglycidyl ether, 1,4-butanediol diglycidyl ether, and , 1,6-hexanediol diglycidyl ether.
［脂環式エポキシ樹脂］
脂環式エポキシ樹脂は、エポキシ基と脂肪族環（脂環骨格）とを有し、芳香族環を有しない硬化性樹脂である。 [Alicyclic epoxy resin]
Alicyclic epoxy resin is a curable resin that has an epoxy group and an aliphatic ring (alicyclic skeleton) and does not have an aromatic ring.
脂環式エポキシ樹脂は、エポキシ基と脂肪族環（脂環骨格）とを有し、芳香族環を有しない硬化性樹脂である。 [Alicyclic epoxy resin]
Alicyclic epoxy resin is a curable resin that has an epoxy group and an aliphatic ring (alicyclic skeleton) and does not have an aromatic ring.
脂環式エポキシ樹脂として、例えば、グリシジル基含有脂環式エポキシ樹脂、グリシジルエーテル基含有脂環式エポキシ樹脂、および、エポキシシクロ構造含有エポキシ樹脂が挙げられる。
Examples of alicyclic epoxy resins include glycidyl group-containing alicyclic epoxy resins, glycidyl ether group-containing alicyclic epoxy resins, and epoxycyclo structure-containing epoxy resins.
（グリシジル基含有脂環式エポキシ樹脂）
グリシジル基含有脂環式エポキシ樹脂は、例えば、脂肪族環に結合するグリシジル基を有する。このようなグリシジル基含有脂環式エポキシ樹脂は、例えば、下記一般式（１）で示される。 (Glycidyl group-containing alicyclic epoxy resin)
A glycidyl group-containing alicyclic epoxy resin has, for example, a glycidyl group bonded to an aliphatic ring. Such a glycidyl group-containing alicyclic epoxy resin is represented by the following general formula (1), for example.
グリシジル基含有脂環式エポキシ樹脂は、例えば、脂肪族環に結合するグリシジル基を有する。このようなグリシジル基含有脂環式エポキシ樹脂は、例えば、下記一般式（１）で示される。 (Glycidyl group-containing alicyclic epoxy resin)
A glycidyl group-containing alicyclic epoxy resin has, for example, a glycidyl group bonded to an aliphatic ring. Such a glycidyl group-containing alicyclic epoxy resin is represented by the following general formula (1), for example.
上記式（１）において、Ｒ１は、一価の有機基を示し、ｎは重合度を示す。また、シクロヘキサン環を構成する炭素原子には、アルキル基などの置換基が結合していてもよい。
In the above formula (1), R1 represents a monovalent organic group, and n represents the degree of polymerization. Further, a substituent such as an alkyl group may be bonded to the carbon atom constituting the cyclohexane ring.
上記一般式（１）で示されるグリシジル基含有脂環式エポキシ樹脂として、具体的には、２，２－ビス（ヒドロキシメチル）－１－ブタノールの１，２－エポキシ－４－（２－オキシラニル）シクロヘキサン付加物が挙げられる。
Specifically, the glycidyl group-containing alicyclic epoxy resin represented by the above general formula (1) includes 1,2-epoxy-4-(2-oxiranyl) of 2,2-bis(hydroxymethyl)-1-butanol. ) cyclohexane adducts.
上記一般式（１）で示されるグリシジル基含有脂環式エポキシ樹脂は、市販品を用いることもできる。上記一般式（１）で示されるグリシジル基含有脂環式エポキシ樹脂の市販品として、例えば、ＥＨＰＥ３１５０（エポキシ当量１７０～１９０ｇ／ｅｑ．、ダイセル社製）が挙げられる。
A commercially available product can also be used as the glycidyl group-containing alicyclic epoxy resin represented by the above general formula (1). As a commercially available glycidyl group-containing alicyclic epoxy resin represented by the above general formula (1), for example, EHPE3150 (epoxy equivalent: 170 to 190 g/eq., manufactured by Daicel Corporation) can be mentioned.
（グリシジルエーテル基含有脂環式エポキシ樹脂）
グリシジルエーテル基含有脂環式エポキシ樹脂は、脂肪族環に結合するグリシジルエーテルユニットを有する。好ましくは、グリシジルエーテル基含有脂環式エポキシ樹脂は、脂肪族環に結合する複数のグリシジルエーテルユニットを有するポリグリシジルエーテル含有脂環式エポキシ樹脂である。 (Glycidyl ether group-containing alicyclic epoxy resin)
A glycidyl ether group-containing alicyclic epoxy resin has a glycidyl ether unit bonded to an aliphatic ring. Preferably, the glycidyl ether group-containing cycloaliphatic epoxy resin is a polyglycidyl ether-containing cycloaliphatic epoxy resin having a plurality of glycidyl ether units bonded to an aliphatic ring.
グリシジルエーテル基含有脂環式エポキシ樹脂は、脂肪族環に結合するグリシジルエーテルユニットを有する。好ましくは、グリシジルエーテル基含有脂環式エポキシ樹脂は、脂肪族環に結合する複数のグリシジルエーテルユニットを有するポリグリシジルエーテル含有脂環式エポキシ樹脂である。 (Glycidyl ether group-containing alicyclic epoxy resin)
A glycidyl ether group-containing alicyclic epoxy resin has a glycidyl ether unit bonded to an aliphatic ring. Preferably, the glycidyl ether group-containing cycloaliphatic epoxy resin is a polyglycidyl ether-containing cycloaliphatic epoxy resin having a plurality of glycidyl ether units bonded to an aliphatic ring.
グリシジルエーテル含有脂環式エポキシ樹脂として、例えば、二官能型グリシジルエーテル含有脂環式エポキシ樹脂が挙げられる。二官能型グリシジルエーテル含有脂環式エポキシ樹脂としては、例えば、水添ビスフェノールＡジグリシジルエーテル、水添ビスフェノールＦジグリシジルエーテル、および、ヘキサヒドロフタル酸ジグリシジルエステルが挙げられる。
Examples of the glycidyl ether-containing alicyclic epoxy resin include bifunctional glycidyl ether-containing alicyclic epoxy resins. Examples of the bifunctional glycidyl ether-containing alicyclic epoxy resin include hydrogenated bisphenol A diglycidyl ether, hydrogenated bisphenol F diglycidyl ether, and hexahydrophthalic acid diglycidyl ester.
（エポキシシクロ構造含有エポキシ樹脂）
エポキシシクロ構造含有エポキシ樹脂は、脂肪族環を形成している隣接する２つの炭素原子と、それら２つの炭素原子に結合する１つの酸素原子とから構成されるエポキシ基を有するエポキシシクロ構造を有する。 (Epoxy resin containing epoxy cyclo structure)
An epoxy cyclo structure-containing epoxy resin has an epoxy cyclo structure that has an epoxy group composed of two adjacent carbon atoms forming an aliphatic ring and one oxygen atom bonded to those two carbon atoms. .
エポキシシクロ構造含有エポキシ樹脂は、脂肪族環を形成している隣接する２つの炭素原子と、それら２つの炭素原子に結合する１つの酸素原子とから構成されるエポキシ基を有するエポキシシクロ構造を有する。 (Epoxy resin containing epoxy cyclo structure)
An epoxy cyclo structure-containing epoxy resin has an epoxy cyclo structure that has an epoxy group composed of two adjacent carbon atoms forming an aliphatic ring and one oxygen atom bonded to those two carbon atoms. .
エポキシシクロ構造含有エポキシ樹脂として、例えば、エポキシシクロヘキサン構造含有エポキシ樹脂（以下、ＥＣＨ構造含有エポキシ樹脂とする。）が挙げられる。
Examples of epoxy cyclo structure-containing epoxy resins include epoxy cyclohexane structure-containing epoxy resins (hereinafter referred to as ECH structure-containing epoxy resins).
ＥＣＨ構造含有エポキシ樹脂として、例えば、下記化学式（２）に示される１つのＥＣＨ構造を含有するエポキシ樹脂、下記化学式（３）に示される１つのＥＣＨ構造を含有するエポキシ樹脂、下記一般式（４）に示される２つのＥＣＨ構造を含有するエポキシ樹脂、および、それらの変性物が挙げられる。
ECH structure-containing epoxy resins include, for example, epoxy resins containing one ECH structure shown in the following chemical formula (2), epoxy resins containing one ECH structure shown in the following chemical formula (3), and the following general formula (4). ) and modified products thereof.
上記式（４）中において、Ｘは、連結基（１以上の原子を有する２価の基）を示す。Ｒ２は、水素原子、フッ素原子、アルキル基、フルオロアルキル基、アリール基、フリル基およびチエニル基からなる群から選択される１つの原子または置換基を示す。式（４）中における２つのＲ２は、互いに同一であってもよく互いに異なっていてもよい。
In the above formula (4), X represents a linking group (a divalent group having one or more atoms). R2 represents one atom or substituent selected from the group consisting of a hydrogen atom, a fluorine atom, an alkyl group, a fluoroalkyl group, an aryl group, a furyl group, and a thienyl group. The two R2's in formula (4) may be the same or different.
上記一般式（４）に示される２つのＥＣＨ構造を含有するエポキシ樹脂（以下、一般式（４）に示されるＥＣＨ構造含有エポキシ樹脂とする。）は、ＥＣＨ構造（エポキシシクロヘキシル基）を分子の両末端に有し、２つのエポキシシクロヘキシル基が連結基を介して結合する。なお、エポキシシクロヘキシル基は、シクロヘキサン環と、シクロヘキサン環を形成している隣接する２つの炭素原子と、それら２つの炭素原子に結合する１つの酸素原子とにより構成されるエポキシ基とを含む官能基である。
The epoxy resin containing the two ECH structures shown in the above general formula (4) (hereinafter referred to as the ECH structure-containing epoxy resin shown in the general formula (4)) has an ECH structure (epoxycyclohexyl group) in the molecule. It has two epoxycyclohexyl groups at both ends and is bonded via a linking group. Note that the epoxycyclohexyl group is a functional group that includes a cyclohexane ring, an epoxy group composed of two adjacent carbon atoms forming the cyclohexane ring, and one oxygen atom bonded to these two carbon atoms. It is.
上記一般式（４）においてＲ２で示されるアルキル基として、例えば、炭素数１～６の直鎖または分岐鎖状のアルキル基（例えば、メチル基、エチル基、プロピル基、ブチル基、ペンチル基、ヘキシル基など）などが挙げられる。
Examples of the alkyl group represented by R2 in the above general formula (4) include linear or branched alkyl groups having 1 to 6 carbon atoms (for example, methyl group, ethyl group, propyl group, butyl group, pentyl group, hexyl group, etc.).
上記一般式（４）においてＲ２で示されるフルオロアルキル基として、例えば、炭素数１～６の直鎖または分岐鎖状のフルオロアルキル基（例えば、パーフルオロメチル基、パーフルオロエチル基、パーフルオロプロピル基など）などが挙げられる。
Examples of the fluoroalkyl group represented by R2 in the above general formula (4) include linear or branched fluoroalkyl groups having 1 to 6 carbon atoms (e.g., perfluoromethyl group, perfluoroethyl group, perfluoropropyl group). etc.).
上記一般式（４）においてＲ２で示されるアリール基として、例えば、炭素数６～１８のアリール基（例えば、フェニル基、ナフチル基など）などが挙げられる。
Examples of the aryl group represented by R2 in the above general formula (4) include aryl groups having 6 to 18 carbon atoms (eg, phenyl group, naphthyl group, etc.).
上記一般式（４）においてＸで示される連結基として、例えば、酸素原子、硫黄原子、２価の炭化水素基、ポリオキシアルキレン基、カルボニル基、エーテル基、チオエーテル基、エステル基、カーボネート基、アミド基、および、これらが連結した基などが挙げられる。
Examples of the linking group represented by X in the above general formula (4) include oxygen atom, sulfur atom, divalent hydrocarbon group, polyoxyalkylene group, carbonyl group, ether group, thioether group, ester group, carbonate group, Examples include an amide group and a group in which these are linked.
２価の炭化水素基として、例えば、炭素数１～２０の直鎖または分岐鎖状のアルキレン基（例えば、メチレン基、メチルメチレン基、ジメチルメチレン基、エチレン基、プロピレン基、トリメチレン基、ブチレン基など）、炭素数１～２０の直鎖または分岐鎖状の不飽和炭化水素基（例えば、プロペニレン基、メチルプロペニレン基、ブテニレン基など）などが挙げられる。
Examples of divalent hydrocarbon groups include linear or branched alkylene groups having 1 to 20 carbon atoms (e.g., methylene group, methylmethylene group, dimethylmethylene group, ethylene group, propylene group, trimethylene group, butylene group). ), linear or branched unsaturated hydrocarbon groups having 1 to 20 carbon atoms (eg, propenylene group, methylpropenylene group, butenylene group, etc.).
ポリオキシアルキレン基として、例えば、炭素数１～１２０の直鎖または分岐鎖状のポリオキシアルキレン基（例えば、ポリオキシエチレン基、ポリオキシプロピレン基など）などが挙げられる。
Examples of the polyoxyalkylene group include linear or branched polyoxyalkylene groups having 1 to 120 carbon atoms (eg, polyoxyethylene group, polyoxypropylene group, etc.).
一般式（４）に示されるＥＣＨ構造含有エポキシ樹脂として、具体的には、ビス（３，４－エポキシシクロヘキシルメチル）エーテル、１，２－ビス（３，４－エポキシシクロヘキサン－１－イル）エタン、２，２－ビス（３，４－エポキシシクロヘキサン－１－イル）プロパン、３，４－エポキシシクロヘキシルメチル（３，４－エポキシ）シクロヘキサンカルボキシレート、および、ε－カプロラクトン変性３’，４’－エポキシシクロヘキシルメチル３，４－エポキシシクロヘキサンカルボキリレートが挙げられ、好ましくは、３，４－エポキシシクロヘキシルメチル（３，４－エポキシ）シクロヘキサンカルボキシレートが挙げられる。
Specifically, the ECH structure-containing epoxy resin represented by general formula (4) includes bis(3,4-epoxycyclohexylmethyl)ether, 1,2-bis(3,4-epoxycyclohexan-1-yl)ethane, , 2,2-bis(3,4-epoxycyclohexan-1-yl)propane, 3,4-epoxycyclohexylmethyl(3,4-epoxy)cyclohexanecarboxylate, and ε-caprolactone modified 3',4'- Examples include epoxycyclohexylmethyl 3,4-epoxycyclohexanecarboxylate, and preferably 3,4-epoxycyclohexylmethyl (3,4-epoxy)cyclohexanecarboxylate.
また、上記一般式（４）に示されるＥＣＨ構造含有エポキシ樹脂は、市販品を用いることもできる。上記一般式（４）に示されるＥＣＨ構造含有エポキシ樹脂の市販品として、例えば、セロキサイド８０１０、セロキサイド２０２１Ｐ（エポキシ当量１２８～１４５ｇ／ｅｑ．）、および、セロキサイド２０８１（以上ダイセル社製）が挙げられる。
Moreover, a commercially available product can also be used as the ECH structure-containing epoxy resin represented by the above general formula (4). Examples of commercially available epoxy resins containing the ECH structure represented by the above general formula (4) include Celloxide 8010, Celloxide 2021P (epoxy equivalent: 128 to 145 g/eq.), and Celloxide 2081 (manufactured by Daicel Corporation). .
脂環式エポキシ樹脂として、好ましくは、エポキシシクロ構造含有エポキシ樹脂が挙げられる。脂環式エポキシ樹脂として、より好ましくは、上記一般式（４）に示されるＥＣＨ構造含有エポキシ樹脂が挙げられる。
Preferably, the alicyclic epoxy resin includes an epoxy cyclo structure-containing epoxy resin. More preferred examples of the alicyclic epoxy resin include ECH structure-containing epoxy resins represented by the above general formula (4).
脂環式エポキシ樹脂の重量平均分子量は、例えば、２００以上、例えば、１０００以下、好ましくは、５００以下である。重量平均分子量（Ｍｗ）は、ポリスチレンを標準物質とするゲルパーミエーションクロマトグラフィー（ＧＰＣ)により求めることができる（以下同様。）。
The weight average molecular weight of the alicyclic epoxy resin is, for example, 200 or more, for example, 1000 or less, and preferably 500 or less. The weight average molecular weight (Mw) can be determined by gel permeation chromatography (GPC) using polystyrene as a standard substance (the same applies hereinafter).
また、脂環式エポキシ樹脂におけるエポキシ当量は、例えば、９０ｇ／ｅｑ．以上、好ましくは、１００ｇ／ｅｑ．以上、例えば、２５０ｇ／ｅｑ．以下、好ましくは、１９０ｇ／ｅｑ．以下である。エポキシ当量は、ＪＩＳ Ｋ７２３６：２００１に準拠して測定できる（以下同様。）。
Furthermore, the epoxy equivalent in the alicyclic epoxy resin is, for example, 90 g/eq. Above, preferably 100g/eq. Above, for example, 250g/eq. Below, preferably 190g/eq. It is as follows. The epoxy equivalent can be measured in accordance with JIS K7236:2001 (the same applies hereinafter).
［芳香族エポキシ樹脂］
芳香族エポキシ樹脂は、エポキシ基と芳香族環とを有し、脂肪族環（脂環骨格）を有しない硬化性樹脂である。 [Aromatic epoxy resin]
Aromatic epoxy resin is a curable resin that has an epoxy group and an aromatic ring, but does not have an aliphatic ring (alicyclic skeleton).
芳香族エポキシ樹脂は、エポキシ基と芳香族環とを有し、脂肪族環（脂環骨格）を有しない硬化性樹脂である。 [Aromatic epoxy resin]
Aromatic epoxy resin is a curable resin that has an epoxy group and an aromatic ring, but does not have an aliphatic ring (alicyclic skeleton).
芳香族エポキシ樹脂として、例えば、ビスフェノール型エポキシ樹脂、ジフェニルエーテル型エポキシ樹脂、ノボラック型エポキシ樹脂（例えば、例えば、フェノールノボラック型、クレゾールノボラック型、ビフェニルノボラック型、ビスフェノールノボラック型、ナフトールノボラック型、トリスフェノールノボラック型、および、ジシクロペンタジエンノボラック型）、ビフェニル型エポキシ樹脂、ナフタレン型エポキシ樹脂が挙げられる。芳香族エポキシ樹脂として、好ましくは、ビスフェノール型エポキシ樹脂およびビフェニル型エポキシ樹脂が挙げられる。
Examples of aromatic epoxy resins include bisphenol type epoxy resins, diphenyl ether type epoxy resins, novolac type epoxy resins (e.g., phenol novolak type, cresol novolak type, biphenyl novolac type, bisphenol novolac type, naphthol novolak type, trisphenol novolak type) type, dicyclopentadiene novolac type), biphenyl type epoxy resin, and naphthalene type epoxy resin. Preferable aromatic epoxy resins include bisphenol-type epoxy resins and biphenyl-type epoxy resins.
ビスフェノール型エポキシ樹脂として、例えば、ビスフェノールＡ型エポキシ樹脂、ビスフェノールＦ型エポキシ樹脂、ビスフェノールＥ型エポキシ樹脂、ビスフェノールＳ型エポキシ樹脂、および、ビスフェノールＡＤ型エポキシ樹脂が挙げられる。ビスフェノール型エポキシ樹脂として、好ましくは、ビスフェノールＦ型エポキシ樹脂が挙げられる。
Examples of bisphenol epoxy resins include bisphenol A epoxy resin, bisphenol F epoxy resin, bisphenol E epoxy resin, bisphenol S epoxy resin, and bisphenol AD epoxy resin. Preferably, the bisphenol epoxy resin includes a bisphenol F epoxy resin.
また、芳香族エポキシ樹脂は、常温固形であってもよく、常温液状であってもよい。芳香族エポキシ樹脂は、好ましくは、常温固形である。なお、「常温固形」とは、常温（２３℃）において、流動性を有さない固体状態であることを示し、「常温液状」とは、常温（２３℃）において、流動性を有する液体状態であることを示す。
Further, the aromatic epoxy resin may be solid at room temperature or liquid at room temperature. The aromatic epoxy resin is preferably solid at room temperature. Note that "solid at room temperature" refers to a solid state that does not have fluidity at room temperature (23°C), and "liquid at room temperature" refers to a liquid state that has fluidity at room temperature (23°C). .
芳香族エポキシ樹脂の重量平均分子量（Ｍｗ）は、例えば、１０００以上、好ましくは、３０００以上、また、例えば、１００００以下、好ましくは、８０００以下である。
The weight average molecular weight (Mw) of the aromatic epoxy resin is, for example, 1,000 or more, preferably 3,000 or more, and, for example, 10,000 or less, preferably 8,000 or less.
また、芳香族エポキシ樹脂におけるエポキシ当量は、例えば、１０００ｇ／ｅｑ．以上、好ましくは、５０００ｇ／ｅｑ．以上、より好ましくは、８０００ｇ／ｅｑ．以上、また、例えば、１２０００ｇ／ｅｑ．以下である。
Furthermore, the epoxy equivalent in the aromatic epoxy resin is, for example, 1000 g/eq. Above, preferably 5000g/eq. Above, more preferably 8000g/eq. Above, for example, 12000g/eq. It is as follows.
エポキシ樹脂として、低透湿性の向上の観点から、好ましくは、脂環式エポキシ樹脂および芳香族エポキシ樹脂が挙げられる。
From the viewpoint of improving low moisture permeability, preferable examples of the epoxy resin include alicyclic epoxy resins and aromatic epoxy resins.
エポキシ樹脂は、単独使用または２種類以上併用することができる。好ましくは、エポキシ樹脂として、脂環式エポキシ樹脂および芳香族エポキシ樹脂を併用する。
Epoxy resins can be used alone or in combination of two or more. Preferably, an alicyclic epoxy resin and an aromatic epoxy resin are used together as the epoxy resin.
脂環式エポキシ樹脂および芳香族エポキシ樹脂を併用する場合には、脂環式エポキシ樹脂の配合割合は、脂環式エポキシ樹脂および芳香族エポキシ樹脂の総量１００質量部に対して、低透湿性の向上の観点から、例えば、２０質量部以上、好ましくは、３０質量部以上、より好ましくは、３５質量部以上、また、低透湿性の向上の観点から、例えば、６０質量部以下、好ましくは、４８質量部以下である。また、芳香族エポキシ樹脂の配合割合は、脂環式エポキシ樹脂および芳香族エポキシ樹脂の総量１００質量部に対して、低透湿性の向上の観点から、例えば、４０質量部以上、好ましくは、５２質量部以上、また、低透湿性の向上の観点から、例えば、８０質量部以下、好ましくは、７０質量部以下、より好ましくは、６５質量部以下である。
When an alicyclic epoxy resin and an aromatic epoxy resin are used together, the blending ratio of the alicyclic epoxy resin should be one with low moisture permeability based on 100 parts by mass of the total amount of the alicyclic epoxy resin and the aromatic epoxy resin. From the viewpoint of improving low moisture permeability, for example, 20 parts by mass or more, preferably 30 parts by mass or more, more preferably 35 parts by mass or more, and from the viewpoint of improving low moisture permeability, for example, 60 parts by mass or less, preferably, It is 48 parts by mass or less. In addition, the blending ratio of the aromatic epoxy resin is, for example, 40 parts by mass or more, preferably 52 parts by mass, from the viewpoint of improving low moisture permeability, with respect to 100 parts by mass of the total amount of the alicyclic epoxy resin and the aromatic epoxy resin. From the viewpoint of improving low moisture permeability, the amount is, for example, 80 parts by mass or less, preferably 70 parts by mass or less, and more preferably 65 parts by mass or less.
エポキシ樹脂の配合割合は、エポキシ樹脂とスチレン系粘度調整剤とポリイソブチレンと相溶化剤との総量１００質量部に対して、低透湿性の向上の観点から、例えば、３０質量部以上、好ましくは、４０質量部以上、また、低透湿性の向上の観点から、例えば、７０質量部以下、好ましくは、６３質量部以下、より好ましくは、５８質量部以下である。
The blending ratio of the epoxy resin is, for example, 30 parts by mass or more, preferably 30 parts by mass or more, based on the total amount of the epoxy resin, styrene viscosity modifier, polyisobutylene, and compatibilizer, from the viewpoint of improving low moisture permeability. , 40 parts by mass or more, and, from the viewpoint of improving low moisture permeability, for example, 70 parts by mass or less, preferably 63 parts by mass or less, more preferably 58 parts by mass or less.
＜スチレン系粘度調整剤＞
スチレン系粘度調整剤は、エポキシ樹脂組成物に粘着力を付与する成分である。 <Styrenic viscosity modifier>
The styrenic viscosity modifier is a component that imparts adhesive strength to the epoxy resin composition.
スチレン系粘度調整剤は、エポキシ樹脂組成物に粘着力を付与する成分である。 <Styrenic viscosity modifier>
The styrenic viscosity modifier is a component that imparts adhesive strength to the epoxy resin composition.
スチレン系粘度調整剤として、例えば、スチレン重合体、α－メチルスチレン重合体、および、スチレン－α－スチレン共重合体が挙げられる。
Examples of styrenic viscosity modifiers include styrene polymers, α-methylstyrene polymers, and styrene-α-styrene copolymers.
スチレン系粘度調整剤は、市販品を用いることもできる。スチレン系粘度調整剤の市販品として、例えば、ＦＴＲシリーズ（例えば、ＦＴＲ－８１２０、ＦＴＲ－８１００、以上三井化学社製）が挙げられる。
A commercially available styrene-based viscosity modifier can also be used. Commercially available styrene-based viscosity modifiers include, for example, the FTR series (eg, FTR-8120, FTR-8100, manufactured by Mitsui Chemicals, Inc.).
スチレン系粘度調整剤の重量平均分子量（Ｍｗ）は、低透湿性の向上の観点から、例えば、１０００以上、好ましくは、１２００以上、より好ましくは、１３００以上、また、低透湿性の向上の観点から、例えば、２０００以下、好ましくは、１５００以下である。
The weight average molecular weight (Mw) of the styrene-based viscosity modifier is, for example, 1000 or more, preferably 1200 or more, more preferably 1300 or more, from the viewpoint of improving low moisture permeability. , for example, 2000 or less, preferably 1500 or less.
スチレン系粘度調整剤は、単独使用または２種類以上併用することができる。
The styrenic viscosity modifiers can be used alone or in combination of two or more.
スチレン系粘度調整剤の配合割合は、エポキシ樹脂１００質量部に対して、低透湿性の向上の観点から、例えば、５質量部以上、好ましくは、１０質量部以上、また、低透湿性の向上の観点から、例えば、２０質量部以下、好ましくは、１５質量部以下である。
The blending ratio of the styrene-based viscosity modifier is, for example, 5 parts by mass or more, preferably 10 parts by mass or more, from the viewpoint of improving low moisture permeability, with respect to 100 parts by mass of the epoxy resin. From this point of view, the amount is, for example, 20 parts by mass or less, preferably 15 parts by mass or less.
また、スチレン系粘度調整剤の配合割合は、エポキシ樹脂とスチレン系粘度調整剤とポリイソブチレンと相溶化剤との総量１００質量部に対して、低透湿性の向上の観点から、例えば、１．０質量部以上、好ましくは、５．０質量部、また、低透湿性の向上の観点から、例えば、１０質量部以下、好ましくは、７．８質量部以下である。
In addition, the blending ratio of the styrene-based viscosity modifier is, for example, 1.0% with respect to 100 parts by mass of the total amount of the epoxy resin, styrene-based viscosity modifier, polyisobutylene, and compatibilizer from the viewpoint of improving low moisture permeability. The content is 0 parts by mass or more, preferably 5.0 parts by mass, and, from the viewpoint of improving low moisture permeability, for example, 10 parts by mass or less, preferably 7.8 parts by mass or less.
＜ポリイソブチレン＞
ポリイソブチレンは、エポキシ樹脂組成物に低透湿性を付与する成分である。 <Polyisobutylene>
Polyisobutylene is a component that imparts low moisture permeability to the epoxy resin composition.
ポリイソブチレンは、エポキシ樹脂組成物に低透湿性を付与する成分である。 <Polyisobutylene>
Polyisobutylene is a component that imparts low moisture permeability to the epoxy resin composition.
ポリイソブチレンの重量平均分子量は、低透湿性の向上の観点から、例えば、１００００以上、好ましくは、３００００以上、より好ましくは、４５０００以上、また、例えば、低透湿性の向上の観点から、１０００００以下、好ましくは、７００００以下、より好ましくは、５００００以下である。
The weight average molecular weight of polyisobutylene is, for example, 10,000 or more, preferably 30,000 or more, more preferably 45,000 or more, from the viewpoint of improving low moisture permeability, and, for example, 100,000 or less from the viewpoint of improving low moisture permeability. , preferably 70,000 or less, more preferably 50,000 or less.
ポリイソブチレンの配合割合は、エポキシ樹脂１００質量部に対して、低透湿性の向上の観点から、例えば、１５質量部以上、好ましくは、２５質量部以上、より好ましくは、３５質量部以上、また、低透湿性の向上の観点から、例えば、５０質量部以下である。
From the viewpoint of improving low moisture permeability, the blending ratio of polyisobutylene is, for example, 15 parts by mass or more, preferably 25 parts by mass or more, more preferably 35 parts by mass or more, based on 100 parts by mass of the epoxy resin. , from the viewpoint of improving low moisture permeability, for example, 50 parts by mass or less.
また、ポリイソブチレンの配合割合は、スチレン系粘度調整剤１００質量部に対して、低透湿性の向上の観点から、例えば、１００質量部以上、好ましくは、１２０質量部以上、より好ましくは、２００質量部以上、さらに好ましくは、２５０質量部以上、また、低透湿性の向上の観点から、例えば、６００質量部以下、好ましくは、４５０質量部以下、より好ましくは、３５０質量部以下である。
In addition, the blending ratio of polyisobutylene is, for example, 100 parts by mass or more, preferably 120 parts by mass or more, more preferably 200 parts by mass or more, from the viewpoint of improving low moisture permeability, with respect to 100 parts by mass of the styrene-based viscosity modifier. The content is at least 250 parts by mass, more preferably at least 250 parts by mass, and from the viewpoint of improving low moisture permeability, for example, at most 600 parts by mass, preferably at most 450 parts by mass, more preferably at most 350 parts by mass.
また、ポリイソブチレンの配合割合は、エポキシ樹脂とスチレン系粘度調整剤とポリイソブチレンと相溶化剤との総量１００質量部に対して、低透湿性の向上の観点から、例えば、１０質量部以上、好ましくは、１５質量部以上、また、低透湿性の向上の観点から、例えば、４０質量部以下、好ましくは、３０質量部以下、より好ましくは、２５質量部以下である。
In addition, from the viewpoint of improving low moisture permeability, the blending ratio of polyisobutylene is, for example, 10 parts by mass or more with respect to 100 parts by mass of the total amount of the epoxy resin, styrene-based viscosity modifier, polyisobutylene, and compatibilizer. Preferably, the amount is 15 parts by mass or more, and from the viewpoint of improving low moisture permeability, it is, for example, 40 parts by mass or less, preferably 30 parts by mass or less, and more preferably 25 parts by mass or less.
＜相溶化剤＞
相溶化剤は、相溶性（具体的には、スチレン系粘度調整剤（エポキシ樹脂）とポリイソブチレンとの相溶性）を向上させるための成分である。 <Compatibilizer>
The compatibilizer is a component for improving compatibility (specifically, compatibility between the styrene viscosity modifier (epoxy resin) and polyisobutylene).
相溶化剤は、相溶性（具体的には、スチレン系粘度調整剤（エポキシ樹脂）とポリイソブチレンとの相溶性）を向上させるための成分である。 <Compatibilizer>
The compatibilizer is a component for improving compatibility (specifically, compatibility between the styrene viscosity modifier (epoxy resin) and polyisobutylene).
相溶化剤は、スチレン由来の構造とオレフィン由来の構造とを含むジブロック構造を有する。相溶化剤が、スチレン由来の構造とオレフィン由来の構造とを含むジブロック構造であれば、スチレン系粘度調整剤（エポキシ樹脂）とポリイソブチレンとの相溶性を向上させることができる。
The compatibilizer has a diblock structure including a styrene-derived structure and an olefin-derived structure. If the compatibilizer has a diblock structure containing a styrene-derived structure and an olefin-derived structure, the compatibility between the styrene-based viscosity modifier (epoxy resin) and polyisobutylene can be improved.
このような相溶化剤として、下記式（５）で示される水添スチレン－イソプレンジブロック共重合体が挙げられる。
上記式（５）において、ｌおよびｍは、重合度を示す。 An example of such a compatibilizer is a hydrogenated styrene-isoprene diblock copolymer represented by the following formula (5).
In the above formula (5), l and m indicate the degree of polymerization.
上記式（５）において、ｌおよびｍは、重合度を示す。 An example of such a compatibilizer is a hydrogenated styrene-isoprene diblock copolymer represented by the following formula (5).
In the above formula (5), l and m indicate the degree of polymerization.
相溶化剤において、スチレン由来の構造を有するユニットの割合は、スチレン由来の構造を有するユニットおよびオレフィン由来の構造を有するユニットの総量に対して、例えば、３０モル％以上、好ましくは、４０モル％以上、また、例えば、７０モル％以下、好ましくは、６０モル％以下である。また、オレフィン由来の構造を有するユニットの割合は、スチレン由来の構造を有するユニットおよびオレフィン由来の構造を有するユニットの総量に対して、例えば、３０モル％以上、好ましくは、４０モル％以上、また、例えば、７０モル％以下、好ましくは、６０モル％以下である。
In the compatibilizer, the proportion of units having a styrene-derived structure is, for example, 30 mol% or more, preferably 40 mol%, based on the total amount of units having a styrene-derived structure and units having an olefin-derived structure. For example, it is 70 mol% or less, preferably 60 mol% or less. Further, the proportion of units having an olefin-derived structure is, for example, 30 mol% or more, preferably 40 mol% or more, with respect to the total amount of units having a styrene-derived structure and olefin-derived structures, and , for example, 70 mol% or less, preferably 60 mol% or less.
より好ましくは、相溶化剤において、スチレン由来の構造を有するユニットの割合とオレフィン由来の構造を有するユニットの割合とは同じである。つまり、スチレン由来の構造を有するユニットおよびオレフィン由来の構造を有するユニットの総量に対して、スチレン由来の構造を有するユニットの割合が、５０モル％であり、また、オレフィン由来の構造を有するユニットの割合が、５０モル％である。なお、相溶化剤のスチレン由来の構造を有するユニットの割合はスチレン系粘度調整材の分子鎖に対して、０．５以上１０以下であることが好ましい。
More preferably, in the compatibilizer, the proportion of units having a styrene-derived structure and the proportion of units having an olefin-derived structure are the same. In other words, the proportion of units having a styrene-derived structure is 50 mol% with respect to the total amount of units having a styrene-derived structure and units having an olefin-derived structure. The proportion is 50 mol%. Note that the proportion of units having a structure derived from styrene in the compatibilizer is preferably 0.5 or more and 10 or less with respect to the molecular chain of the styrene-based viscosity modifier.
相溶化剤は、市販品を用いることもできる。相溶化剤の市販品として、例えば、セプトン１０２０（株式会社クラレ製）が挙げられる。
A commercially available product can also be used as the compatibilizer. Examples of commercially available compatibilizers include Septon 1020 (manufactured by Kuraray Co., Ltd.).
相溶化剤は、単独使用または２種類以上併用することができる。
The compatibilizers can be used alone or in combination of two or more.
相溶化剤の配合割合は、ポリイソブチレン１００質量部に対して、３０質量部以上、好ましくは、４０質量部以上、また、１２０質量部以下、好ましくは、９０質量部以下、より好ましくは、７０質量部以下である。
The compounding ratio of the compatibilizer is 30 parts by mass or more, preferably 40 parts by mass or more, and 120 parts by mass or less, preferably 90 parts by mass or less, more preferably 70 parts by mass or less, based on 100 parts by mass of polyisobutylene. Parts by mass or less.
ポリイソブチレン１００質量部に対する相溶化剤の配合割合が、上記下限以上であれば、相溶性（具体的には、スチレン系粘度調整剤（エポキシ樹脂）とポリイソブチレンとの相溶性）および低透湿性を向上できる。
If the blending ratio of the compatibilizer to 100 parts by mass of polyisobutylene is equal to or higher than the above lower limit, compatibility (specifically, compatibility between the styrene viscosity modifier (epoxy resin) and polyisobutylene) and low moisture permeability are achieved. can be improved.
一方、ポリイソブチレン１００質量部に対する相溶化剤の配合割合が、上記下限未満であれば、上記相溶性および低透湿性が低下する。
On the other hand, if the blending ratio of the compatibilizer to 100 parts by mass of polyisobutylene is less than the above-mentioned lower limit, the above-mentioned compatibility and low moisture permeability will decrease.
また、ポリイソブチレン１００質量部に対する相溶化剤の配合割合が、上記上限以下であれば、低透湿性を向上できる。
Furthermore, if the blending ratio of the compatibilizer to 100 parts by mass of polyisobutylene is below the above upper limit, low moisture permeability can be improved.
一方、ポリイソブチレン１００質量部に対する相溶化剤の配合割合が、上記上限を超過すると、低透湿性が低下する。
On the other hand, if the blending ratio of the compatibilizer to 100 parts by mass of polyisobutylene exceeds the above upper limit, the low moisture permeability will decrease.
また、相溶化剤の配合割合は、スチレン系粘度調整剤１００質量部に対して、８０質量部以上、好ましくは、１２０質量部以上、また、３５０質量部以下、好ましくは、２５０質量部以下、より好ましくは、２００質量部以下である。
Further, the blending ratio of the compatibilizer is 80 parts by mass or more, preferably 120 parts by mass or more, and 350 parts by mass or less, preferably 250 parts by mass or less, with respect to 100 parts by mass of the styrene-based viscosity modifier. More preferably, it is 200 parts by mass or less.
スチレン系粘度調整剤１００質量部に対する相溶化剤の配合割合が、上記下限以上であれば、低透湿性を向上できる。
If the blending ratio of the compatibilizer to 100 parts by mass of the styrene-based viscosity modifier is at least the above lower limit, low moisture permeability can be improved.
一方、スチレン系粘度調整剤１００質量部に対する相溶化剤の配合割合が、上記下限未満であれば、低透湿性が低下する。
On the other hand, if the blending ratio of the compatibilizer to 100 parts by mass of the styrene-based viscosity modifier is less than the above-mentioned lower limit, the low moisture permeability will decrease.
また、スチレン系粘度調整剤１００質量部に対する相溶化剤の配合割合が、上記上限以下であれば、相溶性（具体的には、スチレン系粘度調整剤（エポキシ樹脂）とポリイソブチレンとの相溶性）および低透湿性を向上できる。
In addition, if the blending ratio of the compatibilizer to 100 parts by mass of the styrene-based viscosity modifier is below the above upper limit, the compatibility (specifically, the compatibility between the styrene-based viscosity modifier (epoxy resin) and polyisobutylene) ) and can improve low moisture permeability.
一方、スチレン系粘度調整剤１００質量部に対する相溶化剤の配合割合が、上記上限を超過すると、上記相溶性および低透湿性が低下する。
On the other hand, if the blending ratio of the compatibilizer to 100 parts by mass of the styrene-based viscosity modifier exceeds the above upper limit, the above compatibility and low moisture permeability will decrease.
また、相溶化剤の配合割合は、エポキシ樹脂とスチレン系粘度調整剤とポリイソブチレンと相溶化剤との総量１００質量部に対して、例えば、５質量部以上、好ましくは、８質量部以上、また、例えば、２５質量部以下、好ましくは、２０質量部以下、より好ましくは、１５質量部以下、さらに好ましくは、１２質量部以下である。
Further, the blending ratio of the compatibilizer is, for example, 5 parts by mass or more, preferably 8 parts by mass or more, with respect to 100 parts by mass of the total amount of the epoxy resin, styrene-based viscosity modifier, polyisobutylene, and compatibilizer. Further, for example, the amount is 25 parts by mass or less, preferably 20 parts by mass or less, more preferably 15 parts by mass or less, and even more preferably 12 parts by mass or less.
＜添加剤＞
エポキシ樹脂組成物は、必要により、適宜の割合で、添加剤を含むことができる。 <Additives>
The epoxy resin composition can contain additives in appropriate proportions, if necessary.
エポキシ樹脂組成物は、必要により、適宜の割合で、添加剤を含むことができる。 <Additives>
The epoxy resin composition can contain additives in appropriate proportions, if necessary.
添加剤として、例えば、重合開始剤、その他の粘度調整剤、レベリング剤、シランカップリング剤、充填材、増感剤、酸化防止剤、老化防止剤、可塑剤、紫外線吸収剤、防腐剤、および、抗菌剤が挙げられる。
Additives include, for example, polymerization initiators, other viscosity modifiers, leveling agents, silane coupling agents, fillers, sensitizers, antioxidants, antiaging agents, plasticizers, ultraviolet absorbers, preservatives, and , antibacterial agents.
添加剤は、単独使用または２種類以上併用することができる。
The additives can be used alone or in combination of two or more.
［重合開始剤］
重合開始剤として、例えば、熱カチオン重合開始剤および光カチオン重合開始剤が挙げられる。重合開始剤として、好ましくは、熱カチオン重合開始剤が挙げられる。 [Polymerization initiator]
Examples of the polymerization initiator include thermal cationic polymerization initiators and photocationic polymerization initiators. Preferably, the polymerization initiator is a thermal cationic polymerization initiator.
重合開始剤として、例えば、熱カチオン重合開始剤および光カチオン重合開始剤が挙げられる。重合開始剤として、好ましくは、熱カチオン重合開始剤が挙げられる。 [Polymerization initiator]
Examples of the polymerization initiator include thermal cationic polymerization initiators and photocationic polymerization initiators. Preferably, the polymerization initiator is a thermal cationic polymerization initiator.
熱カチオン重合開始剤は、加熱により酸（カチオン）を発生する熱酸発生剤である。
A thermal cationic polymerization initiator is a thermal acid generator that generates an acid (cation) when heated.
熱カチオン重合開始剤として、公知の熱カチオン重合開始剤を用いることができる。熱カチオン重合開始剤として、例えば、ＡｓＦ６－、ＳｂＦ６－、ＰＦ６－、ＢＦ４－、Ｂ（Ｃ６Ｆ５）４
－、ＣＦ３ＳＯ３
－などを対アニオンとする、スルホニウム塩、ホスホニウム塩、４級アンモニウム塩、ジアゾニウム塩、ヨードニウム塩が挙げられる。
As the thermal cationic polymerization initiator, a known thermal cationic polymerization initiator can be used. Examples of thermal cationic polymerization initiators include sulfonium salts having counteranions such as AsF 6- , SbF 6- , PF 6- , BF 4- , B(C 6 F 5 ) 4 - , CF 3 SO 3 - , etc. Examples include phosphonium salts, quaternary ammonium salts, diazonium salts, and iodonium salts.
重合開始剤は、単独使用または２種類以上併用することができる。
The polymerization initiators can be used alone or in combination of two or more types.
重合開始剤の配合割合は、エポキシ樹脂１００質量部に対して、例えば、１質量部以上、好ましくは、２質量部以上、また、例えば、５質量部以下である。
The blending ratio of the polymerization initiator is, for example, 1 part by mass or more, preferably 2 parts by mass or more, and, for example, 5 parts by mass or less, based on 100 parts by mass of the epoxy resin.
また、重合開始剤の配合割合は、エポキシ樹脂とスチレン系粘度調整剤とポリイソブチレンと相溶化剤との総量１００質量部に対して、例えば、０．１質量部以上、好ましくは、０．５質量部以上、また、例えば、５．０質量部以下、好ましくは、２．０質量部以下である。
The blending ratio of the polymerization initiator is, for example, 0.1 part by mass or more, preferably 0.5 parts by mass, based on 100 parts by mass of the total amount of the epoxy resin, styrene viscosity modifier, polyisobutylene, and compatibilizer. The amount is not less than 5.0 parts by mass, preferably not more than 2.0 parts by mass.
［その他の粘度調整剤］
その他の粘度調整剤は、上記したスチレン系粘度調整剤以外の粘度調整剤である。具体的には、その他の粘度調整剤として、例えば、石油樹脂、テルペン樹脂、フェノール樹脂、およびロジン樹脂が挙げられる。その他の粘度調整剤として、好ましくは、石油樹脂が挙げられる。 [Other viscosity modifiers]
Other viscosity modifiers are viscosity modifiers other than the above-mentioned styrene-based viscosity modifiers. Specifically, other viscosity modifiers include, for example, petroleum resins, terpene resins, phenol resins, and rosin resins. Other viscosity modifiers preferably include petroleum resins.
その他の粘度調整剤は、上記したスチレン系粘度調整剤以外の粘度調整剤である。具体的には、その他の粘度調整剤として、例えば、石油樹脂、テルペン樹脂、フェノール樹脂、およびロジン樹脂が挙げられる。その他の粘度調整剤として、好ましくは、石油樹脂が挙げられる。 [Other viscosity modifiers]
Other viscosity modifiers are viscosity modifiers other than the above-mentioned styrene-based viscosity modifiers. Specifically, other viscosity modifiers include, for example, petroleum resins, terpene resins, phenol resins, and rosin resins. Other viscosity modifiers preferably include petroleum resins.
その他の粘度調整剤は、市販品を用いることもできる。その他の粘度調整剤の市販品として、例えば、ＱＴＮ－１５００（石油樹脂、日本ゼオン社製）が挙げられる。
Commercially available products can also be used as other viscosity modifiers. Other commercially available viscosity modifiers include, for example, QTN-1500 (petroleum resin, manufactured by Nippon Zeon Co., Ltd.).
その他の粘度調整剤は、単独使用または２種類以上併用することができる。
Other viscosity modifiers can be used alone or in combination of two or more.
その他の粘度調整剤の配合割合は、エポキシ樹脂とスチレン系粘度調整剤とポリイソブチレンと相溶化剤との総量１００質量部に対して、例えば、１０質量部以上、好ましくは、１５質量部以上、また、例えば、３０質量部以下、好ましくは、２０質量部以下である。
The blending ratio of other viscosity modifiers is, for example, 10 parts by mass or more, preferably 15 parts by mass or more, with respect to 100 parts by mass of the total amount of the epoxy resin, styrene viscosity modifier, polyisobutylene, and compatibilizer. Further, it is, for example, 30 parts by mass or less, preferably 20 parts by mass or less.
［レベリング剤］
レベリング剤は、エポキシ樹脂組成物を用いて得られる封止材の平坦性を向上させるための成分である。 [Leveling agent]
The leveling agent is a component for improving the flatness of the sealing material obtained using the epoxy resin composition.
レベリング剤は、エポキシ樹脂組成物を用いて得られる封止材の平坦性を向上させるための成分である。 [Leveling agent]
The leveling agent is a component for improving the flatness of the sealing material obtained using the epoxy resin composition.
レベリング剤として、例えば、シリコーン系レベリング剤、アクリル系レベリング剤、および、フッ素系レベリング剤が挙げられる。レベリング剤として、好ましくは、シリコーン系レベリング剤が挙げられる。
Examples of the leveling agent include silicone leveling agents, acrylic leveling agents, and fluorine leveling agents. Preferably, the leveling agent is a silicone leveling agent.
レベリング剤は、単独使用または２種類以上併用することができる。
The leveling agents can be used alone or in combination of two or more.
レベリング剤の配合割合は、エポキシ樹脂とスチレン系粘度調整剤とポリイソブチレンと相溶化剤との総量１００質量部に対して、例えば、０．１質量部以上、また、例えば、１．０質量部以下、好ましくは、０．５質量部以下である。
The blending ratio of the leveling agent is, for example, 0.1 part by mass or more, or, for example, 1.0 part by mass with respect to 100 parts by mass of the total amount of the epoxy resin, styrene-based viscosity modifier, polyisobutylene, and compatibilizer. The amount is preferably 0.5 parts by mass or less.
［シランカップリング剤］
シランカップリング剤として、例えば、エポキシ基を有するシラン化合物、カルボキシル基を有するシラン化合物、メタクリロイル基を有するシラン化合物、酸無水物基を有するシラン化合物、および、イソシアネート基を有するシラン化合物が挙げられる。シランカップリング剤として、好ましくは、エポキシ基を有するシラン化合物が挙げられる。 [Silane coupling agent]
Examples of the silane coupling agent include a silane compound having an epoxy group, a silane compound having a carboxyl group, a silane compound having a methacryloyl group, a silane compound having an acid anhydride group, and a silane compound having an isocyanate group. Preferable examples of the silane coupling agent include silane compounds having an epoxy group.
シランカップリング剤として、例えば、エポキシ基を有するシラン化合物、カルボキシル基を有するシラン化合物、メタクリロイル基を有するシラン化合物、酸無水物基を有するシラン化合物、および、イソシアネート基を有するシラン化合物が挙げられる。シランカップリング剤として、好ましくは、エポキシ基を有するシラン化合物が挙げられる。 [Silane coupling agent]
Examples of the silane coupling agent include a silane compound having an epoxy group, a silane compound having a carboxyl group, a silane compound having a methacryloyl group, a silane compound having an acid anhydride group, and a silane compound having an isocyanate group. Preferable examples of the silane coupling agent include silane compounds having an epoxy group.
シランカップリング剤は、単独使用または２種類以上併用することができる。
The silane coupling agents can be used alone or in combination of two or more.
シランカップリング剤の配合割合は、エポキシ樹脂とスチレン系粘度調整剤とポリイソブチレンと相溶化剤との総量１００質量部に対して、例えば、０．１質量部以上、好ましくは、０．５質量部以上また、例えば、３．０質量部以下、好ましくは、１．０質量部以下である。
The blending ratio of the silane coupling agent is, for example, 0.1 part by mass or more, preferably 0.5 part by mass, based on 100 parts by mass of the epoxy resin, styrene viscosity modifier, polyisobutylene, and compatibilizer. parts or more, and for example, 3.0 parts by mass or less, preferably 1.0 parts by mass or less.
［充填材］
充填材として、例えば、シリカ、アルミナ、酸化物（例えば、酸化チタン、酸化マグネシウム）、および、水酸化物（例えば、水酸化アルミニウム、水酸化マグネシウム）が挙げられる。充填材として、好ましくは、シリカが挙げられる。 [Filling material]
Examples of fillers include silica, alumina, oxides (eg, titanium oxide, magnesium oxide), and hydroxides (eg, aluminum hydroxide, magnesium hydroxide). Preferably, the filler includes silica.
充填材として、例えば、シリカ、アルミナ、酸化物（例えば、酸化チタン、酸化マグネシウム）、および、水酸化物（例えば、水酸化アルミニウム、水酸化マグネシウム）が挙げられる。充填材として、好ましくは、シリカが挙げられる。 [Filling material]
Examples of fillers include silica, alumina, oxides (eg, titanium oxide, magnesium oxide), and hydroxides (eg, aluminum hydroxide, magnesium hydroxide). Preferably, the filler includes silica.
充填材は、単独使用または２種類以上併用することができる。
The fillers can be used alone or in combination of two or more.
充填材の配合割合は、エポキシ樹脂とスチレン系粘度調整剤とポリイソブチレンと相溶化剤との総量１００質量部に対して、例えば、５質量部以上、好ましくは、１０質量部以上また、例えば、５０質量部以下、好ましくは、３０質量部以下である。
The blending ratio of the filler is, for example, 5 parts by mass or more, preferably 10 parts by mass or more, based on 100 parts by mass of the total amount of the epoxy resin, styrene viscosity modifier, polyisobutylene, and compatibilizer. It is 50 parts by mass or less, preferably 30 parts by mass or less.
＜エポキシ樹脂組成物の調製＞
エポキシ樹脂組成物を調製するには、エポキシ樹脂と、スチレン系粘度調整剤と、ポリイソブチレンと、相溶化剤と、必要により配合される添加剤とを混合する。とりわけ、重合開始剤を配合する場合には、重合開始剤以外の成分を配合させた後、重合開始剤を配合する。これにより、エポキシ樹脂組成物を調製する。 <Preparation of epoxy resin composition>
To prepare an epoxy resin composition, an epoxy resin, a styrene-based viscosity modifier, polyisobutylene, a compatibilizer, and optional additives are mixed. In particular, when blending a polymerization initiator, the polymerization initiator is blended after components other than the polymerization initiator are blended. In this way, an epoxy resin composition is prepared.
エポキシ樹脂組成物を調製するには、エポキシ樹脂と、スチレン系粘度調整剤と、ポリイソブチレンと、相溶化剤と、必要により配合される添加剤とを混合する。とりわけ、重合開始剤を配合する場合には、重合開始剤以外の成分を配合させた後、重合開始剤を配合する。これにより、エポキシ樹脂組成物を調製する。 <Preparation of epoxy resin composition>
To prepare an epoxy resin composition, an epoxy resin, a styrene-based viscosity modifier, polyisobutylene, a compatibilizer, and optional additives are mixed. In particular, when blending a polymerization initiator, the polymerization initiator is blended after components other than the polymerization initiator are blended. In this way, an epoxy resin composition is prepared.
また、エポキシ樹脂組成物を、公知の有機溶剤で希釈することもできる。つまり、エポキシ樹脂組成物は、エポキシ樹脂組成物のワニスとして調製することができる。
Additionally, the epoxy resin composition can be diluted with a known organic solvent. That is, the epoxy resin composition can be prepared as an epoxy resin composition varnish.
エポキシ樹脂組成物を、公知の有機溶剤（例えば、メチルエチルケトンおよびトルエン）で希釈する場合には、エポキシ樹脂組成物のワニスの固形分濃度は、例えば、１０質量％以上、また、例えば、５０質量％以下である。
When diluting the epoxy resin composition with a known organic solvent (for example, methyl ethyl ketone and toluene), the solid content concentration of the varnish of the epoxy resin composition is, for example, 10% by mass or more, or, for example, 50% by mass. It is as follows.
このようなエポキシ樹脂組成物は、相溶性（具体的には、スチレン系粘度調整剤（エポキシ樹脂）とポリイソブチレンとの相溶性）および低透湿性に優れる。そのため、光学素子を封止する封止材として、好適に用いることができる。
Such an epoxy resin composition has excellent compatibility (specifically, compatibility between the styrene viscosity modifier (epoxy resin) and polyisobutylene) and low moisture permeability. Therefore, it can be suitably used as a sealing material for sealing an optical element.
詳しくは、封止材は、上記のエポキシ樹脂組成物の硬化物を含む。
Specifically, the sealing material includes a cured product of the above-mentioned epoxy resin composition.
エポキシ樹脂組成物が、熱カチオン重合開始剤を含む場合には、エポキシ樹脂組成物を加熱することにより、エポキシ樹脂組成物を硬化させる。
When the epoxy resin composition contains a thermal cationic polymerization initiator, the epoxy resin composition is cured by heating the epoxy resin composition.
加熱条件として、硬化温度は、例えば、６０℃以上、また、例えば、１００℃以下である。加熱時間は、例えば、１分以上、また、例えば、６０分以下である。
As for the heating conditions, the curing temperature is, for example, 60°C or higher and, for example, 100°C or lower. The heating time is, for example, 1 minute or more and, for example, 60 minutes or less.
エポキシ樹脂組成物の硬化物は、好ましくは、透明性を有する。具体的には、エポキシ樹脂組成物の硬化物の全光線透過率（ＪＩＳ Ｋ ７３６１－１に準拠）は、例えば、８０％以上、好ましくは、８５％以上、より好ましくは、９０％以上、また、例えば、１００％以下である。
The cured product of the epoxy resin composition preferably has transparency. Specifically, the total light transmittance (according to JIS K 7361-1) of the cured product of the epoxy resin composition is, for example, 80% or more, preferably 85% or more, more preferably 90% or more, or , for example, 100% or less.
封止材は、上記のエポキシ樹脂組成物の硬化物を含むため、低透湿性に優れる。
Since the sealing material contains the cured product of the above-mentioned epoxy resin composition, it has excellent low moisture permeability.
＜画像表示装置＞
画像表示装置は、光学素子と、光学素子を封止する上記封止材とを備える。画像表示装置は、上記封止材を備えるため、低透湿性に優れる。 <Image display device>
The image display device includes an optical element and the sealing material that seals the optical element. Since the image display device includes the above sealing material, it has excellent low moisture permeability.
画像表示装置は、光学素子と、光学素子を封止する上記封止材とを備える。画像表示装置は、上記封止材を備えるため、低透湿性に優れる。 <Image display device>
The image display device includes an optical element and the sealing material that seals the optical element. Since the image display device includes the above sealing material, it has excellent low moisture permeability.
＜作用効果＞
エポキシ樹脂組成物は、ポリイソブチレンを含む。そのため、低透湿性に優れる。 <Effect>
The epoxy resin composition includes polyisobutylene. Therefore, it has excellent low moisture permeability.
エポキシ樹脂組成物は、ポリイソブチレンを含む。そのため、低透湿性に優れる。 <Effect>
The epoxy resin composition includes polyisobutylene. Therefore, it has excellent low moisture permeability.
また、このエポキシ樹脂組成物は、ポリイソブチレンおよびスチレン系粘度調整剤のそれぞれに対して、所定の割合の相溶化剤（スチレン由来の構造とオレフィン由来の構造とを含むジブロック構造を有する相溶化剤）を含む。そのため、相溶性に優れる。
This epoxy resin composition also contains a compatibilizer (a compatibilizer having a diblock structure containing a styrene-derived structure and an olefin-derived structure) in a predetermined ratio for each of the polyisobutylene and the styrene-based viscosity modifier. agent). Therefore, it has excellent compatibility.
詳しくは、相溶化剤は、スチレン系粘度調整剤に類似する構造、および、ポリイソブチレンに類似する構造を併有する。具体的には、相溶化剤は、スチレン系粘度調整剤に類似する構造としてのスチレン由来の構造と、ポリイソブチレンに類似する構造としてのオレフィン由来の構造を併有する。
Specifically, the compatibilizer has a structure similar to a styrenic viscosity modifier and a structure similar to polyisobutylene. Specifically, the compatibilizer has both a styrene-derived structure similar to a styrene-based viscosity modifier and an olefin-derived structure similar to polyisobutylene.
さらに、相溶化剤は、スチレン由来の構造とオレフィン由来の構造とがジブロック構造を有する。
Furthermore, the compatibilizer has a diblock structure in which the styrene-derived structure and the olefin-derived structure are combined.
そのため、スチレン系粘度調整剤およびこれと相溶性に優れるエポキシ樹脂と、ポリイソブチレンとの相溶性が向上する。
Therefore, the compatibility between the styrene-based viscosity modifier and the epoxy resin that is highly compatible with the styrene-based viscosity modifier and polyisobutylene is improved.
一方、相溶化剤が、スチレン由来の構造およびオレフィン由来の構造を含むものの、これらがジブロック構造を有しない場合、例えば、スチレン由来の構造－オレフィン由来の構造－スチレン由来の構造からなるブロック共重合体である場合には、両端のスチレン由来の構造の距離が、化学結合で限定されているため、両端近傍に、スチレン系粘度調整剤が隣接しないと、相溶性が向上しない。
On the other hand, if the compatibilizer contains a styrene-derived structure and an olefin-derived structure, but they do not have a diblock structure, for example, a block combination consisting of a styrene-derived structure - an olefin-derived structure - a styrene-derived structure In the case of a polymer, the distance between the styrene-derived structures at both ends is limited by chemical bonds, so compatibility will not improve unless the styrene-based viscosity modifier is adjacent to both ends.
これに対して、このエポキシ樹脂組成物における相溶化剤は、一端が、スチレン由来の構造であり、他端が、オレフィン由来の構造であるため、相溶性を確実に向上できる。
On the other hand, since the compatibilizer in this epoxy resin composition has a structure derived from styrene at one end and a structure derived from olefin at the other end, the compatibility can be reliably improved.
封止材は、上記のエポキシ樹脂組成物の硬化物を含むため、低透湿性に優れる。
Since the sealing material contains the cured product of the above-mentioned epoxy resin composition, it has excellent low moisture permeability.
次に、本発明を、実施例および比較例に基づいて説明するが、本発明は、下記の実施例によって限定されるものではない。なお、「部」および「％」は、特に言及がない限り、質量基準である。また、以下の記載において用いられる配合割合（含有割合）、物性値、パラメータなどの具体的数値は、上記の「発明を実施するための形態」において記載されている、それらに対応する配合割合（含有割合）、物性値、パラメータなど該当記載の上限値（「以下」、「未満」として定義されている数値）または下限値（「以上」、「超過」として定義されている数値）に代替することができる。
Next, the present invention will be explained based on Examples and Comparative Examples, but the present invention is not limited by the Examples below. Note that "parts" and "%" are based on mass unless otherwise specified. In addition, the specific numerical values of the blending ratio (content ratio), physical property values, parameters, etc. used in the following description are the corresponding blending ratios ( Substitute with the upper limit value (value defined as "less than" or "less than") or lower limit value (value defined as "more than" or "exceeding") of the relevant description, such as content percentage), physical property value, parameter, etc. be able to.
＜成分の詳細＞
各実施例、および、各比較例で用いた成分の、商品名および略語について、詳述する。ＣＥＬ２０２１Ｐ：３，４－エポキシシクロヘキシルメチル（３，４－エポキシ）シクロヘキサンカルボキシレート、上記一般式（４）に示されるＥＣＨ構造含有エポキシ樹脂、商品名「セロキサイド２０２１Ｐ」、分子量：２５２．３、エポキシ当量：１２８～１４５ｇ／ｅｑ．、ダイセル社製
ｊＥＲ－４００５Ｐ：常温固形のビスフェノールＦ型エポキシ樹脂、重量平均分子量７５８２、エポキシ当量１００００ｇ／ｅｑ．、商品名「ｊＥＲ４００５Ｐ」、三菱ケミカル社製、
ＸＹ－６９５４Ｂ３５：常温固形のビフェニル型エポキシ樹脂、重量平均分子量３６，６９１、エポキシ当量１００００ｇ／ｅｑ．、商品名「ＸＹ－６９５４Ｂ３５」、三菱ケミカル社製、
ＦＴＲ－８１２０：スチレン系粘度調整剤、重量平均分子量１４２０、三井化学社製
ＦＴＲ－８１００：スチレン系粘度調整剤、重量平均分子量１４２０、三井化学社製
ＴＥＴＲＡＸ－３Ｔ：ポリイソブチレン、商品名「テトラックス グレード３Ｔ」、重量平均分子量４９０００、ＥＮＥＯＳ株式会社社製
ＴＥＴＲＡＸ－６Ｔ：ポリイソブチレン、商品名「テトラックス グレード６Ｔ」、重量平均分子量８００００、ＥＮＥＯＳ株式会社社製
セプトン－１０２０：相溶化剤、水添スチレン－イソプレンジブロック共重合体（スチレン由来の構造を有するユニットの割合：５０％、オレフィン由来の構造を有するユニットの割合：５０％）、株式会社クラレ製
タフテックＭ１９４３：相溶化剤、ポリスチレン－ポリブタジエン－ポリスチレンブロック共重合体、旭化成社製
ＣＸＣ－１７３３：熱カチオン重合開始剤、楠本化成株式会社製
ＱＴＮ－１５００：その他の粘度調整剤、石油樹脂、日本ゼオン社製
ＢＹＫ－３０２：シリコーン系レベリング剤、ビックケミー製
ＫＢＭ－４０３：３－グリシドキシプロピルトリエトキシシラン、信越化学工業株式会社製
Ｘ１２－９６７Ｃ：酸無水物を有するシランカップリング剤、信越化学工業株式会社製
ＫＢＭ－４８０３：エポキシ基を有するシラン化合物、信越化学工業株式会社製
ＥＰ４０８８Ｌ：ジシクロペンタジエン骨格を有するエポキシ樹脂、ＡＤＥＫＡ社製
ＳＣ－２０５０ＭＢ：充填材、シリカ、アドマテックス株式会社製 <Ingredient details>
The trade names and abbreviations of the components used in each Example and each Comparative Example will be explained in detail. CEL2021P: 3,4-epoxycyclohexylmethyl (3,4-epoxy)cyclohexanecarboxylate, ECH structure-containing epoxy resin shown in the above general formula (4), trade name "Celoxide 2021P", molecular weight: 252.3, epoxy equivalent :128-145g/eq. , Daicel Corporation jER-4005P: bisphenol F type epoxy resin solid at room temperature, weight average molecular weight 7582, epoxy equivalent 10000 g/eq. , product name "jER4005P", manufactured by Mitsubishi Chemical Corporation,
XY-6954B35: biphenyl type epoxy resin solid at room temperature, weight average molecular weight 36,691, epoxy equivalent 10000 g/eq. , product name "XY-6954B35", manufactured by Mitsubishi Chemical Corporation,
FTR-8120: Styrene viscosity modifier, weight average molecular weight 1420, Mitsui Chemicals FTR-8100: Styrene viscosity modifier, weight average molecular weight 1420, Mitsui Chemicals TETRAX-3T: Polyisobutylene, product name "Tetrax" Grade 3T", weight average molecular weight 49,000, ENEOS Corporation TETRAX-6T: polyisobutylene, trade name "Tetrax Grade 6T", weight average molecular weight 80,000, ENEOS Corporation Septon-1020: compatibilizer, hydrogenation Styrene-isoprene diblock copolymer (proportion of units with a styrene-derived structure: 50%, proportion of units with an olefin-derived structure: 50%), Tuftec M1943 manufactured by Kuraray Co., Ltd.: Compatibilizer, polystyrene-polybutadiene -Polystyrene block copolymer, Asahi Kasei Co., Ltd. CXC-1733: Thermal cationic polymerization initiator, Kusumoto Kasei Co., Ltd. QTN-1500: Other viscosity modifiers, petroleum resin, Nippon Zeon Co., Ltd. BYK-302: Silicone leveling agent , KBM-403 manufactured by Bick Chemie: 3-glycidoxypropyltriethoxysilane, X12-967C manufactured by Shin-Etsu Chemical Co., Ltd.: Silane coupling agent with acid anhydride, KBM-4803 manufactured by Shin-Etsu Chemical Co., Ltd.: epoxy group Silane compound, EP4088L manufactured by Shin-Etsu Chemical Co., Ltd.: Epoxy resin having a dicyclopentadiene skeleton, SC-2050MB manufactured by ADEKA: Filler, silica, manufactured by Admatex Co., Ltd.
各実施例、および、各比較例で用いた成分の、商品名および略語について、詳述する。ＣＥＬ２０２１Ｐ：３，４－エポキシシクロヘキシルメチル（３，４－エポキシ）シクロヘキサンカルボキシレート、上記一般式（４）に示されるＥＣＨ構造含有エポキシ樹脂、商品名「セロキサイド２０２１Ｐ」、分子量：２５２．３、エポキシ当量：１２８～１４５ｇ／ｅｑ．、ダイセル社製
ｊＥＲ－４００５Ｐ：常温固形のビスフェノールＦ型エポキシ樹脂、重量平均分子量７５８２、エポキシ当量１００００ｇ／ｅｑ．、商品名「ｊＥＲ４００５Ｐ」、三菱ケミカル社製、
ＸＹ－６９５４Ｂ３５：常温固形のビフェニル型エポキシ樹脂、重量平均分子量３６，６９１、エポキシ当量１００００ｇ／ｅｑ．、商品名「ＸＹ－６９５４Ｂ３５」、三菱ケミカル社製、
ＦＴＲ－８１２０：スチレン系粘度調整剤、重量平均分子量１４２０、三井化学社製
ＦＴＲ－８１００：スチレン系粘度調整剤、重量平均分子量１４２０、三井化学社製
ＴＥＴＲＡＸ－３Ｔ：ポリイソブチレン、商品名「テトラックス グレード３Ｔ」、重量平均分子量４９０００、ＥＮＥＯＳ株式会社社製
ＴＥＴＲＡＸ－６Ｔ：ポリイソブチレン、商品名「テトラックス グレード６Ｔ」、重量平均分子量８００００、ＥＮＥＯＳ株式会社社製
セプトン－１０２０：相溶化剤、水添スチレン－イソプレンジブロック共重合体（スチレン由来の構造を有するユニットの割合：５０％、オレフィン由来の構造を有するユニットの割合：５０％）、株式会社クラレ製
タフテックＭ１９４３：相溶化剤、ポリスチレン－ポリブタジエン－ポリスチレンブロック共重合体、旭化成社製
ＣＸＣ－１７３３：熱カチオン重合開始剤、楠本化成株式会社製
ＱＴＮ－１５００：その他の粘度調整剤、石油樹脂、日本ゼオン社製
ＢＹＫ－３０２：シリコーン系レベリング剤、ビックケミー製
ＫＢＭ－４０３：３－グリシドキシプロピルトリエトキシシラン、信越化学工業株式会社製
Ｘ１２－９６７Ｃ：酸無水物を有するシランカップリング剤、信越化学工業株式会社製
ＫＢＭ－４８０３：エポキシ基を有するシラン化合物、信越化学工業株式会社製
ＥＰ４０８８Ｌ：ジシクロペンタジエン骨格を有するエポキシ樹脂、ＡＤＥＫＡ社製
ＳＣ－２０５０ＭＢ：充填材、シリカ、アドマテックス株式会社製 <Ingredient details>
The trade names and abbreviations of the components used in each Example and each Comparative Example will be explained in detail. CEL2021P: 3,4-epoxycyclohexylmethyl (3,4-epoxy)cyclohexanecarboxylate, ECH structure-containing epoxy resin shown in the above general formula (4), trade name "Celoxide 2021P", molecular weight: 252.3, epoxy equivalent :128-145g/eq. , Daicel Corporation jER-4005P: bisphenol F type epoxy resin solid at room temperature, weight average molecular weight 7582, epoxy equivalent 10000 g/eq. , product name "jER4005P", manufactured by Mitsubishi Chemical Corporation,
XY-6954B35: biphenyl type epoxy resin solid at room temperature, weight average molecular weight 36,691, epoxy equivalent 10000 g/eq. , product name "XY-6954B35", manufactured by Mitsubishi Chemical Corporation,
FTR-8120: Styrene viscosity modifier, weight average molecular weight 1420, Mitsui Chemicals FTR-8100: Styrene viscosity modifier, weight average molecular weight 1420, Mitsui Chemicals TETRAX-3T: Polyisobutylene, product name "Tetrax" Grade 3T", weight average molecular weight 49,000, ENEOS Corporation TETRAX-6T: polyisobutylene, trade name "Tetrax Grade 6T", weight average molecular weight 80,000, ENEOS Corporation Septon-1020: compatibilizer, hydrogenation Styrene-isoprene diblock copolymer (proportion of units with a styrene-derived structure: 50%, proportion of units with an olefin-derived structure: 50%), Tuftec M1943 manufactured by Kuraray Co., Ltd.: Compatibilizer, polystyrene-polybutadiene -Polystyrene block copolymer, Asahi Kasei Co., Ltd. CXC-1733: Thermal cationic polymerization initiator, Kusumoto Kasei Co., Ltd. QTN-1500: Other viscosity modifiers, petroleum resin, Nippon Zeon Co., Ltd. BYK-302: Silicone leveling agent , KBM-403 manufactured by Bick Chemie: 3-glycidoxypropyltriethoxysilane, X12-967C manufactured by Shin-Etsu Chemical Co., Ltd.: Silane coupling agent with acid anhydride, KBM-4803 manufactured by Shin-Etsu Chemical Co., Ltd.: epoxy group Silane compound, EP4088L manufactured by Shin-Etsu Chemical Co., Ltd.: Epoxy resin having a dicyclopentadiene skeleton, SC-2050MB manufactured by ADEKA: Filler, silica, manufactured by Admatex Co., Ltd.
＜エポキシ樹脂組成物の調製＞
実施例１～実施例１１、および、比較例１～比較例１５
表１～表３に記載の配合処方に基づいて、各成分を配合して、エポキシ樹脂組成物を調製した。具体的には、まず、フラスコに、重合開始剤以外の成分を配合した。次いで、メチルエチルケトン５０質量部およびトルエン５０質量部を加え、室温で攪拌溶解した。次いで、重合開始剤を添加して室温で攪拌した。これにより、エポキシ樹脂組成物のワニスを調製した。 <Preparation of epoxy resin composition>
Examples 1 to 11 and Comparative Examples 1 to 15
Epoxy resin compositions were prepared by blending each component based on the formulations listed in Tables 1 to 3. Specifically, first, components other than the polymerization initiator were mixed into a flask. Next, 50 parts by mass of methyl ethyl ketone and 50 parts by mass of toluene were added and dissolved with stirring at room temperature. Then, a polymerization initiator was added and stirred at room temperature. In this way, a varnish of an epoxy resin composition was prepared.
実施例１～実施例１１、および、比較例１～比較例１５
表１～表３に記載の配合処方に基づいて、各成分を配合して、エポキシ樹脂組成物を調製した。具体的には、まず、フラスコに、重合開始剤以外の成分を配合した。次いで、メチルエチルケトン５０質量部およびトルエン５０質量部を加え、室温で攪拌溶解した。次いで、重合開始剤を添加して室温で攪拌した。これにより、エポキシ樹脂組成物のワニスを調製した。 <Preparation of epoxy resin composition>
Examples 1 to 11 and Comparative Examples 1 to 15
Epoxy resin compositions were prepared by blending each component based on the formulations listed in Tables 1 to 3. Specifically, first, components other than the polymerization initiator were mixed into a flask. Next, 50 parts by mass of methyl ethyl ketone and 50 parts by mass of toluene were added and dissolved with stirring at room temperature. Then, a polymerization initiator was added and stirred at room temperature. In this way, a varnish of an epoxy resin composition was prepared.
＜評価＞
［相溶性］
各実施例および各比較例のエポキシ樹脂組成物のワニスの状態を目視により観察した。
相溶性について、以下の基準に基づき評価した。その結果を、表１～表３に示す。
｛基準｝
〇：エポキシ樹脂組成物のワニスが、透明であった。
×：エポキシ樹脂組成物のワニスにおいて、白濁および／または凝集物が観察された。 <Evaluation>
[Compatibility]
The state of the varnish of the epoxy resin composition of each Example and each Comparative Example was visually observed.
Compatibility was evaluated based on the following criteria. The results are shown in Tables 1 to 3.
{standard}
Good: The varnish of the epoxy resin composition was transparent.
×: White turbidity and/or aggregates were observed in the varnish of the epoxy resin composition.
［相溶性］
各実施例および各比較例のエポキシ樹脂組成物のワニスの状態を目視により観察した。
相溶性について、以下の基準に基づき評価した。その結果を、表１～表３に示す。
｛基準｝
〇：エポキシ樹脂組成物のワニスが、透明であった。
×：エポキシ樹脂組成物のワニスにおいて、白濁および／または凝集物が観察された。 <Evaluation>
[Compatibility]
The state of the varnish of the epoxy resin composition of each Example and each Comparative Example was visually observed.
Compatibility was evaluated based on the following criteria. The results are shown in Tables 1 to 3.
{standard}
Good: The varnish of the epoxy resin composition was transparent.
×: White turbidity and/or aggregates were observed in the varnish of the epoxy resin composition.
［塗工性］
各実施例および各比較例のエポキシ樹脂組成物のワニスを、塗工機を用いて、ＰＥＴフィルム（離型処理されたＰＥＴフィルム（商品名：ＰＥＴ７５ｘ１Ｈ－ＡＳＩ５、ニッパ（株）社製、厚さ：７５μｍ、ベースフィルム）上に塗工した後、窒素パージオーブンにて、８０℃で３分間乾燥させて、塗膜（厚さ１５μｍ）を形成した。塗工性について、以下の基準に基づき評価した。その結果を、表１～表３に示す。
｛基準｝
〇：塗工スジおよび／またはハジキが観測されなかった。
×：塗工スジおよび／またはハジキが観測された。 [Coatability]
The varnish of the epoxy resin composition of each example and each comparative example was applied to PET film (release-treated PET film (trade name: PET75x1H-ASI5, manufactured by Nipper Co., Ltd., thickness: : 75 μm, base film) and dried in a nitrogen purge oven at 80° C. for 3 minutes to form a coating film (thickness: 15 μm). Coatability was evaluated based on the following criteria. The results are shown in Tables 1 to 3.
{standard}
○: Coating streaks and/or repellency were not observed.
×: Coating streaks and/or repelling were observed.
各実施例および各比較例のエポキシ樹脂組成物のワニスを、塗工機を用いて、ＰＥＴフィルム（離型処理されたＰＥＴフィルム（商品名：ＰＥＴ７５ｘ１Ｈ－ＡＳＩ５、ニッパ（株）社製、厚さ：７５μｍ、ベースフィルム）上に塗工した後、窒素パージオーブンにて、８０℃で３分間乾燥させて、塗膜（厚さ１５μｍ）を形成した。塗工性について、以下の基準に基づき評価した。その結果を、表１～表３に示す。
｛基準｝
〇：塗工スジおよび／またはハジキが観測されなかった。
×：塗工スジおよび／またはハジキが観測された。 [Coatability]
The varnish of the epoxy resin composition of each example and each comparative example was applied to PET film (release-treated PET film (trade name: PET75x1H-ASI5, manufactured by Nipper Co., Ltd., thickness: : 75 μm, base film) and dried in a nitrogen purge oven at 80° C. for 3 minutes to form a coating film (thickness: 15 μm). Coatability was evaluated based on the following criteria. The results are shown in Tables 1 to 3.
{standard}
○: Coating streaks and/or repellency were not observed.
×: Coating streaks and/or repelling were observed.
［剥離性］
剥離性について、以下の基準に基づき評価した。その結果を、表１～表３に示す。
｛基準｝
〇：樹脂単独で、ＰＥＴフィルムから取り外せた。
×：樹脂単独で、ＰＥＴフィルムから取り外せなかった。または傷、穴などにより樹脂の膜が損傷した。 [Releasability]
The peelability was evaluated based on the following criteria. The results are shown in Tables 1 to 3.
{standard}
Good: The resin alone could be removed from the PET film.
×: The resin alone could not be removed from the PET film. Or the resin film is damaged due to scratches, holes, etc.
剥離性について、以下の基準に基づき評価した。その結果を、表１～表３に示す。
｛基準｝
〇：樹脂単独で、ＰＥＴフィルムから取り外せた。
×：樹脂単独で、ＰＥＴフィルムから取り外せなかった。または傷、穴などにより樹脂の膜が損傷した。 [Releasability]
The peelability was evaluated based on the following criteria. The results are shown in Tables 1 to 3.
{standard}
Good: The resin alone could be removed from the PET film.
×: The resin alone could not be removed from the PET film. Or the resin film is damaged due to scratches, holes, etc.
［低透湿性］
剥離性評価において、剥離した塗膜を、ＪＩＳ Ｚ ０２０８ の透湿度試験（カップ法）に準拠して、温度６０℃、相対湿度９５％ＲＨの恒温恒湿槽中で、２４時間の透湿試験を実施し、透湿度を測定した。透湿度が低い方が、低透湿性に優れると評価する。その結果を表１～表３に示す。なお、塗工性評価において、塗膜を剥離できなかったものについては、表２および表３において、「測定不可」と記載する。また、塗膜を剥離できなかったものであっても、小さな穴および／または亀裂が入っている場合には、透湿度を測定することはできず、「測定不可」と記載する。 [Low moisture permeability]
In the peelability evaluation, the peeled coating film was subjected to a 24-hour moisture permeability test in a constant temperature and humidity chamber at a temperature of 60°C and a relative humidity of 95% RH, in accordance with the JIS Z 0208 moisture permeability test (cup method). was carried out and the moisture permeability was measured. The lower the moisture permeability, the better the low moisture permeability. The results are shown in Tables 1 to 3. In addition, in Table 2 and Table 3, in the case where the coating film could not be peeled off in the coating property evaluation, it is described as "unmeasurable". Furthermore, even if the coating cannot be peeled off, if there are small holes and/or cracks, the moisture permeability cannot be measured and is described as "unmeasurable."
剥離性評価において、剥離した塗膜を、ＪＩＳ Ｚ ０２０８ の透湿度試験（カップ法）に準拠して、温度６０℃、相対湿度９５％ＲＨの恒温恒湿槽中で、２４時間の透湿試験を実施し、透湿度を測定した。透湿度が低い方が、低透湿性に優れると評価する。その結果を表１～表３に示す。なお、塗工性評価において、塗膜を剥離できなかったものについては、表２および表３において、「測定不可」と記載する。また、塗膜を剥離できなかったものであっても、小さな穴および／または亀裂が入っている場合には、透湿度を測定することはできず、「測定不可」と記載する。 [Low moisture permeability]
In the peelability evaluation, the peeled coating film was subjected to a 24-hour moisture permeability test in a constant temperature and humidity chamber at a temperature of 60°C and a relative humidity of 95% RH, in accordance with the JIS Z 0208 moisture permeability test (cup method). was carried out and the moisture permeability was measured. The lower the moisture permeability, the better the low moisture permeability. The results are shown in Tables 1 to 3. In addition, in Table 2 and Table 3, in the case where the coating film could not be peeled off in the coating property evaluation, it is described as "unmeasurable". Furthermore, even if the coating cannot be peeled off, if there are small holes and/or cracks, the moisture permeability cannot be measured and is described as "unmeasurable."
なお、上記発明は、本発明の例示の実施形態として提供したが、これは単なる例示にすぎず、限定的に解釈してはならない。当該技術分野の当業者によって明らかな本発明の変形例は、後記請求の範囲に含まれるものである。
Note that although the above invention has been provided as an exemplary embodiment of the present invention, this is merely an example and should not be interpreted in a limiting manner. Variations of the invention that are obvious to those skilled in the art are intended to be within the scope of the following claims.
本発明のエポキシ樹脂組成物、封止材および画像表示装置は、例えば、有機ＥＬディスプレイの製造において好適に用いることができる。
The epoxy resin composition, sealing material, and image display device of the present invention can be suitably used, for example, in the production of organic EL displays.
Claims (3)
- エポキシ樹脂と、スチレン系粘度調整剤と、ポリイソブチレンと、相溶化剤とを含み、
前記相溶化剤は、スチレン由来の構造とオレフィン由来の構造とを含むジブロック構造を有し、
前記相溶化剤の配合割合は、ポリイソブチレン１００質量部に対して、３０質量部以上１２０質量部以下であり、
前記相溶化剤の配合割合は、スチレン系粘度調整剤１００質量部に対して、８０質量部以上３５０質量部以下である、エポキシ樹脂組成物。 Contains an epoxy resin, a styrene viscosity modifier, polyisobutylene, and a compatibilizer,
The compatibilizer has a diblock structure including a styrene-derived structure and an olefin-derived structure,
The blending ratio of the compatibilizer is 30 parts by mass or more and 120 parts by mass or less with respect to 100 parts by mass of polyisobutylene,
In the epoxy resin composition, the blending ratio of the compatibilizer is 80 parts by mass or more and 350 parts by mass or less with respect to 100 parts by mass of the styrene-based viscosity modifier. - 請求項１に記載のエポキシ樹脂組成物の硬化物を含む、封止材。 A sealing material comprising a cured product of the epoxy resin composition according to claim 1.
- 光学素子と、前記光学素子を封止する請求項２に記載の封止材とを備える、画像表示装置。
An image display device comprising an optical element and the sealing material according to claim 2, which seals the optical element.
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| KR1020247026973A KR20240128122A (en) | 2022-03-30 | 2023-03-24 | Epoxy resin composition, encapsulant and image display device |
| CN202380022665.XA CN118742604A (en) | 2022-03-30 | 2023-03-24 | Epoxy resin composition, sealing material and image display device |
| JP2024512377A JPWO2023190191A1 (en) | 2022-03-30 | 2023-03-24 |
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| JP (1) | JPWO2023190191A1 (en) |
| KR (1) | KR20240128122A (en) |
| CN (1) | CN118742604A (en) |
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Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01275620A (en) * | 1988-04-28 | 1989-11-06 | Sumitomo Bakelite Co Ltd | Epoxy resin composition for semiconductor sealing |
| WO2011062167A1 (en) * | 2009-11-18 | 2011-05-26 | 味の素株式会社 | Resin composition |
| WO2015068805A1 (en) * | 2013-11-08 | 2015-05-14 | 日本化薬株式会社 | Sealing resin composition |
| JP2016066471A (en) * | 2014-09-24 | 2016-04-28 | 積水化学工業株式会社 | Resin composition for sealing organic electroluminescence display element, resin sheet for sealing organic electroluminescence display element, and organic electroluminescence display element |
| WO2018235824A1 (en) * | 2017-06-23 | 2018-12-27 | 三井化学株式会社 | Image display device sealing material and image display device sealing sheet |
| JP2020019959A (en) * | 2015-03-24 | 2020-02-06 | エルジー・ケム・リミテッド | Adhesive composition |
| WO2020031941A1 (en) * | 2018-08-10 | 2020-02-13 | 三井化学株式会社 | Sealant |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102448273B1 (en) | 2020-03-19 | 2022-09-28 | (주)블랭크코퍼레이션 | Shower head |
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2023
- 2023-03-24 KR KR1020247026973A patent/KR20240128122A/en unknown
- 2023-03-24 WO PCT/JP2023/011893 patent/WO2023190191A1/en active Application Filing
- 2023-03-24 CN CN202380022665.XA patent/CN118742604A/en active Pending
- 2023-03-24 JP JP2024512377A patent/JPWO2023190191A1/ja active Pending
- 2023-03-28 TW TW112111765A patent/TW202344594A/en unknown
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01275620A (en) * | 1988-04-28 | 1989-11-06 | Sumitomo Bakelite Co Ltd | Epoxy resin composition for semiconductor sealing |
| WO2011062167A1 (en) * | 2009-11-18 | 2011-05-26 | 味の素株式会社 | Resin composition |
| WO2015068805A1 (en) * | 2013-11-08 | 2015-05-14 | 日本化薬株式会社 | Sealing resin composition |
| JP2016066471A (en) * | 2014-09-24 | 2016-04-28 | 積水化学工業株式会社 | Resin composition for sealing organic electroluminescence display element, resin sheet for sealing organic electroluminescence display element, and organic electroluminescence display element |
| JP2020019959A (en) * | 2015-03-24 | 2020-02-06 | エルジー・ケム・リミテッド | Adhesive composition |
| WO2018235824A1 (en) * | 2017-06-23 | 2018-12-27 | 三井化学株式会社 | Image display device sealing material and image display device sealing sheet |
| WO2020031941A1 (en) * | 2018-08-10 | 2020-02-13 | 三井化学株式会社 | Sealant |
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| TW202344594A (en) | 2023-11-16 |
| JPWO2023190191A1 (en) | 2023-10-05 |
| CN118742604A (en) | 2024-10-01 |
| KR20240128122A (en) | 2024-08-23 |
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