WO2022205493A1 - Plateforme de test - Google Patents
Plateforme de test Download PDFInfo
- Publication number
- WO2022205493A1 WO2022205493A1 PCT/CN2021/086366 CN2021086366W WO2022205493A1 WO 2022205493 A1 WO2022205493 A1 WO 2022205493A1 CN 2021086366 W CN2021086366 W CN 2021086366W WO 2022205493 A1 WO2022205493 A1 WO 2022205493A1
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- WO
- WIPO (PCT)
- Prior art keywords
- moving part
- under test
- test
- deviation
- test platform
- Prior art date
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- 238000012360 testing method Methods 0.000 title claims abstract description 111
- 238000012545 processing Methods 0.000 claims abstract description 30
- 238000012544 monitoring process Methods 0.000 claims abstract description 3
- 238000006073 displacement reaction Methods 0.000 claims description 23
- 235000012431 wafers Nutrition 0.000 claims description 11
- 238000012423 maintenance Methods 0.000 claims description 9
- 230000008439 repair process Effects 0.000 claims description 5
- 238000007405 data analysis Methods 0.000 abstract description 5
- 238000000034 method Methods 0.000 description 13
- 230000008569 process Effects 0.000 description 9
- 238000005259 measurement Methods 0.000 description 7
- 238000010586 diagram Methods 0.000 description 4
- 238000005530 etching Methods 0.000 description 4
- 238000001459 lithography Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 238000007689 inspection Methods 0.000 description 2
- 229920002120 photoresistant polymer Polymers 0.000 description 2
- 230000037452 priming Effects 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 238000004528 spin coating Methods 0.000 description 2
- 230000008859 change Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B21/00—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant
- G01B21/02—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring length, width, or thickness
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B21/00—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant
- G01B21/22—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring angles or tapers; for testing the alignment of axes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B21/00—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant
- G01B21/30—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring roughness or irregularity of surfaces
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01M—TESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
- G01M13/00—Testing of machine parts
Definitions
- the present application relates to the field of semiconductor technology, and in particular, to a test platform.
- lithography is a very critical process.
- the general lithography process needs to go through the steps of cleaning and drying the surface of the silicon wafer, priming, spin-coating photoresist, soft baking, alignment exposure, post-baking, developing, hard baking, and etching.
- various equipment is usually designed to carry the wafers. Before these equipments are officially put into use or after failure maintenance, it is usually necessary to check the operation accuracy of the equipment. If the equipment runs for a long time, it is necessary to arrange for operators to monitor these equipment to avoid accidental impact on the test results, and the test cost is high.
- the purpose of the present application is to provide a test platform that can automatically monitor the running accuracy of the device under test.
- an embodiment of the present application proposes a test platform for monitoring the running accuracy of the device to be tested.
- the test platform includes: a base, a fixing frame and a reference piece connected to the fixing frame, and the fixing frame is used to fix the to-be-tested device.
- the reference piece has a reference surface facing the moving part of the equipment to be tested; a driving device is connected to the base, and the driving device is used to provide power for the moving part; the sensing unit is arranged on the moving part and is used for sensing motion The distance or angle between the component and the reference plane after the component moves to the designated position; the data processing unit is configured to judge according to the deviation between the distance sensed by the sensing unit and the preset distance or the deviation between the angle and the preset angle Whether the device under test meets the acceptance requirements.
- the sensing unit includes at least three displacement sensors, and the at least three displacement sensors are disposed on a plane of the moving part facing the reference plane side.
- the mean value of the deviation between the distances sensed by the at least three displacement sensors and the preset distance or the mean value of the absolute value of the deviation between the angle and the preset angle is a
- the deviation threshold of the device under test is b
- the data processing unit determines that the device under test meets the acceptance requirements.
- the mean absolute value of the deviation between the distances sensed by the at least three displacement sensors and the preset distance or the deviation between the angle and the preset angle is a i , where 0 ⁇ i ⁇ n, i and n are natural numbers, the deviation threshold of the device under test is b, the precision index of the moving part is T, and
- the data processing unit determines that the device to be tested meets the acceptance requirements of the new device.
- the data processing unit determines that the device to be tested meets the acceptance requirements of the old device.
- the data processing unit determines that the device to be tested meets the acceptance requirements of the old device within the limited service period.
- the data processing unit determines that the device under test does not meet the acceptance requirements.
- the moving part moves from an initial position to a designated position
- the test platform further includes a first sensor and a second sensor disposed on the fixing frame, the first sensor corresponding to the initial position setting, and the second sensor corresponding to Set at a designated position; when the moving part reaches the initial position, the first sensor outputs a first electrical signal; when the moving part reaches the designated position, the second sensor outputs a second electrical signal.
- the test platform further includes a relay, the relay is electrically connected to the driving device, the relay turns off the driving device according to the first electrical signal sent by the first sensor, and starts the driving device to rotate forward after a first predetermined time interval ;
- the relay closes the drive device according to the second electrical signal sent by the second sensor, and starts the drive device to rotate in reverse after a second predetermined time interval.
- the device to be tested is a carrier device for lifting wafers
- the moving component is a carrier platform that moves back and forth in a vertical direction
- the sensing unit is used to sense when the carrier platform moves to a designated position. The distance between it and the reference plane to detect the flatness of the carrying platform.
- a test platform provided by an embodiment of the present application includes a base, a driving device, a sensing unit and a data processing unit.
- the base includes a fixing frame and a reference piece connected to the fixing frame.
- the fixing frame is used to fix the device to be tested, and the reference
- the device has a reference plane facing the moving part of the device to be tested;
- the driving device is connected to the base, and the driving device is used to provide power for the moving part;
- the sensing unit is arranged on the moving part and is used to sense the moving part after it has moved to a designated position The distance or angle between it and the reference plane;
- the data processing unit is configured to judge whether the device under test meets the acceptance requirements according to the deviation between the distance sensed by the sensing unit and the preset distance or the deviation between the angle and the preset angle .
- the test platform can automatically monitor the running accuracy of the equipment under test and perform quantifiable data analysis, which improves the test efficiency and the reliability of the test results.
- FIG. 1 shows a schematic structural diagram of a test platform testing a device under test according to an embodiment of the present application
- FIG. 2 shows a schematic structural diagram of a test platform according to an embodiment of the present application
- FIG. 3 is a graph showing the running accuracy of the device under test tested by the test platform in FIG. 2 .
- 4-data processing unit 5-first sensor; 6-second sensor; 7-relay.
- lithography is a very critical process.
- the general lithography process needs to go through the steps of cleaning and drying the surface of the silicon wafer, priming, spin-coating photoresist, soft baking, alignment exposure, post-baking, developing, hard baking, and etching.
- various equipment is usually designed to carry the wafers.
- an etching machine commonly used in a photolithography process includes a wafer carrier platform, which can be raised and lowered in a vertical direction for lifting the wafer.
- the equipment In order to improve the reliability of the test results, the equipment usually runs continuously for 24 hours or longer. It is necessary to arrange engineers to monitor these equipment to avoid accidental influence on the test results, and the test cost is high.
- the embodiments of the present application provide a test platform, which can automatically monitor the running accuracy of the device under test.
- FIG. 1 shows a schematic structural diagram of a test platform for testing a device under test according to an embodiment of the present application.
- a test platform provided by the embodiment of the present application is used to monitor the running accuracy of the equipment under test S, and the test platform includes: a base 1 , a driving device 2 , a sensing unit 3 and a data processing unit 4 .
- the base 1 includes a fixing frame 11 and a reference member 12 connected with the fixing frame 11 .
- the fixing frame 11 is used to fix the device S to be tested, and the reference member 12 has a reference plane B facing the moving part M of the device S to be tested.
- the driving device 2 is connected with the base 1 , and the driving device 2 is used to provide power for the moving part M.
- the sensing unit 3 is disposed on the moving part M, and is used to sense the distance or angle between the moving part M and the reference plane B after the moving part M moves to the designated position P2.
- the data processing unit 4 is configured to judge whether the device under test S meets the acceptance requirements according to the deviation between the distance sensed by the sensing unit 3 and the preset distance or the deviation between the angle and the preset angle.
- the embodiments of the present application are described by taking the device under test S shown in FIG. 1 as an example as a carrier device for lifting wafers.
- the carrying device is disposed between the fixed frame 11 of the base 1 and the reference member 12, and the moving part M is a carrying platform that moves back and forth in the vertical direction.
- the sensing unit 3 is disposed on the carrying platform, and is used for sensing the distance between the carrying platform and the reference plane B after the carrying platform moves to the designated position P2, so as to detect the flatness of the carrying platform.
- the equipment under test S drives the bearing platform to move back and forth in the vertical direction through a lifting device, such as a combination of a ball screw and a nut, a combination of a worm gear and a nut, and other structural forms.
- a lifting device such as a combination of a ball screw and a nut, a combination of a worm gear and a nut, and other structural forms.
- the driving device 2 replaces the lifting device to drive the carrying platform to move back and forth in the vertical direction.
- the driving device 2 can be, for example, but not limited to, a driving motor, an air cylinder or a hydraulic cylinder, etc., as long as it can drive the carrying platform to move back and forth in the vertical direction. Since the test platform can automatically drive the moving parts M of the equipment to be tested S to move back and forth through the driving device 2, there is no need to arrange an engineer to monitor the operation of the equipment S to be tested, which reduces labor costs.
- the sensing unit 3 senses the distance between the carrying platform and the reference plane B.
- the data processing unit 4 can determine the flatness of the carrying platform according to the deviation between the distance sensed by the sensing unit 3 and the preset distance, and judge whether the device under test S meets the acceptance requirements through quantifiable data analysis.
- the structural form of the base 1 is not limited, and is determined according to the structure of the device S to be inspected. If the motion form of the moving part M of the device S to be tested is rotational motion, the sensing unit 3 is used to sense the angle between the moving part M and the reference plane B after the moving part M moves to the designated position P2. The deviation between the angle sensed by the measuring unit 3 and the preset angle is used to judge whether the device under test S meets the acceptance requirements.
- a test platform provided in the embodiment of the present application includes a base 1, a driving device 2, a sensing unit 3 and a data processing unit 4.
- the base 1 includes a fixing frame 11 and a reference piece 12 connected to the fixing frame 11.
- the fixing frame 11 is used to fix the device to be tested, the reference piece 12 has a reference plane B facing the moving part M of the device to be tested S;
- the driving device 2 is connected to the base 1, and the driving device 2 is used to provide power for the moving part M;
- the sensing unit 3 is arranged on the moving part M, and is used to sense the distance or angle between the moving part M and the reference plane B after the moving part M moves to the designated position P2;
- the data processing unit 4 is configured to The deviation between the set distances or the deviation between the angle and the preset angle is used to judge whether the device S to be tested meets the acceptance requirements.
- the test platform can automatically monitor the running accuracy of the equipment under test S, and perform quantifiable data analysis, which improves the test efficiency and the reliability of the
- FIG. 2 shows a schematic structural diagram of a test platform according to an embodiment of the present application
- FIG. 3 shows a graph of the running accuracy of the device under test tested by the test platform in FIG. 2 .
- the sensing unit 3 includes at least three displacement sensors 31 , and the at least three displacement sensors 31 are disposed on the plane of the moving part M facing the reference plane B side.
- the displacement sensor 31 is a distance sensor.
- the displacement sensor 31 is an angle sensor. The greater the number of displacement sensors 31, the more accurate the measured data. At least three displacement sensors 31 can determine the distance or angle between the moving part M and the reference plane B when the moving part M reaches the designated position P2, and then determine the flatness of the moving part M.
- the mean absolute value of the deviation between the distances sensed by the at least three displacement sensors 31 and the preset distance or the mean deviation between the angle and the preset angle is a
- the mean value is a.
- the deviation threshold of the device under test S is b, and if a ⁇ b, the data processing unit 4 determines that the device under test S meets the acceptance requirements.
- the device under test S is still taken as an example of a carrier device for lifting wafers for description.
- the moving part M is a liftable carrying platform.
- the carrying platform rises from the initial position P1 to the designated position P2, and then descends from the designated position P2 to the initial position P1. It is a running cycle. During this running cycle, the carrying platform is at the designated position P2.
- the distance from the reference plane B is the test distance.
- the test process will include multiple operation cycles, and the mean absolute value a of the deviation between the test distance and the preset distance sensed by the at least three displacement sensors 31 in each operation cycle is not greater than the deviation threshold b, then the data processing unit 4 It is judged that the equipment under test S meets the acceptance requirements.
- the distance deviation data curve in 5 operating cycles measured by the three displacement sensors 31 is shown.
- the distance deviations in the five operating cycles measured by the first displacement sensor 31 are respectively -0.08mm, -0.03mm, +0.02mm, -0.07mm, and -0.05mm;
- the distance deviations in the 5 running cycles are respectively +0.05mm, -0.02mm, +0.09mm, -0.10mm, +0.08mm;
- the distance deviations in the 5 running cycles measured by the third displacement sensor 31 are respectively - 0.08mm, -0.02mm, +0.095mm, -0.10mm, +0.09mm;
- the data processing unit 4 determines that the flatness of the carrying platform meets the requirements of the running accuracy, that is, the device S to be tested meets the
- the mean absolute value of deviation a ⁇ b in each operating cycle but some mean absolute values of deviation a are close to the deviation threshold b, and some mean absolute values of deviation a are far from the deviation threshold b. If the number of running cycles is more, there may be some deviation absolute value mean a that exceeds the deviation threshold b.
- the equipment accuracy index can be used to evaluate.
- the equipment accuracy index is a parameter to measure whether the machine equipment has the comprehensive accuracy to meet the production needs. It is an important data to evaluate the mutual position change of the various parts caused by the physical wear of the machine equipment. The smaller the equipment accuracy index value, the higher the accuracy. .
- the evaluation method of the equipment accuracy index is obtained by using the mathematical statistics method in the machine tool accuracy inspection, so it is often used in the evaluation of machine tool equipment. For other equipment, if quantitative standards are set for all technical quality requirements, this method can also be used to evaluate.
- the equipment accuracy index T is calculated by the following formula (1) by calculating the measured value (Tp) of each accuracy of the equipment and the specified tolerance value (Ts) within the number of measurement items (n).
- the mean absolute value of the deviation between the distances sensed by the at least three displacement sensors 31 and the preset distance or the deviation between the angle and the preset angle is a i , where 0 ⁇ i ⁇ n, i and n are natural numbers, the deviation threshold of the device under test S is b, the precision index of the moving part M is T, and
- the inventor has concluded that if T ⁇ 0.5, and the device under test S is a new device that has not been put into use, the data processing unit 4 determines that the device under test S meets the acceptance requirements of the new device.
- the data processing unit 4 judges that the equipment under test S meets the acceptance requirements of the old equipment.
- the data processing unit 4 determines that the equipment under test S meets the acceptance requirements of the old equipment within the limited service period. For example, if the equipment in normal use needs to be overhauled after one year of use, the equipment needs to be overhauled after six months of use, and its equipment accuracy index will be tested after the overhaul.
- the data processing unit 4 judges that the equipment under test S does not meet the acceptance requirements. At this time, the equipment S to be inspected needs to undergo key maintenance. If the inspection and acceptance requirements are still not met after the key maintenance, it will be discarded.
- the data processing unit 4 determines that the device to be tested S does not meet the acceptance requirements of the new device. If the device S to be tested is an old device after maintenance, the data processing unit 4 determines that the device S to be tested meets the acceptance requirements of the old device.
- the test platform further includes a first sensor 5 and a second sensor arranged on the fixing frame 11 6.
- the first sensor 5 is set corresponding to the initial position P1
- the second sensor 6 is set corresponding to the designated position P2; when the moving part M reaches the initial position P1, the first sensor 5 outputs the first electrical signal, and when the moving part M reaches the designated position At the position P2, the second sensor 6 outputs a second electrical signal.
- both the first sensor 5 and the second sensor 6 are position sensors, such as infrared sensors or photoelectric sensors arranged in pairs.
- test platform provided in the embodiment of the present application further includes a relay 7, which is electrically connected to the driving device 2, and the relay 7 turns off the driving device 2 according to the first electrical signal sent by the first sensor 5, and after a first predetermined time interval.
- the driving device 2 is started to rotate in the forward direction, the driving device 2 is turned off according to the second electrical signal sent by the second sensor 6, and the driving device 2 is started to rotate in the reverse direction after a second predetermined time interval.
- the relay 7 starts the driving device 2 to rotate in the forward direction, so that the driving device 2 drives the carrying platform to rise from the initial position P1 to the designated position P2, and then the relay 7 receives the second electrical signal sent by the second sensor 6, and turns off the driving device 2.
- the sensing unit 3 senses the distance between the carrying platform and the reference plane B, and after a second predetermined time interval, such as 1s, starts the driving device 2 to rotate in the reverse direction, and the driving device 2 drives the carrying platform to descend from the designated position P2 to the initial position P1; At this time, the relay 7 receives the first electrical signal sent by the first sensor 5, turns off the driving device 2, and completes a running cycle. After a first predetermined time interval, eg, 2 s, the driving device 2 is restarted to rotate in the forward direction, and the cycle of the next operation cycle is started.
- a first predetermined time interval eg, 2 s
- the starting and closing of the driving device 2 can be controlled continuously and orderly, the automatic control of the test process is realized, and the test efficiency is improved. Save labor costs.
- the test platform provided by the embodiment of the present application has a simple structure, is light and convenient, and is easy to operate, and can automatically monitor the running accuracy of the device S to be tested, and perform quantifiable data analysis, and can also analyze the geometric accuracy and working accuracy from the Two dimensions are used to evaluate the operation accuracy of the equipment to be inspected, which improves the test efficiency and the reliability of the test results.
- test platform provided by the embodiment of the present application can not only measure the running accuracy of the wafer carrier, but also can be used for other occasions where the equipment to be tested needs to be measured, and details are not repeated here.
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- Length Measuring Devices With Unspecified Measuring Means (AREA)
- Testing Of Devices, Machine Parts, Or Other Structures Thereof (AREA)
Abstract
L'invention concerne une plateforme de test, qui est utilisée pour contrôler la précision de fonctionnement d'un équipement (S) à tester. La plateforme de test comprend : une base (1), comportant un cadre de fixation (11) et une pièce de référence (12) reliée au cadre de fixation (11), le cadre de fixation (11) étant utilisé pour fixer l'équipement (S), et la pièce de référence (12) étant pourvue d'une surface de référence (B) faisant face à une partie mobile (M) de l'équipement (S) ; un appareil d'entraînement (2), qui est relié à la base (1) et est utilisé pour fournir de l'énergie à la partie mobile ; une unité de détection (3), qui est disposée sur la partie mobile et est utilisée pour détecter la distance ou l'angle entre la partie mobile (M) et la surface de référence (B) après que la partie mobile (M) s'est déplacée vers une position désignée (P2) ; et une unité de traitement de données (4), qui est configurée pour déterminer si l'équipement (S) répond aux exigences d'acceptation selon la déviation entre la distance détectée par l'unité de détection (3) et une distance prédéfinie ou la déviation entre l'angle et un angle prédéfini. La plateforme de test peut contrôler automatiquement la précision de fonctionnement de l'équipement (S) et effectuer une analyse de données quantifiable, de sorte que l'efficacité des tests et la fiabilité des résultats des tests sont améliorées.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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CN202120669587.0 | 2021-04-01 | ||
CN202120669587.0U CN213456087U (zh) | 2021-04-01 | 2021-04-01 | 测试平台 |
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WO2022205493A1 true WO2022205493A1 (fr) | 2022-10-06 |
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PCT/CN2021/086366 WO2022205493A1 (fr) | 2021-04-01 | 2021-04-12 | Plateforme de test |
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WO (1) | WO2022205493A1 (fr) |
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CN113433928B (zh) * | 2021-07-15 | 2022-10-11 | 上海智能网联汽车技术中心有限公司 | 适用于路侧智能云台的精度验证系统及方法 |
CN113758435A (zh) * | 2021-09-10 | 2021-12-07 | 华能新能源股份有限公司 | 一种承载板检测方法及装置 |
Citations (6)
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JP2007109861A (ja) * | 2005-10-13 | 2007-04-26 | Tokyo Seimitsu Co Ltd | プローバ及びプローバにおける回転・移動制御方法 |
US20090059198A1 (en) * | 2007-08-24 | 2009-03-05 | Nikon Corporation | Movable body drive method and movable body drive system, pattern formation method and apparatus, exposure method and apparatus, and device manufacturing method |
CN203704886U (zh) * | 2013-12-27 | 2014-07-09 | 深圳市大族激光科技股份有限公司 | 平面度光学测量设备 |
CN107883884A (zh) * | 2016-09-30 | 2018-04-06 | 上海微电子装备(集团)股份有限公司 | 一种光学测量装置和方法 |
CN207343283U (zh) * | 2017-07-04 | 2018-05-11 | 深圳市明远精密科技有限公司 | 一种面壳钢片变形度位移传感器检测设备 |
CN111998805A (zh) * | 2020-09-03 | 2020-11-27 | 厦门市三安集成电路有限公司 | 一种半导体设备的载具及平行度检测方法 |
-
2021
- 2021-04-01 CN CN202120669587.0U patent/CN213456087U/zh active Active
- 2021-04-12 WO PCT/CN2021/086366 patent/WO2022205493A1/fr active Application Filing
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2007109861A (ja) * | 2005-10-13 | 2007-04-26 | Tokyo Seimitsu Co Ltd | プローバ及びプローバにおける回転・移動制御方法 |
US20090059198A1 (en) * | 2007-08-24 | 2009-03-05 | Nikon Corporation | Movable body drive method and movable body drive system, pattern formation method and apparatus, exposure method and apparatus, and device manufacturing method |
CN203704886U (zh) * | 2013-12-27 | 2014-07-09 | 深圳市大族激光科技股份有限公司 | 平面度光学测量设备 |
CN107883884A (zh) * | 2016-09-30 | 2018-04-06 | 上海微电子装备(集团)股份有限公司 | 一种光学测量装置和方法 |
CN207343283U (zh) * | 2017-07-04 | 2018-05-11 | 深圳市明远精密科技有限公司 | 一种面壳钢片变形度位移传感器检测设备 |
CN111998805A (zh) * | 2020-09-03 | 2020-11-27 | 厦门市三安集成电路有限公司 | 一种半导体设备的载具及平行度检测方法 |
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