WO2022110366A1

WO2022110366A1 - Vapor chamber processing method and vapor chamber

Info

Publication number: WO2022110366A1
Application number: PCT/CN2020/136967
Authority: WO
Inventors: 余永水
Original assignee: 瑞声声学科技(深圳)有限公司; 瑞声科技（南京）有限公司
Priority date: 2020-11-30
Filing date: 2020-12-16
Publication date: 2022-06-02
Also published as: CN112589387A; CN112589387B

Abstract

A vapor chamber (10) processing method, comprising: providing a first cover plate (11) provided with a first groove (110) and a second cover plate (12) provided with a second groove (120); performing cold spraying on the first cover plate (11) to form a first capillary structure (15) in the first groove (110); performing cold spraying on the second cover plate (12) to form a first capillary unit (161) in the second groove (120); performing cold spraying on the first capillary unit (161) to form a second capillary unit (162) on the first capillary unit (161), the cross-sectional area of the first capillary unit (161) being larger than the cross-sectional area of the second capillary unit (162) in a direction of a hot end (101) of the vapor chamber (10) pointing to a cold end (102); covering the first cover plate (11) and the second cover plate (12) such that the first capillary structure (161) abuts against the second capillary unit (162), and fixedly connecting the first cover plate (11) to the second cover plate (12) to form a closed inner cavity (14) between the first cover plate (11) and the second cover plate (12). The vapor chamber (10) processing method can reduce the manufacturing cost of the vapor chamber (10), improve the structural strength of the vapor chamber (10), and improve the heat dissipation effect of the vapor chamber (10).

Description

Temperature chamber processing method and temperature chamber

The present invention claims the priority of the Chinese patent application with the application number 202011380493.8 and the invention titled "Processing Method of Temperature Chamber and Temperature Chamber" submitted to the China Patent Office on November 30, 2020, the entire contents of which are incorporated herein by reference invention.

technical field

The present invention relates to the technical field of heat dissipation, and in particular, to a method for processing a temperature chamber and a chamber.

Background technique

With the development of electronic and electrical technology and the improvement of user needs, various electronic products in daily life, scientific research, science and education have more and more functions and higher power, and the heat of electronic products is becoming more and more serious. Vapor chamber Chamber, VC) is an ideal solution to solve the heat dissipation problem of various electronic products.

technical problem

The temperature-spreading plate in the prior art not only has high manufacturing cost and poor heat dissipation effect, but also has insufficient structural strength, and is prone to collapse after being heated and softened during use.

technical solutions

The purpose of the present invention is to provide a low-cost vapor chamber processing method and an ultra-thin vapor chamber with higher structural strength and better heat dissipation effect.

The technical scheme of the present invention is as follows:

A method for processing a vapor chamber, the vapor chamber has a hot end in contact with a heat source, a cold end away from the heat source, and a first direction from the hot end to the cold end and perpendicular to the first direction The second direction is characterized in that, the method comprises the following steps:

The cover plate providing step: providing a first cover plate and a second cover plate, the first cover plate is provided with a first groove, and the second cover plate is provided with a second groove;

The first capillary structure processing step: cold spraying the first cover plate to form a first capillary structure in the first groove;

The first capillary unit processing step: cold-spraying the second cover plate to form a first capillary unit in the second groove;

The second capillary unit processing step: performing cold spraying on the first capillary unit to form a second capillary unit on the first capillary unit, and the cross-sectional area of the second capillary unit along the second direction is smaller than the the cross-sectional area of the first capillary unit along the second direction;

The cover plate covering step: cover the first cover plate and the second cover plate to make the first capillary structure abut the second capillary unit, and connect the first cover plate with the second capillary unit. The second cover plate is fixedly connected to form a closed inner cavity between the first cover plate and the second cover plate, and the closed inner cavity is used for accommodating the first capillary structure, the first capillary structure and the second cover plate. A capillary unit and the second capillary unit and a cooling medium.

Preferably, the first capillary structure processing step includes: cold spraying the first cover plate at a first feeding speed and a first spraying pressure, so that the first capillary structure is attached to the first capillary structure The bonding force of the cover plate is greater than or equal to 40 MPa and less than or equal to 60 MPa; the first capillary unit processing step includes: performing cold spraying on the second cover plate at a second feeding speed and a second spraying pressure, to The binding force of the first capillary unit to be attached to the second cover plate is greater than or equal to 40 MPa and less than or equal to 60 MPa.

Preferably, the spraying media for cold spraying the first cover plate and the second cover plate are copper powder particles, and the particle size of the copper powder particles is greater than or equal to 20 microns and less than or equal to 50 microns , before the first capillary structure processing step and/or the first capillary unit processing step, further comprising: chemically etching the copper powder particles to increase the surface roughness of the copper powder particles.

Preferably, the first cover plate has a first surface, the first surface is recessed into the first cover plate to form the first groove, and the first capillary structure processing step includes: A cover plate is fixed and a first baffle is placed on the first cover plate to block the part of the first surface other than the first groove; the first surface is subjected to plane scanning cold spraying, In order to form the first capillary structure in the first groove, the thickness of the first capillary structure is less than or equal to the depth of the first groove.

Preferably, the thickness of the first capillary structure is greater than or equal to 0.02 mm and less than or equal to 0.05 mm.

Preferably, the second cover plate has a second surface, the second surface is recessed into the second cover plate to form the second groove, and the first capillary unit processing step includes: Two cover plates are fixed and a second baffle plate is placed on the second cover plate to block the part of the second surface other than the second groove; the second surface is subjected to plane scanning cold spraying, In order to form the first capillary unit in the second groove, the thickness of the first capillary unit is less than or equal to the depth of the second groove.

Preferably, the thickness of the first capillary unit is greater than or equal to 0.02 mm and less than or equal to 0.05 mm.

Preferably, the step of processing the second capillary unit includes: performing cold spraying on the first capillary unit along the first direction, so as to form a plurality of the second capillary units spaced from each other on the first capillary unit Units, a plurality of the second capillary units are arranged in an array along the first direction or each of the second capillary units extends along the first direction and adjacent to the second capillary units along the second The directions are set at intervals, and the thickness of the second capillary unit satisfies the relationship: D3=H1+H2-D1-D2, wherein H1 is the depth of the first groove, H2 is the depth of the second groove, D1 The thickness of the first capillary structure, D2 is the thickness of the first capillary unit, and D3 is the thickness of the second capillary unit.

Preferably, before the step of providing the cover plate, it further includes: providing a first substrate and a second substrate; and performing deep drawing or etching on the first substrate to form the first substrate on the first substrate a groove, the first cover plate is formed after the first substrate is deep-drawn or etched; the second substrate is deep-drawn or etched to form the second groove on the second substrate, The second cover plate is formed after the second substrate is deep-drawn or etched; wherein the depth of the first groove is smaller than the depth of the second groove.

Preferably, the step of covering the cover plate includes: forming the first groove in the first cover plate on a surface other than the first groove and/or in the second cover plate A glue layer is applied to the part other than the second groove on the side where the second groove is formed; and the side where the second groove is formed in the second cover plate is covered with the first cover One side of the plate where the first groove is formed, so that the first capillary structure and the second capillary unit abut; apply pressure to the first cover plate and the second cover plate and keep the preset The time period is long, so that the first cover plate and the second cover plate are bonded through the glue layer.

Preferably, the material of the first cover plate is copper or copper alloy, and the material of the second cover plate is stainless steel or titanium alloy.

A temperature chamber, the temperature chamber has a hot end in contact with a heat source, a cold end away from the heat source, a first direction from the hot end to the cold end, and a second direction perpendicular to the first direction. Two directions, characterized in that the temperature chamber includes:

a first cover plate, the first cover plate has a first surface, and the first surface is provided with a first capillary structure by means of cold spraying;

A second cover plate, the second cover plate has a second surface, the second surface is provided with a second capillary structure by means of cold spraying, and the second capillary structure includes a direction along the second cover plate toward the A first layer and a second layer are stacked in the direction of the first cover plate, the first layer includes a first capillary unit having the same structure as the first capillary structure, and the second layer includes a plurality of capillary units along the second capillary units arranged at intervals in the second direction, the second capillary units are arranged parallel to the first direction;

The first surface is covered with the second surface, and the first cover plate and the second cover plate are fixedly connected, so that the first cover plate and the second cover plate are formed A closed inner cavity, wherein the first capillary structure abuts the second capillary unit.

Preferably, the second capillary unit includes a plurality of capillary monomers spaced along the first direction, and the plurality of the capillary monomers in the adjacent second capillary units are arranged in an array.

Preferably, the first cover plate is provided with a first groove, the first groove is formed by the first surface concave to the inside of the first cover plate, and the first capillary structure is disposed on the first cover plate. In a groove, and the thickness of the first capillary structure is less than or equal to the depth of the first groove; the second cover plate is provided with a second groove, and the second groove is formed by the second groove. The surface is recessed toward the inside of the second cover plate, the second capillary structure is arranged in the second groove, the thickness of the first capillary unit is less than or equal to the depth of the first groove, the The thickness of the second capillary unit satisfies the relationship: D3=H1+H2-D1-D2, H1 is the depth of the first groove, H2 is the depth of the second groove, D1 is the thickness of the first capillary structure , D2 is the thickness of the first capillary unit, and D3 is the thickness of the second capillary unit.

beneficial effect

The beneficial effect of the present invention is that the first capillary structure is directly formed on the first cover plate, and the first capillary unit and the second capillary unit are formed on the second cover plate by means of cold spraying, which avoids the traditional processing of the temperature chamber. The high-temperature sintering process in the process makes the processing technology of the vapor chamber simpler, reduces the manufacturing cost of the vapor chamber, and enables the thickness of the vapor chamber to be less than 0.35mm, realizing ultra-thinning of the vapor chamber; , the first capillary structure on the first cover abuts against the second capillary unit on the second cover, and the second capillary unit acts as a pillar between the first cover and the second cover while exerting capillary action, On the one hand, the capillary action is enhanced to improve the heat dissipation effect of the temperature equalizing plate;

Description of drawings

In order to illustrate the technical solutions in the present invention more clearly, the following briefly introduces the accompanying drawings used in the description of the embodiments. Obviously, the drawings in the following description are only some embodiments of the present invention, and other drawings can also be obtained according to these drawings without any creative effort.

1 is a first schematic flow chart of a method for processing a vapor chamber provided by an embodiment of the present invention;

2 is a second schematic flow chart of the method for processing a vapor chamber provided by an embodiment of the present invention;

3 is a schematic structural diagram of a vapor chamber provided in an embodiment of the invention;

Fig. 4 is the explosion structure diagram of the vapor chamber shown in Fig. 3;

FIG. 5 is a cross-sectional view of the vapor chamber shown in FIG. 3 along the P-P direction;

Fig. 6 is a partial enlarged view of part A in Fig. 5;

FIG. 7 is another structural schematic diagram of the second cover plate in the vapor chamber shown in FIG. 4 .

Embodiments of the present invention

The technical solutions in the present invention will be clearly and completely described below with reference to the accompanying drawings in the present invention. Obviously, the described embodiments are only some, but not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative work fall within the protection scope of the present invention.

Please refer to FIG. 1 . FIG. 1 is a schematic flow chart of a first method for processing a vapor chamber provided by an embodiment of the present invention. The vapor chamber has a hot end in contact with the heat source and a cold end away from the heat source, the direction from the hot end to the cold end is the first direction, and the direction perpendicular to the first direction is the second direction. The temperature chamber processing method includes:

101, the step of providing a cover plate: providing a first cover plate and a second cover plate, the first cover plate is provided with a first groove, and the second cover plate is provided with a second groove.

The first cover plate is close to the heat source, and the material of the first cover plate can be a metal with good thermal conductivity such as copper or copper alloy, so that the heat source can conduct heat to the temperature equalizing plate through the first cover plate. The first substrate can be formed by cutting or die-casting a copper plate or copper alloy plate, and then deep drawing or etching the first substrate to form the first grooves, thereby obtaining the first cover plate provided with the first grooves.

The second cover plate is far away from the heat source, and the material of the second cover plate can be a metal with high strength such as stainless steel or titanium alloy, so as to improve the strength of the plate body of the uniform temperature plate. The second substrate can be formed by cutting or die casting a stainless steel plate or a titanium gold plate, and then deep drawing or etching the second substrate to form the second groove, thereby obtaining the second cover plate provided with the second groove.

The depth of the first groove is smaller than the depth of the second groove, and the sizes of the notch of the first groove and the notch of the second groove can be set according to requirements. For example, the size of the notch of the first groove and the notch of the second groove are equal, so that when the first cover plate and the second cover plate are covered, the groove wall of the first groove and the groove of the second groove connected to the wall. For another example, the size of the notch of the first groove is different from that of the second groove, and the notch of the first groove is larger than the notch of the second groove, so that the first cover plate and the second cover plate are in the same size. When the cover is closed, the groove wall of the first groove abuts the outer side of the second cover plate, thereby ensuring that a closed inner cavity can be formed between the first cover plate and the second cover plate.

102 , the first capillary structure processing step: performing cold spraying on the first cover plate to form a first capillary structure in the first groove.

Before cold spraying the first cover plate, various parameters of the cold spraying of the first cover plate can be adjusted according to the processing needs and the material of the first cover plate. The cover plate is cold sprayed to ensure that the bonding force of the first capillary structure on the first cover plate is greater than or equal to 40 MPa and less than or equal to 60 MPa. The bonding force of the first capillary structure to the first cover plate is controlled at 40MPa-60MPa, on the one hand, it can avoid the deformation of the first cover plate caused by excessive spraying pressure, and on the other hand, it can meet the bonding strength and increase the first capillary Capillary suction of the structure.

103, the first capillary unit processing step: performing cold spraying on the second cover plate to form the first capillary unit in the second groove.

Before cold spraying the second cover plate, various parameters of cold spraying the second cover plate can be adjusted according to the processing needs and the material of the second cover plate. The cover plate is cold sprayed to ensure that the bonding force between the first capillary unit and the second cover plate is greater than or equal to 40 MPa and less than or equal to 60 MPa. The bonding force between the first capillary unit and the second cover plate is controlled at 40MPa-60MPa. On the one hand, it can avoid the deformation of the second cover plate caused by excessive spraying pressure, and on the other hand, it can meet the bonding strength and increase the first capillary at the same time. Capillary suction of the unit.

It can be understood that when cold spraying is performed, under the premise that the cover plate is not deformed, the bonding force of the spray medium that can be endured by the cover plate of different materials may be different. Therefore, in order to control the bonding force between the first capillary structure and the first cover plate at 40MPa-60MPa, and the bonding force between the first capillary unit and the second cover plate at 40MPa-60MPa, the first feed speed Unlike the second feed rate, the first spray pressure and the second spray pressure may also be different.

104, the second capillary unit processing step: performing cold spraying on the first capillary unit to form a second capillary unit on the first capillary unit, the cross-sectional area of the second capillary unit along the first direction is smaller than that of the first capillary unit along the first direction direction cross-sectional area;

The spraying medium for cold spraying the first cover plate and the second cover plate may be copper powder particles, the copper powder particles may be spherical, and the particle size of the copper powder particles is greater than or equal to 20 microns and less than or equal to 50 microns. Before the copper powder particles are cold-sprayed on the first cover plate and the second cover plate, the copper powder particles can be chemically corroded to increase the surface roughness of the copper powder particles, thereby further increasing the first capillary structure and the first capillary structure. Capillary suction of the unit and the second capillary unit.

It should be noted that the copper powder particles may also be elongated. For example, the copper powder particles can be cylindrical. For another example, the copper powder particles may also be prisms such as cubes or rectangular parallelepipeds. For another example, the copper powder particles may also be irregular cylinders. The specific shape of the copper powder particles is not limited in the embodiment of the present invention.

105, the cover plate covering step: cover the first cover plate and the second cover plate to make the first capillary structure abut the second capillary unit, and fix the first cover plate and the second cover plate to A closed inner cavity is formed between the first cover plate and the second cover plate.

The first cover plate and the second cover plate may be bonded with super glue. Specifically: firstly, the part of the first cover plate on which the first groove is formed except the first groove and/or the part of the second cover plate with the second groove formed on the side except the second groove Coat the glue layer; before the glue layer is air-dried, cover the side where the second groove is formed in the second cover to the side where the first groove is formed in the first cover, that is, the first cover is coated with One side of the glue layer, so that the first capillary structure and the second capillary unit abut; apply a certain pressure to the first cover plate and the second cover plate and keep it for a preset time, and remove the pressure after the glue layer is air-dried to make the first cover plate and the second cover plate. A cover plate and a second cover plate are bonded together by a glue layer, so that a closed inner cavity is formed between the first cover plate and the second cover plate. Wherein, the preset duration is not shorter than the duration required for air drying of the glue layer, and the closed inner cavity is used for accommodating the first capillary structure, the first capillary unit, the second capillary unit and the cooling medium of the temperature equalizing plate.

It should be noted that the cooling medium is a liquid phase change material, such as liquid water, ethanol, and acetone. Through the transformation process of the cooling medium from liquid to gas and then to liquid, the heat is quickly dissipated, so as to exert the heat dissipation effect of the vapor chamber. In order to ensure that the transformation process of the cooling medium from liquid to gas to liquid will not be affected by impurities, the closed inner cavity is generally in a vacuum state, thereby improving the heat dissipation effect of the vapor chamber.

In the embodiment of the present invention, the first capillary structure is directly formed on the first cover plate, and the first capillary unit and the second capillary unit are formed on the second cover plate by means of cold spraying, which avoids the traditional processing process of the temperature chamber. The high-temperature sintering process in the medium makes the processing technology of the vapor chamber simpler, reduces the manufacturing cost of the vapor chamber, and enables the thickness of the vapor chamber to be less than 0.35mm, realizing ultra-thinning of the vapor chamber; at the same time, The first capillary structure on the first cover plate is in contact with the second capillary unit on the second cover plate, and the second capillary unit acts as a support between the first cover plate and the second cover plate while exerting capillary action. On the one hand, the capillary action is enhanced, and the heat dissipation effect of the temperature equalizing plate is improved;

Please refer to FIG. 2 . FIG. 2 is a schematic flowchart of a second method for processing a vapor chamber provided by an embodiment of the present invention. The vapor chamber has a hot end in contact with the heat source and a cold end away from the heat source, the direction from the hot end to the cold end is the first direction, and the direction perpendicular to the first direction is the second direction. The method for processing the vapor chamber comprises the following steps:

201. Provide a first cover plate and a second cover plate, the first cover plate is provided with a first groove, and the second cover plate is provided with a second groove.

Wherein, the depth of the first groove is smaller than the depth of the second groove, and the size of the notch of the first groove and the notch of the second groove can be set according to requirements. For example, the size of the notch of the first groove and the notch of the second groove are equal, so that when the first cover plate and the second cover plate are covered, the groove wall of the first groove and the groove of the second groove connected to the wall. For another example, the size of the notch of the first groove is different from that of the second groove, and the notch of the first groove is larger than the notch of the second groove, so that the first cover plate and the second cover plate are in the same size. When the cover is closed, the groove wall of the first groove abuts the outer side of the second cover plate, thereby ensuring that a closed inner cavity can be formed between the first cover plate and the second cover plate.

202 , fixing the first cover plate and placing a first baffle plate on the first cover plate to block the part other than the first groove on the first surface.

The first cover plate has a first surface, and the first surface is recessed into the inside of the first cover plate to form a first groove. When securing the first cover plate, the first surface can be directed towards the spray gun for cold spraying the first cover plate. The shape of the first baffle can be the same as the shape of the first surface, and the shape of the first baffle can also be different from the shape of the first surface, as long as the first baffle is provided with a notch with the same shape as the first groove. through holes. The first baffle plate is placed on the first surface and fixed, and the first baffle plate can block the part of the first surface except the first groove.

203 , performing plane scanning cold spraying on the first surface to form a first capillary structure in the first groove.

The first surface is cold-sprayed by plane scanning, and a layer of uniform copper powder particles is formed in the first groove, and the layer of copper powder particles constitutes a first capillary structure. At the same time, due to the shielding of the first baffle, the part of the first surface other than the first groove will not be sprayed with copper powder particles. Wherein, the thickness of the first capillary structure is greater than or equal to 0.02 mm and less than or equal to 0.05 mm, the thickness of the first capillary structure is less than or equal to the depth of the first groove, that is, 0.02mm≤D1≤H1≤0.05mm, D1 is the first capillary The thickness of the structure, H1 is the depth of the first groove.

204 , fixing the second cover plate and placing a second baffle plate on the second cover plate to block the part other than the second groove on the second surface.

The second cover plate has a second surface, and the second surface is recessed into the second cover plate to form a second groove. When securing the second cover, the second surface may be oriented towards the spray gun for cold spraying the second cover. The shape of the second baffle can be the same as the shape of the second surface, and the shape of the second baffle can also be different from the shape of the second surface, as long as the second baffle has a notch with the same shape as the second groove through holes. The second baffle plate is placed on the second surface and fixed, and the second baffle plate can block the part of the second surface except the second groove.

205. Perform plane scanning cold spraying on the second surface to form a first capillary unit in the second groove.

The second surface is cold-sprayed by plane scanning, and a layer of uniform copper powder particles is formed in the second groove, and the layer of copper powder particles constitutes the first capillary unit. At the same time, due to the shielding of the second baffle, the part of the second surface other than the second groove will not be sprayed with copper powder particles. Wherein, the thickness of the first capillary unit is greater than or equal to 0.02 mm and less than or equal to 0.05 mm, and the thickness of the first capillary unit is less than or equal to the depth of the first groove, that is, 0.02mm≤D2≤H1≤0.05mm, D2 is the first capillary The thickness of the cell, H1 is the depth of the first groove.

206 , cold-spraying the first capillary unit along the first direction to form a plurality of second capillary units spaced apart from each other on the first capillary unit.

When performing cold spraying on the first capillary unit, in order to form a plurality of second capillary units spaced apart from each other, the plane scanning method cannot be used to perform cold spraying.

In some embodiments, the second capillary unit is an elongated structure parallel to the first direction. At this time, the first capillary unit can be continuously cold-sprayed along the first direction until the first second capillary unit is formed; The first capillary unit is continuously cold-sprayed in the opposite direction in one direction until the second second capillary unit is formed... and the cycle repeats. Wherein, a plurality of second capillary units are arranged side by side along the second direction, the distance between two adjacent second capillary units is the above-mentioned first preset distance, and the first preset distance and one second capillary unit along the The difference between the widths in the second direction is controlled within a certain range, so that the first preset distance is approximately equal to the width of one second capillary unit along the second direction, so that the widths of the plurality of second capillary units along the first direction are The total cross-sectional area is about half of the cross-sectional area of the first capillary element along the first direction.

In some embodiments, the second capillary unit includes a plurality of capillary monomers spaced along the first direction. At this time, the first capillary unit can be intermittently cold-sprayed along the first direction until a second capillary unit is formed; then, after the spray gun for cold spraying is moved along the second direction by a second preset distance, the first capillary unit is moved along the first direction. The first capillary unit is intermittently cold sprayed in the opposite direction until the second second capillary unit is formed... This cycle repeats. Wherein, the total cross-sectional area of the plurality of second capillary units along the first direction is about half of the cross-sectional area of the first capillary units along the first direction, and the plurality of capillary monomers in adjacent second capillary units are in an array Arrange.

In the embodiment of the present invention, the thickness of the second capillary unit satisfies the relationship: D3=H1+H2-D1-D2, where H1 is the depth of the first groove, H2 is the depth of the second groove, and D1 is the first capillary structure The thickness of , D2 is the thickness of the first capillary unit, and D3 is the thickness of the second capillary unit.

207. Coat a glue layer on the first surface except for the first groove.

It should be noted that the glue layer can also be applied to the first surface except the first groove and the second surface except the second groove at the same time, so that both the first surface and the second surface have viscosity.

208, cover the second surface to the first surface, so that the first capillary structure and the second capillary unit abut.

209. Apply pressure to the first cover plate and the second cover plate for a preset time period, so that the first cover plate and the second cover plate are bonded through the glue layer.

It should be noted that the preset duration is not shorter than the duration required for air-drying of the glue layer. After the first cover plate and the second cover plate are bonded, a closed inner cavity is formed between the first cover plate and the second cover plate. The closed inner cavity is used for accommodating the first capillary structure, the first capillary unit, the second capillary unit and the cooling medium of the vapor chamber.

In the embodiment of the present invention, the first capillary structure is directly formed on the first cover plate, and the first capillary unit and the second capillary unit are formed on the second cover plate by means of cold spraying, which avoids the traditional processing process of the temperature chamber. The high-temperature sintering process in the medium makes the processing technology of the vapor chamber simpler, reduces the manufacturing cost of the vapor chamber, and enables the thickness of the vapor chamber to be less than 0.35mm, realizing ultra-thinning of the vapor chamber; at the same time, The first capillary structure on the first cover plate is in contact with the second capillary unit on the second cover plate, and the second capillary unit acts as a support between the first cover plate and the second cover plate while exerting capillary action. On the one hand, the capillary action is enhanced, and on the other hand, the structural strength of the first cover plate and the second cover plate is strengthened, so that the plate body is not prone to depression during use; in addition, the first capillary structure and the first capillary unit are both One surface is in contact with the cooling medium, and all sides of the second capillary unit are in contact with the cooling medium, which increases the contact area between the capillary structure and the cooling medium, thereby increasing the capillary force and improving the heat dissipation effect of the vapor chamber .

Hereinafter, the vapor chamber will be described from a structural point of view.

Please refer to FIG. 3 , FIG. 4 , FIG. 5 and FIG. 6 . FIG. 3 is a schematic structural diagram of a vapor chamber provided by an embodiment of the invention, FIG. 4 is an exploded structure diagram of the vapor chamber shown in FIG. 3 , and FIG. Figure 6 is a partial enlarged view of part A in Figure 5 . The vapor chamber 10 has a hot end 101 in contact with the heat source and a cold end 102 away from the heat source. The direction from the hot end 101 to the cold end 102 is the first direction F1, and the direction perpendicular to the first direction F1 is the second direction F2. The vapor chamber 10 includes a first cover plate 11 , a second cover plate 12 and a cooling medium 13 . The cooling medium 13 is filled in the closed inner cavity 14 between the first cover plate 11 and the second cover plate 12 .

The first cover plate 11 is close to the heat source. The material of the first cover plate 11 can be a metal with good thermal conductivity such as copper or copper alloy, so that the heat source can conduct heat to the temperature equalizing plate 10 through the first cover plate 11 . The first cover plate 11 has a first surface 111 , and the first surface 111 is recessed into the first cover plate 11 to form a first groove 110 . A first capillary structure 15 is formed on the first cover plate 11 by cold spraying, and the first capillary structure 15 is disposed in the first groove 110 . Wherein, the thickness of the first capillary structure 15 is greater than or equal to 0.02 mm and less than or equal to 0.05 mm, and the thickness of the first capillary structure 15 is less than or equal to the depth of the first groove 110, that is, 0.02mm≤D1≤H1≤0.05mm, and D1 is For the thickness of the first capillary structure 15 , H1 is the depth of the first groove 110 .

The second cover plate 12 is far away from the heat source. The material of the second cover plate 12 may be a metal with relatively high strength such as stainless steel or titanium alloy, so as to improve the strength of the plate body of the temperature equalizing plate 10 . The second cover plate has a second surface 121 , and the second surface 121 is recessed into the second cover plate 12 to form a second groove 120 . A second capillary structure 16 is formed on the second cover plate 12 by cold spraying, and the second capillary structure 16 is disposed in the second groove 120 .

Wherein, the second capillary structure 16 includes a first layer and a second layer stacked along the direction of the second cover plate 12 toward the first cover plate 11 , and the first layer includes a first capillary structure having the same structure as the first capillary structure 15 . The unit 161, the second layer includes a plurality of second capillary units 162 arranged at intervals along the second direction F2, and the second capillary units 162 are arranged parallel to the first direction F1. The thickness of the first capillary unit 161 is greater than or equal to 0.02 mm and less than or equal to 0.05 mm, and the thickness of the first capillary unit 161 is less than or equal to the depth of the second groove 110, that is, 0.02mm≤D2≤H2≤0.05mm, D2 is the first The thickness of the capillary unit 161, H1 is the depth of the first groove 110; the depth of the first groove 110 is less than the depth of the second groove 120, that is, H1<H2, H2 is the depth of the second groove 120; the second capillary The thickness of the unit 162 satisfies the relationship: D3=H1+H2-D1-D2, and D3 is the thickness of the second capillary unit 162 .

In some embodiments, as shown in FIG. 4 . The second capillary unit 162 is a continuous strip-shaped structure along the first direction F1 , and a plurality of strip-shaped second capillary units 162 are arranged side by side along the second direction F2 to form the second layer of the second capillary structure 16 .

In some embodiments, as shown in FIG. 7 , FIG. 7 is another structural schematic diagram of the second cover plate in the vapor chamber shown in FIG. 4 . The second capillary structure 162 includes a plurality of capillary monomers 1620 arranged at intervals along the first direction F1, the plurality of capillary monomers 1620 are arranged side by side along the first direction F1 to form a second capillary unit 162, and the plurality of second capillary units 162 are arranged along the first direction F1. The second layers forming the second capillary structure 16 are arranged side by side in the second direction F2. The plurality of capillary cells 1620 in adjacent second capillary units 162 are arranged in an array, and the distance between two adjacent capillary cells 1620 in one second capillary cell 162 is the same.

A glue layer 17 is coated on the first surface 111 of the first cover plate 11 except for the first grooves 110 . The first surface 111 is covered with the second surface 121, and the first cover plate 11 and the second cover plate 12 are bonded by the glue layer 17, so that the first groove 110 and the second groove 120 are formed on the first cover. A closed inner cavity 14 between the plate 11 and the second cover plate 12 . The cooling medium 13 , the first capillary structure 15 , the first capillary unit 161 and the second capillary unit 162 are all accommodated in the closed cavity 14 , and the first capillary structure 15 abuts against the second capillary unit 162 .

The above are only the embodiments of the present invention. It should be pointed out that for those of ordinary skill in the art, improvements can be made without departing from the inventive concept of the present invention, but these belong to the present invention. scope of protection.

Claims

A method for processing a vapor chamber, the vapor chamber has a hot end in contact with a heat source, a cold end away from the heat source, and a first direction from the hot end to the cold end and perpendicular to the first direction The second direction is characterized in that, the method comprises the following steps:

The cover plate providing step: providing a first cover plate and a second cover plate, the first cover plate is provided with a first groove, and the second cover plate is provided with a second groove;

The first capillary structure processing step: cold spraying the first cover plate to form a first capillary structure in the first groove;

The first capillary unit processing step: cold-spraying the second cover plate to form a first capillary unit in the second groove;

The second capillary unit processing step: performing cold spraying on the first capillary unit to form a second capillary unit on the first capillary unit, and the cross-sectional area of the second capillary unit along the second direction is smaller than the the cross-sectional area of the first capillary unit along the second direction;

The cover plate covering step: cover the first cover plate and the second cover plate to make the first capillary structure abut the second capillary unit, and connect the first cover plate with the second capillary unit. The second cover plate is fixedly connected to form a closed inner cavity between the first cover plate and the second cover plate, and the closed inner cavity is used for accommodating the first capillary structure, the first capillary structure and the second cover plate. A capillary unit and the second capillary unit and the cooling medium of the vapor chamber.
The method for processing a vapor chamber according to claim 1, wherein:

The first capillary structure processing step includes: cold spraying the first cover plate at a first feed speed and a first spray pressure, so that the first capillary structure is attached to the first cover plate. The binding force is greater than or equal to 40 MPa and less than or equal to 60 MPa;

The first capillary unit processing step includes: cold spraying the second cover plate at a second feed speed and a second spray pressure, so that the first capillary unit is attached to the second cover plate. The binding force is greater than or equal to 40 MPa and less than or equal to 60 MPa.
The method for processing a vapor chamber according to claim 1, wherein the spraying medium for cold spraying the first cover plate and cold spraying the second cover plate are copper powder particles, and the copper The particle size of the powder particles is greater than or equal to 20 microns and less than or equal to 50 microns, before the first capillary structure processing step and/or the first capillary unit processing step, further comprising:

The copper powder particles are chemically etched to increase the surface roughness of the copper powder particles.
The method for processing a vapor chamber according to claim 1, wherein the first cover plate has a first surface, and the first surface is recessed into the first cover plate to form the first groove, The first capillary structure processing step includes:

Fixing the first cover plate and placing a first baffle plate on the first cover plate to block the part of the first surface other than the first groove;

The first surface is subjected to plane scanning cold spraying to form the first capillary structure in the first groove, and the thickness of the first capillary structure is less than or equal to the depth of the first groove.
The method for processing a vapor chamber according to claim 4, wherein the thickness of the first capillary structure is greater than or equal to 0.02 mm and less than or equal to 0.05 mm.
The method for processing a vapor chamber according to claim 1, wherein the second cover plate has a second surface, and the second surface is recessed into the second cover plate to form the second groove, The first capillary unit processing step includes:

Fixing the second cover plate and placing a second baffle plate on the second cover plate to block the part other than the second groove on the second surface;

The second surface is subjected to plane scanning cold spraying to form the first capillary unit in the second groove, and the thickness of the first capillary unit is less than or equal to the depth of the second groove.
The method for processing a vapor chamber according to claim 6, wherein the thickness of the first capillary unit is greater than or equal to 0.02 mm and less than or equal to 0.05 mm.
The method for processing a vapor chamber according to claim 6, wherein the second capillary unit processing step comprises:

cold spraying the first capillary unit along the first direction to form a plurality of the second capillary units spaced from each other on the first capillary unit, a plurality of the second capillary units along the The first direction is arranged in an array or each of the second capillary units extends along the first direction and the adjacent second capillary units are arranged at intervals along the second direction, and the thickness of the second capillary units satisfies Relationship: D3=H1+H2-D1-D2, where H1 is the depth of the first groove, H2 is the depth of the second groove, D1 is the thickness of the first capillary structure, and D2 is the The thickness of the first capillary unit, D3, is the thickness of the second capillary unit.
The method for processing a vapor chamber according to any one of claims 1 to 8, wherein before the step of providing the cover plate, the method further comprises:

providing a first substrate and a second substrate;

performing deep drawing or etching on the first substrate to form the first groove on the first substrate, and forming the first cover plate after the first substrate is deep drawn or etched;

performing deep drawing or etching on the second substrate to form the second groove on the second substrate, and the second cover plate is formed after the second substrate is deep drawn or etched;

Wherein, the depth of the first groove is smaller than the depth of the second groove.
The method for processing a vapor chamber according to any one of claims 1 to 8, wherein the step of covering the cover plate comprises:

On the side of the first cover plate on which the first groove is formed, the part other than the first groove and/or on the side of the second cover plate on which the second groove is formed The part other than the second groove is coated with a glue layer;

Covering the side of the second cover plate on which the second groove is formed to the side of the first cover plate on which the first groove is formed, so that the first capillary structure and the second The capillary units are in contact with each other;

Pressure is applied to the first cover plate and the second cover plate for a predetermined period of time, so that the first cover plate and the second cover plate are bonded through the glue layer.
The method according to any one of claims 1-8, wherein the material of the first cover plate is copper or copper alloy, and the material of the second cover plate is stainless steel or titanium alloy.
A temperature chamber, the temperature chamber has a hot end in contact with a heat source, a cold end away from the heat source, a first direction from the hot end to the cold end, and a second direction perpendicular to the first direction. Two directions, characterized in that the temperature chamber includes:

a first cover plate, the first cover plate has a first surface, and the first surface is provided with a first capillary structure by means of cold spraying;

a second cover plate, the second cover plate has a second surface, the second surface is provided with a second capillary structure by means of cold spraying, and the second capillary structure includes a direction along the second cover plate toward the A first layer and a second layer are stacked in the direction of the first cover plate, the first layer includes a first capillary unit having the same structure as the first capillary structure, and the second layer includes a plurality of capillary units along the second capillary units arranged at intervals in the second direction, the second capillary units are arranged parallel to the first direction;

The first surface is covered with the second surface, and the first cover plate and the second cover plate are fixedly connected, so that the first cover plate and the second cover plate are formed A closed inner cavity, wherein the first capillary structure abuts the second capillary unit.
The vapor chamber according to claim 12, wherein the second capillary unit comprises a plurality of capillary monomers spaced along the first direction, and a plurality of adjacent second capillary units The capillary monomers are arranged in an array.
The temperature equalizing plate according to claim 13, wherein the first cover plate is provided with a first groove, and the first groove is formed by the first surface concave to the inside of the first cover plate , the first capillary structure is arranged in the first groove, and the thickness of the first capillary structure is less than or equal to the depth of the first groove; the second cover plate is provided with a second groove , the second groove is formed by the depression of the second surface to the inside of the second cover plate, the second capillary structure is arranged in the second groove, and the thickness of the first capillary unit is less than or Equal to the depth of the first groove, the thickness of the second capillary unit satisfies the relationship: D3=H1+H2-D1-D2, wherein, H1 is the depth of the first groove, H2 is the second The depth of the groove, D1 is the thickness of the first capillary structure, D2 is the thickness of the first capillary unit, and D3 is the thickness of the second capillary unit.