CN109411431A - A kind of heat exchange structure and preparation method thereof - Google Patents
A kind of heat exchange structure and preparation method thereof Download PDFInfo
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- CN109411431A CN109411431A CN201811424910.7A CN201811424910A CN109411431A CN 109411431 A CN109411431 A CN 109411431A CN 201811424910 A CN201811424910 A CN 201811424910A CN 109411431 A CN109411431 A CN 109411431A
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- heat exchange
- floor
- exchange structure
- preparation
- substrate
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- 238000002360 preparation method Methods 0.000 title claims abstract description 16
- 229910052751 metal Inorganic materials 0.000 claims abstract description 35
- 239000002184 metal Substances 0.000 claims abstract description 35
- 239000000758 substrate Substances 0.000 claims abstract description 35
- 238000003801 milling Methods 0.000 claims abstract description 20
- 238000000034 method Methods 0.000 claims abstract description 16
- 238000012545 processing Methods 0.000 claims abstract description 6
- 239000000843 powder Substances 0.000 claims description 23
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 5
- 229910052802 copper Inorganic materials 0.000 claims description 5
- 239000010949 copper Substances 0.000 claims description 5
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 4
- 239000007787 solid Substances 0.000 claims description 4
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 239000007789 gas Substances 0.000 claims description 3
- 239000001257 hydrogen Substances 0.000 claims description 3
- 229910052739 hydrogen Inorganic materials 0.000 claims description 3
- 238000005245 sintering Methods 0.000 claims description 3
- 239000004411 aluminium Substances 0.000 claims description 2
- 229910052782 aluminium Inorganic materials 0.000 claims description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 2
- 239000010931 gold Substances 0.000 claims description 2
- 229910052737 gold Inorganic materials 0.000 claims description 2
- 239000007769 metal material Substances 0.000 claims description 2
- 229910001220 stainless steel Inorganic materials 0.000 claims description 2
- 239000010935 stainless steel Substances 0.000 claims description 2
- 238000004506 ultrasonic cleaning Methods 0.000 claims 1
- 238000009835 boiling Methods 0.000 abstract description 13
- 239000007788 liquid Substances 0.000 abstract description 5
- 238000001704 evaporation Methods 0.000 abstract description 2
- 230000008020 evaporation Effects 0.000 abstract description 2
- 239000010408 film Substances 0.000 abstract description 2
- 239000010409 thin film Substances 0.000 abstract description 2
- 238000012546 transfer Methods 0.000 description 10
- 150000001875 compounds Chemical class 0.000 description 7
- 238000010586 diagram Methods 0.000 description 4
- 229910002804 graphite Inorganic materials 0.000 description 4
- 239000010439 graphite Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 3
- 238000004140 cleaning Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 238000011161 development Methods 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 230000002708 enhancing effect Effects 0.000 description 2
- 238000009834 vaporization Methods 0.000 description 2
- 230000008016 vaporization Effects 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 239000003673 groundwater Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000002791 soaking Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention discloses a kind of heat exchange structures, including the rib array group arranged in parallel on metal substrate and substrate.Invention additionally discloses the methods for preparing above-mentioned heat exchange structure, comprising steps of processing rib array group arranged in parallel on metallic substrates；By the method for numerical control milling, is processed downwards on the inside of the top edge of floor with micro- milling cutter, inner groovy is processed on side, obtains heat exchange structure.The present invention can increase effective heat exchange area and the nucleus of boiling, working medium is promoted to form thin liquid film on heat exchange structure surface, control submergence amount of the heat exchange structure in working medium, strengthen nucleate boiling and thin film evaporation process, preparation method is simple and efficient, principle is reliable, and inexpensive large-scale application can be realized in a variety of two phase heat-radiation devices.
Description
Technical field
The present invention relates to superelevation heat flow density enhanced boiling heat transfer technical fields, in particular to a kind of close suitable for high power
Spend the compound indent conduit enhanced boiling heat transfer structure of floor and preparation method thereof of electronic device.
Background technique
With the development of microelectric technique, the size of electronic component is constantly reducing, and working frequency is higher and higher, leads to electricity
The heat flow density of sub- device constantly increases, and traditional metal fin radiator has been unable to meet the radiating requirements of electronic device, dissipates
Heat problem, which becomes, restricts the critical issue that electronic device further integrates development.Therefore, solve the heat dissipation problem of electronic device at
For the key technology of current electronics manufacture.
Currently, phase-change heat transfer technology is widely used in electronic radiation field at home and abroad under the joint efforts of scholar, it is main
It wants product to have heat pipe, temperature-uniforming plate etc., has many advantages, such as that load power is big, isothermal is good, performance is stable, the inexpensive and service life is long,
The radiating requirements of part high-power electronic product can be substantially met, but still are difficult to solve the thermal control of high power density electronic product
Problem processed.It is focused on entirely to further enhance the heat-transfer capability of phase-change heat device, researcher and relevant enterprise for target
Cavity type phase-change heat sink will conduct heat and radiate and is integrated, but research shows that: optimal working medium in full cavity type phase-change heat sink
Groundwater increment is bigger with respect to heat pipe and soaking plate, and heat exchange structure is submerged in liquid working substance, meanwhile, it is close in high-power and high power
Under the hot-fluid of degree, the temperature difference of heat source and steam inside is generally larger, becomes the principal element for influencing radiator performance.Therefore, needle
The heat exchange structure of full cavity type phase-change heat sink is optimized, how low cost increases effective heat exchange area and vaporization nucleus
The heart and maintenance liquid working substance being uniformly distributed on heat exchange structure surface, are the cores for enhancing full cavity type phase-change heat sink performance
Problem.
Summary of the invention
The purpose of the present invention is to overcome the shortcomings of the existing technology with it is insufficient, a kind of heat exchange structure and its preparation side are provided
Method, this structure and method can realize being obviously improved for nucleate boiling heat exchange property and critical heat flux density, have heat exchange property good,
The advantages that preparation method is simple and efficient.
The purpose of the present invention is realized by the following technical solution: a kind of heat exchange structure, including on metal substrate and substrate
Rib array group arranged in parallel, increase effective heat exchange area, also can control submergence of the heat exchange structure in working medium in height
Amount.
Preferably, the floor side is uniformly placed with several vertical inner groovies, so that the vaporization of entire heat exchange structure
Core number dramatically increases, and the capillary force of inner groovy can promote the diffusion profile on the floor side of working medium.
Further, the cross sectional shape of the inner groovy is " Ω " shape, equivalent diameter 0.3-0.5mm, in adjacent two
The center of groove is away from for 0.8-1mm.
Preferably, the substrate is metal material；The rib array group be with the integrally formed metal solid of substrate, or
Rib array group described in person is metal powder sintered structure.
Further, the rib array group be with the integrally formed metal solid of substrate, material be red copper or aluminium or
Stainless steel.
Further, the rib array group is metal powder sintered structure, and material is red copper.
Preferably, the floor is with a thickness of 1-2mm, depth of floor 3-10mm, plate spacing 0.8-1mm.
A kind of heat exchange structure preparation method, includes the following steps:
S1, rib array group arranged in parallel is processed on metallic substrates；
S2, the method by numerical control milling are processed downwards on the inside of the top edge of floor with micro- milling cutter, are added on side
Work goes out inner groovy, obtains heat exchange structure.
Preferably, rib array is directly processed by the method for numerical control milling on metallic substrates in the step S1
Group.
Preferably, metal powder is filled into the mold with rib array group's shaped inner chamber in the step S1, gold
Belong to powder and adequately fill up cavity, covers metal substrate, come into full contact with metal powder with substrate by clamp；By above-mentioned mould
Tool, which is placed in sintering furnace, to be sintered, and is passed through hydrogen as gas shield, at 800-900 DEG C, keeps the temperature 30-90min；It is furnace-cooled to room
Temperature, then draft can then obtain powder sintered rib array group on metallic substrates.
Further, for the equivalent diameter of the metal powder between 50-100 μm, metal powder is spherical or branch shape.
Preferably, the workpiece after the processing is placed in supersonic wave cleaning machine is cleaned by ultrasonic with alcohol, takes out punching
It washes and dries.
Preferably, the horizontal distance at micro- milling cutter center and floor edge is 0.4 times of micro- milling cutter diameter.
Compared with the prior art, the invention has the following advantages and beneficial effects:
1, parallel arrangement rib array group design of the invention, can not only increase effective heat exchange area, also controllable in height
Submergence amount of the heat exchange structure processed in working medium, shortens the motion path of high temperature bubble, while also further enhancing element mounting surface
Bending strength, guarantee the planarity requirements of heat source mounting surface under big vapour pressure.
2, the present invention makes the nucleus of boiling number of entire heat exchange structure significant in the indent groove that the side of floor is arranged
Increase, while can promote vertical diffusion of the liquid working substance on floor surface, forms uniform liquid film on floor surface, enhance core state
Boiling and thin film evaporation effect.
3, the preparation method of heat exchange structure of the present invention is simple and efficient, and principle is reliable, can be realized in a variety of two phase heat-radiation devices
Inexpensive large-scale application.
Detailed description of the invention
Fig. 1 is a kind of structural schematic diagram of heat exchange structure of the present invention.
Fig. 2 is the cut-away view that graphite jig clamping is completed in the embodiment of the present invention 2.
Fig. 3 is the schematic diagram of preparatory processing of embodiment of the present invention rib array group.
Fig. 4 is the schematic diagram that indent slot structure is processed in the embodiment of the present invention.
Fig. 5 is the cross sectional shape diagram of indent slot structure of the present invention.
Wherein: 1- metal substrate；2- rib array group；3- inner groovy；The micro- milling cutter of 4-；5- metal powder；6- graphite jig；
7- fixture.
Specific embodiment
For a better understanding of the technical solution of the present invention, the implementation that the present invention is described in detail provides with reference to the accompanying drawing
Example, embodiments of the present invention are not limited thereto.
Embodiment 1
As shown in Figure 1, a kind of compound indent conduit enhanced boiling heat transfer structure of floor, including metal substrate 1, metal substrate
Go up rib array group 2 arranged in parallel, evenly arranged several vertical inner groovies 3 on floor side.The floor of rib array group
With a thickness of 1.2mm, depth of floor 5mm, plate spacing 0.8mm.Floor is metal solid structure, and the material of substrate and floor is
Aluminum metal.The cross sectional shape of inner groovy is " Ω " shape, equivalent diameter 0.35mm, and the center of adjacent two inner groovy is away from for 1mm.
The preparation method of the above-mentioned compound indent conduit enhanced boiling heat transfer structure of floor, includes the following steps:
S1, the metal substrate for selecting thickness 7mm, are processed arranged in parallel on metallic substrates by the method for numerical control milling
Rib array group；
S2, the method by numerical control milling are added downwards on the inside of the top edge of floor with the micro- milling cutter 4 of diameter 0.35mm
Work, processes inner groovy on side, and the horizontal distance at micro- milling cutter center and floor edge is 0.14mm；
S3, the workpiece after processing is placed in supersonic wave cleaning machine it is cleaned by ultrasonic with alcohol, is taken out to rinse and simultaneously dry,
Obtain the compound indent conduit enhanced boiling heat transfer structure of floor.
Embodiment 2
As shown in Fig. 2, a kind of compound indent conduit enhanced boiling heat transfer structure of floor, including metal substrate, metal substrate
Go up rib array group arranged in parallel, evenly arranged several vertical inner groovies on floor side.The floor of rib array group is thick
Degree is 1mm, depth of floor 4mm, plate spacing 1mm.The material of substrate and floor is red copper metal, and floor is metal powder burning
Junction structure, metal powder 5 are spherical shape.The cross sectional shape of inner groovy is " Ω " shape, equivalent diameter 0.3mm, adjacent two inner groovy
Center away from for 0.8mm.
The preparation method of the above-mentioned compound indent conduit enhanced boiling heat transfer structure of floor, includes the following steps:
S1, the metal powder of the metal substrate and equivalent diameter of thickness 2mm between 50-100 μm is selected, by metal powder
Into the graphite jig 6 with rib array group shaped inner chamber, metal powder adequately fills up cavity for filling, covers metal substrate,
Metal powder is come into full contact with substrate by the clamping of fixture 7；
S2, it above-mentioned graphite jig is placed in sintering furnace is sintered, and be passed through hydrogen as gas shield, at 800-900 DEG C
Under, keep the temperature 30-90min；
S3, it is furnace-cooled to room temperature, then draft can then obtain powder sintered rib array group on metallic substrates, pass through number
The method for controlling milling, is processed downwards in the top edge of floor with the micro- milling cutter of diameter 0.3mm, indent is processed on side
The horizontal distance at slot, micro- milling cutter center and floor edge is 0.12mm；
S4, the workpiece after processing is placed in supersonic wave cleaning machine it is cleaned by ultrasonic with alcohol, is taken out to rinse and simultaneously dry,
Obtain the compound indent conduit enhanced boiling heat transfer structure of floor.
The above embodiment is a preferred embodiment of the present invention, but embodiments of the present invention are not by above-described embodiment
Limitation, other any changes, modifications, substitutions, combinations, simplifications made without departing from the spirit and principles of the present invention,
It should be equivalent substitute mode, be included within the scope of the present invention.
Claims (10)
1. a kind of heat exchange structure, which is characterized in that including the rib array group arranged in parallel on metal substrate and substrate.
2. heat exchange structure according to claim 1, which is characterized in that the floor side is uniformly placed with several vertical
Inner groovy.
3. heat exchange structure according to claim 1, which is characterized in that the substrate is metal material；The rib array
It is the powder sintered structure of red copper that group, which is with the integrally formed red copper of substrate or aluminium or stainless steel solid or the rib array group,.
4. heat exchange structure according to claim 1, which is characterized in that the floor is with a thickness of 1-2mm, depth of floor 3-
10mm, plate spacing 0.8-1mm；The cross sectional shape of the inner groovy is " Ω " shape, equivalent diameter 0.3-0.5mm, adjacent two
The center of inner groovy is away from for 0.8-1mm.
5. a kind of heat exchange structure preparation method, which comprises the steps of:
S1, rib array group arranged in parallel is processed on metallic substrates；
S2, the method by numerical control milling are processed downwards on the inside of the top edge of floor with micro- milling cutter, are processed on side
Inner groovy obtains heat exchange structure.
6. preparation method according to claim 5, which is characterized in that straight by the method for numerical control milling in the step S1
It connects and processes rib array group on metallic substrates.
7. preparation method according to claim 5, which is characterized in that fill metal powder to having in the step S1
In the mold of rib array group's shaped inner chamber, metal powder adequately fills up cavity, covers metal substrate, makes gold by clamp
Belong to powder to come into full contact with substrate；Above-mentioned mold is placed in sintering furnace and is sintered, and is passed through hydrogen as gas shield, in 800-
At 900 DEG C, 30-90min is kept the temperature；It is furnace-cooled to room temperature, then draft can then obtain powder sintered floor battle array on metallic substrates
Arrange group.
8. preparation method according to claim 7, which is characterized in that the equivalent diameter of the metal powder is at 50-100 μm
Between, metal powder is spherical or branch shape.
9. preparation method according to claim 5, which is characterized in that the workpiece after the processing is placed in ultrasonic cleaning
It is cleaned by ultrasonic in machine with alcohol, takes out and rinse and dry.
10. preparation method according to claim 5, which is characterized in that the level at micro- the milling cutter center and floor edge
Distance is 0.4 times of micro- milling cutter diameter.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811424910.7A CN109411431A (en) | 2018-11-27 | 2018-11-27 | A kind of heat exchange structure and preparation method thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811424910.7A CN109411431A (en) | 2018-11-27 | 2018-11-27 | A kind of heat exchange structure and preparation method thereof |
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| Publication Number | Publication Date |
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| CN109411431A true CN109411431A (en) | 2019-03-01 |
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| CN201811424910.7A Pending CN109411431A (en) | 2018-11-27 | 2018-11-27 | A kind of heat exchange structure and preparation method thereof |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111702434A (en) * | 2020-04-22 | 2020-09-25 | 安徽帮德电气有限公司 | Aluminum heat dissipation shell machining method |
| CN113270382A (en) * | 2020-02-14 | 2021-08-17 | 昇印光电（昆山）股份有限公司 | Heat dissipation assembly and electronic equipment carrying same |
| JP2021188886A (en) * | 2020-06-04 | 2021-12-13 | 古河電気工業株式会社 | Heat transfer member and cooling device having heat transfer member |
| TWI774542B (en) * | 2021-08-27 | 2022-08-11 | 艾姆勒車電股份有限公司 | Liquid-cooled heat-dissipation substrate with partial reinforcement structure |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101500394A (en) * | 2008-01-30 | 2009-08-05 | 中国科学院工程热物理研究所 | Straight-fin heat expansion reinforced structure minuteness scale composite phase-change heat fetching apparatus |
| CN201550387U (en) * | 2009-09-30 | 2010-08-11 | 浙江西子光电科技有限公司 | Radiator with special structure |
| JP2011003708A (en) * | 2009-06-18 | 2011-01-06 | Furukawa-Sky Aluminum Corp | Heat exchanger using corrugated heat radiation unit |
| CN105845649A (en) * | 2016-05-28 | 2016-08-10 | 扬州大学 | High power electronic chip array radiating module |
| CN207834280U (en) * | 2018-02-02 | 2018-09-07 | 郑州大学 | A kind of novel micro-channel heat sink structure |
-
2018
- 2018-11-27 CN CN201811424910.7A patent/CN109411431A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101500394A (en) * | 2008-01-30 | 2009-08-05 | 中国科学院工程热物理研究所 | Straight-fin heat expansion reinforced structure minuteness scale composite phase-change heat fetching apparatus |
| JP2011003708A (en) * | 2009-06-18 | 2011-01-06 | Furukawa-Sky Aluminum Corp | Heat exchanger using corrugated heat radiation unit |
| CN201550387U (en) * | 2009-09-30 | 2010-08-11 | 浙江西子光电科技有限公司 | Radiator with special structure |
| CN105845649A (en) * | 2016-05-28 | 2016-08-10 | 扬州大学 | High power electronic chip array radiating module |
| CN207834280U (en) * | 2018-02-02 | 2018-09-07 | 郑州大学 | A kind of novel micro-channel heat sink structure |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113270382A (en) * | 2020-02-14 | 2021-08-17 | 昇印光电（昆山）股份有限公司 | Heat dissipation assembly and electronic equipment carrying same |
| CN111702434A (en) * | 2020-04-22 | 2020-09-25 | 安徽帮德电气有限公司 | Aluminum heat dissipation shell machining method |
| JP2021188886A (en) * | 2020-06-04 | 2021-12-13 | 古河電気工業株式会社 | Heat transfer member and cooling device having heat transfer member |
| JP7444703B2 (en) | 2020-06-04 | 2024-03-06 | 古河電気工業株式会社 | Heat transfer member and cooling device having heat transfer member |
| TWI774542B (en) * | 2021-08-27 | 2022-08-11 | 艾姆勒車電股份有限公司 | Liquid-cooled heat-dissipation substrate with partial reinforcement structure |
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