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WO2022144508A1 - Electronic module for a smart card - Google Patents

Electronic module for a smart card Download PDF

Info

Publication number
WO2022144508A1
WO2022144508A1 PCT/FR2020/000286 FR2020000286W WO2022144508A1 WO 2022144508 A1 WO2022144508 A1 WO 2022144508A1 FR 2020000286 W FR2020000286 W FR 2020000286W WO 2022144508 A1 WO2022144508 A1 WO 2022144508A1
Authority
WO
WIPO (PCT)
Prior art keywords
contact
antenna
communication interface
electronic module
module
Prior art date
Application number
PCT/FR2020/000286
Other languages
French (fr)
Inventor
Sebastien Marmugi
Didier LIVRATI
Bernard Calvas
Original Assignee
Smart Packaging Solutions
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Smart Packaging Solutions filed Critical Smart Packaging Solutions
Priority to PCT/FR2020/000286 priority Critical patent/WO2022144508A1/en
Publication of WO2022144508A1 publication Critical patent/WO2022144508A1/en

Links

Classifications

    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07766Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card comprising at least a second communication arrangement in addition to a first non-contact communication arrangement
    • G06K19/07769Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card comprising at least a second communication arrangement in addition to a first non-contact communication arrangement the further communication means being a galvanic interface, e.g. hybrid or mixed smart cards having a contact and a non-contact interface
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • G06K19/07754Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna the connection being galvanic
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745Mounting details of integrated circuit chips
    • G06K19/07747Mounting details of integrated circuit chips at least one of the integrated circuit chips being mounted as a module

Definitions

  • the present invention relates to an electronic module for a smart card having a contact and contactless dual mode of operation, as well as a smart card integrating such an electronic module.
  • chip cards already exist in the state of the art. Some are said to operate by contact. They have a terminal block of contacts intended to cooperate with the contacts of a smart card reader provided with corresponding contacts.
  • Others are said to operate without contact. They include an antenna that allows radio frequency communication with a remote reader.
  • contact terminal block and at least one antenna. Some contacts of the terminal block are connected to the contact interface of a microelectronic chip of the module, and the ends of the antenna are connected to the contactless interface of the electronic module.
  • the electronic module may comprise a single chip comprising both a contact communication interface and a contactless communication interface. This is a so-called dual module.
  • This module comprises connection bridges (“connection bridges”) configured to bring the ends of the antenna of the module inside the zone of encapsulation that protects the single chip.
  • connection bridges are either arranged between two neighboring standardized contacts, or encroach on part of the surface of a standardized contact. In any case, they remain visible as an element that interferes with the appearance of the standardized contacts and with the surface available for the realization of a possible logo in the area of the contacts.
  • the module can also comprise two microelectronic chips, namely a so-called contact chip comprising a contact interface connected to certain contacts of the terminal block, and a separate so-called contactless chip, comprising a contactless interface intended to be connected to the terminals of an antenna.
  • This is a so-called hybrid module.
  • An example of such a two-chip module is described in document WO 2019/045642 A1.
  • this module has under certain contacts large multi-contact pads. As a result, there is no longer any space available to position the coils of an antenna on the module itself. Consequently, the antenna is offset outside the module, so it cannot be an antenna module as targeted by the present invention.
  • the microelectronic module must itself include an antenna, located on the underside of the module, and not visible when the module is integrated into the body of a chip card.
  • the module contacts are standardized according to the ISO 7816 standard. They can be 6 or 8 in number, numbered from Cl to C8. Within the framework of the so-called 5-wire communication protocols, the contacts C6, C7 and C8 are not used and are not connected to the contact communication interface of the chip of the electronic module.
  • the contacts Cl - C8 are included in the metal pads of the terminal block and located on the upper face of the module, which remains visible when the module is integrated into a smart card.
  • the antenna of the module comprises a so-called distal end which terminates the outer circumference of the antenna which extends along the periphery of the module, and a so-called proximal end, which is located in the vicinity of the microelectronic chip located in the center of the surface of the module.
  • the bridging limits the space available on the central pad of the module to engrave a sign or a logo as is often required by suppliers of applications using smart cards, such as banks.
  • the general object of the invention is to propose a new electronic module for smart card, devoid of the disadvantages of the state of the art.
  • the specific object of the invention is to provide an electronic module with mixed contact and contactless operation which is devoid of a bridge in the form of a clearly visible track on the upper surface of the module.
  • the clearly visible bridging is replaced by a connection between the distal end of the antenna and the appropriate pad of the contactless interface of the module, and this connection is fully integrated into one of the standard contacts of the module which are not connected to the contact interface of the chip.
  • the subject of the invention is therefore an electronic module with a double contact and contactless communication interface, comprising a dielectric substrate having on a first face a terminal block of electrical contacts (C1, C2, C3, C5, C6, C7) standardized according to the ISO 7816 standard intended for operation by contact with the corresponding contacts of a smart card reader, said substrate having on a second face the turns of an antenna located under the zone of the electrical contacts of the terminal block, and said antenna comprising a distal end located on the periphery of the electronic module and a proximal end located inside the turns of the antenna, characterized in that it comprises two distinct microelectronic chips, namely a first chip provided with a communication interface with contact connected to contacts of the terminal block, and a second chip provided with a so-called contactless communication interface connected to the distal and proximal ends of the antenna, and the distal end of the antenna being connected to said second contactless communication interface by a metal pad integrating a standardized contact not connected to said first contact communication interface.
  • the metal pad integrates the standardized contact C6 which is not connected to the contact communication interface of the microelectronic chip.
  • the use of two chips then makes it possible not to polarize the contactless chip and avoids destroying it when inserting the card into a contact reader.
  • the distal end of the antenna is connected to contact C6 by a connection perpendicular to the plane of the module, for example a blind via.
  • the standardized contact C6 is connected to a terminal of the contactless communication interface by a second blind via connected to a conductive track and a connection wire.
  • the electronic module according to the invention comprises, between the standardized electrical contacts (C1, C2, C3, C5, C6, C7), a metal pad devoid of visible bridging and entirely available, in particular for producing a logo.
  • the invention also relates to a chip card, characterized in that it comprises an electronic module according to any one of the preceding claims.
  • Figures IA to IC represent a terminal block for the contacts of an electronic module for a smart card according to the state of the art
  • FIG. 2 represents a partially transparent detailed view of the electronic module of FIG. 1;
  • FIG. 3 represents a diagram of the terminal block of the module of FIG. 2 and its equivalent electrical diagram
  • FIG. 4A represents a partially transparent view of the upper face (contact side) of the printed circuit of an electronic module according to the invention
  • FIG. 4B represents a view of the upper face (contact side) of the printed circuit of FIG. 4A;
  • FIG. 5A represents a partially transparent view of an electronic module in accordance with the invention, provided with the printed circuit of FIG. 4A and two distinct chips;
  • FIG. 5B represents a sectional view of the electronic module of FIG. 5A according to section planes AA and BB;
  • FIG. 6 represents a more detailed view partially in transparency of the contact interface of the electronic module according to the invention;
  • FIG. 7 represents the upper face (contact side) of an electronic module according to the invention.
  • Figures IA to IC represent the upper face of a dual electronic module 1 according to the state of the art. It has a set of metal pads, namely contact pads 2 surrounding a central area 3. Depending on the module used, there are 6 or 8 contact pads, the model shown is a model with 6 contact pads. At the center of the contact pads are contact zones standardized according to the ISO 7816 standard, numbered from Cl to C6 and whose functions are as follows:
  • These contact areas serve as a contact area for corresponding contacts of a contact chip card reader.
  • the electronic module comprises a conductive track 4 forming a bridge, or strap in Anglo-Saxon terminology, extending from the periphery of the module to the central area 3.
  • This bridge 4 is well individualized and clearly visible on the known mods. It is used to connect the distal end of the antenna of the module, to the contact pad of the contactless interface of the microelectronic chip.
  • chip card issuers may be asked to engrave a sign or logo 5 in the central area 3.
  • the bridging 4 limits the space available for the production of this logo, and visually interferes with him.
  • the invention aims in particular to solve this problem.
  • FIG 2 there is shown a view of an electronic module similar to that of Figure 1, observed from the side of the antenna and the microelectronic chip, with a reminder by transparency of the position of the contacts C1-C6 and the bridge 4.
  • the distal end 8 of the antenna is brought by the bridge 4 to the level of a metallized via or hole 9 located inside the turns of the antenna and connected by a conductive track 10 and a connection wire 11 to a connection terminal c of the contactless interface of the microelectronic chip 7.
  • the proximal end 12 of the antenna 6 is connected to another connection terminal d of the contactless interface of the microelectronic chip.
  • the presence of the distal end 8 and of the bridge 4 implies a localized offset of the turns of the antenna 6 inwards, which leads to the via 9 being moved and the surface available for the implantation of a second chip or a larger chip.
  • Figure 3 shows in the left part the layout diagram of the ISO contacts C1-C6 and of the chip, and in the right part an equivalent electrical diagram of the electronic module of Figure 2.
  • the connection pad C6 is not used, consequently it is connected neither to the contact communication interface nor to the contactless communication interface of the chip 7.
  • the terminals of the antenna 6 are connected to the pads (c, d) of the contactless interface of chip 7.
  • the invention proposes a dual electronic module with contact and contactless operation, devoid of a clearly visible and identifiable bridging like that known in the state of the art.
  • the central area 3 of the terminal block is full, in one piece, without discontinuity. She lends herself to engraving of a large logo.
  • the bridge 4 in accordance with the state of the art is replaced by a hidden or integrated electrical connection in an unused connection pad of the terminal block, for example the connection pad C6, as can be seen in more detail in FIGS. 5B and 6.
  • FIG. 5A represents a transparent view of an electronic module according to the invention, comprising two chips, namely a chip 7a connected to contacts C1, C2, C3, C5 and C7 of the terminal block and dedicated to contact communication, and a chip 7b connected to the terminals of antenna 6 via contact C6 and dedicated to contactless communication. Consequently, the contact C6 now acts as a bridge to bring the distal end 8 of the antenna back to the central zone of the module, without introducing any track or visible disturbance in this central zone.
  • Figure 5B is a sectional view along section lines A-A and B-B of Figure 5A.
  • the distal end 8 of the antenna 6 is connected by an electrical connection, for example by a blind via 12, to the contact C6 of the terminal block, located opposite the antenna 6 on the other side of the substrate 13.
  • the contact C6 provides the electrical connection with another via 14, a track 15 and a connection wire 16, to a terminal 17 of the contactless interface of the contactless chip 7b.
  • This arrangement advantageously makes it possible to bring the distal end 8 of the antenna 6 towards the contactless chip 7b, without having to use an individualized bridge in the central zone 3 of the module, as can be seen in FIG. to have the entire central zone 3 of the module for the production of a logo, in particular by engraving the metal.
  • a module without bridging in accordance with the invention could also be obtained by using a single dual chip 7.
  • this embodiment is liable to pose problems linked to the polarization of the contactless interface of the chip by the contact reader at the time of its use, risking the destruction of the contactless chip.
  • the invention therefore provides a hybrid solution with 2 chips, one 7A with contact only and the other radio frequency 7b only. In this case, a module is obtained which is both robust in its use, and devoid of a visible bridge on the face of the contacts of the terminal block.
  • the invention achieves the stated aims. In particular, it allows the elimination of the unsightly bridging on the contact side of the module, and the production of logos on the entire surface of the central zone 3 of the terminal block. In addition, it maximizes the useful space available for the implantation on the module of large chips, or of several chips in the case of hybrid modules.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)

Abstract

The invention relates to an electronic module (20) with a dual contact or contactless communication interface, comprising a dielectric substrate (13) having, on a first face, a terminal block of electrical contacts (C1, C2, C3, C5, C6, C7) which are standardised according to ISO 7816 and intended to function by contact with the corresponding contacts of a smart card reader, the substrate (13) having, on a second face, the coils of an antenna (6) located underneath the electrical contact area of the terminal block, and the antenna (6) comprising a distal end (8) located at the peripheral edge of the electronic module (20) and a proximal end (9) located inside the coils of the antenna (6), characterised in that it comprises two separate microelectronic chips (7a, 7b), i.e. a first chip (7a) provided with a contact communication interface connected to terminal block contacts, and a second chip (7b) provided with a contactless communication interface connected to the distal end (8) and the proximal end (9) of the antenna (6), the distal end (8) of the antenna (6) being connected to the second contactless communication interface by a metal pad incorporating a standard contact which is not connected to the first contact communication interface.

Description

DESCRIPTION DESCRIPTION
Titre : Module électronique pour carte à puce Title: Electronic module for smart card
La présente invention concerne un module électronique pour une carte à puce ayant un mode de fonctionnement dual à contact et sans contact, ainsi qu'une carte à puce intégrant un tel module électronique. The present invention relates to an electronic module for a smart card having a contact and contactless dual mode of operation, as well as a smart card integrating such an electronic module.
État de la technique State of the art
Il existe déjà dans l'état de la technique plusieurs types de cartes à puce. Certaines sont dites à fonctionnement par contact. Elles présentent un bornier de contacts destinés à coopérer avec les contacts d'un lecteur de carte à puce pourvus de contacts correspondants. Several types of chip cards already exist in the state of the art. Some are said to operate by contact. They have a terminal block of contacts intended to cooperate with the contacts of a smart card reader provided with corresponding contacts.
D'autres sont dites à fonctionnement sans contact. Elles comportent une antenne qui permet de communiquer par voie radiofréquence avec un lecteur distant. Others are said to operate without contact. They include an antenna that allows radio frequency communication with a remote reader.
Enfin, il existe aussi des cartes à puce à fonctionnement mixte à contact et sans contact. Elles comportent à la fois un bornier de contacts, et au moins une antenne. Certains contacts du bornier sont connectés à l'interface à contact d'une puce microélectronique du module, et les extrémités de l'antenne sont connectées à l'interface sans contact du module électronique. Finally, there are also mixed-function contact and contactless smart cards. They comprise both a contact terminal block and at least one antenna. Some contacts of the terminal block are connected to the contact interface of a microelectronic chip of the module, and the ends of the antenna are connected to the contactless interface of the electronic module.
Le module électronique peut comporter une puce unique comportant à la fois une interface de communication à contact et une interface de communication sans contact. Il s'agit d'un module dit dual. Un exemple d'un tel module est décrit dans le document WO 2015/071086 Al. Ce module comporte des ponts de connexion (« connexion bridges ») configurés pour ramener les extrémités de l'antenne du module à l'intérieur de la zone d'encapsulation qui protège la puce unique. Ces ponts de connexion sont soit disposés entre deux contacts normalisés voisins, soit empiètent sur une partie de la surface d'un contact normalisé. Dans tous les cas, ils restent visibles comme un élément qui interfère avec l'apparence des contacts normalisés et avec la surface disponible pour la réalisation d'un éventuel logo dans la zone des contacts. The electronic module may comprise a single chip comprising both a contact communication interface and a contactless communication interface. This is a so-called dual module. An example of such a module is described in document WO 2015/071086 Al. This module comprises connection bridges (“connection bridges”) configured to bring the ends of the antenna of the module inside the zone of encapsulation that protects the single chip. These connection bridges are either arranged between two neighboring standardized contacts, or encroach on part of the surface of a standardized contact. In any case, they remain visible as an element that interferes with the appearance of the standardized contacts and with the surface available for the realization of a possible logo in the area of the contacts.
Mais le module peut aussi comporter deux puces microélectroniques, à savoir une puce dite à contact comprenant une interface à contact connectée à certains contacts du bornier, et une puce distincte dite sans contact, comprenant une interface sans contact destinée à être connectée aux bornes d'une antenne. Il s'agit d'un module dit hybride. Un exemple d'un tel module à deux puces est décrit dans le document WO 2019/045642 Al. Cependant, ce module comporte sous certains contacts des plots multi-contact de grande taille. De ce fait il n'y a plus de place disponible pour positionner les spires d'une antenne sur le module lui-même. En conséquence, l'antenne est déportée hors du module, il ne peut donc s'agir d'un module à antenne comme cela est visé par la présente invention. But the module can also comprise two microelectronic chips, namely a so-called contact chip comprising a contact interface connected to certain contacts of the terminal block, and a separate so-called contactless chip, comprising a contactless interface intended to be connected to the terminals of an antenna. This is a so-called hybrid module. An example of such a two-chip module is described in document WO 2019/045642 A1. However, this module has under certain contacts large multi-contact pads. As a result, there is no longer any space available to position the coils of an antenna on the module itself. Consequently, the antenna is offset outside the module, so it cannot be an antenna module as targeted by the present invention.
Or dans certains cas, le module microélectronique doit comporter lui-même une antenne, située sur la face inférieure du module, et non visible lorsque le module est intégré dans le corps d'une carte à puce. However, in certain cases, the microelectronic module must itself include an antenna, located on the underside of the module, and not visible when the module is integrated into the body of a chip card.
Les contacts du module sont normalisés selon la norme ISO 7816. Ils peuvent être au nombre de 6 ou de 8, numérotés de Cl à C8. Dans le cadre des protocoles de communication dits à 5 fils, les contacts C6, C7 et C8 ne sont pas utilisés et ne sont pas connectés à l'interface de communication à contact de la puce du module électronique. Les contacts Cl - C8 sont compris dans des plages métalliques du bornier et situés sur la face supérieure du module, qui reste visible lorsque le module est intégré à une carte à puce. The module contacts are standardized according to the ISO 7816 standard. They can be 6 or 8 in number, numbered from Cl to C8. Within the framework of the so-called 5-wire communication protocols, the contacts C6, C7 and C8 are not used and are not connected to the contact communication interface of the chip of the electronic module. The contacts Cl - C8 are included in the metal pads of the terminal block and located on the upper face of the module, which remains visible when the module is integrated into a smart card.
L'antenne du module comporte une extrémité dite distale qui termine le tour extérieur de l'antenne qui s'étend le long de la périphérie du module, et une extrémité dite proximale, qui est située au voisinage de la puce microélectronique située au centre de la surface du module. The antenna of the module comprises a so-called distal end which terminates the outer circumference of the antenna which extends along the periphery of the module, and a so-called proximal end, which is located in the vicinity of the microelectronic chip located in the center of the surface of the module.
Afin de pouvoir connecter l'extrémité distale de l'antenne à la borne correspondante de l'interface sans contact du module, il est connu dans l'état de la technique d'utiliser une connexion électrique passant au-dessus des spires de l'antenne pour ramener son extrémité distale vers le plot approprié de l'interface sans contact de la puce microélectronique du module. Cette connexion électrique est réalisée sous la forme d'un pontage, appelé en général « strap » en terminologie anglo-saxonne. Elle est constituée par une piste individualisée et bien visible sur la surface du module, comme cela est notamment le cas dans le document WO 2015/071086 Al précité. Elle s'étend entre la périphérie du module et la plage métallique centrale située entre les contacts du module. Cette piste est isolée électriquement de la plage métallique centrale par une gravure, ce qui rend le pontage d'autant plus visible. In order to be able to connect the distal end of the antenna to the corresponding terminal of the contactless interface of the module, it is known in the state of the art to use an electrical connection passing above the turns of the antenna to bring its distal end towards the appropriate pad of the contactless interface of the microelectronic chip of the module. This electrical connection is made in the form of a bridge, generally called a “strap” in Anglo-Saxon terminology. It consists of an individualized and clearly visible track on the surface of the module, as is in particular the case in the aforementioned document WO 2015/071086 Al. It extends between the periphery of the module and the central metal pad located between the module contacts. This track is electrically insulated from the central metal pad by an engraving, which makes the bridging all the more visible.
Or ce pontage utilisé dans l'état de la technique présente plusieurs inconvénients. En plus de son aspect inesthétique, il présente des problèmes sur un plan fonctionnel, puisqu'il risque de se rompre pendant une flexion de la carte à puce, ce qui rendrait l'antenne non fonctionnelle. However, this bridging used in the state of the art has several drawbacks. In addition to its unsightly appearance, it presents problems on a functional level, since it risks breaking during a bending of the smart card, which would render the antenna non-functional.
En outre, le pontage limite l'espace disponible sur la plage centrale du module pour graver un signe ou un logo comme cela est souvent demandé par les fournisseurs d'applications utilisant des cartes à puce, tels que les banques. In addition, the bridging limits the space available on the central pad of the module to engrave a sign or a logo as is often required by suppliers of applications using smart cards, such as banks.
Par ailleurs, la technologie actuelle présente des difficultés pour intégrer un pontage dans un module au format d'usage standard de 11,8 mm x 13 mm. En effet, la localisation des extrémités du pontage entraine une diminution de la surface utile disponible pour les composants actifs du module. En particulier, à cause du pontage, les spires de l'antenne doivent comporter un décrochement vers l'intérieur de la surface du module, et ce décrochement à son tour empiète sur la surface disponible pour accueillir la ou les puces microélectroniques du module, ce qui peut limiter le module à des applications ne nécessitant que des puces de petite taille. Furthermore, current technology presents difficulties in integrating a bridge into a module in the standard format of 11.8 mm×13 mm. Indeed, the location of the ends of the bridging leads to a reduction in the useful surface available for the active components of the module. In particular, because of the bridging, the turns of the antenna must have a recess towards the inside of the surface of the module, and this recess in turn encroaches on the surface available to accommodate the microelectronic chip(s) of the module, this which may limit the module to applications requiring only small size chips.
But de l'invention Purpose of the invention
L'invention a pour but général de proposer un nouveau module électronique pour carte à puce, dépourvu des inconvénients de l'état de la technique. The general object of the invention is to propose a new electronic module for smart card, devoid of the disadvantages of the state of the art.
L'invention a pour but spécifique de proposer un module électronique à fonctionnement mixte à contact et sans contact qui soit dépourvu d'un pontage sous la forme d'une piste bien visible sur la surface supérieure du module. The specific object of the invention is to provide an electronic module with mixed contact and contactless operation which is devoid of a bridge in the form of a clearly visible track on the upper surface of the module.
Objet de l'invention Object of the invention
Selon le principe de l'invention, le pontage bien visible est remplacé par une connexion entre l'extrémité distale de l'antenne et le plot adéquat de l'interface sans contact du module, et cette connexion est totalement intégrée à l'un des contacts normalisés du module qui ne sont pas connectés à l'interface à contact de la puce. L'invention a donc pour objet un module électronique à double interface de communication à contact et sans contact, comportant un substrat diélectrique présentant sur une première face un bornier de contacts électriques (Cl, C2, C3, C5, C6, C7) normalisés selon la norme ISO 7816 destinés à un fonctionnement par contact avec les contacts correspondants d'un lecteur de carte à puce, ledit substrat présentant sur une seconde face les spires d'une antenne située sous la zone des contacts électriques du bornier, et ladite antenne comportant une extrémité distale située en périphérie du module électronique et une extrémité proximale située à l'intérieur des spires de l'antenne, caractérisé en ce qu'il comporte deux puces microélectroniques distinctes, à savoir une première puce pourvue d'une interface de communication à contact connectée à des contacts du bornier, et une seconde puce pourvue d'une interface de communication dite sans contact connectée aux extrémités distale et proximale de l'antenne, et l'extrémité distale de l'antenne étant connectée à ladite seconde interface de communication sans contact par une plage métallique intégrant un contact normalisé non connecté à ladite première interface de communication à contact. According to the principle of the invention, the clearly visible bridging is replaced by a connection between the distal end of the antenna and the appropriate pad of the contactless interface of the module, and this connection is fully integrated into one of the standard contacts of the module which are not connected to the contact interface of the chip. The subject of the invention is therefore an electronic module with a double contact and contactless communication interface, comprising a dielectric substrate having on a first face a terminal block of electrical contacts (C1, C2, C3, C5, C6, C7) standardized according to the ISO 7816 standard intended for operation by contact with the corresponding contacts of a smart card reader, said substrate having on a second face the turns of an antenna located under the zone of the electrical contacts of the terminal block, and said antenna comprising a distal end located on the periphery of the electronic module and a proximal end located inside the turns of the antenna, characterized in that it comprises two distinct microelectronic chips, namely a first chip provided with a communication interface with contact connected to contacts of the terminal block, and a second chip provided with a so-called contactless communication interface connected to the distal and proximal ends of the antenna, and the distal end of the antenna being connected to said second contactless communication interface by a metal pad integrating a standardized contact not connected to said first contact communication interface.
Grace à cette disposition, il devient possible de ramener l'extrémité distale de l'antenne dans la zone située à l'intérieur des spires, sans utiliser un pontage spécifique visible, la connexion étant intégrée à un contact normalisé, ce qui laisse libre la zone centrale du bornier du module. Selon un mode de réalisation avantageux, la plage métallique intègre le contact normalisé C6 qui n'est pas connecté à l'interface de communication à contact de la puce microélectronique. En outre, l'utilisation de deux puces permet alors de ne pas polariser la puce sans contact et évite de la détruire lors de l'insertion de la carte dans un lecteur à contacts. Thanks to this arrangement, it becomes possible to bring the distal end of the antenna back to the zone located inside the turns, without using a specific visible bridge, the connection being integrated into a standardized contact, which leaves the central area of the module terminal block. According to an advantageous embodiment, the metal pad integrates the standardized contact C6 which is not connected to the contact communication interface of the microelectronic chip. In addition, the use of two chips then makes it possible not to polarize the contactless chip and avoids destroying it when inserting the card into a contact reader.
Selon un mode de réalisation, l'extrémité distale de l'antenne est connectée au contact C6 par une connexion perpendiculaire au plan du module, par exemple un via non débouchant. According to one embodiment, the distal end of the antenna is connected to contact C6 by a connection perpendicular to the plane of the module, for example a blind via.
Selon un mode de réalisation, le contact normalisé C6 est connecté à une borne de l'interface de communication sans contact par un second via non débouchant relié à une piste conductrice et un fil de connexion. De façon avantageuse, le module électronique selon l'invention comporte entre les contacts électriques (Cl, C2, C3, C5, C6, C7) normalisés une plage métallique dépourvue de pontage visible et entièrement disponible, notamment pour la réalisation d'un logo. According to one embodiment, the standardized contact C6 is connected to a terminal of the contactless communication interface by a second blind via connected to a conductive track and a connection wire. Advantageously, the electronic module according to the invention comprises, between the standardized electrical contacts (C1, C2, C3, C5, C6, C7), a metal pad devoid of visible bridging and entirely available, in particular for producing a logo.
L'invention a également pour objet une carte à puce, caractérisée en ce qu'elle comporte un module électronique selon l'une quelconque des revendications précédentes. The invention also relates to a chip card, characterized in that it comprises an electronic module according to any one of the preceding claims.
Description détaillée detailed description
L'invention sera décrite plus en détail en relation avec les figures, dans lesquelles : The invention will be described in more detail in relation to the figures, in which:
Les figures IA à IC représentent un bornier des contacts d'un module électronique pour carte à puce selon l'état de la technique ; Figures IA to IC represent a terminal block for the contacts of an electronic module for a smart card according to the state of the art;
La figure 2 représente une vue détaillée partiellement en transparence du module électronique de la figure 1 ; FIG. 2 represents a partially transparent detailed view of the electronic module of FIG. 1;
La figure 3 représente un schéma du bornier du module de la figure 2 et son schéma électrique équivalent ; FIG. 3 represents a diagram of the terminal block of the module of FIG. 2 and its equivalent electrical diagram;
La figure 4A représente une vue partiellement en transparence de la face supérieure (côté contacts) du circuit imprimé d'un module électronique conforme à l'invention ; FIG. 4A represents a partially transparent view of the upper face (contact side) of the printed circuit of an electronic module according to the invention;
La figure 4B représente une vue de la face supérieure (côté contacts) du circuit imprimé de la figure 4A ; FIG. 4B represents a view of the upper face (contact side) of the printed circuit of FIG. 4A;
La figure 5A représente une vue partiellement en transparence d'un module électronique conforme à l'invention, pourvu du circuit imprimé de la figure 4A et de deux puces distinctes ; FIG. 5A represents a partially transparent view of an electronic module in accordance with the invention, provided with the printed circuit of FIG. 4A and two distinct chips;
La figure 5B représente une vue en coupe du module électronique de la figure 5A selon les plans de coupe A-A et B-B ; La figure 6 représente une vue plus détaillée partiellement en transparence de l'interface à contact du module électronique selon l'invention ; FIG. 5B represents a sectional view of the electronic module of FIG. 5A according to section planes AA and BB; FIG. 6 represents a more detailed view partially in transparency of the contact interface of the electronic module according to the invention;
La figure 7 représente la face supérieure (côté contacts) d'un module électronique selon l'invention. FIG. 7 represents the upper face (contact side) of an electronic module according to the invention.
Les figures IA à IC représentent la face supérieure d'un module électronique dual 1 conforme à l'état de la technique. Il présente un ensemble de plages métalliques, à savoir des plages de contact 2 entourant une zone centrale 3. Selon le module utilisé, il y a 6 ou 8 plages de contact, le modèle représenté est un modèle à 6 plages de contact. Au centre des plages de contact se trouvent des zones de contact normalisées selon la norme ISO 7816, numérotées de Cl à C6 et dont les fonctions sont comme suit : Figures IA to IC represent the upper face of a dual electronic module 1 according to the state of the art. It has a set of metal pads, namely contact pads 2 surrounding a central area 3. Depending on the module used, there are 6 or 8 contact pads, the model shown is a model with 6 contact pads. At the center of the contact pads are contact zones standardized according to the ISO 7816 standard, numbered from Cl to C6 and whose functions are as follows:
Cl = Alimentation (Vcc) Cl = Power (Vdc)
C2 = Remise à zéro (Reset) C2 = Reset
C3 = Horloge (Clk) C3 = Clock (Clk)
C5 = Masse (Gnd) C5 = Ground (Gnd)
C6 = non connecté C6 = not connected
C7 = Entrées/Sorties (I/O) C7 = Inputs/Outputs (I/O)
Ces zones de contact servent de zone de contact à des contacts correspondants d'un lecteur de carte à puce à contact. These contact areas serve as a contact area for corresponding contacts of a contact chip card reader.
Comme cela est représenté, le module électronique comporte une piste conductrice 4 formant un pontage, ou strap en terminologie anglo-saxonne, s'étendant de la périphérie du module à la plage centrale 3. Ce pontage 4 est bien individualisé et bien visible sur les modules connus. Il sert à connecter l'extrémité distale de l'antenne du module, au plot de contact de l'interface sans contact de la puce microélectronique. Comme on le voit en figure IC, il peut être demandé par les émetteurs de cartes à puce de graver dans la plage centrale 3 un signe ou un logo 5. Le pontage 4 limite la place disponible pour la réalisation de ce logo, et interfère visuellement avec lui. As shown, the electronic module comprises a conductive track 4 forming a bridge, or strap in Anglo-Saxon terminology, extending from the periphery of the module to the central area 3. This bridge 4 is well individualized and clearly visible on the known mods. It is used to connect the distal end of the antenna of the module, to the contact pad of the contactless interface of the microelectronic chip. As can be seen in FIG. 1C, chip card issuers may be asked to engrave a sign or logo 5 in the central area 3. The bridging 4 limits the space available for the production of this logo, and visually interferes with him.
L'invention vise en particulier à résoudre ce problème. The invention aims in particular to solve this problem.
En figure 2 on a représenté une vue d'un module électronique similaire à celui de la figure 1, observé du côté de l'antenne et de la puce microélectronique, avec un rappel par transparence de la position des contacts C1-C6 et du pontage 4. On y voit notamment les spires de l'antenne 6, une puce microélectronique 7 placée au centre du module, et 6 contacts normalisés Cl à C6. L'extrémité distale 8 de l'antenne est ramenée par le pontage 4 au niveau d'un via ou trou métallisé 9 situé à l'intérieur des spires de l'antenne et connecté par une piste conductrice 10 et un fil de connexion 11 à une borne de connexion c de l'interface sans contact de la puce microélectronique 7. L'extrémité proximale 12 de l'antenne 6 est connectée à une autre borne de connexion d de l'interface sans contact de la puce microélectronique. In Figure 2 there is shown a view of an electronic module similar to that of Figure 1, observed from the side of the antenna and the microelectronic chip, with a reminder by transparency of the position of the contacts C1-C6 and the bridge 4. We see in particular the turns of the antenna 6, a microelectronic chip 7 placed in the center of the module, and 6 standardized contacts C1 to C6. The distal end 8 of the antenna is brought by the bridge 4 to the level of a metallized via or hole 9 located inside the turns of the antenna and connected by a conductive track 10 and a connection wire 11 to a connection terminal c of the contactless interface of the microelectronic chip 7. The proximal end 12 of the antenna 6 is connected to another connection terminal d of the contactless interface of the microelectronic chip.
Comme on le voit, la présence de l'extrémité distale 8 et du pontage 4 implique un décrochement localisé des spires de l'antenne 6 vers l'intérieur, ce qui conduit à déplacer le via 9 et à réduire la surface disponible pour l'implantation d'une seconde puce ou d'une puce de plus grande taille. As can be seen, the presence of the distal end 8 and of the bridge 4 implies a localized offset of the turns of the antenna 6 inwards, which leads to the via 9 being moved and the surface available for the implantation of a second chip or a larger chip.
La figure 3 représente en partie gauche le schéma d'implantation des contacts ISO C1-C6 et de la puce, et en partie droite un schéma électrique équivalent du module électronique de la figure 2. Comme on le voit, dans l'état de la technique, la plage de connexion C6 est non utilisée, en conséquence elle n'est connectée ni à l'interface de communication à contact ni à l'interface de communication sans contact de la puce 7. Les bornes de l'antenne 6 sont connectées aux plots (c, d) de l'interface sans contact de la puce 7. Figure 3 shows in the left part the layout diagram of the ISO contacts C1-C6 and of the chip, and in the right part an equivalent electrical diagram of the electronic module of Figure 2. As can be seen, in the state of the technically, the connection pad C6 is not used, consequently it is connected neither to the contact communication interface nor to the contactless communication interface of the chip 7. The terminals of the antenna 6 are connected to the pads (c, d) of the contactless interface of chip 7.
Comme représenté en figures 4A et 4B, l'invention propose un module électronique dual à fonctionnement à contact et sans contact, dépourvu d'un pontage bien visible et identifiable comme celui connu dans l'état de la technique. La plage centrale 3 du bornier est pleine, d'un seul tenant, sans discontinuité. Elle se prête à la gravure d'un logo de grande taille. Le pontage 4 conforme à l'état de la technique est remplacé par une connexion électrique cachée ou intégrée dans une plage de connexion non utilisée du bornier, par exemple la plage de connexion C6, comme cela est visible plus en détail sur les figures 5B et 6. As represented in FIGS. 4A and 4B, the invention proposes a dual electronic module with contact and contactless operation, devoid of a clearly visible and identifiable bridging like that known in the state of the art. The central area 3 of the terminal block is full, in one piece, without discontinuity. She lends herself to engraving of a large logo. The bridge 4 in accordance with the state of the art is replaced by a hidden or integrated electrical connection in an unused connection pad of the terminal block, for example the connection pad C6, as can be seen in more detail in FIGS. 5B and 6.
La figure 5A représente une vue en transparence d'un module électronique selon l'invention, comportant deux puces, à savoir une puce 7a connectée aux contacts Cl, C2, C3, C5 et C7 du bornier et dédiée à la communication à contact, et une puce 7b connectée aux bornes de l'antenne 6 via le contact C6 et dédiée à la communication sans contact. Par conséquent, le contact C6 fait maintenant office de pontage pour ramener l'extrémité distale 8 de l'antenne vers la zone centrale du module, sans introduire de piste ou de perturbation visible dans cette zone centrale. FIG. 5A represents a transparent view of an electronic module according to the invention, comprising two chips, namely a chip 7a connected to contacts C1, C2, C3, C5 and C7 of the terminal block and dedicated to contact communication, and a chip 7b connected to the terminals of antenna 6 via contact C6 and dedicated to contactless communication. Consequently, the contact C6 now acts as a bridge to bring the distal end 8 of the antenna back to the central zone of the module, without introducing any track or visible disturbance in this central zone.
La figure 5B est une vue en coupe selon les lignes de coupe A-A et B-B de la figure 5A. L'extrémité distale 8 de l'antenne 6 est connectée par une connexion électrique, par exemple par un via non débouchant 12, au contact C6 du bornier, situé en face de l'antenne 6 de l'autre côté du substrat 13. Le contact C6 assure la connexion électrique avec un autre via 14, une piste 15 et un fil de connexion 16, à une borne 17 de l'interface sans contact de la puce sans contact 7b. Figure 5B is a sectional view along section lines A-A and B-B of Figure 5A. The distal end 8 of the antenna 6 is connected by an electrical connection, for example by a blind via 12, to the contact C6 of the terminal block, located opposite the antenna 6 on the other side of the substrate 13. The contact C6 provides the electrical connection with another via 14, a track 15 and a connection wire 16, to a terminal 17 of the contactless interface of the contactless chip 7b.
Cette disposition permet de façon avantageuse de ramener l'extrémité distale 8 de l'antenne 6 vers la puce sans contact 7b, sans avoir à utiliser un pontage individualisé dans la zone centrale 3 du module, comme cela est visible en figure 7. Cela permet de disposer de l'intégralité de la zone centrale 3 du module pour la réalisation d'un logo, notamment par gravure du métal. This arrangement advantageously makes it possible to bring the distal end 8 of the antenna 6 towards the contactless chip 7b, without having to use an individualized bridge in the central zone 3 of the module, as can be seen in FIG. to have the entire central zone 3 of the module for the production of a logo, in particular by engraving the metal.
Il est à noter qu'en théorie un module sans pontage conforme à l'invention pourrait être aussi être obtenu en utilisant une puce 7 duale unique. Cependant ce mode de réalisation est susceptible de poser des problèmes liés à la polarisation de l'interface sans contact de la puce par le lecteur à contact au moment de son usage, risquant de détruire la puce sans contact. L'invention prévoit donc une solution hybride avec 2 puces, l'une 7A à contact uniquement et l'autre radiofréquence 7b uniquement. On obtient dans ce cas un module qui est à la fois robuste dans son utilisation, et dépourvu d'un pont visible sur la face des contacts du bornier. It should be noted that in theory a module without bridging in accordance with the invention could also be obtained by using a single dual chip 7. However, this embodiment is liable to pose problems linked to the polarization of the contactless interface of the chip by the contact reader at the time of its use, risking the destruction of the contactless chip. The invention therefore provides a hybrid solution with 2 chips, one 7A with contact only and the other radio frequency 7b only. In this case, a module is obtained which is both robust in its use, and devoid of a visible bridge on the face of the contacts of the terminal block.
Avantages de l'invention Advantages of the invention
L'invention atteint les buts fixés. En particulier, elle permet la suppression du pontage inesthétique sur la face contact du module, et la réalisation de logos sur l'intégralité de la surface de la zone centrale 3 du bornier. En outre, elle maximise l'espace utile disponible pour l'implantation sur le module de puces de grande taille, ou de plusieurs puces dans le cas de modules hybrides. The invention achieves the stated aims. In particular, it allows the elimination of the unsightly bridging on the contact side of the module, and the production of logos on the entire surface of the central zone 3 of the terminal block. In addition, it maximizes the useful space available for the implantation on the module of large chips, or of several chips in the case of hybrid modules.
En outre, la suppression du pontage, qui peut être rompu, permet d'éliminer une source de panne module du module. In addition, the removal of the bridge, which can be broken, makes it possible to eliminate a source of module failure from the module.

Claims

REVENDICATIONS Module électronique (20) à double interface de communication à contact et sans contact, comportant un substrat diélectrique (13) présentant sur une première face un bornier de contacts électriques (Cl, C2, C3, C5, C6, C7) normalisés selon la norme ISO 7816 destinés à un fonctionnement par contact avec les contacts correspondants d'un lecteur de carte à puce, ledit substrat (13) présentant sur une seconde face les spires d'une antenne (6) située sous la zone des contacts électriques du bornier, et ladite antenne (6) comportant une extrémité distale (8) située en périphérie du module électronique (20) et une extrémité proximale (9) située à l'intérieur des spires de l'antenne (6), caractérisé en ce qu'il comporte deux puces microélectroniques distinctes (7a, 7b), à savoir une première puce (7a) pourvue d'une interface de communication à contact connectée à des contacts du bornier, et une seconde puce (7b) pourvue d'une interface de communication dite sans contact connectée aux extrémités distale (8) et proximale (9) de l'antenne (6), et l'extrémité distale (8) de l'antenne (6) étant connectée à ladite seconde interface de communication sans contact par une plage métallique intégrant un contact normalisé non connecté à ladite première interface de communication à contact. Module électronique (20) selon la revendication 1, caractérisé en ce que ladite plage métallique intègre le contact normalisé (C6) non connecté à l'interface de communication à contact de la puce microélectronique (7 ; 7a, 7b). Module électronique (20) selon la revendication 2, caractérisé en ce que l'extrémité distale (8) de l'antenne (6) est connectée au contact (C6) par une connexion perpendiculaire au plan du module, par exemple un via (12) non débouchant. Module électronique (20) selon l'une quelconque des revendications précédentes, caractérisé en ce que le contact normalisé (C6) est connecté à la borne (LA) de l'interface de communication sans contact par un second via (14) non débouchant relié à une piste conductrice (15) et un fil de connexion (16). Module électronique (20) selon l'une quelconque des revendications précédentes, caractérisé en ce qu'il comporte entre les contacts électriques (Cl, C2, C3, C5, C6, C7) normalisés une plage métallique (3) dépourvue de pontage et entièrement disponible pour la réalisation d'un logo. Carte à puce, caractérisée en ce qu'elle comporte un module électronique (20) selon l'une quelconque des revendications précédentes. CLAIMS Electronic module (20) with dual contact and contactless communication interface, comprising a dielectric substrate (13) having on a first face a terminal block of electrical contacts (C1, C2, C3, C5, C6, C7) standardized according to the ISO 7816 standard intended for operation by contact with the corresponding contacts of a smart card reader, said substrate (13) presenting on a second face the turns of an antenna (6) located under the zone of the electrical contacts of the terminal block , and said antenna (6) comprising a distal end (8) located on the periphery of the electronic module (20) and a proximal end (9) located inside the turns of the antenna (6), characterized in that it comprises two separate microelectronic chips (7a, 7b), namely a first chip (7a) provided with a contact communication interface connected to contacts of the terminal block, and a second chip (7b) provided with a communication interface so-called connected contactless at the distal (8) and proximal (9) ends of the antenna (6), and the distal end (8) of the antenna (6) being connected to said second contactless communication interface by a metal pad incorporating a standardized contact not connected to said first contact communication interface. Electronic module (20) according to Claim 1, characterized in that the said metal pad integrates the standardized contact (C6) not connected to the contact communication interface of the microelectronic chip (7; 7a, 7b). Electronic module (20) according to Claim 2, characterized in that the distal end (8) of the antenna (6) is connected to the contact (C6) by a connection perpendicular to the plane of the module, for example a via (12 ) non-opening. Electronic module (20) according to any one of the preceding claims, characterized in that the standardized contact (C6) is connected to the terminal (LA) of the contactless communication interface by a second blind via (14) connected to a conductive track (15) and a connection wire (16). Electronic module (20) according to any one of the preceding claims, characterized in that it comprises between the standardized electrical contacts (C1, C2, C3, C5, C6, C7) a metal pad (3) devoid of bridging and entirely available for the realization of a logo. Smart card, characterized in that it comprises an electronic module (20) according to any one of the preceding claims.
PCT/FR2020/000286 2020-12-31 2020-12-31 Electronic module for a smart card WO2022144508A1 (en)

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014191123A1 (en) * 2013-05-28 2014-12-04 Féinics Amatech Teoranta Antenna modules for dual interface smartcards, booster antenna configurations, and methods
WO2015071086A1 (en) 2013-11-13 2015-05-21 Féinics Amatech Teoranta Connection bridges for dual interface transponder chip modules
EP3159831A1 (en) * 2015-10-21 2017-04-26 Nxp B.V. Dual-interface ic card
WO2019045642A1 (en) 2017-08-28 2019-03-07 Smartflex Technology Pte Ltd Integrated circuit modules and smart cards incorporating the same

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014191123A1 (en) * 2013-05-28 2014-12-04 Féinics Amatech Teoranta Antenna modules for dual interface smartcards, booster antenna configurations, and methods
WO2015071086A1 (en) 2013-11-13 2015-05-21 Féinics Amatech Teoranta Connection bridges for dual interface transponder chip modules
EP3159831A1 (en) * 2015-10-21 2017-04-26 Nxp B.V. Dual-interface ic card
WO2019045642A1 (en) 2017-08-28 2019-03-07 Smartflex Technology Pte Ltd Integrated circuit modules and smart cards incorporating the same
US20190294943A1 (en) * 2017-08-28 2019-09-26 Smartflex Technology Pte Ltd Integrated circuit modules and smart cards incorporating the same

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