EP3182507A1 - Single-sided antenna module with smd component - Google Patents

Abstract

The invention relates to an integrated circuit chip module (1C), comprising: an insulating substrate (3), metallizations comprising conductive tracks (25), made on the same side of the substrate (12), forming an antenna (2) and comprising two connection ends (8, 9), a coating zone (16) or location of the radiofrequency integrated circuit chip (4) and a component (14) in the form of a surface-mounted component (SMD), the radiofrequency integrated circuit chip and the component being disposed on the same face of the substrate and connected to the antenna (2); The module is characterized in that the metallizations (2) are on one and the same side of the insulating substrate, the connection being effected by means of perforations (17) through the insulating film (3) or directly on metal metallizations. area.

Description

Field of the invention

The invention relates to an electronic module comprising an integrated circuit chip connected to a radiofrequency antenna and to a CMS surface component, for example a capacitor.

The invention may relate in particular to the field of electronic media such as contactless and / or contactless smart cards or hybrid cards, tickets or radio frequency tags (RFID), radio frequency transponders, inserts (or inlay) integrating or constituting such a module.
Such electronic supports may in particular comply with the ISO / IEC 14443 or ISO 78016 standard.

The invention is preferably used by being inserted in particular in portable electronic devices such as bracelet, watch, keychain, clothing, etc., to perform radio frequency transactions, payment, identification, authentication.

Prior art.

It is known to manufacture a smart card module by the steps corresponding to the preamble of claim 1. Such antenna modules are described in the patent. FR 2743649 B1 . According to the variants exhibited, the chip may be placed astride the turns of an antenna and at the periphery so as to allow a connection to the chip by soldered wire.

In another variant, the chip is placed in the center of the module, the antenna has a connection end located at the periphery of the turns and the connection of the chip to this end is made by soldered wire spanning the turns.

In another variant, the module comprises a conductive bridge formed on the face opposite to that carrying the turns and conductive vias through the support to connect the conductive bridge to the antenna.

The patent application EP2669852 discloses a single-sided IC module with a deflection of the peripheral antenna turns towards the center to allow a chip to be mounted astride the turns and to directly connect an external terminal of the antenna by soldered wire.

Current contactless smart antenna modules are of the double-sided type and include metallized vias conductive through the support film of the module. In these modules, it is currently proposed on the market to connect, on the etched antenna, a radio frequency integrated circuit chip (IC) and a capacitor for adjusting the resonance frequency of the radiofrequency communication transponder thus formed.
These modules are complex to build and expensive.

Technical problem.

The above modules do not allow optimization of radiofrequency performance at the best cost.

The object of the invention is to solve the above problems and in particular to have a high-performance radiofrequency module simpler and economical to manufacture.

Summary of the invention.

The invention consists firstly in adopting a single-sided antenna module substrate, secondly in providing a capacitor in the form of a passive component or an integrated circuit, thirdly in configuring this single-sided substrate so as to allow surface mounting (CMS ) a component (resistor capacitor, coil or other ...) in the form of passive component or integrated circuit chip and its connection to the antenna. Finally, fourth, the invention consists in retaining a smart card type manufacturing for mechanical reliability and amortize the manufacturing price.

The configuration of the module must allow easy manufacturing on an industrial scale and with conventional technologies of the smart card world.

Thus, one obtains a high-performance product in terms of radio frequency communication and less expensive of 75% compared to current products.

Thanks to the design of the module, we can overcome conductive vias through the insulating film, redirection tracks on a face of the substrate opposite to that supporting the antenna.

It is possible to protect the connections of the chip to the antenna in a central or medial coating zone while having the antenna on one side.

It also simplifies the manufacture with a single-sided etching while having a central or median position of the chip, allowing, if necessary, an optimal surface for bonding the module in the card.

• un substrat isolant, des métallisations comprenant des pistes conductrices, réalisées d'un même côté du substrat et formant une antenne à deux bornes de connexion,
• au moins une zone sur le film support pour l'enrobage ou l'emplacement de la puce de circuit intégré radiofréquence et d'une capacité sous forme de composant monté en surface,

la puce de circuit intégré radiofréquence et le composant étant disposés sur une même face du substrat et connectés à l'antenne,
caractérisé en ce que les pistes conductrices sont d'un seul même côté du film support, la connexion s'effectuant par le biais de perforations à travers le film isolant ou directement sur des pistes en surface du substrat isolant.The subject of the invention is therefore a radiofrequency integrated circuit chip module, comprising:

• an insulating substrate, metallizations comprising conductive tracks, made on the same side of the substrate and forming an antenna with two connection terminals,
• at least one zone on the support film for embedding or locating the radio frequency integrated circuit chip and a surface mounted component capacitance,

the radiofrequency integrated circuit chip and the component being disposed on the same face of the substrate and connected to the antenna,
characterized in that the conductive tracks are on one and the same side of the support film, the connection being effected by means of perforations through the insulating film or directly on the surface tracks of the insulating substrate.

• Le module comprend une spirale comportant des spires d'antenne en périphérie du substrat, la puce et le composant étant disposés à l'intérieur (ou au dessus) de la spirale ;
• Il comprend une borne métallisée d'interconnexion à l'intérieur de la spirale, ladite borne métallisée d'interconnexion étant reliée à l'antenne par une liaison électrique à l'état sectionné ou décourt-circuité ;

• Ledit état sectionné ou décourt-circuité résulte d'une opération parmi une ablation mécanique ou laser, une perforation ponctuelle du substrat (ou film support) et de ladite liaison, une abrasion mécanique, un poinçonnage (ou encore une gravure chimique);
• La connexion de la puce à l'antenne s'effectue par le biais de perforations à travers le film isolant ;
• La puce et le composant sont connectés à une même paire de bornes d'interconnexion disposée à l'intérieur de l'antenne sous forme de spirale ;
• Le module peut comporter de manière optimale une déviation D des spires, ladite déviation s'étendant de la périphérie du film support vers l'intérieur de la spirale ;
• le composant (14) peut être une capacité ;
• La puce et le composant (notamment condensateur) sont enrobés d'une matière isolante de protection ou d'enrobage.

According to other characteristics of the module:

• The module comprises a spiral having antenna turns at the periphery of the substrate, the chip and the component being disposed inside (or above) the spiral;
• It comprises a metallized interconnection terminal inside the spiral, said metallized interconnect terminal being connected to the antenna by a electrical connection in the sectioned or bypassed state;

• Said sectioned or uncoupling state results from an operation among a mechanical or laser ablation, a punctual perforation of the substrate (or support film) and of said connection, mechanical abrasion, punching (or else chemical etching);
• The connection of the chip to the antenna is made through perforations through the insulating film;
• The chip and the component are connected to the same pair of interconnection terminals disposed inside the antenna in the form of a spiral;
• The module may optimally comprise a deflection D of the turns, said deflection extending from the periphery of the support film towards the inside of the spiral;
• the component (14) may be a capacitance;
• The chip and the component (in particular capacitor) are coated with an insulating protective or coating material.

The invention also relates to a device such as a smart card comprising the module above. It may comprise a body with a cavity emerging on the surface and said module encircled and fixed in the cavity.

Thus, the invention makes it possible to economically manufacture a contactless smart card with the technology for manufacturing mini SIM cards by having good radiofrequency performance. The components and their connections are mechanically protected since they are encapsulated with insulating resin and the module is encased in a card body cavity as a module. smart card but preferably with antenna dimensions covering about twice the dimensions of an ISO 7816 chip card module.

The contactless card in mini SIM format can then be detached from its support thanks to a precut around it. Then the contactless card can be slipped into a bracelet or a watch (or any portable object) to perform transactions including banking, identification payment, authentication.

Brief description of the figures.

• The figures 1-2 illustrate a radiofrequency smart card module of the prior art;
• The figure 3 illustrates a current module of the prior art of double-sided type with a radio frequency chip and a capacity on the same side;
• The FIGS. 4A, 4B, 4C, 4D, 4E, 4F illustrate a radiofrequency chip module according to a first embodiment of the invention;
• The FIGS. 5A, 5B, 5C illustrate a radiofrequency chip module according to a second embodiment of the invention;
• The Figures 6 and 7 respectively illustrate a radiofrequency chip module embedded in a device body and a section according to AA of the figure 6 .

Description.

In the drawings, the same references indicate identical or similar elements.

On the Figures 1 and 2 , there is a module 1C integrated circuit of the prior art (patent application EP2669852 ). It comprises an insulating substrate 3, conductive tracks 2, made on the same side of the substrate 12, forming an antenna 2 and having two connection ends 8, 9, - a coating area or location 16 of the chip radio frequency integrated circuit; The radiofrequency integrated circuit chip is disposed on the same face 12 of the substrate 3 and is connected to the antenna; The chip 4 is mounted astride in part on a deflection (D) of the peripheral turns 25 towards a central region of the module.

To the figure 3 , is illustrated an existing embodiment; It comprises a double-face support film (or substrate) 3 comprising etched metallizations on each face of the insulating support film. On a first face 12, are formed the spiral antenna 2 and electrically conductive pads or terminals 8, 9. And on a second face 13 opposite to the first face, there are second engraved metallizations comprising interconnection pads 11a, 11b to connect the integrated circuit chip 4 and a component 14 SMD (surface mounted component) or SMD (Surface Mounted Device). The SMD component can for example be a capacitance in the form of a passive component, the capacitor being formed of a multilayer of dielectric ceramics. It is mounted on the surface of the substrate 3 as opposed to a capacitor which would be formed of capacitor plates obtained by etching on a substrate.

The chip and the component are mounted on the same side of a second face 13 of the insulating substrate and connect terminals 8, 9 of the antenna 2 via conductive vias 10 in blind perforations of the support film. The vias 10 connect terminals 8, 9 of the antenna made on the first face 12.

To the Figure 4A , an integrated circuit chip module 1A 4 according to a first embodiment of the invention, comprises, as before, an insulating substrate 3, conductive tracks 25, made on the same side of the substrate (12); These tracks form an antenna 2 with turns 25 and have two ends or terminals 8, 9.
This mode provides a zone 16 for embedding or locating the radiofrequency integrated circuit chip and the component 14, in the form of a component (of the SMD type), in particular a capacitance; The assembly 4, 14, 5 is substantially centered on a longitudinal bisector ML of the module (to allow a resin coating and embedding in a card body); The coating zone 16 is covered with a coating material 6 protecting these two components 4, 14 as well as their electrical connections. These connections can be of any known type.

The radiofrequency integrated circuit chip 4 and the component 14 are disposed on the same first face 12 of the substrate and connected to the antenna 2.

According to a characteristic of this first mode, the metallizations 8, 9 are made on one and the same side of the support film. The connection 5 connecting the components takes place here through the perforations 17 (non-metallized) of the insulating substrate 3.

The antenna is here produced by etching of metal previously bonded to a substrate presented in ribbon and having perforations or connection wells.

The antenna 2 comprises current supply tracks 19A to achieve electrical continuity of the metallizations during etching. These tracks 19A can be sectioned later at the same time as the extraction of the substrate module by punching along their periphery 33 in dashed lines. Alternatively, these tracks 19A may be sectioned at the same time as the other 19B short-circuit tracks, located outside the module (conventional circuit-breaker films chip module modules).

The antenna comprises a metallized terminal 20 of redirection inside the turns 25. This metallized redirect terminal is connected to the antenna initially by an electrical connection 19B to allow a current supply. These feeds 19A, 19B may subsequently be eliminated, in particular by punching 18 or laser, in particular during the extraction of the module 1A from its transport ribbon R.

The module is provided in a final version with the current supply electrical connections 19 in the sectioned or short-circuited state. The sectioned or unsheathed state of the electrical connection 19 may result from one of mechanical ablation or laser, punctual perforation of the support film and the bond, mechanical abrasion, punching.

The antenna turns extend here at the periphery of the support film 3 and the chip 4 and the component (in particular capacitive) 14 are arranged inside the spiral formed by the turns 25.

In a preferred application, module 1A ( Fig. 4A ) is intended to perform authentications and financial transactions, banking, payment and must be small as in the format of a mini SIM card.

To allow good communication, the turns 25 preferably extend around the periphery of the module to have a larger coupling area on a minimum surface area.

The components 4, 14 are placed substantially on a longitudinal ML median and substantially centered on the module to allow a coating of the components and embedding of the module in a smart card body substantially like mini SIM cards in 2FF format.

It is observed that the chip 4 and the component 14 are connected to the same pair of interconnection terminals 8, 9 disposed inside the antenna spiral 2. Alternatively, the antenna can be of any shape such as an antenna UHF type.

It is observed that the module has an external terminal 9 of the antenna brought close to the metallization interconnection 21 (or redirection terminal) via a deviation D of the turns; The deflection D makes a loop which extends from the periphery of the support film to a median position within the spiral (in fact towards the coating zone or location of the components 16); The deflection "D" also extends towards the metallized interconnection terminal 21 (or redirection terminal).

The Figure 4B illustrates an enlargement of a portion of the Figure 4A centered around the connections of the chip 4 and the capacitor 14.

The capacitor 14 and the radiofrequency chip 4 are disposed on a face 13 of the insulating substrate 3 and connected to the terminals (8, 9 via 21) of the antenna located on the face 12 of the support 3, opposite to the face 13. The chip 4 is connected by soldered wire 5 through wells 17 and the capacitor is connected by conductive adhesive 28 through other wells 17.

The figure 4C is an approximate cut according to CC of the Figure 4B . The capacitor rests on the substrate 3 and the connection ends of the capacitor are in line with the perforations 17 or recesses filled with conductive glue to electrically connect the capacitance to the antenna. The capacity overhangs wells 17 corresponding to it.

The figure 4D illustrates an alternative connection of the capacitor 14. It can be connected to the antenna terminals 8, 9 being arranged in a window or cavity 17 formed in the insulating substrate 3 according to a configuration of the embodiment of the Figure 4A . The advantage is to reduce the overall thickness of the module. Here, the capacitor is connected with conducting glue 28. Rather than being straddling the substrate between two wells 17, the capacitor is at the bottom of a well 17.

The figure 4F illustrates an alternative connection of the components according to a configuration of the first embodiment. This variant differs from the mode of Figure 4A in that the chip 4 and the capacitor 14 are directly connected on the one hand to the stud 9 and on the other hand to the stud 8. This embodiment has the advantage of being compact for modules with little space. Alternatively, the antenna 25 is disposed on the same side of the substrate 3 as the chip. The chip (or component) can be mounted astride turns.

The figure 4E illustrates a connection variant of the figure 4D . It differs in that the capacitor 14 is bonded to the bottom of a well 17 and connected to an antenna terminal 8 by conductive adhesive 28, the capacitor being housed at least partly in the orifice or perforation or well 17 The capacitance here includes connection areas at its opposite ends. The other end is directly connected by soldered wire 5 to the second antenna terminal 9.

The advantage here is to compensate for the height of the capacity and to have a compact configuration of the components. The chip 4 can also be arranged in a cavity of corresponding dimensions.

The module thus produced can be cut at its periphery 33 (dashed) for its extraction of a support film presented in particular in "R" coil strip.

To the Figure 5A is illustrated a second embodiment of the invention. It differs mainly from that of the Figure 4A in that the antenna 2 is disposed on the same side 13 of the substrate as that carrying the components 4, 14. Thus, the connection wells 17 are avoided and the antenna is protected from the outside of the module since it is found in the cavity C2.

The Figure 5B illustrates an enlargement of a portion of the Figure 5A centered around the components and their connections.
The chip 4 is connected to an antenna terminal 9 and a redirection terminal 21. The terminal 21 is connected to the antenna terminal 9 via an electrical connection 26a or printed on an insulating bridge 27 itself printed on turns 25 of the antenna deflection "D". Preferably, the insulating bridge is not essential, the connection being made by soldered wire and flying over the turns of the antenna especially at the level of the deflection (if it is present).

The capacitor 14 is connected to its terminals or pads 11, 12 respectively connected to the terminals 8, and 21 as to the Figure 4A with conductive glue 28. Alternatively, the capacitor 14 may be connected by soldered wire 5 to these terminals 11, 12.

This mode is advantageous in that it does not require any perforation with the exception of the uncoupling 18.

To the Figure 5C are illustrated an arrangement and an electrical connection of the capacitor 14 that may be suitable for one of the modes described above. In this arrangement, the antenna 2 and the components 4, 14 are on the same side of the substrate. The capacitor 14 is fixed astride the turns 25 of the antenna 2 with insulating glue 29. The capacitance is connected to the terminals dashing over the turns 25.

To the figure 7 , there is illustrated a main body device 30 comprising the module 1A, 1B.
In the example, the device 30 is a radio frequency transponder in the form of a smart card. However, the module 1A, 1B can be inserted in various supports or bodies of any product such as clothing, bracelet, watch, belt ...

In the example, the device 30 comprises a mini body 23 with a two-stage cavity C C1, C2, opening on the surface and the module 1A is fixed and fixed in the cavity.
The module 1A is in fact embedded in a mini-card body 23 mini SIM (2FF: 25 x 15 mm). This mini-body 22 is itself detachable in a known manner by breakable straps 31 to a main body 30 of smart card 30. Where appropriate, the other formats 3FF and 4FF smaller are covered by the invention.

Thus, the invention makes it possible to use the mini-SIM smart card technology to economically manufacture, with good range, a radio frequency transponder equipped with an economical single-sided type film.

The device or module can be in different formats including 4FF format of smart cards.

Claims (9)

Integrated circuit chip module (1C), comprising: an insulating substrate (3), metallizations comprising conductive tracks (25), made on the same side of the substrate (12), forming an antenna (2) and comprising two connection ends (8, 9), a coating zone (16) or location of the radiofrequency integrated circuit chip (4) and a component (14) in the form of a surface-mounted component (SMD), the radiofrequency integrated circuit chip and the component being disposed on the same face of the substrate and connected to the antenna (2), by an electrical connection, characterized in that the metallizations (2) are on one and the same side of the insulating substrate, said electrical connection (28, 26 being effected by means of perforations (17) through the insulating film (3) or directly on metallizations on the surface. Module according to the preceding claim, characterized in that it comprises a spiral comprising antenna turns (25) at the periphery (33) of the substrate, the chip (4) and the component (14) being arranged inside the the spiral. Module according to one of the preceding claims, characterized in that it comprises a metallized redirection terminal (21) inside the spiral, said metallized redirection terminal being connected to the antenna (2) by an electrical connection (19) in the sectioned or bypassed state. Module according to the preceding claim, characterized in that said sectioned or unsheathed state results from an operation among a mechanical or laser ablation, a point perforation (18) of the support film and of said connection, mechanical abrasion, punching. Module according to any one of the preceding claims, characterized in that the chip (4) and the component (14) are connected to the same pair of interconnection terminals (8,21) disposed inside the spiral. Module according to any one of the preceding claims, characterized in that it comprises an external terminal of the antenna (9) brought close to the interconnect metallization (21) via a deflection (D) turns, said deflection (D) extending from the periphery of the support film into the interior of the spiral and said metallized interconnect terminal (21). Module according to any one of the preceding claims, characterized in that the component (14) is a capacitor. Device (23, 30) such as a chip card comprising the module (1A, 1B)) according to one of the preceding claims. Device according to the preceding claim, characterized in that it comprises a body (22) with a cavity (C1, C2) opening on the surface and said module (1A, 1B) inset and fixed in the cavity.

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