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WO2022033409A1 - 电磁屏蔽结构的制作方法 - Google Patents

电磁屏蔽结构的制作方法 Download PDF

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Publication number
WO2022033409A1
WO2022033409A1 PCT/CN2021/111404 CN2021111404W WO2022033409A1 WO 2022033409 A1 WO2022033409 A1 WO 2022033409A1 CN 2021111404 W CN2021111404 W CN 2021111404W WO 2022033409 A1 WO2022033409 A1 WO 2022033409A1
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WO
WIPO (PCT)
Prior art keywords
layer
electromagnetic shielding
independent
shielding structure
substrates
Prior art date
Application number
PCT/CN2021/111404
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English (en)
French (fr)
Inventor
李骞
陈建超
詹新明
Original Assignee
青岛歌尔微电子研究院有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 青岛歌尔微电子研究院有限公司 filed Critical 青岛歌尔微电子研究院有限公司
Publication of WO2022033409A1 publication Critical patent/WO2022033409A1/zh

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0224—Patterned shielding planes, ground planes or power planes
    • H05K1/0227—Split or nearly split shielding or ground planes

Definitions

  • the present application relates to the technical field of packaging, and in particular, to a method for manufacturing an electromagnetic shielding structure.
  • the cavity-splitting shielding (CPS) method or the common-type shielding (CFS) method is usually adopted.
  • CPS cavity-splitting shielding
  • CFS common-type shielding
  • Sputter technology is usually used for common shielding.
  • the total cost of the process of split-cavity shielding and common-type shielding is expensive, usually accounting for more than 35% of the packaging cost.
  • the thickness of the shielding layer on the side of the circuit substrate formed by the Sputter process is smaller than the thickness of the shielding layer on the front side, and the thickness of the shielding layer is uneven, which will reduce the shielding effect.
  • the main purpose of the present application is to propose a method for fabricating an electromagnetic shielding structure, which aims to solve the expensive technical problem existing in the existing split-cavity shielding and common-type shielding.
  • the present application proposes a manufacturing method of an electromagnetic shielding structure, and the manufacturing method of the electromagnetic shielding structure includes the following steps:
  • a circuit substrate is provided, wherein the circuit substrate has a plurality of circuit units;
  • a groove is formed between different circuit units, and the circuit substrate is cut, so as to separate the circuit substrates to form a plurality of independent substrates, and each of the independent substrates includes different circuit units;
  • Electroless plating is performed on each of the independent substrates to form conductive plating layers on the walls of the grooves and the surfaces of the independent substrates to shield different circuit units to form the electromagnetic shielding structure.
  • grooves are formed between different circuit units, and the circuit substrate is cut, so as to separate the circuit substrates to form a plurality of independent substrates, and each of the independent substrates includes different Before the steps of the circuit unit, it also includes:
  • Laser irradiation is performed on the non-conductive plastic layer to form an activation layer on the surface of the non-conductive plastic layer.
  • grooves are formed between different circuit units, and the circuit substrate is cut, so as to separate the circuit substrates to form a plurality of independent substrates, and each of the independent substrates includes different
  • the steps of the circuit unit include:
  • Laser laser is performed on the non-conductive plastic layer to form the groove between different circuit units, and the activation layer is formed on the groove wall of the groove;
  • Laser cutting is performed on the circuit substrate to separate the circuit substrate to form a plurality of the independent substrates, and the activation layer is formed on the cut surface of each of the independent substrates.
  • the non-conductive plastic layer is subjected to laser laser to form the grooves between different circuit units, and after the step of forming the activation layer on the walls of the grooves ,Also includes:
  • the laser cutting is performed on the circuit substrate to separate the circuit substrate to form a plurality of the independent substrates, and before the step of forming the activation layer on the cut surface of each of the independent substrates ,Also includes:
  • Laser marking is performed on the non-conductive plastic layer to form product marks on the non-conductive plastic layer.
  • the electroless plating treatment is performed on each of the independent substrates to form a conductive plating layer on the walls of the grooves and the surface of the independent substrates, so as to shield the different circuit units and form a conductive plating layer.
  • the steps of the electromagnetic shielding structure include:
  • Electroless plating is performed on each of the independent substrates, so as to form the conductive plating layer on the active layer, so as to shield the different circuit units to form the electromagnetic shielding structure.
  • electroless plating is performed on each of the independent substrates to form a conductive plating layer on the groove wall and the surface of the independent substrate, so as to shield the different circuit units to form the Before the steps of the electromagnetic shielding structure, it also includes:
  • the sticking films attached to the front surfaces of the independent substrates are removed, so that the front surfaces and the side surfaces of the independent substrates are exposed to the outside.
  • electroless plating is performed on each of the independent substrates to form a conductive plating layer on the groove wall and the surface of the independent substrate, so as to shield the different circuit units to form the After the steps of the electromagnetic shielding structure, it also includes:
  • Electroplating is performed on each of the independent substrates to form a shielding plated layer outside the conductive plated layer, so that the conductive plated layer and the shielded plated layer jointly shield different circuit units.
  • the conductive plating layer is a metal plating layer or a composite plating layer, and the thickness of the conductive plating layer is 0.1 ⁇ m ⁇ 50 ⁇ m.
  • the non-conductive plastic layer is formed by plastic-encapsulated modified plastic of an organometallic compound.
  • the manufacturing method of the electromagnetic shielding structure of the present application there is no need to fill with silver paste, and no glue dispensing equipment and high temperature curing equipment are required, the manufacturing equipment is omitted, the manufacturing process is simplified, the manufacturing cost is reduced, and the production efficiency is improved.
  • multiple independent substrates can be chemically plated at the same time to form multiple circuit shielding structures, that is, multiple products can be made at the same time, the process stability is good, and the productivity is higher than that of the silver paste filling process, which further reduces the production cost. cost.
  • the manufacturing method of the electromagnetic shielding structure of this embodiment there is no need to use Sputter equipment and expensive targets used in the Sputter process, avoiding huge power and target consumption, low energy consumption, and only relatively low-cost electroless plating
  • the formation of the conductive coating can be realized by the solution, which not only greatly reduces the production cost, but also is not limited by the target material.
  • FIG. 1 is a schematic flowchart of a first embodiment of a method for manufacturing an electromagnetic shielding structure of the present application
  • FIG. 2 is a schematic flowchart of a second embodiment of the manufacturing method of the electromagnetic shielding structure of the present application
  • FIG. 3 is a schematic flowchart of a third embodiment of a method for manufacturing an electromagnetic shielding structure of the present application
  • FIG. 4 is a schematic flowchart of a fourth embodiment of a manufacturing method of an electromagnetic shielding structure of the present application.
  • FIG. 5 is a schematic flowchart of a fifth embodiment of the manufacturing method of the electromagnetic shielding structure of the present application.
  • FIG. 6 is a schematic side view of a circuit substrate after plastic sealing according to an embodiment of the present application.
  • FIG. 7 is a schematic side view of a circuit substrate after laser irradiation according to an embodiment of the present application.
  • FIG. 8 is a schematic side view of a circuit substrate after laser grooving according to an embodiment of the present application.
  • FIG. 9 is a schematic side view of a circuit substrate after laser cutting according to an embodiment of the present application.
  • FIG. 10 is a schematic side view of a circuit substrate after filming according to an embodiment of the present application.
  • the present application provides a manufacturing method of an electromagnetic shielding structure.
  • FIG. 1 it is a schematic flowchart of the first embodiment of the manufacturing method of the electromagnetic shielding structure of the present application. The method includes the following steps:
  • Step S100 providing a circuit substrate, wherein the circuit substrate has a plurality of circuit units;
  • circuit units 10 there are multiple circuit units 10 on the circuit substrate 100 , and the circuit units 10 may be different or the same. Electromagnetic interference may exist between different circuit units 10 . In order to prevent electromagnetic interference, circuit shielding needs to be implemented between different circuit units 10 .
  • Step S200 performing a plastic encapsulation process on the circuit substrate to form a non-conductive plastic layer on the circuit substrate, and the non-conductive plastic layer separates a plurality of the circuit units one by one;
  • the plastic encapsulation material in this embodiment does not use conventional plastic encapsulation materials such as overmolding materials, rubber, plastic or simple epoxy resin materials, but uses special plastic encapsulation materials, such as modified plastics of organometallic composites. It should be noted that the modified plastic of the organometallic composite has insulating properties, thermal conductivity, and injection molding properties.
  • the non-conductive plastic layer 20 separates the plurality of circuit units 10 one by one to realize the packaging of the circuit units 10 .
  • Step S300 opening grooves between different circuit units, and cutting the circuit substrate, so as to separate the circuit substrates to form a plurality of independent substrates, and each of the independent substrates includes different circuit units;
  • the groove processing is performed between different circuit units 10 , so that grooves 30 are formed between different circuit units 10 for subsequent electroless plating processing, Electromagnetic shielding between different circuit units 10 is achieved.
  • the circuit substrate 100 is cut, and the circuit substrate 100 after cutting is separated into a plurality of independent substrates 50 , and each independent substrate 50 includes different circuit units 10 .
  • the groove 30 in this embodiment is a common conical groove 30 as shown in FIG. 8 , that is, a conical concave that gradually narrows from top to bottom.
  • the groove 30 only needs to be formed, and the shape of the groove 30 does not need to be formed into a complex shape such as a stepped shape in order to fill the silver paste, which is simple and convenient.
  • Step S400 performing chemical plating on each of the independent substrates to form a conductive plating layer on the walls of the grooves and the surface of the independent substrate to shield different circuit units and form the electromagnetic shielding structure .
  • Each individual substrate 50 is placed into an electroless plating solution to perform an electroless plating process on each individual substrate 50 .
  • the groove wall of the groove 30 and the surface of the independent substrate 50 are soaked in the electroless plating solution, so that a conductive plating layer is formed on both the groove wall of the groove 30 and the surface of the independent substrate 50 (not shown in the figure).
  • the surface of the independent substrate 50 is all the surfaces of the independent substrate 50 except for the connection with the non-conductive plastic layer 20 , including the front and side surfaces of the independent substrate 50 .
  • a conductive plating layer is formed on the groove wall of the groove 30 and the surface of the independent substrate 50 , which can realize the electromagnetic shielding effect between different circuit units 10 and form an electromagnetic shielding structure.
  • the thickness of the conductive coating formed on the surface of the independent substrate 50 is uniform, the thickness of the conductive coating on the front side and the conductive coating on the side are the same, and there is no difference in thickness of the conductive coating, ensuring a good shielding effect of the electromagnetic shielding structure. .
  • the non-conductive plastic layer 20 in this embodiment is formed by plastic-encapsulated modified plastic of an organic metal compound, which can provide structural support for the conductive plating layer, and has good thermal conductivity, can absorb the heat generated by the circuit unit 10 , and ensure the safety of the circuit unit 10 . normal operation.
  • the manufacturing method of the electromagnetic shielding structure of the present embodiment there is no need to fill silver paste, and neither glue dispensing equipment nor high temperature curing equipment is required, manufacturing equipment is omitted, manufacturing process is simplified, manufacturing cost is reduced, and production efficiency is improved.
  • multiple independent substrates 50 can be chemically plated at the same time to form multiple circuit shielding structures, that is, multiple products can be made at the same time, the process stability is good, and the productivity is higher than that of the silver paste filling process, which further reduces the cost of production.
  • the manufacturing method of the electromagnetic shielding structure of this embodiment there is no need to use Sputter equipment and expensive targets used in the Sputter process, avoiding huge power and target consumption, low energy consumption, and only relatively low-cost electroless plating
  • the formation of the conductive coating can be realized by the solution, which not only greatly reduces the production cost, but also is not limited by the target material.
  • FIG. 2 it is a schematic flowchart of the second embodiment of the method for manufacturing an electromagnetic shielding structure of the present application. Based on the above-mentioned first embodiment, before the step S300 , the method further includes:
  • step S201 laser irradiation is performed on the non-conductive plastic layer to form an activation layer on the surface of the non-conductive plastic layer.
  • the non-conductive plastic layer 20 is irradiated with laser light, and the organometallic compound after laser irradiation will release metal ions to form a metal core and a rough surface, so as to form an activation layer on the surface of the non-conductive plastic layer 20 40.
  • the activation layer 40 is distributed on the surface of the non-conductive plastic layer 20 except for the connection with the circuit substrate 100.
  • the wavelength of laser irradiation is preferably 300 ⁇ m to 1200 ⁇ m.
  • step S300 includes:
  • Step S301 performing laser laser on the non-conductive plastic layer to form the groove between different circuit units, and form the activation layer on the groove wall of the groove;
  • laser laser is performed on the non-conductive plastic layer 20 to form grooves 30 between different circuit units 10 .
  • the metal ions will be released from the organometallic compound, forming a metal core and a rough surface on the groove wall of the groove 30, so as to form activation on the groove wall of the groove 30.
  • layer 40 and then an integrated activation layer 40 is formed on the groove wall of the groove 30 and the surface of the non-conductive plastic layer 20 .
  • Step S304 laser cutting the circuit substrate to separate the circuit substrate to form a plurality of the independent substrates, and to form the activation layer on the cut surface of each of the independent substrates.
  • laser cutting is performed on the circuit substrate 100 to cut the circuit substrate 100 into a plurality of separate individual substrates 50 .
  • the organometallic compound on the cutting surface will release metal ions, forming a metal core and a rough surface on the cutting surface, so as to form the activation layer 40 on the cutting surface of the independent substrate 50, Furthermore, in each of the independent substrates 50 , the walls of the grooves 30 and the surfaces outside the connection between the non-conductive plastic layer 20 and the circuit substrate 100 form an integrated activation layer 40 .
  • an integrated activation layer 40 is formed on the surface of each independent substrate 50, which facilitates subsequent electroless plating treatment on the integrated activation layer 40 to achieve electrical conductivity.
  • One-shot molding of the coating is
  • step S301 it also includes:
  • Step S302 dry ice cleaning is performed on the groove.
  • the use of dry ice cleaning to clean the groove 30 will not cause any damage to the surface of the groove 30, nor will it affect the smoothness of the surface of the groove 30, so as to remove impurities on the surface of the groove 30 and ensure the The grooves 30 are not affected, which facilitates subsequent electroless plating of the grooves 30 .
  • step S304 it also includes:
  • step S303 laser marking is performed on the non-conductive plastic layer to form a product mark on the non-conductive plastic layer.
  • the product mark can be traceable product information such as product model, product production date, etc., so that the product has its own logo, which is convenient for subsequent production and after-sales processes.
  • the step S400 includes:
  • Step S401 performing an electroless plating process on each of the independent substrates to form the conductive plating layer on the active layer to shield the different circuit units to form the electromagnetic shielding structure.
  • the surfaces of the individual substrates 50 are activated to form an integrated activation layer 40 . condition.
  • the individual substrates 50 are electrolessly plated with an electroless plating solution, and then a conductive plating layer is formed on the active layer 40.
  • the conductive plating layer is distributed on the surface of the independent substrate 50, which can shield different circuit units 10 before, that is, the conductive plating layer plays a role in Electromagnetic shielding effect.
  • FIG. 4 it is a schematic flowchart of the fourth embodiment of the method for manufacturing an electromagnetic shielding structure of the present application. Based on the above-mentioned first embodiment, before the step S400 , the method further includes:
  • Step S305 attaching the front side of each of the independent substrates to a film, and then attaching the back of each of the independent substrates to another film, so as to integrate the separate independent substrates on the film superior;
  • the circuit substrate 100 is divided into a plurality of independent substrates 50, and the plurality of independent substrates 50 usually need to be fixed on the fixture, for example, the plurality of independent substrates 50 are adsorbed on the vacuum base, in order to avoid
  • the process of electroless plating will affect the fixture and in order to realize the process of simultaneously performing electroless plating on a plurality of independent substrates 50 , in this embodiment, before the electroless plating, a film 60 is attached to the front surface of each independent substrate 50 first. Then stick the back of each independent substrate 50 on another sticker 60, that is, stick the fronts of multiple independent boards 50 on one sticker 60, and stick the back of the multiple independent boards 50 with another sticker 60.
  • the sticking film 60 is used to integrate the separate independent substrates 50 on the sticking film 60 to form a whole.
  • Step S306 removing the sticker film attached to the front surface of each of the independent substrates, so that the front and side surfaces of each of the independent substrates are exposed to the outside.
  • each independent substrate 50 Tear off the film 60 attached to the front of each independent substrate 50, the film 60 on the bottom surface of each independent substrate 50 is retained, each independent substrate 50 maintains the overall state, and the bottom surface of each independent substrate 50 is protected by the film 60 to prevent subsequent
  • the electroless plating process affects the pins on the bottom surface of the independent substrate 50, and at the same time avoids affecting the jig, so as to ensure the reusability of the jig.
  • the front surfaces and side surfaces of the independent substrates 50 are exposed, so that the front and side surfaces of the independent substrates 50 can be subsequently electroless-plated, so that the front surfaces of the independent substrates 50 are exposed to the outside.
  • the front surface of the independent substrate 50 includes the groove wall surface of the groove 30 .
  • the film 60 in this embodiment can use the UV film in the prior art, and the independent substrates 50 that are separated after being cut are integrated together through the film 60 , that is, chemical plating is performed on the plurality of independent substrates 50 at the same time to achieve electrical conductivity.
  • the one-time forming of the plating layer can also protect the jig and the bottom pins of the independent substrate 50 from being affected.
  • FIG. 5 is a schematic flowchart of the fifth embodiment of the method for manufacturing an electromagnetic shielding structure of the present application, based on the above-mentioned first embodiment, after the step S400 , the method further includes:
  • Step S500 performing electroplating treatment on each of the independent substrates to form a shielding coating layer outside the conductive coating layer, so that the conductive coating layer and the shielding coating layer jointly shield different circuit units.
  • the individual substrates 50 may also be subjected to electroplating treatment.
  • the conductive plating layer is a composite plating layer.
  • the individual substrate 50 can also be subjected to an electroplating treatment of first copper plating and then nickel plating to form a composite plating layer on the conductive plating layer. coating.
  • an electroplating process such as gold plating, copper plating, or stainless steel plating may also be performed on the independent substrate 50 to form a metal plating layer on the conductive plating layer.
  • an electroplating process such as gold plating, copper plating, or stainless steel plating may also be performed on the independent substrate 50 to form a metal plating layer on the conductive plating layer.
  • the thickness of the conductive plating layer is 0.1 ⁇ m ⁇ 50 ⁇ m.

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  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Abstract

本申请公开一种电磁屏蔽结构的制作方法，包括如下步骤：提供一电路基板，其中，所述电路基板上具有多个电路单元；对所述电路基板进行塑封处理，以在所述电路基板上形成非导电塑胶层，所述非导电塑胶层将多个所述电路单元一一隔开；在不同所述电路单元之间开设凹槽，并将所述电路基板切割，以使所述电路基板分离形成多个独立基板，各所述独立基板包括不同所述电路单元；对各所述独立基板进行化学镀处理，以在所述凹槽槽壁以及所述独立基板表面形成导电镀层，以对不同所述电路单元之间进行屏蔽，形成所述电磁屏蔽结构。

Description

电磁屏蔽结构的制作方法
本申请要求于2020年8月11日申请的、申请号为202010804150.3的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请涉及封装技术领域，特别涉及一种电磁屏蔽结构的制作方法。
 背景技术
目前，为了使电路基板上的不同电路单元实现电磁屏蔽，通常采用分腔屏蔽（CPS）方式或共型屏蔽（CFS）的方式，其中，分腔屏蔽需经过封装来料、激光开槽、清洗沟槽、填充银浆以及高温固化等工序，其过程需要银浆、点胶设备以及高温固化等设备，共型屏蔽通常采用Sputter工艺。但是，分腔屏蔽和共型屏蔽的制程总费用昂贵，通常占封装制费的35%以上。并且，Sputter工艺形成的电路基板侧面的屏蔽层厚度小于正面的屏蔽层厚度，屏蔽层厚度不均，将导致屏蔽效果下降。
 技术问题
本申请的主要目的是提出一种电磁屏蔽结构的制作方法，旨在解决现有的分腔屏蔽和共型屏蔽的方式存在的费用昂贵的技术问题。
 技术解决方案
为实现上述目的，本申请提出一种电磁屏蔽结构的制作方法，所述电磁屏蔽结构的制作方法包括如下步骤：
提供一电路基板，其中，所述电路基板上具有多个电路单元；
对所述电路基板进行塑封处理，以在所述电路基板上形成非导电塑胶层，所述非导电塑胶层将多个所述电路单元一一隔开；
在不同所述电路单元之间开设凹槽，并将所述电路基板切割，以使所述电路基板分离形成多个独立基板，各所述独立基板包括不同所述电路单元；
对各所述独立基板进行化学镀处理，以在所述凹槽槽壁以及所述独立基板表面形成导电镀层，以对不同所述电路单元之间进行屏蔽，形成所述电磁屏蔽结构。
在一实施例中，所述在不同所述电路单元之间开设凹槽，并将所述电路基板切割，以使所述电路基板分离形成多个独立基板，各所述独立基板包括不同所述电路单元的步骤之前，还包括：
对所述非导电塑胶层进行激光照射，以在所述非导电塑胶层的表面形成活化层。
在一实施例中，所述在不同所述电路单元之间开设凹槽，并将所述电路基板切割，以使所述电路基板分离形成多个独立基板，各所述独立基板包括不同所述电路单元的步骤包括：
对所述非导电塑胶层进行激光镭射，以在不同所述电路单元之间形成所述凹槽，并在所述凹槽槽壁形成所述活化层；
对所述电路基板进行激光切割，以使所述电路基板分离形成多个所述独立基板，并在各所述独立基板的切割面形成所述活化层。
在一实施例中，所述对所述非导电塑胶层进行激光镭射，以在不同所述电路单元之间形成所述凹槽，并在所述凹槽槽壁形成所述活化层的步骤之后，还包括：
对所述凹槽进行干冰清洗。
在一实施例中，所述对所述电路基板进行激光切割，以使所述电路基板分离形成多个所述独立基板，并在各所述独立基板的切割面形成所述活化层的步骤之前，还包括：
对所述非导电塑胶层进行激光打标，以在所述非导电塑胶层上形成产品标记。
在一实施例中，所述对各所述独立基板进行化学镀处理，以在所述凹槽槽壁以及所述独立基板表面形成导电镀层，以对不同所述电路单元之间进行屏蔽，形成所述电磁屏蔽结构的步骤包括：
对各所述独立基板进行化学镀处理，以在所述活化层上形成所述导电镀层，以对不同所述电路单元之间进行屏蔽，形成所述电磁屏蔽结构。
在一实施例中，在对各所述独立基板进行化学镀处理，以在所述凹槽槽壁以及所述独立基板表面形成导电镀层，以对不同所述电路单元之间进行屏蔽，形成所述电磁屏蔽结构的步骤之前，还包括：
将各所述独立基板的正面贴设在一贴膜上，再将各所述独立基板的背面贴设在另一贴膜上，以将分离设置的各所述独立基板整合在所述贴膜上；
取下贴设于各所述独立基板正面的所述贴膜，以使各所述独立基板的正面以及侧面暴露在外。
在一实施例中，在对各所述独立基板进行化学镀处理，以在所述凹槽槽壁以及所述独立基板表面形成导电镀层，以对不同所述电路单元之间进行屏蔽，形成所述电磁屏蔽结构的步骤之后，还包括：
对各所述独立基板进行电镀处理，以在所述导电镀层外形成屏蔽镀层，以使所述导电镀层和所述屏蔽镀层共同对不同所述电路单元进行屏蔽。
在一实施例中，所述导电镀层为金属镀层或复合镀层，所述导电镀层的厚度为0.1μm~50μm。
在一实施例中，所述非导电塑胶层采用有机金属复合物的改性塑料塑封形成。
 有益效果
本申请电磁屏蔽结构的制作方法中，无需填充银浆，也不需要点胶设备和高温固化设备，省略了制作设备并简化了制作工序，降低了制作成本，提高了生产效率。并且，本实施例可同时对多个独立基板进行化学镀处理，形成多个电路屏蔽结构，即同时制成多颗产品，制程稳定性好，产能较银浆填充工艺高，进而进一步降低了制作成本。另外，本实施例的电磁屏蔽结构的制作方法中，无需使用Sputter设备以及Sputter工序中使用的昂贵靶材，避免了巨大的电力以及靶材消耗，能耗低，仅需相对低价的化学镀溶液即可实现导电镀层的形成，不仅大大降低了制作成本，而且不受靶材材料的限制，导电镀层的材料种类更加广泛，并且，导电镀层厚度无差异，保证电磁屏蔽结构良好的屏蔽效果。
 附图说明
为了更清楚地说明本申请实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本申请的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图示出的结构获得其他的附图。
图1为本申请电磁屏蔽结构的制作方法第一实施例的流程示意图；
图2为本申请电磁屏蔽结构的制作方法第二实施例的流程示意图；
图3为本申请电磁屏蔽结构的制作方法第三实施例的流程示意图；
图4为本申请电磁屏蔽结构的制作方法第四实施例的流程示意图；
图5为本申请电磁屏蔽结构的制作方法第五实施例的流程示意图；
图6为本申请一实施例电路基板塑封处理后的侧视示意图；
图7为本申请一实施例电路基板激光照射后的侧视示意图；
图8为本申请一实施例电路基板激光镭射开槽后的侧视示意图；
图9为本申请一实施例电路基板激光切割后的侧视示意图；
图10为本申请一实施例电路基板贴膜后的侧视示意图。
附图标号说明：
标号 名称 标号 名称
100 电路基板 40 活化层
10 电路单元 50 独立基板
20 非导电塑料层 60 贴膜
30 凹槽    
本申请目的的实现、功能特点及优点将结合实施例，参照附图做进一步说明。
 本发明的实施方式
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本申请的一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
需要说明，若本申请实施例中有涉及方向性指示（诸如上、下、左、右、前、后……），则该方向性指示仅用于解释在某一特定姿态（如附图所示）下各部件之间的相对位置关系、运动情况等，如果该特定姿态发生改变时，则该方向性指示也相应地随之改变。
另外，若本申请实施例中有涉及“第一”、“第二”等的描述，则该“第一”、“第二”等的描述仅用于描述目的，而不能理解为指示或暗示其相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括至少一个该特征。另外，各个实施例之间的技术方案可以相互结合，但是必须是以本领域普通技术人员能够实现为基础，当技术方案的结合出现相互矛盾或无法实现时应当认为这种技术方案的结合不存在，也不在本申请要求的保护范围之内。
本申请提出一种电磁屏蔽结构的制作方法。
参照图1，为本申请电磁屏蔽结构的制作方法第一实施例的流程示意图，该方法包括以下步骤：
步骤S100，提供一电路基板，其中，所述电路基板上具有多个电路单元；
参照图6，可以理解地，电路基板100上具有多个电路单元10，电路单元10之间可以不同或相同。不同电路单元10之间会存在电磁干扰现象，为了防止电磁干扰，需要在不同电路单元10之间实现电路屏蔽。
步骤S200，对所述电路基板进行塑封处理，以在所述电路基板上形成非导电塑胶层，所述非导电塑胶层将多个所述电路单元一一隔开；
本实施例的塑封材料不选用包覆模制材料、橡胶、塑料或者单纯的环氧树脂材料等常规塑封材料，而是采用特殊塑封材料，比如有机金属复合物的改性塑料。需要说明的是，有机金属复合物的改性塑料具有绝缘性、导热性以及可注塑性等。非导电塑胶层20将多个电路单元10一一隔开，实现电路单元10的封装。
步骤S300，在不同所述电路单元之间开设凹槽，并将所述电路基板切割，以使所述电路基板分离形成多个独立基板，各所述独立基板包括不同所述电路单元；
参照图8和图9，电路基板100上的多个电路单元10中，在不同电路单元10之间进行开槽处理，使得不同电路单元10之间形成凹槽30，以便后续进行化学镀处理，实现不同电路单元10之间的电磁屏蔽。不同电路单元10之间开设凹槽30后，将电路基板100进行切割处理，切割后的电路基板100分离呈多个独立基板50，每个独立基板50上包括不同所述电路单元10。需要说明的是，相较于分腔屏蔽方式而言，本实施例的凹槽30开设为如图8所示的普通的锥形凹槽30，即从上至下逐渐收窄的锥形凹槽30即可，无需为了填充银浆而使凹槽30的形状成型为阶梯形等复杂形状，简单方便。
步骤S400，对各所述独立基板进行化学镀处理，以在所述凹槽槽壁以及所述独立基板表面形成导电镀层，以对不同所述电路单元之间进行屏蔽，形成所述电磁屏蔽结构。
将每个独立基板50放置进化学镀溶液里，从而对每个独立基板50进行化学镀处理。可以理解地，在进行化学镀处理的过程中，凹槽30槽壁以及独立基板50表面均浸泡化学镀溶液，从而在凹槽30槽壁以及独立基板50表面均形成导电镀层（图未示）。可以理解地，独立基板50的表面为独立基板50上除与非导电塑胶层20连接处外的所有表面，包括独立基板50的正面以及侧面。凹槽30槽壁以及独立基板50表面形成导电镀层，可实现不同电路单元10之间的电磁屏蔽作用，形成电磁屏蔽结构。并且，由于采用化学镀，独立基板50的表面上形成的导电镀层的厚度均匀，位于正面的导电镀层以及位于侧面的导电镀层的厚度一致，导电镀层无厚度差异，保证电磁屏蔽结构良好的屏蔽效果。本实施例的非导电塑胶层20采用有机金属复合物的改性塑料塑封形成，可为导电镀层提供结构支撑，并具有良好的导热性，可吸收电路单元10产生的热量，保证电路单元10的正常运行。
本实施例电磁屏蔽结构的制作方法中，无需填充银浆，也不需要点胶设备和高温固化设备，省略了制作设备并简化了制作工序，降低了制作成本，提高了生产效率。并且，本实施例可同时对多个独立基板50进行化学镀处理，形成多个电路屏蔽结构，即同时制成多颗产品，制程稳定性好，产能较银浆填充工艺高，进而进一步降低了制作成本。另外，本实施例的电磁屏蔽结构的制作方法中，无需使用Sputter设备以及Sputter工序中使用的昂贵靶材，避免了巨大的电力以及靶材消耗，能耗低，仅需相对低价的化学镀溶液即可实现导电镀层的形成，不仅大大降低了制作成本，而且不受靶材材料的限制，导电镀层的材料种类更加广泛，并且，导电镀层厚度无差异，保证电磁屏蔽结构良好的屏蔽效果。
进一步的，参照图2，为本申请电磁屏蔽结构的制作方法第二实施例的流程示意图，基于上述第一实施例，在所述步骤S300之前，还包括：
步骤S201，对所述非导电塑胶层进行激光照射，以在所述非导电塑胶层的表面形成活化层。
参照图7，对非导电塑胶层20进行激光照射，经过激光照射后的有机金属复合物会释放出金属离子，形成金属核和粗糙的表面，以在非导电塑胶层20的表面成型出活化层40，可以理解地，活化层40分布于非导电塑胶层20上除与电路基板100连接处外的表面。本实施例中，激光照射的波长优选为300μm~1200μm。
进一步地，步骤S300包括：
步骤S301，对所述非导电塑胶层进行激光镭射，以在不同所述电路单元之间形成所述凹槽，并在所述凹槽槽壁形成所述活化层；
参照图8，对非导电塑胶层20进行激光镭射，以在不同电路单元10之间镭射出凹槽30。在激光镭射出凹槽30的同时，由于激光照射的作用，有机金属复合物会释放出金属离子，在凹槽30槽壁形成金属核和粗糙的表面，以在凹槽30槽壁成型出活化层40，进而在凹槽30槽壁以及非导电塑胶层20的表面形成一体化的活化层40。
步骤S304，对所述电路基板进行激光切割，以使所述电路基板分离形成多个所述独立基板，并在各所述独立基板的切割面形成所述活化层。
参照图9，对电路基板100进行激光切割，将电路基板100切割成多个分离的独立基板50。在激光切割的同时，由于激光照射的作用，切割面的有机金属复合物会释放出金属离子，在切割面形成金属核和粗糙的表面，以在独立基板50的切割面成型出活化层40，进而在各独立基板50中，凹槽30槽壁以及除非导电塑胶层20与电路基板100连接处外的表面形成一体化的活化层40。即，在进行激光照射、激光镭射成槽以及激光切割的工序后，各独立基板50的表面形成一体化的活化层40，方便后续在一体化的活化层40上同时进行化学镀处理，实现导电镀层的一次成型。
更进一步地，在步骤S301之后，还包括：
步骤S302，对所述凹槽进行干冰清洗。
本实施例中，采用干冰清洗方式对凹槽30进行清理，不会对凹槽30表面造成任何伤害，也不会影响凹槽30表面的光洁度，进而在去除凹槽30表面杂质的同时保证凹槽30不受影响，方便后续对凹槽30进行化学镀处理。
需要说明的是，在步骤S304之前，还包括：
步骤S303，对所述非导电塑胶层进行激光打标，以在所述非导电塑胶层上形成产品标记。
产品标记可为产品型号、产品生产日期等可追溯的产品信息，使得产品自带标识，方便后续生产及售后等过程。
进一步的，参照图3，为本申请电磁屏蔽结构的制作方法第三实施例的流程示意图，基于上述第二实施例，在所述步骤S400包括：
步骤S401，对各所述独立基板进行化学镀处理，以在所述活化层上形成所述导电镀层，以对不同所述电路单元之间进行屏蔽，形成所述电磁屏蔽结构。
在进行激光照射、激光镭射成槽以及激光切割的工序后，各独立基板50的表面会被活化，形成一体化的活化层40，活化层40使得独立基板50形成粗糙的表面，达到化学镀的条件。采用化学镀溶液对各独立基板50进行化学镀处理，进而在活化层40上形成导电镀层，导电镀层分布在独立基板50的表面，，可对不同电路单元10之前进行屏蔽，即导电镀层起到电磁屏蔽作用。
进一步的，参照图4，为本申请电磁屏蔽结构的制作方法第四实施例的流程示意图，基于上述第一实施例，在所述步骤S400之前，还包括：
步骤S305，将各所述独立基板的正面贴设在一贴膜上，再将各所述独立基板的背面贴设在另一贴膜上，以将分离设置的各所述独立基板整合在所述贴膜上；
参照图10，激光切割后，电路基板100被分割为多个独立基板50，且多个独立基板50通常需固定在治具上，比如，多个独立基板50被吸附在真空底座上，为了避免化学镀的过程会对治具造成影响以及为了实现对多个独立基板50同时进行化学镀的过程，本实施例中，在化学镀之前，先将各独立基板50的正面贴设在一贴膜60上，再将各独立基板50的背面贴设在另一贴膜60上，即，将多个独立基板50的正面贴在一个贴膜60上，并且，多个独立基板50的背面贴设有另一个贴膜60，以将分离设置的各独立基板50整合在贴膜60上，形成整体。
步骤S306，取下贴设于各所述独立基板正面的所述贴膜，以使各所述独立基板的正面以及侧面暴露在外。
撕掉贴设于各独立基板50正面的贴膜60，各独立基板50的底面的贴膜60被保留，各独立基板50保持整体状态，而各独立基板50的底面被贴膜60保护起来，以防后续化学镀过程对独立基板50的底面引脚产生影响，同时避免对治具造成影响，保证治具的可重新使用性。撕掉贴设于各独立基板50正面的贴膜60后，各独立基板50的正面以及侧面则暴露在外，以便后续对各独立基板50的正面以及侧面进行化学镀处理，从而在独立基板50的正面以及侧面形成导电镀层，可以理解地，独立基板50的正面包括凹槽30的槽壁面。
本实施例的贴膜60可采用现有技术中的UV膜，将经过切割后呈分离设置的各独立基板50通过贴膜60整合在一起，即对多个独立基板50同时进行化学镀处理，实现导电镀层的一次成型，又可以保护治具以及独立基板50的底面引脚不受影响。
进一步的，参照图5，为本申请电磁屏蔽结构的制作方法第五实施例的流程示意图，基于上述第一实施例，在所述步骤S400之后，还包括：
步骤S500，对各所述独立基板进行电镀处理，以在所述导电镀层外形成屏蔽镀层，以使所述导电镀层和所述屏蔽镀层共同对不同所述电路单元进行屏蔽。
对各独立基板50进行化学镀处理后，为了提高电磁屏蔽结构的电磁屏蔽作用，还可对各独立基板50进行电镀处理。在一实施例中，导电镀层为复合镀层，具体地，在对各独立基板50进行化学镀处理后，还可对独立基板50进行先镀铜再镀镍的电镀处理，在导电镀层上形成复合镀层。在另一实施例中，在对各独立基板50进行化学镀处理后，还可对独立基板50进行镀金、镀铜或镀不锈钢等的电镀处理，在导电镀层上形成金属镀层。如此，通过化学镀和电镀结合的方式，在独立基板50正面以及侧面先后形成导电镀层以及复合镀层或金属镀层，提高电磁屏蔽结构的电磁屏蔽作用。在优选的实施例中，所述导电镀层的厚度为0.1μm~50μm。
以上仅为本申请的优选实施例，并非因此限制本申请的专利范围，凡是在本申请的发明构思下，利用本申请说明书及附图内容所作的等效结构变换，或直接/间接运用在其他相关的技术领域均包括在本申请的专利保护范围内。

Claims (10)

  1. 一种电磁屏蔽结构的制作方法，其中，所述电磁屏蔽结构的制作方法包括如下步骤：
    提供一电路基板，其中，所述电路基板上具有多个电路单元；
    对所述电路基板进行塑封处理，以在所述电路基板上形成非导电塑胶层，所述非导电塑胶层将多个所述电路单元一一隔开；
    在不同所述电路单元之间开设凹槽，并将所述电路基板切割，以使所述电路基板分离形成多个独立基板，各所述独立基板包括不同所述电路单元；
    对各所述独立基板进行化学镀处理，以在所述凹槽槽壁以及所述独立基板表面形成导电镀层，以对不同所述电路单元之间进行屏蔽，形成所述电磁屏蔽结构。
  2. 如权利要求1所述的电磁屏蔽结构的制作方法，其中，所述在不同所述电路单元之间开设凹槽，并将所述电路基板切割，以使所述电路基板分离形成多个独立基板，各所述独立基板包括不同所述电路单元的步骤之前，还包括：
    对所述非导电塑胶层进行激光照射，以在所述非导电塑胶层的表面形成活化层。
  3. 如权利要求2所述的电磁屏蔽结构的制作方法，其中，所述在不同所述电路单元之间开设凹槽，并将所述电路基板切割，以使所述电路基板分离形成多个独立基板，各所述独立基板包括不同所述电路单元的步骤包括：
    对所述非导电塑胶层进行激光镭射，以在不同所述电路单元之间形成所述凹槽，并在所述凹槽槽壁形成所述活化层；
    对所述电路基板进行激光切割，以使所述电路基板分离形成多个所述独立基板，并在各所述独立基板的切割面形成所述活化层。
  4. 如权利要求3所述的电磁屏蔽结构的制作方法，其中，所述对所述非导电塑胶层进行激光镭射，以在不同所述电路单元之间形成所述凹槽，并在所述凹槽槽壁形成所述活化层的步骤之后，还包括：
    对所述凹槽进行干冰清洗。
  5. 如权利要求3所述的电磁屏蔽结构的制作方法，其中，所述对所述电路基板进行激光切割，以使所述电路基板分离形成多个所述独立基板，并在各所述独立基板的切割面形成所述活化层的步骤之前，还包括：
    对所述非导电塑胶层进行激光打标，以在所述非导电塑胶层上形成产品标记。
  6. 如权利要求3所述的电磁屏蔽结构的制作方法，其中，所述对各所述独立基板进行化学镀处理，以在所述凹槽槽壁以及所述独立基板表面形成导电镀层，以对不同所述电路单元之间进行屏蔽，形成所述电磁屏蔽结构的步骤包括：
    对各所述独立基板进行化学镀处理，以在所述活化层上形成所述导电镀层，以对不同所述电路单元之间进行屏蔽，形成所述电磁屏蔽结构。
  7. 如权利要求1-6中任一项所述的电磁屏蔽结构的制作方法，其中，在对各所述独立基板进行化学镀处理，以在所述凹槽槽壁以及所述独立基板表面形成导电镀层，以对不同所述电路单元之间进行屏蔽，形成所述电磁屏蔽结构的步骤之前，还包括：
    将各所述独立基板的正面贴设在一贴膜上，再将各所述独立基板的背面贴设在另一贴膜上，以将分离设置的各所述独立基板整合在所述贴膜上；
    取下贴设于各所述独立基板正面的所述贴膜，以使各所述独立基板的正面以及侧面暴露在外。
  8. 如权利要求1-6中任一项所述的电磁屏蔽结构的制作方法，其中，在对各所述独立基板进行化学镀处理，以在所述凹槽槽壁以及所述独立基板表面形成导电镀层，以对不同所述电路单元之间进行屏蔽，形成所述电磁屏蔽结构的步骤之后，还包括：
    对各所述独立基板进行电镀处理，以在所述导电镀层外形成屏蔽镀层，以使所述导电镀层和所述屏蔽镀层共同对不同所述电路单元进行屏蔽。
  9. 如权利要求1-6中任一项所述的电磁屏蔽结构的制作方法，其中，所述导电镀层为金属镀层或复合镀层，所述导电镀层的厚度为0.1μm~50μm。
  10. 如权利要求1-6中任一项所述的电磁屏蔽结构的制作方法，其中，所述非导电塑胶层采用有机金属复合物的改性塑料塑封形成。
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