WO2022070465A1

WO2022070465A1 - Microstructure manufacturing device and microstructure manufacturing method

Info

Publication number: WO2022070465A1
Application number: PCT/JP2021/009784
Authority: WO
Inventors: 道也横田; 亮一稲葉
Original assignee: 信越エンジニアリング株式会社
Priority date: 2020-10-01
Filing date: 2021-03-11
Publication date: 2022-04-07
Also published as: TW202228988A; WO2022070390A1; JPWO2022070390A1; CN115243863A; JP6950120B1; TWI849338B; KR20230047950A

Abstract

The present invention performs reverse operations of joining or additional pressing of separated recessed and protruding portions and separation of joined recessed and protruding portions, through a change in control of the internal pressure difference.　The present invention provides a microstructure manufacturing device characterized by comprising: a transformer room that is formed inside a chamber and in which a first plate-shaped member and a second plate-shaped member are accommodated so as to be freely put in and out; a variable part that is provided between a first non-opposing surface of the first plate-shaped member, which is accommodated in the transformer room, and a first indoor surface of the chamber; a holding part that is provided between a second non-opposing surface of the second plate-shaped member, which is accommodated in the transformer room, and a second indoor surface of the chamber; a first space that is provided in an airtight manner between the first indoor surface of the chamber and the variable part so as to be separated from the transformer room; a room-pressure adjustment unit that increases the internal pressure of one of the transformer room and the first space so as to be higher than the internal pressure of the other; and a control unit that controls the operation of the room-pressure adjustment unit. The microstructure manufacturing device is also characterized in that: the variable part has a displacement portion that abuts against the first non-opposing surface of the first plate-shaped member in such a manner as to be able to freely deform or move in the thickness direction thereof with respect to the first indoor surface of the chamber; the holding part has a holding portion that supports the second non-opposing surface of the second plate-shaped member with respect to the second indoor surface of the chamber; and the control unit performs a control such that the first plate-shaped member, together with the displacement portion of the variable part, moves toward the second plate-shaped member or the first space as a result of the pressure difference between the transformer room and the first space due to the operation of the room-pressure adjustment unit.

Description

Microstructure manufacturing equipment and microstructure manufacturing method

The present invention produces microstructures including microelements such as microLEDs and microchips, microfabrications molded by microfabrication technology such as nanoimprint, and microstructures including microinsulation pieces including small glass pieces. The present invention relates to a microstructure manufacturing apparatus used for this purpose, and a microstructure manufacturing apparatus using the microstructure manufacturing apparatus.
Specifically, a microstructure manufacturing apparatus used for joining or additional pressing of separated microstructures, separating (peeling) of joined microstructures, or transferring microstructures, and microstructure manufacturing. Regarding the method.

Conventionally, as a microstructure manufacturing apparatus of this type, a peeling prevention means for pressurizing a mold having at least one of them in the form of a film and a molded object so as not to peel off to a predetermined peeling position, and a mold or a molded object. Mold release provided with a holding portion for holding either one, a tension applying means for applying tension to the mold or the object to be molded, and a peeling preventing means and a moving means for relatively moving the mold and the object to be molded. There is an apparatus (see, for example, Patent Document 1).
By nanoimprint technology, the molding pattern of the mold is pressed against the object to be molded such as resin, the molding pattern is transferred to the object to be molded by using heat or light, and then the mold is released from the object to be molded.
In the illustrated example of Patent Document 1, a mold formed in a flexible film shape is peeled off from the peeling position with respect to the object to be molded held in the holding portion, and the mold after peeling and the object to be molded are peeled off. An angle adjusting means for adjusting the angle between the object and the object is provided. That is, the angle adjusting means is used to diagonally pull out the molding pattern of the mold from the object to be molded at a constant mold release angle.

International Publication No. 2015/072572

However, in Patent Document 1, since the molding pattern of the mold is pulled out diagonally at a predetermined angle with respect to the uneven pattern transferred to the object to be molded, the uneven pattern of the object to be molded is deformed in the peeling process. Will cause damage.
More specifically, the case of nanoimprint shown in FIGS. 15 (a) to 15 (c) will be described.
In the state before peeling shown in FIG. 15 (a), the uneven pattern 210 transferred to the object to be molded 200 by the uneven bonding with the forming pattern 110 of the mold 100 is perpendicular to the bottom surface 220 of the object to be molded 200. Standing in the shape.
However, in the state at the time of peeling shown in FIG. 15B, the convex portion 211 of the uneven pattern 210 of the object to be molded 200 collapses as the molding pattern 110 of the mold 100 is pulled out in an oblique direction. ..
Therefore, even in the state after peeling shown in FIG. 15C, the convex portion 211 of the uneven pattern 210 that has once collapsed remains collapsed and does not return to the state before peeling.
When the direction (peeling direction) of pulling out the molding pattern 110 of the mold 100 from the uneven pattern 210 of the object to be molded 200 is slanted in this way, the shape is deformed (tilted) as the unevenness difference of the uneven pattern 210 becomes longer. There was a problem that it became easy to perform and it was not possible to achieve high-precision imprint molding.
In particular, in the case of nanoimprint, since the uneven pattern is extremely fine, there is a problem that even a slight shape deformation (tilt) at the time of peeling causes damage to the uneven pattern and makes it impossible to produce a highly accurate uneven pattern.
By the way, not only the micromolds molded by nanoimprint technology, but also microstructures including microelements such as micro LEDs and microchips, and microstructures including microinsulation pieces including glass pieces are small in size. Not only is it vulnerable to damage, it is difficult to handle. Therefore, in addition to the separation device including the release device as in Patent Document 1, there is a demand for a joining device for separated microstructures, an additional pressing device, a transfer device for microstructures, and the like.
Under such circumstances, there is a demand for a manufacturing apparatus capable of performing joining, additional pressing, separation, transfer, etc. of microstructures with the same structure.

In order to solve such a problem, the microstructure manufacturing apparatus according to the present invention has either or both of the first facing surface of the first plate-shaped member facing each other and the second facing surface of the second plate-shaped member. A transformer chamber formed inside a chamber in which the first plate-shaped member and the second plate-shaped member are freely moved in and out, and the above-mentioned microstructure manufacturing apparatus for joining or separating the uneven portions of the above. The variable portion provided between the first non-opposing surface of the first plate-shaped member housed in the transformation chamber and the first chamber surface of the chamber, and the second plate-shaped member housed in the transformation chamber. A holding portion provided between the second non-opposing surface and the second chamber surface of the chamber, and the transformer chamber separated from the transformer chamber between the first chamber surface and the variable portion of the chamber, are provided in an airtight manner. It includes a first space unit, a chamber pressure adjusting unit that raises the internal pressure of either the transformer chamber or the first space unit more than the other internal pressure, and a control unit that controls the operation of the chamber pressure adjusting unit. The variable portion has a displacement portion that is deformably or movably abutted against the first non-opposing surface of the first plate-shaped member in the thickness direction thereof with respect to the first chamber surface of the chamber, and holds the first plate-shaped member. The unit has a holding portion that supports the second non-opposing surface of the second plate-shaped member with respect to the second chamber surface of the chamber, and the control unit is the transformation caused by the operation of the chamber pressure adjusting unit. The pressure difference between the chamber and the first space portion controls the first plate-shaped member to move toward the second plate-shaped member or the first space portion together with the displacement portion of the fluctuation portion. It is characterized by.
Further, in order to solve such a problem, the microstructure manufacturing method according to the present invention is one of either the first facing surface of the first plate-shaped member or the second facing surface of the second plate-shaped member facing each other. It is a method for manufacturing a microstructure that joins or separates uneven portions having both of them, and is a carry-in step of inserting the first plate-shaped member and the second plate-shaped member into a transformation chamber formed inside the chamber, and the above-mentioned. A holding step of positioning the first plate-shaped member along the first chamber surface of the chamber and positioning the second plate-shaped member along the second chamber surface of the chamber, and adjusting the internal pressure of the transformer chamber. The chamber pressure adjusting step and the carrying-out step of taking out the first plate-shaped member and the second plate-shaped member from the transformation chamber are included, and in the holding step, the first non-opposing surface of the first plate-shaped member is used. The first non-opposing surface of the first plate-shaped member is deformed or movably contacted in the thickness direction with respect to the displacement portion of the variable portion provided between the first chamber surface and the first plate-shaped member. A first space portion is provided in an airtight manner between the first chamber surface and the variable portion so as to be separated from the transformation chamber, and the second non-opposing surface of the second plate-shaped member and the second chamber surface are provided. The second non-opposing surface of the second plate-shaped member is brought into contact with the holding portion of the holding portion provided between them in the thickness direction to support the holding portion, and in the chamber pressure adjusting step, the chamber pressure adjusting portion is used. The internal pressure of either one of the transformation chamber or the first space portion is increased more than the internal pressure of the other, and the first plate-shaped member together with the displacement portion of the variable portion is the second plate-shaped member or the first. It is characterized by moving toward one space.

It is explanatory drawing which shows the whole structure of the microstructure manufacturing apparatus and the microstructure manufacturing method (joining apparatus and joining method) which concerns on embodiment (first embodiment) of this invention, (a) is a vertical sectional front surface after carrying in. FIG. 1 (b) is a cross-sectional plan view of FIG. 1 (a). It is explanatory drawing which shows the carry-in process-holding process of the same joining method, (a) is a vertical sectional front view of a primary carry-in process, (b) is a vertical sectional front view of a secondary carry-in process, (c) is a vertical sectional front view of a holding process. It is a figure. It is explanatory drawing which shows the holding process to carry-out process of the same joining method, (a) is a vertical sectional front view after a chamber is closed, (b) is a vertical sectional front view of a differential pressure process and a pressure joining process, (c) is. It is a vertical sectional front view of the air opening process and the carrying-out process. It is explanatory drawing which shows the whole structure of the microstructure manufacturing apparatus and the microstructure manufacturing method (separation apparatus and separation method) which concerns on embodiment (second embodiment) of this invention, and (a) is a vertical sectional front surface after carrying in. FIG. 4B is a cross-sectional plan view of FIG. 4A, and FIG. 4C is a partially enlarged vertical sectional front view. It is explanatory drawing which shows the holding process-chamber pressure adjustment process of the same separation method, (a) is a vertical sectional front view after a chamber is closed, (b) is a vertical sectional front view of a differential pressure process, (c) is a peeling process. It is a vertical sectional front view. It is explanatory drawing which shows the room pressure adjustment process to carry-out process of the same separation method, (a) is a vertical sectional front view of an atmosphere opening process, (b) is a vertical sectional front view of a primary carry-out process, (c) is a secondary carry-out process. It is a vertical sectional front view of. It is explanatory drawing which shows the whole structure of the microstructure manufacturing apparatus and the microstructure manufacturing method (transfer apparatus and transfer method) which concerns on embodiment (third embodiment) of this invention, (a) is a vertical sectional front surface after carrying in. FIG. 7 (b) is a cross-sectional plan view of FIG. 7 (a). It is explanatory drawing which shows the carry-in process-holding process of the same transfer method, (a) is a vertical sectional front view of a primary carry-in process, (b) is a vertical sectional front view of a secondary carry-in process, (c) is a vertical sectional front view of a holding process. It is a figure. It is explanatory drawing which shows the holding process-chamber pressure adjustment process of the same transfer method, (a) is a longitudinal front view after closing a chamber, (b) is a longitudinal front view of a differential pressure process and a pressure joining process, (c). ) Is a longitudinal front view of the differential pressure process and the peeling process. It is explanatory drawing which shows the room pressure adjustment process to carry-out process of the same transfer method, (a) is the vertical sectional front view of the atmosphere opening process, (b) is the vertical sectional front view of the primary carry-out process, (c) is the secondary carry-out process. It is a vertical sectional front view of. It is explanatory drawing which shows the modification (4th Embodiment) of the microstructure manufacturing apparatus and the microstructure manufacturing method which concerns on embodiment of this invention, (a) is the vertical sectional front view after carrying in, (b) is the difference. The longitudinal front view of the compression process and (c) are the longitudinal front views of the peeling process. It is explanatory drawing which shows the modification (fifth embodiment) of the microstructure manufacturing apparatus and the microstructure manufacturing method which concerns on embodiment of this invention, (a) is the vertical sectional front view after carrying in, (b) is the difference. The longitudinal front view of the compression process and (c) are the longitudinal front views of the peeling process. It is explanatory drawing which shows the modification (sixth embodiment) of the microstructure manufacturing apparatus and the microstructure manufacturing method which concerns on embodiment of this invention, (a) is the vertical sectional front view after carrying in, (b) is the difference. The longitudinal front view of the compression process and (c) are the longitudinal front views of the peeling process. It is explanatory drawing which shows the modification (seventh embodiment) of the microstructure manufacturing apparatus and the microstructure manufacturing method which concerns on embodiment of this invention, (a) is the vertical sectional front view after carrying in, (b) is the difference. The longitudinal front view of the compression process and (c) are the longitudinal front views of the peeling process. It is explanatory drawing which shows an example of the conventional separation method. It is a figure.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
As shown in FIGS. 1 to 14, the microstructure manufacturing apparatus A and the microstructure manufacturing method according to the embodiment of the present invention are either the first plate-shaped member B or the second plate-shaped member C facing each other. On the other hand, it is a manufacturing apparatus and manufacturing method for producing the microstructure M by joining or separating the uneven portions of both the first plate-shaped member B and the second plate-shaped member C. The joining or separation of the uneven portion is performed by the relative approach or separation movement of the first plate-shaped member B and the second plate-shaped member C in the facing direction.
The first plate-shaped member B and the second plate-shaped member C are hard materials such as glass and synthetic resin, and are formed in the shape of a rectangle (a rectangle and a quadrilateral having right-angled corners including a square) or a circular thin plate.
The first facing surface Bf on the front side facing the second plate-shaped member C in the first plate-shaped member B and the second facing surface Cf on the front side facing the first plate-shaped member B in the second plate-shaped member C are Either one of the first facing surface Bf or the second facing surface Cf, or both the first facing surface Bf and the second facing surface Cf.
It has an uneven portion that becomes a part of the microstructure M described later.
That is, the microstructure M described later with respect to the first facing surface Bf of the first plate-shaped member B and the second facing surface Cf of the second plate-shaped member C is finally fixed by adhesion or the like, or is held detachably. It is arranged in an uneven shape by temporary fixing or integration by integral formation. Therefore, as the holding means D of the microstructure M described later, in the case of main fixing, a fixing layer D1 such as an adhesive is used on the first facing surface Bf of the first plate-shaped member B and the second plate-shaped member C. It is provided on the second facing surface Cf, and in the case of temporary fixing, the holding chuck D2 is provided on the first facing surface Bf of the first plate-shaped member B and the second facing surface Cf of the second plate-shaped member C. Specific examples of the holding chuck D2 include a vacuum chuck, an adhesive chuck using an adhesive member, and an electrostatic chuck due to electrostatic adsorption.

The microstructure M includes a microstructure M1 having microelements such as micro LEDs and microchips, microinsulation pieces such as glass pieces, and microparts Ma such as microparts similar to these, and nanoimprints and the like. There are a molding die Mb and a molding substrate Mc which are joined to each other in a concavo-convex manner, which are molded by the microfabrication technique of the above.
As shown in FIGS. 1 to 3, the microstructure M1 is laminated so as to sandwich and join the micropart Ma arranged (mounted) between the first plate-shaped member B and the second plate-shaped member C. As shown in FIGS. 7 to 10, there is a type and a transfer type in which the minute component Ma arranged (mounted) on either the first plate-shaped member B or the second plate-shaped member C is transferred to the other. .. In general, a plurality of minute parts Ma are often arranged in parallel with each of the first plate-shaped member B and the second plate-shaped member C at predetermined intervals.
Therefore, regardless of whether it is a laminated type or a transfer type, in the initial state before joining, either the first facing surface Bf of the first plate-shaped member B or the second facing surface Cf of the second plate-shaped member C. The minute component Ma arranged on one side (second facing surface Cf in the illustrated example) partially protrudes toward the other side. Therefore, either the first facing surface Bf of the first plate-shaped member B or the second facing surface Cf of the second plate-shaped member C is a non-contact uneven portion (non-contact) in which the minute component Ma partially protrudes. It has a joint uneven portion Cu).
As an example of the microstructure manufacturing apparatus A and the microstructure manufacturing method for manufacturing the laminated type microstructure M1 in which the non-bonding concavo-convex portion Cu is joined as the non-contact uneven portion, the joining device and the joining method are used. Used.
Other examples of the microstructure manufacturing apparatus A for manufacturing the transfer type microstructure M1 in which the non-bonded concavo-convex portion Cu is transferred as the non-contact uneven portion and the microstructure manufacturing method include a transfer device and transfer. The method is used.

In the micromolded product M2, as shown in FIGS. 4 to 6, a molding die Mb or the like is arranged on either the first plate-shaped member B or the second plate-shaped member C, and the molded substrate Mc is placed on the other. Another type in which the above is arranged and unevenly joined to each other, and one of the first plate-shaped member B or the second plate-shaped member C becomes a molding mold Mb, and the other whole becomes a molding substrate Mc. There is an integrated type (not shown) that is joined to the uneven surface. Further, although not shown in the micromolded product M2, an adhesive chuck or the like in which the micropart Ma is arranged on either the first plate-shaped member B or the second plate-shaped member C and the micropart Ma is detachably held. Another type or an integrated type in which the holding means is arranged on the other side is also included.
Therefore, regardless of whether it is a different type or an integrated type, in the initial state before the separation, the molding mold Mb or the minute part Ma of either the first plate-shaped member B or the second plate-shaped member C is used. It has a pair of concavo-convex portions (first joint concavo-convex portion B1, second concavo-convex portion C1) in which the other molded substrate Mc and the holding means are concavo-convex-bonded.
Another type or integral type micromolded product M2 having a first joint uneven portion B1 and a second joint uneven portion C1 which are uneven portions in which the molding mold Mb, the minute component Ma, etc., and the molding substrate Mc, the holding means, etc. are unevenly joined. As another example of the microstructure manufacturing apparatus A and the microstructure manufacturing method for manufacturing the above, a separation device and a separation method are used.
In particular, in the case of the micromolded product M2, it is preferable to have a gap E between the first plate-shaped member B and the second plate-shaped member C. As a specific example of the gap E, outer gaps E1 such as a square frame or an annular shape formed on the outside of a plurality of first joint uneven portions B1 and second joint uneven portions C1 shown in FIGS. 4 and 5 and the like. Through gap E2 passing between the plurality of first joint uneven portions B1 and the second joint uneven portion C1, through holes h formed in the first plate-shaped member B and the second plate-shaped member C shown in FIG. There is an inner gap E3 that communicates with.

More specifically, the microstructure manufacturing apparatus A according to the embodiment of the present invention has a transformer chamber 1 in which the first plate-shaped member B and the second plate-shaped member C are housed, and a first transformer chamber 1 housed in the transformer chamber 1. The variable portion 2 provided on the back side of the plate-shaped member B, the holding portion 3 provided on the other back side of the second plate-shaped member C housed in the transformer chamber 1, and the first one provided separately from the transformer chamber 1. A space unit 4 and a room pressure adjusting unit 5 provided so as to cause a pressure difference between the internal pressures of the transformer chamber 1 and the first space unit 4 are provided as main components.
Further, the first internal pressure adjusting unit 6 for changing the internal pressure of the first space portion 4, the second space portion 7 provided separately from the transformer chamber 1, and the second internal pressure adjusting for changing the internal pressure of the second space portion 7. It is preferable to include a unit 8 and a control unit 9 for operating and controlling the chamber pressure adjusting unit 5, the first internal pressure adjusting unit 6, the second internal pressure adjusting unit 8, and the like.
Further, the first plate-shaped member B and the second plate-shaped member C are usually arranged so as to face each other in the vertical direction, and the thickness direction of the first plate-shaped member B and the second plate-shaped member C is hereinafter referred to as "Z direction". ". The direction along the first plate-shaped member B and the second plate-shaped member C that intersect the Z direction is hereinafter referred to as "XY direction".
In the illustrated example, the rectangular first plate-shaped member B is arranged above, and the rectangular second plate-shaped member C is arranged below. Although not shown as another example, on the contrary, the rectangular first plate-shaped member B is arranged below and the rectangular second plate-shaped member C is arranged above, or the circular first plate-shaped member B is arranged. It is also possible to make changes such as arranging the circular second plate-shaped member C vertically.

The transformer chamber 1 is formed so as to be hermetically sealed inside the chamber 10, and the first plate-shaped member B and the second plate-shaped member C can be freely moved in and out of the transformer chamber 1 in the chamber 10 and the external space of the chamber 10. Is housed in.
The inside of the chamber 10 has a first chamber surface 10a and a second chamber surface 10b arranged so as to face the brought-in first plate-shaped member B and the second plate-shaped member C in the thickness direction (Z direction).
The first chamber surface 10a is formed on a plane in the XY direction directly or indirectly facing the first non-opposing surface Br on the back side of the first plate-shaped member B in the Z direction. It is preferable to dispose a gap detection sensor (not shown) on the first chamber surface 10a in order to detect the position of the first non-opposing surface Br of the first plate-shaped member B.
The second indoor surface 10b is formed in the second plate-shaped member C on a plane in the XY direction directly or indirectly facing the second non-opposing surface Cr on the back side in the Z direction.
The chamber 10 has an entrance / exit 10c for moving the first plate-shaped member B and the second plate-shaped member C in and out of the sealable transformer chamber 1. The entrance / exit 10c of the chamber 10 is configured to be openable / closable, and is opened / closed by a drive mechanism 10d including an actuator or the like. The transformer chamber 1 of the chamber 10 has a split type, a partial opening / closing type, and the like, and each has a different structure of the entrance / exit 10c.
The first plate-shaped member B and the second plate-shaped member C are carried into the transformer chamber 1 sequentially or simultaneously by using a transport means (not shown) such as a transport robot. The first plate-shaped member B and the second plate-shaped member C are carried out from the transformer chamber 1 simultaneously or sequentially by the transport means.

The fluctuating portion 2 is arranged so as to be in contact with the first non-opposing surface Br of the carried-in first plate-shaped member B in the thickness direction (Z direction) and to be separated from the first chamber surface 10a of the chamber 10. To.
The fluctuating portion 2 has a displacement portion 2a that abuts on the first chamber surface 10a of the chamber 10 in the thickness direction (Z direction) with the first non-opposing surface Br of the first plate-shaped member B carried in.
The displacement portion 2a is configured to be deformable or movable in the thickness direction (Z direction), and is brought into contact with the first non-opposing surface Br of the carried-in first plate-shaped member B in the thickness direction (Z direction). It is positioned and integrated so that it cannot be displaced in the direction intersecting with (XY direction).
That is, in the variable portion 2, the displacement portion 2a is arranged so as to be deformable or movable in the Z direction with respect to the first chamber surface 10a of the chamber 10, and the first plate-shaped member is arranged as the displacement portion 2a is deformed or moved. It is configured to move B in the Z direction.
A first space portion 4 is formed between the fluctuating portion 2 and the first chamber surface 10a of the chamber 10 so as to be isolated from the transformer chamber 1. The first space portion 4 is formed in an airtight manner by abutting the first non-opposing surface Br of the first plate-shaped member B against the displacement portion 2a of the fluctuating portion 2.
Further, it is preferable that the variable portion 2 has a first vent 2b that allows the first non-opposing surface Br of the first plate-shaped member B and the first space portion 4 to communicate with each other.

When shown in FIGS. 1 to 6 as a specific example of the fluctuating portion 2, it is composed of an elastic ventilator 21 attached so as to be elastically deformable in the Z direction with respect to the first chamber surface 10a of the chamber 10.
The elastic ventilator 21 of the illustrated example is an elastically deformable material such as a soft synthetic resin or rubber, and is a packing or O formed in a square frame shape or an annular shape having one first vent 2b in the center thereof. It consists of an annular member such as a ring. At one end of the elastic ventilator 21 in the thickness direction (Z direction), a mounting portion 21a with respect to the first chamber surface 10a of the chamber 10 is provided. The elastic ventilator 21 is formed by contacting the other end of the thickness direction (Z direction) with the first non-opposing surface Br of the carried-in first plate-shaped member B as the displacement portion 2a. The first space portion 4 is formed inside. Therefore, the elastic ventilator 21 can be elastically compressively deformed and expanded and deformed in the Z direction due to the pressure difference between the internal pressure of the transformer chamber 1 and the internal pressure of the first space portion 4.
Although not shown as another example of the elastic vent body 21, a plate-shaped member having a plurality of first vents 2b, a porous member having a large number of first vents 2b, and the like may be used instead of the annular member. Is also possible.
In these cases, the gap detection sensor arranged on the first chamber surface 10a of the chamber 10 detects the position of the first plate-shaped member B, whereby the first plate-shaped member B is abnormally deformed or excessively deformed. Can also be detected. It is also possible to provide a deformation suppressing member (not shown) such as a stopper for mechanically preventing excessive deformation of the first plate-shaped member B, and further, through the first vent 2b provided in the variable portion 2. Therefore, the first space portion 4 and the first non-opposing surface Br of the first plate-shaped member B are always communicated with each other. Therefore, by utilizing the pressure difference between the internal pressure of the first space portion 4 lowered by the first internal pressure adjusting portion 6 described later and the internal pressure of the transformer chamber 1, the first plate shape is used with respect to the displacement portion 2a of the variable portion 2. The member B can be vacuum-sucked.
As a result, the first non-opposing surface Br of the first plate-shaped member B is detachably attracted and held with respect to the displacement portion 2a due to the increase in the internal pressure of the transformer chamber 1 and temporarily fixed.
Further, although not shown as another example of the variable portion 2, it is possible to change to temporary fixing using an adhesive member, electrostatic suction, or the like instead of vacuum suction.

The holding portion 3 is arranged so as to come into contact with the second non-opposing surface Cr of the carried-in second plate-shaped member C in the thickness direction (Z direction).
Further, the holding portion 3 is a holding portion that is immovably in contact with the second non-opposing surface Cr of the carried-in second plate-shaped member C with respect to the second chamber surface 10b of the chamber 10 in the thickness direction (Z direction). Has 3a.
That is, the holding portion 3 abuts the second non-opposing surface Cr of the second plate-shaped member C against the holding portion 3a so that the second plate-shaped member C is held immovably in the Z direction. It is composed.
It is preferable to form the second space portion 7 separately from the transformer chamber 1 between the holding portion 3 and the second chamber surface 10b of the chamber 10. The second space portion 7 is formed in an airtight manner by abutting the second non-opposing surface Cr of the second plate-shaped member C against the holding portion 3a of the holding portion 3.
Further, it is preferable that the holding portion 3 has a second vent 3b that allows the second non-opposing surface Cr of the second plate-shaped member C and the second space portion 7 to communicate with each other.

When shown in FIGS. 1 to 6 as a specific example of the holding portion 3, it is a holding annular body 31 fixed to the second chamber surface 10b of the chamber 10, and is an inner space of the holding annular body 31. Is the second vent 3b to form the second space 7.
The holding annular body 31 of the illustrated example is formed of an elastically deformable material such as a soft synthetic resin or rubber, or a non-deformable material such as a hard synthetic resin or a metal, in a square frame shape or an annular shape. The holding annular body 31 can also be composed of an annular member such as a packing or an O-ring like the elastic ventilator 21 of the variable portion 2. In this case, the holding annular body 31 is elastic in the Z direction. It can be compressed and deformed by expansion. At one end of the holding annular body 31 in the thickness direction (Z direction), a holding fixing portion 31a with respect to the second chamber surface 10b of the chamber 10 is provided. The other end of the holding annular body 31 in the thickness direction (Z direction), which is the holding portion 3a, is in contact with the second non-opposing surface Cr of the second plate-shaped member C carried in.
Further, since the second space portion 7 serving as the second vent 3b of the holding portion 3 and the second non-opposing surface Cr of the second plate-shaped member C are always communicated with each other, the second internal pressure adjusting portion 8 described later is used. The second plate-shaped member C can be vacuum-sucked to the holding portion 3a of the holding portion 3 by utilizing the pressure difference between the lowered internal pressure of the second space portion 7 and the internal pressure of the transformer chamber 1.
As a result, the second non-opposing surface Cr of the second plate-shaped member C is detachably attracted and held with respect to the holding portion 3a due to the increase in the internal pressure of the transformer chamber 1 and temporarily fixed.
Further, although not shown as another example of the holding portion 3, it is also possible to change to temporary fixing using an adhesive member, electrostatic suction, or the like instead of vacuum suction.
In the cases shown in FIGS. 1 to 3 and 14, the thickness direction (Z direction) size of the elastic ventilator 21 of the variable portion 2 is abbreviated as the Z direction size of the holding annular body 31 of the holding portion 3. It's the same. On the other hand, in the cases shown in FIGS. 4 to 6, 11, and 13, the Z-direction size of the elastic ventilator 21 of the variable portion 2 is larger than the Z-direction size of the holding annular body 31 of the holding portion 3. By increasing the value, the amount of compression deformation and the amount of expansion deformation of the variable portion 2 are set to be emphasized.
Further, although not shown as another example, the Z-direction size of the elastic ventilator 21 of the variable portion 2 shown in FIGS. 1 to 3 and 14 is larger than the Z-direction size of the holding annular body 31 of the holding portion 3. Increasing the size and making the Z-direction size of the elastic ventilator 21 of the variable portion 2 shown in FIGS. 4 to 6, FIG. 11, and FIG. 13 substantially the same as the Z-direction size of the holding annular body 31 of the holding portion 3. Changes such as what to do are also possible.

The chamber pressure adjusting unit 5 raises the internal pressure of the transformer chamber 1 and transforms the fluid 5F such as compressed air, gas, and water from a supply source (not shown) toward the transformer chamber 1 (supplying air). It is configured to lower the internal pressure of the transformer chamber 1 by discharging (exhausting) the fluid 5F such as air from the chamber 1.
In the case shown in FIG. 1A as a specific example of the chamber pressure adjusting unit 5, a chamber that penetrates the chamber 10 from a chamber pressure drive source (not shown) such as a vacuum pump or a compressor and leads to the transformer chamber 1. It has a flow path 5a and a chamber pressure control valve 5b provided in the middle of the chamber flow path 5a.
By operating the chamber pressure adjusting unit 5 (chamber pressure drive source and chamber pressure control valve 5b), the internal pressure of the transformer chamber 1 can be set from an atmospheric atmosphere to a vacuum or a low pressure atmosphere close to a vacuum or a predetermined high pressure atmosphere.
More specifically, the total amount of the negative pressure fluid 5F exhausted from the chamber flow path 5a or the positive pressure fluid 5F supplied to the chamber flow path 5a by the operation control of the chamber pressure drive source and the chamber pressure control valve 5b. It is preferable to control the internal pressure of the transformer chamber 1 in a stepwise manner.

The first internal pressure adjusting unit 6 lowers the internal pressure of the first space portion 4 from the internal pressure of the transformer chamber 1 by discharging (exhausting) the first fluid 6F such as air from the first space portion 4. By supplying (supplying) the first fluid 6F to the first space portion 4, the internal pressure of the first space portion 4 is configured to be higher than the internal pressure of the transformer chamber 1.
When shown in FIG. 1 (a) as a specific example of the first internal pressure adjusting unit 6, the first space unit 4 penetrates the chamber 10 from a first drive source (not shown) such as a vacuum pump or a compressor. It has a first flow path 6a leading to the first flow path 6a and a first control valve 6b provided in the middle of the first flow path 6a.
By operating the first internal pressure adjusting unit 6 (first drive source and first control valve 6b), the internal pressure of the first space unit 4 can be set from an atmospheric atmosphere to a vacuum or a low pressure atmosphere close to a vacuum or a predetermined high pressure atmosphere. ..
More specifically, the negative pressure first fluid 6F exhausted from the first flow path 6a or the positive pressure first fluid supplied to the first flow path 6a by the operation control of the first drive source and the first control valve 6b. It is preferable to control the total amount of 6F and adjust the internal pressure of the first space portion 4 step by step.

The second internal pressure adjusting unit 8 lowers the internal pressure of the second space portion 7 from the internal pressure of the transformer chamber 1 by discharging (exhausting) the second fluid 8F such as air from the second space portion 7. By supplying (supplying) the second fluid 8F to the second space portion 7, the internal pressure of the second space portion 7 is configured to be higher than the internal pressure of the transformer chamber 1.
In the case shown in FIG. 1A as a specific example of the second internal pressure adjusting unit 8, the second space unit 7 penetrates the chamber 10 from a second drive source (not shown) such as a vacuum pump or a compressor. It has a second flow path 8a leading to the second flow path 8a and a second control valve 8b provided in the middle of the second flow path 8a.
By operating the second internal pressure adjusting unit 8 (second drive source or second control valve 8b), the internal pressure of the second space unit 7 can be set from an atmospheric atmosphere to a vacuum or a low pressure atmosphere close to a vacuum or a predetermined high pressure atmosphere. ..
More specifically, the negative pressure second fluid 8F exhausted from the second flow path 8a or the positive pressure second to be supplied to the second flow path 8a by the operation control of the second drive source and the second control valve 8b. It is preferable to control the total amount of the two fluids 8F to adjust the internal pressure of the second space portion 7 step by step.

The control unit 9 is a controller having a control circuit (not shown) electrically connected to the chamber pressure adjusting unit 5, the first internal pressure adjusting unit 6, the second internal pressure adjusting unit 8, and the like, respectively.
Further, it is electrically connected to the drive mechanism 10d that opens and closes the entrance / exit 10c of the chamber 10. In addition to that, the first plate-shaped member B and the second plate-shaped member C are electrically connected to the transformer chamber 1 as a means for moving in and out.
The controller serving as the control unit 9 sequentially controls the operation at preset timings according to a program preset in the control circuit (not shown).

Then, the program set in the control circuit of the control unit 9 will be described as a method of manufacturing the microstructure by the microstructure manufacturing apparatus A.
The microstructure manufacturing method using the microstructure manufacturing apparatus A according to the embodiment of the present invention is divided into a carry-in step, a holding step, a chamber pressure adjusting step, and a carry-out step.
More specifically, the microstructure manufacturing method according to the embodiment of the present invention includes a carry-in step of inserting the first plate-shaped member B and the second plate-shaped member C into the transformer chamber 1, and a first plate-shaped member in the transformer chamber 1. A holding step for holding the member B and the second plate-shaped member C, a room pressure adjusting step for adjusting the internal pressure of the transformer chamber, and a carrying-out step for taking out the first plate-shaped member B and the second plate-shaped member C from the transformer chamber 1. And are included as the main process.

In the carry-in process, as shown in FIGS. 2 (a) and 2 (b), FIGS. 4 (a), 8 (a) and 8 (b), the first plate shape is formed by operating the transport means from the external space of the chamber 10. The member B and the second plate-shaped member C are housed in the transformer chamber 1.
When the first plate-shaped member B and the second plate-shaped member C are in a separated state as shown in FIGS. 2 (a) (b) and 8 (a) (b) at the time of carrying in, the first plate-shaped member B and the second plate-shaped member C are separated. A primary carry-in process for putting either one of the shaped member B or the second plate-shaped member C into the transformer chamber 1 and a secondary carry-in process for putting the other into the transformer chamber 1 are required. ..
Further, when the first plate-shaped member B and the second plate-shaped member C are in a joined state as shown in FIG. 4A at the time of carrying in, the uneven portion (first joint uneven portion B1, second joint). The first plate-shaped member B and the second plate-shaped member C, in which the uneven portions C1) are unevenly joined to each other and integrated, are put into the transformer chamber 1 with the unevenly joined.

In the holding step, as shown in FIGS. 2 (c), 4 (a), 8 (c), and the like, the first non-opposite of the first plate-shaped member B with respect to the displacement portion 2a of the variable portion 2. The surface Br is brought into contact with the thickness direction (Z direction). At the time of this contact, the internal pressure of the first space portion 4 is lowered by the discharge of the first fluid 6F by the operation of the first internal pressure adjusting portion 6, and the displacement portion 2a of the variable portion 2 is passed through the first vent 2b of the variable portion 2. On the other hand, it is preferable to vacuum-adsorb the first non-opposing surface Br of the first plate-shaped member B.
Therefore, the first non-opposing surface Br of the first plate-shaped member B is positioned and integrated with the displacement portion 2a of the variable portion 2 in the direction intersecting the thickness direction (Z direction) (XY direction) so as not to be displaced. Will be done. As a result, the first plate-shaped member B can move with respect to the first chamber surface 10a of the chamber 10 as the displacement portion 2a is deformed or moved in the thickness direction (Z direction).
The second non-opposing surface Cr of the second plate-shaped member C is brought into contact with the holding portion 3a of the holding portion 3 in the thickness direction (Z direction). At the time of this contact, the internal pressure of the second space portion 7 is lowered by the discharge of the second fluid 8F by the operation of the second internal pressure adjusting portion 8, and the holding portion 3a of the holding portion 3 is passed through the second vent 3b of the holding portion 3. On the other hand, it is preferable to vacuum-adsorb the second non-opposing surface Cr of the second plate-shaped member C.
Therefore, the second non-opposing surface Cr of the second plate-shaped member C is positioned and integrated with the holding portion 3a of the holding portion 3 in the direction intersecting the thickness direction (Z direction) (XY direction) so as not to be displaced. Will be done. As a result, the second plate-shaped member C is held immovably in the thickness direction (Z direction) with respect to the second chamber surface 10b of the chamber 10. When the holding portion 3 is elastically deformable, the second plate-shaped member C is deformed in the thickness direction (Z direction) of the holding portion 3a in the thickness direction with respect to the second chamber surface 10b of the chamber 10. It is also possible to change it so that it can be moved toward (Z direction).
After holding the first plate-shaped member B and the second plate-shaped member C, the entrance / exit 10c of the chamber 10 is shown in FIGS. 3 (a), 5 (a), 9 (a), and the like. Is closed, the transformer chamber 1 in the chamber 10 is cut off from the external space of the chamber 10 and becomes a closed state.

In the chamber pressure adjusting step, at least a differential pressure process that controls so that a pressure difference is generated between the internal pressure of the transformer chamber 1 and the internal pressure of the first space portion 4 by the operation of the chamber pressure adjusting unit 5, and the pressure difference is the first. The pressure joining process in which the plate-shaped member B and the second plate-shaped member C are relatively close to each other in the facing direction, and the relative to the facing direction of the first plate-shaped member B and the second plate-shaped member C due to the pressure difference. It includes a peeling process of moving the transformer chamber apart and an opening process of returning the internal pressure of the transformer chamber 1 to atmospheric pressure.
As shown in FIGS. 3 (b), 5 (b), 9 (b), and the like, the differential pressure process is the discharge or supply of the fluid 5F by the operation of the chamber pressure adjusting unit 5, and the transformer chamber 1 or the first. The internal pressure of either one of the space portions 4 is increased more than the internal pressure of the other. As a result, a pressure difference is generated between the internal pressure of the transformer chamber 1 and the internal pressure of the first space portion 4.
At this time, in addition to the change in the internal pressure of the transformer chamber 1 due to the operation of the chamber pressure adjusting unit 5, the change in the internal pressure of the first space portion 4 is simultaneously performed by the supply or discharge of the first fluid 6F by the operation of the first internal pressure adjusting unit 6. It is preferable to control the pressure difference between the internal pressure of the transformer chamber 1 and the internal pressure of the first space portion 4 to be further increased.
When the holding portion 3 is elastically deformable, the second fluid 8F is supplied by the operation of the second internal pressure adjusting portion 8 in addition to the change in the internal pressure of the first space portion 4 by the operation of the first internal pressure adjusting portion 6. Alternatively, it is also possible to simultaneously change the internal pressure of the second space portion 7 by discharging and control so that the pressure difference between the internal pressure of the transformer chamber 1 and the internal pressure of the second space portion 7 becomes larger.

In the pressure joining process, only the discharge of the fluid 5F by the operation of the chamber pressure adjusting unit 5, or in addition to this, the supply of the first fluid 6F by the operation of the first internal pressure adjusting unit 6 and the operation of the second internal pressure adjusting unit 8 are performed. By supplying the second fluid 8F, the internal pressure of the transformer chamber 1 is lowered below the internal pressure of the first space portion 4 and the internal pressure of the second space portion 7.
Due to the pressure difference generated by this, a pressing force is generated in which the first plate-shaped member B is moved toward the second plate-shaped member C in the thickness direction (Z direction) together with the displacement portion 2a of the variable portion 2 to pressurize.
Due to this pressing force, when the second facing surface Cf of the second plate-shaped member C has a non-contact uneven portion (non-bonded uneven portion Cu) as shown in FIG. 3B, the first plate-shaped member The first facing surface Bf of B is joined to the non-bonded uneven portion Cu of the second plate-shaped member C and pressed in the thickness direction (Z direction), and becomes the surface of the minute component Ma in the non-bonded uneven portion Cu. The first facing surfaces Bf are overlapped so as to follow the shape of the portion Mf, and the first plate-shaped member B is evenly pressed toward the non-bonded uneven portion Cu of the second plate-shaped member C by the pressure difference (fluid). Will be done.

In the peeling process, only the supply of the fluid 5F by the operation of the chamber pressure adjusting unit 5, or in addition to this, the discharge of the first fluid 6F by the operation of the first internal pressure adjusting unit 6 and the second operation by the operation of the second internal pressure adjusting unit 8 The discharge of the fluid 8F causes the internal pressure of the transformer chamber 1 to rise higher than the internal pressure of the first space portion 4 and the internal pressure of the second space portion 7.
Due to the pressure difference generated by this, an attractive force is generated that pulls the first plate-shaped member B toward the first space portion 4 in the thickness direction (Z direction) together with the displacement portion 2a of the fluctuating portion 2.
Due to this attractive force, as shown in FIG. 5 (c), the first facing surface Bf of the first plate-shaped member B has the first-joined uneven portion B1 as one of the uneven-bonded concave-convex portions, and the second plate-shaped member C has. When the second facing surface Cf of the above has the second joint uneven portion C1 as the other side of the uneven portion, the first joint uneven portion B1 of the first plate-shaped member B is the second joint uneven portion of the second plate-shaped member C. It is peeled off from the portion C1 in the thickness direction (Z direction), and the first joint uneven portion B1 is peeled off from the second joint uneven portion C1.
Further, as shown in the illustrated example, when a gap E is provided between the first plate-shaped member B and the second plate-shaped member C, the positive pressure fluid 5F intrudes into the gap E to form the first plate-shaped member. A repulsive force is generated that relatively pushes the first joint uneven portion B1 of the member B and the second joint uneven portion C1 of the second plate-shaped member C apart.
Further, the gap detection sensor arranged on the first chamber surface 10a of the chamber 10 detects the position of the first non-opposing surface Br of the first plate-shaped member B and monitors the detected value to monitor the uneven portion. It becomes possible to detect the progress of joining or peeling of (non-joining uneven portion Cu, first joining uneven portion B1, second joining uneven portion C1) and the completion of joining or peeling.

In the process of opening to the atmosphere, as shown in FIGS. 3 (c), 6 (a), 10 (a), etc., the discharge or supply of the fluid 5F by the operation of the chamber pressure adjusting unit 5 is stopped, and the chamber 10 is stopped. The internal pressure of the transformer chamber 1 is returned to the atmospheric pressure by opening the entrance / exit 10c of the above with the drive mechanism 10d and discharging the fluid 5F filled in the transformer chamber 1 to the external space of the transformer chamber 1.

As shown in FIGS. 3 (c), 6 (b), (c), 10 (b), (c), and the like, the carrying-out process involves the operation of the first internal pressure adjusting unit 6 and the operation of the second internal pressure adjusting unit 8. The operation is sequentially stopped, and the first plate-shaped member B and the second plate-shaped member C are taken out from the transformer chamber 1 to the external space of the chamber 10 by the operation of the transport means.
When the first plate-shaped member B and the second plate-shaped member C are in a bonded state as shown in FIG. The formed first plate-shaped member B and the second plate-shaped member C are taken out of the transformer chamber 1 while being joined in a concavo-convex manner.
Further, when the first plate-shaped member B and the second plate-shaped member C are in a separated state as shown in FIGS. 6 (b) (c) and 10 (b) (c) at the time of carrying in, the first plate-shaped member B and the second plate-shaped member C are separated. A primary carry-out process for taking out either one of the one-plate-shaped member B or the second plate-shaped member C to the outside of the transformer chamber 1 and a secondary carry-out process for taking the other out of the transformer chamber 1 are required. become.

Next, specific examples (first embodiment to third embodiment) and modified examples (fourth embodiment to seventh embodiment) of the microstructure manufacturing apparatus A according to the embodiment of the present invention will be described.
The microstructure manufacturing apparatus A1 of the first embodiment shown in FIGS. 1 to 3 is a micropart Ma arranged (mounted) between the first plate-shaped member B and the second plate-shaped member C as the microstructure M. It is a joining device for manufacturing a laminated type microstructure M1 that is joined so as to be sandwiched between the two.
Either the first facing surface Bf of the first plate-shaped member B or the second facing surface Cf of the second plate-shaped member C due to the relative close movement of the first plate-shaped member B and the second plate-shaped member C. The non-contact uneven portion (non-bonded uneven portion Cu) of the minute component Ma arranged in the above is joined and integrated so as to be sandwiched between the other and the other.
In the case of the illustrated example, a fixing layer D1 such as an adhesive or the like is used as a holding means D for the minute component Ma on the first facing surface Bf of the first plate-shaped member B and the second facing surface Cf of the second plate-shaped member C. A holding chuck D2 such as an adhesive chuck is provided. A plurality of minute parts Ma are arranged and arranged in parallel.
In the initial state (carry-in step) before joining shown in FIGS. 2 (a) and 2 (b), the holding means D (fixed layer D1, holding chuck D2) is minute with respect to the second facing surface Cf of the second plate-shaped member C. The component Ma is immovably arranged and has a non-contact uneven portion (non-bonded uneven portion Cu).
Following this, in the chamber pressure adjusting step (differential pressure process, pressure joining process) shown in FIG. 3 (b) from the holding step shown in FIG. 3 (a), the first plate-shaped member B due to the fluid differential pressure is used. Due to the relative approaching movement, the first facing surface Bf of the first plate-shaped member B is joined to the non-bonded uneven portion Cu of the second plate-shaped member C and pressed in the thickness direction (Z direction). Along with this, the first facing surface Bf overlaps with each other so as to follow the shape of the non-joining portion Mf which is the surface of the minute component Ma in the non-joining uneven portion Cu, and is directed toward the non-joining uneven portion Cu by the pressure difference (fluid). Is evenly pressurized. Therefore, the minute component Ma is sandwiched between the first plate-shaped member B and the second plate-shaped member C and integrated to form a laminated body.

Further, in the illustrated example, the transformer chamber 1 of the chamber 10 is a split type. In the split type transformer chamber 1, the chamber 10 is divided into a first chamber 11 and a second chamber 12, and an entrance / exit 10c is formed between the separated first chamber 11 and the second chamber 12. A sealing material 13 made of a square frame-shaped or annular packing, an O-ring, or the like is interposed in the doorway 10c. By bringing the first chamber 11 and the second chamber 12 relatively close to each other by the drive mechanism 10d, the entrance / exit 10c is closed in an airtight manner by the sealing material 13, and the transformer chamber 1 is openable and closable and has a sealed structure.
In the illustrated example, only the upper first chamber 11 is reciprocated with respect to the lower second chamber 12, but only the lower second chamber 12 or both the first chamber 11 and the second chamber 12 are reciprocated. It is possible to change to a structure other than the illustrated example, such as reciprocating.

In the microstructure manufacturing apparatus A2 of the second embodiment shown in FIGS. 4 to 6, the concavo-convex portions (the first) joined to each other arranged on the first plate-shaped member B and the second plate-shaped member C as the microstructure M. The configuration of the separation device for peeling off the one-joint uneven portion B1 and the second joint uneven portion C1) is different from the above-mentioned first embodiment, and the other configurations are the same as those of the first embodiment.
Due to the relative separation movement of the first plate-shaped member B and the second plate-shaped member C, the molding die Mb which becomes the micromolded product M2 and the molded substrate Mc are peeled off, and the micropart Ma which becomes the microstructure M1 is adhered. The first joint uneven portion B1 arranged on the first facing surface Bf of the first plate-shaped member B joined to each other in an uneven shape, such as peeling from a holding means such as a chuck, and the second plate-shaped member C. The second joint uneven portion C1 arranged on the second facing surface Cf is peeled off.
In the case of the illustrated example, the case of another type in which the mold Mb is arranged on the first plate-shaped member B and the molded substrate Mc is arranged on the second plate-shaped member C is shown. In a state where the uneven pattern of the molding die Mb is transferred to the molding substrate Mc by nanoimprint molding or the like, the molding die Mb and the molding substrate Mc are concave-convex bonded to each other to form a laminate that can be conveyed and integrated. The molded substrate Mc has a resin layer Me laminated on the surface of the substrate Md made of a hard material, which is pattern-transferred by light or heat, which is the second joint uneven portion C1.
Further, on the first facing surface Bf of the first plate-shaped member B and the second facing surface Cf of the second plate-shaped member C, a holding chuck D2 such as an adhesive chuck or an adhesive or the like is used as a holding means D for the micromolded product M2. Fixed layer D1 is provided.

In the initial state (carry-in step) at the time of joining shown in FIG. 4A, the first back surface B2 of the molding die Mb, which is the first joint uneven portion B1, is on the first facing surface Bf of the first plate-shaped member B. It is immovably arranged by the holding means D (holding chuck D2, fixed layer D1). The first back surface C2 of the molded substrate Mc, which is the second joint uneven portion C1, is immovably arranged on the second facing surface Cf of the second plate-shaped member C by the holding means D (holding chuck D2, fixed layer D1). There is.
Subsequent to this, in the chamber pressure adjusting step (differential pressure process, peeling process) shown in FIGS. The molding die Mb to be the uneven portion B1 is peeled off from the molded substrate Mc to be the second joint uneven portion C1 in the thickness direction (Z direction).

Further, in the illustrated example, a plurality of first joint uneven portions B1 (molding mold Mb) and second joint uneven portions C1 (molded substrate Mc) are XY between the first plate-shaped member B and the second plate-shaped member C. It is arranged in parallel at predetermined intervals in each direction, and has a square frame-shaped outer gap E1 and a plurality of through gaps E2 that pass linearly in both the XY directions.
As a result, the positive pressure fluid 5F invades not only the outer gap E1 but also the plurality of through gaps E2, so that the repulsive force that completely pushes the first plate-shaped member B and the second plate-shaped member C apart. Occurs.

The microstructure manufacturing apparatus A3 of the third embodiment shown in FIGS. 7 to 10 is arranged (mounted) on either the first plate-shaped member B or the second plate-shaped member C as the microstructure M. The configuration of the transfer device for manufacturing the transfer type microstructure M1 that transfers the micropart Ma to the other is different from the above-mentioned first embodiment, and the other configurations are the same as those of the first embodiment.
Due to the relative close movement and separation movement of the first plate-shaped member B and the second plate-shaped member C, the first facing surface Bf of the first plate-shaped member B or the second facing surface Cf of the second plate-shaped member C The non-contact uneven portion (non-bonded uneven portion Cu) of the minute component Ma arranged on one of them is turned upside down and transferred to the other.
In the case of the illustrated example, the first facing surface Bf of the first plate-shaped member B is set as the transfer destination of the minute component Ma, and has a strong adhesive surface D3 that serves as a holding means D for the minute component Ma. The second facing surface Cf of the second plate-shaped member C has a weak adhesive surface D4 that is set as a transfer source of the minute component Ma and serves as a holding means D for the minute component Ma. A plurality of minute parts Ma are arranged and arranged in parallel.
The strong adhesive surface D3 and the weak adhesive surface D4 are holding chucks D2 that detachably hold and temporarily fix the minute component Ma. Among the holding chucks D2, it is preferable to use an adhesive chuck made of an adhesive member whose holding force of the minute component Ma can be easily controlled. In this case, an adhesive member having a strong adhesive force is used as the strong adhesive surface D3, and an adhesive member having a weak adhesive force is used as the weak adhesive surface D4. Further, as another example, instead of the adhesive chuck, it is possible to change to a vacuum chuck whose suction force is strongly and weakly controlled, or an electrostatic chuck whose electrostatic suction force is strongly and weakly controlled.

In the initial state (carry-in step) before transfer shown in FIGS. 8A and 8B, a plurality of holding means D (holding chuck D2, weakly bonded surface D4) are used on the second facing surface Cf of the second plate-shaped member C. The joint portion Mr, which is the back surface of the minute component Ma, is immovably arranged and arranged.
In the subsequent chamber pressure adjusting step (differential pressure process, pressure joining process) shown in FIG. 9 (b) from the holding step shown in FIG. 9 (a), the first plate-shaped member B due to the fluid differential pressure is used. By relative approaching movement, the holding means D (strong adhesive surface D3) of the first facing surface Bf is joined to the non-joined portion Mf which is the surface of a plurality of minute parts Ma in the thickness direction (Z direction) and integrated. To.
After that, in the chamber pressure adjusting step (peeling step) shown in FIG. 9 (c), the holding means D (weak adhesion) of the second facing surface Cf is caused by the relative separation movement of the first plate-shaped member B due to the fluid differential pressure. The back surfaces (joint portion Mr) of the plurality of minute parts Ma are peeled off from the surface D4) in the thickness direction (Z direction).
As a result, the plurality of microstructures M1 are transferred from the second plate-shaped member C to the first plate-shaped member B by inverting the alignment state without changing the alignment state.

The microstructure manufacturing apparatus A4 of the fourth embodiment shown in FIGS. 11 (a) to 11 (c) has a configuration in which the transformer chamber 1 is a partially open / closed type, but is different from the above-mentioned first embodiment to the third embodiment. The other configurations are the same as those of the first to third embodiments.
In the illustrated example, the case of the separation device of the second embodiment is shown.
A doorway 10c is opened in a part of the box-shaped chamber 14, and a door 14a is opened and closed by a drive mechanism 10d with respect to the doorway 10c.
As a result, a part of the transformer chamber 1 is configured to be openable and closable and has a sealed structure.

The microstructure manufacturing apparatus A5 of the fifth embodiment shown in FIGS. 12 (a) to 12 (c) has uneven portions (first) joined to each other arranged on the first plate-shaped member B and the second plate-shaped member C. The configuration in which the joint uneven portion B1 and the second joint uneven portion C1) are peeled off by the movement of the variable portion 2 is different from the above-mentioned second embodiment and the third embodiment, and the other configurations are the second embodiment and the first. It is the same as the three embodiments.
In the illustrated example, the case of the separation device of the second embodiment is shown.
The movable variable portion 2 is composed of an elevating vent body 22 supported so as to be reciprocating in the Z direction with respect to the first chamber surface 10a of the chamber 10. The elevating ventilation body 22 has a ventilation hole 2c corresponding to a first ventilation port 2b that allows the first non-opposing surface Br of the first plate-shaped member B and the first space portion 4 to communicate with each other.
The elevating vent is made of a non-deformable material such as hard synthetic resin or metal, and is made of a plate-shaped member formed in a square plate shape or a disk shape, and one vent hole 2c is opened in the center thereof. To. The side surface of the elevating ventilator 22 is reciprocating and airtight in the Z direction along the third chamber surface 10e formed in the Z direction between the first chamber surface 10a and the second chamber surface 10b of the chamber 10. It has a supported sliding portion 22a. The third chamber surface 10e of the chamber 10 has a stopper 10f on one side and a stopper 10g on the other side that protrude toward the elevating vent. The ascending / descending ventilator 22 that has moved in the Z direction abuts on the stopper 10f on one side and the stopper 10g on the other side, thereby restricting the moving range of the elevating ventilator 22. The elevating vent body 22 and the chamber are brought into contact with the first non-opposing surface Br of the first plate-shaped member B carried in, with the tip portion in the thickness direction (Z direction) as the displacement portion 2a. The first space portion 4 is formed between the first chamber surface 10a and the first chamber surface 10a.
Therefore, the elevating vent body 22 moves in the Z direction due to the difference between the internal pressure increase of the transformer chamber 1 and the internal pressure of the first space portion 4 due to the inflow of the positive pressure fluid 5F, and the displacement portion 2a and the first plate shape are formed. The member B is moved toward the first space portion 4. As a result, the first plate-shaped member B is peeled off from the second plate-shaped member C.
Although not shown as another example of the elevating vent. It is also possible to use a plate-shaped member or the like.
Further, instead of the support structure in which the sliding portion 22a of the elevating vent body 22 is movably supported along the third indoor surface 10e, the elevating / lowering / elevating body 22 moves up and down to the center of an elastically deformable thin plate-shaped flexible member such as stainless steel. By supporting the vent body 22 in a floating island shape, it is possible to change to a support structure in which the elevating ventilator 22 is supported so as to be able to reciprocate in the Z direction by elastic deformation of the flexible member. In the case of this floating island shape, the outer periphery of the flexible member is attached to the third chamber surface 10e of the chamber 10, so that the first space portion 4 is separated from the transformer chamber 1 on the back side of the flexible member. It is provided in an airtight manner.

In the microstructure manufacturing apparatus A6 of the sixth embodiment shown in FIGS. 13 (a) to 13 (c), a through hole h communicating with the inner gap E3 is formed in the first plate-shaped member B and the second plate-shaped member C. The configured configuration is different from the second embodiment and the third embodiment described above, and the other configurations are the same as those of the second embodiment and the third embodiment.
In the illustrated example, the case of the separation device of the second embodiment is shown.
The through hole h is opened in either or both of the first plate-shaped member B and the second plate-shaped member C so as to be isolated from the first space portion 4 and the second space portion 7, and is formed from the transformer chamber 1. The positive pressure fluid 5F enters the inner gap E3 through the through hole h.
Further, in the illustrated example, a plurality of first joint uneven portions B1 and second joint uneven portions C1 are formed between the first plate-shaped member B and the second plate-shaped member C in the circumferential direction around the inner gap E3. Each is arranged in parallel at predetermined intervals, and has an outer gap E1 and a plurality of through gaps (not shown) that pass linearly in the radial direction around the inner gap E3.
A through hole h is opened in the center of the first plate-shaped member B facing the first space portion 4.
An introduction path 5c through which a positive pressure fluid 5F passes so as to communicate with the through hole h is formed on the first chamber surface 10a of the chamber 10 facing the through hole h, and the through hole h is formed from the outlet of the introduction path 5c. A positive pressure fluid 5F is introduced into the chamber.
Further, similarly to the second embodiment described above, the uneven portions (first joint uneven portion B1, second joint uneven portion C1) joined to each other by the deformation of the variable portion 2 are peeled off. However, since the outlet of the introduction path 5c opens on the first chamber surface 10a of the chamber 10, it is necessary to airtightly separate the passage from the outlet of the introduction path 5c to the through hole h and the first space portion 4. There is.
Therefore, the variable portion 2 of the illustrated example is an inner annular member so as to surround the passage from the outlet of the introduction path 5c to the through hole h, separately from the outer annular member 23 corresponding to the elastic ventilator 21 of the first embodiment. The member 24 is provided. The first space portion 4 is formed between the outer annular member 23 and the inner annular member 24.
Although not shown as another example of the elastic vent body 21, instead of the outer annular member 23 and the inner annular member 24, a plate-shaped member having a plurality of first vents 2b and a large number of first vents 2b are used. It is also possible to use a porous member or the like.
As a result, the positive pressure fluid 5F penetrates not only the outer gap E1 but also the inner gap E3 through the introduction path 5c, the inner passage of the inner annular member 24, and the through hole h, and a plurality of positive pressure fluids 5F enter the inner gap E3. Since the fluid flows through the through gaps (not shown), a repulsive force is generated that completely pushes the first plate-shaped member B and the second plate-shaped member C apart.

The microstructure manufacturing apparatus A7 of the seventh embodiment shown in FIGS. 14A to 14C has a configuration in which the adhesive force of the strong adhesive surface D3 and the weak adhesive surface D4 serving as the holding means D is controlled by a temperature change. , Unlike the third embodiment described above, the other configurations are the same as those of the third embodiment.
When the strong adhesive surface D3 and the weak adhesive surface D4 are made of an adhesive member, it is possible to increase the adhesive force by heating and decrease the adhesive force by cooling.
In the illustrated example, the strong adhesive surface D3 of the first facing surface Bf of the first plate-shaped member B which is the transfer destination of the minute component Ma and the second facing surface D3 of the second plate-shaped member C which is the transfer source of the minute component Ma. Both of the weakly bonded surfaces D4 of the surface Cf are temperature-controlled by temperature-changing members for heating and cooling whose operation is controlled by the control unit 9.
On the first chamber surface 10a of the chamber 10 facing the first non-opposing surface Br of the first plate-shaped member B in the Z direction, the first temperature changing member G1 sandwiches the heat insulating material B4 in the vicinity of the strong adhesive surface D3. It will be provided.
On the second chamber surface 10b of the chamber 10 facing the second non-facing surface Cr of the second plate-shaped member C in the Z direction, the second temperature changing member G2 sandwiches the heat insulating material B5 in the vicinity of the weakly bonded surface D4. It will be provided.
The first temperature changing member G1 and the second temperature changing member G2 have either or both of a heating function such as a heater and a cooling function such as a refrigerant pipe.
Therefore, in the chamber pressure adjusting step (differential pressure process, pressure joining process) shown in FIG. 14B, the relative close movement of the first plate-shaped member B due to the fluid differential pressure causes a plurality of minute parts Ma. The first temperature changing member G1 is heated when the strong adhesive surface D3 of the first facing surface Bf is bonded to the surface (non-bonded portion Mf) in the thickness direction (Z direction). As a result, the adhesive force of the strong adhesive surface D3 is increased, and the surfaces (non-bonded portions Mf) of the plurality of minute parts Ma can be strongly bonded.
At the same time, by cooling the weakly bonded surface D4 with the second temperature changing member G2, the adhesive force of the weakly bonded surface D4 is reduced, and the back surface (joint portion Mr) of the plurality of minute parts Ma is weakly bonded to the weakly bonded surface D4. It becomes easy to peel off from. Therefore, in the chamber pressure adjusting step (peeling process) shown in FIG. 14 (c), the relative separation movement of the first plate-shaped member B due to the fluid differential pressure causes the weakly bonded surface D4 to have a plurality of minute parts Ma. The back surface (joint portion Mr) is smoothly peeled off. As a result, the adhesive strength can be controlled to be easier to join and peel than at room temperature, and the processing time required for joining and peeling in the chamber 10 can be shortened.
Further, although not shown as another example, it is also possible to control the adhesive force of either the strong adhesive surface D3 or the weak adhesive surface D4 by changing the temperature.

According to the microstructure manufacturing apparatus A and the microstructure manufacturing method according to the embodiment of the present invention, the first plate-shaped member B and the second plate-shaped member C are housed in the transformer chamber 1. The first non-opposing surface Br of the plate-shaped member B abuts on the displacement portion 2a of the variable portion 2 in a deformable or movable manner. Therefore, the first plate-shaped member B can move in the thickness direction (Z direction) with respect to the first chamber surface 10a of the chamber 10. The second non-opposing surface Cr of the second plate-shaped member C abuts on the holding portion 3a of the holding portion 3 and is supported by the second chamber surface 10b of the chamber 10.
From this accommodation state, the internal pressure of the first space portion 4 is raised above the internal pressure of the transformer chamber 1 by the chamber pressure adjusting portion 5, so that the first plate-shaped member B is made into the second plate-shaped member together with the displacement portion 2a of the fluctuating portion 2. Move toward C. Therefore, when either one of the first facing surface Bf of the first plate-shaped member B or the second facing surface Cf of the second plate-shaped member C has a concavo-convex portion (non-bonded concavo-convex portion Cu), the concavo-convex portion. The other is overlapped so as to follow the uneven surface shape of the (non-bonded uneven portion Cu), and the first plate-shaped member B is uniformly pressurized toward the second plate-shaped member C by the pressure difference (fluid).
Further, by lowering the internal pressure of the transformer chamber 1 from the internal pressure of the first space portion 4 in the chamber pressure adjusting unit 5, the first plate-shaped member B is directed toward the first space portion 4 together with the displacement portion 2a of the variable portion 2. Moving. Therefore, both the first facing surface Bf of the first plate-shaped member B and the second facing surface Cf of the second plate-shaped member C have uneven portions (first joint uneven portion B1, second joint uneven portion C1). In this case, the uneven portion of the first plate-shaped member B (first joint uneven portion B1) is peeled off from the uneven portion of the second plate-shaped member C (second joint uneven portion C1).
Therefore, the joining and additional pressing of the uneven portion (non-joined uneven portion Cu) separated by the control change of the internal pressure difference and the separation of the joined uneven portion (first joint uneven portion B1, second joint uneven portion C1). Can be reversed.
As a result, as compared with the conventional one having only the separation function of releasing the mold from the object to be molded, the separated uneven portion (non-joined uneven portion) can be separated only by changing the setting of the internal pressure difference between the transformer chamber 1 and the first space portion 4. It can be used as a joining device for Cu), an additional pressing device, or a separating device for the joined uneven portions (first joint uneven portion B1, second joint uneven portion C1), and is excellent in usability.
In particular, in the joining or additional pressing of the separated uneven portion (non-joined uneven portion Cu), the first plate-shaped member B can be uniformly pressed along the surface shape of the uneven portion (non-joined concave-convex portion Cu). Therefore, when the first plate-shaped member B or the second plate-shaped member C has partial thickness unevenness, or when the microstructure M is unevenly formed between the first plate-shaped member B and the second plate-shaped member C. Even in the case of joining by sandwiching it between the two, the pressure is not concentrated only on the convex portion such as the microstructure M, and the joining can be performed in a uniform pressure state. As a result, damage to the convex portion can be prevented, and high-precision joining and additional pressing can be achieved.

Further, the control unit 9 has a concavo-convex portion (first joint concavo-convex portion B1, second joint concavo-convex portion C1) in which the first plate-shaped member B and the second plate-shaped member C are joined to each other in a concavo-convex manner. Due to the operation of the adjusting unit 5, the internal pressure of the transformer chamber 1 rises above the internal pressure of the first space portion 4, and the first plate-shaped member B is moved toward the first space portion 4 together with the displacement portion 2a of the fluctuating portion 2. Is preferable.
In this case, by raising the internal pressure of the transformer chamber 1 above the internal pressure of the first space portion 4, the first plate-shaped member B together with the displacement portion 2a of the variable portion 2 is in the thickness direction toward the first space portion 4. Move in the (Z direction).
Therefore, the concavo-convex portion of the first plate-shaped member B (first joint concavo-convex portion B1) is peeled off from the concavo-convex portion of the second plate-shaped member C (second joint concavo-convex portion C1).
Therefore, the concavo-convex portions (first joint concavo-convex portion B1, second joint concavo-convex portion C1) of the first plate-shaped member B and the second plate-shaped member C can be peeled off without deforming (falling).
As a result, the amount of protrusion of the uneven portion (first joint uneven portion B1, second joint uneven portion C1) becomes longer than that of the conventional one in which the uneven pattern of the mold is diagonally pulled out from the uneven pattern transferred to the object to be molded. However, it is possible to prevent shape deformation due to peeling.
Therefore, when it is used for imprint molding including nanoimprint, it is possible to produce a highly accurate uneven pattern in which the uneven pattern of the uneven portion (first joint uneven portion B1, second joint uneven portion C1) is damaged. ..
Further, in the case of a transfer device or the like in which minute parts Ma such as minute elements arranged in parallel are peeled off from the adhesive chuck and the minute parts Ma are delivered, the minute parts Ma are not damaged and high-precision delivery can be performed.

Further, it is preferable to include a first internal pressure adjusting unit 6 for lowering the internal pressure of the first space unit 4.
In this case, at the same time as the internal pressure of the transformer chamber 1 rises, the internal pressure of the first space portion 4 is lowered by the first internal pressure adjusting unit 6, so that the internal pressure of the transformer chamber 1 and the internal pressure of the first space portion 4 are reduced. The difference is even greater.
Therefore, the attractive force that attracts the variable portion 2 toward the first space portion 4 increases.
Therefore, the concavo-convex portions (first joint concavo-convex portion B1, second joint concavo-convex portion C1) of the first plate-shaped member B and the second plate-shaped member C that are concavo-convex-bonded to each other can be smoothly peeled off.
As a result, the peeling ability can be improved.
In particular, the transformer is transformed by operating control of either or both of the chamber pressure adjusting unit 5 (chamber pressure driving source and chamber pressure control valve 5b) or the first internal pressure adjusting unit 6 (first drive source and first control valve 6b). When the internal pressure of the chamber 1 and the internal pressure of the first space portion 4 are adjusted in a relatively stepwise manner, the uneven portion (first joint uneven portion B1, second joint uneven portion C1) can be peeled off more smoothly.
Further, due to the pressure difference between the internal pressure of the transformer chamber 1 and the internal pressure of the first space portion 4, the first non-opposing surface Br of the first plate-shaped member B is vacuum-sucked to the displacement portion 2a of the fluctuating portion 2. Will be possible. As a result, the pressure difference between the internal pressure of the transformer chamber 1 and the internal pressure of the first space portion 4 can attract and hold the first plate-shaped member B that has moved toward the first space portion 4 together with the displacement portion 2a of the fluctuation portion 2.

Further, an airtight second space portion 7 formed between the second chamber surface 10b and the holding portion 3 of the chamber 10 and a second internal pressure adjusting portion 8 for lowering the internal pressure of the second space portion 7 are provided. Is preferable.
In this case, the internal pressure of the transformer chamber 1 and the internal pressure of the first space portion 4 are reduced by lowering the internal pressure of the first space portion 4 at the same time as the internal pressure of the transformer chamber 1 rises or before the internal pressure rise of the transformer chamber 1 starts. There is a pressure difference with the internal pressure.
Therefore, the second non-opposing surface Cr of the second plate-shaped member C is vacuum-sucked to the holding portion 3a of the holding portion 3 due to the pressure difference. As a result, the second plate-shaped member C is immovably adsorbed and held on the holding portion 3a.
Therefore, the second plate-shaped member C can be reliably fixed to the holding portion 3a of the holding portion 3.
As a result, the concavo-convex portions (first joint concavo-convex portion B1, second joint concavo-convex portion C1) of the first plate-shaped member B and the second plate-shaped member C can be reliably peeled off.

Further, it is preferable that there is a gap E between the first plate-shaped member B and the second plate-shaped member C through which the fluid 5F supplied from the chamber pressure adjusting unit 5 to the transformer chamber 1 can enter.
In this case, due to the pressure difference between the transformer chamber 1 and the first space portion 4, an attractive force that attracts the variable portion 2 toward the first space portion 4 is generated, and at the same time, the chamber pressure adjusting unit 5 supplies the variable portion 2 to the transformer chamber 1. The positive pressure fluid 5F invades the gap E and relatively pushes the uneven portions (first joint uneven portion B1, second joint uneven portion C1) of the first plate-shaped member B and the second plate-shaped member C. Repulsive force to separate is generated.
Therefore, the concavo-convex portion (first joint concavo-convex portion B1, second joint concavo-convex portion C1) can be peeled off more smoothly due to the combination of the attractive force and the repulsive force.
As a result, the peeling ability can be further improved.

Then, one of the first plate-shaped member B and the second plate-shaped member C has a strong adhesive surface D3, and the other is detachably arranged side by side via the weak adhesive surface D4. In the control unit 9, the internal pressure of the first space portion 4 rises above the internal pressure of the transformer chamber 1 due to the operation of the chamber pressure adjusting unit 5, and the first plate-shaped member B becomes the second plate-shaped member C. It is preferable to control the transformer chamber 1 so that the internal pressure of the transformer chamber 1 rises higher than the internal pressure of the first space portion 4 and the first plate-shaped member B moves toward the first space portion 4.
In this case, by raising the internal pressure of the first space portion 4 to be higher than the internal pressure of the transformer chamber 1, the first plate-shaped member B moves toward the second plate-shaped member C. Therefore, the first plate-shaped member B approaches the second plate-shaped member C, and the surfaces (non-bonded uneven portions Cu) of the plurality of microstructures M1 are bonded to the strong adhesive surface D3.
Next, by increasing the internal pressure of the transformer chamber 1 above the internal pressure of the first space portion 4, the first plate-shaped member B moves toward the first space portion 4. Therefore, the first plate-shaped member B is separated from the second plate-shaped member C, and the back surface (joint portion Mr) of the plurality of microstructures M1 is peeled off from the weakly bonded surface D4.
Therefore, the plurality of microstructures M1 can be transferred from either one of the first plate-shaped member B or the second plate-shaped member C to the other by inverting the alignment state without changing the alignment state.
As a result, the transfer can be performed with high accuracy without damaging the plurality of microstructures M1, and the back surface (joint portion Mr) of the plurality of microstructures M1 joined before the transfer is exposed by front-back inversion. be able to.

In the illustrated embodiment of the above-described embodiment (first to seventh embodiment), only the case where the first plate-shaped member B and the second plate-shaped member C are rectangular is shown, but the present invention is limited to this. It may not be rectangular, but may be circular or the like.
Further, in the illustrated example of the second embodiment, only another type of the micromolded product M2 is shown, but the present invention is not limited to this, and the whole of either the first plate-shaped member B or the second plate-shaped member C is used. It may be an integrated type in which the molding mold Mb is formed and the other whole is the molding substrate Mc.
Further, in the illustrated examples of the fourth embodiment to the sixth embodiment, only the modified example of the second embodiment (separation device) is shown, and in the illustrated example of the seventh embodiment, the modified example of the third embodiment (transfer device) is shown. Although only an example is shown, the present invention is not limited to this, and the first embodiment (joining device), the second embodiment (separation device), and the third embodiment (the fourth embodiment to the seventh embodiment) are not shown. It may be a transfer device).
Even in such a case, the same operations and advantages as those of the first to seventh embodiments described above can be obtained.

A Microstructure manufacturing equipment 1 Transformer chamber 2 Fluctuation part 2a Displacement part 3 Holding part 3a Holding part 4 First space part 5 Room pressure adjustment part 5F Fluid 6 First internal pressure adjustment part 7 Second space part 8 Second internal pressure adjustment part 9 Control unit 10a First indoor surface 10b Second indoor surface B First plate-shaped member B1 Concavo-convex part (first joint concavo-convex part) Bf First facing surface Br First non-facing surface C Second plate-shaped member C1 Concavo-convex part ( 2nd joint uneven part) Cf 2nd facing surface Cr 2nd non-facing surface Cu uneven part (non-joining uneven part)
D3 Strong adhesive surface D4 Weak adhesive surface E Gap

Claims

A microstructure manufacturing apparatus for joining or separating uneven portions having one or both of the first facing surface of the first plate-shaped member facing each other and the second facing surface of the second plate-shaped member.
A transformer chamber formed inside the chamber and accommodating the first plate-shaped member and the second plate-shaped member freely in and out.
A variable portion provided between the first non-opposing surface of the first plate-shaped member housed in the transformer chamber and the first chamber surface of the chamber, and
A holding portion provided between the second non-opposing surface of the second plate-shaped member housed in the transformer chamber and the second chamber surface of the chamber, and
A first space portion that is separated from the transformer chamber and airtightly provided between the first chamber surface and the variable portion of the chamber.
A chamber pressure adjusting unit that raises the internal pressure of either the transformer chamber or the first space portion to be higher than the internal pressure of the other.
A control unit that controls the operation of the room pressure adjusting unit is provided.
The variable portion has a displacement portion that is deformably or movably contacted with the first non-opposing surface of the first plate-shaped member in the thickness direction thereof with respect to the first chamber surface of the chamber.
The holding portion has a holding portion that supports the second non-opposing surface of the second plate-shaped member with respect to the second chamber surface of the chamber.
In the control unit, the pressure difference between the transformer chamber and the first space portion due to the operation of the chamber pressure adjusting unit causes the first plate-shaped member to be the second plate-shaped member together with the displacement portion of the variable portion. Alternatively, a microstructure manufacturing apparatus characterized in that it is controlled to move toward the first space portion.
It has the uneven portion in which the first plate-shaped member and the second plate-shaped member are joined to each other in an uneven shape.
In the control unit, the internal pressure of the transformer chamber rises above the internal pressure of the first space portion due to the operation of the chamber pressure adjusting unit, and the first plate-shaped member together with the displacement portion of the variable portion has the first plate-like member. The microstructure manufacturing apparatus according to claim 1, wherein the device moves toward one space.
The microstructure manufacturing apparatus according to claim 1 or 2, further comprising a first internal pressure adjusting unit that lowers the internal pressure of the first space portion.
It is characterized by including an airtight second space portion formed between the second chamber surface and the holding portion of the chamber, and a second internal pressure adjusting portion for lowering the internal pressure of the second space portion. The microstructure manufacturing apparatus according to claim 1, 2 or 3.
Claims 1, 2 and 1. The microstructure manufacturing apparatus according to 3 or 4.
Either one of the first plate-shaped member or the second plate-shaped member has a strong adhesive surface, and the other has a plurality of microstructures detachably arranged side by side via a weak adhesive surface.
In the control unit, the internal pressure of the first space portion rises above the internal pressure of the transformer chamber due to the operation of the chamber pressure adjusting unit, and the first plate-shaped member moves toward the second plate-shaped member. Following this, claim 1 is characterized in that the internal pressure of the transformer chamber rises above the internal pressure of the first space portion, and the first plate-shaped member is controlled to move toward the first space portion. The microstructure manufacturing apparatus described.
A method for manufacturing a microstructure, which joins or separates uneven portions having one or both of the first facing surface of the first plate-shaped member facing each other and the second facing surface of the second plate-shaped member.
The carrying-in process of inserting the first plate-shaped member and the second plate-shaped member into the transformer chamber formed inside the chamber, and
A holding step of positioning the first plate-shaped member along the first chamber surface of the chamber and positioning the second plate-shaped member along the second chamber surface of the chamber.
The chamber pressure adjusting process for adjusting the internal pressure of the transformer chamber and
The process including carrying out the first plate-shaped member and the second plate-shaped member from the transformer chamber is included.
In the holding step, the first non-opposite surface of the first plate-shaped member with respect to the displacement portion of the variable portion provided between the first non-opposing surface of the first plate-shaped member and the first chamber surface. The facing surface is deformed or movably contacted in the thickness direction thereof, and the first space portion is separated from the transformer chamber and airtightly provided between the first chamber surface and the variable portion. The second non-opposing surface of the second plate-shaped member is oriented in the thickness direction with respect to the holding portion of the holding portion provided between the second non-opposing surface of the two-plate-shaped member and the second indoor surface. Contact and support,
In the chamber pressure adjusting step, the internal pressure of either the transformer chamber or the first space portion is increased more than the internal pressure of the other by the chamber pressure adjusting portion, and the first plate shape is formed together with the displacement portion of the variable portion. A method for manufacturing a microstructure, wherein the member is moved toward the second plate-shaped member or the first space portion.