WO2021052593A1

WO2021052593A1 - Evaporation source, shutter device, and evaporation method

Info

Publication number: WO2021052593A1
Application number: PCT/EP2019/075247
Authority: WO
Inventors: Pejman KHAMEHGIR
Original assignee: Applied Materials, Inc.
Priority date: 2019-09-19
Filing date: 2019-09-19
Publication date: 2021-03-25
Also published as: CN114423881A

Abstract

An evaporation source (100) is provided. The evaporation source includes a vapor distribution assembly (130) with a plurality of vapor nozzles (131) for emitting an evaporated source material (15) toward a substrate and a shutter device (120) with at least one material collection cavity (313) for blocking the evaporated source material emitted from the plurality of nozzles. Further, a shutter device (120) for an evaporation source and an evaporation method are provided.

Description

EVAPORATION SOURCE, SHUTTER DEVICE, AND EVAPORATION METHOD

TECHNICAE FIEED

[0001] Embodiments of the present disclosure relate to an evaporation source for depositing an evaporated source material, e.g. an evaporated organic material, on a substrate in a vacuum chamber. Embodiments of the present disclosure further relate to a shutter device for an evaporation source as well as to an evaporation method.

BACKGROUND

[0002] Evaporation sources are a tool for the production of organic light-emitting diodes (OLEDs). OLEDs are a special type of light-emitting diode in which the emissive layer includes a thin film of certain organic compounds. Organic light emitting diodes are used in the manufacture of television screens, computer monitors, mobile phones and other hand-held devices for displaying information. OLEDs can also be used for general space illumination. The range of colors, brightness, and viewing angle possible with OLED displays are greater than that of traditional LCD displays because OLED pixels directly emit light and do not need a back light. Therefore, the energy consumption of OLED displays is considerably less than that of traditional LCD displays. Further, the fact that OLEDs can be manufactured onto flexible substrates results in further applications. A typical OLED display, for example, may include layers of organic material situated between two electrodes that are all deposited on a substrate in a manner to form a matrix display panel having individually energizable pixels. The OLED is generally placed between two glass panels, and the edges of the glass panels are sealed to encapsulate the OLED therein.

[0003] There are many challenges encountered in the manufacture of such display devices. OLED displays include a stack of several organic materials, which are typically evaporated in a vacuum chamber. The evaporated materials are deposited in a subsequent manner through shadow masks. For the fabrication of OLED stacks with high efficiency, the co -deposition or co-evaporation of two or more materials, e.g. host and dopant, leading to mixed/doped layers is beneficial. [0004] For depositing the source material on a substrate, the source material is heated until the source material evaporates. The evaporated source material is guided through a vapor distribution assembly toward a plurality of vapor nozzles. The evaporated source material is emitted by the plurality of vapor nozzles toward a substrate through a mask that includes a plurality of small openings for forming individual pixels on the substrate.

[0005] Stopping the emission of evaporated material from the vapor nozzles may be beneficial in various situations, e.g. for maintenance of the evaporation source, for substrate or mask exchange, or for conducting quality checks. However, a complete shut-down of the evaporation source is very time-consuming because the temperature inside the evaporation source can be varied only slowly. Adding a blocking valve into the evaporation source is challenging due to the high material temperatures. Further, a blocking valve inside the evaporation source may lead to unwanted pressure variations in the vapor distribution assembly. Yet further, conventional shutters increase the cleaning efforts of the evaporation system and are quickly contaminated with source material.

[0006] In view of the above, it would be beneficial to provide an evaporation source that allows for a high up-time and that can be quickly brought into an idle state in which the material emission is stopped. Further, it would be beneficial to provide evaporation methods that allow for a reduction of the maintenance time and ensure a high deposition quality.

SUMMARY

[0007] In light of the above, an evaporation source, a shutter device, as well as evaporation methods are disclosed.

[0008] According to a first aspect of the present disclosure, an evaporation source is provided. The evaporation source includes a vapor distribution assembly with a plurality of vapor nozzles for emitting an evaporated source material toward a substrate, and a shutter device with at least one material collection cavity for blocking the evaporated source material emitted from the plurality of vapor nozzles.

[0009] The shutter device essentially completely blocks the evaporated source material emitted from the plurality of vapor nozzles and may collect the blocked source material in the at least one material collection cavity. The shutter device may be held in front of the plurality of vapor nozzles, such that the emitted source material is essentially completely blocked. [0010] In some embodiments, the shutter device is attached to the vapor distribution assembly. In particular, the shutter device may be detachably held at the vapor distribution assembly, particularly magnetically held at the vapor distribution assembly. Accordingly, the shutter device can be quickly and easily removed from the vapor distribution assembly under vacuum conditions.

[0011] According to a second aspect of the present disclosure, a shutter device for blocking an evaporated source material emitted from a plurality of vapor nozzles is provided. The shutter device includes an elongated bar element with at least one material collection cavity provided in the elongated bar element, the at least one material collection cavity being defined by a circumferential side wall and a cavity front wall closing the circumferential side wall.

[0012] In some embodiments, a plurality of material collection cavities is provided in the elongated bar element, each material collection cavity of the plurality of material collection cavities being defined by a respective circumferential side wall and a cavity front wall closing the circumferential side wall. The plurality of material collection cavities may be provided in a linear array.

[0013] According to a third aspect of the present disclosure, an evaporation method is provided. The evaporation method includes emitting an evaporated source material from a plurality of vapor nozzles of a distribution assembly in a vacuum chamber and blocking the evaporated source material emitted by the plurality of vapor nozzles with at least one material collection cavity of a shutter device held in front of the plurality of vapor nozzles.

[0014] The shutter device may be magnetically and/or mechanically held at the vapor distribution assembly.

[0015] In particular, the shutter device may be held at the vapor distribution assembly in an exchangeable manner, such that the shutter device can be detached with a shield handling apparatus for unblocking the plurality of vapor nozzles, e.g. for directing the evaporated source material onto a substrate that is to be coated. In some embodiments, the shutter device may be replaced by a shielding device, particularly by a shaping device.

[0016] The evaporation method may further include heating of the shutter device for cleaning the shutter device, particularly inside the vacuum chamber. [0017] The evaporation method may further include conducting a calibration measurement while the evaporated source material emitted by the plurality of vapor nozzles is blocked by the shutter device, and another evaporated source material emitted by a second plurality of vapor nozzles arranged adjacent to the plurality of vapor nozzles is unblocked. [0018] According to a fourth aspect of the present disclosure, an evaporation system is provided. The evaporation system includes a vacuum chamber and an evaporation source according to embodiments described herein arranged inside the vacuum chamber. The evaporation system further includes a shield handling apparatus with a shield holder for holding a shutter device. The shield handling apparatus may be configured for detaching the shutter device from a vapor distribution assembly of the evaporation source and/or for attaching another shutter device or a shaping device at the vapor distribution assembly.

[0019] Embodiments are also directed at apparatuses for carrying out the disclosed methods and include apparatus parts for performing each described method aspect. These method aspects may be performed by way of hardware components, a computer programmed by appropriate software, by any combination of the two or in any other manner. Furthermore, embodiments according to the disclosure are also directed at methods for operating the described apparatus. The methods for operating the described apparatus include method aspects for carrying out every function of the apparatus. Embodiments are also directed at methods of manufacturing the described apparatuses and systems. Further aspects, advantages and features of the present disclosure are apparent from the description and the accompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

[0020] So that the manner in which the above recited features of the present disclosure can be understood in detail, a more particular description of the present disclosure, briefly summarized above, may be had by reference to embodiments. The accompanying drawings relate to embodiments of the present disclosure and are described in the following:

[0021] FIG. 1 shows a schematic sectional view of an evaporation source according to embodiments described herein;

[0022] FIGS. 2A-2C show subsequent stages of an evaporation method according to embodiments described herein; [0023] FIG. 3 shows a schematic perspective view of a shutter device according to embodiments described herein;

[0024] FIG. 4 shows a schematic perspective view of a shutter device according to embodiments described herein; [0025] FIG. 5 shows a schematic view of an evaporation system with an evaporation source according to embodiments described herein; and

[0026] FIG. 6 is a flow diagram illustrating an evaporation method according to embodiments described herein.

DETAILED DESCRIPTION OF EMBODIMENTS [0027] Reference will now be made in detail to the various embodiments of the present disclosure, one or more examples of which are illustrated in the figures. Within the following description of the drawings, same reference numbers refer to same components. Generally, only the differences with respect to individual embodiments are described. Each example is provided by way of explanation and is not meant as a limitation of the present disclosure. Features illustrated or described as part of one embodiment can be used on or in conjunction with other embodiments to yield yet a further embodiment. It is intended that the description includes such modifications and variations.

[0028] As used herein, the term “source material” may be understood as a material that is to be evaporated and deposited on a surface of a substrate. In embodiments described herein, a source material (e.g., an organic source material) is evaporated, and the evaporated source material is guided through a vapor distribution assembly and emitted by one or more vapor outlets toward a substrate. Non-limiting examples of source materials include one or more of the following: organic materials, metals, ITO, NPD, Alq3, Quinacridone, Mg, Ag, starburst materials, and the like. [0029] As used herein, the term “evaporation source” may be understood as an arrangement providing an evaporated source material to be deposited on a substrate. In particular, the evaporation source may be configured to direct an evaporated source material into a deposition area in a vacuum chamber. The evaporated source material may be directed toward the substrate by one or more vapor outlets, particularly by a plurality of vapor nozzles of the evaporation source. The vapor nozzles may be directed toward the deposition area and extend along an evaporation direction X, when the evaporation source is provided in a deposition position.

[0030] The evaporation source may include a crucible which evaporates the source material and a vapor distribution assembly in fluid communication with the crucible. The vapor distribution assembly is configured to transport the evaporated source material to the plurality of vapor nozzles for emitting the evaporated source material into the deposition area. The vapor distribution assembly may include a vapor distribution pipe extending in a first direction, e.g. an essentially vertical direction, and the plurality of vapor nozzles may extend through a front wall of the vapor distribution pipe.

[0031] According to embodiments described herein, the vapor distribution pipe may be a linear vapor distribution pipe extending in a first direction, particularly in an essentially vertical direction. “Essentially vertical” as used herein may be understood to include deviations of 10° or less from an exactly vertical direction. In some embodiments, the vapor distribution pipe may have the cross-sectional shape of a cylinder or triangle. In some embodiments, the evaporation source may include two or three crucibles and two or three associated vapor distribution pipes arranged next to each other on a common support which may be movable.

[0032] FIG. 1 shows a schematic view of an evaporation source 100 according to embodiments described herein. The evaporation source 100 may be arranged in a vacuum chamber 11 (depicted in FIG. 5). The evaporation source 100 includes a vapor distribution assembly 130 with a plurality of vapor nozzles 131 for directing an evaporated source material 15 toward a substrate 10 (e.g., ten, thirty or more vapor nozzles). The evaporated source material propagates through an inner volume of the vapor distribution assembly 130 towards the plurality of vapor nozzles 131, and each of the plurality of vapor nozzles 131 emits a plume of evaporated source material in an emission direction. The plurality of vapor nozzles may be arranged one above the other in a linear array. Only two vapor nozzles of the plurality of vapor nozzles are shown in the sectional view of FIG. 1.

[0033] In various situations, it may be beneficial to temporarily stop the emission of the evaporated source material from the plurality of vapor nozzles. In particular, it may be beneficial to be able to quickly switch between a deposition state and an idle state in which the material emission is temporarily stopped. For example, the emission may be temporarily stopped for conducting a substrate or mask exchange, for conducting a quality check, and/or for conducting calibration measurements of only a subset of nozzles. However, quickly stopping the material emission as well as quickly continuing with the material emission after a stop is challenging for various reasons. A complete shut-down of the evaporation source is very time-consuming. Internally closing a vapor conduit of the evaporation source, e.g. via a valve, is difficult and may lead to unwanted pressure variations or pressure drops inside the evaporation source. Shutters that are placed downstream of the plurality of vapor nozzles typically increase the cleaning efforts and are quickly contaminated. Similarly, quickly re starting with a material emission after a temporary stop is challenging. Embodiments described herein provide an evaporation source that can quickly and reliably stop and/or continue with the emission of the evaporated material from the vapor distribution assembly. Further, the cleaning efforts can be reduced, and the up-time of the evaporation system can be increased.

[0034] According to embodiments described herein, the evaporation source 100 further includes a shutter device 120 with at least one material collection cavity 313, the at least one material collection cavity 313 being configured to block the evaporated source material emitted from the plurality of vapor nozzles 131. The shutter device 120 may be arranged in front of the plurality of vapor nozzles for completely blocking the evaporated source material emitted from the plurality of vapor nozzles in the at least one material collection cavity, such that the blocked material can be collected by and accumulated in the at least one material collection cavity. In particular, the blocked source material can accumulate on an inner wall of the at least one material collection cavity 313 or of a plurality of material collection cavities, as is schematically depicted in FIG. 1.

[0035] A “material collection cavity” as used herein may be understood as an inner space of the shutter device surrounded at least partially by a cavity wall that is configured to block the evaporated source material. The material collection cavity may have an open side at which the evaporated source material and/or one or more vapor nozzles may enter the material collection cavity, and a closed front side which may be arranged opposite the open side for blocking the source material. The plurality of vapor nozzles may optionally partially protrude into the at least one material collection cavity, in order to ensure that the emitted source material is completely blocked by the at least one material collection cavity.

[0036] Providing a shutter device with at least one material collection cavity, particularly with a plurality of material collection cavities, is beneficial because the blocked source material can accumulate in an inner space of the shutter device, reducing a risk of an unwanted stray deposition on an inner wall of the vacuum chamber or of components inside the vacuum chamber. Further, the material collection cavity provides a large wall surface where the blocked source material can accumulate, such that a large amount of source material may accumulate inside the material collection cavity. Accordingly, it may be sufficient to clean the shutter device at extended time intervals.

[0037] Further, the risk that source material that has entered the material collection cavity may leave the material collection cavity - e.g. due to re-evaporation - is small or negligible because the inner space of the material collection cavity may be surrounded by walls at all sides or at all sides apart from the open side. The open side may be closed at least partially by a vapor nozzle or by the vapor distribution assembly, particularly in embodiments having the shutter device attached to the vapor distribution assembly.

[0038] In some embodiments, the shielding device may be held at the vapor distribution assembly, particularly be held in contact with the vapor distribution assembly, such that the open side of the at least one material collection cavity is at least partially or completely closed by the vapor distribution assembly and/or by a vapor nozzle which may partially protrude into the at least one material collection cavity (see, e.g., FIG. 1). Accordingly, the at least one material collection cavity may provide a fully closed inner space for the emitted source material, such that a stray coating can be reliably avoided and an accumulation of the blocked source material at inner walls of the at least one material collection cavity can be ensured. In other words, when the shutter device is attached at the vapor distribution assembly, the at least one material collection cavity may provide a fully closed collection space for the evaporated source material emitted by the plurality of vapor nozzles.

[0039] In some embodiments, which may be combined with other embodiments described herein, the at least one material collection cavity 313 may be defined by a circumferential side wall 314 and a cavity front wall 315. The “cavity front wall” may be understood as a cavity wall opposite the open side of the material collection cavity where the evaporated material can enter the material collection cavity. The blocked material can accumulate on the circumferential side wall and/or on the cavity front wall. The circumferential side wall may define a depth of the at least one material collection cavity and may laterally surround the inner space of the at least one material collection cavity. The cavity front wall 315 may close the circumferential side wall 314 and may provide the bottom of the material collection cavity. The circumferential side wall may optionally be at least one of round, circular or oval. [0040] In some embodiments, which may be combined with other embodiments described herein, the shutter device 120 may be held at the vapor distribution assembly 130. In particular, the shutter device 120 may be detachably attached to the vapor distribution assembly 130, such that the shutter device 120 can be detached from the vapor distribution assembly, e.g., for unblocking the plurality of vapor nozzles and for continuing with the deposition process.

[0041 ] For example, the shutter device may be detached from the vapor distribution assembly for at least one or more of (i) continuing with the deposition process, (ii) cleaning of the shutter device at a cleaning position separate from the vapor distribution assembly, e.g. when a considerable amount of source material has accumulated in the shutter device, (iii) exchange of the shutter device with a shielding device, particularly with a shaping device.

[0042] In some embodiments, the shutter device 120 may be magnetically held at the vapor distribution assembly 130, e.g. via one or more magnet units which may be provided at one or both of the shutter device and the vapor distribution assembly. A magnetically attached shutter device can be easily and quickly removed from the vapor distribution assembly, e.g. for continuing with the deposition on the substrate 10. For example, for detaching the magnetically held shutter device, the shutter device may simply be pulled away from the vapor distribution assembly, e.g. with a magnet device of a shield handling apparatus.

[0043] In some implementations, the at least one material collection cavity 313 may be provided as a recess in a body of the shutter device, particularly as a blind hole in the body of the shutter device. The side wall of the blind hole may provide the circumferential side wall 314, and the bottom wall of the blind hole may provide the cavity front wall 315 which closes the circumferential side wall. In some embodiments, a depth of the material collection cavity may be 5 mm or more, particularly 1 cm or more and/or 5 cm or less.

[0044] In some embodiments, which can be combined with other embodiments described herein, the shutter device 120 includes a plurality of material collection cavities as described above. For example, each material collection cavity of the plurality of material collection cavities may be configured for blocking the evaporated source material emitted from an associated vapor nozzle of the plurality of vapor nozzles 131, as is schematically depicted in FIG. 1. The number and arrangement of material collection cavities of the shutter device may correspond to the number and arrangement of the plurality of vapor nozzles of the vapor distribution assembly. Providing a separate material collection cavity for each of the vapor nozzles increases the inner wall surface of the shutter device where source material can accumulate. Accordingly, more source material can be collected in the material collection cavities, such that the shutter device can be used for a longer time before cleaning may be reasonable. The up-time of the evaporation source can be increased, and cleaning efforts can be reduced.

[0045] The plurality of vapor nozzles 131 may be provided in a linear array, e.g. one above the other as depicted in FIG. 1 , and the plurality of material collection cavities may be provided in a corresponding linear array, e.g. one above the other, particularly one material collection cavity for each of the vapor nozzles or one elongated material collection cavity for several or all vapor nozzles of the plurality of vapor nozzles.

[0046] In some embodiments, which can be combined with other embodiments described herein, the vapor distribution assembly 130 includes a vapor distribution pipe 132 with a front wall 133 through which the plurality of vapor nozzles 131 extend. In particular, the vapor distribution pipe 132 may be a linear vapor distribution pipe extending in a first direction V, particularly in an essentially vertical direction, as is schematically depicted in FIG. 1. The linear vapor distribution pipe may include the plurality of vapor nozzles in a linear array, particularly one above the other.

[0047] The evaporation source may further include at least one second vapor distribution assembly with a second plurality of vapor nozzles arranged adjacent to the vapor distribution assembly 130. More specifically, the evaporation source may include two or more vapor distribution pipes which are arranged next to each other. The shutter device 120 may be configured to block the evaporated source material emitted by one of the vapor distribution pipes, but not by the other vapor distribution pipes of the evaporation source. In particular, the shutter device 120 may be held at only one of several vapor distribution assemblies of the evaporation source. Accordingly, the vapor nozzles of each of the vapor distribution assemblies can be independently blocked and/or unblocked with a respective shutter device. Blocking the plurality of vapor nozzles of one vapor distribution assembly while the second plurality of vapor nozzles of the second vapor distribution assembly is unblocked may be reasonable in some situations, e.g. for conducting a quality check or a calibration measurement. The vapor distribution pipes of the evaporation source may be configured to emit different materials, e.g. host and dopant. [0048] Optionally, a shielding device, e.g. another shutter device or a shaping device, may be held at the second vapor distribution assembly. The other shutter device may completely block another evaporated source material emitted by the second plurality of vapor nozzles. The shaping device may block only a part of the evaporated source material emitted by the second plurality of vapor nozzles, particularly only the evaporated source material emitted at an emission angle greater than a predetermined maximum emission angle.

[0049] In some embodiments, the shutter device 120 is provided directly in front of the plurality of vapor nozzles, e.g. with a distance of 5 cm or less or 1 cm or less between each of the plurality of vapor nozzles and the shutter device. The shutter device 120 may be attached to the vapor distribution assembly 130 on an emission side of the vapor distribution assembly where the plurality of vapor nozzles 131 are provided. The emission side is also referred to herein as the “front side” of the vapor distribution assembly. The plurality of vapor nozzles 131 may optionally at least partially protrude into the shutter device 120.

[0050] The shutter device 120 may be placed in front of the plurality of vapor nozzles 131 in one or more of the following situations: (i) for blocking the material emission of the evaporation source during idle times of the evaporation system, e.g. for maintenance and servicing of the evaporation source, where it is not desired to completely shut down the evaporation source; (ii) for substrate or mask exchange; (iii) for calibration measurements or quality checks of the evaporation source; and/or (iv) for covering and protecting the plurality of vapor nozzles. The emitted plumes of evaporated source material can simply be blocked by placing the shutter device on the front side of the vapor distribution assembly, such that the plurality of vapor nozzles is covered.

[0051] Attaching the shutter device 120 to the vapor distribution assembly 130 is beneficial because the shutter device is then arranged close to the plurality of vapor nozzles at a position where the diameters of the emitted vapor plumes are small. A stray coating on a wall of the vacuum chamber and/or on components arranged in the vacuum chamber can be effectively reduced or entirely prevented, and the vapor nozzles can be reliably covered and protected.

[0052] The shutter device 120 may be held at a temperature below the evaporation temperature of the evaporated source material during the evaporation, such that the evaporated source material that is blocked by the shutter device 120 condenses and remains on a wall of the shutter device 120. A re-emission of source material that has been blocked by the shutter device 120 at an undefined emission angle can be reduced or prevented by holding the shutter device 120 at a temperature below the evaporation temperature, e.g. at a temperature of 250°C or less, particularly 150°C or less. On the other hand, the vapor distribution assembly, particularly the vapor distribution pipe 132 and the plurality of vapor nozzles 131, may be held at a temperature above 250°C, e.g. 300°C or more. Hence, it can be ensured that the evaporated source material remains in the vapor state inside the vapor distribution assembly.

[0053] When evaporated source material condenses at the shutter device 120 and accumulates in the at least one material collection cavity 313, the at least one material collection cavity 313 may slowly fill up with condensed source material. It may therefore be beneficial to clean the shutter device 120 at predetermined intervals, in order to make sure that the blocking effect of the shutter device 120 is not negatively affected by source material accumulated thereon. According to some embodiments, the shutter device is removed from a blocking position in front of the plurality of vapor nozzles and is cleaned, particularly at a cleaning position inside the vacuum chamber. In particular, the shutter device 120 may be detached from the vapor distribution assembly 130 for cleaning the shutter device 120.

[0054] According to some embodiments described herein, the shutter device 120 is magnetically held at the vapor distribution assembly 130. Magnetically holding the shutter device 120 at the vapor distribution assembly 130 is beneficial because the shutter device 120 can be pulled away from the vapor distribution assembly, e.g. for cleaning or exchanging the shutter device. Accordingly, the shutter device can be easily and quickly detached from the vapor distribution assembly under vacuum, and there is no need for a complex detachment mechanism.

[0055] In particular, the vapor distribution assembly 130 may include a first magnet element that is configured to magnetically hold the shutter device 120 at the vapor distribution assembly 130. The first magnet element may include a permanent magnet, an electromagnet and/or a ferromagnetic element configured to magnetically hold the shielding device.

[0056] In some embodiments, the shutter device 120 includes a second magnet element 125 or a magnetic material, such that the shutter device 120 can be magnetically held at the vapor distribution assembly. For example, the shutter device may include a ferromagnetic material, e.g. a magnetic metal such as nickel, iron or an iron-nickel alloy, particularly Invar, configured to be magnetically held at the first magnet element of the vapor distribution assembly. Alternatively or additionally, the second magnet element 125 of the shielding device (illustrated in dashed lines in FIG. 1 being an optional component) may be a permanent magnet configured to magnetically interact with the first magnet element of the vapor distribution assembly. The first magnet element may be a permanent magnet or a ferromagnetic element.

[0057] The vapor distribution assembly 130 may include a first magnet element 135, particularly a permanent magnet or a ferromagnetic element, provided in front of the front wall 133 of the vapor distribution pipe and configured to magnetically hold the shutter device. The first magnet element 135 may be configured to magnetically interact with a second magnet element of the shielding device. The first magnet element 135 may include a permanent magnet, particularly an AlNiCo magnet, a neodymium containing magnet, or a FeNb magnet.

[0058] In some embodiments, the first magnet element 135 includes a magnetic plate, particularly a permanent magnetic plate, that may be held spaced apart from the front wall 133 of the vapor distribution pipe. The magnetic plate may be thermally decoupled from the vapor distribution pipe 132 and may be held spaced-apart therefrom. For example, the first magnet element 135 may be an AlNiCo plate, a neodymium containing plate or a FeNb plate. A vapor distribution assembly having a magnetic plate for holding the shutter device thereon is beneficial because the shielding device can be reliably held at the vapor distribution pipe at a correct position in the emission direction X over the whole longitudinal extension of the shutter device. The magnetic plate may have openings for the plurality of vapor nozzles 131 to extend therethrough, as is schematically depicted in FIG. 1.

[0059] In some embodiments, which can be combined with other embodiments described herein, the vapor distribution assembly 130 includes an isolation plate 134 made of a thermally isolating material. The isolation plate 134 may include or be made of a ceramic isolator. The isolation plate 134 may be provided for thermally decoupling the vapor distribution pipe 132 from the shutter device 120. Accordingly, the vapor distribution pipe 132 and the shutter device 120 can reliably be held at different temperatures during the deposition process.

[0060] In some embodiments, the isolation plate 134 is arranged in front of the front wall 133 of the vapor distribution pipe 132, particularly between the front wall 133 and the shutter device 120. The isolation plate 134 may be held spaced-apart from the front wall 133, e.g. via pins, screws or bolts, and/or may be connected to the first magnet element 135. In particular, the first magnet element 135 may be a magnetic plate provided on a front surface of the isolation plate 134, as is schematically depicted in FIG. 1. The isolation plate 134 may have openings for the plurality of vapor nozzles 131 to extend therethrough.

[0061] In some embodiments, which can be combined with other embodiments described herein, the plurality of vapor nozzles 131 protrude at least partially into the shutter device 120, particularly into the at least one material collection cavity of the shutter device 120. A reliable shielding can be ensured, and an unwanted stray coating of the vapor distribution assembly can be reduced or avoided. For example, the plurality of vapor nozzles may protrude through the isolation plate 134 and through the first magnet element 135 configured as a magnetic plate partially into the shutter device 120, as is schematically depicted in FIG. 1.

[0062] The shutter device 120 of FIG. 1 includes a magnetic material, particularly a ferromagnetic material, more particularly a metal such as nickel or Invar, such that the shutter device 120 can be magnetically held at the first magnet element 135. The first magnet element 135 may be a permanent magnetic plate.

[0063] In some embodiments, which can be combined with other embodiments described herein, one of the vapor distribution assembly and the shutter device 120 includes an alignment opening 321, and the other one of the vapor distribution assembly and the shielding device includes an alignment pin 322 protruding into the alignment opening.

[0064] The alignment pin 322 may be inserted into the alignment opening 321 when the shutter device 120 is attached to the vapor distribution assembly 130. Accordingly, a correct positioning of the shutter device 120 at the vapor distribution assembly 130 can be ensured, e.g. in at least one of the vertical direction and a lateral direction, the lateral direction being perpendicular to the vertical direction and to the emission direction X. In some embodiments, the alignment opening 321 is a hole provided in the shutter device, e.g. an elongated hole or a hole with an upwardly tapering cross-section that allows an easy insertion of the alignment pin during the attachment and an alignment of the shutter device relative to the vapor distribution assembly in a vertical direction. Alternatively or additionally, at least one alignment opening may have a hole dimension that gradually reduces with the hole depth, allowing an alignment of the shielding device relative to the vapor distribution assembly in the direction in which the hole dimension reduces (see FIG. 1 in this respect), e.g. in the lateral direction and/or in vertical direction. [0065] In some embodiments, the alignment opening 321 has a conical shape, and the alignment pin 322 has a conical shape complementary to the conical shape of the alignment opening 321. An alignment in two directions can be achieved by inserting the alignment pin into the alignment opening. [0066] Optionally, the shutter device 120 may include a second magnet element 125, e.g. a permanent magnet. The vapor distribution assembly 130 may include the first magnet element 135, e.g. a plate made of a ferromagnetic or permanent magnetic material. The shutter device 120 can be held at the vapor distribution assembly 130 by the attractive magnetic force between the first magnet element 135 and the second magnet element 125. [0067] The shutter device 120 can be detached from the vapor distribution assembly 130 in a simple and quick manner by pulling the shutter device 120 away from the vapor distribution assembly, e.g. with a shield handling apparatus including a shield holder with a magnet device. Similarly, the shutter device 120 can be attached at the vapor distribution assembly 130 in a simple and quick manner by moving the shutter device 120 toward the first magnet element 135 until the attractive magnetic force between the first magnet element 135 and the shutter device 120 is sufficient for holding the shutter device at the vapor distribution assembly 130.

[0068] FIGS. 2A-2C show subsequent stages of an evaporation method according to embodiments described herein. The evaporation source 100 of FIGS. 2A-2C corresponds to the evaporation source 100 of FIG. 1, such that reference can be made to the above explanations, which are not repeated here.

[0069] In FIG. 2 A, the shutter device 120 is magnetically held at the vapor distribution assembly 130 of the evaporation source 100 in a vacuum chamber. Evaporated source material emitted from the plurality of vapor nozzles 131 is completely blocked by the at least one material collection cavity of the shutter device 120. [0070] The plurality of vapor nozzles 131 may be arranged in a linear array extending in the first direction V, particularly in an essentially vertical direction, and the shutter device may include a plurality of material collection cavities, each associated to one of the vapor nozzles. The material collection cavities may be recesses or blind holes which are provided in an elongated body of the shielding device. [0071] In some embodiments, the shutter device 120 may include an elongated bar element, and the at least one material collection cavity 313 may be provided as one or more blind holes in the elongated bar element. In particular, a plurality of round or cylindrical material collection cavities may be provided in the elongated bar element in a linear array, as is schematically depicted in FIG. 3.

[0072] For detaching the shutter device 120 from the vapor distribution assembly 130, a shield holder 184 of a shield handling apparatus 180 (also referred to herein as a “first shield holder 184”) can be moved toward the vapor distribution assembly 130, and the shutter device 120 can be detached from the vapor distribution assembly 130 with the shield holder 184. For example, a first magnet device 189 of the first shield holder 184 is brought in contact with the shutter device 120 and is switched to a holding state for activating a magnetic field attracting the shutter device 120 to the shield holder 184. The first magnet device 189 may include an electropermanent magnet (EPM) that is switchable between a release state and a holding state. The first magnet device 189 can generate a magnetic force that is stronger than the magnetic force generated by the first magnet element 135, such that the shutter device 120 can be pulled away from the vapor distribution assembly 130 by activating the first magnet device 189.

[0073] An electropermanent magnet (EPM) may be understood as a switchable magnet device including an arrangement of permanent magnets, wherein a direction of magnetization of at least one of the permanent magnets can be changed by applying an electric pulse to a coil of the electropermanent magnet. Accordingly, the electropermanent magnet can be switched between a holding state in which a magnetic material is attracted toward the electropermanent magnet and a release state in which a magnetic material is attracted to a lesser extent or repelled from the electropermanent magnet. Since the actual magnetic holding force is generated by the permanent magnets, an electropermanent magnet does not need a continuous power or current supply.

[0074] FIG. 2B shows the shutter device 120 that is held at the shield holder 184 of the shield handling apparatus 180. The shield holder 184 can move toward the vapor distribution assembly 130 and away from the vapor distribution assembly 130, e.g. for transporting the detached shutter device into a cleaning region inside the vacuum chamber.

[0075] As is schematically depicted in FIG. 2B, the shutter device 120 can be magnetically detached from the vapor distribution assembly 130, particularly by switching a first magnet device 189 of the shield holder 184 that is brought into contact with the shutter device 120 to a holding state. The shutter device 120 can then be pulled away from the vapor distribution assembly 130 while being magnetically held at the shield holder 184.

[0076] FIG. 2C shows the shutter device 120 that is held at the first shield holder 184 after the transport to a cleaning position in the vacuum chamber. The shutter device 120 may be at least partially heated up at the cleaning position, particularly with at least one heating device 185. The at least one heating device 185 may be a radiation heater configured to direct heat toward the shutter device 120 held at the shield holder 184. In some embodiments, the at least one heating device 185 is provided at the shield handling apparatus. Alternatively or additionally, at least one heating device may be provided at a material collection wall 160. In some embodiments, the at least one heating device 185 may include at least one of an infrared heater, resistive heater, inductive heater, laser, UV heater or another type of heater. In the embodiment depicted in FIG. 2C, the at least one heating device 185 is mounted at the shield handling apparatus, such that heat radiation can be directed toward the shutter device 120 that is held at the shield holder 184.

[0077] Optionally, at least one cooling device 188 may be provided for cooling down the shutter device 120 after the cleaning. In this case, the cleaned shutter device can more quickly be re-used at the vapor distribution assembly.

[0078] Optionally, at least one heat shield 187 may be provided at the shield handling apparatus for protecting delicate components of the shield handling apparatus from heat of the at least one heating device 185. For example, at least one heat shield 187 may be provided for protecting the first magnet device 189. The at least one heat shield 187 may be a thermal shield or a heat reflector. The durability of the shield handling apparatus, particularly of the magnet devices, can be increased.

[0079] In some embodiments, a material collection wall 160, particularly a material collection box having a bottom wall and side walls, may be provided in a cleaning region of the vacuum chamber. During the heating and cleaning of the shutter device 120, the shutter device 120 may face toward the material collection wall 160, such that the source material that is re-evaporated from the shutter device during the cleaning can accumulate on the material collection wall 160. An unwanted stray coating of inner walls of the vacuum chamber can be reduced or avoided. The shield handling apparatus 180 may be configured to move the shutter device from the vapor distribution assembly to the cleaning position in front of the material collection wall 160. In some embodiments, the material collection wall is a material collection box having an open side. Moving the detached shield holder to the material collection wall 160 may include a translational movement and/or a rotational movement of the shield holder 184.

[0080] After the removal of the shutter device 120 from the vapor distribution assembly 130 in FIG. 2B, a shielding device, e.g. another shutter device or a shaping device, can be attached to the vapor distribution assembly, particularly with a second shield holder of the shield handling apparatus. After the removal of the shutter device, the plurality of vapor nozzles is unblocked, and a deposition process on a substrate can start or a previously interrupted deposition process can continue. The shielding device can be magnetically held at the vapor distribution assembly 130, particularly at the first magnet element 135 of the vapor distribution assembly.

[0081] FIG. 3 is a schematic perspective view of a shutter device 301 according to embodiments described herein. The shutter device 301 may be used in any of the evaporation sources or evaporation methods described herein. The shutter device 301 may include some or all features of the shutter device 120 described above, such that reference can be made to the above explanations which are not repeated here.

[0082] The shutter device 301 is configured to completely block the evaporated source material emitted from a plurality of vapor nozzles of a vapor distribution assembly, as described herein. The shutter device 301 includes an elongated bar element with at least one material collection cavity 313 provided therein, particularly with a plurality of material collection cavities. The at least one material collection cavity 313 may be defined by a circumferential side wall 314 and a cavity front wall which closes the circumferential side wall at a front end thereof.

[0083] The shutter device 301 may be configured to be detachably attached to a vapor distribution assembly of an evaporation source, particularly by at least one magnet device. In some embodiments, the shutter device 301 may be configured to be magnetically held at the vapor distribution assembly. For example, a magnet device may be integrated in the elongated bar element of the shutter device 301, or the material of the elongated bar element may be at least partially magnetic, e.g. ferromagnetic. [0084] The shutter device 301 of FIG. 3 includes a plurality of material collection cavities 313. Each material collection cavity may be configured to block the plume of evaporated source material emitted by one associated vapor nozzle. For example, the shutter device 301 may be an elongated bar element having a plurality of blind holes provided therein. The blind holes may be cylindrical or may have another cross-sectional shape. For example, the shutter device 301 may have ten, thirty or more material collection cavities in a linear array for blocking the evaporated source material emitted by an array of vapor nozzles. The vapor nozzles may optionally protrude into the material collection cavities. An undesired stray coating of other components of the evaporation system can be reduced or avoided.

[0085] The shutter device 301 may include an alignment opening 321. An alignment pin of the vapor distribution assembly may be inserted into the alignment opening 321 when the shutter device 301 is attached to the vapor distribution assembly (see also FIG. 1 in this respect). Alternatively or additionally, the shaping device may be provided with one or more alignment pins protruding from a side surface of the shutter device 301. The one or more alignment pins can be inserted into alignment openings provided at the vapor distribution assembly.

[0086] The distance between two adjacent material collection cavities that are arranged in a linear arrangement may be from 1 cm to 3 cm, e.g. about 2 cm. Thirty or more material collection cavities may be provided in a linear array. The diameter of one material collection cavity may be 3 mm or more and/or 25 mm or less.

[0087] FIG. 4 is a schematic perspective view of another shutter device 302 according to embodiments described herein. The shutter device 302 may be used in any of the evaporation sources or evaporation methods described herein. The shutter device 302 may include some or all features of the shutter devices described above, such that reference can be made to the above explanations which are not repeated here.

[0088] The shutter device 302 of FIG. 4 includes a material collection cavity having a circumferential side wall 314 and a cavity front wall 315 closing the circumferential side wall. The material collection cavity may have an elongated shape and may be configured to block the plumes of evaporated source material emitted by a linear array of vapor nozzles. For example, the material collection cavity may be an elongated recess, particularly a recess with an essentially oval side wall, in an elongated bar element. A dimension of the material collection cavity in the first direction V may be more than ten times or more than thirty times a dimension of the material collection cavity in the second direction L. In particular, the plumes emitted by each of the vapor nozzles of the plurality of vapor nozzles 131 may be blocked by the same material collection cavity. In some implementations, the longitudinal dimension of the shutter device may essentially correspond to the length of the distribution pipe in the first direction V.

[0089] Alternatively, the shutter device may include a plurality of separate blocking elements, each blocking element configured to block a plume of evaporated source material emitted by an associated vapor nozzle. For example, the shutter device may include a plurality of separate tube cylinders that are provided with a closed front wall for completely blocking the evaporated source material and for collecting the evaporated source material in the tube cylinders. The plurality of separate blocking units may be magnetically held at the vapor distribution assembly, particularly at a magnetic plate that is provided in front of the front wall of the vapor distribution pipe.

[0090] FIG. 5 is a schematic view of an evaporation system 200 according to embodiments described herein. The evaporation system 200 includes a vacuum chamber 11 , an evaporation source 100 arranged in the vacuum chamber 11, and a shield handling apparatus 180 arranged in the vacuum chamber 11. The evaporation source 100 includes a vapor distribution assembly with a plurality of vapor nozzles. The vapor distribution assembly may include a crucible 136 in fluid communication with a vapor distribution pipe 132. The plurality of vapor nozzles may be provided in a front wall of the vapor distribution pipe 132. The evaporation source further includes a shutter device 120 for (completely) blocking the evaporated source material emitted from the plurality of vapor nozzles. The shutter device 120 may be attached at the vapor distribution assembly.

[0091] The shield handling apparatus 180 is configured for detaching the shutter device 120 from the vapor distribution assembly. The shield handling apparatus may further be configured for transporting the detached shutter device into a cleaning region for cleaning and/or for attaching a shielding device 121 at the vapor distribution assembly, e.g. another shutter device or a shaping device.

[0092] The evaporation source 100 may include two, three or more crucibles and vapor distribution pipes that are supported on a common source support. The common support may be movable past a substrate 10 in the vacuum chamber. A shutter device or a shaping device may be held at each of the vapor distribution pipes and be configured to at least partially block the plumes of evaporated source material emitted by the plurality of vapor nozzles of the respective vapor distribution pipe. For example, the evaporation source may include three vapor distribution pipes arranged adjacent to each other and three shielding devices attached thereon.

[0093] As is schematically depicted in FIG. 5, the evaporation source 100 can move past the substrate 10 that is arranged in a first deposition area for depositing the evaporated source material on the substrate 10 through a mask 12, particularly along a linear source path. Thereupon, the vapor distribution assembly can rotate, e.g. by an angle of about 180°, until the plurality of vapor nozzles is directed toward a second substrate 10’ that is arranged in a second deposition area on an opposite side of the evaporation source 100. The evaporation source 100 can then move past the second substrate 10’ for depositing the evaporated source material on the second substrate 10’ through a second mask 12’, particularly along a linear source path.

[0094] In some embodiments, a shielding wall 150 may be provided in the vacuum chamber 11 for blocking the evaporated source material during a rotation of the evaporation source from the first deposition area to the second deposition area. The shielding wall 150 may optionally be supported on the same movable support as the vapor distribution pipes and may move together with the evaporation source past the substrate.

[0095] The shield handling apparatus 180 may be configured for detaching the shutter device from the evaporation source and may include a movable shield holding device 182 with a plurality of shield holders. In particular, a first shield holder 184 of the movable shield holding device 182 may be configured for holding and releasing a first shutter device, and a second shield holder 186 may be configured for holding and releasing a second shutter device.

[0096] The movable shield holding device 182 can be moved toward the vapor distribution assembly via a first drive 191, e.g. along a linear translation path. In particular, the movable shield holding device 182 can be moved through a closable opening of the shielding wall 150 toward the shutter device 120 that is held at the vapor distribution assembly. The first shield holder 184 may be configured to detach the shutter device 120 from the vapor distribution assembly and to hold the shutter device 120 thereon. For example, the first shield holder 184 may include a first magnet device configured to magnetically hold the shutter device 120 at the first shield holder. Alternatively, the first shield holder may be configured to mechanically, hydraulically, or electrostatically hold the shutter device thereon, e.g. via a clamp or a hook device or via an electrostatic chuck or a Gecko chuck. The holding mechanism of the first shield holder 184 and of the other shield holders is not restricted to a magnetic holder and another type of holder may be provided.

[0097] A shield holder configured for magnetically holding the shutter device is beneficial because a magnetic holding force can reliably be generated and maintained under vacuum. Further, if the shutter device includes a ferromagnetic material, particularly a metal, the shutter device can be magnetically held at both the first shield holder and at the vapor distribution assembly. In some embodiments, the first magnet device includes an electropermanent magnet that is switchable between a holding state for holding the shutter device and a release state for releasing the shutter device. The second shield holder and further shield holders of the shield holding device 182 may be configured in a corresponding way.

[0098] In some embodiments, a second drive 192 may be provided for rotating the shield holding device 182 around an axis. For example, the shield holding device 182 may be rotated from a first rotation position in which the first shield holder 184 is directed toward the vapor distribution assembly to a second rotation position in which the first shield holder 184 is directed toward the material collection wall 160 via the second drive 192. A quick and easy transport of the shutter device from the vapor distribution assembly into the cleaning region of the vacuum chamber is possible.

[0099] FIG. 6 is a flow diagram for illustrating an evaporation method according to embodiments described herein. [00100] In box 610, an evaporated source material is emitted from a plurality of vapor nozzles of a vapor distribution assembly in a vacuum chamber. The evaporated source material emitted by the plurality of vapor nozzles is blocked with a shutter device having at least one material collection cavity. The shutter device is held in front of the plurality of vapor nozzles such as to completely block the evaporated source material and to collect the blocked source material in the at least one material collection cavity.

[00101] The shutter device may be detachably held at the vapor distribution assembly, particularly magnetically held at the vapor distribution assembly.

[00102] In box 620, the plurality of vapor nozzles is unblocked by detaching the shutter device from the vapor distribution assembly with a shield handling apparatus. The unblocked vapor nozzles can then direct the evaporated source material onto a substrate for coating a substrate.

[00103] After detaching the shutter device, a shielding device may be attached at the vapor distribution assembly. The shielding device may be another shutter device, e.g. a clean shutter device, or a shaping device configured for only partially blocking the evaporated source material for shaping the vapor plumes that are emitted toward the substrate by the plurality of vapor nozzles. In particular, a shaping device may be attached at the vapor distribution assembly, wherein the shaping device is configured to block a part of the evaporated source material emitted from the plurality of vapor nozzles having an emission angle greater than a predetermined maximum emission angle.

[00104] After the unblocking in box 620, the detached shutter device may be moved to a cleaning region in the vacuum chamber, and the shutter device may be cleaned in the cleaning region, particularly by heating the shutter device for re-evaporating the source material that has accumulated in the at least one material collection cavity.

[00105] In some embodiments, the evaporation method may further include, in box 610, conducing a calibration measurement or a quality check measurement while the evaporated source material emitted by the plurality of vapor nozzles is blocked. At the same time, another evaporated source material emitted by a second plurality of vapor nozzles arranged adjacent to the plurality of vapor nozzles may be unblocked.

[00106] In some embodiments, the evaporation method may further include protecting the plurality of vapor nozzles while evaporated source material is emitted by the plurality of vapor nozzles by attaching the shutter device at the vapor distribution assembly, such that the plurality of vapor nozzles is covered by the shutter device.

[00107] Although some of the embodiments shown provide an evaporation deposition system with an evaporation source that is movable, the skilled person may understand that the above described embodiments may also be applied to evaporation systems in which the substrate is moved during processing. For instance, the substrates to be coated may be guided and driven along a stationary evaporation source.

[00108] Embodiments described herein particularly relate to deposition of organic materials, e.g. for OLED display manufacturing on large area substrates. According to some embodiments, large area substrates or carriers supporting one or more substrates may have a size of at least 0.174 m². For instance, the deposition system may be adapted for processing large area substrates, such as substrates of GEN 5, which corresponds to about 1.4 m² substrates (1.1 m x 1.3 m), GEN 7.5, which corresponds to about 4.29 m² substrates (1.95 m x 2.2 m), GEN 8.5, which corresponds to about 5.7 m² substrates (2.2 m x 2.5 m), or even GEN 10, which corresponds to about 8.7 m² substrates (2.85 m x 3.05 m). Even larger generations such as GEN 11 and GEN 12 and corresponding substrate areas can similarly be implemented. Alternatively or additionally, semiconductor wafers may be processed and coated in the evaporation system.

[00109] This written description uses examples to disclose the disclosure, including the best mode, and also to enable any person skilled in the art to practice the described subject-matter, including making and using any devices or systems and performing any incorporated methods. While various specific embodiments have been disclosed in the foregoing, mutually non exclusive features of the embodiments described above may be combined with each other. The patentable scope is defined by the claims, and other examples are intended to be within the scope of the claims if they have structural elements that do not differ from the literal language of the claims, or if they include equivalent structural elements with insubstantial differences from the literal language of the claims.

Claims

1. An evaporation source (100), comprising: a vapor distribution assembly (130) with a plurality of vapor nozzles (131) for emitting an evaporated source material (15) toward a substrate; and a shutter device (120) with at least one material collection cavity (313) for blocking the evaporated source material emitted from the plurality of vapor nozzles.

2. The evaporation source of claim 1, wherein the at least one material collection cavity (313) is defined by a circumferential side wall (314) and a cavity front wall (315) closing the circumferential side wall.

3. The evaporation source of claim 1 or 2, wherein the shutter device comprises a plurality of material collection cavities (313), each configured for blocking the evaporated source material emitted from an associated vapor nozzle of the plurality of vapor nozzles (131).

4. The evaporation source of any of claims 1 to 3, the vapor distribution assembly comprising a vapor distribution pipe (132) with a front wall (133) through which the plurality of vapor nozzles extend, particularly a linear vapor distribution pipe extending in an essentially vertical direction and including the plurality of vapor nozzles in a linear array one above the other.

5. The evaporation source of claim 4, further comprising an isolation plate (134) made of a thermally isolating material arranged in front of the front wall (133), particularly between the front wall and the shutter device.

6. The evaporation source of any of claims 1 to 5, wherein the shutter device (120) is detachably held at the vapor distribution assembly (130), particularly magnetically held at the vapor distribution assembly.

7. The evaporation source of claim 6, wherein the vapor distribution assembly comprises a first magnet element (135), particularly a ferromagnetic or permanent magnetic plate, for magnetically holding the shutter device (120) thereon.

8. The evaporation source of any of claims 1 to 7, wherein the plurality of vapor nozzles protrude (131) at least partially into the at least one material collection cavity (313), particularly through the isolation plate.

9. The evaporation source of any of claims 1 to 8, wherein the shutter device (120) comprises an elongated bar element, and the at least one material collection cavity (313) is provided as one or more blind holes in the elongated bar element.

10. The evaporation source of any of claims 1 to 9, wherein the shutter device (120) comprises a plurality of separate blocking units, particularly tube cylinders with a closed front side, magnetically held at the vapor distribution assembly.

11. The evaporation source of any of claims 1 to 8, wherein the shutter device comprises an elongated bar element with an elongated recess formed therein for blocking the evaporated source material emitted from several or all vapor nozzles of the plurality of vapor nozzles (131).

12. The evaporation source of any of claims 1 to 11, further comprising: at least one second vapor distribution assembly with a second plurality of vapor nozzles arranged adjacent to the vapor distribution assembly; and a shielding device attached to the at least one second vapor distribution assembly for at least partially blocking another evaporated source material emitted from the second plurality of vapor nozzles.

13. A shutter device (120) for blocking an evaporated source material emitted from a plurality of vapor nozzles (131), comprising an elongated bar element with at least one material collection cavity (313) provided therein, the at least one material collection cavity defined by a circumferential side wall (314) and a cavity front wall (315) closing the circumferential side wall.

14. The shutter device of claim 13, further comprising a magnet element (125) integrated in the shutter device and configured to be magnetically held at a vapor distribution assembly of an evaporation source.

15. An evaporation method, comprising: emitting an evaporated source material (15) from a plurality of vapor nozzles of a vapor distribution assembly in a vacuum chamber; and blocking the evaporated source material emitted by the plurality of vapor nozzles with at least one material collection cavity (313) of a shutter device (120) held in front of the plurality of vapor nozzles.

16. The evaporation method of claim 15, wherein the shutter device is detachably held at the vapor distribution assembly, particularly magnetically held at the vapor distribution assembly.

17. The evaporation method of claim 15 or 16, further comprising: detaching the shutter device (120) from the vapor distribution assembly with a shield handling apparatus, and attaching a shielding device (121) at the vapor distribution assembly, particularly wherein the shielding device is a shaping device configured to block a part of the evaporated source material emitted from the plurality of vapor nozzles having an emission angle greater than a predetermined maximum emission angle.

18. The evaporation method of any of claims 15 to 17, further comprising detaching the shutter device from the vapor distribution assembly, moving the shutter device to a cleaning region in the vacuum chamber, and cleaning the shutter device in the cleaning region.

19. The evaporation method of any of claims 15 to 18, comprising heating of the shutter device for cleaning the shutter device.

20. The evaporation method of any of claims 15 to 19, further comprising: conducting a calibration measurement or a quality check measurement while the evaporated source material emitted by the plurality of vapor nozzles is blocked and another evaporated source material emitted by a second plurality of vapor nozzles arranged adjacent to the plurality of vapor nozzles is unblocked.