WO2020114193A1

WO2020114193A1 - Line structure of circuit board, circuit board assembly and electronic device

Info

Publication number: WO2020114193A1
Application number: PCT/CN2019/116594
Authority: WO
Inventors: 张卫鹏
Original assignee: 维沃移动通信有限公司
Priority date: 2018-12-03
Filing date: 2019-11-08
Publication date: 2020-06-11
Also published as: CN109379839A

Abstract

A line structure of a circuit board, a circuit board assembly and an electronic device, wherein the line structure of a circuit board is applied to a circuit board (2) configured with a component (1), and the circuit board (2) is a multi-layered circuit board the number of layers of which is equal to or greater than two; a line of the circuit board (2) comprises a line section (31) that passes through an orthographic projection area of the component (1); the line section (31) comprises an even number of layers of wiring, each layer of wiring of the line section (31) is respectively provided on a different layer of the circuit board (2), each layer of wiring of the line section (31) is connected in sequence by means of a connection section (313), and the directions of the currents of two adjacent layers of wiring of the line section (31) are opposite.

Description

Circuit board circuit structure, circuit board assembly and electronic equipment

Cross-reference of related applications

This application claims the priority of Chinese Patent Application No. 201811466251.3 filed in China on December 3, 2018, the entire contents of which are hereby incorporated by reference.

Technical field

The present disclosure relates to the technical field of circuit boards, and in particular, to a circuit board circuit structure, circuit board assembly, and electronic equipment.

Background technique

As the functions of electronic equipment continue to expand, more and more devices are provided in electronic equipment. There is a change in current during operation of the device in the electronic device, which results in a change in the magnetic field in the electronic device, thereby generating magnetic field interference. Changes in the magnetic field will have a certain impact on the performance of the device, especially devices that are more sensitive to magnetic fields. Such devices are generally placed in areas away from the magnetic field. In order to reduce the influence of magnetic field interference on the performance of the device, it is also necessary to avoid the device when performing circuit layout on the circuit board.

It can be seen that the circuit board layout of the electronic equipment in the related art has greater restrictions, and as the space of the circuit board becomes more and more tight, the layout problem becomes more and more serious.

Summary of the invention

The embodiments of the present disclosure provide a circuit board circuit structure, a circuit board assembly, and an electronic device, to solve the problem that the circuit board layout of the electronic device in the related art is relatively restrictive.

In order to solve the above technical problems, the present disclosure is implemented as follows:

In a first aspect, an embodiment of the present disclosure provides a circuit board circuit structure applied to a circuit board provided with devices, the circuit board being a multi-layer circuit board with a number of layers greater than or equal to 2;

The circuit board circuit has a circuit segment passing through the orthographic projection area of the device;

The line segment includes even-numbered layer traces, and the layer traces of the line segment are respectively disposed on different layers of the circuit board, and the layer traces of the line segment are sequentially connected by a connecting segment, and the line segment The current directions of adjacent two layers of traces are opposite.

In a second aspect, an embodiment of the present disclosure provides a circuit board assembly, including a circuit board, a magnetic sensitive device provided on the circuit board, and a circuit board circuit, the circuit board circuit adopts the structure of the first aspect.

In a third aspect, an embodiment of the present disclosure provides an electronic device, including the circuit board assembly in the second aspect.

In the embodiments of the present disclosure, the even-numbered layer traces are arranged under the device, so that the magnetic fields generated by the current changes of the layer traces can cancel each other, thereby reducing the magnetic field interference around the device. In this way, there is no need to passively select an area where the magnetic field interference is small to set up the device, and the circuit board traces need not avoid the device. It can be seen that the embodiments of the present disclosure can make the circuit board layout more flexible.

BRIEF DESCRIPTION

1 is one of the structural schematic diagrams of the circuit board assembly provided by the embodiment of the present disclosure;

2 is a second structural diagram of a circuit board assembly provided by an embodiment of the present disclosure.

detailed description

The technical solutions in the embodiments of the present disclosure will be described clearly and completely in conjunction with the drawings in the embodiments of the present disclosure. Obviously, the described embodiments are part of the embodiments of the present disclosure, but not all of the embodiments. Based on the embodiments in the present disclosure, all other embodiments obtained by a person of ordinary skill in the art without creative efforts fall within the protection scope of the present disclosure.

In electronic equipment, such as mobile phones, tablet computers, car navigation systems, etc., various electronic components (referred to as "devices") are implemented on the circuit board to achieve different functions. During the operation of the device, the current level generally occurs. There are more or less changes, and with the change of the working scene of the electronic device (such as charging scene, call scene, video scene, etc.), the change of the current size is also different. According to the principle of electromagnetic induction, a changing electric current produces a changing electric field, and a changing electric field produces a changing magnetic field. Therefore, the device will generate magnetic field interference to the device, especially the magnetic sensitive device, and the magnetic field interference may change at any time. With the continuous expansion of the functions of electronic equipment, there are more and more scenes with large loads, and the current changes are more frequent, which makes the device more susceptible to magnetic field interference.

In the related art, the methods to avoid magnetic field interference mainly include the following: First, the device is placed in an area away from the magnetic field interference, but as the layout area of the circuit board becomes more and more tight, the layout space restrictions are more and more, It is also getting harder and harder to find a location away from magnetic interference. Second, when laying out the circuit board traces, avoid the surrounding and bottom areas of the device, which limits the flexibility of the circuit board traces to a certain extent. Third, the device is placed in the clearance area of the radio frequency antenna, which reduces the effective clearance area of the radio frequency antenna, thereby reducing the sensitivity of the radio frequency antenna. It can be seen that none of the above methods can effectively solve the above-mentioned problems caused by installing devices in the electronic equipment.

In view of this, embodiments of the present disclosure provide a circuit board circuit structure to solve the above-mentioned problems.

As shown in FIGS. 1 to 2, an embodiment of the present disclosure provides a circuit board circuit structure, which is applied to a circuit board 2 provided with a device 1. The circuit board 2 is a multilayer circuit board with a number of layers greater than or equal to 2; a circuit board The line 3 has a line segment 31 passing through the orthographic projection area of the device 1; the line segment 31 includes even-numbered layer traces, the layer traces of the line segment 31 are respectively disposed on different layers of the circuit board 2, and the layer traces of the line segment 31 pass through The connection sections 313 are connected in sequence, and the current directions of the two adjacent layers of the line section 31 are opposite.

The circuit board circuit 3 is a circuit of other devices (not shown) provided on the circuit board 2.

The above-mentioned device 1 may be a device that realizes its function by a magnetic field (may be referred to as a "magnetic sensitive device"), such as a magnetic sensor. Magnetically sensitive devices commonly used in related technologies include compasses, Hall elements, and so on.

The circuit board circuit 3 described above includes a current input terminal 32 and a current output terminal 33 in addition to the circuit segment 31 passing through the front projection area of the device 1. The orthographic projection area of the device 1 on the circuit board 2 is a sealed area, and the line segment 31 passing through the orthographic projection area of the device 1 includes the first layer trace 311 passing through the orthographic projection area, which is outside the orthographic projection area It is connected to the connection section 313 and connected to the second layer trace 312 through the connection section 313. The second layer trace 312 also passes through the orthographic projection area and forms the current output terminal 33. The line segment 31 passing through the front projection area of the device 1 further includes that the first layer trace 311 extends from the front projection area to the front projection area, and is connected to the second layer trace 312 through the connection section 313 in the front projection area. The second layer trace 312 passes through the orthographic projection area and forms the current output terminal 33. The line segment 31 passing through the front projection area of the device 1 further includes that the first layer trace 311 extends from the front projection area to the outside of the front projection area, and is connected to the second layer trace 312 through the connecting section 313 outside the front projection area. The second layer trace 312 extends into the orthographic projection area and forms a current output terminal 33.

The number of wiring layers of the above-mentioned line segment 31 is at least 2 layers, and the maximum number of wiring layers can be reasonably set according to the number of layers of the circuit board 2, for example, if the number of layers of the circuit board 2 is 4, the number of the line segment 31 The maximum number of trace layers is 4, and so on. The connection section 313 between the adjacent two layers of traces of the line section 31 can be realized by copper plating through vias.

1 to FIG. 2 shows a specific implementation manner in which the number of wiring layers of the line segment 31 is two layers. In FIGS. 1 to 2, the line segment 31 includes the first layer trace 311 and the second layer trace 312. The first layer traces 311 and the second layer traces 312 are located on different layers of the circuit board 2 respectively. The first layer traces 311 and the second layer traces 312 are arranged substantially in parallel (may be arranged in parallel or non-parallel); The line section 31 further includes a connection section 313 connecting adjacent two layers of traces. The connection section 313 may be a portion where the via on the circuit board 2 is located.

When the device operates, the first layer trace 311 and the second layer trace 312 will form current paths of equal size and substantially opposite directions. According to Ampere's rule, the two current paths in the area where the device is located will produce magnetic fields with substantially opposite directions and almost equal sizes (due to the layer spacing between the first layer trace 311 and the second layer trace 312, the two current paths are in The size of the magnetic field in the area where the device 1 is located cannot be completely equal), so that the magnetic fields generated by the two current paths can be almost completely cancelled out, thus minimizing the magnetic field interference of the circuit board circuit 3 on the device.

It should be noted that the number of wiring layers of the line segment 31 may be two layers, or even layers such as four layers or six layers. Among them, the number of wiring layers of the line segment 31 is optionally two layers, the reason is that, because there is only a magnetic field difference caused by the spacing between the two layers of wiring, the magnetic field cancellation effect is the best; and, the wiring layer The smaller the number, the fewer the number of layers occupying the circuit board 2, which can simplify the wiring arrangement inside the circuit board 2. In addition, the number of wiring layers of the line segment 31 also needs to be set reasonably according to various parameters of the device.

Through the above settings, there is no need to passively select the area where the magnetic field interference is small to set up the device, and the position of the device on the circuit board is more flexible; the circuit board routing does not need to avoid the device, and the circuit board layout is more flexible; the circuit board can be laid out The number of devices can also be appropriately increased, which can increase the layout density of the circuit board; and, it does not need to occupy the clearance area of the RF antenna to set the device, ensuring the working performance of the RF antenna and improving the sensitivity of the RF antenna.

Optionally, the wiring of each layer of the line segment 31 is parallel. In this way, when the device works, two adjacent layers of traces will form current paths of equal size and completely opposite directions. According to Ampere's rule, the two current paths will generate magnetic fields with completely opposite directions and almost equal sizes in the area where the device is located, so as to offset the magnetic fields generated by the adjacent two layers of traces to the greatest extent.

Optionally, the traces of each layer of the line segment 31 are respectively disposed on successive layers of the circuit board 2.

As mentioned above, due to the layer distance between the first layer trace 311 and the second layer trace 312, the magnetic fields of the two current paths in the area where the device 1 is located cannot be completely equal. In addition, the smaller the distance between the first layer trace 311 and the second layer trace 312, the closer the magnetic fields of the two current paths in the area where the device 1 is located. In view of this, the traces of each layer of the line segment 31 can be respectively provided on the continuous layer of the circuit board 2, so that the distance between the traces of each layer can be minimized, so that the magnetic fields generated by the two current paths can be cancelled to the greatest extent. FIGS. 1 to 2 show an embodiment in which the first layer traces 311 and the second layer traces 312 are respectively disposed on the second layer and the third layer of the circuit board 2.

Optionally, when the number of layers of the circuit board 2 is greater than 2, and the number of layers of the circuit board 2 is greater than the number of traces of the line segment 31, the distance between the trace of the line segment 31 closest to the device 1 and the device 1 is at least one Layer circuit board.

Considering that the device 1 needs to be electrically and mechanically connected to the circuit board 2 through appropriate connection structures, such as solder pins, pads, etc., in order not to affect the stability of the various connections between the device 1 and the circuit board 2 The line segment 31 should avoid the circuit board layer where the device 1 is located as much as possible. When the number of layers of the circuit board 2 is greater than 2, the trace of the line segment 31 closest to the device 1 may be separated from the device 1 by at least one layer of circuit board. That is to say, the device 1 is arranged on the first layer of the circuit board 2, and the line segment 31 can be arranged from the second layer of the circuit board 2 or a layer below the second layer.

In the case where the number of layers of the circuit board 2 is limited and the circuit segment 31 cannot be separated from the device 1 by at least one circuit board, the circuit segment 31 can also be placed at the device 1 avoiding the connection structure such as solder legs and pads Circuit board layer.

Optionally, when the number of layers of the circuit board 2 is greater than 3, and the number of layers of the circuit board 2 is greater than the number of wiring layers of the line segment 31 by 2, the distance between the trace of the line segment 31 closest to the device 1 and the device 1 At least two layers of circuit boards.

It is easy to understand that the closer the traces of the line segment 31 are to the device 1, the stronger the interference to the magnetic field of the device 1, and the greater the difference in the magnetic field of the device 1 between the two adjacent traces. Therefore, in order to weaken the magnetic field difference of the adjacent two layers of traces to the device 1 as much as possible, when the number of layers of the circuit board 2 is sufficient, the traces of each layer of the line segment 31 can be arranged on the layers of the circuit board 2 away from the device 1 . For example, when the number of layers of the circuit board 2 is 4, and the number of wiring layers of the line segment 31 is 2, the wiring of the line segment 31 may be provided on the third and fourth layers of the circuit board 2.

In addition, the routing of each layer of the line segment 31 also needs to be reasonably set according to the overall layout requirements of the circuit board 2.

Optionally, the layer spacing of the circuit board 2 where the line segments 31 are provided is less than or equal to the layer spacing of the circuit board 2 where the line segments 31 are not provided.

As mentioned above, the smaller the distance between the adjacent two layers of traces of the line segment 31, the closer the magnetic fields of the two current paths in the area where the device 1 is located, and the smaller the magnetic field interference to the device 1 generated thereby. In view of this, the spacing between the layers of the circuit board 2 can be set differently, and the line segment 31 can be disposed on a layer with a smaller layer spacing of the circuit board 2.

Optionally, the lengths of the traces of each layer of the line segment 31 are equal, and the connecting segment 313 between the traces of two adjacent layers is perpendicular to the traces of each layer. In this way, the closer the magnitude of the magnetic field generated by the traces of each layer to the device 1 is, the less the interference of the magnetic field generated by the device 1 to the device 1 is.

Optionally, the vertical distance between the two ends of the traces of each layer of the line segment 31 and the edge of the device 1 is equal, and the connection segment 313 between the traces of two adjacent traces is perpendicular to the traces of each layer. In this way, the two ends of the traces of each layer are arranged symmetrically with respect to the center of the device 1, and the resulting interference to the magnetic field of the device 1 is smaller.

In addition, the vertical distance between each connection segment 313 connected to both ends of each layer trace in the line segment 31 to the edge of the device 1 is also approximately equal, and the vertical distance between each connection segment 313 and the edge of the device 1 is the same as the current input terminal 32 The vertical distance from the (or current output terminal 33) to the edge of the device 1 is also approximately equal. In this way, the magnetic field interference to the device 1 generated in the above-mentioned places can be substantially completely cancelled, thereby further reducing the magnetic field interference of the entire circuit board circuit 3 to the device 1.

Optionally, the current input terminal 32 of the circuit board circuit 3 is located in the area from the edge of the device 1 to the outside of the device 1;

The current output terminal 33 of the circuit board line 3 is located in the area from the edge of the device 1 to the outside of the device 1.

Through the above arrangement, the circuit board lines 3 of other devices can be introduced from the outside of the device 1 and drawn out from the outside of the device 1 so as to avoid affecting the arrangement of the device 1 on the circuit board 2.

Optionally, the connection segment 313 between the adjacent two layers of traces of the line segment 31 is located in the area from the edge of the device 1 to the outside of the device 1.

Further, the vertical distance between each connecting section 313 and the edge of the device 1 is approximately equal to the vertical distance between the current input terminal 32 (or current output terminal 33) and the edge of the device 1.

Optionally, the current output terminal 33 of the circuit board line 3 is directly led out from the last layer of the line segment 31 as shown in FIG. 1; when there is a surplus number of layers of the circuit board 2, the current of the circuit board line 3 The output terminal 33 is led out from the circuit board layer located under the last layer of the line segment 31, as shown in FIG. 2.

An embodiment of the present disclosure also provides a circuit board assembly. As shown in FIGS. 1 to 2, the circuit board assembly includes a circuit board 2 and a device 1 provided on the circuit board 2 and a circuit board circuit 3. The circuit board circuit 3 adopts the above disclosure The circuit board circuit structure in the embodiment.

Wherein, the device 1 is a magnetic sensitive device, including at least one of a compass and a Hall element.

The specific implementation of the circuit board assembly can refer to the above description, and can achieve the same technical effect. In order to avoid repetition, it will not be repeated here.

An embodiment of the present disclosure also provides an electronic device, including the circuit board assembly in the above disclosed embodiment. The specific implementation of the circuit board assembly in the electronic device can refer to the above description, and can achieve the same technical effect. In order to avoid repetition, it will not be repeated here.

In the embodiment of the present disclosure, the electronic device may be a computer, a mobile phone, a tablet, a laptop, a laptop, a personal computer, a personal digital assistant (PDA), or a mobile Internet electronic Device (Mobile Internet Device, MID), wearable device (Wearable Device), e-reader, navigator, digital camera, etc.

The above are only specific implementations of the present disclosure, but the scope of protection of the present disclosure is not limited to this, and any person skilled in the art can easily think of changes or replacements within the technical scope disclosed in the present disclosure. It should be covered by the protection scope of the present disclosure. Therefore, the protection scope of the present disclosure shall be subject to the protection scope of the claims.

Claims

A circuit board circuit structure is applied to a circuit board provided with devices, and the circuit board is a multilayer circuit board with a number of layers greater than or equal to 2;

The circuit board circuit has a circuit segment passing through the orthographic projection area of the device;

The line segment includes even-numbered layer traces, and the layer traces of the line segment are respectively disposed on different layers of the circuit board, and the layer traces of the line segment are sequentially connected by a connecting segment, and the line segment The current directions of adjacent two layers of traces are opposite.
The circuit board circuit structure according to claim 1, wherein the traces of each layer of the circuit segment are parallel.
The circuit board circuit structure according to claim 1, wherein the traces of each layer of the circuit segment are respectively disposed on successive layers of the circuit board.
The circuit board circuit structure according to claim 1, wherein when the number of layers of the circuit board is greater than 2, and the number of layers of the circuit board is greater than the number of wiring layers of the circuit segment, the most of the circuit segment At least one circuit board is spaced between the trace close to the device and the device.
The circuit board circuit structure according to claim 1, wherein the layer interval of the circuit board where the circuit segment is provided is less than or equal to the layer interval of the circuit board where the circuit segment is not provided.
The circuit board circuit structure according to claim 1, wherein the lengths of the traces of each layer of the circuit segment are equal, and the connection section between the traces of two adjacent layers is perpendicular to the traces of each layer.
The circuit board circuit structure according to claim 1, wherein the vertical distance between the two ends of each layer trace of the circuit segment and the edge of the device is equal, and the connection segment between adjacent two layers of traces is vertical Route on all layers.
The circuit board circuit structure according to claim 1, wherein the current input terminal of the circuit board circuit is located in a region from the edge of the device to the outside of the device;

The current output end of the circuit board circuit is located in an area from the edge of the device to the outside of the device.
The circuit board circuit structure according to claim 1, wherein the number of wiring layers of the circuit segment is two.
A circuit board assembly includes a circuit board, a device provided on the circuit board, and a circuit board circuit, and the circuit board circuit adopts the structure according to any one of claims 1 to 9.
The circuit board assembly of claim 10, wherein the device is a magnetically sensitive device, including at least one of a compass and a Hall element.
An electronic device comprising the circuit board assembly according to claim 10 or 11.