WO2019131081A1 - シリコーンゴム組成物およびそれを用いてなる複合体 - Google Patents
シリコーンゴム組成物およびそれを用いてなる複合体 Download PDFInfo
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- WO2019131081A1 WO2019131081A1 PCT/JP2018/045255 JP2018045255W WO2019131081A1 WO 2019131081 A1 WO2019131081 A1 WO 2019131081A1 JP 2018045255 W JP2018045255 W JP 2018045255W WO 2019131081 A1 WO2019131081 A1 WO 2019131081A1
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- 0 C*(C*(C)(C)ICI)I(*)N Chemical compound C*(C*(C)(C)ICI)I(*)N 0.000 description 2
- PMRMHXUYXNEVFS-UHFFFAOYSA-N CS(C)OS(c1ccccc1)(c1ccccc1)OS(C)C Chemical compound CS(C)OS(c1ccccc1)(c1ccccc1)OS(C)C PMRMHXUYXNEVFS-UHFFFAOYSA-N 0.000 description 1
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/04—Ingredients treated with organic substances
- C08K9/06—Ingredients treated with organic substances with silicon-containing compounds
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/48—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
- C08G77/54—Nitrogen-containing linkages
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/36—Silica
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/10—Esters; Ether-esters
- C08K5/101—Esters; Ether-esters of monocarboxylic acids
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
- C08K5/541—Silicon-containing compounds containing oxygen
- C08K5/5415—Silicon-containing compounds containing oxygen containing at least one Si—O bond
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/04—Ingredients treated with organic substances
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L101/00—Compositions of unspecified macromolecular compounds
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/12—Polysiloxanes containing silicon bound to hydrogen
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
Definitions
- the present invention relates to a silicone rubber composition and composites made from the silicone rubber composition.
- Silicone rubber compositions which are adhesive to organic resins which are in the process of curing and which simultaneously exhibit mold release properties for the molds used for their molding are well known.
- a heat-curable organopolysiloxane composition a fine reinforcing silica powder, an adhesion promoter, and a functional group reactive with the organopolysiloxane composition.
- a silicone rubber composition comprising at least an organosilicon compound having a siloxane skeleton incompatible with the organopolysiloxane composition and disclosed in US Patent Application Publication No. 2007/0100072.
- Organopolysiloxane having at least two silicon-bonded alkenyl groups in one molecule Organopolysiloxane having at least two silicon-bonded hydrogen atoms in one molecule, alkylene glycol diacrylate or alkylene glycol dimethacryl Acid ester, and hydro At least comprising the silicone rubber composition from Lil-reaction catalyst.
- the former silicone rubber composition forms a silicone rubber with poor appearance, its application is limited. And the former silicone rubber composition does not have sufficient adhesiveness to various organic resins in contact during curing. Also, the latter silicone rubber composition does not have sufficient adhesion to various organic resins being in contact during curing, while at the same time the mold releasability to the mold used for its molding is not sufficient. .
- the object of the present invention is to provide a silicone rubber composition which is excellent in adhesiveness to various organic resins in contact during curing, and at the same time, excellent in mold releasability with respect to a mold used for its molding. It is. Another object of the present invention is to provide a composite in which the silicone rubber is sufficiently adhered to at least one organic resin.
- the silicone rubber composition of the present invention is (A) 100 parts by mass of organopolysiloxane having at least two alkenyl groups in one molecule, (B) Silica filler 1 to 100 parts by mass, (C) organosiloxane having at least two silicon-bonded hydrogen atoms in one molecule and having no alkenyl group (in this component per 1 mol in total of aliphatic unsaturated bonds in the present composition) Amount of 0.5 to 5 moles of silicon-bonded hydrogen atoms of (D) Catalyst for hydrosilylation reaction A catalytic amount, and (F) at least an adhesive agent, 0.01 to 20 parts by mass, wherein the component (B) is in the presence of part or all of the component (A), A silica filler obtained by surface treatment with at least 30 parts by mass of (E) a surface treatment agent with respect to 100 parts by mass of a silica filler having a specific surface area of at least 50 m 2 / g according to the BET method .
- the composite material of the present composition is characterized by comprising the silicone rubber formed by curing the silicone rubber composition of the present invention and an organic resin, and the silicone rubber is adhered to the organic resin.
- the silicone rubber composition of the present invention has excellent adhesion to various organic resins in contact with curing, and at the same time, excellent mold releasability from the mold used for its molding. It is characterized by In addition, the composite material of the present invention is characterized in that the silicone rubber is sufficiently adhered to at least one organic resin.
- Component (A) is an organopolysiloxane having at least two alkenyl groups in one molecule.
- the alkenyl group in component (A) has 2 to 12 carbon atoms, such as vinyl, allyl, butenyl, pentenyl, hexenyl, heptenyl, octenyl, nonenyl, decenyl, undecenyl, dodecenyl and the like are exemplified, preferably a vinyl group.
- Alkyl group having 1 to 12 carbon atoms such as heptyl group, octyl group, nonyl group, decyl group, undecyl group and dodecyl group; aryl having 6 to 12 carbon atoms such as phenyl group, tolyl group, xylyl group and naphthyl group
- a halogen atom such as a fluorine atom, a chlorine atom or a bromine atom
- the molecular structure of the component (A) is not limited, and examples thereof include linear, partially branched linear, branched, cyclic, or three-dimensional network.
- the component (A) may be a kind of organopolysiloxane having these molecular structures, or a mixture of two or more kinds of organopolysiloxanes having these molecular structures.
- dimethylpolysiloxane terminated with dimethylvinylsiloxy at both ends of molecular chain
- dimethylvinylsiloxy copolymer terminated with dimethylvinylsiloxy at both ends of branched chain
- dimethylvinylsiloxy group terminated at both ends of molecular chain Blocked dimethylsiloxane / methyl vinyl siloxane copolymer
- a copolymer comprising (CH 3 ) 3 SiO 1/2 units, (CH 3 ) 2 (CH 2 CHCH) SiO 1/2 units and SiO 4/2 units, (CH 3 ) 2 (CH 2 CHCH ) Combined weight consisting of SiO 1/2 units and SiO 4/2 units Coal
- the viscosity at 25 ° C. of the component (A) is not limited, it is preferably in the range of 100 to 100,000 mPa ⁇ s. This is because when the viscosity is at least the lower limit of the above range, the composition forms a silicone rubber having good mechanical properties, while when the viscosity is at or below the upper limit of the above range, It is because handling workability is good.
- This viscosity can be measured using a B-type viscometer according to JIS K 7117-1: 1999.
- the component (B) improves the mechanical strength of the silicone rubber obtained by curing the composition, and has excellent adhesion to various organic resins with which the composition is in the process of curing. At the same time, it is a silica filler for exerting an effect that mold releasability is excellent with respect to a mold used for the molding.
- the component (B) is at least 30 parts by mass (E) per 100 parts by mass of the silica filler having a specific surface area according to the BET method of at least 50 m 2 / g in the presence of part or all of the component (A). 2.) A silica filler obtained by surface treatment with a surface treatment agent.
- the silica filler of the component (E) prior to surface treatment with the component (E) has a BET specific surface area of at least 50 m 2 / g, preferably at least 100 m 2 / g, or at least 200 m 2 / g. is there.
- a silica filler may be untreated or may be previously surface-treated, and is preferably an untreated silica filler.
- an untreated silica filler As an untreated silica filler, HDK (registered trademark) T30P manufactured by Wacker Co., Ltd., AEROSIL (registered trademark) 380 manufactured by Nippon Aerosil Co., Ltd., and the like are available.
- Organohalosilanes such as trimethylchlorosilane and dimethyldichlorosilane as the surface treatment agent of component (E); hexamethyldisilazane, 1,1,3,3-tetramethyl-1,3-divinyldisilazane, hexamethylsilane Organosilazanes such as trisilazane; Organoalkoxysilanes such as methyltrimethoxysilane, ethyltrimethoxysilane, methyltriethoxysilane, methyltriethoxysilane, hexyltrimethoxysilane, octyltrimethoxysilane, etc. are exemplified, and preferred are organosilazanes, and further, And hexamethyldisilazane in combination with 1,1,3,3-tetramethyl-1,3-divinyldisilazane.
- the component (E) is treated with at least 30 parts by weight, preferably at least 35 parts by weight, per 100 parts by weight of the silica filler in the presence of part or all of the component (A). This is because when the amount of the component (E) treated is in the above range, it has excellent adhesion to various organic resins, and furthermore, the viscosity of the present composition decreases and the formability improves. .
- the preparation method of the component (B) is not limited, and a part or all of the component (A) in the presence of the silica filler and the component (E) are introduced into a kneading apparatus sealed under normal pressure, It is preferable to knead as necessary at room temperature or with heating in the presence of an inert gas and then heat-knead under reduced pressure. In order to accelerate the treatment of the silica filler with the surface treatment agent, water or a reaction catalyst may be added as necessary.
- the component (C) is a crosslinking agent of the present composition, and is an organopolysiloxane having at least two silicon-bonded hydrogen atoms in one molecule and no alkenyl group.
- Examples of the group to be bonded to a silicon atom other than a hydrogen atom in the component (C) include a methyl group, an ethyl group, a propyl group, an isopropyl group, a butyl group, an isobutyl group, a terbutyl group, a pentyl group, a neopentyl group, a hexyl group and a cyclohexyl group Alkyl group having 1 to 12 carbon atoms such as heptyl group, octyl group, nonyl group, decyl group, undecyl group and dodecyl group; aryl having 6 to 12 carbon atoms such as phenyl group, tolyl group, xyly
- the molecular structure of the component (C) is not limited, and includes, for example, linear, partially branched linear, branched, cyclic, and three-dimensional network, and preferably partially branched linear , Branched, or three-dimensional network.
- the viscosity at 25 ° C. of the component (C) is not limited, it is preferably 10,000 mPa ⁇ s or less, or in the range of 1 to 5,000 mPa ⁇ s, or in the range of 1 to 1,000 mPa ⁇ s. This is because when the viscosity is at least the lower limit of the above range, the composition forms a silicone rubber having good mechanical properties, while when the viscosity is at or below the upper limit of the above range, It is because handling workability is good. This viscosity can be measured using a B-type viscometer according to JIS K 7117-1: 1999.
- Such component (C) examples include 1,1,3,3-tetramethyldisiloxane, 1,3,5,7-tetramethylcyclotetrasiloxane, and molecular chain both terminal trimethylsiloxy group-blocked methyl hydrogen polysiloxane , A molecular chain both terminal trimethylsiloxy group blocked dimethyl siloxane / methyl hydrogen siloxane copolymer, a molecular chain both terminal dimethyl hydrogen siloxy group blocked dimethyl siloxane / methyl hydrogen siloxane copolymer, (CH 3 ) 2 HSiO 1/2 Copolymer comprising unit and SiO 4/2 unit, copolymer comprising (CH 3 ) 2 HSiO 1/2 unit, SiO 4/2 unit and (C 6 H 5 ) SiO 3/2 unit, and A mixture of two or more is exemplified.
- Component (C) is an aliphatic unsaturated bond in the present composition, for example, an alkenyl group in component (A), an alkenyl group in component (G-2), an aliphatic carbon-carbon in component (F).
- the amount of silicon-bonded hydrogen atoms in this component is in the range of 0.5 to 5 moles, or in the range of 0.8 to 2.5 moles relative to a total of 1 mole of double bonds. . This is because if the compounding amount of the component (C) is at least the lower limit of the above range, the present composition can form a silicone rubber having good adhesion to various organic resins, while at the upper limit or less of the above range If present, the present composition can form a silicone rubber having good mechanical properties.
- the content of silicon-bonded hydrogen atoms in component (C) can be analyzed by Fourier transform infrared spectroscopy (FT-IR), nuclear magnetic resonance (NMR), gel permeation chromatography (GPC), etc. It can be determined by the method.
- FT-IR Fourier transform infrared spectroscopy
- NMR nuclear magnetic resonance
- GPC gel permeation chromatography
- the component (D) is a hydrosilylation reaction catalyst for promoting the curing of the composition, and examples thereof include platinum catalysts, rhodium catalysts, and palladium catalysts.
- the component (D) is preferably a platinum-based catalyst because it can significantly accelerate the curing of the composition.
- platinum-based catalysts include fine platinum powder, chloroplatinic acid, alcohol solutions of chloroplatinic acid, alkenylsiloxane complexes of platinum, olefin complexes of platinum, carbonyl complexes of platinum, and preferably alkenylsiloxane complexes of platinum .
- the compounding amount of the component (D) is a catalytic amount and is not particularly limited as long as it is an amount effective to accelerate the curing of the composition, but the compounding amount is in the component (D).
- the catalyst metal is in the range of 1 to 1000 ppm, or in the range of 1 to 500 ppm, or in the range of 1 to 300 ppm by mass unit relative to the composition. This is because if the compounding amount of the component (D) is in the above range, the curing reaction of the resulting composition is promoted.
- the component (F) is an adhesion promoter for improving the adhesion of the resulting silicone rubber.
- a component (F) an acrylic compound, a methacrylic compound, an epoxy compound, an organosilicon compound having at least one phenylene skeleton in one molecule, or at least one silicon bond hydrolyzable in one molecule
- the organosilicon compounds having a group are exemplified, preferably an acrylic compound or a methacrylic compound having an ester bond in the molecule.
- acryl compound and methacryl compound of (F) component are not limited, Preferably, following General formula (1): A compound represented by the following general formula (2): A compound represented by the following general formula (3): And a compound represented by the following general formula (4): And at least one acrylic compound or methacrylic compound selected from the compounds represented by
- each R 1 is independently a hydrogen atom or a methyl group, preferably a hydrogen atom.
- R 2 is an aralkyl group having 7 to 20 carbon atoms, a phenoxyalkyl group, or a phenoxyhydroxyalkyl group.
- the aralkyl group in the component (C) include a benzyl group, a phenethyl group and a phenylpropyl group.
- the phenoxyalkyl group in the component (C) include a phenoxyethyl group and a phenoxypropyl group.
- a phenoxy hydroxyalkyl group in (C) component a phenoxy hydroxy propyl group is illustrated.
- a is an integer of 1 to 4, or an integer of 2 to 4, or an integer of 3 to 4.
- b is each independently an integer of 1 to 3, or an integer of 2 to 3.
- p is an integer of 4 to 12, or an integer of 1 to 10, or an integer of 6 to 12, or an integer of 6 to 10.
- epoxy compound of (F) component is not limited, Preferably, glycidoxy methacrylate, following formula: And a linear siloxane compound represented by the following formula: A cyclic siloxane compound represented by the following formula: And a linear siloxane compound represented by
- the organosilicon compound having at least one phenylene skeleton in one molecule of the component (F) is not limited, but preferably, the following formula: A compound represented by the following formula: A compound represented by the following formula: A compound represented by the following formula: The compound represented by these is illustrated.
- the organosilicon compound having at least one silicon-bonded hydrolyzable group in one molecule of the component (F) is not limited, but preferably vinyltrimethoxysilane, vinyltriethoxysilane, vinyltris (2-methoxyethoxy) Silane, vinyldiethoxymethylsilane, allyltrimethoxysilane, phenyltrimethoxysilane, 3-glycidoxypropyltrimethoxysilane, 2- (3,4-epoxycyclohexyl) ethyltrimethoxysilane, 3-aminopropyltrimethoxysilane , 3-aminopropyltriethoxysilane, N- (2-aminoethyl) -3-aminopropyltrimethoxysilane, acryloyloxymethyltrimethoxysilane, 3-methacryloxypropyltrimethoxysilane, 3-acryloxypropyltrimethoxysila , 1,6-bis
- Component (F) is in the range of 0.01 to 20 parts by weight, preferably 0.05 to 10 parts by weight, or 0.1 to 5 parts by weight per 100 parts by weight of component (A). Within the range of parts by mass. This means that the composition forms a silicone rubber having good adhesion to various organic resins when the amount of the component (F) is at least the lower limit of the above range, while at the upper limit of the above range If so, the composition forms a silicone rubber having good mechanical properties.
- an organosiloxane having an atom and no alkenyl group, or an organosiloxane having at least one aryl group and at least one alkenyl group in one molecule of the component (G-1) and the component (G-2) A mixture may be blended.
- the component (G-1) is an organosiloxane having at least one aryl group and at least one silicon-bonded hydrogen atom in one molecule and no alkenyl group.
- the aryl group in the component (G-1) include aryl groups having a carbon number of 6 to 12, such as phenyl group, tolyl group, xylyl group and naphthyl group, with preference given to phenyl group.
- Examples of the group to be bonded to a silicon atom other than the aryl group in the component (G-1) include methyl, ethyl, propyl, isopropyl, butyl, isobutyl, terbutyl, pentyl, neopentyl and hexyl groups.
- alkyl groups having 1 to 12 carbon atoms such as cyclohexyl, heptyl, octyl, nonyl, decyl, undecyl and dodecyl; some or all of the hydrogen atoms of these alkyl groups are fluorine atoms or chlorine atoms And groups substituted with a halogen atom such as bromine atom.
- the silicon atom in the component (G-1) may be bonded with a small amount of hydroxyl groups as long as the object of the present invention is not impaired.
- the component (G-1) is preferably selected from the following general formula (4): It is an organosiloxane represented by
- each R 3 independently represents a hydrogen atom, an alkyl group having 1 to 12 carbon atoms, or an aryl group having 6 to 12 carbon atoms.
- the alkyl group include the same alkyl groups as described above.
- the aryl group include the same aryl groups as described above.
- at least one R 3 is a hydrogen atom, preferably at least two R 3 is a hydrogen atom.
- at least one R 3 is an aryl group.
- m is an integer of 1 to 20, or an integer of 1 to 10, or an integer of 1 to 5. This is because if m is in the above range, the present composition forms a silicone rubber having good adhesion to organic resins.
- the component (G-2) is an organosiloxane having at least one aryl group and at least one alkenyl group in one molecule.
- the aryl group in the component (G-2) include aryl groups having a carbon number of 6 to 12, such as phenyl group, tolyl group, xylyl group and naphthyl group, with preference given to phenyl group.
- the alkenyl group in component (G-2) has 2 carbon atoms, such as vinyl, allyl, butenyl, pentenyl, hexenyl, heptenyl, octenyl, nonenyl, decenyl, undecenyl, dodecenyl and the like
- An alkenyl group of -12 is exemplified, preferably a vinyl group.
- Examples of the group to be bonded to the silicon atom other than the aryl group and the alkenyl group in the component (G-2) include a methyl group, an ethyl group, a propyl group, an isopropyl group, a butyl group, an isobutyl group, a terbutyl group, a pentyl group and a neopentyl group Alkyl groups having 1 to 12 carbon atoms such as hexyl, cyclohexyl, heptyl, octyl, nonyl, decyl, undecyl and dodecyl; some or all of the hydrogen atoms of these alkyl groups are fluorine atoms And groups substituted by halogen atoms such as chlorine atom and bromine atom.
- the silicon atom in the component (G-2) may be bonded with a small amount of hydroxyl groups as long as the object of the present invention is not impaired.
- the component (G-2) is preferably selected from the following general formula (5): It is an organosiloxane represented by
- each R 4 is independently an alkenyl group having 2 to 12 carbon atoms, an alkyl group having 1 to 12 carbon atoms, or an aryl group having 6 to 12 carbon atoms.
- this alkenyl group include the same alkenyl groups as described above.
- examples of the alkyl group include the same alkyl groups as described above.
- Examples of the aryl group include the same aryl groups as described above.
- at least one R 4 is an alkenyl group, or at least two R 4 are an alkenyl group.
- at least one R 4 is an aryl group.
- n is an integer of 0 to 20, or an integer of 0 to 10, or an integer of 0 to 5. This is because, when n is not more than the upper limit of the above range, the present composition forms a silicone rubber having good adhesion to an organic resin.
- the component (G) is preferably a mixture of the components (G-1) and (G-2).
- the mass ratio of the (G-1) component to the (G-2) component is not limited, but preferably, it is in the range of 1:10 to 10: 1, or preferably in the range of 1: 5 to 5: 1. It is inside. This is because if the mass ratio is within the above range, the present composition can form a silicone rubber having good adhesion to various organic resins.
- Component (G) is used in an amount of 0.1 to 5 parts by mass, 0.5 to 5 parts by mass, or 1 to 5 parts by mass with respect to 100 parts by mass of component (A). It is blended. This means that the composition forms a silicone rubber having good adhesiveness to various organic resins when the amount of the component (G) compounded is at least the lower limit of the above range, while at the upper limit of the above range or less If so, the composition forms a silicone rubber having good mechanical properties.
- the composition may contain a reaction inhibitor.
- a reaction inhibitor 1-ethynyl-cyclohexane-1-ol, 2-methyl-3-butyn-2-ol, 3,5-dimethyl-1-hexyn-3-ol, and 2-phenyl-3-ol Alkyne alcohols such as butyn-2-ol; En-yne compounds such as 3-methyl-3-penten-1-yne and 3,5-dimethyl-3-hexen-1-yne; 1,3,5,7 Alkenyl siloxane oligomers such as -tetramethyl-1,3,5,7-tetravinylcyclotetrasiloxane, 1,3,5,7-tetramethyl-1,3,5,7-tetrahexenyl cyclotetrasiloxane; and the like, Hydrazine, triazole, phosphine, mercaptan, organic nitrogen compound, acetylene alcohol, silylated acetylene alcohol, maleic acid,
- the silicone rubber composition of the present invention is suitable for obtaining an integral mold with an organic resin.
- the silicone rubber composition may be in the form of liquid, putty or paste, but is preferably in the form of liquid or paste because of easy molding.
- the curing conditions of the silicone rubber composition are the temperature and time at which the shape and quality do not change in order to obtain strong adhesion to the organic resin.
- the conditions depend on the type of organic resin, but integral molds can be obtained under conditions of a temperature of 80 to 180 ° C. and a molding time of 0.2 to 30 minutes.
- the silicone rubber obtained from the above silicone rubber composition preferably has a Shore A hardness (durometer) of 80 or less or 60 or less.
- the composite of the present invention comprises a silicone rubber and an organic resin obtained by curing the above silicone rubber composition, and the silicone rubber is adhered to the organic resin.
- organic resin acrylonitrile butadiene styrene copolymer, polyphenylene / styrene mixture, polystyrene, polycarbonate, polyurethane, polyethylene, polypropylene, polyacrylate, polymethacrylate, polyacrylamide, polyester, polyethylene terephthalate, polybutylene terephthalate, polyphenylene oxide, Polyphenylene sulfide, polysulfone, nylon, polyamide, polyimide, fluoropolymer, liquid crystal resin, polyether imide, phenol resin, epoxy resin, urea resin, melamine resin, alkyd resin, derivatives of these organic resins, and two or more of these A mixture of
- Such a composite material has a structure used as an integral part of silicone rubber and an organic resin.
- the silicone rubber composition and composite of the present invention will be described in more detail by way of examples and comparative examples.
- the present invention is not limited by the description of the following examples.
- the viscosity was measured at 25 ° C.
- a silicone rubber sheet having a thickness of 2 mm was produced by heating the silicone rubber composition for 10 minutes at 120 ° C. using a 50 ton hot press. The hardness at 25 ° C. of this silicone rubber sheet was measured by a Shore A hardness tester.
- the silicone rubber composition was applied to the test specimens and then placed in a preheated stainless steel mold. Except for the polyester resin, the test pieces were molded at 120 ° C. for 4 minutes using a 50 ton hot press. The test pieces were stored in an aging room (25 ° C., 50% RH) overnight before the peel test. The speed of the 90 ° peel test at 25 ° C. is 50 mm / min. In addition, after the peel test, the ratio of the area of the cohesively broken silicone rubber to the bonded area of the silicone rubber was measured and indicated as CF (%).
- Example 1 Molecular weight of 40,000 mPa ⁇ s, both ends of terminal dimethylvinylicyloxy-blocked dimethylpolysiloxane in 176.8 parts by mass of the silicone rubber base (1) prepared in Reference Example 1 and having a viscosity of 370 mPa ⁇ s 10.5 parts by mass of a chain end-terminated dimethylvinylosyloxy-blocked dimethylsiloxane / methylvinylsiloxane copolymer, the following formula: Embedded image 2.0 parts by mass of a diacrylic acid ester represented by the formula: both ends of a trimethylsiloxy group-blocked dimethylsiloxane / methylhydrogensiloxane copolymer having a viscosity of 43 mPa ⁇ s (in 1 mol of aliphatic unsaturated bond in the present composition) On the other hand, methyl hydrogen cyclosiloxane having a viscosity of 1 mP
- Example 2 Molecular weight of 40,000 mPa ⁇ s, both ends of terminally chained dimethyl vinyloxy group-capped dimethylpolysiloxane 1 in 160.0 parts by mass of silicone rubber base (1) prepared in Reference Example 1 and viscosity, 370 mPa ⁇ s 10.5 parts by mass of a chain end-terminated dimethylvinylosyloxy-blocked dimethylsiloxane / methylvinylsiloxane copolymer, the following formula: Embedded image 2.0 parts by mass of a diacrylic acid ester represented by the formula, a methyl chain hydroxyl-terminated methylhydrogenpolysiloxane having a viscosity of 20 mPa ⁇ s and having a viscosity of 20 mPa ⁇ s (a silicon atom relative to 1 mol of aliphatic unsaturated bond in the composition) The amount of bonded hydrogen atoms is 1.2 mol), the following formula: 2.0 parts by mass of an
- Example 3 Molecular weight of 40,000 mPa ⁇ s, both ends of terminally chained dimethyl vinyloxy group-capped dimethylpolysiloxane 1 in 160.0 parts by mass of silicone rubber base (2) prepared in Reference Example 2 and viscosity, 370 mPa ⁇ s 10.5 parts by mass of a chain end-terminated dimethylvinylosyloxy-blocked dimethylsiloxane / methylvinylsiloxane copolymer, the following formula: Embedded image 2.0 parts by mass of a diacrylic acid ester represented by the formula, a methyl chain hydroxyl-terminated methylhydrogenpolysiloxane having a viscosity of 20 mPa ⁇ s and having a viscosity of 20 mPa ⁇ s (a silicon atom relative to 1 mol of aliphatic unsaturated bond in the composition) The amount of bonded hydrogen atoms is 1.2 mol), the following formula: 2.0 parts by
- Example 4 The silicone rubber base (1) prepared in Reference Example 1 has a viscosity of 40,000 mPa ⁇ s and 5.9 parts by mass of dimethylvinylicoxy-blocked dimethylpolysiloxane having a viscosity of 40,000 mPa ⁇ s and a molecule having a viscosity of 370 mPa ⁇ s in 168.0 parts by mass.
- Hydrogen polysiloxane (an amount such that the silicon-bonded hydrogen atoms become 1.2 mol with respect to 1 mol of the aliphatic unsaturated bond in the present composition), the following formula: 2.0 parts by mass of an organosiloxane represented by the following formula: And 1.6 parts by weight of an organosiloxane represented by the formula, 0.1 parts by weight of 1-ethynyl-cyclohexane-1-ol, and a 1,3-divinyl-1,1,3,3-tetramethyldisiloxane complex of platinum
- a silicone rubber composition was prepared by adding 140 ppm by mass of platinum metal in the component to the present composition and uniformly mixing at room temperature. The properties of the silicone rubber obtained by curing the silicone rubber composition are shown in Table 1.
- the silicone rubber composition of the present invention exhibits excellent adhesion to various organic resins in contact with curing during curing, and at the same time, excellent mold releasability from the mold used in the molding.
- the silicone rubber composition is suitable as a silicone rubber composition for integral molding with an organic resin.
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Abstract
Description
(A)一分子中に少なくとも2個のアルケニル基を有するオルガノポリシロキサン 100質量部、
(B)シリカ充填材 1~100質量部、
(C)一分子中に少なくとも2個のケイ素原子結合水素原子を有し、アルケニル基を有さないオルガノシロキサン(本組成物中の脂肪族不飽和結合の合計1モルに対して、本成分中のケイ素原子結合水素原子が0.5~5モルとなる量)
(D)ヒドロシリル化反応用触媒 触媒量、および
(F)接着付与剤 0.01~20質量部
から少なくともなり、前記(B)成分が、前記(A)成分の一部または全部の存在下、BET法による比表面積が少なくとも50m2/gであるシリカ充填材100質量部に対して、少なくとも30質量部の(E)表面処理剤で表面処理してなるシリカ充填材であることを特徴とする。
(A)成分は、一分子中に少なくとも2個のアルケニル基を有するオルガノポリシロキサンである。(A)成分中のアルケニル基としては、ビニル基、アリル基、ブテニル基、ペンテニル基、ヘキセニル基、ヘプテニル基、オクテニル基、ノネニル基、デセニル基、ウンデセニル基、ドデセニル基等の炭素数2~12のアルケニル基が例示され、好ましくは、ビニル基である。(A)成分中のアルケニル基以外のケイ素原子に結合する基としては、メチル基、エチル基、プロピル基、イソプロピル基、ブチル基、イソブチル基、ターブチル基、ペンチル基、ネオペンチル基、ヘキシル基、シクロヘキシル基、ヘプチル基、オクチル基、ノニル基、デシル基、ウンデシル基、ドデシル基等の炭素数1~12のアルキル基;フェニル基、トリル基、キシリル基、ナフチル基等の炭素数6~12のアリール基;これらのアルキル基の水素原子の一部または全部をフッ素原子、塩素原子、臭素原子等のハロゲン原子で置換した基が例示される。本発明の目的を損なわない範囲で、(A)成分中のケイ素原子は、少量の水酸基を結合していてもよい。
本発明の複合体は、上記のシリコーンゴム組成物を硬化して得られるシリコーンゴムと有機樹脂からなり、前記シリコーンゴムが前記有機樹脂に接着している。
シリコーンゴム組成物を50トンのホットプレスを用いて、120℃、10分間加熱することにより、厚さ2mmのシリコーンゴムシートを作製した。このシリコーンゴムシートの25℃における硬さを、ショアA硬度計により測定した。
シリコーンゴム組成物を試験片に塗布し、次いで、予備加熱したステンレス製金型中に置いた。ポリエステル樹脂以外は、試験片を50トンのホットプレスを用いて、120℃、4分間で成型された。試験片は、剥離試験前に一晩、エージング室(25℃、50%RH)に保管した。25℃における90°はく離試験の速度は50mm/分である。また、はく離試験後、シリコーンゴムの接着面積に対する凝集破壊したシリコーンゴムの面積の割合を測定し、CF(%)として示した。
粘度40,000mPa・sの分子鎖両末端ジメチルビニシロキシ基封鎖ジメチルポリシロキサン 100.0質量部、BET比表面積が300m2/gのヒュームドシリカ(ワッカー社製のHDK T30P) 48質量部、ヘキサメチルジシラザン 18.0質量部、1,1,3,3-テトラメチル-1,3-ジビニルジシラザン 0.5質量部、および水 6.0質量部を、ロスミキサーを用いて、室温で混練した。次いで、減圧下、150℃、1時間加熱混合することにより、粘度520Pa・sのシリコーンゴムベース(1)を調製した。
粘度40,000mPa・sの分子鎖両末端ジメチルビニシロキシ基封鎖ジメチルポリシロキサン 100.0質量部、BET比表面積が300m2/gのヒュームドシリカ(ワッカー社製のHDK T30P) 48質量部、ヘキサメチルジシラザン 22.5質量部、1,1,3,3-テトラメチル-1,3-ジビニルジシラザン 0.5質量部、および水 7.5質量部を、ロスミキサーを用いて、室温で混練した。次いで、減圧下、150℃、1時間加熱混合することにより、粘度567Pa・sのシリコーンゴムベース(2)を調製した。
粘度40,000mPa・sの分子鎖両末端ジメチルビニシロキシ基封鎖ジメチルポリシロキサン 100.0質量部、BET比表面積が300m2/gのヒュームドシリカ(ワッカー社製のHDK T30P) 48質量部、ヘキサメチルジシラザン 9.0質量部、1,1,3,3-テトラメチル-1,3-ジビニルジシラザン 0.5質量部、および水 3.0質量部を、ロスミキサーを用いて、室温で混練した。次いで、減圧下、150℃、1時間加熱混合することにより、粘度745Pa・sのシリコーンゴムベース(3)を調製した。
参考例1で調製したシリコーンゴムベース(1) 176.8質量部に、粘度40,000mPa・sの分子鎖両末端ジメチルビニシロキシ基封鎖ジメチルポリシロキサン 6.5質量部、粘度370mPa・sの分子鎖両末端ジメチルビニシロキシ基封鎖ジメチルシロキサン・メチルビニルシロキサン共重合体 10.5質量部、下記式:
参考例3で調製したシリコーンゴムベース(3) 176.8質量部に、粘度40,000mPa・sの分子鎖両末端ジメチルビニシロキシ基封鎖ジメチルポリシロキサン 6.5質量部、粘度370mPa・sの分子鎖両末端ジメチルビニシロキシ基封鎖ジメチルシロキサン・メチルビニルシロキサン共重合体 10.5質量部、下記式:
参考例1で調製したシリコーンゴムベース(1) 160.0質量部に、粘度40,000mPa・sの分子鎖両末端ジメチルビニシロキシ基封鎖ジメチルポリシロキサン 15.6質量部、粘度370mPa・sの分子鎖両末端ジメチルビニシロキシ基封鎖ジメチルシロキサン・メチルビニルシロキサン共重合体 10.5質量部、下記式:
参考例3で調製したシリコーンゴムベース(3) 160.0質量部に、粘度40,000mPa・sの分子鎖両末端ジメチルビニシロキシ基封鎖ジメチルポリシロキサン 15.6質量部、粘度370mPa・sの分子鎖両末端ジメチルビニシロキシ基封鎖ジメチルシロキサン・メチルビニルシロキサン共重合体 10.5質量部、下記式:
参考例2で調製したシリコーンゴムベース(2) 160.0質量部に、粘度40,000mPa・sの分子鎖両末端ジメチルビニシロキシ基封鎖ジメチルポリシロキサン 15.6質量部、粘度370mPa・sの分子鎖両末端ジメチルビニシロキシ基封鎖ジメチルシロキサン・メチルビニルシロキサン共重合体 10.5質量部、下記式:
参考例1で調製したシリコーンゴムベース(1) 168.0質量部に、粘度40,000mPa・sの分子鎖両末端ジメチルビニシロキシ基封鎖ジメチルポリシロキサン 5.9質量部、粘度370mPa・sの分子鎖両末端ジメチルビニシロキシ基封鎖ジメチルシロキサン・メチルビニルシロキサン共重合体 10.2質量部、下記式:
Claims (12)
- (A)一分子中に少なくとも2個のアルケニル基を有するオルガノポリシロキサン 100質量部、
(B)シリカ充填材 1~100質量部、
(C)一分子中に少なくとも2個のケイ素原子結合水素原子を有し、アルケニル基を有さないオルガノシロキサン(本組成物中の脂肪族不飽和結合の合計1モルに対して、本成分中のケイ素原子結合水素原子が0.5~5モルとなる量)、
(D)ヒドロシリル化反応用触媒 触媒量、および
(F)接着付与剤 0.01~20質量部
から少なくともなり、前記(B)成分が、前記(A)成分の一部または全部の存在下、BET法による比表面積が少なくとも50m2/gであるシリカ充填材100質量部に対して、少なくとも30質量部の(E)表面処理剤で表面処理してなるシリカ充填材である、シリコーンゴム組成物。 - (E)成分が少なくとも1種のシラザン化合物である、請求項1記載のシリコーンゴム組成物。
- (E)成分がヘキサメチルジシラザンおよび/またはテトラメチルジビニルジシラザンである、請求項2記載のシリコーンゴム組成物。
- (F)成分が、アクリル化合物、メタクリル化合物、エポキシ化合物、一分子中に少なくとも1個のフェニレン骨格を有する有機ケイ素化合物、および一分子中に少なくとも1個のケイ素原子結合加水分解性基を有する有機ケイ素化合物から選ばれる少なくとも1種の化合物である、請求項1乃至3のいずれか1項記載のシリコーンゴム組成物。
- (F)成分が、分子中にエステル結合を有するアクリル化合物またはメタクリル化合物である、請求項4記載のシリコーンゴム組成物。
- さらに、(G)(G-1)一分子中に少なくとも1個のアリール基および少なくとも1個のケイ素原子結合水素原子を有し、アルケニル基を有さないオルガノシロキサン、または前記(G-1)成分と(G-2)一分子中に少なくとも1個のアリール基および少なくとも1個のアルケニル基を有するオルガノシロキサンの混合物を、(A)成分100質量部に対して0.1~5質量部含有する、請求項1記載のシリコーンゴム組成物。
- (G)成分が、(G-1)成分と(G-2)成分の質量比が1:10~10:1である(G-1)成分と(G-2)成分の混合物である、請求項7記載のシリコーンゴム組成物。
- 請求項1乃至10のいずれか1項記載のシリコーンゴム組成物を硬化してなるシリコーンゴムと有機樹脂からなり、前記シリコーンゴムが前記有機樹脂に接着している複合材。
- 有機樹脂が、アクリロニトリル・ブタジエン・スチレン共重合体、ポリフェニレン/スチレン混合物、ポリスチレン、ポリカーボネート、ポリウレタン、ポリエチレン、ポリプロピレン、ポリアクリレート、ポリメタクリレート、ポリアクリルアミド、ポリエステル、ポリエチレンテレフタレート、ポリブチレンテレフタレート、ポリフェニレンオキシド、ポリフェニレンスルフィド、ポリスルフォン、ナイロン、ポリアミド、ポリイミド、フルオロポリマー、液晶樹脂、ポリエーテルイミド、フェノール樹脂、エポキシ樹脂、尿素樹脂、メラミン樹脂、アルキド樹脂、およびこれらの有機樹脂の誘導体から選ばれる少なくとも1種の有機樹脂である、請求項11記載の複合材。
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- 2018-12-10 EP EP18896672.5A patent/EP3733780A4/en active Pending
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- 2018-12-10 JP JP2019562932A patent/JP7131883B2/ja active Active
- 2018-12-10 CN CN201880076379.0A patent/CN111417687B/zh active Active
- 2018-12-10 US US16/957,634 patent/US11492490B2/en active Active
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Also Published As
Publication number | Publication date |
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JPWO2019131081A1 (ja) | 2020-12-10 |
US11492490B2 (en) | 2022-11-08 |
EP3733780A1 (en) | 2020-11-04 |
US20210054199A1 (en) | 2021-02-25 |
EP3733780A4 (en) | 2021-10-06 |
TW201930475A (zh) | 2019-08-01 |
CN111417687B (zh) | 2022-06-03 |
CN111417687A (zh) | 2020-07-14 |
KR102664519B1 (ko) | 2024-05-16 |
KR20200093587A (ko) | 2020-08-05 |
JP7131883B2 (ja) | 2022-09-06 |
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