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WO2019123921A1 - Abrasive member - Google Patents

Abrasive member Download PDF

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Publication number
WO2019123921A1
WO2019123921A1 PCT/JP2018/042367 JP2018042367W WO2019123921A1 WO 2019123921 A1 WO2019123921 A1 WO 2019123921A1 JP 2018042367 W JP2018042367 W JP 2018042367W WO 2019123921 A1 WO2019123921 A1 WO 2019123921A1
Authority
WO
WIPO (PCT)
Prior art keywords
polishing
abrasive
average thickness
substrate
area
Prior art date
Application number
PCT/JP2018/042367
Other languages
French (fr)
Japanese (ja)
Inventor
聡一郎 中根
友樹 岩永
Original Assignee
バンドー化学株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by バンドー化学株式会社 filed Critical バンドー化学株式会社
Priority to CN201880003043.1A priority Critical patent/CN110177654B/en
Priority to JP2018560922A priority patent/JP6605761B1/en
Priority to US16/955,037 priority patent/US20200376628A1/en
Priority to EP18890415.5A priority patent/EP3730245A4/en
Publication of WO2019123921A1 publication Critical patent/WO2019123921A1/en

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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24DTOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
    • B24D11/04Zonally-graded surfaces
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00Lapping machines or devices; Accessories
    • B24B37/11Lapping tools
    • B24B37/20Lapping pads for working plane surfaces
    • B24B37/26Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24DTOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/001Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as supporting member
    • B24D3/002Flexible supporting members, e.g. paper, woven, plastic materials
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24DTOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/20Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
    • B24D3/28Resins or natural or synthetic macromolecular compounds

Definitions

  • the present invention relates to an abrasive.
  • an abrasive of fixed abrasive is generally used.
  • an abrasive comprising a polishing layer containing abrasive grains and a binder laminated on the surface of a substrate (see, for example, Japanese Patent No. 6091704).
  • the polishing layer is composed of a plurality of regions (grinding parts) whose surfaces are divided by grooves, and the maximum peak height of the surface of the grinding part is controlled to achieve high processing efficiency and high finish flatness. It is compatible with the level.
  • the above-mentioned conventional abrasive is a fixed abrasive type, and the polishing layer gradually wears by polishing, and the lifetime of the polishing layer is abraded. Therefore, in order to extend the life of the above-mentioned conventional abrasives, it is necessary to increase the thickness of the abrasive layer, that is, the height of the individual abrasives.
  • the aspect ratio of the polishing portion is increased, and the polishing portion tends to fall down during grinding. For this reason, the polishing material tends to have a lifetime due to the fact that the polishing portion falls down. If the aspect ratio of the polishing portion is lowered to make the polishing portion difficult to fall down, the area of each polishing portion increases. When the area of each polishing portion is large, warpage of the base material is likely to occur as the polishing layer cures and shrinks when producing the polishing layer by printing or the like. For this reason, there is a possibility that it may become difficult to perform uniform polish by curvature of this base material.
  • the polishing rate may be reduced.
  • the present invention has been made in view of such problems, and it is an object of the present invention to provide an abrasive that can thicken the polishing portion while suppressing a decrease in the polishing rate.
  • the inventors of the present invention conducted intensive studies on an abrasive which hardly causes warping of the substrate even if the thickness of the polishing portion is increased while suppressing a decrease in the polishing rate. By finding the arrangement of parts in a staggered manner, it was found that the warping of the substrate was dramatically improved, and the present invention was completed. The reason why the warping of the base material is dramatically improved by arranging the polishing portions in a zigzag arrangement is not clear, but the warpage generated in the polishing portions arranged alternately by arranging the polishing portions in a zigzag manner is not clear. It is presumed that is because it is easy to cancel each other.
  • the invention made in order to solve the above-mentioned subject is an abrasives provided with a substrate, and an abrasive layer laminated on the surface side of this substrate and containing an abrasive grain and a binder, and the above-mentioned abrasive layer is plural.
  • the plurality of polishing portions are arranged in a zigzag, the average thickness of the polishing portions is 300 ⁇ m or more, the area of the top surface of the polishing portion is 6 mm 2 or more, and The average thickness of these is 300 ⁇ m or more and 3000 ⁇ m or less.
  • the polishing portion Since the surface area of the top surface of the polishing portion is equal to or more than the lower limit, the polishing portion is unlikely to fall during grinding even if the average thickness of the polishing portion is equal to or more than the lower limit. Moreover, since the said abrasive
  • polishing part with respect to the average thickness of the said base material 0.7 or more and 4 or less are preferable.
  • the ratio of the average thickness of the polishing portion to the average thickness of the base material to be the lower limit or more, it is possible to make the polishing portion thicker while suppressing a decrease in the polishing rate.
  • production of the curvature of a base material can be suppressed by making ratio of the average thickness of the said grinding
  • the value of the area of the top surface was divided by the average thickness of the abrasive portion, 0.015 mm 2 / [mu] m or more 0.04 mm 2 / [mu] m or less.
  • the area of the top surface of the polishing portion is preferably 100 mm 2 or less, and the average thickness of the polishing portion is preferably 5000 ⁇ m or less.
  • the binder contains a thermosetting resin as a main component.
  • thermosetting resin as the main component of the binder, for example, it is possible to suppress the occurrence of glass breakage at the time of polishing of the glass material.
  • the plurality of polishing portions are arranged in a staggered arrangement means that the polishing portions are arranged at equal intervals in a plurality of parallel rows, pass through the center of the polishing portions included in one row, and This arrangement means that the centers of the polishing portions of the row adjacent to this one row are not positioned in the orthogonal direction.
  • main component means a component with the highest content, preferably a component with a content of 50% by mass or more, more preferably 90% by mass or more.
  • the thickness of the polishing portion can be increased while suppressing the decrease in the polishing rate. Therefore, the abrasive of the present invention has a long life.
  • FIG. 3 is a schematic partial cross-sectional view showing an abrasive according to an embodiment different from FIG. 2;
  • the abrasive 1 shown in FIGS. 1 and 2 includes a base 10, an abrasive layer 20 laminated on the front side of the base 10, and an adhesive layer 30 laminated on the back side of the base 10.
  • the polishing layer 20 also has a plurality of polishing portions 20a and grooves 20b disposed between the polishing portions 20a.
  • the said abrasives 1 are used suitably, for example as a fixed abrasive abrasives for surface grinding
  • the substrate 10 is a plate-like or sheet-like member for supporting the polishing layer 20.
  • the main component of the substrate 10 is not particularly limited, but polyethylene terephthalate (PET), polycarbonate (PC), polypropylene (PP), polyethylene (PE), polyimide (PI), polyethylene naphthalate (PEN), aramid, aluminum , Copper and the like.
  • PET polyethylene terephthalate
  • PC polycarbonate
  • PP polypropylene
  • PE polyethylene
  • PE polyimide
  • PEN polyethylene naphthalate
  • aramid aluminum , Copper and the like.
  • PET, PC and aluminum which have good adhesion to the polishing layer 20, are preferable.
  • the surface of the substrate 10 may be subjected to a treatment such as a chemical treatment, a corona treatment, a primer treatment, or the like to improve adhesion.
  • the substrate 10 may have flexibility or ductility.
  • the abrasive material 1 follows the surface shape of the workpiece, and the contact area between the polishing surface and the workpiece becomes large, so that the polishing rate is reduced. It will increase further.
  • PET, PC, etc. can be mentioned, for example.
  • aluminum, copper, etc. can be mentioned.
  • the shape and size of the substrate 10 are not particularly limited, and for example, a square shape having one side of 140 mm to 160 mm, a disk of 200 mm to 2022 mm in diameter, an outer diameter of 200 mm to 2022 mm, and an inner diameter of 100 mm to 658 mm It can be annular or the like.
  • the plurality of substrates 10 juxtaposed on a plane may be supported by a single support.
  • the lower limit of the average thickness of the substrate 10 is 300 ⁇ m, more preferably 500 ⁇ m.
  • the upper limit of the average thickness of the substrate 10 is 3000 ⁇ m, and 1000 ⁇ m is more preferable. If the average thickness of the substrate 10 is less than the above lower limit, the substrate 10 may be easily warped. Conversely, when the average thickness of the substrate 10 exceeds the above upper limit, the flexibility of the substrate 10 may be insufficient, and the effect of improving the polishing rate may be insufficient.
  • the polishing layer 20 includes a plurality of abrasive grains 21 and a binder 22 in the polishing portion 20 a.
  • abrasive grains 21 examples include diamond abrasive grains, alumina abrasive grains, silica abrasive grains, ceria abrasive grains, silicon carbide abrasive grains and the like. Among them, diamond abrasives which are harder than other abrasives are preferable. By making the said abrasive grain 21 into a diamond abrasive grain, polishing power can be improved and a polishing rate can further be improved.
  • a diamond of a diamond abrasive grain a single crystal or a polycrystal may be sufficient, and the diamond by which Ni coating etc. were processed may be sufficient.
  • single crystal diamond and polycrystalline diamond are preferable.
  • Single crystal diamond is harder and more abrasive than other diamonds.
  • polycrystalline diamond is apt to be easily cleaved in a microcrystalline unit constituting a polycrystalline, and it is difficult for the eye to crush to progress, so that the reduction in polishing rate is small even if polishing is performed for a long time.
  • the average particle size of the abrasive grains 21 is appropriately selected from the viewpoint of the polishing rate and the surface roughness of the object after polishing.
  • the lower limit of the average particle size of the abrasive grains 21 is preferably 2 ⁇ m, more preferably 10 ⁇ m, and still more preferably 15 ⁇ m.
  • an upper limit of the average particle diameter of the abrasive grain 21 150 micrometers is preferable, 125 micrometers is more preferable, and 100 micrometers is more preferable. If the average particle diameter of the abrasive grains 21 is less than the above lower limit, the polishing force of the polishing material 1 may be insufficient, and the polishing rate may be reduced.
  • the average particle size of the abrasive grains 21 exceeds the above upper limit, the polishing accuracy may be reduced.
  • the "average particle size” refers to the 50% value (50% particle size, D50) of the volume-based cumulative particle size distribution curve measured by a laser diffraction method or the like.
  • the upper limit of the content of the abrasive grains 21 is preferably 55% by volume, more preferably 45% by volume, and still more preferably 35% by volume. If the content of the abrasive grains 21 is less than the lower limit, the polishing power of the polishing layer 20 may be insufficient. Conversely, when the content of the abrasive grains 21 exceeds the upper limit, the abrasive layer 20 may not be able to hold the abrasive grains 21.
  • binder Although it does not specifically limit as a main component of the binder 22, Resin or an inorganic substance is mentioned. Among them, a resin, particularly a thermosetting resin, is preferable because it is difficult to cause glass cracking when polishing a glass material and is suitable for polishing a glass.
  • the resin examples include polyurethane, phenol resin, epoxy, polyester, cellulose, ethylene copolymer, polyvinyl acetal, polyacrylic acid and salts thereof, polyacrylic acid ester, polyvinyl alcohol, polyvinyl chloride, polyvinyl acetate, polyamide and the like. Resin can be mentioned. Among them, polyacrylic acid ester, epoxy, polyester and polyurethane are preferable because it is easy to ensure good adhesion to the substrate 10, and epoxy having thermosetting property is more preferable.
  • the resin may be at least partially crosslinked.
  • silicates having high abrasive retention are preferred.
  • examples of such silicates include sodium silicate and potassium silicate.
  • the binder 22 may appropriately contain various assistants and additives such as a dispersant, a coupling agent, a surfactant, a lubricant, an antifoamer, and a colorant according to the purpose.
  • the polishing layer 20 may include a filler in the polishing portion 20a.
  • fillers include oxides such as alumina, silica, cerium oxide, magnesium oxide, zirconia, and titanium oxide, and composite oxides such as silica-alumina, silica-zirconia, and silica-magnesia. You may use these individually or in combination of 2 or more types as needed. Among them, alumina is preferable because high polishing power can be obtained.
  • the average particle size of the filler depends on the average particle size of the abrasive grains 21, but the lower limit of the average particle size of the filler is preferably 0.01 ⁇ m, more preferably 2 ⁇ m.
  • the upper limit of the average particle size of the filler is preferably 40 ⁇ m, more preferably 20 ⁇ m, and still more preferably 15 ⁇ m. If the average particle diameter of the filler is less than the above lower limit, the polishing rate may be lowered due to the insufficient effect of the filler on the elastic modulus improvement of the binder 22. On the other hand, when the average particle diameter of the filler exceeds the upper limit, the filler may inhibit the polishing force of the abrasive grains 21.
  • the average particle size of the filler may be smaller than the average particle size of the abrasive grains 21.
  • the lower limit of the ratio of the average particle size of the filler to the average particle size of the abrasive grains 21 is preferably 0.01, more preferably 0.05, and still more preferably 0.1.
  • the upper limit of the ratio of the average particle size of the filler to the average particle size of the abrasive grains 21 is preferably 0.8, and more preferably 0.6. If the ratio of the average particle size of the filler to the average particle size of the abrasive grains 21 is less than the lower limit, the polishing rate may be reduced due to the insufficient effect of the filler on the elastic modulus of the binder 22. Conversely, if the ratio of the average particle size of the filler to the average particle size of the abrasive grains 21 exceeds the upper limit, the filler may inhibit the polishing force of the abrasive grains 21.
  • the content of the filler to the polishing portion 20a depends on the content of the abrasive grains 21, the lower limit of the content of the filler to the polishing portion 20a is preferably 15% by volume, and more preferably 30% by volume. preferable. On the other hand, as a maximum of content of the above-mentioned filler, 75 volume% is preferred, and 72 volume% is more preferred. If the content of the filler is less than the lower limit, the polishing rate may be reduced due to the insufficient effect of the filler on the elastic modulus improvement of the binder 22. Conversely, if the content of the filler exceeds the upper limit, the filler may inhibit the polishing force of the abrasive grains 21.
  • the polishing portion 20a is columnar. That is, the area of the bottom surface of the polishing portion 20a is 0.9 times to 1.5 times the area of the top surface of the polishing portion 20a, preferably 0.93 times to 1.2 times, more preferably 0.95. It is twice or more and 1.05 or less.
  • the plurality of polishing units 20a are arranged in a zigzag in the same shape.
  • the shape of the top surface of the polishing portion 20a can be a circular shape as shown in FIG. 1, a square shape, a polygonal shape or the like. From the viewpoint of the effect of reducing the warpage of the substrate 10, a circular shape or a square shape having a relatively low anisotropy is preferable, and a circular shape is particularly preferable.
  • the plurality of polishing units 20a are arranged in a plurality of parallel rows.
  • the intervals (distance between centers, pitch) of the polishing portions 20a arranged in one row are equal.
  • the intervals between the polishing portions 20a are the same among the plurality of rows.
  • the spacing between the plurality of rows is equal to the spacing of the polishing portions 20a.
  • the center of the polishing portion 20a in a row adjacent to this one row is located in the direction orthogonal to the one row from the midpoint of the straight line connecting the centers of the adjacent polishing portions 20a in one row.
  • the positions of the polishing portions 20a in the adjacent rows are offset by half a pitch from the position of the polishing portions 20a in one row. Therefore, as arrangement
  • the lower limit of the average pitch of the polishing portions 20a arranged in one row is preferably 3 mm, and more preferably 5 mm.
  • an upper limit of the above-mentioned average pitch 15 mm is preferred and 10 mm is more preferred. If the average pitch is less than the lower limit, the average area of the top surface of the polishing portion 20a can not be increased, and the polishing portion 20a may be prone to fall during polishing. On the other hand, when the average pitch exceeds the upper limit, the width of the groove 20b between the adjacent polishing portions 20a becomes large, and there is a possibility that the base 10 is easily warped.
  • the lower limit of the average area of the top surface of the polishing portion 20 a is 6 mm 2 , and more preferably 15 mm 2 .
  • polishing part 20a 100 mm ⁇ 2 > is preferable and 30 mm ⁇ 2 > is more preferable. If the average area of the top surface of the polishing portion 20a is less than the above-described lower limit, the polishing portion 20a may be prone to fall down during polishing. Conversely, when the average area of the top surface of the polishing portion 20a exceeds the above-described upper limit, warpage may easily occur in the base material 10.
  • the lower limit of the area occupancy ratio of the plurality of polishing portions 20a to the entire polishing layer 20 is preferably 5%, more preferably 20%, and still more preferably 30%.
  • the upper limit of the area occupancy of the polishing portion 20a is preferably 60%, and more preferably 55%. If the area occupancy rate of the polishing portion 20a is less than the above lower limit, the pressure applied at the time of polishing is too concentrated on the narrow polishing portion 20a, and the polishing portion 20a may be peeled off from the base material 10. On the contrary, when the area occupancy of the polishing portion 20a exceeds the upper limit, the contact area of the polishing layer 20 to the workpiece at the time of polishing becomes large, and the polishing rate may be reduced due to the frictional resistance.
  • polishing layer is the concept also including the area of the groove
  • the lower limit of the average thickness of the polishing portion 20a is 300 ⁇ m, and more preferably 1000 ⁇ m. On the other hand, as a maximum of average thickness of polish part 20a, 5000 micrometers is preferred and 3000 micrometers is more preferred. If the average thickness of the polishing portion 20a is less than the above lower limit, the life may be short. On the contrary, when the average thickness of the polishing portion 20a exceeds the above upper limit, the polishing portion 20a may be easily fallen at the time of polishing.
  • the lower limit of the ratio of the average thickness of the polishing portion 20a to the average thickness of the substrate 10 is preferably 0.7, and more preferably 1.
  • the upper limit of the ratio of the average thickness of the polished portion 20a is preferably 4 and more preferably 2.5.
  • the reduction effect of the curvature by the thickness of the base material 10 is not fully obtained with respect to the fall of the polishing rate by the base material 10 becoming thick as ratio of the average thickness of the said grinding
  • the lower limit of the value of the area of the top surface is divided by the average thickness of the polishing portion 20a (the area / thickness ratio) is preferably from 0.015mm 2 / ⁇ m, 0.02mm 2 / ⁇ m is more preferable.
  • the upper limit of the area / thickness ratio is preferably 0.04mm 2 / ⁇ m, 0.03mm 2 / ⁇ m is more preferable. If the area / thickness ratio is less than the lower limit, the polishing portion 20a may be easily fallen at the time of polishing. Conversely, when the area / thickness ratio exceeds the upper limit, warpage may easily occur in the base material 10.
  • the bottom surface of the groove 20 b is constituted by the surface of the base material 10.
  • the average width of the grooves 20b is determined by the area and the area occupancy of the top surface of the polishing portion 20a, but the lower limit of the average width of the grooves 20b is preferably 0.3 mm and more preferably 0.5 mm.
  • the upper limit of the average width of the grooves 20b is preferably 10 mm, more preferably 8 mm. If the average width of the grooves 20b is less than the above-mentioned lower limit, there is a possibility that abrasive powder generated by polishing may clog the grooves 20b.
  • the “average groove width” means the length (D in FIG. 1) of a portion where a straight line L connecting the centers M of adjacent polishing portions 20a in one row passes the groove 20b as shown in FIG. Point to.
  • the adhesive layer 30 is a layer for supporting the abrasive 1 and fixing the abrasive 1 to a support for mounting the abrasive 1 on a polishing apparatus.
  • the adhesive used for the adhesive layer 30 is not particularly limited, and examples thereof include reactive adhesives, instant adhesives, hot melt adhesives, and adhesives that can be replaced.
  • an adhesive is preferable.
  • a pressure-sensitive adhesive as the adhesive used for the adhesive layer 30, the abrasive 1 can be peeled off and replaced from the support, and reuse of the abrasive 1 and the support becomes easy.
  • an adhesive is not particularly limited, but, for example, acrylic adhesive, acrylic-rubber adhesive, natural rubber adhesive, synthetic rubber adhesive such as butyl rubber, silicone adhesive, polyurethane adhesive Agents and the like.
  • the average thickness of the adhesive layer 30 is less than the above lower limit, the adhesive strength may be insufficient, and the abrasive 1 may be peeled off from the support. Conversely, if the average thickness of the adhesive layer 30 exceeds the above upper limit, there is a possibility that the workability may be deteriorated, for example, when the abrasive material 1 is cut into a desired shape due to the thickness of the adhesive layer 30 .
  • the said abrasives 1 can be manufactured by the manufacturing method mainly provided, for example with a preparation process, a grinding layer formation process, and an adhesion layer sticking process.
  • a composition for an abrasive layer containing abrasive grains 21 and a binder 22 is prepared.
  • a composition for an abrasive layer containing materials for forming the abrasive grains 21 and the binder 22 is prepared as a coating liquid.
  • the quantity of solid content is carried out so that content in the grinding
  • a diluent such as water or alcohol is added.
  • a part of the abrasive grains 21 contained in the polishing portion 20 a can be made to project from the surface of the binder 22. That is, by adding the diluent, when the composition for polishing layer is dried in the polishing layer forming step, the thickness of the binder 22 can be reduced, and the protrusion amount of the abrasive grains 21 can be increased. Therefore, this dilution makes it possible to develop a high polishing rate from the beginning of polishing.
  • the polishing layer 20 is formed by printing the polishing layer composition prepared in the preparation step.
  • the polishing layer forming step includes a coating step and a drying step.
  • the composition for a polishing layer is coated on the surface of the substrate 10.
  • a polishing layer 20 having a plurality of polishing portions 20a and grooves 20b disposed between the polishing portions 20a is formed on the surface of the substrate 10 by printing.
  • a mask having a shape corresponding to the shape of the groove 20b is prepared, and the coating liquid is printed through the mask.
  • this printing method for example, screen printing, metal mask printing, etc. can be used.
  • the mask made from SUS or a fluorine resin is preferable. Since a mask made of SUS or a fluorine resin mask can be thickened, the polishing portion 20a having a large average thickness can be easily manufactured.
  • the thickness of the polishing portion 20a can be adjusted mainly by the thickness of the mask and the coating amount. Therefore, it is good to adjust the amount of application of the above-mentioned constituent for polish layers so that average thickness of polish part 20a may be made into a desired value at this coating process.
  • the coating liquid (composition for polishing layer) after the coating step is dried by heating.
  • the coating liquid is cured by the heat drying to form the polishing layer 20. This drying step is performed with the mask removed.
  • heating temperature in a drying process 80 ° C is preferred and 100 ° C is more preferred.
  • an upper limit of the above-mentioned heating temperature 300 ° C is preferred and 200 ° C is more preferred. If the heating temperature is less than the above lower limit, the composition for polishing layer may not be sufficiently cured, the amount of wear may be increased, and the life of the abrasive 1 may be shortened. Conversely, if the heating temperature exceeds the upper limit, the polished portion 20a may be degraded by heat.
  • the heating time in the drying step depends on the heating temperature, but the lower limit of the heating time is preferably 2 hours, more preferably 2.5 hours. On the other hand, as an upper limit of the said heating time, 40 hours are preferable, 32 hours are more preferable, and 20 hours are further more preferable. If the heating time is less than the above lower limit, the composition for polishing layer may not be sufficiently cured, the amount of wear may be increased, and the life of the abrasive 1 may be shortened. Conversely, if the heating time exceeds the upper limit, the manufacturing efficiency may be reduced.
  • the adhesive layer 30 is laminated on the back surface side of the substrate 10. Specifically, for example, a tape-shaped adhesive layer 30 formed in advance is attached to the back surface of the substrate 10.
  • the polishing portion 20a Since the area of the top surface of the polishing portion 20a is 6 mm 2 or more, the polishing portion 20a is unlikely to fall down during grinding even if the average thickness of the polishing portion 20a is 300 ⁇ m or more. Moreover, since the said abrasives 1 make the average thickness of the base material 10 300 micrometers or more, and make the some grinding
  • the interval between the rows of a plurality of polishers is the interval between the polishers in one row It may be different from For example, even if a plurality of polishing portions are arranged in one row of polishing portions and in a row adjacent to the polishing portions, the two closest polishing portions from the polishing portion are arranged to form an equilateral triangle. Good.
  • the spacing between the rows is preferably 3 mm or more and 15 mm or less.
  • the distance between the rows is less than the above lower limit, the average area of the top surface of the polishing portion can not be increased, and the polishing portion may be prone to fall during polishing.
  • the distance between the rows exceeds the upper limit, the width of the groove between the adjacent rows becomes large, and the substrate may be easily warped.
  • the shift of the position is not limited to the half pitch. It may be / 3 pitch. In this case, the same pattern is repeated every three rows as the arrangement of the plurality of polishing units.
  • an adhesion layer is not an essential component and can be omitted.
  • the adhesive layer attaching step of the method of manufacturing the abrasive is omitted.
  • the abrasive 2 may be provided with a support 40 laminated via the adhesive layer 30 on the back surface side and a second adhesive layer 31 laminated on the back surface side of the support 40.
  • the abrasive 2 can be easily handled.
  • the main component of the support 40 examples include thermoplastic resins such as polypropylene, polyethylene, polytetrafluoroethylene and polyvinyl chloride, and engineering plastics such as polycarbonate, polyamide and polyethylene terephthalate.
  • thermoplastic resins such as polypropylene, polyethylene, polytetrafluoroethylene and polyvinyl chloride
  • engineering plastics such as polycarbonate, polyamide and polyethylene terephthalate.
  • the average thickness of the support 40 can be, for example, 0.5 mm or more and 3 mm or less. If the average thickness of the support 40 is less than the above lower limit, the strength of the abrasive 2 may be insufficient. On the other hand, when the average thickness of the support 40 exceeds the above-mentioned upper limit, there is a possibility that the support 40 may not be easily attached to the polishing apparatus, or the flexibility of the support 40 may be insufficient.
  • the second adhesive layer 31 can use the same adhesive as the adhesive layer 30. Further, the second adhesive layer 31 can have the same average thickness as the adhesive layer 30.
  • Example 1 Diamond abrasive grains (“SCMD-C12-22” from Sino Crystal Diamond, average particle diameter 16 ⁇ m), alumina as filler (Al 2 O 3 , “LA 4000” from Pacific Random Co., Ltd., average particle diameter 4 ⁇ m), An epoxy resin (“JER 828” from Mitsubishi Chemical Corporation) as a binder is mixed, and adjusted so that the content of the diamond abrasive in the solid content is 3 vol% and the content of the filler is 75 vol%, A coating liquid was obtained.
  • SCMD-C12-22 from Sino Crystal Diamond, average particle diameter 16 ⁇ m
  • alumina Al 2 O 3 , “LA 4000” from Pacific Random Co., Ltd., average particle diameter 4 ⁇ m
  • An epoxy resin (“JER 828” from Mitsubishi Chemical Corporation) as a binder is mixed, and adjusted so that the content of the diamond abrasive in the solid content is 3 vol% and the content of the filler is 75 vol%, A coating liquid was obtained.
  • a substrate As a substrate, a substrate (average thickness 500 ⁇ m) mainly comprising polycarbonate which is a thermosetting resin was prepared, and was coated on the surface of the substrate by printing using the above-mentioned coating liquid.
  • a metal mask having an opening with a circular shape (average area 11.95 mm 2 ) with a diameter of 3.9 mm in plan view with an area occupancy of 9% and an average thickness of 350 ⁇ m was used.
  • the said opening part is a zigzag form.
  • the coating amount was adjusted so that the average thickness of a grinding
  • the coating liquid was cured by drying in an oven at 120 ° C. for 16 hours. Thus, the abrasive of Example 1 was obtained.
  • Example 2 An aluminum sheet (A1050, average thickness 300 ⁇ m) was prepared as a substrate, and the same coating liquid as in Example 1 was used to print on the surface of the substrate.
  • a printing pattern use is made of a metal mask that has square openings (average area of 6.76 mm 2 ) with an area occupancy of 44% and an average thickness of 350 ⁇ m with a square shape (average area of 6.76 mm 2 ) of 2.6 mm per side in plan view It was.
  • the said opening part is a zigzag form.
  • the coating amount was adjusted so that the average thickness of a grinding
  • the coating liquid was cured by drying in an oven at 120 ° C. for 16 hours. Thus, the abrasive of Example 2 was obtained.
  • Example 3 An aluminum sheet (average thickness: 300 ⁇ m) was prepared as a substrate, and was coated on the surface of the substrate using the same coating liquid as in Example 1 by printing.
  • a fluorine resin mask having an opening with a circular shape (average area of 28.27 mm 2 ) with a diameter of 6 mm in plan view with an area occupancy of 44% and an average thickness of 1000 ⁇ m was used.
  • the said opening part is a zigzag form.
  • the coating amount was adjusted so that the average thickness of a grinding
  • the coating liquid was cured by drying in an oven at 120 ° C. for 16 hours. Thus, the abrasive of Example 3 was obtained.
  • Example 4 The abrasives of Example 4 were obtained in the same manner as in Example 3 except that a base material having a polycarbonate as a main component (average thickness: 500 ⁇ m) was used as the base material.
  • Example 5 A substrate (average thickness: 500 ⁇ m) containing polycarbonate as a main component was prepared as a substrate, and the same coating liquid as in Example 1 was used to print on the surface of the substrate.
  • a fluorine resin mask having an opening with a square shape (average area 6.76 mm 2 ) of 2.6 mm on a side in a plan view with an area occupancy of 44% and an average thickness of 350 ⁇ m Using.
  • the said opening part is a zigzag form.
  • the coating amount was adjusted so that the average thickness of a grinding
  • the coating liquid was cured by drying in an oven at 120 ° C. for 16 hours. Thus, the abrasive of Example 5 was obtained.
  • Comparative Example 1 Prepare a base material mainly composed of polyethylene terephthalate (“Melinex S” manufactured by Teijin DuPont Film Co., Ltd., average thickness 75 ⁇ m) as a base material, and using the same coating liquid as in Example 1
  • the surface was coated by printing.
  • a printing pattern use is made of a metal mask having an opening with a square shape (average area: 2.25 mm 2 ) with an area occupancy of 36% and an average thickness of 350 ⁇ m in plan view. It was.
  • the openings are in the form of regularly arranged block patterns.
  • the coating amount was adjusted so that the average thickness of a grinding
  • the coating liquid was cured by drying in an oven at 120 ° C. for 16 hours. Thus, the abrasive of Comparative Example 1 was obtained.
  • Comparative Example 2 An abrasive of Comparative Example 2 was obtained in the same manner as Comparative Example 1 except that an aluminum sheet (average thickness: 300 ⁇ m) was used as a substrate.
  • Comparative Example 3 A substrate (average thickness: 100 ⁇ m) containing polycarbonate as a main component was prepared as a substrate, and the same coating liquid as in Example 1 was used to print on the surface of the substrate. As a printing pattern, a fluorine resin mask having an opening with a circular shape (average area of 28.27 mm 2 ) with a diameter of 6 mm in plan view with an area occupancy of 44% and an average thickness of 1000 ⁇ m was used. In addition, the said opening part is a zigzag form. Moreover, the coating amount was adjusted so that the average thickness of a grinding
  • Comparative Example 4 A substrate (average thickness: 500 ⁇ m) containing polycarbonate as a main component was prepared as a substrate, and the same coating liquid as in Example 1 was used to print on the surface of the substrate. As a printing pattern, a fluorine resin mask having an area occupancy of 34% and having a square shape (average area of 16 mm 2 ) having a square shape (average area of 16 mm 2 ) having a side of 4 mm in plan view was used. The openings are in the form of regularly arranged block patterns. Moreover, the coating amount was adjusted so that the average thickness of a grinding
  • ⁇ Curve of Abrasive Material> The warpage of the abrasive was visually determined according to the following judgment criteria.
  • the life of the abrasive is considered to be determined by the average thickness of the polishing portion. Therefore, the following judgment criteria were used.
  • the difficulty of falling of the polishing portion is determined by the ratio of the height to the area of the top surface of the polishing portion. Specifically, it is considered that the larger the value (area / thickness ratio) obtained by dividing the area of the top surface of the polishing portion by the average thickness, the more difficult it is to fall down. Therefore, the area / thickness ratio was calculated, and the value was used as the following judgment standard.
  • the area / thickness ratio is 0.02 mm 2 / ⁇ m or more, and the polished portion hardly falls down.
  • B area / a thickness ratio 0.015 mm 2 / [mu] m or more 0.02mm less than 2 / [mu] m, the polishing unit is relatively difficult fall.
  • C The area / thickness ratio is less than 0.015 mm 2 / ⁇ m, and the polished portion tends to fall down.
  • PC polycarbonate
  • PET polyethylene terephthalate
  • Al aluminum sheet
  • warpage of the base material and polishing part can be achieved by arranging a plurality of polishing parts of the abrasive material in a zigzag manner, setting the area of the top surface of the polishing part to 6 mm 2 or more, and setting the average thickness of the substrate to 300 ⁇ m or more. It is understood that the ease of falling down is suppressed, and an abrasive having an average thickness of 300 ⁇ m or more and a long life and an excellent polishing rate can be obtained.
  • the polishing material of the present invention can thicken the polishing portion while suppressing the decrease in the polishing rate. Therefore, the abrasive of the present invention has a long life.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Polishing Bodies And Polishing Tools (AREA)

Abstract

The purpose of the present invention is to provide an abrasive member in which it is possible to increase the thickness of an abrasive part while preventing a reduction in the abrasion rate. This abrasive member (1) comprises a base material (10) and an abrasive layer (20) that includes abrasive grains (21) and a binder (22), the abrasive layer (20) being laminated on the obverse side of the base material (10), wherein the abrasive layer (20) has a plurality of columnar abrasive parts (20a), the plurality of abrasive parts (20a) are disposed in a zigzag pattern, the average thickness of the abrasive parts (20a) is 300 μm or greater, the area of the top surface of the abrasive parts (20a) is 6 mm2 or greater, and the average thickness of the base material (10) is 300-3000 μm (inclusive).

Description

研磨材Abrasive material
 本発明は、研磨材に関する。 The present invention relates to an abrasive.
 例えばハードディスク等の電子機器に用いられるガラス基板の加工には一般に固定砥粒の研磨材が使用されている。このような研磨材として、基材の表面に砥粒及びバインダーを含む研磨層を積層して構成した研磨材が公知である(例えば特許第6091704号公報参照)。上記従来の研磨材では、研磨層を表面が溝で区分された複数の領域(研磨部)で構成し、研磨部表面の最大山高さを制御することで、加工効率と仕上がり平坦性とを高い水準で両立している。 For example, in the processing of a glass substrate used in an electronic device such as a hard disk, an abrasive of fixed abrasive is generally used. As such an abrasive, there is known an abrasive comprising a polishing layer containing abrasive grains and a binder laminated on the surface of a substrate (see, for example, Japanese Patent No. 6091704). In the above-mentioned conventional abrasives, the polishing layer is composed of a plurality of regions (grinding parts) whose surfaces are divided by grooves, and the maximum peak height of the surface of the grinding part is controlled to achieve high processing efficiency and high finish flatness. It is compatible with the level.
 上記従来の研磨材は、固定砥粒方式であり、研磨により研磨層が徐々に摩耗し、研磨層が摩滅することで寿命となる。従って、上記従来の研磨材の寿命を延ばすためには、研磨層の厚さ、つまり個々の研磨部の高さを大きくする必要がある。 The above-mentioned conventional abrasive is a fixed abrasive type, and the polishing layer gradually wears by polishing, and the lifetime of the polishing layer is abraded. Therefore, in order to extend the life of the above-mentioned conventional abrasives, it is necessary to increase the thickness of the abrasive layer, that is, the height of the individual abrasives.
 ところが、研磨部の高さをそのまま大きくすると、研磨部のアスペクト比が大きくなり研削中に研磨部が倒れ易くなる。このため、研磨部が倒れることに起因して研磨材が寿命となり易い。研磨部を倒れ難くするために研磨部のアスペクト比を下げると、個々の研磨部の面積が大きくなる。個々の研磨部の面積が大きい場合、研磨層を印刷等により作製する際の研磨層の硬化収縮に伴って、基材に反りが発生し易くなる。このため、この基材の反りにより均一な研磨を行うことが困難となるおそれがある。基材の平均厚さを厚くすることで、基材の反りは緩和されるが、その緩和には限度がある。また、基材が厚くなると、基材の可撓性や延性が低下し、研磨材が被削体の表面形状に追従し難くなる。このため、研磨レートが低下するおそれもある。 However, if the height of the polishing portion is increased as it is, the aspect ratio of the polishing portion is increased, and the polishing portion tends to fall down during grinding. For this reason, the polishing material tends to have a lifetime due to the fact that the polishing portion falls down. If the aspect ratio of the polishing portion is lowered to make the polishing portion difficult to fall down, the area of each polishing portion increases. When the area of each polishing portion is large, warpage of the base material is likely to occur as the polishing layer cures and shrinks when producing the polishing layer by printing or the like. For this reason, there is a possibility that it may become difficult to perform uniform polish by curvature of this base material. By increasing the average thickness of the substrate, the warping of the substrate is alleviated, but there is a limit to its relaxation. In addition, when the base material becomes thick, the flexibility and ductility of the base material decrease, and it becomes difficult for the abrasive to follow the surface shape of the workpiece. Therefore, the polishing rate may be reduced.
特許第6091704号公報Patent No. 6091704
 本発明はこのような不都合に鑑みてなされたものであり、研磨レートの低下を抑止しつつ、研磨部を厚くできる研摩材の提供を目的とする。 The present invention has been made in view of such problems, and it is an object of the present invention to provide an abrasive that can thicken the polishing portion while suppressing a decrease in the polishing rate.
 本発明者らが、研磨レートの低下を抑止しつつ、研磨部を厚くしても基材に反りが生じ難い研磨材について鋭意検討した結果、基材の厚さを調整することに加え、研磨部の配置を千鳥状とすることで、基材の反りが劇的に改善することを見出し、本発明を完成させた。研磨部を千鳥配置とすることで、基材の反りが劇的に改善する理由は定かではないが、研磨部の配置を千鳥状とすることで、互い違いに配置された研磨部で発生する反りが打ち消し合い易くなるためであると推測される。 In addition to adjusting the thickness of the substrate, the inventors of the present invention conducted intensive studies on an abrasive which hardly causes warping of the substrate even if the thickness of the polishing portion is increased while suppressing a decrease in the polishing rate. By finding the arrangement of parts in a staggered manner, it was found that the warping of the substrate was dramatically improved, and the present invention was completed. The reason why the warping of the base material is dramatically improved by arranging the polishing portions in a zigzag arrangement is not clear, but the warpage generated in the polishing portions arranged alternately by arranging the polishing portions in a zigzag manner is not clear. It is presumed that is because it is easy to cancel each other.
 すなわち、上記課題を解決するためになされた発明は、基材と、この基材の表面側に積層され、砥粒及びバインダーを含む研磨層とを備える研磨材であって、上記研磨層が複数の柱状の研磨部を有し、上記複数の研磨部が千鳥配置され、上記研磨部の平均厚さが300μm以上であり、上記研磨部の頂面の面積が6mm以上であり、上記基材の平均厚さが300μm以上3000μm以下である。 That is, the invention made in order to solve the above-mentioned subject is an abrasives provided with a substrate, and an abrasive layer laminated on the surface side of this substrate and containing an abrasive grain and a binder, and the above-mentioned abrasive layer is plural. The plurality of polishing portions are arranged in a zigzag, the average thickness of the polishing portions is 300 μm or more, the area of the top surface of the polishing portion is 6 mm 2 or more, and The average thickness of these is 300 μm or more and 3000 μm or less.
 当該研磨材は、研磨部の頂面の面積を上記下限以上とするので、研磨部の平均厚さが上記下限以上であっても、研削中に研磨部が倒れ難い。また、当該研磨材は、上記基材の平均厚さを上記下限以上とし、複数の研磨部を千鳥配置とするので、研磨部の平均厚さが上記下限以上であっても、基材に反りが発生し難い。さらに、当該研磨材は、基材の平均厚さを上記上限以下とするので、被削体の表面形状に追従し易く、研磨レートを高められる。従って、当該研磨材は、研磨レートの低下を抑止しつつ、研磨部を厚くできる。 Since the surface area of the top surface of the polishing portion is equal to or more than the lower limit, the polishing portion is unlikely to fall during grinding even if the average thickness of the polishing portion is equal to or more than the lower limit. Moreover, since the said abrasive | polishing material makes the average thickness of the said base material more than the said lower limit, and makes a some polishing part a zigzag arrangement, even if the average thickness of a grinding | polishing part is more than the said lower limit, it warps to a base material Is hard to occur. Furthermore, since the said abrasives make the average thickness of a base material below the said upper limit, it is easy to follow the surface shape of a to-be-cut body, and a polishing rate can be raised. Therefore, the said abrasives can thicken a grinding | polishing part, suppressing the fall of a grinding | polishing rate.
 上記基材の平均厚さに対する上記研磨部の平均厚さの比としては、0.7以上4以下が好ましい。上記基材の平均厚さに対する上記研磨部の平均厚さの比を上記下限以上とすることで、研磨レートの低下を抑止しつつ、研磨部を厚くできる。また、上記基材の平均厚さに対する上記研磨部の平均厚さの比を上限以下とすることで、基材の反りの発生を抑止できる。 As a ratio of the average thickness of the said grinding | polishing part with respect to the average thickness of the said base material, 0.7 or more and 4 or less are preferable. By setting the ratio of the average thickness of the polishing portion to the average thickness of the base material to be the lower limit or more, it is possible to make the polishing portion thicker while suppressing a decrease in the polishing rate. Moreover, generation | occurrence | production of the curvature of a base material can be suppressed by making ratio of the average thickness of the said grinding | polishing part with respect to the average thickness of the said base material below an upper limit.
 上記研磨部の頂面の面積を平均厚さで除した値としては、0.015mm/μm以上0.04mm/μm以下が好ましい。研磨部の頂面の面積を平均厚さで除した値を上記範囲内とすることで、基材の反りの発生を抑止しつつ、研磨部を厚くすることができる。 The value of the area of the top surface was divided by the average thickness of the abrasive portion, 0.015 mm 2 / [mu] m or more 0.04 mm 2 / [mu] m or less. By setting the value obtained by dividing the area of the top surface of the polishing portion by the average thickness within the above range, it is possible to make the polishing portion thicker while suppressing the occurrence of warpage of the substrate.
 上記研磨部の頂面の面積としては、100mm以下が好ましく、上記研磨部の平均厚さとしては、5000μm以下が好ましい。上記研磨部の頂面の面積を上記上限以下とすることで、基材の反りの発生を抑止できる。また、上記研磨部の平均厚さを上記上限以下とすることで、研磨部を倒れ難くすることができる。 The area of the top surface of the polishing portion is preferably 100 mm 2 or less, and the average thickness of the polishing portion is preferably 5000 μm or less. By setting the area of the top surface of the polishing portion to the upper limit or less, it is possible to suppress the occurrence of warpage of the base material. Moreover, it can be made hard to fall down a grinding part by making average thickness of the above-mentioned grinding part below the above-mentioned maximum.
 上記バインダーが熱硬化性樹脂を主成分とするとよい。上記バインダーの主成分を熱硬化性樹脂とすることで、例えばガラス材料の研磨時にガラス割れが発生することを抑止できる。 It is preferable that the binder contains a thermosetting resin as a main component. By using the thermosetting resin as the main component of the binder, for example, it is possible to suppress the occurrence of glass breakage at the time of polishing of the glass material.
 「複数の研磨部が千鳥配置である」とは、研磨部が、平行する複数の列に等間隔で配置され、一の列に含まれる研磨部の中心を通り、この一の列に対して直交する方向に、この一の列と隣接する列の研磨部の中心が位置しないような配列をいう。また、「主成分」とは、最も含有量の多い成分を意味し、好ましくは含有量が50質量%以上、より好ましくは90質量%以上の成分をいう。 “The plurality of polishing portions are arranged in a staggered arrangement” means that the polishing portions are arranged at equal intervals in a plurality of parallel rows, pass through the center of the polishing portions included in one row, and This arrangement means that the centers of the polishing portions of the row adjacent to this one row are not positioned in the orthogonal direction. Further, "main component" means a component with the highest content, preferably a component with a content of 50% by mass or more, more preferably 90% by mass or more.
 以上説明したように、本発明の研磨材は、研磨レートの低下を抑止しつつ、研磨部を厚くできる。従って、本発明の研磨材は、寿命が長い。 As described above, in the abrasive of the present invention, the thickness of the polishing portion can be increased while suppressing the decrease in the polishing rate. Therefore, the abrasive of the present invention has a long life.
本発明の一実施形態に係る研磨材を示す模式的部分平面図である。It is a typical fragmentary plan view showing the abrasives concerning one embodiment of the present invention. 図1のA-A線での模式的部分断面図である。It is a typical fragmentary sectional view in the AA line of FIG. 図2とは異なる実施形態に係る研磨材を示す模式的部分断面図である。FIG. 3 is a schematic partial cross-sectional view showing an abrasive according to an embodiment different from FIG. 2;
 以下、本発明の一実施形態について適宜図面を参照しつつ詳説する。 Hereinafter, an embodiment of the present invention will be described in detail with reference to the drawings.
 図1及び図2に示す研磨材1は、基材10と、この基材10の表面側に積層される研磨層20と、基材10の裏面側に積層される接着層30とを備える。また、研磨層20は、複数の研磨部20aと、この研磨部20a間に配設される溝20bとを有する。 The abrasive 1 shown in FIGS. 1 and 2 includes a base 10, an abrasive layer 20 laminated on the front side of the base 10, and an adhesive layer 30 laminated on the back side of the base 10. The polishing layer 20 also has a plurality of polishing portions 20a and grooves 20b disposed between the polishing portions 20a.
 当該研磨材1は、例えばガラス材料の表面研磨、とりわけカバーガラスやハードディスク等に用いられるアルミノシリケートガラス基板の表面研磨のための固定砥粒研磨材として好適に用いられる。 The said abrasives 1 are used suitably, for example as a fixed abrasive abrasives for surface grinding | polishing of a glass material, especially surface grinding of the aluminosilicate glass substrate used for a cover glass, a hard disk, etc.
<基材>
 基材10は、研磨層20を支持するための板状又はシート状の部材である。
<Base material>
The substrate 10 is a plate-like or sheet-like member for supporting the polishing layer 20.
 基材10の主成分としては、特に限定されないが、ポリエチレンテレフタレート(PET)、ポリカーボネート(PC)、ポリプロピレン(PP)、ポリエチレン(PE)、ポリイミド(PI)、ポリエチレンナフタレート(PEN)、アラミド、アルミニウム、銅等が挙げられる。中でも研磨層20との接着性が良好なPET、PC及びアルミニウムが好ましい。また、基材10の表面に化学処理、コロナ処理、プライマー処理等の接着性を高める処理が行われてもよい。 The main component of the substrate 10 is not particularly limited, but polyethylene terephthalate (PET), polycarbonate (PC), polypropylene (PP), polyethylene (PE), polyimide (PI), polyethylene naphthalate (PEN), aramid, aluminum , Copper and the like. Among them, PET, PC and aluminum, which have good adhesion to the polishing layer 20, are preferable. In addition, the surface of the substrate 10 may be subjected to a treatment such as a chemical treatment, a corona treatment, a primer treatment, or the like to improve adhesion.
 また、基材10は可撓性又は延性を有するとよい。このように基材10が可撓性又は延性を有することで、当該研磨材1が被削体の表面形状に追従し、研磨面と被削体との接触面積が大きくなるため、研磨レートがさらに高まる。このような可撓性を有する基材10の材質としては、例えばPETやPC等を挙げることができる。また、延性を有する基材10の材質としては、アルミニウムや銅等を挙げることができる。 Also, the substrate 10 may have flexibility or ductility. As described above, when the base material 10 has flexibility or ductility, the abrasive material 1 follows the surface shape of the workpiece, and the contact area between the polishing surface and the workpiece becomes large, so that the polishing rate is reduced. It will increase further. As a material of the base material 10 which has such flexibility, PET, PC, etc. can be mentioned, for example. Moreover, as a material of the base material 10 which has ductility, aluminum, copper, etc. can be mentioned.
 基材10の形状及び大きさとしては、特に限定されないが、例えば一辺が140mm以上160mm以下の正方形状、直径200mm以上2022mm以下の円盤状、外径200mm以上2022mm以下及び内径100mm以上658mm以下の円環状等とすることができる。また、平面上に並置した複数の基材10が単一の支持体により支持される構成であってもよい。 The shape and size of the substrate 10 are not particularly limited, and for example, a square shape having one side of 140 mm to 160 mm, a disk of 200 mm to 2022 mm in diameter, an outer diameter of 200 mm to 2022 mm, and an inner diameter of 100 mm to 658 mm It can be annular or the like. In addition, the plurality of substrates 10 juxtaposed on a plane may be supported by a single support.
 基材10の平均厚さの下限としては、300μmであり、500μmがより好ましい。一方、基材10の平均厚さの上限としては、3000μmであり、1000μmがより好ましい。基材10の平均厚さが上記下限未満であると、基材10に反りが発生し易くなるおそれがある。逆に、基材10の平均厚さが上記上限を超えると、基材10の可撓性が不十分となり、研磨レートの向上効果が不十分となるおそれがある。 The lower limit of the average thickness of the substrate 10 is 300 μm, more preferably 500 μm. On the other hand, the upper limit of the average thickness of the substrate 10 is 3000 μm, and 1000 μm is more preferable. If the average thickness of the substrate 10 is less than the above lower limit, the substrate 10 may be easily warped. Conversely, when the average thickness of the substrate 10 exceeds the above upper limit, the flexibility of the substrate 10 may be insufficient, and the effect of improving the polishing rate may be insufficient.
<研磨層>
 研磨層20は、研磨部20aに複数の砥粒21及びバインダー22を含む。
<Abrasive layer>
The polishing layer 20 includes a plurality of abrasive grains 21 and a binder 22 in the polishing portion 20 a.
(砥粒)
 砥粒21としては、ダイヤモンド砥粒、アルミナ砥粒、シリカ砥粒、セリア砥粒、炭化ケイ素砥粒等が挙げられる。中でも他の砥粒より硬質であるダイヤモンド砥粒が好ましい。上記砥粒21をダイヤモンド砥粒とすることで、研磨力が向上し、研磨レートをさらに向上できる。
(Abrasive)
Examples of the abrasive grains 21 include diamond abrasive grains, alumina abrasive grains, silica abrasive grains, ceria abrasive grains, silicon carbide abrasive grains and the like. Among them, diamond abrasives which are harder than other abrasives are preferable. By making the said abrasive grain 21 into a diamond abrasive grain, polishing power can be improved and a polishing rate can further be improved.
 なお、ダイヤモンド砥粒のダイヤモンドとしては、単結晶でも多結晶でもよく、またNiコーティング等の処理がされたダイヤモンドであってもよい。中でも単結晶ダイヤモンド及び多結晶ダイヤモンドが好ましい。単結晶ダイヤモンドは、他のダイヤモンドより硬質であり研削力が高い。また、多結晶ダイヤモンドは多結晶を構成する微結晶単位で劈開し易く目つぶれが進行し難いので、長期間研磨を行っても研磨レートの低下が小さい。 In addition, as a diamond of a diamond abrasive grain, a single crystal or a polycrystal may be sufficient, and the diamond by which Ni coating etc. were processed may be sufficient. Among them, single crystal diamond and polycrystalline diamond are preferable. Single crystal diamond is harder and more abrasive than other diamonds. In addition, polycrystalline diamond is apt to be easily cleaved in a microcrystalline unit constituting a polycrystalline, and it is difficult for the eye to crush to progress, so that the reduction in polishing rate is small even if polishing is performed for a long time.
 砥粒21の平均粒子径は、研磨レートと研磨後の被削体の表面粗さとの観点から適宜選択される。砥粒21の平均粒子径の下限としては、2μmが好ましく、10μmがより好ましく、15μmがさらに好ましい。一方、砥粒21の平均粒子径の上限としては、150μmが好ましく、125μmがより好ましく、100μmがさらに好ましい。砥粒21の平均粒子径が上記下限未満であると、当該研磨材1の研磨力が不足し、研磨レートが低下するおそれがある。逆に、砥粒21の平均粒子径が上記上限を超えると、研磨精度が低下するおそれがある。ここで、「平均粒子径」とは、レーザー回折法等により測定された体積基準の累積粒度分布曲線の50%値(50%粒子径、D50)をいう。 The average particle size of the abrasive grains 21 is appropriately selected from the viewpoint of the polishing rate and the surface roughness of the object after polishing. The lower limit of the average particle size of the abrasive grains 21 is preferably 2 μm, more preferably 10 μm, and still more preferably 15 μm. On the other hand, as an upper limit of the average particle diameter of the abrasive grain 21, 150 micrometers is preferable, 125 micrometers is more preferable, and 100 micrometers is more preferable. If the average particle diameter of the abrasive grains 21 is less than the above lower limit, the polishing force of the polishing material 1 may be insufficient, and the polishing rate may be reduced. Conversely, if the average particle size of the abrasive grains 21 exceeds the above upper limit, the polishing accuracy may be reduced. Here, the "average particle size" refers to the 50% value (50% particle size, D50) of the volume-based cumulative particle size distribution curve measured by a laser diffraction method or the like.
 研磨部20aにおける砥粒21の含有量の下限としては、0.5体積%が好ましく、2体積%がより好ましく、4体積%がさらに好ましい。一方、上記砥粒21の含有量の上限としては、55体積%が好ましく、45体積%がより好ましく、35体積%がさらに好ましい。上記砥粒21の含有量が上記下限未満であると、研磨層20の研磨力が不足するおそれがある。逆に、上記砥粒21の含有量が上記上限を超えると、研磨層20が砥粒21を保持できないおそれがある。 As a minimum of content of abrasive grain 21 in polish part 20a, 0.5 volume% is preferred, 2 volume% is more preferred, and 4 volume% is still more preferred. On the other hand, the upper limit of the content of the abrasive grains 21 is preferably 55% by volume, more preferably 45% by volume, and still more preferably 35% by volume. If the content of the abrasive grains 21 is less than the lower limit, the polishing power of the polishing layer 20 may be insufficient. Conversely, when the content of the abrasive grains 21 exceeds the upper limit, the abrasive layer 20 may not be able to hold the abrasive grains 21.
(バインダー)
 バインダー22の主成分としては、特に限定されないが、樹脂又は無機物が挙げられる。中でもガラス材料を研磨する際にガラス割れを生じ難くガラス研磨に好適であることから、樹脂、特に熱硬化性樹脂が好ましい。
(binder)
Although it does not specifically limit as a main component of the binder 22, Resin or an inorganic substance is mentioned. Among them, a resin, particularly a thermosetting resin, is preferable because it is difficult to cause glass cracking when polishing a glass material and is suitable for polishing a glass.
 上記樹脂としては、ポリウレタン、フェノール樹脂、エポキシ、ポリエステル、セルロース、エチレン共重合体、ポリビニルアセタール、ポリアクリル酸及びその塩、ポリアクリル酸エステル、ポリビニルアルコール、ポリ塩化ビニル、ポリ酢酸ビニル、ポリアミド等の樹脂を挙げることができる。中でも基材10への良好な密着性が確保し易いポリアクリル酸エステル、エポキシ、ポリエステル及びポリウレタンが好ましく、さらに熱硬化性を有するエポキシがより好ましい。なお、上記樹脂は、少なくとも一部が架橋していてもよい。 Examples of the resin include polyurethane, phenol resin, epoxy, polyester, cellulose, ethylene copolymer, polyvinyl acetal, polyacrylic acid and salts thereof, polyacrylic acid ester, polyvinyl alcohol, polyvinyl chloride, polyvinyl acetate, polyamide and the like. Resin can be mentioned. Among them, polyacrylic acid ester, epoxy, polyester and polyurethane are preferable because it is easy to ensure good adhesion to the substrate 10, and epoxy having thermosetting property is more preferable. The resin may be at least partially crosslinked.
 また、上記無機物としては、ケイ酸塩、リン酸塩、多価金属アルコキシド等を挙げることができる。中でも砥粒保持力が高いケイ酸塩が好ましい。このようなケイ酸塩としてはケイ酸ナトリウムやケイ酸カリウム等を挙げることができる。 Moreover, a silicate, a phosphate, a polyhydric-metal alkoxide etc. can be mentioned as said inorganic substance. Among them, silicates having high abrasive retention are preferred. Examples of such silicates include sodium silicate and potassium silicate.
 なお、バインダー22には、分散剤、カップリング剤、界面活性剤、潤滑剤、消泡剤、着色剤等の各種助剤及び添加剤などを目的に応じて適宜含有させてもよい。 The binder 22 may appropriately contain various assistants and additives such as a dispersant, a coupling agent, a surfactant, a lubricant, an antifoamer, and a colorant according to the purpose.
(その他)
 また、研磨層20は、研磨部20aに充填剤を含んでもよい。このような充填剤としては、例えばアルミナ、シリカ、酸化セリウム、酸化マグネシウム、ジルコニア、酸化チタン等の酸化物及びシリカ-アルミナ、シリカ-ジルコニア、シリカ-マグネシア等の複合酸化物を挙げることができる。これらは単独で又は必要に応じて2種以上を組み合わせて用いてもよい。中でも高い研磨力が得られるアルミナが好ましい。
(Others)
In addition, the polishing layer 20 may include a filler in the polishing portion 20a. Examples of such fillers include oxides such as alumina, silica, cerium oxide, magnesium oxide, zirconia, and titanium oxide, and composite oxides such as silica-alumina, silica-zirconia, and silica-magnesia. You may use these individually or in combination of 2 or more types as needed. Among them, alumina is preferable because high polishing power can be obtained.
 上記充填剤の平均粒子径は砥粒21の平均粒子径にも依存するが、上記充填剤の平均粒子径の下限としては、0.01μmが好ましく、2μmがより好ましい。一方、上記充填剤の平均粒子径の上限としては、40μmが好ましく、20μmがより好ましく、15μmがさらに好ましい。上記充填剤の平均粒子径が上記下限未満であると、上記充填剤によるバインダー22の弾性率向上効果の不足により、研磨レートが低下するおそれがある。一方、上記充填剤の平均粒子径が上記上限を超えると、充填剤が砥粒21の研磨力を阻害するおそれがある。 The average particle size of the filler depends on the average particle size of the abrasive grains 21, but the lower limit of the average particle size of the filler is preferably 0.01 μm, more preferably 2 μm. On the other hand, the upper limit of the average particle size of the filler is preferably 40 μm, more preferably 20 μm, and still more preferably 15 μm. If the average particle diameter of the filler is less than the above lower limit, the polishing rate may be lowered due to the insufficient effect of the filler on the elastic modulus improvement of the binder 22. On the other hand, when the average particle diameter of the filler exceeds the upper limit, the filler may inhibit the polishing force of the abrasive grains 21.
 また、上記充填剤の平均粒子径は砥粒21の平均粒子径よりも小さいとよい。砥粒21の平均粒子径に対する上記充填剤の平均粒子径の比の下限としては、0.01が好ましく、0.05がより好ましく、0.1がさらに好ましい。一方、砥粒21の平均粒子径に対する上記充填剤の平均粒子径の比の上限としては、0.8が好ましく、0.6がより好ましい。砥粒21の平均粒子径に対する上記充填剤の平均粒子径の比が上記下限未満であると、上記充填剤によるバインダー22の弾性率向上効果の不足により、研磨レートが低下するおそれがある。逆に、砥粒21の平均粒子径に対する上記充填剤の平均粒子径の比が上記上限を超えると、充填剤が砥粒21の研磨力を阻害するおそれがある。 The average particle size of the filler may be smaller than the average particle size of the abrasive grains 21. The lower limit of the ratio of the average particle size of the filler to the average particle size of the abrasive grains 21 is preferably 0.01, more preferably 0.05, and still more preferably 0.1. On the other hand, the upper limit of the ratio of the average particle size of the filler to the average particle size of the abrasive grains 21 is preferably 0.8, and more preferably 0.6. If the ratio of the average particle size of the filler to the average particle size of the abrasive grains 21 is less than the lower limit, the polishing rate may be reduced due to the insufficient effect of the filler on the elastic modulus of the binder 22. Conversely, if the ratio of the average particle size of the filler to the average particle size of the abrasive grains 21 exceeds the upper limit, the filler may inhibit the polishing force of the abrasive grains 21.
 上記充填剤の研磨部20aに対する含有量は、砥粒21の含有量にも依存するが、上記充填剤の研磨部20aに対する含有量の下限としては、15体積%が好ましく、30体積%がより好ましい。一方、上記充填剤の含有量の上限としては、75体積%が好ましく、72体積%がより好ましい。上記充填剤の含有量が上記下限未満であると、上記充填剤によるバインダー22の弾性率向上効果の不足により、研磨レートが低下するおそれがある。逆に、上記充填剤の含有量が上記上限を超えると、充填剤が砥粒21の研磨力を阻害するおそれがある。 Although the content of the filler to the polishing portion 20a depends on the content of the abrasive grains 21, the lower limit of the content of the filler to the polishing portion 20a is preferably 15% by volume, and more preferably 30% by volume. preferable. On the other hand, as a maximum of content of the above-mentioned filler, 75 volume% is preferred, and 72 volume% is more preferred. If the content of the filler is less than the lower limit, the polishing rate may be reduced due to the insufficient effect of the filler on the elastic modulus improvement of the binder 22. Conversely, if the content of the filler exceeds the upper limit, the filler may inhibit the polishing force of the abrasive grains 21.
(研磨部)
 研磨部20aは柱状である。つまり、研磨部20aの底面の面積は、研磨部20aの頂面の面積の0.9倍以上1.5倍以下、好ましくは0.93倍以上1.2倍以下、より好ましくは0.95倍以上1.05倍以下である。
(Polishing section)
The polishing portion 20a is columnar. That is, the area of the bottom surface of the polishing portion 20a is 0.9 times to 1.5 times the area of the top surface of the polishing portion 20a, preferably 0.93 times to 1.2 times, more preferably 0.95. It is twice or more and 1.05 or less.
 複数の研磨部20aは、同一形状で千鳥配置されている。研磨部20aの頂面の形状としては、図1のような円形状とできる他、正方形状や多角形状等とすることができる。基材10の反りの低減効果の観点から、異方性が比較的低い円形状や正方形状が好ましく、特に円形状が好ましい。 The plurality of polishing units 20a are arranged in a zigzag in the same shape. The shape of the top surface of the polishing portion 20a can be a circular shape as shown in FIG. 1, a square shape, a polygonal shape or the like. From the viewpoint of the effect of reducing the warpage of the substrate 10, a circular shape or a square shape having a relatively low anisotropy is preferable, and a circular shape is particularly preferable.
 複数の研磨部20aは、平行する複数の列に配置される。一の列に配置される研磨部20aの間隔(中心間の距離、ピッチ)は等しい。この研磨部20aの間隔は、複数の列間で同じ間隔とされる。また、複数の列間の間隔(各列の研磨部20aの中心を結ぶ直線の間の距離)は、上記研磨部20aの間隔と等しい。さらに、この一の列と隣接する列の研磨部20aの中心は、一の列で隣接する研磨部20aの中心を結ぶ直線の中点からこの一の列に対して直交する方向に位置する。つまり、隣接列の研磨部20aの位置は、一の列の研磨部20aの位置から半ピッチずれている。従って、複数の研磨部20aの配置としては、複数の列は2列ごとに同じパターンが繰り返される。このように複数の研磨部20aを配置することで、基材10の反りを効果的に低減できる。 The plurality of polishing units 20a are arranged in a plurality of parallel rows. The intervals (distance between centers, pitch) of the polishing portions 20a arranged in one row are equal. The intervals between the polishing portions 20a are the same among the plurality of rows. Further, the spacing between the plurality of rows (the distance between the straight lines connecting the centers of the polishing portions 20a in each row) is equal to the spacing of the polishing portions 20a. Furthermore, the center of the polishing portion 20a in a row adjacent to this one row is located in the direction orthogonal to the one row from the midpoint of the straight line connecting the centers of the adjacent polishing portions 20a in one row. That is, the positions of the polishing portions 20a in the adjacent rows are offset by half a pitch from the position of the polishing portions 20a in one row. Therefore, as arrangement | positioning of several grinding | polishing part 20a, the same pattern is repeated for every two lines of several lines. By arranging the plurality of polishing parts 20 a in this manner, the warp of the base material 10 can be effectively reduced.
 一の列に配置される研磨部20aの平均ピッチの下限としては、3mmが好ましく、5mmがより好ましい。一方、上記平均ピッチの上限としては、15mmが好ましく、10mmがより好ましい。上記平均ピッチが上記下限未満であると、研磨部20aの頂面の平均面積を大きくできず、研磨部20aが研磨時に倒れ易くなるおそれがある。逆に、上記平均ピッチが上記上限を超えると、隣接する研磨部20a間の溝20bの幅が大きくなり、基材10に反りが発生し易くなるおそれがある。 The lower limit of the average pitch of the polishing portions 20a arranged in one row is preferably 3 mm, and more preferably 5 mm. On the other hand, as an upper limit of the above-mentioned average pitch, 15 mm is preferred and 10 mm is more preferred. If the average pitch is less than the lower limit, the average area of the top surface of the polishing portion 20a can not be increased, and the polishing portion 20a may be prone to fall during polishing. On the other hand, when the average pitch exceeds the upper limit, the width of the groove 20b between the adjacent polishing portions 20a becomes large, and there is a possibility that the base 10 is easily warped.
 研磨部20aの頂面の平均面積の下限としては、6mmであり、15mmがより好ましい。一方、研磨部20aの頂面の平均面積の上限としては、100mmが好ましく、30mmがより好ましい。研磨部20aの頂面の平均面積が上記下限未満であると、研磨部20aが研磨時に倒れ易くなるおそれがある。逆に、研磨部20aの頂面の平均面積が上記上限を超えると、基材10に反りが発生し易くなるおそれがある。 The lower limit of the average area of the top surface of the polishing portion 20 a is 6 mm 2 , and more preferably 15 mm 2 . On the other hand, as an upper limit of the average area of the top surface of the grinding | polishing part 20a, 100 mm < 2 > is preferable and 30 mm < 2 > is more preferable. If the average area of the top surface of the polishing portion 20a is less than the above-described lower limit, the polishing portion 20a may be prone to fall down during polishing. Conversely, when the average area of the top surface of the polishing portion 20a exceeds the above-described upper limit, warpage may easily occur in the base material 10.
 複数の研磨部20aの研磨層20全体に対する面積占有率の下限としては、5%が好ましく、20%がより好ましく、30%がさらに好ましい。一方、上記研磨部20aの面積占有率の上限としては、60%が好ましく、55%がより好ましい。上記研磨部20aの面積占有率が上記下限未満であると、研磨時に加える圧力が狭い研磨部20aに集中し過ぎるため、研磨部20aが基材10から剥離するおそれがある。逆に、上記研磨部20aの面積占有率が上記上限を超えると、研磨時に研磨層20の被削体への接触面積が大きくなるため、摩擦抵抗により研磨レートが低下するおそれがある。なお、「研磨層全体の面積」は、研磨層の溝の面積も含む概念である。 The lower limit of the area occupancy ratio of the plurality of polishing portions 20a to the entire polishing layer 20 is preferably 5%, more preferably 20%, and still more preferably 30%. On the other hand, the upper limit of the area occupancy of the polishing portion 20a is preferably 60%, and more preferably 55%. If the area occupancy rate of the polishing portion 20a is less than the above lower limit, the pressure applied at the time of polishing is too concentrated on the narrow polishing portion 20a, and the polishing portion 20a may be peeled off from the base material 10. On the contrary, when the area occupancy of the polishing portion 20a exceeds the upper limit, the contact area of the polishing layer 20 to the workpiece at the time of polishing becomes large, and the polishing rate may be reduced due to the frictional resistance. In addition, "the area of the whole grinding | polishing layer" is the concept also including the area of the groove | channel of a grinding layer.
 研磨部20aの平均厚さの下限としては、300μmであり、1000μmがより好ましい。一方、研磨部20aの平均厚さの上限としては、5000μmが好ましく、3000μmがより好ましい。研磨部20aの平均厚さが上記下限未満であると、寿命が不足するおそれがある。逆に、研磨部20aの平均厚さが上記上限を超えると、研磨部20aが研磨時に倒れ易くなるおそれがある。 The lower limit of the average thickness of the polishing portion 20a is 300 μm, and more preferably 1000 μm. On the other hand, as a maximum of average thickness of polish part 20a, 5000 micrometers is preferred and 3000 micrometers is more preferred. If the average thickness of the polishing portion 20a is less than the above lower limit, the life may be short. On the contrary, when the average thickness of the polishing portion 20a exceeds the above upper limit, the polishing portion 20a may be easily fallen at the time of polishing.
 基材10の平均厚さに対する研磨部20aの平均厚さの比の下限としては、0.7が好ましく、1がより好ましい。一方、上記研磨部20aの平均厚さの比の上限としては、4が好ましく、2.5がより好ましい。上記研磨部20aの平均厚さの比が上記下限未満であると、基材10が厚くなることによる研磨レートの低下に対し、基材10の厚さによる反りの低減効果が十分に得られないおそれがある。逆に、上記研磨部20aの平均厚さの比が上記上限を超えると、基材10に反りが発生し易くなるおそれがある。 The lower limit of the ratio of the average thickness of the polishing portion 20a to the average thickness of the substrate 10 is preferably 0.7, and more preferably 1. On the other hand, the upper limit of the ratio of the average thickness of the polished portion 20a is preferably 4 and more preferably 2.5. The reduction effect of the curvature by the thickness of the base material 10 is not fully obtained with respect to the fall of the polishing rate by the base material 10 becoming thick as ratio of the average thickness of the said grinding | polishing part 20a is less than the said minimum. There is a fear. Conversely, when the ratio of the average thickness of the polishing portion 20a exceeds the upper limit, warpage may easily occur in the base material 10.
 研磨部20aの頂面の面積を平均厚さで除した値(面積/厚さ比)の下限としては、0.015mm/μmが好ましく、0.02mm/μmがより好ましい。一方、上記面積/厚さ比の上限としては、0.04mm/μmが好ましく、0.03mm/μmがより好ましい。上記面積/厚さ比が上記下限未満であると、研磨部20aが研磨時に倒れ易くなるおそれがある。逆に、上記面積/厚さ比が上記上限を超えると、基材10に反りが発生し易くなるおそれがある。 The lower limit of the value of the area of the top surface is divided by the average thickness of the polishing portion 20a (the area / thickness ratio) is preferably from 0.015mm 2 / μm, 0.02mm 2 / μm is more preferable. On the other hand, the upper limit of the area / thickness ratio is preferably 0.04mm 2 / μm, 0.03mm 2 / μm is more preferable. If the area / thickness ratio is less than the lower limit, the polishing portion 20a may be easily fallen at the time of polishing. Conversely, when the area / thickness ratio exceeds the upper limit, warpage may easily occur in the base material 10.
(溝)
 溝20bの底面は、基材10の表面で構成されている。
(groove)
The bottom surface of the groove 20 b is constituted by the surface of the base material 10.
 溝20bの平均幅は、研磨部20aの頂面の面積や面積占有率により決定されるが、溝20bの平均幅の下限としては、0.3mmが好ましく、0.5mmがより好ましい。一方、溝20bの平均幅の上限としては、10mmが好ましく、8mmがより好ましい。溝20bの平均幅が上記下限未満であると、研磨により発生する研磨粉が溝20bに詰まるおそれがある。逆に、溝20bの平均幅が上記上限を超えると、研磨時に被削体が溝20bに落ち込み易くなるため、被削体に傷が生じるおそれがある。なお、「溝の平均幅」とは、図1に示すように一の列の隣接する研磨部20aの中心Mを結ぶ直線Lが溝20bを通過する部分の長さ(図1のD)を指す。 The average width of the grooves 20b is determined by the area and the area occupancy of the top surface of the polishing portion 20a, but the lower limit of the average width of the grooves 20b is preferably 0.3 mm and more preferably 0.5 mm. On the other hand, the upper limit of the average width of the grooves 20b is preferably 10 mm, more preferably 8 mm. If the average width of the grooves 20b is less than the above-mentioned lower limit, there is a possibility that abrasive powder generated by polishing may clog the grooves 20b. Conversely, if the average width of the grooves 20b exceeds the above-described upper limit, the workpiece tends to fall into the grooves 20b at the time of polishing, and therefore, the workpiece may be damaged. The “average groove width” means the length (D in FIG. 1) of a portion where a straight line L connecting the centers M of adjacent polishing portions 20a in one row passes the groove 20b as shown in FIG. Point to.
<接着層>
 接着層30は、当該研磨材1を支持し研磨装置に装着するための支持体に当該研磨材1を固定する層である。
<Adhesive layer>
The adhesive layer 30 is a layer for supporting the abrasive 1 and fixing the abrasive 1 to a support for mounting the abrasive 1 on a polishing apparatus.
 この接着層30に用いられる接着剤としては、特に限定されないが、例えば反応型接着剤、瞬間接着剤、ホットメルト接着剤、貼り替え可能な接着剤である粘着剤等を挙げることができる。 The adhesive used for the adhesive layer 30 is not particularly limited, and examples thereof include reactive adhesives, instant adhesives, hot melt adhesives, and adhesives that can be replaced.
 この接着層30に用いられる接着剤としては、粘着剤が好ましい。接着層30に用いられる接着剤として粘着剤を用いることで、支持体から当該研磨材1を剥がして貼り替えることができるため当該研磨材1及び支持体の再利用が容易になる。このような粘着剤としては、特に限定されないが、例えばアクリル系粘着剤、アクリル-ゴム系粘着剤、天然ゴム系粘着剤、ブチルゴム系等の合成ゴム系粘着剤、シリコーン系粘着剤、ポリウレタン系粘着剤等が挙げられる。 As an adhesive used for this adhesive layer 30, an adhesive is preferable. By using a pressure-sensitive adhesive as the adhesive used for the adhesive layer 30, the abrasive 1 can be peeled off and replaced from the support, and reuse of the abrasive 1 and the support becomes easy. Such an adhesive is not particularly limited, but, for example, acrylic adhesive, acrylic-rubber adhesive, natural rubber adhesive, synthetic rubber adhesive such as butyl rubber, silicone adhesive, polyurethane adhesive Agents and the like.
 接着層30の平均厚さの下限としては、0.05mmが好ましく、0.1mmがより好ましい。一方、接着層30の平均厚さの上限としては、0.3mmが好ましく、0.2mmがより好ましい。接着層30の平均厚さが上記下限未満であると、接着力が不足し、当該研磨材1が支持体から剥離するおそれがある。逆に、接着層30の平均厚さが上記上限を超えると、例えば接着層30の厚みのため当該研磨材1を所望する形状に切る際に支障をきたすなど、作業性が低下するおそれがある。 As a lower limit of the average thickness of adhesion layer 30, 0.05 mm is preferred and 0.1 mm is more preferred. On the other hand, as an upper limit of the average thickness of adhesion layer 30, 0.3 mm is preferred and 0.2 mm is more preferred. If the average thickness of the adhesive layer 30 is less than the above lower limit, the adhesive strength may be insufficient, and the abrasive 1 may be peeled off from the support. Conversely, if the average thickness of the adhesive layer 30 exceeds the above upper limit, there is a possibility that the workability may be deteriorated, for example, when the abrasive material 1 is cut into a desired shape due to the thickness of the adhesive layer 30 .
<研磨材の製造方法>
 当該研磨材1は、例えば調製工程と、研磨層形成工程と、接着層貼付工程とを主に備える製造方法により製造することができる。
<Method of manufacturing abrasive>
The said abrasives 1 can be manufactured by the manufacturing method mainly provided, for example with a preparation process, a grinding layer formation process, and an adhesion layer sticking process.
(調製工程)
 調製工程では、砥粒21及びバインダー22を含む研磨層用組成物を調製する。
(Preparation process)
In the preparation step, a composition for an abrasive layer containing abrasive grains 21 and a binder 22 is prepared.
 具体的には、砥粒21及びバインダー22の形成材料を含む研磨層用組成物を塗工液として準備する。なお、固形分中の砥粒21の含有量が、製造後の研磨部20aの砥粒21の含有量となるので、研磨部20aにおける含有量が所望の値となるように固形分の量を適宜決定する。 Specifically, a composition for an abrasive layer containing materials for forming the abrasive grains 21 and the binder 22 is prepared as a coating liquid. In addition, since content of the abrasive grain 21 in solid content turns into content of the abrasive grain 21 of the grinding | polishing part 20a after manufacture, the quantity of solid content is carried out so that content in the grinding | polishing part 20a may become a desired value. Determine as appropriate.
 また、塗工液の粘度や流動性を制御するために、水、アルコール等の希釈剤を添加する。この希釈により、研磨部20aに含まれる砥粒21の一部をバインダー22の表面から突出させることができる。つまり、希釈剤を添加することで、研磨層形成工程で研磨層用組成物を乾燥させたときにバインダー22の厚さが減少し、砥粒21の突出量を増やすことができる。従って、この希釈により研磨の初期から高い研磨レートを発現させることができる。 Moreover, in order to control the viscosity and fluidity of the coating liquid, a diluent such as water or alcohol is added. By this dilution, a part of the abrasive grains 21 contained in the polishing portion 20 a can be made to project from the surface of the binder 22. That is, by adding the diluent, when the composition for polishing layer is dried in the polishing layer forming step, the thickness of the binder 22 can be reduced, and the protrusion amount of the abrasive grains 21 can be increased. Therefore, this dilution makes it possible to develop a high polishing rate from the beginning of polishing.
(研磨層形成工程)
 研磨層形成工程では、調製工程で準備した研磨層用組成物の印刷により研磨層20を形成する。研磨層形成工程は、塗工工程と乾燥工程とを備える。
(Abrasive layer formation process)
In the polishing layer forming step, the polishing layer 20 is formed by printing the polishing layer composition prepared in the preparation step. The polishing layer forming step includes a coating step and a drying step.
[塗工工程]
 塗工工程では、上記研磨層用組成物を基材10の表面に塗工する。
[Coating process]
In the coating step, the composition for a polishing layer is coated on the surface of the substrate 10.
 具体的には、調製工程で準備した塗工液を用い、基材10の表面に印刷法により複数の研磨部20a及びこの研磨部20a間に配設される溝20bを有する研磨層20を形成する。この溝20bを形成するために、溝20bの形状に対応する形状を有するマスクを用意し、このマスクを介して上記塗工液を印刷する。この印刷方式としては、例えばスクリーン印刷、メタルマスク印刷等を用いることができる。 Specifically, using the coating liquid prepared in the preparation step, a polishing layer 20 having a plurality of polishing portions 20a and grooves 20b disposed between the polishing portions 20a is formed on the surface of the substrate 10 by printing. Do. In order to form the groove 20b, a mask having a shape corresponding to the shape of the groove 20b is prepared, and the coating liquid is printed through the mask. As this printing method, for example, screen printing, metal mask printing, etc. can be used.
 上記印刷用のマスクとしては、SUS製又はフッ素樹脂製のマスクが好ましい。SUS製又はフッ素樹脂製のマスクはマスクを厚くできるので、平均厚さの大きい研磨部20aを容易に作製することができる。 As a mask for the said printing, the mask made from SUS or a fluorine resin is preferable. Since a mask made of SUS or a fluorine resin mask can be thickened, the polishing portion 20a having a large average thickness can be easily manufactured.
 研磨部20aの厚さは、主にマスクの厚みと塗工量とにより調整することができる。従って、この塗工工程で、研磨部20aの平均厚さを所望の値とするように上記研磨層用組成物の塗工量を調整するとよい。 The thickness of the polishing portion 20a can be adjusted mainly by the thickness of the mask and the coating amount. Therefore, it is good to adjust the amount of application of the above-mentioned constituent for polish layers so that average thickness of polish part 20a may be made into a desired value at this coating process.
[乾燥工程]
 乾燥工程では、上記塗工工程後の塗工液(研磨層用組成物)を加熱乾燥する。この加熱乾燥により塗工液が硬化し、研磨層20が形成される。この乾燥工程は、マスクを除去して行われる。
[Drying process]
In the drying step, the coating liquid (composition for polishing layer) after the coating step is dried by heating. The coating liquid is cured by the heat drying to form the polishing layer 20. This drying step is performed with the mask removed.
 乾燥工程での加熱温度の下限としては、80℃が好ましく、100℃がより好ましい。一方、上記加熱温度の上限としては、300℃が好ましく、200℃がより好ましい。上記加熱温度が上記下限未満であると、研磨層用組成物が十分に硬化せず、摩耗量が増大し、研磨材1の寿命が短くなるおそれがある。逆に、上記加熱温度が上記上限を超えると、研磨部20aが熱により変質するおそれがある。 As a minimum of heating temperature in a drying process, 80 ° C is preferred and 100 ° C is more preferred. On the other hand, as an upper limit of the above-mentioned heating temperature, 300 ° C is preferred and 200 ° C is more preferred. If the heating temperature is less than the above lower limit, the composition for polishing layer may not be sufficiently cured, the amount of wear may be increased, and the life of the abrasive 1 may be shortened. Conversely, if the heating temperature exceeds the upper limit, the polished portion 20a may be degraded by heat.
 乾燥工程での加熱時間は、加熱温度にもよるが、上記加熱時間の下限としては、2時間が好ましく、2.5時間がより好ましい。一方、上記加熱時間の上限としては、40時間が好ましく、32時間がより好ましく、20時間がさらに好ましい。上記加熱時間が上記下限未満であると、研磨層用組成物が十分に硬化せず、摩耗量が増大し、研磨材1の寿命が短くなるおそれがある。逆に、上記加熱時間が上記上限を超えると、製造効率が低下するおそれがある。 The heating time in the drying step depends on the heating temperature, but the lower limit of the heating time is preferably 2 hours, more preferably 2.5 hours. On the other hand, as an upper limit of the said heating time, 40 hours are preferable, 32 hours are more preferable, and 20 hours are further more preferable. If the heating time is less than the above lower limit, the composition for polishing layer may not be sufficiently cured, the amount of wear may be increased, and the life of the abrasive 1 may be shortened. Conversely, if the heating time exceeds the upper limit, the manufacturing efficiency may be reduced.
(接着層貼付工程)
 接着層貼付工程では、基材10の裏面側に接着層30を積層する。具体的には、例えば予め形成されたテープ状の接着層30を基材10の裏面に貼り付ける。
(Adhesive layer sticking process)
In the adhesive layer attaching step, the adhesive layer 30 is laminated on the back surface side of the substrate 10. Specifically, for example, a tape-shaped adhesive layer 30 formed in advance is attached to the back surface of the substrate 10.
<利点>
 当該研磨材1は、研磨部20aの頂面の面積を6mm以上とするので、研磨部20aの平均厚さが300μm以上であっても、研削中に研磨部20aが倒れ難い。また、当該研磨材1は、基材10の平均厚さを300μm以上とし、複数の研磨部20aを千鳥配置とするので、研磨部20aの平均厚さが300μm以上であっても、基材10に反りが発生し難い。さらに、当該研磨材1は、基材10の平均厚さを3000μm以下とするので、被削体の表面形状に追従し易く、研磨レートを高められる。従って、当該研磨材1は、研磨レートの低下を抑止しつつ、研磨部20aを厚くできる。
<Advantage>
Since the area of the top surface of the polishing portion 20a is 6 mm 2 or more, the polishing portion 20a is unlikely to fall down during grinding even if the average thickness of the polishing portion 20a is 300 μm or more. Moreover, since the said abrasives 1 make the average thickness of the base material 10 300 micrometers or more, and make the some grinding | polishing part 20a staggered, even if the average thickness of the grinding | polishing part 20a is 300 micrometers or more, the base material 10 It is hard to generate warpage. Furthermore, since the average thickness of the base material 10 is 3000 μm or less, the abrasive material 1 can easily follow the surface shape of the workpiece, and the polishing rate can be increased. Therefore, the said abrasives 1 can thicken the grinding | polishing part 20a, suppressing the fall of a grinding | polishing rate.
[その他の実施形態]
 本発明は上記実施形態に限定されるものではなく、上記態様の他、種々の変更、改良を施した態様で実施することができる。
Other Embodiments
The present invention is not limited to the above embodiment, and can be implemented in various modifications and improvements in addition to the above embodiment.
 上記実施形態では、複数の研磨部の列間の間隔を一の列内の研磨部間の間隔と等しくする場合を説明したが、列間の間隔は、一の列内の研磨部間の間隔と異なってもよい。例えば、複数の研磨部は、一の列の研磨部と、この研磨部と隣接する列に配置され、上記研磨部から至近2個の研磨部とが正三角形を構成するように配置してもよい。なお、列間の間隔を一の列内の研磨部間の間隔と異なるものとする場合、列間の間隔としては、3mm以上15mm以下とすることが好ましい。列間の間隔が上記下限未満であると、研磨部の頂面の平均面積を大きくできず、研磨部が研磨時に倒れ易くなるおそれがある。逆に、列間の間隔が上記上限を超えると、隣接する列間の溝の幅が大きくなり、基材に反りが発生し易くなるおそれがある。 Although the above-mentioned embodiment explained the case where the interval between the rows of a plurality of polishers was made equal to the interval between the polishers in one row, the interval between the rows is the interval between the polishers in one row It may be different from For example, even if a plurality of polishing portions are arranged in one row of polishing portions and in a row adjacent to the polishing portions, the two closest polishing portions from the polishing portion are arranged to form an equilateral triangle. Good. When the spacing between the rows is different from the spacing between the polishing portions in one row, the spacing between the rows is preferably 3 mm or more and 15 mm or less. If the distance between the rows is less than the above lower limit, the average area of the top surface of the polishing portion can not be increased, and the polishing portion may be prone to fall during polishing. On the contrary, when the distance between the rows exceeds the upper limit, the width of the groove between the adjacent rows becomes large, and the substrate may be easily warped.
 また、上記実施形態では、隣接列の研磨部の位置が、一の列の研磨部の位置から半ピッチずれている場合を説明したが、この位置のずれは半ピッチに限定されず、例えば1/3ピッチであってもよい。この場合、複数の研磨部の配置としては、3列ごとに同じパターンが繰り返される。 In the above embodiment, the case where the position of the polishing portion in the adjacent row is shifted by half a pitch from the position of the polishing portion in one row has been described, but the shift of the position is not limited to the half pitch. It may be / 3 pitch. In this case, the same pattern is repeated every three rows as the arrangement of the plurality of polishing units.
 上記実施形態では、研磨材が接着層を有する場合を説明したが、接着層は必須の構成要件ではなく、省略可能である。研磨材が接着層を有さない場合は、研磨材の製造方法の接着層貼付工程は省略される。 Although the above-mentioned embodiment explained the case where an abrasives has an adhesion layer, an adhesion layer is not an essential component and can be omitted. When the abrasive does not have the adhesive layer, the adhesive layer attaching step of the method of manufacturing the abrasive is omitted.
 あるいは、図3に示すように当該研磨材2は裏面側の接着層30を介して積層される支持体40及びその支持体40の裏面側に積層される第2接着層31を備えてもよい。当該研磨材2が支持体40を備えることにより、当該研磨材2の取扱いが容易となる。 Alternatively, as shown in FIG. 3, the abrasive 2 may be provided with a support 40 laminated via the adhesive layer 30 on the back surface side and a second adhesive layer 31 laminated on the back surface side of the support 40. . When the abrasive 2 includes the support 40, the abrasive 2 can be easily handled.
 支持体40の主成分としては、ポリプロピレン、ポリエチレン、ポリテトラフルオロエチレン、ポリ塩化ビニル等の熱可塑性を有する樹脂やポリカーボネート、ポリアミド、ポリエチレンテレフタレート等のエンジニアリングプラスチックを挙げることができる。支持体40の主成分にこのような材質を用いることにより支持体40が可撓性を有し、当該研磨材2が被削体の表面形状に追従し、研磨面と被削体とが接触し易くなるため研磨レートがさらに向上する。 Examples of the main component of the support 40 include thermoplastic resins such as polypropylene, polyethylene, polytetrafluoroethylene and polyvinyl chloride, and engineering plastics such as polycarbonate, polyamide and polyethylene terephthalate. By using such a material as the main component of the support 40, the support 40 has flexibility, the abrasive 2 follows the surface shape of the object to be cut, and the polishing surface and the object to be cut are in contact with each other. The polishing rate is further improved because it is easy to do.
 支持体40の平均厚さとしては、例えば0.5mm以上3mm以下とすることができる。支持体40の平均厚さが上記下限未満であると、当該研磨材2の強度が不足するおそれがある。一方、支持体40の平均厚さが上記上限を超えると、支持体40を研磨装置に取り付け難くなるおそれや支持体40の可撓性が不足するおそれがある。 The average thickness of the support 40 can be, for example, 0.5 mm or more and 3 mm or less. If the average thickness of the support 40 is less than the above lower limit, the strength of the abrasive 2 may be insufficient. On the other hand, when the average thickness of the support 40 exceeds the above-mentioned upper limit, there is a possibility that the support 40 may not be easily attached to the polishing apparatus, or the flexibility of the support 40 may be insufficient.
 第2接着層31は、接着層30と同様の接着剤を用いることができる。また、第2接着層31は、接着層30と同様の平均厚さとできる。 The second adhesive layer 31 can use the same adhesive as the adhesive layer 30. Further, the second adhesive layer 31 can have the same average thickness as the adhesive layer 30.
 以下、実施例及び比較例を挙げて本発明をさらに詳細に説明するが、当該発明は以下の実施例に限定されるものではない。 Hereinafter, the present invention will be described in more detail by way of examples and comparative examples, but the present invention is not limited to the following examples.
[実施例1]
 ダイヤモンド砥粒(Sino Crystal Diamond社の「SCMD-C12-22」、平均粒子径16μm)、充填剤としてのアルミナ(Al、太平洋ランダム株式会社の「LA4000」、平均粒子径4μm)、及びバインダーとしてのエポキシ樹脂(三菱化学株式会社の「JER828」)を混合し、固形分中のダイヤモンド砥粒の含有量が3体積%、及び充填剤の含有量が75体積%となるよう調整し、塗工液を得た。
Example 1
Diamond abrasive grains (“SCMD-C12-22” from Sino Crystal Diamond, average particle diameter 16 μm), alumina as filler (Al 2 O 3 , “LA 4000” from Pacific Random Co., Ltd., average particle diameter 4 μm), An epoxy resin ("JER 828" from Mitsubishi Chemical Corporation) as a binder is mixed, and adjusted so that the content of the diamond abrasive in the solid content is 3 vol% and the content of the filler is 75 vol%, A coating liquid was obtained.
 基材として熱硬化性樹脂であるポリカーボネートを主成分とする基材(平均厚さ500μm)を用意し、上記塗工液を用いてこの基材の表面に印刷により塗工した。印刷のパターンとして、平面視で直径3.9mmの円形状(平均面積11.95mm)の開口部を面積占有率9%で有し、平均厚さが350μmであるメタル製のマスクを用いた。なお、上記開口部は、千鳥状である。また、塗工量は、研磨部の平均厚さが350μmとなるように調整した。塗工液は、オーブンで120℃、16時間の乾燥を行い硬化させた。このようにして実施例1の研磨材を得た。 As a substrate, a substrate (average thickness 500 μm) mainly comprising polycarbonate which is a thermosetting resin was prepared, and was coated on the surface of the substrate by printing using the above-mentioned coating liquid. As a printing pattern, a metal mask having an opening with a circular shape (average area 11.95 mm 2 ) with a diameter of 3.9 mm in plan view with an area occupancy of 9% and an average thickness of 350 μm was used. . In addition, the said opening part is a zigzag form. Moreover, the coating amount was adjusted so that the average thickness of a grinding | polishing part might be 350 micrometers. The coating liquid was cured by drying in an oven at 120 ° C. for 16 hours. Thus, the abrasive of Example 1 was obtained.
[実施例2]
 基材としてアルミニウムシート(A1050、平均厚さ300μm)を用意し、実施例1と同様の塗工液を用いてこの基材の表面に印刷により塗工した。印刷のパターンとして、平面視で1辺2.6mmの正方形状(平均面積6.76mm)の開口部を面積占有率44%で有し、平均厚さが350μmであるメタル製のマスクを用いた。なお、上記開口部は、千鳥状である。また、塗工量は、研磨部の平均厚さが350μmとなるように調整した。塗工液は、オーブンで120℃、16時間の乾燥を行い硬化させた。このようにして実施例2の研磨材を得た。
Example 2
An aluminum sheet (A1050, average thickness 300 μm) was prepared as a substrate, and the same coating liquid as in Example 1 was used to print on the surface of the substrate. As a printing pattern, use is made of a metal mask that has square openings (average area of 6.76 mm 2 ) with an area occupancy of 44% and an average thickness of 350 μm with a square shape (average area of 6.76 mm 2 ) of 2.6 mm per side in plan view It was. In addition, the said opening part is a zigzag form. Moreover, the coating amount was adjusted so that the average thickness of a grinding | polishing part might be 350 micrometers. The coating liquid was cured by drying in an oven at 120 ° C. for 16 hours. Thus, the abrasive of Example 2 was obtained.
[実施例3]
 基材としてアルミニウムシート(平均厚さ300μm)を用意し、実施例1と同様の塗工液を用いてこの基材の表面に印刷により塗工した。印刷のパターンとして、平面視で直径6mmの円形状(平均面積28.27mm)の開口部を面積占有率44%で有し、平均厚さが1000μmであるフッ素樹脂製のマスクを用いた。なお、上記開口部は、千鳥状である。また、塗工量は、研磨部の平均厚さが1000μmとなるように調整した。塗工液は、オーブンで120℃、16時間の乾燥を行い硬化させた。このようにして実施例3の研磨材を得た。
[Example 3]
An aluminum sheet (average thickness: 300 μm) was prepared as a substrate, and was coated on the surface of the substrate using the same coating liquid as in Example 1 by printing. As a printing pattern, a fluorine resin mask having an opening with a circular shape (average area of 28.27 mm 2 ) with a diameter of 6 mm in plan view with an area occupancy of 44% and an average thickness of 1000 μm was used. In addition, the said opening part is a zigzag form. Moreover, the coating amount was adjusted so that the average thickness of a grinding | polishing part might be 1000 micrometers. The coating liquid was cured by drying in an oven at 120 ° C. for 16 hours. Thus, the abrasive of Example 3 was obtained.
[実施例4]
 基材としてポリカーボネートを主成分とする基材(平均厚さ500μm)を用いた以外は、実施例3と同様にして実施例4の研磨材を得た。
Example 4
The abrasives of Example 4 were obtained in the same manner as in Example 3 except that a base material having a polycarbonate as a main component (average thickness: 500 μm) was used as the base material.
[実施例5]
 基材としてポリカーボネートを主成分とする基材(平均厚さ500μm)を用意し、実施例1と同様の塗工液を用いてこの基材の表面に印刷により塗工した。印刷のパターンとして、平面視で1辺2.6mmの正方形状(平均面積6.76mm)の開口部を面積占有率44%で有し、平均厚さが350μmであるフッ素樹脂製のマスクを用いた。なお、上記開口部は、千鳥状である。また、塗工量は、研磨部の平均厚さが350μmとなるように調整した。塗工液は、オーブンで120℃、16時間の乾燥を行い硬化させた。このようにして実施例5の研磨材を得た。
[Example 5]
A substrate (average thickness: 500 μm) containing polycarbonate as a main component was prepared as a substrate, and the same coating liquid as in Example 1 was used to print on the surface of the substrate. As a printing pattern, a fluorine resin mask having an opening with a square shape (average area 6.76 mm 2 ) of 2.6 mm on a side in a plan view with an area occupancy of 44% and an average thickness of 350 μm Using. In addition, the said opening part is a zigzag form. Moreover, the coating amount was adjusted so that the average thickness of a grinding | polishing part might be 350 micrometers. The coating liquid was cured by drying in an oven at 120 ° C. for 16 hours. Thus, the abrasive of Example 5 was obtained.
[比較例1]
 基材としてポリエチレンテレフタレートを主成分とする基材(帝人デュポンフィルム株式会社製の「メリネックスS」、平均厚さ75μm)を用意し、実施例1と同様の塗工液を用いてこの基材の表面に印刷により塗工した。印刷のパターンとして、平面視で1辺1.5mmの正方形状(平均面積2.25mm)の開口部を面積占有率36%で有し、平均厚さが350μmであるメタル製のマスクを用いた。なお、上記開口部は、規則的に配列されたブロックパターン状である。また、塗工量は、研磨部の平均厚さが350μmとなるように調整した。塗工液は、オーブンで120℃、16時間の乾燥を行い硬化させた。このようにして比較例1の研磨材を得た。
Comparative Example 1
Prepare a base material mainly composed of polyethylene terephthalate (“Melinex S” manufactured by Teijin DuPont Film Co., Ltd., average thickness 75 μm) as a base material, and using the same coating liquid as in Example 1 The surface was coated by printing. As a printing pattern, use is made of a metal mask having an opening with a square shape (average area: 2.25 mm 2 ) with an area occupancy of 36% and an average thickness of 350 μm in plan view. It was. The openings are in the form of regularly arranged block patterns. Moreover, the coating amount was adjusted so that the average thickness of a grinding | polishing part might be 350 micrometers. The coating liquid was cured by drying in an oven at 120 ° C. for 16 hours. Thus, the abrasive of Comparative Example 1 was obtained.
[比較例2]
 基材としてアルミニウムシート(平均厚さ300μm)を用いた以外は、比較例1と同様にして比較例2の研磨材を得た。
Comparative Example 2
An abrasive of Comparative Example 2 was obtained in the same manner as Comparative Example 1 except that an aluminum sheet (average thickness: 300 μm) was used as a substrate.
[比較例3]
 基材としてポリカーボネートを主成分とする基材(平均厚さ100μm)を用意し、実施例1と同様の塗工液を用いてこの基材の表面に印刷により塗工した。印刷のパターンとして、平面視で直径6mmの円形状(平均面積28.27mm)の開口部を面積占有率44%で有し、平均厚さが1000μmであるフッ素樹脂製のマスクを用いた。なお、上記開口部は、千鳥状である。また、塗工量は、研磨部の平均厚さが1000μmとなるように調整した。塗工液は、オーブンで120℃、16時間の乾燥を行い硬化させた。このようにして比較例3の研磨材を得た。
Comparative Example 3
A substrate (average thickness: 100 μm) containing polycarbonate as a main component was prepared as a substrate, and the same coating liquid as in Example 1 was used to print on the surface of the substrate. As a printing pattern, a fluorine resin mask having an opening with a circular shape (average area of 28.27 mm 2 ) with a diameter of 6 mm in plan view with an area occupancy of 44% and an average thickness of 1000 μm was used. In addition, the said opening part is a zigzag form. Moreover, the coating amount was adjusted so that the average thickness of a grinding | polishing part might be 1000 micrometers. The coating liquid was cured by drying in an oven at 120 ° C. for 16 hours. Thus, the abrasive of Comparative Example 3 was obtained.
[比較例4]
 基材としてポリカーボネートを主成分とする基材(平均厚さ500μm)を用意し、実施例1と同様の塗工液を用いてこの基材の表面に印刷により塗工した。印刷のパターンとして、平面視で1辺4mmの正方形状(平均面積16mm)の開口部を面積占有率34%で有し、平均厚さが350μmであるフッ素樹脂製のマスクを用いた。なお、上記開口部は、規則的に配列されたブロックパターン状である。また、塗工量は、研磨部の平均厚さが350μmとなるように調整した。塗工液は、オーブンで120℃、16時間の乾燥を行い硬化させた。このようにして比較例4の研磨材を得た。
Comparative Example 4
A substrate (average thickness: 500 μm) containing polycarbonate as a main component was prepared as a substrate, and the same coating liquid as in Example 1 was used to print on the surface of the substrate. As a printing pattern, a fluorine resin mask having an area occupancy of 34% and having a square shape (average area of 16 mm 2 ) having a square shape (average area of 16 mm 2 ) having a side of 4 mm in plan view was used. The openings are in the form of regularly arranged block patterns. Moreover, the coating amount was adjusted so that the average thickness of a grinding | polishing part might be 350 micrometers. The coating liquid was cured by drying in an oven at 120 ° C. for 16 hours. Thus, the abrasive of Comparative Example 4 was obtained.
[評価]
 実施例1~5及び比較例1~4の研磨材について、研磨材の反り、研磨材の寿命、及び研磨部の倒れ難さについて、以下の判断基準で評価を行った。結果を表1に示す。
[Evaluation]
With respect to the abrasives of Examples 1 to 5 and Comparative Examples 1 to 4, evaluations were made based on the following judgment criteria with respect to the curvature of the abrasive, the life of the abrasive, and the difficulty of falling the abraded part. The results are shown in Table 1.
<研磨材の反り>
 研磨材の反りは、目視により以下の判断基準で判定した。
 A:基材の裏側(研磨層を形成した面と反対側)に変形がなく、反りが認められない。
 B:基材の裏側に変形が見られるが、研磨材を平坦面に静置すると平坦面に追従する。
 C:基材の裏側に変形が見られ、平坦面に静置しても反り返りが認められる。
<Curve of Abrasive Material>
The warpage of the abrasive was visually determined according to the following judgment criteria.
A: There is no deformation on the back side of the substrate (the side opposite to the side on which the polishing layer is formed), and no warping is observed.
B: Deformation is observed on the back side of the substrate, but when the abrasive is allowed to stand on the flat surface, it follows the flat surface.
C: Deformation is observed on the back side of the substrate, and warping is observed even if it is allowed to stand on a flat surface.
<研磨材の寿命>
 研磨材の寿命は研磨部の平均厚さにより決まると考えられる。そこで、以下の判断基準とした。
 A:研磨部の平均厚さが1000μm以上であり、高寿命である。
 B:研磨部の平均厚さが300μm以上1000μm未満であり、寿命がやや短い。
 C:研磨部の平均厚さが300μm未満であり、寿命が短い。
<Abrasive Life>
The life of the abrasive is considered to be determined by the average thickness of the polishing portion. Therefore, the following judgment criteria were used.
A: The average thickness of the polished portion is 1000 μm or more, and the life is high.
B: The average thickness of the polished portion is 300 μm or more and less than 1000 μm, and the life is slightly short.
C: The average thickness of the polished portion is less than 300 μm, and the life is short.
<研磨部の倒れ難さ>
 研磨部の倒れ難さは、研磨部の頂面の面積に対する高さの比により決まると考えられる。具体的には、研磨部の頂面の面積を平均厚さで除した値(面積/厚さ比)が大きいほど倒れ難くなると考えられる。そこで、面積/厚さ比を算出し、その値により以下の判断基準とした。
 A:面積/厚さ比が0.02mm/μm以上であり、研磨部が倒れ難い。
 B:面積/厚さ比が0.015mm/μm以上0.02mm/μm未満であり、研磨部が比較的倒れ難い。
 C:面積/厚さ比が0.015mm/μm未満であり、研磨部が倒れ易い。
<It is hard to fall down the polishing part>
It is considered that the difficulty of falling of the polishing portion is determined by the ratio of the height to the area of the top surface of the polishing portion. Specifically, it is considered that the larger the value (area / thickness ratio) obtained by dividing the area of the top surface of the polishing portion by the average thickness, the more difficult it is to fall down. Therefore, the area / thickness ratio was calculated, and the value was used as the following judgment standard.
A: The area / thickness ratio is 0.02 mm 2 / μm or more, and the polished portion hardly falls down.
B: area / a thickness ratio 0.015 mm 2 / [mu] m or more 0.02mm less than 2 / [mu] m, the polishing unit is relatively difficult fall.
C: The area / thickness ratio is less than 0.015 mm 2 / μm, and the polished portion tends to fall down.
Figure JPOXMLDOC01-appb-T000001
Figure JPOXMLDOC01-appb-T000001
 表1で、基材の材質について「PC」はポリカーボネート、「PET」はポリエチレンテレフタレート、「Al」はアルミニウムシートを意味する。 In Table 1, "PC" is polycarbonate, "PET" is polyethylene terephthalate, and "Al" is an aluminum sheet.
 表1から、実施例1~5の研磨材は、研磨部が倒れ難く、かつ研磨層の厚い高寿命でありながら、基材の反りが抑制されていることが分かる。一方、比較例1及び比較例3の研磨材では、基材の平均厚みが300μm未満であるため、基材の反りが発生している。比較例2の研磨材では、研磨部の頂面の面積が6mm未満であるため、研磨部が倒れ易い。比較例4の研磨材では、研磨部が千鳥配置されていないため、基材の反りが発生している。 From Table 1, it can be seen that in the abrasives of Examples 1 to 5, it is difficult for the polishing portion to fall down, and the warpage of the base material is suppressed while having a thick and long life of the abrasive layer. On the other hand, in the abrasives of Comparative Example 1 and Comparative Example 3, since the average thickness of the substrate is less than 300 μm, warpage of the substrate occurs. In the abrasive of Comparative Example 2, since the area of the top surface of the polishing portion is less than 6 mm 2 , the polishing portion tends to fall down. In the abrasive of Comparative Example 4, since the polishing portions are not arranged in a zigzag manner, the warp of the base occurs.
 以上の結果から、研磨材の複数の研磨部を千鳥配置し、研磨部の頂面の面積を6mm以上、基材の平均厚さを300μm以上とすることで、基材の反りや研磨部の倒れ易さが抑制され、研磨層の平均厚さが300μm以上で高寿命であり、かつ研磨レートに優れる研磨材を得られることが分かる。 From the above results, warpage of the base material and polishing part can be achieved by arranging a plurality of polishing parts of the abrasive material in a zigzag manner, setting the area of the top surface of the polishing part to 6 mm 2 or more, and setting the average thickness of the substrate to 300 μm or more. It is understood that the ease of falling down is suppressed, and an abrasive having an average thickness of 300 μm or more and a long life and an excellent polishing rate can be obtained.
 本発明の研磨材は、研磨レートの低下を抑止しつつ、研磨部を厚くできる。従って、本発明の研磨材は、寿命が長い。 The polishing material of the present invention can thicken the polishing portion while suppressing the decrease in the polishing rate. Therefore, the abrasive of the present invention has a long life.
1、2 研磨材
10 基材
20 研磨層
20a 研磨部
20b 溝
21 砥粒
22 バインダー
30 接着層
31 第2接着層
40 支持体
1, 2 Abrasive material 10 Substrate 20 Abrasive layer 20a Abrasive portion 20b Groove 21 Abrasive particle 22 Binder 30 Adhesive layer 31 Second adhesive layer 40 Support

Claims (5)

  1.  基材と、この基材の表面側に積層され、砥粒及びバインダーを含む研磨層とを備える研磨材であって、
     上記研磨層が複数の柱状の研磨部を有し、
     上記複数の研磨部が千鳥配置され、
     上記研磨部の平均厚さが300μm以上であり、
     上記研磨部の頂面の面積が6mm以上であり、
     上記基材の平均厚さが300μm以上3000μm以下である研磨材。
    An abrasive comprising: a substrate; and an abrasive layer laminated on the surface side of the substrate and containing an abrasive and a binder,
    The polishing layer has a plurality of columnar polishing portions,
    The plurality of polishing parts are arranged in a staggered manner,
    The average thickness of the polishing portion is 300 μm or more,
    The area of the top surface of the polishing portion is 6 mm 2 or more,
    The abrasives whose average thickness of the above-mentioned substrate is 300 micrometers or more and 3000 micrometers or less.
  2.  上記基材の平均厚さに対する上記研磨部の平均厚さの比が0.7以上4以下である請求項1に記載の研磨材。 The abrasive according to claim 1, wherein the ratio of the average thickness of the polishing portion to the average thickness of the substrate is 0.7 or more and 4 or less.
  3.  上記研磨部の頂面の面積を平均厚さで除した値が0.015mm/μm以上0.04mm/μm以下である請求項1又は請求項2に記載の研磨材。 Abrasive material according to claim 1 or claim 2 the area of the top surface value obtained by dividing the average thickness is 0.015 mm 2 / [mu] m or more 0.04 mm 2 / [mu] m or less of the polishing unit.
  4.  上記研磨部の頂面の面積が100mm以下であり、
     上記研磨部の平均厚さが5000μm以下である請求項1、請求項2又は請求項3に記載の研磨材。
    The area of the top surface of the polishing portion is 100 mm 2 or less,
    The abrasive according to any one of claims 1 to 3, wherein an average thickness of the polishing portion is 5000 μm or less.
  5.  上記バインダーが熱硬化性樹脂を主成分とする請求項1から請求項4のいずれか1項に記載の研磨材。 The abrasive according to any one of claims 1 to 4, wherein the binder contains a thermosetting resin as a main component.
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