WO2019196587A1 - 有机电致发光显示面板、其制作方法及显示装置 - Google Patents
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- WO2019196587A1 WO2019196587A1 PCT/CN2019/077837 CN2019077837W WO2019196587A1 WO 2019196587 A1 WO2019196587 A1 WO 2019196587A1 CN 2019077837 W CN2019077837 W CN 2019077837W WO 2019196587 A1 WO2019196587 A1 WO 2019196587A1
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- 238000004519 manufacturing process Methods 0.000 title claims description 12
- 230000002209 hydrophobic effect Effects 0.000 claims abstract description 60
- 239000000463 material Substances 0.000 claims abstract description 24
- 239000010410 layer Substances 0.000 claims description 133
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 38
- 239000000377 silicon dioxide Substances 0.000 claims description 19
- 239000004020 conductor Substances 0.000 claims description 17
- 235000012239 silicon dioxide Nutrition 0.000 claims description 16
- 239000000758 substrate Substances 0.000 claims description 15
- 239000002346 layers by function Substances 0.000 claims description 13
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 12
- 238000005401 electroluminescence Methods 0.000 claims description 11
- 239000011347 resin Substances 0.000 claims description 11
- 229920005989 resin Polymers 0.000 claims description 11
- 238000007641 inkjet printing Methods 0.000 claims description 9
- 239000002041 carbon nanotube Substances 0.000 claims description 7
- 229910021393 carbon nanotube Inorganic materials 0.000 claims description 7
- 238000005530 etching Methods 0.000 claims description 6
- 239000003504 photosensitizing agent Substances 0.000 claims description 6
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 5
- 229910021389 graphene Inorganic materials 0.000 claims description 5
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 claims description 4
- 229910052731 fluorine Inorganic materials 0.000 claims description 4
- 239000011737 fluorine Substances 0.000 claims description 4
- 238000000059 patterning Methods 0.000 claims description 2
- 230000003075 superhydrophobic effect Effects 0.000 description 6
- 238000000034 method Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 229920001621 AMOLED Polymers 0.000 description 2
- 230000000903 blocking effect Effects 0.000 description 2
- 230000002708 enhancing effect Effects 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000001020 plasma etching Methods 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 239000002096 quantum dot Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 238000003682 fluorination reaction Methods 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 230000005525 hole transport Effects 0.000 description 1
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(III) oxide Inorganic materials [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000001755 magnetron sputter deposition Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 239000002086 nanomaterial Substances 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 238000009751 slip forming Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/122—Pixel-defining structures or layers, e.g. banks
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/1201—Manufacture or treatment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/805—Electrodes
- H10K59/8052—Cathodes
- H10K59/80522—Cathodes combined with auxiliary electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
- H10K71/13—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing
- H10K71/135—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing using ink-jet printing
Definitions
- the present disclosure relates to the field of display technologies, and in particular, to an organic electroluminescence display panel, a method of fabricating the same, and a display device.
- OLED Organic Light Emitting Diode
- QLED Quadantum Dot Light Emitting Diode
- the pixel defining layer bank is set to be narrower and lower.
- a wide, flat top structure as shown in FIG. 1, the pixel defining layer bank 5' located above the substrate 1', the TFT array structure 2', the planarization layer 3' and the OLED anode 4' is narrower and wider. And the top is flat.
- Embodiments of the present disclosure provide an organic electroluminescence display panel, a manufacturing method, and a display device.
- An aspect of the present disclosure provides an organic electroluminescence display panel including a pixel defining layer disposed on a substrate, the pixel defining layer including a plurality of openings and a bank surrounding each opening and defining a plurality of pixel regions,
- the bank portion is composed of a hydrophilic material pattern layer and a conductive hydrophobic pattern layer which are stacked upward from the substrate.
- the material of the hydrophilic material pattern layer includes silicon dioxide.
- the material of the conductive hydrophobic pattern layer includes a hydrophobic resin, a photosensitizer, and a conductive material.
- the conductive material includes at least one of carbon nanotubes, graphene, and nano silver wires, and the conductive material has a mass percentage of 5% of the mass of the conductive hydrophobic pattern layer- 20%.
- the conductive hydrophobic pattern layer is subjected to a hydrophobic treatment.
- the height of the hydrophilic material pattern layer occupies 1/2 to 2/3 of the height of the bank.
- the opening region of the pixel defining layer is provided with an organic electroluminescent device (OLED) functional layer, and the OLED functional layer and the pixel defining layer bank are provided with an OLED cathode layer.
- OLED organic electroluminescent device
- Another aspect of the present disclosure also provides a method of fabricating an organic electroluminescence display panel, comprising the steps of: providing an OLED array substrate; forming a hydrophilic material layer on the OLED array substrate; forming on the hydrophilic material layer a conductive hydrophobic layer; patterning the conductive hydrophobic layer to form a conductive hydrophobic pattern layer; and using a fluorine-based gas as a working gas, using the conductive hydrophobic pattern layer as an anti-etching layer, and plasma etching the hydrophilic material layer to form a pro a water material pattern layer; wherein the hydrophilic material pattern layer and the conductive hydrophobic pattern layer form a pixel defining layer including a plurality of openings and a plurality of banks.
- the hydrophilic material layer comprises silicon dioxide.
- the conductive hydrophobic pattern includes a hydrophobic resin, a photosensitizer, and a conductive material.
- the conductive material includes at least one of carbon nanotubes, graphene, and nano silver wires, and the conductive material has a mass percentage of 5% of the mass of the conductive hydrophobic layer - 20%.
- the step of performing a hydrophobic treatment on the conductive hydrophobic pattern layer is further included.
- the method further includes the steps of: performing inkjet printing on the open area to form an OLED functional layer; and forming an OLED cathode layer on the OLED functional layer and the bank.
- a third aspect of the present disclosure also provides a display device including the above display panel.
- FIG. 1 is a schematic structural view of a conventional organic light emitting display panel.
- 2 to 8 are flowcharts showing a process of preparing an organic light emitting display panel according to an embodiment of the present disclosure.
- each film layer in the drawings do not reflect the true proportion of the organic electroluminescent display panel, and the purpose is only to illustrate the disclosure.
- Embodiments of the present disclosure provide an organic electroluminescence display panel and a method of fabricating the same.
- an OLED array substrate is selected, including a substrate 1, a TFT array structure layer 2, a flat layer 3, an OLED anode layer 4, and the like.
- the OLED anode layer 4 may further include a top portion having a height.
- a silicon dioxide layer 5 is deposited on the upper surface of the OLED array substrate by plasma enhanced vapor deposition (PECVD).
- PECVD plasma enhanced vapor deposition
- silica is used as the hydrophilic material, but the hydrophilic material of the present disclosure is not limited to silica, and may be any hydrophilic material suitable for use as a pixel defining layer.
- a transparent conductive hydrophobic layer 6 is formed on the upper surface of the silicon dioxide layer 5 by coating, as shown in FIG.
- the transparent conductive hydrophobic layer 6 is composed of a conductive material, a hydrophobic resin, a photosensitizer, and the like.
- the conductive material can provide good conductivity, and the hydrophobic resin provides hydrophobicity.
- the conductive material may be at least one of carbon nanotubes, graphene, nano silver wires, and the like.
- the conductive material may alternatively be carbon nanotubes.
- the mass percentage of the carbon nanotubes in the conductive water layer 6 may be 5%-20%.
- the hydrophobic resin may be any hydrophobic resin suitable for use in an OLED device, and those skilled in the art may select a suitable hydrophobic resin as needed.
- the transparent conductive hydrophobic film has a thickness of about 100 to 1000 nm.
- the hydrophobic resin is a photosensitive resin (or photoresist) which is developed by exposure to form a pattern.
- the photosensitive portion of the transparent conductive hydrophobic layer 6 is removed by development processing by exposure development, thereby producing a transparent conductive hydrophobic pattern layer 61 as shown in FIG.
- a transparent conductive hydrophobic pattern layer 61 is used as an anti-etching layer by a plasma etching apparatus, and the exposed silicon dioxide layer 5 is etched to form a silicon dioxide pattern layer. 51.
- the fluorine-based plasma fluorinates and treats the upper surface of the transparent conductive hydrophobic pattern layer 61 while etching the silicon dioxide layer 5, thereby enhancing the hydrophobic property and making it superhydrophobic; and simultaneously
- the bombardment forms a micro/nano structure on the surface thereof, thereby further enhancing the superhydrophobic property of the upper surface of the transparent conductive hydrophobic pattern layer 61, and the conductive hydrophobic pattern layer 61 after the fluorination etching treatment is a conductive material having superhydrophobic properties.
- Hydrophobic patterned layer 62 After the etching is completed, as shown in FIG.
- the upper half of the pixel defining layer bank is a conductive hydrophobic pattern layer 62 having superhydrophobic properties on the upper surface, which is common with the lower hydrophilic silicon dioxide pattern layer 51.
- a bank defining a pixel defining layer of the OLED device In inkjet printing, when the ink droplets drips on the top of the transparent conductive hydrophobic layer 62 having the superhydrophobicity of the bank of the pixel defining layer, the ink droplets will slide down to the lower portion of the hydrophilic silicon dioxide pattern layer under the action of gravity.
- the silicon dioxide pattern layer 51 has hydrophilicity, can attract ink droplets during inkjet printing, prevents ink trajectories from shifting or generating comet points, and selects a silicon dioxide pattern for better effects.
- the height of layer 51 is between 1/2 and 2/3 of the height of the bank.
- the OLED organic functional layer 7 is printed by inkjet printing.
- the OLED organic functional layer 7 is generally composed of one or more layers of a hole injection layer, a hole transport layer, a light-emitting layer, a hole blocking layer, an electron blocking layer, an electron transport layer, an electron injection layer, and the like.
- the top of the OLED organic functional layer 7 has a certain distance d from the bottom of the transparent conductive hydrophobic pattern layer 62 having superhydrophobic properties, as shown in FIG.
- the distance d is to prevent the OLED film layer from being short-circuited, and a person skilled in the art can select a suitable distance according to a specific structure, and details are not described herein again.
- the OLED cathode layer 8 is continuously formed by evaporation or magnetron sputtering.
- the cathode layer 8 on the top of the OLED may be a metal having a small work function (for example, Li, Ca, A layer formed of LiF/Ca, LiF/Al, Al, Ag, Mg, or a combination thereof and a transparent conductive layer formed of ITO, IZO, ZnO, or In2O3 are as shown in FIG.
- the transparent conductive hydrophobic pattern layer 62 having superhydrophobic property on the upper surface of the pixel defining layer bank is integrated with the cathode 8 at the top of the OLED, which can reduce the voltage drop of the cathode film layer, thereby improving the brightness uniformity of the OLED light emitting device.
- the embodiment of the present disclosure further provides a display device, which may include the above OLED display panel, and the display device may be: a liquid crystal panel, an electronic paper, a mobile phone, a tablet computer, a television, a display, a notebook computer, a digital photo frame. , navigation, etc. Any product or component that has a display function.
- the display substrate provided by the embodiment of the present disclosure can utilize a conductive hydrophobic pattern by ink-jet printing by laminating a hydrophilic silicon dioxide pattern layer disposed at a lower portion of the pixel defining layer and an upper conductive hydrophobic pattern layer.
- the conductive hydrophobic pattern layer on the upper portion of the bank is integrated with the cathode layer of the OLED, which can reduce the voltage drop of the cathode film layer, thereby improving the brightness uniformity of the OLED light-emitting device.
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
提供一种有机电致发光显示面板,包括像素界定层,所述像素界定层包括多个开口和围设形成所述多个开口的每个、且限定所述多个像素区域的堤部,所述堤部由由下至上层叠设置的亲水材料图案层和导电疏水图案层组成。
Description
相关申请的交叉引用
本申请要求于2018年04月11日递交的中国专利申请第201810319552.7号的优先权,在此上述中国专利申请全文公开的内容以引入的方式并入本申请。
本公开涉及显示技术领域,尤其涉及一种有机电致发光显示面板、其制作方法及显示装置。
采用喷墨打印制作OLED(有机发光二极管)以及QLED(量子点发光二极管)显示器,由于其低成本、高产能、易于实现大尺寸等优点,是未来显示技术发展的重要方向。其中,喷墨打印技术被认为是实现OLED以及QLED低成本和大面积全彩显示的最有效途径。
在常规的打印AM-QLED(有源矩阵量子点发光二极管)或AMOLED(有源矩阵有机发光二极管)器件中,为防止显示墨水在印刷时向四周溢出,像素界定层堤部设置成上窄下宽、且顶部平坦的结构,如图1所示,位于基板1'、TFT阵列结构2'、平坦化层3'和OLED阳极4'之上的像素界定层堤部5'呈上窄下宽且顶部平坦的结构。这种结构中,打印过程中当墨水轨迹发生偏移或者当喷出墨滴产生彗星点等状况时,滴落在像素界定层堤部5'顶部的墨水会遗留在堤部5'顶部,从而导致像素界定层开口区域的墨水量减小,进而造成干燥后各像素区域发光元件功能层的薄膜厚度不均匀。
发明内容
本公开实施例提供了一种有机电致发光显示面板、制造方法和显示装置。
本公开一方面提供一种有机电致发光显示面板,包括设置于基板上的像素界定层,所述像素界定层包括多个开口和围设每个开口、且限定多个像素区域的堤部,所述堤部由从所述基板向上层叠设置的亲水材料图案层和导电疏水图案层组成。
根据本公开一实施方式,所述亲水材料图案层的材料包括二氧化硅。
根据本公开另一实施方式,所述导电疏水图案层的材料包括疏水树脂、光敏剂和导电材料。
根据本公开另一实施方式,所述导电材料包括碳纳米管、石墨烯、纳米银线中的至少一种,所述导电材料的质量百分含量为所述导电疏水图案层质量的5%-20%。
根据本公开另一实施方式,所述导电疏水图案层经过疏水处理。
根据本公开另一实施方式,所述亲水材料图案层的高度占所述堤部高度的1/2-2/3。
根据本公开另一实施方式,所述像素界定层的开口区域设置有有机电致发光器件(OLED)功能层,所述OLED功能层和所述像素界定层堤部之上设置有OLED阴极层。
本公开另一方面还提供一种有机电致发光显示面板的制造方法,包括如下步骤:提供OLED阵列基板;在所述OLED阵列基板上形成亲水材料层;在所述亲水材料层上形成导电疏水层;图案化所述导电疏水层形成导电疏水图案层;以及以氟基气体为工作气体,以所述导电疏水图案层为抗刻蚀层,等离子刻蚀所述亲水材料层形成亲水材料图案层;其中所述亲水材料图案层和所述导电疏水图案层形成包括多个开口和多个堤部的像素界定层。
根据本公开的一实施方式,所述亲水材料层包括二氧化硅。
根据本公开的另一实施方式,所述导电疏水图案包括疏水树脂、光敏剂和导电材料。
根据本公开的另一实施方式,所述导电材料包括碳纳米管、石墨烯、纳米银线中的至少一种,所述导电材料的质量百分含量为所述导电疏水层质量的5%-20%。
根据本公开的另一实施方式,还包括对所述导电疏水图案层进行疏水处理步骤。
根据本公开的一实施方式,所述方法还包括如下步骤:在所述开口区域喷墨打印形成OLED功能层;以及在所述OLED功能层和所述堤部上形成OLED阴极层。
本公开第三方面还提供一种包含上述显示面板的显示装置。
通过参照附图详细描述其示例实施方式,本公开的上述和其它特征及优点将变得更加明显。
图1是现有有机发光显示面板的结构示意图。
图2至图8是本公开一个实施方式的有机发光显示面板的制备工艺流程图。
其中,附图标记说明如下:
1:基板
2:TFT阵列结构层
3:平坦化层
4:OLED阳极层
5:二氧化硅层
51:二氧化硅图案层
6:导电疏水层
61:导电疏水图案层
62:具有超疏水性的导电疏水图案层
7:OLED功能层
8:OLED阴极层
1':基板
2':TFT阵列结构层
3':平坦化层
4':OLED阳极层
5':像素界定层堤部
下面结合附图,对本公开实施例提供的有机电致发光显示面板、其制作方法及显示装置的具体实施方式进行详细地说明。
其中,附图中各膜层的厚度和形状不反映有机电致发光显示面板的真实比例,目的只是示意说明本公开内容。
本公开实施例提供了一种有机电致发光显示面板及其制造方法。
如图2所示,选取OLED阵列基板,包括基底1、TFT阵列结构层2、平坦层3以及OLED阳极层4等等,对于顶发光型OLED,上述OLED阳极层4还可以包括顶部的具有高功函数的ITO层以及下部的反射金属层。图中省略了部分结构。
如图3所示,通过等离子体增强气相沉积(PECVD)的方式在OLED阵列基板的上表面沉积生长出一层二氧化硅层5。本实施例中以二氧化硅为亲水材,但本公开的亲水材料并不仅限定为二氧化硅,可以是任何适于用作像素界定层的亲水材料。
通过涂覆的方式在二氧化硅层5的上表面形成透明的导电疏水层6,如图4所示。透明导电疏水层6由导电材料和疏水树脂以及光敏剂等复合而成。其中导电材料可以提供良好的导电性,疏水树脂提供疏水性。导电材料可以是碳纳米管、石墨烯、纳米银线等中的至少一种。导电材料可选是碳纳米管。导电水层6中碳纳米管的质量百分含量可选为5%-20%。疏水树脂可以是任何适于用于OLED器件中的疏水树脂,本领域技术人员可以根据需要选择合适的疏水树脂。透明导电疏水薄膜的厚度约为100~1000nm。添加光敏剂后,疏水树脂就是光敏树脂(或光刻胶),经过曝光显影该层即可形成图案。
通过曝光显影的方式,透明的导电疏水层6的感光部分通过显影处理被去除,从而制作出透明的导电疏水图案层61,如图5所示。
以氟基气体为工作气体(如CF4),利用等离子体刻蚀设备,以透明的导电疏水图案层61为抗刻蚀层,刻蚀暴露出来的二氧化硅层5,形成二氧化硅图案层51。氟基等离子体在刻蚀二氧化硅层5的同时,会对透明的导电疏水图案层61的上表面进行氟化疏水处理,增强其疏水性能,使其具有超疏水性能;并且同时由于等离子体的轰击在其表面会形成微纳结构,从而使透明的导电疏水图案层61的上表面的超疏水性能进一步加强,经过氟化刻蚀处理后的导电疏水图案层61为具有超疏水性能的导电疏水图案层62。刻蚀完成后的结构,如图6所示,像素界定层堤部的上半部分为上表面具有超疏水性能的导电疏水图案 层62,与下部的亲水性的二氧化硅图案层51共同构成了OLED器件的像素界定层的堤部。喷墨打印时,墨滴滴落在像素界定层的堤部具有超疏水性的透明导电疏水层62的顶部时,在重力作用下,墨滴会滑落到下部为亲水性二氧化硅图案层51围设的开口区域中,从而防止墨水轨迹发生偏移或者墨滴产生彗星点,解决了喷墨打印工艺制备OLED时膜厚不均匀的问题。本公开中二氧化硅图案层51由于具有亲水性,在喷墨打印时,可吸引墨滴,防止墨水轨迹发生偏移或者产生彗星点,为了达到更优的效果,可选二氧化硅图案层51的高度为堤部高度的1/2-2/3之间。
形成像素界定层之后,通过喷墨打印的方式,打印制作出OLED有机功能层7。OLED有机功能层7通常由空穴注入层、空穴传输层、发光层、空穴阻挡层、电子阻挡层、电子传输层、电子注入层等其中的一层或多层组成。为了防止OLED膜层短路,OLED有机功能层7的顶部与具有超疏水性能的透明导电疏水图案层62的底部具有一定的距离d,如图7所示。距离d是为了防止OLED膜层短路,本领域技术人员可以根据具体的结构选择合适的距离,在此不再详细赘述。
最后,继续通过蒸镀或者是磁控溅射等方式形成OLED阴极层8,对于顶发光型OLED,上述OLED顶部的阴极层8可以是选用具有小逸出功的金属(例如,Li、Ca、LiF/Ca、LiF/Al、Al、Ag、Mg或它们的组合)形成的层和由ITO、IZO、ZnO或In2O3形成的透明导电层,如图8所示。位于像素界定层堤部的上表面具有超疏水性能的透明导电疏水图案层62与OLED顶部的阴极8连成一体,可以减小阴极膜层的电压降,进而提高OLED发光器件的亮度均匀性。
可选地,本公开实施例还提供一种显示装置,可以包括上述该OLED显示面板,该显示装置可以为:液晶面板、电子纸、手机、平板电脑、电视机、显示器、笔记本电脑、数码相框、导航仪等任何具有显示功能的产品或部件。
综上所述,本公开实施例提供的显示基板,通过层叠设置在像素界定层下部的亲水二氧化硅图案层和上部的导电疏水图案层,使得在喷墨打印时,能够利用导电疏水图案层上表面对墨滴的排斥作用和二氧化硅图案层对墨滴的吸引作用,控制滴落在堤部上表面的墨滴,防止墨水轨迹发生偏移或者产生彗星点,进而减小像素区域内的成膜不均的缺陷。更进一步,堤部上部的导电疏水图案层与OLED阴极层连成一体,可以减小阴极膜层的电压降,进而提高OLED发光器件的亮度均匀性。
当然,本公开还可有其它多种实施例,在不背离本公开精神及其实质的情况下,熟悉本领域的技术人员当可根据本公开作出各种相应的改变和变形,但这些相应的改变和变形都应属于本公开所附的权利要求的保护范围。
Claims (14)
- 一种有机电致发光显示面板,包括设置于基板上的像素界定层,所述像素界定层包括多个开口和围设每个开口、且限定多个像素区域的堤部,所述堤部由从所述基板向上层叠设置的亲水材料图案层和导电疏水图案层组成。
- 根据权利要求1所述的有机电致发光显示面板,其中所述亲水材料图案层包括二氧化硅。
- 根据权利要求1所述的有机电致发光显示面板,其中所述导电疏水图案层包括疏水树脂、光敏剂和导电材料。
- 根据权利要求3所述的有机电致发光显示面板,其中所述导电材料包括碳纳米管、石墨烯、纳米银线中的至少一种,所述导电材料的质量百分含量为所述导电疏水图案层质量的5%-20%。
- 根据权利要求1所述的有机电致发光显示面板,其中所述导电疏水图案层经过疏水处理。
- 根据权利要求1所述的有机电致发光显示面板,其中所述亲水材料图案层的高度占所述堤部高度的1/2-2/3。
- 根据权利要求1所述的有机电致发光显示面板,其中所述像素界定层的开口区域设置有有机电致发光器件功能层,所述有机电致发光器件功能层和所述像素界定层堤部之上设置有有机电致发光器件阴极层。
- 一种有机电致发光显示面板的制造方法,包括如下步骤:提供OLED阵列基板;在所述OLED阵列基板上形成亲水材料层;在所述亲水材料层上形成导电疏水层;图案化所述导电疏水层形成导电疏水图案层;以及以氟基气体为工作气体,以所述导电疏水图案层为抗刻蚀层,等离子刻蚀所述亲水材料层形成亲水材料图案层;其中所述亲水材料图案层和所述导电疏水图案层形成包括多个开口和多个堤部的像素界定层。
- 根据权利要求8所述的制造方法,其中所述亲水材料层包括二氧化硅。
- 根据权利要求8所述的制造方法,其中所述导电疏水图案包括疏水树脂、光敏剂和导电材料。
- 根据权利要求10所述的制造方法,其中所述导电材料包括碳纳米管、石墨烯、纳米银线中的至少一种,所述导电材料的质量百分含量为所述导电疏水层质量的5%-20%。
- 根据权利要求8所述的制造方法,其中还包括对所述导电疏水图案层进行疏水处理步骤。
- 根据权利要求8所述的制造方法,其中还包括如下步骤:在所述开口区域喷墨打印形成OLED功能层;以及在所述OLED功能层和所述堤部上形成OLED阴极层。
- 一种显示装置,其特征在于包括权利要求1所述的显示面板。
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