WO2019172123A1

WO2019172123A1 - Wiring substrate and method for producing same

Info

Publication number: WO2019172123A1
Application number: PCT/JP2019/008112
Authority: WO
Inventors: 圭佑奥村
Original assignee: 日東電工株式会社
Priority date: 2018-03-09
Filing date: 2019-03-01
Publication date: 2019-09-12
Also published as: JP7464352B2; JP2019160929A; TW201939631A; CN111837210A; CN111837210B

Abstract

This method for producing a wiring substrate comprises: a wiring line formation step wherein a wiring pattern is formed on a surface of a first insulating layer, said surface being on one side in the thickness direction; an electrodeposition step wherein the wiring pattern is covered by a second insulating layer by means of electrodeposition; and a magnetic layer arrangement step wherein a magnetic layer is arranged on surfaces of the first insulating layer and the second insulating layer, said surfaces being on one side in the thickness direction.

Description

Wiring board and manufacturing method thereof

The present invention relates to a wiring board and a manufacturing method thereof.

It is known that an inductor is mounted on an electronic device or the like and used as a passive element such as a voltage conversion member.

For example, a flexible inductor is proposed in which an anisotropic composite magnetic sheet obtained by dispersing a flat or needle-like soft magnetic metal powder in a resin material is laminated on the upper and / or lower surface of a coil. (For example, refer to Patent Document 1).

JP 2009-9985 A

Incidentally, in the inductor of Patent Document 1, the anisotropic composite magnetic sheet is in direct contact with the coil. For this reason, there arises a problem that the wiring portions adjacent to each other in the plane direction constituting the coil are short-circuited via a large number of soft magnetic metal powders in the anisotropic composite magnetic sheet.

Therefore, it is considered that the wiring part is not directly in contact with the anisotropic composite magnetic sheet by covering the wiring part with an insulating coverlay film. Specifically, the wiring part 52 is disposed on the upper surface of the base insulating layer 51, then the wiring part 52 is covered with the coverlay film 53, and finally the magnetic sheet 54 is disposed from the upper side of the coverlay film 53. (See FIG. 15).

However, in this method, the coverlay film 53 is disposed between the adjacent wiring portions 52 so that the wiring portions 52 are continuous. Therefore, a portion 55 where no soft magnetic metal powder is disposed exists in the thickness direction (vertical direction) between the adjacent wiring portions 52. As a result, a problem that inductance is reduced occurs.

The present invention provides a wiring board capable of suppressing a short circuit between wiring parts and having good inductance, and a method for manufacturing the same.

The present invention [1] includes a wiring forming step of forming a wiring pattern on one side in the thickness direction of the first insulating layer, an electrodeposition step of covering the wiring pattern with a second insulating layer by electrodeposition, And a magnetic layer arranging step of arranging a magnetic layer on one side in the thickness direction of the first insulating layer and the second insulating layer.

In this method of manufacturing a wiring board, since the second insulating layer is coated on the wiring pattern by electrodeposition, it is possible to suppress the wiring pattern from directly contacting the magnetic layer. Therefore, a short circuit of the wiring pattern can be suppressed.

Further, in this method of manufacturing a wiring board, the second insulating layer is coated on the wiring pattern by electrodeposition, so that the second insulating layer is placed between the wiring parts adjacent to each other in the plurality of wiring parts constituting the wiring pattern. The wiring pattern can be covered so as not to be continuous. Therefore, the magnetic layer can be disposed over the entire thickness direction between the wiring patterns (that is, between the adjacent wiring portions). Therefore, the inductance of the wiring board can be improved.

Also, in this method of manufacturing a wiring board, the second insulating layer is coated on the wiring pattern by electrodeposition, so that the second insulating layer can be coated thinly and uniformly on the surface of the wiring pattern. Therefore, the distance between the magnetic layer and the wiring pattern can be made closer. Therefore, the inductance of the wiring board can be improved.

The present invention [2] includes the method for manufacturing a wiring board according to [1], wherein the wiring forming step is a step of forming the wiring pattern by a subtractive method.

In this wiring board manufacturing method, since a wiring pattern can be formed by a subtractive method, the wiring board can be manufactured in a shorter time compared to the additive method. In addition, a wiring board having a large wiring thickness can be manufactured, and a large current can flow.

The present invention [3] includes the step of supplying power to the wiring pattern through the through hole of the first insulating layer that overlaps the wiring pattern when the electrodeposition step is projected in the thickness direction. [1] Or the manufacturing method of the wiring board as described in [2] is included.

In this method of manufacturing a wiring board, power is supplied to the wiring pattern from the other side in the thickness direction through the through hole of the first insulating layer, so that the entire surface of the wiring pattern in the thickness direction on one side and side is covered with the second insulating layer can do. Therefore, it can suppress more reliably that a wiring pattern contacts a magnetic layer.

This invention [4] contains the manufacturing method of the wiring board as described in [3] in which the said 1st insulating layer is provided with the positioning part for forming the said wiring pattern in the thickness direction one side of the said through-hole.

In this wiring board manufacturing method, since the first insulating layer includes the positioning portion, the wiring pattern can be accurately formed on one side in the thickness direction of the through hole with the positioning portion as a mark. Therefore, the wiring pattern can be more reliably covered with the second insulating layer by supplying power from the through hole.

[5] The present invention [5] includes the method of manufacturing a wiring board according to any one of [1] to [4], wherein the wiring pattern includes a copper wiring.

In this wiring board manufacturing method, since the wiring pattern is a copper wiring, a wiring board having good conductivity and patternability can be manufactured.

The present invention [6] includes a first insulating layer, a plurality of wiring portions arranged at predetermined intervals on one side in the thickness direction of the first insulating layer, and each of the plurality of wiring portions. A second insulating layer covering the wiring portions adjacent to each other in a predetermined direction so as not to be continuous, and one thickness direction of the first insulating layer on one side of the first insulating layer and the second insulating layer. A wiring board including a magnetic layer disposed to cover the surface.

In this wiring board, since the second insulating layer covering the plurality of wiring portions is provided, the wiring portions can be prevented from coming into contact with the magnetic layer, and a short circuit between the wiring portions can be suppressed. The second insulating layer covers a plurality of wiring portions so as not to be continuous between the wiring portions in a predetermined direction, and the magnetic layer is disposed on one surface in the thickness direction of the first insulating layer. The layers are arranged over the entire thickness direction between the wiring portions in the predetermined direction. Therefore, the inductance of the wiring board can be improved.

In the present invention [7], the plurality of wiring portions are arranged on one side in the thickness direction of the common first insulating layer, and the second insulating layer has one side surface and a side surface in the thickness direction of the plurality of wiring portions. The wiring board according to [6] is covered.

In this wiring board, since the plurality of wiring portions are arranged in a common first insulating layer, the plurality of wiring portions have a good positional accuracy in the thickness direction with respect to each other, And it is reliably supported by the 1st insulating layer.

The present invention [8] includes the wiring board according to [6] or [7], wherein the first insulating layer has a through hole that overlaps the wiring portion when projected in the thickness direction.

In this wiring board, power is supplied to the wiring portion through the through hole of the first insulating layer, so that the entire surface of the wiring portion on one side and the side in the thickness direction can be covered with the second insulating layer. Therefore, it can suppress more reliably that a wiring part contacts a magnetic layer.

[9] The wiring board according to any one of [6] to [8], wherein the thickness of the first insulating layer is not less than 0.5 μm and not more than 10 μm.

In this wiring board, since the thickness of the first insulating layer is in a predetermined range, it is possible to reduce the thickness of the wiring board while maintaining the mechanical strength of the inductance.

The method for manufacturing a wiring board of the present invention can suppress a short circuit and can manufacture a wiring board with good inductance.

The wiring board of the present invention can suppress a short circuit and has a good inductance.

FIG. 1 shows a plan view of a first embodiment of an inductor of the present invention. 2A and 2B are cross-sectional views of FIG. 1, FIG. 2A is a cross-sectional view along AA, and FIG. 2B is a cross-sectional view along BB. 3A to 3F are cross-sectional views of the manufacturing process of the inductor shown in FIG. 1 (AA cross-sectional view of FIG. 1), FIG. 3A is a step of preparing a metal sheet, and FIG. Step of placing, FIG. 3C shows a step of placing a metal thin film, FIG. 3D shows a step of placing a support film, FIG. 3E shows a step of forming a wiring pattern, and FIG. 3F shows a step of performing electrodeposition. 4G to 4J are cross-sectional views of the inductor manufacturing process subsequent to FIG. 3 (AA cross-sectional view of FIG. 1), FIG. 4G is a process of disposing the first magnetic layer, and FIG. 4H is a support film. FIG. 4I shows the step of removing the metal thin film, and FIG. 4J shows the step of disposing the adhesive layer and the second magnetic layer. 5A to 5F are cross-sectional views (sectional view taken along the line BB of FIG. 1) of the manufacturing process of the inductor shown in FIG. 1, FIG. 5A is a step of preparing a metal sheet, and FIG. Step of placing, FIG. 5C shows a step of placing a metal thin film, FIG. 5D shows a step of placing a support film, FIG. 5E shows a step of forming a wiring pattern, and FIG. 5F shows a step of performing electrodeposition. 6G to 6J are cross-sectional views (sectional view taken along the line BB of FIG. 1) of the inductor manufacturing process subsequent to FIG. 5, FIG. 6G is a step of arranging the first magnetic layer, and FIG. 6H is a support film. FIG. 6I shows the step of removing the metal thin film, and FIG. 6J shows the step of disposing the adhesive layer and the second magnetic layer. FIG. 7 shows a cross-sectional view of the usage pattern of the inductor shown in FIG. 8A and 8B are a first modification of the inductor manufacturing method according to the first embodiment (method of arranging the first diffusion prevention layer), and FIG. 8A is a process diagram of arranging the first diffusion prevention layer. FIG. 8B shows a cross-sectional view of the inductor obtained when the first diffusion prevention layer is arranged. 9A and 9B are a second modification of the inductor manufacturing method according to the first embodiment (method of disposing the second diffusion prevention layer), and FIG. 9A is a process diagram of disposing the second diffusion prevention layer. FIG. 9B shows a cross-sectional view of the inductor obtained when the second diffusion barrier layer is disposed. 10A to 10C are modified examples of the inductor according to the first embodiment. FIG. 10A is a meander shape in which the wiring pattern advances in the front-rear direction, and FIG. 10B is a meander in which the wiring pattern advances in the left-right direction. Shape, FIG. 10C shows a loop shape with a circular wiring pattern. 11A to 11E are sectional views (sectional view taken along the line AA in FIG. 13) of the manufacturing process of the inductor according to the second embodiment of the present invention. FIG. 11A is a process of preparing a metal sheet laminate, and FIG. FIG. 11C shows a step of forming a wiring pattern, FIG. 11D shows a step of masking an electrodeposition lead, and FIG. 11E shows a step of performing electrodeposition. 12F to 12I are cross-sectional views of the inductor manufacturing process subsequent to FIG. 11, where FIG. 12F is a process of removing the masking sheet, FIG. 12G is a process of removing the electrodeposited leads, and FIG. The step of arranging the magnetic layer, FIG. 12I shows the step of arranging the adhesive layer and the second magnetic layer. 13A to 13C are plan views of the manufacturing process of the inductor according to the second embodiment of the present invention, in which FIG. 13A is a process of forming a wiring pattern, FIG. 13B is a process of masking the electrodeposition lead, and FIG. Indicates a step of performing electrodeposition. 14D to 14F are plan views of the inductor manufacturing process subsequent to FIG. 13, in which FIG. 14D is a process of removing the masking sheet, FIG. 14E is a process of removing the electrodeposition leads, and FIG. The process of arrange | positioning a magnetic layer is shown. A sectional view of an inductor as a reference example is shown.

In FIG. 1, the vertical direction of the paper surface is the front-back direction (first direction), the lower side of the paper surface is the front side (one side in the first direction), and the upper side of the paper surface is the rear side (the other side in the first direction). The left-right direction on the paper surface is the left-right direction (second direction orthogonal to the first direction), the left side of the paper surface is the left side (second side in the second direction), and the right side of the paper surface is the right side (the other side in the second direction). The paper thickness direction is the vertical direction (thickness direction, third direction orthogonal to the first direction and the second direction), the front side of the paper is the upper side (one side in the thickness direction, the third direction one side), and the back side of the paper is The lower side (the other side in the thickness direction, the other side in the third direction). Specifically, it conforms to the direction arrow in each figure.

<First Embodiment>
A first embodiment of a method for manufacturing an inductor 1 will be described with reference to FIGS. 1 to 7 as an example of a method for manufacturing a wiring board according to the present invention.

The first embodiment of the method for manufacturing the inductor 1 is a method for manufacturing the inductor 1 shown in FIGS. 1 to 2B, and includes a metal sheet preparation step, a base insulating layer placement step, a conductor layer placement step, and a wiring formation step. And an electrodeposition step, a first magnetic layer placement step, a conductor layer removal step, and a second magnetic layer placement step. Hereinafter, each process is explained in full detail.

(Metal sheet preparation process)
In the metal sheet preparation step, the metal sheet 10 is prepared as shown in FIGS. 3A and 5A.

The metal sheet 10 is a member that becomes a wiring pattern 3 to be described later in the wiring forming process. That is, the metal sheet 10 is a raw material for the wiring pattern 3. The metal sheet 10 has a sheet shape extending in the front-rear direction and the left-right direction.

Examples of the material of the metal sheet 10 include copper, silver, gold, nickel, and alloys containing them. The material of the metal sheet 10 is preferably copper. Thereby, the inductor 1 provided with favorable electroconductivity and patterning property can be manufactured.

The thickness of the metal sheet 10 is, for example, 25 μm or more, preferably 50 μm or more, and for example, 300 μm or less, preferably 150 μm or less. Thereby, the inductor 1 which flows a large current can be manufactured.

In addition, the metal sheet 10 can also be prepared as a two-layer base material (such as a conductive sheet laminate 40 described later) as indicated by a virtual line together with the base insulating layer 2 described below.

(Base insulating layer placement process)
In the base insulating layer arranging step, the base insulating layer 2 as an example of the first insulating layer is arranged below the metal sheet 10 as shown in FIGS. 3B and 5B. That is, the base insulating layer 2 having a plurality of through holes 6 and a plurality of alignment marks 7 as an example of a plurality of positioning portions is formed on the lower surface (the other surface in the thickness direction) of the metal sheet 10.

Specifically, first, a varnish of a photosensitive insulating material is prepared, and this varnish is applied to the entire lower surface of the metal sheet 10 and dried to form a base film. The base film is exposed through a photomask having a pattern corresponding to the through hole 6 and the alignment mark 7.
Thereafter, the base film is developed and cured by heating if necessary.

When the two-layer base material is prepared, an etching resist having a pattern corresponding to the through hole 6 and the alignment mark 7 is disposed on the lower surface of the base insulating layer 2, and after etching the base insulating layer 2, the etching resist Remove. Alternatively, the through hole 6 and the alignment mark 7 are formed in the base insulating layer 2 using a laser.

Examples of the insulating material for the base insulating layer 2 include organic materials such as polyimide, polysiloxane, epoxy resin, and fluorine resin. Preferably, polyimide is used.

As shown in FIG. 1, the through hole 6 is formed in the base insulating layer 2 at a position overlapping with the wiring portion 21 (described later) when projected in the thickness direction. The through-hole 6 has a substantially circular shape in plan view and a substantially rectangular shape in sectional view. The length (width) and the length in the front-rear direction of the through hole 6 are shorter than the length (width) and the length in the front-rear direction of the wiring part 21, respectively.

The alignment mark 7 is an insulating portion formed by a mark hole 11 penetrating the insulating base layer 2 in the thickness direction. The alignment mark 7 is formed on the insulating base layer 2 at a position that does not overlap with the wiring pattern 3 when projected in the thickness direction. The alignment mark 7 has a substantially circular shape in plan view and a substantially rectangular shape in sectional view.

Thereby, the base insulating layer 2 having the through holes 6 and the alignment marks 7 is formed on the lower surface of the metal sheet 10.

(Conductor layer placement process)
In the conductor layer forming step, as shown in FIGS. 3C and 5C, a metal thin film 12 as an example of a conductor layer is disposed below the insulating base layer 2. That is, the metal thin film 12 is formed on the entire lower surface of the base insulating layer 2.

In the arrangement of the metal thin film 12, the metal thin film 12 is formed so that the upper surface (one surface in the thickness direction) of the metal thin film 12 is in contact with the lower surface of the metal sheet 10 in the through hole 6 and the alignment mark 7. Specifically, the surface (first exposed surface 13) of the metal sheet 10 exposed from the through hole 6, the surface (second exposed surface 14) of the metal sheet 10 exposed from the mark hole 11, and the base insulation. A metal thin film 12 is formed so as to cover the lower surface of the layer 2.

Examples of the method for disposing the metal thin film 12 include dry methods such as sputtering, vacuum deposition, and ion plating, and wet methods such as electroless plating (electroless copper plating, electroless nickel plating, etc.). Preferably, a dry method is mentioned, More preferably, a sputtering method is mentioned. Thereby, a uniform thin film (specifically, a sputtered film) having good adhesion can be reliably disposed on the first exposed surface 13 and the second exposed surface 14. In addition, the metal thin film 12 can be selectively removed with certainty in a removing step described later.

The material of the metal thin film 12 is a metal material that can selectively remove the metal thin film 12 in a removing step described later, and examples thereof include metals such as copper, chromium, and nichrome.

The thickness of the metal thin film 12 is, for example, 10 nm or more, preferably 30 nm or more, and for example, 200 nm or less, preferably 100 nm or less.

(Wiring formation process)
In the wiring formation step, the wiring pattern 3 is formed on the upper side of the base insulating layer 2. That is, the subtractive method is performed on the metal sheet 10 to remove unnecessary portions from the metal sheet 10 to form the wiring pattern 3.

First, as shown in FIGS. 3D and 5D, a support film 15 is disposed on the lower surface of the metal thin film 12.

Examples of the support film 15 include a separator film having slight adhesiveness that can be easily peeled off from the metal thin film 12 in a later step. The arrangement of the support film 15 can reliably support the metal sheet 10 and the base insulating layer 2 and can prevent the cover insulating layer 4 from being coated on the lower surface of the metal thin film 12 in the electrodeposition process described later.

Next, as shown in FIGS. 3E and 5E, the subtractive method is performed. Specifically, a dry film resist 16 (see virtual line) having a pattern corresponding to the wiring pattern 3 (described later) is disposed on the metal sheet 10, and then an unnecessary metal sheet 10 other than the wiring pattern 3 is attached. The dry film resist 16 is finally removed by etching or peeling.

In the method of disposing the dry film resist 16 having a pattern, the dry film resist 16 is disposed on the entire upper surface of the metal sheet 10, exposed and developed through a photomask having a pattern corresponding to the wiring pattern 3, and heated and cured as necessary. Let

At this time, by recognizing the alignment mark 7 with a detection device from the lower side, the dry film resist 16 remains so that the dry film resist 16 having a pattern remains at a position overlapping the through hole 6 when projected in the thickness direction. 16 is exposed and developed.

Etching includes, for example, wet etching such as chemical etching. In the case of wet etching, the upper part of the metal sheet 10 is more easily etched than the lower part, so that the wiring pattern 3 has a tapered shape in which a side sectional view shape extends downward.

Thereby, the first electrodeposit 17 having the support film 15, the metal thin film 12, the base insulating layer 2, and the wiring pattern 3 in order is obtained.

(Electrodeposition process)
In the electrodeposition step, as shown in FIGS. 3F and 5F, the wiring pattern 3 is covered with a cover insulating layer 4 as an example of a second insulating layer by electrodeposition. That is, the cover insulating layer 4 made of an electrodeposition coating film is formed on the upper surface and side surfaces of the wiring pattern 3 by electrodeposition coating.

Specifically, the electrodeposition paint is applied to the surface of the wiring pattern 3 by immersing the first electrodeposition object 17 in the electrodeposition paint-containing liquid and subsequently applying an electric current to the first electrodeposition object 17. Next, the deposited electrodeposition paint is dried. Thereby, the electrodeposition coating film (that is, the cover insulating layer 4) formed from the electrodeposition paint is coated on the surface (upper surface and side surface) of the wiring pattern 3.

Examples of the electrodeposition paint (that is, the insulating material of the cover insulating layer 4) include resins that are ionic in water and known or commercially available, such as acrylic resins, epoxy resins, Examples thereof include a polyimide resin or a mixture thereof.

In order to apply a current to the first electrodeposit 17, a lead wire (not shown) connected to an external power source is connected to the metal thin film 12. As a result, a direct current is applied from the first exposed surface 13 to the entire wiring pattern 3 via the lead wire and the metal thin film 12.

As the electrodeposition coating, an anionic electrodeposition coating that employs the first electrodeposit 17 (specifically, the wiring pattern 3) as a cathode, and a cationic electrodeposition that employs the first electrodeposit 17 as an anode. Any of painting may be sufficient.

The drying temperature of the electrodeposition paint is, for example, 90 ° C. or more and 150 ° C. or less, and the drying time is, for example, 1 minute or more and 30 minutes or less.

Thereby, a cover insulating layer 4 (electrodeposition coating film) is formed on the upper surface and side surfaces of the wiring pattern 3.

If necessary, the surface of the wiring pattern 3 is cleaned by degreasing and pickling before electrodeposition. If necessary, the electrodeposition paint is heat-cured by baking after electrodeposition. The heating temperature at the time of baking is, for example, 150 ° C. or more and 250 ° C. or less, and the heating time is, for example, 10 minutes or more and 5 hours or less.

(First magnetic layer arranging step)
In the first magnetic layer arranging step, as shown in FIGS. 4G and 6G, the first magnetic layer 5 as an example of the magnetic layer is arranged above the base insulating layer 2 and the cover insulating layer 4. That is, the first magnetic layer 5 is laminated on the upper surface and side surfaces of the insulating cover layer 4 and the upper surface of the insulating base layer 2 exposed from the insulating cover layer 4 so as to cover the upper surface and side surfaces thereof.

Examples of the material of the first magnetic layer 5 include a magnetic composition (preferably a soft magnetic composition) disclosed in Japanese Patent Application Laid-Open No. 2014-189015. Specifically, the material of the first magnetic layer 5 includes magnetic particles (preferably soft magnetic particles such as an Fe—Si—A1 alloy) and a resin (preferably a thermosetting resin such as an epoxy resin, Phenolic resin etc.).

In order to dispose the first magnetic layer 5, for example, a semi-cured magnetic sheet formed from a magnetic composition is pressed against the upper surfaces of the base insulating layer 2 and the cover insulating layer 4, and thereafter or simultaneously with the pressing, The semi-cured magnetic sheet is cured by heating. For details, refer to Japanese Unexamined Patent Application Publication No. 2014-189015.

Thereby, the first magnetic layer 5 is disposed on the upper surfaces of the base insulating layer 2 and the cover insulating layer 4.

(Conductor layer removal process)
In the conductor layer removing step, the metal thin film 12 (conductor layer) is removed.

First, the support film 15 is removed from the metal thin film 12 by peeling as shown in FIGS. 4H and 6H.

Next, the metal thin film 12 is removed from the insulating base layer 2 by etching or peeling as shown in FIGS. 4I and 6I. Preferably, the metal thin film 12 is removed by etching. Examples of the etching include the above-described wet etching.

In the case where the metal thin film 12 is removed by etching, the first magnetic layer 5 is protected before the etching so as to protect the first magnetic layer 5 as necessary, as indicated by the phantom lines in FIGS. 4H and 6H. A protective sheet (masking sheet or the like) 46 is disposed on the entire upper surface of the substrate, and the protective sheet 46 is removed after etching.

Thereby, the lower surface of the base insulating layer 2, the first exposed surface 13 and the second exposed surface 14 are exposed.

(Second magnetic layer arranging step)
In the second magnetic layer arranging step, the second magnetic layer 18 is arranged below the base insulating layer 2 as shown in FIGS. 4J and 6J. That is, the second magnetic layer 18 is laminated on the lower surface of the base insulating layer 2 via the adhesive layer 19.

First, the adhesive layer 19 is disposed on the upper surface of the second magnetic layer 18 to prepare a laminate of the adhesive layer 19 and the second magnetic layer 18.

The material of the second magnetic layer 18 is the same as the material of the first magnetic layer 5. The second magnetic layer 18 can be produced by the method exemplified for the first magnetic layer 5.

Examples of the material for the adhesive layer 19 include known or commercially available adhesive compositions and pressure-sensitive adhesive compositions, such as acrylic compositions, epoxy compositions, rubber compositions, and silicone compositions. It is done.

Examples of the arrangement of the adhesive layer 19 include a method of applying an adhesive composition to the second magnetic layer 18 and a method of pressing an adhesive tape against the second magnetic layer 18.

Next, a laminate of the adhesive layer 19 and the second magnetic layer 18 is disposed on the lower surface of the base insulating layer 2 so that the adhesive layer 19 and the base insulating layer 2 are in contact with each other. At this time, the adhesive layer 19 is disposed on the lower surface of the base insulating layer 2 so that the insides of the through holes 6 and the mark holes 11 are filled with the adhesive layer 19.

In the second magnetic layer arranging step, the adhesive layer 19 is arranged on the lower surface of the base insulating layer 2 by coating or the like from the viewpoint of good filling of the adhesive layer 19 into the holes, and then the second magnetic layer 18 can also be placed on the underside of the adhesive layer 19. On the other hand, from the viewpoint of productivity, as described above, a laminated body of the adhesive layer 19 and the second magnetic layer 18 is prepared and disposed on the lower surface of the base insulating layer 2.

Thereby, the inductor 1 is obtained.

(Inductor)
As shown in FIG. 1, the inductor 1 has a substantially rectangular sheet shape extending in the front-rear direction and the left-right direction. As shown in FIGS. 2A and 2B, the inductor 1 includes a second magnetic layer 18, an adhesive layer 19, a base insulating layer 2, a wiring pattern 3, a cover insulating layer 4, and a first magnetic layer 5. Provide in this order in the thickness direction.

The second magnetic layer 18 is a layer that imparts high inductance to the inductor 1. The second magnetic layer 18 is the lowest layer in the inductor 1. The second magnetic layer 18 has substantially the same shape as the base insulating layer 2 in plan view, and has a sheet shape extending in the front-rear direction and the left-right direction.

The thickness of the second magnetic layer 18 is, for example, 10 μm or more, preferably 50 μm or more, and for example, 500 μm or less, preferably 300 μm or less.

The adhesive layer 19 is a layer that bonds the second magnetic layer 18 and the base insulating layer 2 together. The adhesive layer 19 is disposed on the upper surface of the second magnetic layer 18. Specifically, the adhesive layer 19 is disposed between the second magnetic layer 18 and the base insulating layer 2 so as to be in contact with the upper surface of the second magnetic layer 18 and the lower surface of the base insulating layer 2. .

The adhesive layer 19 is filled inside the through hole 6 and the mark hole 11 in the base insulating layer 2. That is, the upper surface of the adhesive layer 19 is in contact with the first exposed surface 13 of the wiring pattern 3 and the second exposed surface 14 of the first magnetic layer 5.

The thickness (maximum thickness) of the adhesive layer 19 is, for example, 0.5 μm or more, preferably 1 μm or more, and for example, 10 μm or less, preferably 5 μm or less.

The base insulating layer 2 is a layer that supports the wiring pattern 3. The base insulating layer 2 is disposed on the upper surface of the adhesive layer 19. A wiring pattern 3, a cover insulating layer 4, and a first magnetic layer 5 are disposed on the upper surface of the base insulating layer 2. The base insulating layer 2 has a sheet shape that is the same outer shape as the inductor 1. The base insulating layer 2 includes a through hole 6 and an alignment mark 7.

The insulating base layer 2 has a thickness of, for example, 0.1 μm or more, preferably 0.5 μm or more, more preferably 1 μm or more, and for example, 15 μm or less, preferably 10 μm or less, more preferably 5 μm. It is as follows. If the thickness of the base insulating layer 2 is in the above range, the inductor 1 can be made thin while maintaining the mechanical strength of the inductance.

The wiring pattern 3 is disposed on the upper surface of the base insulating layer 2. The wiring pattern 3 has a substantially rectangular loop shape in plan view.

The wiring pattern 3 includes a plurality (two) of wiring portions 21 extending in the front-rear direction, a connection wiring portion 22 that connects the front ends of the plurality of wiring portions 21, and a plurality ( Two) terminal portions 23 are integrally provided.

The plurality of wiring sections 21 include a first wiring section 21a and a second wiring section 21b that are arranged at intervals in the left-right direction (an example of a predetermined direction). Each of the plurality of wiring portions 21 has a substantially rectangular shape that extends in the front-rear direction in a plan view, and a substantially trapezoidal shape that has a tapered shape that extends downward in a side sectional view.

The wiring pattern 3, in particular, the first wiring part 21 a and the second wiring part 21 b are arranged on the upper surface of the common base insulating layer 2. That is, the base insulating layer 2 that supports the first wiring portion 21a and the base insulating layer 2 that supports the second wiring portion 21b are continuous with each other.

The connection wiring part 22 is disposed on the front side of the first wiring part 21a and the second wiring part 21b, and connects the front ends thereof to each other. That is, the rear end edge of the left end portion of the connection wiring portion 22 is continuous with the front end edge of the first wiring portion 21a, and the front end edge of the right end portion of the connection wiring portion 22 is continuous with the front end edge of the second wiring portion 21b. . The connection wiring portion 22 has a substantially rectangular shape extending in the left-right direction in a plan view, and has a substantially trapezoidal shape having a tapered shape that expands downward in a side sectional view.

The plurality (two) of terminal portions 23 are arranged at the rear end of the first wiring portion 21a and the rear end of the second wiring portion 21b so as to be continuous therewith. The length (width) in the left-right direction of the plurality of terminal portions 23 is shorter than the length (width) in the left-right direction of the wiring portion 21. The terminal part 23 has a substantially rectangular shape in plan view, and has a substantially trapezoidal shape having a tapered shape that expands downward in a side sectional view.

The width (length in the left-right direction) of the wiring part 21 and the width (length in the front-rear direction) of the connection wiring part 22 are, for example, 25 μm or more, preferably 100 μm or more, and for example, 2000 μm or less, preferably 750 μm or less.

The thickness of the wiring pattern 3 is the same as the thickness of the metal sheet 10 described above.

The material of the wiring pattern 3 is the same as the material of the metal sheet 10, and preferably copper. If the wiring pattern 3 is a copper wiring formed of copper, since copper has good conductivity and patterning properties, the inductor 1 having good conductivity and fine patterning can be easily manufactured.

The insulating cover layer 4 is an insulating layer that protects the wiring pattern 3. The insulating cover layer 4 is disposed on the insulating base layer 2 so as to cover the entire upper surface and side surfaces of the wiring pattern 3.

The cover insulating layer 4 includes a first cover insulating portion 4a that covers the first wiring portion 21a, a second cover insulating portion 4b that covers the second wiring portion 21b, and a third cover insulating portion that covers the connection wiring portion 22. 4c and a plurality (two) of fourth cover insulating portions 4d that cover the plurality (two) of terminal portions 23 are integrally provided.

In the cover insulating layer 4, the left fourth cover insulating portion 4d, the first cover insulating portion 4a, the third cover insulating portion 4c, the second cover insulating portion 4b, and the right fourth cover insulating portion 4d are arranged in this order. Continuous in the direction or front-rear direction.

Further, as shown in the cross-sectional view of FIG. 2A, in the cover insulating layer 4, the first cover insulating portion 4a and the second cover insulating portion 4b are not directly connected to each other. That is, the insulating cover layer 4 is not formed so as to continue between the plurality of wiring portions 21 (the first wiring portion 21a and the second wiring portion 21b) adjacent to each other in the left-right direction. More specifically, the insulating cover layer 4 is not substantially present between the plurality of wiring portions 24 (however, the insulating cover layer 4 (4a, 4b) covering the side surface of the wiring portion 21 is excluded).

The thickness of the insulating cover layer 4 is, for example, 0.5 μm or more, preferably 1 μm or more, and for example, 10 μm or less, preferably 7 μm or less. Thereby, the distance between the wiring pattern 3 and the first magnetic layer 5 can be made closer while the wiring pattern 3 and the first magnetic layer 5 are in contact with each other. Therefore, the inductance of the inductor 1 can be further improved.

The first magnetic layer 5 is a layer that imparts high inductance to the inductor 1. The first magnetic layer 5 has substantially the same shape as the base insulating layer 2 in plan view, and has a sheet shape extending in the front-rear direction and the left-right direction.

The first magnetic layer 5 is the uppermost layer in the inductor 1. The first magnetic layer 5 is disposed on the base insulating layer 2 and the cover insulating layer 4. Specifically, the first magnetic layer 5 is disposed on the upper surface of the base insulating layer 2 so as to cover the upper surface and side surfaces of the insulating cover layer 4.

The first magnetic layer 5 exists over the entire vertical direction of the wiring portion 21 between the wiring portions 24. In other words, the first magnetic layer 5 exists from the upper surface of the base insulating layer 2 to a position higher than the wiring portion 21 in the wiring portion 24. Further, the first magnetic layer 5 substantially fills the entire wiring portion 24. Specifically, the wiring portion 21 (the first wiring portion 21a and the second wiring portion 21b) and the cover insulating layer 4 (the first cover insulating portion 4a and the second cover insulating portion 4b) covering the wiring portion 21 are configured. When the member is a cover wiring part, only the first magnetic layer 5 exists between the cover wiring parts adjacent to each other in a side sectional view.

The thickness of the first magnetic layer 5 is, for example, 10 μm or more, preferably 50 μm or more, and, for example, 500 μm or less, preferably 300 μm or less.

The inductor 1 is not an electronic device to be described later, but is a component of the electronic device, that is, a component for manufacturing the electronic device, and does not include an electronic element (chip, capacitor, etc.) or a mounting substrate on which the electronic element is mounted. It is a device that can be distributed industrially and used by industry.

The inductor 1 is mounted (embedded) in an electronic device, for example. Although not shown, the electronic device includes a mounting substrate and electronic elements (chip, capacitor, etc.) mounted on the mounting substrate. In the electronic device, the inductor 1 is mounted on a mounting board.

Specifically, as shown in FIG. 7, a plurality of vias 25 (through holes) penetrating the first magnetic layer 5 and the cover insulating layer 4 in the thickness direction are formed so that the terminal portions 23 are exposed. An insulation treatment is performed on the inner peripheral surface of 25. Next, the conductive connection member 26 is disposed inside the via 25 so that one end of the connection member 26 is in contact with the upper surface of the terminal portion 23. The inductor 1 is mounted on the mounting substrate via the connection member 26, is electrically connected to other electronic devices, and functions as a passive element.

In the method for manufacturing the inductor 1, a wiring forming process for forming the wiring pattern 3 on the upper side of the insulating base layer 2, an electrodeposition process for covering the wiring pattern 3 with the insulating cover layer 4 by electrodeposition, a base A first magnetic layer disposing step of disposing the first magnetic layer 5 on the insulating layer 2 and the cover insulating layer 4;

For this reason, it is possible to suppress the wiring pattern 3 from coming into direct contact with the first magnetic layer 5. Therefore, a short circuit of the wiring pattern 3 can be suppressed.

Further, in the method for manufacturing the inductor 1, the cover insulating layer 4 is formed between the wiring portions 24 in which the plurality of wiring portions 21 (first wiring portion 21 a and second wiring portion 21 b) constituting the wiring pattern 3 are adjacent to each other. The wiring pattern 3 can be covered so as not to be continuous. Therefore, the first magnetic layer 5 can be disposed across the entire thickness direction between the wiring patterns 3 (that is, between the adjacent wiring portions 21). Therefore, the inductance of the inductor 1 can be improved.

Further, in the method for manufacturing the inductor 1, the cover insulating layer 4 can be covered thinly and uniformly on the surface of the wiring pattern 3. Therefore, the distance between the first magnetic layer 5 and the wiring pattern 3 can be made closer. Therefore, the inductance of the inductor 1 can be improved.

Further, in the method for manufacturing the inductor 1, the wiring pattern 3 is formed by a subtractive method in the wiring forming process.

Therefore, compared to the additive method, the wiring pattern 3 can be formed in a short time, and thus the inductor 1 can be manufactured. Further, the inductor 1 having a large wiring thickness can be easily manufactured, and a large current can flow.

Further, in the method for manufacturing the inductor 1, the electrodeposition process supplies power to the wiring pattern 3 through the through hole 6 of the base insulating layer 2 that overlaps the wiring pattern 3 when projected in the thickness direction (see FIG. 3F). .

Therefore, the entire upper surface and side surfaces of the wiring pattern 3 can be covered with the insulating cover layer 4. That is, the upper surface and side surfaces of the wiring pattern 3 are completely covered with the insulating cover layer 4.

In particular, in the method of manufacturing the inductor 1 according to the second embodiment to be described later, the inductor 1 has an exposed side surface 48 (described later) where the magnetic layer and the wiring pattern 3 are in contact with each other. Insulating in a form is difficult. On the other hand, in the inductor 1 of the first embodiment, the contact between the magnetic layer and the wiring pattern 3 can be completely suppressed. As a result, the wiring pattern 3 can be more reliably suppressed from coming into contact with the first magnetic layer 5.

Further, in the method for manufacturing the inductor 1, the base insulating layer 2 includes the alignment mark 7.

Therefore, the wiring pattern 3 can be accurately formed above the through hole 6 with the alignment mark 7 as a mark. Therefore, the cover insulating layer 4 can be more reliably covered with the wiring pattern 3 by the power supply from the through hole 6.

In addition, the inductor 1 obtained by this manufacturing method includes a base insulating layer 2, a plurality of wiring portions 21 that are spaced apart from each other in the left-right direction above the base insulating layer 2, and a plurality of wiring portions 21. The cover insulating layer 4 that covers each of the wiring portions adjacent to each other in the left-right direction so as not to be continuous, and the upper surface of the base insulating layer 2 and the cover insulating layer 4 are disposed so as to cover the upper surface of the base insulating layer 2. The first magnetic layer 5 is provided.

For this reason, it can suppress that the wiring part 21 contacts the 1st magnetic layer 5, and can suppress the short circuit between wiring parts 21. FIG. Moreover, since the 1st magnetic layer 5 is arrange | positioned over the whole thickness direction in 24 between wiring parts, the inductance of the inductor 1 can be made favorable.

Further, in this inductor 1, the plurality of wiring parts 21 are arranged above the common base insulating layer 2, and the cover insulating layer 4 covers the upper surfaces and side surfaces of the plurality of wiring parts 21.

For this reason, the plurality of wiring portions 21 have good positional accuracy in the thickness direction and are reliably supported by the base insulating layer 2.

(Modification)
In the following modifications, members and processes similar to those in the above-described embodiment are denoted by the same reference numerals, and detailed description thereof is omitted. Moreover, each modification can be combined suitably. Furthermore, each modification can produce the same effects as those of the embodiment, unless otherwise specified.

First Modified Example As shown in FIG. 8A, a step of arranging the first diffusion prevention layer 30 on the lower surface of the metal sheet 10 can be performed before the base insulating layer arranging step. That is, the first diffusion prevention layer 30 can be disposed on the lower surface of the metal sheet 10 and the upper surface of the base insulating layer 2.

Examples of the material of the first diffusion preventing layer 30 include conductors such as nickel, nichrome, cobalt, and tantalum. From the viewpoint of enabling easy execution of plating during formation and soft etching during removal, and good workability, nickel is preferably used.

When the first diffusion prevention layer 30 is disposed as shown in FIG. 8A and the inductor 1 is manufactured, as shown in FIG. 8B, the wiring pattern 3 in the inductor 1 has a lower wiring portion 31 formed from the first diffusion prevention layer 30. And a wiring main part 32 formed on the upper surface and formed from the metal sheet 10.

Note that, in the manufacturing method shown in FIG. 8A, in the wiring forming step, the step of etching the first diffusion prevention layer 30 is performed in addition to the step of etching the metal sheet 10 due to the difference in the etching rates.

In the manufacturing method shown in FIG. 8A, the metal component (for example, copper ions) of the metal sheet 10 can be prevented from eroding the base insulating layer 2 and diffusing into the base insulating layer 2. The peel strength between the sheet 10 and the base insulating layer 2 can be improved.

Second Modification As shown in FIG. 9A, in the wiring formation process, after the subtractive method, a process of disposing the second diffusion prevention layer 33 on the wiring pattern 3 formed from the metal sheet 10 may be performed. it can.

Examples of the material of the second diffusion preventing layer 33 include a conductor such as nickel.

In order to arrange the second diffusion preventing layer 33, for example, a plating treatment using a nickel bath may be used.

When the second diffusion prevention layer 33 is disposed as shown in FIG. 9A and the inductor 1 is manufactured, as shown in FIG. 9B, the wiring pattern 3 in the inductor 1 includes a wiring main portion 32 formed from the metal sheet 10, and And a second diffusion preventing layer 33 covering the upper surface and side surfaces thereof.

In the manufacturing method shown in FIG. 9B, a short circuit caused by the metal component (for example, copper ions) from the wiring main part 32 eroding the cover insulating layer 4 and the first magnetic layer 5 can be suppressed.

Further, the first modification and the second modification may be combined.

Third Modification The shape of the wiring pattern 3 is not limited to the above. For example, as shown in FIGS. 10A and 10B, the wiring pattern 3 may have a meander shape (meandering shape) that advances in the front-rear direction and the left-right direction.

For example, in the wiring pattern 3 shown in FIG. 10A, a plurality (five) of wiring portions 21 extending in the left-right direction and a plurality of (four) connection wirings connecting the left ends or the right ends of the plurality of wiring portions 21 are connected. Part 22 and a plurality of terminal parts 23 arranged at both ends of wiring pattern 3.

For example, in the wiring pattern 3 shown in FIG. 10B, a plurality (three) of wiring portions 21 extending in the front-rear direction and a plurality (two) of connections connecting the front end portions or the rear end portions of the plurality of wiring portions 21. The wiring part 22 and a plurality of terminal parts 23 disposed at both ends of the wiring pattern 3 are provided.

Further, the wiring pattern 3 may have a substantially circular loop shape in a plan view as shown in FIG. 10C, for example. In the wiring pattern 3 shown in FIG. 10C, in the wiring portions 21 adjacent to each other in a predetermined direction, the predetermined direction and the length of the wiring portion 21 adopt an arbitrary direction (for example, left and right direction, crossing direction) and an arbitrary length. be able to. For example, in FIG. 10C, when a crossing direction (a direction crossing both the front-rear direction and the left-right direction: oblique direction) is adopted as the predetermined direction, a plurality of (two) wiring portions 21 adjacent to each other in the crossing direction are hatched. It shows with.

Although not shown, the wiring pattern 3 does not include the terminal portion 23 and may be configured by the wiring portion 21 and the connection wiring portion 22.

Fourth Example Although not shown, the inductor 1 may not include the second magnetic layer 18 and the adhesive layer 19. From the viewpoint of providing higher inductance, the inductor 1 preferably includes the second magnetic layer 18 and the adhesive layer 19.

Fifth Embodiment Although not shown, the inductor 1 may not include the alignment mark 7 in the base insulating layer 2 by subsequent outer shape processing or the like.

Second Embodiment
A second embodiment of a method for manufacturing an inductor 1 will be described with reference to FIGS. 11A to 14F as an example of a method for manufacturing a wiring board according to the present invention. Note that in the second embodiment, the same members and steps as those in the first embodiment described above are denoted by the same reference numerals, and detailed description thereof is omitted.

The second embodiment of the method for manufacturing the inductor 1 includes a metal sheet laminate preparation step, a wiring formation step, a lead masking step, an electrodeposition step, a masking removal step, a lead removal step, and a first magnetic layer arrangement. And a second magnetic layer arranging step. Hereinafter, each process is explained in full detail.

(Metal sheet laminate preparation process)
In the metal sheet laminate preparation step, as shown in FIG. 11A, a metal sheet laminate 40 including the metal sheet 10 and the base insulating layer 2 disposed on the entire lower surface thereof is prepared.

The metal sheet 10 is the same as that in the first embodiment.

In addition to the same organic material as in the first embodiment, the base insulating layer 2 is made of, for example, an inorganic material such as glass or ceramics, for example, an insulating material such as a composite material (glass epoxy) of an inorganic material and an organic material. Is mentioned.

The metal sheet laminate 40 is preferably a copper clad laminate or the like.

(Wiring formation process)
In the wiring formation step, the conductor pattern 42 having the wiring pattern 3 and the electrodeposition leads 41 is formed on the upper side of the insulating base layer 2. That is, a subtractive method is performed on the metal sheet 10 to remove unnecessary portions from the metal sheet 10 to form the conductor pattern 42.

First, as shown in FIG. 11B, a support film 15 is disposed on the lower surface of the base insulating layer 2.

Next, as shown in FIGS. 11C and 13A, the subtractive method is performed. The subtractive method is the same as that in the first embodiment.

The conductor pattern 42 includes a wiring pattern 3 and an electrodeposition lead 41.

The electrodeposition lead 41 is continuous with the first lead portion 43 extending from the rear end edge of one (left side) terminal portion 23 of the wiring pattern 3 to the rear side, and the rear end edge of the first lead portion 43, and in the left-right direction. And a second lead portion 44 extending.

Thereby, the second electrodeposit 45 having the support film 15, the base insulating layer 2, and the conductor pattern 42 in order is obtained.

(Lead masking process)
In the masking step, the electrodeposition lead 41 is masked as shown in FIGS. 11D and 13B. That is, the upper surface and the side surface of the electrodeposition lead 41 are covered with the masking sheet 46.

Examples of the masking sheet 46 include a separator film having slight adhesiveness.

Thereby, it is possible to prevent the cover insulating layer 4 from being covered with the electrodeposited lead 41 in the electrodeposition process described later, and to reliably remove the electrodeposited lead 41 in the lead etching process described later.

(Electrodeposition process)
In the electrodeposition process, as shown in FIGS. 11E and 13C, the wiring pattern 3 is covered with the insulating cover layer 4 by electrodeposition.

Specifically, the masked second electrodeposition object 45 is immersed in the electrodeposition paint-containing liquid, and then an electric current is applied to the second electrodeposition object 45, whereby the electrodeposition paint is applied to the wiring pattern 3. Then, the deposited electrodeposition paint is dried.

In order to apply a current to the second electrodeposit 45, a lead wire (not shown) connected to an external power source is connected to the end of the second lead portion 44. Thereby, a direct current is applied to the whole wiring pattern 3 through the lead wire and the electrodeposition lead 41.

The electrodeposition conditions are the same as in the first embodiment.

(Masking removal process)
In the masking removal, the masking sheet 46 is removed as shown in FIGS. 12F and 14D. That is, the masking sheet 46 is peeled from the electrodeposition lead 41.

Thereby, the surface of the electrodeposition lead 41 is exposed.

(Lead removal process)
In the lead removal step, the electrodeposited lead 41 is removed as shown in FIGS. 12G and 14E. That is, the electrodeposited lead 41 is removed from the conductor pattern 42 by etching.

Etching includes, for example, the above-described wet etching.

At this time, since the wiring pattern 3 is covered with the insulating cover layer 4, it is not removed by etching.

Thereby, the 1st intermediate body 47 provided with the support film 15, the base insulating layer 2, the wiring pattern 3, and the cover insulating layer 4 in order is obtained.

In the first intermediate 47, the insulating cover layer 4 is not covered on the side surface of the rear edge of the wiring pattern 3. That is, the wiring pattern 3 (specifically, the left terminal portion 23) has an exposed side surface 48 exposed from the cover insulating layer 4 on the side surface of the rear end edge.

(First magnetic layer arranging step)
In the first magnetic layer arranging step, the first magnetic layer 5 is arranged above the base insulating layer 2 and the cover insulating layer 4 as shown in FIGS. 12H and 14F.

The first magnetic layer arranging step is the same as in the first embodiment.

Thereafter, the support film 15 is removed from the base insulating layer 2 by peeling.

Thereby, the second intermediate body 49 including the insulating base layer 2, the wiring pattern 3, the insulating cover layer 4, and the first magnetic layer 5 in order is obtained. In the second intermediate body 49, the exposed side surface 48 is in contact with the first magnetic layer 5.

(Second magnetic layer arranging step)
In the second magnetic layer step, as shown in FIG. 12I, the second magnetic layer 18 is disposed below the base insulating layer 2. That is, the insulating cover layer 4 is disposed on the lower surface of the insulating base layer 2 via the adhesive layer 19.

The second magnetic layer arranging step is the same as in the first embodiment.

Thereby, the inductor 1 of the second embodiment is obtained.

(Inductor)
The inductor 1 includes a second magnetic layer 18, an adhesive layer 19, a base insulating layer 2, a conductor pattern 42, a cover insulating layer 4, and a first magnetic layer 5 in this order in the thickness direction. These members are the same as those of the first embodiment except for special mention.

The base insulating layer 2 of the second embodiment does not include the through hole 6 and the alignment mark 7. That is, the entire lower surface of the base insulating layer 2 is in contact with the entire upper surface of the adhesive layer 19. Further, the adhesive layer 19 is not in contact with the wiring pattern 3 and the second magnetic layer 18.

In the inductor 1 of the second embodiment, the exposed side surface 48 of one terminal portion 23 is in contact with the first magnetic layer 5.

The manufacturing method of the inductor 1 according to the second embodiment and the inductor 1 manufactured therefrom have the same effects as the manufacturing method and the inductor 1 according to the first embodiment.

Also, the modification of the second embodiment can be the same as the modification of the first embodiment.

Although the above invention has been provided as an exemplary embodiment of the present invention, this is merely an example and should not be construed as limiting. Variations of the present invention that are apparent to one of ordinary skill in the art are within the scope of the following claims.

The inductor is mounted on, for example, an electronic device.

DESCRIPTION OF SYMBOLS 1 Inductor 2 Base insulating layer 3 Wiring pattern 4 Cover insulating layer 5 1st magnetic layer 6 Through-hole 7 Alignment mark 21 Wiring part 24 Between wiring parts

Claims

A wiring forming step of forming a wiring pattern on one side in the thickness direction of the first insulating layer;
An electrodeposition step of covering the wiring pattern with a second insulating layer by electrodeposition;
A magnetic layer disposing step of disposing a magnetic layer on one side in the thickness direction of the first insulating layer and the second insulating layer;
A method of manufacturing a wiring board, comprising:
The method for manufacturing a wiring board according to claim 1, wherein the wiring forming step is a step of forming the wiring pattern by a subtractive method.
2. The method of claim 1, wherein the electrodeposition step includes a step of supplying power to the wiring pattern through a through hole of the first insulating layer that overlaps the wiring pattern when projected in the thickness direction. Wiring board manufacturing method.
The method for manufacturing a wiring board according to claim 3, wherein the first insulating layer includes a positioning portion for forming the wiring pattern on one side in the thickness direction of the through hole.
2. The method of manufacturing a wiring board according to claim 1, wherein the wiring pattern includes a copper wiring.
A first insulating layer;
A plurality of wiring portions arranged at intervals in a predetermined direction on one side in the thickness direction of the first insulating layer;
A second insulating layer that covers each of the plurality of wiring portions so as not to be continuous between adjacent wiring portions in a predetermined direction;
A wiring board comprising: a magnetic layer disposed on one side in the thickness direction of the first insulating layer and the second insulating layer so as to cover one side in the thickness direction of the first insulating layer.
The plurality of wiring portions are arranged on one side in the thickness direction of the common first insulating layer,
The wiring board according to claim 6, wherein the second insulating layer covers one surface and side surfaces in the thickness direction of the plurality of wiring portions.
The wiring board according to claim 6, wherein the first insulating layer has a through hole that overlaps the wiring portion when projected in the thickness direction.
The wiring board according to claim 6, wherein a thickness of the first insulating layer is not less than 0.5 μm and not more than 10 μm.