WO2017217308A1

WO2017217308A1 - Electronic component, vibration plate, electronic device, and method for manufacturing electronic components

Info

Publication number: WO2017217308A1
Application number: PCT/JP2017/021254
Authority: WO
Inventors: 伊藤　慎悟
Original assignee: 株式会社村田製作所
Priority date: 2016-06-17
Filing date: 2017-06-08
Publication date: 2017-12-21
Also published as: US10770215B2; US20190088403A1; CN209729659U

Abstract

An electronic component (101) comprises an insulation substrate (10) having a first main surface (VS1) that serves as a mounting surface, a coil that is formed on the insulation substrate (3), and mounting electrodes (P1, P2) that are connected to the coil (3) formed on the first main surface (VS1). The insulation substrate (10) is formed by laminating a plurality of insulation substrate layers (11, 12, 13). The coil (3) is configured with a coil conductor (31) formed in the insulation substrate (12), and has a winding axis (AX) in the direction of lamination (the z-axis direction) of the plurality of insulation substrate layers (11, 12, 13). The area of the first main surface (VS1) differs from the area of the first main surface (VS1) in a cross-section parallel to the first main surface (VS1) (the cross-section of the XY plane), and is smaller than the area of the cross-section closest to the first main surface (VS1) (e.g., the interface between the insulation substrate layer (12) and the insulation substrate layer (13)).

Description

Electronic component, diaphragm, electronic device, and method of manufacturing electronic component

The present invention relates to an electronic component, and more particularly to an electronic component and a diaphragm in which a coil is formed in a laminated body, an electronic device including the electronic component, and a method for manufacturing the electronic component.

Conventionally, various electronic components in which a coil is formed on an insulating base material formed by laminating a plurality of insulating base material layers are known. For example, Patent Document 1 discloses an electronic component having a winding shaft in a method for laminating a plurality of insulating base layers and having mounting electrodes formed only on the mounting surface of the insulating base. Such an electronic component is mounted on a mounting substrate or the like (hereinafter referred to as “other member”).

However, in the electronic component having the above configuration, if a large mounting electrode is formed on the mounting surface, the mounting electrode may interfere with the magnetic flux passing through the coil. Therefore, in order to suppress the magnetic flux passing through the coil from being obstructed, a configuration in which the area of the mounting electrode is reduced can be considered. However, when such a mounting electrode is bonded to a conductor pattern or the like formed on another member via a conductive bonding material such as solder, the area of the mounting electrode is small. There is a possibility that the bonding strength cannot be secured.

It is also conceivable to apply the above configuration to the diaphragm. Similar to the electronic component described above, the diaphragm has a mounting electrode formed for connection to another member. When the diaphragm vibrates, stress is applied to a portion (hereinafter, “joined portion”) joined to the diaphragm and another member. Therefore, when the mounting electrode of the diaphragm is bonded to another member with only the conductive bonding material, stress concentrates on the interface between the insulating base material and the conductive bonding material, and the vibration plate is separated from the other member. There is a risk of easy peeling.

In contrast, when mounting an electronic component and a diaphragm on another member, or when joining a diaphragm to another member, an insulating bonding material (such as underfill) is used to mount a mounting surface other than the mounting electrode. A method of joining (adhering) the joining portion to another member is conceivable.

International Publication No. 2014/115433

However, even in the joining method as described above, joining between the insulating base material layer and the insulating joining material constituting the insulating base material (or between the insulating base material layer and another member) is performed between different materials. Due to the bonding, sufficient bonding strength cannot be ensured, and the electronic component or the diaphragm may fall off from other members.

An object of the present invention is to provide an electronic component and a diaphragm that can easily ensure sufficient bonding strength to other members in an electronic component and a diaphragm that are mounted on another member using a conductive bonding material and an insulating bonding material, An object of the present invention is to provide an electronic device including another member on which the electronic component is mounted. Moreover, the objective of this invention is providing the manufacturing method of the said electronic component.

(1) The electronic component of the present invention
An insulating substrate having a first main surface that is a mounting surface and formed by laminating a plurality of insulating substrate layers;
A coil including a coil conductor formed on the insulating base layer, and a coil having a winding axis in the stacking direction of the plurality of insulating base layers;
A mounting electrode formed on the first main surface and connected to the coil;
With
The area of the first main surface is different from the area of the first main surface among the cross sections parallel to the first main surface and is smaller than the area of the cross section closest to the first main surface. Features.

With this configuration, it is possible to increase the bonding strength between the electronic component and the insulating bonding material without increasing the mounting area of the electronic component including the insulating bonding material, and to improve the bonding reliability with respect to the mounting substrate. Parts can be realized.

(2) In the above (1), the number of the coil conductors is plural, and the plurality of coil conductors are respectively formed on two or more insulating base material layers among the plurality of insulating base material layers. preferable. With this configuration, an electronic component including a coil having a predetermined number of turns and an inductance can be realized.

(3) In the above (1) or (2), the insulating base material may have a notch formed in an outer edge portion of the first main surface.

(4) In any one of the above (1) to (3), it is preferable that an uneven portion is formed in an electrode non-formed portion where the mounting electrode is not formed in the first main surface. This configuration increases the surface area of the electrode non-forming portion that is in contact with the insulating bonding material when mounted on the mounting substrate as compared to the case where the uneven portion is not formed on the electrode non-forming portion. The bonding strength between the adhesive bonding material is further increased.

(5) The diaphragm of the present invention is
It vibrates by electromagnetic force,
A support film having flexibility and having a wiring conductor formed thereon;
An electronic component bonded to the support film via a conductive bonding material and an insulating bonding material;
With
The electronic component is
An insulating substrate having a first main surface that is a mounting surface and formed by laminating a plurality of insulating substrate layers;
A coil configured to include a coil conductor formed on the insulating base layer;
A mounting electrode formed on the first main surface and connected to the coil;
Have
The area of the first main surface is different from the area of the first main surface among the cross sections parallel to the first main surface and is smaller than the area of the cross section closest to the first main surface. Features.

When the diaphragm is bonded to the support film using only the conductive bonding material, stress concentrates on the interface between the mounting electrode of the vibration plate and the conductive bonding material during vibration, and the vibration plate is easily peeled off from the support film. . Further, when the vibration plate repeatedly vibrates, stress is generated at the interface between the insulating base material and the support film, and peeling is likely to occur at the interface between the electrode non-formed portion and the insulating bonding material. On the other hand, according to this configuration, the area where the insulating base material is in contact with the insulating bonding material is larger than when only the electrode non-forming portion of the insulating base material is bonded to the support film via the insulating bonding material. The bonding strength between the insulating substrate and the insulating bonding material is increased. Therefore, peeling of the interface between the insulating base material and the insulating bonding material is suppressed, and a diaphragm with improved bonding reliability to the support film can be realized.

(6) In the above (5), the insulating base material may have a notch formed in an outer edge portion of the first main surface.

(7) The diaphragm of the present invention is
It vibrates by electromagnetic force,
An insulating base material that has a first main surface, a vibrating part that vibrates, and a support part that is fixed to another member, and is formed by laminating a plurality of insulating base material layers;
A coil configured to include a coil conductor formed on the insulating base layer;
A mounting electrode formed on the first main surface and connected to the coil;
With
The area of the first main surface is different from the area of the first main surface among the cross sections parallel to the first main surface and is smaller than the area of the cross section closest to the first main surface. Features.

When the diaphragm vibrates, stress is applied to the joint of the support part. When the diaphragm is bonded to another member only with the conductive bonding material, there is a large difference in physical properties between the insulating base material and the conductive bonding material (the elastic modulus of the insulating base material and the elastic modulus of the conductive bonding material). Therefore, the stress is concentrated on the interface between the mounting electrode of the diaphragm and the conductive bonding material during vibration, and the diaphragm is easily peeled off from other members. Further, when the vibration plate repeatedly vibrates, stress is generated at the interface between the joint portion of the support portion and the other member, and peeling easily occurs at the interface between the insulating base material and the insulating bonding material. On the other hand, according to this configuration, the surface area of the portion where the insulating base material and the insulating bonding material are in contact with each other is compared with the case where only the first main surface side of the support portion is bonded to another member via the insulating bonding material. Increases and the bonding strength between the insulating base material and the insulating bonding material increases. Therefore, it is possible to realize a diaphragm that suppresses peeling of the interface between the insulating base material and the insulating bonding material.

(8) In the above (7), the insulating base material may have a cutout portion formed in an outer edge portion of the support portion in the first main surface.

(9) In the above (7) or (8), it is preferable that the width of the support portion is narrower than the width of the vibration portion. With this configuration, the vibration part is easily vibrated by electromagnetic force, and a diaphragm having a large amplitude can be realized.

(10) The electronic apparatus of the present invention
A mounting board;
Electronic components mounted on the mounting substrate using a conductive bonding material and an insulating bonding material,
With
The electronic component is
An insulating substrate having a first main surface that is a mounting surface and formed by laminating a plurality of insulating substrate layers;
A coil including a coil conductor formed on the insulating base layer, and a coil having a winding axis in the stacking direction of the plurality of insulating base layers;
A mounting electrode formed on the first main surface and connected to the coil;
With
The area of the first main surface is different from the area of the first main surface among the cross sections parallel to the first main surface, and is smaller than the area of the cross section closest to the first main surface,
The mounting electrode is connected to the mounting substrate via the conductive bonding material,
The insulating base material has an end surface connected to the first main surface, or a notch formed at an outer edge portion of the first main surface,
An electrode non-formation portion in which the mounting electrode is not formed in the first main surface is bonded to the mounting substrate through the insulating bonding material together with at least a part of an end surface or the cutout portion. Features.

With this configuration, compared to the case where only the electrode non-forming portion is bonded to the mounting substrate via the insulating bonding material, the area in contact with the insulating bonding material is increased, and the electronic component (insulating base material) and the insulating bonding are bonded. The bonding strength between the materials is increased. Further, in this configuration, the area of the first main surface is different from the area of the first main surface in the cross section parallel to the first main surface and is smaller than the area of the cross section closest to the first main surface. Therefore, without increasing the mounting area of the electronic component including the insulating bonding material, it is possible to realize an electronic component with improved bonding reliability with respect to the mounting substrate and the like, and an electronic device including the mounting substrate on which the electronic component is mounted. realizable.

(11) A method for manufacturing an electronic component of the present invention includes:
A conductor forming step of forming a coil conductor on the insulating base layer;
After the conductor forming step, the insulating base material is formed by heating and pressurizing the plurality of laminated insulating base material layers, and a base material forming step,
Forming a mounting electrode on the first main surface of the insulating substrate;
A notch forming step of forming a notch in the first main surface after the base material forming step;
It is characterized by providing.

(12) A method for manufacturing an electronic component of the present invention includes:
An electronic component manufacturing method comprising:
A conductor forming step of forming a coil conductor on the insulating base layer;
After the conductor forming step, the insulating base material is formed by heating and pressurizing the plurality of laminated insulating base material layers, and a base material forming step,
Forming a mounting electrode on the first main surface of the insulating substrate;
After the base material forming step, the area of the first main surface is different from the area of the first main surface in the cross section parallel to the first main surface and is closest to the first main surface. Separating the insulating base material into pieces by grinding with a laser from the first main surface side so as to be smaller than the cross-sectional area; and
It is characterized by providing.

By these manufacturing methods, when mounting on a mounting board using a conductive bonding material and an insulating bonding material, it is possible to easily manufacture an electronic component that can ensure sufficient bonding strength to the mounting board.

(13) In the above (11) or (12), the insulating base material layer is made of a thermoplastic resin, and the base material forming step is performed by collectively pressing the laminated insulating base material layers, thereby It is preferable to include the process of forming a base material. According to this method, since the insulating base material can be easily formed by collectively pressing a plurality of laminated insulating base material layers, the number of steps in the manufacturing process of the insulating base material can be reduced, and the cost can be kept low. .

(14) In any one of the above (11) to (13), before the base material forming step, the mounting electrode is placed on the surface of the insulating base material layer that becomes the first main surface of the insulating base material. A step of forming may be included.

According to the present invention, in an electronic component and a diaphragm that are mounted on a mounting substrate or the like using a conductive bonding material and an insulating bonding material, the electronic component and the diaphragm that can easily ensure sufficient bonding strength to the mounting substrate or the like, An electronic device including a mounting substrate on which the electronic component or the diaphragm is mounted can be realized. In addition, according to the present invention, the electronic component can be easily manufactured.

FIG. 1A is a cross-sectional view of the electronic component 101 according to the first embodiment, and FIG. 1B is an exploded perspective view of the electronic component 101. FIG. 2A is a plan view of the electronic component 101 showing the electrode non-forming portion PE, and FIG. 2B is an enlarged view of the DP1 portion in FIG. FIG. 3 is a cross-sectional view illustrating a main part of the electronic apparatus 301 according to the first embodiment. FIG. 4 is a cross-sectional view illustrating a main part of an electronic device 300 as a comparative example. FIG. 5 is a cross-sectional view sequentially illustrating the manufacturing process of the electronic component 101. 6A is a cross-sectional view of the electronic component 102 according to the second embodiment, and FIG. 6B is an enlarged view of the DP2 portion in FIG. 6A. FIG. 7 is a cross-sectional view illustrating a main part of the electronic device 302 according to the second embodiment. FIG. 8 is a cross-sectional view sequentially illustrating the manufacturing process of the electronic component 102. FIG. 9A is a cross-sectional view of the electronic component 103 according to the third embodiment, and FIG. 9B is an exploded plan view of the electronic component 103. FIG. 10 is a cross-sectional view illustrating a main part of an electronic device 303 according to the third embodiment. FIG. 11 is a plan view showing the main part of the insulating base material layer 13A in the aggregate substrate state. FIG. 12 is a cross-sectional view sequentially illustrating manufacturing steps of the electronic component 104 according to the fourth embodiment. FIG. 13A is a perspective view of a diaphragm 405 according to the fifth embodiment, and FIG. 13B is an exploded perspective view of the diaphragm 405. 14A is a plan view of the diaphragm 405, and FIG. 14B is a cross-sectional view taken along the line AA in FIG. FIG. 15A is an exploded perspective view of the vibration device 505 according to the fifth embodiment, and FIG. 15B is a cross-sectional view of the vibration device 505. FIG. 16 is a cross-sectional view of a vibration device 500 as a comparative example. FIG. 17 is an exploded perspective view of the vibration device 506 according to the sixth embodiment. 18A is a cross-sectional view of the electronic component 107 according to the seventh embodiment, and FIG. 18B is an exploded perspective view of the electronic component 107. FIG. 19A is a perspective view of a diaphragm 407 according to the seventh embodiment, and FIG. 19B is an exploded perspective view of the diaphragm 407. FIG. 20 is a cross-sectional view of the diaphragm 407. FIG. 21A is a perspective view of a vibration device 507 according to the seventh embodiment, and FIG. 21B is an exploded perspective view of the vibration device 507. FIG. 22 is a cross-sectional view of the vibration device 507. FIG. 23A is a plan view of the diaphragm 408 according to the eighth embodiment showing the support portions FP1 and FP2, and FIG. 23B is a plan view of the diaphragm 408 showing the first main surfaces VS1A and VS1B. FIG. 24 is a cross-sectional view taken along line BB in FIG. FIG. 25 is a cross-sectional view of a vibration device 508 according to the eighth embodiment.

Hereinafter, several specific examples will be given with reference to the drawings to show a plurality of modes for carrying out the present invention. In each figure, the same reference numerals are assigned to the same portions. In consideration of ease of explanation or understanding of the main points, the embodiments are shown separately for convenience, but the components shown in different embodiments can be partially replaced or combined. In the second and subsequent embodiments, description of matters common to the first embodiment is omitted, and only different points will be described. In particular, the same operation effect by the same configuration will not be sequentially described for each embodiment.

<< First Embodiment >>
FIG. 1A is a cross-sectional view of the electronic component 101 according to the first embodiment, and FIG. 1B is an exploded perspective view of the electronic component 101. FIG. 2A is a plan view of the electronic component 101 showing the electrode non-forming portion PE, and FIG. 2B is an enlarged view of the DP1 portion in FIG. Note that in FIG. 1A, the thickness of each portion is exaggerated. The same applies to the sectional views in the following embodiments. In FIG. 2A, in order to make the structure easy to understand, the electrode non-forming portion PE is indicated by hatching.

The “electronic component” in the present invention is an element mounted on a mounting board or the like using a conductive bonding material and an insulating bonding material. In addition, the “electronic device” in the present invention is a device including the above-described electronic components, a mounting substrate, and the like. ), Cameras, game machines, toys and the like.

The electronic component 101 is formed on the insulating base material 10 having the first main surface VS1 and the second main surface VS2, the coil 3 (described in detail later) formed on the insulating base material 10, and the first main surface VS1. Mounting electrodes P1 and P2. In the present embodiment, the first main surface VS1 of the insulating base material 10 corresponds to a “mounting surface”, and the second main surface VS2 facing the first main surface VS1 corresponds to a “top surface”.

The insulating base material 10 is a substantially rectangular parallelepiped of a thermoplastic resin whose longitudinal direction coincides with the X-axis direction. Insulating base material 10 has notch part NT1 formed over the perimeter of the outer edge part of the 1st principal surface VS1. As shown in FIG. 2B and the like, the cross-sectional shape of the notch NT1 is L-shaped. Moreover, the electronic component 101 has the electrode non-formation part PE as shown to FIG. 2 (A). The electrode non-forming portion PE is a portion where the mounting electrodes P1 and P2 are not formed in the first main surface VS1.

As shown in FIG. 1B, the insulating base material 10 is formed by laminating a plurality of insulating base material layers 11, 12, 13 made of thermoplastic resin in this order. Each of the plurality of insulating base layers 11, 12, and 13 is a flat plate having a rectangular planar shape, and the longitudinal direction coincides with the X-axis direction. The plurality of insulating base layers 11, 12, and 13 are sheets mainly made of a liquid crystal polymer (LCP), for example.

The conductor 21 is formed on the surface of the insulating base layer 11. The conductor 21 is an L-shaped conductor that is disposed near the first corner of the insulating base layer 11 (the lower left corner of the insulating base layer 11 in FIG. 1B) and extends in the X-axis direction and the Y-axis direction. . The conductor 21 is a conductor pattern made of, for example, Cu foil.

The coil conductor 31 and the conductor 22 are formed on the surface of the insulating base layer 12. The coil conductor 31 is a rectangular spiral conductor having a little over two turns that is wound along the outer shape of the insulating base layer 12. The conductor 22 is a rectangular conductor disposed near the first corner of the insulating base layer 12 (the lower left corner of the insulating base layer 12 in FIG. 1B). The coil conductor 31 and the conductor 22 are conductor patterns made of, for example, Cu foil.

Two mounting electrodes P1 and P2 are formed on the surface of the insulating base layer 13. The mounting electrodes P1 and P2 are rectangular conductors whose longitudinal direction coincides with the Y-axis direction. The mounting electrodes P1 and P2 according to the present embodiment are near the first side (the right side of the insulating base layer 13 in FIG. 1B) and the second side (the left side of the insulating base layer 13) of the insulating base layer 13. They are arranged in the vicinity and arranged along the X-axis direction. The mounting electrodes P1 and P2 are conductor patterns made of, for example, Cu foil.

As shown in FIG. 1B, the mounting electrode P1 is connected to the first end of the coil conductor 31 through an interlayer connection conductor V33 formed on the insulating base layer 13. The second end of the coil conductor 31 is connected to the first end of the conductor 21 via an interlayer connection conductor V32 formed in the insulating base layer 12. The second end of the conductor 21 is connected to the mounting electrode P2 via the conductor 22 formed on the insulating base material layers 12 and 13 and the interlayer connection conductors V21 and V22.

As described above, in the electronic component 101, the rectangular spiral coil 3 having about two turns is configured including the coil conductor 31 formed on the insulating base layer 12. As shown in FIG. 1 (A), the coil 3 is formed inside an insulating substrate 10, and both ends of the coil 3 are connected to mounting electrodes P1 and P2, respectively. Further, the coil 3 has a winding axis AX in the stacking direction (Z-axis direction) of the plurality of insulating base material layers 11, 12, 13 as shown in FIG.

In the present embodiment, the example of the coil 3 having the winding axis AX in the stacking direction (Z-axis direction) of the plurality of insulating base layers 11, 12, and 13 has been shown. It is not limited to exactly matching the Z-axis direction. In the present invention, “having a winding axis in the stacking direction of the plurality of insulating base layers” means, for example, when the winding axis AX of the coil 3 is within a range of −30 ° to + 30 ° with respect to the Z-axis direction. Including.

In the electronic component 101, as shown in FIG. 1A and the like, the area of the first main surface VS1 is the first main surface among the cross sections parallel to the first main surface VS1 (the cross sections parallel to the XY plane). Unlike the area of the surface VS1, it is smaller than the area of the cross section closest to the first main surface (for example, the interface between the insulating base material layer 12 and the insulating base material layer 13).

Next, a state where the electronic component 101 is mounted on the mounting substrate using the conductive bonding material and the insulating bonding material will be described with reference to the drawings. FIG. 3 is a cross-sectional view illustrating a main part of the electronic device 301 according to the first embodiment.

The electronic device 301 includes an electronic component 101, a mounting substrate 201, and the like. The mounting board 201 is, for example, a printed wiring board.

Conductors

51 and 52 are formed on the main surface of the mounting substrate 201. The

conductors

51 and 52 are connected to the mounting electrodes P1 and P2 through the conductive bonding material 4, respectively. The electrode non-forming part PE and the notch part NT1 shown in FIG. 2A are bonded to the mounting substrate 201 via the insulating bonding material 5. The conductive bonding material 4 is, for example, solder or the like, and the insulating bonding material 5 is an adhesive that is thermally cured at a temperature approximately equal to the melting temperature of the conductive bonding material 4, for example, adhesion of an epoxy thermosetting resin. It is an agent. The insulating bonding material may be an underfill, for example.

The electronic component 101 according to the present embodiment is mounted on the mounting substrate 201 in the following process, for example.

First, after the paste-like conductive bonding material 4 is printed on the

conductors

51 and 52 and the insulating bonding material 5 before thermosetting is applied on the mounting substrate 201, the mounting electrodes P1 and P2 are respectively connected to the

conductors

51 and 52. The electronic component 101 is mounted with a mounter or the like so as to be arranged above. Thereafter, the mounting electrodes P1 and P2 are bonded to the

conductors

51 and 52 via the conductive bonding material 4 by the reflow process, respectively, and the electrode non-forming portion PE and the notch portion NT1 are mounted via the insulating bonding material 5 to the mounting substrate. It is joined to 201. Due to the temperature during the reflow process, the paste-like conductive bonding material 4 is melted, and the mounting electrodes P1 and P2 are connected to the

conductors

51 and 52, respectively. At the same time, the insulating bonding material 5 before thermosetting is thermoset, and the electrode non-forming portion PE and the notch NT1 are bonded to the mounting substrate 201.

Next, as a comparative example, an electronic device in which an electronic component not provided with a notch is mounted on a mounting board will be described. FIG. 4 is a cross-sectional view illustrating a main part of an electronic device 300 as a comparative example.

The electronic device 300 includes an electronic component 100, a mounting board 201, and the like. The electronic component 100 is different from the electronic component 101 in that it does not include a notch, and the other configuration is the same as the electronic component 101. In the electronic component 100, only the electrode non-forming part PE0 is bonded to the mounting substrate 201 via the insulating bonding material 5. As shown in FIGS. 3 and 4, the mounting area of the electronic component 100 including the insulating bonding material 5 is substantially the same as the mounting area of the electronic component 101 including the insulating bonding material 5.

On the other hand, in the electronic component 101, as shown in FIG. 3, the electrode non-forming part PE and the notch part NT1 are bonded to the mounting substrate 201 via the insulating bonding material 5. Therefore, compared with the case where only the electrode non-forming portion PE0 shown in FIG. 4 is bonded to the mounting substrate 201 via the insulating bonding material 5, the area in contact with the insulating bonding material 5 is increased, and the electronic component (insulating base) Material) and the insulating bonding material 5 are increased in bonding strength.

According to this embodiment, the following effects can be obtained.

(A) In the electronic component 101 according to the present embodiment, the area of the first main surface VS1 is the same as the area of the first main surface VS1 in the cross section parallel to the first main surface VS1 (the cross section parallel to the XY plane). And is smaller than the area of the cross section closest to the first main surface VS1. In addition, the electronic component 101 includes a cutout portion NT1 formed at the outer edge portion of the first main surface VS1. The cutout portion NT1 and the electrode non-formed portion PE are mounted on the mounting substrate 201 via the insulating bonding material 5. To be joined. With this configuration, the bonding strength between the electronic component 101 (insulating base material 10) and the insulating bonding material 5 can be increased without increasing the mounting area of the electronic component including the insulating bonding material 5, An electronic component with improved bonding reliability to a mounting substrate or the like can be realized. In addition, an electronic device including a mounting substrate on which the electronic component is mounted can be realized.

(B) In this embodiment, the insulating bonding material 5 is an adhesive that is thermoset at a temperature similar to the melting temperature of the conductive bonding material 4. With this configuration, the step of connecting the mounting electrodes P1 and P2 to the

conductors

51 and 52 via the conductive bonding material 4 and the notch portion NT1 and the electrode non-forming portion PE via the insulating bonding material 5 are mounted on the mounting board. The step of bonding to 201 can be performed at the same time. Therefore, the process of mounting electronic components on the mounting board can be simplified.

The electronic component 101 according to the present embodiment is manufactured by, for example, the following process. FIG. 5 is a cross-sectional view sequentially illustrating the manufacturing process of the electronic component 101.

First, as shown in (1) in FIG. 5, the conductor 21 is formed on the insulating base material layer 11 in the aggregate substrate state. Specifically, a conductor 21 is formed by laminating a metal foil (for example, Cu foil) on one main surface of the insulating base material layer 11 and patterning the metal foil by photolithography. The insulating base material layer 11 is a thermoplastic resin sheet such as a liquid crystal polymer.

Next, the coil conductor 31 and the conductor 22 are formed on the insulating base material layer 12 in the aggregate substrate state. Specifically, the coil conductor 31 and the conductor 22 are formed by laminating a metal foil (for example, Cu foil) on one main surface of the insulating base material layer 12 and patterning the metal foil by photolithography. The insulating base layer 12 is a thermoplastic resin sheet such as a liquid crystal polymer.

This step of forming a coil conductor on an insulating base layer (one or more insulating base layers among a plurality of insulating base layers) is an example of the “conductor forming step” in the present invention.

Further, the mounting electrodes P1 and P2 are formed on the surface of the insulating base material layer 13 in the aggregate substrate state (the surface of the insulating base material layer that becomes the first main surface VS1 after forming the insulating base material 10). Specifically, the mounting electrodes P1 and P2 are formed by laminating a metal foil (for example, Cu foil) on one side main surface of the insulating base material layer 13 in the aggregate substrate state and patterning the metal foil by photolithography. To do. Thereby, the electrode expense formation area (PE) in which the mounting electrodes P1 and P2 are not formed is formed in the surface of the insulating base material layer that becomes the first main surface VS1 after the insulating base material 10 is formed. As described above, the electrode non-forming portion (PE) is a portion where the insulating bonding material is in contact with the electronic component mounted on the mounting substrate. The insulating base layer 13 is a thermoplastic resin sheet such as a liquid crystal polymer.

A mounting electrode is formed on the surface of the insulating base material layer that becomes the first main surface of the insulating base material (at the same time, no mounting electrode is formed among the surfaces of the insulating base material layer that becomes the first main surface of the insulating base material). This step (forming the electrode non-forming portion PE) is an example of the “electrode forming step” in the present invention.

In addition, interlayer connection conductors (interlayer connection conductors V22, V23, V32, and V33 in FIG. 1B) are formed on the plurality of insulating base material layers 11, 12, and 13 in addition. The interlayer connection conductor is provided with a conductive paste containing one or more of Cu, Ag, Sn, Ni, Mo or the like or an alloy thereof after providing a through hole with a laser or the like, It is provided by curing in the “base material forming step”) of the invention. Therefore, the interlayer connection conductor is made of a material having a melting point lower than the temperature at the time of subsequent heating and pressurization.

Next, the insulating base material layers 11, 12, and 13 are laminated in this order, and the insulating base material 10 B is formed by heating and pressing (collective pressing) the plurality of laminated insulating base material layers 11, 12, and 13.

This step of forming an insulating base material by heating and pressing a plurality of laminated insulating base material layers after the “conductor forming step” is an example of the “base material forming step” in the present invention.

After the above process, the insulating base material 10B in the aggregated substrate state is separated into individual pieces (insulating base material 10A) along the separation line DL shown in (2) in FIG.

Next, as shown in (3) in FIG. 5, the notch NT1 is formed by grinding the vicinity of the outer edge E1 of the first main surface VS1 of the insulating base 10A with a laser. Specifically, the notch NT1 is formed by grinding the vicinity of the outer edge E1 of the first main surface VS1 with a laser over the entire circumference. Thereby, the electronic component 101 shown in (4) in FIG. 5 is obtained.

When mounting on a mounting board using a conductive bonding material and an insulating bonding material by the above manufacturing method, the bonding reliability to the mounting board is increased without increasing the mounting area of the electronic component including the insulating bonding material. Elevated electronic components can be easily manufactured.

In this embodiment, the insulating base layer is made of a thermoplastic resin. According to the above manufacturing method, since the insulating base material 10A can be easily formed by collectively pressing the laminated insulating base material layers 11, 12, and 13, the man-hours for the manufacturing process of the insulating base material are reduced, Cost can be kept low.

In the present embodiment, an example in which the “electrode forming step” is performed before the “base material forming step” is shown, but the present invention is not limited to this configuration. The “electrode forming step” may be performed after the “base material forming step”. That is, in the “electrode forming step” in the present invention, the mounting electrodes P1 and P2 may be formed on the first main surface VS1 of the insulating base material 10 after the “base material forming step”.

<< Second Embodiment >>
In 2nd Embodiment, it shows about the example from which the shape of an insulation base material differs from 1st Embodiment.

6A is a cross-sectional view of the electronic component 102 according to the second embodiment, and FIG. 6B is an enlarged view of the DP2 portion in FIG. 6A.

The electronic component 102 is different from the electronic component 101 according to the first embodiment in the shape of the insulating base material. Other configurations are substantially the same as those of the electronic component 101.

The electronic component 102 includes an insulating base material 10C having a first main surface VS1, an end surface SS, and a second main surface VS2, a coil 3 formed on the insulating base material 10C, and a mounting electrode formed on the first main surface VS1. P1 and P2 and the uneven | corrugated | grooved part RP are provided. The end surface SS is a surface connected to the first main surface VS1.

The insulating base material 10C is a trapezoidal column made of a thermoplastic resin in which the area of the first main surface VS1 is smaller than the area of the second main surface VS2. In other words, the insulating base material 10C is formed in a tapered shape from the second main surface VS2 toward the first main surface VS1 (+ Z direction). Therefore, in the electronic component 102, the area of the first main surface VS1 is different from the area of the first main surface VS1 in the cross section (cross section of the XY plane) parallel to the first main surface VS1, and the first main surface VS1. It is smaller than the cross section closest to the surface VS1 (for example, in the insulating base material 10C shown in FIG. 6A, the cross section parallel to the XY plane in the −Z direction than the first main surface VS1).

Further, an uneven portion RP is formed in the electrode non-forming portion PE of the electronic component 102 (the portion of the first main surface VS1 where the mounting electrodes P1 and P2 are not formed). The uneven part RP is a groove formed in the electrode non-forming part PE by laser irradiation or the like.

Next, a state where the electronic component 102 is mounted on the mounting substrate using the conductive bonding material and the insulating bonding material will be described with reference to the drawings. FIG. 7 is a cross-sectional view illustrating a main part of the electronic device 302 according to the second embodiment.

The electronic device 302 includes an electronic component 102, a mounting substrate 201, and the like. The mounting substrate 201 is the same as that described in the first embodiment.

The

conductors

51 and 52 are connected to the mounting electrodes P1 and P2 through the conductive bonding material 4, respectively. Part of the end surface SS and the electrode non-forming portion PE are bonded to the mounting substrate 201 via the insulating bonding material 5.

The electronic component 102 according to the present embodiment has the following effects in addition to the effects described in the first embodiment.

(C) In this embodiment, the uneven | corrugated | grooved part RP formed in the electrode non-formation part PE is provided. In this configuration, since the surface area of the electrode non-forming part PE in contact with the insulating bonding material 5 in the mounting state on the mounting substrate 201 is larger than when the uneven part RP is not formed in the electrode non-forming part PE, The bonding strength between the insulating base material 10C and the insulating bonding material 5 is further increased.

As shown in this embodiment, the shape of the insulating base material may be a trapezoidal column in which the area of the first main surface VS1 is smaller than the area of the second main surface VS2. The shape of the insulating base material in the present invention is such that the area of the first main surface VS1 is different from the area of the first main surface VS1 in the cross section parallel to the first main surface VS1, and the first main surface If the configuration smaller than the area of the cross section closest to VS1 is satisfied, it can be changed as appropriate.

The electronic component 102 according to the present embodiment is manufactured by, for example, the following process. FIG. 8 is a cross-sectional view sequentially illustrating the manufacturing process of the electronic component 102. In addition, about the same thing as the manufacturing process demonstrated using FIG. 5, description of a specific manufacturing process is abbreviate | omitted.

First, as shown in (1) in FIG. 8, the conductor 21 is formed on the insulating base layer 11, the coil conductor 31 and the conductor 22 are formed on the insulating base layer 12, and the mounting electrode is formed on the insulating base layer 13. P1 and P2 are formed ("conductor formation process" and "electrode formation process").

Next, the insulating base material layers 11, 12, and 13 are laminated in this order, and the insulating base material layers 10 B are formed by heating and pressurizing the plurality of laminated insulating base material layers 11, 12, and 13 (“base material forming step”). ").

Next, as shown in (2) in FIG. 8, individual pieces (insulating bases) are ground by laser LR along the separating line DL from the first main surface VS1 side of the insulating base material 10B in the aggregated substrate state. Material 10D). By this step, the insulating base 10D is formed in a tapered shape from the second main surface VS2 toward the first main surface VS1 (+ Z direction) as shown in (3) in FIG.

This step of separating the insulating base material into individual pieces by grinding with a laser from the first main surface side after the “base material forming step” is an example of the “separation step” in the present invention.

Next, as shown in (3) in FIG. 8, the uneven portion RP is formed in the electrode non-forming portion PE. The uneven part RP is formed by, for example, irradiating the electrode non-forming part PE with a laser from the first main surface VS1 side. The area of the hole formed by the laser decreases from the laser irradiation surface toward the opposite surface. Therefore, by using this, a taper can be formed simply by irradiating a laser.

<< Third Embodiment >>
In the third embodiment, an example in which the shape of the coil is different from those in the first and second embodiments will be described.

FIG. 9A is a cross-sectional view of the electronic component 103 according to the third embodiment, and FIG. 9B is an exploded plan view of the electronic component 103.

The electronic component 103 is different from the electronic component 101 according to the first embodiment in the shape of the coil. The electronic component 103 is different from the electronic component 101 in the shape of the notch. Other configurations are substantially the same as those of the electronic component 101.

The electronic component 103 includes an insulating base material 10E having a first main surface VS1 and a second main surface VS2, a coil 3A (described in detail later) formed on the insulating base material 10E, mounting electrodes P1 and P2, Is provided.

As shown in FIGS. 9A and 9B, the insulating base material 10E has a notch NT2 formed at the outer edge of the first main surface VS1. Cutout portion NT2 is in the vicinity of the first side (the right side of insulating base layer 13 in FIG. 9B) and the second side (the left side of insulating base layer 13 in FIG. 9B) of first main surface VS1. Is formed. The cross-sectional shape of the notch NT2 is C-shaped.

As shown in FIG. 9B, the insulating base material 10E is formed by laminating a plurality of insulating base material layers 11, 12, and 13 made of a thermoplastic resin in this order.

A coil conductor 31 is formed on the surface of the insulating base material layer 11. The coil conductor 31 is a rectangular loop-shaped conductor of about one turn that is wound along the outer shape of the insulating base material layer 11.

The coil conductor 32 and the conductor 22 are formed on the surface of the insulating base layer 12. The coil conductor 32 is a rectangular loop-shaped conductor that is disposed near the center of the insulating base material layer 12 and is wound around the center of the insulating base material layer 12. The outer diameter of the coil conductor 32 is smaller than the outer diameter of the coil conductor 31 formed on the insulating base material layer 11. The conductor 22 is an I-shaped conductor that is disposed near the second corner of the insulating base layer 12 (the upper left corner of the insulating base layer 12 in FIG. 9B) and extends in the X-axis direction.

Two mounting electrodes P1 and P2 are formed on the surface of the insulating base layer 13.

As shown in FIG. 9B, the mounting electrode P1 is connected to the first end of the coil conductor 32 via an interlayer connection conductor V33 formed on the insulating base layer 13. The second end of the coil conductor 32 is connected to the first end of the coil conductor 31 via an interlayer connection conductor V32 formed on the insulating base layer 12. The second end of the coil conductor 31 is connected to the first end of the conductor 22 via an interlayer connection conductor V22 formed in the insulating base layer 12. A second end of the conductor 22 is connected to the mounting electrode P 2 via an interlayer connection conductor V 23 formed on the insulating base material layer 13.

As described above, in the electronic component 103, the rectangular shape of about two turns including the

coil conductors

31 and 32 formed on two or more insulating base layers 11 and 12 among the plurality of insulating base layers 11, 12 and 13. A spiral coil 3A is formed. Both ends of the coil 3A are connected to the mounting electrodes P1 and P2, respectively.

The outer shape of the coil 3A according to the present embodiment is an inverted cone shape with respect to the first main surface VS1, which is the mounting surface, as shown in FIG. More specifically, the coil conductor 32 close to the first main surface VS1 among the plurality of

coil conductors

31, 32 has a smaller outer diameter and a shorter line length than the coil conductor 31 far from the first main surface VS1. Therefore, the coil conductor 32 close to the first main surface VS1 has a smaller conductor area than the coil conductor 31 far from the first main surface VS1.

Next, a state in which the electronic component 103 is mounted on the mounting substrate using the conductive bonding material and the insulating bonding material will be described with reference to the drawings. FIG. 10 is a cross-sectional view illustrating a main part of an electronic device 303 according to the third embodiment.

The electronic device 303 includes an electronic component 103, a mounting board 203, and the like. The mounting substrate 203 is a multilayer substrate, for example.

The mounting substrate 203 is different from the mounting substrate 201 according to the first embodiment in that

conductors

53 and 54 are formed inside. The

conductors

51 and 52 are connected to the mounting electrodes P1 and P2 through the conductive bonding material 4, respectively. The electrode non-forming part PE and the notch part NT2 of the electronic component 103 are bonded to the mounting substrate 203 via the insulating bonding material 5.

The electronic component 103 according to the present embodiment has the following effects in addition to the effects described in the first embodiment.

(A) In the present embodiment, the coil 3 A is configured to include the

coil conductors

31 and 32 respectively formed on the two or more insulating base material layers 11 and 12. With this configuration, an electronic component including a coil having a predetermined number of turns and an inductance can be realized.

(B) In the present embodiment, the outer diameter and line length of the coil conductor 32 close to the first main surface VS1 among the plurality of

coil conductors

31 and 32 are the outer shape and line length of the coil conductor 31 far from the first main surface VS1. Smaller than. That is, the coil conductor 32 having a relatively small conductor area is arranged on the first main surface VS1 side which is a mounting surface. Therefore, the

conductors

53, 54 and the like formed on the mounting board are compared with the case where the electronic component in which the coil conductor 31 having a larger conductor area than the coil conductor 32 is arranged on the first main surface VS1 side is mounted on the mounting board. The stray capacitance generated between the coil and the coil (refer to the capacitor symbol in FIG. 10) is suppressed.

Furthermore, when the electronic component 103 having this configuration is mounted on the mounting board 203, a gap between the coil conductor 31 having a relatively large outer shape and line length and the conductor formed on the mounting board is increased. Therefore, even when the insulating bonding material 5 having a dielectric constant higher than that of the insulating base material is bonded (filled) to the notch NT2, the stray capacitance generated between the coil 3A and the conductor formed on the mounting substrate is reduced. The increase is suppressed. In addition, with this configuration, it is possible to reduce the change in stray capacitance that occurs between the coil 3A and the conductor formed on the mounting board due to the change in the amount of the insulating bonding material 5 that fills the notch NT2. (C) Further, in the above configuration, the notch portion NT2 is formed on the outer edge portion of the first main surface VS1 along the outer shape of the coil (see the outer shape line OF of the coil 3A in FIG. 10). There are few restrictions by the external shape (especially arrangement | positioning of the coil conductor with respect to an insulating base material) of the coil at the time of forming a notch part. Therefore, with this configuration, the degree of freedom in design (number, depth, shape, size, etc.) of the notch formed in the outer edge portion of the first main surface VS1 is increased.

<< Fourth Embodiment >>
In the fourth embodiment, a manufacturing method different from the manufacturing method of the electronic component shown in the first embodiment will be described.

FIG. 11 is a plan view showing a main part of the insulating base material layer 13A in the aggregate substrate state.

The surface of the insulating base material layer 13A shown in FIG. 11 is a surface that becomes the first main surface after forming the insulating base material. The insulating base material according to this embodiment is configured by laminating the insulating base material layers 11, 12, and 13A shown in FIG. 12 in this order, and heating and pressurizing the laminated insulating base material layers 11, 12, and 13A. The

As shown in FIG. 11, holes SL1 and SL2 are formed in the insulating base material layer 13A. The hole SL1 is formed along the separation line DL1 (X-axis direction) for separating the insulating base material in the aggregate substrate state into electronic components (pieces) after the “base material forming step”, and the insulating base material layer It is a through-hole reaching from 13A to the back surface. The hole SL2 is formed along the separation line DL2 (Y-axis direction) for separating the insulating base material in the aggregate substrate state into electronic components (pieces) after the “base material forming step”, and the insulating base material layer It is a through-hole reaching from 13A to the back surface. The holes SL1 and SL2 are formed, for example, by grinding the insulating base material layer 13A with a laser.

Next, a method for manufacturing an electronic component using the insulating base layer 13A will be described with reference to the drawings. FIG. 12 is a cross-sectional view sequentially illustrating manufacturing steps of the electronic component 104 according to the fourth embodiment. In addition, about the same thing as the manufacturing process demonstrated using FIG. 5 and FIG. 8, description of a specific manufacturing process is abbreviate | omitted.

First, as shown in (1) of FIG. 12, the conductor 21 is formed on the insulating base layer 11, the coil conductor 31 and the conductor 22 are formed on the insulating base layer 12, and the mounting electrode is formed on the insulating base layer 13A. P1 and P2 are formed ("conductor formation process" and "electrode formation process"). Note that holes (SL1, SL2) are formed in the insulating base layer 13A, and holes (SL1, SL2) are not formed in the insulating base layers 11, 12.

Next, the insulating base material layers 11, 12, 13A are laminated in this order, and the insulating base material 10D is formed by heating and pressurizing the plurality of laminated insulating base material layers 11, 12, 13A (“base material forming step”). "). At this time, a notch NT3 is formed in the first main surface VS1 of the insulating base 10D.

After the above process, as shown in (2) and (3) in FIG. 12, along the separation line DL2 (and the separation line DL1 shown in FIG. 11), the insulating base material 10D in the collective substrate state is separated into individual pieces. Separated into (electronic component 104).

As shown in the above manufacturing process, between the “conductor forming process” and the “base material forming process”, one or more insulating base material layers adjacent to the first main surface among the plurality of insulating base material layers In addition, there may be a step of forming a hole to be a notch portion in advance (after the “base material forming step”).

In the present embodiment, the example in which the holes SL1 and SL2 are formed only in the insulating base material layer 13A having the surface to be the first main surface of the insulating base material is shown, but the present invention is not limited to this configuration. . The holes SL1 and SL2 may be formed not only in the insulating base material layer 13A but also in the insulating base material layer 12 and the like. In addition, holes may be formed in the insulating base material layer 12 without forming holes in the insulating base material layer 13A. In this case, the insulating base layer 11, the insulating base layer 12 with holes formed therein, and the insulating base layer 13 A with no holes formed thereon are laminated and heated to press the insulating base layer during heating and pressurization. 13 A of material layers deform | transform and a groove | channel (notch part) is formed in the 1st main surface of an insulating base material. Further, the holes SL1 and SL2 may be grooves formed from the surface of the insulating base material layer 13A toward the inside instead of the through holes.

<< Fifth Embodiment >>
In the fifth embodiment, a diaphragm that vibrates by electromagnetic force will be described.

FIG. 13A is a perspective view of a diaphragm 405 according to the fifth embodiment, and FIG. 13B is an exploded perspective view of the diaphragm 405. 14A is a plan view of the diaphragm 405, and FIG. 14B is a cross-sectional view taken along the line AA in FIG. In FIGS. 13A and 14A, the support portions FP1 and FP2 are indicated by dot patterns in order to make the structure easy to understand.

The diaphragm 405 includes a first main surface VS1 and an insulating base material 10H having a second main surface VS2 facing the first main surface VS1, and a coil 3B (described in detail later) formed on the insulating base material 10H. Mounting electrodes P1 and P2 formed on the first main surface VS1.

The insulating substrate 10H is a substantially rectangular parallelepiped of thermoplastic resin whose longitudinal direction coincides with the X-axis direction. The insulating base material 10H includes a vibration part VP that vibrates by electromagnetic force, and support parts FP1 and FP2 that are fixed to other members (a casing 70 described in detail later). The vibration part VP is located in the center in the longitudinal direction of the insulating base material 10H, and the support parts FP1 and FP2 are located at both ends in the longitudinal direction of the insulating base material 10H. The support part FP1, the vibration part VP, and the support part FP2 are arranged in order along the X-axis direction.

As shown in FIGS. 13A and 14, the widths of the support portions FP1 and FP2 in the Y-axis direction are narrower than the width of the vibrating portion VP in the Y-axis direction. Further, the insulating base material 10H has a cutout portion NT4 formed in the outer edge portion of the support portions FP1 and FP2 in the first main surface VS1. Cutout portion NT4 is formed by grinding the vicinity of the outer edge portion of first main surface VS1 of support portions FP1 and FP2 with a laser.

As shown in FIG. 13B, the insulating base material 10H is formed by laminating a plurality of insulating base material layers 11, 12, 13, and 14 made of thermoplastic resin in this order. The insulating base layers 11, 12, 13, and 14 are flat plates each having a substantially rectangular planar shape, and the longitudinal direction coincides with the X-axis direction. The insulating base material layers 11, 12, 13, and 14 are sheets mainly made of a liquid crystal polymer (LCP), for example.

The coil conductor 31b is formed on the surface of the insulating base material layer 11. The coil conductor 31 b is a meander line-shaped conductor formed along the longitudinal direction of the insulating base material layer 11.

The coil conductor 32b and the conductor 22 are formed on the surface of the insulating base material layer 12. The coil conductor 32 b is an L-shaped conductor formed along the outer periphery of the insulating base material layer 12. The conductor 22 is a rectangular conductor disposed at a position near the first side (the right side of the insulating base layer 12 in FIG. 13B) from the center of the insulating base layer 12.

The coil conductor 33 b and the conductor 23 are formed on the surface of the insulating base layer 13. The coil conductor 33 b is a meander line-shaped conductor formed along the longitudinal direction of the insulating base material layer 13. The conductor 23 is a rectangular conductor disposed at a position near the first side (the right side of the insulating base layer 13 in FIG. 13B) from the center of the insulating base layer 13.

Two mounting electrodes P1 and P2 are formed on the surface of the insulating base layer 14. The mounting electrode P 1 is arranged near the center of the first side of the insulating base layer 14 (the right side of the insulating base layer 14 in FIG. 13B), and extends linearly along the longitudinal direction of the insulating base layer 14. Conductor. The mounting electrode P2 is arranged in the vicinity of the center of the second side of the insulating base layer 14 (the left side of the insulating base layer 14 in FIG. 13B) and extends along the longitudinal direction of the insulating base layer 14 Conductor.

As shown in FIG. 13B, the mounting electrode P1 is connected to the coil conductor 31b through the

conductors

22 and 23 and the interlayer connection conductors V22, V23, and V24 formed on the insulating base layers 12, 13, and 14. Connected to one end. The second end of the coil conductor 31b is connected to the first end of the coil conductor 32b via an interlayer connection conductor V32 formed in the insulating base material layer 12. The second end of the coil conductor 32b is connected to the first end of the coil conductor 33b via an interlayer connection conductor V33 formed in the insulating base layer 13. A second end of the coil conductor 33b is connected to the mounting electrode P2 via an interlayer connection conductor V35 formed on the insulating base layer 14.

Thus, in the diaphragm 405, the coil 3B is configured including the

coil conductors

31b, 32b, 33b and the interlayer connection conductors V32, V33 formed on the insulating base material layers 11, 12, 13 respectively. The coil 3B is formed inside the insulating base 10H, and both ends of the coil 3B are connected to the mounting electrodes P1 and P2, respectively.

The area of the first main surface VS1 is different from the area of the first main surface VS1 in the cross section parallel to the first main surface VS1 (the cross section of the XY plane), and is the cross section closest to the first main surface VS1 ( For example, in the insulating base material 10H shown in FIG. 14B, the area is smaller than the area of the first main surface VS1 and a cross section parallel to the XY plane in the −Z direction.

Next, an electronic device including a diaphragm will be described with reference to the drawings. FIG. 15A is an exploded perspective view of the vibration device 505 according to the fifth embodiment, and FIG. 15B is a cross-sectional view of the vibration device 505.

The vibration device 505 includes a vibration plate 405, a housing 70, and the like. On the first surface S1 of the housing 70, a recess 70CA and connection conductor patterns LP1, LP2 are formed. A plurality of magnets 8 are arranged inside the recess 70CA.

As shown in FIG. 15, the vibration plate 405 is placed on the housing 70 with the first main surface VS 1 side facing the first surface S 1 side of the housing 70. A support portion is attached to the upper surface of the housing 70. Specifically, the mounting electrode P 1 is connected to the connection conductor pattern LP 1 through the conductive bonding material 4. Further, the mounting electrode P2 is connected to the connection conductor pattern LP2 through the conductive bonding material 4. Further, the joints (the first main surface VS1 side of the support portions FP1 and FP2 and the cutout portion NT4) of the diaphragm 405 are connected to the first surface S1 of the housing 70 via the insulating joint material 5. .

In this embodiment, the elastic modulus of the conductive bonding material 4 (for example, the elastic modulus of solder (Sn-3Ag-0.5Cu): 41.6 GPa) is equal to the elastic modulus of the insulating bonding material 5 (20 GPa to 25 GPa). ) And the elastic modulus of the insulating base material 10H (for example, the elastic modulus of an insulating base material made of LCP: 12 GPa to 14 GPa). By using the insulating bonding material 5 having an elastic modulus intermediate between the conductive bonding material and the insulating base material, the diaphragm can be made difficult to peel from other members as will be described in detail later.

The plurality of magnets 8 are arranged so that the south and north poles are alternately opposed between the conductor patterns of the

coil conductors

31b and 33b. The housing 70 includes terminals (not shown) that are electrically connected to the connection conductor patterns LP1 and LP2. When the vibration device 508 according to this embodiment is incorporated in an electronic device, this terminal is connected to a circuit of the electronic device. When a drive current flows through the connection conductor patterns LP1 and LP2 to the

coil conductors

31b, 32b, and 33b of the vibration plate 405, the vibration portion VP of the vibration plate 405 vibrates in the direction indicated by the white arrow in FIG. To do.

Next, as a comparative example, a vibration device in which a diaphragm not having a notch is fixed to a housing will be described. FIG. 16 is a cross-sectional view of a vibration device 500 as a comparative example.

The vibration device 500 includes a diaphragm 400, a housing 70, and the like. The diaphragm 400 is different from the diaphragm 405 in that it does not have a notch, and other configurations are the same as the diaphragm 405. Only the first main surface VS1 side of the support portions FP1 and FP2 of the diaphragm 400 is bonded to the housing 70 via the insulating bonding material 5.

On the other hand, in the diaphragm 405, as shown in FIG. 15B, the first main surface VS1 side of the support portions FP1 and FP2 and the cutout portion NT4 are joined to the housing 70 via the insulating joining material 5. The Therefore, compared with the case where only the first main surface VS1 side of the support portions FP1 and FP2 illustrated in FIG. 16 is bonded to the housing 70 via the insulating bonding material 5, the area in contact with the insulating bonding material 5 is large. Thus, the bonding strength between the diaphragm (insulating base material) and the insulating bonding material 5 is increased.

According to this embodiment, the following effects can be obtained.

(A) When the vibration plate 405 repeatedly vibrates, stress is generated at the interface between the support portions FP1 and FP2 of the insulating base material 10H and the casing 70, and peeling occurs at the interface between the insulating base material 10H and the insulating bonding material 5. Is likely to occur. In the present embodiment, not only the first main surface VS1 side of the support portions FP1 and FP2, but also the notch portion NT4 is bonded to the housing 70 via the insulating bonding material 5. Therefore, compared with the case where only the first main surface VS1 side of the support portions FP1 and FP2 is bonded to the housing 70 via the insulating bonding material 5, the bonding portion (the insulating base material 10H and the insulating bonding material 5 are separated from each other). The surface area of the contact portion) increases, and the bonding strength between the insulating base material 10H and the insulating bonding material 5 increases. Therefore, with this configuration, it is possible to realize a diaphragm that suppresses the separation of the interface between the insulating base material 10H and the insulating bonding material 5.

(B) When the diaphragm vibrates, stress is applied to the joint portion of the support portions FP1 and FP2. When the diaphragm is bonded to another member (housing 70) with only the conductive bonding material 4, there is a large difference in physical properties between the insulating base material and the conductive bonding material (the elastic modulus and the conductivity of the insulating base material). Since the elastic modulus of the bonding material is greatly different), stress concentrates on the interface between the mounting electrodes P1 and P2 of the vibration plate and the conductive bonding material during vibration, and the vibration plate is easily separated from other members. On the other hand, in the present embodiment, the insulating bonding material 5 having an intermediate elastic modulus between the conductive bonding material and the insulating base material is used for bonding the vibration plate to other members, whereby the mounting electrodes P1, The stress applied to the interface between P2 and the conductive bonding material 4 is dispersed. Therefore, with this configuration, it is possible to suppress peeling of the diaphragm from other members during vibration.

(C) Moreover, in this embodiment, the width | variety of the Y-axis direction of support part FP1, FP2 is narrower than the width | variety of the Y-axis direction of the vibration part VP. With this configuration, the flexibility of the support parts FP1 and FP2 is increased, and the vibration part VP is easily vibrated by electromagnetic force, so that a diaphragm with a large amplitude can be realized. In addition, when the widths of the support portions FP1 and FP2 are narrower than the width of the vibration portion VP, it is difficult to ensure the bonding strength between the insulating base material and the insulating bonding material 5. However, the insulating base material and the insulating bonding material 5 are in contact with each other by bonding the first main surface VS1 side of the support portions FP1 and FP2 and the notch NT4 to the housing 70 via the insulating bonding material 5. The surface area of the portion is increased, and the bonding strength between the insulating base material and the insulating bonding material 5 can be increased.

Moreover, in this embodiment, since the insulating base material 10H is formed by laminating a plurality of insulating base material layers 11, 12, 13, and 14 in this order, it is supported as compared with the case where the number of insulating base material layers is small. The strength of the parts FP1, FP2 is ensured.

(C) In the present embodiment, since the

coil conductors

31b, 32b, and 33b formed on the plurality of insulating base material layers 11, 12, and 13 are provided, a diaphragm with high electromagnetic force can be realized while being small. Further, since the

coil conductors

31b and 33b overlap each other when viewed from the Z-axis direction, the density of the current path of the coil conductor contributing to the electromagnetic force is increased.

In the present embodiment, the insulating base material 10H in which the cutout portion NT4 is formed in the outer edge portion of the support portions FP1 and FP2 in the first main surface VS1 is shown, but the present invention is not limited to this configuration. . Of the cross section (cross section of the XY plane) parallel to the first main surface VS1, the area of the first main surface VS1 is different from the area of the first main surface VS1, and is the cross section closest to the first main surface VS1. A configuration smaller than the area may be satisfied. That is, the outer edge portion of the support portion of the insulating base material may be formed in a tapered shape from the second main surface VS2 of the insulating base material toward the first main surface VS1 (in the + Z direction).

Moreover, in this embodiment, although the insulating base material 10H showed the example which has the two support parts FP1 and FP2, it is not limited to this structure. The number of support portions can be changed as appropriate within the range where the functions and effects of the present invention are exhibited, and may be, for example, one or three or more.

<< Sixth Embodiment >>
In the sixth embodiment, an example of a diaphragm having four support portions is shown.

FIG. 17 is an exploded perspective view of the vibration device 506 according to the sixth embodiment. In FIG. 17, in order to make the structure easy to understand, the support portions FP1, FP2, FP3, and FP4 are shown as dot patterns.

The vibration device 506 includes a vibration plate 406, a housing 70, and the like. The diaphragm 406 includes an insulating base material 10K having a first main surface VS1, coils (not shown) formed on the insulating base material 10K, and mounting electrodes formed on the first main surface VS1.

The insulating base material 10K is different from the insulating base material 10H according to the fifth embodiment in that the insulating base material 10K further includes support portions FP3 and FP4 fixed to other members (housing 70). About another structure, it is the same as the insulating base material 10H.

Hereinafter, parts different from the diaphragm 405 and the vibration device 505 according to the fifth embodiment will be described.

The support parts FP3 and FP4 are located at both ends in the short direction (Y-axis direction) of the insulating base material 10K. The support part FP3, the vibration part VP, and the support part FP4 are arranged in order along the Y-axis direction. As shown in FIG. 17, the width in the X-axis direction of the support portions FP3 and FP4 is narrower than the width in the X-axis direction of the vibration portion VP.

As shown in FIG. 17, the vibration plate 406 is placed on the housing 70 with the first main surface VS 1 side facing the first surface S 1 side of the housing 70. Support portions FP1, FP2, FP3, and FP4 are attached to the upper surface of housing 70. The joint portion of the diaphragm 406 (the first main surface VS1 side of the support portions FP1, FP2, FP3, and FP4 and the cutout portion NT4) is connected to the first surface S1 of the housing 70 via the insulating joint material 5. Is done.

The vibration device 506 according to the present embodiment has the following effects in addition to the effects described in the fifth embodiment.

(A) The insulating base material 10K according to the present embodiment is provided at both ends in the short direction (Y-axis direction) in addition to the support portions FP1 and FP2 located at both ends in the longitudinal direction (X-axis direction) of the insulating base material 10K. It has the support parts FP3 and FP4 which are located. With this configuration, when the vibration plate 405 vibrates, twisting of the insulating base material 10K (for example, twisting about the X-axis direction) is suppressed, and vibration characteristics of the vibration plate are further stabilized.

In the present embodiment, an example in which the notch portion NT4 is formed only in the support portion (support portions FP1 and FP2) in which the mounting electrodes P1 and P2 are formed on the first main surface VS1 is shown. It is not limited to. The notch portions may not be formed in all the support portions, and may be formed in the support portions (the support portions FP3 and FP4 in the present embodiment) in which the mounting electrode is not formed on the first main surface VS1. Good. Further, the outer edge portion of the support portion (support portions FP3, FP4) where the mounting electrode is not formed is tapered from the second main surface VS2 of the insulating base toward the first main surface VS1 (toward the + Z direction). It may be formed.

<< Seventh Embodiment >>
In the seventh embodiment, an example of a diaphragm including an electronic component and a support film is shown.

FIG. 18A is a cross-sectional view of the electronic component 107 according to the seventh embodiment, and FIG. 18B is an exploded perspective view of the electronic component 107.

The electronic component 107 includes a first main surface VS1 and an insulating base material 10L having a second main surface VS2 facing the first main surface VS1, and a coil 3C (described in detail later) formed on the insulating base material 10L. Mounting electrodes P1 and P2 formed on the first main surface VS1.

The insulating base 10L is a substantially rectangular parallelepiped made of a thermoplastic resin whose longitudinal direction coincides with the X-axis direction. Insulating base material 10L has notch NT5 formed over the perimeter of the outer edge part of 1st main surface VS1. As shown in FIG. 18A, the cross-sectional shape of the notch NT5 is L-shaped.

As shown in FIG. 18B, the insulating base material 10L is configured by laminating a plurality of insulating base material layers 11, 12, 13, and 14 made of a thermoplastic resin in this order. Each of the plurality of insulating base material layers 11, 12, 13, and 14 is a flat plate having a rectangular planar shape, and the longitudinal direction coincides with the X-axis direction.

A coil conductor 31 c is formed on the surface of the insulating base material layer 11. The basic configuration of the coil conductor 31c is substantially the same as the coil conductor 31b described in the fifth embodiment.

The coil conductor 32c and the conductor 22 are formed on the surface of the insulating base material layer 12. The basic configuration of the coil conductor 32c and the conductor 22 is substantially the same as that of the coil conductor 32b and the conductor 22 described in the fifth embodiment.

The coil conductor 33 c and the conductor 23 are formed on the surface of the insulating base material layer 13. The basic configuration of the coil conductor 33c and the conductor 23 is substantially the same as that of the coil conductor 33c and the conductor 23 described in the fifth embodiment.

Two mounting electrodes P1 and P2 are formed on the surface of the insulating base layer 14. The mounting electrode P1 is a rectangular conductor arranged near the center of the first side of the insulating base layer 14 (the right side of the insulating base layer 14 in FIG. 18B). The mounting electrode P2 is a rectangular conductor disposed near the center of the second side of the insulating base layer 14 (the left side of the insulating base layer 14 in FIG. 18B).

As shown in FIG. 18B, the mounting electrode P1 is connected to the coil conductor 31c through the

conductors

22 and 23 and the interlayer connection conductors V22, V23, and V24 formed on the insulating base layers 12, 13, and 14. Connected to one end. The second end of the coil conductor 31c is connected to the first end of the coil conductor 32c via an interlayer connection conductor V32 formed in the insulating base material layer 12. The second end of the coil conductor 32c is connected to the first end of the coil conductor 33c via an interlayer connection conductor V33 formed in the insulating base material layer 13. A second end of the coil conductor 33c is connected to the mounting electrode P2 via an interlayer connection conductor V35 formed on the insulating base layer 14.

Thus, in the electronic component 107, the coil C is configured including the

coil conductors

31c, 32c, 33c and the interlayer connection conductors V32, V33 formed on the insulating base material layers 11, 12, 13 respectively. The coil 3C is formed inside the insulating base 10L, and both ends of the coil 3D are connected to the mounting electrodes P1 and P2, respectively.

The area of the first main surface VS1 is different from the area of the first main surface VS1 in the cross section parallel to the first main surface VS1 (the cross section of the XY plane), and is the cross section closest to the first main surface VS1 ( For example, it is smaller than the area of the XY plane on the −Z direction side than the notch NT5.

Next, a diaphragm including an electronic component and a support film will be described with reference to the drawings. FIG. 19A is a perspective view of a diaphragm 407 according to the seventh embodiment, and FIG. 19B is an exploded perspective view of the diaphragm 407. FIG. 20 is a cross-sectional view of the diaphragm 407.

The diaphragm 407 includes the electronic component 107 according to the present embodiment, the support film 9, and the like.

The support film 9 is a rectangular insulating sheet having flexibility and having a longitudinal direction coinciding with the X-axis direction, and has a first surface FS1. The thickness of the support film 9 (the thickness in the Z-axis direction) is thinner than the thickness of the insulating base 10L. Therefore, the flexibility of the support film 9 is high. Further, the first surface FS1 of the support film 9 is larger than the first main surface VS1 of the insulating base material 10L included in the electronic component 107. The support film 9 is, for example, a polyether ether ketone (PEEK) film. In addition, the elasticity of the support film 9 made of PEEK (4.2 GPa) is lower than the elasticity of the insulating base material 10L made of LCP (13.3 GPa), so that the flexibility of the support film 9 is further increased.

The electronic component 107 is fixed (mounted) to the support film 9 with the first main surface VS1 of the insulating base 10L facing the first surface FS1 of the support film 9.

Wiring conductors

61 and 62 are formed on the first surface FS1 of the support film 9. The wiring conductor 61 is a linear conductor that is disposed near the center of the first side of the support film 9 (the right side of the support film 9 in FIG. 19B) and extends in the X-axis direction. The wiring conductor 62 is a linear conductor that is disposed near the center of the second side of the support film 9 (the left side of the support film 9 in FIG. 10B) and extends in the X-axis direction. The

wiring conductors

61 and 62 are conductor patterns, such as Cu foil, for example.

The first end of the wiring conductor 61 (the left end of the wiring conductor 61 in FIG. 19B or FIG. 20) is connected to the mounting electrode P1 of the electronic component 107 through the conductive bonding material 4. The first end of the wiring conductor 62 (the right end of the wiring conductor 62 in FIG. 19B or FIG. 20) is connected to the mounting electrode P2 of the electronic component 107 through the conductive bonding material 4. The joint part (electrode non-formation part PE and notch part NT5) of the electronic component 107 is joined to the first surface FS1 of the support film 9 via the insulating joining material 5.

The insulating base material 10K is made of, for example, LCP, the conductive bonding material 4 is, for example, solder (Sn-3Ag-0.5Cu), and the insulating bonding material 5 is, for example, an adhesive of a glass epoxy thermosetting resin. . The elastic modulus of the insulating base material 10K is, for example, 12 GPa to 14 GPa. The elastic modulus of the conductive bonding material 4 is 41.6 GPa, for example, and the elastic modulus of the insulating bonding material 5 is 20 GPa to 25 GPa, for example.

Next, an electronic device including a diaphragm will be described with reference to the drawings. FIG. 21A is a perspective view of a vibration device 507 according to the seventh embodiment, and FIG. 21B is an exploded perspective view of the vibration device 507. FIG. 22 is a cross-sectional view of the vibration device 507.

The vibration device 507 includes a vibration plate 407 and a housing 71, and the vibration plate 407 is joined to the housing 70. As shown in FIG. 21B, a recess 71CA and connection conductor patterns LP1, LP2 are formed on the first surface FS1 of the housing 71. A plurality of magnets 8 are arranged inside the recess 71CA.

As shown in FIG. 21B and FIG. 22, the vibration plate 407 is placed on the housing 71 with the first surface FS1 side of the support film 9 facing the first surface S1 side of the housing 71, and A support film 9 is attached to the upper surface of the casing 71. The second end of the wiring conductor 61 (the right end of the wiring conductor 61 in FIG. 21B) is connected to the connection conductor pattern LP1 through the conductive bonding material 4. Further, the second end of the wiring conductor 62 (the left end portion of the wiring conductor 62 in FIG. 21B) is connected to the connection conductor pattern LP2 through the conductive bonding material 4. The outer peripheral end of the support film 9 is joined to the first surface S1 of the casing 71 via an adhesive layer (not shown).

The plurality of magnets 8 are arranged between the conductor patterns of the

coil conductors

31c and 33c in the X-axis direction so that the S poles and the N poles alternately oppose each other. The casing 71 includes terminals (not shown) that are electrically connected to the connection conductor patterns LP1 and LP2. When the vibration device 507 according to this embodiment is incorporated in an electronic device, this terminal is connected to a circuit of the electronic device. When a drive current flows through the connection conductor patterns LP1 and LP2 to the

coil conductors

31c, 32c, and 33c of the diaphragm 407, the diaphragm 407 vibrates in the direction indicated by the white arrow in FIG.

According to this embodiment, the following effects can be obtained.

(A) When the vibration plate 407 repeatedly vibrates, stress is generated at the interface between the insulating base material 10L and the support film 9, and peeling occurs at the interface between the electrode non-forming portion PE of the insulating base material 10L and the insulating bonding material 5. Is likely to occur. In addition, when the area of the mounting electrodes P1 and P2 is increased and the diaphragm is bonded to the support film 9 without using an insulating bonding material (using only the conductive bonding material 4), the mounting of the diaphragm during vibration is performed. Stress concentrates on the interface between the electrodes P 1 and P 2 and the conductive bonding material 4, and the diaphragm is easily peeled off from the support film 9. On the other hand, the electronic component 107 according to the present embodiment includes a notch portion NT5 formed at the outer edge portion of the first main surface VS1, and the notch portion NT5 and the electrode non-forming portion PE connect the insulating bonding material 5 to each other. To the support film 9. With this configuration, the area where the insulating base material 10L is in contact with the insulating bonding material 5 is larger than when only the electrode non-forming portion of the insulating base material 10L is bonded to the support film 9 via the insulating bonding material 5. Thus, the bonding strength between the insulating base material 10L and the insulating bonding material 5 is increased. Therefore, with this configuration, peeling of the interface between the insulating base material 10L and the insulating bonding material 5 is suppressed, and a diaphragm with improved bonding reliability to the support film 9 can be realized.

In addition, it is preferable that the area of the notch NT5 is large. By joining the notch portion NT5 having a large area to the support film 9 via the insulating bonding material 5, the bonding strength between the insulating base material and the insulating bonding material 5 is further increased. Separation of the interface with the insulating bonding material 5 is further suppressed.

In addition, when the thickness of the insulating base material in the Z-axis direction (stacking direction) is large, the insulating base material is difficult to deform following the deformation of the support film 9 during vibration, so the interface between the insulating base material and the insulating bonding material Stress is concentrated on the surface, and peeling of the interface between the insulating base material and the insulating bonding material is particularly likely to occur. Even in such a case, according to the above configuration, the interface between the insulating base material and the insulating bonding material can be made difficult to peel off.

(B) In this embodiment, since the thickness of the support film 9 is thinner than the thickness of the insulating base 10 L and the elastic modulus is low, the displacement amplitude of the vibration plate 407 with respect to electromagnetic force is not easily inhibited by the support film 9.

(C) In the present embodiment, since the

coil conductors

31c, 32c, and 33c formed on the plurality of insulating base material layers 11, 12, and 13 are provided, a diaphragm with high electromagnetic force can be realized while being small. Moreover, since the

coil conductors

31c and 33c overlap each other when viewed from the Z-axis direction, the density of the current path of the coil conductor contributing to electromagnetic force is increased.

<< Eighth Embodiment >>
In the eighth embodiment, an example of a diaphragm having a thick part in the vibration part VP is shown.

FIG. 23A is a plan view of the diaphragm 408 according to the eighth embodiment showing the support portions FP1 and FP2, and FIG. 23B is a plan view of the diaphragm 408 showing the first main surfaces VS1A and VS1B. FIG. 24 is a cross-sectional view taken along line BB in FIG. In FIG. 23A, the support portions FP1 and FP2 are indicated by dot patterns in order to make the structure easy to understand. In FIG. 23B, the first main surfaces VS1A and VS1B are indicated by hatching.

The diaphragm 408 includes an insulating base material 10M having a first main surface VS1A, VS1B and a second main surface VS2 facing the first main surface VS1A, VS2, a coil 3B formed on the insulating base material 10M, and a first Mounting electrodes P1 and P2 formed on main surfaces VS1A and VS1B are provided. The vibration plate 408 is different from the vibration plate 405 according to the fifth embodiment in that the vibration portion VP of the insulating base material 10M has a thick portion. Other configurations are substantially the same as those of the diaphragm 405.

As described above, the insulating base material 10M has a thick part in the vibration part VP. The thick portion is a portion in which the thickness in the stacking direction (Z-axis direction) of the plurality of insulating base layers is relatively thicker than other portions (for example, support portions FP1, FP2, etc.). In addition, since the support portions FP1 and FP2 are relatively thin, the amplitude of the diaphragm due to the electromagnetic force can be increased while maintaining flexibility.

The first main surfaces VS1A and VS1B of the insulating base material 10M of the present embodiment are surfaces including “joining portions” joined to other members (housing 70). In addition, the “joining portion” in the present embodiment is a portion that is joined to another member of the support portions FP1 and FP2.

The area of the first main surfaces VS1A and VS1B of the insulating base 10M (the total area of the first main surfaces VS1A and VS1B) is the first of the cross sections (cross sections of the XY plane) parallel to the first main surfaces VS1A and VS1B. A cross section that is different from the areas of the main surfaces VS1A and VS1B and is closest to the first main surfaces VS1A and VS1B (for example, in the insulating base material 10M shown in FIG. 24, in the −Z direction from the first main surfaces VS1A and VS1B). Is smaller than the area of the cross section parallel to the XY plane.

Next, an electronic device including a diaphragm will be described with reference to the drawings. FIG. 25 is a cross-sectional view of a vibration device 508 according to the eighth embodiment.

The vibration device 508 includes a vibration plate 408, a housing 70, and the like. As shown in FIG. 25, the mounting electrode P1 is connected to the connection conductor pattern LP1 via the conductive bonding material 4. The mounting electrode P2 is connected to the connection conductor pattern LP2 via the conductive bonding material 4. The joint portions (the first main surface VS1A side of the support portion FP1, the first main surface VS1B side of the support portion FP2, and the cutout portion NT4) of the vibration plate 408 are connected to the housing 70 via the insulating bonding material 5. Connected to the first surface S1.

Even with such a configuration, the same operation and effect as the vibration device 505 according to the fifth embodiment are obtained.

<< Other Embodiments >>
In each embodiment shown above, although the example in which an insulating base material is a substantially rectangular parallelepiped was shown, it is not limited to this structure. As described above, the shape of the insulating base material can be appropriately changed within the scope of the effects and effects of the present invention, and may be, for example, a cube, a polygonal column, a cylinder, an elliptical column, etc. The shape may be L-shaped, crank-shaped, T-shaped, Y-shaped, or the like.

Further, in each of the embodiments described above, the example in which the insulating base material is formed by stacking three or four insulating base material layers is shown, but the present invention is not limited to this configuration. The number of insulating base material layers can be changed as appropriate within the range where the effects and advantages of the present invention are achieved.

In each embodiment shown above, although the coil formed in an insulating base material showed the example comprised including a coil conductor of spiral shape, reverse cone shape, or meander line shape, it is limited to this. It is not a thing. The shape, number of turns, etc. of the coil can be changed as appropriate within the scope of the effects and effects of the present invention. The shape of the coil may be, for example, a helical shape or a planar loop shape. Also, the direction of the winding axis AX of the coil can be changed as appropriate within the range where the functions and effects of the present invention are exhibited. For example, the winding axis AX of the coil may coincide with the X-axis direction or may coincide with the Y-axis direction.

Furthermore, the shape, number, position, etc. of the cutout portions can be changed as appropriate within the range where the functions and effects of the present invention are exhibited. As in the third, fifth, or sixth embodiment, the notch may be formed only on a part of the entire circumference of the first main surface VS1. However, when the entire electrode non-forming portion PE is bonded to another member via the insulating bonding material 5, the notch portion is preferably formed over the entire circumference of the first main surface VS1. .

Further, in each of the embodiments described above, an example in which the second main surface VS2 of the insulating base material is a plane is shown, but the present invention is not limited to this configuration. The second main surface VS2 may be a curved surface.

In each of the embodiments described above, the example in which the two mounting electrodes P1 and P2 are linear or the planar shape is rectangular has been described. However, the present invention is not limited to this configuration. The shape of the mounting electrode can be changed as appropriate within the range where the functions and effects of the present invention are exhibited, and may be, for example, a square, a polygon, a circle, an ellipse, an L shape, a T shape, or the like. Further, the arrangement and number of mounting electrodes can be changed as appropriate depending on the circuit configuration of the electronic component or the diaphragm.

In each of the embodiments described above, an example in which the insulating base material is made of a thermoplastic resin has been described. However, the present invention is not limited to this configuration. The insulating base material may be a thermosetting resin. Further, the insulating base of the electronic component may be a ceramic. In addition, when an insulating base material is a thermoplastic resin, as above-mentioned, the man-hour of the manufacturing process of an insulating base material is reduced, and it can hold down cost.

In each of the embodiments described above, an example of an electronic component or a diaphragm in which only a coil is formed on an insulating base material is shown, but the present invention is not limited to this configuration. The electronic component and the diaphragm may include a capacitor formed of a conductor in addition to the coil. Further, chip parts (resistors, inductors, capacitors) and the like may be mounted on the electronic parts and the diaphragm.

Finally, the description of the above embodiment is illustrative in all respects and not restrictive. Modifications and changes can be made as appropriate by those skilled in the art. The scope of the present invention is shown not by the above embodiments but by the claims. Furthermore, the scope of the present invention includes modifications from the embodiments within the scope equivalent to the claims.

AX ... Coil winding axes DL, DL1, DL2 ... Separation lines P1, P2 ... Mounting electrodes PE, PE0 ... Electrode non-forming part RP ... Uneven part OF ... Coil outline SL1, SL2 ... Holes NT1, NT2, NT3 NT4, NT5 ... notches V21, V22, V23, V32, V33 ... interlayer connection conductor VS1 ... first main surface VS2 of insulating base material ... second main surface S1 of insulating base material ... first surface FS1 of housing 1st surface FS2 of support film ... 2nd surface SS of support film ...

End surface

3, 3A, 3B, 3C of insulating base material ... Coil 4 ... Conductive bonding material 5 ... Insulating bonding material 8 ... Magnet 9 ...

Support film

10 , 10A, 10C, 10D, 10E, 10G, 10H, 10J, 10K, 10L, 10M ... Insulating base material 10B, 10F ... Insulating base material (collective substrate)
11, 12, 13, 13A, 14 ... insulating base layers 21, 22 ...

conductors

31, 31b, 31c, 32, 32b, 32c, 33b, 33c ...

coil conductors

51, 52, 53, 54 ...

conductors

61, 62 ...

Wiring conductors

70, 71... Housings 70CA, 71CA...

Recesses

101, 102, 103, 104, 107.

Electronic components

201, 203. Mounting

boards

301, 302, 303.

Electronic devices

400, 405, 406, 407. 408 ...

diaphragms

500, 505, 506, 507, 508 ... vibration devices

Claims

An insulating substrate having a first main surface that is a mounting surface and formed by laminating a plurality of insulating substrate layers;
A coil including a coil conductor formed on the insulating base layer, and a coil having a winding axis in the stacking direction of the plurality of insulating base layers;
A mounting electrode formed on the first main surface and connected to the coil;
With
The area of the first main surface is different from the area of the first main surface among the cross sections parallel to the first main surface, and is smaller than the area of the cross section closest to the first main surface, parts.
The number of the coil conductors is plural,
The electronic component according to claim 1, wherein the plurality of coil conductors are respectively formed on two or more insulating base material layers among the plurality of insulating base material layers.
The electronic component according to claim 1 or 2, wherein the insulating base has a notch formed at an outer edge of the first main surface.
The electronic component according to any one of claims 1 to 3, wherein an uneven portion is formed in an electrode non-formed portion where the mounting electrode is not formed in the first main surface.
A diaphragm that vibrates by electromagnetic force,
A support film having flexibility and having a wiring conductor formed thereon;
An electronic component bonded to the support film via a conductive bonding material and an insulating bonding material;
With
The electronic component is
An insulating substrate having a first main surface that is a mounting surface and formed by laminating a plurality of insulating substrate layers;
A coil configured to include a coil conductor formed on the insulating base layer;
A mounting electrode formed on the first main surface and connected to the coil;
Have
The area of the first main surface is different from the area of the first main surface in a cross section parallel to the first main surface and is smaller than the area of the cross section closest to the first main surface. Board.
The diaphragm according to claim 5, wherein the insulating base has a notch formed at an outer edge of the first main surface.
A diaphragm that vibrates by electromagnetic force,
A vibration part that vibrates, a support part fixed to another member, and a first main surface including a joint part joined to the other member, and formed by laminating a plurality of insulating base layers An insulating base material,
A coil configured to include a coil conductor formed on the insulating base layer;
A mounting electrode formed on the first main surface and connected to the coil;
With
The area of the first main surface is different from the area of the first main surface in a cross section parallel to the first main surface and is smaller than the area of the cross section closest to the first main surface. Board.
The diaphragm according to claim 7, wherein the insulating base material has a notch portion formed at an outer edge portion of the support portion in the first main surface.
The diaphragm according to claim 7 or 8, wherein a width of the support portion is narrower than a width of the vibration portion.
A mounting board;
Electronic components mounted on the mounting substrate using a conductive bonding material and an insulating bonding material,
With
The electronic component is
An insulating substrate having a first main surface that is a mounting surface and formed by laminating a plurality of insulating substrate layers;
A coil including a coil conductor formed on the insulating base layer, and a coil having a winding axis in the stacking direction of the plurality of insulating base layers;
A mounting electrode formed on the first main surface and connected to the coil;
With
The area of the first main surface is different from the area of the first main surface among the cross sections parallel to the first main surface, and is smaller than the area of the cross section closest to the first main surface,
The mounting electrode is connected to the mounting substrate via the conductive bonding material,
The insulating base material has an end surface connected to the first main surface, or a notch formed at an outer edge portion of the first main surface,
An electrode non-formation part in which the mounting electrode is not formed in the first main surface is bonded to the mounting substrate through the insulating bonding material together with at least a part of the end surface or the notch. machine.
An electronic component manufacturing method comprising:
A conductor forming step of forming a coil conductor on the insulating base layer;
After the conductor forming step, the insulating base material is formed by heating and pressurizing the plurality of laminated insulating base material layers, and a base material forming step,
Forming a mounting electrode on the first main surface of the insulating substrate;
A notch forming step of forming a notch in the first main surface after the base material forming step;
An electronic component manufacturing method comprising:
An electronic component manufacturing method comprising:
A conductor forming step of forming a coil conductor on the insulating base layer;
After the conductor forming step, the insulating base material is formed by heating and pressurizing the plurality of laminated insulating base material layers, and a base material forming step,
Forming a mounting electrode on the first main surface of the insulating substrate;
After the base material forming step, the area of the first main surface is different from the area of the first main surface in the cross section parallel to the first main surface and is closest to the first main surface. Separating the insulating base material into pieces by grinding with a laser from the first main surface side so as to be smaller than the cross-sectional area; and
An electronic component manufacturing method comprising:
The insulating base layer is made of a thermoplastic resin,
The method of manufacturing an electronic component according to claim 11, wherein the base material forming step includes a step of forming the insulating base material by collectively pressing the plurality of laminated insulating base material layers.
The said electrode formation process includes the process of forming the said mounting electrode in the surface of the said insulation base material layer used as the said 1st main surface of the said insulation base material before the said base material formation process. 14. A method for manufacturing an electronic component according to any one of items 13 to 13.