WO2017098996A1 - Thermally curable resin composition - Google Patents

Abstract

A thermally curable resin composition which comprises a cationic dye (A), a cationically polymerizable organic substance (B), and a thermoacid generator (C). It is preferable that the cationic dye (A) be a polymethine compound represented by the following general formula (1). (In the formula, A represents a group selected from among (a) to (m) of group I, A' represents a group selected from among (a') to (m') of group II (for the groups of groups I and II, see the description), Q represents a linking group including a methine chain, An^q- represents a q-valent anion, q is 1 or 2, and p represents a coefficient that keeps the charge neutral.)

Description

Thermosetting resin composition

The present invention uses a thermosetting resin composition, a method for curing the thermosetting resin composition, a cured product obtained by curing the thermosetting resin composition, and a cured product obtained by curing the thermosetting resin composition. The present invention relates to a wavelength cut filter.

The sensitivity of solid-state image sensors (CCD, C-MOS, etc.) used in digital still cameras, video cameras, mobile phone cameras, etc., extends from the ultraviolet region to the infrared region of the light wavelength. On the other hand, human visibility is only in the visible region of the wavelength of light. For this reason, the sensitivity of the solid-state image sensor is corrected so as to approach the human visual sensitivity by providing an infrared cut filter, which is a type of wavelength cut filter, between the imaging lens and the solid-state image sensor.

As such an infrared cut filter, those manufactured by various methods are conventionally used. For example, a reflection type filter such as one that combines layers containing materials that do not have absorption characteristics, such as metal, as in Patent Document 1 and uses a difference in refractive index thereof, or Patent Document 2. Absorption filters such as those having a resin substrate containing an organic compound having a compound having a squarylium structure, such as 2, are used. These wavelength cut filters have exceptionally steep light absorption so that they approach human visibility, that is, the half-value width of λmax is small, and the durability is not lost due to light, heat, etc. Is required to be high.

The reflection type filter as in Patent Document 1 has a problem such that the color changes between the center and the periphery of the screen because the characteristics change depending on the incident angle of light. In addition, the reflected light becomes stray light in the optical path, leading to a problem that causes a reduction in resolution, image spots, unevenness, multiple images called ghosts, and the like.

On the other hand, although the absorption filter as in Patent Document 2 does not change the characteristics depending on the incident angle of light, a considerable thickness may be required to obtain the target characteristics. In addition, curable resins such as acrylic resins and plastic resins such as cyclic olefin resins and polycarbonate resins are used as materials for resin substrates containing light absorbers using organic compounds. Often inferior.

Also, the curing method of the curable resin such as acrylic resin includes photopolymerization using a photopolymerization initiator such as a photoacid generator and a photoradical initiator and thermal polymerization using a thermal polymerization initiator such as a thermal acid generator. is there. Patent Document 3 discloses a three-dimensional crosslinked polymer matrix precursor material containing a non-ester alicyclic epoxy compound and a thermal acid generator, a radical polymerizable compound, a radical polymerization initiator, and a sensitizing dye. A photosensitive composition for recording volume holograms is disclosed. In this document, a dye is used as a sensitizer for a radical polymerization initiator. However, it is preferable that the sensitizing dye is preferably colorless and transparent when decomposed by heating, irradiation with ultraviolet light or visible light. There is. As described above, the curable resin containing a dye is likely to decompose the dye at the time of curing, and when this is used as an optical filter, it may be a cause that a sufficient wavelength absorption ability cannot be obtained.

US2005253048 (A1) JP 2012-008532 A JP 2011-118363 A

An object of the present invention is to provide a resin composition having excellent heat resistance. Another object of the present invention is to provide a method for curing the resin composition and a cured product obtained by curing the resin composition. Furthermore, it is providing the wavelength cut filter excellent in heat resistance using the said hardened | cured material.

As a result of extensive studies, the present inventor has found that a thermosetting resin composition containing a cationic dye, a cationic polymerizable organic substance, and a thermal acid generator is excellent in heat resistance. The present inventors have found that the resin composition is suitable for the production of a wavelength cut filter, and have reached the present invention.

That is, the present invention provides a thermosetting resin composition containing a cationic dye (A), a cationic polymerizable organic substance (B), and a thermal acid generator (C).

The present invention also provides a method for curing the thermosetting resin composition, a cured product obtained by curing the thermosetting resin, and a wavelength cut filter using the cured product.

A cured product obtained by curing the thermosetting resin composition of the present invention is excellent in heat resistance. A cured product obtained by curing the thermosetting resin is suitable for a wavelength cut filter.

It is sectional drawing which shows the outline of the layer structure of a wavelength cut filter. It is sectional drawing which shows the outline of the layer structure of a wavelength cut filter.

Hereinafter, the thermosetting resin composition of the present invention will be described based on preferred embodiments.

The thermosetting resin composition of the present invention contains a cationic dye (A), a cationic polymerizable organic substance (B), and a thermal acid generator (C). Hereinafter, each component will be described in order.

The cationic dye (A) used in the thermosetting resin composition of the present invention is not particularly limited, and known dyes can be used. Examples thereof include triphenylmethane dyes such as malachite green and crystal violet, and auramine. Diphenylmethane dyes such as quinoline blue, thiazine dyes such as methylene blue, xanthene dyes such as rhodamine B, azo dyes such as safranine, oxazine dyes such as basic blue 3, acridine such as acridine orange And dyes such as pyrylium dyes such as anthocyanidins can be used. Of these, polymethine dyes are preferred because of their good heat resistance, solubility, and compatibility with resins.

Examples of the polymethine dye include compounds that form a salt represented by the following general formula (1).

(In the formula, A represents a group selected from (a) to (m) of the following group I; A ′ represents a group selected from (a ′) to (m ′) of the following group II; Represents a linking group represented by the following general formula (1-A), An ^q- represents a q-valent anion, q represents 1 or 2, and p represents a coefficient for keeping the charge neutral. )

(Wherein, ring C and ring C ′ each independently represent a benzene ring, a naphthalene ring, a phenanthrene ring or a pyridine ring.
In the formula, R ¹ and R ¹ ′ are each independently a hydrogen atom, a hydroxyl group, a halogen atom, a nitro group, a cyano group, a carboxyl group, an amino group, an amide group, a ferrocenyl group, an aryl group having 6 to 20 carbon atoms, Represents an arylalkyl group having 7 to 30 carbon atoms or an alkyl group having 1 to 8 carbon atoms, and the aryl group, arylalkyl group and alkyl group in R ¹ and R ¹ ′ are each independently a hydroxyl group. , A halogen atom, a nitro group, a cyano group, a carboxyl group, an amino group, an amide group or a ferrocenyl group, the arylalkyl group in the R ¹ and R ¹ ′ and the methylene group in the alkyl group are Each independently, —O—, —S—, —CO—, —COO—, —OCO—, —SO ₂ —, —NH—, —CONH—, —NHCO—, —N═CH— or —CH. = H- is sometimes replaced by.
In the formula, R ² to R ⁹ and R ² ′ to R ⁹ ′ each independently represent a hydroxyl group, a halogen atom, a nitro group, a cyano group, a carboxyl group, an amino group, an amide group, a ferrocenyl group, or 6 to 20 carbon atoms. An aryl group of 7 to 30 carbon atoms or an alkyl group of 1 to 8 carbon atoms, and the aryl group, arylalkyl group in R ² to R ⁹ and R ² ′ to R ⁹ ′ and The hydrogen atom of the alkyl group may be independently substituted with a hydroxyl group, a halogen atom, a nitro group, a cyano group, a carboxyl group, an amino group, an amide group or a ferrocenyl group, and the R ² to R ⁹ and R ² ′ may be substituted. The arylalkyl group in —R ⁹ ′ and the methylene group in the alkyl group are each independently —O—, —S—, —CO—, —COO—, —OCO—, —SO ₂ —, —NH—. , -CONH-, -N CO -, - N = CH- or may be replaced by -CH = CH-.
In the formula, X and X ′ are each independently an oxygen atom, a sulfur atom, a selenium atom, —CR ⁵¹ R ⁵² —, a C 3-6 cycloalkane-1,1-diyl group, —NH— or — NY ² — and R ⁵¹ and R ⁵² each independently represent a hydrogen atom, a hydroxyl group, a halogen atom, a nitro group, a cyano group, a carboxyl group, an amino group, an amide group, a ferrocenyl group, or an aryl group having 6 to 20 carbon atoms. Group, an arylalkyl group having 7 to 30 carbon atoms or an alkyl group having 1 to 8 carbon atoms, wherein the aryl group, arylalkyl group and alkyl group in R ⁵¹ and R ⁵² are each independently a hydrogen atom. It may be substituted with a hydroxyl group, a halogen atom, a nitro group, a cyano group, a carboxyl group, an amino group, an amide group or a ferrocenyl group, and the arylalkyl group in R ⁵¹ and R ⁵² and The methylene groups in the alkyl group are each independently —O—, —S—, —CO—, —COO—, —OCO—, —SO ₂ —, —NH—, —CONH—, —NHCO—, — In some cases, N═CH— or —CH═CH— may be substituted.
In the formula, Y, Y ′ and Y ² are each independently a hydrogen atom, a hydroxyl group, a halogen atom, a cyano group, a carboxyl group, an amino group, an amide group, a ferrocenyl group, a nitro group, or an aryl group having 6 to 20 carbon atoms. Represents an arylalkyl group having 7 to 30 carbon atoms or an alkyl group having 1 to 8 carbon atoms, and the aryl group, arylalkyl group, and methylene group in the alkyl group in Y, Y ′ and Y ² are Each independently, —O—, —S—, —CO—, —COO—, —OCO—, —SO ₂ —, —NH—, —CONH—, —NHCO—, —N═CH— or —CH. ═CH— may be substituted.
In the formula, r and r ′ are 0 or (a) to (e), (g) to (j), (l), (m), (a ′) to (e ′), (g ′) to It represents one or more numbers that can be substituted in (j ′), (l ′), and (m ′). )

(In the formula, k represents an integer of 0 to 4.)
In the formula, the hydrogen atoms of each methine group constituting the linking group are each independently a hydroxyl group, a halogen atom, a cyano group, —NRR ′, an aryl group having 6 to 20 carbon atoms, or an arylalkyl having 7 to 30 carbon atoms. In some cases, the alkyl group may be substituted with a group or an alkyl group having 1 to 8 carbon atoms, and the alkyl group forms a ring structure having 3 to 10 carbon atoms that connects any two carbon atoms of the methine group And each hydrogen atom of the ring structure is independently a hydroxyl group, a halogen atom, a cyano group, —NRR ′, an aryl group having 6 to 20 carbon atoms, an arylalkyl group having 7 to 30 carbon atoms, or 1 carbon atom. And R and R ′ in the methine group and the ring structure are each independently an aryl group having 6 to 20 carbon atoms or an arylalkyl having 7 to 30 carbon atoms. Group or 1 carbon atom And a hydrogen atom in the methine group and in the ring structure, an aryl group, an arylalkyl group and an alkyl group each independently represents a hydroxyl group, a halogen atom, a cyano group or —NRR ′. The methine group, the arylalkyl group in the ring structure and the methylene group in the alkyl group are each independently —O—, —S—, —CO—, —COO—, — OCO—, —SO ₂ —, —NH—, —CONH—, —NHCO—, —N═CH— or —CH═CH— may be substituted. )

Examples of the halogen atom represented by R ⁵¹ and R ⁵² in R ¹ to R ⁹ and R ¹ ′ to R ⁹ ′ and X and X ′ in the general formula (1) include fluorine, chlorine, bromine and iodine. It is done. Examples of the aryl group having 6 to 20 carbon atoms represented by R ¹ to R ⁹ and R ¹ ′ to R ⁹ ′ and R ⁵¹ and R ⁵² in X and X ′ in the general formula (1) include phenyl, Naphthyl, 2-methylphenyl, 3-methylphenyl, 4-methylphenyl, 4-vinylphenyl, 3-iso-propylphenyl, 4-iso-propylphenyl, 4-butylphenyl, 4-iso-butylphenyl, 4- tert-butylphenyl, 4-hexylphenyl, 4-cyclohexylphenyl, 4-octylphenyl, 4- (2-ethylhexyl) phenyl, 4-stearylphenyl, 2,3-dimethylphenyl, 2,4-dimethylphenyl, 2, 5-dimethylphenyl, 2,6-dimethylphenyl, 3,4-dimethylphenyl, 3,5-dimethylphenyl, , 4-Di-tert-butylphenyl, 2,5-di-tert-butylphenyl, 2,6-di-tert-butylphenyl, 2,4-di-tert-pentylphenyl, 2,5-di-tert -Amylphenyl, 2,5-di-tert-octylphenyl, 2,4-dicumylphenyl, 4-cyclohexylphenyl, (1,1'-biphenyl) -4-yl, 2,4,5-trimethylphenyl, And ferrocenyl. The arylalkyl group having 7 to 30 carbon atoms represented by R ¹ to R ⁹ and R ¹ ′ to R ⁹ ′ and R ⁵¹ and R ⁵² in X and X ′ in the general formula (1) is benzyl. Phenethyl, 2-phenylpropan-2-yl, diphenylmethyl, triphenylmethyl, styryl, cinnamyl, ferrocenylmethyl, ferrocenylpropyl, 4-isopropylphenethyl and the like. Examples of the alkyl group having 1 to 8 carbon atoms represented by R ¹ to R ⁹ and R ¹ ′ to R ⁹ ′ and R ⁵¹ and R ⁵² in X and X ′ in the general formula (1) include methyl, Ethyl, n-propyl, iso-propyl, n-butyl, sec-butyl, tert-butyl, iso-butyl, amyl, iso-amyl, tert-amyl, n-hexyl, 2-hexyl, 3-hexyl, cyclohexyl, Examples include 1-methylcyclohexyl, n-heptyl, 2-heptyl, 3-heptyl, iso-heptyl, tert-heptyl, 1-octyl, iso-octyl, tert-octyl and the like.
The hydrogen atoms in the aryl group having 6 to 20 carbon atoms, the arylalkyl group having 7 to 30 carbon atoms and the alkyl group having 1 to 8 carbon atoms are each independently a hydroxyl group, a halogen atom, a nitro group, or a cyano group. , A carboxyl group, an amino group, an amido group or a ferrocenyl group, and the arylalkyl group and the methylene group in the alkyl group are each independently —O—, —S—, —CO—, — COO—, —OCO—, —SO ₂ —, —NH—, —CONH—, —NHCO—, —N═CH— or —CH═CH— may be substituted, and the number and position of these substitutions Is optional.
For example, examples of the group in which a hydrogen atom in the alkyl group having 1 to 8 carbon atoms is substituted with a halogen atom include chloromethyl, dichloromethyl, trichloromethyl, fluoromethyl, difluoromethyl, trifluoromethyl, and nonafluoro Examples of the group in which the methylene group in the alkyl group having 1 to 8 carbon atoms is substituted with —O— include methyloxy, ethyloxy, iso-propyloxy, propyloxy, butyloxy, pentyloxy, and the like. alkoxy groups such as iso-pentyloxy, hexyloxy, heptyloxy, octyloxy, 2-ethylhexyloxy, 2-methoxyethyl, 2- (2-methoxy) ethoxyethyl, 2-ethoxyethyl, 2-butoxyethyl, 4 -Al, such as methoxybutyl and 3-methoxybutyl Examples of the group in which a hydrogen atom in the alkyl group having 1 to 8 carbon atoms is substituted with a halogen atom, and a methylene group in the alkyl group is substituted with —O— are, for example, Examples include chloromethyloxy, dichloromethyloxy, trichloromethyloxy, fluoromethyloxy, difluoromethyloxy, trifluoromethyloxy, nonafluorobutyloxy and the like.

In the above general formula (1), the cycloalkane-1,1-diyl group having 3 to 6 carbon atoms represented by X and X ′ is cyclopropane-1,1-diyl, cyclobutane-1,1- Examples thereof include diyl, 2,4-dimethylcyclobutane-1,1-diyl, 3,3-dimethylcyclobutane-1,1-diyl, cyclopentane-1,1-diyl, cyclohexane-1,1-diyl and the like.

In the general formula (1), examples of the halogen atom represented by Y, Y ′, and Y ² include fluorine, chlorine, bromine, and iodine. Examples of the aryl group having 6 to 20 carbon atoms represented by Y, Y ′ and Y ² include phenyl, naphthyl, 2-methylphenyl, 3-methylphenyl, 4-methylphenyl, 4-vinylphenyl, 3-iso -Propylphenyl, 4-iso-propylphenyl, 4-butylphenyl, 4-iso-butylphenyl, 4-tert-butylphenyl, 4-hexylphenyl, 4-cyclohexylphenyl, 4-octylphenyl, 4- (2- Ethylhexyl) phenyl, 4-stearylphenyl, 2,3-dimethylphenyl, 2,4-dimethylphenyl, 2,5-dimethylphenyl, 2,6-dimethylphenyl, 3,4-dimethylphenyl, 3,5-dimethylphenyl 2,4-di-tert-butylphenyl, 2,5-di-tert-butylphenyl 2,6-di-tert-butylphenyl, 2,4-di-tert-pentylphenyl, 2,5-di-tert-amylphenyl, 2,5-di-tert-octylphenyl, 2,4-dicumyl Examples include phenyl, 4-cyclohexylphenyl, (1,1′-biphenyl) -4-yl, 2,4,5-trimethylphenyl, ferrocenyl and the like. Examples of the arylalkyl group having 7 to 30 carbon atoms represented by Y, Y ′ and Y ² include benzyl, phenethyl, 2-phenylpropan-2-yl, diphenylmethyl, triphenylmethyl, styryl, cinnamyl, ferrocete. Nylmethyl, ferrocenylpropyl, 4-isopropylphenethyl and the like. Examples of the alkyl group having 1 to 8 carbon atoms represented by Y, Y ′ and Y ² include methyl, ethyl, n-propyl, iso-propyl, n-butyl, sec-butyl, tert-butyl and iso-butyl. , Amyl, iso-amyl, tert-amyl, n-hexyl, 2-hexyl, 3-hexyl, cyclohexyl, 1-methylcyclohexyl, n-heptyl, 2-heptyl, 3-heptyl, iso-heptyl, tert-heptyl, Examples include 1-octyl, iso-octyl, tert-octyl and the like. The hydrogen atoms in these aryl groups, arylalkyl groups and alkyl groups may each independently be substituted with a hydroxyl group, a halogen group, a cyano group, a carboxyl group, an amino group, an amide group, a ferrocenyl group or a nitro group. The number and position of these substitutions are arbitrary.
In the general formula (1), the aryl group and arylalkyl group in Y, Y ′, and Y ² and the methylene group in the alkyl group are each independently —O—, —S—, —CO—, In some cases, it is substituted with —COO—, —OCO—, —SO ₂ —, —NH—, —CONH—, —NHCO—, —N═CH— or —CH═CH—. Examples of the above-described methylene group substituted with —O— or the like include, for example, methyl, ethyl, propyl, iso-propyl, butyl, sec-butyl, tert-butyl, iso-butyl, amyl, iso-amyl. , Tert-amyl, hexyl, 2-hexyl, 3-hexyl, cyclohexyl, 1-methylcyclohexyl, heptyl, 2-heptyl, 3-heptyl, iso-heptyl, tert-heptyl, 1-octyl, iso-octyl, tert- Alkyl groups such as octyl, 2-ethylhexyl, nonyl, iso-nonyl, decyl, dodecyl, tridecyl, tetradecyl, pentadecyl, hexadecyl, heptadecyl, octadecyl; phenyl, naphthyl, 2-methylphenyl, 3-methylphenyl, 4-methylphenyl , 4-vinyl Enyl, 3-iso-propylphenyl, 4-iso-propylphenyl, 4-butylphenyl, 4-iso-butylphenyl, 4-tert-butylphenyl, 4-hexylphenyl, 4-cyclohexylphenyl, 4-octylphenyl, 4- (2-ethylhexyl) phenyl, 4-stearylphenyl, 2,3-dimethylphenyl, 2,4-dimethylphenyl, 2,5-dimethylphenyl, 2,6-dimethylphenyl, 3,4-dimethylphenyl, 3 , 5-dimethylphenyl, 2,4-di-tert-butylphenyl, cyclohexylphenyl and other aryl groups; benzyl, phenethyl, 2-phenylpropan-2-yl, diphenylmethyl, triphenylmethyl, styryl, cinnamyl and the like The methylene group in the alkyl group etc. Those substituted with an ether bond, a thioether bond, etc., such as 2-methoxyethyl, 3-methoxypropyl, 4-methoxybutyl, 2-butoxyethyl, methoxyethoxyethyl, methoxyethoxyethoxyethyl, 3-methoxybutyl, 2-methoxybutyl Examples include phenoxyethyl, 3-phenoxypropyl, 2-methylthioethyl, 2-phenylthioethyl and the like.

The methine chain in the linking group represented by the general formula (1-A) and a halogen atom that may be substituted by a ring structure having 3 to 10 carbon atoms, an aryl group having 6 to 20 carbon atoms, and the number of carbon atoms An arylalkyl group having 7 to 30 carbon atoms or an alkyl group having 1 to 8 carbon atoms, an aryl group having 6 to 20 carbon atoms represented by R and R ′ in the above general formula (1-A), and the number of carbon atoms Examples of the arylalkyl group having 7 to 30 or the alkyl group having 1 to 8 carbon atoms include R ¹ to R ⁹ and R ¹ ′ to R ⁹ ′ in the general formula (1), R ^{51 in} X and X ′, and the same as those represented by R ⁵² can be mentioned.

As the linking group represented by the general formula (1-A), a group represented by any of the following (Q-1) to (Q-11) is preferable because of easy production. In addition, the groups represented by the following (Q-1) to (Q-3) and (Q-11) are more preferable because the methine chain is short and the heat resistance is high, and the following (Q-1), (Q -2) and (Q-11) are more preferred. Also, (Q-4) to (Q-9) are more preferable because of having high heat resistance since they have a ring structure in the methine chain.

(Wherein R ¹⁴ , R ¹⁵ , R ¹⁶ , R ¹⁷ , R ¹⁸ , R ¹⁹ and Z ′ each independently represent a hydrogen atom, a hydroxyl group, a halogen atom, a cyano group, —NRR ′, a carbon atom number of 6 to Represents an aryl group having 20 carbon atoms, an arylalkyl group having 7 to 30 carbon atoms, or an alkyl group having 1 to 8 carbon atoms, wherein R and R ′ are each independently an aryl group having 6 to 20 carbon atoms or a carbon atom. Represents an arylalkyl group having 7 to 30 carbon atoms or an alkyl group having 1 to 8 carbon atoms, and —NRR ′ and aryl groups in R ¹⁴ , R ¹⁵ , R ¹⁶ , R ¹⁷ , R ¹⁸ , R ¹⁹ and Z ′ , The arylalkyl group and the hydrogen atom in the alkyl group may each independently be substituted with a hydroxyl group, a halogen atom, a cyano group or —NRR ′, and the arylalkyl group and the methylene group in the alkyl group are each Independently, -O- , —S—, —CO—, —COO—, —OCO—, —SO ₂ —, —NH—, —CONH—, —NHCO—, —N═CH— or —CH═CH— There is.)

Examples of the halogen atom represented by R ¹⁴ , R ¹⁵ , R ¹⁶ , R ¹⁷ , R ¹⁸ , R ¹⁹ and Z ′ include fluorine, chlorine, bromine and iodine. Examples of the aryl group having 6 to 20 carbon atoms represented by R ¹⁴ , R ¹⁵ , R ¹⁶ , R ¹⁷ , R ¹⁸ , R ¹⁹ , Z ′, R and R ′ include phenyl, naphthyl, 2-methylphenyl, 3-methylphenyl, 4-methylphenyl, 4-vinylphenyl, 3-iso-propylphenyl, 4-iso-propylphenyl, 4-butylphenyl, 4-iso-butylphenyl, 4-tert-butylphenyl, 4- Hexylphenyl, 4-cyclohexylphenyl, 4-octylphenyl, 4- (2-ethylhexyl) phenyl, 4-stearylphenyl, 2,3-dimethylphenyl, 2,4-dimethylphenyl, 2,5-dimethylphenyl, 2, 6-dimethylphenyl, 3,4-dimethylphenyl, 3,5-dimethylphenyl, 2,4-di-t rt-butylphenyl, 2,5-di-tert-butylphenyl, 2,6-di-tert-butylphenyl, 2,4-di-tert-pentylphenyl, 2,5-di-tert-amylphenyl, 2 , 5-di-tert-octylphenyl, 2,4-dicumylphenyl, 4-cyclohexylphenyl, (1,1′-biphenyl) -4-yl, 2,4,5-trimethylphenyl, ferrocenyl, etc. . Examples of the arylalkyl group having 7 to 30 carbon atoms represented by R ¹⁴ , R ¹⁵ , R ¹⁶ , R ¹⁷ , R ¹⁸ , R ¹⁹ , Z ′, R and R ′ include benzyl, phenethyl and 2-phenylpropane. -2-yl, diphenylmethyl, triphenylmethyl, styryl, cinnamyl, ferrocenylmethyl, ferrocenylpropyl, 4-isopropylphenethyl and the like. Examples of the alkyl group having 1 to 8 carbon atoms represented by R ¹⁴ , R ¹⁵ , R ¹⁶ , R ¹⁷ , R ¹⁸ , R ¹⁹ , Z ′, R and R ′ include methyl, ethyl, propyl and iso-propyl. , Butyl, sec-butyl, tert-butyl, iso-butyl, amyl, iso-amyl, tert-amyl, hexyl, 2-hexyl, 3-hexyl, cyclohexyl, 1-methylcyclohexyl, heptyl, 2-heptyl, 3- Examples include heptyl, iso-heptyl, tert-heptyl, 1-octyl, iso-octyl, tert-octyl and the like. The hydrogen atom in these aryl group, arylalkyl group and alkyl group may each independently be substituted with a hydroxyl group, a halogen group, a cyano group, a carboxyl group, an amino group, an amide group, a ferrocenyl group, or a nitro group. The number and position of these substitutions are arbitrary.

Examples of the q-valent anion represented by pAn ^q- in the general formula (1) include methanesulfonate anion, dodecylsulfonate anion, benzenesulfonate anion, toluenesulfonate anion, trifluoromethanesulfonate anion, naphthalenesulfone. Acid anion, diphenylamine-4-sulfonic acid anion, 2-amino-4-methyl-5-chlorobenzenesulfonic acid anion, 2-amino-5-nitrobenzenesulfonic acid anion, JP-A-10-235999, JP-A-10-337959 JP, 10-112088, 2000-108510, 2000-168233, 2001-209969, 2001-322354, 2006-248180. , JP Organic sulfonic acids such as sulfonate anions described in 2006-297907, JP-A-8-253705, JP-T-2004-503379, JP-A-2005-336150, International Publication 2006/28006, etc. In addition to anions, chloride ions, bromide ions, iodide ions, fluoride ions, chlorate ions, thiocyanate ions, perchlorate ions, hexafluorophosphate ions, hexafluoroantimonate ions, tetrafluoroborate ions, Octyl phosphate ion, dodecyl phosphate ion, octadecyl phosphate ion, phenyl phosphate ion, nonylphenyl phosphate ion, tris (pentafluoroethyl) trifluorophosphate ion, 2,2'-methylenebis (4,6-di-t -Butylphenyl) phosphonic acid Ions, tetrakis (pentafluorophenyl) borate ions, quencher anions that have the function of deexciting (quenching) active molecules in the excited state, carboxyl groups, phosphonic acid groups, and sulfonic acids on cyclopentadienyl rings And metallocene compound anions such as ferrocene and luteocene having an anionic group. Of these, organic sulfonate anions, hexafluorophosphate ions, and polyfluoroborate ions are preferred because of their high heat resistance, and N, N′-bis (trifluoromethanesulfonyl) imido anion, N, N′-bis. (Fluorosulfonyl) imidate anion, N, N′-bis (nonafluorobutanesulfonyl) imidate anion, trifluoromethanesulfonate anion, tris (trifluoromethanesulfonyl) methide anion, hexafluorophosphate ion, tris (pentafluoro) More preferred are ethyl) trifluorophosphate ion and tetrakis (pentafluorophenyl) borate ion.

Specific examples of the polymethine compound used in the present invention include the following compound No. 1-107. In the following illustrations, the compounds are shown with the anion omitted.

The production method of the polymethine compound is not particularly limited, and can be obtained by a method using a well-known general reaction. For example, a compound having a corresponding structure, such as a route described in JP2010-209191A And a method of synthesis by reaction with an imine derivative.

The cationic dye (A) used in the present invention preferably has a maximum absorption wavelength (λmax) of 650 to 1200 nm, more preferably 650 to 900 nm because of its high infrared cut performance.

As the cationically polymerizable organic substance (B) used in the thermosetting resin composition of the present invention, any compound can be used as long as it is polymerized or cross-linked by a thermal acid generator (C) activated by heat. Such a compound may be used and is not particularly limited, but an epoxy compound, an oxetane compound, a cyclic lactone compound, a cyclic acetal compound, a cyclic thioether compound, a spiro orthoester compound, a vinyl compound, and the like can be used. Two or more types can be used. Among them, it is preferable to use one or more selected from an epoxy compound, an oxetane compound, and a cyclic acetal compound because the cured product has good heat resistance and transparency, and epoxy is preferable because the cured product has high heat resistance. Compounds are more preferable, and aromatic epoxy compounds, alicyclic epoxy compounds, aliphatic epoxy compounds, and the like are more preferable.

Specific examples of the alicyclic epoxy compound include cyclohexene oxide obtained by epoxidizing a polyglycidyl ether of polyhydric alcohol having at least one alicyclic ring or a cyclohexene or cyclopentene ring-containing compound with an oxidizing agent. A cyclopentene oxide containing compound is mentioned. For example, hydrogenated bisphenol A diglycidyl ether, 3,4-epoxycyclohexylmethyl-3,4-epoxycyclohexanecarboxylate, 3,4-epoxy-1-methylcyclohexyl-3,4-epoxy-1-methylhexanecarboxylate 6-methyl-3,4-epoxycyclohexylmethyl-6-methyl-3,4-epoxycyclohexanecarboxylate, 3,4-epoxy-3-methylcyclohexylmethyl-3,4-epoxy-3-methylcyclohexanecarboxylate 3,4-epoxy-5-methylcyclohexylmethyl-3,4-epoxy-5-methylcyclohexanecarboxylate, 2- (3,4-epoxycyclohexyl-5,5-spiro-3,4-epoxy) cyclohexane Metageo Sun, bis (3,4-epoxycyclohexylmethyl) adipate, 3,4-epoxy-6-methylcyclohexyl carboxylate, methylene bis (3,4-epoxycyclohexane), dicyclopentadiene diepoxide, ethylene bis (3,4 Epoxycyclohexanecarboxylate), dioctyl epoxyhexahydrophthalate, di-2-ethylhexyl epoxyhexahydrophthalate, 1-epoxyethyl-3,4-epoxycyclohexane, 1,2-epoxy-2-epoxyethylcyclohexane, 3, Examples include 4-epoxycyclohexylmethyl acrylate and 3,4-epoxycyclohexylmethyl methacrylate.

Examples of commercially available products that can be suitably used as the alicyclic epoxy compound include UVR-6100, UVR-6105, UVR-6110, UVR-6128, UVR-6200 (manufactured by Union Carbide), Celoxide 2021, Celoxide 2021P, Celoxide 2081, Celoxide 2083, Celoxide 2085, Celoxide 2000, Celoxide 3000, Cyclomer A200, Cyclomer M100, Cyclomer M101, Epolide GT-301, Epolide GT-302, Epolide 401, Epolide 403, ETHB, Epolide HD300, EHPE- 3150 (above, manufactured by Daicel Corporation), Adeka Arcles KRM-2110, Adeka Arcles KRM-2199 (above, manufactured by ADEKA Corporation), etc. It can gel.
Among the alicyclic epoxy compounds, an epoxy resin having a cyclohexene oxide structure is preferable because it cures quickly.

Specific examples of the aromatic epoxy compound include polyphenol having at least one aromatic ring or polyglycidyl ether of an alkylene oxide adduct thereof such as bisphenol A, bisphenol F, or further alkylene oxide added thereto. Examples thereof include glycidyl ethers and epoxy novolac resins of the above compounds.

Specific examples of the aliphatic epoxy compound were synthesized by vinyl polymerization of a polyglycidyl ether of an aliphatic polyhydric alcohol or an alkylene oxide adduct thereof, a polyglycidyl ester of an aliphatic long-chain polybasic acid, glycidyl acrylate or glycidyl methacrylate. Examples thereof include homopolymers, copolymers synthesized by vinyl polymerization of glycidyl acrylate or glycidyl methacrylate and other vinyl monomers. Typical compounds include 1,4-butanediol diglycidyl ether, 1,6-hexanediol diglycidyl ether, triglycidyl ether of glycerin, triglycidyl ether of trimethylolpropane, tetraglycidyl ether of sorbitol, dipentaerythritol One or more kinds of glycidyl ethers of polyhydric alcohols such as hexaglycidyl ether, diglycidyl ether of polyethylene glycol, diglycidyl ether of polypropylene glycol, and aliphatic polyhydric alcohols such as propylene glycol, trimethylolpropane and glycerin Polyglycidyl ether of polyether polyol obtained by adding alkylene oxide, diglycidyl ester of aliphatic long-chain dibasic acid It is. In addition, monoglycidyl ethers of higher aliphatic alcohols, phenols, cresols, butylphenols, polyether alcohol monoglycidyl ethers obtained by adding alkylene oxides to these, glycidyl esters of higher fatty acids, epoxidized soybean oil, epoxy Examples include octyl stearate, butyl epoxy stearate, and epoxidized polybutadiene.

Commercially available products that can be suitably used as the aromatic and aliphatic epoxy compounds include jER801, jER828, jER-1001, jER-1004, jER-1010, jERYX-4000, jERYDE-305, jER871, jER872 (and above, Mitsubishi Chemical). PY-306, 0163, DY-022 (Ciba Geigy), Adeka Arcles KRM-2720, Adeka Resin EP-4100, Adeka Resin EP-4000, Adeka Resin EP-4080, Adeka Resin EP-4088, Adeka Resin EP-4900, Adekaglycilol ED-505, Adekaglycilol ED-506 (above, manufactured by ADEKA Corporation), Epolite M-1230, Epolite EHDG-L, Epolite 40E, Epolite 100 Epolite 200E, Epolite 400E, Epolite 70P, Epolite 200P, Epolite 400P, Epolite 1500NP, Epolite 1600, Epolite 80MF, Epolite 100MF, Epolite 4000, Epolite 3002, Epolite FR-1500 (above, manufactured by Kyoeisha Chemical Co., Ltd.), Santo Tote ST3000, Epototo YD-716, YH-300, PG-202, PG-207, Epototo YD-172, YDPN638 (above, manufactured by Nippon Steel & Sumikin Chemical Co., Ltd.) Denacol EX321, Denacol EX313, Denacol 314, Denacol EX-411, EM-150 (manufactured by Nagase ChemteX Corporation), EPPN-201, EOCN-1020, EPPN-501H (Nippon Kayaku Co., Ltd.), OGSOL PG- 00, OGSOL EG-200 (manufactured by Osaka Gas Chemicals Co., Ltd.), and the like.

Specific examples of the oxetane compound include the following compounds. 3-ethyl-3-hydroxymethyloxetane, 3- (meth) allyloxymethyl-3-ethyloxetane, (3-ethyl-3-oxetanylmethoxy) methylbenzene, 4-fluoro- [1- (3-ethyl-3 -Oxetanylmethoxy) methyl] benzene, 4-methoxy- [1- (3-ethyl-3-oxetanylmethoxy) methyl] benzene, [1- (3-ethyl-3-oxetanylmethoxy) ethyl] phenyl ether, isobutoxymethyl (3-ethyl-3-oxetanylmethyl) ether, isobornyloxyethyl (3-ethyl-3-oxetanylmethyl) ether, isobornyl (3-ethyl-3-oxetanylmethyl) ether, 2-ethylhexyl (3-ethyl- 3-Oxetanylmethyl) ether, ethyldiethylene glycol (3-ethyl-3-oxetanylmethyl) ether, dicyclopentadiene (3-ethyl-3-oxetanylmethyl) ether, dicyclopentenyloxyethyl (3-ethyl-3-oxetanylmethyl) ether, dicyclopentenyl ( 3-ethyl-3-oxetanylmethyl) ether, tetrahydrofurfuryl (3-ethyl-3-oxetanylmethyl) ether, tetrabromophenyl (3-ethyl-3-oxetanylmethyl) ether, 2-tetrabromophenoxyethyl (3- Ethyl-3-oxetanylmethyl) ether, tribromophenyl (3-ethyl-3-oxetanylmethyl) ether, 2-tribromophenoxyethyl (3-ethyl-3-oxetanylmethyl) ether, 2-hydroxyethyl (3-ethyl) -3- Xetanylmethyl) ether, 2-hydroxypropyl (3-ethyl-3-oxetanylmethyl) ether, butoxyethyl (3-ethyl-3-oxetanylmethyl) ether, pentachlorophenyl (3-ethyl-3-oxetanylmethyl) ether, pentabromo Phenyl (3-ethyl-3-oxetanylmethyl) ether, bornyl (3-ethyl-3-oxetanylmethyl) ether, 3,7-bis (3-oxetanyl) -5-oxa-nonane, 3,3 ′-(1 , 3- (2-Methylenyl) propanediylbis (oxymethylene)) bis- (3-ethyloxetane), 1,4-bis [(3-ethyl-3-oxetanylmethoxy) methyl] benzene, 1,2-bis [(3-Ethyl-3-oxetanylmethoxy) methyl] ethane, 1,3-bi [(3-Ethyl-3-oxetanylmethoxy) methyl] propane, ethylene glycol bis (3-ethyl-3-oxetanylmethyl) ether, dicyclopentenylbis (3-ethyl-3-oxetanylmethyl) ether, triethylene glycol Bis (3-ethyl-3-oxetanylmethyl) ether, tetraethylene glycol bis (3-ethyl-3-oxetanylmethyl) ether, tricyclodecanediyldimethylene (3-ethyl-3-oxetanylmethyl) ether, trimethylolpropane Tris (3-ethyl-3-oxetanylmethyl) ether, 1,4-bis (3-ethyl-3-oxetanylmethoxy) butane, 1,6-bis (3-ethyl-3-oxetanylmethoxy) hexane, pentaerythritol tris (3-Echi -3-Oxetanylmethyl) ether, pentaerythritol tetrakis (3-ethyl-3-oxetanylmethyl) ether, polyethylene glycol bis (3-ethyl-3-oxetanylmethyl) ether, dipentaerythritol hexakis (3-ethyl-3- Oxetanylmethyl) ether, dipentaerythritol pentakis (3-ethyl-3-oxetanylmethyl) ether, dipentaerythritol tetrakis (3-ethyl-3-oxetanylmethyl) ether, caprolactone-modified dipentaerythritol hexakis (3-ethyl- 3-oxetanylmethyl) ether, caprolactone-modified dipentaerythritol pentakis (3-ethyl-3-oxetanylmethyl) ether, ditrimethylolpropanetetrakis (3- Til-3-oxetanylmethyl) ether, EO-modified bisphenol A bis (3-ethyl-3-oxetanylmethyl) ether, PO-modified bisphenol A bis (3-ethyl-3-oxetanylmethyl) ether, EO-modified hydrogenated bisphenol A bis Examples include (3-ethyl-3-oxetanylmethyl) ether, PO-modified hydrogenated bisphenol A bis (3-ethyl-3-oxetanylmethyl) ether, EO-modified bisphenol F (3-ethyl-3-oxetanylmethyl) ether, etc. be able to.

Examples of commercially available products that can be suitably used as the oxetane compound include Aron Oxetane OXT-101, Aron Oxetane OXT-121, Aron Oxetane OXT-221, Aron Oxetane OXT-212, Aron Oxetane OXT-211 (above, Toagosei Co., Ltd.) ), Etanacol EHO, Etanacol OXBP, Etanacol OXTP, Etanacol OXMA (Ube Industries, Ltd.). These can be used alone or in combination of two or more.
These oxetane compounds are effective and preferable when used particularly when flexibility is required.

Other cationically polymerizable organic substances (B) include oxolane compounds such as tetrahydrofuran and 2,3-dimethyltetrahydrofuran, cyclic acetal compounds such as trioxane, 1,3-dioxolane, and 1,3,6-trioxane cyclooctane, β -Cyclic lactone compounds such as propiolactone and ε-caprolactone, thiirane compounds such as ethylene sulfide and thioepichlorohydrin, thietane compounds such as 1,3-propyne sulfide and 3,3-dimethylthietane, and cyclics such as tetrahydrothiophene derivatives Thioether compound, ethylene glycol divinyl ether, alkyl vinyl ether, 2-chloroethyl vinyl ether, 2-hydroxyethyl vinyl ether, triethylene glycol divinyl ether, 1,4-cyclohexane Vinyl ether compounds such as dimethanol divinyl ether, hydroxybutyl vinyl ether, propenyl ether of propylene glycol, spiro ortho ester compounds obtained by reaction of epoxy compounds with lactones, ethylenically unsaturated compounds such as styrene, vinylcyclohexene, isobutylene, polybutadiene, and the above Derivatives and the like.

The thermal acid generator (C) used in the thermosetting resin composition of the present invention is not particularly limited as long as it is a compound that can generate an acid by heat. However, a double salt, which is an onium salt that releases a Lewis acid by heat, or a derivative thereof is preferable because the cured product obtained by curing the resin composition has good heat resistance. Representative examples of such compounds include the following general formula:
[A] ^{m +} [B] ^m-
And cation and anion salts represented by the formula:

Here, the cation [A] ^{m +} is not particularly limited, but is preferably onium that releases a Lewis acid by heat, and the structure thereof is, for example, the following general formula [(R ³ ) _a Q] ^{m +}
Can be expressed as

Further, here, R ³ is an organic group having 1 to 60 carbon atoms and possibly containing atoms other than carbon atoms. a is an integer of 1 to 5. The a R ^{3 s} are independent and may be the same or different. Further, at least one of the above organic groups having an aromatic ring is preferable because the resin has good curability. Q is an atom or atomic group selected from the group consisting of S, N, Se, Te, P, As, Sb, Bi, O, I, Br, Cl, F, and N = N. Further, when the valence of Q in the cation [A] ^{m +} is q, it is necessary that the relationship m = a−q holds (where N = N is treated as valence 0).

The anion [B] ^m- is not particularly limited, but is preferably a halide complex from the viewpoint of good curability of the resin, and the structure thereof is, for example, the following general formula [LX _b ]. ^m-
Can be expressed as

Further, here, L is a metal or metalloid which is a central atom of a halide complex, and B, P, As, Sb, Fe, Sn, Bi, Al, Ca, In, Ti, Zn, Sc, V, Cr, Mn, Co and the like. X is a halogen atom. b is an integer from 3 to 7. Further, when the valence of L in the anion [B] ^m− is p, it is necessary that the relationship m = b−p holds.

Specific examples of the anion [LX _b ] ^m- of the above general formula include tetrakis (pentafluorophenyl) borate [(C ₆ F ₅ ) ₄ B] ⁻ , tetrafluoroborate (BF ₄ ) ⁻ , hexafluorophosphate (PF ₆ ) ⁻ , hexafluoroantimonate (SbF ₆ ) ⁻ , hexafluoroarsenate (AsF ₆ ) ⁻ , hexachloroantimonate (SbCl ₆ ) ^{− and the} like.

Further, the anion [B] ^m- is represented by the following general formula [LX _b-1 (OH)] ^m-
The thing of the structure represented by can also be used preferably. L, X, and b are the same as described above. Other anions that can be used include perchlorate ion (ClO ₄ ) ⁻ , trifluoromethylsulfite ion (CF ₃ SO ₃ ) ⁻ , fluorosulfonate ion (FSO ₃ ) ⁻ , and toluenesulfonate anion. , Trinitrobenzenesulfonate anion, camphor sulfonate, nonafluorobutane sulfonate, hexadecafluorooctane sulfonate, tetraarylborate, tetrakis (pentafluorophenyl) borate and the like.

Among these, since the curability of the resin is good and the heat resistance of the cured product is high, a sulfonium salt is preferable. The sulfonium salt represented by the following general formula (2) or the sulfonium represented by the following general formula (3) More preferred are salts.

(Wherein R ²¹ and R ²² each independently represents an alkyl group having 1 to 10 carbon atoms, an aromatic group having 6 to 20 carbon atoms, or an arylalkyl group having 7 to 30 carbon atoms, The hydrogen atoms of the alkyl group, aromatic group, and arylalkyl group are each independently a hydroxyl group, a halogen group, an alkyl group having 1 to 10 carbon atoms, an aromatic group having 6 to 20 carbon atoms, a nitro group, or a sulfone group. In addition, R ²¹ and R ²² may form a ring structure with an alkyl chain having 2 to 7 carbon atoms, and R ²³ and R ²⁴ are each independently a hydrogen atom. Represents an atom, a halogen atom or an alkyl group having 1 to 10 carbon atoms, an aromatic group having 6 to 20 carbon atoms, an arylalkyl group having 7 to 30 carbon atoms, a nitro group, a cyano group, or a sulfone group. Group, aromatic group, arylal Each independently represents a hydroxyl group, a halogen group, an alkyl group having 1 to 10 carbon atoms, an aromatic group having 6 to 20 carbon atoms, an arylalkyl group having 7 to 30 carbon atoms, or a nitro group. , A sulfone group, and a cyano group, An ^q′- represents a ^q′- valent anion, q ′ represents 1 or 2, and p ′ represents a coefficient for maintaining a neutral charge.)

Wherein R ²⁵ is a hydrogen atom, a halogen atom, an alkyl group having 1 to 10 carbon atoms, an aromatic group having 6 to 20 carbon atoms, an arylalkyl group having 7 to 30 carbon atoms, a hydroxyl group, or a nitro group. Represents a sulfone group or a cyano group, and the hydrogen atom of the alkyl group, aromatic group or arylalkyl group independently represents a hydroxyl group, a halogen group, an alkyl group having 1 to 10 carbon atoms, or 6 to 20 carbon atoms. R ²⁶ represents a hydrogen atom, an alkyl group having 1 to 10 carbon atoms, a carbon atom, or an aryl group having 7 to 30 carbon atoms, a nitro group, a sulfone group, or a cyano group. Represents an aromatic group having 6 to 20 atoms and an arylalkyl group having 7 to 30 carbon atoms, and the hydrogen atoms of the alkyl group, aromatic group and arylalkyl group are each independently a hydroxyl group, a halogen group or a carbon atom. Number 1 ~ 0 alkyl group, an aromatic group having 6 to 20 carbon atoms, an arylalkyl group having 7 to 30 carbon atoms, a nitro group, a sulfonic group, .R ²⁷ that may be substituted with a cyano group, a methylene constituting The group represents a halogen group, an alkyl group having 1 to 10 carbon atoms that may be substituted with a group represented by —O— or S—, and An ^{q ″ −} represents a ^{q ″} -valent anion. Q ″ represents 1 or 2, and p ″ represents a coefficient for keeping the charge neutral.)

In the compounds represented by the general formulas (2) and (3), the halogen atoms represented by R ²³ , R ²⁴ and R ²⁵ and R ²¹ , R ²² , R ²³ , R ²⁴ , R ²⁵ , R ²⁶ and Examples of the halogen atom that may be substituted with the group represented by R ²⁷ include fluorine, chlorine, bromine, iodine, and the like. R ²¹ , R ²² , R ²³ , R ²⁴ , R ²⁵ , R ²⁶ and R An alkyl group having 1 to 10 carbon atoms represented by ²⁷ and a group having 1 to 10 carbon atoms that may be substituted by a group represented by R ²¹ , R ²² , R ²³ , R ²⁴ , R ²⁵ and R ^26. As the alkyl group, methyl, ethyl, propyl, isopropyl, butyl, s-butyl, t-butyl, isobutyl, amyl, isoamyl, t-amyl, hexyl, cyclohexyl, heptyl, octyl Nonyl, ethyloctyl, 2-methoxyethyl, 3-methoxypropyl, 4-methoxybutyl, 2-butoxyethyl, methoxyethoxyethyl, methoxyethoxyethoxyethyl, 3-methoxybutyl, 2-methylthioethyl, fluoromethyl, difluoromethyl, Trifluoromethyl, chloromethyl, dichloromethyl, trichloromethyl, bromomethyl, dibromomethyl, tribromomethyl, difluoroethyl, trichloroethyl, dichlorodifluoroethyl, pentafluoroethyl, heptafluoropropyl, nonafluorobutyl, decafluoropentyl, trideca Fluorohexyl, pentadecafluoroheptyl, heptadecafluorooctyl, methoxymethyl, 1,2-epoxyethyl, methoxyethyl, methoxyethoxymethyl, Methylthiomethyl, ethoxyethyl, butoxymethyl, t-butylthiomethyl, 4-pentenyloxymethyl, trichloroethoxymethyl, bis (2-chloroethoxy) methyl, methoxycyclohexyl, 1- (2-chloroethoxy) ethyl, 1-methyl -1-methoxyethyl, ethyldithioethyl, trimethylsilylethyl, t-butyldimethylsilyloxymethyl, 2- (trimethylsilyl) ethoxymethyl, t-butoxycarbonylmethyl, ethyloxycarbonylmethyl, ethylcarbonylmethyl, t-butoxycarbonylmethyl, Acryloyloxyethyl, methacryloyloxyethyl, 2-methyl-2-adamantyloxycarbonylmethyl, acetylethyl, 2-methoxy-1-propenyl, hydroxymethyl, 2-hydro Ciethyl, 1-hydroxyethyl, 2-hydroxypropyl, 3-hydroxypropyl, 3-hydroxybutyl, 4-hydroxybutyl, 1,2-dihydroxyethyl and the like, and the methylene group in the alkyl group is —O— , —CO—, —OCO—, —COO—, —C═C—, —NHCO—, —NH— or —CONH— may be substituted. In addition, an aromatic group having 6 to 20 carbon atoms represented by R ²¹ , R ²² , R ²³ , R ²⁴ , R ²⁵ and R ²⁶ , and R ²¹ , R ²² , R ²³ , R ²⁴ , R ²⁵ and R ^Examples of the aromatic group having 6 to 20 carbon atoms that may be substituted with the group represented by ²⁶ include phenyl, naphthyl, anthranyl, and the like, and R ²¹ , R ²² , R ²³ , R ²⁴ , R ²⁵ and ^R 7 to 30 carbon atoms represented by ²⁶ arylalkyl group and ^{R 21, R 22, R 23} , R 24, R 25 and the number of carbon atoms that may be substituted with the group represented by ^{R 26} As the arylalkyl group having 7 to 30 carbon atoms, a combination of the above-described alkyl group having 1 to 10 carbon atoms and an aromatic group having 6 to 20 carbon atoms can be used.

Examples of the q ′ or q ″ valent anion represented by p′An ^q′— and ^{p ″} An ^{q ″ —} in the general formulas (2) and (3) include a methanesulfonate anion and dodecylsulfone. Acid anion, benzenesulfonate anion, toluenesulfonate anion, trifluoromethanesulfonate anion, naphthalenesulfonate anion, diphenylamine-4-sulfonate anion, 2-amino-4-methyl-5-chlorobenzenesulfonate anion, 2-amino -5-nitrobenzenesulfonic acid anion, JP 10-235999 A, JP 10-337959 A, JP 11-102088 A, JP 2000-108510 A, JP 2000-168233 A, JP Japanese Patent Laid-Open No. 2001-209969, Japanese Patent Laid-Open No. 2001-322354 JP-A-2006-248180, JP-A-2006-297907, JP-A-8-253705, JP-T-2004-503379, JP-A-2005-336150, International Publication 2006/28006, etc. In addition to organic sulfonate anions such as sulfonate anion, chloride ion, bromide ion, iodide ion, fluoride ion, chlorate ion, thiocyanate ion, perchlorate ion, hexafluorophosphate ion, hexafluoro Antimonate ion, tetrafluoroborate ion, octyl phosphate ion, dodecyl phosphate ion, octadecyl phosphate ion, phenyl phosphate ion, nonylphenyl phosphate ion, 2,2'-methylenebis (4,6-di-t- Butylphenyl) phosphonate ion, tetrakis (Pentafluorophenyl) borate ion, quencher anion that has the function of de-exciting (quenching) active molecules in an excited state, cyclopentadienyl ring, carboxyl group, phosphonic acid group, sulfonic acid group, etc. And metallocene compound anions such as ferrocene and luteocene having an anionic group. Of these, hexafluorophosphate ions, hexafluoroantimonate ions, and tetrakis (pentafluorophenyl) borate ions are preferred because of their high heat resistance.

The range of the temperature at which the thermal acid generator (C) used in the thermosetting resin composition of the present invention can generate an acid by heat and cure the resin composition is not particularly limited, but suitable heat resistance Is preferably 50 ° C. to 250 ° C., more preferably 100 ° C. to 220 ° C., still more preferably 130 ° C. to 200 ° C., and more preferably 150 ° C. More preferably, it is from 180 ° C to 180 ° C.

In addition, commercially available products that can be suitably used as the thermal acid generator (C) used in the thermosetting resin composition of the present invention include the compounds shown below, specific names include Sun-Aid SI-B2A, Sun-Aid SI-B3A, Sun-Aid SI-B3, Sun-Aid SI-B4, Sun-Aid SI-60, Sun-Aid SI-80, Sun-Aid SI-100, Sun-Aid SI-110, Sun-Aid SI-150 (manufactured by Sanshin Chemical Industry Co., Ltd.), Adeka Opton CP-66 ADEKA OPTON CP-77 (manufactured by ADEKA Co., Ltd.) and the like. These can be used alone or in combination of two or more.

In the thermosetting resin composition of the present invention, the content of the cationic dye (A) is not particularly limited, but it is preferably a single or a total of a plurality of types in the thermosetting resin composition of the present invention, preferably 0.01. The heat resistance of the cured product is particularly good in the range of ˜50 mass%, more preferably in the range of 0.05 to 30 mass%. The content of the cationically polymerizable organic substance (B) is not particularly limited, but is preferably 5 to 99.5% by mass, more preferably 5 to 99.5% by mass, alone or in total of a plurality of types. 20 to 99% by mass is preferable because of good heat resistance. Although content of the said thermal acid generator (C) is not specifically limited, Since the heat resistance of the hardened | cured material of a resin composition is high, in the thermosetting resin composition of this invention individually or in total of multiple types. The content is preferably 0.01 to 10% by mass, more preferably 0.1 to 5% by mass.

The use ratio of the thermal acid generator (C) with respect to the cationic polymerizable organic substance (B) is not particularly limited, and may be used at a generally normal use ratio within a range not impairing the object of the present invention. The thermal acid generator (C) is 0.05 to 10 parts by weight, preferably 0.5 to 10 parts by weight with respect to 100 parts by weight of the cationically polymerizable organic substance (B). It is suitable.

In the thermosetting resin composition of the present invention, a solvent capable of dissolving or dispersing each of the above components as necessary, for example, acetone, methyl ethyl ketone, methyl isobutyl ketone, diacetone alcohol, methyl cellosolve, ethyl cellosolve, chloroform, chloride Methylene, hexane, heptane, octane, cyclohexane, benzene, toluene, xylene, methanol, ethanol, isopropanol, cyclohexanone, dimethylformamide, dimethylacetamide, N-methylpyrrolidinone and the like can be added.

Further, as an optional component other than the cationic dye (A), the cationic polymerizable organic substance (B), and the thermal acid generator (C), a benzotriazole-based compound may be used as necessary as long as the effects of the present invention are not impaired. , Triazine and benzoate UV absorbers; phenol, phosphorus and sulfur antioxidants or latent antioxidants; cationic surfactants, anionic surfactants, nonionic surfactants, amphoteric interfaces Antistatic agent comprising activator, etc .; halogen compound, phosphate ester compound, phosphate amide compound, melamine compound, fluorine resin or metal oxide, (poly) phosphate melamine, (poly) phosphate piperazine, etc. Flame retardants; hydrocarbons, fatty acids, aliphatic alcohols, aliphatic esters, aliphatic amides or metal soaps; pigments, carbon Coloring agents such as silica gel; fumed silica, fine particle silica, silica, diatomaceous earth, clay, kaolin, diatomaceous earth, silica gel, calcium silicate, sericite, kaolinite, flint, feldspar powder, meteorite, attapulgite, talc, mica Silica-based inorganic additives such as mineralsite, pyrophyllite and silica; fillers such as glass fiber and calcium carbonate; crystallization agents such as nucleating agents and crystallization accelerators; silane coupling agents and flexible polymers Rubber elasticity imparting agent, sensitizer, other monomers, antifoaming agent, thickener, leveling agent, plasticizer, polymerization inhibitor, antistatic agent, flow regulator, coupling agent, adhesion promoter, etc. These various additives can be added singly or in combination of two or more. The total amount of these various additives is 50% by mass or less in the thermosetting resin composition of the present invention.

The antioxidant that can be added to the thermosetting resin composition of the present invention as needed is not particularly limited, but specific products shown below include ADK STAB AO-20 and ADK STAB. AO-30, ADK STAB AO-40, ADK STAB AO-50, ADK STAB AO-60, ADK STAB AO-80, ADK STAB AO-330 (manufactured by Adeka Co., Ltd.) and the like can be preferably used.

In addition, the ultraviolet absorber that can be added to the thermosetting resin composition of the present invention as needed is not particularly limited, but specific products include ADK STAB LA-29 and ADK STAB LA. -31G, ADK STAB LA-32, ADK STAB LA-46, ADK STAB LA-52, ADK STAB LA-57, ADK STAB LA-63P, ADK STAB LA-68, ADK STAB LA-72, ADK STAB LA-77Y, ADK STAB LA-81, ADK STAB LA -82, ADK STAB LA-87 (above, manufactured by ADEKA Corporation) and the like can be suitably used.

The curing method of the thermosetting resin composition of the present invention is not particularly limited, and examples thereof include curing with a hot plate such as a hot plate, curing method with an air oven, an inert gas oven, a vacuum oven, a hot air circulation oven, and the like.

The heating conditions for thermosetting the thermosetting resin composition of the present invention are not particularly limited, but are preferably from 130 ° C. to 200 ° C., and from 150 ° C. to 180 ° C. in that a cured product having suitable heat resistance can be obtained. Is more preferable. If the heating temperature exceeds 200 ° C., there is a concern about degradation of performance due to thermal degradation such as pigment decomposition, resin discoloration, or volatilization of composition components. There is a risk of failure.

The curing time for thermosetting of the thermosetting resin composition of the present invention is not particularly limited, but is preferably 10 minutes to 1 hour in terms of obtaining a cured product having suitable heat resistance, and 10 minutes to 30 minutes. Is more preferable. When the curing time exceeds 1 hour, the production time is long and not suitable for mass production. On the other hand, if the curing time is less than 10 minutes, the curing time is short and a reaction failure may occur.

Specific uses of the cured product obtained by curing the thermosetting resin composition of the present invention include wavelength cut filters, paints, coating agents, lining agents, adhesives, printing plates, insulating varnishes, insulating sheets, laminates, and prints. Sealants, molding materials, putty, glass fiber impregnants, etc. for substrates, semiconductor devices, LED packages, liquid crystal inlets, organic ELs, optical elements, electrical insulation, electronic parts, separation membranes, etc. Sealing agents, passivation films for semiconductors and solar cells, interlayer insulating films, protective films, printed circuit boards, color TVs, PC monitors, personal digital assistants, color filters for CCD image sensors, electrode materials for plasma display panels , Printing ink, dental composition, stereolithography resin, both liquid and dry film, micro mechanical parts, glass fiber cable coating, holographic recording material Can be exemplified a variety of applications, there is no particular restriction on the use, it is preferably used as a wavelength cut filter.

When the cured product obtained by curing the thermosetting resin composition of the present invention is used as a wavelength cut filter, a heat ray cut filter mounted on a window glass of an automobile or a building; a digital still camera, a digital video For visual sensitivity correction for solid-state imaging devices such as CCD and CMOS in solid-state imaging devices such as cameras, surveillance cameras, in-vehicle cameras, web cameras, and mobile phone cameras; automatic exposure meters; display devices such as plasma displays Can do.

Hereinafter, the wavelength cut filter of the present invention will be described based on embodiments.
The wavelength cut filter of the present invention can be used without being limited to the embodiments described below.

The wavelength cut filter of the present invention has a coating layer (I) made of a cured product of the thermosetting resin composition of the present invention on one surface of a glass substrate (H), and the other side of the glass substrate (H). The surface is formed by laminating an infrared reflecting film (J). As shown in FIG. 1, the side having the coating layer (I) may be the light incident side. As shown in FIG. The side having the film (J) may be the light incident side. Hereinafter, each layer will be described in order.

<Glass substrate (H)>
The glass substrate (H) used in the wavelength cut filter of the present invention can be used by appropriately selecting from colorless or colored transparent glass materials in the visible range, but soda lime glass, white plate glass, borosilicate glass. Further, tempered glass, quartz glass, phosphate glass and the like can be used, and infrared absorbing glass and blue glass containing a trace amount of metal components can be used. Among them, soda lime glass is preferable because it is inexpensive and easily available, and white plate glass, borosilicate glass, and tempered glass are preferable because they are easily available and have high hardness and excellent workability.
Infrared absorbing glass and blue glass are preferable because the wavelength cut performance of the wavelength cut filter is further improved.

Furthermore, after pre-treating the glass substrate (H) with a silane coupling agent or the like, the coating liquid is applied to form a coating layer (I) containing the dye described later, and then the dye after drying the coating liquid Adhesiveness of the coating layer (I) containing the glass substrate to the glass substrate is enhanced.

Examples of the silane coupling agent include epoxy-functional alkoxysilanes such as γ-glycidoxypropyltrimethoxysilane, γ-glycidoxypropylmethyldiethoxysilane, and β- (3,4-epoxycyclohexyl) ethyltrimethoxysilane. Amino-functional alkoxysilanes such as N-β (aminoethyl) -γ-aminopropyltrimethoxysilane, γ-aminopropyltriethoxysilane, N-phenyl-γ-aminopropyltrimethoxysilane, γ-mercaptopropyltrimethoxy Examples include mercapto functional alkoxysilanes such as silane.

Further, the wavelength cut filter of the present invention may have an underlayer between the glass substrate (H) and the coating layer (I). The underlayer is made of a coating liquid in which aggregates of metal oxide fine particles having an average secondary particle diameter of 20 to 250 nm in which primary particles having an average primary particle diameter of 5 to 100 nm are aggregated are dispersed in a solvent shown below. It is obtained by coating and has a thickness of 30 to 1000 nm. The aggregate of the metal oxide fine particles is preferably 0.1 to 50% by mass with respect to the total amount of the coating solution.

The thickness of the glass substrate (H) is not particularly limited, but is preferably 0.05 to 8 mm, and more preferably 0.05 to 1 mm from the viewpoint of weight reduction and strength.

<Coating layer (I)>
The coating layer (I) made of the cured product obtained by curing the thermosetting resin composition of the present invention used for the wavelength cut filter of the present invention was obtained by preparing a coating liquid by the method described in the Examples. It can be formed by applying the coating liquid on the glass substrate (H), drying, and thermosetting.
As the coating method of the coating liquid, spin coating method, dip coating method, spray coating method, bead coating method, air knife coating method, curtain coating method, roller coating method, wire bar coating method, gravure coating method, die coating method, Examples include an extrusion coating method using a hopper.

The thickness of the coating layer (I) is preferably 1 to 200 μm because a uniform film can be obtained and it is advantageous for thinning.

<Infrared reflective film (J)>
The infrared reflective film (J) used in the cut filter of the present invention has a function of blocking light in a wavelength region of 700 to 1200 nm, and a low refractive index layer and a high refractive index layer are alternately laminated. It is formed of a dielectric multilayer film.

As a material constituting the low refractive index layer, a material having a refractive index of 1.2 to 1.6 can be used. For example, silica, alumina, lanthanum fluoride, magnesium fluoride, aluminum hexafluoride sodium, etc. Can be mentioned.

As the material constituting the high refractive index layer, a material having a refractive index of 1.7 to 2.5 can be used. For example, titanium oxide, zirconium oxide, tantalum pentoxide, niobium pentoxide, lanthanum oxide, oxidation Examples thereof include yttrium, zinc oxide, zinc sulfide, indium oxide, and the like, and those containing these as main components and containing a small amount of titanium oxide, tin oxide, cerium oxide, and the like.

The method for laminating the low refractive index layer and the high refractive index layer is not particularly limited as long as a dielectric multilayer film in which these layers are laminated is formed. For example, a CVD method, a sputtering method on a glass substrate. And a method of forming a dielectric multilayer film in which a low refractive index layer and a high refractive index layer are alternately laminated by a vacuum deposition method or the like. It is also possible to form a dielectric multilayer film in advance and attach it to the glass substrate with an adhesive.
The number of laminated layers is 10 to 80, and 25 to 50 is preferable from the viewpoint of process and strength.

The thickness of the low refractive index layer and the high refractive index layer is usually 1/10 to 1/2 of the wavelength λ (nm) of the light beam to be blocked. When the thickness is less than 0.1λ or greater than 0.5λ, the product (nd) of the refractive index (n) and the physical film thickness (d) is significantly different from the optical film thickness expressed as a multiple of λ / 4. There is a risk that the wavelength cannot be blocked or transmitted.

As the infrared reflective film (J), in addition to the dielectric multilayer film, a film containing a dye having a maximum absorption wavelength of 700 to 1100 nm, a film in which a polymer is laminated, or a film formed by applying a cholesteric liquid crystal The thing using organic materials, such as these, can also be used.

Hereinafter, the present invention will be described in more detail with reference to examples and the like, but the present invention is not limited to these examples and the like.

[Preparation of Thermosetting Resin Compositions 1 to 25]
Resin (B) and solvent (D) were mixed at the mass ratios shown in [Table 1] to [Table 3A], and stirred until no insoluble matter was found to obtain solution α. In addition, the cationic dye (A), the thermal acid generator (C), the solvent (D), and the additive (E) are mixed at the mass ratio shown in [Table 1] to [Table 3A], and insoluble matter is eliminated. To obtain a solution β. Immediately before use, the solution α and the solution β were mixed and stirred until uniform to obtain thermosetting resin compositions 1 to 25 corresponding to Examples 1 to 25. In addition, each code | symbol in [Table 1]-[Table 3A] represents the following, respectively. In addition, Examples 1 to 25 in [Table 1] to [Table 3A] mean the thermosetting resin compositions 1 to 25.

[Preparation of Comparative Resin Compositions 1 to 4]
Except for changing the thermal acid generator (C) to the photoacid generator (C ′) at the mass ratio shown in [Table 3], the same method as for preparing the thermosetting resin compositions 1 to 25 described above was used. Comparative resin compositions 1 to 4 corresponding to Comparative Examples 1 to 4 were obtained. In addition, each code | symbol in [Table 3] represents the following, respectively. Further, Comparative Examples 1 to 4 in [Table 3] mean Comparative Resin Compositions 1 to 4.

A-1: Compound No. 100 N, N-bis (trifluoromethanesulfonyl) imidate A-2: Compound No. 101, N, N-bis (trifluoromethanesulfonyl) imidate A-3: Compound No. 102, N, N-bis (trifluoromethanesulfonyl) imidate A-4: Compound No. 103, N, N-bis (trifluoromethanesulfonyl) imidate A-5: Compound No. 104, N, N-bis (trifluoromethanesulfonyl) imidate A-6: 76, N, N-bis (trifluoromethanesulfonyl) imidate A-7: Compound No. 100 N, N-bis (fluorosulfonyl) imidate A-8: Compound No. 100 N, N-bis (nonafluorobutanesulfonyl) imidate A-9: Compound No. 100 trifluoromethanesulfonate A-10: Compound no. 100 nonafluorobutane sulfonate A-11: Compound No. 100 tetrakis (pentafluorophenyl) borate A-12: Compound no. 100 tris (trifluoromethanesulfonyl) methidoate A-13: Compound no. 100 hexafluorophosphate A-14: Compound no. 76 Tetrakis (pentafluorophenyl) borate A-15: Compound No. 99 tetrakis (pentafluorophenyl) borate A-16: Compound no. 102 tetrakis (pentafluorophenyl) borate A-17: Compound No. 37 tris (pentafluoroethyl) trifluorophosphate A-18: Compound No. 103 tris (pentafluoroethyl) trifluorophosphate A-19: Compound no. 105 tris (pentafluoroethyl) trifluorophosphate A-20: Compound No. 106 tris (pentafluoroethyl) trifluorophosphate A-21: compound no. 107 tetrakis (pentafluorophenyl) borate B-1: Celoxide 2021P (epoxy compound manufactured by Daicel Corporation)
B-2: jER-1004 (epoxy compound manufactured by Mitsubishi Chemical Corporation)
B-3: jER-1010 (Epoxy compound manufactured by Mitsubishi Chemical Corporation)
B-4: EHPE-3150 (Epoxy compound manufactured by Daicel Corporation)
B-5: EPPN-201 (epoxy compound manufactured by Nippon Kayaku Co., Ltd.)
B-6: Adeka Resin EP-4000 (epoxy compound manufactured by ADEKA Corporation)
B-7: Adeka Resin EP-4080 (epoxy compound manufactured by ADEKA Corporation)
B-8: Adeka Resin EP-4088S (epoxy compound manufactured by ADEKA Corporation)
B-9: Adeka Resin EP-4100E (epoxy compound manufactured by ADEKA Corporation)
B-10: OGSOL EG-200 (epoxy compound manufactured by Osaka Gas Chemical Co., Ltd.)
B-11: Adeka Resin EP-4400 (epoxy compound manufactured by ADEKA Corporation)
B-12: Adekaglycilol ED-503 (epoxy compound manufactured by ADEKA Corporation)
B-13: Aron Oxetane OXT-101 (Oxetane compound manufactured by Toa Gosei Co., Ltd.)
B-14: Aron Oxetane OXT-211 (Oxetane compound manufactured by Toa Gosei Co., Ltd.)
B-15: Adekaglycilol ED-523T (epoxy compound manufactured by ADEKA Corporation)
B-16: Adekaglycilol ED-503 (epoxy compound manufactured by ADEKA Corporation)
B-17: Adekaglycilol ED-505 (epoxy compound manufactured by ADEKA Corporation)
C-1: Sun-Aid SI-100 (thermal acid generator manufactured by Sanshin Chemical Industry Co., Ltd.)
C-2: Sun-Aid SI-60 (thermal acid generator manufactured by Sanshin Chemical Industry Co., Ltd.)
C-3: Sun-Aid SI-80 (thermal acid generator manufactured by Sanshin Chemical Industry Co., Ltd.)
C-4: Sun-Aid SI-150 (thermal acid generator manufactured by Sanshin Chemical Industry Co., Ltd.)
C-5: Sun-Aid SI-B3 (thermal acid generator manufactured by Sanshin Chemical Industry Co., Ltd.)
C-6: Sun-Aid SI-B3A (thermal acid generator manufactured by Sanshin Chemical Industry Co., Ltd.)
C-7: Sun-Aid SI-110 (thermal acid generator manufactured by Sanshin Chemical Industry Co., Ltd.)
C′-1: Adekaoptomer SP-150 (Photoacid generator manufactured by ADEKA Corporation)
C′-2: Adekaoptomer SP-172 (Photoacid generator manufactured by ADEKA Corporation)
C′-3: CPI-100P (Photo acid generator manufactured by San Apro Co., Ltd.)
D-1: Methyl ethyl ketone D-2: Diacetone alcohol D-3: Dimethylacetamide D-4: Cyclohexanone E-1: Adekastab AO-60 (An antioxidant manufactured by ADEKA Corporation)
E-2: ADK STAB AO-20 (Andeka manufactured by ADEKA Corporation)
E-3: ADK STAB AO-40 (An antioxidant manufactured by ADEKA Corporation)
E-4: ADK STAB AO-30 (An antioxidant manufactured by ADEKA Corporation)
E-5: ADK STAB AO-80 (Andeka manufactured by ADEKA Corporation)

[Examples 1 to 25]
Each of the thermosetting resin compositions 1 to 25 was spin-coated on a glass substrate at 300 rpm × 7 seconds, and dried on a hot plate (90 ° C., 10 minutes). After drying, the coated glass substrate was cured on a hot plate (150 ° C., 10 minutes) to obtain Examples 1 to 25 corresponding to the thermosetting resin compositions 1 to 25, respectively.

[Comparative Examples 1 to 4]
Comparative resin compositions 1 to 4 were each spin-coated on a glass substrate under the same conditions as in the Examples, and dried on a hot plate. After drying, the coated glass substrate was exposed (300 mJ / cm ² ) with an ultra high pressure mercury lamp and cured to obtain Comparative Examples 1 to 4 corresponding to Comparative Resin Compositions 1 to 4, respectively.

[Heat resistance test]
Each cured product obtained in Examples 1 to 25 and Comparative Examples 1 to 4 was examined for heat resistance under the following conditions.
The cured product was heat-treated at 200 ° C. for 30 minutes in an atmospheric oven, and before and after the heat treatment, the transmittance at the maximum absorption wavelength of the dye of the cured product was measured using an ultraviolet-visible-near infrared spectrophotometer V-570 (manufactured by JASCO Corporation). The dye residual ratio (%) was determined by the following formula.

Dye residual ratio = (transmittance after heat test) / (transmittance before heat test) × 100

The values of the calculated dye residual ratio are shown in the following [Table 4] as heat resistance evaluation values.

From the results of [Table 4] above, it is clear that a cured product obtained by curing the thermosetting resin composition of the present invention has high heat resistance.

From the above results, the cured product obtained by curing the thermosetting resin composition of the present invention containing the cationic dye (A), the cationic polymerizable organic substance (B), and the thermal acid generator (C) is heat resistant. It is excellent. Therefore, the thermosetting resin composition of the present invention is useful for a wavelength cut filter.

Claims (9)

1. A thermosetting resin composition containing a cationic dye (A), a cationic polymerizable organic substance (B), and a thermal acid generator (C).
2. The thermosetting resin composition according to claim 1, wherein the cationic dye (A) is a polymethine compound represented by the following general formula (1).
   

   

   (In the formula, A represents a group selected from (a) to (m) of the following group I; A ′ represents a group selected from (a ′) to (m ′) of the following group II; Represents a linking group containing a methine chain represented by the following general formula (1-A), An ^q- represents a q-valent anion, q represents 1 or 2, and p keeps the charge neutral. Represents the coefficient.)
   

   

   

   (Wherein, ring C and ring C ′ each independently represent a benzene ring, a naphthalene ring, a phenanthrene ring or a pyridine ring,
   In the formula, R ¹ and R ¹ ′ are each independently a hydrogen atom, a hydroxyl group, a halogen atom, a nitro group, a cyano group, a carboxyl group, an amino group, an amide group, a ferrocenyl group, an aryl group having 6 to 20 carbon atoms, Represents an arylalkyl group having 7 to 30 carbon atoms or an alkyl group having 1 to 8 carbon atoms, and the aryl group, arylalkyl group and alkyl group in R ¹ and R ¹ ′ are each independently a hydroxyl group. , A halogen atom, a nitro group, a cyano group, a carboxyl group, an amino group, an amide group or a ferrocenyl group, the arylalkyl group in the R ¹ and R ¹ ′ and the methylene group in the alkyl group are Each independently, —O—, —S—, —CO—, —COO—, —OCO—, —SO ₂ —, —NH—, —CONH—, —NHCO—, —N═CH— or —CH. = May be substituted by H-,
   In the formula, R ² to R ⁹ and R ² ′ to R ⁹ ′ each independently represent a hydroxyl group, a halogen atom, a nitro group, a cyano group, a carboxyl group, an amino group, an amide group, a ferrocenyl group, or 6 to 20 carbon atoms. An aryl group of 7 to 30 carbon atoms or an alkyl group of 1 to 8 carbon atoms, and the aryl group, arylalkyl group in R ² to R ⁹ and R ² ′ to R ⁹ ′ and The hydrogen atom of the alkyl group may be independently substituted with a hydroxyl group, a halogen atom, a nitro group, a cyano group, a carboxyl group, an amino group, an amide group or a ferrocenyl group, and the R ² to R ⁹ and R ² ′ may be substituted. The arylalkyl group in —R ⁹ ′ and the methylene group in the alkyl group are each independently —O—, —S—, —CO—, —COO—, —OCO—, —SO ₂ —, —NH—. , -CONH-, -N CO -, - N = CH- or may be replaced by -CH = CH-,
   In the formula, X and X ′ are each independently an oxygen atom, a sulfur atom, a selenium atom, —CR ⁵¹ R ⁵² —, a C 3-6 cycloalkane-1,1-diyl group, —NH— or — NY ² — and R ⁵¹ and R ⁵² each independently represent a hydrogen atom, a hydroxyl group, a halogen atom, a nitro group, a cyano group, a carboxyl group, an amino group, an amide group, a ferrocenyl group, or an aryl group having 6 to 20 carbon atoms. Group, an arylalkyl group having 7 to 30 carbon atoms or an alkyl group having 1 to 8 carbon atoms, wherein the aryl group, arylalkyl group and alkyl group in R ⁵¹ and R ⁵² are each independently a hydrogen atom. It may be substituted with a hydroxyl group, a halogen atom, a nitro group, a cyano group, a carboxyl group, an amino group, an amide group or a ferrocenyl group, and the arylalkyl group in R ⁵¹ and R ⁵² and The methylene groups in the alkyl group are each independently —O—, —S—, —CO—, —COO—, —OCO—, —SO ₂ —, —NH—, —CONH—, —NHCO—, — May be substituted with N═CH— or —CH═CH—,
   In the formula, Y, Y ′ and Y ² are each independently a hydrogen atom, a hydroxyl group, a halogen atom, a cyano group, a carboxyl group, an amino group, an amide group, a ferrocenyl group, a nitro group, or an aryl group having 6 to 20 carbon atoms. Represents an arylalkyl group having 7 to 30 carbon atoms or an alkyl group having 1 to 8 carbon atoms, and the aryl group, arylalkyl group, and methylene group in the alkyl group in Y, Y ′ and Y ² are Each independently, —O—, —S—, —CO—, —COO—, —OCO—, —SO ₂ —, —NH—, —CONH—, —NHCO—, —N═CH— or —CH. ═CH— may be substituted,
   In the formula, r and r ′ are 0 or (a) to (e), (g) to (j), (l), (m), (a ′) to (e ′), (g ′) to ( j ′) represents one or more numbers that can be substituted in (l ′) and (m ′). )
   

   

   (In the formula, k represents an integer of 0 to 4,
   In the formula, each hydrogen atom of the methine chain is independently a hydroxyl group, a halogen atom, a cyano group, —NRR ′, an aryl group having 6 to 20 carbon atoms, an arylalkyl group having 7 to 30 carbon atoms, or 1 carbon atom. May be substituted with an alkyl group of ˜8, and the alkyl group may constitute a ring structure of 3 to 10 carbon atoms connecting any two carbon atoms of the methine chain. Each independently represents a hydroxyl group, a halogen atom, a cyano group, —NRR ′, an aryl group having 6 to 20 carbon atoms, an arylalkyl group having 7 to 30 carbon atoms, or an alkyl group having 1 to 8 carbon atoms. R and R ′ in the methine chain and the ring structure may each independently be an aryl group having 6 to 20 carbon atoms, an arylalkyl group having 7 to 30 carbon atoms, or 1 carbon atom. Represents an alkyl group of ~ 8 In the methine chain and the ring structure, —NRR ′, an aryl group, an arylalkyl group, and a hydrogen atom in the alkyl group may be each independently further substituted with a hydroxyl group, a halogen atom, a cyano group, or —NRR ′. And the methine chain and the arylalkyl group in the ring structure and the methylene group in the alkyl group are each independently —O—, —S—, —CO—, —COO—, —OCO—, —SO _2. In some cases,-, -NH-, -CONH-, -NHCO-, -N = CH-, or -CH = CH- may be substituted. )
3. The thermosetting resin composition according to claim 1 or 2, wherein the cationically polymerizable organic substance (B) is at least one selected from the group consisting of an epoxy compound, an oxetane compound, and a cyclic acetal compound. .
4. The thermosetting resin composition according to any one of claims 1 to 3, wherein the cationically polymerizable organic substance (B) is an epoxy compound.
5. The thermosetting resin composition according to any one of claims 1 to 4, wherein the thermal acid generator (C) is a sulfonium salt.
6. 6. The thermal acid generator (C) is at least one selected from the group consisting of sulfonium salts represented by the following general formula (2) or (3): The thermosetting resin composition according to item 1.
   

   

   (Wherein R ²¹ and R ²² each independently represents an alkyl group having 1 to 10 carbon atoms, an aromatic group having 6 to 20 carbon atoms, or an arylalkyl group having 7 to 30 carbon atoms, The hydrogen atoms of the alkyl group, aromatic group, and arylalkyl group are each independently a hydroxyl group, a halogen group, an alkyl group having 1 to 10 carbon atoms, an aromatic group having 6 to 20 carbon atoms, a nitro group, or a sulfone group. , May be substituted with a cyano group, and R ²¹ and R ²² may form a ring structure with an alkyl chain having 2 to 7 carbon atoms,
   R ²³ and R ²⁴ each independently represents a hydrogen atom, a halogen atom or an alkyl group having 1 to 10 carbon atoms, an aromatic group having 6 to 20 carbon atoms, an arylalkyl group having 7 to 30 carbon atoms, nitro A hydrogen atom of the alkyl group, aromatic group or arylalkyl group independently represents a hydroxyl group, a halogen group, an alkyl group having 1 to 10 carbon atoms, or 6 to 6 carbon atoms. May be substituted with 20 aromatic groups, arylalkyl groups having 7 to 30 carbon atoms, nitro groups, sulfone groups, cyano groups,
   An ^q′− represents a ^q′- valent anion, q ′ represents 1 or 2, and p ′ represents a coefficient for maintaining a neutral charge. )
   

   

   Wherein R ²⁵ is a hydrogen atom, a halogen atom, an alkyl group having 1 to 10 carbon atoms, an aromatic group having 6 to 20 carbon atoms, an arylalkyl group having 7 to 30 carbon atoms, a hydroxyl group, or a nitro group. Represents a sulfone group or a cyano group, and the hydrogen atom of the alkyl group, aromatic group or arylalkyl group independently represents a hydroxyl group, a halogen group, an alkyl group having 1 to 10 carbon atoms, or 6 to 20 carbon atoms. May be substituted with an aromatic group, an arylalkyl group having 7 to 30 carbon atoms, a nitro group, a sulfone group, or a cyano group,
   R ²⁶ represents a hydrogen atom, an alkyl group having 1 to 10 carbon atoms, an aromatic group having 6 to 20 carbon atoms, or an arylalkyl group having 7 to 30 carbon atoms, and the alkyl group, aromatic group, aryl group The hydrogen atoms of the alkyl group are each independently a hydroxyl group, a halogen group, an alkyl group having 1 to 10 carbon atoms, an aromatic group having 6 to 20 carbon atoms, an arylalkyl group having 7 to 30 carbon atoms, or a nitro group. May be substituted with a sulfone group or a cyano group,
   R ²⁷ represents a C 1-10 alkyl group in which the constituting methylene group may be substituted with a halogen group, a group represented by —O— or S—,
   An ^{q ″ −} represents a q ″ valent anion, q ″ represents 1 or 2, and p ″ represents a coefficient for maintaining a neutral charge. )
7. The thermosetting resin composition according to any one of claims 1 to 6, wherein a composition obtained by dissolving or dispersing the thermosetting resin composition in an organic solvent is applied to a substrate and then cured by heating. A method for curing a thermosetting resin composition.
8. A cured product obtained by curing the thermosetting resin composition according to any one of claims 1 to 6.
9. A wavelength cut filter comprising at least a part of the cured product according to claim 8.

Images