[go: up one dir, main page]
More Web Proxy on the site http://driver.im/

WO2016171055A1 - Matériau d'alliage de cuivre et son procédé de production - Google Patents

Matériau d'alliage de cuivre et son procédé de production Download PDF

Info

Publication number
WO2016171055A1
WO2016171055A1 PCT/JP2016/061908 JP2016061908W WO2016171055A1 WO 2016171055 A1 WO2016171055 A1 WO 2016171055A1 JP 2016061908 W JP2016061908 W JP 2016061908W WO 2016171055 A1 WO2016171055 A1 WO 2016171055A1
Authority
WO
WIPO (PCT)
Prior art keywords
mass
copper alloy
compound particles
alloy material
content
Prior art date
Application number
PCT/JP2016/061908
Other languages
English (en)
Japanese (ja)
Inventor
恵人 藤井
岳己 磯松
樋口　優
Original Assignee
古河電気工業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 古河電気工業株式会社 filed Critical 古河電気工業株式会社
Priority to CN201680007533.XA priority Critical patent/CN107208191B/zh
Priority to JP2016567450A priority patent/JP6155405B2/ja
Priority to KR1020177019274A priority patent/KR102059917B1/ko
Publication of WO2016171055A1 publication Critical patent/WO2016171055A1/fr

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21B—ROLLING OF METAL
    • B21B3/00—Rolling materials of special alloys so far as the composition of the alloy requires or permits special rolling methods or sequences ; Rolling of aluminium, copper, zinc or other non-ferrous metals
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/02—Alloys based on copper with tin as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/04—Alloys based on copper with zinc as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/05—Alloys based on copper with manganese as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/08—Alloys based on copper with lead as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/10—Alloys based on copper with silicon as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/002—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working by rapid cooling or quenching; cooling agents used therefor
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21B—ROLLING OF METAL
    • B21B3/00—Rolling materials of special alloys so far as the composition of the alloy requires or permits special rolling methods or sequences ; Rolling of aluminium, copper, zinc or other non-ferrous metals
    • B21B2003/005—Copper or its alloys
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working

Definitions

  • the present invention relates to a copper alloy material and a method for manufacturing the same, and more particularly to a copper alloy material used for electrical and electronic parts such as lead frames used in semiconductor devices and a method for manufacturing the same.
  • a lead frame used in a semiconductor device such as an IC or LSI is formed by pressing a copper alloy material. At this time, processing strain remains in the material. If this processing strain remains, the material is warped during the subsequent etching process, and the dimensional accuracy of the lead pin interval of the lead frame decreases. For this reason, the lead frame after press working is usually subjected to heat treatment at 400 to 450 ° C. to remove the processing strain. During this heat treatment, the crystal structure of the copper alloy is recrystallized, so that the copper alloy material It is known that the strength of the steel tends to decrease. Therefore, the copper alloy material for electronic equipment used for the lead frame is required to have a characteristic (heat resistance) that does not decrease the strength even when the heat treatment is performed.
  • the copper alloy material for lead frames has a high degree of freedom in molding parts. It is also required to have good bending workability to enhance.
  • Cu-Ni-Sn-P-based alloys are widely provided as copper alloy materials that satisfy these requirements.
  • the Cu—Ni—Sn—P based alloy can have both high strength, high electrical conductivity, and good bending workability by precipitating a Ni—P based compound.
  • Patent Documents 1 to 9 by controlling the size and distribution of precipitates, in addition to tensile strength, electrical conductivity and bending workability, spring properties, stress relaxation properties, press workability, corrosion resistance, plating properties, solder wetting It has been studied to combine various properties such as heat resistance, migration resistance, and hot workability.
  • Cu—Ni—Sn—P alloy is an excellent alloy system that has high strength, high electrical conductivity, and good bending workability, but is heat treated at 400 to 450 ° C. applied to the lead frame after press working. It is hard to say that the heat resistance against is sufficient.
  • Patent Documents 1 to 9 Although attempts have been made to improve various material properties, they do not focus on improving heat resistance.
  • an object of the present invention is to provide a copper alloy material having a good heat resistance in addition to a high strength, a high conductivity, and a good bending workability, and a method for producing the same.
  • the present inventors have studied Cu—Ni—Sn—P based alloys used for electric and electronic parts such as lead frames, and 0.05 to 1.2 mass% of Ni and 0.01 to 0.01% of P. It has an alloy composition containing 0.15% by mass and 0.05 to 2.5% by mass of Sn, and the surface of the material after electropolishing is observed with an FE-SEM.
  • the gist configuration of the present invention is as follows. (1) An alloy containing 0.05 to 1.2% by mass of Ni, 0.01 to 0.15% by mass of P and 0.05 to 2.5% by mass of Sn, with the balance being Cu and inevitable impurities The surface of the material after electropolishing having a composition is observed by FE-SEM, and the ratio of the number of compound particles having a particle size of 5 to 30 nm per 1 ⁇ m ⁇ 1 ⁇ m viewing area is 20 particles / ⁇ m 2 or more. A copper alloy material, wherein the number ratio of the compound particles having a particle size exceeding 30 nm is 1 / ⁇ m 2 or less.
  • the content of Sn is more than 0.5% by mass and 2.5% by mass or less, the tensile strength is 500 MPa or more, and the conductivity is 25% IACS or more. Copper alloy material.
  • the method for producing a copper alloy material as described in any one of (1) to (4) above which comprises the following steps (a) to (e): (A) A melt casting step in which the cooling rate to 300 ° C. is 30 ° C./min or more. (B) A homogenization heat treatment step in which the temperature is raised at 5 ° C./min or more and maintained at 600 to 1000 ° C. for 30 minutes to 10 hours. (C) A hot rolling step in which the cooling rate to 300 ° C. is 30 ° C./min or more. (D) A cold rolling step in which the processing rate is 80% or more. (E) An annealing step of holding at 350 to 600 ° C. for 5 seconds to 10 hours.
  • the present invention 0.05 to 1.2% by mass of Ni, 0.01 to 0.15% by mass of P and 0.05 to 2.5% by mass of Sn, with the balance being Cu and inevitable impurities
  • the surface of the material after electrolytic polishing is observed with an FE-SEM, and the ratio of the number of compound particles having a particle diameter of 5 to 30 nm per field area of 1 ⁇ m ⁇ 1 ⁇ m is 20 particles / ⁇ m 2 or more.
  • copper having better heat resistance can be obtained by setting the number ratio of compound particles having a particle diameter of more than 30 nm to 1 / ⁇ m 2 or less. It is now possible to provide alloy materials.
  • FIG. 1 is an SEM photograph of the surface after electrolytic polishing of a copper alloy material of the present invention (Example 14) observed with an FE-SEM at a magnification of 50000 times.
  • FIG. 2 is an SEM photograph of the surface after electropolishing of Comparative Example 22 observed with an FE-SEM at a magnification of 50000 times.
  • the basic composition of the copper alloy material of the present invention contains 0.05 to 1.2% by mass of Ni, 0.01 to 0.15% by mass of P and 0.05 to 2.5% by mass of Sn, and the balance Are Cu and inevitable impurities.
  • Ni is an element that increases the strength by forming a solid solution with the matrix and forming a compound with P. Ni has the effect of increasing the electrical conductivity and heat resistance by generating a compound with P and precipitating this product. However, if the Ni content is less than 0.05% by mass, the effect cannot be sufficiently exerted, and if it exceeds 1.2% by mass, the conductivity is significantly reduced. Therefore, the Ni content is 0.05 to 1.2% by mass, preferably 0.10 to 1.00% by mass, and more preferably 0.10 to 0.40% by mass.
  • P 0.01 to 0.15% by mass
  • P is an element that contributes to an increase in strength, an increase in conductivity, and an improvement in heat resistance by forming a compound with Ni.
  • the P content is set to 0.01 to 0.15% by mass, preferably 0.01 to 0.10% by mass, and more preferably 0.05 to 0.10% by mass.
  • Sn 0.05 to 2.5% by mass
  • Sn is an element that contributes to an increase in strength and an improvement in heat resistance by dissolving in the matrix.
  • the Sn content is set to 0.05 to 2.5% by mass.
  • the tensile strength and electrical conductivity when emphasizing electrical conductivity in particular, if the Sn content is limited to 0.05 to 0.5% by mass, the tensile strength is 400 MPa or more and 50% IACS or more.
  • Ni, P and Sn as a basic composition, but as optional additional components, Fe, Zn, Pb, Si, Mg, Zr, Cr, Ti, Mn and Co At least one component selected from among them may be selectively contained.
  • Fe is an element that contributes to an increase in strength and an improvement in heat resistance by forming a compound with P.
  • the Fe content is preferably 0.001% by mass or more.
  • the Fe content is preferably 0.001 to 0.1% by mass, more preferably 0.001 to 0.05% by mass, and further preferably 0.001 to 0.01% by mass.
  • Zn 0.001 to 0.5 mass%
  • Zn is an element that contributes to an increase in strength, improvement in solder wettability, and improvement in plating properties by dissolving in the matrix phase.
  • the Zn content is 0.001% by mass or more. It is preferable to do.
  • the Zn content is preferably 0.001 to 0.5% by mass, more preferably 0.01 to 0.5% by mass, and further preferably 0.1 to 0.5% by mass.
  • Pb 0.001 to 0.05 mass%
  • the Pb content is preferably 0.001% by mass or more.
  • the Pb content is preferably 0.001 to 0.05% by mass, and more preferably 0.001 to 0.01% by mass.
  • Si is an element that contributes to an increase in strength.
  • the Si content is preferably 0.001% by mass or more.
  • the Si content is preferably 0.001 to 0.1% by mass, and more preferably 0.01 to 0.1% by mass.
  • Mg is an element that contributes to an increase in strength and an improvement in heat resistance. Further, for example, it contributes to improvement of stress relaxation resistance in a spring contact of an electronic component.
  • the Mg content is preferably 0.001% by mass or more. However, when the Mg content is more than 0.3% by mass, there is a concern that the electrical conductivity is lowered and inclusions are formed during casting. For this reason, the Mg content is preferably 0.001 to 0.3% by mass, and more preferably 0.01 to 0.3% by mass.
  • Zr 0.001 to 0.15 mass%
  • Zr is an element that contributes to an increase in strength and an improvement in heat resistance. Further, for example, it contributes to improvement of stress relaxation resistance in a spring contact of an electronic component.
  • the Zr content is preferably 0.001% by mass or more. However, when the Zr content is more than 0.15% by mass, there is a concern about a decrease in conductivity and cracking during hot working. For this reason, the Zr content is preferably 0.001 to 0.15% by mass, and more preferably 0.01 to 0.1% by mass.
  • Cr 0.001 to 0.3% by mass
  • Cr content is preferably 0.001% by mass or more.
  • the Cr content is preferably 0.001 to 0.3% by mass, and more preferably 0.01 to 0.3% by mass.
  • Ti is an element that contributes to an increase in strength and an improvement in heat resistance. Further, for example, it contributes to improvement of stress relaxation resistance in a spring contact of an electronic component.
  • the Ti content is preferably 0.001% by mass or more. However, if the Ti content is more than 0.05% by mass, there is a concern about a decrease in electrical conductivity or abnormal casting surface on the ingot surface. For this reason, the Ti content is preferably 0.001 to 0.05% by mass, and more preferably 0.01 to 0.05% by mass.
  • Mn is an element that contributes to an increase in strength, heat resistance, and hot workability.
  • the Mn content is preferably 0.001% by mass or more.
  • the Mn content is preferably 0.001 to 0.2% by mass, and more preferably 0.01 to 0.2% by mass.
  • Co (Co: 0.001 to 0.2% by mass) Co is an element that contributes to an increase in strength and an improvement in hot workability.
  • the Co content is preferably 0.001% by mass or more.
  • the Co content is preferably 0.001 to 0.2% by mass, more preferably 0.01 to 0.2% by mass.
  • Mg, Zr, Cr, Ti, Mn and Co contribute to an increase in strength and an improvement in heat resistance by forming a compound with P.
  • the addition amount of these elements is preferably 0.001 to 0.5% by mass, more preferably 0.01 to 0.5% by mass, and further preferably 0.1 to 0.5% by mass. When it is larger than 0.5% by mass, there is a concern about decrease in conductivity and decrease in bending workability due to the formation of a coarse compound.
  • the surface of the material after electropolishing is observed with an FE-SEM, and the ratio of the number of compound particles having a particle diameter of 5 to 30 nm per 1 ⁇ m ⁇ 1 ⁇ m viewing area is 20 particles / ⁇ m 2 or more.
  • the ratio of the number of compound particles having a particle diameter of 5 to 30 nm per 1 ⁇ m ⁇ 1 ⁇ m viewing area is 20 particles / ⁇ m 2 or more.
  • the number ratio of fine compound particles having a particle size of 5 to 30 nm per particle area of 1 ⁇ m ⁇ 1 ⁇ m is 20 / ⁇ m 2 or more, a sufficient pinning effect can be obtained by the fine compound particles. Crystals are suppressed and good heat resistance is obtained. On the other hand, when the number ratio of fine compound particles is less than 20 / ⁇ m 2, good heat resistance cannot be obtained. Moreover, favorable bending workability is obtained because the number ratio of the coarse compound particle
  • the coarse compound particles When the number ratio of the coarse compound particles exceeds 1 / ⁇ m 2 , the coarse compound particles serve as a starting point of fracture, and the bending workability is remarkably deteriorated. Further, at this time, if a large number of coarse compound particles are formed, the number ratio of fine compound particles tends to decrease, so that heat resistance may be deteriorated.
  • the dispersion state of compound particles is often observed with a transmission electron microscope (TEM) and is often expressed by the number and area ratio in the field of view, but these values depend on the thickness of the test piece. . However, it is difficult to make the thickness of the test pieces prepared for TEM uniform.
  • the number ratio of the compound particles was evaluated using a field emission scanning electron microscope (FE-SEM) that does not depend on the thickness of the test piece.
  • the copper alloy material of the present invention is usually produced by performing melt casting ⁇ homogenization heat treatment ⁇ hot rolling ⁇ cold rolling ⁇ annealing ⁇ finish rolling. Between each process, you may perform chamfering, buffing, pickling, degreasing, etc. suitably as needed. Moreover, cold rolling and annealing may be repeated a plurality of times, and low temperature annealing may be performed after finish rolling. In the production method of the present invention, it is important not to produce coarse compound particles as much as possible by melt casting, homogenization heat treatment and hot rolling, but to produce many fine precipitates by subsequent cold rolling and annealing. . Although the manufacturing method of the present invention has the same number of steps as the conventional method, the material characteristics can be improved by appropriately adjusting each process condition.
  • Melting casting may be carried out by a general method, but in the present invention, cooling to 300 ° C. at the time of casting is performed at a cooling rate of 30 ° C./min or more, so that crystallization and precipitation at the time of cooling are performed. It is preferable in that it suppresses the formation of coarse compound particles. This is because if the cooling rate is lower than 30 ° C./min, crystallization and precipitation during cooling cannot be sufficiently suppressed, and coarse compound particles tend to be generated.
  • the homogenization heat treatment is carried out in order to make the coarse compound particles produced by the melt casting form a solid solution in the matrix phase to obtain a solution state.
  • the homogenization heat treatment is preferably maintained at 600 to 1000 ° C. for 30 minutes to 10 hours.
  • the heating rate of the homogenization heat treatment has not been regarded as important, but in the present invention, in order to obtain the specified material structure, the heating rate is particularly 5 ° C./min or more, preferably 10 ° C./min or more. It is necessary to control.
  • the rate of temperature increase is less than 5 ° C./min, coarse compound particles formed by dissolution casting grow at the time of temperature rise, and the coarse compound particles can be sufficiently dissolved in the parent phase by the subsequent homogenization heat treatment. This is because it is difficult to remain and the bending workability is deteriorated with the final characteristics. In addition, the number ratio of fine compound particles is reduced, so that the heat resistance is also deteriorated.
  • the holding temperature of less than 600 ° C. and the holding time of less than 30 minutes is satisfied, coarse compound particles that cannot be completely dissolved in the matrix phase are likely to remain, and the bending properties are deteriorated in the final characteristics. This is because, when the holding temperature exceeds 1000 ° C., hot working cracks may occur in the subsequent hot rolling process.
  • the upper limit of the retention time is preferably 10 hours from the viewpoint of saturation of the effect of solution treatment and time constraints in actual production.
  • Hot rolling is preferably performed at 550 to 950 ° C.
  • the cooling rate up to 300 ° C. needs to be 30 ° C./min or more. This is because if the cooling rate to 300 ° C. is smaller than 30 ° C./min, coarse compound particles are likely to precipitate during cooling, which adversely affects the final characteristics.
  • the cold rolling after hot rolling is preferably performed at a processing rate of 80% or more.
  • the processing rate is less than 80%, strain is not uniformly introduced into the material, and when fine compound particles are precipitated by subsequent annealing, there is a possibility that a difference in the precipitation state occurs in the material.
  • the annealing is preferably held at 350 to 600 ° C. for 5 seconds to 10 hours. If the temperature is lower than the above range for a short time, the precipitation of fine compound particles is insufficient, and there is a concern that the strength and conductivity are lowered. If the temperature is higher than the above range for a long time, coarse compound particles are produced. This is because there is a concern about precipitation and deterioration of bending workability and heat resistance.
  • the processing rate of finish rolling is not particularly limited, but is preferably 60% or less in order to obtain good bending workability.
  • low temperature annealing may be performed at 250 to 400 ° C. for 2 seconds to 5 hours.
  • the spring property and stress relaxation resistance of the material can be improved. If the temperature is lower than the above range for a short time, the effect of low temperature annealing may not be obtained, and if the temperature is higher than the above range for a long time, fine compound particles grow coarsely, This is because the heat resistance may be adversely affected. In addition, recrystallization of the material may proceed, and a desired strength may not be obtained.
  • the copper alloy material of the present invention has high strength, high electrical conductivity, and good bending workability by controlling the size and amount of compound particles in a Cu—Ni—Sn—P based copper alloy having a predetermined alloy composition. In addition, it can also have heat resistance. For this reason, the copper alloy material of the present invention is suitable for use in electrical and electronic parts such as lead frames.
  • test material After 20 ⁇ m of the surface of a test piece (size: 20 mm ⁇ 20 mm) collected from each manufactured copper alloy material (test material) is electropolished with a phosphoric acid aqueous solution, the surface of the material is 10000-100000 times by FE-SEM. Observed. The observation is performed by observing three fields of view of 1 ⁇ m ⁇ 1 ⁇ m arbitrarily, and the number of fine compound particles having a particle diameter of 5 to 30 nm and the number of coarse compound particles having a particle diameter exceeding 30 nm within the field of view. Was measured. Thereafter, the measured number was converted into a number ratio per visual field area of 1 ⁇ m ⁇ 1 ⁇ m (1 ⁇ m 2 ). The converted number ratio was rounded off, and the fine compound particles were shown as integers, and the coarse compound particles were shown up to the second decimal place.
  • Tensile strength was specified in JIS Z2241: 2011 by extracting three specimens of No. 5 specified in Annex B of JIS Z2241: 2011 along the rolling parallel direction. Three samples were measured according to “Metal material tensile test method”. Table 2 shows the average values of the tensile strengths.
  • the heat resistance is a value obtained by putting a test piece in a salt bath heated to 450 ° C., performing a heat treatment of taking out after 5 minutes and cooling with water and dividing the hardness after the heat treatment by the hardness before the heat treatment.
  • the case of 8 or more was evaluated as good heat resistance (A), and the case of less than 0.8 was evaluated as heat resistance defect (D).
  • the evaluation results are shown in Table 2.
  • the hardness was measured based on the Vickers hardness test-test method specified in JIS Z 2244: 2009. Moreover, since the film after the heat treatment had a film formed on the surface in contact with the salt bath, the hardness was measured after removing it by pickling.
  • Example 14 to 26 in which the Sn concentration is in the range of 0.5% by mass to 2.5% by mass or less, the tensile strength is 512 to 593 MPa and 500 MPa or more, and the conductivity is 27 to 38% IACS. 25% IACS or more, and good bending workability (A) and good heat resistance (A) are obtained.
  • Comparative Examples 12 to 20 in which the component composition shown in Table 1 is outside the scope of the present invention and Comparative Examples 21 and 22 in which the production conditions shown in Table 2 are outside the scope of the present invention At least one of tensile strength, electrical conductivity, bending workability, heat resistance and manufacturability was inferior.
  • Example 1 and 2 show SEM photographs when the surfaces of the copper alloy materials of Example 14 and Comparative Example 22 after electropolishing were observed by FE-SEM, respectively.
  • the compound particles are coarse. .
  • the present invention it has become possible to provide a copper alloy material having not only high strength, high conductivity, and good bending workability, but also good heat resistance.
  • the copper alloy material of the present invention is particularly suitable for use in electrical and electronic parts such as lead frames used in semiconductor devices.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Conductive Materials (AREA)

Abstract

La présente invention concerne : un matériau d'alliage de cuivre qui présente une bonne résistance à la chaleur ainsi qu'une haute résistance mécanique, une conductivité électrique élevée et une bonne aptitude au pliage ; et un procédé de fabrication de ce dernier. Ce matériau d'alliage de cuivre est caractérisé en ce qu'il présente une composition d'alliage qui contient de 0,05 à 1,2 % en masse de Ni, de 0,01 à 0,15 % en masse de P et de 0,05 à 2,5 % en masse de Sn, le reste comprenant du Cu et des impuretés inévitables, et en ce que lorsqu'une surface du matériau est observée par MEB à émission de champ après un polissage électrolytique, le nombre de particules de composé ayant des diamètres de particule de 5 à 30 nm est supérieur ou égal à 20 particules/µm2, et le nombre de particules de composé ayant des diamètres de particules supérieurs à 30 nm est inférieur ou égal à 1 particule/µm2 dans un champ d'observation ayant une surface de 1µm par 1 µm.
PCT/JP2016/061908 2015-04-24 2016-04-13 Matériau d'alliage de cuivre et son procédé de production WO2016171055A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN201680007533.XA CN107208191B (zh) 2015-04-24 2016-04-13 铜合金材料及其制造方法
JP2016567450A JP6155405B2 (ja) 2015-04-24 2016-04-13 銅合金材料およびその製造方法
KR1020177019274A KR102059917B1 (ko) 2015-04-24 2016-04-13 구리합금재료 및 그 제조 방법

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015-089869 2015-04-24
JP2015089869 2015-04-24

Publications (1)

Publication Number Publication Date
WO2016171055A1 true WO2016171055A1 (fr) 2016-10-27

Family

ID=57143055

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2016/061908 WO2016171055A1 (fr) 2015-04-24 2016-04-13 Matériau d'alliage de cuivre et son procédé de production

Country Status (5)

Country Link
JP (1) JP6155405B2 (fr)
KR (1) KR102059917B1 (fr)
CN (1) CN107208191B (fr)
TW (1) TWI695075B (fr)
WO (1) WO2016171055A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3839083A4 (fr) * 2018-08-17 2022-06-15 Ningbo Powerway Alloy Material Co., Ltd Alliage de cuivre présentant une excellente performance globale et son application

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101492250B1 (ko) * 2014-06-10 2015-02-13 디와이파워 주식회사 유압 실린더의 내부 누유량 측정 장치
WO2019244842A1 (fr) * 2018-06-20 2019-12-26 古河電気工業株式会社 Matériau de résistance pour résistances, son procédé de production et résistance
JP7202121B2 (ja) * 2018-09-27 2023-01-11 Ｄｏｗａメタルテック株式会社 Ｃｕ－Ｎｉ－Ａｌ系銅合金板材およびその製造方法並びに導電ばね部材
CN110042274A (zh) * 2019-05-05 2019-07-23 陶大海 一种高弹性模量、抗应力松弛的铜合金及其制备方法
CN113201663B (zh) * 2021-04-16 2022-01-07 安徽绿能技术研究院有限公司 一种高导电铜合金板材及其制备方法
CN113215438A (zh) * 2021-04-25 2021-08-06 江苏青益金属科技股份有限公司 一种用于地板电加热的微合金化铜基丝材及其制备方法
CN114807673B (zh) * 2022-05-23 2023-10-10 安徽富悦达电子有限公司 一种用于高强度高导电率线束端子的合金材料及其制备方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04154942A (ja) * 1990-10-17 1992-05-27 Dowa Mining Co Ltd コネクタ用銅基合金の製造法
JP2000256814A (ja) * 1999-03-03 2000-09-19 Sumitomo Metal Mining Co Ltd 端子用銅基合金条の製造方法
JP2007100111A (ja) * 2005-09-30 2007-04-19 Dowa Holdings Co Ltd プレス打抜き性の良いＣｕ−Ｎｉ−Ｓｎ−Ｐ系銅合金およびその製造法
JP2010106355A (ja) * 2008-09-30 2010-05-13 Kobe Steel Ltd 高強度高耐熱性銅合金板
JP2015048503A (ja) * 2013-08-30 2015-03-16 Ｄｏｗａメタルテック株式会社 銅合金板材およびその製造方法並びに通電部品

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH089745B2 (ja) 1991-01-17 1996-01-31 同和鉱業株式会社 端子用銅基合金
JPH10226835A (ja) 1997-02-18 1998-08-25 Dowa Mining Co Ltd 端子用銅基合金とそれを用いた端子
JP2000129377A (ja) 1998-10-28 2000-05-09 Sumitomo Metal Mining Co Ltd 端子用銅基合金
JP4393663B2 (ja) 2000-03-17 2010-01-06 住友金属鉱山株式会社 端子用銅基合金条およびその製造方法
JP4396874B2 (ja) 2000-03-17 2010-01-13 住友金属鉱山株式会社 端子用銅基合金条の製造方法
JP3744810B2 (ja) * 2001-03-30 2006-02-15 株式会社神戸製鋼所 端子・コネクタ用銅合金及びその製造方法
JP4887851B2 (ja) 2005-03-17 2012-02-29 Ｄｏｗａメタルテック株式会社 Ｎｉ−Ｓｎ−Ｐ系銅合金
WO2006132317A1 (fr) * 2005-06-08 2006-12-14 Kabushiki Kaisha Kobe Seiko Sho Alliage de cuivre, plaque en alliage de cuivre et procédé pour sa fabrication
KR101203437B1 (ko) * 2007-09-27 2012-11-21 제이엑스 닛코 닛세키 킨조쿠 가부시키가이샤 열간 가공성이 우수한 고강도 고도전성 구리 합금
JP5468423B2 (ja) * 2010-03-10 2014-04-09 株式会社神戸製鋼所 高強度高耐熱性銅合金材
JP5647703B2 (ja) * 2013-02-14 2015-01-07 Ｄｏｗａメタルテック株式会社 高強度Ｃｕ−Ｎｉ−Ｃｏ−Ｓｉ系銅合金板材およびその製造法並びに通電部品

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04154942A (ja) * 1990-10-17 1992-05-27 Dowa Mining Co Ltd コネクタ用銅基合金の製造法
JP2000256814A (ja) * 1999-03-03 2000-09-19 Sumitomo Metal Mining Co Ltd 端子用銅基合金条の製造方法
JP2007100111A (ja) * 2005-09-30 2007-04-19 Dowa Holdings Co Ltd プレス打抜き性の良いＣｕ−Ｎｉ−Ｓｎ−Ｐ系銅合金およびその製造法
JP2010106355A (ja) * 2008-09-30 2010-05-13 Kobe Steel Ltd 高強度高耐熱性銅合金板
JP2015048503A (ja) * 2013-08-30 2015-03-16 Ｄｏｗａメタルテック株式会社 銅合金板材およびその製造方法並びに通電部品

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3839083A4 (fr) * 2018-08-17 2022-06-15 Ningbo Powerway Alloy Material Co., Ltd Alliage de cuivre présentant une excellente performance globale et son application

Also Published As

Publication number Publication date
JPWO2016171055A1 (ja) 2017-05-18
CN107208191B (zh) 2020-03-13
CN107208191A (zh) 2017-09-26
KR102059917B1 (ko) 2019-12-27
TWI695075B (zh) 2020-06-01
JP6155405B2 (ja) 2017-06-28
TW201704490A (zh) 2017-02-01
KR20170125805A (ko) 2017-11-15

Similar Documents

Publication Publication Date Title
JP6155405B2 (ja) 銅合金材料およびその製造方法
TWI503425B (zh) 電子機器用銅合金，電子機器用銅合金之製造方法以及電子機器用銅合金軋製材
TWI547572B (zh) 電子機器用銅合金、電子機器用銅合金之製造方法、電子機器用銅合金塑性加工材及電子機器用零件
TWI400342B (zh) Cu-Ni-Si-Co based copper alloy for electronic materials and its manufacturing method
TWI422692B (zh) Cu-Co-Si based copper alloy for electronic materials and method for producing the same
TWI513833B (zh) 電子機器用銅合金、電子機器用銅合金之製造方法、電子機器銅合金用塑性加工材、以及電子機器用零件
JP2011214088A (ja) 電子材料用Ｃｕ−Ｎｉ−Ｓｉ−Ｃｏ系銅合金及びその製造方法
JP2009242895A (ja) 曲げ加工性に優れた高強度銅合金
TWI429768B (zh) Cu-Co-Si based copper alloy for electronic materials and method for producing the same
JP4950734B2 (ja) 熱間加工性に優れた高強度高導電性銅合金
TW201339328A (zh) 電子機器用銅合金、電子機器用銅合金之製造方法、電子機器用銅合金壓延材及電子機器用零件
JP4834781B1 (ja) 電子材料用Ｃｕ−Ｃｏ−Ｓｉ系合金
JP2015161009A (ja) 高強度銅合金薄板材およびその製造方法
JP2018159104A (ja) 強度及び導電性に優れる銅合金板
JP6230341B2 (ja) 応力緩和特性に優れる銅合金板
JP2017179502A (ja) 強度及び導電性に優れる銅合金板
JP6246456B2 (ja) チタン銅
JP5232794B2 (ja) 熱間加工性に優れた高強度高導電性銅合金
JP2010121166A (ja) 高強度かつ高導電率を備えた銅合金
JP2012229467A (ja) 電子材料用Ｃｕ−Ｎｉ−Ｓｉ系銅合金
JP5524901B2 (ja) 電子材料用Ｃｕ−Ｎｉ−Ｓｉ−Ｃｏ系銅合金
TWI639163B (zh) Cu-Co-Ni-Si alloy for electronic parts, and electronic parts
JP2016176106A (ja) 電子部品用Ｃｕ−Ｎｉ−Ｃｏ−Ｓｉ合金
JP2008001937A (ja) 端子・コネクタ用銅合金材及びその製造方法
JP6246174B2 (ja) 電子部品用Ｃｕ−Ｃｏ−Ｎｉ−Ｓｉ合金

Legal Events

Date Code Title Description
ENP Entry into the national phase

Ref document number: 2016567450

Country of ref document: JP

Kind code of ref document: A

121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 16783076

Country of ref document: EP

Kind code of ref document: A1

ENP Entry into the national phase

Ref document number: 20177019274

Country of ref document: KR

Kind code of ref document: A

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 16783076

Country of ref document: EP

Kind code of ref document: A1