WO2016159200A1

WO2016159200A1 - Exposure device, method for producing flat panel display, method for producing device, and exposure method

Info

Publication number: WO2016159200A1
Application number: PCT/JP2016/060592
Authority: WO
Inventors: 一夫内藤; 青木　保夫; 雅幸長島
Original assignee: 株式会社ニコン
Priority date: 2015-03-31
Filing date: 2016-03-31
Publication date: 2016-10-06
Also published as: CN107533303B; KR102549056B1; KR20170128601A; TWI846603B; TW201643558A; TW202401146A; TW202041978A; JP6855008B2; JPWO2016159200A1; TW202316204A; CN107533303A

Abstract

　This liquid crystal exposure device (10) which performs scanning exposure by irradiating a substrate (P) with illuminating light (IL) via a projection optical system (30), and driving the projection optical system (PL) relative to the substrate (P), is equipped with alignment microscopes (62, 64) which perform mark detection of marks (Mk) provided on a substrate (P), a first drive system that drives the alignment microscopes (62, 64), a second drive system that drives the projection optical system (40), and a control device that controls the first and second drive systems in such a manner that the alignment microscopes (62, 64) are driven before the projection optical system (40) is driven. As a result of this configuration it is possible to minimize tact time required for exposure.

Description

Exposure apparatus, flat panel display manufacturing method, device manufacturing method, and exposure method

The present invention relates to an exposure apparatus, a flat panel display manufacturing method, a device manufacturing method, and an exposure method. More specifically, the present invention relates to an exposure apparatus that scans an energy beam in a predetermined scanning direction to form a predetermined pattern. The present invention relates to an exposure apparatus and method for forming on an object, and a method of manufacturing a flat panel display or device including the exposure apparatus or method.

2. Description of the Related Art Conventionally, in a lithography process for manufacturing electronic devices (microdevices) such as liquid crystal display elements and semiconductor elements (such as integrated circuits), an energy beam is applied to a pattern formed on a mask or reticle (hereinafter collectively referred to as “mask”). An exposure apparatus is used for transferring onto a glass plate or a wafer (hereinafter collectively referred to as “substrate”).

In this type of exposure apparatus, a beam that forms a predetermined pattern on a substrate by scanning exposure illumination light (energy beam) in a predetermined scanning direction while the mask and the substrate are substantially stationary. A scanning-type scanning exposure apparatus is known (see, for example, Patent Document 1).

In the exposure apparatus described in Patent Document 1, in order to correct the position error between the exposure target region on the substrate and the mask, the projection optical system is moved through the projection optical system while moving in the direction opposite to the scanning direction at the time of exposure. Then, the mark on the substrate and the mask is measured (alignment measurement) by the alignment microscope, and the position error between the substrate and the mask is corrected based on the measurement result. Here, since the alignment mark on the substrate is measured via the projection optical system, the alignment operation and the exposure operation are executed sequentially (serially), and the processing time (tact time) required for the entire exposure processing of the substrate is calculated. It was difficult to suppress.

JP 2000-12422 A

The present invention has been made under the above circumstances. From the first viewpoint, the object is irradiated with illumination light through the projection optical system, and the projection optical system is driven relative to the object. An exposure apparatus that performs scanning exposure, wherein a mark detection unit that detects a mark provided on the object, a first drive system that drives the mark detection unit, and a second drive system that drives the projection optical system And a control device that controls the first and second drive systems so as to drive the mark detection unit prior to driving the projection optical system.

From a second aspect, the present invention is a flat panel display manufacturing method including exposing the object using the exposure apparatus of the present invention and developing the exposed object.

From a third aspect, the present invention is a device manufacturing method including exposing the object using the exposure light apparatus of the present invention and developing the exposed object.

According to a fourth aspect of the present invention, there is provided an exposure method in which scanning exposure is performed by irradiating an object with illumination light through a projection optical system and driving the projection optical system relative to the object. Performing mark detection of a mark provided on the mark using a mark detection unit, driving the mark detection unit using a first drive system, and driving the projection optical system using a second drive system And controlling the first and second drive systems to drive the mark detection unit prior to driving the projection optical system.

From a fifth aspect, the present invention is a flat panel display manufacturing method including exposing the object using the exposure method of the present invention and developing the exposed object.

From a sixth aspect, the present invention is a device manufacturing method including exposing the object using the exposure method of the present invention and developing the exposed object.

1 is a conceptual diagram of a liquid crystal exposure apparatus according to a first embodiment. FIG. 2 is a block diagram showing an input / output relationship of a main controller that mainly constitutes a control system of the liquid crystal exposure apparatus of FIG. 1. It is a figure for demonstrating the structure of the measurement system of a projection system main body and an alignment microscope. FIGS. 4A to 4D are diagrams (Nos. 1 to 4) for explaining the operation of the liquid crystal exposure apparatus during the exposure operation. FIGS. 5A to 5D are views (Nos. 5 to 8) for explaining the operation of the liquid crystal exposure apparatus during the exposure operation. FIGS. 6A to 6C are views (Nos. 9 to 11) for explaining the operation of the liquid crystal exposure apparatus during the exposure operation. FIGS. 7A to 7C are views (Nos. 12 to 15) for explaining the operation of the liquid crystal exposure apparatus during the exposure operation. FIGS. 8A to 8D are views (Nos. 1 to 4) for explaining the operation of the alignment system according to the second embodiment. FIGS. 9A and 9B are views (No. 1 and No. 2) for explaining the operations of the alignment system and the projection optical system according to the third embodiment. It is a figure which shows the modification (the 1) of the drive system of a projection optical system and an alignment system. It is a figure which shows the modification (the 2) of the drive system of a projection optical system and an alignment system. It is a conceptual diagram of module replacement | exchange in a liquid crystal exposure apparatus.

<< First Embodiment >>
Hereinafter, the first embodiment will be described with reference to FIGS. 1 to 7C.

FIG. 1 shows a conceptual diagram of a liquid crystal exposure apparatus 10 according to the first embodiment. The liquid crystal exposure apparatus 10 employs a step-and-scan method in which a rectangular (square) glass substrate P (hereinafter simply referred to as a substrate P) used in, for example, a liquid crystal display device (flat panel display) is an exposure object. A projection exposure apparatus, a so-called scanner.

The liquid crystal exposure apparatus 10 includes an illumination system 20 that irradiates illumination light IL that is an energy beam for exposure, and a projection optical system 40. Hereinafter, the direction parallel to the optical axis of the illumination light IL applied to the substrate P from the illumination system 20 via the projection optical system 40 is referred to as the Z-axis direction, and the X-axis is orthogonal to each other in a plane orthogonal to the Z-axis. The explanation will be given with the Y axis set. In the coordinate system of the present embodiment, it is assumed that the Y axis is substantially parallel to the direction of gravity. Therefore, the XZ plane is substantially parallel to the horizontal plane. The rotation (tilt) direction around the Z axis will be described as the θz direction.

Here, in this embodiment, a plurality of exposure target areas (which will be referred to as partition areas or shot areas as appropriate) are set on one substrate P, and a mask pattern is sequentially transferred to the plurality of shot areas. Is done. In the present embodiment, a case where four partition areas are set on the substrate P (so-called four-chamfering) will be described, but the number of partition areas is not limited to this and can be changed as appropriate. is there.

The liquid crystal exposure apparatus 10 performs a so-called step-and-scan exposure operation. During the scan exposure operation, the mask M and the substrate P are substantially stationary, and the illumination system 20 and the projection optical system. 40 (illumination light IL) moves relative to the mask M and the substrate P with a long stroke in the X-axis direction (referred to as the scanning direction as appropriate) (see the white arrow in FIG. 1). On the other hand, at the time of the step operation for changing the partition area to be exposed, the mask M is stepped with a predetermined stroke in the X-axis direction, and the substrate P is stepped with a predetermined stroke in the Y-axis direction (see FIGS. 1 black arrow).

FIG. 2 is a block diagram showing the input / output relationship of the main control device 90 that controls the components of the liquid crystal exposure apparatus 10 in an integrated manner. As shown in FIG. 2, the liquid crystal exposure apparatus 10 includes an illumination system 20, a mask stage apparatus 30, a projection optical system 40, a substrate stage apparatus 50, an alignment system 60, and the like.

The illumination system 20 includes an illumination system body 22 including a light source (for example, a mercury lamp) of illumination light IL (see FIG. 1). During the scan exposure operation, the main controller 90 scans the illumination system main body 22 with a predetermined long stroke in the X-axis direction by controlling the drive system 24 including, for example, a linear motor. The main controller 90 obtains position information of the illumination system body 22 in the X-axis direction via the measurement system 26 including, for example, a linear encoder, and performs position control of the illumination system body 22 based on the position information. In the present embodiment, for example, g-line, h-line, i-line or the like is used as the illumination light IL.

The mask stage apparatus 30 includes a stage main body 32 that holds the mask M. The stage main body 32 is configured to be appropriately step-movable in the X axis direction and the Y axis direction by a drive system 34 including, for example, a linear motor. During the step operation for changing the exposure target partition area with respect to the X-axis direction, the main controller 90 controls the drive system 34 to step-drive the stage body 32 in the X-axis direction. Further, as will be described later, during the step operation for changing the scanning exposure region (position) in the Y-axis direction in the partition region to be exposed, the main controller 90 controls the drive system 34 to control the stage. The main body 32 is step-driven in the Y-axis direction. The drive system 34 can also appropriately finely drive the mask M in the direction of three degrees of freedom (X, Y, θz) in the XY plane during an alignment operation described later. The position information of the mask M is obtained by a measurement system 36 including a linear encoder, for example.

The projection optical system 40 includes a projection system main body 42 including an optical system that forms an erect image of a mask pattern on a substrate P (see FIG. 1) in the same magnification system. The projection system main body 42 is disposed in a space formed between the substrate P and the mask M (see FIG. 1). During the scan exposure operation, the main controller 90 controls the drive system 44 including, for example, a linear motor, so that the projection system main body 42 has a predetermined length in the X-axis direction so as to synchronize with the illumination system main body 22. Scan drive with stroke. The main controller 90 obtains position information in the X-axis direction of the projection system main body 42 via the measurement system 46 including, for example, a linear encoder, and controls the position of the projection system main body 42 based on the position information.

Returning to FIG. 1, in the liquid crystal exposure apparatus 10, when the illumination area IAM on the mask M is illuminated by the illumination light IL from the illumination system 20, the illumination light IL that has passed through the mask M passes through the projection optical system 40. A projection image (partial upright image) of the mask pattern in the illumination area IAM is formed in the irradiation area (exposure area IA) of the illumination light IL conjugate to the illumination area IAM on the substrate P. Then, the scanning light exposure operation is performed when the illumination light IL (the illumination area IAM and the exposure area IA) moves relative to the mask M and the substrate P in the scanning direction. That is, in the liquid crystal exposure apparatus 10, the pattern of the mask M is generated on the substrate P by the illumination system 20 and the projection optical system 40, and the sensitive layer (resist layer) on the substrate P is exposed by the illumination light IL. The pattern is formed.

Here, in the present embodiment, the illumination area IAM generated on the mask M by the illumination system 20 includes a pair of rectangular areas separated in the Y-axis direction. The length in the Y-axis direction of one rectangular area is, for example, 1 in the length in the Y-axis direction of the pattern surface of the mask M (that is, the length in the Y-axis direction of each partition area set on the substrate P). / 4 is set. Similarly, the distance between the pair of rectangular areas is set to, for example, 1/4 of the length of the pattern surface of the mask M in the Y-axis direction. Accordingly, the exposure area IA generated on the substrate P similarly includes a pair of rectangular areas spaced apart in the Y-axis direction. In the present embodiment, in order to completely transfer the pattern of the mask M onto the substrate P, it is necessary to perform two scanning exposure operations for one partition region. However, the illumination system main body 22 and the projection system main body 42 are required. There is an advantage that can be downsized. A specific example of the scanning exposure operation will be described later.

The substrate stage apparatus 50 includes a stage body 52 that holds the back surface of the substrate P (the surface opposite to the exposure surface). Returning to FIG. 2, during the step operation for changing the section area to be exposed in the Y-axis direction, the main controller 90 controls the drive system 54 including, for example, a linear motor to move the stage main body 52 to the Y-direction. Step drive in the axial direction. The drive system 54 can also minutely drive the substrate P in the direction of three degrees of freedom (X, Y, θz) in the XY plane during a substrate alignment operation described later. The position information of the substrate P (stage main body 52) is obtained by a measurement system 56 including, for example, a linear encoder.

Returning to FIG. 1, the alignment system 60 includes, for example, two

alignment microscopes

62 and 64. The alignment microscopes 62 and 64 are disposed in a space formed between the substrate P and the mask M (position between the substrate P and the mask M with respect to the Z-axis direction), and the alignment microscope is formed on the substrate P. A mark Mk (hereinafter simply referred to as a mark Mk) and a mark (not shown) formed on the mask M are detected. In the present embodiment, one mark Mk is formed near each of the four corners of each partition area (for example, four for each partition area), and the mark on the mask M is marked via the projection optical system 40. It is formed at a position corresponding to Mk. Note that the numbers and positions of the marks Mk and the marks of the mask M are not limited to this, and can be changed as appropriate. In each drawing, the mark Mk is shown larger than the actual size for easy understanding.

One alignment microscope 62 is arranged on the + X side of the projection system main body 42, and the other alignment microscope 64 is arranged on the −X side of the projection system main body 42. The alignment microscopes 62 and 64 each have a pair of detection visual fields (detection regions) separated in the Y-axis direction, and simultaneously detect, for example, two marks Mk separated in the Y-axis direction in one partition region. Be able to.

The alignment microscopes 62 and 64 can simultaneously detect the mark formed on the mask M and the mark Mk formed on the substrate P (in other words, without changing the position of the alignment microscopes 62 and 64). It has become. For example, each time the mask M performs an X-step operation or the substrate P performs a Y-step operation, the main controller 90 performs information on the relative displacement between the mark formed on the mask M and the mark Mk formed on the substrate P. Then, relative positioning of the substrate P and the mask M in the direction along the XY plane is performed so as to correct (cancel or reduce) the positional deviation. In the

alignment microscopes

62 and 64, the mask detection unit for detecting (observing) the mark on the mask M and the substrate detection unit for detecting (observing) the mark Mk on the substrate P are integrally formed by a common housing or the like. The drive system 66 (refer FIG. 2) is comprised through the common housing | casing. Alternatively, the mask detection unit and the substrate detection unit may be configured by separate housings, and in that case, for example, the mask detection unit and the substrate detection unit are substantially equivalent by a common drive system 66. It is preferable to be configured so that it can move with operating characteristics.

The main control device 90 (see FIG. 2) independently drives the

alignment microscopes

62 and 64 with a predetermined long stroke in the X-axis direction by controlling a drive system 66 including, for example, a linear motor. The main controller 90 obtains position information in the X-axis direction of each of the

alignment microscopes

62 and 64 via a measurement system 68 including, for example, a linear encoder, and controls the position of the

alignment microscopes

62 and 64 based on the position information. Are performed independently. Further, the projection system main body 42 and the

alignment microscopes

62 and 64 have substantially the same position in the Y-axis direction, and their movable ranges partially overlap each other.

Here, the

alignment microscopes

62 and 64 of the alignment system 60 and the projection system main body 42 of the above-described projection optical system 40 are physically (mechanically) independent (separated) elements, and the main controller 90 (FIG. 2 (see 2), drive (speed and position) control is performed independently of each other. The drive system 66 that drives the

alignment microscopes

62 and 64 and the drive system 44 that drives the projection system main body 42 are in the X-axis direction. For example, linear motors, linear guides, and the like are shared, and the drive characteristics of the

alignment microscopes

62 and 64 and the projection system main body 42 or the control characteristics of the main controller 90 are substantially equal. It is comprised so that it may become.

As a specific example, when the

alignment microscopes

62 and 64 and the projection system main body 42 are driven in the X-axis direction by a moving coil linear motor, for example, a magnetic body (for example, a permanent magnet) is used as a stator. ) The unit is shared by the drive system 66 and the drive system 44. On the other hand, the coil unit as a mover has the

alignment microscopes

62 and 64 and the projection system main body 42 independently, and the main control device 90 (see FIG. 2) individually supplies power to the coil unit. Thus, the drive (speed and position) of the

alignment microscopes

62 and 64 in the X-axis direction and the drive (speed and position) of the projection system main body 42 in the X-axis direction are controlled independently. Therefore, the main controller 90 can change (arbitrarily change) the intervals (distances) between the

alignment microscopes

62 and 64 and the projection system main body 42 in the X-axis direction. Further, the main controller 90 can also move the

alignment microscopes

62 and 64 and the projection system main body 42 at different speeds in the X-axis direction.

The main controller 90 (see FIG. 2) detects a plurality of marks Mk formed on the substrate P using the alignment microscope 62 (or the alignment microscope 64), and the detection results (position information of the plurality of marks Mk). Based on the above, the array information (including information on the position (coordinate value), shape, etc. of the partition area) of the partition area in which the mark Mk to be detected is formed is calculated by a known enhanced global alignment (EGA) method. To do.

Specifically, in the scanning exposure operation, when the projection system main body 42 is driven in the + X direction, the main controller 90 (see FIG. 2) moves to the + X side of the projection system main body 42 prior to the scanning exposure operation. Using the arranged alignment microscope 62, the positions of the plurality of marks Mk are detected, and the arrangement information of the partition areas to be exposed is calculated. In the scanning exposure operation, when the projection system main body 42 is driven in the −X direction, a plurality of alignment microscopes 64 arranged on the −X side of the projection system main body 42 are used prior to the scanning exposure operation. The position information of the mark Mk is detected, and the arrangement information of the partition area to be exposed is calculated. Based on the calculated arrangement information, main controller 90 appropriately controls illumination system 20 and projection optical system 40 while performing precise positioning (substrate alignment operation) in the three-degree-of-freedom direction of substrate P in the XY plane. Then, the scanning exposure operation (mask pattern transfer) is performed on the target partition region.

Next, a measurement system 46 (see FIG. 2) for obtaining position information of the projection system main body 42 included in the projection optical system 40 and a measurement system 68 for obtaining position information of the alignment microscope 62 included in the alignment system 60 will be described. A typical configuration will be described.

As shown in FIG. 3, the liquid crystal exposure apparatus 10 has a guide 80 for guiding the projection system main body 42 in the scanning direction. The guide 80 is made of a member extending in parallel with the scanning direction. The guide 80 also has a function of guiding the movement of the alignment microscope 62 in the scanning direction. In FIG. 3, the guide 80 is illustrated between the mask M and the substrate P. Actually, however, the guide 80 is disposed at a position avoiding the optical path of the illumination light IL in the Y-axis direction. .

A scale 82 including a reflective diffraction grating having a periodic direction at least in a direction parallel to the scanning direction (X-axis direction) is fixed to the guide 80. In addition, the projection system main body 42 has a head 84 disposed so as to face the scale 82. In the present embodiment, the scale 82 and the head 84 form an encoder system that constitutes a measurement system 46 (see FIG. 2) for obtaining position information of the projection system main body 42. Further, the

alignment microscopes

62 and 64 each have a head 86 disposed so as to face the scale 82 (the alignment system 64 is not shown in FIG. 3). In the present embodiment, the scale 82 and the head 86 form an encoder system that constitutes a measurement system 68 (see FIG. 2) for obtaining positional information of the

alignment microscopes

62 and 64. Here, each of the

heads

84 and 86 irradiates the scale 82 with a beam for encoder measurement, receives a beam (reflected beam by the scale 82) via the scale 82, and based on the light reception result, the scale 82. Relative position information can be output.

Thus, in this embodiment, the scale 82 constitutes the measurement system 46 (see FIG. 2) for obtaining the position information of the projection system main body 42, and the measurement system for obtaining the position information of the

alignment microscopes

62 and 64. 68 (see FIG. 2). That is, the position control of the projection system main body 42 and the

alignment microscopes

62 and 64 is performed based on a common coordinate system (measurement axis) set by a diffraction grating formed on the scale 82. Note that the drive system 44 (see FIG. 2) for driving the projection system main body 42 and the drive system 66 (see FIG. 2) for driving the

alignment microscopes

62 and 64 may have some common elements. It may be good or may be composed of completely independent elements.

The encoder system constituting the measuring systems 46 and 68 (see FIG. 2 respectively) may be a linear (1 DOF) encoder system whose length measuring axis is only in the X-axis direction (scanning direction), for example. There may be more measuring axes. For example, the rotation amounts of the projection system main body 42 and the

alignment microscopes

62 and 64 in the θz direction may be obtained by arranging a plurality of

heads

84 and 86 at predetermined intervals in the Y-axis direction. Alternatively, an XY two-dimensional diffraction grating may be formed on the scale 82, and a 3DOF encoder system having measurement axes in the three degrees of freedom in the X, Y, and θz directions may be used. Furthermore, by using a plurality of known two-dimensional heads that can measure the length in the direction orthogonal to the scale surface in combination with the periodic direction of the diffraction grating as the

heads

84 and 86, the projection system main body 42 and the

alignment microscopes

62 and 64 Position information in the direction of 6 degrees of freedom may be obtained.

Next, an example of the operation of the liquid crystal exposure apparatus 10 during the scanning exposure operation will be described with reference to FIGS. 4 (a) to 7 (c). The following exposure operation (including alignment measurement operation) is performed under the control of the main controller 90 (not shown in FIGS. 4A to 7C, see FIG. 2).

In this embodiment, divided areas exposed order is the first (hereinafter referred to as the first shot area S ₁₎ is set on the -X side and -Y side of the substrate P. Further, the reference numerals S ₂ to S _{4 given} to the partition areas on the substrate P indicate that the exposure areas are the second to fourth shot areas, respectively.

As shown in FIG. 4 (a), before starting exposure, the projection system main body 42, and the

alignment microscopes

62 and 64, respectively, to the initial position set in the -X side of the first shot area S ₁ in a plan view Be placed. At this time, the projection system main body 42 and the

alignment microscopes

62 and 64 are arranged close to each other in the X-axis direction. Further, the position of the detection visual field of the alignment microscope 62 in the Y-axis direction and the position of the mark Mk formed in the first and fourth shot regions S ₁ and S ₄ in the Y-axis direction substantially coincide.

Then, the main controller 90, as shown in FIG. 4 (b), to drive the alignment microscope 62 in the + X direction, formed in the first shot area S _1, for example, of the four Mark Mk, For example, two marks Mk formed in the vicinity of the end on the −X side are detected (see the bold circle in FIG. 4B, the same applies hereinafter). The main control unit 90, as shown in FIG. 4 (c), by driving further the + X direction of the alignment microscope 62, formed in the first shot area S _1, for example, among the four marks Mk , For example, two marks Mk formed near the end on the + X side are detected. In FIG. 4 (b), the projection system main body 42 is stopped, even after the alignment microscope 62 starts the detection of the mark Mk in the first shot area S _1, the mark Mk detection During the movement, for example, during the movement to the + X side mark Mk after detecting the −X side mark Mk (more specifically, immediately before the + X side mark Mk is detected), the projection system The main body 42 may start accelerating.

The main control device 90, the formed first shot area S _1, for example based on the four marks Mk detection result (position information) to determine the sequence information of the first shot area S _1. The main control unit 90, as shown in FIG. 4 (d), based on the first shot region the sequence information of the S ₁ 3 precise positioning of the degrees of freedom in the XY plane of the substrate P (substrate alignment operation) while performing, with respect to the illumination system main body 22 (FIG. 4 (d) the not shown. see FIG. 1) and is driven in synchronism with + X direction, the first shot area S ₁ of the projection system main body 42 and the illumination system 20 The first scanning exposure is performed.

The main control unit 90, in parallel with the start of the first scanning exposure operation for the first shot area S _1, the fourth shot area S _{4 (first} shot area S ₁ of the + X side using an alignment microscope 62 For example, two marks Mk formed in the vicinity of the end portion on the −X side among the four marks Mk formed in the partition area) are detected.

The main controller 90, the fourth shot area S ₄ obtained newly, for example, the detection results of the two marks Mk, which (stored in a memory device (not shown)) which previously acquired in the first shot region in S _1, it may update the first sequence information of the shot areas S ₁ by EGA calculation based on the detection result of the example four marks. The main controller 90 while performing the 3 precise positioning of the degrees of freedom in the XY plane of the appropriate substrate P on the basis of the updated sequence information, to continue with scanning exposure operation of the first shot area S ₁ it can. By using the mark position information of the fourth shot area S ₄ in order to obtain the sequence information of the first shot area S _1, the sequence information based only on the four marks Mk provided in the first shot area S ₁ than determined, it is possible to obtain the sequence information in consideration of the statistical trend over a wide range, it is possible to improve the alignment accuracy for the first shot area S _1.

Further, as shown in FIG. 5A, the main controller 90 drives the projection system main body 42 in the + X direction to perform the scanning exposure operation, and further drives the alignment microscope 62 in the + X direction to It formed in 4 shot area S _4, for example, among the four marks Mk, formed near the + X side end, for example, to detect the two marks Mk. The main controller 90, the fourth shot area S ₄ obtained newly, for example, the detection results of the two marks Mk, the mark Mk (this example obtained which previously in the first shot area S _1, For example, the arrangement information of the first shot region S ₁ may be updated by performing EGA calculation based on the detection results of the four marks Mk and, for example, two marks Mk) in the fourth shot region S ₄ . The main controller 90 is able to continue the 3 while performing precise positioning of the degrees of freedom, the scanning exposure operation in the first shot area S ₁ in the XY plane of the substrate P on the basis of the updated sequence information .

As described above, in the present embodiment, using the alignment microscope 62 disposed in the front (+ X direction) in the scanning direction with respect to the projection system main body 42, the front (in the scanning direction) of the exposure area IA (illumination light IL). At least a part of the operation for detecting the mark Mk formed in the (+ X direction) and the scanning exposure operation for scanning the projection system main body 42 in the + X direction can be performed simultaneously (in parallel). Thereby, it is possible to shorten the time required for a series of operations including the alignment operation and the scanning exposure operation. Further, the main control device 90 can appropriately perform EGA calculation each time the marks Mk sequentially provided at different positions are measured, for example, and update the arrangement information of the partition areas to be exposed. Thereby, it is possible to improve the alignment accuracy of the partition area to be exposed.

Further, when driving the projection system main body 42 in the + X direction for the scanning exposure operation, the main controller 90 moves the alignment microscope 64 arranged behind the projection system main body 42 in the scanning direction (−X direction). Then, it is driven in the + X direction so as to follow the projection system main body 42 (see FIGS. 5A and 5B). At this time, the main controller 90 uses the alignment microscope 64 to detect the mark Mk formed behind the exposure area IA (illumination light IL) in the scanning direction (−X direction), and this detection result is detected by the EGA. It may be used for calculation.

As described above, in this embodiment, the illumination area IAM (see FIG. 1) generated on the mask M and the exposure area IA generated on the substrate P are a pair of rectangular areas separated in the Y-axis direction. Therefore, the pattern image of the mask M transferred to the substrate P by one scanning exposure operation is a band-like region extending in the X-axis direction and separated from the Y-axis direction (of the total area of one partition region). Half area).

Then, the main controller 90, as shown in FIG. 5 (b), for scanning exposure operation for the second time in the first shot area S ₁ (return path), the step moves the substrate P and the mask M in the -Y direction (See the black arrow in FIG. 5B). The step movement amount of the substrate P at this time is, for example, 1/4 of the length of one partition region in the Y-axis direction. In this case, in the step movement of the substrate P and the mask M in the −Y direction, the relative positional relationship between the substrate P and the mask M is not changed (or the relative positional relationship can be corrected). ) It is preferable to move the step.

In this embodiment, the second scanning exposure operation of the first shot area S _1, as shown in FIG. 5 (c), performing the projection system main body 42 is moved in the -X direction. The main control device 90, the alignment microscope 64 is driven in the -X direction, which is formed in the first shot area S ₁ is detected, for example, the + X side end mark Mk formed in the vicinity (not shown) . The main controller 90 while performing a precise positioning of the 3 degrees of freedom in the XY plane of the substrate P based on the detection result and the above-described first arrangement information of the shot areas S ₁ and the alignment microscope 64, the first shot performing second scanning exposure operation region S _1. Thus, as shown in FIG. 5 (d), the mask pattern transferred by the first scanning exposure operation, a mask pattern transferred by the second scanning exposure operation in the first shot in region S ₁ are joined together, the overall pattern of the mask M is transferred onto the first shot area S _1. In the alignment operation corresponding to the second scanning exposure of the first shot region S ₁ , the XY plane is based on the two marks (the + X side mark) of the mark of the mask M and the mark Mk of the substrate P. Since it is only necessary to measure the positional deviation in the three degrees of freedom (X, Y, θz) direction, the time required for alignment can be substantially shortened compared to the first alignment operation.

When the scanning exposure of the first shot area S ₁ is completed, the main controller 90, for scanning exposure operation for the second shot area S _{2 (partitioned} region of the first shot area S ₁ of the + Y side), the substrate P after step moves in the -Y direction to perform scanning exposure for the second shot area S ₂ in the scanning exposure operation similar procedure for the first shot area S _1.

That is, in the first scanning exposure operation for the second shot region S ₂ , as shown in FIG. 6A, the second shot region S ₂ and the third shot region S ₃ ( sequence information of the second shot area S ₂ is obtained based on the second shot area S ₂ of the + divided area X side) in the mark Mk result of detecting, 3 in the XY plane of the substrate P on the basis of this sequence information Precise positioning in the direction of freedom is performed. Among them, the detection operation of the marks Mk third shot area S ₃ (and the update sequence information) is performed in parallel with at least a portion scanning exposure operation for the second shot area S _2. The main control unit 90, after the substrate P and the mask M is moved stepwise in the -Y direction, the alignment microscope 64, for example + mark Mk in the second shot area S ₂ formed in the vicinity of an end of the X-side (Not shown) is detected. The main controller 90 while performing the 3 precise positioning of the degrees of freedom in the XY plane of the substrate P based on the sequence information of the detection result and the second shot area S ₂ of the alignment microscope 64, FIG. 6 (b as shown in), while moving the projection system main body 42 in the -X direction, a second time scanning exposure operation for the second shot area S _2.

When the scanning exposure of the second shot area S ₂ has been completed, main controller 90, by step movement mask M (see FIG. 1) in the + X direction, and the third shot area S ₃ on the mask M and the substrate P Face each other. The main control device 90, the alignment microscope 62 detects the mark Mk example formed in the vicinity of an end of the -X side of the third shot area S _3. The main control device 90, in this state, as shown in FIG. 6 (c), while moving the projection system main body 42 in the + X direction to perform the first scan exposure operation for the third shot area S _3. (Fine positioning of the substrate P) control alignment at this time is performed in accordance with the detection result of the sequence information of the third shot area S ₃ and alignment microscope 62. Sequence information for the third shot area S ₃ is calculated on the basis of the mark Mk position of the second and third shot area S _2, S ₃ obtained when exposing the second shot area S _2, alignment in the microscope 62, in a state where the mask M third shot area S ₃ were opposed, three degrees of freedom in the XY plane on the basis of the marks of the respective two points between the mark Mk mark and the substrate P of the mask M ( It is only necessary to measure the displacement in the X, Y, θz) direction. Therefore, it is possible to shorten the time required for the third alignment shot area S ₃ in comparison with the alignment of the second shot area S ₂ substantially.

Thereafter, the main controller 90, for the second scanning exposure operation for the third shot area S _3, as shown in FIG. 7 (a), moved stepwise substrate P and the mask M in the + Y direction. Thereby, the position of the detection visual field of the alignment microscope 64 in the Y-axis direction substantially coincides with the position of the mark Mk formed in the second and third shot regions S ₂ and S ₃ in the Y-axis direction.

The main controller 90, the first shot area S ₁ for the first scanning exposure operation similar procedure described above (however, alignment microscope are different to be used for detection of the mark Mk), the second to the third shot area S ₃ The scanning exposure operation is performed. That is, the main controller 90, the second scanning exposure operation for the third shot area S _3, as shown in FIG. 7 (b), the alignment microscope 64 prior to the projection system main body 42 is a third shot region formed in the S _3, it detects, for example, four marks Mk, in response to this detection result, the main controller 90 updates the sequence information of the third shot area S _3. The main controller 90 while performing a precise positioning of the 3 degrees of freedom in the XY plane of the substrate P, and the scanning exposure operation for the third shot area S ₃ performed on the basis of the updated sequence information. In parallel with the scanning exposure operation, the alignment microscope 64, as shown in FIG. 7 (c), formed in the second shot area S _2, detects, for example four marks Mk. The main controller 90, based on the newly acquired positional information of the mark Mk, while updating the sequence information of the third shot area S _3, the second scanning exposure operation for the third shot area S ₃ in parallel Do.

Hereinafter, although not shown, the main controller 90 while performing the Y stepping of the substrate P as appropriate, performs scanning exposure for the fourth shot area S _4. Scanning exposure operation for the fourth shot area S ₄ will be omitted because it is substantially the same as the scanning exposure operation for the third shot area S _3.

In the scanning exposure operation for the third and fourth shot regions S ₃ and S ₄ , the mark Mk is detected by the alignment microscope 62 together with the alignment microscope 64, and the division is performed using the outputs of the

alignment microscopes

62 and 64. You may update the arrangement | sequence information of an area | region. Further, in order to expose the divided area of the second shot area S ₂ and later, when obtaining the sequence information of the divided areas may be using the position information of the mark Mk obtained when exposing the earlier defined areas . Specifically, for example, for obtaining the sequence information of the fourth shot area S _4, the main controller 90 uses a position information of the mark Mk of the first and fourth shot area S _1, S _4, and this In addition, the position information of the mark Mk in the second and third shot areas S ₂ and S ₃ obtained previously may be used.

According to the present embodiment described above, since the

alignment microscopes

62 and 64 move in the scanning direction independently of the projection system main body 42, at least a part of the scanning exposure operation and the alignment operation are performed simultaneously (in parallel). be able to. Accordingly, it is possible to shorten a time required for a series of operations including the alignment operation and the scanning exposure operation, that is, a series of processing times (tact time) required for the exposure processing of the substrate P.

In addition, since the

alignment microscopes

62 and 64 are arranged on one side and the other side of the projection system main body 42 with respect to the scanning direction, the alignment operation is performed regardless of the scanning direction (forward scanning and backward scanning) during the scanning exposure operation. The time required for a series of operations including the scanning exposure operation can be shortened.

<< Second Embodiment >>
Next, a liquid crystal exposure apparatus according to a second embodiment will be described with reference to FIGS. 8 (a) to 8 (d). Since the configuration of the liquid crystal exposure apparatus according to the second embodiment is the same as that of the first embodiment except that the configuration and operation of the alignment system are different, only the differences will be described below. Elements having the same configuration and function as those of the first embodiment are denoted by the same reference numerals as those of the first embodiment, and description thereof is omitted.

In the first embodiment, the alignment microscopes 62 and 64 (see FIG. 1) are respectively arranged before and after (+ X side and −X side) in the scanning direction with respect to the projection system main body 42. In the second embodiment, as shown in FIG. 8A, the alignment microscope 162 is provided only on the + X side of the projection system main body 42.

The alignment microscopes 62 and 64 of the first embodiment have a pair of detection fields separated in the Y-axis direction (see FIG. 4B and the like), whereas the alignment microscope 162 has a Y-axis. For example, there are four detection fields separated in the direction. The alignment microscope 162 has, for example, four detection fields of view that are spaced apart from each other so that marks Mk that are adjacent to each other in the Y-axis direction, for example, formed over two partition regions can be detected simultaneously. .

In the second embodiment, the main controller 90 (see FIG. 2), as shown in FIG. 8 (b) and FIG. 8 (c), the prior to the scanning exposure operation of the first shot area S _1, while driving the alignment microscope 162 in the + X direction, formed on the substrate P, for example a total of performs 16 marks Mk detection, the first sequence information of the shot areas S ₁ based on the detection result of the mark Mk As shown in FIG. 8D, the projection system main body 42 is driven in the + X direction while performing the precise position control of the substrate P according to the arrangement information, and the scanning exposure operation of the first shot region S ₁ is performed. I do.

In the second embodiment, since the alignment microscope 162 has, for example, four detection fields in the Y-axis direction, a wider area of the substrate P can be obtained by moving the alignment microscope 62 once in the + X direction. Can be detected (all marks Mk in the second embodiment). Therefore, as compared with the first embodiment, it is possible to further shorten a series of processing time (tact time) required for the exposure processing of the substrate P.

Also in the second embodiment, similarly to the first embodiment, the Y-step operation of the substrate P and / or the X-step operation of the mask M (see FIG. 1) is performed, so that the partition area to be exposed is determined. Move. Incidentally, in the second embodiment, prior to the scanning exposure of the first shot area S _1, since the detection of all the marks Mk formed on the substrate P, when the second shot area S ₂ and subsequent scanning exposure In addition, it is not necessary to perform the EGA calculation again. At the time of the second shot area S ₂ and subsequent scanning exposure may update the sequence information of the partitioned regions performed again alignment measurement (EGA calculation).

<< Third Embodiment >>
Next, a liquid crystal exposure apparatus according to a third embodiment will be described with reference to FIGS. 9 (a) and 9 (b). Since the configuration of the liquid crystal exposure apparatus according to the third embodiment is the same as that of the first embodiment except that the configurations and operations of the alignment system and the projection optical system are different, only the differences will be described below. Elements having the same configurations and functions as those of the first embodiment are denoted by the same reference numerals as those of the first embodiment, and description thereof is omitted.

In the first embodiment, the alignment system 60 has the

alignment microscopes

62 and 64 in the front and rear (+ X side and −X side) of the projection system main body 42 in the scanning direction. The difference is that the alignment microscope 62 is provided only on the + X side of the projection system main body 42.

In the third embodiment, in the main controller 90 (see FIG. 2), when the substrate P is Y-stepped with respect to the projection system main body 42, the alignment microscope 62 and the projection system main body 42 are set to a predetermined initial stage. Return to position. Specifically, for example, as shown in FIG. 9 (a), when the scanning exposure operation in the first shot area S ₁ is completed, the main controller 90, as in the first embodiment, FIG. 9 As shown in FIG. 9B, the substrate P is moved in the −Y direction by a Y step operation (see the black arrow in FIG. 9B).

Further, the main controller 90 drives the alignment microscope 62 and the projection system main body 42 in the −X direction in parallel with the Y step operation of the substrate P in the −Y direction, respectively, so that the initial position (FIG. 4) is reached. (See (a)) (see white arrow in FIG. 9B). In the present embodiment, the initial positions of the alignment microscope 62 and the projection system main body 42 are in the vicinity of the −X side end of each movable range. Thereafter, the main controller 90, by driving the alignment microscope 62, and a projection system main body 42 in the respective + X direction to perform the second scanning exposure operation for the first shot area S _1. Prior to the scanning exposure operation in the second, the alignment microscope 62, performs detection operation of the marks Mk formed on the substrate P, in accordance with the output, and updates the first sequence information of the shot areas S ₁ May be.

According to the third embodiment, even if there is only one alignment microscope 62, the same effect as in the first embodiment can be obtained.

Note that the configurations of the first to third embodiments described above can be changed as appropriate. For example, in the second embodiment, similarly to the first embodiment, the alignment microscopes 162 may be arranged on both sides (+ X side and −X side) of the projection system main body 42 in the scanning direction. In this case, alignment measurement can be performed prior to the movement of the projection system main body 42 even if the scanning direction is the -X direction.

In the first embodiment, the scanning exposure operation for the first shot region S ₁ is started after the detection of all the marks Mk in the first shot region S ₁ is completed. However, the present invention is not limited to this. it may start the scanning exposure operation of the first shot area S ₁ during the measurement of a plurality of marks Mk formed in the first shot area S _1.

In each of the above embodiments, the alignment measurement operation and the scanning exposure operation are performed in parallel on a single substrate P. However, the present invention is not limited to this. For example, two substrates P are prepared. While performing the scanning exposure of the substrate P, the alignment measurement of the other substrate P may be performed.

In the above embodiments, after the scanning exposure of the first shot area S _1, it was subjected to second scanning exposure for the shot area S ₂ set in the + Y (upper) side of the first shot area S ₁ is not limited to this, the next scanning exposure of the first shot area S ₁ may be performed scanning exposure of the fourth shot area S _4. In this case, for example, by using a mask facing the first shot region S ₁ and a mask corresponding to the fourth shot region S ₄ (two masks in total), the first and fourth shot regions S ₁ , it can be scanned exposing the S ₄ sequentially. Also, it may be performed scanning exposure of the fourth shot area S ₄ by step movement of the mask M in the + X direction after the scanning exposure of the first shot area S _1.

In each of the above embodiments, the mark Mk is formed in each partition area (first to fourth shot areas S ₁ to S ₄ ). It may be formed in a scribe line.

In each of the above embodiments, a pair of illumination area IAM and exposure area IA that are separated in the Y-axis direction are generated on mask M and substrate P, respectively (see FIG. 1), but illumination area IAM and exposure area IA The shape and length are not limited to this, and can be changed as appropriate. For example, the length of the illumination area IAM and the exposure area IA in the Y-axis direction may be equal to the pattern surface of the mask M and the length of one partition area on the substrate P in the Y-axis direction, respectively. In this case, the transfer of the mask pattern is completed with a single scanning exposure operation for each partitioned region. Alternatively, the illumination area IAM and the exposure area IA are one area whose length in the Y-axis direction is half the length in the Y-axis direction of one partition area on the pattern surface of the mask M and the substrate P, respectively. Also good. In this case, similarly to the above embodiment, it is necessary to perform the scanning exposure operation twice for one partitioned area.

Further, as in the above-described embodiment, when joint exposure is performed by reciprocating the projection system main body 42 in order to form a single mask pattern in a partitioned area, alignment for the forward path and the backward path having different detection fields of view. You may arrange | position a microscope before and behind the projection system main body 42 regarding a scanning direction (X direction). In this case, for example, the mark Mk at the four corners of the partitioned area is detected by an alignment microscope for the forward path (for the first exposure operation), and the mark near the joint is detected by the alignment microscope for the backward path (for the second exposure operation). Mk may be detected. Here, the joint portion means a joint portion between an area exposed by the forward scanning exposure (area where the pattern is transferred) and an area exposed by the backward scanning exposure (the area where the pattern is transferred). To do. As the mark Mk in the vicinity of the joint portion, the mark Mk may be formed on the substrate in advance, or an exposed pattern may be used as the mark Mk. In each of the above embodiments, when the scanning system main body 42 is driven in the + X direction to perform the scanning exposure operation, the forward alignment microscope is the alignment microscope 62 and the return alignment microscope is the alignment microscope 64. When the scanning exposure operation is performed by driving the projection system main body 42 in the −X direction, the forward alignment microscope is the alignment microscope 64, and the backward alignment microscope is the alignment microscope 62.

In the above-described embodiment (and the first and second modifications), the drive system 24 for driving the illumination system body 22 of the illumination system 20 and the drive system 34 for driving the stage body 32 of the mask stage apparatus 30 are used. A drive system 44 for driving the projection optical system main body 42 of the projection optical system 40, a drive system 54 for driving the stage main body 52 of the substrate stage apparatus 50, and an alignment microscope 62 for driving the alignment system 60. The case where each of the drive systems 66 (see FIG. 2) includes a linear motor has been described. However, in order to drive the illumination system main body 22, the stage main body 32, the projection optical system main body 42, the stage main body 52, and the alignment microscope 62. The type of actuator is not limited to this, and can be changed as appropriate. For example, a feed screw (ball screw) device, a belt It is possible to use various actuators such as braking system appropriately.

In each of the above embodiments, the projection system main body 42 and the alignment microscope 62 share a part of the drive system in the scanning direction (for example, a linear motor, a guide, etc.). The driving system 66 for driving the alignment microscope 62 and the driving system 44 for driving the projection system main body 42 of the projection optical system 40 are configured completely independently. May be. That is, like the exposure apparatus 10A shown in FIG. 10, the projection optical system main body 42 included in the projection optical system 40A and the alignment microscope 62 included in the alignment system 60A are arranged so that the Y positions do not overlap each other. A drive system 66 (including a linear motor, a guide, etc.) for driving the alignment microscope 62 and a drive system 44 (eg, including a linear motor, a guide, etc.) for driving the projection system main body 42 are completely provided. It can be set as an independent structure. In this case, before the start of the scanning exposure operation for the partitioned area to be exposed, the substrate P is moved stepwise (reciprocated) in the Y-axis direction to measure alignment of the partitioned area. Further, like the exposure apparatus 10B shown in FIG. 11, the alignment system 60B includes a drive system 44 (including a linear motor, a guide, etc.) for driving the projection optical system main body 42 of the projection optical system 40B. The drive system 44 and the drive system 66 are completely independent by arranging the Y positions so as not to overlap with a drive system 66 (including a linear motor, a guide, etc.) for driving the alignment microscope 62. It can also be.

In each of the above embodiments, the measurement system 26 for measuring the position of the illumination system body 22 of the illumination system 20, the measurement system 36 for measuring the position of the stage body 32 of the mask stage apparatus 30, and the projection optical system 40. A measurement system 46 for measuring the position of the projection optical system main body 42, a measurement system 56 for measuring the position of the stage main body 52 of the substrate stage device 50, and a position measurement of the alignment microscope 62 of the alignment system 60. The measurement system 68 (see FIG. 2) includes linear encoders. However, the illumination system main body 22, the stage main body 32, the projection system projection optical system main body 42, the stage main body 52, and the alignment microscope 62 are described. The type of measurement system for performing position measurement is not limited to this, and can be changed as appropriate, for example, an optical interferometer, an There is possible to use various measuring systems such as the measurement system using a combination of linear encoder and optical interferometer as appropriate.

Here, the illumination system 20, the mask stage device 30, the projection optical system 40, the substrate stage device 50, and the alignment system 60 may be modularized. The illumination system 20 is called the illumination system module 12M, the mask stage device 30 is called the mask stage module 14M, the projection optical system 40 is called the projection optical system module 16M, the substrate stage device 50 is called the substrate stage module 18M, and the alignment system 60 is called the alignment system module 20M. . Hereinafter, although appropriately referred to as “each module 12M to 20M”, they are placed on the corresponding bases 28A to 28E so as to be physically independent of each other.

Accordingly, as shown in FIG. 12, in the liquid crystal exposure apparatus 10, an arbitrary (one or a plurality) of the modules 12M to 20M (the substrate stage module 18M as an example in FIG. 12) is replaced with another module. Can be replaced independently of the module. At this time, the module to be exchanged is exchanged integrally with the gantry 28A to 28E (the gantry 28E in FIG. 12) that supports the module.

During the replacement operation of the modules 12M to 20M, the modules 12M to 20M (and the bases 28A to 28E supporting the modules) to be replaced move in the X-axis direction along the floor 26 surface. Therefore, for example, wheels or an air caster device may be provided on the bases 28A to 28E so that the bases 28A to 28E can be easily moved on the floor 26, for example. As described above, in the liquid crystal exposure apparatus 10 according to the present embodiment, an arbitrary module among the modules 12M to 20M can be easily separated from other modules, so that it is excellent in maintainability. In FIG. 12, the substrate stage module 18M is separated from other elements by moving in the + X direction (back side of the drawing) with respect to the other elements (such as the projection optical system module 16M) together with the gantry 28E. Although shown, the moving direction of the module to be moved (and the gantry) is not limited to this, and may be, for example, the −X direction (front of the page) or the + Y direction (upward on the page). good. Further, a positioning device may be provided to ensure position reproducibility after installation on the floor 26 of each gantry 28A to 28E. The positioning device may be provided on each of the gantry 28A to 28E, or the installation position of each of the gantry 28A to 28E by cooperation of a member provided on each of the gantry 28A to 28E and a member provided on the floor 26. May be configured to be reproduced.

In addition, since the liquid crystal exposure apparatus 10 of the present embodiment has a configuration in which the modules 12M to 20M can be separated independently, the modules 12M to 20M can be individually upgraded. The upgrade refers to, for example, an upgrade to cope with an increase in the size of the substrate P to be exposed, and the modules 12M to 20M are replaced with modules having the same performance but with improved performance. This includes cases where

Here, for example, when the substrate P is increased in size, only the area of the substrate P (in this embodiment, the dimensions in the X-axis and Y-axis directions) is increased, and the thickness of the normal substrate P (the dimension in the Z-axis direction) is Does not change substantially. Therefore, for example, when the substrate stage module 18M of the liquid crystal exposure apparatus 10 is upgraded in response to an increase in the size of the substrate P, as shown in FIG. 12, a substrate stage module 18AM newly inserted instead of the substrate stage module 18M is used. The gantry 28G that supports the substrate stage module 18AM changes in the X-axis and / or Y-axis direction dimensions, but the Z-axis direction dimension does not change substantially. Similarly, the dimension in the Z-axis direction of the mask stage module 14M is not substantially changed by the upgrade corresponding to the increase in the size of the mask M.

For example, in order to enlarge the illumination area IAM and the exposure area IA (see FIG. 1 and the like), the number of illumination optical systems included in the illumination system module 12M and the number of projection lens modules included in the projection optical system module 16M are increased. Thus, each of the illumination system module 12M and the projection optical system module 16M can be upgraded. The illumination system module and the projection optical system module (not shown) after the upgrade only change the dimensions in the X-axis and / or Y-axis direction compared to before the upgrade, and the dimensions in the Z-axis direction do not substantially change. .

For this reason, in the liquid crystal exposure apparatus 10 of this embodiment, the bases 28A to 28E that support the modules 12M to 20M and the bases that support the upgraded modules (the substrate stage module 18AM shown in FIG. 12 are supported). The gantry 28G) is sized in the Z-axis direction. Here, the term “scaling” means that the dimensions in the Z-axis direction are the same for the base before and after the replacement, that is, the dimensions in the Z-axis direction of the base supporting the module having the same function are substantially constant. It means that. As described above, in the liquid crystal exposure apparatus 10 of the present embodiment, since the dimensions in the Z-axis direction of each of the mounts 28A to 28E are made constant, it is possible to reduce the time for designing each module.

Further, in the liquid crystal exposure apparatus 10, since the exposure surface of the substrate P and the pattern surface of the mask M are parallel to the direction of gravity (so-called vertical arrangement), the illumination system module 12M, the mask stage module 14M, and the projection optical system module Each module of 16M and the substrate stage module 18M can be installed in series on the floor 26 surface. As described above, since each module does not have its own weight, for example, the substrate stage device, the projection optical system, the mask stage device, and the illumination system corresponding to each module are stacked in the direction of gravity. Unlike the conventional exposure apparatus, it is not necessary to provide a high-rigidity main frame (body) that supports each element. Further, since the structure is simple, installation (installation) work of the apparatus, maintenance work of each module 12M to 20M, replacement work, etc. can be performed easily and in a short time. Moreover, since each said module is a structure arrange | positioned along the floor 26 surface, the height of the whole apparatus can be made low. Thereby, the chamber which accommodates each said module can be reduced in size, cost can be reduced, and an installation construction period can be shortened.

Moreover, in each said embodiment, the wavelength of the light source used in the illumination system 20 and the illumination light IL irradiated from this light source is not specifically limited, For example, ArF excimer laser light (wavelength 193 nm), KrF excimer laser light ( Ultraviolet light having a wavelength of 248 nm) or vacuum ultraviolet light such as F ₂ laser light (wavelength 157 nm) may be used.

In the above embodiment, the illumination system main body 22 including the light source is driven in the scanning direction. However, the present invention is not limited to this. For example, as in the exposure apparatus disclosed in Japanese Patent Laid-Open No. 2000-12422, the light source is fixed. Only the illumination light IL may be scanned in the scanning direction.

Further, in the above embodiment, the illumination area IAM and the exposure area IA are formed in a strip shape extending in the Y-axis direction. However, the present invention is not limited to this. For example, as disclosed in US Pat. No. 5,729,331. A plurality of regions arranged in a staggered pattern may be combined.

In each of the above embodiments, the mask M and the substrate P are arranged so as to be orthogonal to the horizontal plane (so-called vertical arrangement). However, the present invention is not limited to this, and the mask M and the substrate P are parallel to the horizontal plane. It may be arranged. In this case, the optical axis of the illumination light IL is substantially parallel to the direction of gravity.

In addition, precise positioning in the XY plane of the substrate P was performed in accordance with the alignment measurement result during the scanning exposure operation. At the same time, before the scanning exposure operation (or in parallel with the scanning exposure operation), Surface position information may be obtained, and surface position control (so-called autofocus control) of the substrate P may be performed during the scanning exposure operation.

Further, the use of the exposure apparatus is not limited to an exposure apparatus for liquid crystal that transfers a liquid crystal display element pattern onto a square glass plate. For example, an exposure apparatus for manufacturing an organic EL (Electro-Luminescence) panel, a semiconductor The present invention can be widely applied to an exposure apparatus for manufacturing, an exposure apparatus for manufacturing a thin film magnetic head, a micromachine, a DNA chip, and the like. Moreover, in order to manufacture not only microdevices such as semiconductor elements but also masks or reticles used in light exposure apparatuses, EUV exposure apparatuses, X-ray exposure apparatuses, electron beam exposure apparatuses, etc., glass substrates, silicon wafers, etc. The present invention can also be applied to an exposure apparatus that transfers a circuit pattern.

The object to be exposed is not limited to the glass plate, but may be another object such as a wafer, a ceramic substrate, a film member, or a mask blank. Moreover, when the exposure target is a substrate for a flat panel display, the thickness of the substrate is not particularly limited, and includes, for example, a film-like (flexible sheet-like member). The exposure apparatus of the present embodiment is particularly effective when a substrate having a side length or diagonal length of 500 mm or more is an exposure target. Further, when the substrate to be exposed is a flexible sheet, the sheet may be formed in a roll shape. In this case, the partition area to be exposed can be easily changed (stepped) with respect to the illumination area (illumination light) by rotating (winding) the roll regardless of the step operation of the stage device. .

For electronic devices such as liquid crystal display elements (or semiconductor elements), the step of designing the function and performance of the device, the step of producing a mask (or reticle) based on this design step, and the step of producing a glass substrate (or wafer) A lithography step for transferring a mask (reticle) pattern to a glass substrate by the exposure apparatus and the exposure method of each embodiment described above, a development step for developing the exposed glass substrate, and a portion where the resist remains. It is manufactured through an etching step for removing the exposed member of the portion by etching, a resist removing step for removing a resist that has become unnecessary after etching, a device assembly step, an inspection step, and the like. In this case, in the lithography step, the above-described exposure method is executed using the exposure apparatus of the above embodiment, and a device pattern is formed on the glass substrate. Therefore, a highly integrated device can be manufactured with high productivity. .

As described above, the exposure apparatus and method of the present invention are suitable for scanning exposure of an object. Moreover, the manufacturing method of the flat panel display of this invention is suitable for production of a flat panel display. The device manufacturing method of the present invention is suitable for the production of micro devices.

DESCRIPTION OF SYMBOLS 10 ... Liquid crystal exposure apparatus, 20 ... Illumination system, 30 ... Mask stage apparatus, 40 ... Projection optical system, 50 ... Substrate stage apparatus, 60 ... Alignment system, M ... Mask, P ... Substrate.

Claims

An exposure apparatus that irradiates an object with illumination light via a projection optical system, scans and exposes the object by relatively driving the projection optical system,
A mark detection unit that performs mark detection of a mark provided on the object;
A first drive system for driving the mark detection unit;
A second drive system for driving the projection optical system;
An exposure apparatus comprising: a control device that controls the first and second drive systems so as to drive the mark detection unit before driving the projection optical system.
2. The exposure apparatus according to claim 1, wherein the control device controls the first and second drive systems so as to drive the projection optical system after at least a part of the mark detection by the mark detection unit is completed.
The mark detection unit is provided on a first detection device provided on one side of the projection optical system and on the other side of the projection optical system with respect to a scanning direction in which the projection optical system is relatively driven with respect to the object. A second detection device,
The controller is
In the scanning exposure from the other side to the one side, the projection optical system is driven based on a detection result by the first detection device,
3. The first and second drive systems are controlled so as to drive the projection optical system based on a detection result by the second detection device in the scanning exposure from the one side to the other side. The exposure apparatus described in 1.
The object has at least first and second partition regions whose positions are different from each other,
The control device drives and controls the second detection device to a position where the mark can be detected in the second partition region before performing the scanning exposure from the one side to the other side with respect to the second partition region. The exposure apparatus according to claim 3, wherein the second drive system is controlled to do so.
In the scanning exposure from the other side to the one side, the control device drives the first detection device and the projection optical system from the other side to the one side while moving the second detection device to the other side. 5. The exposure apparatus according to claim 3, wherein the first and second drive systems are controlled so as to be driven from one side to the other side.
6. The control device according to claim 1, wherein the control device performs control so that at least a part of a mark detection operation including the mark detection and a scanning exposure operation including the scanning exposure are performed in parallel. Exposure device.
The mark detection operation includes a detection position movement operation in which the mark detection unit moves to a position where the mark detection operation is performed,
The exposure apparatus according to claim 6, wherein the scanning exposure operation includes a movement operation of the projection optical system before the start of the scanning exposure.
The exposure apparatus according to claim 6 or 7, wherein the control device makes the drive speed of the projection optical system different from the drive speed of the mark detection unit during at least one of the mark detection operation and the scanning exposure operation. .
The exposure apparatus according to claim 8, wherein the drive speed of the mark detection unit is slower when the mark detection operation is performed in parallel with the scanning exposure operation than when only the mark detection operation is performed.
The mark detection unit includes a plurality of marks provided on the object with respect to a direction intersecting a scanning direction in which the projection optical system is relatively driven with respect to the object, rather than a length of a region irradiated with the illumination light. The exposure apparatus according to any one of claims 1 to 9, wherein a mark having a long distance is provided so as to be detectable.
The object has first and second partition regions provided side by side in a direction intersecting the scanning direction,
The mark detection unit is provided so as to be capable of simultaneously detecting at least one of the marks on the first partition area and at least one of the marks on the second partition area in a direction intersecting the scanning direction. Item 15. The exposure apparatus according to Item 10.
The control device moves the object and the projection optical system relative to each other in a direction intersecting the scanning direction when changing the region where the exposure operation is performed from the first partition region to the second partition region, The exposure apparatus according to claim 11, wherein the mark detection unit and the projection optical system are moved to a detection start position in parallel with the relative movement.
The optical axis of the projection optical system is parallel to a horizontal plane;
The exposure apparatus according to any one of claims 1 to 12, wherein the object is disposed in a state where an exposure surface irradiated with the illumination light is orthogonal to the horizontal plane.
14. The exposure apparatus according to claim 13, wherein the mark detection unit and the projection optical system are arranged so as to be separable from each other.
The exposure apparatus according to any one of claims 1 to 14, wherein the object is a substrate used in a flat panel display device.
The exposure apparatus according to claim 15, wherein the substrate has a length of at least one side or a diagonal length of 500 mm or more.
Exposing the object using the exposure apparatus according to any one of claims 1 to 16,
Developing the exposed object. A method of manufacturing a flat panel display.
Exposing the object using the exposure apparatus according to any one of claims 1 to 16,
Developing the exposed object.
An exposure method of irradiating an object with illumination light through a projection optical system, and performing scanning exposure by relatively driving the projection optical system with respect to the object,
Performing mark detection of a mark provided on the object using a mark detection unit;
Driving the mark detection unit using a first drive system;
When the projection optical system is driven using the second drive system,
Controlling the first and second drive systems to drive the mark detection unit prior to driving the projection optical system.
20. The exposure method according to claim 19, wherein in the control, the first and second drive systems are controlled to drive the projection optical system after at least a part of the mark detection by the mark detection unit is completed. .
The mark detection unit is provided on a first detection device provided on one side of the projection optical system and on the other side of the projection optical system with respect to a scanning direction in which the projection optical system is relatively driven with respect to the object. A second detection device,
In the control,
In the scanning exposure from the other side to the one side, the projection optical system is driven based on a detection result by the first detection device,
21. In the scanning exposure from the one side to the other side, the first and second drive systems are controlled so as to drive the projection optical system based on a detection result by the second detection device. An exposure method according to 1.
The object has at least first and second partition regions whose positions are different from each other,
In the control, before the scanning exposure from the one side to the other side of the second partitioned area is performed, the second detection device is driven to a position where the mark can be detected in the second partitioned area. The exposure method according to claim 21, wherein the second drive system is controlled to be controlled.
In the control, in the scanning exposure from the other side to the one side, the second detection device is moved to the other side while driving the first detection device and the projection optical system from the other side to the one side. The exposure method according to claim 21 or 22, wherein the first and second drive systems are controlled so as to be driven from the side to the one side.
The control is performed so that at least a part of the mark detection operation including the mark detection and the scanning exposure operation including the scanning exposure are performed in parallel. Exposure method.
The mark detection operation includes a detection position movement operation in which the mark detection unit moves to a position where the mark detection operation is performed,
The exposure method according to claim 24, wherein the scanning exposure operation includes a moving operation of the projection optical system before the start of the scanning exposure.
26. The exposure according to claim 24 or 25, wherein the controlling makes a driving speed of the projection optical system different from a driving speed of the mark detection unit during at least one of the mark detection operation and the scanning exposure operation. Method.
27. The exposure method according to claim 26, wherein the drive speed of the mark detection unit is slower when the mark detection operation is performed in parallel with the scanning exposure operation than when only the mark detection operation is performed.
The mark detection unit includes a plurality of marks provided on the object with respect to a direction intersecting a scanning direction in which the projection optical system is relatively driven with respect to the object, rather than a length of a region irradiated with the illumination light. The exposure method according to any one of claims 19 to 27, wherein marks having a long distance are provided so as to be detectable.
The object has first and second partition regions provided side by side in a direction intersecting the scanning direction,
The mark detection unit is provided so as to be capable of simultaneously detecting at least one of the marks on the first partition area and at least one of the marks on the second partition area in a direction intersecting the scanning direction. Item 28. The exposure method according to Item 28.
In the control, when changing the region where the exposure operation is performed from the first partition region to the second partition region, the object and the projection optical system are relatively moved in a direction intersecting the scanning direction, 30. The exposure method according to claim 29, wherein the mark detection unit and the projection optical system are moved to a detection start position in parallel with the relative movement.
The optical axis of the projection optical system is parallel to a horizontal plane;
The exposure method according to any one of claims 19 to 30, wherein the object is arranged in a state where an exposure surface irradiated with the illumination light is orthogonal to the horizontal plane.
32. The exposure method according to claim 31, wherein the mark detection unit and the projection optical system are arranged so as to be separable from each other.
The exposure method according to any one of claims 19 to 32, wherein the object is a substrate used in a flat panel display device.
34. The exposure method according to claim 33, wherein the substrate has a length of at least one side or a diagonal length of 500 mm or more.
Exposing the object using the exposure method according to any one of claims 19 to 34;
Developing the exposed object. A method of manufacturing a flat panel display.
Exposing the object using the exposure method according to any one of claims 19 to 34;
Developing the exposed object.