WO2015139190A1

WO2015139190A1 - Led frame and led illuminant

Info

Publication number: WO2015139190A1
Application number: PCT/CN2014/073565
Authority: WO
Inventors: 游志
Original assignee: 深圳市瑞丰光电子股份有限公司
Priority date: 2014-03-18
Filing date: 2014-03-18
Publication date: 2015-09-24

Abstract

An LED frame comprising a metal substrate (1). The metal substrate (1) is provided with multiple grooves (2) used for mounting an LED chip (5). The grooves (2) are provided with two sets of opposite sides (21 and 22). Opening angles of each set of opposite sides (21 and 22) are less than 60°. The depth of the grooves (2) is 1/3 to 3 times of the thickness of the LED chip (5). The LED frame has the grooves (2) manufactured directly on the metal substrate (1) to prevent light absorption by the sides of the chip (5) and obviates the need for an encircling embankment to be provided additionally on the metal substrate (1), thus reducing the number of processes, and increasing productivity. The grooves (2) and the metal substrate (1) are integrally formed and are free from possibilities of deformation and peeling, thus ensuring the reliability of an LED and increasing the quality of the LED. With the depth of the grooves (2) being designed as 1/3 to 3 times of the thickness of the LED chip (5), and at the same time, with the opening angles of the opposite sides (21 and 22) being limited to 60° or less, simultaneously ensured are light emission by the front side of the chip (5) and prevention of light absorption by the sides, thus increasing light emission efficiency of the LED.

Description

LED bracket and LED lighting part

Technical field

The utility model relates to the technical field of LED illumination, in particular to an LED bracket and an LED lighting component.

Background technique

LED is one of the widely used light sources. In the LED manufacturing process, the dam is usually made around the chip to facilitate the coating of fluorescent glue or encapsulant, or to block the absorption of light by the sidewall of the chip. The existing dam manufacturing method is to make a dam on the substrate before packaging, and then install the chips one by one in the middle of the dam. This method is complicated, the efficiency is low, the cost is increased, and the dam is independent. On the substrate, long-term use has a hidden danger, which affects the reliability of the LED.

technical problem

The purpose of the utility model is to provide a novel LED bracket, which aims to simplify the process, improve the production efficiency and improve the reliability.

Technical solution

The utility model is realized as follows, an LED bracket comprises a metal substrate, wherein the metal substrate is provided with a plurality of grooves for mounting LED chips, the grooves having two sets of opposite sides, each set of opposite sides The opening angle is less than 60°, and the depth of the groove is 1/3 to 3 times the thickness of the LED chip.

Further, the LED holder further includes a plastic reflective cup surrounding the periphery of the groove, and the groove is provided with a plastic reflective layer adjacent to a pair of opposite sides of the plastic reflective cup, the plastic layer and the plastic layer The plastic reflective cup is integrally formed. This design not only precisely controls the shape and size of the sinker cup, but also does not destroy the optical structure of the reflector cup due to the sinker design.

Further, the surface of the metal substrate is provided with a laminated structure of one or more of a gold plating layer, a silver plating layer, a copper plating layer, a nickel plating layer, and a palladium plating layer.

Another object of the present invention is to provide an LED lighting device, comprising the LED bracket, wherein the LED bracket is provided with an LED chip.

Further, a fluorescent glue is disposed outside the LED chip and the recess.

Alternatively, a transparent encapsulant is disposed on the outside of the LED chip and the recess.

Beneficial effect

The LED bracket provided by the utility model directly forms a groove on the metal substrate to prevent the side of the chip from absorbing light, and does not need to additionally set a dam on the metal substrate, thereby saving the process and improving the production efficiency; and, because the groove is integrated with the metal substrate Forming, there is no possibility of deformation, peeling, etc., thus ensuring The reliability of the LED improves the quality of the LED; the depth of the groove is designed to be 1/3 to 3 times the thickness of the LED chip, and the opening angle of the opposite surface is limited to 60°, and the front surface of the chip can be ensured at the same time. Avoid side light absorption and improve the light output efficiency of the LED.

DRAWINGS

1 is a front elevational view of an LED bracket provided by an embodiment of the present invention;

Figure 2 is a cross-sectional view taken along the line A-A of the LED holder shown in Figure 1;

Figure 3 is a cross-sectional view taken along the line B-B of the LED holder shown in Figure 1.

Embodiments of the invention

In order to make the objects, technical solutions and advantages of the present invention more comprehensible, the present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It is understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

Referring to FIG. 1 and FIG. 2 , an LED bracket provided by an embodiment of the present invention includes a metal substrate 1 , which is fabricated by chemical etching, stamping, forging, machining, and the like to form a plurality of LED chips 5 . The number of the grooves 2 and the arrangement of the grooves 2 are naturally the same as the number and arrangement of the preset LED chips 5. The size of the grooves 2 is slightly larger than the size of the LED chips 5, and the depth is the thickness of the LED chips 5. 1/3 to 3 times, and preferably 1 to 2 times. The groove 2 is generally quadrangular in shape, having two opposite sides, namely two opposite first sides 21 and two opposite second sides 22, two first sides 21 and two second sides 22 The opening angles α and β are both less than 60°. The surface of the metal substrate 1 may be provided with a laminated structure of one or more of a gold plating layer, a silver plating layer, a copper plating layer, a nickel plating layer, and a palladium plating layer for electrically connecting the LED chip 5 to the power supply line.

The side of the LED chip 5 has light absorbing capability, and the light emitted by the chip itself and the light emitted by other chips are irradiated to the side thereof to be absorbed in a large amount, resulting in light loss, and the depth of the groove 2 is designed to be 1/3 of the thickness of the LED chip 5. ~3 times, while the opening angle of the opposite surface is limited to 60 °, so that the light can not be irradiated to the side of the LED chip 5, to avoid side light absorption. The definition of the opening angle is necessary. If the opening angle is too large, the light cannot be blocked from illuminating the side of the chip. If the problem of the side light absorption is solved by deepening the groove 2, the light output on the front side of the LED chip 5 is limited, and therefore, The depth of the groove 2 is designed to be 1/3 to 3 times the thickness of the LED chip 5, and it is a preferred solution to limit the opening angle of the opposite surface to 60°, which can simultaneously ensure the front side of the chip and avoid side light absorption.

Further, in the subsequent dispensing process, the fluorescent glue or the transparent glue covers the LED chip 5 and the groove 2, and when the size of the groove 2 is large, the fluorescent glue or the transparent glue fills the groove 2, and To some extent, the coating of fluorescent glue or transparent glue is facilitated. When the size of the groove 2 is small, the fluorescent glue or the transparent glue does not fill the inside of the groove 2, and neither of them will affect the LED light.

The LED bracket directly forms the groove 2 on the metal substrate 1 to prevent the side of the chip from absorbing light, and does not need to additionally set a dam on the metal substrate 1, thereby saving the process and improving the production efficiency; and, due to the groove 2 and the metal substrate 1 One-piece molding, there is no possibility of deformation, peeling, etc., thereby ensuring the reliability of the LED and improving the quality of the LED.

Further referring to FIGS. 1, 2, and 3, the LED bracket further includes a plastic reflective cup 3 surrounding the periphery of the recess 2, and the material thereof may be a thermosetting or thermoplastic highly reflective plastic material such as PPA, PCT, epoxy resin or silica gel. The shape of the plastic reflector cup 3 may be a rectangle whose short side is slightly larger than the width of the side surface of the groove 2. The pair of opposite first side faces 21 of the groove 2 adjacent to the plastic reflector cup 3 are provided with a plastic reflective layer 4, and the plastic reflection is The layer 4 is integrally formed with the plastic reflector cup 3. In the manufacturing process, a series of plastic reflector cups 3 are formed on the metal substrate 1 to form a plastic reflective layer 4 directly on the side of the recess 2 adjacent to the plastic reflector cup 3. Thus, the plastic reflective layer 4 on the side of each groove 2 is integrated with the plastic reflective cup 3, further enhancing the bonding of the plastic reflective cup 3 and the metal substrate 1, enhancing the reliability of the LED and facilitating the reflection of light.

The utility model also provides an LED lighting component, comprising the above LED bracket, and an LED chip 5 disposed in the recess 2 of the LED bracket. A fluorescent glue or a transparent encapsulant is disposed on the outside of the LED chip 5 and the recess 2 to form an optical lens. The light-emitting lens can be formed in the plastic reflector cup 3. Of course, it is also possible to form a light lens on the LED chip 5 and the groove 2 without providing a reflector cup.

The above is only the preferred embodiment of the present invention, and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the present invention. The scope of protection of utility models.

Claims

An LED bracket, comprising: a metal substrate, wherein the metal substrate is provided with a plurality of grooves for mounting LED chips, the grooves having two sets of opposite sides, and the opening angles of the opposite sides of each group are Less than 60°, the depth of the groove is 1/3 to 3 times the thickness of the LED chip.
The LED holder according to claim 1, wherein the LED holder further comprises a plastic reflective cup surrounding the periphery of the recess, the recess being adjacent to a pair of opposite sides of the plastic reflective cup. There is a plastic reflective layer, and the plastic layer is integrally formed with the plastic reflective cup.
The LED holder according to claim 1, wherein a surface of the metal substrate is provided with a laminated structure of one or more of a gold plating layer, a silver plating layer, a copper plating layer, a nickel plating layer, and a palladium plating layer.
An LED lighting device comprising the LED holder according to any one of claims 1 to 3, wherein the LED holder is provided with an LED chip.
The LED lighting device according to claim 4, wherein a fluorescent glue is disposed outside the LED chip and the recess.
The LED lighting device of claim 4, wherein a transparent encapsulant is disposed on the outside of the LED chip and the recess.