CN203491259U - Large-power white light device for integrated packaging of LED chips - Google Patents
Large-power white light device for integrated packaging of LED chips Download PDFInfo
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- CN203491259U CN203491259U CN201320626929.6U CN201320626929U CN203491259U CN 203491259 U CN203491259 U CN 203491259U CN 201320626929 U CN201320626929 U CN 201320626929U CN 203491259 U CN203491259 U CN 203491259U
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Abstract
The utility model provides a large-power white light device for integrated packaging of LED chips, relating to LED packaging technology. The device is used to solve the problem that COB-packaged LED light sources in the prior art are small in illumination angle, and makes improvements in the defect that LED lights have granular and dazzling sense, so that people feel more comfortable. The device employs the following technical scheme: a packaging groove in an aluminium substrate comprises a bottom; steps are arranged on two sides of the bottom; LED chips are packaged and fixed on the steps; a light guiding plate is disposed on the bottom; the bottom surface of the light guiding plate is provided with an arc-shaped surface as a reflective surface of the light guiding plate; the upper surface of the light guiding plate is at the same level with an opening of the packaging groove; two side edges of the light guiding plate contact with groove walls above the packaging groove and under the steps; a reflective layer is arranged on the bottom and the walls of the packaging groove; a layer of phosphor glue is on the surface of the packaging groove; and the phosphor glue covers the LED chips and the light guiding plate from the top. The device is especially suitable for applications of small chips in the field of indoor lighting.
Description
Technical field
The utility model relates to a kind of LED encapsulation technology, particularly relates to chip on board (COB) encapsulation technology.
Background technology
LED high-power chip is commonly used to make the high-power illumination devices such as outdoor lighting, car headlight.But the complex manufacturing of high-power chip, yield is low, and production cost is high.Yield is high, cost is low for the little chip of LED.In order to reduce the production cost of LED high power device, all adopt the scheme of the little chip of integrated LED in the market.In the technology path of multiple integrated little chip, chip on board (being called for short COB) encapsulation technology is just becoming the hot technology of development and application at present, and this technology has been widely used in indoor LED illumination light fixture at present.The COB encapsulation technology of general LED chip is: on aluminium base, establish encapsulation groove, LED chip is encapsulated in encapsulation groove by packaging plastic.Because LED is unidirectional point light source, its light sending is not easy to surrounding diffusion, and illumination angle is less than normal, and it in range of exposures, seems undesirable as illuminating device.In addition, the light that the point-source of light of LED sends is very dazzling, and when it is luminous, granular sensation is very strong.
Utility model content
Technical problem to be solved in the utility model is: the high power white light device that a kind of LED chip integration packaging is provided, it is for solving the illumination angle problem less than normal of the LED lighting source of existing COB encapsulation, and improve LED light fixture granular sensation and dazzling sense simultaneously, make people feel more comfortable.
In order to solve above-mentioned technical problem, the utility model proposes a kind of high power white light device of LED chip integration packaging, comprise aluminium base, on aluminium base, be provided with encapsulation groove, in encapsulation groove, be packaged with LED chip; And described encapsulation groove comprises bottom, in the both sides of bottom, be equipped with step, on step, encapsulation is fixed with LED chip;
On bottom, be provided with light guide plate, the bottom surface of light guide plate is provided with the arcuate surface as light guide plate reflecting surface; The upper surface of light guide plate maintains an equal level with the notch of encapsulation groove; The dual-side of light guide plate contacts with the cell wall that encapsulates on groove, be positioned at below step;
On the encapsulation bottom of groove and cell wall, be provided with reflector;
There is layer of fluorescent powder glue on surface at encapsulation groove, and phosphor gel covers the top of LED chip and light guide plate.
Preferably: described LED chip is blue chip, the fluorescent material in described phosphor gel is gold-tinted fluorescent material.
Preferably: described light guide plate is glass light guide plate.
Preferably: described arcuate surface is circular arch, ellipse or triangle arch.
The beneficial effects of the utility model: compared to existing technology, the utility model is provided with a light guide plate in the middle of two row's LED chips, by light guide plate, spread the light that LED chip sends, and this light guide plate is arranged in the encapsulation groove of chip, and LED chip is arranged on the step of encapsulation groove, the light that this structure can well be sent LED chip is diffused into the light-emitting area of whole light guide plate, thereby realize light source and become area source by point-source of light, it makes the unidirection luminous range of exposures expanded of LED chip, more meets the result of use requirement of lighting.In addition, this practical technique can weaken in the situation of a large amount of use LED particles, the serious dazzling effect of light fixture granular sensation.Owing to the utlity model has larger illumination angle, and dazzling effect is more weak, therefore in illumination module, can not use lampshade or use Transparent lamp shade.The utility model is specially adapted to the application of little chip on room lighting field, realizes the demand of indoor high-power illumination by the little chip of a large amount of LED.
Accompanying drawing explanation
Fig. 1 is cross-sectional view of the present utility model.
Fig. 2 is the structural representation of the depression angle of the uncured phosphor gel of the utility model.
Fig. 3 is the structure chart of the second light guide plate of the present utility model.
Embodiment
The example structure of the high power white light device of the LED chip integration packaging the utility model proposes is referring to Fig. 1 and Fig. 2.On aluminium base 3, be provided with encapsulation groove 5, in encapsulation groove 5, be packaged with LED chip 1.Encapsulation groove 5 comprises bottom 9, and in bottom, 9 both sides are equipped with step 7, and on step, encapsulation is fixed with LED chip, and LED chip encapsulates by packaging plastic 8.
On bottom 9, be provided with light guide plate 6.The bottom surface of light guide plate 6 is provided with the arcuate surface 10 as light guide plate reflecting surface.The upper surface of light guide plate 6 maintains an equal level with the notch of encapsulation groove.The dual-side of light guide plate 6 contacts with the cell wall that encapsulates on groove, be positioned at below step, and LED chip 1 is as the side entering type light source of light guide plate.
On the encapsulation bottom of groove and cell wall, be provided with reflector 4.Reflector can silver or the coating of aluminium.Reflector can increase bright dipping, reduces light loss.
There is layer of fluorescent powder glue 2 on surface at encapsulation groove, and phosphor gel 2 covers the top of LED chip and light guide plate.In one embodiment, LED chip 1 is blue chip, and the fluorescent material in phosphor gel 2 is gold-tinted fluorescent material.Light guide plate 6 is glass light guide plate.In one embodiment, arcuate surface 10 is circular arch, can be also elliptic arch shape.Referring to Fig. 3, arcuate surface can be triangular arch shape 11.
The light that LED chip sends is entered by light guide plate side, through after light guide plate conduction, by the exiting surface of light guide plate, is evenly penetrated, and makes LED chip send light and becomes area source.Due to the scale of construction of light guide plate, it makes whole light fixture present area source feature, has weakened LED point-source of light effect, and its illumination angle is compared LED chip and is significantly improved.In encapsulation groove, establish new breakthrough and the application that light conducting plate structure is COB encapsulation technology.
There is layer of fluorescent powder glue 2 on surface at encapsulation groove, and phosphor gel covers the top of LED chip and light guide plate.In a preferred embodiment, LED chip 1 is blue chip, and the fluorescent material in phosphor gel is gold-tinted fluorescent material.In one embodiment, light guide plate is preferably quartz glass light guide plate, can be also optical grade acryl material.The useful life of quartz glass can be more longer.
In use, the light that LED chip sends can be injected light guide plate to the utility model, and a large amount of light, through the arcuate surface reflection of light guide plate, is penetrated by light guide plate exiting surface.Due to the scale of construction of the light guide plate scale of construction much larger than LED chip, it is flat luminous that it forms whole light source, the luminous obvious reduction of point-like and hiding, and it is luminous with respect to the unidirectional point-like of LED, and its lighting angle obviously increases, and light is also softer.
Claims (4)
1. a high power white light device for LED chip integration packaging, comprises aluminium base, is provided with encapsulation groove on aluminium base, in encapsulation groove, is packaged with LED chip, it is characterized in that:
Described encapsulation groove comprises bottom, in the both sides of bottom, is equipped with step, and on step, encapsulation is fixed with LED chip;
On bottom, be provided with light guide plate, the bottom surface of light guide plate is provided with the arcuate surface as light guide plate reflecting surface; The upper surface of light guide plate maintains an equal level with the notch of encapsulation groove; The dual-side of light guide plate contacts with the cell wall that encapsulates on groove, be positioned at below step;
On the encapsulation bottom of groove and cell wall, be provided with reflector;
There is layer of fluorescent powder glue on surface at encapsulation groove, and phosphor gel covers the top of LED chip and light guide plate.
2. the high power white light device of LED chip integration packaging according to claim 1, is characterized in that: described LED chip is blue chip, and the fluorescent material in described phosphor gel is gold-tinted fluorescent material.
3. the high power white light device of LED chip integration packaging according to claim 1, is characterized in that: described light guide plate is glass light guide plate.
4. the high power white light device of LED chip integration packaging according to claim 1, is characterized in that: described arcuate surface is circular arch, ellipse or triangle arch.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320626929.6U CN203491259U (en) | 2013-10-09 | 2013-10-09 | Large-power white light device for integrated packaging of LED chips |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320626929.6U CN203491259U (en) | 2013-10-09 | 2013-10-09 | Large-power white light device for integrated packaging of LED chips |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203491259U true CN203491259U (en) | 2014-03-19 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320626929.6U Expired - Fee Related CN203491259U (en) | 2013-10-09 | 2013-10-09 | Large-power white light device for integrated packaging of LED chips |
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| CN (1) | CN203491259U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112563383A (en) * | 2019-09-25 | 2021-03-26 | 佛山市国星光电股份有限公司 | LED packaging method, LED device and COB light source |
-
2013
- 2013-10-09 CN CN201320626929.6U patent/CN203491259U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112563383A (en) * | 2019-09-25 | 2021-03-26 | 佛山市国星光电股份有限公司 | LED packaging method, LED device and COB light source |
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Legal Events
| Date | Code | Title | Description |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee | ||
| CP03 | Change of name, title or address |
Address after: 518000 Guangdong, Baoan District, Songgang street Luotian community Xiangshan Avenue 334-1 building A, building A, building 202, building 3, building Patentee after: SHENZHEN KERUN OPTOELECTRONICS Inc. Address before: 518000 Guangdong city of Shenzhen province Baoan District Xixiang Aviation Road Science and Technology Park Building 6 floor measurements Sokkia Patentee before: Shenzhen Kerun Optoelectronics Co.,Ltd. |
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| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140319 Termination date: 20211009 |