WO2015098976A1 - 電子機器および電子機器用の透光性カバー基板 - Google Patents
電子機器および電子機器用の透光性カバー基板 Download PDFInfo
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- WO2015098976A1 WO2015098976A1 PCT/JP2014/084176 JP2014084176W WO2015098976A1 WO 2015098976 A1 WO2015098976 A1 WO 2015098976A1 JP 2014084176 W JP2014084176 W JP 2014084176W WO 2015098976 A1 WO2015098976 A1 WO 2015098976A1
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- WIPO (PCT)
- Prior art keywords
- cover substrate
- main surface
- translucent cover
- electronic device
- single crystal
- Prior art date
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V15/00—Protecting lighting devices from damage
- F21V15/01—Housings, e.g. material or assembling of housing parts
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/1613—Constructional details or arrangements for portable computers
- G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
- G06F1/1684—Constructional details or arrangements related to integrated I/O peripherals not covered by groups G06F1/1635 - G06F1/1675
- G06F1/1688—Constructional details or arrangements related to integrated I/O peripherals not covered by groups G06F1/1635 - G06F1/1675 the I/O peripheral being integrated loudspeakers
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V33/00—Structural combinations of lighting devices with other articles, not otherwise provided for
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/1613—Constructional details or arrangements for portable computers
- G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
- G06F1/1637—Details related to the display arrangement, including those related to the mounting of the display in the housing
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/1613—Constructional details or arrangements for portable computers
- G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
- G06F1/1656—Details related to functional adaptations of the enclosure, e.g. to provide protection against EMI, shock, water, or to host detachable peripherals like a mouse or removable expansions units like PCMCIA cards, or to provide access to internal components for maintenance or to removable storage supports like CDs or DVDs, or to mechanically mount accessories
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
- G06F1/203—Cooling means for portable computers, e.g. for laptops
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
- H04M1/0266—Details of the structure or mounting of specific components for a display module assembly
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/1613—Constructional details or arrangements for portable computers
- G06F1/1626—Constructional details or arrangements for portable computers with a single-body enclosure integrating a flat display, e.g. Personal Digital Assistants [PDAs]
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/22—Illumination; Arrangements for improving the visibility of characters on dials
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R2499/00—Aspects covered by H04R or H04S not otherwise provided for in their subgroups
- H04R2499/10—General applications
- H04R2499/11—Transducers incorporated or for use in hand-held devices, e.g. mobile phones, PDA's, camera's
Definitions
- Patent Document 1 discloses a technique related to such a so-called smartphone.
- a translucent cover substrate that protects the image display surface of an image display device such as a built-in liquid crystal panel or organic EL panel is disposed and used as a part of the exterior of the electronic device.
- a so-called tempered glass made of, for example, aminosilicate glass is mainly used for the translucent cover substrate for protecting the image display surface of the image display device.
- the translucent cover substrate is required to have characteristics such as being hard to crack when an impact is applied from the outside, and being easy to release heat generated from an internal electronic circuit or the like provided in an electronic device with high heat dissipation. ing. However, a translucent cover substrate that satisfies these multiple types of characteristics at a high level simultaneously has not been obtained.
- An electronic device comprising: an image display device having an image display surface; and a translucent cover substrate having one main surface facing the image display surface and the other main surface located on the opposite side of the one main surface,
- the translucent cover substrate includes a single crystal body mainly composed of alumina (Al 2 O 3 ), the single crystal body includes the other main surface, and at least part of the other main surface is step- Provided is an electronic device characterized by having a terrace structure.
- the translucent cover substrate for electronic equipment includes a single crystal mainly composed of alumina (Al 2 O 3 ), and a step-terrace structure is formed on at least a part of the main surface of the single crystal.
- a translucent cover substrate for an electronic device characterized by comprising the above.
- (A) It is a perspective view which shows the external appearance of an electronic device
- (b) is a perspective view of the translucent cover board
- (A) is a conceptual diagram explaining the inclination direction of the other main surface which consists of a single crystal body which comprises a translucent cover board
- (b) is a schematic perspective view which expands and shows a part of other main surface.
- FIG. 4C is a schematic cross-sectional view showing an enlarged part of the translucent cover substrate. It is a block diagram which shows the electric constitution of an electronic device.
- FIG. 1A is a schematic perspective view illustrating an electronic device 100 that is an embodiment of the electronic device
- FIG. 1B is a diagram illustrating a translucent cover substrate included in the electronic device illustrated in FIG. It is a schematic perspective view of the translucent cover substrate 1 which is one Embodiment.
- FIG. 2 is a front view of the electronic device 100
- FIG. 3 is a back view of the electronic device 100.
- the electronic device 100 according to the present embodiment is a so-called smartphone terminal, for example.
- FIG. 4 is a schematic cross-sectional view of the electronic device 100.
- the electronic device 100 includes a translucent cover substrate 1, a case portion 2, and an image display device 52 having an image display surface 52a.
- the translucent cover substrate 1 is a substantially rectangular substrate in plan view.
- the translucent cover substrate 1 and the case portion 2 are combined to form a device case 3.
- the translucent cover substrate 1 has one main surface 1A facing the image display surface 52a and the other main surface 1B opposite to the one main surface 1A.
- the translucent cover substrate 1 is provided with a display portion 1a on which various information such as characters, symbols and figures are displayed.
- the display portion 1a has, for example, a rectangular shape in plan view.
- the peripheral portion 1b surrounding the display portion 1a in the translucent cover substrate 1 is black, for example, by applying a film as a light shielding film or the like, and is a non-display portion where no information is displayed.
- a touch panel 53 which will be described later, is attached to the inner main surface of the translucent cover substrate 1, and the user operates the display portion 1a of the other main surface 1B of the translucent cover substrate 1 with a finger or the like.
- Various instructions can be given to the electronic device 100.
- the entire transparent cover substrate 1 is described as being made of a single crystal mainly composed of alumina (Al 2 O 3 ).
- the single crystal and another transparent substrate are bonded together.
- FIG. 5 is a diagram for explaining the other main surface 1B made of a single crystal, (a) is a conceptual diagram for explaining the inclination direction of the other main surface 1B, and (b) is a part of the other main surface 1B.
- FIG. 2B is a schematic perspective view showing an enlarged view
- FIG. 4B is a schematic sectional view showing a part of the other main surface 1B in an enlarged manner.
- FIG. 5C is a cross section of the translucent cover substrate 1 taken along a plane perpendicular to the c-axis (a plane parallel to the c-plane) of sapphire.
- the translucent cover substrate 1 shown in FIG. 5 has a rectangular short side parallel to the c-axis of sapphire.
- the translucent cover substrate 1 is made of a single crystal mainly composed of alumina (Al 2 O 3 ), and this single crystal has the other main surface 1B, and is formed on at least a part of the other main surface 1B. It has a step-terrace structure 60.
- a single crystal containing alumina (Al 2 O 3 ) as a main component is generally called sapphire, and is less likely to be scratched and harder to crack than tempered glass.
- a single crystal body mainly composed of alumina (Al 2 O 3 ) is also simply referred to as sapphire.
- main component when it is contained as a “main component”, it specifically means that it is contained at least 50% by mass, preferably 70% by mass.
- the single crystal body of the translucent cover substrate 1 has an Al 2 O 3 purity (content) of 99% by mass or more from the viewpoint that scratches are less likely to be caused and cracks and chips are more reliably suppressed.
- the one main surface 1A also has a step-terrace structure (not shown) similar to the step-terrace structure 60 of the other main surface 1B.
- the electronic device 100 is a portable electronic device called a so-called smartphone terminal.
- a portable electronic device breakage of the cover substrate due to an impact at the time of dropping is often a problem.
- the translucent cover substrate 1 made of a single crystal mainly composed of alumina (Al 2 O 3 ) is less likely to be scratched and difficult to crack compared to tempered glass or the like.
- the electronic device 100 provided is unlikely to be damaged or broken due to dropping.
- the step-terrace structure 60 only needs to have a step, and includes, for example, a horizontal terrace portion 62 and a step portion 63 substantially perpendicular to the terrace portion 62. At the boundary between the terrace portion 62 and the step portion 63, an upper ridge (convex angle) 61a and a lower ridge (concave angle) 61b are formed.
- Such a step-terrace structure portion 60 is desirably formed continuously over the other main surface 1B, but may be partially formed.
- the step height H of the step-terrace structure 60 is about 5 ⁇ 10 ⁇ 10 (m)
- the terrace width W of the step-terrace structure 60 is about 2 ⁇ 10 ⁇ 7 (m).
- the other main surface 1B of the present embodiment is a surface inclined from a plane [ie (11-20) plane of the sapphire] in sapphire, tilt angle theta a becomes approximately 0.5 °. More specifically, in the other main surface 1B, a virtual line V perpendicular to the other main surface 1B is inclined with respect to the m-axis of sapphire.
- the other main surface 1B which serves as a reference for the inclination angle ⁇ a, corresponds to a virtual plane including a plurality of lower ridges 61b. Tilt angle theta a, as shown in FIG.
- the other principal surface 1B is a surface inclined from the a-plane in the single crystal body mainly composed of alumina (Al 2 O 3 ), and the imaginary line V is inclined with respect to the m-axis. Since the step-terrace structure having a stable height and width is formed, the heat radiation effect and the fingerprint stain-preventing effect described later are high.
- the step -The height and width of the terrace structure are more stable.
- the other main surface 1B is a surface inclined from the a-plane in the single crystal body mainly composed of alumina (Al 2 O 3 ), and the virtual line V is inclined with respect to the c-axis, that is, the virtual line Even when the angle between the V axis and the c axis is not vertical (that is, in the direction in which the virtual line V and the c axis approach each other), the step-terrace structure having a stable height and width is obtained. Since it is formed, the heat dissipation effect and the adhesion suppression effect of fingerprint dirt are high.
- the step-terrace structure 60 is caused by the fact that the other main surface 1B of the translucent cover substrate 1 is deviated from the sapphire crystal plane (a-plane in the present embodiment) in the translucent cover substrate 1.
- This structure is formed by aligning the atoms in the vicinity of the other main surface 1B of the translucent cover substrate 1 in a step shape according to the actual crystal structure.
- sapphire is polished by mechanical polishing or chemical mechanical polishing (so-called CMP) to form a precursor of the translucent cover substrate 1, and then this precursor is heat-treated at a temperature of about 500 ° C. to 1500 ° C.
- CMP chemical mechanical polishing
- the light-transmitting cover substrate 1 having the step-terrace structure 60 can be formed by rearranging the atoms on the surface of the precursor according to the crystal structure.
- a method for manufacturing the translucent cover substrate 1 will be described in detail later.
- the size and direction of the tilt angle of the other main surface 1B with respect to sapphire can be measured using a crystal orientation measuring device using an X-ray diffraction method.
- the translucent cover substrate 1 is set so that the other main surface 1B is at a predetermined angle at a predetermined position, and then the translucent cover substrate 1 is irradiated with X-rays to transmit the translucent light.
- an automatic X-ray crystal orientation measuring device (model 2991F2) manufactured by Rigaku Corporation may be used.
- the details of the structure of the step-terrace structure 60 such as the step height H and the width of the terrace width W of the step-terrace structure 60, the inclination direction and inclination angle of the other main surface 1B with respect to the crystal structure, the conditions of heat treatment, etc. It changes according to. That is, the step-terrace structure 60 such as the step height H and the terrace width W of the Tepu-terrace structure 60 is changed by changing the inclination direction and the inclination angle of the other main surface 1B with respect to the crystal structure, the heat treatment conditions, and the like. The details of the structure can be adjusted.
- FIG. 6 is a block diagram showing an electrical configuration of the electronic device 100.
- the electronic device 100 includes a control unit 50, a wireless communication unit 51, an image display device 52, a touch panel 53, a piezoelectric vibration element 55, an external speaker 56, a microphone 57, an imaging unit 58, and a battery 59. These components are housed in the device case 3.
- the control unit 50 includes a CPU 50a (also illustrated in FIG. 4), a storage unit 50b, and the like, and comprehensively manages the operation of the electronic device 100 by controlling other components of the electronic device 100.
- the storage unit 50b includes a ROM, a RAM, and the like.
- Various functional blocks are formed in the control unit 50 when the CPU 50a executes various programs in the storage unit 50b.
- the control unit 50 receives various and large amounts of information from each component, and processes (information processing) these information in a relatively short time. During this information processing, the CPU 50a generates a relatively large amount of heat. When the heat generated by the CPU 50a stays in the device case 3, the temperature in the device case 3 rises, and the operation of the CPU 50a may be slowed or malfunctioned. Component malfunction may also occur.
- the single crystal body of the translucent cover substrate 1 has a thermal conductivity of about 42 W / (m ⁇ K).
- the thermal conductivity is higher than that of quartz glass having a thermal conductivity of about 1 W / (m ⁇ K).
- the rate is large.
- the heat generated from the CPU 50 a can be efficiently released to the outside of the device case 3 through the translucent cover substrate 1.
- the translucent cover substrate 1 further has the step-terrace structure 60 as described above, the surface area of the other main surface 1B is larger than that in the case where the other main surface 1B has a simple planar shape, for example.
- the translucent cover substrate 1 since the surface area of the other main surface 1B, which is a heat release surface, is large, the translucent cover substrate 1 has a larger surface area than the case where the other main surface 1B has a simple planar shape. The amount of heat released per unit time is even greater.
- the heat generated by the CPU 50 a is quickly released to the outside of the device case 3, so that the temperature rise in the device case 3 is suppressed, and the CPU 50 a and other components are Malfunctions are also suppressed. Further, the single crystal body of the translucent cover substrate 1 is very hard and hardly scratches and is not easily cracked.
- the translucent cover substrate 1 has the step-terrace structure 60
- fingerprint stains due to sebum on the user's finger are removed. Adhesion is also suppressed. More specifically, since the translucent cover substrate 1 has fine irregularities like the step-terrace structure 60, dirt of the user's sebum is easily dispersed along the irregularities, for example, the lower ridge 61b. For this reason, even when the user operates the other main surface 1B of the translucent cover substrate 1 with a finger or the like, the sebum attached according to the fingerprint is quickly dispersed on the other main surface 1B. As described above, the translucent cover substrate 1 can suppress so-called fingerprint stains that are noticeable to the extent that sebum remains partially.
- the terrace width is preferably about 10 to 1000 times the step height of the step-terrace structure in order to realize relatively high heat dissipation and more reliably prevent fingerprint contamination.
- the step height of the step-terrace structure is preferably 1 ⁇ 10 ⁇ 10 (m) to 5 ⁇ 10 ⁇ 8 (m). It is also preferable that the terrace width of the step-terrace structure is 1 ⁇ 10 ⁇ 9 (m) to 1 ⁇ 10 ⁇ 6 (m).
- the translucent cover substrate 1 is obtained by grinding and polishing the surface of sapphire, and a substrate member (translucent member) having a main surface inclined by about 0.5 ° from the a-plane of sapphire [that is, the (11-20) plane of sapphire].
- the precursor can be formed by heat treatment as described above, for example.
- a copper plate is used as a polishing pad, and after mechanical polishing using diamond abrasive grains having a particle diameter of about 1 to 3 ⁇ m as polishing abrasive grains, for example, polishing abrasive grains
- polishing abrasive grains For example, chemical mechanical polishing (so-called CMP) using colloidal silica abrasive grains having a particle diameter of about 20 to 80 ⁇ m may be performed.
- CMP chemical mechanical polishing
- the substrate member transparent member
- the substrate member transparent member
- a virtual line V perpendicular to the principal surface is inclined with respect to the m-axis in sapphire.
- the precursor of the optical cover substrate 1 may be formed.
- the substrate member formed through such polishing may be heat treated at 1000 ° C. for 3 hours using a heat treatment apparatus.
- rearrangement according to the crystal structure of atoms on the surface of the substrate member (precursor of the transparent cover substrate 1) proceeds to form the transparent cover substrate 1A having the step-terrace structure 60. can do.
- Step-terrace structure with a step height of 1 ⁇ 10 ⁇ 10 (m) to 1 ⁇ 10 ⁇ 8 (m) and a terrace width of 1 ⁇ 10 ⁇ 9 (m) to 1 ⁇ 10 ⁇ 7 (m)
- the inclination angle ⁇ A from the a-plane is preferably less than 1.5 °.
- the other main surface 1B of the first embodiment is a surface inclined from the a-plane of sapphire [that is, the (11-20) plane of sapphire], and the virtual line V perpendicular to the other main surface 1B is relative to the m-axis of sapphire.
- the inclination direction of the main surface of sapphire is not particularly limited.
- the other main surface 1B is a surface inclined from the a-plane in sapphire, and a virtual line V perpendicular to the other main surface 1B may be inclined with respect to the c-axis in sapphire, and the inclination direction is not particularly limited. .
- the other main surface 1B is a surface inclined by 0.5 ° from the a-plane of sapphire [that is, the (11-20) plane of sapphire], but the other main surface 1B is c-plane in sapphire. It may be a surface inclined from the surface [that is, the (0001) surface of sapphire], and the size of the inclination angle is not particularly limited. However, step by heat treatment - in that it can form a stable terrace structure, it is preferable that the inclination angle theta c from c plane is less than 1.5 °.
- the inclination direction is not particularly limited.
- the imaginary line V perpendicular to the other main surface 1B may be inclined with respect to the a-axis of sapphire or may be inclined with respect to the m-axis, and is not particularly limited.
- the other main surface 1B may be a surface inclined from the r-plane of sapphire [that is, the (01-12) plane of sapphire], and the magnitude of the inclination angle and the direction of inclination are not particularly limited.
- FIG. 7 (a-1) shows that the other main surface 1B is 0.3 ° from the a-plane of sapphire and the virtual line V perpendicular to the other main surface 1B is in the direction toward the c-axis with respect to the c-axis of sapphire.
- FIG. 7 (a-2) shows a cross-sectional shape along the line AA shown in FIG. 7 (a-1).
- FIG. 7 (a-2) shows a cross-sectional shape along the line AA shown in FIG. 7 (a-1).
- FIG. 7B-1 shows the surface of the substrate in which the other principal surface 1B is inclined by 0.3 ° from the c-plane of sapphire and the virtual line V perpendicular to the other principal surface 1B is inclined with respect to the a-axis in sapphire.
- FIG. 7B-2 shows image data of a surface profile measured with an atomic force microscope, and FIG. 7B-2 shows a cross-sectional shape along the line BB shown in FIG. 7B-1.
- FIG. 7 (c-1) shows the surface of the substrate in which the other main surface 1B is 0.4 ° from the r-plane of sapphire and the virtual line V perpendicular to the other main surface 1B is inclined with respect to the c-axis in sapphire.
- FIG. 7 (c-1) shows the surface of the substrate in which the other main surface 1B is 0.4 ° from the r-plane of sapphire and the virtual line V perpendicular to the other main surface 1B is inclined with respect to the c-
- FIG. 7C-2 shows the image data of the surface profile measured by the atomic force microscope
- FIG. 7C-2 shows the cross-sectional shape along the line CC shown in FIG. 7C-1.
- the terrace width W and the step height H are partially different.
- the terrace width W is about 5 ⁇ 10 ⁇ 8 to 5 ⁇ 10 ⁇ 7 (m).
- the step height H is about 3 ⁇ 10 ⁇ 10 to 3 ⁇ 10 ⁇ 9 .
- the scale interval between the horizontal axis and the vertical axis is different, and the appearance unevenness on the graph is expressed exaggerated extremely (about 1000 times) in the vertical axis direction.
- the case part 2 constitutes a peripheral part, a side part and a back part of the front part of the electronic device 100.
- the case portion 2 is formed of polycarbonate resin, but is not particularly limited as long as it is a member that covers an electronic device.
- the same material as the translucent cover substrate 1 may be used.
- the electronic device 100 includes the image display device 52 as described above.
- the image display device 52 is controlled by the control unit 50 to be described later, and displays image information representing characters, symbols, figures, and the like on the image display surface 52a.
- the image display device 52 is a so-called liquid crystal display panel, and includes a backlight unit (not shown) and a liquid crystal layer (not shown).
- a backlight unit (not shown)
- a liquid crystal layer (not shown).
- the LED lamp of the backlight unit an LED lamp that emits white light in which a phosphor is combined with a blue LED element is mainly used.
- the image information displayed on the image display surface 52a of the image display device 52 is partially colored by white light emitted from the LED lamp of the backlight unit passing through the liquid crystal layer included in the image display device 52. It is formed with. That is, when white light emitted from an LED lamp passes through the liquid crystal layer, the wavelength range of the transmitted light is limited for each part, so that the color of the transmitted light is changed.
- Image information representing characters, symbols, figures, and the like having the symbol is formed on the image display surface 52a.
- the light representing the image information formed on the image display surface 52a is incident from the one main surface 1A of the translucent cover substrate 1 and is emitted from the other main surface 1B to be an operator (user) of the electronic device 100.
- the operator recognizes characters, symbols, graphics, and the like represented by the image information.
- a speaker hole 20 and a microphone hole 21 are formed on the back surface 101 of the electronic device 100, in other words, on the back surface of the device case 3.
- An imaging lens 58 a included in an imaging unit 58 described later is exposed from the back surface 101 of the electronic device 100.
- the wireless communication unit 51 receives a signal from a communication device such as a smart phone terminal different from the electronic device 100 or a web server connected to the Internet via the base station by the antenna 51 a.
- the wireless communication unit 51 performs amplification processing and down-conversion on the received signal and outputs the result to the control unit 50.
- the control unit 50 performs demodulation processing or the like on the input reception signal, and acquires a sound signal indicating voice or music included in the reception signal.
- the wireless communication unit 51 performs up-conversion and amplification processing on the transmission signal including the sound signal generated by the control unit 50, and wirelessly transmits the processed transmission signal from the antenna 51a.
- the transmission signal from the antenna 51a is received through a base station by a communication device connected to a smart phone terminal, a mobile phone, or the Internet different from the electronic device 100.
- the image display device 52 is, for example, a liquid crystal image display device, and displays various information such as characters, symbols, and graphics on the image display surface 52a by being controlled by the control unit 50.
- the information displayed on the image display device 52 is displayed on the display portion 1 a of the translucent cover substrate 1, so that the information can be visually recognized by the user of the electronic device 100.
- the touch panel 53 is, for example, a projected electrostatic capacitance type touch panel, and detects a user operation on the display portion 1 a of the translucent cover substrate 1.
- the touch panel 53 is affixed to the inner main surface of the translucent cover substrate 1 and includes two sheet-like electrode sensors arranged to face each other. The two electrode sensors are bonded together with a transparent adhesive sheet.
- One electrode sensor is formed with a plurality of elongated X electrodes that extend along the X-axis direction (for example, the short side direction of the translucent cover substrate 1) and are arranged in parallel to each other.
- the other electrode sensor is formed with a plurality of elongated Y electrodes that extend along the Y-axis direction (for example, the long side direction of the translucent cover substrate 1) and are arranged in parallel to each other.
- the capacitance change between the X electrode and the Y electrode that occurs in the touch panel 53 is transmitted to the control unit 50, and the control unit 50 applies to the display portion 1 a of the translucent cover substrate 1 based on the capacitance change.
- the content of the operation that has been performed is specified, and the corresponding operation is performed.
- the translucent cover substrate 1 shown in FIG. 5 has a rectangular short side direction parallel to the c-axis of sapphire.
- the upper ridge 61a and the lower ridge 61b Step-terrace structure 60 is formed so as to extend along this short piece direction.
- the short-side direction of the translucent cover substrate 1 and the long-side direction orthogonal to the short-side direction are the pixels in the image display device 52 composed of the above-described liquid crystal display panel, for example, and the arrangement direction of each electrode of the touch panel 53. It is a standard.
- the step-terrace structure 60 affects the partial diffraction of light in the transparent cover substrate 1 and the partial capacitance of the transparent cover substrate 1 and thus the detection sensitivity of the touch panel.
- step-terrace structure 60 is formed so that the upper ridge 61a and the lower ridge 61b extend along the short-side direction or the long-side direction, matching with the display conditions of the image display device 52 and the detection conditions of the touch panel 53 is possible.
- the detection sensitivity of the touch panel 53 is improved or the image displayed by the image display device 52 is compared with the case where the other main surface 1B of the translucent cover substrate 1 is a simple flat surface. It is also relatively easy to improve the visibility.
- the piezoelectric vibration element 55 is for transmitting the received sound to the user of the electronic device 100.
- the piezoelectric vibration element 55 is vibrated by a drive voltage supplied from the control unit 50.
- the control unit 50 generates a drive voltage based on the sound signal indicating the received sound, and applies the drive voltage to the piezoelectric vibration element 55.
- the piezoelectric vibration element 55 is vibrated by the control unit 50 based on the sound signal indicating the reception sound, whereby the reception sound is transmitted to the user of the electronic device 100.
- the control unit 50 functions as a drive unit that vibrates the piezoelectric vibration element 55 based on the sound signal.
- the piezoelectric vibration element 55 will be described in detail later.
- the external speaker 56 converts the electrical sound signal from the control unit 50 into sound and outputs the sound. Sound output from the external speaker 56 is output to the outside from the speaker hole 20 provided on the back surface 101 of the electronic device 100.
- the microphone 57 converts the sound input from the outside of the electronic device 100 into an electrical sound signal and outputs it to the control unit 50. Sound from the outside of the electronic device 100 is taken into the electronic device 100 through the microphone hole 21 provided on the back surface 101 of the electronic device 100 and input to the microphone 57.
- the imaging unit 58 includes an imaging lens 58a and an imaging element, and captures a still image and a moving image based on control by the control unit 50.
- the battery 59 outputs a power source for the electronic device 100.
- the power output from the battery 59 is supplied to each electronic component included in the control unit 50, the wireless communication unit 51, and the like included in the electronic device 100.
- ⁇ Details of piezoelectric vibration element> 8 and 9 are a top view and a side view showing the structure of the piezoelectric vibration element 55, respectively.
- the piezoelectric vibration element 55 has a long shape in one direction. By making the shape long in one direction, the degree of deformation described later can be made relatively large.
- the piezoelectric vibration element 55 has a rectangular elongated plate shape in plan view.
- the piezoelectric vibration element 55 has, for example, a bimorph structure, and includes a first piezoelectric ceramic plate 55a and a second piezoelectric ceramic plate 55b that are bonded to each other via a shim material 55c.
- the piezoelectric vibration element 55 when a positive voltage is applied to the first piezoelectric ceramic plate 55a and a negative voltage is applied to the second piezoelectric ceramic plate 55b, the first piezoelectric ceramic plate 55a extends along the longitudinal direction.
- the second piezoelectric ceramic plate 55b extends and contracts along the longitudinal direction. As a result, as shown in FIG. 10, the piezoelectric vibration element 55 bends in a mountain shape with the first piezoelectric ceramic plate 55a outside.
- the piezoelectric vibration element 55 when a negative voltage is applied to the first piezoelectric ceramic plate 55a and a positive voltage is applied to the second piezoelectric ceramic plate 55b, the first piezoelectric ceramic plate 55a is in the longitudinal direction.
- the second piezoelectric ceramic plate 55b extends along the longitudinal direction. Accordingly, as shown in FIG. 11, the piezoelectric vibration element 55 bends in a valley shape with the second piezoelectric ceramic plate 55b facing outside.
- the piezoelectric vibration element 55 performs flexural vibration by alternately taking the state of FIG. 10 and the state of FIG.
- the controller 50 flexes and vibrates the piezoelectric vibration element 55 by applying an alternating voltage in which a positive voltage and a negative voltage appear alternately between the first piezoelectric ceramic plate 55a and the second piezoelectric ceramic plate 55b.
- the piezoelectric vibration element 55 shown in FIGS. 9 to 11 is provided with only one structure composed of the first piezoelectric ceramic plate 55a and the second piezoelectric ceramic plate 55b bonded with the shim material 55c interposed therebetween. However, a plurality of such structures may be stacked.
- FIG. 12 is a plan view when the translucent cover substrate 1 is viewed from the one main surface 1A side.
- the piezoelectric vibration element 55 is attached to the one main surface 1A of the translucent cover substrate 1 with an adhesive such as a double-sided tape.
- the piezoelectric vibration element 55 is located on one main surface 1A of the translucent cover substrate 1 so as not to overlap the image display device 52 and the touch panel 53 in a plan view when the translucent cover substrate 1 is viewed from the one main surface 1A side. Is arranged.
- the piezoelectric vibration element 55 vibrates the translucent cover substrate 1 so that air conduction sound and conduction sound are transmitted from the translucent cover substrate 1 to the user.
- air conduction sound and conduction sound are transmitted from the translucent cover substrate 1 to the user by transmitting the vibration of the piezoelectric vibration element 55 itself to the translucent cover substrate 1.
- the airway sound is a sound that is recognized by the human brain when sound waves (air vibrations) entering the ear canal hole (so-called “ear hole”) vibrate the eardrum.
- the conduction sound is sound that is recognized by the human brain when the auricle is vibrated and the vibration of the auricle is transmitted to the eardrum and the eardrum vibrates.
- the air conduction sound and the conduction sound will be described in detail.
- FIG. 13 is a diagram for explaining air conduction sound and conduction sound.
- FIG. 13 shows the structure of the ear of the user of electronic device 100.
- a wavy line 400 indicates a conduction path of a sound signal (sound information) when an airway sound is recognized by the brain
- a solid line 410 indicates a conduction path of the sound signal when a conduction sound is recognized by the brain. Is shown.
- the translucent cover substrate 1 vibrates, and the translucent cover substrate Sound waves are output from 1.
- the user holds the electronic device 100 in his hand and brings the translucent cover substrate 1 of the electronic device 100 close to the user's auricle 200, or the translucent cover substrate 1 of the electronic device 100 is When hitting the user's pinna 200, sound waves output from the translucent cover substrate 1 enter the ear canal hole 210. Sound waves from the translucent cover substrate 1 travel through the ear canal hole 210 and vibrate the eardrum 220. The vibration of the eardrum 220 is transmitted to the ossicle 230, and the ossicle 230 vibrates.
- the vibration of the ossicle 230 is transmitted to the cochlea 240 and converted into an electric signal in the cochlea 240.
- This electrical signal is transmitted to the brain through the auditory nerve 250, and the received sound is recognized in the brain. In this way, air conduction sound is transmitted from the translucent cover substrate 1 to the user.
- FIG. 13 also shows an auricular cartilage 200a inside the auricle 200.
- Bone conduction sound is sound that is recognized by the human brain by vibrating the skull and directly stimulating the inner ear such as the cochlea.
- a sound signal transmission path when a bone conduction sound is recognized by the brain is indicated by a plurality of arcs 420.
- the piezoelectric vibrating element 55 appropriately vibrates the translucent cover substrate 1 on the front surface, so that the user of the electronic device 100 can transmit the translucent cover substrate 1. Air conduction sound and conduction sound can be communicated to it.
- the structure is devised so that air conduction sound and conduction sound can be appropriately transmitted to the user.
- Various merits are generated by configuring the electronic device 100 so that air conduction sound and conduction sound can be transmitted to the user.
- the user can hear a sound when the translucent cover substrate 1 is applied to the ear, the user can make a call without much worrying about the position of the electronic device 100 where the ear is applied.
- the user can make the surrounding noise difficult to hear while increasing the volume of the conduction sound by pressing the ear strongly against the translucent cover substrate 1. Therefore, the user can make a call appropriately even when the ambient noise is high.
- the user can receive a reception sound from the electronic device 100 by placing the translucent cover substrate 1 on his / her ear (more specifically, the auricle). Can be recognized. Further, the user can recognize the received sound from the electronic device 100 by applying the translucent cover substrate 1 to the headphones even when the headphones are attached to the ears.
- a translucent cover substrate 1 on the front surface is used to extract sound output from a receiver (receiver speaker) provided inside the electronic device to the outside of the electronic device.
- a receiver receiver
- the translucent cover substrate 1 is a single crystal having alumina (Al 2 O 3) as a main component, and is extremely hard compared to tempered glass or the like. Furthermore, the resistance to various chemicals is very high.
- alumina Al 2 O 3
- Al2O3 alumina
- an expensive manufacturing apparatus such as a laser processing apparatus is required, The time required for processing becomes long, and the manufacturing cost may be relatively high.
- the translucent cover substrate 1 of this embodiment does not have a hole for the earpiece, the cost for the hole processing does not occur, and the manufacturing cost of the electronic device 100 is low. Moreover, since the translucent cover substrate 1 does not have a hole for the earpiece, the translucent cover substrate 1 is maintained at a relatively high strength. Further, in the present embodiment, since there is no earpiece hole on the surface of electronic device 100, there is no problem of water or dust entering from the earpiece hole. Therefore, the electronic device 100 does not require a waterproof structure or a dust-proof structure for this problem, and the cost of the electronic device 100 can be further reduced.
- the present invention can also be applied to an electronic device other than a smartphone terminal.
- the present invention can be applied to a tablet terminal, a mobile phone, a game machine, a notebook computer, a portable navigation system, and the like.
- the present invention is not limited to the above-described embodiments, and various improvements and modifications may be made without departing from the scope of the present invention.
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Abstract
Description
図1(a)は、電子機器の一実施形態である電子機器100について説明する概略斜視図であり、図1(b)は図1(a)に示す電子機器が備える透光性カバー基板の一実施形態である透光性カバー基板1の概略斜視図である。また図2は、電子機器100の前面図であり、図3は電子機器100の裏面図である。本実施形態に係る電子機器100は、例えばいわゆるスマートフォン端末である。また図4は電子機器100の概略断面図である。
図8および9は、それぞれ、圧電振動素子55の構造を示す上面図及び側面図である。図8、9に示されるように、圧電振動素子55は一方向に長い形状を成している。一方向に長い形状とすることで、後述する変形の程度を比較的大きくすることができる。具体的には、圧電振動素子55は、平面視で長方形の細長い板状を成している。圧電振動素子55は、例えばバイモルフ構造を有しており、シム材55cを介して互いに貼り合わされた第1圧電セラミック板55a及び第2圧電セラミック板55bを備えている。シム材55cがなく、圧電セラミック板と電極とが交互に積層され、厚み方向の上側の圧電セラミク板と下側のセラミック板とで分極方向を異ならせた積層型圧電振動素子でもよい。
図12は、透光性カバー基板1を一方主面1A側から見た際の平面図である。圧電振動素子55は、両面テープ等の接着剤によって、透光性カバー基板1の一方主面1Aに貼り付けられている。圧電振動素子55は、透光性カバー基板1の一方主面1Aにおいて、この透光性カバー基板1を一方主面1A側から見た平面視で画像表示デバイス52及びタッチパネル53とは重ならない位置に配置されている。
本実施形態では、圧電振動素子55が透光性カバー基板1を振動させることによって、当該透光性カバー基板1から気導音及び伝導音が使用者に伝達されるようになっている。言い換えれば、圧電振動素子55自身の振動が透光性カバー基板1に伝わることにより、当該透光性カバー基板1から気導音及び伝導音が使用者に伝達されるようになっている。
スマトーフォン端末や携帯電話機などの電子機器では、当該電子機器の内部に設けられたレシーバ(受話用スピーカ)から出力される音を当該電子機器の外部に取り出すために、前面の透光性カバー基板1に受話口の穴があけられることがある。
1A 一方主面
1B 他方主面
50 制御部
52 画像表示デバイス
52a 画像表示面
53 タッチパネル
55 圧電振動素子
100 電子機器
Claims (12)
- 画像表示面を有する画像表示デバイスと、
前記画像表示面に対向する一方主面および該一方主面の反対側に位置する他方主面を有する透光性カバー基板とを備える電子機器であって、
前記透光性カバー基板は、アルミナ(Al2O3)を主成分とする単結晶体を含み、当該単結晶体は前記他方主面を有し、前記他方主面の少なくとも一部にステップ-テラス構造を有することを特徴とする電子機器。 - 前記他方主面は、前記単結晶体におけるa面から傾斜した面であり、前記a面からの傾斜角が1.5°未満であることを特徴とする請求項1記載の電子機器。
- 前記他方主面は、前記他方主面に垂直な仮想線が前記単結晶体におけるm軸に近づく方向に傾斜していることを特徴とする請求項2記載の電子機器。
- 前記他方主面は、前記他方主面に垂直な仮想線が前記単結晶体におけるc軸に近づく方向に傾斜していることを特徴とする請求項2記載の電子機器。
- 前記ステップ-テラス構造のステップ高さが1×10-10(m)~5×10-8(m)であることを特徴とする請求項1~4のいずれかに記載の電子機器。
- 前記透光性カバー基板に配置された、圧電振動素子をさらに備えることを特徴とする請求項1~5のいずれかに記載の電子機器。
- 前記圧電振動素子は、音信号に基づいた駆動電圧が印加されて振動することを特徴とする請求項6に記載の電子機器。
- 前記圧電振動素子は、平面視で長方形の細長い板状であることを特徴とする請求項6または7に記載の電子機器。
- 前記圧電振動素子は、画像表示デバイスとは重ならない位置に配置されていることを特徴とする請求項6~8記載の電子機器。
- 電子機器用の透光性カバー基板であって、アルミナ(Al2O3)を主成分とする単結晶体を含み、当該単結晶体の主面の少なくとも一部にステップ-テラス構造を有することを特徴とする電子機器用の透光性カバー基板。
- 前記主面は、前記単結晶体におけるm軸に近づく方向に傾斜していることを特徴とする請求項10記載の電子機器用の透光性カバー基板。
- 前記主面は、前記主面に垂直な仮想線が前記単結晶体におけるc軸に近づく方向に傾斜していることを特徴とする請求項10記載の電子機器用の透光性カバー基板。
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EP14874333.9A EP3089141B1 (en) | 2013-12-24 | 2014-12-24 | Electronic device and light-transmitting cover substrate for electronic device |
CN201480069219.5A CN105830136A (zh) | 2013-12-24 | 2014-12-24 | 电子设备以及电子设备用的透光性盖基板 |
JP2015554962A JP6235613B2 (ja) | 2013-12-24 | 2014-12-24 | 電子機器および電子機器用の透光性カバー基板 |
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Also Published As
Publication number | Publication date |
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JP6235613B2 (ja) | 2017-11-22 |
JP6527207B2 (ja) | 2019-06-05 |
EP3089141A4 (en) | 2017-08-23 |
EP3089141B1 (en) | 2021-06-30 |
JP2018050313A (ja) | 2018-03-29 |
US9151473B2 (en) | 2015-10-06 |
JP2019061280A (ja) | 2019-04-18 |
JPWO2015098976A1 (ja) | 2017-03-23 |
JP6711896B2 (ja) | 2020-06-17 |
EP3089141A1 (en) | 2016-11-02 |
CN105830136A (zh) | 2016-08-03 |
US20150176816A1 (en) | 2015-06-25 |
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