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WO2013168198A1 - Spray nozzle cleaning device, soldering device, and spray nozzle cleaning method - Google Patents

Spray nozzle cleaning device, soldering device, and spray nozzle cleaning method Download PDF

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Publication number
WO2013168198A1
WO2013168198A1 PCT/JP2012/003063 JP2012003063W WO2013168198A1 WO 2013168198 A1 WO2013168198 A1 WO 2013168198A1 JP 2012003063 W JP2012003063 W JP 2012003063W WO 2013168198 A1 WO2013168198 A1 WO 2013168198A1
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WO
WIPO (PCT)
Prior art keywords
jet nozzle
brush
flux
unit
soldering
Prior art date
Application number
PCT/JP2012/003063
Other languages
French (fr)
Japanese (ja)
Inventor
秀樹 時本
Original Assignee
三菱電機株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 三菱電機株式会社 filed Critical 三菱電機株式会社
Priority to PCT/JP2012/003063 priority Critical patent/WO2013168198A1/en
Priority to JP2014513841A priority patent/JP5583304B2/en
Publication of WO2013168198A1 publication Critical patent/WO2013168198A1/en

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/08—Auxiliary devices therefor

Definitions

  • the present invention relates to a jet nozzle cleaning device that cleans a small-diameter jet nozzle for spot soldering, a soldering device including the same, and a jet nozzle cleaning method.
  • soldering apparatus that performs spot soldering on a terminal of an electronic component by jetting molten solder with a small-diameter jet nozzle.
  • soldering apparatus if soldering is performed for a long time without cleaning the jet nozzle, the surface of the jet nozzle is oxidized and oxides and carbides are adhered, and the solder jet is disturbed. When turbulence occurs in the solder jet, it causes soldering unevenness and the soldering quality is deteriorated.
  • This cleaning unit is a unit in which a rotating drum with a wiper made of a brush attached to the outer periphery is provided in a liquid tank in which cleaning liquid is stored, and the rotating drum is rotated with the tip of the nozzle pressed against the wiper. Then, the nozzle is cleaned while the solder is dissolved with the cleaning liquid.
  • Patent Document 1 can be used for cleaning the jet nozzle instead of manual work, it is necessary to completely end the soldering process once and sufficiently lower the temperature around the jet nozzle. Therefore, the deterioration of work efficiency cannot be solved.
  • the present invention has been made to solve the above-described problems, and is a jet nozzle cleaning device capable of performing cleaning of a jet nozzle as a series of operations of a soldering process, a soldering device including the same, and a jet nozzle The purpose is to obtain a cleaning method.
  • the jet nozzle cleaning device includes a jet nozzle that is movably provided, moves the jet nozzle to an object to be soldered that is transported through a transport path, and is soldered by a solder jet formed by the jet nozzle.
  • a jet nozzle cleaning device used for a soldering apparatus for performing a soldering a plate-shaped member that can be transported in a transport path, a brush that is rotatably provided on the plate-shaped member, a drive unit that rotates the brush, and a plate-shaped member
  • a flux storage section that stores the flux, brushes the jet nozzle that has been transported through the transport path and moved to the position of the brush in the soldering apparatus with a brush that is rotated by the drive section, and the flux storage section.
  • the flux in the flux storage section is applied to the jet nozzle that has moved to the position.
  • the jet nozzle can be cleaned as a series of soldering operations.
  • FIG. 10 is a flowchart showing a soldering process of the soldering apparatus according to the second embodiment.
  • 6 is a flowchart showing a cleaning process for a jet nozzle of a soldering apparatus according to a second embodiment.
  • FIG. 1 is a diagram showing an outline of a soldering apparatus according to Embodiment 1 of the present invention, and shows a soldering apparatus that performs spot soldering.
  • a soldering apparatus 1 includes a jet nozzle 2, a solder bath 3, a solder flow supply unit 4, an XYZ stage unit 5, an X-axis drive unit 5a, a Y-axis drive unit 5b, a Z-axis drive unit 5c, and a conveyance path drive.
  • Unit 6 a conveyance path 7, a sensor 8, a control unit 9, and an input / output unit 9a.
  • the jet nozzle 2 is a small-diameter jet nozzle that performs spot soldering on a printed circuit board that is an object to be soldered.
  • a cylindrical portion for collecting molten solder is provided around the jet nozzle 2, and the molten solder flows from the opening of the jet nozzle 2 over the entire outer periphery to the inside of the cylindrical portion.
  • a solder jet having a corresponding outer diameter is formed.
  • the solder bath 3 is a solder bath for storing molten solder, and the opening is closed so that the inside of the bath is not exposed to the outside as shown in FIG.
  • the solder flow supply unit 4 is a component that forms molten solder in the solder tank 3 and supplies the molten solder to the jet nozzle 2. And a heater that heats the jet nozzle 2, a pump that forms a solder flow of molten solder, and a solder flow path that supplies the molten solder that has become a solder flow to the jet nozzle 2.
  • the heater temperature adjustment and pump drive control are performed by the control unit 9 described later.
  • the XYZ stage unit 5 moves the solder tank 3 having the jet nozzle 2 and the solder flow supply unit 4 in the X-axis direction, the Y-axis direction, and the Z-axis direction.
  • the X-axis drive unit 5a is a drive unit that moves the solder tank 3 having the jet nozzle 2 and the solder flow supply unit 4 along the X-axis direction, and includes, for example, a motor and a drive gear mechanism.
  • the Y-axis drive unit 5b is a drive unit that moves the solder bath 3 and the solder flow supply unit 4 along the Y-axis direction
  • the Z-axis drive unit 5c is the solder bath 3 and the solder flow supply unit 4. It is a drive part which moves this along the Z-axis direction.
  • the conveyance path driving unit 6 is a driving unit that generates a conveyance driving force for conveying an object to be soldered such as a printed circuit board disposed on the conveyance path 7, for example, a motor that drives a conveyance belt conveyor and The drive gear mechanism is used.
  • the transport path driving unit 6 is driven and controlled by a control unit 9 described later.
  • the conveyance path 7 is a conveyance path through which the conveyance frame A having a predetermined conveyance width is conveyed from the conveyance inlet 1a to the conveyance outlet 1b by the driving force of the conveyance path driving unit 6.
  • the sensor 8 is a sensor that detects whether or not the transported object that is transported along the transport path 7 is a predetermined soldering object.
  • a predetermined soldering object For example, there is an optical sensor that is arranged in the vicinity of the transport path 7 and detects whether or not the transport frame A has a predetermined shape.
  • the image of the transported object photographed by the camera may be analyzed to detect whether or not the transported object is a predetermined transported object.
  • the control unit 9 includes a solder flow supply unit 4, an X-axis drive unit 5 a, a Y-axis drive unit 5 b, a Z-axis drive unit 5 c, and a conveyance path drive unit 6. It is a control part which controls operation
  • control part 9 is the operation
  • the input / output unit 9a is an input / output unit that exchanges data between the outside of the apparatus and the control unit 9.
  • it is composed of an input device such as a touch panel and a display device such as a liquid crystal monitor, and the temperature of the heater is set via the input / output unit 9a.
  • FIG. 2 is a diagram illustrating the jet nozzle cleaning device according to the first embodiment
  • FIG. 2A is a top view of the jet nozzle cleaning device according to the first embodiment
  • FIG. 2B is a side view of the jet nozzle cleaning device according to the first embodiment, and shows a cross section partially cut along the line aa in FIG.
  • FIG.2 (c) has shown the back surface of the jet nozzle cleaning apparatus which concerns on Embodiment 1.
  • FIG. 2A in the jet nozzle cleaning device 10, the brush rotation mechanism unit 12, the drive motor 13, and the specific shape unit 15 are arranged on the plate member 11, and the plate member 11 The flux inlet 14 is formed.
  • the plate-like member 11 is a plate-like member for carrying the jet nozzle cleaning device 10 into the soldering device 1 via the conveyance path 7.
  • the plate-like member 11 is conveyed at least with the conveyance frame A for conveyance in the conveyance path 7.
  • the width is formed with the same dimension.
  • the brush rotation mechanism unit 12 is a mechanism unit that rotates the brush 16 by the rotational force of the drive motor 13, and has an internal configuration as shown in FIG. That is, the brush 16, the shaft portion 17, the bearing portion 18, the first gear 19 a and the second gear 19 b are provided.
  • the brush 16 is a cup-type wire brush in which the inner diameter of the recess is approximately the same as the outer diameter of the jet nozzle 2 and is provided coaxially on one end side of the shaft portion 17.
  • a wire brush made of SUS is used to brush the outer periphery of the high-temperature jet nozzle 2.
  • the brush 16 may be a micro-spiral brush or the like as an inner diameter brush for brushing the opening of the jet nozzle 2 in addition to a cup-type brush.
  • the shaft portion 17 is a shaft portion that is inserted into the plate-like member 11 with the brush 16 facing the back surface side and is rotatably attached to the plate-like member 11 via the bearing portion 18.
  • the first gear 19a is a gear provided coaxially at the other end of the shaft portion 17, and meshes with the second gear 19b.
  • the second gear 19b is a gear that is provided on the output shaft of the drive motor 13 and transmits the rotational force of the drive motor 13 to the first gear 19a.
  • the flux inlet 14 communicates with the flux pod 21 shown in FIGS. 2B and 2C, and the flux to be applied to the jet nozzle 2 is introduced.
  • the flux pod 21 is a flux storage unit that stores a flux to be applied to the jet nozzle 2 brushed by the brush 16.
  • the mesh 14 a is a mesh stretched in an opening formed in the bottom surface portion of the flux pod 21.
  • the flux pod 21 stores a paste-like flux so that the flux does not drip from the mesh 14a until the flux melting temperature is reached.
  • a corrosion-resistant member such as stainless steel (SUS) is used so that it does not change even when the flux is stored.
  • the specific shape portion 15 is provided so as to protrude from the outer shape of the plate-like member 11 and is a member for discriminating the jet nozzle cleaning device 10 from a normal soldering object. For example, whether or not the specific shape portion 15 is detected by the sensor 8 when the jet nozzle cleaning device 10 is disposed at a predetermined position in the transport path 7 via the plate-like member 11 having the same shape as the normal transport frame A. Based on the normal soldering object, the jet nozzle cleaning device 10 is identified. Thereby, even if the jet nozzle cleaning device 10 is conveyed in the middle of the soldering process, the jet nozzle cleaning device 10 can be accurately determined and the process can proceed to the jet nozzle 2 cleaning process.
  • a cleaning waste receiving portion 20 is provided on the back side of the plate-like member 11.
  • the cleaning waste receiving portion 20 is formed as a standing wall that rises from the back surface of the plate-like member 11 so as to surround the brush 16.
  • oxides and carbides scattered around the brush 16 from the surface of the jet nozzle 2 are blocked by the standing wall of the cleaning waste receiving portion 20 and scattered to the surroundings. Is prevented.
  • the jet nozzle cleaning device 10 cleans the jet nozzle 2 by being arranged in the conveying path 7 of the soldering device 1 shown in FIG.
  • the soldering apparatus 1 carries out the jet nozzle cleaning apparatus 10 while carrying out the soldering process by sequentially carrying the soldering objects arranged on the carrying frame A, so that the jet nozzle 2 is cleaned. Transition.
  • the specific shape portion 15 is detected by the sensor 8.
  • the sensor 8 outputs a detection signal of the specific shape portion 15 to the control portion 9.
  • the control portion 9 controls the solder flow supply portion 4 to stop the solder jet flow of the jet nozzle 2.
  • the control unit 9 controls the X-axis drive unit 5a, the Y-axis drive unit 5b, and the Z-axis drive unit 5c, thereby moving the jet nozzle 2 into the jet nozzle cleaning device 10 as shown in FIG.
  • the brush 16 is arranged.
  • the jet nozzle cleaning device 10 is arranged in the conveying path 7 with the brush portion 16 rotated about the shaft portion 17 as a rotation axis, or is driven by remote control or the like when the jet nozzle 2 is arranged on the brush 16.
  • the motor 13 is driven. Thereby, as shown in FIG.3 (b), the outer periphery of the jet nozzle 2 is brushed by the rotating brush 16.
  • FIG. The oxide or carbide removed from the outer periphery of the jet nozzle 2 by brushing is scattered around the rotating brush 16 and received by the cleaning waste receiving portion 20.
  • the control unit 9 controls the X-axis drive unit 5a, the Y-axis drive unit 5b, and the Z-axis drive unit 5c to cause the jet nozzle 2 to be fluxed as shown in FIG. Move to the pod 21 and press the tip of the jet nozzle 2 against the mesh 14a until a predetermined application time has elapsed.
  • the flux 22 around the mesh 14a out of the flux stored in the flux pod 21 is melted by the heat of the jet nozzle 2, and FIG.
  • the flux 22 exudes from the mesh 14a.
  • the flux 22 can be applied to the outer periphery of the jet nozzle 2 after brushing by setting the time for the flux 22 that has exuded from the mesh 14a to sufficiently reach the outer periphery of the jet nozzle 2 as the predetermined application time.
  • the jet nozzle cleaning device 10 includes the brush 16 that removes oxides and carbides attached to the jet nozzle 2, and the flux pod 21 that applies flux to the jet nozzle 2 after brushing. Since it is provided on the back side of the plate-like member 11 having the same dimensions as the transport frame A, the jet nozzle 2 is cleaned as a series of soldering processes by moving the jet nozzle 2 in the same manner as the normal soldering process. it can. Further, even during the normal soldering process of the soldering object, the jet nozzle cleaning device 10 can be determined based on whether or not the specific shape portion 15 is detected.
  • FIG. 4 is a diagram illustrating an example of a conveyance width adjusting mechanism in the jet nozzle cleaning device.
  • FIG. 4A shows a state where the conveyance width is narrowed
  • FIG. 4B shows a state where the conveyance width is widened.
  • side pieces 23 are provided on both sides in the width direction of the plate-like member 11A as the conveyance width adjusting mechanism.
  • the side piece 23 is screwed to the side surface of the plate-like member 11 ⁇ / b> A by a width adjusting screw 25, and by adjusting the interval between the width adjusting nuts 24 a and 24 b screwed to the width adjusting screw 25, It is possible to approach and separate from the side surface of the member 11A.
  • this invention is a mechanism which can change the conveyance width of the jet nozzle cleaning apparatus 10, it will not be limited to the structure shown in FIG.
  • the plate-like member 11 that can be conveyed by the conveyance path 7, the brush 16 that is rotatably provided on the plate-like member 11, and the drive motor 13 that rotates the brush 16.
  • the flux nozzle 21 provided in the plate-like member 11 for storing the flux, and the jet nozzle 2 that has been transported through the transport path 7 and moved to the position of the brush 16 in the soldering apparatus 1 is connected to the drive motor 13.
  • the flux of the flux pod 21 is applied to the jet nozzle 2 moved to the position of the flux pod 21.
  • cleaning of the jet nozzle 2 can be implemented as a series of operations of the soldering process.
  • the soldering apparatus 1 since the soldering apparatus 1 is equipped with the specific shape part 15 used when discriminating the jet nozzle cleaning apparatus 10 from a soldering target object, even if it is in the middle of a soldering process The jet nozzle cleaning device 10 can be accurately determined from the soldering object.
  • the jet nozzle cleaning device 10 can be used with various transport widths.
  • the flux pod 21 has an opening with the mesh 14a interposed, and the flux 22 melted by the heat of the jet nozzle 2 is applied to the jet nozzle 2 through the mesh 14a. Therefore, the flux 22 can be applied to the jet nozzle 2 with a simple configuration.
  • the brush 16 is provided with the cleaning waste receiving part 20 which receives the cleaning waste removed by brushing the jet nozzle 2, the cleaning waste is scattered inside the soldering apparatus 1. Can be prevented.
  • FIG. FIG. 5 is a diagram showing an outline of a soldering apparatus according to Embodiment 2 of the present invention, and shows a soldering apparatus that performs spot soldering similarly to the soldering apparatus of FIG.
  • a soldering apparatus 1A includes a jet nozzle 2, a solder bath 3, a solder flow supply unit 4, an XYZ stage unit 5, an X-axis drive unit 5a, a Y-axis drive unit 5b, a Z-axis drive unit 5c, and a conveyance path drive.
  • Unit 6 transport path 7, sensor 8, control unit 9A, input / output unit 9a, and jet nozzle cleaning device 10A.
  • the jet nozzle cleaning device 10A is mounted in advance at a location where the jet nozzle 2 inside the apparatus can move, and the control unit 9A includes solder including a cleaning process of the jet nozzle 2.
  • the soldering process and the cleaning of the jet nozzle 2 are controlled according to the attaching algorithm.
  • the control unit 9A controls the operations of the solder flow supply unit 4, the X-axis drive unit 5a, the Y-axis drive unit 5b, the Z-axis drive unit 5c, and the conveyance path drive unit 6 as in the first embodiment. It is a control part which controls the drive of the drive motor 13 of 10 A of jet nozzle cleaning apparatuses. For example, it is composed of a microcomputer system or a programmable controller, executes a program according to the algorithm stored in the memory, and controls the operation of each component according to the set value received by the input / output unit 9a. In the second embodiment, since the jet nozzle cleaning device 10A is mounted in advance at a predetermined location inside the device, the control unit 9A can clean the jet nozzle 2 at a predetermined cleaning timing.
  • the input / output unit 9a is an input / output unit that exchanges data between the outside of the apparatus and the control unit 9.
  • it is composed of an input device such as a touch panel and a display device such as a liquid crystal monitor, the heater temperature is set via the input / output unit 9a, and the number of cleanings and the cleaning timing are displayed.
  • the jet nozzle cleaning device 10A functions in the same manner as in the configuration of FIG. 2, but the mounting of the specific shape portion 15 is omitted. Moreover, 10 A of jet nozzle cleaning apparatuses are mounted in the location which can move the jet nozzle 2 except the conveyance path
  • FIG. 6 is a flowchart showing a soldering process of the soldering apparatus according to the second embodiment. Details of the soldering process by the soldering apparatus 1A according to the second embodiment will be described with reference to FIG.
  • the control unit 9A controls the heater of the solder flow supply unit 4 to heat the solder material of the solder bath 3 and the jet nozzle 2, and the molten solder formed in the solder bath 3 is pumped by the pump of the solder flow supply unit 4. It is sent to the jet nozzle 2 to start forming a solder jet (step ST1).
  • control unit 9A controls the conveyance path driving unit 6 to convey the conveyance frame A on which the soldering object on the conveyance path 7 is arranged from the conveyance inlet 1a side toward the conveyance outlet 1b (step). ST2).
  • control unit 9A controls the X-axis drive unit 5a, the Y-axis drive unit 5b, and the Z-axis drive unit 5c to solder the soldering object.
  • the jet nozzle 2 is moved to the processing location (step ST3), and the soldering processing location is soldered with a solder jet (step ST4).
  • 9 A of control parts determine whether it is the predetermined cleaning timing which cleans the jet nozzle 2 (step ST5). For example, the jet nozzle 2 is cleaned when a soldering process is performed on a predetermined number of objects to be soldered on the transport frame A, or when a soldering process is performed on a predetermined number of soldering locations. Clean 2 If the predetermined cleaning timing is not reached (step ST5; NO), the process returns to step ST2, and the soldering process for the next soldering object is performed.
  • step ST5 When it is a predetermined cleaning timing (step ST5; YES), the control unit 9A performs the cleaning process of the jet nozzle 2 using the jet nozzle cleaning device 10A (step ST6). When the cleaning of the jet nozzle 2 is completed, the control unit 9A determines whether or not the soldering process has been performed on all the soldering objects (step ST7). For example, it is determined whether the number of soldering objects set via the input / output unit 9a has been reached.
  • step ST7; NO When there is a soldering target for which soldering processing has not been performed (step ST7; NO), the control unit 9A returns to step ST2 and performs the soldering processing for the next soldering target. Moreover, when the soldering process about all the soldering objects is completed (step ST7; YES), the soldering process is terminated.
  • the control unit 9A stops the pump to end the solder jet of the jet nozzle 2, and controls the heater to stop the heating of the solder tank 3 and the jet nozzle 2.
  • FIG. 7 is a flowchart showing a cleaning process of the jet nozzle of the soldering apparatus according to the second embodiment.
  • the control unit 9A stops the pump of the solder flow supply unit 4 and stops the solder jet in the jet nozzle 2 (step ST1a).
  • the control unit 9A controls the X-axis drive unit 5a, the Y-axis drive unit 5b, and the Z-axis drive unit 5c to place the jet nozzle 2 on the brush 16 of the jet nozzle cleaning device 10A (step ST2a).
  • the jet nozzle 2 is arranged so as to be inserted into the cup-shaped brush 16.
  • the control unit 9A controls the drive motor 13 to rotate the brush 16 around the shaft portion 17 to perform brushing of the jet nozzle 2 (step ST3a). Further, the control unit 9A sets a timer when the brushing is started, and determines whether or not a predetermined brushing time has elapsed (step ST4a). If the predetermined brushing time has not elapsed (step ST4a; NO), the process returns to step ST3a and the brushing of the brush 16 is continued.
  • step ST4a When a predetermined brushing time has elapsed (step ST4a; YES), the control unit 9A controls the X-axis drive unit 5a, the Y-axis drive unit 5b, and the Z-axis drive unit 5c to move the jet nozzle 2 to the flux pod 21.
  • the tip of the jet nozzle 2 is pressed against the mesh 14a (step ST5a).
  • the controller 9A sets a timer when the position of the jet nozzle 2 is moved to the flux pod 21, and determines whether or not a predetermined application time has elapsed (step ST6a).
  • step ST6a If the predetermined application time has not elapsed (step ST6a; NO), the control unit 9A returns to step ST6a and continues the process of pressing the tip of the jet nozzle 2 against the mesh 14a.
  • step ST6a YES
  • the control unit 9A causes the flux melted by the heat of the jet nozzle 2 to ooze out from the mesh 14a as shown in FIG. 2 and the number of cleanings of the jet nozzle 2 stored in the internal memory is updated (step ST7a).
  • control unit 9A outputs the current number of cleanings and the cleaning timing of the jet nozzle 2 to the input / output unit 9a.
  • the input / output unit 9a displays the current number of cleanings and cleaning timing input from the control unit 9A on the monitor (step ST8a).
  • the operator can determine an appropriate number of cleanings and cleaning timing by referring to the product after the soldering process and the number of cleanings and the cleaning timing displayed on the monitor of the input / output unit 9a.
  • the control unit 9A operates the pump of the solder flow supply unit 4 to restart the solder jet in the jet nozzle 2 (step ST9a), and proceeds to step ST7 in FIG.
  • the soldering device 1A uses a jet nozzle cleaning device 10A in which the brush 16 and the flux pod 21 are provided on the same surface (back surface) side of the plate-like member 11, so that the normal The cleaning process can be performed by moving the jet nozzle 2 in the same manner as the soldering process.
  • the jet nozzle cleaning device 10A since the jet nozzle cleaning device 10A is built in the soldering device 1A, the jet nozzle 2 can be cleaned at a predetermined cleaning timing as a series of soldering operations.
  • the jet nozzle cleaning device 10A having the drive motor 13 for rotating the brush 16 and the flux pod 21 for storing the flux, and the jet nozzle 2 moved to the position of the brush 16 by controlling the drive units 5a, 5b, 5c,
  • cleaning of the jet nozzle 2 can be performed as a series of operation
  • jet nozzle cleaning device can perform jet nozzle cleaning as a series of soldering operations, it is suitable for a soldering device that performs spot soldering.
  • 1,1A soldering device 1a transfer inlet, 1b transfer outlet, 2 jet nozzle, 3 solder bath, 4 solder flow supply unit, 5 XYZ stage unit, 5a X axis drive unit, 5b Y axis drive unit, 5c Z axis drive Section, 6 transport path drive section, 7 transport path, 8 sensor, 9, 9A control section, 9a input / output section, 10, 10A jet nozzle cleaning device, 11, 11A plate member, 12 brush rotation mechanism section, 13 drive motor , 14 flux inlet, 14a mesh, 15 specific shape part, 16 brush, 17 shaft part, 18 bearing part, 19a first gear, 19b second gear, 20 cleaning waste receiving part, 21 flux pod, 22 flux, 23 Side pieces, 24a, 24b Width adjusting nut, 25 Width adjusting screw.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Molten Solder (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

To clean a spray nozzle as an action in a series of soldering processes, this spray nozzle cleaning feature comprises a plate-shaped member (11) that can be conveyed over a conveying path (7), a brush (16) rotatably provided to the plate-shaped member (11), a drive part (13) for rotating the brush (16), and a flux storage part (21) provided to the plate-shaped member (11) and used to store flux. A spray nozzle (2), having been moved to the position of the brush (16), is brushed by the brush (16) being rotated by the drive part (13), and when moved to the position of the flux storage part (21), the spray nozzle (2) is coated with flux from the flux storage part (21).

Description

噴流ノズル清掃装置、はんだ付け装置および噴流ノズル清掃方法Jet nozzle cleaning device, soldering device, and jet nozzle cleaning method
　この発明は、スポットはんだ付け用の小口径の噴流ノズルを清掃する噴流ノズル清掃装置、これを備えるはんだ付け装置および噴流ノズル清掃方法に関する。 The present invention relates to a jet nozzle cleaning device that cleans a small-diameter jet nozzle for spot soldering, a soldering device including the same, and a jet nozzle cleaning method.
　従来から、小口径の噴流ノズルで溶融はんだを噴流させて電子部品の端子にスポット的にはんだ付けを行うはんだ付け装置が知られている。
　このはんだ付け装置において、噴流ノズルを清掃することなく、長時間のはんだ付けを行うと、噴流ノズルの表面が酸化して酸化物や炭化物が付着し、はんだ噴流に乱れが発生する。はんだ噴流に乱れが発生した場合、はんだ付けムラの発生要因となり、はんだ付け品質が低下する。 2. Description of the Related Art Conventionally, there has been known a soldering apparatus that performs spot soldering on a terminal of an electronic component by jetting molten solder with a small-diameter jet nozzle.
In this soldering apparatus, if soldering is performed for a long time without cleaning the jet nozzle, the surface of the jet nozzle is oxidized and oxides and carbides are adhered, and the solder jet is disturbed. When turbulence occurs in the solder jet, it causes soldering unevenness and the soldering quality is deteriorated.
　小口径のノズルに付着したはんだなどを除去する従来の技術として、例えば特許文献１に記載されるノズルの清掃ユニットがある。この清掃ユニットは、洗浄液を溜めた液槽内に、ブラシからなるワイパを外周に取り付けた回転ドラムを設けてなるユニットであり、ノズルの先端をワイパに押し当てた状態で回転ドラムを回転させることにより、洗浄液ではんだなどを溶解しながらノズルの洗浄を行う。 As a conventional technique for removing solder or the like attached to a small-diameter nozzle, there is a nozzle cleaning unit described in Patent Document 1, for example. This cleaning unit is a unit in which a rotating drum with a wiper made of a brush attached to the outer periphery is provided in a liquid tank in which cleaning liquid is stored, and the rotating drum is rotated with the tip of the nozzle pressed against the wiper. Then, the nozzle is cleaned while the solder is dissolved with the cleaning liquid.
特開２００３－３１１２２９号公報JP 2003-311229 A
　従来の噴流ノズルの清掃は、はんだ付け処理を一旦完全に終了させて噴流ノズル周辺の温度を十分に下げてから、手作業で噴流ノズルをブラッシングし、フラックスを塗布することが一般的であった。このように、従来では、噴流ノズルの清掃のたびに、噴流ノズル周辺の温度を下げる必要があるため、はんだ付け処理全体の作業効率を悪化させるという課題があった。 In conventional jet nozzle cleaning, it is common to finish the soldering process once and lower the temperature around the jet nozzle sufficiently, then brush the jet nozzle manually and apply flux. . As described above, conventionally, since it is necessary to lower the temperature around the jet nozzle every time the jet nozzle is cleaned, there is a problem that the working efficiency of the entire soldering process is deteriorated.
　また、特許文献１に記載される清掃ユニットは、手作業の代わりに噴流ノズルの清掃に利用することができるが、はんだ付け処理を一旦完全に終了させて噴流ノズル周辺の温度を十分に下げる必要があり、作業効率の悪化を解消することはできない。 Moreover, although the cleaning unit described in Patent Document 1 can be used for cleaning the jet nozzle instead of manual work, it is necessary to completely end the soldering process once and sufficiently lower the temperature around the jet nozzle. Therefore, the deterioration of work efficiency cannot be solved.
　この発明は、上記のような課題を解決するためになされたもので、噴流ノズルの清掃をはんだ付け処理の一連の動作として行うことができる噴流ノズル清掃装置、これを備えるはんだ付け装置および噴流ノズル清掃方法を得ることを目的とする。 The present invention has been made to solve the above-described problems, and is a jet nozzle cleaning device capable of performing cleaning of a jet nozzle as a series of operations of a soldering process, a soldering device including the same, and a jet nozzle The purpose is to obtain a cleaning method.
　この発明に係る噴流ノズル清掃装置は、移動自在に設けられた噴流ノズルを備え、搬送経路を搬送されるはんだ付け対象物まで噴流ノズルを移動させ、当該噴流ノズルで形成されたはんだ噴流ではんだ付けを行うはんだ付け装置に使用される噴流ノズル清掃装置において、搬送経路で搬送可能な板状部材と、板状部材に回転自在に設けられたブラシと、ブラシを回転させる駆動部と、板状部材に設けられ、フラックスを格納するフラックス格納部とを備え、搬送経路を搬送されてはんだ付け装置内で、ブラシの位置に移動した噴流ノズルを、駆動部により回転するブラシでブラッシングし、フラックス格納部の位置に移動した当該噴流ノズルにフラックス格納部のフラックスを塗布することを特徴とする。 The jet nozzle cleaning device according to the present invention includes a jet nozzle that is movably provided, moves the jet nozzle to an object to be soldered that is transported through a transport path, and is soldered by a solder jet formed by the jet nozzle. In a jet nozzle cleaning device used for a soldering apparatus for performing a soldering, a plate-shaped member that can be transported in a transport path, a brush that is rotatably provided on the plate-shaped member, a drive unit that rotates the brush, and a plate-shaped member And a flux storage section that stores the flux, brushes the jet nozzle that has been transported through the transport path and moved to the position of the brush in the soldering apparatus with a brush that is rotated by the drive section, and the flux storage section. The flux in the flux storage section is applied to the jet nozzle that has moved to the position.
　この発明によれば、噴流ノズルの清掃をはんだ付け処理の一連の動作として行うことができるという効果がある。 According to the present invention, the jet nozzle can be cleaned as a series of soldering operations.
この発明の実施の形態１に係るはんだ付け装置の概要を示す図である。It is a figure which shows the outline | summary of the soldering apparatus which concerns on Embodiment 1 of this invention. 実施の形態１に係る噴流ノズル清掃装置を示す図である。It is a figure which shows the jet nozzle cleaning apparatus which concerns on Embodiment 1. FIG. 実施の形態１に係る噴流ノズル清掃装置によるノズル清掃の概要を示す図である。It is a figure which shows the outline | summary of the nozzle cleaning by the jet nozzle cleaning apparatus which concerns on Embodiment 1. FIG. 実施の形態１に係る噴流ノズル清掃装置の搬送幅調整機構の一例を示す図である。It is a figure which shows an example of the conveyance width adjustment mechanism of the jet nozzle cleaning apparatus which concerns on Embodiment 1. FIG. この発明の実施の形態２に係るはんだ付け装置の概要を示す図である。It is a figure which shows the outline | summary of the soldering apparatus which concerns on Embodiment 2 of this invention. 実施の形態２に係るはんだ付け装置のはんだ付け処理を示すフローチャートである。10 is a flowchart showing a soldering process of the soldering apparatus according to the second embodiment. 実施の形態２に係るはんだ付け装置の噴流ノズルの清掃処理を示すフローチャートである。6 is a flowchart showing a cleaning process for a jet nozzle of a soldering apparatus according to a second embodiment.
　以下、この発明をより詳細に説明するため、この発明を実施するための形態について、添付の図面に従って説明する。
実施の形態１．
　図１は、この発明の実施の形態１に係るはんだ付け装置の概要を示す図であり、スポットはんだ付けを行うはんだ付け装置を示している。図１において、はんだ付け装置１は、噴流ノズル２、はんだ槽３、はんだ流供給部４、ＸＹＺステージ部５、Ｘ軸駆動部５ａ、Ｙ軸駆動部５ｂ、Ｚ軸駆動部５ｃ、搬送経路駆動部６、搬送経路７、センサ８、制御部９および入出力部９ａを備える。 Hereinafter, in order to describe the present invention in more detail, modes for carrying out the present invention will be described with reference to the accompanying drawings.
Embodiment 1 FIG.
FIG. 1 is a diagram showing an outline of a soldering apparatus according to Embodiment 1 of the present invention, and shows a soldering apparatus that performs spot soldering. In FIG. 1, a soldering apparatus 1 includes a jet nozzle 2, a solder bath 3, a solder flow supply unit 4, an XYZ stage unit 5, an X-axis drive unit 5a, a Y-axis drive unit 5b, a Z-axis drive unit 5c, and a conveyance path drive. Unit 6, a conveyance path 7, a sensor 8, a control unit 9, and an input / output unit 9a.
　噴流ノズル２は、はんだ付け対象物であるプリント基板に対してスポットはんだ付けを行う小口径の噴流ノズルである。噴流ノズル２の周囲には、溶融はんだを溜める筒状部が設けられており、噴流ノズル２の開口部から溶融はんだがその外周の全域をつたって筒状部内に溢れ出すことにより、開口径に応じた外径のはんだ噴流が形成される。
　はんだ槽３は、溶融はんだを貯留するはんだ槽であり、図１に示すように槽内部が外部に曝されないように開口が閉塞されている。 The jet nozzle 2 is a small-diameter jet nozzle that performs spot soldering on a printed circuit board that is an object to be soldered. A cylindrical portion for collecting molten solder is provided around the jet nozzle 2, and the molten solder flows from the opening of the jet nozzle 2 over the entire outer periphery to the inside of the cylindrical portion. A solder jet having a corresponding outer diameter is formed.
The solder bath 3 is a solder bath for storing molten solder, and the opening is closed so that the inside of the bath is not exposed to the outside as shown in FIG.
　はんだ流供給部４は、はんだ槽３で溶融はんだを形成して噴流ノズル２に供給する構成要素であり、例えば、はんだ槽３の内部に投入したはんだ材を加熱して溶融はんだを形成するヒーターと、噴流ノズル２を加熱するヒーターと、溶融はんだのはんだ流を形成するポンプと、はんだ流となった溶融はんだを噴流ノズル２に供給するはんだ流経路とを備える。なお、ヒーターの温度調整とポンプの駆動制御は、後述する制御部９によって実施される。 The solder flow supply unit 4 is a component that forms molten solder in the solder tank 3 and supplies the molten solder to the jet nozzle 2. And a heater that heats the jet nozzle 2, a pump that forms a solder flow of molten solder, and a solder flow path that supplies the molten solder that has become a solder flow to the jet nozzle 2. The heater temperature adjustment and pump drive control are performed by the control unit 9 described later.
　ＸＹＺステージ部５は、噴流ノズル２を有するはんだ槽３およびはんだ流供給部４を、Ｘ軸方向、Ｙ軸方向、Ｚ軸方向に移動させる。
　Ｘ軸駆動部５ａは、噴流ノズル２を有するはんだ槽３とはんだ流供給部４を、Ｘ軸方向に沿って移動させる駆動部であり、例えばモータおよび駆動ギア機構を備える。同様に、Ｙ軸駆動部５ｂは、はんだ槽３とはんだ流供給部４をＹ軸方向に沿って移動させる駆動部であって、Ｚ軸駆動部５ｃは、はんだ槽３とはんだ流供給部４をＺ軸方向に沿って移動させる駆動部である。 The XYZ stage unit 5 moves the solder tank 3 having the jet nozzle 2 and the solder flow supply unit 4 in the X-axis direction, the Y-axis direction, and the Z-axis direction.
The X-axis drive unit 5a is a drive unit that moves the solder tank 3 having the jet nozzle 2 and the solder flow supply unit 4 along the X-axis direction, and includes, for example, a motor and a drive gear mechanism. Similarly, the Y-axis drive unit 5b is a drive unit that moves the solder bath 3 and the solder flow supply unit 4 along the Y-axis direction, and the Z-axis drive unit 5c is the solder bath 3 and the solder flow supply unit 4. It is a drive part which moves this along the Z-axis direction.
　搬送経路駆動部６は、搬送経路７上に配置されたプリント基板などのはんだ付け対象物を搬送するための搬送用駆動力を発生する駆動部であって、例えば搬送ベルトコンベアを駆動させるモータおよびその駆動ギア機構などから構成される。なお、搬送経路駆動部６は、後述する制御部９によって駆動制御される。
　搬送経路７は、搬送経路駆動部６の駆動力によって所定の搬送幅を有する搬送フレームＡが搬送入口１ａから搬送出口１ｂへ搬送される搬送経路である。 The conveyance path driving unit 6 is a driving unit that generates a conveyance driving force for conveying an object to be soldered such as a printed circuit board disposed on the conveyance path 7, for example, a motor that drives a conveyance belt conveyor and The drive gear mechanism is used. The transport path driving unit 6 is driven and controlled by a control unit 9 described later.
The conveyance path 7 is a conveyance path through which the conveyance frame A having a predetermined conveyance width is conveyed from the conveyance inlet 1a to the conveyance outlet 1b by the driving force of the conveyance path driving unit 6.
　センサ８は、搬送経路７を搬送している搬送物が所定のはんだ付け対象物であるか否かを検出するセンサである。例えば、搬送経路７の近傍に配置されて搬送フレームＡが所定の形状であるか否かを検出する光センサが挙げられる。また、カメラで撮影された搬送物の画像を画像解析して所定の搬送物であるか否かを検出してもよい。 The sensor 8 is a sensor that detects whether or not the transported object that is transported along the transport path 7 is a predetermined soldering object. For example, there is an optical sensor that is arranged in the vicinity of the transport path 7 and detects whether or not the transport frame A has a predetermined shape. Alternatively, the image of the transported object photographed by the camera may be analyzed to detect whether or not the transported object is a predetermined transported object.
　制御部９は、所定のはんだ付けアルゴリズムに従うはんだ付け処理を実施するために、はんだ流供給部４、Ｘ軸駆動部５ａ、Ｙ軸駆動部５ｂ、Ｚ軸駆動部５ｃおよび搬送経路駆動部６の動作を制御する制御部である。例えば、マイクロコンピュータシステムやプログラマブルコントローラなどで構成され、メモリに記憶した上記アルゴリズムに従うプログラムを実行し、入出力部９ａで受け付けた設定値に応じて各構成要素の動作を制御する。また、制御部９は、搬送フレームＡがはんだ付け対象物を配置する所定の形状ではなく、後述する噴流ノズル清掃装置の特定形状部がセンサ８によって検出されると、噴流ノズル２を清掃する動作モードに移行する。 In order to perform a soldering process according to a predetermined soldering algorithm, the control unit 9 includes a solder flow supply unit 4, an X-axis drive unit 5 a, a Y-axis drive unit 5 b, a Z-axis drive unit 5 c, and a conveyance path drive unit 6. It is a control part which controls operation | movement. For example, it is composed of a microcomputer system, a programmable controller, etc., executes a program according to the algorithm stored in the memory, and controls the operation of each component according to the set value received by the input / output unit 9a. Moreover, the control part 9 is the operation | movement which cleans the jet nozzle 2, if the specific shape part of the jet nozzle cleaning apparatus mentioned later is detected by the sensor 8 instead of the predetermined shape which the conveyance frame A arrange | positions the soldering target object. Enter mode.
　入出力部９ａは、装置外部と制御部９の間のデータのやり取りを行う入出力部である。例えば、タッチパネルなどの入力装置と液晶モニタなどの表示装置で構成され、入出力部９ａを介してヒーターの温度設定などが行われる。 The input / output unit 9a is an input / output unit that exchanges data between the outside of the apparatus and the control unit 9. For example, it is composed of an input device such as a touch panel and a display device such as a liquid crystal monitor, and the temperature of the heater is set via the input / output unit 9a.
　図２は、実施の形態１に係る噴流ノズル清掃装置を示す図であり、図２（ａ）は、実施の形態１に係る噴流ノズル清掃装置の上面図である。また、図２（ｂ）は、実施の形態１に係る噴流ノズル清掃装置の側面図であり、部分的に図２（ａ）のａ－ａ線で切った断面を示している。さらに、図２（ｃ）は、実施の形態１に係る噴流ノズル清掃装置の裏面を示している。図２（ａ）に示すように、噴流ノズル清掃装置１０では、板状部材１１上にブラシ回転機構部１２、駆動モータ１３および特定形状部１５が配置されており、また、板状部材１１には、フラックス投入口１４が形成されている。 FIG. 2 is a diagram illustrating the jet nozzle cleaning device according to the first embodiment, and FIG. 2A is a top view of the jet nozzle cleaning device according to the first embodiment. FIG. 2B is a side view of the jet nozzle cleaning device according to the first embodiment, and shows a cross section partially cut along the line aa in FIG. Furthermore, FIG.2 (c) has shown the back surface of the jet nozzle cleaning apparatus which concerns on Embodiment 1. FIG. As shown in FIG. 2A, in the jet nozzle cleaning device 10, the brush rotation mechanism unit 12, the drive motor 13, and the specific shape unit 15 are arranged on the plate member 11, and the plate member 11 The flux inlet 14 is formed.
　板状部材１１は、搬送経路７を介して噴流ノズル清掃装置１０をはんだ付け装置１内に搬送するための板状部材であり、例えば、搬送経路７で搬送するために搬送フレームＡと少なくとも搬送幅が同じ寸法で形成される。
　ブラシ回転機構部１２は、駆動モータ１３の回転力でブラシ１６を回転させる機構部であり、図２（ｂ）に示すような内部構成を有する。すなわち、ブラシ１６、軸部１７、ベアリング部１８、第１のギア１９ａおよび第２のギア１９ｂを備える。 The plate-like member 11 is a plate-like member for carrying the jet nozzle cleaning device 10 into the soldering device 1 via the conveyance path 7. For example, the plate-like member 11 is conveyed at least with the conveyance frame A for conveyance in the conveyance path 7. The width is formed with the same dimension.
The brush rotation mechanism unit 12 is a mechanism unit that rotates the brush 16 by the rotational force of the drive motor 13, and has an internal configuration as shown in FIG. That is, the brush 16, the shaft portion 17, the bearing portion 18, the first gear 19 a and the second gear 19 b are provided.
　ブラシ１６は、凹部の内径寸法が噴流ノズル２の外径と同程度のカップ型のワイヤブラシであり、軸部１７の一端側に同軸に設けられる。ブラシ１６には、高温の噴流ノズル２の外周をブラッシングするために、例えばＳＵＳ製のワイヤブラシを使用する。
　なお、ブラシ１６には、カップ型のブラシの他に噴流ノズル２の開口部をブラッシングする内径ブラシとしてマイクロスパイラルブラシなどを使用してもよい。 The brush 16 is a cup-type wire brush in which the inner diameter of the recess is approximately the same as the outer diameter of the jet nozzle 2 and is provided coaxially on one end side of the shaft portion 17. For the brush 16, for example, a wire brush made of SUS is used to brush the outer periphery of the high-temperature jet nozzle 2.
The brush 16 may be a micro-spiral brush or the like as an inner diameter brush for brushing the opening of the jet nozzle 2 in addition to a cup-type brush.
　軸部１７は、板状部材１１にブラシ１６を裏面側に向けて挿通されて、ベアリング部１８を介して板状部材１１に回転自在に取り付けられる軸部である。
　第１のギア１９ａは、軸部１７の他端に同軸に設けたギアであって、第２のギア１９ｂと噛み合う。第２のギア１９ｂは、駆動モータ１３の出力軸に設けられ、駆動モータ１３の回転力を第１のギア１９ａに伝達するギアである。 The shaft portion 17 is a shaft portion that is inserted into the plate-like member 11 with the brush 16 facing the back surface side and is rotatably attached to the plate-like member 11 via the bearing portion 18.
The first gear 19a is a gear provided coaxially at the other end of the shaft portion 17, and meshes with the second gear 19b. The second gear 19b is a gear that is provided on the output shaft of the drive motor 13 and transmits the rotational force of the drive motor 13 to the first gear 19a.
　また、フラックス投入口１４は、図２（ｂ）、図２（ｃ）に示すフラックスポッド２１に連通しており、噴流ノズル２に塗布するフラックスが投入される。
　フラックスポッド２１は、ブラシ１６によりブラッシングされた噴流ノズル２に塗布するフラックスを格納しておくフラックス格納部である。メッシュ１４ａは、フラックスポッド２１の底面部に形成された開口に張られたメッシュである。フラックスポッド２１には、フラックスの溶融温度になるまで、メッシュ１４ａからフラックスが滴下することがないようにペースト状のフラックスを格納しておく。
　なお、メッシュ１４ａおよびフラックスポッド２１には、フラックスを格納しても変質しないようにステンレス鋼（ＳＵＳ）などの耐腐食性の部材を使用する。 Further, the flux inlet 14 communicates with the flux pod 21 shown in FIGS. 2B and 2C, and the flux to be applied to the jet nozzle 2 is introduced.
The flux pod 21 is a flux storage unit that stores a flux to be applied to the jet nozzle 2 brushed by the brush 16. The mesh 14 a is a mesh stretched in an opening formed in the bottom surface portion of the flux pod 21. The flux pod 21 stores a paste-like flux so that the flux does not drip from the mesh 14a until the flux melting temperature is reached.
For the mesh 14a and the flux pod 21, a corrosion-resistant member such as stainless steel (SUS) is used so that it does not change even when the flux is stored.
　特定形状部１５は、板状部材１１の外形から突出するように設けられて、通常のはんだ付け対象物から噴流ノズル清掃装置１０を判別させるための部材である。例えば、通常の搬送フレームＡと同じ形状の板状部材１１を介して噴流ノズル清掃装置１０を搬送経路７の所定位置に配置したときに、センサ８に特定形状部１５が検出されたか否かに基づいて通常のはんだ付け対象物から噴流ノズル清掃装置１０を見分ける。これにより、はんだ付け処理の途中で噴流ノズル清掃装置１０が搬送されても、的確に噴流ノズル清掃装置１０であることが判別されて噴流ノズル２の清掃処理へ移行することができる。 The specific shape portion 15 is provided so as to protrude from the outer shape of the plate-like member 11 and is a member for discriminating the jet nozzle cleaning device 10 from a normal soldering object. For example, whether or not the specific shape portion 15 is detected by the sensor 8 when the jet nozzle cleaning device 10 is disposed at a predetermined position in the transport path 7 via the plate-like member 11 having the same shape as the normal transport frame A. Based on the normal soldering object, the jet nozzle cleaning device 10 is identified. Thereby, even if the jet nozzle cleaning device 10 is conveyed in the middle of the soldering process, the jet nozzle cleaning device 10 can be accurately determined and the process can proceed to the jet nozzle 2 cleaning process.
　さらに、板状部材１１の裏面側には清掃屑受け部２０が設けられる。清掃屑受け部２０は、例えば、図２（ｂ）、図２（ｃ）に示すように、板状部材１１の裏面からブラシ１６の周りを囲むように立ち上がった立ち壁として形成される。ブラシ１６を回転させながら噴流ノズル２をブラッシングしたときに、噴流ノズル２の表面からブラシ１６周りに飛び散った酸化物や炭化物は、清掃屑受け部２０の立ち壁に遮られてその周囲への飛散が防止される。 Furthermore, a cleaning waste receiving portion 20 is provided on the back side of the plate-like member 11. For example, as shown in FIGS. 2B and 2C, the cleaning waste receiving portion 20 is formed as a standing wall that rises from the back surface of the plate-like member 11 so as to surround the brush 16. When the jet nozzle 2 is brushed while rotating the brush 16, oxides and carbides scattered around the brush 16 from the surface of the jet nozzle 2 are blocked by the standing wall of the cleaning waste receiving portion 20 and scattered to the surroundings. Is prevented.
　次に動作について説明する。
　実施の形態１に係る噴流ノズル清掃装置１０は、図１に示したはんだ付け装置１の搬送経路７に配置されることにより噴流ノズル２の清掃を行う。
　例えば、はんだ付け装置１が、搬送フレームＡに配置したはんだ付け対象物を順次搬送してはんだ付け処理を行っている途中に噴流ノズル清掃装置１０を搬送することにより、噴流ノズル２の清掃処理へ移行する。 Next, the operation will be described.
The jet nozzle cleaning device 10 according to the first embodiment cleans the jet nozzle 2 by being arranged in the conveying path 7 of the soldering device 1 shown in FIG.
For example, the soldering apparatus 1 carries out the jet nozzle cleaning apparatus 10 while carrying out the soldering process by sequentially carrying the soldering objects arranged on the carrying frame A, so that the jet nozzle 2 is cleaned. Transition.
　まず、搬送経路７で噴流ノズル清掃装置１０がはんだ付け装置１内の所定位置まで搬送されると、センサ８によって特定形状部１５が検出される。センサ８は、特定形状部１５の検出信号を制御部９に出力する。制御部９は、センサ８から特定形状部１５の検出信号を受けると、はんだ流供給部４を制御して噴流ノズル２のはんだ噴流を停止する。 First, when the jet nozzle cleaning device 10 is transported to a predetermined position in the soldering device 1 through the transport path 7, the specific shape portion 15 is detected by the sensor 8. The sensor 8 outputs a detection signal of the specific shape portion 15 to the control portion 9. When receiving the detection signal of the specific shape portion 15 from the sensor 8, the control portion 9 controls the solder flow supply portion 4 to stop the solder jet flow of the jet nozzle 2.
　次に、制御部９は、Ｘ軸駆動部５ａ、Ｙ軸駆動部５ｂおよびＺ軸駆動部５ｃを制御することで、図３（ａ）に示すように、噴流ノズル２を噴流ノズル清掃装置１０のブラシ１６に配置する。このとき、軸部１７を回転軸としてブラシ１６を回転させた状態で噴流ノズル清掃装置１０を搬送経路７に配置するか、あるいは、噴流ノズル２をブラシ１６に配置したときに遠隔操作などで駆動モータ１３を駆動させる。これにより、図３（ｂ）に示すように、回転するブラシ１６により噴流ノズル２の外周がブラッシングされる。
　なお、ブラッシングにより噴流ノズル２の外周から除去された酸化物や炭化物は、回転するブラシ１６の周囲に飛び散って清掃屑受け部２０に受け取られる。 Next, the control unit 9 controls the X-axis drive unit 5a, the Y-axis drive unit 5b, and the Z-axis drive unit 5c, thereby moving the jet nozzle 2 into the jet nozzle cleaning device 10 as shown in FIG. The brush 16 is arranged. At this time, the jet nozzle cleaning device 10 is arranged in the conveying path 7 with the brush portion 16 rotated about the shaft portion 17 as a rotation axis, or is driven by remote control or the like when the jet nozzle 2 is arranged on the brush 16. The motor 13 is driven. Thereby, as shown in FIG.3 (b), the outer periphery of the jet nozzle 2 is brushed by the rotating brush 16. FIG.
The oxide or carbide removed from the outer periphery of the jet nozzle 2 by brushing is scattered around the rotating brush 16 and received by the cleaning waste receiving portion 20.
　所定のブラッシング時間が経過すると、制御部９は、Ｘ軸駆動部５ａ、Ｙ軸駆動部５ｂおよびＺ軸駆動部５ｃを制御して、図３（ｃ）に示すように、噴流ノズル２をフラックスポッド２１へ移動させ、所定の塗布時間が経過するまでメッシュ１４ａに噴流ノズル２の先端部を押し付ける。このとき、噴流ノズル２は、ヒーターにより高温が維持されているので、フラックスポッド２１に貯留したフラックスのうち、メッシュ１４ａ周辺のフラックス２２が噴流ノズル２の熱で溶融して、図３（ｄ）に示すように、メッシュ１４ａからフラックス２２がしみ出してくる。所定の塗布時間として、メッシュ１４ａからしみ出たフラックス２２が噴流ノズル２の外周に十分に行き渡る時間を設定することで、ブラッシング後の噴流ノズル２の外周にフラックス２２を塗布することができる。 When a predetermined brushing time has elapsed, the control unit 9 controls the X-axis drive unit 5a, the Y-axis drive unit 5b, and the Z-axis drive unit 5c to cause the jet nozzle 2 to be fluxed as shown in FIG. Move to the pod 21 and press the tip of the jet nozzle 2 against the mesh 14a until a predetermined application time has elapsed. At this time, since the jet nozzle 2 is maintained at a high temperature by the heater, the flux 22 around the mesh 14a out of the flux stored in the flux pod 21 is melted by the heat of the jet nozzle 2, and FIG. As shown, the flux 22 exudes from the mesh 14a. The flux 22 can be applied to the outer periphery of the jet nozzle 2 after brushing by setting the time for the flux 22 that has exuded from the mesh 14a to sufficiently reach the outer periphery of the jet nozzle 2 as the predetermined application time.
　このように、実施の形態１に係る噴流ノズル清掃装置１０は、噴流ノズル２に付着した酸化物や炭化物を除去するブラシ１６と、ブラッシング後の噴流ノズル２にフラックスを塗布するフラックスポッド２１を、搬送フレームＡと同様な寸法の板状部材１１の裏面側に設けたので、通常のはんだ付け処理と同様な噴流ノズル２の移動操作によってはんだ付け処理の一連の動作として噴流ノズル２の清掃を実施できる。また、通常のはんだ付け対象物のはんだ付け処理の途中であっても、特定形状部１５の検出有無に基づいて、噴流ノズル清掃装置１０の判別が可能である。 As described above, the jet nozzle cleaning device 10 according to the first embodiment includes the brush 16 that removes oxides and carbides attached to the jet nozzle 2, and the flux pod 21 that applies flux to the jet nozzle 2 after brushing. Since it is provided on the back side of the plate-like member 11 having the same dimensions as the transport frame A, the jet nozzle 2 is cleaned as a series of soldering processes by moving the jet nozzle 2 in the same manner as the normal soldering process. it can. Further, even during the normal soldering process of the soldering object, the jet nozzle cleaning device 10 can be determined based on whether or not the specific shape portion 15 is detected.
　はんだ付け装置１は、はんだ付け対象物の仕様に応じて搬送経路７の搬送幅が変更される場合がある。そこで、噴流ノズル清掃装置１０を様々な搬送幅で使用できるようにするため、搬送幅を調整する機構を設けてもよい。
　図４は、噴流ノズル清掃装置における搬送幅調整機構の一例を示す図である。図４（ａ）は搬送幅を狭めた状態を示しており、図４（ｂ）は搬送幅を広げた状態を示している。
　図４の例では、搬送幅調整機構として、板状部材１１Ａの幅方向の両側にサイド片２３をそれぞれ設けている。サイド片２３は、幅調整用ネジ２５によって板状部材１１Ａの側面にネジ止めされており、幅調整用ネジ２５に螺着された幅調整用ナット２４ａ，２４ｂの間隔を調整することにより、板状部材１１Ａの側面に接近、離間させることが可能である。なお、本発明は、噴流ノズル清掃装置１０の搬送幅を変更することができる機構であれば、図４に示した構成に限定されるものではない。 In the soldering apparatus 1, the transport width of the transport path 7 may be changed according to the specifications of the soldering object. Therefore, a mechanism for adjusting the conveyance width may be provided so that the jet nozzle cleaning device 10 can be used with various conveyance widths.
FIG. 4 is a diagram illustrating an example of a conveyance width adjusting mechanism in the jet nozzle cleaning device. FIG. 4A shows a state where the conveyance width is narrowed, and FIG. 4B shows a state where the conveyance width is widened.
In the example of FIG. 4, side pieces 23 are provided on both sides in the width direction of the plate-like member 11A as the conveyance width adjusting mechanism. The side piece 23 is screwed to the side surface of the plate-like member 11 </ b> A by a width adjusting screw 25, and by adjusting the interval between the width adjusting nuts 24 a and 24 b screwed to the width adjusting screw 25, It is possible to approach and separate from the side surface of the member 11A. In addition, if this invention is a mechanism which can change the conveyance width of the jet nozzle cleaning apparatus 10, it will not be limited to the structure shown in FIG.
　以上のように、この実施の形態１によれば、搬送経路７で搬送可能な板状部材１１と、板状部材１１に回転自在に設けられたブラシ１６と、ブラシ１６を回転させる駆動モータ１３と、板状部材１１に設けられ、フラックスを格納するフラックス格納部２１を備え、搬送経路７を搬送されてはんだ付け装置１内で、ブラシ１６の位置に移動した噴流ノズル２を、駆動モータ１３により回転するブラシ１６でブラッシングし、フラックスポッド２１の位置に移動した噴流ノズル２にフラックスポッド２１のフラックスを塗布する。このように構成することで、はんだ付け処理の一連の動作として噴流ノズル２の清掃を実施することができる。 As described above, according to the first embodiment, the plate-like member 11 that can be conveyed by the conveyance path 7, the brush 16 that is rotatably provided on the plate-like member 11, and the drive motor 13 that rotates the brush 16. The flux nozzle 21 provided in the plate-like member 11 for storing the flux, and the jet nozzle 2 that has been transported through the transport path 7 and moved to the position of the brush 16 in the soldering apparatus 1 is connected to the drive motor 13. By brushing with the rotating brush 16, the flux of the flux pod 21 is applied to the jet nozzle 2 moved to the position of the flux pod 21. By comprising in this way, cleaning of the jet nozzle 2 can be implemented as a series of operations of the soldering process.
　また、この実施の形態１によれば、はんだ付け装置１がはんだ付け対象物から噴流ノズル清掃装置１０を判別する際に使用する特定形状部１５を備えるので、はんだ付け処理の途中であっても、はんだ付け対象物から噴流ノズル清掃装置１０を的確に判別することができる。 Moreover, according to this Embodiment 1, since the soldering apparatus 1 is equipped with the specific shape part 15 used when discriminating the jet nozzle cleaning apparatus 10 from a soldering target object, even if it is in the middle of a soldering process The jet nozzle cleaning device 10 can be accurately determined from the soldering object.
　さらに、この実施の形態１によれば、板状部材１１Ａが搬送幅の調整機構を有するので、噴流ノズル清掃装置１０を様々な搬送幅で使用することができる。 Furthermore, according to the first embodiment, since the plate-like member 11A has the transport width adjusting mechanism, the jet nozzle cleaning device 10 can be used with various transport widths.
　さらに、この実施の形態１によれば、フラックスポッド２１が、メッシュ１４ａを介在させた開口部を備え、噴流ノズル２の熱で溶融させたフラックス２２を、メッシュ１４ａを介して噴流ノズル２に塗布するので、簡易な構成でフラックス２２を噴流ノズル２に塗布することができる。 Furthermore, according to the first embodiment, the flux pod 21 has an opening with the mesh 14a interposed, and the flux 22 melted by the heat of the jet nozzle 2 is applied to the jet nozzle 2 through the mesh 14a. Therefore, the flux 22 can be applied to the jet nozzle 2 with a simple configuration.
　さらに、この実施の形態１によれば、ブラシ１６が噴流ノズル２をブラッシングして除去した清掃屑を受ける清掃屑受け部２０を備えるので、はんだ付け装置１の内部で清掃屑が飛散することを防止できる。 Furthermore, according to this Embodiment 1, since the brush 16 is provided with the cleaning waste receiving part 20 which receives the cleaning waste removed by brushing the jet nozzle 2, the cleaning waste is scattered inside the soldering apparatus 1. Can be prevented.
実施の形態２．
　図５は、この発明の実施の形態２に係るはんだ付け装置の概要を示す図であり、図１のはんだ付け装置と同様に、スポットはんだ付けを行うはんだ付け装置を示している。図５において、はんだ付け装置１Ａは、噴流ノズル２、はんだ槽３、はんだ流供給部４、ＸＹＺステージ部５、Ｘ軸駆動部５ａ、Ｙ軸駆動部５ｂ、Ｚ軸駆動部５ｃ、搬送経路駆動部６、搬送経路７、センサ８、制御部９Ａ、入出力部９ａおよび噴流ノズル清掃装置１０Ａを備える。 Embodiment 2. FIG.
FIG. 5 is a diagram showing an outline of a soldering apparatus according to Embodiment 2 of the present invention, and shows a soldering apparatus that performs spot soldering similarly to the soldering apparatus of FIG. In FIG. 5, a soldering apparatus 1A includes a jet nozzle 2, a solder bath 3, a solder flow supply unit 4, an XYZ stage unit 5, an X-axis drive unit 5a, a Y-axis drive unit 5b, a Z-axis drive unit 5c, and a conveyance path drive. Unit 6, transport path 7, sensor 8, control unit 9A, input / output unit 9a, and jet nozzle cleaning device 10A.
　実施の形態２に係るはんだ付け装置１Ａでは、装置内部の噴流ノズル２が移動可能な箇所に噴流ノズル清掃装置１０Ａが予め搭載されており、制御部９Ａが、噴流ノズル２の清掃工程を含むはんだ付けアルゴリズムに従って、はんだ付け処理と噴流ノズル２の清掃を制御する。 In the soldering apparatus 1A according to the second embodiment, the jet nozzle cleaning device 10A is mounted in advance at a location where the jet nozzle 2 inside the apparatus can move, and the control unit 9A includes solder including a cleaning process of the jet nozzle 2. The soldering process and the cleaning of the jet nozzle 2 are controlled according to the attaching algorithm.
　制御部９Ａは、上記実施の形態１と同様に、はんだ流供給部４、Ｘ軸駆動部５ａ、Ｙ軸駆動部５ｂ、Ｚ軸駆動部５ｃおよび搬送経路駆動部６の動作を制御するとともに、噴流ノズル清掃装置１０Ａの駆動モータ１３の駆動を制御する制御部である。
　例えば、マイクロコンピュータシステムやプログラマブルコントローラで構成されて、メモリに記憶した上記アルゴリズムに従うプログラムを実行し、入出力部９ａで受け付けた設定値に応じて各構成要素の動作を制御する。
　なお、実施の形態２では、噴流ノズル清掃装置１０Ａが装置内部の所定箇所に予め搭載されているので、制御部９Ａが、所定の清掃タイミングで噴流ノズル２を清掃することができる。 The control unit 9A controls the operations of the solder flow supply unit 4, the X-axis drive unit 5a, the Y-axis drive unit 5b, the Z-axis drive unit 5c, and the conveyance path drive unit 6 as in the first embodiment. It is a control part which controls the drive of the drive motor 13 of 10 A of jet nozzle cleaning apparatuses.
For example, it is composed of a microcomputer system or a programmable controller, executes a program according to the algorithm stored in the memory, and controls the operation of each component according to the set value received by the input / output unit 9a.
In the second embodiment, since the jet nozzle cleaning device 10A is mounted in advance at a predetermined location inside the device, the control unit 9A can clean the jet nozzle 2 at a predetermined cleaning timing.
　また、入出力部９ａは、装置外部と制御部９の間のデータのやり取りを行う入出力部である。例えば、タッチパネルなどの入力装置と液晶モニタなどの表示装置で構成され、入出力部９ａを介してヒーターの温度設定などが行われ、清掃回数や清掃タイミングが表示される。 The input / output unit 9a is an input / output unit that exchanges data between the outside of the apparatus and the control unit 9. For example, it is composed of an input device such as a touch panel and a display device such as a liquid crystal monitor, the heater temperature is set via the input / output unit 9a, and the number of cleanings and the cleaning timing are displayed.
　噴流ノズル清掃装置１０Ａは、図２の構成と同様でかつ同様に機能するが、特定形状部１５の搭載は省略される。
　また、噴流ノズル清掃装置１０Ａは、はんだ付け装置１Ａの内部の搬送経路７以外で、噴流ノズル２が移動可能な箇所に搭載される。例えば、搬送経路７の搬送面と同一平面上で搬送経路７に隣接した箇所などが挙げられる。
　なお、図５において、上述した構成要素以外は図１と同様である。 The jet nozzle cleaning device 10A functions in the same manner as in the configuration of FIG. 2, but the mounting of the specific shape portion 15 is omitted.
Moreover, 10 A of jet nozzle cleaning apparatuses are mounted in the location which can move the jet nozzle 2 except the conveyance path | route 7 inside 1 A of soldering apparatuses. For example, the location adjacent to the conveyance path | route 7 on the same plane as the conveyance surface of the conveyance path | route 7 etc. are mentioned.
5 is the same as FIG. 1 except for the components described above.
　次に動作について説明する。
　図６は、実施の形態２に係るはんだ付け装置のはんだ付け処理を示すフローチャートであり、この図６に沿って実施の形態２に係るはんだ付け装置１Ａによるはんだ付け処理の詳細を説明する。
　まず、制御部９Ａは、はんだ流供給部４のヒーターを制御してはんだ槽３のはんだ材と噴流ノズル２を加熱し、はんだ槽３に形成された溶融はんだをはんだ流供給部４のポンプで噴流ノズル２に送ってはんだ噴流の形成を開始する（ステップＳＴ１）。
　次に、制御部９Ａは、搬送経路駆動部６を制御して、搬送経路７上のはんだ付け対象物が配置された搬送フレームＡを搬送入口１ａ側から搬送出口１ｂへ向けて搬送する（ステップＳＴ２）。
　搬送フレームＡが搬送経路７の所定位置まで搬送されると、制御部９Ａは、Ｘ軸駆動部５ａ、Ｙ軸駆動部５ｂ、Ｚ軸駆動部５ｃを制御して、はんだ付け対象物のはんだ付け処理箇所に噴流ノズル２を移動させ（ステップＳＴ３）、当該はんだ付け処理箇所に対して、はんだ噴流ではんだ付けを行う（ステップＳＴ４）。 Next, the operation will be described.
FIG. 6 is a flowchart showing a soldering process of the soldering apparatus according to the second embodiment. Details of the soldering process by the soldering apparatus 1A according to the second embodiment will be described with reference to FIG.
First, the control unit 9A controls the heater of the solder flow supply unit 4 to heat the solder material of the solder bath 3 and the jet nozzle 2, and the molten solder formed in the solder bath 3 is pumped by the pump of the solder flow supply unit 4. It is sent to the jet nozzle 2 to start forming a solder jet (step ST1).
Next, the control unit 9A controls the conveyance path driving unit 6 to convey the conveyance frame A on which the soldering object on the conveyance path 7 is arranged from the conveyance inlet 1a side toward the conveyance outlet 1b (step). ST2).
When the transport frame A is transported to a predetermined position on the transport path 7, the control unit 9A controls the X-axis drive unit 5a, the Y-axis drive unit 5b, and the Z-axis drive unit 5c to solder the soldering object. The jet nozzle 2 is moved to the processing location (step ST3), and the soldering processing location is soldered with a solder jet (step ST4).
　また、制御部９Ａは、噴流ノズル２の清掃を行う所定の清掃タイミングであるか否かを判定する（ステップＳＴ５）。例えば、所定数の搬送フレームＡのはんだ付け対象物についてはんだ付け処理を実施した場合に噴流ノズル２を清掃する、あるいは、所定数のはんだ付け箇所に対してはんだ付け処理を実施した場合に噴流ノズル２を清掃する。
　所定の清掃タイミングでなければ（ステップＳＴ５；ＮＯ）、ステップＳＴ２の処理に戻り、次のはんだ付け対象物に対するはんだ付け処理を実施する。 Moreover, 9 A of control parts determine whether it is the predetermined cleaning timing which cleans the jet nozzle 2 (step ST5). For example, the jet nozzle 2 is cleaned when a soldering process is performed on a predetermined number of objects to be soldered on the transport frame A, or when a soldering process is performed on a predetermined number of soldering locations. Clean 2
If the predetermined cleaning timing is not reached (step ST5; NO), the process returns to step ST2, and the soldering process for the next soldering object is performed.
　所定の清掃タイミングである場合（ステップＳＴ５；ＹＥＳ）、制御部９Ａは、噴流ノズル清掃装置１０Ａを用いた噴流ノズル２の清掃処理を実施する（ステップＳＴ６）。
　噴流ノズル２の清掃が完了すると、制御部９Ａは、全てのはんだ付け対象物に対して、はんだ付け処理を行ったか否かを判定する（ステップＳＴ７）。例えば、入出力部９ａを介して設定されたはんだ付け対象物の数に達したか否かを判定する。 When it is a predetermined cleaning timing (step ST5; YES), the control unit 9A performs the cleaning process of the jet nozzle 2 using the jet nozzle cleaning device 10A (step ST6).
When the cleaning of the jet nozzle 2 is completed, the control unit 9A determines whether or not the soldering process has been performed on all the soldering objects (step ST7). For example, it is determined whether the number of soldering objects set via the input / output unit 9a has been reached.
　はんだ付け処理が未実施のはんだ付け対象物がある場合（ステップＳＴ７；ＮＯ）、制御部９Ａは、ステップＳＴ２の処理に戻り、次のはんだ付け対象物に対するはんだ付け処理を実施する。また、全てのはんだ付け対象物についてのはんだ付け処理が完了している場合（ステップＳＴ７；ＹＥＳ）、はんだ付け処理を終了する。ここで、制御部９Ａは、ポンプを停止して噴流ノズル２のはんだ噴流を終了し、ヒーターを制御してはんだ槽３と噴流ノズル２の加熱を停止する。 When there is a soldering target for which soldering processing has not been performed (step ST7; NO), the control unit 9A returns to step ST2 and performs the soldering processing for the next soldering target. Moreover, when the soldering process about all the soldering objects is completed (step ST7; YES), the soldering process is terminated. Here, the control unit 9A stops the pump to end the solder jet of the jet nozzle 2, and controls the heater to stop the heating of the solder tank 3 and the jet nozzle 2.
　次に、上述したステップＳＴ６における噴流ノズル２の清掃処理の詳細を説明する。
　図７は、実施の形態２に係るはんだ付け装置の噴流ノズルの清掃処理を示すフローチャートである。
　所定の清掃タイミングになると、制御部９Ａは、はんだ流供給部４のポンプを停止して噴流ノズル２におけるはんだ噴流を停止する（ステップＳＴ１ａ）。
　次に、制御部９Ａは、Ｘ軸駆動部５ａ、Ｙ軸駆動部５ｂ、Ｚ軸駆動部５ｃを制御して、噴流ノズル２を、噴流ノズル清掃装置１０Ａのブラシ１６に配置する（ステップＳＴ２ａ）。例えば、図３（ｂ）に示すように、カップ型のブラシ１６に噴流ノズル２を差し込むように配置する。 Next, details of the cleaning process of the jet nozzle 2 in step ST6 described above will be described.
FIG. 7 is a flowchart showing a cleaning process of the jet nozzle of the soldering apparatus according to the second embodiment.
When the predetermined cleaning timing is reached, the control unit 9A stops the pump of the solder flow supply unit 4 and stops the solder jet in the jet nozzle 2 (step ST1a).
Next, the control unit 9A controls the X-axis drive unit 5a, the Y-axis drive unit 5b, and the Z-axis drive unit 5c to place the jet nozzle 2 on the brush 16 of the jet nozzle cleaning device 10A (step ST2a). . For example, as shown in FIG. 3B, the jet nozzle 2 is arranged so as to be inserted into the cup-shaped brush 16.
　噴流ノズル２を上記所定位置に移動すると、制御部９Ａは、駆動モータ１３を制御して軸部１７周りにブラシ１６を回転させて噴流ノズル２のブラッシングを実施する（ステップＳＴ３ａ）。また、制御部９Ａは、ブラッシングを開始するとタイマを設定して、所定のブラッシング時間が経過したか否かを判定する（ステップＳＴ４ａ）。ここで、所定のブラッシング時間が経過していなければ（ステップＳＴ４ａ；ＮＯ）、ステップＳＴ３ａに戻り、ブラシ１６のブラッシングを継続する。 When the jet nozzle 2 is moved to the predetermined position, the control unit 9A controls the drive motor 13 to rotate the brush 16 around the shaft portion 17 to perform brushing of the jet nozzle 2 (step ST3a). Further, the control unit 9A sets a timer when the brushing is started, and determines whether or not a predetermined brushing time has elapsed (step ST4a). If the predetermined brushing time has not elapsed (step ST4a; NO), the process returns to step ST3a and the brushing of the brush 16 is continued.
　所定のブラッシング時間が経過すると（ステップＳＴ４ａ；ＹＥＳ）、制御部９Ａは、Ｘ軸駆動部５ａ、Ｙ軸駆動部５ｂ、Ｚ軸駆動部５ｃを制御して、噴流ノズル２をフラックスポッド２１へ移動させ、メッシュ１４ａに噴流ノズル２の先端部を押し付ける（ステップＳＴ５ａ）。このとき、制御部９Ａは、噴流ノズル２の位置をフラックスポッド２１へ移動させるとタイマを設定して、所定の塗布時間が経過したか否かを判定する（ステップＳＴ６ａ）。 When a predetermined brushing time has elapsed (step ST4a; YES), the control unit 9A controls the X-axis drive unit 5a, the Y-axis drive unit 5b, and the Z-axis drive unit 5c to move the jet nozzle 2 to the flux pod 21. The tip of the jet nozzle 2 is pressed against the mesh 14a (step ST5a). At this time, the controller 9A sets a timer when the position of the jet nozzle 2 is moved to the flux pod 21, and determines whether or not a predetermined application time has elapsed (step ST6a).
　所定の塗布時間が経過していなければ（ステップＳＴ６ａ；ＮＯ）、制御部９Ａは、ステップＳＴ６ａに戻り、噴流ノズル２の先端部をメッシュ１４ａに押し付ける処理を継続する。また、所定の塗布時間が経過した場合（ステップＳＴ６ａ；ＹＥＳ）、制御部９Ａは、図３（ｄ）で示したように噴流ノズル２の熱で溶解したフラックスがメッシュ１４ａからしみ出して噴流ノズル２の外周に塗布されていると判断し、内部のメモリに記憶されている噴流ノズル２の清掃回数を更新する（ステップＳＴ７ａ）。 If the predetermined application time has not elapsed (step ST6a; NO), the control unit 9A returns to step ST6a and continues the process of pressing the tip of the jet nozzle 2 against the mesh 14a. When a predetermined application time has elapsed (step ST6a; YES), the control unit 9A causes the flux melted by the heat of the jet nozzle 2 to ooze out from the mesh 14a as shown in FIG. 2 and the number of cleanings of the jet nozzle 2 stored in the internal memory is updated (step ST7a).
　次いで、制御部９Ａは、噴流ノズル２の現在の清掃回数および清掃タイミングを入出力部９ａへ出力する。入出力部９ａは、制御部９Ａから入力した現在の清掃回数および清掃タイミングをモニタに表示する（ステップＳＴ８ａ）。作業者は、はんだ付け処理後の製品と、入出力部９ａのモニタに表示された清掃回数および清掃タイミングを参照することにより、適切な清掃回数および清掃タイミングを決定できる。
　上記表示処理が完了すると、制御部９Ａは、はんだ流供給部４のポンプの動作させて噴流ノズル２におけるはんだ噴流を再開（ステップＳＴ９ａ）し、図６のステップＳＴ７へ移行する。 Next, the control unit 9A outputs the current number of cleanings and the cleaning timing of the jet nozzle 2 to the input / output unit 9a. The input / output unit 9a displays the current number of cleanings and cleaning timing input from the control unit 9A on the monitor (step ST8a). The operator can determine an appropriate number of cleanings and cleaning timing by referring to the product after the soldering process and the number of cleanings and the cleaning timing displayed on the monitor of the input / output unit 9a.
When the display processing is completed, the control unit 9A operates the pump of the solder flow supply unit 4 to restart the solder jet in the jet nozzle 2 (step ST9a), and proceeds to step ST7 in FIG.
　このように、実施の形態２に係るはんだ付け装置１Ａは、ブラシ１６とフラックスポッド２１とを板状部材１１の同一面（裏面）側に設けた噴流ノズル清掃装置１０Ａを用いることで、通常のはんだ付け処理と同様な噴流ノズル２の移動操作によって清掃処理が可能である。また、噴流ノズル清掃装置１０Ａがはんだ付け装置１Ａに内蔵されているので、はんだ付け処理の一連の動作として、所定の清掃タイミングで噴流ノズル２の清掃処理を実施できる。 As described above, the soldering device 1A according to the second embodiment uses a jet nozzle cleaning device 10A in which the brush 16 and the flux pod 21 are provided on the same surface (back surface) side of the plate-like member 11, so that the normal The cleaning process can be performed by moving the jet nozzle 2 in the same manner as the soldering process. In addition, since the jet nozzle cleaning device 10A is built in the soldering device 1A, the jet nozzle 2 can be cleaned at a predetermined cleaning timing as a series of soldering operations.
　以上のように、この実施の形態２によれば、はんだ噴流を形成する噴流ノズル２と、噴流ノズル２を移動させる各軸の駆動部５ａ，５ｂ，５ｃと、回転自在に設けられたブラシ１６、ブラシ１６を回転させる駆動モータ１３およびフラックスを格納するフラックスポッド２１を有する噴流ノズル清掃装置１０Ａと、駆動部５ａ，５ｂ，５ｃを制御してブラシ１６の位置に移動させた噴流ノズル２を、駆動モータ１３により回転するブラシ１６でブラッシングし、駆動部５ａ，５ｂ，５ｃを制御してフラックスポッド２１の位置に移動させた噴流ノズル２にフラックスポッド２１のフラックスを塗布させる制御部９Ａとを備える。このように構成することで、噴流ノズル２の清掃をはんだ付け処理の一連の動作として行うことができる。 As described above, according to the second embodiment, the jet nozzle 2 that forms the solder jet, the drive units 5a, 5b, and 5c of the respective axes that move the jet nozzle 2, and the brush 16 that is rotatably provided. The jet nozzle cleaning device 10A having the drive motor 13 for rotating the brush 16 and the flux pod 21 for storing the flux, and the jet nozzle 2 moved to the position of the brush 16 by controlling the drive units 5a, 5b, 5c, A control unit 9A for applying the flux of the flux pod 21 to the jet nozzle 2 which has been brushed by the brush 16 rotated by the drive motor 13 and controlled to move to the position of the flux pod 21 by controlling the drive units 5a, 5b and 5c. . By comprising in this way, cleaning of the jet nozzle 2 can be performed as a series of operation | movement of a soldering process.
　なお、本発明はその発明の範囲内において、各実施の形態の自由な組み合わせあるいは各実施の形態の任意の構成要素の変形、もしくは各実施の形態において任意の構成要素の省略が可能である。 In the present invention, within the scope of the invention, a free combination of each embodiment, a modification of an arbitrary component of each embodiment, or an omission of any component in each embodiment is possible.
　この発明に係る噴流ノズル清掃装置は、噴流ノズル清掃をはんだ付け処理の一連の動作として行うことができるので、スポットはんだ付けを行うはんだ付け装置に好適である。 Since the jet nozzle cleaning device according to the present invention can perform jet nozzle cleaning as a series of soldering operations, it is suitable for a soldering device that performs spot soldering.
　１，１Ａ　はんだ付け装置、１ａ　搬送入口、１ｂ　搬送出口、２　噴流ノズル、３　はんだ槽、４　はんだ流供給部、５　ＸＹＺステージ部、５ａ　Ｘ軸駆動部、５ｂ　Ｙ軸駆動部、５ｃ　Ｚ軸駆動部、６　搬送経路駆動部、７　搬送経路、８　センサ、９，９Ａ　制御部、９ａ　入出力部、１０，１０Ａ　噴流ノズル清掃装置、１１，１１Ａ　板状部材、１２　ブラシ回転機構部、１３　駆動モータ、１４　フラックス投入口、１４ａ　メッシュ、１５　特定形状部、１６　ブラシ、１７　軸部、１８　ベアリング部、１９ａ　第１のギア、１９ｂ　第２のギア、２０　清掃屑受け部、２１　フラックスポッド、２２　フラックス、２３　サイド片、２４ａ，２４ｂ　幅調整用ナット、２５　幅調整用ネジ。 1,1A soldering device, 1a transfer inlet, 1b transfer outlet, 2 jet nozzle, 3 solder bath, 4 solder flow supply unit, 5 XYZ stage unit, 5a X axis drive unit, 5b Y axis drive unit, 5c Z axis drive Section, 6 transport path drive section, 7 transport path, 8 sensor, 9, 9A control section, 9a input / output section, 10, 10A jet nozzle cleaning device, 11, 11A plate member, 12 brush rotation mechanism section, 13 drive motor , 14 flux inlet, 14a mesh, 15 specific shape part, 16 brush, 17 shaft part, 18 bearing part, 19a first gear, 19b second gear, 20 cleaning waste receiving part, 21 flux pod, 22 flux, 23 Side pieces, 24a, 24b Width adjusting nut, 25 Width adjusting screw.

Claims (7)

  1. 　移動自在に設けられた噴流ノズルを備え、搬送経路を搬送されるはんだ付け対象物まで前記噴流ノズルを移動させ、当該噴流ノズルで形成されたはんだ噴流ではんだ付けを行うはんだ付け装置に使用される噴流ノズル清掃装置において、
    　前記搬送経路で搬送可能な板状部材と、
    　前記板状部材に回転自在に設けられたブラシと、
    　前記ブラシを回転させる駆動部と、
    　前記板状部材に設けられ、フラックスを格納するフラックス格納部とを備え、
    　前記搬送経路を搬送されて前記はんだ付け装置内で、前記ブラシの位置に移動した前記噴流ノズルを、前記駆動部により回転する前記ブラシでブラッシングし、前記フラックス格納部の位置に移動した当該噴流ノズルに前記フラックス格納部のフラックスを塗布することを特徴とする噴流ノズル清掃装置。     Used in a soldering apparatus that includes a jet nozzle that is movably provided, moves the jet nozzle to an object to be soldered that is transported along a transport path, and performs soldering with a solder jet formed by the jet nozzle. In the jet nozzle cleaning device,
    A plate-like member that can be transported along the transport path;
    A brush rotatably provided on the plate member;
    A drive unit for rotating the brush;
    Provided in the plate-like member, comprising a flux storage section for storing flux;
    The jet nozzle that has been transported through the transport path and moved to the position of the brush in the soldering apparatus is brushed by the brush rotated by the drive unit and moved to the position of the flux storage unit. A jet nozzle cleaning device, wherein the flux in the flux storage portion is applied to the nozzle.
  2. 　前記はんだ付け装置が前記はんだ付け対象物から前記噴流ノズル清掃装置を判別する際に使用する特定形状部を備えることを特徴とする請求項１記載の噴流ノズル清掃装置。 The jet nozzle cleaning device according to claim 1, further comprising a specific shape portion used when the soldering device discriminates the jet nozzle cleaning device from the soldering object.
  3. 　前記板状部材は、搬送幅の調整機構を備えることを特徴とする請求項１記載の噴流ノズル清掃装置。 The jet nozzle cleaning device according to claim 1, wherein the plate-like member includes a conveyance width adjusting mechanism.
  4. 　前記フラックス格納部は、
    　メッシュを介在させた開口部を備え、
    　前記噴流ノズルの熱で溶融させたフラックスを、前記メッシュを介して当該噴流ノズルに塗布することを特徴とする請求項１記載の噴流ノズル清掃装置。     The flux storage part
    With an opening with a mesh interposed,
    The jet nozzle cleaning device according to claim 1, wherein a flux melted by heat of the jet nozzle is applied to the jet nozzle through the mesh.
  5. 　前記ブラシが前記噴流ノズルをブラッシングして除去した清掃屑を受ける清掃屑受け部を備えることを特徴とする請求項１記載の噴流ノズル清掃装置。 The jet nozzle cleaning device according to claim 1, wherein the brush includes a cleaning waste receiving portion that receives cleaning waste removed by brushing the jet nozzle.
  6. 　はんだ噴流を形成する噴流ノズルと、
    　前記噴流ノズルを移動させるノズル移動部と、
    　回転自在に設けられたブラシ、前記ブラシを回転させる駆動部およびフラックスを格納するフラックス格納部を有する噴流ノズル清掃装置と、
    　前記ノズル移動部を制御して前記ブラシの位置に移動させた前記噴流ノズルを、前記駆動部により回転する前記ブラシでブラッシングし、前記ノズル移動部を制御して前記フラックス格納部の位置に移動させた前記噴流ノズルに前記フラックス格納部のフラックスを塗布させる制御部とを備えるはんだ付け装置。     A jet nozzle for forming a solder jet;
    A nozzle moving section for moving the jet nozzle;
    A jet nozzle cleaning device having a brush provided rotatably, a drive unit for rotating the brush, and a flux storage unit for storing flux;
    The jet nozzle that has been moved to the position of the brush by controlling the nozzle moving unit is brushed by the brush that is rotated by the drive unit, and is moved to the position of the flux storage unit by controlling the nozzle moving unit. And a control unit that applies the flux of the flux storage unit to the jet nozzle.
  7. 　はんだ噴流を形成する噴流ノズルと、前記噴流ノズルを移動させるノズル移動部と、回転自在に設けられたブラシ、前記ブラシを回転させる駆動部およびフラックスを格納するフラックス格納部を有する噴流ノズル清掃装置と、前記ノズル移動部および前記駆動部を制御する制御部とを備えるはんだ付け装置の噴流ノズル清掃方法において、
    　前記制御部が、はんだ噴流を停止させた前記噴流ノズルを前記ノズル移動部を制御して前記ブラシの位置に移動させるステップと、
    　前記制御部が、前記駆動部により回転する前記ブラシで前記噴流ノズルをブラッシングするステップと、
    　前記制御部が、ブラッシングされた前記噴流ノズルを前記ノズル移動部を制御して前記フラックス格納部の位置に移動させてフラックスを塗布させるステップとを備えることを特徴とする噴流ノズル清掃方法。     A jet nozzle cleaning device having a jet nozzle that forms a solder jet, a nozzle moving unit that moves the jet nozzle, a brush that is rotatably provided, a drive unit that rotates the brush, and a flux storage unit that stores flux. In the jet nozzle cleaning method of a soldering apparatus comprising the nozzle moving unit and a control unit for controlling the driving unit,
    The control unit controlling the nozzle moving unit to move the jet nozzle that has stopped the solder jet to the position of the brush;
    The control unit brushing the jet nozzle with the brush rotated by the drive unit;
    The jet nozzle cleaning method, comprising: a step of controlling the nozzle moving unit to move the brushed jet nozzle to a position of the flux storage unit to apply the flux.
PCT/JP2012/003063 2012-05-10 2012-05-10 Spray nozzle cleaning device, soldering device, and spray nozzle cleaning method WO2013168198A1 (en)

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