JP5583304B2 - Jet nozzle cleaning device, soldering device, and jet nozzle cleaning method - Google Patents

Description

  The present invention relates to a jet nozzle cleaning device that cleans a small-diameter jet nozzle for spot soldering, a soldering device including the same, and a jet nozzle cleaning method.

2. Description of the Related Art Conventionally, there has been known a soldering apparatus that performs spot soldering on a terminal of an electronic component by jetting molten solder with a small-diameter jet nozzle.
In this soldering apparatus, if soldering is performed for a long time without cleaning the jet nozzle, the surface of the jet nozzle is oxidized and oxides and carbides are adhered, and the solder jet is disturbed. When turbulence occurs in the solder jet, it causes soldering unevenness and the soldering quality is deteriorated.

  As a conventional technique for removing solder attached to a small-diameter nozzle, for example, there is a nozzle cleaning unit described in Patent Document 1. This cleaning unit is a unit in which a rotating drum with a wiper made of a brush attached to the outer periphery is provided in a liquid tank in which cleaning liquid is stored, and the rotating drum is rotated with the tip of the nozzle pressed against the wiper. Then, the nozzle is cleaned while the solder is dissolved with the cleaning liquid.

Japanese Patent Laid-Open No. 2003-311229

  In conventional jet nozzle cleaning, it is common to finish the soldering process once and lower the temperature around the jet nozzle sufficiently, then brush the jet nozzle manually and apply flux. . As described above, conventionally, since it is necessary to lower the temperature around the jet nozzle every time the jet nozzle is cleaned, there is a problem that the working efficiency of the entire soldering process is deteriorated.

  Moreover, although the cleaning unit described in Patent Document 1 can be used for cleaning the jet nozzle instead of manual work, it is necessary to completely end the soldering process once and sufficiently lower the temperature around the jet nozzle. Therefore, the deterioration of work efficiency cannot be solved.

  The present invention has been made to solve the above-described problems, and is a jet nozzle cleaning device capable of performing cleaning of a jet nozzle as a series of operations of a soldering process, a soldering device including the same, and a jet nozzle The purpose is to obtain a cleaning method.

  The jet nozzle cleaning device according to the present invention includes a jet nozzle that is movably provided, moves the jet nozzle to an object to be soldered that is transported through a transport path, and is soldered by a solder jet formed by the jet nozzle. In a jet nozzle cleaning device used for a soldering apparatus for performing a soldering, a plate-shaped member that can be transported in a transport path, a brush that is rotatably provided on the plate-shaped member, a drive unit that rotates the brush, and a plate-shaped member And a flux storage section that stores the flux, brushes the jet nozzle that has been transported through the transport path and moved to the position of the brush in the soldering apparatus with a brush that is rotated by the drive section, and the flux storage section. The flux in the flux storage section is applied to the jet nozzle that has moved to the position.

  According to the present invention, the jet nozzle can be cleaned as a series of soldering operations.

It is a figure which shows the outline | summary of the soldering apparatus which concerns on Embodiment 1 of this invention. It is a figure which shows the jet nozzle cleaning apparatus which concerns on Embodiment 1. FIG. It is a figure which shows the outline | summary of the nozzle cleaning by the jet nozzle cleaning apparatus which concerns on Embodiment 1. FIG. It is a figure which shows an example of the conveyance width adjustment mechanism of the jet nozzle cleaning apparatus which concerns on Embodiment 1. FIG. It is a figure which shows the outline | summary of the soldering apparatus which concerns on Embodiment 2 of this invention. 10 is a flowchart showing a soldering process of the soldering apparatus according to the second embodiment. 6 is a flowchart showing a cleaning process for a jet nozzle of a soldering apparatus according to a second embodiment.

Hereinafter, in order to describe the present invention in more detail, modes for carrying out the present invention will be described with reference to the accompanying drawings.
Embodiment 1 FIG.
FIG. 1 is a diagram showing an outline of a soldering apparatus according to Embodiment 1 of the present invention, and shows a soldering apparatus that performs spot soldering. In FIG. 1, a soldering apparatus 1 includes a jet nozzle 2, a solder bath 3, a solder flow supply unit 4, an XYZ stage unit 5, an X-axis drive unit 5a, a Y-axis drive unit 5b, a Z-axis drive unit 5c, and a conveyance path drive. Unit 6, a conveyance path 7, a sensor 8, a control unit 9, and an input / output unit 9a.

The jet nozzle 2 is a small-diameter jet nozzle that performs spot soldering on a printed circuit board that is an object to be soldered. A cylindrical portion for collecting molten solder is provided around the jet nozzle 2, and the molten solder flows from the opening of the jet nozzle 2 over the entire outer periphery to the inside of the cylindrical portion. A solder jet having a corresponding outer diameter is formed.
The solder bath 3 is a solder bath for storing molten solder, and the opening is closed so that the inside of the bath is not exposed to the outside as shown in FIG.

  The solder flow supply unit 4 is a component that forms molten solder in the solder tank 3 and supplies the molten solder to the jet nozzle 2. For example, a heater that forms molten solder by heating a solder material introduced into the solder tank 3 And a heater that heats the jet nozzle 2, a pump that forms a solder flow of molten solder, and a solder flow path that supplies the molten solder that has become a solder flow to the jet nozzle 2. The heater temperature adjustment and pump drive control are performed by the control unit 9 described later.

The XYZ stage unit 5 moves the solder tank 3 having the jet nozzle 2 and the solder flow supply unit 4 in the X-axis direction, the Y-axis direction, and the Z-axis direction.
The X-axis drive unit 5a is a drive unit that moves the solder tank 3 having the jet nozzle 2 and the solder flow supply unit 4 along the X-axis direction, and includes, for example, a motor and a drive gear mechanism. Similarly, the Y-axis drive unit 5b is a drive unit that moves the solder bath 3 and the solder flow supply unit 4 along the Y-axis direction, and the Z-axis drive unit 5c is the solder bath 3 and the solder flow supply unit 4. It is a drive part which moves this along the Z-axis direction.

The conveyance path driving unit 6 is a driving unit that generates a conveyance driving force for conveying an object to be soldered such as a printed circuit board disposed on the conveyance path 7, for example, a motor that drives a conveyance belt conveyor and The drive gear mechanism is used. The transport path driving unit 6 is driven and controlled by a control unit 9 described later.
The conveyance path 7 is a conveyance path through which the conveyance frame A having a predetermined conveyance width is conveyed from the conveyance inlet 1a to the conveyance outlet 1b by the driving force of the conveyance path driving unit 6.

  The sensor 8 is a sensor that detects whether or not the conveyed object that is conveyed on the conveying path 7 is a predetermined soldering object. For example, there is an optical sensor that is arranged in the vicinity of the transport path 7 and detects whether or not the transport frame A has a predetermined shape. Alternatively, the image of the transported object photographed by the camera may be analyzed to detect whether or not the transported object is a predetermined transported object.

  In order to perform a soldering process according to a predetermined soldering algorithm, the control unit 9 includes a solder flow supply unit 4, an X-axis drive unit 5 a, a Y-axis drive unit 5 b, a Z-axis drive unit 5 c, and a conveyance path drive unit 6. It is a control part which controls operation | movement. For example, it is composed of a microcomputer system, a programmable controller, etc., executes a program according to the algorithm stored in the memory, and controls the operation of each component according to the set value received by the input / output unit 9a. Moreover, the control part 9 is the operation | movement which cleans the jet nozzle 2, if the specific shape part of the jet nozzle cleaning apparatus mentioned later is detected by the sensor 8 instead of the predetermined shape which the conveyance frame A arrange | positions the soldering target object. Enter mode.

  The input / output unit 9 a is an input / output unit that exchanges data between the outside of the apparatus and the control unit 9. For example, it is composed of an input device such as a touch panel and a display device such as a liquid crystal monitor, and the temperature of the heater is set via the input / output unit 9a.

  FIG. 2 is a diagram illustrating the jet nozzle cleaning device according to the first embodiment, and FIG. 2A is a top view of the jet nozzle cleaning device according to the first embodiment. Moreover, FIG.2 (b) is a side view of the jet nozzle cleaning apparatus which concerns on Embodiment 1, and has shown the cross section partially cut by the aa line | wire of Fig.2 (a). Furthermore, FIG.2 (c) has shown the back surface of the jet nozzle cleaning apparatus which concerns on Embodiment 1. FIG. As shown in FIG. 2A, in the jet nozzle cleaning device 10, the brush rotation mechanism unit 12, the drive motor 13, and the specific shape unit 15 are arranged on the plate member 11, and the plate member 11 The flux inlet 14 is formed.

The plate-like member 11 is a plate-like member for carrying the jet nozzle cleaning device 10 into the soldering device 1 via the conveyance path 7. For example, the plate-like member 11 is conveyed at least with the conveyance frame A for conveyance in the conveyance path 7. The width is formed with the same dimension.
The brush rotation mechanism unit 12 is a mechanism unit that rotates the brush 16 by the rotational force of the drive motor 13, and has an internal configuration as shown in FIG. That is, the brush 16, the shaft portion 17, the bearing portion 18, the first gear 19 a and the second gear 19 b are provided.

The brush 16 is a cup-type wire brush whose inner diameter dimension of the recess is approximately the same as the outer diameter of the jet nozzle 2, and is provided coaxially on one end side of the shaft portion 17. For the brush 16, for example, a wire brush made of SUS is used to brush the outer periphery of the high-temperature jet nozzle 2.
The brush 16 may be a micro-spiral brush or the like as an inner diameter brush for brushing the opening of the jet nozzle 2 in addition to a cup-type brush.

The shaft portion 17 is a shaft portion that is inserted into the plate-like member 11 with the brush 16 facing the back surface side and is rotatably attached to the plate-like member 11 via the bearing portion 18.
The first gear 19a is a gear provided coaxially at the other end of the shaft portion 17, and meshes with the second gear 19b. The second gear 19b is a gear that is provided on the output shaft of the drive motor 13 and transmits the rotational force of the drive motor 13 to the first gear 19a.

Further, the flux inlet 14 communicates with the flux pod 21 shown in FIGS. 2B and 2C, and the flux to be applied to the jet nozzle 2 is introduced.
The flux pod 21 is a flux storage unit that stores a flux to be applied to the jet nozzle 2 brushed by the brush 16. The mesh 14 a is a mesh stretched in an opening formed in the bottom surface portion of the flux pod 21. The flux pod 21 stores a paste-like flux so that the flux does not drip from the mesh 14a until the flux melting temperature is reached.
For the mesh 14a and the flux pod 21, a corrosion-resistant member such as stainless steel (SUS) is used so that it does not change even when the flux is stored.

  The specific shape portion 15 is provided so as to protrude from the outer shape of the plate-like member 11 and is a member for discriminating the jet nozzle cleaning device 10 from a normal soldering object. For example, whether or not the specific shape portion 15 is detected by the sensor 8 when the jet nozzle cleaning device 10 is disposed at a predetermined position in the transport path 7 via the plate-like member 11 having the same shape as the normal transport frame A Based on the normal soldering object, the jet nozzle cleaning device 10 is identified. Thereby, even if the jet nozzle cleaning device 10 is conveyed in the middle of the soldering process, the jet nozzle cleaning device 10 can be accurately determined and the process can proceed to the jet nozzle 2 cleaning process.

  Further, a cleaning waste receiving portion 20 is provided on the back side of the plate-like member 11. For example, as shown in FIGS. 2B and 2C, the cleaning waste receiving portion 20 is formed as a standing wall that rises from the back surface of the plate-like member 11 so as to surround the brush 16. When the jet nozzle 2 is brushed while rotating the brush 16, oxides and carbides scattered around the brush 16 from the surface of the jet nozzle 2 are blocked by the standing wall of the cleaning waste receiving portion 20 and scattered to the surroundings. Is prevented.

Next, the operation will be described.
The jet nozzle cleaning device 10 according to the first embodiment cleans the jet nozzle 2 by being arranged in the conveying path 7 of the soldering device 1 shown in FIG.
For example, the soldering apparatus 1 carries out the jet nozzle cleaning apparatus 10 while carrying out the soldering process by sequentially carrying the soldering objects arranged on the carrying frame A, so that the jet nozzle 2 is cleaned. Transition.

  First, when the jet nozzle cleaning device 10 is transported to a predetermined position in the soldering device 1 through the transport path 7, the specific shape portion 15 is detected by the sensor 8. The sensor 8 outputs a detection signal of the specific shape portion 15 to the control portion 9. When receiving the detection signal of the specific shape portion 15 from the sensor 8, the control portion 9 controls the solder flow supply portion 4 to stop the solder jet flow of the jet nozzle 2.

Next, the control unit 9 controls the X-axis drive unit 5a, the Y-axis drive unit 5b, and the Z-axis drive unit 5c, thereby moving the jet nozzle 2 into the jet nozzle cleaning device 10 as shown in FIG. The brush 16 is arranged. At this time, the jet nozzle cleaning device 10 is arranged in the conveying path 7 with the brush portion 16 rotated about the shaft portion 17 as a rotation axis, or is driven by remote control or the like when the jet nozzle 2 is arranged on the brush 16. The motor 13 is driven. Thereby, as shown in FIG.3 (b), the outer periphery of the jet nozzle 2 is brushed by the rotating brush 16. FIG.
The oxide or carbide removed from the outer periphery of the jet nozzle 2 by brushing is scattered around the rotating brush 16 and received by the cleaning waste receiving portion 20.

  When a predetermined brushing time has elapsed, the control unit 9 controls the X-axis drive unit 5a, the Y-axis drive unit 5b, and the Z-axis drive unit 5c to cause the jet nozzle 2 to be fluxed as shown in FIG. Move to the pod 21 and press the tip of the jet nozzle 2 against the mesh 14a until a predetermined application time has elapsed. At this time, since the jet nozzle 2 is maintained at a high temperature by the heater, the flux 22 around the mesh 14a out of the flux stored in the flux pod 21 is melted by the heat of the jet nozzle 2, and FIG. As shown, the flux 22 exudes from the mesh 14a. The flux 22 can be applied to the outer periphery of the jet nozzle 2 after brushing by setting the time for the flux 22 that has exuded from the mesh 14a to sufficiently spread to the outer periphery of the jet nozzle 2 as the predetermined application time.

  As described above, the jet nozzle cleaning device 10 according to the first embodiment includes the brush 16 that removes oxides and carbides attached to the jet nozzle 2, and the flux pod 21 that applies flux to the jet nozzle 2 after brushing. Since it is provided on the back side of the plate-like member 11 having the same dimensions as the transport frame A, the jet nozzle 2 is cleaned as a series of soldering processes by moving the jet nozzle 2 in the same manner as the normal soldering process. it can. Further, even during the normal soldering process of the soldering object, the jet nozzle cleaning device 10 can be determined based on whether or not the specific shape portion 15 is detected.

In the soldering apparatus 1, the transport width of the transport path 7 may be changed according to the specifications of the soldering object. Therefore, a mechanism for adjusting the conveyance width may be provided so that the jet nozzle cleaning device 10 can be used with various conveyance widths.
FIG. 4 is a diagram illustrating an example of a conveyance width adjusting mechanism in the jet nozzle cleaning device. FIG. 4A shows a state where the conveyance width is narrowed, and FIG. 4B shows a state where the conveyance width is widened.
In the example of FIG. 4, side pieces 23 are provided on both sides in the width direction of the plate-like member 11A as the conveyance width adjusting mechanism. The side piece 23 is screwed to the side surface of the plate-like member 11 </ b> A by a width adjusting screw 25, and by adjusting the interval between the width adjusting nuts 24 a and 24 b screwed to the width adjusting screw 25, It is possible to approach and separate from the side surface of the member 11A. In addition, if this invention is a mechanism which can change the conveyance width of the jet nozzle cleaning apparatus 10, it will not be limited to the structure shown in FIG.

  As described above, according to the first embodiment, the plate-like member 11 that can be conveyed by the conveyance path 7, the brush 16 that is rotatably provided on the plate-like member 11, and the drive motor 13 that rotates the brush 16. The flux nozzle 21 provided in the plate-like member 11 for storing the flux, and the jet nozzle 2 that has been transported through the transport path 7 and moved to the position of the brush 16 in the soldering apparatus 1 is connected to the drive motor 13. By brushing with the rotating brush 16, the flux of the flux pod 21 is applied to the jet nozzle 2 moved to the position of the flux pod 21. By comprising in this way, cleaning of the jet nozzle 2 can be implemented as a series of operations of the soldering process.

  Moreover, according to this Embodiment 1, since the soldering apparatus 1 is equipped with the specific shape part 15 used when discriminating the jet nozzle cleaning apparatus 10 from a soldering target object, even if it is in the middle of a soldering process The jet nozzle cleaning device 10 can be accurately determined from the soldering object.

  Further, according to the first embodiment, since the plate-like member 11A has the conveyance width adjusting mechanism, the jet nozzle cleaning device 10 can be used with various conveyance widths.

  Furthermore, according to the first embodiment, the flux pod 21 has an opening with the mesh 14a interposed, and the flux 22 melted by the heat of the jet nozzle 2 is applied to the jet nozzle 2 through the mesh 14a. Therefore, the flux 22 can be applied to the jet nozzle 2 with a simple configuration.

  Furthermore, according to this Embodiment 1, since the brush 16 is provided with the cleaning waste receiving part 20 which receives the cleaning waste removed by brushing the jet nozzle 2, the cleaning waste is scattered inside the soldering apparatus 1. Can be prevented.

Embodiment 2. FIG.
FIG. 5 is a diagram showing an outline of a soldering apparatus according to Embodiment 2 of the present invention, and shows a soldering apparatus that performs spot soldering similarly to the soldering apparatus of FIG. In FIG. 5, a soldering apparatus 1A includes a jet nozzle 2, a solder bath 3, a solder flow supply unit 4, an XYZ stage unit 5, an X-axis drive unit 5a, a Y-axis drive unit 5b, a Z-axis drive unit 5c, and a conveyance path drive. Unit 6, transport path 7, sensor 8, control unit 9A, input / output unit 9a, and jet nozzle cleaning device 10A.

  In the soldering apparatus 1A according to the second embodiment, the jet nozzle cleaning device 10A is mounted in advance at a location where the jet nozzle 2 inside the apparatus can move, and the control unit 9A includes solder including a cleaning process of the jet nozzle 2. The soldering process and the cleaning of the jet nozzle 2 are controlled according to the attaching algorithm.

The control unit 9A controls the operations of the solder flow supply unit 4, the X-axis drive unit 5a, the Y-axis drive unit 5b, the Z-axis drive unit 5c, and the conveyance path drive unit 6 as in the first embodiment. It is a control part which controls the drive of the drive motor 13 of 10 A of jet nozzle cleaning apparatuses.
For example, it is composed of a microcomputer system or a programmable controller, executes a program according to the algorithm stored in the memory, and controls the operation of each component according to the set value received by the input / output unit 9a.
In the second embodiment, since the jet nozzle cleaning device 10A is mounted in advance at a predetermined location inside the device, the control unit 9A can clean the jet nozzle 2 at a predetermined cleaning timing.

  The input / output unit 9 a is an input / output unit that exchanges data between the outside of the apparatus and the control unit 9. For example, it is composed of an input device such as a touch panel and a display device such as a liquid crystal monitor, the heater temperature is set via the input / output unit 9a, and the number of cleanings and the cleaning timing are displayed.

The jet nozzle cleaning device 10A functions in the same manner as in the configuration of FIG. 2, but the mounting of the specific shape portion 15 is omitted.
Moreover, 10 A of jet nozzle cleaning apparatuses are mounted in the location which can move the jet nozzle 2 except the conveyance path | route 7 inside 1 A of soldering apparatuses. For example, the location adjacent to the conveyance path | route 7 on the same plane as the conveyance surface of the conveyance path | route 7 etc. are mentioned.
5 is the same as FIG. 1 except for the components described above.

Next, the operation will be described.
FIG. 6 is a flowchart showing a soldering process of the soldering apparatus according to the second embodiment. Details of the soldering process by the soldering apparatus 1A according to the second embodiment will be described with reference to FIG.
First, the control unit 9A controls the heater of the solder flow supply unit 4 to heat the solder material of the solder bath 3 and the jet nozzle 2, and the molten solder formed in the solder bath 3 is pumped by the pump of the solder flow supply unit 4. It is sent to the jet nozzle 2 to start forming a solder jet (step ST1).
Next, the control unit 9A controls the conveyance path driving unit 6 to convey the conveyance frame A on which the soldering object on the conveyance path 7 is arranged from the conveyance inlet 1a side toward the conveyance outlet 1b (step). ST2).
When the transport frame A is transported to a predetermined position on the transport path 7, the control unit 9A controls the X-axis drive unit 5a, the Y-axis drive unit 5b, and the Z-axis drive unit 5c to solder the soldering object. The jet nozzle 2 is moved to the processing location (step ST3), and the soldering processing location is soldered with a solder jet (step ST4).

Moreover, 9 A of control parts determine whether it is the predetermined cleaning timing which cleans the jet nozzle 2 (step ST5). For example, the jet nozzle 2 is cleaned when a soldering process is performed on a predetermined number of objects to be soldered on the transport frame A, or when a soldering process is performed on a predetermined number of soldering locations. Clean 2
If the predetermined cleaning timing is not reached (step ST5; NO), the process returns to step ST2, and the soldering process for the next soldering object is performed.

When it is a predetermined cleaning timing (step ST5; YES), the control unit 9A performs the cleaning process of the jet nozzle 2 using the jet nozzle cleaning device 10A (step ST6).
When the cleaning of the jet nozzle 2 is completed, the control unit 9A determines whether or not the soldering process has been performed on all the soldering objects (step ST7). For example, it is determined whether the number of soldering objects set via the input / output unit 9a has been reached.

  When there is a soldering target that has not been subjected to soldering processing (step ST7; NO), the control unit 9A returns to the processing of step ST2 and performs the soldering processing for the next soldering target. Moreover, when the soldering process about all the soldering objects is completed (step ST7; YES), the soldering process is terminated. Here, the control unit 9A stops the pump to end the solder jet of the jet nozzle 2, and controls the heater to stop the heating of the solder tank 3 and the jet nozzle 2.

Next, details of the cleaning process of the jet nozzle 2 in step ST6 described above will be described.
FIG. 7 is a flowchart showing a cleaning process of the jet nozzle of the soldering apparatus according to the second embodiment.
When the predetermined cleaning timing is reached, the control unit 9A stops the pump of the solder flow supply unit 4 and stops the solder jet in the jet nozzle 2 (step ST1a).
Next, the control unit 9A controls the X-axis drive unit 5a, the Y-axis drive unit 5b, and the Z-axis drive unit 5c to place the jet nozzle 2 on the brush 16 of the jet nozzle cleaning device 10A (step ST2a). . For example, as shown in FIG. 3B, the jet nozzle 2 is arranged so as to be inserted into the cup-shaped brush 16.

  When the jet nozzle 2 is moved to the predetermined position, the controller 9A controls the drive motor 13 to rotate the brush 16 around the shaft portion 17 to perform brushing of the jet nozzle 2 (step ST3a). Further, the control unit 9A sets a timer when the brushing is started, and determines whether or not a predetermined brushing time has elapsed (step ST4a). If the predetermined brushing time has not elapsed (step ST4a; NO), the process returns to step ST3a and the brushing of the brush 16 is continued.

  When a predetermined brushing time has elapsed (step ST4a; YES), the control unit 9A controls the X-axis drive unit 5a, the Y-axis drive unit 5b, and the Z-axis drive unit 5c to move the jet nozzle 2 to the flux pod 21. The tip of the jet nozzle 2 is pressed against the mesh 14a (step ST5a). At this time, the controller 9A sets a timer when the position of the jet nozzle 2 is moved to the flux pod 21, and determines whether or not a predetermined application time has elapsed (step ST6a).

  If the predetermined application time has not elapsed (step ST6a; NO), the controller 9A returns to step ST6a and continues the process of pressing the tip of the jet nozzle 2 against the mesh 14a. When a predetermined application time has elapsed (step ST6a; YES), the control unit 9A causes the flux melted by the heat of the jet nozzle 2 to ooze out from the mesh 14a as shown in FIG. 2 and the number of cleanings of the jet nozzle 2 stored in the internal memory is updated (step ST7a).

Next, the control unit 9A outputs the current number of cleanings and the cleaning timing of the jet nozzle 2 to the input / output unit 9a. The input / output unit 9a displays the current number of cleanings and cleaning timing input from the control unit 9A on the monitor (step ST8a). The operator can determine an appropriate number of cleanings and cleaning timing by referring to the product after the soldering process and the number of cleanings and the cleaning timing displayed on the monitor of the input / output unit 9a.
When the display processing is completed, the control unit 9A operates the pump of the solder flow supply unit 4 to restart the solder jet in the jet nozzle 2 (step ST9a), and proceeds to step ST7 in FIG.

  As described above, the soldering device 1A according to the second embodiment uses a jet nozzle cleaning device 10A in which the brush 16 and the flux pod 21 are provided on the same surface (back surface) side of the plate-like member 11, so that the normal The cleaning process can be performed by moving the jet nozzle 2 in the same manner as the soldering process. In addition, since the jet nozzle cleaning device 10A is built in the soldering device 1A, the jet nozzle 2 can be cleaned at a predetermined cleaning timing as a series of soldering operations.

  As described above, according to the second embodiment, the jet nozzle 2 that forms the solder jet, the drive units 5a, 5b, and 5c of the respective axes that move the jet nozzle 2, and the brush 16 that is rotatably provided. The jet nozzle cleaning device 10A having the drive motor 13 for rotating the brush 16 and the flux pod 21 for storing the flux, and the jet nozzle 2 moved to the position of the brush 16 by controlling the drive units 5a, 5b, 5c, A control unit 9A for applying the flux of the flux pod 21 to the jet nozzle 2 which has been brushed by the brush 16 rotated by the drive motor 13 and controlled to move to the position of the flux pod 21 by controlling the drive units 5a, 5b and 5c. . By comprising in this way, cleaning of the jet nozzle 2 can be performed as a series of operation | movement of a soldering process.

  In the present invention, within the scope of the invention, a free combination of each embodiment, a modification of an arbitrary component of each embodiment, or an optional component in each embodiment can be omitted.

  Since the jet nozzle cleaning device according to the present invention can perform jet nozzle cleaning as a series of operations of soldering processing, it is suitable for a soldering device that performs spot soldering.

  1, 1A Soldering device, 1a transfer inlet, 1b transfer outlet, 2 jet nozzle, 3 solder tank, 4 solder flow supply unit, 5 XYZ stage unit, 5a X axis drive unit, 5b Y axis drive unit, 5c Z axis drive Unit, 6 transport path drive unit, 7 transport path, 8 sensor, 9, 9A control unit, 9a input / output unit, 10, 10A jet nozzle cleaning device, 11, 11A plate member, 12 brush rotation mechanism unit, 13 drive motor , 14 Flux inlet, 14a mesh, 15 specific shape part, 16 brush, 17 shaft part, 18 bearing part, 19a first gear, 19b second gear, 20 cleaning waste receiving part, 21 flux pod, 22 flux, 23 Side piece, 24a, 24b Width adjusting nut, 25 Width adjusting screw.

Claims (7)

Used in a soldering apparatus that includes a jet nozzle that is movably provided, moves the jet nozzle to an object to be soldered that is transported along a transport path, and performs soldering with a solder jet formed by the jet nozzle. In the jet nozzle cleaning device,
A plate-like member that can be transported along the transport path;
A brush rotatably provided on the plate member;
A drive unit for rotating the brush;
Provided in the plate-like member, comprising a flux storage section for storing flux;
The jet nozzle that has been transported through the transport path and moved to the position of the brush in the soldering apparatus is brushed by the brush rotated by the drive unit and moved to the position of the flux storage unit. A jet nozzle cleaning device, wherein the flux in the flux storage portion is applied to the nozzle.   The jet nozzle cleaning device according to claim 1, further comprising a specific shape portion used when the soldering device discriminates the jet nozzle cleaning device from the soldering object.   The jet nozzle cleaning apparatus according to claim 1, wherein the plate-like member includes a conveyance width adjusting mechanism. The flux storage part
With an opening with a mesh interposed,
The jet nozzle cleaning device according to claim 1, wherein a flux melted by heat of the jet nozzle is applied to the jet nozzle through the mesh.   The jet nozzle cleaning device according to claim 1, wherein the brush includes a cleaning waste receiving portion that receives cleaning waste removed by brushing the jet nozzle. A jet nozzle for forming a solder jet;
A nozzle moving section for moving the jet nozzle;
A jet nozzle cleaning device having a brush provided rotatably, a drive unit for rotating the brush, and a flux storage unit for storing flux;
The jet nozzle that has been moved to the position of the brush by controlling the nozzle moving unit is brushed by the brush that is rotated by the drive unit, and is moved to the position of the flux storage unit by controlling the nozzle moving unit. And a control unit that applies the flux of the flux storage unit to the jet nozzle. A jet nozzle cleaning device having a jet nozzle that forms a solder jet, a nozzle moving unit that moves the jet nozzle, a brush that is rotatably provided, a drive unit that rotates the brush, and a flux storage unit that stores flux. In the jet nozzle cleaning method of a soldering apparatus comprising the nozzle moving unit and a control unit for controlling the driving unit,
The control unit controlling the nozzle moving unit to move the jet nozzle that has stopped the solder jet to the position of the brush;
The control unit brushing the jet nozzle with the brush rotated by the drive unit;
The jet nozzle cleaning method, comprising: a step of controlling the nozzle moving unit to move the brushed jet nozzle to a position of the flux storage unit to apply the flux.

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