WO2013021933A1

WO2013021933A1 - Lighting device, display device, and television receiver

Info

Publication number: WO2013021933A1
Application number: PCT/JP2012/069810
Authority: WO
Inventors: 真之助野澤
Original assignee: シャープ株式会社
Priority date: 2011-08-09
Filing date: 2012-08-03
Publication date: 2013-02-14

Abstract

This backlight device (12) is provided with: LEDs (17); an LED board (18) on which the LEDs (17) are mounted; a chassis (14) on which the LED board (18) is disposed; a wiring pattern (31), which is disposed on a board surface (18b) of the LED board (18) on which the LEDs (17) are mounted, and is electrically connected to the LEDs (17); and a solder resist layer (32), which is laminated on the wiring pattern (31) on the LED board (18), and has a thickness that is relatively thinly formed in areas positioned toward the center from areas positioned on the ends of the chassis (14), compared to the areas positioned toward the ends.

Description

Lighting device, display device, and television receiver

The present invention relates to a lighting device, a display device, and a television receiver.

In recent years, image display devices such as television receivers are shifting from conventional cathode ray tubes to thin display devices to which thin display elements such as liquid crystal panels and plasma display panels are applied. When a liquid crystal panel is used as the display element, the liquid crystal panel does not emit light, and thus a backlight device is separately required as a lighting device.

Patent Document 1 discloses a backlight device that includes an LED mounted on a surface of a mounting substrate as a light source, and the surface of the mounting substrate is covered with a light reflecting member. The light reflecting member is made of a material obtained by further adding a high light reflecting material having a high light reflectance to a white solder resist, and is obtained by printing and applying the material onto the mounting surface of the mounting substrate. Has been. According to such a backlight device, it is possible to suppress the absorption of light on the surface of the mounting substrate, and to improve the luminance and reduce the occurrence of luminance unevenness.

JP 2011-90977 A

(Problems to be solved by the invention)
By the way, when the light emitting portion of the backlight device is viewed from the front side, there is a portion that is darkly shown at the end of the light emitting portion due to insufficient light quantity, which is a problem. This is because the number of light sources that supply light to the region is smaller at the end of the backlight device than at the center.

In order to make the luminance of the light emitting unit uniform, for example, the current value for driving the LED is changed, and the luminance of the LED arranged on the end side of the backlight device is changed to that of the LED arranged on the central side. It can be considered to be relatively higher than the luminance. However, such a method requires special electrical control, and a simpler method is required.

The present invention has been completed based on the above situation, and aims to make the luminance uniform with a simple configuration.

(Means for solving the problem)
In order to solve the above problems, an illumination device according to the present invention includes a light source, a light source board on which the light source is mounted, a chassis on which the light source board is disposed, and the light source among the light source boards. A pattern wiring electrically connected to the light source, and a reflection layer laminated on at least a part of the pattern wiring on the light source substrate, the layer thickness of which is the chassis And a reflective layer formed relatively thin in a portion located closer to the center than a portion located on the end portion side than a portion located on the end portion side.

In the present invention, the reflective layer is formed so that the thickness of the reflection layer is relatively thinner than the portion located on the end side of the chassis, in the portion located on the center side from the portion located on the end side. Thus, the light reflectance on the central portion side of the chassis can be lower than that on the end portion side, and conversely, the light reflectance on the end portion side of the chassis can be made higher than that on the central portion side. For this reason, even when a region where the light source cannot be arranged on the end side of the chassis occurs, the luminance on the end side of the chassis can be relatively high, and the luminance of the lighting device can be increased. It can be made uniform.

In the above configuration, the reflective layer may be made of a white solder resist.

With such a configuration, a solder resist necessary for ensuring the insulating properties of the substrate can be used as the reflective layer, so that the configuration is simple and the manufacturing cost can be reduced.

In the above configuration, the lens member diffuses light, the lens member is disposed on a plate surface on which the light source of the light source substrate is mounted, and covers a light emitting side of the light source, and the reflective layer includes at least the reflection layer It may be formed in a portion overlapping with the lens member.

With such a configuration, since the reflective layer is formed at least in a portion overlapping with the lens member, the light reflected by the reflective layer enters the lens member, and a part thereof is in the end direction of the light emitting portion. Thus, the luminance at the end of the light emitting part can be made relatively higher.

In the above configuration, the reflection sheet reflects light, and has an opening that is larger than the outer shape of the lens member. The lens member is inserted through the opening, and the light source of the light source substrate is mounted. A reflective sheet disposed on the plate surface, and the reflective layer may be formed at least in a portion overlapping the opening.

With such a configuration, in the reflection sheet, the light is efficiently reflected on the light emitting surface side, and the reflection layer is formed at least in a portion overlapping with the opening of the reflection sheet. Therefore, the light entering the opening is reflected. The light can be reflected by the layer, and the luminance of the end portion of the light emitting portion can be further increased.

The said structure WHEREIN: The said light source substrate has at least the 1st light source substrate distribute | arranged to the said edge part side, and the 2nd light source substrate distribute | arranged to the said center part side, The said light source substrate formed in the said 1st light source substrate The thickness of the reflective layer formed on the second light source substrate may be thinner than the thickness of the reflective layer.

If the thickness of the reflective layer is made different for each light source substrate in this way, the thickness of the reflective layer can be easily made different between the end portion side and the central portion side of the chassis.

In the above configuration, the chassis has a rectangular bottom plate, the first light source substrate and the second light source substrate have a strip shape, and the long side of the bottom plate extends along the longitudinal direction of the strip shape. , Each of which can be arranged on the bottom plate surface in parallel with the strip-like short direction.

With such a configuration, the first light source substrate can be disposed in the vicinity of the long side of the bottom plate, and the luminance on the long side of the bottom plate in the light emitting portion is relatively high. it can.

In the above configuration, the chassis has a rectangular bottom plate, the first light source substrate and the second light source substrate have a strip shape, and the longitudinal direction of the strip shape extends along the short side of the bottom plate. , Each of which can be arranged on the bottom plate surface in parallel with the strip-like short direction.

With such a configuration, the first light source substrate can be disposed close to the short side of the bottom plate, and the luminance on the short side of the bottom plate in the light emitting portion is relatively high. it can.

In the above configuration, one or a plurality of the second light source substrates are arranged in a row, and among the second light source substrates arranged in the row, the center side is closer to the layer thickness on the end side of the row. It can be assumed that the layer thickness is formed thin.

With such a configuration, among the second light source substrates arranged in a row, the layer thickness on the center side is thinner than the layer thickness on the end side of the row, so the luminance on the end side is reduced. It can be made relatively high, and the luminance on the side where the end side of the light emitting part is arranged can be made relatively high.

In the above configuration, a light guide member having a light incident surface provided on a side surface and a light emitting surface provided on one plate surface, and the light emitted from the light source is incident on the light incident surface And a light guide member that is emitted from the light exit surface, and the light source substrate is disposed with a plate surface on which the light source is mounted facing the light incident surface of the light guide member. It can be.

With such a configuration, the light source substrate is disposed with the plate surface on which the light source is mounted facing the light incident surface of the light guide member, so that the light reflected by the reflective layer enters the light guide member. And the brightness of the light emitting part can be made uniform.

In the above configuration, the reflective layer may have a thickness of 5 μm or more and 30 μm or less at a portion located on the center side.

With such a configuration, since the thickness of the reflective layer in the portion located on the central portion side of the chassis is 5 μm or more, the substrate can be sufficiently protected in the portion located on the central portion side. . Moreover, since the layer thickness of the reflective layer in the portion located on the central portion side is 30 μm or less, the reflectance of the portion located on the end portion side and the portion located on the central portion side can be easily set.

The said structure WHEREIN: The said chassis has the light-projection part which radiate | emits the light from the said light source, It further comprises the optical member distribute | arranged in the form which covers the said light-projection part, The said optical member is from the said light source. A diffusion plate having a function of diffusing the light, and an optical sheet having at least one of a function of condensing the light transmitted through the diffusion plate and a function of diffusing the light transmitted through the diffusion plate Can be.

With such a configuration, the light emitted from the light emitting portion of the chassis is transmitted through the diffusion plate and the optical sheet, and the luminance of the illumination device can be made even more uniform.

In the above configuration, the light source may include a light emitting diode.

With such a configuration, it is possible to achieve high brightness by using a light emitting diode as a light source.

Next, in order to solve the above problem, a display device of the present invention includes the above-described illumination device and a display panel that performs display using light from the illumination device.

According to such a display device, since the luminance of the lighting device that supplies light to the display panel is uniform, it is possible to realize display with excellent display quality.

A liquid crystal panel can be exemplified as the display panel. Such a display device can be applied as a liquid crystal display device to various uses such as a display of a television or a personal computer, and is particularly suitable for a large screen.

(The invention's effect)
ADVANTAGE OF THE INVENTION According to this invention, the illuminating device which can make a brightness | luminance uniform can be provided.

1 is an exploded perspective view showing a schematic configuration of a television receiver according to Embodiment 1 of the present invention. The exploded perspective view which shows schematic structure of the liquid crystal display device with which a television receiver is equipped The top view which shows the arrangement configuration of the LED board in the chassis with which a liquid crystal display device is equipped, and a diffusion member Sectional view taken along line iv-iv in FIG. 3 in the liquid crystal display device FIG. 3 is a cross-sectional view taken along the line v-v in FIG. An enlarged plan view showing the arrangement configuration of the solder resist layer Vi-vi sectional view of FIG. Plan view of LED board Vii-vii sectional view of FIG. The top view which shows the arrangement configuration of a 1st LED board and a 2nd LED board (it abbreviate | omits and shows a reflection sheet) Graph showing the relationship between the thickness of the solder resist layer and the reflectance of light The top view which shows the arrangement configuration of the 1st LED board which concerns on Embodiment 2, and a 2nd LED board (a reflection sheet is abbreviate | omitted and shown) The top view which shows the 2nd LED board distribute | arranged to the edge part side among 3 2nd LED boards arrange | positioned to 1 line. The graph which shows typically the film thickness of the 2nd LED board of FIG. The top view which shows the arrangement configuration of the 1st LED board and 2nd LED board which concern on Embodiment 3 (a reflection sheet is abbreviate | omitted and shown) The top view which shows the arrangement configuration of the 1st LED board and 2nd LED board which concern on Embodiment 4 (a reflection sheet is abbreviate | omitted and shown) The top view which shows the arrangement configuration of the LED board which concerns on Embodiment 5 (a reflection sheet is abbreviate | omitted and shown) FIG. 7 is an exploded perspective view illustrating a schematic configuration of a liquid crystal display device included in a television receiver according to a sixth embodiment. Sectional view showing the liquid crystal display device cut in the short side direction Plan view of LED board The graph which shows typically the film thickness of the LED substrate of FIG.

<Embodiment 1>
A first embodiment of the present invention will be described with reference to FIGS. In this embodiment, the liquid crystal display device 10 is illustrated. A part of each drawing shows an X-axis, a Y-axis, and a Z-axis, and the directions of the axes are drawn in common directions in the drawings. Moreover, let the upper side shown in FIG.4 and FIG.5 be a front side, and let the lower side of the figure be a back side.

As shown in FIG. 1, the television receiver TV according to the present embodiment includes a liquid crystal display device 10, front and back cabinets Ca and Cb that are accommodated so as to sandwich the liquid crystal display device 10, a power source P, a tuner T, And a stand S. The liquid crystal display device (display device) 10 has a horizontally long rectangular shape (rectangular shape) as a whole and is accommodated in a vertically placed state. As shown in FIG. 2, the liquid crystal display device 10 includes a liquid crystal panel 11 that is a display panel and a backlight device (illumination device) 12 that is an external light source, which are integrated by a frame-like bezel 13 or the like. Is supposed to be retained.

Next, the liquid crystal panel 11 and the backlight device 12 constituting the liquid crystal display device 10 will be described. Among these, the liquid crystal panel (display panel) 11 has a rectangular shape in plan view, and a pair of glass substrates are bonded together with a predetermined gap therebetween, and liquid crystal is sealed between the glass substrates. It is said. One glass substrate is provided with a switching element (for example, TFT) connected to a source wiring and a gate wiring orthogonal to each other, a pixel electrode connected to the switching element, an alignment film, and the like. The substrate is provided with a color filter and counter electrodes in which colored portions such as R (red), G (green), and B (blue) are arranged in a predetermined arrangement, and an alignment film. A polarizing plate is disposed on the outside of both substrates.

Subsequently, the backlight device 12 will be described. As shown in FIG. 2, the backlight device 12 has a substantially box-shaped chassis 14 having an opening 14b (light emitting portion) for emitting light from a light source on the light emitting portion 12a side (liquid crystal panel 11 side). And an optical member 15 group (a diffusing plate 15 a and a plurality of optical sheets 15 b arranged between the diffusing plate 15 a and the liquid crystal panel 11) arranged so as to cover the opening 14 b of the chassis 14, A frame 16 is provided along the outer edge portion and holds the outer edge portion of the group of optical members 15 between the chassis 14 and the frame 16. Further, in the chassis 14, as shown in FIGS. 3 to 5, an LED 17 (Light Emitting で Diode) as a light source, an LED substrate 18 (light source substrate) on which the LED 17 is mounted, and an LED substrate 18 A diffusion lens 19 (lens member) attached at a position corresponding to the LED 17 is provided. In addition, the chassis 14 includes a holding member 20 that can hold the LED board 18 between the chassis 14 and a reflection sheet 21 that reflects light in the chassis 14 toward the optical member 15. . In the backlight device 12, the optical member 15 side is closer to the light emitting portion 12 a side than the LED 17. Below, each component of the backlight apparatus 12 is demonstrated.

The chassis 14 is made of metal and, as shown in FIGS. 3 to 5, has a rectangular bottom plate 14a similar to the liquid crystal panel 11, a side plate 14c rising from an outer end of each side of the bottom plate 14a, and each side plate 14c. And a receiving plate 14d projecting outward from the rising edge, and as a whole, has a shallow substantially box shape (substantially shallow dish shape) opened toward the front side. The long side direction of the chassis 14 matches the X-axis direction, and the short side direction matches the Y-axis direction. A frame 16 and an optical member 15 to be described below can be placed on each receiving plate 14d in the chassis 14 from the front side. The frame 16 is screwed to the receiving plate 14d. In addition, an attachment hole for attaching the holding member 20 is provided in the bottom plate 14a of the chassis 14 so as to open.

As shown in FIG. 2, the optical member 15 has a horizontally long rectangular shape (rectangular shape) in a plan view, like the liquid crystal panel 11 and the chassis 14. As shown in FIGS. 4 and 5, the optical member 15 has its outer edge portion placed on the receiving plate 14 d so as to cover the opening 14 b of the chassis 14 and be interposed between the liquid crystal panel 11 and the LED 17. Arranged. The optical member 15 includes a diffusion plate 15a disposed on the back side (the side opposite to the LED 17 side and the light emitting unit 12a side), and an optical sheet 15b disposed on the front side (the liquid crystal panel 11 side and the light emitting unit 12a side). Consists of The diffusing plate 15a has a structure in which a large number of diffusing particles are dispersed in a substantially transparent resin base material having a predetermined thickness, and has a function of diffusing transmitted light. The optical sheet 15b has a sheet shape that is thinner than the diffusion plate 15a, and two optical sheets 15b are laminated. Specific types of the optical sheet 15b include, for example, a diffusion sheet, a lens sheet, a reflective polarizing sheet, and the like, which can be appropriately selected and used.

As shown in FIG. 2, the frame 16 has a frame shape along the outer peripheral edge portions of the liquid crystal panel 11 and the optical member 15. An outer edge portion of the optical member 15 can be sandwiched between the frame 16 and each receiving plate 14d (FIGS. 4 and 5). The frame 16 can receive the outer edge portion of the liquid crystal panel 11 from the back side, and can sandwich the outer edge portion of the liquid crystal panel 11 with the bezel 13 disposed on the front side (FIGS. 4 and 5). ).

Next, the LED 17 and the LED board 18 on which the LED 17 is mounted will be described. As shown in FIG. 7, the LED 17 has a configuration in which an LED chip is sealed with a resin material on a substrate portion fixed to the LED substrate 18. The LED chip mounted on the substrate unit has one main emission wavelength, and specifically, one that emits blue light in a single color is used. On the other hand, a phosphor that converts blue light emitted from the LED chip into white light is dispersed and blended in the resin material for sealing the LED chip. As a result, the LED 17 can emit white light. The LED 17 is a so-called top type in which a surface opposite to the mounting surface with respect to the LED substrate 18 is a light emitting surface 17a. The optical axis LA of the LED 17 is set to substantially coincide with the Z-axis direction (direction orthogonal to the main plate surfaces of the liquid crystal panel 11 and the optical member 15). Note that the light emitted from the LED 17 spreads radially to some extent within a predetermined angle range around the optical axis LA, but its directivity is higher than that of a cold cathode tube or the like. That is, the emission intensity of the LED 17 shows an angular distribution that tends to decrease as the direction along the optical axis LA is high and the tilt angle with respect to the optical axis LA increases.

As shown in FIGS. 8 and 9, the LED substrate 18 includes a base material 30 that is rectangular (strip-shaped) in plan view, and the long side direction is the X-axis direction (the bottom plate 14 a of the chassis 14 is (Long side direction) and the short side direction matches the Y-axis direction (short side direction of the bottom plate 14a of the chassis 14) and is accommodated while extending along the bottom plate 14a in the chassis 14 (see FIG. 3 to 5). The substrate 30 of the LED substrate 18 is made of a metal such as an aluminum material same as the chassis 14, and a pattern wiring 31 made of a metal film such as a copper foil is formed on the surface of the substrate 30 via an insulating layer (not shown). Is done. The pattern wiring 31 is disposed on the side of the plate surface 18b (the plate surface on which the light source is mounted) on which the LED 17 is mounted, and is electrically connected to the LED 17. Further, a white solder resist layer 32 (reflection layer) for protecting the wiring is laminated on the surface of the pattern wiring 31. The solder resist layer 32 will be described in detail later. Then, on the surface of the substrate 30 of the LED substrate 18 facing the front side (the surface facing the optical member 15 side), as shown in FIG. ing. A plurality of LEDs 17 are linearly arranged in parallel along the long side direction (X-axis direction) of the LED substrate 18, and are connected in series by a pattern wiring 31 formed on the LED substrate 18. The arrangement pitch of the LEDs 17 is substantially constant, that is, the LEDs 17 are arranged at equal intervals. Moreover, the connector part 18a is provided in the both ends of the long side direction in the LED board 18. As shown in FIG.

As shown in FIG. 3, the LED substrate 18 having the above-described configuration is arranged in parallel in the chassis 14 in a state where the long side direction and the short side direction are aligned with each other in the X-axis direction and the Y-axis direction. ing. That is, the LED board 18 and the LED 17 mounted thereon are both set in the X-axis direction (the long side direction of the chassis 14 and the LED board 18) in the chassis 14 and in the Y-axis direction (of the chassis 14 and the LED board 18). Matrix arrangement (arranged in a matrix) with the short side direction as the column direction. Specifically, a total of 27 LED substrates 18 are arranged in parallel in the chassis 14, three in the X-axis direction and nine in the Y-axis direction. In the present embodiment, two types of LED substrates 18 having different long side dimensions and the number of mounted LEDs 17 are used. Specifically, as the LED substrate 18, six LEDs 17 are mounted, and the long side dimension is a relatively long six-part mounting type and the five LEDs 17 are mounted, and the long side dimension is relatively long. The short five-mount type is used, one for the six-mount type at the X-axis direction end position of the chassis 14 and one for the five-mount type at the central position in the same direction. , Each is arranged. As described above, the LED boards 18 that form one row along the X-axis direction are electrically connected to each other by fitting and connecting the adjacent connector portions 18a to each other. Connector portions 18a corresponding to both ends in the X-axis direction are electrically connected to external control circuits (not shown). As a result, the LEDs 17 arranged on the LED boards 18 in one row are connected in series, and the lighting / extinction of a large number of LEDs 17 included in the row is collectively controlled by a single control circuit. be able to. In addition, even if it is a kind of LED board 18 from which the long side dimension and the number of LED17 mounted differ, the short side dimension and the arrangement pitch of LED17 are made substantially the same.

In this way, by preparing a plurality of types of LED substrates 18 having different long side dimensions and the number of LEDs 17 to be mounted, and employing a method of appropriately combining and using these different types of LED substrates 18, the following effects can be obtained. Obtainable. That is, when manufacturing various types of liquid crystal display devices 10 having different screen sizes, it is easy to change the appropriateness of the use of each type of LED board 18 and the number of LED boards 18 used for each type according to each screen size. It can correspond to. For this reason, compared with the case where the LED board of the special design which has a long side dimension equivalent to the long side dimension of the chassis 14 is prepared for every screen size, the kind of required LED board 18 can be reduced significantly. Therefore, the manufacturing cost can be reduced.

The diffusing lens 19 is made of a synthetic resin material (for example, polycarbonate or acrylic) that is almost transparent (having high translucency) and has a refractive index higher than that of air. As shown in FIGS. 6 and 7, the diffusing lens 19 is formed in a substantially circular shape when seen in a plan view, and covers each LED 17 individually from the front side with respect to the LED substrate 18, that is, as seen in a plan view. Each is attached so as to overlap with the LED 17. The diffusing lens 19 can emit light having strong directivity emitted from the LED 17 while diffusing. Thereby, it is possible to reduce the number of installed LEDs 17. The diffusing lens 19 is disposed at a position that is substantially concentric with the LED 17 in a plan view. The diffuser lens 19 is sufficiently larger in both the X-axis direction and the Y-axis direction than the LED 17. On the other hand, the diffusing lens 19 has dimensions smaller than the LED substrate 18 in the X-axis direction and the Y-axis direction. Therefore, the LED substrate 18 is disposed in a region overlapping with the diffusing lens 19 in the Z-axis direction.

Of the diffusing lens 19, a surface facing the LED substrate 18 is a light incident surface 19a on which light from the LED 17 is incident, whereas a surface facing the optical member 15 is a light emitting surface 19b that emits light. It is said. Among these, as shown in FIG. 7, the light incident surface 19a is parallel to the plate surface 18b of the LED substrate 18 as a whole. However, the light incident side 19a overlaps with the LED 17 when seen in a plan view. The recess 19c is formed to have an inclined surface. The light incident side concave portion 19c has a substantially conical shape and is disposed at a substantially concentric position in the diffusing lens 19, and is open toward the back side, that is, the LED 17 side. The light incident side concave portion 19c has a substantially inverted V-shaped cross section, and its peripheral surface is an inclined surface inclined with respect to the Z-axis direction. Therefore, the light emitted from the LED 17 and entering the light incident side concave portion 19c enters the diffusion lens 19 through the inclined surface, but at that time, the amount of the inclination angle of the inclined surface with respect to the optical axis LA is as follows. The light is refracted in a direction away from the center, that is, a wide angle, and enters the diffusing lens 19.

The diffusing lens 19 is provided with mounting legs 19 d that project toward the LED substrate 18 and that serve as a structure for attaching the diffusing lens 19 to the LED substrate 18. Three attachment legs 19d are arranged in the diffuser lens 19 at positions closer to the outer peripheral end than the light incident side recess 19c, and the lines connecting the attachments form a substantially equilateral triangle when viewed in a plane. Arranged in position. Each mounting leg 19d has its tip fixed to the LED substrate 18 with an adhesive or the like. The diffusing lens 19 is fixed to the LED substrate 18 via the mounting leg portion 19d, so that a predetermined gap is formed between the light incident surface 19a and the LED substrate 18. In this gap, incidence of light from a space outside the diffusion lens 19 in a plan view is allowed.

The light exit surface 19b of the diffusion lens 19 is formed in a flat and substantially spherical shape. As a result, the light emitted from the diffusing lens 19 can be emitted while being refracted in a direction away from the center at the interface with the external air layer, that is, a wide angle. A light emitting side recess 19e is formed in a region of the light emitting surface 19b that overlaps the LED 17 when seen in a plan view. The light emitting side concave portion 19e has a substantially bowl shape, and is formed in a flat and substantially spherical shape with a peripheral surface having a downward slope toward the center. Further, the angle formed by the tangent of the peripheral surface of the light exit side recess 19e with respect to the optical axis LA of the LED 17 is relatively larger than the angle formed by the inclined surface of the light incident side recess 19c with respect to the optical axis LA. It is said. By forming a light emission side recess 19e in a region of the light emission surface 19b that overlaps the LED 17 when viewed in plan, much of the light from the LED 17 is emitted while being refracted at a wide angle, or one of the light from the LED 17 is The portion can be reflected to the LED substrate 18 side.

The reflection sheet 21 is made of a synthetic resin, and the surface of the reflection sheet 21 is white with excellent light reflectivity. As shown in FIG. 3, the reflection sheet 21 has a size that is laid over almost the entire inner surface of the chassis 14, so that all the LED boards 18 that are arranged in parallel in the chassis 14 are collectively displayed from the front side. And can be covered. The reflection sheet 21 can efficiently raise the light in the chassis 14 toward the optical member 15 side. The reflection sheet 21 extends along the bottom plate 14a of the chassis 14 and covers a large portion of the bottom plate 14a. The reflection sheet 21 rises from each outer end of the bottom portion 21a to the front side and is inclined with respect to the bottom portion 21a. The four rising portions 21b and the extending portions 21c that extend outward from the outer ends of the respective rising portions 21b and are placed on the receiving plate 14d of the chassis 14 are configured. The bottom 21a of the reflection sheet 21 is disposed so as to overlap the front side with respect to the plate surface 18b on which the LEDs 17 of each LED board 18 are mounted. In addition, a lens insertion hole 21d (opening) through which each diffusion lens 19 is inserted is provided in the bottom portion 21a of the reflection sheet 21 at a position overlapping with each diffusion lens 19 (each LED 17) in plan view.

The lens insertion holes 21 d are individually inserted through the respective diffusion lenses 19, and are arranged in a matrix of 9 rows and 17 columns on the bottom 21 a of the reflection sheet 21 in the same manner as the LEDs 17. As shown in FIG. 6, the lens insertion hole 21 d has a circular shape when seen in a plan view, and its diameter is set to be larger than that of the diffusing lens 19. Thereby, when the reflection sheet 21 is laid in the chassis 14, each diffusing lens 19 can be surely passed through each lens insertion hole 21 d regardless of the presence or absence of a dimensional error. Further, the diameter dimension of the lens insertion hole 21 d is set to be smaller than the short side dimension of the LED substrate 18. Thus, the solder resist layer 32 provided on the LED substrate 18 is exposed in the lens insertion hole 21d, and the chassis 14 is not exposed.

The holding member 20 holds the LED substrate 18 and also has a holding member 20B having a support portion 27 that supports the optical member 15, and a holding member that holds the LED substrate 18 but does not have the support portion 27 that supports the optical member 15. Two types, 20A. This support portion 27 can support the optical member 15 (directly the diffusion plate 15a) from the back side, thereby maintaining a constant positional relationship between the LED 17 and the optical member 15 in the Z-axis direction. And inadvertent deformation of the optical member 15 can be restricted.

Next, the configuration related to the solder resist layer 32 will be described in detail. The solder resist layer 32 is obtained by printing and applying a white solder resist having a light reflectivity superior to that of a commonly used green solder resist to a predetermined thickness. As shown in FIG. 9, the solder resist layer 32 is provided over substantially the entire surface of the base material 30 and the pattern wiring 31 of the LED substrate 18 except for the portion where the LEDs 17 are mounted. That is, the solder resist layer 32 is formed in a portion overlapping the diffusing lens 19 as shown in FIG. The solder resist layer 32 faces the light incident surface 19a of the diffusion lens 19 in the Z-axis direction, and is located between the diffusion lens 19 and the base material 30 of the LED substrate 18. Therefore, about the light returned from the diffusion lens 19 side to the LED substrate 18 side, or the light entering the space between the diffusion lens 19 and the LED substrate 18 from the space outside the diffusion lens 19 in a plan view, It can be reflected again by the solder resist layer 32 toward the diffusing lens 19.

Furthermore, as shown in FIG. 6, the solder resist layer 32 is formed on the entire portion overlapping with the opening of the lens insertion hole 21 d of the reflection sheet 21 except for a portion where the LED 17 is mounted in a plan view. Thereby, the solder resist layer 32 is exposed at the opening of the lens insertion hole 21d, and the chassis 14, the base material 30 of the LED substrate 18 or the pattern wiring 31 is hardly exposed.

The layer thickness of the solder resist layer 32 is 5 μm or more in order to sufficiently protect the pattern wiring 31 from external impacts and corrosive substances. Further, as shown in FIG. 11, it is known that the thickness of the solder resist layer 32 is at least in the range from 5 μm to 30 μm, and the light reflectance increases as the layer thickness increases, and from 5 μm to 25 μm. It is known that the tendency is remarkable in the range of. In the present embodiment, the light reflectance of the solder resist layer 32 is an average light reflectance within the measurement diameter measured by CM-700d manufactured by Konica Minolta. In this embodiment, the thickness of the solder resist layer 32 is measured by a film thickness meter DUALSCOPE MPOR-FP manufactured by Fischer.

Here, among the LED boards 18, as shown in FIG. 10, those located in the first and ninth rows in the matrix arrangement of the LED boards 18, that is, located on both end sides in the short side direction of the chassis 14. The one to be used is the first LED substrate 34 (first light source substrate). Further, among the LED boards 18, those located in the second to eighth lines, that is, those located closer to the center of the chassis 14 than the first LED board 34 are the second LED boards 35 (second light source boards). And

The layer thickness of the solder resist layer 32 in the first LED substrate 34 is substantially uniform over the substrate surface, and is 30 μm, and its light reflectance is about 90%. On the other hand, the layer thickness of the solder resist layer 32 in the second LED substrate 35 is substantially uniform over the substrate surface and is 15 μm, and its light reflectance is about 83%. That is, the layer thickness of the second LED substrate 35 is relatively thinner than the layer thickness of the first LED substrate 34, and the light reflectance of the first LED substrate 34 is relatively larger than the light reflectance of the second LED substrate 35. It is considered expensive. The layer thickness of the second LED substrate 35 is preferably set to a thickness of 5 μm to 30 μm in designing the light reflectance of the LED substrate 18, and is set to a thickness of 5 μm to 25 μm. More preferably.

As shown in FIG. 3, the solder resist layer 32 is exposed from the lens insertion holes 21 d arranged in a matrix of 9 rows and 17 columns in the backlight device 12. The solder resist layers 32 arranged on the first LED substrate 34 are located on both ends of the short side direction (Y-axis direction) of the chassis 14 in plan view among the lens insertion holes 21d arranged in a matrix. It will be exposed from the lens insertion hole 21d located in the eye and the ninth row. In addition, the solder resist layer 32 disposed on the second LED substrate 35 is exposed from the lens insertion holes 21d located in the second to eighth rows of the lens insertion holes 21d arranged in a matrix. That is, the solder resist layers 32 arranged on the first LED substrate 34 are dotted along the long side of the chassis 14 and in the vicinity thereof.

When the liquid crystal display device 10 is used, each LED 17 provided in the backlight device 12 is turned on and an image signal is supplied to the liquid crystal panel 11. Thereby, a predetermined image is displayed on the display surface of the liquid crystal panel 11. The light emitted as each LED 17 is turned on first enters the light incident surface 19 a of the diffusing lens 19. At this time, most of the light is incident on the inclined surface of the light incident side recess 19c in the light incident surface 19a, so that the light enters the diffusing lens 19 while being refracted at a wide angle according to the inclination angle. The incident light propagates through the diffusing lens 19 and then exits from the light exit surface 19b. Since the light exit surface 19b has a flat, substantially spherical shape, an external air layer is formed. Light is emitted while being refracted at a wider angle at the interface. In addition, in the light emitting surface 19b, in the region where the amount of light from the LED 17 is the largest, a light emitting side concave portion 19e having a substantially bowl shape is formed, and the peripheral surface has a flat and substantially spherical shape. Light can be emitted while being refracted at a wide angle on the peripheral surface of the light emitting side recess 19e, or reflected to the LED substrate 18 side.

Part of the light emitted from the diffusing lens 19 is emitted to the light emitting unit 12a side (the liquid crystal panel 11 side) of the backlight device 12 via the optical member 15. On the other hand, a part of the light emitted from the diffusing lens 19 is directed toward the reflection sheet 21 or the solder resist layer 32 and is reflected by the reflection sheet 21 or the solder resist layer 32, and again, the light emission part 12a side (liquid crystal Panel 11 side).

As described above, the backlight device 12 of the present embodiment includes the LED 17, the LED board 18 on which the LED 17 is mounted, the chassis 14 on which the LED board 18 is disposed, and the LED 17 among the LED boards 18. A pattern wiring 31 disposed on the plate surface 30 a and electrically connected to the LED 17, and a solder resist layer 32 laminated on the pattern wiring 31 on the LED substrate 18, the layer thickness of which is The solder resist layer 32 is formed so as to be relatively thin in a portion located closer to the center than a portion located on the end portion side than a portion located on the end portion side.

In the present embodiment, the layer thickness of the solder resist layer 32 is located closer to the center than the portion located on both ends in the short side direction (Y-axis direction) of the chassis 14. Since the light reflection rate at the central portion side of the chassis is lower than that at the end portion side, the light reflection at both end portions in the short side direction (Y-axis direction) of the chassis 14 is reversed. The rate can be made higher than the center side. For this reason, even when the area | region which cannot arrange | position LED17 to the edge part side in the short side direction (Y-axis direction) of the chassis 14 arises, the edge part in the short side direction (Y-axis direction) of the chassis 14 The luminance of the light emitting portion 12a of the backlight device 12 can be made uniform.

Specifically, when the backlight device 12 is viewed from the light emitting portion 12a side, the rising portion 21b of the reflection sheet 21 is formed in a region overlapping with both ends of the light emitting portion 12a in the Y-axis direction, as shown in FIG. It is arranged, LED17 is not arranged. On the other hand, an LED 17 is disposed immediately below the region overlapping the central portion of the light emitting portion 12a in the Y-axis direction. For this reason, even if the light emitted from the LED 17 is diffused by the diffusing lens 19 in the backlight device 12, the amount of light directed toward both ends in the Y-axis direction of the light emitting portion 12a is small. In particular, backlight devices in recent years tend to be thin and have a narrow frame. In such backlight devices, there is a remarkable shortage of light amount toward the peripheral end of the light emitting portion.
On the other hand, in the present embodiment, among the lens insertion holes 21d arranged in a matrix, the first row and the ninth row are located at both ends in the short side direction (Y-axis direction) of the chassis 14 in plan view. The solder resist layer 32 with a light reflectance of about 90% is exposed in the lens insertion hole 21d, and the solder resist layer 32 with a light reflectance of about 83% is exposed in the lens insertion hole 21d located in the second to eighth rows. is doing. For this reason, the amount of light reflected by the solder resist layer 32 located on both ends of the short side direction (Y-axis direction) of the chassis 14 is changed to the amount of light reflected by the solder resist layer 32 located on the center side of the chassis 14. Can be more than That is, the shortage of light amount toward both ends in the Y-axis direction of the light emitting part 12a can be supplemented by the light reflected by the solder resist layer 32.

In this embodiment, the reflective layer provided on the LED substrate 18 is made of the white solder resist layer 32. In this case, since the solder resist layer 32 necessary for ensuring the insulation of the substrate can be used as the reflective layer, the configuration is simple and the manufacturing cost can be reduced.

Further, in this embodiment, the solder resist layer 32 is formed at least in a portion overlapping with the diffusing lens 19. For this reason, the light reflected by the solder resist layer 32 enters the diffusing lens 19, and a part thereof is diffused toward both ends in the Y-axis direction of the light emitting portion 12a of the backlight device 12, The luminance at the end of the light emitting part 12a can be further improved.

In the present embodiment, the solder resist layer 32 is formed at least in a portion overlapping with the lens insertion hole 21d of the reflection sheet 21. For this reason, the light that has entered the lens insertion hole 21d can be reflected by the solder resist layer 32, and the luminance of the end of the light emitting portion 12a can be further improved.

In the present embodiment, the LED substrate 18 includes a first LED substrate 34 and a second LED substrate 35, and is formed on the second LED substrate 35 based on the layer thickness of the solder resist layer 32 formed on the first LED substrate 34. The solder resist layer 32 is formed to be thin. Thus, when the layer thickness of the solder resist layer 32 is made different for each LED substrate 18, the layer thickness of the solder resist layer 32 can be easily made different between the end portion side and the central portion side of the chassis 14.
Specifically, when a printed circuit board such as the LED board 18 is manufactured, the layer thickness of one board is generally made uniform within the plate surface. In the present embodiment, the first LED substrate 34 and the second LED substrate 35 can be individually manufactured by a general method of forming the solder resist layer 32, and the configuration is simple and the manufacturing cost can be reduced.

In the present embodiment, the first LED substrate 34 and the second LED substrate 35 are formed in a strip shape, and the long side of the bottom plate 14a of the chassis 14 is along the longitudinal direction of the strip shape. It is arranged in parallel with the hand direction on the bottom plate 14a surface. For this reason, the 1st LED board 34 can be arrange | positioned close to the long side of the baseplate 14a, and the brightness | luminance of the long side of the baseplate 14a in the light emission part 12a of the backlight apparatus 12 can be improved. In the liquid crystal display device 10, the change in luminance along the short side direction is more visible than the change in luminance along the long side direction. Especially in this embodiment, the brightness | luminance along a short side direction can be made uniform, and the brightness | luminance of the light emission part 12a of the backlight apparatus 12 can be made uniform effectively.

In the present embodiment, the layer thickness of the second LED substrate 35 is set to 5 μm or more and 30 μm or less. For this reason, the layer thickness of the solder resist layer 32 of the 1st LED board 34 and the 2nd LED board 35 will be 5 micrometers or more, and a board | substrate can fully be protected. Further, since the layer thickness of the second LED substrate 35 is 30 μm or less, the desired reflectance can be easily set by making the layer thickness of the first LED substrate 34 larger than the layer thickness of the second LED substrate 35. This is because, in the solder resist layer 32 in the range of at least 5 μm to 30 μm, the change in light reflectance due to the layer thickness is large.

Further, in the present embodiment, since the diffusion plate 15a and the optical sheet 15b are provided, the light emitted from the opening 14b of the chassis 14 is transmitted through the diffusion plate 15a and the optical sheet 15b. The luminance of the light emitting part 12a of the backlight device 12 can be made uniform.

Further, in the present embodiment, the light source is the LED 17 and includes a light emitting diode, so that it is possible to increase the brightness.

<Embodiment 2>
A second embodiment of the present invention will be described with reference to FIGS. In this Embodiment 2, the 2nd LED board 135 and the soldering resist layer 132 which changed the structure of the soldering resist layer 32 of the 2nd LED board 35 are shown. In addition, the overlapping description about the same structure, an effect | action, and effect as above-mentioned Embodiment 1 is abbreviate | omitted.

The layer thickness of the solder resist layer 132 in the first LED substrate 34 is substantially uniform over the substrate surface, and is 30 μm, and its light reflectance is about 90%. On the other hand, the layer thickness of the solder resist layer 132 in the second LED substrate 135 is such that the two second LED substrates 135 arranged in a line along the long side direction (X-axis direction) of the chassis 14 are on both ends of the line. The end side portion 137 disposed on the central portion and the central portion side portion 138 disposed on the central portion side are different from each other.

Here, as shown in FIG. 12, three second LED boards 135 arranged in a line along the long side direction (X-axis direction) of the chassis 14 are arranged from the left in the arrangement order of the lines. These are called the second LED board 135-2 and the second LED board 135-3.
The end side portion 137 is located in the first column among the diffusion lenses 19 arranged in a matrix of 9 rows and 17 columns, and overlaps with the diffusion lens 19 located at the left end of the second LED substrate 135-1. The region is located in the row and overlaps with the diffusion lens 19 located at the right end of the second LED substrate 135-3. That is, the end portion side portion 137 is a portion adjacent to the short side of the chassis 14 in a state where the second LED substrate 135 is disposed on the chassis 14. The center side portion 138 is a portion of the second LED substrate 135 excluding the end side portion 137. That is, the central portion 138 is an area overlapping with the diffusing lens 19 located in the 2nd to 16th rows, that is, a portion on the right side of the diffusing lens 19 adjacent to the diffusing lens 19 at the right end of the second LED substrate 135-1 And the entire second LED substrate 135-2 and a portion on the left side of the diffusion lens 19 adjacent to the diffusion lens 19 at the left end of the second LED substrate 135-3.

The layer thickness of the solder resist layer 132 on the second LED substrate 135 is such that the layer thickness of the central portion 138 is 15 μm, and the light reflectance is about 83%. That is, the layer thickness of the central side portion 138 of the second LED substrate 135 is relatively thinner than the layer thickness of the first LED substrate 34, and the light reflectance of the first LED substrate 34 is that of the second LED substrate 135. The light reflectance of the central portion 138 is relatively higher. The layer thickness of the central side portion 138 of the second LED substrate 135 is preferably set to a thickness of 5 μm to 30 μm in designing the light reflectance of the LED substrate 18. More preferably, the thickness is set.

Furthermore, the layer thickness of the solder resist layer 132 on the second LED substrate 135 is such that the end portion 137 has a layer thickness of 30 μm, and its light reflectance is about 90%. That is, the layer thickness of the central side portion 138 of the second LED boards 135 arranged in a row is relatively thinner than the layer thickness of the end side portion 137, and the light reflection of the end side portion 137 is performed. The rate is relatively higher than the light reflectivity of the central portion 138. Specifically, as shown in FIGS. 13 and 14, the layer thickness and the light reflectance of the solder resist layer 32 of the second LED substrate 135-3 are the end portion 137 located on the right side and the center located on the left side. It changes with the part side part 138. In the second LED board 135-1, the end side part 137 is arranged on the left side and the center side part 138 is arranged on the right side symmetrically with the second LED board 135-3. In order to make the layer thickness of the end side portion 137 thicker than the layer thickness of the central side portion 138, the solder resist is printed on the entire second LED boards 135-1 and 135-3 in the solder resist printing and coating process. The process of apply | coating and the process of printing and apply | coating a soldering resist only to the edge part side part 137 shall be included. That is, the solder resist layer 132 can be easily formed by performing a so-called twice coating process.

As shown in FIG. 3, the solder resist layer 132 is exposed from the lens insertion holes 21 d arranged in a matrix of 9 rows and 17 columns in the backlight device 12. Solder resist layers 132 arranged on the first LED substrate 34 are located at both ends in the short side direction (Y-axis direction) of the chassis 14 in plan view among the lens insertion holes 21d arranged in a matrix. It will be exposed from the lens insertion hole 21d located in the eye and the ninth row. In addition, the solder resist layers 132 disposed on the end portion 137 of the second LED substrate 135 are located at both ends of the chassis 14 in the long side direction (X-axis direction) of the lens insertion holes 21d arranged in a matrix. It will be exposed from the lens insertion hole 21d located in the 1st and 17th columns of the 2nd to 8th rows. Furthermore, the solder resist layer 132 disposed on the central portion 138 of the second LED substrate 135 is positioned in the second to the 17th columns of the second to eighth rows of the lens insertion holes 21d arranged in a matrix. It is exposed from the lens insertion hole 21d. That is, the solder resist layer 132 disposed on the first LED substrate 34 and the solder resist layer 132 disposed on the end side portion 137 of the second LED substrate 135 are pointed along and close to the long side and the short side of the chassis 14. Will exist.

In the present embodiment, three second LED substrates 135 are arranged in a row, and among the second LED substrates 135 arranged in a row, the layer thickness of the central portion side portion 138 is larger than the layer thickness of the end portion portion 137. Thinly formed. For this reason, the luminance of the end portion 137 can be made relatively higher than that of the central portion 138, and the luminance on the short side of the bottom plate 14a of the chassis 14 in the light emitting portion 12a of the backlight device 12 can be reduced. It can be relatively high. That is, the brightness of the long side of the bottom plate 14a of the chassis 14 can be increased by the first LED board 34, and the brightness of the short side can be increased by the end portion portion 137 of the second LED board 135. The luminance can be made relatively high over the entire circumference of the bottom plate 14a of the chassis 14. That is, the shortage of light amount toward the peripheral end portion of the light emitting portion 12 a can be supplemented by the light reflected by the solder resist layer 132.

<Embodiment 3>
Embodiment 3 of the present invention will be described with reference to FIG. In this Embodiment 3, the 1st LED board 234 and the 2nd LED board 235 which changed the arrangement configuration of the 1st LED board 34 and the 2nd LED board 35 are shown. In addition, the overlapping description about the same structure, an effect | action, and effect as above-mentioned Embodiment 1 is abbreviate | omitted.

As shown in FIG. 15, the LED substrate 18 has a base material 30 that has a rectangular shape (strip shape) in plan view, and the long side direction is the Y-axis direction (the short side direction of the bottom plate 14 a of the chassis 14). ) And the short side direction coincides with the X-axis direction (long side direction of the bottom plate 14a of the chassis 14) and is accommodated while extending along the bottom plate 14a in the chassis 14.
As shown in FIG. 15, a plurality of LED substrates 18 are arranged in parallel in the chassis 14 in the X-axis direction with the long side direction and the short side direction aligned with each other. That is, the LED boards 18 are arranged in parallel with the X-axis direction aligned with the alignment direction, and the LEDs 17 mounted on the LED boards 18 are arranged in the X-axis direction (the long side direction of the chassis 14 and the LED board 18 in the chassis 14). The short side direction) is a row direction, and the Y-axis direction (the short side direction of the chassis 14 and the long side direction of the LED substrate 18) is a column direction (arranged in a matrix). Specifically, the LED boards 18 are arranged in parallel in the

chassis

14, 17 in the X-axis direction and 1 in the Y-axis direction. In this embodiment, the LED substrate 18 is a type on which nine LEDs 17 are mounted.

Here, among the LED boards 18, as shown in FIG. 15, the LED boards 18 are positioned on the first and the 17th board in the parallel arrangement of the LED boards 18, that is, positioned on both ends in the long side direction of the chassis 14. This is the first LED substrate 234 (first light source substrate). In addition, among the LED boards 18, the one located between the second board and the 16th board, that is, the one located closer to the center of the chassis 14 than the first LED board 234 is the second LED board 235 (second light source board). And

The layer thickness of the solder resist layer 232 in the first LED substrate 234 is substantially uniform over the substrate surface and is 30 μm, and its light reflectance is about 90%. On the other hand, the layer thickness of the solder resist layer 232 in the second LED substrate 235 is substantially uniform over the substrate surface, being 15 μm, and its light reflectance is about 83%. That is, the layer thickness of the second LED substrate 235 is relatively thinner than the layer thickness of the first LED substrate 234, and the light reflectance of the first LED substrate 234 is relatively larger than the light reflectance of the second LED substrate 235. It is considered expensive. The layer thickness of the second LED substrate 235 is preferably set to a thickness of 5 μm to 30 μm in designing the light reflectance of the LED substrate 18, and is set to a thickness of 5 μm to 25 μm. More preferably.

The solder resist layer 232 is exposed from the lens insertion holes 21 d arranged in a matrix of 9 rows and 17 columns in the backlight device 12. The solder resist layer 232 disposed on the first LED substrate 234 is one row located at both ends of the long side direction (X-axis direction) of the chassis 14 in plan view among the lens insertion holes 21d arranged in a matrix. It will be exposed from the lens insertion hole 21d located in the eye and the 17th row. Further, the solder resist layer 232 disposed on the second LED substrate 235 is exposed from the lens insertion holes 21d located in the second to sixteenth rows among the lens insertion holes 21d arranged in a matrix. That is, the solder resist layer 232 disposed on the first LED substrate 234 is dotted along the short side of the chassis 14 and in proximity thereto.

In the present embodiment, the first LED substrate 234 and the second LED substrate 235 are formed in a strip shape, and the short side of the bottom plate 14a of the chassis 14 extends along the longitudinal direction of the strip shape. Parallel to the bottom plate surface. For this reason, the 1st LED board 234 can be arrange | positioned close to the short side of the baseplate 14a, and the brightness | luminance of the short side of the baseplate 14a in the light emission part 12a of the backlight apparatus 12 can be improved.

<Embodiment 4>
A fourth embodiment of the present invention will be described with reference to FIG. In this Embodiment 4, the 2nd LED board 335 and the soldering resist layer 332 which changed the structure of the soldering resist layer 232 of the 2nd LED board 235 of Embodiment 3 are shown. In addition, the description which overlaps about the structure, an effect | action, and effect similar to above-described embodiment is abbreviate | omitted.

As in the third embodiment, 17 LED boards 18 on which nine LEDs 17 are mounted are arranged in parallel.
Here, as shown in FIG. 16 among the LED boards 18, the LED boards 18 positioned on the first and 17th boards in the parallel arrangement, that is, positioned on both ends in the long side direction of the chassis 14. This is the first LED substrate 334 (first light source substrate). In addition, among the LED boards 18, the one located between the second and 16th boards, that is, the one located closer to the center of the chassis 14 than the first LED board 334 is the second LED board 335 (second light source board). And

The layer thickness of the solder resist layer 332 on the first LED substrate 334 is substantially uniform over the substrate surface, and is 30 μm, and its light reflectance is about 90%. On the other hand, the layer thickness of the solder resist layer 332 in the second LED substrate 335 is the same as that of the second LED substrate 335 arranged along the long side direction in the short side direction (Y-axis direction) of the chassis 14. The end portion side portion 337 disposed on both end sides is different from the central portion side portion 338 disposed on the center portion side.

The end portion 337 is located in the first row of the diffusion lenses 19 arranged in a matrix of 9 rows and 17 columns, and overlaps with the diffusion lens 19 located at the upper end of the second LED substrate 335, and the ninth row. The region overlaps with the diffusion lens 19 located at the lower end of the second LED substrate 335. That is, the end portion 337 is a portion adjacent to the long side of the chassis 14 in a state where the second LED substrate 335 is disposed on the chassis 14. The central portion side portion 338 is a portion of the second LED substrate 335 excluding the end portion side portion 337. That is, the central portion 338 has a region overlapping with the diffuser lens 19 located in the second to eighth rows, that is, from the diffuser lens 19 adjacent to the diffuser lens 19 at the upper end of the second LED substrate 335, to the second LED substrate 335. It is a part to the diffuser lens 19 adjacent to the diffuser lens 19 at the lower end.

The layer thickness of the solder resist layer 332 in the second LED substrate 335 is such that the thickness of the central side portion 338 is 15 μm, and the light reflectance is about 83%. That is, the layer thickness of the central portion side portion 338 of the second LED substrate 335 is relatively thinner than the layer thickness of the first LED substrate 334, and the light reflectance of the first LED substrate 334 is lower than that of the second LED substrate 335. The light reflectance of the center side portion 338 is relatively higher. The layer thickness of the central side portion 338 of the second LED substrate 335 is preferably set to a thickness of 5 μm to 30 μm in designing the light reflectivity of the LED substrate 18. More preferably, the thickness is set.

Furthermore, the layer thickness of the solder resist layer 332 on the second LED substrate 335 is such that the layer thickness of the end portion side portion 337 is 30 μm, and the light reflectance is about 90%. That is, as shown in FIG. 16, the layer thickness of the central side portion 338 of the second LED substrate 335 is relatively thinner than the layer thickness of the end side portion 337. The light reflectance is relatively higher than the light reflectance of the central portion side portion 338.

The solder resist layer 332 is exposed from the lens insertion holes 21 d arranged in a matrix of 9 rows and 17 columns in the backlight device 12. The solder resist layer 332 arranged on the first LED substrate 334 is one row located at both ends of the long side direction (X-axis direction) of the chassis 14 in plan view among the lens insertion holes 21d arranged in a matrix. It will be exposed from the lens insertion hole 21d located in the eye and the 17th row. In addition, the solder resist layer 332 disposed on the end side portion 337 of the second LED substrate 335 is located at both ends in the short side direction (Y-axis direction) of the chassis 14 in the lens insertion holes 21d arranged in a matrix. It will be exposed from the lens insertion hole 21d located in the 2nd to 16th columns of the 1st and 9th rows. Furthermore, the solder resist layer 332 disposed on the central portion 338 of the second LED substrate 335 is positioned in the second to the 17th columns of the second to eighth rows in the lens insertion holes 21d arranged in a matrix. It is exposed from the lens insertion hole 21d. That is, the solder resist layer 332 disposed on the first LED substrate 334 and the solder resist layer 332 disposed on the end side portion 337 of the second LED substrate 335 are pointed along the short side and the long side of the chassis 14. Will exist.

In the present embodiment, the second LED substrate 335 is formed such that, of the second LED substrates 335 arranged in a row, the central portion side portion 338 is thinner than the end portion portion 337. Therefore, the luminance of the end portion 337 can be made relatively higher than that of the central portion 338, and the luminance of the long side of the bottom plate 14a of the chassis 14 in the light emitting portion 12a of the backlight device 12 can be increased. It can be relatively high. That is, the brightness of the short side of the bottom plate 14a of the chassis 14 can be increased by the first LED board 334, and the brightness of the long side can be increased by the end portion side portion 337 of the second LED board 335. The luminance can be made relatively high over the entire circumference of the bottom plate 14a of the chassis 14. That is, the shortage of light amount toward the peripheral end portion of the light emitting portion 12 a can be supplemented by the light reflected by the solder resist layer 332.

<Embodiment 5>
Embodiment 5 of the present invention will be described with reference to FIG. In the fifth embodiment, an LED substrate 418 in which the first LED substrate 334 of the fourth embodiment is changed to the configuration of the second LED substrate 335 is shown. In addition, the description which overlaps about the structure, an effect | action, and effect similar to above-described embodiment is abbreviate | omitted.

As in the third embodiment, 17 LED boards 418 in which nine LEDs 17 are mounted are arranged in parallel.
As shown in FIG. 17, the layer thickness of the solder resist layer 332 on the LED substrate 418 is the length of the LED substrate 418 arranged along the long side direction along the short side direction (Y-axis direction) of the chassis 14. The end portion side portion 437 disposed on both end sides in the side direction is different from the center portion side portion 438 disposed on the center portion side.

The end side portion 437 is located in the first row of the diffusion lenses 19 arranged in a matrix of 9 rows and 17 columns, and overlaps with the diffusion lens 19 located at the upper end of the second LED substrate 335, and the ninth row. It is an area that overlaps with the diffuser lens 19 that is positioned and located at the lower end of the second LED substrate 335. In other words, the end side portion 437 is a portion adjacent to the long side of the chassis 14 in a state where the LED substrate 418 is disposed on the chassis 14. The central portion side portion 438 is a portion of the LED substrate 418 excluding the end portion side portion 437. That is, the central portion side portion 438 extends from the diffusion lens 19 adjacent to the diffusion lens 19 at the upper end of the LED substrate 418 from the region overlapping the diffusion lens 19 located in the second to eighth rows, that is, the lower end of the LED substrate 418. It is a part to the diffuser lens 19 adjacent to the diffuser lens 19.

The layer thickness of the solder resist layer 432 on the LED substrate 418 is 30 μm at the end side portion 437, and the light reflectance is about 90%. On the other hand, the layer thickness of the central portion 438 is 15 μm, and the light reflectance is about 83%. That is, the layer thickness of the central side portion 438 of the LED substrate 418 is relatively thinner than the layer thickness of the end side portion 437, and the light reflectance of the end side portion 438 is the central side portion. The light reflectance is relatively higher than 338. The layer thickness of the central side portion 438 of the LED substrate 418 is preferably set to a thickness of 5 μm to 30 μm in designing the light reflectance of the LED substrate 418, and a thickness of 5 μm to 25 μm. More preferably, it is set.

The solder resist layer 432 is exposed from the lens insertion holes 21 d arranged in a matrix of 9 rows and 17 columns in the backlight device 12. The solder resist layers 432 disposed on the end portion 437 are positioned at both ends of the short side direction (Y-axis direction) of the chassis 14 in a plan view among the lens insertion holes 21d arranged in a matrix. It will be exposed from the lens insertion hole 21d located in the row and the ninth row. In addition, the solder resist layer 432 disposed in the central portion 438 is exposed from the lens insertion holes 21d located in the second to eighth rows of the lens insertion holes 21d arranged in a matrix. That is, the solder resist layer 332 disposed on the end portion side portion 437 of the LED substrate 418 is dotted along the long side of the chassis 14 and close thereto.

In the present embodiment, the thickness of the solder resist layer 432 is relatively thinner in the central portion side portion 438 than in the end portion side portion 437 in the short side direction (Y-axis direction) of the chassis 14. The light reflectance on the center side of the chassis can be lower than that on the end side, and conversely, the light reflectance on both ends in the short side direction (Y-axis direction) of the chassis 14 can be higher than that on the center side. For this reason, even when the area | region which cannot arrange | position LED17 to the edge part side in the short side direction (Y-axis direction) of the chassis 14 arises, the edge part in the short side direction (Y-axis direction) of the chassis 14 The luminance of the light emitting portion 12a of the backlight device 12 can be made uniform. In the liquid crystal display device 10, the change in luminance along the short side direction is more visible than the change in luminance along the long side direction. Especially in this embodiment, the brightness | luminance along a short side direction can be made uniform, and the brightness | luminance of the light emission part 12a of the backlight apparatus 12 can be made uniform effectively. Further, in the present embodiment, since the plurality of LED boards 418 have the same configuration, it is not necessary to prepare many kinds of boards, which can contribute to a reduction in the number of parts.

<Embodiment 6>
A sixth embodiment of the present invention will be described with reference to FIGS. The sixth embodiment shows a backlight device 512 in which the backlight device 12 is changed to an edge light type from the first embodiment. In addition, the overlapping description about the same structure, an effect | action, and effect as above-mentioned Embodiment 1 is abbreviate | omitted.

As shown in FIG. 18, the liquid crystal display device 10 according to the present embodiment has a configuration in which a liquid crystal panel 11 and an edge light type backlight device 512 are integrated by a bezel 13 or the like. Note that the configuration of the liquid crystal panel 11 is the same as that of the first embodiment described above, and thus redundant description is omitted. Hereinafter, the configuration of the edge light type backlight device 512 will be described.

As shown in FIG. 18, the backlight device 512 includes a chassis 14 having a substantially box shape having an opening portion 14 b (light emitting portion) that opens to the front side, that is, the light emitting portion 12 a side (the liquid crystal panel 11 side), The optical member 15 is provided so as to cover the opening 14b of the chassis 14, and the frame 16 that presses the light guide member 519 described below from the front side. Further, in the chassis 14, an LED substrate 518 (light source substrate) on which an LED (Light Emitting Diode) 17 as a light source is mounted, and light from the LED 17 is guided to the optical member 15 (the liquid crystal panel 11). The light guide member 519 leading to the light emitting part 12a side) is accommodated. The backlight device 512 includes LED substrates 518 having LEDs 17 at both ends on the long side, and a light guide member 519 between the LED substrates 518 disposed on both ends. Is a so-called edge light type (side light type).

The chassis 14 is made of a metal plate, and as shown in FIG. 18, the bottom plate 14a has a horizontally long rectangular shape similar to the liquid crystal panel 11, and the sides of the bottom plate 14a (a pair of long sides and a pair of short sides) are outside. Each side plate 14c rises from the end toward the front side. Further, the frame 16 and the bezel 13 can be screwed to the side plate 14c.

As shown in FIG. 18, the optical member 15 has a horizontally long rectangular shape in a plan view, like the liquid crystal panel 11 and the chassis 14. The optical member 15 is placed on the front side (light emitting side) of the light guide member 519 and is interposed between the liquid crystal panel 11 and the light guide member 519. The optical member 15 includes a diffusion plate 15a disposed on the back side (the side opposite to the light guide member 519 side and the light emitting portion 12b side) and an optical disposed on the front side (the liquid crystal panel 11 side and the light emitting portion 12b side). And a sheet 15b. The diffusing plate 15a has a structure in which a large number of diffusing particles are dispersed in a translucent base material made of a substantially transparent synthetic resin having a predetermined thickness, and has a function of diffusing transmitted light. . The optical sheet 15b has a sheet shape that is thinner than the diffusion plate 15a, and three optical sheets are laminated. As the specific optical sheet 15b, for example, a diffusion sheet, a prism sheet, or a reflective polarizing sheet is used.

As shown in FIG. 18, the frame 16 is formed in a frame shape (frame shape) extending along the outer peripheral end portion of the light guide member 519, and the outer peripheral end portion of the light guide member 519 extends substantially over the entire circumference. It can be pressed from the front side. Further, the frame 16 can receive the outer peripheral end of the liquid crystal panel 11 from the back side.

19 and 20, the LED 17 has a configuration in which an LED chip is sealed with a resin material on a substrate portion fixed to the LED substrate 518. As shown in FIG. 18, the LED substrate 518 has a long plate shape extending along the long side direction of the chassis 14, and the plate surface of the liquid crystal panel 11 and the light guide member 519 (optical member 15). And is accommodated in the chassis 14 in a posture orthogonal to each other. That is, the LED substrate 518 has a posture in which the long side direction on the plate surface coincides with the X-axis direction, the short side direction coincides with the Z-axis direction, and the plate thickness direction orthogonal to the plate surface coincides with the Y-axis direction. It is said.

As shown in FIG. 19, the LED substrate 518 is arranged in a pair at a position sandwiching the light guide member 519 in the Y-axis direction. Specifically, each side plate on the long side of the light guide member 519 and the chassis 14 is arranged. 14c, respectively. Among the plate surfaces of the LED substrate 518, a plurality (27 in this embodiment) of LEDs 17 are arranged on the inner side, that is, the surface facing the light guide member 519 (a surface facing the light guide member 519) of the LED substrate 518. They are arranged intermittently in parallel along the long side direction (the long side direction of the chassis 14, the X-axis direction). The LED 17 is mounted on the surface of the LED substrate 518 facing the light guide member 519 side, and this surface is referred to as a plate surface 518a (a plate surface on which the light source is mounted) on which the LED 17 is mounted. On the plate surface 518a on which the LED 17 is mounted, a pattern wiring 31 made of a metal film (such as a copper foil) is formed that extends along the X-axis direction and connects the LEDs 17 in series. Terminal portions (not shown) are formed at both ends of the pattern wiring 31, and the terminal portions are connected to an external driving circuit, so that driving power can be supplied to each LED 17. Further, a white solder resist layer 532 (reflection layer) for protecting the wiring is laminated on the surface of the pattern wiring 31. The solder resist layer 532 will be described in detail later.
As shown in FIG. 19, the pair of LED substrates 518 are attached so that the plate surface opposite to the plate surface 518 a on which the LED 17 is mounted is in contact with the inner surfaces of the pair of side plates 14 c on the long side of the chassis 14. ing.

The light guide member 519 is made of a synthetic resin material (for example, acrylic) having a refractive index sufficiently higher than that of air and substantially transparent (exceeding translucency). As shown in FIG. 18, the light guide member 519 is formed in a plate shape that has a horizontally long rectangular shape when viewed in a plane, like the liquid crystal panel 11 and the chassis 14, and the long side direction on the plate surface is the X-axis direction. In addition, the short side direction coincides with the Y-axis direction, and the plate thickness direction orthogonal to the plate surface coincides with the Z-axis direction. As shown in FIG. 19, the light guide member 519 is disposed in the chassis 14 at a position immediately below the liquid crystal panel 11 and the optical member 15, and forms a pair of LEDs disposed at both ends of the long side of the chassis 14. They are arranged so as to be sandwiched between the substrates 518 in the Y-axis direction. Then, the light guide member 519 introduces the light emitted from the LED 17 in the Y-axis direction, and rises toward the optical member 15 side (front side, light emission side) while propagating the light inside. It has a function to emit light.

Among the plate surfaces of the light guide member 519, the surface facing the front side is a light emission surface 519b that emits internal light toward the optical member 15 and the liquid crystal panel 11. Of the outer peripheral end surfaces adjacent to the plate surface in the light guide member 519, both end surfaces on the long side that are long along the X-axis direction are respectively LED 17 (LED substrate 518) and LED 17, as shown in FIG. These are opposed to each other with a predetermined space therebetween, and these constitute a light incident surface 519a on which light emitted from the LED 17 is incident.

Of the plate surface of the light guide member 519, the surface 519c opposite to the light exit surface 519b can reflect the light in the light guide member 519 and rise to the front side as shown in FIG. A reflective optical member 25 is provided so as to cover the entire area. Note that a scattering portion (not shown) that scatters light in the light guide member 519 is provided on at least one of the light exit surface 519b and the opposite surface 519c of the light guide member 519, or on the surface of the reflective optical member 25. ) And the like are patterned so as to have a predetermined in-plane distribution, whereby the light emitted from the light emitting surface 519b is controlled to have a uniform distribution in the surface.

Next, the configuration related to the solder resist layer 532 will be described in detail. The solder resist layer 532 is obtained by printing and applying a white solder resist having a light reflectivity superior to that of a commonly used green solder resist to a predetermined thickness. As shown in FIG. 20, the solder resist layer 532 is provided over substantially the entire surface of the base material (not shown) of the LED substrate 518 and the surface of the pattern wiring 31 except for the portion where the LED 17 is mounted. . The solder resist layer 532 faces the light incident surface 519a of the light guide member 519 and is located between the light incident surface 519a of the light guide member 519 and the base material of the LED substrate 518. Therefore, the light returned from the light guide member 519 side to the LED substrate 518 side can be reflected again to the light guide member 519 side by the solder resist layer 532.

The layer thickness of the solder resist layer 532 in the LED substrate 518 is such that the end side portion 537 disposed on both end sides in the long side direction of the LED substrate 518 (long side direction of the chassis 14, X-axis direction) and the central portion side. The central portion side portion 538 disposed is different. The layer thickness of the solder resist layer 532 in the end portion 537 is 30 μm, and the light reflectance is about 90%. On the other hand, the thickness of the solder resist layer 532 in the central portion 538 is 15 μm, and the light reflectance is about 83%. That is, the layer thickness of the central portion 538 is relatively thinner than the layer thickness of the end portion 537, and the light reflectance of the end portion 537 is the light reflectance of the central portion 538. It is said that it is relatively higher. The layer thickness of the central portion 538 is preferably set to a thickness of 5 μm to 30 μm in designing the light reflectivity of the LED substrate 518, and is set to a thickness of 5 μm to 25 μm. More preferably.
In addition, in order to make the layer thickness of the end portion side portion 537 thicker than the layer thickness of the central portion side portion 538, in the solder resist printing and coating step, the step of printing and applying the solder resist to the entire LED substrate 518, and the end portion And a step of printing and applying a solder resist only to the side portion 537. That is, the solder resist layer 532 can be easily formed by performing a so-called twice coating process.

In the present embodiment, the LED substrate 518 is disposed such that the plate surface 518a on which the solder resist layer 532 is formed is opposed to the light incident surface 519a of the light guide member, so that the light reflected by the solder resist layer 532 is guided. The light can be made incident on the light member 519, and the luminance of the light emitting portion 12a of the backlight device 512 can be made uniform.

Specifically, in the backlight device 512, even if the light guide member 519 has a scattering portion patterned so as to have a predetermined in-plane distribution, the light emitting portion 12a has both ends in the X-axis direction. There is a tendency for the amount of light to go to be small.
On the other hand, in the present embodiment, a solder resist layer 532 having a light reflectance of about 90% is provided on the end side portions 537 of the LED substrate 518 located at both ends in the long side direction (X-axis direction) of the chassis 14. In addition, a solder resist layer 532 having a light reflectance of about 83% is provided on the central portion 538. Therefore, the amount of light reflected by the solder resist layer 532 located on both ends of the long side direction (X-axis direction) of the chassis 14 is changed to the amount of light reflected by the solder resist layer 532 located on the center side of the chassis 14. Can be more than That is, the shortage of light amount toward both ends in the X-axis direction of the light emitting surface can be supplemented by the light reflected by the solder resist layer 532.

<Other embodiments>
The present invention is not limited to the embodiments described with reference to the above description and drawings. For example, the following embodiments are also included in the technical scope of the present invention.
(1) In Embodiments 1 to 5 described above, the example including the diffusing lens 19 is illustrated, but those not including the diffusing lens 19 are also included in the present invention.

(2) In each of the above-described embodiments, the white solder resist

layers

32 and 232 are exemplified as the reflective layer. However, the reflective layer may be any layer as long as the reflectance changes depending on the layer thickness, and may be titanium oxide or titanium. It is good also as a soldering resist layer containing highly light reflective materials, such as barium acid or a polycarbonate. Moreover, even if a reflection layer is milky white etc., it can be used conveniently.

(3) In Embodiment 2 described above, the first LED substrate 34 and the second LED substrate 235 are exemplified, but a configuration including only the second LED substrate 235 may be employed. In this case, the end portion 237 of the second LED substrate 235 can be disposed close to the short side of the bottom plate 14a, and the luminance on the short side of the bottom plate 14a in the light emitting portion 12a of the backlight device 12 can be set. Can be improved.

(4) In Embodiment 1 to Embodiment 5 described above, the LED substrate 18 is illustrated as being divided into a plurality of strip-shaped first LED substrates 34 and

second LED substrates

35 and 135. It may be configured by one sheet, or may be configured by combining a plurality of rectangular LED substrates on which LEDs are arranged in a matrix.

(5) In Embodiment 1 to Embodiment 5 described above, the LEDs 17 arranged in a matrix are illustrated, but the LEDs 17 may have other arrangement configurations such as a staggered arrangement.

(6) In Embodiment 1 and Embodiment 6 described above, the base material 30 of the LED board 18 has been exemplified by a metal such as the same aluminum-based material as the chassis 14, but an insulating material such as ceramic is used. It is also possible.

(7) In Embodiments 1 to 5 described above, the one provided with the reflective sheet is shown, but the one in which the reflective sheet is omitted is also included in the present invention.

(8) In Embodiment 1 described above, examples of the optical sheet include a diffusion sheet having a function of diffusing light and a lens sheet having a function of condensing light, but the optical sheet condenses light. It may have both a function and a function of diffusing light.

(9) In each of the above-described embodiments, it has been described that the LED board is used in an appropriate combination of the five-mounting type, the six-mounting type, and the eight-mounting type, but other than five, six, and eight. What used the LED board which mounted the number of LED is also contained in this invention.

(10) In each of the above-described embodiments, an example in which an LED is used as a light source is illustrated, but an example in which a light source other than an LED is used is also included in the present invention.

(11) In each of the above-described embodiments, the liquid crystal panel and the chassis are illustrated in a vertically placed state in which the short side direction coincides with the vertical direction. However, the liquid crystal panel and the chassis have the long side direction in the vertical direction. Those that are in a vertically placed state matched with are also included in the present invention.

(12) In each of the embodiments described above, a TFT is used as a switching element of a liquid crystal display device. However, the present invention can also be applied to a liquid crystal display device using a switching element other than a TFT (for example, a thin film diode (TFD)). In addition to the liquid crystal display device for display, the present invention can also be applied to a liquid crystal display device for monochrome display.

(13) In each of the above-described embodiments, the liquid crystal display device using the liquid crystal panel as the display panel is exemplified, but the present invention is also applicable to a display device using another type of display panel.

(14) In each of the above-described embodiments, the television receiver provided with the tuner is exemplified, but the present invention can be applied to a display device not provided with the tuner.

DESCRIPTION OF SYMBOLS 10 ... Liquid crystal display device (display device), 11 ... Liquid crystal panel (display panel), 12 ... Backlight device (illuminating device), 14 ... Chassis, 15 ... Optical member, 15a ... Diffusing plate, 15b ... Optical sheet, 17 ... LED (light source), 18, 418, 518 ... LED substrate (light source substrate), 18b, 518a ... plate surface (plate surface on which the light source is mounted), 19 ... diffusion lens (lens member), 20 ... holding member, 21 ... Reflective sheet, 21b ... lens insertion hole (opening), 31 ... pattern wiring, 32, 132, 232, 332, 432, 532 ... solder resist layer (reflective layer), 34, 234, 334 ... first LED substrate (first Light source substrate), 35, 135, 235, 335 ... second LED substrate (second light source substrate), 137, 337, 437, 537 ... end side portion, 138, 338, 438, 5 8 ... central portion, 519 ... light guide member, 519a ... light incident surface, 519b ... light exit surface, TV ... television receiver apparatus

Claims

A light source;
A light source substrate on which the light source is mounted;
A chassis in which the light source substrate is disposed;
A pattern wiring that is disposed on the surface of the light source substrate on which the light source is mounted and electrically connected to the light source,
A reflective layer laminated on at least a part of the pattern wiring on the light source substrate, the layer thickness of which is located on the end side of the chassis rather than the part located on the end side In a portion located on the more central side, a reflective layer formed relatively thin,
A lighting device comprising:
The lighting device according to claim 1, wherein the reflective layer is made of a white solder resist.
A lens member for diffusing light, comprising a lens member disposed on a plate surface on which the light source of the light source substrate is mounted and covering a light emitting side of the light source;
The lighting device according to claim 1, wherein the reflective layer is formed at least in a portion overlapping with the lens member.
A reflection sheet for reflecting light, having an opening that is larger than the outer shape of the lens member, and allowing the lens member to be inserted through the opening and on the plate surface on which the light source of the light source substrate is mounted With a reflective sheet
The lighting device according to claim 3, wherein the reflection layer is formed at least in a portion overlapping with the opening.
The light source substrate has at least a first light source substrate disposed on the end portion side and a second light source substrate disposed on the center portion side, and the layer of the reflective layer formed on the first light source substrate. The lighting device according to any one of claims 1 to 4, wherein a thickness of the reflective layer formed on the second light source substrate is thinner than a thickness.
The chassis has a rectangular bottom plate,
The first light source substrate and the second light source substrate are formed in a strip shape, the long side of the bottom plate is along the longitudinal direction of the strip shape, and a plurality of the light source substrate and the second light source substrate are arranged in parallel in the short side direction of the strip shape. The lighting device according to claim 5, wherein the lighting device is disposed on the bottom plate surface.
The chassis has a rectangular bottom plate,
The first light source substrate and the second light source substrate have a strip shape, the longitudinal direction of the strip is along the short side of the bottom plate, and a plurality of the light source substrate and the second light source substrate are arranged in parallel in the short direction of the strip shape. The lighting device according to claim 5, wherein the lighting device is disposed on the bottom plate surface.
One or a plurality of the second light source substrates are arranged in a row, and among the second light source substrates arranged in the row, the layer thickness on the center side is larger than the layer thickness on the end side of the row. The lighting device according to claim 5, wherein the lighting device is thin.
A light guide member having a light incident surface provided on a side surface and a light emitting surface provided on one plate surface, and the light emitted from the light source is incident on the light incident surface, and A light guide member emitted from the light exit surface,
The lighting device according to any one of claims 1 to 5, wherein the light source substrate is disposed with a plate surface on which the light source is mounted facing the light incident surface of the light guide member.
The lighting device according to any one of claims 1 to 9, wherein the reflective layer has a layer thickness of 5 μm or more and 30 μm or less at a portion located on the center side.
The chassis has a light emitting portion that emits light from the light source,
An optical member disposed so as to cover the light emitting portion;
The optical member has at least one of a diffusion plate having a function of diffusing light from the light source, a function of collecting light transmitted through the diffusion plate, and a function of diffusing light transmitted through the diffusion plate. The lighting device according to any one of claims 1 to 10, further comprising an optical sheet having a function.
The lighting device according to any one of claims 1 to 11, wherein the light source includes a light emitting diode.
A display device comprising: the display device illumination device according to any one of claims 1 to 12; and a display panel arranged on a front side of the display device illumination device.
14. The display device according to claim 13, wherein the display panel is a liquid crystal panel in which liquid crystal is sealed between a pair of substrates.
A television receiver comprising the display device according to claim 13 or 14.