WO2012117466A1 - 部品実装装置及び部品実装方法、並びに撮像装置及び撮像方法 - Google Patents
部品実装装置及び部品実装方法、並びに撮像装置及び撮像方法 Download PDFInfo
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- WO2012117466A1 WO2012117466A1 PCT/JP2011/005745 JP2011005745W WO2012117466A1 WO 2012117466 A1 WO2012117466 A1 WO 2012117466A1 JP 2011005745 W JP2011005745 W JP 2011005745W WO 2012117466 A1 WO2012117466 A1 WO 2012117466A1
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- Prior art keywords
- component
- imaging
- illumination
- suction nozzle
- light
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
- H05K13/0413—Pick-and-place heads or apparatus, e.g. with jaws with orientation of the component while holding it; Drive mechanisms for gripping tools, e.g. lifting, lowering or turning of gripping tools
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
- H05K13/0812—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines the monitoring devices being integrated in the mounting machine, e.g. for monitoring components, leads, component placement
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N7/00—Television systems
- H04N7/18—Closed-circuit television [CCTV] systems, i.e. systems in which the video signal is not broadcast
Definitions
- the present invention relates to a component mounting apparatus and a component mounting method for mounting a component on a substrate by moving a suction nozzle that has sucked the component, and an imaging that is provided in the component mounting apparatus and performs imaging of the component sucked by the suction nozzle.
- the present invention relates to an apparatus and an imaging method.
- the component mounting apparatus moves the suction nozzle that sucks the component, and mounts the component on the substrate positioned by the substrate positioning means such as a transfer conveyor.
- a component mounting apparatus includes an imaging device (imaging means) that images a component sucked by a suction nozzle from below, and recognizes the posture of the component by performing image recognition of the component based on the obtained image. With this configuration, the component mounting apparatus can accurately mount the component at a predetermined position on the board in a predetermined posture.
- the component when the component is a surface-mounted component that is surface-mounted on the surface of the board, the lower surface of the component is illuminated by an illumination device that emits light from obliquely below the component. This is performed by recognizing the position of the electrode portion and the like.
- the surface mount component includes, for example, a chip component such as a chip resistor or a chip capacitor in addition to a component having a bent electrode portion that is in contact with the surface of the substrate.
- the illumination device when the component is an insertion component having a downwardly extending portion that extends downward, the illumination device irradiates light in a direction (horizontal direction) orthogonal to the longitudinal direction of the downwardly extending portion.
- the downward extending portion of the insertion component is a portion that extends downward from a component such as a linear electrode portion or an insertion piece that passes through the substrate in the thickness direction.
- an image pickup apparatus including an illumination device that emits light in the horizontal direction cannot illuminate a component located above the image pickup apparatus. Therefore, in order to illuminate the downward extension part of the insertion part and image this part by the imaging device, the suction nozzle that sucks the component is lowered so that the downward extension part enters the inside of the imaging device. There is a need. However, as the suction nozzle is lowered, there is a problem in that the time required for imaging the component is increased, the mounting tact is increased, and the productivity of the board is lowered.
- the present invention provides a component mounting apparatus, a component mounting method, an imaging apparatus, and an imaging method that can prevent an increase in mounting tact of the component mounting apparatus by imaging an inserted component in a short time. For the purpose.
- an imaging apparatus is provided in a component mounting apparatus that moves a suction nozzle that sucks a component and mounts the component on a substrate, and moves the suction nozzle so that the component is positioned in the imaging field of view.
- An imaging device that picks up an image of a component adsorbed by the adsorption nozzle from below, and a component that is adsorbed by the adsorption nozzle and positioned within the imaging field of view is a surface-mounted component that is surface-mounted on the surface of the substrate
- the part is irradiated with light at an irradiation angle closer to the horizontal direction irradiation than the light irradiation angle by the first illumination means to illuminate only the downwardly extending part of the part.
- Second illumination means and adsorption Illumination switching means for switching between illumination of the component by the first illumination means and illumination of the component by the second illumination means according to whether the component adsorbed by the slip is a surface-mounted component or an insertion component; And an imaging execution unit that performs imaging of components illuminated by the first illumination unit or the second illumination unit.
- the component is imaged at the same imaging height within the imaging field regardless of whether the component sucked by the suction nozzle is a surface-mounted component or an inserted component.
- the light emitted from the first illumination means is composed of diffused light
- the light emitted from the second illumination means is comprised of parallel light or convergent light.
- the second illumination unit is provided at a higher position than the first illumination unit.
- an imaging method is provided in a component mounting apparatus that moves a suction nozzle that sucks a component and mounts the component on a substrate, and the component that is sucked by the suction nozzle and positioned in the imaging field of view is
- the first illumination means for illuminating the lower surface of the component by irradiating light from below the component and the suction nozzle are attracted to the imaging field of view.
- the positioned component is an insertion component having a downward extending portion extending downward
- the component is irradiated with light at an irradiation angle closer to the horizontal irradiation than the irradiation angle of the light by the first illumination means.
- a second illumination unit that irradiates and illuminates only the downward extension part of the component is provided, and the component adsorbed by the adsorption nozzle is viewed from below in a state where the adsorption nozzle is moved so that the component is positioned in the imaging field of view.
- Imaging with imaging device Switching between illumination of the component by the first illumination means and illumination of the component by the second illumination means according to whether the component adsorbed by the adsorption nozzle is a surface-mounted component or an insertion component And a step of imaging a component illuminated by the first illumination unit or the second illumination unit.
- imaging of a component is performed at the same imaging height within the imaging field regardless of whether the component sucked by the suction nozzle is a surface-mounted component or an inserted component.
- the light emitted from the first illumination means is composed of diffused light
- the light emitted from the second illumination means is comprised of parallel light or convergent light
- the second illumination means is provided at a higher position than the first illumination means.
- a component mounting apparatus includes a substrate positioning unit that positions a substrate, a component supply unit that supplies a component, a suction nozzle that sucks a component supplied from the component supply unit, and a suction nozzle. If the component that has been attracted and moved into the imaging field is a surface-mounted component that is surface-mounted on the surface of the substrate, the lower surface of the component is applied to the component by the first illumination means that emits light obliquely from below.
- An imaging unit that illuminates only the downward extension portion by the second illumination unit that irradiates light at an irradiation angle closer to the horizontal direction irradiation than the light irradiation angle of the first illumination unit, and images the component from below;
- a component mounting method includes: a substrate positioning unit that positions a substrate; a component supply unit that supplies a component; a suction nozzle that absorbs a component supplied from the component supply unit; A component mounting method using a component mounting apparatus including an imaging unit that captures an image from a surface mounting component in which a component that is attracted to a suction nozzle and moved into an imaging field of view of the imaging unit is surface-mounted on the surface of a substrate.
- the lower surface of the component is illuminated by the first illumination unit that irradiates the component from obliquely below, and the component is imaged by the imaging unit, and is picked up by the suction nozzle and within the imaging field of the imaging unit.
- the moved part is an insertion part having a downward extending part that extends downward
- the light is irradiated at an irradiation angle closer to the horizontal direction irradiation than the light irradiation angle by the first illumination means for the part.
- the first illumination means for illuminating the lower surface of the surface-mounted component by irradiating the surface-mounted component positioned in the imaging visual field with light from obliquely below.
- the first illuminating means irradiates light at an irradiation angle closer to the horizontal direction irradiation than the light irradiation angle (that is, not horizontal direction irradiation).
- Two illumination means are provided.
- the imaging region of the component can be set at a position above the imaging device in both the case where the component is illuminated by the first illumination means and the case where the component is illuminated by the second illumination means. Regardless of whether the component sucked by the suction nozzle is a surface-mounted component or an inserted component, the component can be imaged at the same height in the imaging field of view. Therefore, in the present invention, unlike the conventional case, when the sucked insertion part is positioned in the imaging field of the imaging apparatus, the operation of temporarily stopping the horizontal movement of the suction nozzle and then lowering the suction nozzle is unnecessary. In addition, it is possible to shorten the time required for imaging the inserted component and prevent the mounting tact of the component mounting apparatus from increasing.
- the first illumination means for imaging the surface mount component and the second illumination means for imaging the insert component are provided, and the image of the insert component is captured by the surface mount component. It can be performed at the same imaging height as the case. Therefore, in the present invention, the operation of the suction nozzle when imaging a component can be made constant regardless of whether the component is a surface-mounted component or an inserted component.
- the top view of the component mounting apparatus in one embodiment of this invention The side view of the component mounting apparatus in one embodiment of this invention (A) Perspective view of surface-mounted component mounted on substrate by component mounting apparatus in one embodiment of the present invention (b) Perspective view of insertion component mounted on substrate by component mounting apparatus in one embodiment of the present invention
- Figure The block diagram which shows the control system of the component mounting apparatus in one embodiment of this invention
- the side view of the component camera with which the component real phase apparatus in one embodiment of this invention is provided
- the top view of the component camera in one embodiment of this invention The side view of the component camera in one embodiment of this invention
- the side view of the component camera in one embodiment of this invention The side view of the component camera in one embodiment of this invention (A) (b)
- the figure which shows an example of the image data of the insertion component imaged with the component camera in one embodiment of this invention The flowchart which shows the
- the component mounting apparatus 1 shown in FIGS. 1 and 2 performs a series of operations including loading and positioning of the substrate 2, mounting of the component 4 on the electrode 3 on the positioned substrate 2, and unloading of the substrate 2 on which the component 4 is mounted. It is a device that executes repeatedly.
- the conveyance direction (arrow A shown in FIG. 1) of the substrate 2 in the component mounting apparatus 1 is the X-axis direction
- the horizontal plane direction orthogonal to the X-axis direction is the Y-axis direction (front-rear direction).
- the direction be the Z-axis direction.
- the side where the operator OP is normally located with respect to the component mounting apparatus 1 is the front, and the opposite side is the rear.
- the component mounting apparatus 1 is provided on a base 11 and is a conveyor 11 as a board positioning unit that transports the board 2 and positions the board 2 at a predetermined work position (position shown in FIG. 1).
- a plurality of tape feeders 13 and tray feeders 14 serving as component supply means for supplying the components 4, an orthogonal coordinate type head moving robot 15 provided on the base 11, and the head moving robot 15 are moved in a horizontal plane.
- Two mounting heads 16, each mounting head 16 can be moved up and down and rotatable about a vertical axis, and suction nozzle 17 that sucks the component 4 supplied from the tape feeder 13 and the tray feeder 14 is provided in each mounting head 16.
- Two component cameras 19 (imaging devices) provided at both positions across the substrate camera 18 and the transport conveyor 12 on the base 11. Eteiru.
- the conveyor 12 includes a pair of belt conveyors provided on the base 11 so as to extend in the X-axis direction.
- the conveyor 12 conveys the substrate 2 in the X-axis direction while supporting both ends of the substrate 2 in the Y-axis direction from below.
- a plurality of tape feeders 13 are installed on a carriage 13C attached to the front side of the base 11 by an operator OP.
- Each tape feeder 13 continuously supplies the component 4 to a component supply port 13p provided at the end of the base 11 on the center side.
- the tray feeder 14 is attached to the rear side of the base 11 by the operator OP.
- the tray feeder 14 supplies the component 4 by the tray 14 t that accommodates the component 4.
- the component 4 supplied by each tape feeder 13 includes, as shown in FIG. 3A, for example, a plurality of bent electrode portions 4D that are in contact with the surface of the substrate 2 (16 here). ) Having the surface mount component 4a.
- the component 4 supplied by the tray feeder 14 includes a plurality of linearly extending downwardly extending portions 4F that extend downward and are attached to the substrate 2 (16 in this case). It comprises the provided insertion part 4b.
- the head moving robot 15 is provided with a Y-axis table 15a that extends in the Y-axis direction above the transport conveyor 12, and is movably provided in the Y-axis direction on the Y-axis table 15a.
- Each moving stage 15c is attached to each of the two mounting heads 16, and operation of the head moving robot 15, that is, movement of the X-axis table 15b with respect to the Y-axis table 15a and movement of the moving stage 15c with respect to the X-axis table 15b.
- the upper part of the base 11 is moved in the horizontal direction by a combination of movements.
- the suction nozzle 17 provided in each mounting head 16 vacuum picks up and picks up the component 4 supplied from the tape feeder 13 or the tray feeder 14, and on the substrate 2 positioned by the transport conveyor 12.
- the vacuum suction of the part 4 is released at a predetermined part (part mounting part), and the part 4 is detached from the suction nozzle 17.
- the suction nozzle 17 mounts the component 4 on the substrate 2.
- each substrate camera 18 has an imaging field of view directed downward, and when the substrate 2 is positioned at a work position by the transport conveyor 12, it is used for position detection of the substrate 2 provided on the substrate 2.
- a substrate mark (not shown) as a mark is imaged from above.
- each component camera 19 has its imaging field of view directed upward, and is picked up by the mounting head 16 and images the component 4 positioned in the imaging field of view by moving the mounting head 16 from below.
- the substrate conveyor 2 is transported by the conveyor 12 and the positioning operation to the working position is performed by the operation of the conveyor driving mechanism 21 (FIG. 4) including an actuator not shown in the control device 20 (FIGS. 2 and 4) included in the component mounting apparatus 1. This is done by performing control.
- the supply of the component 4 to the component supply port 13p by the tape feeder 13 is performed by controlling the operation of the tape feeder drive mechanism 22 (FIG. 4) including an actuator or the like (not shown) by the control device 20.
- the supply of the component 4 by the tray feeder 14 is performed by controlling the operation of the tray feeder drive mechanism 23 (FIG. 4) including an actuator or the like (not shown) by the control device 20.
- each mounting head 16 in the horizontal plane direction is performed by the operation control of the robot drive mechanism 24 (FIG. 4) for operating the head moving robot 15 by the control device 20.
- each suction nozzle 17 with respect to the mounting head 16 and the rotation operation about the vertical axis are performed by the control device 20 controlling the operation of a nozzle driving mechanism 25 (FIG. 4) including an actuator (not shown).
- the suction (pickup) and release (separation) operation of the component 4 by each suction nozzle 17 is performed by the control device 20 controlling the operation of a suction mechanism 26 (FIG. 4) including an actuator (not shown), and vacuuming the suction nozzle 17. This is done by supplying pressure and releasing the vacuum pressure.
- the imaging operation control of each board camera 18 and the imaging operation control of each component camera 19 are performed by the control device 20 (FIG. 4).
- the image data obtained by the imaging operation of each board camera 18 and the image data obtained by the imaging operation of each component camera 19 are respectively sent to the control device 20, and in the image recognition unit 20a (FIG. 4) provided in the control device 20. Image recognition processing is performed.
- each of the component cameras 19 includes a housing 31 provided on the base 11, a first lighting device 32, a second lighting device 33 provided in the housing 31, and lighting.
- a switching unit 34 and an imaging execution unit 35 are provided.
- a plurality of (four in this case) first illumination devices 32 are provided so as to surround the vertical center axis J of the casing 31.
- Each first illumination device 32 irradiates light from below obliquely to the component 4 located in the imaging field of view Rg of the component camera 19 and above the component camera 19 (the optical axis L1 of the first illumination device 32). reference).
- the light emitted from each first illumination device 32 is diffused light so that a wide range of illumination is possible.
- the light emitted from the first illumination device 32 illuminates the lower surface of the component 4 positioned in the imaging field of view Rg of the component camera 19 from below (FIG. 7).
- each second illumination device 33 irradiates the component 4 positioned in the imaging field of view Rg above the component camera 19 in a horizontal direction (horizontal direction) than the light irradiation angle ⁇ 1 (FIG. 5) by each first illumination device 32.
- Light is irradiated at an angle ⁇ 2 (FIG. 5) close to (irradiation in the direction) (see the optical axis L2 of the second illumination device 33).
- the light emitted from each second illumination device 33 is composed of parallel light or convergent light so that local illumination is possible.
- each second illumination device 33 The light emitted from each second illumination device 33 is, when the component 4 positioned in the imaging field of view Rg of the component camera 19 is the insertion component 4b, the downward extension 4F (particularly the lower portion) included in the insertion component 4b. Only the lower end of the extension 4F is illuminated (FIG. 8).
- the second illumination device 33 is provided at a position higher than the first illumination device 32 inside the housing 31 (however, a position that does not block light from the first illumination device 32).
- the entire component camera 19 has a compact configuration that does not spread laterally.
- the illumination switching unit 34 switches between illumination of the component 4 by the first illumination device 32 and illumination of the component 4 by the second illumination device 33 based on a command from the control device 20.
- the control device 20 determines whether the component 4 sucked by the suction nozzle 17 is the surface mounting component 4a or the insertion component 4b based on the contents of the mounting program in which the component mounting work procedure is recorded. Make a decision.
- the control device 20 outputs a command to turn on the first lighting device 32 to the illumination switching unit 34, and the component sucked by the suction nozzle 17
- the illumination switching unit 34 outputs a command to turn on the second illumination device 33.
- the imaging execution unit 35 has an imaging element composed of a line sensor (not shown).
- the imaging execution unit 35 is provided in the casing 31 so that the imaging optical axis K coincides with the vertical center axis J of the casing 31.
- the imaging execution unit 35 is controlled by the control device 20 and images the component 4 illuminated by the first illumination device 32 or the second illumination device 33 (FIG. 4).
- the illumination switching unit 34 determines whether the component 4 sucked by the suction nozzle 17, that is, the component 4 that is located in the imaging field of view Rg of the component camera 19 and is the imaging target is the surface mounting component 4 a. It functions as an illumination switching unit that switches between illumination of the component 4 by the first illumination device 32 and illumination of the component 4 by the second illumination device 33 depending on whether the illumination is 4b.
- the imaging execution unit 35 functions as an imaging execution unit that captures an image of the component 4 illuminated by the first illumination device 32 or the second illumination device 33.
- the component camera 19 having such a configuration includes a first illumination device 32 that illuminates the lower surface of the surface mount component 4a by irradiating the surface mount component 4a located in the imaging visual field Rg obliquely from below.
- a first illumination device 32 that illuminates the lower surface of the surface mount component 4a by irradiating the surface mount component 4a located in the imaging visual field Rg obliquely from below.
- the horizontal illumination is closer than the irradiation angle of light by the first illumination device 32 (as shown in FIG. 5)
- a second illumination device 33 that irradiates light at an irradiation angle (which is smaller than the irradiation angle of light by the first illumination device 32 instead of directional irradiation).
- the component camera 19 captures an imaging area Ar (FIG.
- the imaging region Ar (FIG. 5) of the component 4 by the component camera 19 is set to a position above the component camera 19 in both cases where the component 4 is the surface mount component 4a and the insertion component 4b. can do. Therefore, regardless of whether the component 4 sucked by the suction nozzle 17 is the surface mounting component 4a or the insertion component 4b, the component camera 19 has the same imaging height H in the imaging field of view Rg (FIGS. 7 and 8). ), The component 4 can be imaged.
- each electrode portion 4D appears brighter than the lower surface of the surface mounted component 4a when the imaging execution unit 35 performs imaging of the surface mounted component 4a whose lower surface is illuminated by the first lighting device 32. An image like this is obtained. Based on this image, the control device 20 can recognize the position of the electrode portion 4D included in the surface mount component 4a, and thereby can grasp the posture of the surface mount component 4a.
- the imaging execution unit 35 performs imaging of the insertion part 4b in which only the lower extension part 4F is illuminated by the second illumination device 33
- the lower surface of the insertion part 4b is dark because the light does not strike it. Images as shown in FIGS. 10A and 10B are obtained in which only the lower end of the downward extending portion 4F is brightly shining. Based on this image, the control device 20 can recognize the position of the downward extending portion 4F included in the insertion component 4b, and thereby can grasp the posture of the insertion component 4b.
- the control device 20 grasps the posture of the component 4 based on the image of the component 4 obtained by the imaging operation by the imaging execution unit 35, and whether or not an abnormal part is recognized in the component 4. Judgment is made.
- the case where the abnormal part of the component 4 is recognized means that, for the surface mounting component 4a, for example, a bending or a defect is recognized in the electrode portion 4D, and the insertion component 4b is in the downward extending portion 4F. This refers to cases where bending or loss is observed.
- FIG. 9A is an example of an image in the case where all 16 electrode portions 4D included in the surface mount component 4a are not bent and all the electrode portions 4D are arranged in an orderly manner.
- the control is performed.
- the apparatus 20 determines that no abnormal portion is recognized in the surface mount component 4a.
- FIG. 9 (b) shows that one of the 16 electrode portions 4D (reference numeral 4Dp) is bent, and one electrode portion 4Dp where the bending occurs is compared to the other electrode portion 4D.
- the control device 20 determines that an abnormal portion is recognized in the surface mount component 4a.
- FIG. 10A is an example of an image in a case where all the 16 downward extending portions 4F included in the insertion part 4b are not bent and all the downward extending portions 4F are arranged in an orderly manner.
- the control device 20 determines that no abnormal portion is recognized in the insertion part 4b.
- FIG. 10 (b) shows that one of the 16 downward extending portions 4F (reference numeral is indicated by 4Fp) is bent, and one downward extending portion 4Fp where the bending occurs is the other lower portion. It is an example of an image in the case where it looks shifted with respect to the extension part 4F. In this case, the control device 20 determines that an abnormal part is recognized in the insertion part 4b.
- the control device 20 determines that the suction nozzle is based on the grasped posture of the component 4 when no abnormal portion is found in the component 4.
- the suction nozzle 17 (the mounting head 16) is moved so that the component 4 adsorbed by 17 is accurately mounted on the component mounting portion on the substrate 2 positioned by the conveyor 12.
- the control device 20 discards the component 4 without mounting it on the substrate 2 when an abnormal part is recognized in the component 4 sucked by the suction nozzle 17.
- the control device 20 first has the substrate 2 sent from another device (for example, a solder printer) arranged on the upstream side of the component mounting device 1. Is carried by the conveyor 12 and positioned at a predetermined work position (step ST1 shown in FIG. 11). Then, the head moving robot 15 is operated to move the substrate camera 18 (the mounting head 16) above the substrate 2, and the substrate camera 18 causes the substrate mark on the substrate 2 to be imaged to perform image recognition. The positional deviation from the normal work position is calculated (step ST2 shown in FIG. 11).
- another device for example, a solder printer
- the control device 20 After calculating the positional deviation of the substrate 2, the control device 20 operates the head moving robot 15 to move the mounting head 16 above the tape feeder 13, and the suction nozzle 17 is supplied to the component supply port 13 p of the tape feeder 13. Then, the vacuum pressure is supplied to the suction nozzle 17 by controlling the operation of the suction mechanism 26, and the component 4 is sucked and picked up by the suction nozzle 17 (step ST3 shown in FIG. 11). .
- the control device 20 determines whether or not the component 4 currently sucked by the suction nozzle 17 is the insertion component 4b from the contents of the mounting program (step ST4 shown in FIG. 11). Then, when the component 4 currently sucked by the suction nozzle 17 is not the insertion component 4b (the surface mounting component 4a), the first illumination device 32 is turned on (step ST5 shown in FIG. 11), and the current suction is performed. When the component 4 attracted by the nozzle 17 is the insertion component 4b, the second illumination device 33 is turned on (step ST6 shown in FIG. 11).
- steps ST4 to ST6 the illumination of the component 4 by the first illumination device 32 and the second are performed according to whether the component 4 attracted by the suction nozzle 17 is the surface mounting component 4a or the insertion component 4b. This is a process of switching the illumination of the component 4 by the illumination device 33.
- control device 20 When the control device 20 turns on the first illumination device 32 or the second illumination device 33 according to whether or not the component 4 currently attracted by the suction nozzle 17 is the insertion component 4b, the control nozzle 20 turns the suction nozzle 17 (The mounting head 16 is moved to position the component 4 within the imaging field of view Rg of the component camera 19, and the component camera 19 images the component 4 from below (step ST7 shown in FIG. 11).
- imaging of the component 4 can be performed while performing a scanning operation of moving the suction nozzle 17 (mounting head 16) in the horizontal direction so that the component 4 crosses the component camera 19 in the horizontal direction.
- an expensive area sensor has to be used for the imaging execution unit 35.
- the cost can be reduced.
- the control device 20 recognizes the image data of the component 4 obtained by the imaging and determines whether or not an abnormal part is recognized in the component 4 (see FIG. Step ST8 shown in FIG. As a result, when no abnormal part is recognized in the component 4, the control device 20 grasps the posture of the component 4 with respect to the suction nozzle 17 and calculates a positional shift (suction shift) with respect to the suction nozzle 17 (FIG. 11). Step ST9). Then, the control device 20 moves the suction nozzle 17 (the mounting head 16) above the substrate 2 and controls the operation of the nozzle drive mechanism 25, thereby positioning the component 4 sucked by the suction nozzle 17 by the transport conveyor 12.
- the solder is printed by the solder printing machine arranged on the upstream side of the component mounting apparatus 1)
- the supply of the vacuum pressure to the suction nozzle 17 is released, and the component 4 is mounted on the substrate 2 (step ST10 shown in FIG. 11).
- the control device 20 when mounting the component 4 on the substrate 2, the control device 20 considers the posture of the component 4 grasped in step ST ⁇ b> 9 and takes the position of the substrate 2 obtained by imaging the substrate mark by the substrate camera 18.
- the position correction (including rotation correction) of the suction nozzle 17 is performed so that the shift and the position shift (suction shift) of the component 4 with respect to the suction nozzle 17 obtained by imaging the component 4 by the component camera 19 are canceled.
- the position correction including rotation correction of the suction nozzle 17 is performed so that the shift and the position shift (suction shift) of the component 4 with respect to the suction nozzle 17 obtained by imaging the component 4 by the component camera 19 are canceled.
- the control device 20 grasps the posture of the component 4 based on the image obtained by the imaging, and based on the grasped posture.
- This is a mounting control means for mounting the component 4 on the substrate 2 positioned by the transport conveyor 12.
- step ST9 and step ST10 the posture of the component 4 is grasped based on the image obtained by the imaging by the component camera 19 in step ST7, and the component 4 is positioned by the conveyor 12 based on the grasped posture. This is a process of mounting on the substrate 2.
- control device 20 discards the component 4 sucked by the suction nozzle 17 to a predetermined component discarding position (not shown) (FIG. 11). Step ST11).
- step ST10 or step ST11 the control device 20 determines whether or not all the components 4 to be mounted on the substrate 2 have been mounted on the substrate 2 (step ST12 shown in FIG. 11). If all the components 4 to be mounted on the substrate 2 have not been mounted on the substrate 2, the process returns to step ST3 to pick up the next component 4, and all the components 4 to be mounted on the substrate 2 are picked up.
- the transport conveyor 12 is operated, and the substrate 2 is placed on another device (for example, a post-mounting inspection machine) disposed on the downstream side of the component mounting device 1. It is carried out (step ST13 shown in FIG. 11).
- the component camera 19 provided in the component mounting apparatus 1 is the surface mount component 4a in which the component 4 that is sucked by the suction nozzle 17 and located in the imaging field of view Rg is surface-mounted on the surface of the substrate 2.
- the component 4 (surface-mounted component 4a) is attracted to the first illumination device 32 and the suction nozzle 17 as first illumination means for illuminating the lower surface of the component 4 by irradiating light obliquely from below.
- the component 4 located in the imaging field of view Rg is an insertion component 4b having a downward extension 4F extending downward, the light from the first illumination device 32 is applied to the component 4 (insertion component 4b).
- Only the downward extension 4F of the component 4 is illuminated by irradiating light at an irradiation angle that is closer to the horizontal direction irradiation than the irradiation angle (not horizontal direction irradiation but smaller than the light irradiation angle by the first illumination device 32).
- the second lighting means Illumination of the component 4 by the first illumination device 32 and the component by the second illumination device 33 depending on whether the component 4 adsorbed by the second illumination device 33 and the adsorption nozzle 17 is the surface mounting component 4a or the insertion component 4b
- An illumination switching unit 34 serving as an illumination switching unit that performs switching of 4 illuminations
- an imaging execution unit 35 serving as an imaging execution unit that performs imaging of the component 4 illuminated by the first illumination device 32 or the second illumination device 33. It has become a thing.
- the imaging method by the component camera 19 is based on whether the component 4 sucked by the suction nozzle 17 is the surface mounting component 4a or the insertion component 4b, and the second illumination of the component 4 by the first illumination device 32 and the second. Including a step of switching illumination of the component 4 by the illumination device 33 (step ST4 to step ST6) and a step of imaging the component 4 illuminated by the first illumination device 32 or the second illumination device 33 (step ST7). It has become.
- 4 imaging areas Ar can be set at positions above the component camera 19.
- the same imaging within the imaging field Rg is performed regardless of whether the component 4 sucked by the suction nozzle 17 is the surface mount component 4a or the insertion component 4b.
- the component 4 can be imaged at the height H.
- the horizontal movement of the suction nozzle 17 is temporarily stopped.
- the operation of lowering the suction nozzle 17 is unnecessary, and the time required for imaging the inserted component 4b can be shortened to prevent the mounting tact of the component mounting apparatus from increasing.
- the first illumination device 32 for imaging the surface mount component 4a and the second illumination device 33 for imaging the insertion component 4b are provided side by side.
- the imaging of the insertion component 4b can be performed at the same imaging height H as that of the surface mounting component 4a. Therefore, in the component camera 19 and its imaging method in the present embodiment, the operation of the suction nozzle 17 at the time of imaging the component 4 is constant regardless of whether the component 4 is the surface mount component 4a or the insertion component 4b. Can be.
- the first type of component for example, BGA
- BGA downward extending portion
- a component mounting apparatus a component mounting method, an imaging apparatus, and an imaging method capable of preventing an increase in mounting tact of the component mounting apparatus by imaging an inserted component in a short time.
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Abstract
Description
そして、制御装置20は、吸着ノズル17を(装着ヘッド16)を基板2の上方に移動させ、ノズル駆動機構25の作動制御を行うことによって吸着ノズル17により吸着した部品4を搬送コンベア12によって位置決めされた基板2上の目標装着部位(この目標装着部位にある電極3上には、部品実装装置1の上流側に配置された半田印刷機によって半田が印刷されている)に接触させるとともに、吸着機構26の作動制御を行うことによって吸着ノズル17への真空圧の供給を解除し、部品4を基板2に装着する(図11に示すステップST10)。
2 基板
3 電極
4 部品
4a 表面実装部品
4b 挿入部品
4D、4Dp 電極部
4F、4Fp 下方延出部
11 基台
12 搬送コンベア(基板位置決め手段)
13 テープフィーダ(部品供給手段)
13C 台車
13p 部品供給口
14 トレイフィーダ(部品供給手段)
14t トレイ
15 ヘッド移動ロボット
15a Y軸テーブル
15b X軸テーブル
16 装着ヘッド
17 吸着ノズル
18 基板カメラ
19 部品カメラ(撮像装置)
20 制御装置(照明切り替え手段)
20a 画像認識部
21 搬送コンベア駆動機構
22 テープフィーダ駆動機構
23 トレイフィーダ駆動機構
24 ロボット駆動機構
25 ノズル駆動機構
26 吸着機構
31 筐体
32 第1照明装置(第1の照明手段)
33 第2照明装置(第2の照明手段)
34 照明切り替え部(照明切り替え手段)
35 撮像実行部(撮像実行手段)
A 矢印
Ar 撮像領域
J 上下中心軸
K 撮像光軸
L1、L2 光軸
OP オペレータ
Rg 撮像視野
H 撮像高さ
Claims (10)
- 部品を吸着させた吸着ノズルを移動させて基板に前記部品を装着する部品実装装置に備えられ、撮像視野内に前記部品が位置するように前記吸着ノズルを移動させた状態で前記吸着ノズルに吸着された前記部品を下方から撮像する撮像装置であって、
前記吸着ノズルに吸着されて撮像視野内に位置した前記部品が前記基板の表面に表面実装される表面実装部品である場合に、前記表面実装部品に対して斜め下方から光を照射して前記表面実装部品の下面を照明する第1の照明手段と、
前記吸着ノズルに吸着されて前記撮像視野内に位置した前記部品が下方に延出する下方延出部を有した挿入部品である場合に、前記挿入部品に対して前記第1の照明手段による光の照射角度よりも水平方向照射に近い照射角度で光を照射して前記挿入部品の前記下方延出部のみを照明する第2の照明手段と、
前記吸着ノズルに吸着された前記部品が前記表面実装部品であるか前記挿入部品であるかに応じて前記第1の照明手段による前記部品の照明と前記第2の照明手段による前記部品の照明の切り替えを行う照明切り替え手段と、
前記第1の照明手段又は前記第2の照明手段により照明された前記部品の撮像を行う撮像実行手段と
を備えたことを特徴とする撮像装置。 - 前記吸着ノズルにより吸着した前記部品が前記表面実装部品であるか前記挿入部品であるかによらず、前記撮像視野内の同一の撮像高さで前記部品の撮像を行うことを特徴とする請求項1に記載の撮像装置。
- 前記第1の照明手段から照射される光は拡散光から成り、前記第2の照明手段から照射される光は平行光又は収束光から成ることを特徴とする請求項1又は2に記載の撮像装置。
- 前記第2の照明手段は前記第1の照明手段よりも高い位置に設けられていることを特徴とする請求項1乃至3の何れか一項に記載の撮像装置。
- 部品を吸着させた吸着ノズルを移動させて基板に前記部品を装着する部品実装装置に備えられ、前記吸着ノズルに吸着されて撮像視野内に位置した前記部品が前記基板の表面に表面実装される表面実装部品である場合に、前記表面実装部部品に対して斜め下方から光を照射して前記表面実装部品の下面を照明する第1の照明手段及び前記吸着ノズルに吸着されて前記撮像視野内に位置した前記部品が下方に延出する下方延出部を有した挿入部品である場合に、前記挿入部品に対して前記第1の照明手段による光の照射角度よりも水平方向照射に近い照射角度で光を照射して前記挿入部品の前記下方延出部のみを照明する第2の照明手段を有し、前記撮像視野内に前記部品が位置するように前記吸着ノズルが移動された状態で前記吸着ノズルに吸着された前記部品を下方から撮像する撮像装置による撮像方法であって、
前記吸着ノズルに吸着された前記部品が前記表面実装部品であるか前記挿入部品であるかに応じて前記第1の照明手段による前記部品の照明と前記第2の照明手段による前記部品の照明の切り替えを行う工程と、
前記第1の照明手段又は前記第2の照明手段により照明された前記部品の撮像を行う工程とを含むことを特徴とする撮像方法。 - 前記吸着ノズルにより吸着した前記部品が前記表面実装部品であるか前記挿入部品であるかによらず、前記撮像視野内の同一の撮像高さで前記部品の撮像を行うことを特徴とする請求項5に記載の撮像方法。
- 前記第1の照明手段から照射される光は拡散光から成り、前記第2の照明手段から照射される光は平行光又は収束光から成ることを特徴とする請求項5又は6に記載の撮像方法。
- 前記第2の照明手段は前記第1の照明手段よりも高い位置に設けられていることを特徴とする請求項5乃至7の何れか一項に記載の撮像方法。
- 基板の位置決めを行う基板位置決め手段と、
部品の供給を行う部品供給手段と、
前記部品供給手段より供給される前記部品を吸着する吸着ノズルと、
前記吸着ノズルに吸着されて撮像視野内に移動された前記部品が前記基板の表面に表面実装される表面実装部品である場合には前記表面実装部品に対して斜め下方から光を照射する第1の照明手段によって前記表面実装部品の下面を照明して前記表面実装部品を下方から撮像し、前記吸着ノズルに吸着されて前記撮像視野内に移動された前記部品が下方に延出する下方延出部を有した挿入部品である場合には前記挿入部品に対して前記第1の照明手段による光の照射角度よりも水平方向照射に近い照射角度で光を照射する第2の照明手段によって前記下方延出部のみを照明して前記挿入部品を下方から撮像する撮像手段と、
前記撮像手段により前記部品が撮像された後、その撮像によって得られた画像に基づいて前記部品の姿勢を把握し、その把握した姿勢に基づいて前記部品を前記基板位置決め手段によって位置決めされた前記基板に装着させる装着制御手段とを備えたことを特徴とする部品実装装置。 - 基板の位置決めを行う基板位置決め手段と、部品の供給を行う部品供給手段と、前記部品供給手段より供給される前記部品を吸着する吸着ノズルと、前記部品を下方から撮像する撮像手段とを備えた部品実装装置による部品実装方法であって、
前記吸着ノズルに吸着されて前記撮像手段の撮像視野内に移動された前記部品が前記基板の表面に表面実装される表面実装部品である場合には前記表面実装部品に対して斜め下方から光を照射する第1の照明手段によって前記表面実装部品の下面を照明して前記撮像手段により前記表面実装部品を撮像し、前記吸着ノズルに吸着されて前記撮像手段の前記撮像視野内に移動された前記部品が下方に延出する下方延出部を有した挿入部品である場合には前記挿入部品に対して前記第1の照明手段による光の照射角度よりも水平方向照射に近い照射角度で光を照射する第2の照明手段によって前記下方延出部のみを照明して前記撮像手段により前記挿入部品を撮像する工程と、
前記撮像手段による撮像によって得られた画像に基づいて前記部品の姿勢を把握し、その把握した姿勢に基づいて前記部品を前記基板位置決め手段によって位置決めされた前記基板に装着させる工程とを含むことを特徴とする部品実装方法。
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US13/579,752 US9241436B2 (en) | 2011-03-02 | 2011-10-13 | Component mounting device, a component mounting method, an imaging device and an imaging method |
CN201180011048.7A CN102783268B (zh) | 2011-03-02 | 2011-10-13 | 元件安装装置、元件安装方法、成像装置以及成像方法 |
KR1020127021838A KR20130138646A (ko) | 2011-03-02 | 2011-10-13 | 부품 실장 장치, 부품 실장 방법, 촬상 장치, 및 촬상 방법 |
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US10551181B2 (en) * | 2015-06-24 | 2020-02-04 | Fuji Corporation | Board inspection machine |
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Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09178445A (ja) * | 1995-12-25 | 1997-07-11 | Matsushita Electric Works Ltd | 電子部品の端子曲がり検査装置 |
JPH10332331A (ja) * | 1997-05-27 | 1998-12-18 | Sony Corp | 部品認識装置 |
JP2009302147A (ja) * | 2008-06-10 | 2009-12-24 | Hitachi High-Tech Instruments Co Ltd | 電子部品装着装置 |
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JP4315752B2 (ja) * | 2003-08-21 | 2009-08-19 | Juki株式会社 | 電子部品実装装置 |
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---|---|---|---|---|
JPH09178445A (ja) * | 1995-12-25 | 1997-07-11 | Matsushita Electric Works Ltd | 電子部品の端子曲がり検査装置 |
JPH10332331A (ja) * | 1997-05-27 | 1998-12-18 | Sony Corp | 部品認識装置 |
JP2009302147A (ja) * | 2008-06-10 | 2009-12-24 | Hitachi High-Tech Instruments Co Ltd | 電子部品装着装置 |
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