WO2012095905A1 - 照明用光源 - Google Patents
照明用光源 Download PDFInfo
- Publication number
- WO2012095905A1 WO2012095905A1 PCT/JP2011/005551 JP2011005551W WO2012095905A1 WO 2012095905 A1 WO2012095905 A1 WO 2012095905A1 JP 2011005551 W JP2011005551 W JP 2011005551W WO 2012095905 A1 WO2012095905 A1 WO 2012095905A1
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- WO
- WIPO (PCT)
- Prior art keywords
- light source
- light emitting
- semiconductor light
- illumination
- base
- Prior art date
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V7/00—Reflectors for light sources
- F21V7/0008—Reflectors for light sources providing for indirect lighting
- F21V7/0016—Reflectors for light sources providing for indirect lighting on lighting devices that also provide for direct lighting, e.g. by means of independent light sources, by splitting of the light beam, by switching between both lighting modes
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
- F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
- F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
- F21K9/238—Arrangement or mounting of circuit elements integrated in the light source
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
- F21K9/68—Details of reflectors forming part of the light source
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
- F21V23/004—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board
- F21V23/006—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board the substrate being distinct from the light source holder
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
- F21V17/10—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
- F21V17/12—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening by screwing
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
- F21V19/003—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
- F21V19/0035—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources the fastening means being capable of simultaneously attaching of an other part, e.g. a housing portion or an optical component
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V3/00—Globes; Bowls; Cover glasses
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V3/00—Globes; Bowls; Cover glasses
- F21V3/02—Globes; Bowls; Cover glasses characterised by the shape
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V7/00—Reflectors for light sources
- F21V7/22—Reflectors for light sources characterised by materials, surface treatments or coatings, e.g. dichroic reflectors
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2103/00—Elongate light sources, e.g. fluorescent tubes
- F21Y2103/10—Elongate light sources, e.g. fluorescent tubes comprising a linear array of point-like light-generating elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2103/00—Elongate light sources, e.g. fluorescent tubes
- F21Y2103/30—Elongate light sources, e.g. fluorescent tubes curved
- F21Y2103/33—Elongate light sources, e.g. fluorescent tubes curved annular
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
Definitions
- the present invention relates to an illumination light source using a semiconductor light emitting device, and more particularly to a technology for improving light distribution characteristics.
- a light bulb-shaped illumination light source using a semiconductor light emitting element such as a light emitting diode (LED) has been widely used as a substitute for an incandescent light bulb.
- LED light emitting diode
- the base 901 is an inverted pyramid from the first base portion 902 and a partial region of the upper surface of the first base portion 902.
- the first LED 904 is disposed on the top surface of the first pedestal portion 902
- the second LED 905 is disposed on the top surface of the second pedestal portion 903.
- the configuration that became 906 is adopted. With this configuration, the light emitted from the first LED 904 is reflected obliquely downward by the light reflecting surface 906 to compensate for the narrowing of the irradiation angle of the LED, thereby achieving relatively good light distribution characteristics.
- the upper surface of the first base portion 902 and the upper surface of the second base portion 903 become the mounting surface of the LED, and the two mounting surfaces separately
- the assembly operation is complicated compared to the case where there is only one mounting surface of the LED.
- the base 901 is formed into a complicated shape including the first base portion 902 and the second base portion 903, the cost of the base 901 is increased.
- the present invention has been made in view of the problems as described above, and it is an object of the present invention to provide a light source for illumination having good light distribution characteristics and easy assembly work.
- the plurality of semiconductor light emitting devices are disposed on the upper surface of the base with their main emission directions directed upward, and the main emission light of the semiconductor light emitting devices is disposed above each semiconductor light emitting device.
- a reflecting member having a reflecting surface that reflects a portion of the main surface obliquely downward avoiding the upper surface of the base, and an opening for leaking the other portion of the main emitted light upward to the reflecting member A part or a notch is provided.
- the illumination light source according to the present invention has a configuration in which the plurality of semiconductor light emitting elements are disposed on the upper surface of the base, so the semiconductor light emitting element can be easily mounted on the base and the assembly operation of the illumination light source is easy. .
- the reflecting member disposed above the plurality of semiconductor light emitting elements has a reflecting surface that reflects part of the main emission light of the semiconductor light emitting elements obliquely downward away from the upper surface of the base, the irradiation angle is narrow. Even when the semiconductor light emitting element is disposed, the light distribution characteristic of the illumination light source is good.
- the reflecting member is provided with an opening or a notch for leaking the other part of the main emitted light upward, a shadow by the reflecting member is unlikely to occur, and the design of the illumination light source at the time of lighting is also possible. It is good.
- Partially broken perspective view showing the illumination light source according to the first embodiment A sectional arrow view along the line AA shown in FIG. 1
- a plan view showing a semiconductor light emitting module according to a first embodiment A sectional arrow view along the line B-B shown in FIG. 1
- Light distribution curve for explaining the light distribution characteristics of the illumination light source Diagram showing the radiation intensity distribution when the illumination light source is on Partially broken perspective view showing the illumination light source according to the second embodiment Sectional drawing which shows the principal part structure of the light source for illumination which concerns on 2nd Embodiment.
- Partially broken perspective view showing the illumination light source according to the third embodiment A diagram for explaining an illumination light source according to a third embodiment Partially broken perspective view showing the illumination light source according to the fourth embodiment Sectional drawing which shows the principal part structure of the light source for illumination which concerns on 4th Embodiment.
- FIG. 1 is a partially broken perspective view showing the illumination light source according to the first embodiment.
- FIG. 2 is a cross-sectional view along the line AA shown in FIG.
- FIG. 3 is an enlarged sectional view showing a portion surrounded by a two-dot chain line in FIG.
- the dashed-dotted line drawn along the vertical direction of the drawing shows the lamp axis J of the light source for illumination, the upper part of the sheet is above the illumination light source and the lower part of the sheet is below the illumination light source. is there.
- the illumination light source 1 is an LED lamp that is an alternative to an incandescent lamp, and includes a semiconductor light emitting module 10 as a light source and a semiconductor light emitting module 10.
- FIG. 4 is a plan view showing a semiconductor light emitting module according to the first embodiment.
- the semiconductor light emitting module 10 includes a mounting substrate 11, a plurality of semiconductor light emitting devices 12 as light sources mounted on the mounting substrate 11, and the mounting substrate 11 so as to cover the semiconductor light emitting devices 12.
- the sealing body 13 provided on the In the present embodiment the semiconductor light emitting element 12 is an LED, and the semiconductor light emitting module 10 is an LED module.
- the semiconductor light emitting element 12 may be, for example, an LD (laser diode). It may be an electric luminescence element).
- the mounting substrate 11 has a substantially annular element mounting portion 15 having a substantially circular hole portion 14 at the center, and a tongue piece portion extending from one point on the inner peripheral edge of the element mounting portion 15 toward the center of the hole portion 14 It consists of 16 and.
- the connector 17 to which the wiring 41 of the circuit unit 40 is connected is provided on the lower surface of the tongue piece 16. By connecting the wiring 41 to the connector 17, the semiconductor light emitting module 10 and the circuit unit 40 are electrically connected. It is connected (see FIG. 2).
- 32 semiconductor light emitting elements 12 are annularly mounted on the upper surface of the element mounting portion 15.
- 16 sets of semiconductor light emitting elements 12 arranged along the radial direction of the element mounting portion 15 are arranged in a circle at equal intervals along the circumferential direction of the element mounting portion 15 as one set of two semiconductor light emitting elements 12. It is arranged in a ring.
- the term "annular” includes not only annular, but also polygonal annular rings such as triangles, squares, and pentagons. Therefore, the semiconductor light emitting device 12 may be mounted in, for example, an elliptical or polygonal ring shape.
- the semiconductor light emitting elements 12 are individually sealed by a substantially rectangular parallelepiped sealing body 13 for each set. Therefore, the sealing body 13 is 16 pieces in all.
- the longitudinal direction of each sealing body 13 coincides with the radial direction of the element mounting portion 15, and when the lower side is viewed from the upper side along the lamp axis J (in plan view), the lamp axis J is centered Are arranged radially.
- the sealing body 13 is mainly made of a translucent material, but when it is necessary to convert the wavelength of light emitted from the semiconductor light emitting element 12 into a predetermined wavelength, the wavelength of the light of the translucent material is used.
- the wavelength conversion material is mixed to convert the
- a silicone resin can be used as the translucent material, and phosphor particles can be used as the wavelength conversion material, for example.
- semiconductor light emitting element 12 emitting blue light and sealing body 13 formed of a translucent material mixed with phosphor particles for wavelength converting blue light to yellow light are adopted.
- a part of the blue light emitted from the semiconductor light emitting element 12 is wavelength converted to yellow light by the sealing body 13, and white light generated by mixing of unconverted blue light and converted yellow light is semiconductor The light is emitted from the light emitting module 10.
- the semiconductor light emitting module 10 may be, for example, a combination of a semiconductor light emitting element emitting ultraviolet light and each color phosphor particle emitting light in three primary colors (red, green and blue). Further, as the wavelength conversion material, a material including a semiconductor, a metal complex, an organic dye, a pigment, or the like, which absorbs light of a certain wavelength and emits light of a wavelength different from the absorbed light may be used.
- the semiconductor light emitting element 12 is disposed with its main emission direction upward, that is, in the direction of the lamp axis J.
- the base 20 is, for example, a substantially cylindrical shape having a substantially cylindrical through hole 21, and the cylinder axis of the base 20 is disposed in an attitude that matches the lamp axis J. Therefore, the through hole 21 penetrates in the vertical direction, and the upper surface 22 and the lower surface 23 of the base 20 shown in FIG. 3 are both substantially annular flat surfaces.
- the semiconductor light emitting module 10 is mounted on the upper surface 22 of the base 20, whereby the semiconductor light emitting elements 12 are planarly disposed with their main emission directions directed upward.
- the semiconductor light emitting elements 12 can be easily mounted on the base 20, and the assembly work of the illumination light source is easy. It is.
- the upper surface 22 is not limited to the substantially annular shape, and may have any shape.
- the upper surface 22 does not necessarily have to be a plane as a whole as long as the semiconductor light emitting element can be arranged in a plane.
- the lower surface 23 is not limited to a flat surface.
- the semiconductor light emitting module 10 is, for example, fixed to the base 20 together with the reflecting member 80 by using a screw.
- the semiconductor light emitting module 10 may be fixed to the base 20 by adhesion or engagement.
- the base 20 is made of, for example, a metal material, and as the metal material, for example, Al, Ag, Au, Ni, Rh, Pd, an alloy of two or more of them, an alloy of Cu and Ag, etc. can be considered. .
- a metal material has good thermal conductivity, so that the heat generated by the semiconductor light emitting module 10 can be efficiently conducted to the case 60.
- the illumination light source 1 is lightweight because the through hole 21 is provided in the base 20. In addition, since a part of the circuit unit 40 is disposed in the through hole 21 and in the globe 30 via the through hole 21, the size is small.
- the globe 30 has a shape that simulates a bulb of A-type bulb which is a general bulb shape, and the opening side end 31 of the globe 30 is a case 60
- the semiconductor light emitting module 10 and the reflecting member 80 are fixed to the case 60 in a state of covering the semiconductor light emitting module 10 and the reflecting member 80 by press-fitting into the upper side end 62.
- the envelope of the illumination light source 1 is configured of a glove 30 and a case 60.
- globe 30 is not limited to the shape which imitated the bulb
- the illumination light source may be configured without the glove.
- the glove 30 may be fixed to the case 60 by an adhesive or the like.
- the inner surface 32 of the globe 30 is subjected to a diffusion process for diffusing light emitted from the semiconductor light emitting module 10, for example, a diffusion process using silica, a white pigment, or the like.
- a diffusion process for diffusing light emitted from the semiconductor light emitting module 10, for example, a diffusion process using silica, a white pigment, or the like.
- the light incident on the inner surface 32 of the globe 30 passes through the globe 30 and is extracted to the outside of the globe 30.
- the circuit unit 40 is for lighting a semiconductor light emitting element, and includes a circuit board 42 and various electronic components 43 and 44 mounted on the circuit board 42. In the drawings, only some electronic components are denoted by reference numerals.
- the circuit unit 40 is accommodated in the circuit holder 50, and is fixed to the circuit holder 50 by, for example, screwing, bonding, and engagement.
- the circuit board 42 is disposed such that its main surface is parallel to the lamp axis J. In this way, the circuit unit 40 can be stored more compactly in the circuit holder 50.
- the circuit unit 40 is disposed such that the heat-sensitive electronic component 43 is located on the lower side far from the semiconductor light emitting module 10 and the heat-resistant electronic component 44 is located on the upper side closer to the semiconductor light emitting module 10 . In this way, the heat-resistant electronic component 43 is less likely to be thermally destroyed by the heat generated in the semiconductor light emitting module 10.
- the circuit unit 40 and the base 70 are electrically connected by electrical wires 45 and 46.
- the electrical wiring 45 is connected to the shell portion 71 of the base 70 through the through hole 51 provided in the circuit holder 50. Further, the electrical wiring 46 is connected to the eyelet portion 73 of the base 70 through the lower opening 54 of the circuit holder 50.
- a part of the circuit unit 40 is disposed in the through hole 21 of the base 20 and in the globe 30. By doing this, the space for housing the circuit unit 40 below the base 20 can be reduced. Therefore, it is possible to reduce the distance between the base 20 and the base 70, and to reduce the diameter of the case 60, which is advantageous for downsizing of the illumination light source 1.
- the circuit holder 50 has, for example, a substantially cylindrical shape with both sides open, and is configured of a large diameter portion 52 and a small diameter portion 53.
- the large diameter portion 52 located on the upper side accommodates most of the circuit unit 40.
- a base 70 is externally fitted to the small diameter portion 53 located on the lower side, whereby the lower side opening 54 of the circuit holder 50 is closed.
- the circuit holder 50 is preferably made of, for example, an insulating material such as a resin.
- the large diameter portion 52 of the circuit holder 50 penetrates the through hole 21 of the base 20, and a part of the circuit unit is disposed in the through hole 21 of the base 20 in a state of being accommodated in the circuit holder 50. .
- the circuit holder 50 and the base 20 are not in contact, and a gap is provided between the outer surface 55 of the circuit holder 50 and the inner surface 24 of the through hole 21 of the base 20.
- the circuit holder 50 is not in contact with the semiconductor light emitting module 10 and the reflecting member 80 either, and between the mounting substrate 11 of the semiconductor light emitting module 10 and the outer surface 55 of the circuit holder 50 and the upper side end of the circuit holder 50 A gap is also provided between the portion 57 and the reflecting member 80. Therefore, the heat generated in the semiconductor light emitting module 10 is difficult to propagate to the circuit holder 50, and the circuit holder 50 does not easily become high temperature, so the circuit unit 40 is unlikely to be thermally destroyed.
- the circuit holder 50 is provided with a through hole 56 at a position corresponding to the tongue portion 16 of the semiconductor light emitting module 10.
- the tip of the tongue portion 16 is inserted into the circuit holder 50 through the through hole 51, and the connector 17 provided on the tongue portion 16 is located in the circuit holder 50.
- the case 60 has, for example, a cylindrical shape which is open at both ends and reduced in diameter from the upper side to the lower side. As shown in FIG. 3, the base 20 and the opening side end 31 of the glove 30 are accommodated in the upper side end 62 of the case 60, and the case 60 is fixed to the base 20 by caulking, for example. There is.
- the case 60 may be fixed to the base 20 by pouring an adhesive into a space 63 surrounded by the case 60, the base 20, and the globe 30, for example.
- the outer peripheral edge of the lower side end of the base 20 is tapered according to the shape of the inner peripheral surface 64 of the case 60. Since the tapered surface 25 is in surface contact with the inner circumferential surface 64 of the case 60, the heat transmitted from the semiconductor light emitting module 10 to the base 20 is more easily conducted to the case 60.
- the heat generated by the semiconductor light emitting element 12 is conducted to the base 70 mainly through the base 20 and the case 60 and further through the small diameter portion 53 of the circuit holder 50, and from the base 70 to the lighting equipment (not shown) side Heat is dissipated.
- the case 60 is made of, for example, a metal material, and the metal material may be, for example, Al, Ag, Au, Ni, Rh, Pd, an alloy of two or more of them, or an alloy of Cu and Ag.
- a metal material has good thermal conductivity, so the heat transmitted to the case 60 can be efficiently transmitted to the base 70 side.
- the material of case 60 is not limited to a metal, For example, resin with high heat conductivity, etc. may be sufficient.
- the base 70 is a member for receiving power from the socket of the lighting device when the lighting light source 1 is attached to the lighting device and turned on.
- the type of the base 70 is not particularly limited, but in the present embodiment, an E26 base which is an Edison type is used.
- the base 70 includes a shell portion 71 which has a substantially cylindrical shape and whose outer peripheral surface is an external thread, and an eyelet portion 73 attached to the shell portion 71 via an insulating portion 72.
- An insulating member 74 is interposed between the shell portion 71 and the case 60.
- the reflecting member 80 has, for example, a bottomed cylindrical shape, a substantially cylindrical main body portion 81 opened on both sides, and a substantially disc shaped attachment portion 82 closing the lower side opening of the main body portion 81.
- resin such as polycarbonate, metal such as aluminum, glass, ceramic, etc. can be considered, but in the present embodiment, polycarbonate is used. Since a resin such as polycarbonate is lightweight, it is suitable for reducing the weight of the illumination light source 1.
- FIG. 5 is a sectional view taken along the line BB shown in FIG.
- the hole 83 is provided in the reflection member 80, and the hole 83 is mounted in a state where the outer peripheral edge of the mounting portion 82 is mounted on the inner peripheral edge of the mounting substrate 11 of the semiconductor light emitting module 10.
- the reflection member 80 and the mounting substrate 11 are fastened together to the base 20 by screwing the screw 90 inserted into the screw hole 26 of the base 20.
- the holes 83 are provided, for example, at three locations near the boundary between the main body 81 and the attachment 82.
- a notch 18 is provided at one location on the inner peripheral edge of the element mounting portion 15 of the mounting substrate 11, and as shown in FIG. A projection 84 is provided at the location.
- the use of these notches 18 and protrusions 84 is a simple operation of fitting the protrusions 84 into the notches 18, and the reflective member 80 can be positioned at an appropriate position corresponding to the position of the semiconductor light emitting element 12 .
- the main body 81 is substantially cylindrical with an outer diameter larger at the upper side than at the lower side, and floats from the semiconductor light emitting module 10 in such a posture that its cylindrical axis and the upper surface 22 of the base 20 are orthogonal to each other. In this state, it is disposed above the semiconductor light emitting element 12, and the cylinder axis of the main body 81 coincides with the lamp axis J.
- the outer peripheral surface 85 of the main body 81 is substantially annular when the upper side is viewed from the lower side along the lamp axis J, and the plurality of semiconductor light emitting element groups 12 arranged in a ring on the mounting substrate 11 To face the semiconductor light emitting elements 12.
- a plurality of openings 86 are provided along the circumferential direction of the outer peripheral surface 85 of the main body 81 around the cylinder axis of the main body 81 over the main body 81 and the mounting portion 82. Is provided. Specifically, along the circumferential direction of the outer peripheral surface 85 so that the 16 openings 86 the same as the number of the sealing bodies 13 of the semiconductor light emitting module 10 face the sealing bodies 13 in a one-to-one relationship.
- the main body portion 81 is provided at equal intervals.
- the opening 86 is a through hole and nothing is inserted.
- the opening 86 may have a configuration that allows light to leak upward without this configuration, for example, the opening A translucent member may be fitted in all or part of the portion 86, and light may leak upward through the translucent member.
- the number of the openings 86 is not necessarily the same as that of the sealing body 13 and may be more or less than the number of the sealing bodies 13, and may be one or more. .
- each opening 86 is substantially square, and a portion on the cylinder axis side that is about half of the sealing body 13 is located in the opening 86 and opposite to the other half of the cylinder axis.
- the portion on the side faces the outer peripheral surface 85 of the main body 81.
- about half of the sealing body 13 is exposed from the opening 86 and the other half is hidden by the main body 81.
- This will be described in relation to the semiconductor light emitting element 12.
- the semiconductor light emitting element 12 a closer to the cylinder axis is in the opening 86.
- the semiconductor light emitting element 12 b located on the far side of the cylinder axis is opposed to the outer peripheral surface 85 of the main body 81.
- the main emission direction of the semiconductor light emitting element 12 b is directed to the outer peripheral surface 85, and the outer peripheral surface 85 is a reflection surface of the reflecting member 80.
- the reflective member 80 is formed of white polycarbonate. Forming the main body 81 with a white material is suitable for increasing the reflectance of the outer peripheral surface 85.
- FIG. As a method of performing mirror surface processing, methods, such as grinding
- the outer peripheral surface 85 of the main body portion 81 has a concave curved surface shape which is recessed on the cylindrical shaft side of the main body portion 81. More specifically, in the cut surface (hereinafter referred to as "longitudinal section") when the main body portion 81 is cut along a virtual plane including the lamp axis J (coincident with the cylinder axis), the shape of the outer peripheral surface 85 is the lamp axis It has a substantially arc shape that bulges to the J side. In other words, it has a substantially arc shape recessed toward the lamp axis J side from a straight line connecting the lower side edge and the upper side edge of the outer peripheral surface 85 in the cut surface. Specifically, in the case of the present embodiment, the shape of the arc of the outer peripheral surface 85 in the vertical cross section is a substantially elliptic arc shape.
- the concave curved surface shape recessed on the cylinder axis side is suitable for reflecting the emitted light of the semiconductor light emitting element 12 obliquely downward closer to the lower side (more parallel to the lamp axis J). It is effective to widen the light distribution angle. It is also advantageous to concentrate the reflected light in a specific direction.
- the entire outer peripheral surface 85 of the main body portion 81 is a reflective surface, but the entire peripheral surface 85 does not necessarily have to be a reflective surface, and only a part of the outer peripheral surface 85 is a reflective surface. It may be done.
- the shape of the outer peripheral surface 85 of the main body 81 of the reflection member 80 is not limited to the substantially arc shape which bulges toward the lamp axis J in the longitudinal cross section, but the substantially arc which bulges in the opposite side to the lamp axis J in the longitudinal cross section. It may be shaped or linear in the longitudinal cross section.
- the reflective member 80 of this Embodiment was cylindrical shape with a bottom, a substantially plate shape may be sufficient as a reflective member.
- an optical path L1 in FIG. 3 most of the main emission light emitted from the semiconductor light emitting element 12b and incident on the outer peripheral surface 85 of the main body 81 is incident on the outer peripheral surface 85, and the incident light is outer peripheral surface 85 , And the reflected light passes through an annular region laterally surrounding the base 20 and is reflected obliquely downward so as to avoid the upper surface 22 of the base 20.
- an optical path L2 in FIG. 3 most of the main emission light of the semiconductor light emitting element 12a passes through the opening 86 and leaks upward.
- the reflecting member 80 exhibits a diffusion function of diffusing the light emitted from the semiconductor light emitting element 12.
- the illumination light source 1 includes the outer peripheral surface 85 that reflects a part of the main emission light of the semiconductor light emitting device 12 obliquely downward avoiding the upper surface 22 of the base 20, the semiconductor light emitting device 12 with a narrow irradiation angle Even if it is used, the light distribution characteristic of the illumination light source 1 is good.
- the semiconductor light emitting element 12 is disposed in a ring shape, and the outer peripheral surface 85 is also disposed in a ring shape corresponding to that, reflection to the diagonally lower side avoiding the top surface 22 of the base 20 is It occurs over the entire outer circumference. Therefore, the light distribution characteristic is good over the entire circumference around the lamp axis J.
- FIG. 6 is a light distribution curve diagram for explaining light distribution characteristics of the illumination light source.
- the light distribution curve diagram represents the magnitude of the luminous intensity for each direction of 360 ° including the upward direction of the illumination light source 1, and the upper side of the illumination light source 1 along the lamp axis J is Clockwise and counterclockwise, tick marks are formed at intervals of 10 ° with 0 ° and 180 ° downward along the lamp axis J, respectively.
- a scale attached in the radial direction of the light distribution curve diagram represents light intensity, and the light intensity is represented by a relative magnitude with the maximum value in each light distribution curve as 1.
- the light distribution curve A of the incandescent lamp is shown using a dashed dotted line
- the light distribution curve B of the illumination light source 900 of Patent Document 1 is shown using a broken line
- the illumination according to the present embodiment is shown using a solid line.
- the light distribution curve C of the light source 1 is shown.
- the light distribution characteristics were evaluated based on the light distribution angle.
- the light distribution angle refers to the size of an angular range in which a light intensity of half or more of the maximum value of the light intensity in the illumination light source is emitted. In the case of the light distribution curve shown in FIG. 6, it is the magnitude
- the light distribution angle of the incandescent lamp is about 315 °
- the light distribution angle of the illumination light source 900 of Patent Document 1 is about 165 °
- the light distribution angle is about 270 °.
- the light source 1 for illumination has a light distribution angle wider than the light source 900 for illumination, and has a light distribution angle closer to the incandescent lamp. Therefore, it can be said that the illumination light source 1 has better light distribution characteristics than the illumination light source 900, and has light distribution characteristics similar to an incandescent lamp.
- the semiconductor light emitting element 12 on the outer peripheral edge of the element mounting portion 15 of the mounting substrate 11 as one of methods for further increasing the light distribution angle of the illumination light source 1. In this way, the light emitted from the semiconductor light emitting element 12 can be reflected obliquely downward (closer to the lamp axis J) more directly below by the reflecting member 80.
- the light source 1 for illumination is provided with the opening part 86 in the reflection member 80, it demonstrates that the designability at the time of lighting is also favorable.
- the main portion 81 of the reflection member 80 not only reflects the main emission light from the semiconductor light emitting element 12 but also a part of the main emission light leaks upward from the opening 86, so that the shadow by the reflection member 80 is less likely to occur.
- the designability when the illumination light source 1 is viewed from the upper side and the side (in the direction orthogonal to the lamp axis J) at the time of lighting is good.
- the radiation intensity distribution of the light source for illumination 1 according to the present embodiment, and for illumination according to a comparative example provided with a reflecting member not provided with an opening was compared.
- the light source for illumination which concerns on a comparative example has the structure similar to the light source 1 for illumination which concerns on this Embodiment except the point by which the opening part is not provided in the reflection member.
- FIG. 7 is a view showing a radiation intensity distribution at the time of lighting of the illumination light source, where A is a comparative example when the illumination light source according to the present embodiment is viewed from above (in plan view).
- A is a comparative example when the illumination light source according to the present embodiment is viewed from above (in plan view).
- C is the illumination light source according to the present embodiment when viewed from the side (when viewed from the direction orthogonal to the lamp axis J)
- D corresponds to the comparative example.
- the illumination light source is viewed from the side.
- the illumination light source 1 according to the present embodiment in which the opening 86 is provided in the reflection member 80 is the illumination according to the comparative example in which the opening is not provided in the reflection member. It can be seen that the shadow due to the reflective member is less likely to occur at the center of the globe 30 when viewed from above than the light source. Further, as can be seen by comparing C and D, the illumination light source 1 according to the present embodiment is the top side (upper side) of the globe 30 when viewed from the side than the illumination light source according to the comparative example. It can be seen that the shadow due to the reflective member is less likely to occur. Thus, since the shadow by a reflective member does not produce easily, the designability at the time of lighting is favorable.
- FIG. 8 is a partially broken perspective view showing the illumination light source according to the second embodiment.
- FIG. 9 is a cross-sectional view showing the main configuration of the illumination light source according to the second embodiment.
- the illumination light source 100 according to the second embodiment is largely different from the illumination light source 1 according to the first embodiment in the shape of the opening 186 of the main body 181.
- the other configuration is basically the same as that of the illumination light source 1 according to the first embodiment. Therefore, only the difference will be described in detail, and the description of the other components will be simplified or omitted.
- the same reference numerals as in the first embodiment are used for the same members as in the first embodiment.
- the illumination light source 100 is an LED lamp that is an alternative to an incandescent lamp, and includes the semiconductor light emitting module 10, the base 20, the globe 30, the circuit unit 40, and the circuit holder 50.
- the circuit holder 150 is substantially the same as the circuit holder 50 according to the first embodiment, except that the upper side end portion 157 protrudes in the glove 30 more than in the first embodiment.
- the circuit holder 150 has a larger space for accommodating the circuit unit 40 than the first embodiment, because the upper end portion 157 protrudes into the globe 30.
- the main body portion 181 of the reflection member 180 has a substantially cylindrical shape as if the lower end of the main body portion 81 of the reflection member 80 according to the first embodiment is extended downward along the lamp axis J.
- the diameter of the upper side of the main body portion 181 gradually increases from the lower side to the upper side, and the diameter (the outer diameter and the inner diameter) of the lower side of the main body portion 181 is constant.
- the lower end portion 187 of the main body portion 181 is fixed to the upper surface 19 of the element mounting portion 15 of the mounting substrate 11.
- the attachment portion 182 of the reflection member 180 has a substantially disc shape and is provided at the boundary between the gradually enlarged diameter portion 181 a of the main body portion 181 and the constant diameter portion 181 b so as to partition the inside of the main body portion 181. It is arranged.
- the attachment portion 182 is attached to the upper end portion 157 of the circuit holder 150.
- each opening 186 is substantially rectangular such that its longitudinal direction is in a direction orthogonal to the lamp axis J in plan view, and the entire sealing body 13 of the semiconductor light emitting module 10 is an opening Located within 186 (exposed from opening 186).
- the amount of exposure of the sealing body 13 from the opening 186 in a plan view may be reduced by shifting the position of the opening 186.
- the opening 186 may be provided at a position where the entire sealing body 13 is hidden by the main body portion 181.
- the number of the openings 186 is not necessarily the same as that of the sealing body 13 and may be more or less than the number of the sealing bodies 13 and may be one or more. Further, the width of the opening portion 186 in the short side direction (circumferential direction of the main body portion 181) may be uniform over the longitudinal direction (direction orthogonal to the lamp axis J), or spreads with distance from the lamp axis J Also, the distance from the lamp axis J may be narrowed as the distance from the lamp axis J increases.
- the entire outer peripheral surface 185 of the main body portion 181 is a reflection surface.
- the entire outer peripheral surface 185 of the main body portion 181 is a reflective surface, but the entire outer surface 185 does not necessarily have to be a reflective surface, and only a part of the outer peripheral surface 185 is a reflective surface. It may be done.
- the semiconductor light emitting element 12 having a narrow irradiation angle is used for illumination
- the light distribution characteristic of the light source 100 is good. Furthermore, since the other part of the main emitted light emitted from the semiconductor light emitting module 10 passes through the opening 186 and leaks upward, the designability when the illumination light source 100 is lit is good.
- FIG. 10 is a partially broken perspective view showing the illumination light source according to the third embodiment.
- FIG. 11 is a view for explaining the illumination light source according to the third embodiment, and FIG. 11 (a) is a cross-sectional view showing the main configuration of the illumination light source, and FIG. 11 (b) is a semiconductor light emission It is a top view which shows a module.
- the shape of the opening 286 of the main body 281 and the arrangement of the semiconductor light emitting element 212 are the same as in the second embodiment.
- the other configuration is basically the same as that of the illumination light source 100 according to the second embodiment. Therefore, only the difference will be described in detail, and the description of the other components will be simplified or omitted.
- symbol same as the embodiment is used.
- the illumination light source 200 is an LED lamp that is an alternative to an incandescent lamp, and includes a semiconductor light emitting module 210 as a light source, a base 20 on which the semiconductor light emitting module 210 is mounted, and semiconductor light emission Electrically connected to the globe 30 covering the module 210, the circuit unit 40 for lighting the semiconductor light emitting module 210, the circuit holder 150 accommodating the circuit unit 40, the case 60 covering the circuit holder 150, and the circuit unit 40 And a reflecting member 280 for diffusing the light emitted from the semiconductor light emitting module 210.
- the semiconductor light emitting module 210 is such that the longitudinal direction of the sealing body 213 is along the circumferential direction of the element mounting portion 215 in the element mounting portion 215 of the mounting substrate 211. Is located in A plurality of semiconductor light emitting elements 212 are arranged side by side along the circumferential direction of the element mounting portion 215 in the element mounting portion 215 of the mounting substrate 211, and these semiconductor light emitting elements 212 are sealed by the sealing body 213 as a pair. The longitudinal direction of the sealing body 213 is along the circumferential direction of the element mounting portion 215.
- the light emitting portion is in a state closer to continuous in the circumferential direction of the element mounting portion 215, and thus uneven illuminance in the circumferential direction is less likely to occur.
- a tongue piece 216 extends from a portion of the inner peripheral edge of the element mounting portion 215 toward the center of the hole 214, and a connector 217 is provided on the lower surface of the tongue piece 216.
- the main body portion 281 and the attachment portion 282 have substantially the same shape as the main body portion 181 and the attachment portion 182 of the reflection member 180 according to the second embodiment.
- the lower end 287 of the main body 281 is fixed to the upper surface 219 of the element mounting portion 215 of the mounting substrate 211, and the mounting portion 182 is attached to the upper end 157 of the circuit holder 150. There is.
- each opening 286 is an arc-shaped slit formed by dividing an annular ring into eight equal parts, and a substantially annular slit having a break composed of eight arc-shaped slits has a cylindrical axis. It is provided concentrically five times as a center.
- the sealing body 213 of the semiconductor light emitting module 210 is partially located in each opening 286 in planar view (it is partially exposed from the opening 286). With such a configuration, since positioning in the circumferential direction between the opening 286 and the sealing body 213 is almost unnecessary, assembly of the illumination light source 200 is easy.
- the shape, size, number, and arrangement of the openings 286 are not necessarily limited to the above, but are arbitrary, but in order to make positioning in the circumferential direction of the openings 286 and the sealing body 213 almost unnecessary, It is preferable that a slit is provided along the circumferential direction of the main body portion 281 by the arc-shaped opening 286 or by one annular opening.
- the entire outer peripheral surface 285 of the main body portion 281 is a reflection surface.
- the entire outer peripheral surface 285 of the main body portion 281 is a reflective surface, but the entire outer peripheral surface 285 does not necessarily have to be a reflective surface, and only a part of the outer peripheral surface 285 is a reflective surface. It may be done.
- the semiconductor light emitting element 212 having a narrow irradiation angle is used for illumination
- the light distribution characteristic of the light source 200 is good. Furthermore, since another part of the main emitted light emitted from the semiconductor light emitting module 210 passes through the opening 286 and leaks upward, the designability when the illumination light source 200 is lit is good.
- FIG. 12 is a partially broken perspective view showing the illumination light source according to the fourth embodiment.
- FIG. 13 is a cross-sectional view showing the main configuration of the illumination light source according to the fourth embodiment.
- the illumination light source 300 according to the fourth embodiment relates to the second embodiment in that the reflecting member 380 is provided with not the opening but the cutout 386. It differs from the light source 100 for illumination.
- the other configuration is basically the same as that of the illumination light source 100 according to the second embodiment. Therefore, only the difference will be described in detail, and the description of the other components will be simplified or omitted.
- symbol as 2nd Embodiment is used.
- the illumination light source 300 is an LED lamp that is an alternative to an incandescent lamp, and includes the semiconductor light emitting module 10, the base 20, the globe 30, the circuit unit 40, and the circuit holder 150.
- the reflecting member 380 has a body portion 381 and an attaching portion 382 in substantially the same shape as the body portion 181 and the attaching portion 182 of the reflecting member 180 according to the second embodiment, and the body is the same as the second embodiment.
- the lower end portion 387 of the portion 381 is fixed to the upper surface 19 of the element mounting portion 15 of the mounting substrate 11, and the mounting portion 382 is attached to the upper end portion 157 of the circuit holder 150.
- a rectangular notch 386 is radially provided centering on the cylinder axis along a direction orthogonal to the cylinder axis.
- each notch 386 is substantially rectangular such that its longitudinal direction is in a direction orthogonal to the lamp axis J in plan view, and the entire sealing body 13 of the semiconductor light emitting module 10 is a notch. Located within 386 (exposed from notch 386). With such a configuration, it is possible to further increase the ratio of the outgoing light going upward.
- the amount of exposure of the sealing body 13 from the cutout 386 in plan view may be reduced by shifting the position of the cutout 386.
- the notch portion 386 may be provided at a position where the entire sealing body 13 is concealed in the main body portion 381.
- the opening 86 is a through hole and nothing is inserted.
- the opening 86 may have a configuration that allows light to leak upward without this configuration, for example, the opening 86
- a translucent member may be fitted into all or a part of the, and light may leak upward through the translucent member.
- the notch 386 is in the state of being cut away and nothing is inserted therein, the light may leak upward even if the notch 386 is not such a configuration.
- a translucent member may be fitted into all or part of the notch 386, and light may leak upward through the translucent member.
- the number of cutouts 386 does not necessarily have to be the same as that of the sealing body 13 and may be more or less than the number of the sealing bodies 13, even if it is one or more. good.
- the width in the short side direction (the circumferential direction of the main body 381) of the notch 386 may be uniform over the longitudinal direction (the direction orthogonal to the lamp axis J), or extends as the distance from the lamp axis J increases. Also, the distance from the lamp axis J may be narrowed as the distance from the lamp axis J increases.
- the entire outer peripheral surface 385 of the main body portion 381 is a reflective surface.
- the entire outer peripheral surface 385 of the main body portion 381 is a reflective surface, but the entire outer peripheral surface 385 does not necessarily have to be a reflective surface, and only a part of the outer peripheral surface 385 is a reflective surface. It may be done.
- the semiconductor light emitting element 12 with a narrow irradiation angle is used for illumination
- the light distribution characteristic of the light source 300 is good. Furthermore, since another part of the main emitted light emitted from the semiconductor light emitting module 10 passes through the notch 386 and leaks upward, the designability when the illumination light source 300 is lit is good.
- FIG. 14 is a partially broken perspective view showing the illumination light source according to the fifth embodiment.
- FIG. 15 is a cross-sectional view showing the main configuration of the illumination light source according to the fifth embodiment.
- FIG. 16 is an enlarged sectional view showing a portion surrounded by a two-dot chain line in FIG.
- the illumination light source 400 according to the fifth embodiment includes the auxiliary reflection member that reflects part of the light having passed through the opening 486. This is largely different from the illumination light source 1 according to.
- the other configuration is basically the same as that of the illumination light source 1 according to the first embodiment. Therefore, only the difference will be described in detail, and the description of the other components will be simplified or omitted.
- the same reference numerals as in the first embodiment are used for the same members as in the first embodiment.
- the illumination light source 400 is an LED lamp that is an alternative to an incandescent lamp, and includes the semiconductor light emitting module 10, the base 20, the globe 30, the circuit unit 40, and the circuit holder 50.
- the reflection member 480 includes a main body 481 and an attachment portion 482, and an auxiliary reflection member 490 is attached to the upper surface of the attachment portion 482 by, for example, an engagement structure or adhesion.
- the main body portion 481 of the reflection member 480 has the same aspect as the main body portion 81 of the reflection member 80 according to the first embodiment, but the attachment portion 482 is an attachment portion of the reflection member 80 according to the first embodiment.
- 82 is slightly different in structure. Specifically, a protrusion 484 fitted to the notch 18 of the mounting substrate 11 is provided on the lower surface of the attachment portion 482 in the same manner as the attachment portion 82 according to the first embodiment. Is different in that a substantially circular hole 487 is provided substantially at the center thereof.
- the connector 17 of the semiconductor light emitting module 10 is provided not on the lower surface of the tongue piece portion 16 of the mounting substrate 11 but on the upper surface.
- the auxiliary reflection member 490 includes a substantially cylindrical main body portion 491 and a cap-like lid portion 492 that closes the upper side opening of the main body portion 491.
- the inner diameter of the main portion 491 is constant, but the outer diameter gradually increases from the lower side to the upper side on the upper side.
- the entire outer peripheral surface of the main body portion 491 is a reflecting surface, and the reflective surface is formed of the outer peripheral surface of a portion where the outer diameter of the main body portion 491 is constant, and has a linear shape parallel to the lamp axis J in the longitudinal cross section.
- a second reflecting surface 494 which is a substantially arc shape which is formed of a first reflecting surface 493 and an outer peripheral surface of a portion where the outer diameter of the main body portion 491 is expanded and which bulges toward the lamp axis J in the longitudinal cross section. It consists of
- a part of the light emitted from the semiconductor light emitting module 10 and passing through the opening 486 of the reflection member 480 is incident on the first reflection surface 493 of the auxiliary reflection member 490 and obliquely upward. And the other part is incident on the second reflective surface 494 of the auxiliary reflective member 490 and laterally reflected.
- creating an intermediate direction light that fills between the light traveling upward through the opening 486 of the reflection member 480 and the light that is reflected by the reflection surface 485 of the reflection member 480 and travels obliquely downward
- unevenness in the radiation intensity distribution does not easily occur, and the light distribution characteristic of the illumination light source 400 is particularly good.
- part of the light emitted from the semiconductor light emitting module 10 and passing through the opening 486 of the reflecting member 480 is directed upward without being incident on the first and second reflecting surfaces 493 and 494 of the auxiliary reflecting member 490.
- the design at the time of lighting of the illumination light source 100 is good.
- FIG. 17 is a view for explaining the illumination light source according to the sixth embodiment, and FIG. 17 (a) is a cross-sectional view showing the main configuration of the illumination light source, and FIG. It is a top view of a semiconductor light emitting module.
- the semiconductor light emitting element 512 is disposed also near the lamp axis J of the mounting substrate 511 of the semiconductor light emitting module 510.
- the second embodiment differs from the illumination light source 100 according to the second embodiment.
- the other configuration is basically the same as that of the illumination light source 100 according to the second embodiment. Therefore, only the difference will be described in detail, and the description of the other components will be simplified or omitted.
- symbol same as the embodiment is used.
- the illumination light source 500 is an LED lamp as a substitute for an incandescent lamp, and includes a semiconductor light emitting module 510 as a light source, a base 20 on which the semiconductor light emitting module 510 is mounted, and semiconductor light emission
- the globe 30 covering the module 510, the circuit unit 40 for lighting the semiconductor light emitting module 510, the circuit holder 150, the case 60, the base (not shown), and the light emitted from the semiconductor light emitting module 510 are diffused.
- the semiconductor light emitting module 510 has a substantially circular mounting substrate 511 instead of a substantially annular shape, and only the semiconductor light emitting element 512 is disposed on the mounting substrate 511 in a ring shape. It is also located inside the ring. Specifically, for example, in the central region of the mounting substrate 511 (the region near the lamp axis J), for example, four sets of semiconductor light emitting elements 512 in which two are set as one set are arranged. The four sets of semiconductor light emitting elements 512 are located inside the reflecting member 580. Note that the semiconductor light emitting elements 512 are sealed by a sealing body 513 for each set. Further, a connector 517 is provided on the lower surface of the mounting substrate 511.
- the reflecting member 580 has a substantially cylindrical main body 581. Like the main body part 181 of the reflection member 180 according to the second embodiment, the main body part 581 does not have the gradually enlarged diameter part 181a and the constant diameter part 181b, and the whole is from the bottom to the top The diameter gradually increases toward the The entire outer peripheral surface 585 of the main body portion 581 is a reflective surface, and has a substantially arc shape which bulges toward the lamp axis J in the longitudinal cross section.
- Openings 586 elongated in the direction orthogonal to the cylinder axis of the main body 581 are provided radially around the cylinder axis.
- each opening 586 is substantially rectangular such that its longitudinal direction is in a direction perpendicular to the lamp axis J in plan view, and the semiconductor light emitting elements 512 are arranged in an annular shape of the semiconductor light emitting module 510.
- a portion of the sealing body 513 that seals the light emitting diode is located in the opening 586 (exposed from the opening 586).
- the illumination light source 500 is configured as described above, the light emitted from the semiconductor light emitting element 512 located inside the reflection member 580 is almost interfered with the reflection member 580 Head upwards. Therefore, since the amount of light directed upward can be increased, the shadow by the reflecting member 580 is less likely to occur.
- the illumination light source may be an appropriate combination of the partial configuration of the illumination light source according to the first to sixth embodiments and the configuration according to the following modification.
- the materials, numerical values, and the like described in the above-described embodiment only exemplify preferable ones, and are not limited thereto.
- the semiconductor light emitting module according to the present invention may be configured to have only one semiconductor light emitting element instead of a plurality of semiconductor light emitting elements.
- a plurality of semiconductor light emitting elements 612 are arranged on the element mounting portion 615 of the mounting substrate 611 in a zigzag along the circumferential direction of the element mounting portion 615. It is good.
- the semiconductor light emitting elements 612 are sealed, for example, by individual sealing bodies 613 one by one. With such a configuration, the light emitting portion can be formed on the element mounting portion 615 more evenly, and the light distribution characteristic is further improved.
- a plurality of semiconductor light emitting elements 712 are arranged in the element mounting portion 715 of the mounting substrate 711 along the circumferential direction of the element mounting portion 715.
- the semiconductor light emitting device 712 may be sealed by one sealing member 713 having a substantially annular shape. With such a configuration, it is possible to make the light emitting part continuous in the circumferential direction of the element mounting portion 715, and thus it is difficult for the illuminance unevenness in the circumferential direction to occur.
- the combination with the reflective member 280 according to the third embodiment provided with the opening 286 elongated along the circumferential direction of the main body 281 is compatible with the opening 286 and the sealing body 213. The assembly of the illumination light source 200 is easier because the circumferential positioning thereof is completely unnecessary.
- the mounting substrate 811 includes an element mounting portion 815 having a substantially semicircular arc shape and a tongue piece 816 extending from one position of the element mounting portion 815, and a plurality of semiconductor light emitting elements 812 are arc-shaped in the element mounting portion 815.
- the semiconductor light emitting elements 812 are sealed by one substantially arc-shaped sealing body 813.
- the tongue piece portion 816 is provided with a connector 817.
- diffusion processing may be performed such that the light diffusivity is higher than in the other regions.
- FIG. 19 is a view for explaining the diffusion treatment applied to the glove according to the modification, which is an end view of the region 34 near the opening of the glove 30 and showing only the cut surface, and the lamp axis It is an end elevation cut by the plane containing J.
- the outer peripheral surface is formed by forming a region of double depression structure in which smaller depressions (dimples) are uniformly formed in each of the uniformly formed minute depressions (dimples).
- the light reflected obliquely downward avoiding the upper surface 22 of the base 20 by 85 can be diffused by (the area 34 in the vicinity of the opening of) the globe 30 to further expand the light distribution range further downward.
- the semiconductor light emitting device is disposed with its main emission direction upward, ie, in the direction of the lamp axis J.
- the semiconductor light emitting device may be disposed with all or part of the semiconductor light emitting device inclined with respect to the lamp axis J Thereby, the controllability of light distribution is improved, and a desired light distribution can be obtained.
- the present invention can be widely used in lighting in general.
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Abstract
Description
[概略構成]
図1は、第1の実施形態に係る照明用光源を示す一部破断斜視図である。図2は、図1に示すA-A線に沿った断面矢視図である。図3は、図2において二点鎖線で囲んだ部分を示す拡大断面図である。なお、本願図面において紙面上下方向に沿って描かれた一点鎖線は照明用光源のランプ軸Jを示しており、紙面上方が照明用光源の上方であって、紙面下方が照明用光源の下方である。
(1)半導体発光モジュール
図4は、第1の実施形態に係る半導体発光モジュールを示す平面図である。図4に示すように、半導体発光モジュール10は、実装基板11と、実装基板11に実装された光源としての複数の半導体発光素子12と、それら半導体発光素子12を被覆するように実装基板11上に設けられた封止体13とを備える。なお、本実施の形態では、半導体発光素子12はLEDであり、半導体発光モジュール10はLEDモジュールであるが、半導体発光素子12は、例えば、LD(レーザダイオード)であっても良く、EL素子(エレクトリックルミネッセンス素子)であっても良い。
図2に戻って、基台20は、例えば、略円柱形状の貫通孔21を有する略円筒形状であり、その筒軸がランプ軸Jと一致する姿勢で配置されている。したがって、貫通孔21は上下方向に貫通し、図3に示す基台20の上面22および下面23はいずれも略円環形状の平面である。そして、基台20の上面22に半導体発光モジュール10が搭載されており、これにより各半導体発光素子12がそれぞれの主出射方向を上方に向けた状態で平面配置された状態となっている。このように全ての半導体発光素子12が基台20の上面22に平面配置された構成であるため、基台20へ半導体発光素子12を容易に搭載することでき、照明用光源の組立作業が簡単である。
図2に戻って、グローブ30は、本実施の形態では、一般電球形状であるA型の電球のバルブを模した形状であり、グローブ30の開口側端部31をケース60の上方側端部62内に圧入することにより、半導体発光モジュール10および反射部材80の上方を覆った状態で、ケース60に固定されている。照明用光源1の外囲器は、グローブ30とケース60とで構成されている。
回路ユニット40は、半導体発光素子を点灯させるためのものであって、回路基板42と、当該回路基板42に実装された各種の電子部品43,44とを有している。なお、図面では一部の電子部品にのみ符号を付している。回路ユニット40は、回路ホルダ50内に収容されており、例えば、ねじ止め、接着、係合などにより回路ホルダ50に固定されている。
回路ホルダ50は、例えば、両側が開口した略円筒形状であって、大径部52と小径部53とで構成される。上方側に位置する大径部52には回路ユニット40の大半が収容されている。一方、下方側に位置する小径部53には口金70が外嵌されており、これによって回路ホルダ50の下方側開口54が塞がれている。回路ホルダ50は、例えば、樹脂などの絶縁性材料で形成されていることが好ましい。
ケース60は、例えば、両端が開口し上方から下方へ向けて縮径した円筒形状を有する。図3に示すように、ケース60の上方側端部62内には基台20とグローブ30の開口側端部31とが収容されており、例えばカシメによりケース60が基台20に固定されている。なお、ケース60、基台20およびグローブ30で囲まれた空間63に接着剤を流し込むなどしてケース60が基台20に固定されていても良い。
図2に戻って、口金70は、照明用光源1が照明器具に取り付けられ点灯された際に、照明器具のソケットから電力を受けるための部材である。口金70の種類は、特に限定されるものではないが、本実施の形態ではエジソンタイプであるE26口金が使用されている。口金70は、略円筒形状であって外周面が雄ねじとなっているシェル部71と、シェル部71に絶縁部72を介して装着されたアイレット部73とを備える。シェル部71とケース60との間には絶縁部材74が介在している。
反射部材80は、例えば、有底筒状であって、両側が開口した略円筒形状の本体部81と、本体部81の下方側開口を塞ぐ略円板形状の取付部82とを備える。反射部材80の材料としては、例えば、ポリカーボネート等の樹脂、アルミ等の金属、ガラス、セラミック等が考えられるが、本実施の形態ではポリカーボネートが使用されている。ポリカーボネート等の樹脂は軽量であるため照明用光源1の軽量化に好適である。
次に、照明用光源1の配光特性が良好である理由を詳細に説明する。図6は、照明用光源の配光特性を説明するための配光曲線図である。図6に示すように、配光曲線図は、照明用光源1の上方方向を含む360°の各方向に対する光度の大きさを表しており、照明用光源1のランプ軸Jに沿った上方を0°、ランプ軸Jに沿った下方を180°として、時計回りおよび反時計回りにそれぞれ10°間隔に目盛を刻んでいる。配光曲線図の径方向に付した目盛は光度を表しており、光度は各配光曲線における最大値を1とする相対的な大きさで表されている。
次に、照明用光源1は、反射部材80に開口部86が設けられているため、点灯時の意匠性も良好であることについて説明する。反射部材80の本体部81は、半導体発光素子12からの主出射光を反射させるだけでなく、その主出射光の一部が開口部86から上方へ漏れるため、反射部材80による影が生じ難く、点灯時に照明用光源1を上方および側方(ランプ軸Jと直交する方向)から見た場合の意匠性が良好である。
図8は、第2の実施形態に係る照明用光源を示す一部破断斜視図である。図9は、第2の実施形態に係る照明用光源の要部構成を示す断面図である。図8および図9に示すように、第2の実施の形態に係る照明用光源100は、本体部181の開口部186の形状が第1の実施形態に係る照明用光源1と大きく相違する。その他の構成については基本的に第1の実施形態に係る照明用光源1と略同様である。したがって、上記相違点についてのみ詳細に説明し、その他の構成については説明を簡略若しくは省略する。なお、第1の実施形態と同じ部材については、そのまま第1の実施形態と同じ符号を用いている。
図10は、第3の実施形態に係る照明用光源を示す一部破断斜視図である。図11は、第3の実施形態に係る照明用光源を説明するための図であって、図11(a)は照明用光源の要部構成を示す断面図、図11(b)は半導体発光モジュールを示す平面図である。図10および図11(a)に示すように、第3の実施の形態に係る照明用光源200は、本体部281の開口部286の形状および半導体発光素子212の配置が、第2の実施形態に係る照明用光源100と相違する。その他の構成については基本的に第2の実施形態に係る照明用光源100と略同様である。したがって、上記相違点についてのみ詳細に説明し、その他の構成については説明を簡略若しくは省略する。なお、既に説明した実施形態と同じ部材が使用されている場合は、その実施形態と同じ符号を用いている。
図12は、第4の実施形態に係る照明用光源を示す一部破断斜視図である。図13は、第4の実施形態に係る照明用光源の要部構成を示す断面図である。図12および図13に示すように、第4の実施の形態に係る照明用光源300は、反射部材380に開口部ではなく切欠部386が設けられている点において、第2の実施形態に係る照明用光源100と相違する。その他の構成については基本的に第2の実施形態に係る照明用光源100と略同様である。したがって、上記相違点についてのみ詳細に説明し、その他の構成については説明を簡略若しくは省略する。なお、第2の実施形態と同じ部材については、第2の実施形態と同じ符号を用いている。
図14は、第5の実施形態に係る照明用光源を示す一部破断斜視図である。図15は、第5の実施形態に係る照明用光源の要部構成を示す断面図である。図16は、図15において二点鎖線で囲んだ部分を示す拡大断面図である。図14および図15に示すように、第5の実施の形態に係る照明用光源400は、開口部486を通過した光の一部を反射させる補助反射部材を備える点において、第1の実施形態に係る照明用光源1と大きく相違する。その他の構成については基本的に第1の実施形態に係る照明用光源1と略同様である。したがって、上記相違点についてのみ詳細に説明し、その他の構成については説明を簡略若しくは省略する。なお、第1の実施形態と同じ部材については、そのまま第1の実施形態と同じ符号を用いている。
図17は、第6の実施形態に係る照明用光源を説明するための図であって、図17(a)は照明用光源の要部構成を示す断面図であり、図17(b)は半導体発光モジュールの平面図である。図17(a)に示すように、第6の実施の形態に係る照明用光源500は、半導体発光モジュール510の実装基板511のランプ軸J付近にも半導体発光素子512が配置されている点において、第2の実施形態に係る照明用光源100と相違する。その他の構成については基本的に第2の実施形態に係る照明用光源100と略同様である。したがって、上記相違点についてのみ詳細に説明し、その他の構成については説明を簡略若しくは省略する。なお、既に説明した実施形態と同じ部材が使用されている場合は、その実施形態と同じ符号を用いている。
以上、本発明の構成を第1~第6の実施の形態に基づいて説明したが、本発明は上記実施の形態に限られない。例えば、第1~第6の実施形態に係る照明用光源の部分的な構成、および下記の変形例に係る構成を、適宜組み合わせてなる照明用光源であっても良い。また、上記実施の形態に記載した材料、数値等は好ましいものを例示しているだけであり、それに限定されることはない。さらに、本発明の技術的思想の範囲を逸脱しない範囲で、照明用光源の構成に適宜変更を加えることは可能である。
12,212,512,612,712,812 半導体発光素子
18 内面
20 基台
21 貫通孔
22 上面
30 グローブ
35,36 窪み
40 回路ユニット
50,150 回路ホルダ
55 外面
80,180,280,380,480,580 反射部材
81,181,281,381,481,581 本体部
181a,281a,381a 漸次拡径した部分
85,185,285,385,485,585 反射面
86,186,286,486,586 開口部
386 切欠部
490 補助反射部材
493,494 反射面
Claims (14)
- 複数の半導体発光素子が基台の上面にそれぞれの主出射方向を上方に向けた状態で配置され、各半導体発光素子の上方にそれら半導体発光素子の主出射光の一部を前記基台の上面を避けた斜め下方へ反射させる反射面を有する反射部材が配置されていると共に、前記反射部材に前記主出射光の他の一部を上方へ漏らすための開口部または切欠部が設けられていることを特徴とする照明用光源。
- 前記複数の半導体発光素子は前記基台の上面に環状に配置されており、前記反射部材の反射面はそれら半導体発光素子と対向する環形状であって、前記反射面に入射した光は前記基台を側方から囲繞する環状の領域を通過することを特徴とする請求項1記載の照明用光源。
- 前記反射部材は筒状の本体部を有し、前記本体部は、その筒軸が前記基台の上面と直交し、その外径が少なくとも一部において下方から上方へ向け漸次拡径し、その漸次拡径した部分の外周面で前記複数の半導体発光素子の上方を覆うものであって、前記漸次拡径した部分の外周面が少なくとも前記反射面であることを特徴とする請求項2記載の照明用光源。
- 前記本体部の漸次拡径する部分の外周面は、前記本体部の筒軸側に凹入した凹曲面形状であることを特徴とする請求項3記載の照明用光源。
- 前記開口部または切欠部は、少なくとも前記本体部に設けられていることを特徴とする請求項3または4に記載の照明用光源。
- 前記開口部または切欠部は、前記本体部の筒軸を中心として前記本体部の周方向に沿って間隔を空けて複数設けられていることを特徴とする請求項5記載の照明用光源。
- 前記各開口部または各切欠部は、前記本体部の筒軸と直交する方向に沿って長尺であって、その筒軸を中心として放射状に設けられていることを特徴とする請求項6記載の照明用光源。
- 前記各開口部または各切欠部は、前記本体部の周方向に沿って長尺であって、その筒軸を中心として環状または円弧状に設けられていることを特徴とする請求項6記載の照明用光源。
- さらに、開口部または切欠部を通過した光の一部を側方へ反射させる補助反射部材を備えることを特徴とする請求項1~8のいずれかに記載の照明用光源。
- 前記基台は上方方向に貫通する貫通孔を有し、前記貫通孔内には前記複数の半導体発光素子を点灯させるための回路ユニットの少なくとも一部が配置されていることを特徴とする請求項1~9のいずれかに記載の照明用光源。
- 前記回路ユニットの少なくとも一部は、回路ホルダ内に収容された状態で前記基台の貫通孔内に配置されており、前記回路ホルダの外面と前記基台の貫通孔の内面との間には隙間が設けられていることを特徴とする請求項10記載の照明用光源。
- 前記反射部材の上方を覆うグローブを備え、当該グローブは、前記斜め下方へ反射した光が到達する領域の方がそれ以外の領域よりも光拡散性が高いことを特徴とする請求項1~11のいずれかに記載の照明用光源。
- 半導体発光素子をランプ軸方向に対して全て、あるいは一部を傾けて配置したことを特徴とする請求項1~12のいずれかに記載の照明用光源。
- 前記グローブの内周面には、前記斜め下方へ反射した光が到達する領域に複数の窪みが形成されており、それぞれの窪みの内面にはさらに窪みが形成されていることを特徴とする請求項12に記載の照明用光源。
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- 2011-09-30 US US13/513,121 patent/US20120273812A1/en not_active Abandoned
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JP2014032877A (ja) * | 2012-08-03 | 2014-02-20 | Iris Ohyama Inc | Led照明装置 |
JP2015032830A (ja) * | 2013-08-05 | 2015-02-16 | アドヴァンスト オプトエレクトロニック テクノロジー インコーポレイテッドAdvanced Optoelectronic Technology Inc. | 発光ダイオードランプ |
US9200764B2 (en) | 2013-08-05 | 2015-12-01 | Advanced Optoelectronic Technology, Inc. | Light emitting diode lamp |
JP2017175054A (ja) * | 2016-03-25 | 2017-09-28 | 東芝ライテック株式会社 | 発光装置、および照明装置 |
JP2020038800A (ja) * | 2018-09-05 | 2020-03-12 | スタンレー電気株式会社 | 車両用灯具 |
JP7193276B2 (ja) | 2018-09-05 | 2022-12-20 | スタンレー電気株式会社 | 車両用灯具 |
Also Published As
Publication number | Publication date |
---|---|
US20120273812A1 (en) | 2012-11-01 |
EP2587562A4 (en) | 2013-06-12 |
CN102714266B (zh) | 2016-03-16 |
CN102714266A (zh) | 2012-10-03 |
EP2587562A1 (en) | 2013-05-01 |
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