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WO2009005135A1 - Agent de durcissement pour une composition de résine époxy et agent de durcissement de la résine époxy - Google Patents

Agent de durcissement pour une composition de résine époxy et agent de durcissement de la résine époxy Download PDF

Info

Publication number
WO2009005135A1
WO2009005135A1 PCT/JP2008/062113 JP2008062113W WO2009005135A1 WO 2009005135 A1 WO2009005135 A1 WO 2009005135A1 JP 2008062113 W JP2008062113 W JP 2008062113W WO 2009005135 A1 WO2009005135 A1 WO 2009005135A1
Authority
WO
WIPO (PCT)
Prior art keywords
epoxy resin
curing agent
carbon atoms
optionally substituted
general formula
Prior art date
Application number
PCT/JP2008/062113
Other languages
English (en)
Japanese (ja)
Inventor
Yoshihiko Takada
Original Assignee
Asahi Kasei E-Materials Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Kasei E-Materials Corporation filed Critical Asahi Kasei E-Materials Corporation
Priority to JP2009521673A priority Critical patent/JP5138685B2/ja
Publication of WO2009005135A1 publication Critical patent/WO2009005135A1/fr

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07D—HETEROCYCLIC COMPOUNDS
    • C07D233/00—Heterocyclic compounds containing 1,3-diazole or hydrogenated 1,3-diazole rings, not condensed with other rings
    • C07D233/54—Heterocyclic compounds containing 1,3-diazole or hydrogenated 1,3-diazole rings, not condensed with other rings having two double bonds between ring members or between ring members and non-ring members
    • C07D233/56—Heterocyclic compounds containing 1,3-diazole or hydrogenated 1,3-diazole rings, not condensed with other rings having two double bonds between ring members or between ring members and non-ring members with only hydrogen atoms or radicals containing only hydrogen and carbon atoms, attached to ring carbon atoms
    • C07D233/60—Heterocyclic compounds containing 1,3-diazole or hydrogenated 1,3-diazole rings, not condensed with other rings having two double bonds between ring members or between ring members and non-ring members with only hydrogen atoms or radicals containing only hydrogen and carbon atoms, attached to ring carbon atoms with hydrocarbon radicals, substituted by oxygen or sulfur atoms, attached to ring nitrogen atoms
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/5046—Amines heterocyclic
    • C08G59/5053—Amines heterocyclic containing only nitrogen as a heteroatom
    • C08G59/5073—Amines heterocyclic containing only nitrogen as a heteroatom having two nitrogen atoms in the ring
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/64—Amino alcohols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Epoxy Resins (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)

Abstract

L'invention concerne un agent de durcissement d'une résine époxy qui est représenté par la formule générale suivante (1) ou (2). (1) (2) (Dans les formules, R1 et R5 représentent chacun un atome d'hydrogène, un groupe alkyle facultativement substitué ayant de 1 à 6 atomes de carbone ou un groupe aryle facultativement substitué ayant de 1 à 12 atomes de carbone ; R2 représente un atome d'hydrogène ou un groupe alkyle facultativement substitué ayant de 1 à 6 atomes de carbone ; R3 et R4 représentent indépendamment un atome d'hydrogène ou un groupe représenté par la formule générale suivante (3) : (3) (R1 et R2 étant tels que définis ci-dessus) ou la formule générale suivante (4) : (4) ; et n représente un nombre entier allant de 1 à 3.)
PCT/JP2008/062113 2007-07-05 2008-07-03 Agent de durcissement pour une composition de résine époxy et agent de durcissement de la résine époxy WO2009005135A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009521673A JP5138685B2 (ja) 2007-07-05 2008-07-03 エポキシ樹脂用硬化剤及びエポキシ樹脂用硬化剤組成物

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007177261 2007-07-05
JP2007-177261 2007-07-05

Publications (1)

Publication Number Publication Date
WO2009005135A1 true WO2009005135A1 (fr) 2009-01-08

Family

ID=40226176

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/062113 WO2009005135A1 (fr) 2007-07-05 2008-07-03 Agent de durcissement pour une composition de résine époxy et agent de durcissement de la résine époxy

Country Status (3)

Country Link
JP (1) JP5138685B2 (fr)
TW (1) TW200916496A (fr)
WO (1) WO2009005135A1 (fr)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010122995A1 (fr) * 2009-04-24 2010-10-28 旭化成イーマテリアルズ株式会社 Composition microencapsulée contenant un composé imidazole, composition durcissable l'utilisant et agent de durcissement de type mélange-maître
JP2013095876A (ja) * 2011-11-02 2013-05-20 Asahi Kasei E-Materials Corp 硬化剤、マイクロカプセル型硬化剤、マスターバッチ型硬化剤組成物、一液性エポキシ樹脂組成物および加工品
KR20140065420A (ko) * 2011-09-20 2014-05-29 헨켈 아게 운트 코. 카게아아 은-코팅된 입자를 포함하는 전기 전도성 접착제
KR20190016303A (ko) * 2017-08-08 2019-02-18 주식회사 케이씨씨 양이온성 우레탄 경화제 및 이를 포함하는 전착 도료 조성물
CN112500821A (zh) * 2020-12-29 2021-03-16 烟台信友新材料有限公司 一种紫外光固化可变操作时间单组份环氧胶及其制备方法

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI406925B (zh) * 2010-09-14 2013-09-01 Zhen Ding Technology Co Ltd 電路板基板及其製作方法
TWI582370B (zh) * 2015-03-17 2017-05-11 Method for Making High Thermal Conductivity Elements

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06207152A (ja) * 1992-10-02 1994-07-26 W R Grace & Co 低粘度無溶媒の一液型エポキシ樹脂接着性組成物
JPH09175848A (ja) * 1995-10-24 1997-07-08 Asahi Chem Ind Co Ltd セメント成形体用組成物
JP2000080146A (ja) * 1998-09-03 2000-03-21 Asahi Chem Ind Co Ltd エポキシ系樹脂組成物
JP2002088137A (ja) * 2000-09-14 2002-03-27 Sanwa Chemical Industry Co Ltd エポキシ樹脂用低温硬化型潜在性硬化剤
JP2004292737A (ja) * 2003-03-28 2004-10-21 Asahi Denka Kogyo Kk エポキシ樹脂用硬化剤組成物
WO2007037378A1 (fr) * 2005-09-29 2007-04-05 Asahi Kasei Chemicals Corporation Agent de durcissement microencapsule presentant une grande stabilite pour resine epoxy et composition de resine epoxy
WO2007088889A1 (fr) * 2006-02-03 2007-08-09 Asahi Kasei Chemicals Corporation Agent de durcissement de type microcapsule pour resine epoxy, composition d'agent de durcissement de type melange maitre pour resine epoxy, composition de resine epoxy de type en une partie et article traite

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH041219A (ja) * 1990-04-19 1992-01-06 Toyama Pref Gov 一液型熱硬化性組成物
JP3270775B2 (ja) * 1992-01-24 2002-04-02 ナショナル スターチ アンド ケミカル インベストメント ホールディング コーポレイション 改良されたエポキシ樹脂用潜在性硬化剤及びその製造方法
JPH06184274A (ja) * 1992-12-16 1994-07-05 Fuji Kasei Kogyo Kk 一成分系加熱硬化性エポキシド組成物
JP3562323B2 (ja) * 1998-07-09 2004-09-08 株式会社スリーボンド 熱硬化型導電性接着剤

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06207152A (ja) * 1992-10-02 1994-07-26 W R Grace & Co 低粘度無溶媒の一液型エポキシ樹脂接着性組成物
JPH09175848A (ja) * 1995-10-24 1997-07-08 Asahi Chem Ind Co Ltd セメント成形体用組成物
JP2000080146A (ja) * 1998-09-03 2000-03-21 Asahi Chem Ind Co Ltd エポキシ系樹脂組成物
JP2002088137A (ja) * 2000-09-14 2002-03-27 Sanwa Chemical Industry Co Ltd エポキシ樹脂用低温硬化型潜在性硬化剤
JP2004292737A (ja) * 2003-03-28 2004-10-21 Asahi Denka Kogyo Kk エポキシ樹脂用硬化剤組成物
WO2007037378A1 (fr) * 2005-09-29 2007-04-05 Asahi Kasei Chemicals Corporation Agent de durcissement microencapsule presentant une grande stabilite pour resine epoxy et composition de resine epoxy
WO2007088889A1 (fr) * 2006-02-03 2007-08-09 Asahi Kasei Chemicals Corporation Agent de durcissement de type microcapsule pour resine epoxy, composition d'agent de durcissement de type melange maitre pour resine epoxy, composition de resine epoxy de type en une partie et article traite

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010122995A1 (fr) * 2009-04-24 2010-10-28 旭化成イーマテリアルズ株式会社 Composition microencapsulée contenant un composé imidazole, composition durcissable l'utilisant et agent de durcissement de type mélange-maître
JP5763527B2 (ja) * 2009-04-24 2015-08-12 旭化成イーマテリアルズ株式会社 イミダゾール化合物含有マイクロカプセル化組成物、それを用いた硬化性組成物及びマスターバッチ型硬化剤
KR20140065420A (ko) * 2011-09-20 2014-05-29 헨켈 아게 운트 코. 카게아아 은-코팅된 입자를 포함하는 전기 전도성 접착제
JP2014531495A (ja) * 2011-09-20 2014-11-27 ヘンケル・アクチェンゲゼルシャフト・ウント・コムパニー・コマンディットゲゼルシャフト・アウフ・アクチェンＨｅｎｋｅｌ ＡＧ ＆ Ｃｏ．ＫＧａＡ 銀被覆粒子含有導電性接着剤
US9770886B2 (en) 2011-09-20 2017-09-26 Henkel Ag & Co. Kgaa Electrically conductive adhesives comprising silver-coated particles
KR102009534B1 (ko) * 2011-09-20 2019-08-09 헨켈 아게 운트 코. 카게아아 은-코팅된 입자를 포함하는 전기 전도성 접착제
JP2013095876A (ja) * 2011-11-02 2013-05-20 Asahi Kasei E-Materials Corp 硬化剤、マイクロカプセル型硬化剤、マスターバッチ型硬化剤組成物、一液性エポキシ樹脂組成物および加工品
KR20190016303A (ko) * 2017-08-08 2019-02-18 주식회사 케이씨씨 양이온성 우레탄 경화제 및 이를 포함하는 전착 도료 조성물
KR102042239B1 (ko) 2017-08-08 2019-11-08 주식회사 케이씨씨 양이온성 우레탄 경화제 및 이를 포함하는 전착 도료 조성물
CN112500821A (zh) * 2020-12-29 2021-03-16 烟台信友新材料有限公司 一种紫外光固化可变操作时间单组份环氧胶及其制备方法

Also Published As

Publication number Publication date
JPWO2009005135A1 (ja) 2010-08-26
TWI370823B (fr) 2012-08-21
TW200916496A (en) 2009-04-16
JP5138685B2 (ja) 2013-02-06

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