WO2009098815A1 - 液体原料気化器及びそれを用いた成膜装置 - Google Patents
液体原料気化器及びそれを用いた成膜装置 Download PDFInfo
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- WO2009098815A1 WO2009098815A1 PCT/JP2008/072233 JP2008072233W WO2009098815A1 WO 2009098815 A1 WO2009098815 A1 WO 2009098815A1 JP 2008072233 W JP2008072233 W JP 2008072233W WO 2009098815 A1 WO2009098815 A1 WO 2009098815A1
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- Prior art keywords
- liquid
- raw material
- vaporizer
- radiant heat
- gas
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- 239000011344 liquid material Substances 0.000 title claims abstract description 64
- 239000007788 liquid Substances 0.000 claims abstract description 216
- 239000003595 mist Substances 0.000 claims abstract description 31
- 239000000463 material Substances 0.000 claims abstract description 19
- 238000007599 discharging Methods 0.000 claims abstract description 4
- 239000002994 raw material Substances 0.000 claims description 146
- 239000006200 vaporizer Substances 0.000 claims description 109
- 230000008016 vaporization Effects 0.000 claims description 108
- 238000009834 vaporization Methods 0.000 claims description 86
- 238000005192 partition Methods 0.000 claims description 11
- 239000000758 substrate Substances 0.000 claims description 10
- 238000000034 method Methods 0.000 claims description 9
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 3
- 229910052799 carbon Inorganic materials 0.000 claims description 3
- 239000010453 quartz Substances 0.000 claims description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 3
- 230000005855 radiation Effects 0.000 abstract description 4
- 230000001678 irradiating effect Effects 0.000 abstract 1
- 239000007789 gas Substances 0.000 description 79
- 239000010408 film Substances 0.000 description 62
- 239000012159 carrier gas Substances 0.000 description 48
- 238000011144 upstream manufacturing Methods 0.000 description 16
- 238000010438 heat treatment Methods 0.000 description 11
- 230000015572 biosynthetic process Effects 0.000 description 7
- 238000002347 injection Methods 0.000 description 7
- 239000007924 injection Substances 0.000 description 7
- 229910052751 metal Inorganic materials 0.000 description 7
- 239000002184 metal Substances 0.000 description 7
- 239000007787 solid Substances 0.000 description 7
- 239000002245 particle Substances 0.000 description 6
- 229910001220 stainless steel Inorganic materials 0.000 description 5
- 239000010935 stainless steel Substances 0.000 description 5
- 238000005229 chemical vapour deposition Methods 0.000 description 4
- 239000000470 constituent Substances 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 238000000151 deposition Methods 0.000 description 3
- 230000008021 deposition Effects 0.000 description 3
- 238000012856 packing Methods 0.000 description 3
- 230000035699 permeability Effects 0.000 description 3
- 239000011148 porous material Substances 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 238000000231 atomic layer deposition Methods 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- -1 ceramics Chemical class 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 239000009719 polyimide resin Substances 0.000 description 2
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 2
- 229920003002 synthetic resin Polymers 0.000 description 2
- 239000000057 synthetic resin Substances 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 230000002159 abnormal effect Effects 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229910052735 hafnium Inorganic materials 0.000 description 1
- VBJZVLUMGGDVMO-UHFFFAOYSA-N hafnium atom Chemical compound [Hf] VBJZVLUMGGDVMO-UHFFFAOYSA-N 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 150000002736 metal compounds Chemical class 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 238000002488 metal-organic chemical vapour deposition Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 229910001120 nichrome Inorganic materials 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000005268 plasma chemical vapour deposition Methods 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/448—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for generating reactive gas streams, e.g. by evaporation or sublimation of precursor materials
- C23C16/4486—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for generating reactive gas streams, e.g. by evaporation or sublimation of precursor materials by producing an aerosol and subsequent evaporation of the droplets or particles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
- H01L21/02172—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing at least one metal element, e.g. metal oxides, metal nitrides, metal oxynitrides or metal carbides
- H01L21/02175—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing at least one metal element, e.g. metal oxides, metal nitrides, metal oxynitrides or metal carbides characterised by the metal
- H01L21/02181—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing at least one metal element, e.g. metal oxides, metal nitrides, metal oxynitrides or metal carbides characterised by the metal the material containing hafnium, e.g. HfO2
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
Definitions
- the present invention relates to a liquid source vaporizer that generates a source gas by vaporizing a liquid source and a film forming apparatus using the same.
- an organic metal compound or the like is formed in a film forming chamber in which the substrate to be processed is placed.
- CVD chemical vapor deposition
- an organic raw material gas is supplied and this organic raw material gas is reacted with another gas such as oxygen or ammonia to form a film. Since many organic raw materials used in such a CVD method are liquid or solid at room temperature, a vaporizer for vaporizing the organic raw materials is required.
- the above organic raw material is introduced into a vaporizer after having been liquefied beforehand using a solvent.
- a conventional vaporizer that vaporizes such a liquid raw material to generate a raw material gas
- a vaporization surface having a large number of holes is provided in the vaporization chamber, and the vaporization surface is heated by a resistance heater while the liquid is discharged from the nozzle.
- a raw material discharged into droplets (mist) is vaporized by being placed on the flow of a carrier gas and sprayed on a vaporization surface.
- a vaporizer in order to increase the vaporization efficiency, it is desirable to spray the liquid raw material on the vaporization surface as droplets having the smallest possible diameter.
- the smaller the diameter of the droplet the more likely it will pass through the hole without contacting the vaporization surface.
- the droplets that could not be vaporized in this way enter the film formation chamber on the carrier gas stream and cause generation of particles. For example, if a liquid source droplet that could not be vaporized entered the deposition chamber and oxygen remained in the deposition chamber, the droplet would oxidize into fine particles that would adhere to the substrate. There is a problem that abnormal film formation and film quality defects occur.
- the raw material gas generated by the vaporizer is supplied to the film forming chamber through a filter having minute holes, and this filter is heated by a resistance heater or the like to vaporize the raw material gas.
- the droplets that could not be broken were vaporized through the filter. According to this, even if the vaporization efficiency of the vaporizer itself is somewhat poor, it is possible to prevent the liquid droplets that could not be vaporized from entering the film forming chamber as they are.
- a gas-permeable member having fine pores such as a solid packing having a pore or a porous material is disposed, and the gas-permeable member is heated by a resistance heater or a heat medium.
- Some of them are vaporized through droplets of a liquid source (see, for example, Patent Documents 1 and 2). According to this, since the possibility that the droplet contacts the breathable member increases, the vaporization efficiency can be improved.
- JP 2005-347598 A Japanese Patent Laid-Open No. 10-85581
- air-permeable members such as solid fillers, porous bodies, and filters that have been used to vaporize liquid raw material droplets have been heated by heat conduction from a resistance heater.
- the amount of heat could not be supplied uniformly over the entire member.
- the breathable members for example, there are portions where the temperature is low, such as a portion where the amount of heat does not reach sufficiently because they are separated from the resistance heater, so there is a possibility that the droplets are not vaporized and clogged.
- the surface of the air-permeable member since the surface of the air-permeable member has a large number of holes, its surface area is wide, and the air-permeable member originally has high heat dissipation. In addition, the surface is exposed to low temperature source gas or liquid source droplets. For this reason, in the whole breathable member, the temperature of the region where the heat from the resistance heater is difficult to be transmitted further decreases. Further, when a liquid material droplet adheres to the surface of the air-permeable member and is vaporized, heat is removed from the air-permeable member by the heat of vaporization at that time. At this time, in the region where heat is not easily transmitted, the heat energy corresponding to the heat of vaporization cannot be sufficiently replenished, resulting in a temperature difference in the breathable member.
- the temperature in the central region of the solid filling is higher than the outer peripheral region near the resistance heater. It is difficult to make the temperature of the entire solid packing uniform, such as lowering the temperature. In such a case, the temperature of the central region does not reach the temperature at which the liquid raw material can be vaporized, and vaporization failure may occur and the solid packing may be clogged.
- an object of the present invention is to make the temperature of the entire breathable member uniform when vaporizing liquid raw material droplets through the breathable member.
- An object of the present invention is to provide a liquid source vaporizer that can prevent clogging without being vaporized and a film forming apparatus using the same.
- a liquid material supply unit that discharges liquid material in the form of droplets, and a vaporization that generates the material gas by vaporizing the liquid material in the form of droplets.
- an introduction port for introducing the liquid material in the form of liquid droplets from the liquid material supply unit into the vaporization unit, and a breathable member disposed in the vaporization unit and made of a material heated by radiant heat
- a radiant heat heater that irradiates the entire outer surface of the mist trap portion and the breathable member with heat rays and heats the breathable member by the radiant heat, and the liquid material in the form of droplets is passed through the heated breathable member.
- a raw material gas is introduced from a liquid raw material vaporizer that vaporizes a liquid raw material to generate a raw material gas, and a film forming process is performed on the substrate to be processed.
- a film forming apparatus including a film forming chamber, wherein the liquid source vaporizer includes a liquid source supply unit that discharges the liquid source in the form of droplets, and a source gas that vaporizes the droplet-like liquid source A vaporizer configured to generate gas, an inlet for introducing the liquid material in the form of liquid droplets from the liquid material supply unit into the vaporization unit, and a vent configured by a material disposed in the vaporization unit and heated by radiant heat A mist trap portion made of a heat-permeable member, a radiant heat heater that irradiates the entire outer surface of the air-permeable member with heat rays, and heats the air-permeable member by the radiant heat, and the droplet-like shape on the heated air-permeable member Mind through liquid ingredients Film forming apparatus is provided which is characterized in that a delivery port delivering the generated raw material gas to the outside by.
- the mist trap part that captures and vaporizes the liquid material in the form of liquid droplets is constituted by the breathable member heated by radiant heat, and the radiant heat heater applies the heat rays to the entire outer surface of the breathable member. Since irradiation is performed, the entire breathable member can be heated uniformly. As a result, the temperature of the air-permeable member can be made uniform throughout, so that all the liquid droplets can be vaporized evenly by simply passing the liquid material in the form of liquid droplets through the air-permeable member. Thereby, while being able to improve vaporization efficiency more than before, since the vaporization defect by a partial temperature fall can be prevented, clogging of a breathable member can be prevented.
- the introduction port and the delivery port of the vaporization section are provided to face each other, and the air-permeable member has a cylindrical shape arranged from the introduction port side to the delivery port side, and the introduction port side It is preferable that the end of the outlet is closed and the end on the outlet side communicates with the outlet.
- the air-permeable member in a cylindrical shape, the surface area of the air-permeable member can be increased with a more compact size. Therefore, a sufficient amount of liquid material can be vaporized by vaporizing more liquid droplets.
- by closing the end portion on the introduction port side it is possible to guide the liquid material droplet supplied from the introduction port to the outer side surface of the breathable member surrounded by the radiant heat heater.
- the radiant heater is preferably arranged so as to surround the outer surface of the breathable member.
- a radiant heater is composed of, for example, a carbon heater that can be easily processed into a desired shape. According to this, since the whole surface of the air-permeable member can be heated from the radiant heat heater at a time, the heating efficiency can be further increased.
- a cylindrical partition member that partitions the vaporization space in which the liquid material in the form of liquid droplets circulates and the installation space of the radiant heat heater is surrounded by the gas permeable member between the gas permeable member and the radiant heat heater. It is preferable that the partition member is formed of a non-breathable member that transmits heat rays irradiated by the radiant heater. Such a partition member is made of, for example, quartz. By providing such a partition member, it is possible to prevent particles from adhering to the surface of the radiant heat heater and to improve the vaporization efficiency of the liquid material in the form of droplets.
- the temperature of the breathable member is controlled, and the radiant heater is controlled based on the temperature of the breathable member measured by the temperature sensor, whereby the temperature of the breathable member is set to a predetermined temperature.
- a control unit that adjusts to the above may be provided.
- the temperature of the breathable member can be accurately adjusted by directly measuring and monitoring the temperature of the breathable member with the temperature sensor and controlling the radiant heat heater based on the measured temperature. For this reason, the temperature of the whole breathable member can always be kept at a predetermined temperature.
- the inner surface of the housing constituting the outer frame of the vaporizing portion is mirror-finished so as to reflect the heat rays from the radiant heat heater and to go to the outer surface of the breathable member.
- the heat rays from the radiant heat heater can be efficiently collected on the breathable member, so that the heating efficiency of the breathable member can be increased.
- a liquid source vaporizer connected to another liquid source vaporizer for generating a source gas by vaporizing a liquid source. Irradiate the entire outer surface of the breathable member with an introduction port for introducing the raw material gas generated by the liquid raw material vaporizer, a mist trap part made of a breathable member made of a material heated by radiant heat And a radiant heat heater that heats the breathable member by the radiant heat, and a delivery port that sends the source gas from the other liquid source vaporizer introduced from the inlet to the outside through the heated breathable member;
- a liquid raw material vaporizer is provided.
- the other liquid raw material vaporizer by passing the raw material gas generated by the other liquid raw material vaporizer through the breathable member heated by the radiant heat from the radiant heat heater, the other liquid raw material vaporizer cannot be vaporized.
- the liquid droplets can also be vaporized by the liquid raw material vaporizer according to the present invention.
- a raw material gas is introduced from a liquid raw material vaporizer that vaporizes a liquid raw material to generate a raw material gas, and a film forming process is performed on the substrate to be processed.
- a film forming apparatus including a film forming chamber, wherein the liquid raw material vaporizer includes a first liquid raw material vaporizer that vaporizes a liquid raw material to generate a raw material gas, and a second liquid raw material vaporizer connected thereto.
- the second liquid raw material vaporizer comprises an inlet for introducing the raw material gas generated by the first liquid raw material vaporizer, and a breathable member composed of a material heated by radiant heat.
- a mist trap section a radiant heat heater that irradiates the entire outer surface of the breathable member with heat rays, and heats the breathable member by the radiant heat, and the first liquid raw material vaporizer introduced from the inlet.
- the raw material gas Film forming apparatus characterized by comprising a delivery port delivering the outside through the air-permeable member which is is provided.
- the raw material gas generated by the first liquid raw material vaporizer is passed through the gas permeable member of the second liquid raw material vaporizer heated by the radiant heat from the radiant heat heater. Droplets that could not be vaporized by one liquid source vaporizer can also be vaporized by the second liquid source vaporizer. Thereby, it is possible to prevent liquid material droplets from entering the film forming chamber and the like together with the material gas.
- the entire breathable member can be directly heated by the radiant heat generated by the radiant heat heater. For this reason, since it can heat uniformly over the whole air permeable member, all the droplets can be vaporized uniformly. As a result, the vaporization efficiency can be improved as compared with the conventional case, and the vaporization failure due to a partial temperature drop can be prevented, so that the air-permeable member can be prevented from being clogged.
- FIG. 1 is a diagram for explaining a schematic configuration example of a film forming apparatus according to the first embodiment.
- a film forming apparatus 100 shown in FIG. 1 forms a metal oxide film on a substrate to be processed, for example, a semiconductor wafer (hereinafter simply referred to as “wafer”) W by a CVD method, for example, an HTB (hafnium tarbutoxy).
- Wafer semiconductor wafer
- HTB hafnium tarbutoxy
- Liquid source supply source 110 for supplying a liquid source containing Hf such as side), a carrier gas supply source 120 for supplying an inert gas such as Ar as a carrier gas, and a liquid source supplied from the liquid source supply source 110
- a liquid source vaporizer 300 that generates a source gas by vaporizing
- a film formation chamber 200 that forms, for example, an HfO 2 film on the wafer W using the source gas generated by the liquid source vaporizer 300
- a control unit 140 that controls each unit is provided.
- the liquid source supply source 110 and the liquid source vaporizer 300 are connected by a liquid source supply pipe 112, and the carrier gas supply source 120 and the liquid source vaporizer 300 are connected by a carrier gas supply pipe 122.
- the vaporizer 300 and the film forming chamber 200 are connected by a source gas supply pipe 132.
- the liquid source supply pipe 112 is provided with a liquid source flow rate control valve 114
- the carrier gas supply pipe 122 is provided with a carrier gas flow rate control valve 124
- the source gas supply pipe 132 is provided with a source gas flow rate control valve 134. Is provided.
- the liquid raw material flow rate control valve 114, the carrier gas flow rate control valve 124 and the raw material gas flow rate control valve 134 are configured such that their opening degrees are adjusted by a control signal from the control unit 140.
- the control unit 140 measures the flow rate of the liquid raw material flowing through the liquid raw material supply pipe 112, the flow rate of the carrier gas flowing through the carrier gas supply pipe 122, and the flow rate of the raw material gas flowing through the raw material gas supply pipe 132. Accordingly, it is preferable to output a control signal.
- the film formation chamber 200 includes, for example, a substantially cylindrical side wall member 210, and a susceptor on which the wafer W is horizontally placed in an internal space surrounded by the side wall member 210, the top wall member 212, and the bottom wall member 214.
- 222 is comprised.
- the side wall member 210, the top wall member 212, and the bottom wall member 214 are made of a metal such as aluminum or stainless steel.
- the susceptor 222 is supported by a plurality of cylindrical support members 224 (only one is shown here).
- a heater 226 is embedded in the susceptor 222, and the temperature of the wafer W placed on the susceptor 222 can be adjusted by controlling the power supplied from the power source 228 to the heater 226.
- An exhaust port 230 is formed in the bottom wall member 214 of the film forming chamber 200, and an exhaust unit 232 is connected to the exhaust port 230. Then, the inside of the film formation chamber 200 can be adjusted to a predetermined degree of vacuum by the exhaust unit 232.
- a shower head 240 is attached to the top wall member 212 of the film forming chamber 200.
- a raw material gas supply pipe 132 is connected to the shower head 240, and the raw material gas generated by the liquid raw material vaporizer 300 is introduced into the shower head 240 via the raw material gas supply pipe 132.
- the shower head 240 has an internal space 242 and a number of gas discharge holes 244 communicating with the internal space 242.
- the source gas introduced into the internal space 242 of the shower head 240 via the source gas supply pipe 132 is discharged toward the wafer W on the susceptor 222 from the gas discharge hole 244.
- the source gas from the liquid source vaporizer 300 is supplied as follows.
- the liquid source from the liquid source supply source 110 is supplied to the liquid source vaporizer 300 via the liquid source supply pipe 112 and the carrier gas from the carrier gas supply source 120 is supplied via the carrier gas supply pipe 122.
- a liquid source supply unit 300A which will be described later, of the liquid source vaporizer 300 forms a liquid material together with a carrier gas in the form of droplets and is discharged into the vaporization unit 300B.
- the droplets are vaporized in the vaporization unit 300B to generate a source gas Is done.
- the source gas generated in the liquid source vaporizer 300 is supplied to the film forming chamber 200 via the source gas supply pipe 132, and a desired process is performed on the wafer W in the film forming chamber 200.
- the liquid source vaporizer 300 of the film forming apparatus 100 as described above cannot completely vaporize the liquid source, some of the liquid source droplets are mixed into the source gas and enter the source gas supply pipe 132. There is a risk of being sent out and flowing into the film forming chamber 200. As described above, the liquid material droplets flowing into the film forming chamber 200 may cause deterioration in the quality of the film formed on the wafer W as particles. Further, when the vaporization efficiency of the liquid source deteriorates in the liquid source vaporizer 300, the flow rate of the source gas supplied to the film formation chamber 200 is insufficient, and a desired film formation is performed when, for example, an HfO 2 film is formed on the wafer W. There is a risk that the rate cannot be obtained.
- liquid source vaporizer 300 According to the present embodiment, all of the liquid source droplets can be efficiently vaporized to generate a sufficient amount of high-quality source gas for the film forming process in the film forming chamber 200. Configure as you can. A specific configuration example of such a liquid raw material vaporizer 300 will be described below.
- FIG. 2 is a longitudinal sectional view showing a schematic configuration example of the liquid raw material vaporizer 300 according to the first embodiment.
- the liquid raw material vaporizer 300 is roughly divided into a liquid raw material supply unit 300A for supplying the liquid raw material in the form of droplets to the subsequent stage, and a vaporization unit 300B for vaporizing the liquid raw material supplied from the liquid raw material supply unit 300A. It is composed of
- the liquid source supply unit 300A is provided with a liquid source channel 310 extending vertically from the upper surface to the inside, and a carrier gas channel 312 extending horizontally from the side to the inside.
- a liquid source supply pipe 112 is connected to one end of the liquid source channel 310, and a carrier gas supply pipe 122 is connected to one end of the carrier gas channel 312.
- the other end of the liquid material flow path 310 is provided with a discharge nozzle 314 for discharging the liquid material in the form of droplets.
- the discharge nozzle 314 is tapered, for example (not shown in FIG. 2), and is disposed so that the discharge port 316 at the tip thereof faces the vaporization space 350 in the vaporization unit 300B.
- the diameter of the discharge port 316 of the discharge nozzle 314 is determined according to the target size of the liquid material droplets supplied into the vaporization unit 300B. In order to reliably vaporize the liquid material in the form of droplets in the vaporization unit 300B, it is preferable that the droplet size is small, and therefore it is preferable that the diameter of the discharge port 316 is also small. However, if the droplet size becomes too small, the flow rate of the raw material gas obtained by vaporizing the droplet may be insufficient. It is preferable to determine the diameter of the discharge port 316 in consideration of these points.
- a synthetic resin such as a polyimide resin having resistance to an organic solvent or a metal such as stainless steel or titanium is preferable. If the discharge nozzle 314 is made of synthetic resin, heat can be prevented from being conducted from the surroundings to the liquid raw material before being discharged. In particular, the use of polyimide resin makes it difficult for liquid raw material residues (precipitates) to adhere to the discharge nozzle 314, thereby preventing nozzle clogging.
- a carrier gas injection unit 318 is disposed inside the liquid source supply unit 300A so as to surround the tip of the discharge nozzle 314.
- the carrier gas injection unit 318 is connected to the other end of the carrier gas channel 312 and is configured to eject the carrier gas from the carrier gas channel 312 together with the liquid material toward the vaporization space 350 of the vaporization unit 300B. ing.
- the carrier gas injection unit 318 is formed in a cup shape surrounding the tip of the discharge nozzle 314, and the carrier gas injection port 320 is formed at the bottom thereof.
- the carrier gas outlet 320 is formed in the vicinity of the outlet 316 at the tip of the outlet nozzle 314 so as to surround the outlet 316.
- the carrier gas can be ejected from around the ejection port 316, and the liquid material droplets ejected from the ejection port 316 are surely made to fly toward the vaporization unit 300B and provided in the vaporization unit 300B. Can be guided to the mist trap unit 360 described later.
- the vaporizing unit 300B includes a substantially cylindrical housing 330, a mist trap unit 360 including a cylindrical air-permeable member 362 provided in a vaporization space 350 formed in the center, and a periphery of the air-permeable member 362.
- a radiant heat heater 370 that uniformly heats the breathable member 362 by radiant heat;
- a cylindrical sleeve member 342 as a member.
- An inlet 338 for taking in liquid droplets supplied from the liquid raw material supply unit 300A is formed at the upstream end of the housing 330, and the liquid raw material droplets are vaporized at the downstream end.
- An outlet 340 is formed through which the raw material gas generated by vaporization is sent out.
- the mist trap part 360 includes a cylindrical air-permeable member 362 disposed from the inlet 338 to the outlet 340. One end of the air-permeable member 362 is closed, and the other end is attached so as to open and cover the delivery port 340.
- the vaporization space 350 is partitioned into the inner space 366 and the outer space 368 of the air-permeable member 362 by the mist trap part 360.
- liquid material droplets from the inlet 338 are sprayed together with the carrier gas.
- the liquid raw material droplets circulate into the outer space 368 and are sprayed and vaporized on the outer surface of the heated air-permeable member 362 to enter the inner space 366 as raw material gas, and are sent out from the outlet 340. Will be.
- FIG. 3 is a cross-sectional perspective view for explaining a configuration example of the vaporizing unit 300B shown in FIG.
- FIG. 4 is a perspective view showing an arrangement example of the radiant heater 370. In FIG. 3, the radiation heater 370 is not shown.
- the housing 330 of the vaporizing section 300B includes a cylindrical side wall member 331, an upstream end wall member 332 and a downstream end wall provided to close the upstream end and the downstream end of the side wall member 331, respectively. It consists of a member 334.
- the introduction port 338 is formed in the upstream end wall member 332, and the delivery port 340 is formed in the downstream end wall member 334.
- the side wall member 331, the upstream side end wall member 332, and the downstream side end wall member 334 constituting the housing 330 are each made of a metal such as aluminum or stainless steel.
- Each of the upstream end wall member 332 and the downstream end wall member 334 is attached to the side wall member 331 by fastening members 336 such as a plurality of bolts, for example, as shown in FIG.
- the inner surface of the side wall member 331 is mirror-finished so that heat rays (for example, electromagnetic waves such as far infrared rays) from the radiant heat heater 370 are directed to the vaporization space 350 at the center of the housing 330. Thereby, the heat rays from the radiant heat heater 370 can be efficiently collected in the air-permeable member 362 in the vaporization space 350, so that the heating efficiency of the air-permeable member 362 can be increased.
- the sleeve member 342 is provided inside the housing 330 so as to form a double tube structure coaxial with the side wall member 331.
- the sleeve member 342 is attached so as to be pressed between the upstream end wall member 332 and the downstream end wall member 334.
- flanges formed at both ends of the sleeve member 342 are inserted into counterbore 344 and 346 formed inside the upstream end wall member 332 and the downstream end wall member 334, respectively. Is positioned.
- the contact portions of the sleeve member 342, the upstream end wall member 332, and the downstream end wall member 334 are each sealed by a seal member 348 such as a metal O-ring. Thereby, the vaporization space 350 inside the sleeve member 342 and the installation space of the outside radiant heater 370 are sealed.
- the vaporization space 350 inside the sleeve member 342 and the arrangement space of the external radiant heater 370 are partitioned, so that, for example, the components of the liquid raw material thermally decomposed in the vaporization space 350 Or the like can be prevented from adhering to the surface of the radiant heat heater 370.
- particles may adhere to the inside of the sleeve member 342, but can be easily removed by cleaning only the sleeve member 342.
- the sleeve member 342 has a cylindrical shape, and particles can be made difficult to adhere by processing the inner surface thereof smoothly.
- the mist trap part 360 is provided in the vaporization space 350 formed in the sleeve member 342. As described above, the mist trap part 360 includes the cylindrical air-permeable member 362. A disc-shaped closing member 364 that closes the opening end face is provided at the upstream end of the air-permeable member 362, and the downstream end is open and surrounds the delivery port 340. And are attached so as to be joined to the downstream end wall member 334. Thus, the downstream end of the air-permeable member 362 communicates with the delivery port 340.
- the mist trap unit 360 captures and vaporizes liquid source liquid droplets introduced together with the carrier gas from the introduction port 338 with the air-permeable member 362.
- the raw material gas enters the inner space 366 of the air-permeable member 362 together with the carrier gas and is sent out from the delivery port 340.
- the downstream end of the air-permeable member 362 may be joined with the heat insulating member interposed therebetween without directly joining the downstream end wall member 334. According to this, since the heat of the mist trap part 360 can be prevented from escaping to the downstream side end wall member 334, the heating efficiency can be increased.
- the air permeable member 362 has air permeability through which a raw material gas captured by vaporization of liquid material droplets is allowed to pass without passing therethrough.
- a material that is heated by heat rays from the radiant heater 370 for example, a material that absorbs electromagnetic waves such as infrared rays and easily rises in temperature is used.
- metals such as ceramics, such as silicon carbide (SiC) which has a porous structure, or stainless steel, are mentioned, for example.
- the closing member 364 is made of a ceramic such as silicon carbide (SiC) or a metal such as stainless steel, like the air-permeable member 362.
- the thickness of the air-permeable member 362 is preferably determined in consideration of not only the heat capacity but also the vaporization efficiency and the heating temperature. As the thickness of the air-permeable member 362 is reduced, the heat capacity of the air-permeable member 362 is reduced, so that the heating efficiency can be improved and the time required for heating can be shortened. However, as the thickness of the air-permeable member 362 is reduced, the surface area of the air-permeable member 362 is also reduced, and the vaporization efficiency of the liquid liquid material in the form of liquid is reduced. However, a decrease in vaporization efficiency can be suppressed by increasing the heating temperature. Therefore, the thickness of the air-permeable member 362 is preferably as thin as possible within a range where sufficient vaporization efficiency can be obtained.
- the length of the breathable member 362 is shorter than the length of the side wall member 331, and the diameter of the breathable member 362 is smaller than that of the sleeve member 342.
- the upstream end portion (end portion on the closing member 364 side) of the air permeable member 362 is slightly separated from the upstream end wall member 332, and the side surface of the air permeable member 362 is inside the sleeve member 342.
- a flow path is formed in which the liquid droplets and the carrier gas discharged toward the inlet 338 are directed from the upstream side of the air-permeable member 362 toward the side surface (outer space 368).
- the sleeve member 342 is made of a material that transmits, for example, heat rays (for example, electromagnetic waves such as far infrared rays) from the radiant heat heater 370.
- heat rays for example, electromagnetic waves such as far infrared rays
- Examples of such a material include transparent quartz and alumina.
- the radiant heat heater 370 that emits heat rays in this way, for example, a carbon heater such as QCH-HEATER (registered trademark) can be used.
- the radiant heat heater 370 is not limited to this, and a halogen heater or a nichrome heater may be used.
- Such a radiant heat heater 370 is given to the air-permeable member 362 by controlling the power (heater power) irradiated from the radiant heat heater 370 by controlling the power supplied from the heater power source 374, for example. The amount of heat can be controlled.
- the radiant heat heater 370 is disposed so as to cover the side surface (outer surface) of the air-permeable member 362 from the outside of the sleeve member 342.
- QCH-HEATER registered trademark
- the radiant heat heater 370 is configured in a zigzag manner. According to such a radiant heat heater 370, the entire side surface (outer surface) of the air permeable member 362 of the air permeable member 362 can be irradiated with the heat rays from the radiant heat heater 370. Can be uniformly heated.
- the end of the radiant heater 370 extends from the through hole 372 formed in the downstream end wall member 334 to the outside of the housing 330 of the vaporization unit 300 ⁇ / b> B and is connected to the heater power supply 374. .
- the air permeable member 362 is provided with a temperature sensor 376 such as a thermocouple. These heater power supply 374 and temperature sensor 376 are connected to the control unit 140.
- the control unit 140 can control the radiant heater 370 by controlling the electric power of the heater power supply 374 according to the temperature from the temperature sensor 376, and can control the air-permeable member 362 to a predetermined temperature.
- each unit of the film forming apparatus 100 is controlled by a control unit 140 to operate.
- the radiant heat heater 370 of the liquid raw material vaporizer 300 is heated to heat the air-permeable member 362 to a predetermined temperature.
- heat rays are radiated from the radiant heater 370 around the air-permeable member 362, and the entire air-permeable member 362 is uniformly heated to a predetermined temperature.
- the temperature of the breathable member 362 is measured by the temperature sensor 376, and the power of the radiant heat heater 370 is adjusted via the heater power supply 374 based on the measured temperature.
- the temperature of the air permeable member 362 is maintained at a predetermined temperature.
- the temperature of the air-permeable member 362 is maintained at a temperature (for example, 100 to 300 ° C.) higher than the vaporization temperature of the liquid raw material, for example.
- the opening degree of the liquid material flow rate control valve 114 is adjusted so that the liquid material having a predetermined flow rate is supplied from the liquid material supply source 110 to the liquid material vaporizer 300 via the liquid material supply pipe 112.
- the opening degree of the carrier gas flow control valve 124 is adjusted so that the carrier gas having a predetermined flow rate is supplied from the carrier gas supply source 120 to the liquid raw material vaporizer 300 via the carrier gas supply pipe 122.
- the liquid material droplets discharged from the discharge nozzle 314 are sprayed together with the carrier gas from the inlet 338 toward the mist trap portion 360 of the vaporization space 350. At this time, the droplet and the carrier gas are guided to the side surface along the flow path (outer space 368) from the upstream side of the mist trap part 360, and thus are sprayed on the outer surface of the air-permeable member 362 of the mist trap part 360. become.
- the air-permeable member 362 is adjusted to a predetermined temperature that is higher than the vaporization temperature of the liquid raw material uniformly by the radiant heat from the radiant heat heater 370. For this reason, even if the droplet of the liquid material is sprayed on any part of the surface of the air-permeable member 362, the droplet can be sufficiently vaporized.
- the liquid material droplets are sprayed and vaporized onto the air-permeable member 362, and flow into the inner space 366 as raw material gas, and are sent together with the carrier gas to the raw material gas supply pipe 132 through the delivery port 340.
- the source gas sent to the source gas supply pipe 132 is supplied to the film forming chamber 200, introduced into the internal space 242 of the shower head 240, and discharged toward the wafer W on the susceptor 222 from the gas discharge hole 244. Then, a predetermined film such as an HfO 2 film is formed on the wafer W.
- the flow rate of the source gas introduced into the film forming chamber 200 can be adjusted by controlling the opening degree of the source gas flow rate control valve 134 provided in the source gas supply pipe 132.
- the mist trap part 360 that captures and vaporizes the liquid material in the form of droplets is constituted by the breathable member 362 that is heated by radiant heat.
- the entire breathable member 362 can be directly heated by the radiant heat from the radiant heat heater 370.
- the temperature of the air-permeable member 362 can be made uniform throughout, the liquid material can be uniformly vaporized only by spraying the liquid material of the liquid droplets onto the air-permeable member 362. Can do. Thereby, vaporization efficiency can be improved more than before.
- the sleeve member 342 that partitions the vaporization space 350 through which the liquid material in the form of liquid droplets flows and the space in which the radiant heater 370 is disposed it is possible to prevent particles from adhering to the surface of the radiant heater 370.
- the vaporization efficiency of the liquid raw material droplets can be improved. That is, since a flow path surrounded by the radiant heat heater 370 is formed between the inner surface of the sleeve member 342 and the outer side surface of the air-permeable member 362, liquid droplets of the liquid material passing through the flow path are emitted from the radiant heat heater 370. While the heat rays act directly, the atmosphere of the entire flow path is also heated by the radiant heat heater 370. Thereby, the vaporization efficiency of the liquid raw material droplets can be further improved.
- the temperature of the air permeable member 362 is measured in real time by the temperature sensor 376, and the radiant heat heater 370 is controlled based on the measured temperature, so that the temperature of the air permeable member 362 is always adjusted to maintain the set temperature. it can. For this reason, during the film forming process, the temperature of the entire air-permeable member 362 is always kept uniform, and the liquid material in the form of liquid droplets sprayed on the air-permeable member 362 is surely vaporized. Can be stably supplied.
- the power of the radiant heat heater 370 is adjusted so that the temperature of the air-permeable member 362 is optimized in accordance with the conditions of the liquid source supply unit 300A, for example, the type and amount of the liquid source, the size of the droplets, and the like. Also good. Thereby, vaporization efficiency can be improved irrespective of the conditions of the liquid raw material supply unit 300A.
- the mist trap portion is configured by the cylindrical air-permeable member 362 whose one end is closed.
- the present invention is not necessarily limited thereto.
- the mist trap part 360 may be configured by a conical air-permeable member 362 that protrudes upstream.
- the entire mist trap portion 360 may be constituted by the air-permeable member 362, or the tip portion may be opened and the closing member 364 may be attached.
- the radiant heater 370 may be disposed along the outer surface of the air-permeable member 362.
- the closing member 364 that closes one end of the air-permeable member 362 may be formed of a member having air permeability similarly to the air-permeable member 362. However, the closing member 364 is formed of a member that does not have air permeability.
- the closing member 364 is formed of a member that does not have air permeability.
- the present invention is not necessarily limited thereto, and may be formed in a cylindrical shape other than the cylindrical shape.
- it may be formed in a rectangular tube shape.
- the vaporizing unit 300B may be configured without providing the sleeve member 342.
- FIG. 5 is a diagram for explaining a schematic configuration example of the film forming apparatus 102 according to the second embodiment.
- the liquid raw material vaporizer 302 used for the film forming apparatus 102 is configured by the first liquid raw material vaporizer 304 and the second liquid raw material vaporizer 308 connected to this by a connection pipe 306 will be described. Since the configuration of the film forming apparatus 102 according to the second embodiment other than the liquid source vaporizer 302 is the same as that of the film forming apparatus 100 according to the first embodiment shown in FIG. Constituent elements having the same reference numerals are given and detailed descriptions thereof are omitted.
- the liquid source vaporizer 302 includes a first liquid source vaporizer 304 that generates a source gas by vaporizing a liquid source supplied from the liquid source supply source 110, and a first liquid source vaporizer. And a second liquid source vaporizer 308 connected to the discharge port of the source gas generated in 304 via a connection pipe 306, and the source gas discharged from the discharge port of the second liquid source vaporizer 308 is used as a raw material. It is configured to be supplied to the film forming chamber 200 via the gas supply pipe 132.
- FIG. 6 shows a configuration example of the second liquid source vaporizer 308 according to the second embodiment.
- the second liquid raw material vaporizer 308 is a liquid raw material vaporizer composed of only the vaporization unit 300B of the liquid raw material vaporizer 300 according to the first embodiment. Therefore, since the second liquid raw material vaporizer 308 has the same configuration as the vaporization unit 300B shown in FIG. 2, components having the same functional configuration are denoted by the same reference numerals and detailed description thereof is omitted. .
- the first liquid raw material vaporizer 304 is a liquid raw material vaporizer that generates a raw material gas by vaporizing the liquid raw material supplied from the liquid raw material supply source 110, regardless of its configuration or type.
- the liquid raw material vaporizer may be used.
- the raw material gas generated by the first liquid raw material vaporizer 304 is added to the air-permeable member 362 whose temperature has been increased uniformly uniformly by the radiant heat in the second liquid raw material vaporizer 308.
- the liquid droplets that could not be vaporized by the first liquid raw material vaporizer 304 can be vaporized by the second liquid raw material vaporizer 308. Accordingly, it is possible to prevent liquid source droplets from flowing into the film forming chamber 200 and the like together with the source gas. Further, since the vaporization failure due to a partial temperature decrease of the air-permeable member 362 can be prevented, the air-permeable member 362 can be prevented from being clogged.
- the liquid source vaporizer according to the present invention is a liquid source vaporizer used for MOCVD apparatus, plasma CVD apparatus, ALD (atomic layer deposition) apparatus, LP-CVD (batch type, vertical type, horizontal type, minibatch type) and the like. It is also applicable to.
- the present invention is applicable to a liquid source vaporizer that vaporizes a liquid source to generate a source gas and a film forming apparatus using the same.
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Abstract
Description
110 液体原料供給源
112 液体原料供給配管
114 液体原料流量制御バルブ
120 キャリアガス供給源
122 キャリアガス供給配管
124 キャリアガス流量制御バルブ
132 原料ガス供給配管
134 原料ガス流量制御バルブ
140 制御部
200 成膜室
210 側壁部材
212 天壁部材
214 底壁部材
222 サセプタ
224 支持部材
226 ヒータ
228 電源
230 排気口
232 排気手段
240 シャワーヘッド
242 内部空間
244 ガス吐出孔
300 液体原料気化器
300A 液体原料供給部
300B 気化部
302,304,308 液体原料気化器
306 接続配管
310 液体原料流路
312 キャリアガス流路
314 吐出ノズル
316 吐出口
318 キャリアガス噴射部
320 キャリアガス噴出口
330 ハウジング
331 側壁部材
332 上流側端壁部材
334 下流側単壁部材
336 締結部材
338 導入口
340 送出口
342 スリーブ部材
344,346 ザグリ
348 シール部材
350 気化空間
360 ミストトラップ部
362 通気性部材
364 閉じ部材
366 内側空間
368 外側空間(流路)
370 輻射熱ヒータ
372 貫通孔
374 ヒータ電源
376 温度センサ
W ウエハ
まず,本発明の第1実施形態にかかる成膜装置について図面を参照しながら説明する。図1は第1実施形態にかかる成膜装置の概略構成例を説明するための図である。図1に示す成膜装置100は,被処理基板例えば半導体ウエハ(以下,単に「ウエハ」という)W上にCVD法により金属酸化物膜を成膜するものであり,例えばHTB(ハフニウムタートブトキサイド)などのHfを含有する液体原料を供給する液体原料供給源110と,Arなどの不活性ガスをキャリアガスとして供給するキャリアガス供給源120と,液体原料供給源110から供給される液体原料を気化させて原料ガスを生成する液体原料気化器300と,液体原料気化器300が生成した原料ガスを用いてウエハWに例えばHfO2膜を形成する成膜室200と,成膜装置100の各部を制御する制御部140を備えている。
次に,本発明の第1実施形態にかかる液体原料気化器300の構成例について図面を参照しながら説明する。図2は,第1実施形態にかかる液体原料気化器300の概略構成例を示す縦断面図である。この液体原料気化器300は,大きく分けて,液体原料を液滴状にして後段に供給する液体原料供給部300Aと,この液体原料供給部300Aから供給される液体原料を気化させる気化部300Bとから構成されている。
次に,本実施形態にかかる成膜装置100の動作について説明する。成膜装置100は制御部140により各部が制御され,動作するようになっている。液体原料気化器300によって原料ガスを生成するにあたり,液体原料気化器300の輻射熱ヒータ370を発熱させて通気性部材362を所定の温度に加熱する。このとき,輻射熱ヒータ370からは熱線が通気性部材362の周りに放射され,通気性部材362はその全体がむらなく所定の温度に加熱される。そして,温度センサ376により通気性部材362の温度が測定され,その測定温度に基づいてヒータ電源374を介して輻射熱ヒータ370のパワーが調整される。こうして,通気性部材362の温度を所定の温度に保持する。このときの通気性部材362の温度は,例えば液体原料の気化温度よりも高い温度(例えば100~300℃)に保持される。
次に,本発明の第2実施形態にかかる成膜装置について図面を参照しながら説明する。図5は第2実施形態にかかる成膜装置102の概略構成例を説明するための図である。ここでは,成膜装置102に利用する液体原料気化器302を第1の液体原料気化器304とこれに接続配管306で接続された第2の液体原料気化器308により構成した場合について説明する。なお,第2実施形態にかかる成膜装置102における液体原料気化器302以外の構成については図1に示す第1実施形態にかかる成膜装置100と同様であるため,図5では同一機能構成を有する構成要素には同一符号を付してそれらの詳細な説明を省略する。
Claims (11)
- 液体原料を液滴状にして吐出する液体原料供給部と,
前記液滴状の液体原料を気化させて原料ガスを生成する気化部と,
前記液体原料供給部からの前記液滴状の液体原料を前記気化部内に導入する導入口と,
前記気化部内に配置され,輻射熱によって加熱される材料で構成された通気性部材からなるミストトラップ部と,
前記通気性部材の外側表面の全体に熱線を照射し,その輻射熱によって前記通気性部材を加熱する輻射熱ヒータと,
加熱された前記通気性部材に前記液滴状の液体原料を通して気化させることによって生成した原料ガスを外部に送出する送出口と,
を備えたことを特徴とする液体原料気化器。 - 前記気化部の前記導入口と前記送出口とは対向して設け,
前記通気性部材は,前記導入口側から前記送出口側にわたって配置された筒状の形状をなし,前記導入口側の端部は閉じられるとともに,前記送出口側の端部は前記送出口に連通するように構成したことを特徴とする請求項1に記載の液体原料気化器。 - 前記輻射熱ヒータは,前記通気性部材の外側表面を囲むように配置したことを特徴とする請求項2に記載の液体原料気化器。
- 前記輻射熱ヒータは,カーボンヒータにより構成されることを特徴とする請求項3に記載の液体原料気化器。
- 前記通気性部材と前記輻射熱ヒータとの間に,前記液滴状の液体原料が流通する気化空間と前記輻射熱ヒータの配設空間とを仕切る筒状の仕切部材を前記通気性部材を囲むように設け,
前記仕切部材は,前記輻射熱ヒータが照射する熱線を透過させる通気性のない部材で構成したことを特徴とする請求項3に記載の液体原料気化器。 - 前記仕切部材は石英で構成したことを特徴とする請求項5に記載の液体原料気化器。
- 前記通気性部材の温度を測定する温度センサと,
前記温度センサによって測定された前記通気性部材の温度に基づいて前記輻射熱ヒータを制御することにより,前記通気性部材の温度を所定の温度に調節する制御部と,
を設けたことを特徴とする請求項1に記載の液体原料気化器。 - 前記気化部の外枠を構成するハウジングの内側面は,前記輻射熱ヒータからの熱線を反射して前記通気性部材の外側表面に向かうように鏡面加工したことを特徴とする請求項7に記載の液体原料気化器。
- 液体原料を気化させて原料ガスを生成する他の液体原料気化器に接続される液体原料気化器であって,
前記他の液体原料気化器で生成された原料ガスを導入する導入口と,
輻射熱によって加熱される材料で構成された通気性部材からなるミストトラップ部と,
前記通気性部材の外側表面の全体に熱線を照射し,その輻射熱によって前記通気性部材を加熱する輻射熱ヒータと,
前記導入口から導入した前記他の液体原料気化器からの原料ガスを,加熱された前記通気性部材を通して外部に送出する送出口と,
を備えたことを特徴とする液体原料気化器。 - 液体原料を気化させて原料ガスを生成する液体原料気化器から原料ガスを導入して被処理基板に対して成膜処理を行う成膜室を備える成膜装置であって,
前記液体原料気化器は,
前記液体原料を液滴状にして吐出する液体原料供給部と,
前記液滴状の液体原料を気化させて原料ガスを生成する気化部と,
前記液体原料供給部からの前記液滴状の液体原料を前記気化部内に導入する導入口と,
前記気化部内に配置され,輻射熱によって加熱される材料で構成された通気性部材からなるミストトラップ部と,
前記通気性部材の外側表面の全体に熱線を照射し,その輻射熱によって前記通気性部材を加熱する輻射熱ヒータと,
加熱された前記通気性部材に前記液滴状の液体原料を通して気化させることによって生成した原料ガスを外部に送出する送出口と,
を備えたことを特徴とする成膜装置。 - 液体原料を気化させて原料ガスを生成する液体原料気化器から原料ガスを導入して被処理基板に対して成膜処理を行う成膜室を備える成膜装置であって,
前記液体原料気化器は,液体原料を気化させて原料ガスを生成する第1の液体原料気化器とこれに接続された第2の液体原料気化器により構成され,
前記第2の液体原料気化器は,
前記第1の液体原料気化器で生成された原料ガスを導入する導入口と,
輻射熱によって加熱される材料で構成された通気性部材からなるミストトラップ部と,
前記通気性部材の外側表面の全体に熱線を照射し,その輻射熱によって前記通気性部材を加熱する輻射熱ヒータと,
前記導入口から導入した前記第1の液体原料気化器からの原料ガスを,加熱された前記通気性部材を通して外部に送出する送出口と,
を備えたことを特徴とする成膜装置。
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JP5885564B2 (ja) * | 2012-03-30 | 2016-03-15 | 株式会社ブイテックス | 気化装置 |
CN103422075B (zh) * | 2012-05-14 | 2015-09-02 | 中芯国际集成电路制造(上海)有限公司 | 形成膜层的方法 |
CN105214568B (zh) | 2014-06-10 | 2018-04-20 | 万华化学集团股份有限公司 | 一种加热器、该加热器的用途和应用该加热器制备异氰酸酯的方法 |
KR102244073B1 (ko) * | 2014-09-16 | 2021-04-26 | 삼성디스플레이 주식회사 | 표시 장치의 제조 장치 및 이를 이용한 표시 장치의 제조 방법 |
JP6321767B1 (ja) * | 2016-12-14 | 2018-05-09 | 日本特殊陶業株式会社 | 呼気センサ |
SG11202007413VA (en) * | 2018-03-23 | 2020-09-29 | Kokusai Electric Corp | Vaporizer, substrate processing apparatus and method of manufacturing semiconductor device |
KR102449994B1 (ko) * | 2021-02-22 | 2022-10-04 | (주)탑크루 | 배기 배관의 유해가스 가열용 히팅 모듈 및 배기 배관에 주입되는 열전달 가스 가열용 히팅 모듈 |
JP2024531516A (ja) * | 2021-09-01 | 2024-08-29 | インテグリス・インコーポレーテッド | 気化器アセンブリ |
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JP2007100207A (ja) * | 2005-09-09 | 2007-04-19 | Lintec Co Ltd | 低温度で液体原料を気化させることのできる液体原料の気化方法および該方法を用いた気化器 |
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KR200173175Y1 (ko) * | 1996-10-17 | 2000-03-02 | 김영환 | 액상반응원료의 기화장치 |
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JPH0317271A (ja) * | 1989-01-23 | 1991-01-25 | Anelva Corp | Cvd装置 |
JPH06181177A (ja) * | 1991-07-19 | 1994-06-28 | Leybold Ag | 液体蒸発装置 |
JPH10337464A (ja) * | 1997-06-04 | 1998-12-22 | Ckd Corp | 液体原料の気化装置 |
JP2005109349A (ja) * | 2003-10-01 | 2005-04-21 | Tokyo Electron Ltd | 気化器及び成膜装置 |
JP2007100207A (ja) * | 2005-09-09 | 2007-04-19 | Lintec Co Ltd | 低温度で液体原料を気化させることのできる液体原料の気化方法および該方法を用いた気化器 |
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KR20100116170A (ko) | 2010-10-29 |
CN101939827A (zh) | 2011-01-05 |
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