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WO2009044732A1 - 接着剤組成物及びこれを用いた回路接続材料、並びに、回路部材の接続方法及び回路接続体 - Google Patents

接着剤組成物及びこれを用いた回路接続材料、並びに、回路部材の接続方法及び回路接続体 Download PDF

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Publication number
WO2009044732A1
WO2009044732A1 PCT/JP2008/067742 JP2008067742W WO2009044732A1 WO 2009044732 A1 WO2009044732 A1 WO 2009044732A1 JP 2008067742 W JP2008067742 W JP 2008067742W WO 2009044732 A1 WO2009044732 A1 WO 2009044732A1
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WO
WIPO (PCT)
Prior art keywords
circuit
adhesive composition
connection structure
same
members
Prior art date
Application number
PCT/JP2008/067742
Other languages
English (en)
French (fr)
Inventor
Masaru Tanaka
Original Assignee
Hitachi Chemical Company, Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Company, Ltd. filed Critical Hitachi Chemical Company, Ltd.
Priority to JP2009536053A priority Critical patent/JP5126233B2/ja
Priority to KR1020127013159A priority patent/KR101403282B1/ko
Priority to KR1020117012448A priority patent/KR101376002B1/ko
Priority to CN2008801101962A priority patent/CN101815769B/zh
Publication of WO2009044732A1 publication Critical patent/WO2009044732A1/ja

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • C—CHEMISTRY; METALLURGY
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    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
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    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
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    • H01L2924/151—Die mounting substrate
    • H01L2924/156—Material
    • H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
    • H01L2924/15788—Glasses, e.g. amorphous oxides, nitrides or fluorides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19041—Component type being a capacitor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19043—Component type being a resistor

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Inorganic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Conductive Materials (AREA)
  • Wire Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Combinations Of Printed Boards (AREA)
  • Adhesive Tapes (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

本発明の接着剤組成物は、回路部材同士を接着するとともにそれぞれの回路部材が有する回路電極同士を電気的に接続するために用いられるものであって、エポキシ樹脂、エポキシ樹脂硬化剤、及び、架橋構造を有し且つ重量平均分子量が３００００～８００００であるアクリル系共重合体を含む接着剤成分を含有する。
PCT/JP2008/067742 2007-10-05 2008-09-30 接着剤組成物及びこれを用いた回路接続材料、並びに、回路部材の接続方法及び回路接続体 WO2009044732A1 (ja)

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JP2009536053A JP5126233B2 (ja) 2007-10-05 2008-09-30 接着剤組成物及びこれを用いた回路接続材料、並びに、回路部材の接続方法、回路接続体及び接着剤組成物の硬化物
KR1020127013159A KR101403282B1 (ko) 2007-10-05 2008-09-30 접착제 조성물 및 이것을 이용한 회로 접속 재료, 및 회로 부재의 접속 방법 및 회로 접속체
KR1020117012448A KR101376002B1 (ko) 2007-10-05 2008-09-30 접착제 조성물 및 이것을 이용한 회로 접속 재료, 및 회로 부재의 접속 방법 및 회로 접속체
CN2008801101962A CN101815769B (zh) 2007-10-05 2008-09-30 粘接剂组合物和使用该组合物的电路连接材料,以及电路部件的连接方法和电路连接体

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JP2015052114A (ja) * 2014-09-10 2015-03-19 デクセリアルズ株式会社 異方性導電接着剤
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WO2015093362A1 (ja) * 2013-12-16 2015-06-25 デクセリアルズ株式会社 実装体の製造方法、及び異方性導電フィルム
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JP6292808B2 (ja) * 2013-09-13 2018-03-14 デクセリアルズ株式会社 接着剤、及び発光装置
KR20160130783A (ko) * 2014-03-05 2016-11-14 쓰리엠 이노베이티브 프로퍼티즈 캄파니 피부에 부드러운 (메트)아크릴레이트 감압성 접착제
JP6114883B1 (ja) * 2015-05-20 2017-04-12 積水化学工業株式会社 導電性粘着材及び導電性基材付き導電性粘着材
CN107920923A (zh) 2015-08-31 2018-04-17 3M创新有限公司 包含对湿表面具有增强的粘附性的(甲基)丙烯酸酯压敏粘合剂的负压伤口治疗敷料
CN107922811B (zh) 2015-08-31 2019-04-19 3M创新有限公司 包含对湿表面具有增强的粘附性的(甲基)丙烯酸酯压敏粘合剂的制品
JP2017110128A (ja) * 2015-12-17 2017-06-22 Dic株式会社 熱硬化性接着シート、物品及び物品の製造方法
FR3066385B1 (fr) 2017-05-19 2020-01-17 Laboratoires M&L Composition cosmetique biphasique
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US20120043118A1 (en) * 2009-04-30 2012-02-23 Sumitomo Electric Printed Circuits, Inc. Adhesive resin composition, and laminate and flexible printed wiring board using the same
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CN102549097A (zh) * 2009-10-07 2012-07-04 索尼化学&信息部件株式会社 热固性粘接组合物、热固性粘接片材、其制造方法及增强柔性印刷布线板
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CN102533170A (zh) * 2010-12-27 2012-07-04 第一毛织株式会社 用于半导体的粘合剂组合物和包括该组合物的粘合剂膜
CN102702988B (zh) * 2011-03-25 2014-02-26 藤森工业株式会社 粘合剂组合物的制造方法、粘合剂组合物以及粘合带
CN102702988A (zh) * 2011-03-25 2012-10-03 藤森工业株式会社 粘合剂组合物的制造方法、粘合剂组合物以及粘合带
JP2012248654A (ja) * 2011-05-27 2012-12-13 Sanyo Electric Co Ltd 太陽電池モジュール及びその製造方法
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JP2015005502A (ja) * 2013-05-23 2015-01-08 積水化学工業株式会社 導電ペースト、接続構造体及び接続構造体の製造方法
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WO2015093362A1 (ja) * 2013-12-16 2015-06-25 デクセリアルズ株式会社 実装体の製造方法、及び異方性導電フィルム
JP2015135949A (ja) * 2013-12-16 2015-07-27 デクセリアルズ株式会社 実装体の製造方法、及び異方性導電フィルム
CN104673111A (zh) * 2014-06-30 2015-06-03 广东丹邦科技有限公司 环氧树脂基各向异性导电胶膜的配方及制备方法
JP2015052114A (ja) * 2014-09-10 2015-03-19 デクセリアルズ株式会社 異方性導電接着剤
CN104403610A (zh) * 2014-11-24 2015-03-11 苏州斯迪克新材料科技股份有限公司 高阻燃性压敏胶黏剂及其制造工艺
WO2020096011A1 (ja) * 2018-11-09 2020-05-14 日立化成株式会社 半導体装置製造用仮保護フィルム、リール体、及び、半導体装置を製造する方法
JPWO2020096011A1 (ja) * 2018-11-09 2021-10-07 昭和電工マテリアルズ株式会社 半導体装置製造用仮保護フィルム、リール体、及び、半導体装置を製造する方法
JP7151782B2 (ja) 2018-11-09 2022-10-12 昭和電工マテリアルズ株式会社 半導体装置製造用仮保護フィルム、リール体、及び、半導体装置を製造する方法
WO2020110785A1 (ja) * 2018-11-29 2020-06-04 日立化成株式会社 半導体用フィルム状接着剤、半導体装置及びその製造方法

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CN102876277A (zh) 2013-01-16
JP2013058764A (ja) 2013-03-28
KR101376002B1 (ko) 2014-03-19
CN101815769B (zh) 2012-11-07
TW201309770A (zh) 2013-03-01
CN102850982A (zh) 2013-01-02
KR20110066235A (ko) 2011-06-16
CN101815769A (zh) 2010-08-25
JP5126233B2 (ja) 2013-01-23
KR20100009538A (ko) 2010-01-27
KR20120073354A (ko) 2012-07-04
TW200932860A (en) 2009-08-01
CN102876277B (zh) 2014-12-10
TWI394810B (zh) 2013-05-01
JPWO2009044732A1 (ja) 2011-02-10

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