[go: up one dir, main page]
More Web Proxy on the site http://driver.im/

WO2008129762A1 - 移動体装置、パターン形成装置及びパターン形成方法、デバイス製造方法、移動体装置の製造方法、並びに移動体駆動方法 - Google Patents

移動体装置、パターン形成装置及びパターン形成方法、デバイス製造方法、移動体装置の製造方法、並びに移動体駆動方法 Download PDF

Info

Publication number
WO2008129762A1
WO2008129762A1 PCT/JP2008/000437 JP2008000437W WO2008129762A1 WO 2008129762 A1 WO2008129762 A1 WO 2008129762A1 JP 2008000437 W JP2008000437 W JP 2008000437W WO 2008129762 A1 WO2008129762 A1 WO 2008129762A1
Authority
WO
WIPO (PCT)
Prior art keywords
moving body
forming pattern
substrate stage
producing
weight
Prior art date
Application number
PCT/JP2008/000437
Other languages
English (en)
French (fr)
Inventor
Yasuo Aoki
Hiroshi Shirasu
Yoshihiko Kudo
Original Assignee
Nikon Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nikon Corporation filed Critical Nikon Corporation
Priority to JP2009510750A priority Critical patent/JP5448070B2/ja
Priority to CN200880004910XA priority patent/CN101611470B/zh
Priority to KR1020147019380A priority patent/KR101547784B1/ko
Publication of WO2008129762A1 publication Critical patent/WO2008129762A1/ja
Priority to US12/553,549 priority patent/US9366974B2/en
Priority to HK10103101.8A priority patent/HK1136388A1/xx
Priority to US15/153,244 priority patent/US10228625B2/en
Priority to US16/257,554 priority patent/US10627725B2/en
Priority to US16/834,122 priority patent/US20200225589A1/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70758—Drive means, e.g. actuators, motors for long- or short-stroke modules or fine or coarse driving
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70775—Position control, e.g. interferometers or encoders for determining the stage position
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70791—Large workpieces, e.g. glass substrates for flat panel displays or solar panels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/682—Mask-wafer alignment

Landscapes

  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

Abstract

　基板ステージ（２１）と、基板ステージ（２１）の自重を支持する自重キャンセル機構（２７）とを別体で構成する。これにより、基板ステージと自重キャンセル機構とを一体的に構成する場合と比べて基板ステージ（基板ステージを含む構造体）を小型・軽量化することができる。また、Ｘ駆動機構（９７Ｘ），Ｙ駆動機構（９７Ｙ）によるＸ粗動ステージ（２３Ｘ）、Ｙ粗動ステージ（２３Ｙ）の移動により、基板ステージがＸＹ平面内で駆動されるとともに、基板ステージの自重を支持する自重キャンセル機構も駆動される。これにより、基板ステージと自重キャンセル機構とを別体で構成しても支障なく、基板ステージを駆動できる。
PCT/JP2008/000437 2007-03-05 2008-03-04 移動体装置、パターン形成装置及びパターン形成方法、デバイス製造方法、移動体装置の製造方法、並びに移動体駆動方法 WO2008129762A1 (ja)

Priority Applications (8)

Application Number Priority Date Filing Date Title
JP2009510750A JP5448070B2 (ja) 2007-03-05 2008-03-04 移動体装置、パターン形成装置及びパターン形成方法、デバイス製造方法、並びに移動体駆動方法
CN200880004910XA CN101611470B (zh) 2007-03-05 2008-03-04 移动体装置、图案形成装置及图案形成方法、设备制造方法、移动体装置的制造方法以及移动体驱动方法
KR1020147019380A KR101547784B1 (ko) 2007-03-05 2008-03-04 이동체 장치, 패턴 형성 장치 및 패턴 형성 방법, 디바이스 제조 방법, 이동체 장치의 제조 방법, 및 이동체 구동 방법
US12/553,549 US9366974B2 (en) 2007-03-05 2009-09-03 Movable body apparatus, pattern forming apparatus and pattern forming method, device manufacturing method, manufacturing method of movable body apparatus, and movable body drive method
HK10103101.8A HK1136388A1 (en) 2007-03-05 2010-03-24 Moving body apparatus, apparatus for forming pattern, method of forming pattern, method of producing device, method of producing moving body apparatus, and method of driving moving body
US15/153,244 US10228625B2 (en) 2007-03-05 2016-05-12 Movable body apparatus, pattern forming apparatus and pattern forming method, device manufacturing method, manufacturing method of movable body apparatus, and movable body drive method
US16/257,554 US10627725B2 (en) 2007-03-05 2019-01-25 Movable body apparatus, pattern forming apparatus and pattern forming method, device manufacturing method, manufacturing method of movable body apparatus, and movable body drive method
US16/834,122 US20200225589A1 (en) 2007-03-05 2020-03-30 Movable body apparatus, pattern forming apparatus and pattern forming method, device manufacturing method, manufacturing method of movable body apparatus, and movable body drive method

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007054442 2007-03-05
JP2007-054442 2007-03-05

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US12/553,549 Continuation US9366974B2 (en) 2007-03-05 2009-09-03 Movable body apparatus, pattern forming apparatus and pattern forming method, device manufacturing method, manufacturing method of movable body apparatus, and movable body drive method

Publications (1)

Publication Number Publication Date
WO2008129762A1 true WO2008129762A1 (ja) 2008-10-30

Family

ID=39875300

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/000437 WO2008129762A1 (ja) 2007-03-05 2008-03-04 移動体装置、パターン形成装置及びパターン形成方法、デバイス製造方法、移動体装置の製造方法、並びに移動体駆動方法

Country Status (7)

Country Link
US (4) US9366974B2 (ja)
JP (2) JP5448070B2 (ja)
KR (2) KR101547784B1 (ja)
CN (1) CN101611470B (ja)
HK (1) HK1136388A1 (ja)
TW (1) TWI533093B (ja)
WO (1) WO2008129762A1 (ja)

Cited By (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008235889A (ja) * 2007-03-20 2008-10-02 Asml Netherlands Bv 振動絶縁サポートデバイスを含むリソグラフィ装置
WO2010101267A1 (en) 2009-03-04 2010-09-10 Nikon Corporation Movable body apparatus, exposure apparatus and device manufacturing method
WO2010122788A1 (ja) * 2009-04-21 2010-10-28 株式会社ニコン 移動体装置、露光装置、露光方法、及びデバイス製造方法
WO2011021723A1 (en) 2009-08-20 2011-02-24 Nikon Corporation Object processing apparatus, exposure apparatus and exposure method, and device manufacturing method
WO2011021711A1 (en) 2009-08-20 2011-02-24 Nikon Corporation Object processing apparatus, exposure apparatus and exposure method, and device manufacturing method
WO2011021709A1 (en) 2009-08-20 2011-02-24 Nikon Corporation Object moving apparatus, object processing apparatus, exposure apparatus, object inspecting apparatus and device manufacturing method
JP2011085672A (ja) * 2009-10-14 2011-04-28 Nikon Corp 移動体装置、露光装置、及びデバイス製造方法
WO2012033212A1 (en) * 2010-09-07 2012-03-15 Nikon Corporation Movable body apparatus, object processing device, exposure apparatus, flat-panel display manufacturing method, and device manufacturing method
WO2012032768A1 (ja) * 2010-09-07 2012-03-15 株式会社ニコン 移動体装置、露光装置、露光方法、フラットパネルディスプレイの製造方法、及びデバイス製造方法
JP2012234109A (ja) * 2011-05-09 2012-11-29 Nikon Corp 移動体装置、露光装置、フラットパネルディスプレイの製造方法、デバイス製造方法、及び移動体装置の組立方法。
US8395758B2 (en) 2009-05-15 2013-03-12 Nikon Corporation Exposure apparatus and device manufacturing method
WO2013150790A1 (ja) * 2012-04-04 2013-10-10 株式会社ニコン 露光装置、フラットパネルディスプレイの製造方法、及びデバイス製造方法
JP2013217950A (ja) * 2012-04-04 2013-10-24 Nikon Corp 移動体装置、露光装置、フラットパネルディスプレイの製造方法、及びデバイス製造方法
US8598538B2 (en) 2010-09-07 2013-12-03 Nikon Corporation Movable body apparatus, object processing device, exposure apparatus, flat-panel display manufacturing method, and device manufacturing method
JP5541398B1 (ja) * 2013-07-02 2014-07-09 日本精工株式会社 テーブル装置、及び搬送装置
JP2016224379A (ja) * 2015-06-03 2016-12-28 旭化成エンジニアリング株式会社 平面移動装置
JP2017021361A (ja) * 2010-09-07 2017-01-26 株式会社ニコン 露光装置、フラットパネルディスプレイの製造方法、デバイス製造方法、及び露光方法
JP2017156761A (ja) * 2017-04-19 2017-09-07 株式会社ニコン 移動体装置、露光装置、フラットパネルディスプレイの製造方法、及びデバイス製造方法
JP2019113868A (ja) * 2019-04-03 2019-07-11 株式会社ニコン 露光装置及び露光方法、並びにフラットパネルディスプレイの製造方法、及びデバイス製造方法
JP2019179250A (ja) * 2010-09-07 2019-10-17 株式会社ニコン 露光装置、フラットパネルディスプレイの製造方法、及びデバイス製造方法
JP2019185056A (ja) * 2014-03-26 2019-10-24 株式会社ニコン 移動体装置、露光装置、フラットパネルディスプレイの製造方法、及びデバイス製造方法
JP2020190740A (ja) * 2015-03-31 2020-11-26 株式会社ニコン 露光装置、フラットパネルディスプレイの製造方法、デバイス製造方法、及び露光方法

Families Citing this family (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110141448A1 (en) 2009-11-27 2011-06-16 Nikon Corporation Substrate carrier device, substrate carrying method, substrate supporting member, substrate holding device, exposure apparatus, exposure method and device manufacturing method
US20110244396A1 (en) * 2010-04-01 2011-10-06 Nikon Corporation Exposure apparatus, exchange method of object, exposure method, and device manufacturing method
US20120064461A1 (en) 2010-09-13 2012-03-15 Nikon Corporation Movable body apparatus, exposure apparatus, device manufacturing method, flat-panel display manufacturing method, and object exchange method
JP5137218B1 (ja) * 2011-08-30 2013-02-06 株式会社ソディック 工作機械
TWI650612B (zh) 2011-08-30 2019-02-11 尼康股份有限公司 基板處理裝置及基板處理方法、以及元件製造方法、及平板顯示器之製造方法
JP5807841B2 (ja) * 2011-08-30 2015-11-10 株式会社ニコン 移動体装置、露光装置、フラットパネルディスプレイの製造方法、及びデバイス製造方法
JP5910992B2 (ja) * 2012-04-04 2016-04-27 株式会社ニコン 移動体装置、露光装置、フラットパネルディスプレイの製造方法、及びデバイス製造方法
TWI499872B (zh) * 2013-06-18 2015-09-11 Innolux Corp 曝光系統與曝光製程
KR101907864B1 (ko) 2014-03-28 2018-10-15 가부시키가이샤 니콘 이동체 장치, 노광 장치, 플랫 패널 디스플레이의 제조 방법, 디바이스 제조 방법, 및 이동체 구동 방법
CN113267964B (zh) 2015-09-30 2023-05-23 株式会社尼康 曝光装置及曝光方法、以及平面显示器制造方法
US20180364595A1 (en) 2015-09-30 2018-12-20 Nikon Corporation Exposure apparatus, flat panel display manufacturing method, and device manufacturing method
WO2017057539A1 (ja) 2015-09-30 2017-04-06 株式会社ニコン 露光装置及び露光方法、並びにフラットパネルディスプレイ製造方法
US10732517B2 (en) 2015-09-30 2020-08-04 Nikon Corporation Exposure apparatus and exposure method, and flat panel display manufacturing method
WO2017057583A1 (ja) 2015-09-30 2017-04-06 株式会社ニコン 露光装置、フラットパネルディスプレイの製造方法、デバイス製造方法、及び露光方法
KR20180058734A (ko) 2015-09-30 2018-06-01 가부시키가이샤 니콘 노광 장치, 플랫 패널 디스플레이의 제조 방법, 디바이스 제조 방법, 및 노광 방법
US10268121B2 (en) 2015-09-30 2019-04-23 Nikon Corporation Exposure apparatus and exposure method, and flat panel display manufacturing method
CN108139678B (zh) 2015-09-30 2022-03-15 株式会社尼康 曝光装置、平面显示器的制造方法及元件制造方法
CN111965948B (zh) 2015-09-30 2023-06-27 株式会社尼康 曝光装置、曝光方法、平面显示器的制造方法、及元件制造方法
US9819916B2 (en) * 2015-12-25 2017-11-14 Ricoh Company, Ltd. Movable apparatus, image generation apparataus, and image projection apparatus
CN108700827B (zh) * 2016-02-24 2020-07-24 Asml荷兰有限公司 衬底处理系统及光刻设备
CN113433802B (zh) 2016-09-30 2023-05-23 株式会社尼康 移动体装置、移动方法、曝光装置、曝光方法、平板显示器的制造方法、以及元件制造方法
US20200019071A1 (en) 2016-09-30 2020-01-16 Nikon Corporation Carrier device, exposure apparatus, exposure method, manufacturing method of flat-panel display, device manufacturing method, and carrying method
US10852647B2 (en) 2016-09-30 2020-12-01 Nikon Corporation Movable body apparatus, moving method, exposure apparatus, exposure method, flat-panel display manufacturing method , and device manufacturing method
CN109791364B (zh) 2016-09-30 2021-04-27 株式会社尼康 移动体装置、移动方法、曝光装置、曝光方法、平板显示器的制造方法、以及元件制造方法
TWI784972B (zh) * 2016-09-30 2022-12-01 日商尼康股份有限公司 曝光裝置、平板顯示器的製造方法、元件製造方法以及曝光方法
JP6787404B2 (ja) 2016-09-30 2020-11-18 株式会社ニコン 移動体装置、移動方法、露光装置、露光方法、フラットパネルディスプレイの製造方法、並びにデバイス製造方法
CN110709793B (zh) * 2017-03-31 2024-03-08 株式会社尼康 移动体装置、曝光装置、平板显示器的制造方法、元件制造方法以及移动体的驱动方法
US10254659B1 (en) * 2017-09-27 2019-04-09 Wuhan China Star Optoelectronics Technology Co., Ltd Exposure apparatus and method for exposure of transparent substrate
US10451109B1 (en) * 2018-04-18 2019-10-22 Schaeffler Technologies AG & Co. KG Linear guide bearing and associated quick-change system
KR102653016B1 (ko) * 2018-09-18 2024-03-29 삼성전자주식회사 척 구동 장치 및 기판 처리 장치
CN111650815B (zh) * 2019-03-04 2022-09-20 上海微电子装备（集团）股份有限公司 一种掩模台及光刻系统
CN111230490B (zh) * 2020-03-18 2024-09-10 苏州赛腾菱欧智能科技有限公司 一种马达冷却器辅助组装机构
JP7370920B2 (ja) * 2020-03-31 2023-10-30 住友重機械工業株式会社 ステージ装置
CN112223425A (zh) * 2020-09-29 2021-01-15 上海精测半导体技术有限公司 一种输送机构及切割装置
KR20220081858A (ko) 2020-12-09 2022-06-16 이준희 인체감지센서를 이용한 비접촉 방식 및 자외선을 이용한 자동 살균 방식의 엘리베이터 버튼

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004363259A (ja) * 2003-06-03 2004-12-24 Canon Inc 位置決め装置及び露光装置
JP2006086442A (ja) * 2004-09-17 2006-03-30 Nikon Corp ステージ装置及び露光装置
JP2006224237A (ja) * 2005-02-17 2006-08-31 Utsunomiya Univ ステージ制御装置
JP2006253572A (ja) * 2005-03-14 2006-09-21 Nikon Corp ステージ装置、露光装置、及びデバイス製造方法

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02284837A (ja) * 1989-04-25 1990-11-22 Fujitsu Ltd 縦型ステージに於けるステージ自重補償方法
KR100300618B1 (ko) * 1992-12-25 2001-11-22 오노 시게오 노광방법,노광장치,및그장치를사용하는디바이스제조방법
JPH07183192A (ja) * 1993-12-22 1995-07-21 Canon Inc 移動ステージ機構およびこれを用いた露光装置
JP2001230305A (ja) * 2000-02-18 2001-08-24 Canon Inc 支持装置
JP2001313250A (ja) 2000-02-25 2001-11-09 Nikon Corp 露光装置、その調整方法、及び前記露光装置を用いるデバイス製造方法
TW546699B (en) 2000-02-25 2003-08-11 Nikon Corp Exposure apparatus and exposure method capable of controlling illumination distribution
JP5205683B2 (ja) 2000-04-19 2013-06-05 株式会社ニコン 光学装置、露光装置、および露光方法
JP2004130312A (ja) 2000-12-28 2004-04-30 Seiko Epson Corp 素子製造装置
JP2003022960A (ja) 2001-07-09 2003-01-24 Canon Inc ステージ装置及びその駆動方法
TW529172B (en) 2001-07-24 2003-04-21 Asml Netherlands Bv Imaging apparatus
JP4136363B2 (ja) * 2001-11-29 2008-08-20 キヤノン株式会社 位置決め装置及びそれを用いた露光装置
JP4122922B2 (ja) * 2002-10-18 2008-07-23 ウシオ電機株式会社 平面ステージ装置
KR20050085235A (ko) 2002-12-10 2005-08-29 가부시키가이샤 니콘 노광 장치 및 디바이스 제조 방법
KR20190002749A (ko) * 2003-07-28 2019-01-08 가부시키가이샤 니콘 노광 장치 및 디바이스 제조 방법, 그리고 노광 장치의 제어 방법
JP4307288B2 (ja) 2004-02-25 2009-08-05 キヤノン株式会社 位置決め装置
KR20070039926A (ko) * 2004-07-23 2007-04-13 가부시키가이샤 니콘 지지 장치, 스테이지 장치, 노광 장치, 및 디바이스의 제조방법
JP2006203113A (ja) 2005-01-24 2006-08-03 Nikon Corp ステージ装置、ステージ制御方法、露光装置及び方法、並びにデバイス製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004363259A (ja) * 2003-06-03 2004-12-24 Canon Inc 位置決め装置及び露光装置
JP2006086442A (ja) * 2004-09-17 2006-03-30 Nikon Corp ステージ装置及び露光装置
JP2006224237A (ja) * 2005-02-17 2006-08-31 Utsunomiya Univ ステージ制御装置
JP2006253572A (ja) * 2005-03-14 2006-09-21 Nikon Corp ステージ装置、露光装置、及びデバイス製造方法

Cited By (42)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8102505B2 (en) 2007-03-20 2012-01-24 Asml Netherlands B.V. Lithographic apparatus comprising a vibration isolation support device
JP2008235889A (ja) * 2007-03-20 2008-10-02 Asml Netherlands Bv 振動絶縁サポートデバイスを含むリソグラフィ装置
KR20110133570A (ko) 2009-03-04 2011-12-13 가부시키가이샤 니콘 이동체 장치, 노광 장치, 및 디바이스 제조 방법
JP2010206205A (ja) * 2009-03-04 2010-09-16 Nikon Corp 移動体装置、露光装置、及びデバイス製造方法
KR20200051842A (ko) 2009-03-04 2020-05-13 가부시키가이샤 니콘 이동체 장치, 노광 장치, 및 디바이스 제조 방법
US10514616B2 (en) 2009-03-04 2019-12-24 Nikon Corporation Movable body apparatus, exposure apparatus and device manufacturing method
KR20190038956A (ko) 2009-03-04 2019-04-09 가부시키가이샤 니콘 이동체 장치, 노광 장치, 및 디바이스 제조 방법
US9977345B2 (en) 2009-03-04 2018-05-22 Nikon Corporation Movable body apparatus, exposure apparatus and device manufacturing method
US8659746B2 (en) 2009-03-04 2014-02-25 Nikon Corporation Movable body apparatus, exposure apparatus and device manufacturing method
WO2010101267A1 (en) 2009-03-04 2010-09-10 Nikon Corporation Movable body apparatus, exposure apparatus and device manufacturing method
KR20170012584A (ko) 2009-03-04 2017-02-02 가부시키가이샤 니콘 이동체 장치, 노광 장치, 및 디바이스 제조 방법
US9500963B2 (en) 2009-03-04 2016-11-22 Nikon Corporation Movable body apparatus, exposure apparatus and device manufacturing method
US9170504B2 (en) 2009-03-04 2015-10-27 Nikon Corporation Movable body apparatus, exposure apparatus and device manufacturing method
JP2014112247A (ja) * 2009-03-04 2014-06-19 Nikon Corp 移動体装置、露光装置、及び移動方法
WO2010122788A1 (ja) * 2009-04-21 2010-10-28 株式会社ニコン 移動体装置、露光装置、露光方法、及びデバイス製造方法
US8395758B2 (en) 2009-05-15 2013-03-12 Nikon Corporation Exposure apparatus and device manufacturing method
US8699001B2 (en) 2009-08-20 2014-04-15 Nikon Corporation Object moving apparatus, object processing apparatus, exposure apparatus, object inspecting apparatus and device manufacturing method
WO2011021723A1 (en) 2009-08-20 2011-02-24 Nikon Corporation Object processing apparatus, exposure apparatus and exposure method, and device manufacturing method
WO2011021711A1 (en) 2009-08-20 2011-02-24 Nikon Corporation Object processing apparatus, exposure apparatus and exposure method, and device manufacturing method
WO2011021709A1 (en) 2009-08-20 2011-02-24 Nikon Corporation Object moving apparatus, object processing apparatus, exposure apparatus, object inspecting apparatus and device manufacturing method
KR20180058854A (ko) 2009-08-20 2018-06-01 가부시키가이샤 니콘 물체 처리 장치, 노광 장치 및 노광 방법, 및 디바이스 제조 방법
JP2011085672A (ja) * 2009-10-14 2011-04-28 Nikon Corp 移動体装置、露光装置、及びデバイス製造方法
JP2017021361A (ja) * 2010-09-07 2017-01-26 株式会社ニコン 露光装置、フラットパネルディスプレイの製造方法、デバイス製造方法、及び露光方法
WO2012033212A1 (en) * 2010-09-07 2012-03-15 Nikon Corporation Movable body apparatus, object processing device, exposure apparatus, flat-panel display manufacturing method, and device manufacturing method
JPWO2012032768A1 (ja) * 2010-09-07 2014-01-20 株式会社ニコン 移動体装置、露光装置、露光方法、フラットパネルディスプレイの製造方法、及びデバイス製造方法
JP5849955B2 (ja) * 2010-09-07 2016-02-03 株式会社ニコン 移動体装置、露光装置、露光方法、フラットパネルディスプレイの製造方法、及びデバイス製造方法
WO2012032768A1 (ja) * 2010-09-07 2012-03-15 株式会社ニコン 移動体装置、露光装置、露光方法、フラットパネルディスプレイの製造方法、及びデバイス製造方法
JP2019179250A (ja) * 2010-09-07 2019-10-17 株式会社ニコン 露光装置、フラットパネルディスプレイの製造方法、及びデバイス製造方法
US8598538B2 (en) 2010-09-07 2013-12-03 Nikon Corporation Movable body apparatus, object processing device, exposure apparatus, flat-panel display manufacturing method, and device manufacturing method
JP2012234109A (ja) * 2011-05-09 2012-11-29 Nikon Corp 移動体装置、露光装置、フラットパネルディスプレイの製造方法、デバイス製造方法、及び移動体装置の組立方法。
JP2013217957A (ja) * 2012-04-04 2013-10-24 Nikon Corp 露光装置、フラットパネルディスプレイの製造方法、及びデバイス製造方法
WO2013150790A1 (ja) * 2012-04-04 2013-10-10 株式会社ニコン 露光装置、フラットパネルディスプレイの製造方法、及びデバイス製造方法
JP2013217950A (ja) * 2012-04-04 2013-10-24 Nikon Corp 移動体装置、露光装置、フラットパネルディスプレイの製造方法、及びデバイス製造方法
US9933108B2 (en) 2013-07-02 2018-04-03 Nsk Ltd. Table device and conveyance device
JP5541398B1 (ja) * 2013-07-02 2014-07-09 日本精工株式会社 テーブル装置、及び搬送装置
WO2015001689A1 (ja) * 2013-07-02 2015-01-08 日本精工株式会社 テーブル装置、及び搬送装置
JP2015012256A (ja) * 2013-07-02 2015-01-19 日本精工株式会社 テーブル装置、及び搬送装置
JP2019185056A (ja) * 2014-03-26 2019-10-24 株式会社ニコン 移動体装置、露光装置、フラットパネルディスプレイの製造方法、及びデバイス製造方法
JP2020190740A (ja) * 2015-03-31 2020-11-26 株式会社ニコン 露光装置、フラットパネルディスプレイの製造方法、デバイス製造方法、及び露光方法
JP2016224379A (ja) * 2015-06-03 2016-12-28 旭化成エンジニアリング株式会社 平面移動装置
JP2017156761A (ja) * 2017-04-19 2017-09-07 株式会社ニコン 移動体装置、露光装置、フラットパネルディスプレイの製造方法、及びデバイス製造方法
JP2019113868A (ja) * 2019-04-03 2019-07-11 株式会社ニコン 露光装置及び露光方法、並びにフラットパネルディスプレイの製造方法、及びデバイス製造方法

Also Published As

Publication number Publication date
CN101611470A (zh) 2009-12-23
US20100018950A1 (en) 2010-01-28
TW200846842A (en) 2008-12-01
US20200225589A1 (en) 2020-07-16
JP5854336B2 (ja) 2016-02-09
KR101547784B1 (ko) 2015-08-26
US9366974B2 (en) 2016-06-14
JP5448070B2 (ja) 2014-03-19
KR20090127309A (ko) 2009-12-10
KR20140097572A (ko) 2014-08-06
TWI533093B (zh) 2016-05-11
JP2014090198A (ja) 2014-05-15
US10228625B2 (en) 2019-03-12
JPWO2008129762A1 (ja) 2010-07-22
KR101590645B1 (ko) 2016-02-18
US10627725B2 (en) 2020-04-21
US20190155176A1 (en) 2019-05-23
HK1136388A1 (en) 2010-06-25
US20160259255A1 (en) 2016-09-08
CN101611470B (zh) 2012-04-18

Similar Documents

Publication Publication Date Title
WO2008129762A1 (ja) 移動体装置、パターン形成装置及びパターン形成方法、デバイス製造方法、移動体装置の製造方法、並びに移動体駆動方法
SG140481A1 (en) A method for fabricating micro and nano structures
WO2008054379A3 (en) Shape controlled growth of nanostructured films and objects
ATE405707T1 (de) Verfahren und vorrichtung zum rammen eines pfahls in substrate unter wasser
MY143355A (en) Process for transesterification
EP2490248A3 (en) Exposure apparatus and device manufacturing method
TW200712573A (en) Method and apparatus for manufacturing a pixel matrix of a color filter for a flat panel display
DE602004008620D1 (de) Verfahren zur herstellung dreidimensionalen formteilen
PA8629901A1 (es) Sintesis regioespecifica de derivados de 42-ester de rapamicina
TW200607753A (en) Nanostructures and method of making the same
TW200734076A (en) Apparatus and method for cleaning a substrate terminal area
ATE479202T1 (de) Verfahren zur herstellung vollfarbiger organischer elektrolumineszenter vorrichtungen
WO2012027422A3 (en) Methods and apparatus for interacting with an electronic device application by moving an object in the air over an electronic device display
WO2007047747A3 (en) System and method for designing and producing confectionary arrangement
TW200729311A (en) Liquid processing method and liquid processing apparatus
PL2220269T3 (pl) Sposób wytwarzania płyty prasującej i sposób wytłaczania panelu podłogowego
CN105818392B (zh) 家具制造的3d打印机及其打印方法
ITMO20060038A1 (it) Apparato per la decorazione di piastrelle ceramiche
WO2005077549A8 (en) Thin film transistor and display device, and method for manufacturing thereof
TW200631724A (en) Stage device, gantry-type stage device, and method for controlling stage device
WO2009063906A1 (ja) 貼合せ基板製造装置および貼合せ基板製造方法
CN102887343A (zh) 垂直升降立体多层一体化输送装置及其输送方法
WO2008078500A1 (ja) 成膜装置および成膜方法
DE602005012308D1 (de) VERFAHREN UND VORRICHTUNG ZUM HERSTELLEN einer VERPACKUNG
EP2545802A3 (en) Manufacturing method of artificial nail with 3-dimension ornament

Legal Events

Date Code Title Description
WWE Wipo information: entry into national phase

Ref document number: 200880004910.X

Country of ref document: CN

121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 08720323

Country of ref document: EP

Kind code of ref document: A1

ENP Entry into the national phase

Ref document number: 2009510750

Country of ref document: JP

Kind code of ref document: A

NENP Non-entry into the national phase

Ref country code: DE

WWE Wipo information: entry into national phase

Ref document number: 1020097020433

Country of ref document: KR

122 Ep: pct application non-entry in european phase

Ref document number: 08720323

Country of ref document: EP

Kind code of ref document: A1

WWE Wipo information: entry into national phase

Ref document number: 1020147019380

Country of ref document: KR