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WO2008123519A1 - レーザ加工装置及びレーザ加工方法 - Google Patents

レーザ加工装置及びレーザ加工方法 Download PDF

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Publication number
WO2008123519A1
WO2008123519A1 PCT/JP2008/056463 JP2008056463W WO2008123519A1 WO 2008123519 A1 WO2008123519 A1 WO 2008123519A1 JP 2008056463 W JP2008056463 W JP 2008056463W WO 2008123519 A1 WO2008123519 A1 WO 2008123519A1
Authority
WO
WIPO (PCT)
Prior art keywords
processing
laser
laser processing
outputs
processing apparatus
Prior art date
Application number
PCT/JP2008/056463
Other languages
English (en)
French (fr)
Inventor
Naruhiko Mukai
Wataru Kono
Makoto Ochiai
Katsuhiko Sato
Nobuichi Suezono
Original Assignee
Kabushiki Kaisha Toshiba
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kabushiki Kaisha Toshiba filed Critical Kabushiki Kaisha Toshiba
Priority to US12/594,240 priority Critical patent/US20100116801A1/en
Priority to EP08739576A priority patent/EP2135703A1/en
Publication of WO2008123519A1 publication Critical patent/WO2008123519A1/ja

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • B08B7/0035—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like
    • B08B7/0042—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like by laser
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
    • B23K26/0613—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams having a common axis
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4296—Coupling light guides with opto-electronic elements coupling with sources of high radiant energy, e.g. high power lasers, high temperature light sources

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Laser Beam Processing (AREA)

Abstract

　本発明に係るレーザ加工装置は、連続波またはパルス波の熱加工用レーザ光、またはパルス波の表面処理用レーザ光を射出するレーザ発振器と、前記レーザ発振器から射出されるレーザ光を光ファイバに入射させる入射光学系と、光ファイバから射出されるレーザ光を集光させる集光レンズと、集光レンズを搭載して処理対象物の近傍に移動して、処理対象物の表面にレーザ光を照射する施工装置と、を備え、前記レーザ発振器は、熱加工を行う際には前記熱加工用レーザ光を射出し、この熱加工の前処理または後処理を行う際には表面処理用レーザ光を射出する。
PCT/JP2008/056463 2007-04-02 2008-04-01 レーザ加工装置及びレーザ加工方法 WO2008123519A1 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US12/594,240 US20100116801A1 (en) 2007-04-02 2008-04-01 Laser processing apparatus and laser processing method
EP08739576A EP2135703A1 (en) 2007-04-02 2008-04-01 Laser processing apparatus and laser processing method

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-096356 2007-04-02
JP2007096356A JP2008254006A (ja) 2007-04-02 2007-04-02 レーザ加工装置及びレーザ加工方法

Publications (1)

Publication Number Publication Date
WO2008123519A1 true WO2008123519A1 (ja) 2008-10-16

Family

ID=39830996

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/056463 WO2008123519A1 (ja) 2007-04-02 2008-04-01 レーザ加工装置及びレーザ加工方法

Country Status (4)

Country Link
US (1) US20100116801A1 (ja)
EP (1) EP2135703A1 (ja)
JP (1) JP2008254006A (ja)
WO (1) WO2008123519A1 (ja)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5667344B2 (ja) * 2009-01-22 2015-02-12 オー・エム・シー株式会社 レーザー出射ユニット
US20130061827A1 (en) * 2011-09-09 2013-03-14 GM Global Technology Operations LLC Cylinder head system and method of forming same
US10179378B2 (en) 2012-05-10 2019-01-15 Preco, Inc. Odor reduction in laser processed material with curl reduction
US9458728B2 (en) * 2013-09-04 2016-10-04 Siemens Energy, Inc. Method for forming three-dimensional anchoring structures on a surface by propagating energy through a multi-core fiber
US9343307B2 (en) 2013-12-24 2016-05-17 Ultratech, Inc. Laser spike annealing using fiber lasers
US10239155B1 (en) * 2014-04-30 2019-03-26 The Boeing Company Multiple laser beam processing
JP6549878B2 (ja) * 2015-04-03 2019-07-24 株式会社東芝 レーザ光照射装置およびレーザピーニング処理方法
US10226838B2 (en) * 2015-04-03 2019-03-12 Kabushiki Kaisha Toshiba Laser light irradiation apparatus and laser peening treatment method
JP5997804B1 (ja) * 2015-06-03 2016-09-28 株式会社Ihi 表面処理装置
US11433483B2 (en) * 2016-11-18 2022-09-06 Ipg Photonics Corporation System and method laser for processing of materials
US20220317484A1 (en) * 2021-03-30 2022-10-06 Tdk Corporation Optical device and optical system
KR20240098378A (ko) * 2022-12-21 2024-06-28 한국광기술원 레이저 기반 배관내 녹 제거장치

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11277277A (ja) * 1994-01-25 1999-10-12 Sumitomo Heavy Ind Ltd レ―ザ加工機
JP2003053533A (ja) 2001-08-09 2003-02-26 Toshiba Corp 構造物の補修方法および補修溶接装置
JP2005034849A (ja) * 2003-07-15 2005-02-10 Seiko Epson Corp レーザ加工方法および液滴吐出ヘッド
JP2005262220A (ja) * 2004-03-16 2005-09-29 Ricoh Co Ltd レーザ加工その場計測装置、その場計測方法、及びレーザ加工装置
JP2006130534A (ja) * 2004-11-05 2006-05-25 Honda Motor Co Ltd レーザビームろう接法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6769307B1 (en) * 1997-11-21 2004-08-03 Perceptron, Inc. Method and system for processing measurement signals to obtain a value for a physical parameter
US6211482B1 (en) * 1997-10-24 2001-04-03 Electric Power Research Institute, Inc. Apparatus and method for precision excavation and welding of thick-walled components

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11277277A (ja) * 1994-01-25 1999-10-12 Sumitomo Heavy Ind Ltd レ―ザ加工機
JP2003053533A (ja) 2001-08-09 2003-02-26 Toshiba Corp 構造物の補修方法および補修溶接装置
JP2005034849A (ja) * 2003-07-15 2005-02-10 Seiko Epson Corp レーザ加工方法および液滴吐出ヘッド
JP2005262220A (ja) * 2004-03-16 2005-09-29 Ricoh Co Ltd レーザ加工その場計測装置、その場計測方法、及びレーザ加工装置
JP2006130534A (ja) * 2004-11-05 2006-05-25 Honda Motor Co Ltd レーザビームろう接法

Also Published As

Publication number Publication date
US20100116801A1 (en) 2010-05-13
EP2135703A1 (en) 2009-12-23
JP2008254006A (ja) 2008-10-23

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