WO2008007134A3 - Method of controlling contamination of a surface - Google Patents
Method of controlling contamination of a surface Download PDFInfo
- Publication number
- WO2008007134A3 WO2008007134A3 PCT/GB2007/050350 GB2007050350W WO2008007134A3 WO 2008007134 A3 WO2008007134 A3 WO 2008007134A3 GB 2007050350 W GB2007050350 W GB 2007050350W WO 2008007134 A3 WO2008007134 A3 WO 2008007134A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- chamber
- euv
- optical element
- tin
- controlling contamination
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
- G03F7/70925—Cleaning, i.e. actively freeing apparatus from pollutants, e.g. using plasma cleaning
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F4/00—Processes for removing metallic material from surfaces, not provided for in group C23F1/00 or C23F3/00
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
- G03F7/70916—Pollution mitigation, i.e. mitigating effect of contamination or debris, e.g. foil traps
Landscapes
- Health & Medical Sciences (AREA)
- Epidemiology (AREA)
- Public Health (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Atmospheric Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- General Physics & Mathematics (AREA)
- Environmental & Geological Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Plasma & Fusion (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Abstract
Apparatus for generating extreme ultra violet (EUV) radialson comprises a tin EUV source, a chamber housing at least one optical element for directing EUV radiation generated by the EUV source towards a radiation outlet from the chamber, at least one vacuum pump for evacuating the chamber, and means for supplying to the chamber an organic halide for reacting with the deposited on said at least one optical element to form an organo-tin halide.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB0614028A GB0614028D0 (en) | 2006-07-14 | 2006-07-14 | Method of controlling contamination of a surface |
GB0614028.9 | 2006-07-14 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2008007134A2 WO2008007134A2 (en) | 2008-01-17 |
WO2008007134A3 true WO2008007134A3 (en) | 2008-03-27 |
Family
ID=36955676
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/GB2007/050350 WO2008007134A2 (en) | 2006-07-14 | 2007-06-22 | Method of controlling contamination of a surface |
Country Status (3)
Country | Link |
---|---|
GB (1) | GB0614028D0 (en) |
TW (1) | TW200821762A (en) |
WO (1) | WO2008007134A2 (en) |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6051150A (en) * | 1995-08-07 | 2000-04-18 | Seiko Epson Corporation | Plasma etching method and method of manufacturing liquid crystal display panel |
WO2006020080A2 (en) * | 2004-07-27 | 2006-02-23 | Cymer, Inc. | Systems and methods for reducing the influence of plasma-generated debris on the internal components of an euv light source |
WO2006056730A2 (en) * | 2004-11-26 | 2006-06-01 | The Boc Group Plc | Protection of surfaces exposed to charged particles |
EP1671711A1 (en) * | 2003-10-09 | 2006-06-21 | Ebara Corporation | Method of purifying matter contaminated by heavy metal and apparatus therefor |
WO2007107783A1 (en) * | 2006-03-23 | 2007-09-27 | Edwards Limited | Spectral filter repair |
-
2006
- 2006-07-14 GB GB0614028A patent/GB0614028D0/en not_active Ceased
-
2007
- 2007-06-22 WO PCT/GB2007/050350 patent/WO2008007134A2/en active Application Filing
- 2007-07-04 TW TW96124322A patent/TW200821762A/en unknown
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6051150A (en) * | 1995-08-07 | 2000-04-18 | Seiko Epson Corporation | Plasma etching method and method of manufacturing liquid crystal display panel |
EP1671711A1 (en) * | 2003-10-09 | 2006-06-21 | Ebara Corporation | Method of purifying matter contaminated by heavy metal and apparatus therefor |
WO2006020080A2 (en) * | 2004-07-27 | 2006-02-23 | Cymer, Inc. | Systems and methods for reducing the influence of plasma-generated debris on the internal components of an euv light source |
WO2006056730A2 (en) * | 2004-11-26 | 2006-06-01 | The Boc Group Plc | Protection of surfaces exposed to charged particles |
WO2007107783A1 (en) * | 2006-03-23 | 2007-09-27 | Edwards Limited | Spectral filter repair |
Non-Patent Citations (1)
Title |
---|
KLUNDER D J W ET AL: "Debris mitigation and cleaning strategies for Sn-based sources for EUV lithography", PROCEEDINGS OF THE SPIE, SPIE, BELLINGHAM, VA, US, vol. 5751, no. II, 1 May 2005 (2005-05-01), pages 943 - 951, XP002421952, ISSN: 0277-786X * |
Also Published As
Publication number | Publication date |
---|---|
WO2008007134A2 (en) | 2008-01-17 |
GB0614028D0 (en) | 2006-08-23 |
TW200821762A (en) | 2008-05-16 |
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