WO2008000425A1

WO2008000425A1 - Method for producing a transponder

Info

Publication number: WO2008000425A1
Application number: PCT/EP2007/005604
Authority: WO
Inventors: Klaus Finkenzeller; Stefan Kluge
Original assignee: Giesecke & Devrient Gmbh
Priority date: 2006-06-26
Filing date: 2007-06-25
Publication date: 2008-01-03
Also published as: DE102006029250A1

Abstract

The invention relates to a method for producing a transponder (1) comprising an integrated circuit (2) for storing and/or processing data. According to the method of the invention, a cuboid support (3) having six faces (4, 5, 6, 7, 8, 9) is produced. One at least partially electrically conducting respective layer (20, 21, 27, 28, 34, 41) is formed in parallel to a first face (4), a second face (5), a third face (6), a fourth face (7) and a fifth face (9) of the support (3). The support (3) is configured as an electrically insulating structure in the area of a sixth face (8).

Description

Method for producing a transponder

The invention relates to a method for producing a transponder. Furthermore, the invention relates to a transponder and a transponder arrangement.

Transponders are known in many designs and for many different applications and usually have an integrated circuit for storing and / or processing data and an antenna connected thereto for contactless transmission of data. Depending on the transmission wavelength, the desired range, the environment of use, etc., the design of the antenna may vary considerably. The preparation of such an antenna is sometimes very expensive. In addition, it may be difficult to form a reliable signal path between the integrated circuit and the antenna.

From JD Kraus "Antennas for all applications" 3rd edition, Mc Graw Hill (2002) pages 304-307 it is known to use a slot antenna for the emission of electromagnetic waves.To form a slot antenna in a metal sheet an elongated slot is recessed Length of the slot corresponds to half the wavelength of the radiated waves.The width of the slot is significantly smaller.At the two long sides of the slot, signal lines are connected, through which the slot antenna is supplied with the RF signal to be radiated.

In a further development of the slot antenna, the slot is formed as a cuboid depression whose side walls and bottom consist of a conductive material. This design is also referred to as an encapsulated (boiled-in) slot antenna. The depth of the recess is preferably one quarter of the wavelength of the waves radiated by the slot antenna. The invention has for its object to produce a transponder with reasonable effort, which is particularly suitable for mounting in the region of an electrically conductive surface.

This object is achieved by a method with the combination of features of claim 1.

The method according to the invention relates to the production of a transponder with an integrated circuit for storing and / or processing data. In the context of the method according to the invention, a parallelepiped carrier with six outer surfaces is produced. Parallel to a first outer surface, a second outer surface, a third outer surface, a fourth outer surface and a fifth outer surface of the carrier, an at least partially electrically conductive layer is formed in each case. In the region of a sixth outer surface of the carrier is formed electrically insulating.

The invention has the advantage that a transponder can be produced in a relatively simple manner, which is suitable for operation with a slot antenna and thus can be mounted in particular in the region of an electrically conductive surface. For this purpose, only one slot in the electrically conductive surface is provided. It is particularly advantageous that, in view of the design of the transponder, already existing production systems for chip cards can be used, which merely need to be slightly modified.

The first outer surface, the second outer surface, the third outer surface, the fourth outer surface and / or the fifth outer surface can each through the at least partially electrically conductive layer are formed. This means that the transponder is electrically conductive directly on the outer surfaces and thus the dimensions of the carrier can be used optimally and an electrical contacting of the outer surfaces is easily possible.

Likewise, it is also possible that the first outer surface, the second outer surface, the third outer surface, the fourth outer surface and / or the fifth outer surface of the carrier are each formed by an electrically insulating layer, which covers the at least partially electrically conductive layer. By the insulating layer, the at least partially electrically conductive layer is protected, for example against external mechanical effects. In particular, a combination of the two embodiments is possible, in which at least one outer surface is formed by the at least partially electrically conductive layer and at least one further outer surface by the electrically insulating layer which covers the at least partially electrically conductive layer.

Preferably, the at least partially electrically conductive layers formed parallel to the first outer surface, the second outer surface, the third outer surface, the fourth outer surface and the fifth outer surface of the carrier are connected to one another in an electrically conductive manner.

Between the integrated circuit and the parallel to the first outer surface and / or the parallel to the second outer surface formed at least partially electrically conductive layer, a signal path can be formed. This allows a simple electrical connection of the transponder in the intended installation environment. The signal path can be achieved by an electrically conductive connection between the integrated circuit circle and the at least partially electrically conductive layer are formed. Likewise, it is also possible to form the signal path by a capacitive coupling between the integrated circuit and the at least partially electrically conductive layer. For this purpose, a capacitive coupling surface can be embedded in the carrier. The capacitive coupling has the advantage that a DC-moderate short circuit of the integrated circuit is prevented via the electrically conductively connected layers.

The first outer surface and the second outer surface are preferably formed as main surfaces of the carrier. It is particularly advantageous if the first outer surface and the second outer surface have a length which corresponds to half of a wavelength intended for contactless data transmission with the integrated circuit and / or a width which corresponds to one quarter of the wavelength. These dimensions have been proven in encapsulated slot antennas.

In the context of the method according to the invention, the carrier is preferably produced from at least one film. In particular, the carrier is produced by lamination of a plurality of films. In this way, the integrated circuit can be embedded in the carrier with little effort and there is great freedom in designing the carrier.

The carrier can be made of at least one plastic film. Plastic films are available at low cost and can be processed well. Likewise, it is also possible to produce the carrier from at least one composite film which has a plastic film and a metal foil. Depending on the process variant, the use of a composite film that allows for the formation of a metallization during the production of Transponders can be dispensed with. The composite film may in particular be designed so that the plastic film extends only over a portion of the Metallf olie. As a result, a further simplification of the method can be achieved.

In the context of the method according to the invention it can be provided that at least one film is folded. It is advantageous if in the composite film only partial areas are folded, which have no plastic film. Furthermore, it can be provided that at least one film is completely or partially severed and thereby a portion of the film is removed.

In the context of the method according to the invention, a semifinished product with larger dimensions than the intended dimensions of the carrier is preferably produced. This has manufacturing advantages. In particular, this approach allows the use of existing production systems for smart cards. In particular, it can also be provided that the semifinished product is severed along a first contour, which is larger than the intended dimensions of the carrier. If personalization is to be carried out after the cut along the first outline, already existing systems for the personalization of chip cards can be used for this purpose. Furthermore, the semifinished product can be cut along a second contour, which corresponds to the intended dimensions of the carrier.

In the edge region of the first outer surface and / or the second outer surface a plurality of perforations can be formed. In this case, a portion of the edge region of the first outer surface and / or the second outer surface, to which the sixth outer surface adjoins, in the formation of the first outer surface and / or the second outer surface be omitted. The perforations can be filled at least partially with an electrically conductive material. This procedure is one of several ways of producing the at least partially electrically conductive layers. Likewise, it is also possible in this context to form at least one elongate opening in the edge region of the first outer surface and / or the second outer surface. In this variant, it is in an analogous manner advantageous if a portion of the edge region of the first outer surface and / or the second outer surface adjacent to the sixth outer surface is recessed in the formation of the opening. The opening can be filled at least partially with an electrically conductive material.

In particular, in order to save material, there is the possibility that the at least partially electrically conductive layer is formed according to a predetermined pattern for electrically conductive subregions.

The at least partially electrically conductive layer can be produced for example by printing or electroplating. Both procedures allow a precise and economical material application.

The integrated circuit can be embedded in the carrier and thus reliably protected against external influences. It is possible to expose the also embedded in the carrier terminals of the integrated circuit by a material removal.

It is particularly advantageous if at least one fastening device is formed on the carrier. As a result, later assembly of the transponder can be considerably facilitated. The fastening device is preferably formed integrally with the carrier. This has production niche advantages and can be achieved, for example, characterized in that the carrier is severed along the desired contour of the fastening device. In particular, the fastening device is equipped with at least one undercut. This has the advantage that the subsequent installation of the transponder can be carried out quickly and easily and, moreover, a very durable attachment is achieved.

The inventive method is particularly suitable for the production of transponders, which are operable in the UHF range.

The transponder according to the invention has an integrated circuit for storing and / or processing data and a flat piece-like carrier with two main surfaces and at least two end surfaces, each extending between the skin surfaces. Parallel to the main surfaces and parallel to at least one of the end surfaces of the carrier, an at least partially electrically conductive layer is formed in each case. In the region of at least one of the end faces, the carrier is designed to be electrically insulating.

The invention further relates to a transponder arrangement with a transponder produced according to the invention and an electrically conductive surface which has a slot, wherein the transponder is arranged in the region of the slot of the electrically conductive surface.

The invention will be explained below with reference to the embodiments illustrated in the drawings. It should be regarded as a transponder in the sense of the invention, a computer system in which the resources, ie memory resources and / or computing capacity (computing power) are limited. The transponder is capable of performing at least one unidirectional communication with a reader in a contactless manner.

Show it:

1 shows an embodiment of a transponder according to the invention in a schematic perspective view,

Fig. 2 shows an embodiment of the transponder with capacitive

Coupling of the integrated circuit in a schematic perspective view,

FIG. 3 shows the embodiment of the transponder shown in FIG. 2 in a schematic plan view of the long end face, FIG.

4 to 14 different snapshots during the production of the transponder according to a first variant of the method in a schematic perspective view,

15, 16 each show an embodiment of the transponder produced with the first variant of the method in a schematic plan view of the main surface,

17 is a snapshot during the manufacture of the

Transponders according to a second variant of the method in a schematic perspective view, 18 to 20 different snapshots during the production of the transponder according to a third variant of the method in a schematic perspective view,

21, 22 each an embodiment of the transponder produced by the third method variant in a schematic plan view of the main surface,

23, 24 different snapshots during the production of the transponder according to a fourth variant of the method in a schematic perspective view,

25 shows an exemplary embodiment of the transponder produced by the fourth variant of the method, in a schematic view of the main surface,

26 to 33 different snapshots during the production of the transponder according to a fifth variant of the method in a schematic plan view of the long end face,

Fig. 34 produced according to the fifth method variant

Transponder in a schematic plan view of the main surface, which forms in the illustration of FIG. 32, the underside of the laminate body,

FIGS. 35 to 38 different snapshots during the manufacture of the transponder according to a sixth variant of the method in a schematic plan view and 39 to 44 different snapshots during the manufacture of the transponder according to a seventh method variant in a schematic plan view of the long end face 8 is a circuit diagram for a modification of the third embodiment of the chip card.

Fig. 1 shows an embodiment of an inventively designed transponder 1 in a schematic perspective view. The representation is simplified and not true to scale. This also applies to the other figures.

The transponder 1 has an integrated circuit 2, which is embedded in a cuboid carrier 3. The integrated circuit 2 is preferably designed so that it supports a contactless data transmission in the UHF range. In this case, the integrated circuit 2 may be formed as a pure memory module, are stored in the data. Furthermore, it is also possible that the integrated circuit 2 is able to perform a processing of the data.

The carrier 3 is made of an electrically insulating material, for example a plastic. The carrier 3 has two major surfaces 4 and 5, which are parallel to each other. In the representation of FIG. 1, the two main surfaces 4 and 5 run parallel to the plane of the drawing and each have two vertically aligned narrow sides and two horizontally aligned longitudinal sides. Between the two narrow sides of the main surface 4 and the two narrow sides of the main surface 5, two short end faces 6 and 7 are formed. Between the two longitudinal sides of the main surfaces 4 and the two longitudinal sides of the main surfaces 5, two long end faces 8 and 9 are formed. The two main surfaces 4 and 5, which the short end faces 6 and 7 and the long end face 9 are each formed electrically conductive and electrically conductively connected to each other. Electrically conductive surfaces are characterized in Fig. 1 and in all other figures by a simple hatching. The long end face 8, which is arranged in the illustration of FIG. 1 on the upper side of the carrier 3, is designed to be electrically insulating. Electrically insulating surfaces are characterized in Fig. 1 and in all other figures by a cross-hatching.

Thus, all outer surfaces of the transponder 1 with the exception of the long end face 8 are electrically conductive. To generate the electrical conductivity, a metallization can be applied, wherein the long end face 8 either left blank or is subjected to an additional treatment to remove the metallization. The metalization can be formed either as a full-surface layer or in the form of a net or a similar structure. The metallization can be formed, for example, by a metallic foil, by printing, by electroplating, etc. Removal of the metallization is possible, for example, by punching or milling.

Between the integrated circuit 2 and the two main surfaces 4 and 5 of the carrier 3, a signal path is formed. For this purpose, the main surfaces 4 and 5 of the carrier 3 may be electrically connected to terminals provided for this purpose of the integrated circuit 2. Instead of an electrically conductive connection, for example, a capacitive coupling is possible. This will be explained with reference to FIGS. 2 and 3.

FIG. 2 shows an exemplary embodiment of the transponder 1 with capacitive coupling of the integrated circuit 2 in a schematic perspective. tivdarstellung. An associated schematic plan view of the long end face 8 is shown in FIG.

The embodiment of the transponder 1 shown in FIGS. 2 and 3 substantially corresponds to the embodiment of FIG. 1. However, the embodiment shown in Figures 2 and 3 as an additional component on a capacitive coupling surface 10, which within the carrier. 3 is arranged at a small distance from the main surface 4. Thus, a capacitance is formed by the main surface 4 and the coupling surface 10, wherein the material of the carrier 3 between the main surface 4 and the coupling surface 10 acts as a dielectric. The integrated circuit 2 is connected via electrically conductive connections to the coupling surface 10 and to the main surface 5 of the carrier 3, which is arranged at a greater distance to the coupling surface 10 than the main surface 4. This means that the integrated circuit 2 with the main surface. 5 is electrically connected and is capacitively coupled to the main surface 4. As a result, the integrated circuit 2 is prevented from being short-circuited by the DC current between the main surfaces 4 and 5.

As an alternative to the coupling surface 10 described above, a capacitance can also be connected in the signal path in some other way in order to prevent a DC-equivalent short circuit. For example, a capacitor can be provided as a discrete component, in particular in SMD construction. Likewise, it is also possible to form a capacitance by a suitable wiring or to provide a capacitance already in the integrated circuit 2. Finally, the integrated circuit 2 may also be designed so that it can be operated without a capacitance in the signal path. Without explicitly mentioning each one in the following assuming that adequate capacity exists as required.

The manufacture of the transponder 1 can be carried out in different ways. Some particularly advantageous procedures are described below.

4 to 14 show various snapshots during the production of the transponder 1 according to a first variant of the method in a schematic perspective view. In the first variant of the method and also in the further variants of the method described below, the carrier 3 is produced according to a technology which is usually used in the production of card bodies for chip cards. By way of example, the carrier 3 is produced by hot lamination of a plurality of films, in particular of plastic, the films preferably being processed in sheet form.

For example, in the context of the first variant of the method, the main surface 5 can be formed by a first plastic film 11, which is shown in FIG. In Fig. 4, an outline 12 of a standard card body for smart cards and an outline 13 of the finished transponder 1 are also shown. The first plastic film 11 may be a single film or a prelaminate of a plurality of individual films.

As shown in Fig. 5, a recess 14 for the integrated circuit 2 is milled into the first plastic film 11. The recess 14 is milled within the region of the first plastic film 11, which is bounded by the outline 13 of the finished transponder 1. At the same time, the Fung 14 preferably formed so that it is immediately adjacent to the outline 13 of the finished transponder 1.

In a subsequent processing step, the integrated circuit 2, which can be located in a standard housing and can have contact lugs 15, inserted into the recess 14 of the first film 11. This is shown in FIG.

Thereafter, a second plastic film 16, which forms the main surface 4, congruently placed on the first plastic film 11, so that the film stack shown in Fig. 7 is formed. The second plastic film 16 may again be a single film or a prelaminate of a plurality of individual films.

Subsequently, the first plastic film 11 and the second plastic film 16 are inseparably connected to each other by Heißlamination, so that the semifinished product 17 shown in Fig. 8 is formed. In this case, the integrated circuit 2 is embedded between the first plastic film 11 and the second plastic film 16.

As shown in FIG. 9, perforations 18 are formed in the inner region along the outline 13 of the finished transponder 1, which penetrate the semifinished product 17 in its full thickness from the main surface 4 to the main surface 5. The production of the holes 18 can be made for example by means of a laser, by drilling or by milling. The perforations 18 can be formed at equal distances from each other. Likewise, it is also possible to vary the distances of the holes 18, as shown in Fig. 9. In particular, the electrical requirements can be taken into account. In the region of the outline 13 of the finished transponder ders 1, within which the long end face 8 is formed, no perforations 18 are made.

In the region of the two Kontaktfähnchen 15 of the integrated circuit 2 recesses 19 are milled, which extend to the Kontaktfähnchen 15. In this case, a recess 19 is milled starting from the main surface 4 in the semifinished product 17 and thereby exposing a Kontaktfähnchen 15. A second recess 19 is milled starting from the main surface 5 in the semifinished product 17, thereby exposing the other Kontaktfähnchen 15. In this way, the embedded in the semifinished product 17

Contact flag 15 exposed, so that a Kontaktdähnchen 15 for contacting from the main surface 4 forth and the other Kontaktfähnchen 15 is accessible from the main surface 5 for contacting. The result of this processing step is shown in FIG.

As shown in FIG. 11, the holes 18 and the recesses 19 are filled with an electrically conductive filler 20. In this way, the conditions are created that the two main surfaces 4 and 5 can be electrically connected to each other. In addition, the conditions are created so that the main surfaces 4 and 5 can be electrically conductively connected to one of the Kontaktfähnchen 15 of the integrated circuit 2. The filling of the holes 18 and the recesses 19 may alternatively be carried out at a later time together with one of the operations described below.

FIG. 12 shows how an electrically conductive coating 21 is applied to the main surface 4. The coating 21 can be applied in particular by printing technology. For example, a sieve printing process are used, in which a polymer printing paste is applied. The coating 21 is applied in a region which is slightly larger than the outline 13 of the finished transponder 1. On the main surface 5, the coating 21 is applied in a corresponding manner. The applied coating 21 is electrically conductively connected to the filling material 20 in the perforations 18 and recesses 19. Thus, via the filling material 20 in the holes 18, an electrically conductive connection between the coating 21 on the main surface 4 and the coating 21 on the main surface 5. Furthermore, there is an electrically conductive connection between the coating 21 through the filler 20 in the recesses 19 the main surface 4 and the one contact lugs 15 of the integrated circuit 2 and between the coating 21 on the main surface 5 and the other Kontaktfähnchen 15 of the integrated circuit. 2

If the perforations 18 and recesses 19 are not already filled with the filling material 20, the filling can take place within the scope of the application of the coating 21, thereby saving a work step.

The application of the coating 21 can alternatively also take place at a later time after a punching along the outline 12 of a standard card body or the outline 13 of the finished transponder 1 has been carried out.

In particular, in order to save material during the application of the coating 21, it is possible to dispense with a full-area formation of the coating 21. Instead, the coating 21 can be applied according to a predetermined pattern, which can be both coated and uncoated. te areas has. For example, the pattern may be a grid structure. In particular, the pattern can be adapted to the electrical requirements, for example to the expected current densities in the region of the coating 21.

As shown in FIG. 13, as the next processing step, a punching operation is performed along the outline 12 of a standard card body. This makes it possible to perform a personalization of the integrated circuit 2 in a personalization system for smart cards. A tailored to the dimensions of the transponder 1 personalization system is not needed. The punching operation along the outline 12 of a standard card body may also be omitted if no personalization is to be performed. This may for example be the case when a serial number is stored in the integrated circuit 2 and this is sufficient for the intended application.

To protect the coating 21 on the main surfaces 4 and 5, a protective film can be applied in each case.

To complete the transponder 1, a punching along the outline 13 of the finished transponder 1 is performed. This is shown in FIG. After this punching step, the perforations 18 filled with the filling material 20 are located on the edge of the carrier 3 of the transponder 1, specifically in the region of the short end faces 6 and 7 and the long end face 9.

It is also possible to punch out a different shape to facilitate the subsequent assembly of the transponder 1. Exemplary embodiments hereby are shown in Figs. 15 and 16, which show the transponder 1 respectively in a plan view of the main surface 4.

According to FIG. 15, a material strip 22 still remains after punching on the short end faces 6 and 7. The material strips 22 each protrude slightly beyond the long end face 8 and are formed as hooks 23 in the protruding area.

16 remains after punching on the long end face 8, a strip of material 24 which projects on both sides slightly beyond the short end faces 6 and 7. In the protruding areas, a hook 25 is formed, which projects at right angles from the material strip 24 in the direction of the long end face 9.

The strips of material 22, 24 with the hooks 23, 25 are used to attach the transponder 1 by snapping into a slot formed in a sheet metal part. By locking the integrated circuit 2 of the transponder 1 is connected to a slot antenna, via which a contactless signal transmission can be performed.

The electrical properties of the transponder 1 are not appreciably influenced by the different punching geometries of FIGS. 14, 15 and 16, since these are determined by the respective same arrangement of the holes 18 filled with the filling material 20. In addition, the strips of material 22, 24 and the hooks 23, 25 no Beschichrung 21. This can be achieved in that in the area of the material strips 22, 24 and the hooks 23, 25 no coating 21 is printed on the main surfaces 4 and 5 of the transponder 1. 17 shows a snapshot during the production of the transponder 1 according to a second variant of the method in a schematic perspective view. In the second variant of the method, it is possible to proceed in an analogous manner, as explained with reference to FIGS. 4 to 8 for the first method variant. In contrast to the first variant of the method, however, no individual perforations 18 are produced, but instead a U-shaped cut-out 26 is formed along the outline 13 of the finished transponder 1. Then the Kontaktfähnchen 15 of the integrated circuit 2 are exposed analogous to the first manufacturing variant by milling the recesses 19. This is shown in FIG. 17.

An electrically conductive connection between the two main surfaces 4 and 5 can be produced, for example, by inserting a non-figuratively illustrated metallic insert into the punch-out 26. To fix the insert 17 recesses may be provided in the semifinished product, in which engages the insert. The further production sequence can be carried out according to the first method variant, d. H. on the main surfaces 4 and 5, the coating 21 is applied by screen printing and it is carried out a punching along the outline 13 of the finished transponder 1, wherein previously optionally still a punching along the outline 12 of a standard card body and a personalization can be performed. It is also possible to dispense with the insert and fill the punch 26 in the screen printing process with a conductive paste.

If the insert is used, it is possible to make it so that it may be provided for the attachment of the transponder 1 in an installation environment provided hooks 23 and 25, so that a better spring action and a higher mechanical stability can be achieved.

FIGS. 18 to 20 show various snapshots during the production of the transponder 1 according to a third variant of the method in a schematic perspective view. The third variant of the method is characterized in that all or part of the electrically conductive surfaces are produced by means of a galvanic process. Moreover, the preparation according to the first or the second process variant can be carried out. This means that first of the holes 18 or the punch 26 are formed. Then, the perforations 18 and the punch 26 are coated by a galvanic process electrically conductive, d. H. The perforations 18 and the punched-out 26 are not filled with the filling material 20, but only galvanically coated in the region of their walls.

In order to enable a durable coating, the surfaces to be coated are subjected to an activation process, by which a starting layer for the electroplating process is produced. The activation can be done for example by means of a chemical bath. Likewise, activation by means of a laser is possible. In this case, it is also possible to produce the perforations 18 or the punch 26 by laser cutting and at the same time perform an activation. As part of the subsequent electroplating process, a metal layer 27 is deposited on the activated surfaces. The layer thickness is typically 20 microns. As a metal, for example, copper is suitable.

If a full-surface activation was carried out by a chemical bath, the deposition of the metal layer 27 by the galva- nik process over the entire surface. The result of a full-surface metallization is shown in FIG. The metal layer 27 covers all outer surfaces of the semifinished product 17 and the walls of the holes 18 and the recesses 19th

In the case of a selective activation by means of a laser, the electroplating process causes a correspondingly selective metallization. In Fig. 19, a selective activation of the perforations 18, the recesses 19 and the major surfaces 4 and 5 within the outline 13 of the finished transponder 1 was performed. Through the subsequent electroplating process, the activated areas, i. H. the perforations 18, the recesses 19 and the main surfaces 4 and 5 within the outline 13 of the finished transponder 1 with the metal layer 27 coated. The metal layer 27 has a layer thickness of typically about 20 .mu.m and may consist, for example, of copper.

Alternatively, for example, it is also possible to activate only the perforations 18 and the recesses 19 and then metallize them by the electroplating process. The main surfaces 4 and 5, which have been left open by the activation, are then provided with the coating 21 by screen printing. This is illustrated in FIG. 20, wherein different hatchings were used for the galvanically and for the metallurgically metallized surfaces.

After the metallization, the transponder 1 is punched out in a manner analogous to that described in the first method variant. If necessary, personalization of the transponder 1 can also be carried out. As part of the punching process, in turn, there is the possibility of material strips 22, 24 and hooks 23, 25 for later attachment of the Form transponders 1 in an installation environment. Embodiments of finished transponder 1, which were produced according to the third method variant, are shown in FIGS. 21 and 22 respectively as a plan view of the main surface 4.

FIG. 21 shows an exemplary embodiment of a transponder 1 with metallized perforations 18. Since the galvanically applied metal layer 27 is very thin, the perforations 18 are not completely filled up, but only coated with the metal layer 27 in the region of their walls. Furthermore, the walls of the recesses 19 and the main surfaces 4 and 5 of the carrier 3 are coated with the metal layer 27. On the long end faces 8 and 9 and on the short end faces 6 and 7 no metal layer 27 is formed. The punching geometry was chosen so that in the region of the short end faces 6 and 7 strips of material 22 are formed with hooks 23, each having no metal layer 27.

FIG. 22 shows an exemplary embodiment of a transponder 1 in which a U-shaped free punch 26 has been formed for the metallization of the short end faces 6 and 7 and the long end face 9. Since the free punch 26 is formed in the region of the outline 13 of the finished transponder 1, this is no longer visible after completion of the transponder 1. In the embodiment of the transponder 1 shown in FIG. 22, the walls of the recesses 19, the main surfaces 4 and 5, the long end face 9 and the short end faces 6 and 7 are covered with the metal layer 27. In the region of the long end face 8 a material strip 24 formed with hooks 25, each having no metal layer 27.

The embodiments of the transponder 1 shown in FIGS. 21 and 22 can also be modified such that the material strips 22, 24 and the hooks 23, 25 are wholly or partially coated with the metal layer 27.

FIGS. 23 and 24 show various snapshots during the production of the transponder 1 according to a fourth variant of the method in a schematic perspective view. In a fourth variant of the method, a coating 21 is applied by screen printing analogously to the first variant of the method, although neither perforations 18 nor a U-shaped Ausaustrufanzung 26 are formed. The coating 21 is printed in an area on the two main surfaces 4 and 5 of the semifinished product 17, which is slightly larger than predetermined by the outline 13 of the finished transponder 1. This is shown in Fig. 23. If a personalization is to be performed, then is punched along the outline 12 of a standard card body.

Thereafter, the long end face 9 of the transponder 1 is exposed by a punching operation and then coated in a pad printing process (see arrow) conductive. A snapshot at this time is shown in FIG. Then, further punching operations are performed to form the strips of material 22 and hooks 23 and expose the long end face 8. Finally, the short end faces 6 and 7, on which the material strips 22 are formed, are conductively coated in the pad printing process. The long end face 8 is not coated. When coating the long end face 9 and the short end faces 6 and 7, the procedure is such that the applied coating 21 in each case covers the edges formed with the main faces 4 and 5. In this way, the long end face 9 and the short end faces 6 and 7 are electrically connected to the main surfaces 4 and 5. The transponder 1 produced in this way is shown in FIG. FIGS. 26 to 33 show various snapshots during the production of the transponder 1 according to a fifth variant of the method in a schematic plan view of the long end face 8. The fifth method variant is characterized in that the transponder 1 is produced by means of metal foils 28. In the illustrated embodiment, the metal foils 28 are each combined with a thin cover sheet 29 made of plastic to form a composite film 30. As shown in FIG. 26, the composite foil 30 with the metal foil 28 is brought closer to a core foil 31. The core foil 31 is partially coated with an adhesive 32. By lamination, the core film 31 is bonded to the metal foil 28 within the area coated with the adhesive 32. Outside this range, there is no connection between the core sheet 31 and the metal foil 28.

Subsequently, the depression 14 for receiving the integrated circuit 2 is milled into the core foil 31. A snapshot at this time is shown in FIG. Then, the integrated circuit 2 is inserted into the recess 14. This is shown in FIG. 28.

As shown in FIG. 29, after inserting the integrated circuit 2 into the depression 14, the core foil 31 is approximated by a further composite foil 33 made of a metal foil 34 and a plastic cover foil 35. In this case, the composite film 33 is oriented such that it is approximated to the core film 31 with the cover film 35 in front. By lamination, the cover film 35 is fully bonded to the core film 31.

Then the cover sheet 29 is scratched, for example by means of a rolling knife 36. This is indicated in FIG. 30. In addition, the laminate from the Core film 31 and the composite film 33 cut so that the areas of the laminate can be removed, in which no composite between the core film 31 and the composite film 330 is formed. A snapshot after carrying out these processing steps is shown in FIG. 31. The cover sheet 29 has a series of notches 37, which were produced with the roller blade 36 and each extend over the entire thickness of the cover sheet 29.

As shown in FIG. 32, in a further processing step, a conductive adhesive 38 is applied in the edge region of the metal foil 34, for example by screen printing. Instead of the conductive adhesive 38, a solder can also be provided. Subsequently, the regions of the composite film 30 projecting beyond the core film 31 are folded along the incisions 37 in the cover film 29 toward the core film 31, so that the end regions of the composite film 30 strike the conductive adhesive 38 and thereby the metal film 28 and the metal film 34 electrically be connected conductively. This is shown in FIG.

In a corresponding manner, in the region of the side opposite the integrated circuit 2, the cover film 29 is scored, the laminate of the core film 31 and the composite film 33 severed, the composite film 30 folded toward the core film 31 and the metal film 34 bonded to the metal film 28. In this way, a cuboid transponder 1 is formed, which is metallized to five out of six outer surfaces.

The transponder 1 produced in this way is shown in FIG. 34 in the form of a schematic plan view of the main surface 5, which in the representation of FIG. 33 forms the underside of the laminate body. As is apparent from FIGS. 33 and 34, the transponder 1 has in the region of its main surface che 4, its long end face 9 and its short end faces 6 and 7, the metal foil 28 on. In the region of its main surface 5, the transponder 1 has the metal foil 34. Outwardly, the metal foil 34 is partially covered and the metal foil 28 over the entire surface of the cover sheet 29.

The electrically conductive connections between the terminal lugs 15 of the integrated circuit 2 and the main surfaces 4 and 5 of the transponder 1 can be formed in an analogous manner as described in the first method variant.

FIGS. 35 to 38 show various snapshots during the production of the transponder 1 according to a sixth variant of the method in a schematic plan view. In the sixth variant of the method, the transponder 1 is formed by folding the composite film 39 shown in FIG. 35. The composite film 39 has a cover film 40 made of plastic and a metal foil 41, wherein the cover film 40 covers only a portion of the metal foil 41.

To form the transponder 1, the protruding areas of the metal foil 41 are folded toward the cover film 40 and connected to it, for example, by lamination. The transponder 1 produced in this way is shown in FIG. With the exception of the long end face 8, all outer surfaces of the transponder 1 are formed by the metal foil 41 and are thus electrically conductive.

For the production of the transponder 1 according to the sixth variant of the method, it is also possible to use a composite film 39 in a different blank shape than shown in FIG. 35. For example, the composite foil 39 may have the blank shapes shown in FIGS. 37 and 38. Even with these blank forms, the metal foil 41 projects laterally beyond the cover film 40. The projecting regions of the metal foil 41 are in turn folded toward the cover film 40 and joined to the cover film 40, for example by lamination.

The integrated circuit 2 is not shown in FIGS. 35 to 37 and can be embedded in a corresponding manner in the carrier 3 of the transponder 1 and electrically connected to the metal foil 41 in the region of the main surfaces 4 and 5 as in the first method - Variant described.

39 to 44 show various snapshots during the production of the transponder 1 according to a seventh variant of the method in a schematic plan view of the long end face 8. In the seventh variant of the method, the transponder 1 is produced from a laminate of a composite film 30 and a core film 31, which is shown in Fig. 38. The composite film 30 has a plastic cover sheet 29 and a metal foil 28. The core film 31 is partially coated with an adhesive 32 and firmly bonded to the composite film 30 within the coated area. In the core sheet 31 of the integrated circuit 2 is embedded. The cover film 29 and the core film 31 are severed, for example, by means of the roll knife 36 along the outer contour of the adhesive-free region. The arranged between the cover film 29 and the core film 31 metal foil 28 is not severed. As indicated in Fig. 40, the cut-away portion of the core sheet 31 is removed. The cut-free region of the cover film 29 is not removed since the cover film 29 is connected over its entire area to the metal foil 28. Subsequently, an adhesive layer 42 is placed on the core film 31. This is shown in FIG. 41. Then, the composite sheet 30 is folded so that the portions of the adhesive layer 42 on both sides of the cut-away portion approach each other and finally pressed against each other. As shown in FIG. 42, in this way the regions of the core film 31 are adhesively bonded to one another on both sides of the cut-free region.

Then, starting from the main surfaces 4 and 5 of the transponder 1 recesses 19 are milled, which extend up to the Kontaktfähn- Chen 15 of the integrated circuit 2. This is shown in Fig. 43.

As shown in FIG. 44, the recesses 19 are filled with the electrically conductive filling material 20 in order to electrically connect the regions of the metal foil 28 adjacent the main surfaces 4 and 5 to the contact lugs 15 of the integrated circuit 2.

The described variants of the method for producing the transponder 1 can also be modified or combined in other ways.

The transponder 1 is preferably arranged in the region of a slot in an electrically conductive surface, in particular a metal surface. In this case, a signal path between the integrated circuit 2 of the transponder 1 and the electrically conductive surface is formed. The signal path preferably runs via an electrically conductive connection between the metallized main surfaces 4 and 5 of the transponder 1 and the adjacent edges of the slot, against which the main surfaces 4 and 5 touch. The electrically conductive surface is used by the transponder 1 as an antenna for contactless transmission of data. For this Data transmission is advantageous if the dimensions of the slot approximately correspond to the dimensions of the long end face 8 of the transponder 1 and have a value which corresponds approximately to half a wavelength of the carrier wave used for the data transmission. In this case, the influence of the dielectric effect of the material from which the transponder 1 is made, to be considered on the wavelength. The length of the short end faces 6 and 7 of the transponder 1 preferably corresponds to a quarter of the wavelength.

Claims

Patent claims

1. A method for producing a transponder (1) with an integrated circuit (2) for storing and / or processing data, wherein a parallelepiped carrier (3) with six outer surfaces (4, 5, 6, 7, 8, 9) produced is, parallel to a first outer surface (4), a second outer surface (5), a third outer surface (6), a fourth outer surface (7) and a fifth outer surface (9) of the carrier (3) each an at least partially electrically conductive layer (20, 21, 27, 28, 34, 41) is formed and the carrier (3) in the region of a sixth outer surface (8) is formed electrically insulating.

2. The method according to claim 1, characterized in that the first outer surface (4), the second outer surface (5), the third outer surface (6), the fourth outer surface (7) and / or the fifth outer surface (9) of the carrier ( 3) in each case by the at least partially electrically conductive layer (20, 21, 27, 34, 41) are formed.

3. The method according to any one of the preceding claims, characterized in that the first outer surface (4), the second outer surface (5), the third outer surface (6), the fourth outer surface (7) and / or the fifth outer surface (9) of Support (3) in each case by an electrically insulating layer (29, 40) are formed, which covers the at least region-wise electrically conductive layer (28, 41).

4. The method according to any one of the preceding claims, characterized in that parallel to the first outer surface (4), the second outer surface (5), the third outer surface (6), the fourth outer surface (7) and the fifth outer surface (9 ) of the carrier (3) at least partially electrically conductive layers (20, 21, 27, 28, 34, 41) are electrically conductively connected to each other.

5. The method according to any one of the preceding claims, character- ized in that between the integrated circuit (2) and parallel to the first outer surface (4) and / or parallel to the second outer surface (5) of the carrier (3) formed at least partially electrically conductive layer (21, 27, 28, 34, 41) a signal path is formed.

6. The method according to claim 5, characterized in that the signal path through an electrically conductive connection (20) between the integrated circuit (2) and the at least partially electrically conductive layer (21, 27, 28, 34, 41) is formed.

7. The method according to claim 5, characterized in that the signal path is formed by a capacitive coupling between the integrated circuit (2) and the at least partially electrically conductive layer (21, 27, 28, 34, 41).

8. The method according to claim 7, characterized in that in the carrier (3) a capacitive coupling surface (10) is embedded.

9. The method according to any one of the preceding claims, character- ized in that the first outer surface (4) and the second outer surface (5) are formed as the main surfaces of the carrier (3).

10. The method according to any one of the preceding claims, characterized in that the first outer surface (4) and the second outer Area (5) have a length which corresponds to half of a provided for contactless data transmission with the integrated circuit (2) wavelength and / or a width which corresponds to a quarter of the wavelength.

11. The method according to any one of the preceding claims, characterized in that the carrier (3) is made of at least one film.

12. The method according to claim 11, characterized in that the carrier (3) is produced by lamination of a plurality of films.

13. The method according to any one of claims 11 or 12, characterized in that the carrier (3) from at least one plastic film (11, 16, 31) is produced.

14. The method according to any one of claims 11 to 13, characterized in that the carrier (3) from at least one composite film (30, 33, 39) is produced, which comprises a plastic film (29, 35, 40) and a metal foil (28, 34, 41).

15. The method according to claim 14, characterized in that the plastic film (40) extends only over a portion of the metal foil (41).

16. The method according to any one of claims 11 to 15, characterized in that at least one film is folded.

17. The method according to claim 16, characterized in that in the composite film (39) only partial areas are folded, which have no plastic film (40).

18. The method according to any one of claims 11 to 17, characterized in that at least one film is completely or partially severed and thereby a portion of the film is removed.

19. The method according to any one of the preceding claims, character- ized in that a semi-finished product (17) is made with larger dimensions than the intended dimensions of the carrier (3).

20. The method according to claim 19, characterized in that the semifinished product (17) along a first contour (12) is severed, which is larger than the intended dimensions of the carrier (3).

21. The method according to claim 20, characterized in that after the cutting along the first outline (12) a personalization is performed.

22. The method according to any one of claims 19 to 21, characterized in that the semi-finished product (17) along a second contour (13) is cut, which corresponds to the intended dimensions of the carrier (3).

23. The method according to any one of the preceding claims, characterized in that in the edge region of the first outer surface (4) and / or the second outer surface (5) a plurality of perforations (18) are formed.

24. The method according to claim 23, characterized in that a portion of the edge region of the first outer surface (4) and / or the second outer surface (5) to which the sixth outer surface (8) adjacent, recessed in the formation of the perforations (18) becomes.

25. The method according to any one of claims 23 or 24, characterized in that the perforations (18) with an electrically conductive material (20, 21) are at least partially filled.

26. The method according to any one of the preceding claims, characterized in that at least one elongate opening (26) is formed in the edge region of the first outer surface (4) and / or the second outer surface (5).

27. The method according to claim 26, characterized in that a portion of the edge region of the first outer surface (4) and / or the second outer surface (5) to which the sixth outer surface (8) adjacent, recessed in the formation of the opening (26) becomes.

28. The method according to any one of claims 26 or 27, characterized in that the opening (26) with an electrically conductive material (20, 21) is at least partially filled.

29. The method according to any one of the preceding claims, characterized in that the at least partially electrically conductive layer (20, 21, 27) is formed according to a predetermined pattern for electrically conductive portions.

30. The method according to any one of the preceding claims, characterized in that the at least partially electrically conductive layer (20, 21, 27) is produced by printing or electroplating.

31. The method according to any one of the preceding claims, characterized in that the integrated circuit (2) is embedded in the carrier (3).

32. The method according to claim 31, characterized in that a material removal to expose terminals (15) of the integrated

Circuit (2) is performed.

33. The method according to any one of the preceding claims, characterized in that on the carrier (3) at least one fastening device (22, 23, 24, 25) is formed.

34. The method according to claim 33, characterized in that the fastening device (22, 23, 24, 25) is formed integrally with the carrier (3).

35. The method according to claim 34, characterized in that the support (3) for forming the fastening device (22, 23, 24, 25) along the desired contour of the fastening device (22, 23, 24, 25) is severed.

36. The method according to any one of claims 33 to 35, characterized in that the fastening device (22, 23) is equipped with at least one undercut.

37. The method according to any one of the preceding claims, characterized in that the transponder (1) is operable in the UHF range.

38. Transponder (1) with an integrated circuit (2) for storing and / or processing data and with a flat-piece carrier (3) having two main surfaces (4, 5) and at least two end surfaces (6, 7, 8, 9 ), each extending between the skin surfaces, wherein parallel to the main surfaces (4, 5) and parallel to at least one of the end faces (6, 7, 8, 9) of the carrier (3) in each case an at least partially electrically conductive layer ( 20, 21, 27, 28, 34, 41) is formed and wherein the carrier (3) in the region of at least one of the end faces (6, 7, 8, 9) is electrically insulating.

39. Transponder arrangement with a transponder (1), which is produced according to a method according to one of claims 1 to 37 and an electrically conductive surface having a slot, wherein the transponder (1) is arranged in the region of the slot of the electrically conductive surface ,