WO2007119477A1 - 硬化性樹脂及び硬化性樹脂組成物並びにその成形体 - Google Patents
硬化性樹脂及び硬化性樹脂組成物並びにその成形体 Download PDFInfo
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- WO2007119477A1 WO2007119477A1 PCT/JP2007/055849 JP2007055849W WO2007119477A1 WO 2007119477 A1 WO2007119477 A1 WO 2007119477A1 JP 2007055849 W JP2007055849 W JP 2007055849W WO 2007119477 A1 WO2007119477 A1 WO 2007119477A1
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/48—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
- C08G77/58—Metal-containing linkages
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/42—Block-or graft-polymers containing polysiloxane sequences
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G79/00—Macromolecular compounds obtained by reactions forming a linkage containing atoms other than silicon, sulfur, nitrogen, oxygen, and carbon with or without the latter elements in the main chain of the macromolecule
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L85/00—Compositions of macromolecular compounds obtained by reactions forming a linkage in the main chain of the macromolecule containing atoms other than silicon, sulfur, nitrogen, oxygen and carbon; Compositions of derivatives of such polymers
Definitions
- the present invention provides a molded article that can achieve both strength, transparency, heat resistance, and dimensional stability, such as inorganic glass, and high toughness and cacheability, such as plastic. It can be applied to optical applications such as lenses, optical discs, optical fibers, and flat panel display substrates, various transportation machines, window materials for houses, etc., and it is lightweight and has high impact strength.
- the present invention also relates to a curable resin capable of obtaining a molded body that can have transparency. Background art
- inorganic glass As a transparent material, inorganic glass has excellent heat resistance and dimensional stability, and is used in a wide range of industrial fields.
- the inorganic glass having such excellent characteristics is disadvantageous in that it is heavy with a force specific gravity of 3 ⁇ 4.5 or more, has poor toughness and is susceptible to cracking, and is inferior in workability.
- transparent plastics such as polystyrene and PMMA (polymethyl methacrylate) as an alternative to glass is growing. Although these are lightweight and excellent in flexibility, they are organic, so they have heat resistance, light resistance, and dimensional stability. Etc. are significantly inferior to glass, and there is a problem that applications are limited.
- a silicone resin that is superior in terms of heat resistance, weather resistance, and water resistance is promising due to the intermediate characteristics of the metal and nonmetal of the silicon atom. It is.
- High-strength silicone resins are composed only of dense structural units that have a high crosslinking density and a low free volume fraction that suppresses molecular motion. It is difficult to mold to a brittle thickness, and its use is limited to coating agents.
- low-strength silicone rubbers composed of sparse structural units with a high free volume fraction, which suppresses the binding force of molecules with low crosslink density, are used for molding applications.
- Patent Document 1 Japanese Patent No. 3598749
- Patent Document 2 Japanese Patent Laid-Open No. 2006-22207
- Patent Document 3 Japanese Patent Laid-Open No. 2005-330455
- the object of the present invention is to provide a curability that can achieve both strength, transparency, heat resistance, and dimensional stability as in inorganic glass, and high toughness and cacheability as in plastic. It is in providing a resin and its composition.
- the present invention is a curable resin having a molecular structure composed of a dense structural unit (A) and a sparse structural unit (B) represented by the following general formula (1).
- the structural unit (A) is a sparse structural unit composed of a metal oxide having a packing coefficient Kp of 0.68 to 0.8 calculated by the following formula (2) calculated from the free volume fraction.
- the structural unit ( ⁇ ) is a structural unit comprising the organic material and the organometallic oxide with the packing coefficient Kp of less than 0.68, and the weight ratio of the structural unit (A) Z (B).
- n (However, m and n are integers of 1 or more.)
- the dense structural unit (A) is composed of a metal oxide portion having a three-dimensional polyhedral structure skeleton excluding the organic matter portion of the following general formula (I), and the sparse structural unit (B) is It is a preferred embodiment of the curable resin of the present invention that it is composed of a chain unit composed of an organometallic oxide represented by the following general formula (II) and an organic part of the general formula (I).
- R 1 represents an alkylene group, an alkylidene group or a phenylene group
- R 2 represents hydrogen.
- An unsaturated group represented by CH CH, an alkyl group, a cycloalkyl group, a cycloalkenyl group,
- M is a metal atom of silicon, germanium, titanium, or zirconium
- X is a halogen atom, or an alkoxyl group
- w is an integer of 4 or more
- X, y, and z are w + x + y + It is an integer that satisfies z ⁇ 8.
- j, k, and 1 each represent an integer of 0 or more.
- the curable resin represented by the general formula (1) may be blended with a hydrosilylation catalyst, a radical initiator, or both to obtain a curable resin composition.
- the curable resin composition may be blended with a hydrosilylatable compound having a hydrogen atom on at least one silicon atom, a compound having an unsaturated group, or both. Les.
- the curable resin of the present invention has a molecular structure composed of a dense structural unit (A) and a sparse structural unit (B) as represented by the general formula (1), and has at least one unsaturated component. Have a bond.
- the dense structural unit (A) is composed of a metal oxide having a packing coefficient Kp calculated by the above formula (2) of 0.68 to 0.8, and is a sparse structural unit ( ⁇ ) has a packing coefficient Kp of less than 0.68 and includes organic substances and organometallic oxides.
- the dense structural unit (A) is preferably composed of a metal oxide portion having a three-dimensional polyhedral structure skeleton, excluding the organic portion of the general formula (I).
- the organic part is a part of R (organic group) in the general formula (I) that is bonded to a metal atom (that is, Si and M).
- R is preferably an organic group having an unsaturated group represented by the above formulas (a) to (c). Note that the plurality of R in the general formula (I) may not all be the same.
- General formula (I) is a cage-type siloxane resin composed of a three-dimensional polyhedral structure skeleton and R.
- w in general formula (I) is 8, and X, y, and z If w is 0, w is 1 0 and X, y and z are 0, and w is 12 and X, y and z are 0, a specific example of the structure is represented by the following structural formula (3), Shown in (4) and (5).
- the structural unit represented by the general formula (I) is not limited to those represented by the structural formulas (3), (4) and (5). These structures are known and have been shown by X-ray crystal structure analysis for those having specific functional groups. (3;
- R, X and M have the same meaning as R, X and M in formula (I).
- a part of R is preferably an unsaturated group represented by the above (a), (b) or (c).
- 3-metaatally Examples include a loxypropyl group, a 3-ataryloxypropyl group, an aryl group, a vinyl group, and a styryl group.
- X is a hydrolyzable group of a halogen atom or an alkoxyl group.
- Preferable examples of the compound represented by RSiX include trichlorosilane, methyloletrichlorosilane.
- etyltrichlorosilane isopropyltrichlorosilane, butyltrichlorosilane, t_butyltrichlorosilane, cyclohexyltrichlorosilane, phenyltrichlorosilane, vinylenotrichlorosilane, arinoletrichlorosilane, styryltrichlorosilane, cyclohexenyltrichlorosilane , Trimethoxysilane, methyltrimethoxysilane, etyltrimethoxysilane, cyclohexyltrimethoxysilane, phenyltrimethoxysilane, butyltrimethoxysilane, allyltrimethoxysilane, styryltrimethoxysilane, cyclohexenyltri Methoxysilane, triethoxysilane, methyltriethoxys
- M is silicon, germanium, titanium, or zirconium.
- MX is the table
- Preferred examples of the compound are tetrachlorosilane, tetramethoxysilane, tetraethoxysilane, tetrachromate germane, tetramethoxygermane, tetraethoxygermane, titanium ethoxide, titanium propoxide, titanium isopropoxide, titanium yubutoxide, Titanium isobutoxide, zirconium ethoxide, zirconium propoxide, zirconium isopropoxide, zirconium butoxide, zirconium isobutoxide and the like can be mentioned.
- the sparse structural unit (B) is a three-dimensional polyhedron in the structural unit represented by the general formula (I).
- the organic structure (silicone compound) having a chain unit as represented by the above general formula ( ⁇ ) and the organic part (or substituent) which is a residue other than the body structure skeleton .
- it consists of the structural unit represented by the above general formula (I) except the dense structural unit (A) and the structural unit represented by the general formula ( ⁇ ). More specifically, as described below, R3 ⁇ 4 4R 5 SiX, R 6 R 7 SiX or a mixture thereof (wherein, R 3 to R 7 and X are the same as those in the general formula ([pi)
- a chain structure of an organometallic oxide of the general formula (ii) consisting of a hydrolysis condensate of (a) and an organic moiety of the general formula (I) [ie, in the structural unit represented by the general formula (I) Or a residue (or substituent)] or at least a part of X is preferably bonded to form the structural site (B) of the general formula (1). That is, a part of the organic part of the general formula (1) may be bonded to the general formula (II), or the whole organic part of the general formula (1) may be bonded to the general formula ( ⁇ ). ,. The organic part of the general formula (I) bonded to the general formula ( ⁇ ) is incorporated into the chain unit of the general formula (II).
- the structural unit represented by the general formula ( ⁇ ) is a compound represented by R 3 R 4 R iX or R 7 SiX.
- R 3 to R 7 have the same meaning as R 3 to R 7 in formula (II).
- preferred specific examples include a 3-methatalyloxypropyl group, a 3-aryloxypropyl group, an aryl group, a bier group and a styryl group.
- X is a halogen atom or an alkoxy group, and specific examples include chlorine, bromine, methoxy group, ethoxy group, n-propoxyl group, and i-propoxyl group.
- Preferred examples of the compound represented by R 3 R 4 R iX include trimethylchlorosilane, vinylenodimethylchlorosilane, dimethylchlorosilane, phenyldimethylchlorosilane, phenolinochlorosilane, trietinorechlorosilane, and trivininorechlorosilane. , Methino Resinino Lecro mouth
- preferable examples of the compound represented by R 6 R 7 SiX include dimethyldichlorosilane,
- the curable resin of the present invention can be obtained by reacting a force-type siloxane resin represented by the general formula (I) with a silicone compound represented by the general formula (I).
- the obtained curable resin has a molecular structure in which the unsaturated bonds of the structural units represented by the general formula (I) and the general formula ( ⁇ ) are condensed by crosslinking or hydrolysis condensation.
- This curable resin is composed of a dense structural unit (A) having a packing coefficient calculated from a free volume fraction of 0.68 to 0.8 and a sparse structural unit (B) having a packing coefficient of less than 0.6 ⁇ 68. ) And at least one unsaturated bond.
- the packing coefficient Kp used in the present invention is calculated by the following calculation formula (2).
- M key atom
- R 3 and R 4 , R 5 The density of otamethyl trisicoxane having a chain structure of 0.820 gm 3 and a packing coefficient of 0.521. That is, the packing coefficient of a metal oxide having a three-dimensional polyhedral structure in which a key atom is bonded to three or more oxygen atoms is 0.69 or more, which is a dense structural unit in the present invention.
- the packing coefficients of the compounds having a cyclic structure and a chain structure are 0.576 and 0.521, which are sparse structural units in the present invention.
- the curable resin of the present invention has a weight ratio (A) / (B) of the structural unit of the dense structural unit (A) to the sparse structural unit (B) of 0.01 to 5.00, preferably Is between 0.5 and 3.00.
- (A) / (B) is less than 0.01, the dense structure is too small, and the mechanical properties and heat resistance of a molded product obtained by molding and curing a curable resin are significantly deteriorated.
- it is 5.00 or more, there are too few sparse structural parts imparting flexibility to the molded product, and the toughness will be remarkably deteriorated and become brittle.
- the curable resin of the present invention has an average molecular weight of 800 to 60000. If the average molecular weight is less than 800, it becomes brittle after molding, and on the contrary, if it exceeds 60,000, it may be difficult to cure and process, resulting in inconvenience in handling.
- the average molecular weight can be measured with a known GPC measurement device.
- Acid catalysts used for hydrolysis and condensation of the compound include hydrochloric acid and sulfuric acid. The These can also be used as a mixture.
- hydrolyzable group is a halogen atom
- halogen hydrogen generated during hydrolysis may be used.
- Basic catalysts used for hydrolysis and condensation include alkali metal hydroxides such as potassium hydroxide, sodium hydroxide and cesium hydroxide, tetramethylammonium hydroxide, tetraethylammonium hydroxide, Examples thereof include ammonium hydroxide salts such as tetraptylammonium hydroxide, benzyltrimethylammonium hydroxide, and benzyltriethylammonium hydroxide. Among these, tetramethylammonium hydroxide is preferably used because of its high catalytic activity. Basic catalysts are usually used as aqueous solutions.
- water is essential for the hydrolysis reaction, it can be supplied from an aqueous solution of the catalyst, or may be added as water separately.
- the amount of water is not less than the amount sufficient to hydrolyze the hydrolyzable group, preferably 1.0 to 1.5 times the theoretical amount.
- a curable resin composition may be obtained by blending a hydrosilylation catalyst or a radical initiator with a curable resin, or blending both.
- a cured product (molded article) can be obtained by thermally curing or photocuring the curable resin composition, followed by hydrosilylation or radical polymerization.
- a compound having a hydrogen atom on the silicon atom or a compound having an unsaturated group in the molecule is further blended to obtain a curable resin composition. Also good.
- hydrosilylation catalyst for the purpose of obtaining a molded product by curing a curable resin and improving the physical properties of the resulting molded product.
- thermal polymerization initiator for the purpose of obtaining a molded product by curing a curable resin and improving the physical properties of the resulting molded product.
- thermal polymerization accelerator as additives for promoting the reaction.
- a photopolymerization initiator, a photoinitiator auxiliary agent, a sharpening agent and the like are blended to obtain a curable resin composition.
- the compound having a hydrogen atom on a silicon atom used together with the curable resin has at least one hydrogen atom on the hydrosilylatable key atom in the molecule. It has oligomers and monomers. Among these, oligomers having a hydrogen atom on a silicon atom include polyhydrosiloxane siloxanes, polydimethylhydroxysiloxanes and copolymers thereof, and siloxanes whose ends are modified with dimethylhydrosiloxy. Is mentioned. In addition, a molecule having a hydrogen atom on the key atom.
- Examples of the monomers include cyclic siloxanes such as tetramethylcyclotetrasiloxane and pentamethylcyclopenta, dihydrodisiloxanes, trihydromonosilanes, dihydromonosilanes, monohydromonosilanes, dimethylsiloxysiloxanes, and the like. Two or more of these may be mixed.
- the compound having an unsaturated group used together with the curable resin is a reactive oligomer that is a polymer having a structural unit having a repeating power of about ⁇ 20.
- the reactive monomer is roughly classified into low molecular weight and low viscosity reactive monomers. They are broadly divided into monofunctional unsaturated compounds having one unsaturated group and polyfunctional unsaturated compounds having two or more.
- reactive oligomers include polybutylsiloxanes, polydimethylvinylsiloxysiloxanes, and copolymers thereof, siloxanes modified with dimethylvinylsiloxy at the ends, epoxy acrylate, epoxidized oil Examples thereof include acrylate, urethane acrylate, unsaturated polyester, polyester acrylate, polyether acrylate, butyl acrylate, polyene / thiol, silicone acrylate, polybutadiene, and polystyryl methacrylate. These include monofunctional unsaturated compounds and polyfunctional unsaturated compounds.
- Examples of the reactive monofunctional monomer include bur-substituted silicon compounds such as triethylbiylsilane and triphenylvinylsilane, cyclic olefins such as cyclohexene, styrene, vinyl acetate, and N-vinyl.
- Examples of reactive polyfunctional monomers include bur-substituted cation compounds such as tetrabulesilane and dibutyltetramethyldisiloxane, and butyl substitution such as tetramethyltetrabutycyclotetrasiloxane and pentamethylpentabutylcyclopentasiloxane. Circular key compound
- Cyclic polyenes such as norbornagen, dicyclopentadiene, cyclooctagen, bur-substituted cyclic olefins such as burcyclohexene, dibulubenzenes, Turlbenzenes, trimethylolpropane dialyl ether, pentaerythritol triaryl ether, tripropylene glycol ditalylate, 1,6-hexanediol ditalylate, bisphenol A diglycidyl ether ditalylate, tetraethyleneglycol Dimethyl diatalylate, hydroxypentaglycol dipentayl glycol ditalylate, trimethylolpropane tritalylate, pentaerythritol retoralirate, pentaerythritol tetraatalylate, dipentaerythritol hexaatalylate, etc. can do.
- the compound having a hydrogen atom on the silicon atom and the compound having an unsaturated group in the molecule used in the present invention may be used alone or in combination of two or more.
- the curable resin composition of the present invention includes a hydrosilylation catalyst, a radical initiator, a compound containing a hydrogen atom on a silicon atom, or a compound having an unsaturated group. It is obtained by blending.
- the molded product of the present invention is obtained by molding and curing this curable resin composition. That is, a cured product can be obtained by hydrosilylation curing and radical polymerization of the curable resin composition.
- the addition amount is preferably in the range of 1 to 1000 ppm, more preferably 20 to 500 ppm as metal atoms with respect to the weight of the curable resin.
- the amount added is preferably 0.1 to 3 parts by weight with respect to 100 parts by weight of the curable resin. It is more preferable to use the range of the amount part. If the amount of the additive is less than 0.1 parts by weight, the curing is insufficient and the strength and rigidity of the obtained sealing material are lowered. On the other hand, if it exceeds 5 parts by weight, problems such as coloring of the sealing material may occur.
- the hydrosilylation catalyst and the radical initiator may be used alone or in combination of two or more.
- Hydrosilylation catalysts include platinous chloride, chloroplatinic acid, chloroplatinic acid and alcohol, aldehydes, ketone complexes, chloroplatinic acid and olefins complexes, platinum and bursiro.
- Platinum group metal catalysts such as complexes with xanthine, dicarbonyl diplatinum platinum and palladium catalysts, rhodium catalysts, and the like can be mentioned.
- chloroplatinic acid, a complex of chloroplatinic acid and olefins, and a complex of platinum and vinylsiloxane are preferable from the viewpoint of catalytic activity. These may be used alone or in combination of two or more.
- Examples of the photopolymerization initiator used when the curable resin composition is a photocurable resin composition include compounds such as acetophenone-based, benzoin-based, benzophenone-based, thixanthone-based, and acylphosphine oxide-based compounds. It can be preferably used.
- trichloroacetophenone methoxyacetophenone, 1-phenyl-2-hydroxy-2-methylpropan-1-one, 1-hydroxycyclohexyl phenyl ketone, 2-methyl-1 -(4-Methylthiophene) -2-morpholinopropan-1-one, benzoin methyl ether, benzyldimethyl ketal, benzophenone, thixanthone, 2,4,6-trimethylbenzoyldiphenylphosphine oxide, methylphenyl Examples thereof include dalioxylate, camphorquinone, benzyl, anthraquinone, Michler's ketone and the like. Further, a photoinitiator auxiliary agent or a sharpening agent that exhibits an effect in combination with a photopolymerization initiator can be used in combination.
- thermal polymerization initiator examples include ketone peroxides, peroxide ketals, hide port peroxides, dialkyl peroxides, disyl peroxides, peroxide dicarbonates, peroxides.
- ketone peroxides peroxide ketals
- hide port peroxides dialkyl peroxides
- disyl peroxides peroxide dicarbonates
- peroxides Various organic peroxides such as xyesters can be preferably used.
- thermal polymerization initiators may be used alone or in combination of two or more.
- additives include organic / inorganic fillers, plasticizers, flame retardants, heat stabilizers, antioxidants, light stabilizers, UV absorbers, lubricants, antistatic agents, mold release agents, foaming agents, nucleating agents, colorants, Crosslinking agents, dispersion aids, resin components and the like can be exemplified.
- a molded product comprising the curable resin of the present invention comprises a hydrosilylation catalyst and a radical polymerization initiator. It can be produced by curing a curable resin composition containing the above, misalignment, or both by heating or light irradiation.
- the molding temperature can be selected from a wide range from room temperature to around 200 ° C., depending on the selection of the thermal polymerization initiator and accelerator.
- a silicone resin molded body having a desired shape can be obtained by polymerization and hardening in a mold or on a steel belt. More specifically, all general molding methods such as injection molding, extrusion molding, compression molding, transfer molding, calendar molding, and casting (casting) molding can be applied.
- a molded product When a copolymer (molded product) is produced by light irradiation, a molded product can be obtained by irradiating ultraviolet rays having a wavelength of 100 to 400 nm or visible light having a wavelength of 400 to 700 nm.
- the wavelength of light to be used is not particularly limited, but in particular, near ultraviolet rays having a wavelength of 200 to 400 nm are preferably used.
- Lamps used as ultraviolet light sources include low-pressure mercury lamps (output: 0.4 to 4 W / m), high-pressure mercury lamps (40 to 160 W / m), ultra-high pressure mercury lamps (173 to 435 W / m), metal halide lamps. (80 to 160 Wm), pulse xenon lamp (80 to 120 Wm), electrodeless discharge lamp (80 to 120 cm), and the like.
- Each of these ultraviolet lamps is characterized by its spectral distribution and is selected according to the type of photoinitiator used.
- a method of obtaining a silicone resin copolymer (molded body) by light irradiation for example, it is injected into a mold having an arbitrary cavity shape and made of a transparent material such as quartz glass, and the above-mentioned A method of producing a molded body having a desired shape by irradiating ultraviolet rays with an ultraviolet lamp to carry out polymerization and curing, and removing from the mold, or when not using a mold, for example, on a moving steel belt Examples thereof include a method for producing a sheet-shaped molded article by applying the curable resin composition of the present invention using a doctor blade or a roll-shaped coater and polymerizing and curing with the above ultraviolet lamp. Furthermore, in the present invention, a method of obtaining a molded body by heating and light irradiation may be used in combination.
- the curable resin of the present invention molding capable of achieving both strength, transparency, heat resistance, and dimensional stability like inorganic glass, high toughness like plastic, and workability.
- the ability to obtain a body can be achieved, for example, lenses, optical discs, optical fibers and flat panel displays. It can be used for a variety of applications such as optical applications such as circuit boards and window materials for various transport machinery and houses.
- the obtained molded body is a transparent member having a light weight and high impact strength, and has a wide range of use as a glass substitute material and has high industrial utility value.
- the dense structural unit (A) which is a three-dimensional polyhedral structure composed of metal oxides, ie, key oxides, is composed of eight key atoms and twelve oxygen atoms (Si ⁇ ) can be assumed to be a cubic structure, and the derived Kp is 0.73. there were.
- the required weight ratio [(A) / (B)] was 1.302, and the number average molecular weight Mn by GPC was 5200. Also, the sparse structural unit (B) is derived from a bur group, (Me 2 SiO 3), and (Me 2 SiO).
- Table 1 shows the transmittance results at 600 nm, 400 nm, and 400 nm.
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Abstract
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JP2008510838A JP5108751B2 (ja) | 2006-03-27 | 2007-03-22 | 硬化性樹脂及び硬化性樹脂組成物並びにその成形体 |
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Cited By (6)
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JP2007302892A (ja) * | 2006-05-11 | 2007-11-22 | Wacker Chemie Ag | 電子素子のためのシリコーン樹脂被覆 |
WO2009084562A1 (ja) * | 2007-12-27 | 2009-07-09 | Nippon Steel Chemical Co., Ltd. | 籠構造含有硬化性シリコーン共重合体及びその製造方法並びに籠構造含有硬化性シリコーン共重合体を用いた硬化性樹脂組成物及びその硬化物 |
JP2009155287A (ja) * | 2007-12-27 | 2009-07-16 | Nippon Steel Chem Co Ltd | アルコキシル基含有籠型シロキサン化合物及びシラノール基含有籠型シロキサン化合物並びにこれらの製造方法 |
JP2009173910A (ja) * | 2007-12-27 | 2009-08-06 | Nagase Chemtex Corp | 硬化性組成物 |
JP2009227863A (ja) * | 2008-03-24 | 2009-10-08 | Nippon Steel Chem Co Ltd | 籠構造含有硬化性シリコーン共重合体及びその製造方法並びに籠構造含有硬化性シリコーン共重合体を用いた硬化性樹脂組成物及びその硬化物 |
JP2010254927A (ja) * | 2009-04-28 | 2010-11-11 | Kaneka Corp | 光硬化可能な組成物 |
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Also Published As
Publication number | Publication date |
---|---|
JPWO2007119477A1 (ja) | 2009-08-27 |
TWI411648B (zh) | 2013-10-11 |
TW200801121A (en) | 2008-01-01 |
KR20080108307A (ko) | 2008-12-12 |
CN101410437A (zh) | 2009-04-15 |
JP5108751B2 (ja) | 2012-12-26 |
KR101075358B1 (ko) | 2011-10-19 |
CN101410437B (zh) | 2012-01-04 |
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