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WO2005099326A3 - A method for manufacturing a flexible circuit board having small thickness and flexible board manufactured thereby - Google Patents

A method for manufacturing a flexible circuit board having small thickness and flexible board manufactured thereby Download PDF

Info

Publication number
WO2005099326A3
WO2005099326A3 PCT/IB2005/000786 IB2005000786W WO2005099326A3 WO 2005099326 A3 WO2005099326 A3 WO 2005099326A3 IB 2005000786 W IB2005000786 W IB 2005000786W WO 2005099326 A3 WO2005099326 A3 WO 2005099326A3
Authority
WO
WIPO (PCT)
Prior art keywords
flexible
manufacturing
support means
small thickness
flexible support
Prior art date
Application number
PCT/IB2005/000786
Other languages
French (fr)
Other versions
WO2005099326A2 (en
Inventor
Marcello Lolli
Original Assignee
Windinglab S R L
Marcello Lolli
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Windinglab S R L, Marcello Lolli filed Critical Windinglab S R L
Publication of WO2005099326A2 publication Critical patent/WO2005099326A2/en
Publication of WO2005099326A3 publication Critical patent/WO2005099326A3/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07718—Constructional details, e.g. mounting of circuits in the carrier the record carrier being manufactured in a continuous process, e.g. using endless rolls
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G06K19/07777—Antenna details the antenna being of the inductive type
    • G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
    • G06K19/07783—Antenna details the antenna being of the inductive type the inductive antenna being a coil the coil being planar
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed inductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H05K2203/0528—Patterning during transfer, i.e. without preformed pattern, e.g. by using a die, a programmed tool or a laser
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/027—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed by irradiation, e.g. by photons, alpha or beta particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
    • H05K3/041—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by using a die for cutting the conductive material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
    • H05K3/043—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by using a moving tool for milling or cutting the conductive material

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Manufacturing & Machinery (AREA)
  • Credit Cards Or The Like (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

A method for making a conductive track on a flexible support means (1) comprising setting up on a flexible support means (1) at least one conductive track (3; 7; 7a; 10; 11) removably coupled with said flexible support means (1), transferring said at least one conductive track (3; 7; 7a; 10; 11) to a further flexible support means (14; 19) suitable for acting as a support for an electronic circuit, fixing said at least one conductive track (3; 10) to said further flexible support means. An electronic device comprising a substantially flat first element (19), to which conductive tracks (10) are applied and electronic components (4) connected together, and a second substantially flat element (27) arranged on said first element (19).
PCT/IB2005/000786 2004-04-08 2005-03-25 A method for manufacturing a flexible circuit board having small thickness and flexible board manufactured thereby WO2005099326A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
ITMO2004A000080 2004-04-08
ITMO20040080 ITMO20040080A1 (en) 2004-04-08 2004-04-08 METHOD OF CREATION OF A THIN THICK PRINTED CIRCUIT AND RELATED CIRCUIT

Publications (2)

Publication Number Publication Date
WO2005099326A2 WO2005099326A2 (en) 2005-10-20
WO2005099326A3 true WO2005099326A3 (en) 2006-03-16

Family

ID=34964582

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/IB2005/000786 WO2005099326A2 (en) 2004-04-08 2005-03-25 A method for manufacturing a flexible circuit board having small thickness and flexible board manufactured thereby

Country Status (2)

Country Link
IT (1) ITMO20040080A1 (en)
WO (1) WO2005099326A2 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2341472A1 (en) * 2009-12-22 2011-07-06 Gemalto SA Method for manufacturing by transfer of an electronic device comprising a communication interface
DE102010015659A1 (en) 2010-04-20 2011-10-20 Giesecke & Devrient Gmbh Transfer method for the production of conductor structures by means of nanoinks
US9159015B2 (en) 2012-04-23 2015-10-13 Assa Abloy Ab Flexible tag

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0395411A2 (en) * 1989-04-26 1990-10-31 Flex Products, Inc. Method for making patterned thin film
US5217550A (en) * 1990-09-28 1993-06-08 Dai Nippon Printing Co., Ltd Alignment transfer method
WO2001018749A2 (en) * 1999-09-10 2001-03-15 Moore North America, Inc. Radio frequency identification tags and labels
WO2001061646A1 (en) * 2000-02-18 2001-08-23 Moore North America, Inc. Rfid manufacturing concepts
EP1302974A2 (en) * 2001-10-11 2003-04-16 Westvaco Corporation, Alfred H Nissan Technical Center Chip alignment and placement apparatus for integrated circuit, MEMS, photonic or other devices
US6667092B1 (en) * 2002-09-26 2003-12-23 International Paper Company RFID enabled corrugated structures
US20040026754A1 (en) * 2002-08-07 2004-02-12 Peikang Liu Radio frequency identification device and method
US20040177492A1 (en) * 2003-03-13 2004-09-16 Checkpoint Systems, Inc. Resonant frequency tag and method for controlling tag frequency

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0395411A2 (en) * 1989-04-26 1990-10-31 Flex Products, Inc. Method for making patterned thin film
US5217550A (en) * 1990-09-28 1993-06-08 Dai Nippon Printing Co., Ltd Alignment transfer method
WO2001018749A2 (en) * 1999-09-10 2001-03-15 Moore North America, Inc. Radio frequency identification tags and labels
WO2001061646A1 (en) * 2000-02-18 2001-08-23 Moore North America, Inc. Rfid manufacturing concepts
EP1302974A2 (en) * 2001-10-11 2003-04-16 Westvaco Corporation, Alfred H Nissan Technical Center Chip alignment and placement apparatus for integrated circuit, MEMS, photonic or other devices
US20040026754A1 (en) * 2002-08-07 2004-02-12 Peikang Liu Radio frequency identification device and method
US6667092B1 (en) * 2002-09-26 2003-12-23 International Paper Company RFID enabled corrugated structures
US20040177492A1 (en) * 2003-03-13 2004-09-16 Checkpoint Systems, Inc. Resonant frequency tag and method for controlling tag frequency

Also Published As

Publication number Publication date
WO2005099326A2 (en) 2005-10-20
ITMO20040080A1 (en) 2004-07-08

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