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WO2009037833A1 - Solid printed wiring board, method for manufacturing solid printed wiring board, and electronic component module - Google Patents

Solid printed wiring board, method for manufacturing solid printed wiring board, and electronic component module Download PDF

Info

Publication number
WO2009037833A1
WO2009037833A1 PCT/JP2008/002564 JP2008002564W WO2009037833A1 WO 2009037833 A1 WO2009037833 A1 WO 2009037833A1 JP 2008002564 W JP2008002564 W JP 2008002564W WO 2009037833 A1 WO2009037833 A1 WO 2009037833A1
Authority
WO
WIPO (PCT)
Prior art keywords
wiring board
printed wiring
solid printed
electronic component
component module
Prior art date
Application number
PCT/JP2008/002564
Other languages
French (fr)
Japanese (ja)
Inventor
Takayuki Kita
Masaaki Katsumata
Keiichi Nakao
Original Assignee
Panasonic Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Corporation filed Critical Panasonic Corporation
Priority to JP2009533045A priority Critical patent/JPWO2009037833A1/en
Priority to CN200880107929A priority patent/CN101803476A/en
Publication of WO2009037833A1 publication Critical patent/WO2009037833A1/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09072—Hole or recess under component or special relationship between hole and component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10378—Interposers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10439—Position of a single component
    • H05K2201/10477—Inverted
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
    • H05K3/4069—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Combinations Of Printed Boards (AREA)

Abstract

A solid printed wiring board (13) is provided with a first printed wiring board (22) having an opening section (18), and a second printed wiring board (26), which is fixed to the first printed wiring board (22), below the opening section (18), through a bonding layer (17) having a conductive paste section (19). A large-height electronic component (11b) is arranged on a second wiring section (14b) on the second printed wiring board (26) in the opening section (18). Thus, a mounting component is reduced in height by making the height equivalent to that of a small-height electronic component (11a) arranged on a first wiring section (14a) of the first printed wiring board (22).
PCT/JP2008/002564 2007-09-21 2008-09-18 Solid printed wiring board, method for manufacturing solid printed wiring board, and electronic component module WO2009037833A1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2009533045A JPWO2009037833A1 (en) 2007-09-21 2008-09-18 Three-dimensional printed wiring board, method for manufacturing the same, and electronic component module
CN200880107929A CN101803476A (en) 2007-09-21 2008-09-18 Solid printed wiring board, method for manufacturing solid printed wiring board, and electronic component module

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2007244838 2007-09-21
JP2007-244839 2007-09-21
JP2007-244838 2007-09-21
JP2007244839 2007-09-21

Publications (1)

Publication Number Publication Date
WO2009037833A1 true WO2009037833A1 (en) 2009-03-26

Family

ID=40467660

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/002564 WO2009037833A1 (en) 2007-09-21 2008-09-18 Solid printed wiring board, method for manufacturing solid printed wiring board, and electronic component module

Country Status (4)

Country Link
JP (1) JPWO2009037833A1 (en)
CN (1) CN101803476A (en)
TW (1) TW200922417A (en)
WO (1) WO2009037833A1 (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011148915A1 (en) * 2010-05-26 2011-12-01 株式会社村田製作所 Module substrate and method for manufacturing same
EP2473012A1 (en) * 2010-12-30 2012-07-04 Research In Motion Limited Combining printed circuit boards
JP2016039213A (en) * 2014-08-06 2016-03-22 ローム株式会社 Substrate built-in package, semiconductor device, and module
WO2018110383A1 (en) * 2016-12-15 2018-06-21 株式会社村田製作所 Electronic module and method for producing electronic module
JP2021082771A (en) * 2019-11-22 2021-05-27 株式会社ジェイテクト Electric apparatus

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105977364A (en) * 2016-07-20 2016-09-28 广州硅能照明有限公司 Multilayer LED light engine structure and processing method thereof
CN108513432B (en) * 2017-02-24 2021-06-29 泰连公司 Electronic component assembly and method of assembling the same

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63254788A (en) * 1987-04-10 1988-10-21 松下電器産業株式会社 Printed wiring board
JPH06334298A (en) * 1993-05-27 1994-12-02 Fujitsu Ltd Mounting structure of surface mount part
JP2005504443A (en) * 2001-08-31 2005-02-10 エプコス　アクチエンゲゼルシャフト Component device
JP2005236256A (en) * 2003-09-12 2005-09-02 Matsushita Electric Ind Co Ltd Connector sheet, wiring board and manufacturing method of connector sheet and wiring board

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006332246A (en) * 2005-05-25 2006-12-07 Matsushita Electric Ind Co Ltd Circuit board, connection structure thereof and electronic device
EP1885168A1 (en) * 2005-05-25 2008-02-06 Matsushita Electric Industrial Co., Ltd. Circuit substrate connection structure and circuit substrate connection method

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63254788A (en) * 1987-04-10 1988-10-21 松下電器産業株式会社 Printed wiring board
JPH06334298A (en) * 1993-05-27 1994-12-02 Fujitsu Ltd Mounting structure of surface mount part
JP2005504443A (en) * 2001-08-31 2005-02-10 エプコス　アクチエンゲゼルシャフト Component device
JP2005236256A (en) * 2003-09-12 2005-09-02 Matsushita Electric Ind Co Ltd Connector sheet, wiring board and manufacturing method of connector sheet and wiring board

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011148915A1 (en) * 2010-05-26 2011-12-01 株式会社村田製作所 Module substrate and method for manufacturing same
CN102907188A (en) * 2010-05-26 2013-01-30 株式会社村田制作所 Module substrate and method for manufacturing same
JP5454681B2 (en) * 2010-05-26 2014-03-26 株式会社村田製作所 Module substrate and manufacturing method thereof
US9674970B2 (en) 2010-05-26 2017-06-06 Murata Manufacturing Co., Ltd. Module board and manufacturing method thereof
EP2473012A1 (en) * 2010-12-30 2012-07-04 Research In Motion Limited Combining printed circuit boards
JP2016039213A (en) * 2014-08-06 2016-03-22 ローム株式会社 Substrate built-in package, semiconductor device, and module
WO2018110383A1 (en) * 2016-12-15 2018-06-21 株式会社村田製作所 Electronic module and method for producing electronic module
JPWO2018110383A1 (en) * 2016-12-15 2019-10-24 株式会社村田製作所 Electronic module and method for manufacturing electronic module
US10660227B2 (en) 2016-12-15 2020-05-19 Murata Manufacturing Co., Ltd. Electronic module and method of manufacturing electronic module
JP2021082771A (en) * 2019-11-22 2021-05-27 株式会社ジェイテクト Electric apparatus
JP7427928B2 (en) 2019-11-22 2024-02-06 株式会社ジェイテクト electrical equipment

Also Published As

Publication number Publication date
TW200922417A (en) 2009-05-16
CN101803476A (en) 2010-08-11
JPWO2009037833A1 (en) 2011-01-06

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