WO2004105105A1

WO2004105105A1 - Stage apparatus, exposure apparatus, and method of producing device

Info

Publication number: WO2004105105A1
Application number: PCT/JP2004/006823
Authority: WO
Inventors: Makoto Kondo; Hideaki Hara
Original assignee: Nikon Corporation
Priority date: 2003-05-21
Filing date: 2004-05-20
Publication date: 2004-12-02
Also published as: JPWO2004105105A1

Abstract

A stage (WST) is guided by a guide surface (44a) of a first surface-plate (44) and minutely driven together with a moving-member unit in the X-axis direction, Y-axis direction, and rotating direction about the Z-axis. Further, the stage is driven integrally with a stationary-member unit in the Y-axis direction. In the above, the stationary-member unit is supported, relative to the Z-axis direction, at a supporting surface on second surface-plates (46A, 46B) vibrationally separated from the first surface-plate where the guide surface for the stage is formed. This results that, even when vibration is generated in a Y-axis stationary member by the drive of the stage in the Y-axis direction, the vibration is transmitted only to the second surface-plates supporting the Y-axis stationary member and not to the first surface-plate. Consequently, vibration can be avoided from being transmitted to the stage through the first surface-plate, so that position control accuracy of the stage can be maintained at a high level.

Description

Specification

Stage apparatus, exposure apparatus, and device manufacturing method

Technical field

The present invention relates to a stage apparatus, an exposure apparatus, and a device manufacturing method, and more particularly, to a stage apparatus having a stage on which an object is mounted and movable in a two-dimensional plane, and including the stage apparatus. The present invention relates to an exposure apparatus that performs, and a device manufacturing method using the exposure apparatus.

Background art

[0002] In a lithographic process for manufacturing a semiconductor element, a liquid crystal display element, or the like, a resist or the like is applied to a pattern formed on a mask or a reticle (hereinafter, collectively referred to as a "reticle") via a projection optical system. Step of transferring onto a photosensitive object such as a wafer or a glass plate (hereinafter, collectively referred to as “wafer”). 'And' a repeat type reduction projection exposure apparatus (so-called stepper), or a step which has been improved to this stepper. An AND'scan type scanning projection exposure apparatus (retro scanning 'stepper) or the like is mainly used.

[0003] In a projection exposure apparatus such as a stepper, a stage apparatus including a stage that holds a wafer as an object to be exposed and moves two-dimensionally and a drive mechanism that drives the stage is used. In recent years, as a stage device, a linear motor type stage device having a linear motor as a driving source has become mainstream. This linear motor type stage device includes a first axis linear motor that drives the stage in a first axis direction, and a second axis direction that is orthogonal to the first axis and is integrated with the first axis linear motor and the stage. A two-axis drive linear motor type stage device having a pair of second-axis drive motors that are driven in parallel is relatively frequently used. In this case, the positional relationship between the stator of the first axis linear motor and the stage in the second axis direction is maintained substantially constant by the gas static pressure bearing or the magnetic bearing provided therebetween.

[0004] In a conventional two-axis drive linear motor type stage device, each of the second-axis linear motors is, for example, a fixed member whose both ends are supported by a support member or a vibration isolator installed on the floor. Due to electromagnetic interaction between the linear guide as a child and the linear guide. And a slider as a mover that moves in the longitudinal direction of the linear guide due to the electromagnetic force generated by the slider. In this case, each slider is provided at one end and the other end in the longitudinal direction of the linear guide constituting the stator of the first-axis linear motor, and has a fixed surface formed with a guide surface for guiding the stage. It moves along the board. Further, by making the driving forces generated by the pair of second axis linear motors slightly different from each other, the stage can be minutely rotated integrally with the first axis linear motor. In recent years, the stage has often adopted a configuration in which it is levitated and supported by a non-contact bearing, for example, an air bearing, on a guide surface on the surface of the surface plate (for example, see Patent Documents 1 and 2).

In the two-axis drive linear motor type stage device described in Patent Document 1, since the stators (linear guides) of the pair of second-axis linear motors have a beam structure, When the stage is driven in the direction of the second axis with a certain driving force, vibration is likely to occur in the linear guide.If the vibration occurs, the vibration is transferred to the slider (and the fixed linear motor of the first axis). There is a possibility that the vibrations of the platen are transmitted to the stage via air bearings which levitate and support the stage, via an air bearing which floats and supports the child on the guide surface). This is because an air bearing having a rigidity high enough to maintain a substantially constant clearance (a so-called bearing gap) between the guide surface and the guide surface is generally used.

[0006] In recent years, with the increase in the degree of integration of semiconductor elements, a scanning 'stepper capable of exposing light with higher precision than a stepper has become mainstream. In the case of this scanning' stepper, a reticle is mounted. It is necessary to improve the synchronization accuracy in the scanning direction (synchronous movement direction) between the reticle stage and the stage holding the wafer as the object to be exposed. However, in the stage apparatus described in Patent Document 1 or Patent Document 2, Since the stage has a structure capable of only micro-rotation, the synchronization accuracy relied solely on the accuracy of following the stage on the reticle stage side.

[0007] However, with the further increase in the integration of semiconductor devices in the future, it is certain that the synchronization accuracy between the reticle and the wafer required for the scanning stepper will become even more severe, and such a requirement has been realized. Is expected to improve the position controllability of the stage that holds the wafer. Have been.

Patent Document 1: JP-A-11-352266

Patent Document 2: JP-A-8-233964

Disclosure of the invention

Problems the invention is trying to solve

The present invention has been made under vigorous circumstances, and a first object of the present invention is to provide a stage device capable of improving the position controllability of a stage on which an object is placed. It is in that.

[0010] A second object of the present invention is to provide an exposure apparatus capable of improving the transfer accuracy of a pattern onto a photosensitive object.

[0011] A third object of the present invention is to provide a device manufacturing method capable of improving the productivity of a highly integrated device.

Means for solving the problem

[0012] According to a first aspect, the present invention provides a stage on which an object is placed; a mover unit provided on the stage; and an electromagnetic interaction between the mover unit and the stage. Is driven in the first axis direction at a predetermined stroke, and in a second axis direction orthogonal to the first axis and orthogonal to the first axis and the second axis in a plane parallel to the moving surface of the stage. A first drive mechanism having a stator unit extending in the first axis direction and minutely driven around a third axis; and one end and the other end of the stator unit in the first axis direction. The stator unit is integrated with the corresponding first mover by the electromagnetic interaction between the pair of first movers respectively provided and the respective first movers in the second axial direction. A second driving mechanism having a pair of first stators for generating a driving force; A first plate guide surface for guiding the over-di are formed; and the first plate are vibrationally separated, supporting surface for supporting the stator unit with respect to said _third axis direction are formed, the A pair of

And at least one second platen for supporting each of the stators.

[0013] According to this, the stage is guided by the guide surface formed on the first platen, and is integrated with the mover unit constituting the first drive mechanism, and is connected to the mover unit and the stator unit. Electricity between Due to the driving force generated by the magnetic interaction, it is driven in the first axis direction and minutely driven in the rotation directions around the second and third axes. The stage is guided by a guide surface formed on the first platen, and an electromagnetic interaction between a pair of first stators constituting the second drive mechanism and a pair of first movers corresponding thereto. The pair of first movers is driven in the second axial direction integrally with the stator units provided respectively at one end and the other end in the longitudinal direction by the driving force generated by the above. In this case, the stator unit that constitutes the first drive mechanism is supported in the third axial direction by a support surface formed on the second platen that is vibrationally separated from the first platen.

[0014] Therefore, when the stage is driven in the second axial direction by the second drive mechanism together with the stator unit, even if vibration occurs in the pair of first stators, the vibration is generated by the pair of first stators. It is only transmitted to the second platen that supports each of the first stators, but not transmitted to the first platen. Further, even if the vibration of each first stator is transmitted to the corresponding first mover, the stator unit having each first mover at both ends thereof is supported by the support surface of the second platen. Because it is supported in the third axis direction, vibration is transmitted to the second surface plate, but is not transmitted to the first surface plate that is vibrationally separated from the second surface plate. . Further, the vibration of each first mover hardly affects the stator unit. In addition, the stage can be finely driven in the second axis direction by a driving force generated by an electromagnetic interaction between the mover unit and the stator unit. It is necessary to provide an air bearing or the like in order to maintain the positional relationship in the two axial directions, and the stage can be accurately moved to a desired position in the second axial direction. In this case, the movement of the stator unit in the second axis direction does not directly affect the stage. This makes it possible to maintain high stage position control accuracy when driving the stage in the second axis direction without driving the stage in the second axis direction as a vibration factor of the stage.

[0015] The stage is driven in the first axial direction along the stator unit while being guided on the guide surface by a driving force generated by electromagnetic interaction between the mover unit and the stator unit. Therefore, the stage does not vibrate during this drive. In addition, the reaction force generated by this drive is transmitted to the second surface plate supporting each first stator via the stator unit. This vibration is not transmitted to the first platen.

[0016] In this case, the stator unit and the mover unit allow a change in the relative position of the first platen and the second platen in the third axial direction during the stage running. Thus, the interval in the third axis direction may be set.

[0017] In the first stage device of the present invention, the stator unit includes a second stator extending in the first axial direction, and one side of the second axial centered on the second stator. A pair of third stators respectively arranged on the other side and extending in the first axial direction, wherein the mover unit is configured to move the stage by the electromagnetic interaction between the movable unit and the second stator. Electromagnetic interaction is individually performed between the second mover that generates a driving force for minutely driving in the axial direction and the pair of third stators, and the drive that drives the stage in the first axial direction. It may include a pair of third movers each generating a force.

[0018] In the first stage device of the present invention, the stage includes a stage main body provided with the mover unit, and a minute drive that holds the object on the stage main body and at least moves in the third axis direction. And a possible table.

[0019] In the first stage device of the present invention, the second drive mechanism may include a pair of moving coils, wherein each of the first movers comprises an armature unit and each of the first stators comprises a magnetic pole unit. And a linear motor of the same type.

[0020] In the first stage device of the present invention, a first bearing mechanism is provided on the stage so as to face the guide surface, and supports the stage in non-contact with the guide surface; A second bearing mechanism provided on the stator unit so as to face the support surface of the second platen, and supporting the stator unit in a non-contact manner with respect to the support surface. Power S can.

[0021] In the first stage device of the present invention, each of the first stators has at least a relative movement in the second axial direction in a state where the frictional force between the first stator and the second platen is substantially zero. It can be accepted.

[0022] In this case, two position adjusting mechanisms for adjusting the position of each of the first stators in the second axial direction may be further provided.

In this case, each of the second driving mechanisms has a magnetic pole unit as a stator. Each of the position adjusting mechanisms may include a part of the magnetic pole unit as a mover.

[0024] In the first stage device of the present invention, the stator unit may allow at least relative movement in the first axial direction in a state where the frictional force between the stage and the guide surface is substantially zero. It can be done.

[0025] In this case, a pair of the second bases is provided corresponding to the pair of the first stators, and at least one specific base of the pair of the second bases is provided with respect to a floor surface. The apparatus may further include a transmission mechanism that is movable and transmits a reaction force generated when the mover unit is driven in the first axis direction to the specific surface plate via the stator unit.

[0026] In this case, it is possible to further include an offset mechanism provided on the specific surface plate, for canceling a rotational moment generated in the specific surface plate due to the action of the reaction force.

In this case, various configurations can be considered as the canceling mechanism. For example, the canceling mechanism includes an electromagnetic interaction between the stator fixed on the specific surface plate and the stator. And a movable element that generates a reaction force in a direction that cancels the rotation of the specific surface plate due to the rotational moment.

[0028] In this case, the canceling mechanism may move the movable element by a predetermined amount according to a position of the first movable element in the second axial direction and a driving amount of the stage in the first axial direction. Can be driven in a predetermined direction.

According to a second aspect of the present invention, there is provided a stage on which an object is placed; a mover unit provided on the stage; and an electromagnetic interaction between the mover unit and the stage. Is driven in the first axis direction at a predetermined stroke, and in a second axis direction orthogonal to the first axis and orthogonal to the first axis and the second axis in a plane parallel to the moving surface of the stage. A first drive mechanism having a stator unit extending in the first axis direction and minutely driven around a third axis; and one end and the other end of the stator unit in the first axis direction. The stator unit is integrated with the corresponding first mover by the electromagnetic interaction between the pair of first movers respectively provided and the respective first movers in the second axial direction. Drive to A second drive mechanism having a pair of first stators that generate a driving force; and each of the first stators is supported in a state in which movement in at least the second axial direction is allowed. A second stage device.

[0030] According to this, the first drive mechanism moves the stage in the first axial direction by electromagnetic interaction between the mover unit provided on the stage and the stator unit extending in the first axial direction. Driving at a constant stroke, minute driving in the second axis direction perpendicular to the first axis and around the third axis perpendicular to the first and second axes in a plane parallel to the moving surface of the stage, and the second driving The mechanism is constituted by a pair of first movers provided at one end and the other end of the stator unit in the first axial direction, respectively, and a corresponding one of the first movers by an electromagnetic interaction between the pair of first stators. (1) The stator unit is driven in the second axis direction integrally with the mover. That is, the stage is driven by the first drive mechanism and the second drive mechanism at a predetermined stroke in the first and second axis directions, and is minutely driven around the second axis direction and the third axis. I have. Further, since the pair of first stators is supported in a state where movement in at least the second axial direction is permitted, the pair of first stators receive a reaction force generated when the first movable element is driven in the second axial direction. Then, the first stator moves in the direction of the second axis by a predetermined distance in accordance with the law of conservation of momentum, whereby the reaction force is absorbed (canceled). Therefore, since the driving of the stator unit (the pair of first movers) in the second axis direction does not cause the stage to vibrate, the position control accuracy of the stage can be maintained at a high level.

[0031] In this case, the stator unit may be allowed to move relative to the stage at least in the first axial direction while the frictional force between the stages is substantially zero. .

[0032] The second stage device of the present invention may further include a first position adjusting mechanism for adjusting a position of at least one of the first stators in the first axial direction.

[0033] The second stage device of the present invention may further include a second position adjusting mechanism for adjusting the position of each of the first stators in the second axial direction.

[0034] In the second stage device of the present invention, at least one of the first stators is movable in the first axial direction by a reaction force generated when the stator unit is driven in the first axial direction. Can be supported by [0035] In this case, it is possible to further include an offset mechanism for offsetting a rotational moment generated in at least one of the first stators due to the action of the reaction force. Alternatively, a first platen that supports the stage; a second platen that supports each of the pair of first stators and at least one of which is movable with respect to a floor surface; A transmission mechanism for transmitting a reaction force generated at the time of driving in the first axial direction to the at least one second base plate via the stator unit may be further provided.

[0036] In this case, it is possible to further include an offset mechanism for offsetting a rotational moment generated in the at least one second platen due to the action of the reaction force.

[0037] In this case, the canceling mechanism is driven by electromagnetic interaction between the stator fixed on the at least one second platen and the stator; And a mover that generates a reaction force in a direction that cancels the rotation of one second base plate.

[0038] According to a third aspect of the present invention, there is provided an exposure apparatus for transferring a pattern formed on a mask onto a photosensitive object, wherein the photosensitive object is placed on the stage as the object. An exposure apparatus comprising one of the first and second stage devices of the invention.

[0039] According to this, since one of the first and second stage devices of the present invention in which the photosensitive object is placed as an object on the stage is provided, the position controllability of the photosensitive object can be improved. This makes it possible to transfer the pattern formed on the mask with high accuracy onto the photosensitive object.

[0040] In this case, a projection optical system for projecting the pattern onto the photosensitive object; a mask stage on which the mask is mounted; and the second axis in synchronization with the mask stage and the stage. A synchronous movement device that moves relative to the projection optical system with respect to the direction.

In the lithographic process, the productivity of highly integrated microdevices can be improved by transferring a device pattern onto a substrate using the exposure apparatus of the present invention. Therefore, from another viewpoint, the present invention can be said to be a device manufacturing method using the exposure apparatus of the present invention. BRIEF DESCRIPTION OF THE FIGURES

FIG. 1 is a view schematically showing an exposure apparatus according to one embodiment.

FIG. 2 is a perspective view showing the wafer stage device of FIG. 1.

FIG. 3 (A) is a view of the wafer stage as viewed from the + X side.

FIG. 3 (B) is a plan view showing a wafer stage and a stator unit.

FIG. 4 is a view for explaining a configuration of an air bearing 51B provided on a mounting member 65B.

FIG. 5 (A) is a diagram (part 1) for describing a drive control method of a pair of X-axis linear motors;

FIG. 5 (B) is a diagram (part 2) for explaining a drive control method of a pair of X-axis linear motors;

FIG. 6 is a diagram for explaining a relationship between a position adjustment mechanism and a Y-axis stator.

FIG. 7 (A) is a diagram (No. 1) for describing the configuration of the canceling mechanism.

FIG. 7 (B) is a diagram (part 2) for describing the configuration of the canceling mechanism.

FIG. 8 is a view for explaining a driving method and an operation of the canceling mechanism.

FIG. 9 is a perspective view showing a configuration of a stage device according to a first modification.

FIG. 10 (A) is a view (No. 1) for describing a method of controlling a canceling mechanism in the stage device of the first modification.

FIG. 10 (B) is a diagram (part 2) for describing a method of controlling the canceling mechanism in the stage device of the first modification.

FIG. 11 is a perspective view showing a configuration of a stage device according to a second modification.

FIG. 12 is a perspective view showing a configuration of a stage device according to a third modification.

FIG. 13 is a flowchart for explaining a device manufacturing method according to the present invention.

FIG. 14 is a flowchart showing a specific example of step 204 in FIG. 13.

BEST MODE FOR CARRYING OUT THE INVENTION

One embodiment of the present invention will be described with reference to FIGS. FIG. 1 schematically shows an exposure apparatus 10 according to one embodiment in a cross-sectional view.

The exposure apparatus 10 includes a reticle R as a mask and a reticle R as a photosensitive object (and an object). C) While synchronously moving W and the one-dimensional direction (here, the Y-axis direction, which is a direction orthogonal to the plane of FIG. 1), the circuit pattern formed on the reticle R is transferred to the wafer via the projection optical system PL. This is a step-and-scan type scanning exposure apparatus that transfers data to a plurality of shot areas on the W, that is, a so-called scanning stepper.

Exposure apparatus 10 includes an illumination system 12 for illuminating reticle R with illumination light IL, a reticle stage RST on which reticle R is mounted, and a projection for projecting illumination light IL emitted from reticle R onto wafer W. An optical system PL and a stage device 20 on which the wafer W is placed are provided.

The illumination system 12 includes a light source, an optical integrator (a fly-eye lens, and an internal reflection) as disclosed in, for example, JP-A-6-349701 and US Pat. No. 5,534,970 corresponding thereto. Illumination uniformizing optical system including a mold integrator or a diffractive optical element, etc., a relay lens, a variable ND filter, a reticle blind, and an illumination optical system consisting of a dike opening mirror and the like. It is composed of To the extent permitted by the national laws of the designated States (or selected elected States) specified in this International Application, the disclosures in the above publications and corresponding US Patents are hereby incorporated by reference. In the illumination system 12, a slit-shaped (or rectangular) illumination area extending in the X-axis direction on the reticle R on which a circuit pattern or the like is formed (this illumination area is defined by a reticle blind) is provided by the illumination light IL. Illuminate with almost uniform illuminance. Here, as the illumination light IL, far ultraviolet light such as KrF excimer laser light (wavelength 248 nm), vacuum ultraviolet light such as ArF excimer laser light (wavelength 193 nm) or F laser light (wavelength 157 nm) is used.

Two

It is. It is also possible to use an ultraviolet bright line (g-line, i-line, etc.) from an ultra-high pressure mercury lamp as the illumination light IL.

Here, each driving unit in the illumination system 12, for example, a variable ND filter, a reticle blind, and the like are controlled by an illumination control device (exposure controller) (not shown) according to an instruction from the main control device 50. You.

[0048] On reticle stage RST, reticle R force S, for example, is fixed by vacuum suction. The reticle stage RST is driven by a reticle stage drive unit 22 in an X-axis direction, a Y-axis direction, and a Θz direction in an XY plane perpendicular to an optical axis of the illumination system 12 (coincident with an optical axis AX of a projection optical system PL described later). (Rotational direction around the Z-axis) It can be driven at a designated scanning speed in a predetermined scanning direction (Y-axis direction) along the upper surface of the no-stage base 30. The reticle stage drive section 22 is a single block that is a mechanism that uses a linear motor, a voice coil motor, or the like as a drive source. The reticle stage RST includes a coarse movement stage driven one-dimensionally in the Y-axis direction, and a reticle R with at least three degrees of freedom relative to the coarse movement stage (X-axis direction, Y-axis direction, and Θz direction). It is a matter of course that a stage having a coarse / fine movement structure having a fine movement stage capable of fine driving can be adopted.

[0049] The position of the reticle stage RST in the XY plane (including the 例えば z rotation) is adjusted, for example, by a reticle laser interferometer (hereinafter, referred to as a "reticle interferometer") 16 via a movable mirror 15 through a movable mirror 15. It is always detected with a resolution of about 1 nm. The position information of the reticle stage RST from the reticle interferometer 16 (including rotation information such as the Θz rotation amount (jowing amount)) is supplied to the main controller 50. Main controller 50 drives and controls reticle stage RST via reticle stage drive unit 22 based on the position information of reticle stage RST. Note that, instead of the moving mirror 15, for example, an end surface of the reticle stage RST may be mirror-finished to form a reflecting surface (corresponding to the reflecting surface of the moving mirror 15).

[0050] As the projection optical system PL, a reduction system whose telescopic magnification is Sl / 4 (or 1/5) on both the object plane side (reticle side) and the image plane side (wafer side) is used. ing. Therefore, when the reticle R is irradiated with the illumination light (ultraviolet pulse light) IL from the illumination system 12, the connection from the portion illuminated by the ultraviolet pulse light in the circuit pattern area formed on the reticle R is formed. The image light beam enters the projection optical system PL, and the image (partial inverted image) of the circuit pattern in the irradiation area of the illumination light IL (the above-mentioned illumination area) is projected at each pulse irradiation of the ultraviolet laser light. At the center of the field of view on the image plane side of the optical system PL, an image is formed with a slit (or rectangular (polygonal)) elongated in the X-axis direction. Thereby, the projected partial inverted image of the circuit pattern is reduced and transferred to the resist layer on the surface of one of the plurality of shot areas on the wafer W arranged on the imaging plane of the projection optical system PL. .

When a KrF excimer laser beam or an ArF excimer laser beam is used as the illumination light IL as the projection optical system PL, a refraction system including only a refraction optical element (lens element) is mainly used. When using F laser light as IL, for example, A so-called catadioptric combining a refractive optical element and a reflective optical element (such as a concave mirror or a beam splitter) as disclosed in Japanese Patent No. 3-282527 and the corresponding US Pat. No. 5,220,454. A system (a catadioptric system) or a reflection system consisting of only a reflection optical element is mainly used. To the extent permitted by national legislation in the designated country (or selected elected country) specified in this international application, the disclosures in the above publications and corresponding US patents are hereby incorporated by reference. However, when F laser light is used, a refractive system can be used.

The stage device 20 is disposed below the projection optical system PL in FIG. 1, and is a wafer stage WST as a stage for holding the wafer W, and moves the wafer stage WST by a predetermined stroke in the X-axis (first axis) direction. And a first drive mechanism that minutely drives in the rotation direction (Θz direction) around the Y-axis (second axis) and the Z-axis (third axis), and integrally with the first drive mechanism A second drive mechanism for driving the wafer stage WST in the Y-axis direction is provided.

Hereinafter, each component of the configuration of the stage device 20 will be described in detail with reference to FIG. 2 and appropriately referring to other drawings.

[0054] The wafer stage WST is a first platen 4 having a rectangular shape in plan view (as viewed from above) supported substantially horizontally on a floor F of a clean room via a plurality (for example, three) of vibration isolation units 92. 4 is located above. The upper surface 44a of the first platen 44 has a very high degree of flatness and serves as a guide surface for guiding the wafer stage WST. In the following, the upper surface 44a of the first platen 44 is also referred to as a “guide surface 44a”.

[0055] The plurality of vibration isolation units 92 insulate micro vibration (喑 vibration) transmitted from the floor F to the first base 44 at the micro G level. In addition, as the plurality of vibration isolating units 92, the first base plate 44 is actively damped based on the output of a vibration sensor such as a semiconductor accelerometer fixed to a predetermined portion of the first base plate 44, respectively. It is of course possible to use an active vibration isolator.

As shown in FIG. 2, the wafer stage WST includes, as shown in FIG. 2, a wafer table WTB for holding a wafer W, and a stage body 100 for supporting the wafer table WTB via a tilt drive mechanism 96a 96c. It has.

As shown in FIG. 3 (A), the stage body 100 is formed by a frame having a rectangular YZ section. It is configured. The stage body 100 is provided with a top plate 99a and a bottom plate 99b arranged at a predetermined interval in the Z-axis direction, and a predetermined interval in the Y-axis direction between the top plate 99a and the bottom plate 99b. It has two side plates 99c and 99d connecting the both. Among them, a polygonal plate member in plan view (as viewed from above) is used as the top plate 99a, and rectangular plate members are used as the remaining plates 99b, 99c, and 99d.

As shown in FIG. 3A, a plurality of gas static pressure bearings (eg, air bearings) 94 as a first bearing mechanism are provided on the bottom surface of the bottom plate 99b. By blowing a pressurized gas (for example, helium or nitrogen gas (or clean air)) from the gas static pressure bearing 94 toward the guide surface 44a of the first platen 44, the static pressure of the pressurized gas is reduced. The wafer stage WST is levitated above the guide surface 44a via a clearance of about several μm by balancing the pressure and the weight of the wafer stage WST (whole).

As shown in FIG. 3 (A), a magnetic pole unit 76A as a second movable element is fixed to the center of the lower surface of the top plate 99a. Further, a pair of magnetic pole units 76B and 76C as a third movable element is provided on one side and the other side of the magnetic pole unit 76A on the lower surface of the top plate 99a in the Y-axis direction. Of these magnetic pole units 76A-76C, the magnetic pole unit 76A is provided on a frame member 31 made of a magnetic material having a rectangular YZ section and a pair of opposing surfaces (upper surface and lower surface) inside the frame member 31. And a pair of permanent magnets 33A and 33B elongated in the X-axis direction. The permanent magnet 33A and the permanent magnet 33B have opposite polarities. Therefore, between the permanent magnet 33A and the permanent magnet 33B, a magnetic field having a magnetic flux direction of + Z direction (or -Z direction) is generated.

As shown in FIG. 3 (A), one magnetic pole unit 76B of the remaining magnetic pole units 76B and 76C includes a frame-shaped member 35 made of a magnetic material having a rectangular YZ section and a frame-shaped member 35B. It has a plurality of field magnets 37 arranged at predetermined intervals along the X-axis direction on a pair of opposing surfaces (upper surface and lower surface) inside. In this case, the field magnets 37 adjacent in the X-axis direction and the field magnets 37 facing in the Z-axis direction have opposite polarities. Therefore, an alternating magnetic field is formed in the internal space of the frame member 35 in the X-axis direction. The other magnetic pole unit 76C has the same configuration as the magnetic pole unit 76B.

[0061] The stator unit 60 has an X-axis direction, as can be seen from a combination of Figs. 3 (A) and 3 (B). An armature unit 61A as a second stator having an H-shaped cross section extending in the YZ direction, and a pair of H-shaped cross sections extending in parallel at predetermined intervals on the soil Y side of the armature unit 61A. Armature units 61B and 61C as third stators, and a pair of mounting members 65A and 65B respectively integrating one end and the other end in the longitudinal direction of these armature units 61A-61C. I have.

Of these, the armature unit 61A is inserted into a space formed by the permanent magnets 33A and 33B and the frame member 31 that constitute the magnetic pole unit 76A. Further, the armature unit 61B is inserted into the internal space of the magnetic pole unit 76B described above. The electronic unit 61C is inserted into the internal space of the magnetic pole unit 76C described above. In the present embodiment, when assembling the stator unit 60 and the wafer stage main body 100, the armature units 61A to 61C are connected at one end in the longitudinal direction by, for example, a mounting member 65A. Insert the other longitudinal end of 61C into the interior space of the corresponding magnetic pole unit 76A-76C, and connect the longitudinal end of armature unit 61A-61C with mounting member 65B after the insertion. It is good.

[0063] Inside the armature unit 61A, for example, an arrangement is made such that current can flow only in the + X direction or only in the 1X direction in a magnetic field in the Z-axis direction formed in the magnetic pole unit 76A. One or more armature coils are provided. In this case, as the armature coil, for example, a pair of coils that are elongated in the X-axis direction and are arranged at predetermined intervals in the Y-axis direction can be used.

[0064] In the present embodiment, the magnitude and direction of the current supplied to the armature coil constituting armature unit 61A are controlled by main controller 50. The magnitude and direction of the driving force (Lorentz force) for driving the magnetic pole unit 76A in the Y-axis direction with respect to the armature unit 61A are arbitrarily controlled. That is, the armature unit 61A and the magnetic pole unit 76A constitute a Y-axis fine movement motor 75A that minutely drives the wafer stage WST in the Y-axis direction. In the following, armature unit 61A is also referred to as Y-axis fine movement stator 61A, and magnetic pole unit 76A is also referred to as Y-axis fine movement movable element 76A.

[0065] Further, inside the armature units 61B and 61C, a predetermined interval (place) is provided along the X-axis direction. A plurality of armature coils are arranged at a constant pitch. In the present embodiment, the magnitude and direction of the current supplied to at least one armature coil located in the alternating magnetic field in the X-axis direction formed in the internal space of the magnetic pole units 76B and 76C are mainly determined. The control unit 50 controls the magnetic pole units 76B and 76C mounted on the stage body 100 with respect to the armature units 61B and 61C in the X-axis direction. The magnitude and direction of the driving force (Lorentz force) are controlled arbitrarily. In this case, for example, as shown in FIG. 5A, by generating a driving force f in the X-axis direction at a position symmetric with respect to the center of gravity Gs of the wafer stage WST, the center of gravity of the wafer stage WST (

1

) Can be driven in the X-axis direction with a force of 2 X f. In addition, as shown in FIG.

1

The wafer stage WST is rotated around the center of gravity Gs by generating driving forces f and 1f of the same size and opposite directions at positions symmetric with respect to the center of gravity Gs of the wafer stage WST.

1 1

You can force it.

[0066] That is, armature units 61B and 61C and magnetic pole units 76B and 76C respectively engaged with them drive wafer stage WST at a predetermined stroke in the X-axis direction, and move wafer stage WST around Z-axis. The moving magnet type X-axis linear motors 75B and 75C are minutely driven in the rotation direction. In the following, the armature units 6 IB and 61C are also referred to as X-axis stators 61B and 61C, and the magnetic pole units 76B and 76C are referred to as X-axis movers 76B and 76C.

Further, as is clear from the above description, a mover unit is constituted by the Y-axis fine mover 76A and the X-axis movers 76B and 76C provided on the stage main body 100. And the above-described stator unit 60 constitute a first drive mechanism that drives the wafer stage WST by a predetermined stroke in the X-axis direction by electromagnetic interaction and minutely drives the wafer stage WST in the Y-axis direction and around the Z-axis. Have been.

As shown in FIG. 1, one side (one X side) and the other side (+ X side) of the first surface plate 44 in the X-axis direction have an L-shape in an XZ section and a Y-axis direction. The pair of second stools 46A and 46B having the longitudinal direction as the longitudinal direction are arranged in a symmetrical manner. Of these, the second platen 46A, which is located on one X side of the first platen 44, is fixed on the floor F of the clean room, and the end on the + X side (inside) is a convex portion. Have been. The upper surface of the convex portion (hereinafter also referred to as “first surface” for convenience) 146a ( 2) is a support surface for supporting the stator unit 60 in the Z-axis direction as described later. As shown in FIG. 2, a guide member having a U-shaped cross section whose longitudinal direction is the Y-axis direction is provided on a surface one step lower than the convex portion (hereinafter, also referred to as “second surface” for convenience) 146b. 48A is fixed.

[0069] The other second surface plate 46B, which is located on the + X side of the first surface plate 44, is levitated and supported via a static gas pressure bearing (for example, an air bearing) 42 on the floor surface F of the clean norem. I have. The second surface plate 46B is symmetrical to the second surface plate 46A, but has the same shape. The second surface plate 46B is formed to be somewhat longer in the Y-axis direction than the second surface plate 46A described above (see FIG. 2).

[0070] As shown in FIG. 2, the second platen 46B has a convex portion on the X side (inside) end, and the upper surface of the convex portion (hereinafter also referred to as "first surface" for convenience). The side surfaces 146c and ± X sides (146e, 146f (see FIG. 4)) are support surfaces for supporting the stator unit 60 in the Z-axis direction and the X-axis direction, respectively, as described later. A guide member 48B having the same shape as the above-described guide member 48A is fixed to a one-step lower surface 146d outside the convex portion (hereinafter, also referred to as a “second surface” for convenience).

As shown in FIG. 3 (B), a pair of armatures as first movers are provided at one end and the other end in the longitudinal direction of the stator unit 60 via mounting members 65A and 65B, respectively. Units 64A and 64B are provided.

[0072] Further, on the bottom surfaces of the mounting members 65A and 65B, gas static pressure bearings (for example, air bearings) 51A and 51B (however, in FIG. 2, one second bearing mechanism is provided) as a second bearing mechanism. 51B is not shown, see FIG. 4).

[0073] As shown in Fig. 2, the gas static pressure bearing 51A provided on one mounting member 65A is disposed so as to face the upper surface (first surface) 146a of the convex portion of the second surface plate 46A described above. Have been. Pressurized gas (for example, helium or nitrogen gas (or clean air)) is ejected from the static gas pressure bearing 51A toward the first surface 146a, and the static pressure of the pressurized gas causes the static gas pressure bearing 51A. A clearance of about several / zm is formed between the bearing surface of the first surface 146a and the first surface 146a.

[0074] The gas static pressure bearing 51B provided on the other mounting member 65B is as shown in FIG. The second platen 46B is disposed so as to face the first surface 146c of the second platen 46B. The pressurized gas is ejected toward the first surface 146c, and the static pressure of the pressurized gas causes a static pressure between the bearing surface of the gas static pressure bearing 51B and the first surface 146c. A clearance of about several μΐη is formed.

[0075] That is, the total force of the stator unit 60 and the pair of armature units 64Β and 64Β is in non-contact with the first surfaces 146a and 146c of the second platens 46Α and 46Β by the gas static pressure vehicle supports 51A and 51B. In the Z-axis direction.

As shown in FIG. 4, a pair of hydrostatic gas bearings 151a and 151b are fixed to one side and the other side of the air bearing 51B in the X-axis direction. Among them, one gas static pressure bearing 151a is arranged to face the side surface 146e of the convex portion of the second platen 46B, and blows out a pressurized gas toward the side surface 146e. Further, the other gas static pressure bearing 151b is arranged to face the side surface 146f of the convex portion of the second platen 46B, and blows out a pressurized gas toward the side surface 146f. In this case, depending on the balance of the static pressure (pressure in the gap) of the pressurized gas ejected from each of the static gas pressure bearings 151a and 151b, the distance between the convex portion and each static gas pressure bearing is approximately several m / m. Clearance is formed and maintained. In the present embodiment, the convex portion of the second platen 46B also serves as a yaw guide for the stator unit 60. In addition, a transmission mechanism that transmits a reaction force generated when the wafer stage WST (movable unit) is driven in the X-axis direction by the static gas pressure bearings 151a and 151b to the second platen 46B via the stator unit 60 is configured. Have been.

[0077] As described above, the vibration isolation unit 92 that supports the first base 44 has a function of insulating vibration transmitted from the floor F. For this purpose, a configuration may be adopted in which the first platen 44 can be minutely driven in the Z-axis direction by the vibration isolation unit 92. Further, even in the case where the vibration isolating unit 92 is an active vibration isolating device having, for example, an actuator and an air mount, the first platen 44 is actively moved in the Z-axis direction by the actuator to prevent the vibration. The vibration function can also be activated. In addition, if necessary, the first surface plate 44 may be moved in six directions of freedom (Χ, Υ, Ζ, θ χ, θ γ, θ ζ directions) by the active vibration isolating device so that the vibration is damped. Good les ,. Furthermore, in order to maintain a predetermined positional relationship in the Ζ-axis direction between the wafer holding surface of the wafer stage WST and the focal position of the projection optical system ΡL, It is also conceivable to move the first platen 44 in the Z-axis direction using data or the like. When the first surface plate 44 is moved in this manner, the wafer stage WST on the guide surface 44a of the first surface plate 44 also functions in substantially the same manner as the first surface plate 44. Therefore, when the first surface plate 44 is configured to be movable in the Z-axis direction, a change in the relative position in the Z-axis direction between the first surface plate 44 and the second surface plates 46A and 46B. Occurs. Further, even when the first platen 44 is configured to be able to move (rotate) in the θX and Θy directions, the Z-axis direction is provided between the first platen 44 and the second platens 46A and 46B. A change in relative position with respect to In the configuration of the present embodiment, the Y-axis fine movement motor 75A and the X-axis linear motors 75B and 75C have their respective movers (magnetic pole units 76A, 76B and 76C) fixed to the wafer stage WST. Supported on the first platen 44. The respective stators (armature units 61A, 61B, 61C) are supported on second platens 46A, 46B via a pair of mounting members 65A, 65B. As a result, when the relative position between the first surface plate 44 and the second surface plates 46A and 46B in the Z-axis direction changes, the Y-axis fine movement motor 75A and the X-axis linear motors 75B and 75C The relative position in the Z-axis direction between the stator and the stator will also change. Therefore, the gap (gap) in the Z-axis direction between the mover and the stator of each of these motors 75A, 75B, and 75C can be maintained even if the first platen 44 moves in the Z-axis direction. It is necessary to predetermine a value that does not cause contact between the stator and the stator. For example, during scanning exposure, if the range in which the first platen 44 can be moved in the Z-axis direction by the vibration isolation unit 92 is set to ± 0.3-3.0 mm from the reference position, the motors 75A, 75B, and 75C will The distance between the mover and the stator in the Z-axis direction is preferably set to about 0.4-4. Omm. In this case, it is desirable that each of the motors 75A, 75B, and 75C be configured so that the output in the driving direction does not change due to the gap distance between the mover and the stator. Also, when the Z position of the first platen 44 changes during maintenance of the stage device 20 (for example, when the vibration isolating unit 92 has an air mount and the air is released). It is necessary to make sure that the mover of each of the motors 75A, 75B, and 75C does not come into contact with the stator. At this time, if contact cannot be prevented only by the distance between the mover and the stator, a stopper or the like is provided in advance, and after the stopper is used to prevent contact, the first platen 44 May be changed in the Z-axis direction. In addition, the parallelism of the guide surface between the first platen 44 and the second platen 46A, 46B changes. In this case, the clearance in the static gas pressure bearings 51A, 51B, 151a, 151b decreases, and for example, the bearing may come into contact with the guide surface of the surface plate. Therefore, for example, a hinge mechanism (not shown) having a plate panel, a flexure, and the like is provided between the mounting member 65B and the stator unit 60 and between the mounting member 65A and the hydrostatic gas bearing 51A. The configuration may be such that a change in parallelism can be tolerated. In this case, the hinge mechanism provided between the mounting member 65B and the stator unit 60 has a degree of freedom in the y-direction, and the hinge mechanism provided between the mounting member 65A and the hydrostatic gas bearing 51A. May be configured to have degrees of freedom in the θ X direction and the Θ y direction. Due to these hinge mechanisms, even if the parallelism between the first platen 44 and the second platens 46A, 46B changes, the rotation of the gas static pressure bearings 51A, 51B, 151a, 151b is caused by the deformation of the hinge mechanism. Therefore, it is possible to maintain a predetermined clearance in each of the gas static pressure bearings without applying the stress.

Returning to FIG. 2, a pair of magnetic pole units 62A and 62B as a first stator are provided above the second platens 46A and 46B so as to face the pair of armature units 64A and 64B, respectively. It extends along the axial direction.

As shown in FIG. 2, one of the magnetic pole units 62A and 62B has an upper plate member 54A having a rectangular plate shape in plan view (as viewed from above), and A yoke 60A includes a lower plate member 54B having the same shape, and an intermediate member 56 having a U-shaped cross section provided in a state where the upper plate member 54A and the lower plate member 54B are connected to each other. The yoke 60A has a plurality of field magnets 108 disposed on the pair of opposing surfaces (upper and lower surfaces) at predetermined intervals along the Y-axis direction. In this case, the field magnets 108 adjacent in the Y-axis direction and the field magnets 108 facing in the Z-axis direction have opposite polarities. For this reason, an alternating magnetic field is formed in the interior space of the yoke 60A in the Y-axis direction.

[0080] The other magnetic pole unit 62B is configured similarly to the magnetic pole unit 64A. That is, an upper plate member 54A having a rectangular plate shape in plan view (as viewed from above), a lower plate member 54B having the same shape as the upper plate member 54A, and connecting the upper plate member 54A and the lower plate member 54B. A yoke 60B composed of an intermediate member 56 having a U-shaped cross section provided in a state, and a pair of opposing surfaces (upper and lower surfaces) of the yoke 60B are provided at predetermined intervals along the Y-axis direction. And a plurality of field magnets 108 disposed therein. Y-axis direction Thus, an alternating magnetic field is formed.

[0081] The armature units 64A and 64B are each composed of a housing having a hollow interior, and armature coils (not shown) arranged at predetermined intervals in the housing along the Y-axis direction. ing.

[0082] Accordingly, the electromagnetic interaction between the current flowing through the armature coils constituting the armature units 64A and 64B and the magnetic field (alternating magnetic field) generated by the field magnets constituting the magnetic pole units 62A and 62B respectively. The generated Lorentz force drives the armature units 64A, 64B (that is, the stator unit 60) in the Y-axis direction along the magnetic pole units 62A, 62B. That is, in the present embodiment, the armature units 64A and 64B and the magnetic pole units 62A and 62B also provide a moving coil type linear motor force. It is configured. Therefore, hereinafter, the magnetic pole units 62A and 62B are also referred to as Y-axis stators 62A and 62B, and the armature units 64A and 64B are also referred to as Y-axis movers 64A and 64B.

[0083] A prismatic slide member 68A having the Y-axis direction as a longitudinal direction is fixed to the lower surface of one magnetic pole unit (Y-axis stator) 62A, and the other magnetic pole unit (Y-axis stator). A prismatic slide member 68B whose longitudinal direction is in the Y-axis direction is fixed to the lower surface of 62B.

As shown in FIG. 2, one slide member 68A is arranged such that the side surfaces and the lower surface on both sides in the X-axis direction respectively face the three inner surfaces of the aforementioned U-shaped guide member 48A. The slide member 68A is supported from three directions (+ X, X and Z directions) by a guide member 48A in a non-contact manner through static gas bearings (for example, air bearings) (not shown). . In this case, a predetermined clearance is formed between the lower surface of the Y-axis stator 62A and the guide member 48A.

As shown in FIG. 2, the other slide member 68B is disposed so as to face the inner three surfaces of the above-described U-shaped guide member 48B, respectively, on the side surfaces on both sides in the X-axis direction and the lower surface force. The slide member 68B is not contacted by the guide member 48B from three directions (+ X direction, 1X direction and 1Z direction) via static gas bearings (for example, air bearings) (not shown). Supported by. In this case, a predetermined clearance is formed between the lower surface of the Y-axis stator 62B and the guide member 48B.

[0086] The Ζ-tilt drive mechanisms 96a-96c are substantially equilateral triangles on the upper surface of the stage body 100. It is arranged at each of the vertices. Ζ · Tilt drive mechanisms 96a-96c each include a voice coil motor that supports the wafer table WTB and independently drives minutely in the Z-axis direction. Accordingly, the wafer table WTB can be moved in three directions of freedom in the Z-axis direction, the θ-X direction (rotation direction around the X-axis), and the Θy direction (rotation direction around the Y-axis) by the Ζ-tilt drive mechanisms 96a-96c. Is slightly driven. In the present embodiment, the tilt drive mechanisms 96a and 96c are controlled by the main controller 50 in FIG.

[0087] On the wafer table WTB supported on the stage main body 100 by the tilt drive mechanisms 96a-96c, as shown in FIG. It is fixed by vacuum suction. The position of the wafer table WTB in the XY plane (including the rotation of θ）) is, for example, about 0.5 nm by a wafer laser interferometer (hereinafter referred to as “wafer interferometer”) 104 via a movable mirror 102. It is always measured with a resolution of.

Here, on wafer table WTB, actually, as shown in FIG. 2, a Y movable mirror 102a extending in the X-axis direction is provided at one end (+ Y side) in the Y-axis direction. An X movable mirror 102b that is fixed and extends in the Y-axis direction is fixed to one end (−X side) in the X-axis direction. The outer surfaces of these moving mirrors 102a and 102b are mirror-finished reflecting surfaces. Corresponding to the above moving mirrors 102a and 102b, the wafer interferometer also has a Y interferometer that irradiates a laser beam (length measuring beam) on the reflecting surface of the Y moving mirror 102a and a wafer interferometer that reflects the reflecting surface of the X moving mirror 102b. An X interferometer that irradiates a laser beam (length measuring beam) is provided.

As described above, a plurality of moving mirrors and a plurality of wafer interferometers are provided, respectively. In FIG. 1, these are representatively shown as a moving mirror 102 and a wafer interferometer 104.

[0090] In this case, as the X interferometer and the Y interferometer, a multi-axis interferometer having a plurality of measurement axes is used, and the X and Y positions of the wafer table WTB and the jowing (rotation around the Z axis) are used. In addition to certain Θ z rotations), pitching (θ X rotation, rotation around the X axis) and rolling (Θ y rotation, rotation around the axis)) can also be measured. Note that, for example, a reflective surface (corresponding to the reflective surfaces of the movable mirrors 102a and 102b described above) may be formed by mirror-finish the end surface of the wafer table WTB. In addition, the above-described multi-axis interferometer injects a laser beam through a reflecting surface installed on the wafer table WTB at an angle of 45 ° to a reflecting surface installed on a mount (not shown) on which the projection optical system PL is mounted. Irradiation and projection optical system PL optical axis direction (Z axis direction) It is good to detect relative position information.

[0091] Position information (or speed information) of wafer table WTB (wafer stage WST) measured by wafer interferometer 104 is sent to main controller 50, and main controller 50 transmits position information (wafer stage WST) of wafer stage WST. Or, the position in the XY plane of the wafer stage WST is controlled via the Y-axis linear motors 66A and 66B, the X-axis linear motors 75B and 75C, and the Y-axis fine movement motor 75A based on the speed information).

As shown in FIG. 2, the stage device 20 further includes two position adjusting mechanisms 52 位置, 52Β for adjusting the positions of the above-mentioned Υ-axis stators 62Α, 62Β in the Υ-axis direction. As shown in FIG. 2, one of the position adjustment mechanisms 52Β has, as a stator, an armature unit 74 supported at a predetermined height position on a floor F via a support member 72, as described above. The magnetic pole unit 62Β, that is, a moving magnet type linear motor having a part of the Υ-axis stator 62Β as a mover.

[0093] That is, as shown in FIG. 6, the armature unit 74 is configured such that the inner space of the yoke 60Β is formed through a rectangular opening に formed in the intermediate member 56 of the yoke 60Β constituting the shaft stator 62Β. (A space in which an alternating magnetic field is formed by the field magnet). Inside the armature unit 74, at least one armature coil is provided, and an electromagnetic interaction between the X-axis direction current flowing through the armature coil and the alternating magnetic field described above is provided. The generated Lorentz force drives the γ-axis stator 62Β relative to the armature unit 74 in the Υ-axis direction. In this case, the magnitude and direction of the current supplied to the armature coil inside the armature unit 74 are controlled by the main controller 50 in FIG.

[0094] The other position adjustment mechanism 52 # is configured by a moving magnet type linear motor having the same configuration as the above-described position adjustment mechanism 52 #, and drives the # axis stator 62 # in the # axis direction.

[0095] The timing and the like for adjusting the position of the Υ-axis stator by these position adjusting mechanisms 52Β and 52Β will be further described later.

[0096] Stage device 20 further includes an offset mechanism that offsets a rotational moment generated on second platen 46 ° due to the effect of a reaction force generated when wafer stage WST is driven in the X-axis direction. As shown in FIG. 2, the canceling mechanism 78 is provided on the second surface 146d of the second platen 46Β. -It is provided at the end on the Y side. As shown in FIGS. 2 and 7 (A), the canceling mechanism 78 includes a fixed portion 78Β fixed on the second platen 46 可動 and a movable portion 78 移動 moving along the longitudinal direction of the fixed portion 78Β. And

[0097] As shown in FIG. 7 (B), the fixing portion 78 # includes a guide 179 having a substantially U-shaped cross section and a stator RMa fixed to the upper surface of the guide 179. In this case, the guide 179 is directly fixed on the second platen 46B. The stator RMa has an I-shaped cross section, and has a plurality of armature coils disposed therein.

[0098] As shown in FIG. 7 (B), the movable portion 78B includes a mover RMb and a pair of heavy objects (mass) 178A, 178B fixed to both sides of the mover RMb in the Y-axis direction. Have. The mover RMb includes a tubular member having a rectangular cross section, and a plurality of field magnets fixed to a pair of opposing surfaces (both side surfaces in the Y-axis direction) inside the tubular member.

[0099] When the stator RMa and the mover RMb are engaged as shown in Fig. 7 (A), the current flowing through the stator RMa and the magnetic field formed within the mover RMb are different. Due to the electromagnetic interaction between them, a driving force in the X-axis direction acts on the mover RMb. That is, the moving magnet type linear motor RM is constituted by the stator RMa and the mover RMb.

[0100] A part of the portion of the masses 178A, 178B fixed to both sides in the Y-axis direction of the mover RMb facing the guide 179 is provided with a gas static pressure bearing (not shown). Masses 178A and 178B are supported by guides 179 in a floating manner via clearances of several μΐη via pressure bearings. These masses 178A and 178B are provided to generate a large reaction force (force) with a small stroke. It is desirable that the masses 178A and 178B be made as large as possible by being made of a member having a relatively high density.

The cancellation mechanism 78 (that is, the linear motor RM) thus configured is controlled by the main control device 50 shown in FIG. 1 as described later.

[0102] As shown in FIG. 2, the stage device 20 further includes a voice coil motor 80 that can drive the second platen 46B in the X-axis direction. The voice coil motor 80 includes a flat movable member 81 protruding from the + X side surface of the second base plate 46B, and a support member 83 so as to engage with the movable member 81 in a non-contact manner. U-shaped stator placed above floor F via And In this case, for example, the mover 81 is an armature unit having an armature coil therein, and the stator 82 has a pair of opposing surfaces (upper surface and lower surface) having field magnets having opposite polarities. The magnetic pole unit may be provided.

[0103] The mover 81 is provided at a position in the Y-axis direction corresponding to the center of gravity of the second platen 46B.

Therefore, when the voice coil motor 80 is driven by the main controller 50, it can be driven in the X-axis direction without rotating the second platen 46B by Θz.

Returning to FIG. 1, exposure apparatus 10 of the present embodiment has a light source whose on / off is controlled by main controller 50, and has a large number of pinholes or slits facing the image forming plane of projection optical system PL. An irradiation system AFa that irradiates an image forming light beam for forming an image from an oblique direction with respect to the optical axis AX, and a light receiving system AFb that receives the light beam reflected by the surface of the wafer W of the image forming light beam. The apparatus further includes a focal position detection system comprising an input type multi-point focal position detection system. The detailed configuration of the multipoint focal position detection system similar to the focal position detection systems (AFa, AFb) of the present embodiment is described in, for example, JP-A-6-283403 and U.S. Pat. No. 448, 332, etc. To the extent permitted by national law in the designated country (or selected elected country) specified in this international application, the disclosures in the above-mentioned publications and corresponding US patents are incorporated herein by reference.

[0105] In the main controller 50, a defocus signal from the light receiving system AFb is output during scanning exposure, which will be described later.

(Defocus signal), for example, the movement of the wafer table WTB in the Z-axis direction via the tilt drive mechanism 96a-96c based on the S-curve signal, and the inclination with respect to the two-dimensional surface (ie, θ X, Θ By controlling the movement of the wafer table WTB based on the detection results of the multi-point focal position detection system (AFa, AFb), the illumination area of the illumination light IL (the illumination area and the imaging area) is controlled. The image plane of the projection optical system PL substantially coincides with the surface of the wafer W (shot area) within the exposure area to be related (in other words, the surface of the shot area is projected onto the projection optical system PL within the exposure area). Auto focus (set within the depth of focus) and auto leveling.

According to the exposure apparatus 10 of the present embodiment configured as described above, the reticle alignment, the baseline measurement of the alignment system (not shown), and the EGA (Enhanced.glo. Places such as the wafer alignment method After the predetermined preparation work, the exposure operation of the step-and-scan method is performed as follows.

[0107] The above-mentioned preparation work such as reticle alignment and baseline measurement is disclosed in detail in, for example, JP-A-7-176468 and US Patent No. 5,646,413 corresponding thereto. The subsequent EGA is disclosed in detail in Japanese Patent Application Laid-Open No. 61-44429 and the corresponding US Pat. No. 4,780,617. To the extent permitted by national laws of the designated country (or elected elected country) designated in this international application, the disclosures in each of the above-mentioned publications and the corresponding U.S. patents above are incorporated by reference in their entirety with this disclosure. I do.

In other words, main controller 50 starts the acceleration start position for the exposure of the first shot area (first shot area) on wafer W held on wafer table WTB based on the result of the wafer alignment. Move wafer stage WST to. This movement is performed by the main controller 50 controlling the Y-axis linear motors 66A and 66B and the X-axis linear motors 75B and 75C based on the measurement values of the wafer interferometer 104.

Next, main controller 50 starts relative scanning in the Y-axis direction between reticle stage RST and wafer stage WST, performs scanning exposure on the first shot area on wafer W, The circuit pattern of the reticle R is reduced and transferred via the projection optical system PL.

Here, at the time of scanning exposure, main controller 50 monitors reticle interferometer 22 and wafer interferometer 104 while monitoring reticle stage drive unit 22 and Y-axis linear motors 66A and 66B. By controlling, the reticle stage RST and the wafer stage WST relatively run, but during this relative scanning (at least during exposure), it is necessary to synchronize them accurately. In consideration of this point, main controller 50 uses Y-axis fine movement motor 75A to adjust the position of wafer stage WST in the Y-axis direction so that the tracking error of reticle stage RST with respect to wafer stage WST is minimized. Fine adjustments have been made.

[0111] Also, during scanning exposure, auto-focusing and auto-leveling based on the output of the focus position detection system (AFa, AFb) described above cause the main controller 50 to control the tilt driving mechanisms 96a-96c. Running through. [0112] In this way, when the scanning exposure of the first shot is completed, the main controller 50 moves the wafer stage WST stepwise in the axial direction, and performs exposure for the second shot area (second shot area). It is moved to the acceleration start position. Then, under the control of the main controller 50, the traveling exposure similar to the above is performed on the second shot area.

[0113] In this manner, the running exposure of the shot area on the wafer W and the stepping operation between the shot areas are repeatedly performed, and the circuit pattern of the reticle R is sequentially placed on all the exposure target shot areas on the wafer W. Transcribed.

When the wafer stage WST is driven in the Y-axis direction together with the stator unit 60 during the above-described step-and-scan exposure operation, the reaction force due to the driving causes the Y-axis linear motors 66A and 66B to move. Acts on the constituent Y-axis stators 62A, 62B. By the action of this reaction force, the Y-axis stators 62A and 62B are driven in the Y-axis direction along the guides 48A and 48B. In this case, since the guides 48A and 48B and the sliders 68A and 68B fixed to the Y-wheel stators 62A and 62B are not in contact with each other by the static gas pressure bearing, the law of conservation of momentum is substantially satisfied. Then, the Y-axis stators 62A and 62B move, and the aforementioned reaction force is almost completely canceled.

[0115] However, if the Y-axis stators 62A and 62B repeatedly move by a distance corresponding to the above reaction force, the Y-axis stators 62A and 62B deviate from predetermined reference positions. It may be out of the required stroke range of Tage WST. For this reason, in the present embodiment, the main controller 50 sets the above-described position adjustment mechanisms 52A and 52B at a timing that does not affect the exposure accuracy, that is, for example, at a time when the exposure operation alignment operation is not performed. By controlling the supply current to the armature coils constituting the above, an operation of returning the Y-axis stators 62A and 62B to a predetermined reference position is performed.

[0116] Also, based on the target position of wafer stage WST in the Y-axis direction, the Y-axis is fixed at a position where the reaction force generated when driving wafer stage WST to the target position is canceled by the law of conservation of momentum. The position adjusting mechanisms 52A and 52B may be constantly controlled so that the slaves 62A and 62B move. Also in this case, it is preferable to control the position adjustment mechanisms 52A and 52B to be driven at a timing when the exposure operation alignment operation is not performed.

[0117] On the other hand, when the wafer stage is driven along the ST-axis direction, Acts on the stator unit 60, and the stator unit 60 tries to move in the opposite direction to the wafer stage WST. In this case, since the position of the stator unit 60 in the X-axis direction with respect to the second platen 46B is maintained via the gas static pressure bearings 151a and 151b, the above-described reaction force in the X-axis direction is maintained at the second constant. Also transmitted to the platen 46B, the stator unit 60 and the second platen 46B move physically in the direction opposite to the wafer stage WST.

[0118] In this case, since the second base plate 46B is supported by floating above the floor F, the stator unit 60 and the second base plate 46B are integrated so that the momentum conservation law is substantially satisfied. Then, the wafer stage WST is almost completely canceled by the driving force in the X-axis direction. In addition, since the second platen 46B moves together with the stator unit 60 instead of moving only the stator unit 60 for canceling the reaction force in this way, the weight of the second platen 46B is increased, so that the X-axis direction is reduced. It is possible to keep the moving stroke small.

[0119] In this case, the reaction force generated by driving the wafer stage WST in the X-axis direction is composed of members supported by the second platen 46B such as the second platen 46B, the guide member 48B, and the Y-axis stator 62B. Although there is no problem when acting on the center of gravity of the system, as shown in FIG. 8, the wafer stage WST is located at a distance L1 from the center of gravity Gp of the system, and a reaction force acts on that position. In this case, a rotating moment (torque) M is generated on the second platen 46B.

1

U. Therefore, in the present embodiment, the main control device 50 drives the movable portion 78B constituting the above-described canceling mechanism 78 in the X-axis direction according to the magnitude of the reaction force and the position of the action point. The rotational moment M is canceled in the closed system including the second platen 46B.

1

[0120] More specifically, main controller 50 controls the reaction force (F) due to the movement of wafer stage WST in the X-axis direction and the point from the center of gravity Gp of the system to the point where reaction force (F) acts. Departure according to the distance (L1)

1 1

The rotational moment (M) generated around the center of gravity and the movable part 78B of the cancellation mechanism 78 in the X-axis direction

1

The reaction force (F) due to the movement and the distance (L2) from the center of gravity Gp of the system to the point where the reaction force (F) acts

twenty two

The drive of the movable portion 78B of the canceling mechanism 78 is controlled so that the rotational moment around the center of gravity generated in the opposite direction has the same magnitude in the opposite direction. As a result, the moment (M) acting around the center of gravity Gp of the system including the second base plate 46B is offset in the system including the second base plate 46B.

1

The rotation of the second platen 46B due to the rotation moment M can be prevented.

1

[0121] In the present embodiment, the rotating moment acting on the system including the second platen 46B as described above is described. However, the second platen 46B has the effect of the resultant force of the reaction force F and the reaction force F.

1 2

Moves a small amount of force in the X-axis direction while obeying the law of conservation of momentum. With the movement of the second surface plate 46B, the stator unit 60 and the pair of Y-axis movers 64A and 64B move in the X-axis direction with respect to the second surface plate 46B and the like. If such movements are repeated, the second base plate 46B and the stator unit 60 and the like deviate from the reference position, and if the deviation becomes large, the control of the Y-axis linear motor 66A will be affected. That is, for example, there is a possibility that the Y-axis mover 64A comes off the internal space of the Y-axis stator 62A, or the air bearing 51A comes off the first surface 146a of the second platen 46A. Therefore, in order to prevent such a situation from occurring, main controller 50 controls the driving of voice coil motor 80 while the exposure operation and the alignment operation are not performed, and causes second base plate 46B Then, the stator unit 60 is appropriately moved to a predetermined reference position or its vicinity.

[0122] Further, based on the target position of wafer stage WST in the X-axis direction, a position where the reaction force generated when driving wafer stage WST to the target position is canceled by the law of conservation of momentum is set. The voice coil motor 80 may be constantly controlled so that the second base plate 46B and the stator unit 60 move. Also in this case, it is preferable to control the voice coil motor 80 to be driven at a timing when the exposure operation alignment operation is not performed.

[0123] By the above, the reaction force generated during the exposure operation and the alignment operation is almost completely canceled, and the influence of the rotational moment given to the second platen 46B and the like by the reaction force is minimized. In addition, it is possible to reliably prevent the Y-axis linear motor from becoming uncontrollable.

As described in detail above, according to the stage device 20 according to the present embodiment, the wafer stage WST is guided by the guide surface 44a formed on the first platen 44, and the first drive mechanism described above is operated. The X-axis linear motors 75B and 75C are driven at a predetermined stroke in the X-axis direction and minutely driven in the rotation direction around the Z-axis. Further, wafer stage WST is minutely driven in the Y-axis direction by Y-axis fine movement motor 75A constituting the first drive mechanism. Further, the wafer stage WST is guided by a guide surface 44a formed on the first platen 44, and a pair of Y-axis movers 65 corresponding to a pair of Y-axis stators 64A and 64B constituting a second drive mechanism. The pair of Y-axis movers 65A and 65B are connected to one end in the longitudinal direction by the driving force generated by the electromagnetic interaction between A and 65B (ie, the driving force of the pair of Y-axis linear motors 66A and 66B). It is driven in the Y-axis direction integrally with the stator unit 60 provided at each of the other ends.

[0125] In this case, the stator unit 60 (including the X-axis stators 61B and 61C and the Y-axis fine movement stator 61A) constituting the first drive mechanism (the Y-axis fine movement motor 75A, the X-axis linear motors 75B and 75C) is included. ) Is supported in the Z-axis direction by the first surfaces 146a and 146c of the second surface plates 46A and 46B which are vibrationally separated from the first surface plate 44.

[0126] Therefore, when the wafer stage WST is driven in the Y-axis direction by the pair of Y-axis linear motors 66A and 66B together with the stator unit 60, vibration is temporarily generated in the pair of Y-axis stators 64A and 64B. In this case, the vibration is transmitted only to the second base plates 46A and 46B that individually support the Y-axis stators 64A and 64B, and is transmitted to the first base plate 44 that is vibrationally separated therefrom. Never. Further, even if the vibrations of the Y-axis stators 64A, 64B are transmitted to the corresponding Y-axis movers 65A, 65B, the stator unit 60 having the Y-axis movers 65A, 65B provided at both ends thereof, Since the support surfaces 146a and 146B of the pair of second base plates 46A and 46B are supported in a non-contact manner in the Z-axis direction via static gas bearings, vibration is transmitted to the second base plates 46A and 46B. Nevertheless, it is not transmitted to the first platen 44, which is vibrationally separated from these second platens 46A and 46B. Also, the vibration of the Y-axis movers 65A and 65B hardly affects the stator unit 60. The vibration isolating unit 92 is not necessarily provided if there is no influence of the vibration transmitted to the first base plate 44. When the anti-vibration unit 92 is not provided, the first surface plate 44 and the second surface plates 46A and 46B may be integrally configured.

[0127] The magnetic force is generated by electromagnetic interaction between the mover unit (specifically, the Y-axis fine-movement mover 76A) and the stator unit 60 (specifically, the Y-axis fine-movement stator 61A). Since the wafer stage WST can be finely driven in the Y-axis direction (running direction) by the driving force, it is necessary to maintain the positional relationship between the wafer stage WST (movable unit) and the stator unit 60 in the Y-axis direction. It is not necessary to provide an air bearing or the like, and the wafer stage WST can be accurately moved to a desired position in the Y-axis direction.

In this case, the movement of stator unit 60 in the Y-axis direction is directly performed on wafer stage WST. Does not affect Thus, the position control accuracy of the wafer stage WST can be maintained at a high level when the wafer stage WST is driven in the Y-axis direction without being driven by the wafer stage WST in the Y-axis direction as a vibration factor of the wafer stage WST.

The wafer stage WST moves along the stator unit 60 along the stator unit 60 while being guided by the guide surface 44a by the driving force generated by electromagnetic interaction between the mover unit and the stator unit 60. Since it is driven in the axial direction, the wafer stage WST does not vibrate during this drive. Even if the reaction force due to this drive is transmitted to the second bases 46A and 46B that support the Y-axis stators 64A and 64B via the stator unit 60, this vibration is transmitted to the first base 44. It is not transmitted.

[0130] Therefore, according to stage device 20, the height of wafer stage WST that hardly causes the vibration of each part caused by the reaction force generated by driving wafer stage WST to deteriorate the position controllability of wafer stage WST. Accurate position control can be realized.

[0131] According to the stage device 20, the stator unit 60 includes a Y-axis fine movement stator 61A extending in the X-axis direction, and one side in the Y-axis direction with the Y-axis fine movement stator 61A as a center. And a pair of X-axis stators 61B and 61C extending in the X-axis direction, respectively, and the mover unit is provided with a wafer stage by electromagnetic interaction with the Y-axis fine movement stator 61A. Electromagnetic interaction is performed individually between the Y-axis fine mover 76A, which generates a driving force to slightly drive the WST in the Y-axis direction, and the pair of X-axis stators 61B, 61C. It includes a pair of X-axis movers 76B and 76C that respectively generate a driving force for driving in the axial direction. That is, a Y-axis fine movement motor 75A for finely driving the wafer stage WST in the Y-axis direction, and X-axis linear motors 75B and 75C respectively arranged on one side and the other side of the Y-axis direction centering on the Y-axis fine movement motor 75A. Since the driving force of the X-axis linear motors 75B and 75C is the same, the driving force can be applied to the vicinity of the center of gravity of the stage. Are made to have the same magnitude and force in opposite directions, so that rotational driving around the center of gravity can be performed.

Further, according to the stage device 20 according to the present embodiment, the Y-axis linear motors 66A and 66B are configured such that the movers 64A and 64B are composed of armature units, and the stators 64A and 64B are composed of magnetic pole units. Since it is composed of a moving coil type linear motor, The side can be made lighter, and the stator side can be made heavier. In this case, the stroke when the stator functions as the counter mass can be reduced, and the size of the device can be reduced. In this embodiment, the moving coil type Y-axis linear motors 66A and 66B are used.Therefore, two wafer stages are provided, and the Y-axis linear motor of the two wafer stages has a common stator. Thus, a twin wafer stage type wafer stage device having two wafer stages can be realized relatively easily.

[0133] Further, the second bases 46A and 46B also serve as the bases of the Y-axis stators 62A and 62B, and each of the Y-axis stators 62A and 62B is provided between the second bases 46A and 46B. When the frictional force is almost zero, relative movement at least in the Y-axis direction is allowed. For this reason, when the wafer stage WST is driven in the Y-axis direction, the Y-axis movers 64A and 64B are integrated with the stator unit 60, and are driven by the reaction force generated in the Y-axis stators 62A and 62B when driven in the axial direction. The Y-axis stators 62A and 62B move in the Y-axis direction according to the law of conservation of momentum. As a result, the reaction force is almost completely canceled, and the occurrence of vibration is prevented. In this case, since the center of gravity does not move, there is no occurrence of an eccentric load.

Further, according to stage device 20 according to the present embodiment, stator unit 60 moves relative to the X-axis direction in a state where the frictional force between wafer stage WST and guide surface 44a is substantially zero. When the wafer stage WST is driven in the X-axis direction, the stator unit 60 moves in the X-axis direction in accordance with the law of conservation of momentum due to the reaction force of the driving force, and the reaction force is canceled. To prevent the occurrence of vibrations caused by the reaction force. Further, the second platen 46B is movable with respect to the floor surface F, and generates a reaction force generated in the stator unit 60 when the wafer stage WST (X-axis movers 76B, 76C) is driven in the X-axis direction. The stator unit 60 has static gas bearings 151a and 151b for transmitting to the second base plate 46B. Therefore, the reaction force of wafer stage WST (X-axis mover 76B, 76C) is canceled by the movement of stator unit 60 and second platen 46B. In this case, the mass of the second platen 46B and the like is large, so that the moving distance can be reduced as much as possible.

Further, according to the stage device 20 according to the present embodiment, the two position adjusting mechanisms 52 described above are used. A and 52B make it possible to return the Y-axis stators 62A and 62B in the Y-axis direction to a predetermined reference position, so it is necessary to increase the travel stroke of the Υaxis stators 62Α and 62Β. In other words, it is possible to reduce the size. In addition, since the position adjusting devices 52Α and 52Β use a part of the Υ-axis stators 62Α and 62Β as movers, there is no need to provide a magnetic pole unit (or armature unit) separately from the Υ-axis linear motor.

Further, according to stage device 20, it is possible to prevent the rotation of second platen 46 ° due to the reaction force when wafer stage WST is driven, by canceling mechanism 78 described above.

In addition, according to exposure apparatus 10 of the present embodiment, since stage control device 20 can improve the position controllability of wafer stage WST, wafer W held on wafer stage WST can be placed with high accuracy. It becomes possible to transfer the pattern of the reticle R.

Further, according to the exposure apparatus 10, the stage apparatus 20 employs a coarse / fine movement type configuration in the running direction, so that the synchronization accuracy between the reticle stage RST and the wafer stage WS during scanning exposure is improved. Exposure accuracy (such as overlay accuracy of a reticle pattern and a wafer) can also be improved in this regard.

[0139] In the above embodiment, two second bases are provided corresponding to the Υ-axis stator. The present invention is not limited to this. One second base may be used. In this case, for example, a frame-shaped surface plate surrounding the first surface plate 44 can be adopted as the second surface plate.

[0140] In the above embodiment, one of the two second platens 46Α, 46Β is supported by floating above the floor surface, and the other second platen 46 盤 is moved in the X-axis direction. The present invention is not limited to the case where the present invention is used as a countermass of any of the two second base plates 46Α and 46Β. Good les ,. Further, in this case, a configuration may be adopted in which the two second base plates 46 #, 46 # are connected by a predetermined connecting member, and the respective base plates move by the same amount. For example, two second surface plates 46Α and 46Β are connected by a predetermined connecting member or integrated into a frame-shaped surface plate surrounding the first surface plate 44, and this surface plate is placed on the floor F. It is also possible to adopt a configuration in which the robot can be supported by levitation so that it can move in the X-axis direction and the Υ-axis direction and rotate θ θ. This allows the second platen to function as a counter mass for the X-axis direction and the θζ direction. And the X-axis direction of this 2nd surface plate A drive device may be provided for adjusting the position of the lens and the position in the Y-axis direction and removing the θζ rotation. As this driving device, the same configuration as the above-described position adjusting mechanisms 52 #, 52 #, the voice control motor 80, the canceling mechanism 78, and the like can be used. Furthermore, the first base 44 and the second bases 46Α and 46Β can be integrated to function as a counter mass for the X-axis direction, the Υ-axis direction, and the θζ rotation.

[0141] Further, the second surface plates 46Α and 46Β are connected or integrated with a predetermined connecting member to form a frame member surrounding the first surface plate 44. The frame member has a に -axis linear motor 66Α Β 良 shaft stator (magnetic pole unit) of 66 mm. Then, the frame-shaped member is configured to float on the floor surface F so as to be movable in the X-axis direction and the Υ-axis direction and to be able to rotate θ X, and for the X-axis direction, the Υ-axis direction, and the θζ rotation. It may be made to function as the counter mass of the above. Also in this case, as described above, a driving device for adjusting the position of the frame-shaped member in the X-axis direction and the Υ-axis direction and removing the θ θ rotation may be provided. Further, the frame member and the first platen 44 are integrated so that the reaction force is transmitted to the first platen 44, and the first platen 44 is rotated in the X-axis direction, the Υ-axis direction, and θζ It is also possible to make it function as a countermass for this.

[0142] The offset mechanism 78 described in the above embodiment is an example, and in the stage apparatus of the present invention, the offset mechanism 78 is provided on a specific surface plate (the second surface plate 46B in the above embodiment). Various configurations can be adopted as the configuration of the canceling mechanism for canceling the rotational moment generated on the specific surface plate due to the action of the reaction force generated when the moving unit (unit) is driven in the X-axis direction.

That is, for example, a configuration as shown in FIG. 9 can be adopted (hereinafter, referred to as a first modified example). The stage device 20 'according to the first modified example shown in FIG. 9 has substantially the same configuration as the stage device 20 described above, but is provided with a canceling mechanism BM instead of the canceling mechanism 78. There is a characteristic in the point.

[0144] The offset mechanism BM includes a guide 181 provided on the + X side end of the second platen 46B and extending in the Y-axis direction, and a balance mass 182 engaged with the guide 181. Are provided. The balance mass 182 can be driven in the Y-axis direction along a guide 181 by a drive mechanism (not shown). The balance mass 182 is driven by the main controller 50 via the drive mechanism according to the position of the wafer stage WST in the Y-axis direction, and is generated when the wafer stage WST is driven in the axial direction. The control is performed so that the center of gravity of the system including the second base plate 46B and the canceling mechanism BM is located near the portion where the force is transmitted to the second base plate 46B. In other words, as shown in FIG. 10 (A), when the wafer stage is located near one side (+ Y side end) in the axial direction of the WST force, the balance mass 182 is also positioned at the + Y side end. As shown in FIG. 10 (B), when the wafer stage WST force is located near the other side (one Y side end) in the SY axis direction, the balance mass 182 is also located at the one Y side end. Is controlled.

[0146] As described above, according to stage device 20 'according to the first modification, regardless of the position (Y-axis direction position) of wafer stage WST, the reaction force caused by driving wafer stage WST in the X-axis direction is: Since the light is always transmitted to the vicinity of the center of gravity of the second base plate 46B, the second base plate 46B does not generate a tonole component, or can suppress the tongue component to a small amount.

[0147] The mass of the balance mass 182 constituting the canceling mechanism BM is determined by estimating the torque component generated in the second platen 46B and setting it to a value that can cancel the torque component. The drive amount is adjusted according to the mass of the balance mass 182.

[0148] Further, a stage device 20 "according to a second modified example having two actuators (reaction motors) 80A and 80B as shown in FIG. The stage device 20 "according to the second modified example may be employed instead of the stage device 20. In the stage device 20" according to the second modified example, the torque component of the second platen 46B due to the reaction force generated by driving the wafer stage WST is used. Canceling mechanism force to cancel This is composed of two actuators (reaction motors) 80A and 80B arranged on the + X side of the second platen 46B at predetermined intervals in the Y-axis direction.

The one actuator (reaction motor) 80A includes, for example, a mover 81A protruding in the vicinity of one Y-side end of the + X side of the second platen 46B, A voice coil motor including a stator 82A that generates a driving force in the X-axis direction by an electromagnetic interaction between the two can be used. In this case, the stator 82A is supported at a predetermined height from the floor F by the support member 83A.

[0150] The other actuator (reaction motor) 80B includes the above actuator (reactor). As in the case of 80A, the stator 82B supported by the support member 83B, the movable coil 81B protruding near the + Y side end of the + X side surface of the second platen 46B, and the voice coil motor formed by force. Can be used.

[0151] According to the stage device 20 "according to the second modification, the balance between the forces in the X-axis direction applied from the two actuators 80A, 80B to the second platens 46A, 46B is adjusted. As a result, it is possible to almost completely cancel the tonolech component generated on the second platen 46B due to the movement of the wafer stage WST.

[0152] The reaction force acting on the support members 83A and 83B by driving these two actuators 80A and 80B may be canceled, if necessary, using a counter mass having three degrees of freedom (not shown). Also good ,. It is also possible to use the functions of the voice coil motor 80 in combination with the two actuators 80A and 80B. That is, the two actuators 80A and 80B are not only used for canceling the torque component generated in the second base plate 46B, but as described above, the second base plate 46B and the stator unit 60 are located at or near the predetermined reference position. Good to use to move.

[0153] Further, a stage device 120 of a third modified example as shown in FIG. 12 may be employed instead of the above-described stage device 20. The stage device 120 of the third modified example is characterized in that the two reaction motors 115A and 115B arranged on the second base plate 46B constitute a canceling mechanism.

As shown in FIG. 12, one reaction motor 115A has a guide 114 fixed in the vicinity of the −Y end of the second platen 46B, with the X-axis direction as the longitudinal direction, and the guide 114 The stator unit 112 includes a movable part 113 provided inside the stator part 112 that can slide along the stator part 112.

[0155] The stator portion 112 includes a pair of masses 111A and 111B provided at predetermined intervals in the Z-axis direction, and a plurality of permanent magnets provided on a surface where the masses 111A and 111B face each other. And a stator unit (not shown). In this case, the mass 111B located below is brought into non-contact with the guide 114 and the second platen 46B via an air bearing or the like (not shown).

[0156] The mover 113 is composed of an armature unit including a plurality of armature coils inside. Inserted between the 111A and 11 IB. That is, the mover 113 is moved in the X-axis direction inside the stator portion 112 by an electromagnetic interaction between a current supplied to the armature coil of the mover 113 and a magnetic field formed by the stator unit. It is now driven.

That is, according to the reaction motor 115A configured as described above, when the mover 113 is driven in, for example, the + X direction, a reaction force generated by the drive acts on the stator portion 112, and the stator portion 112 is driven. The mover 112 moves in the direction opposite to the driving direction of the mover 113 (one X direction). Further, a reaction force in the + X direction due to the movement of the stator portion 112 acts on the second platen 46B. Therefore, a force in the + X direction acts on the second platen 46B. As described above, according to the reaction motor 115A, a force in the same direction as the driving direction of the mover 113 can be applied to the second base plate 46B.

[0158] The other reaction motor 115B is configured similarly to the above-described reaction motor 115A.

[0159] Therefore, according to the stage device 120 of the third modification, the balance of the reaction force transmitted from the two reaction motors 115A and 115B disposed on the second base plate 46B to the second base plate 46B, respectively. By adjusting the position, it is possible to cancel the torque component caused by the position and movement of wafer stage WST acting on second platen 46B. In this case, the masses and generated thrusts of the masses 111A and 111B of the stator portion 112 constituting the reaction motors 115A and 115B are determined based on the Y-axis position of the wafer stage WST and the torque component generated on the second platen 46B. By estimating the torque component, the torque component can be almost completely canceled.

The two reaction motors (115A, 115B) are provided on the second platen 46B. However, the present invention is not limited to this, and the reaction motors (115A, 115B) are not limited to this. It is good also as providing only one data.

[0161] In the above embodiment, a part of the Y-axis linear motor is also used as the mover of the position adjusting mechanism. However, the present invention is not limited to this, and a separate mover may be attached to the Y-axis stator. The good thing is, of course.

In the above embodiment, the voice coil motor is used as the position adjusting mechanism for returning the second platen to the predetermined position. However, another driving mechanism such as a linear motor may be used. Les ,.

In the above embodiment, a moving magnet type linear motor is used for the X-axis linear motor, and a moving coil type linear motor is used for the Y-axis linear motor. The present invention is not limited to this. Moving linear motors may be used for both linear motors, and moving magnet linear motors may be used for both. Also, the X-axis linear motor can be a moving coil type linear motor, and the Y-axis linear motor can be a moving magnet type linear motor.

[0164] In the above embodiment, the first drive mechanism is constituted by two X-axis linear motors and one Y-axis fine movement motor. The force W stage is moved in the first axis direction (for example, in the X axis direction). ) At a predetermined stroke, and in the second axis direction (for example, the Y axis direction) orthogonal to the first axis in a plane parallel to the moving plane of the wafer stage WST, and in the first axis and the second axis. The configuration is not limited to the configuration of the above-described embodiment as long as it is a driving mechanism that minutely drives around a third axis (for example, the Z axis) orthogonal to the above.

In the above embodiment, the force S described in the case where the Y-axis stator, and the X-axis stator and the second surface plate have a function as a counter mass is not limited thereto. It is not necessary to have the function as.

In the above embodiment, the wafer stage WST is supported by the hydrostatic gas bearing against the guide surface 44a of the first platen 44, and the stator unit 60 is mounted on the second platen 46A, 46B. Although the description has been given of the case where the one surface 146a, 146c is levitated and supported by the gas static pressure bearing, the present invention is not limited to this, and magnetic levitation or a mechanical guide may be adopted.

In the above embodiment, the case where the present invention is applied to a scanning stepper is described. However, the present invention is not limited to this, and a static exposure type exposure apparatus such as a step-and-repeat type stepper is used. Also applicable to

In the above embodiment, the case where the stage device of the present invention is applied to the stage device for holding a wafer of the exposure device has been described. However, the present invention is not limited to this. The stage device of the present invention can be suitably applied to precision machines other than the above.

An illumination optical system and a projection optical system composed of a plurality of lenses are assembled in an exposure apparatus main body. In addition to making optical adjustments, attach a reticle stage and a wafer stage consisting of many mechanical parts to the main body of the exposure apparatus, connect wiring and piping, and make comprehensive adjustments (electrical adjustment, operation confirmation, etc.). Accordingly, the exposure apparatus of the above embodiment can be manufactured. It is desirable that the manufacture of the exposure apparatus be performed using a clean frame whose temperature, cleanliness, etc. are controlled.

The present invention is not limited to an exposure apparatus for manufacturing a semiconductor, but also includes an exposure apparatus for transferring a device pattern onto a glass plate and a method for manufacturing a thin film magnetic head, which are used for manufacturing a display including a liquid crystal display element and the like. It can also be applied to an exposure apparatus used for manufacturing an exposure device that transfers a device pattern used for a semiconductor wafer onto a ceramic wafer, an imaging device (such as a CCD), a micromachine, an organic EL, a DNA chip, and the like. In addition, glass substrates or silicon wafers are used to manufacture reticles or masks used in optical exposure equipment, EUV exposure equipment, X-ray exposure equipment, electron beam exposure equipment, etc. that can only be used with micro devices such as semiconductor devices. The present invention can also be applied to an exposure apparatus that transfers a circuit pattern to a substrate. Here, a transmissive reticle is generally used in an exposure apparatus using DUV (far ultraviolet) light or VUV (vacuum ultraviolet) light, and the reticle substrate is quartz glass, fluorine-doped quartz glass, or fluorescent glass. Stone, magnesium fluoride, quartz, or the like is used. In a proximity type X-ray exposure apparatus or an electron beam exposure apparatus, a transmission mask (stencil mask, membrane mask) is used, and a silicon substrate is used as a mask substrate.

[0171] 《Device manufacturing method》

Next, an embodiment of a device manufacturing method using the above-described exposure apparatus in a lithographic process will be described.

FIG. 13 shows a flowchart of an example of manufacturing devices (semiconductor chips such as ICs and LSIs, liquid crystal panels, CCDs, thin-film magnetic heads, micromachines, and the like). As shown in FIG. 13, first, in step 201 (design step), a device function 'performance design (eg, a semiconductor device circuit design, etc.) is performed, and a pattern design for realizing the function is performed. . Subsequently, in step 202 (mask manufacturing step), a mask on which the designed circuit pattern is formed is manufactured. On the other hand, in step 203 (wafer manufacturing step) Then, a wafer is manufactured using a material such as silicon.

[0173] Next, in step 204 (wafer processing step), using the mask and wafer prepared in step 201-step 203, an actual circuit or the like is placed on the wafer by lithography technology or the like as described later. Form. Next, in step 205 (device assembly step), device assembly is performed using the wafer processed in step 204. Step 205 includes steps such as a dicing step, a bonding step, and a packaging step (chip sealing) as necessary.

[0174] Finally, in step 206 (verification step), the device created in step 205 is subjected to inspection such as an operation confirmation test and an endurance test. After these steps, the device is completed and shipped.

FIG. 14 shows a detailed flow example of step 204 in the semiconductor device. In FIG. 14, in step 211 (oxidation step), the surface of the wafer is oxidized. In step 212 (CVD step), an insulating film is formed on the wafer surface. In step 213 (electrode forming step), electrodes are formed on the wafer by vapor deposition. In step 214 (ion implantation step), ions are implanted into the wafer. Each of the above steps 211 to 214 constitutes a pre-processing step of each stage of the wafer processing, and is selected and executed according to a necessary process in each stage.

In each stage of the wafer process, when the above-described pre-processing step is completed, a post-processing step is executed as follows. In this post-processing step, first, in step 215 (resist forming step), a photosensitive agent is applied to the wafer. Subsequently, in step 216 (exposure step), the circuit pattern of the mask is transferred to the wafer by the lithography system (exposure apparatus) and the exposure method described above. Next, in step 217 (development step), the exposed wafer is developed, and in step 218 (etching step), the exposed members other than the portion where the resist remains are removed by etching. Then, in step 219 (resist removing step), the unnecessary resist after etching is removed.

[0177] By repeatedly performing these pre-processing steps and post-processing steps, multiple circuit patterns are formed on the wafer. When the device manufacturing method of the present embodiment described above is used, the exposure apparatus of the above embodiment is used in the exposure step (step 216), so that the reticle pattern can be accurately transferred onto the wafer. it can. As a result, the yield of highly integrated microdevices can be improved, and the productivity can be improved.

Industrial applicability

As described above, the stage device of the present invention is suitable for moving a stage on which an object is placed in a two-dimensional plane. Further, the exposure apparatus of the present invention is suitable for transferring a pattern formed on a mask onto a photosensitive object. Further, the device manufacturing method of the present invention is suitable for producing a highly integrated microdevice.

Claims

The scope of the claims

[1] a stage on which the object is placed;

The stage is driven by a predetermined stroke in the first axial direction by electromagnetic interaction between the mover unit provided on the stage and the mover unit, and the stage is moved in a plane parallel to the moving surface of the stage. A first drive having a stator unit extending in the first axis direction, which is finely driven in a second axis direction orthogonal to the first axis and around a third axis orthogonal to the first axis and the second axis. Mechanism and;

A pair of first movers provided at one end and the other end of the stator unit in the first axial direction, respectively, and a first movable corresponding to each of the first movers by electromagnetic interaction between the first movers. A second drive mechanism having a pair of first stators for generating a driving force for driving the stator unit in the second axial direction integrally with the stator;

A first surface plate on which a guide surface for guiding the stage is formed;

The first platen is vibratedly separated from the first platen, a support surface for supporting the stator unit in the third axial direction is formed, and at least one first support for supporting each of the pair of first stators is formed. A stage device comprising: a surface plate;

[2] The stage device according to claim 1,

The stator unit and the mover unit are configured to allow the relative position of the first surface plate and the second surface plate in the third axial direction to change during the operation of the stage. A stage device wherein an interval in a third axis direction is set.

[3] The stage device according to claim 1,

The stator unit includes a second stator extending in the first axial direction, and a second stator extending in the first axial direction disposed on one side and the other side in the second axial direction. An extended pair of third stators,

The mover unit includes a second mover that generates a driving force for minutely driving the stage in the second axial direction by electromagnetic interaction with the second stator, and the pair of third stators. And a pair of third movers that respectively generate a driving force for driving the stage in the first axial direction by performing an electromagnetic interaction individually between the stage and the stage.

[4] The stage device according to claim 1,

The stage device, comprising: a stage main body provided with the mover unit; and a table that holds the object on the stage main body and can be minutely driven at least in the third axis direction. .

[5] The stage device according to claim 1,

The second drive mechanism is characterized in that each of the first movers is composed of an armature unit, and each of the first stators is composed of a magnetic pole unit. And stage equipment.

[6] The stage device according to claim 1,

A first bearing mechanism provided on the stage so as to face the guide surface, and supporting the stage without contacting the guide surface;

A second bearing mechanism provided on the stator unit so as to face the support surface of the second platen, and supporting the stator unit in non-contact with the support surface. .

[7] The stage device according to claim 1,

A stage device wherein each of the first stators is allowed to move at least in the second axial direction in a state where frictional force between the first stator and the second platen is substantially zero;

[8] The stage device according to claim 7,

A stage device further comprising two position adjusting mechanisms for adjusting the position of each of the first stators in the second axial direction.

[9] The stage device according to claim 8,

The second drive mechanism includes a pair of moving coil type linear motors each having a magnetic pole unit as a stator,

The stage device, wherein each of the position adjusting mechanisms uses a part of the magnetic pole unit as a mover.

[10] The stage device according to claim 1,

The stator unit has substantially no frictional force between the stage and the guide surface. In the state, the relative movement at least in the first axis direction is allowed.

[11] The stage device according to claim 10,

The second surface plate is provided as a pair corresponding to the pair of first stators, and at least one specific surface plate of the pair of second surface plates is movable with respect to the floor surface,

A stage apparatus further comprising a transmission mechanism for transmitting a reaction force generated when the mover unit is driven in the first axis direction to the specific surface plate via the stator unit.

[12] The stage device according to claim 11, wherein

A stage device further provided with an offset mechanism provided on the specific surface plate for canceling a rotational moment generated on the specific surface plate due to the action of the reaction force.

[13] The stage device according to claim 12,

The offset mechanism is driven by electromagnetic interaction between a stator fixed on the specific surface plate and the stator, and is a reaction force in a direction to cancel the rotation of the specific surface plate due to the rotational moment. A stage device having a mover that generates a force.

[14] The stage device according to claim 13,

The offset mechanism drives the mover in a predetermined direction by a predetermined amount according to a position of the first mover in the second axis direction and a drive amount of the stage in the first axis direction. A stage device.

[15] a stage on which the object is placed;

A pair of first movers provided at one end and the other end of the stator unit in the first axial direction, respectively, and a first movable corresponding to each of the first movers by electromagnetic interaction between the first movers. A second drive mechanism having a pair of first stators that generate driving force for driving the stator unit in the second axial direction integrally with the stator. A stage device, wherein each of the first stators is supported while being allowed to move at least in the second axial direction.

[16] The stage device according to claim 15,

The stage device, wherein the stator unit is allowed to move relative to the stage at least in the first axial direction while frictional force between the stages is substantially zero.

[17] The stage device according to claim 15,

A stage device further comprising a first position adjusting mechanism for adjusting a position of at least one of the first stators in the first axial direction.

[18] The stage device according to claim 15,

A stage device further comprising a second position adjusting mechanism for adjusting a position of each of the first stators in the second axial direction.

[19] The stage device according to claim 15,

At least one of the first stators is supported movably in the first axis direction by a reaction force generated when the stator unit is driven in the first axis direction. Stage equipment.

[20] The stage device according to claim 19,

A stage device further comprising an offset mechanism for offsetting a rotational moment generated in at least one of the first stators due to the action of the reaction force.

[21] The stage device according to claim 19,

A first surface plate supporting the stage;

A second surface plate supporting each of the pair of first stators, at least one of which is movable with respect to the floor;

A transmission mechanism for transmitting a reaction force generated when the mover unit is driven in the first axial direction to the at least one second platen via the stator unit.

[22] The stage device according to claim 21, wherein

The rotational moment generated in the at least one second platen due to the action of the reaction force is A stage device further provided with an offset mechanism for offsetting.

[23] The stage device according to claim 22, wherein

The canceling mechanism is driven by electromagnetic interaction between the stator and the stator fixed on the at least one second platen; and the at least one second platen is driven by the rotating moment. A mover for generating a reaction force in a direction to cancel the rotation of the stage.

[24] An exposure apparatus for transferring a pattern formed on a mask onto a photosensitive object,

24. An exposure apparatus comprising the stage device according to claim 11, wherein the photosensitive object is mounted on the stage as the object.

[25] The exposure apparatus according to claim 24,

A projection optical system for projecting the pattern onto the photosensitive object;

A mask stage on which the mask is mounted;

A synchronous moving device that synchronizes the mask stage with the stage and relatively moves with respect to the projection optical system in the second axis direction.

[26] A device manufacturing method including a lithographic process,

25. A device manufacturing method, wherein in the lithographic process, exposure is performed using the exposure apparatus according to claim 24.