JP2003133204A - Stage apparatus and exposure apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve the position controllability of a stage body by eliminating an effect of a reaction force brought by movement even when the stage body moves in a plurality of directions. SOLUTION: First and second stators are disposed such that the first stator is moved by a reaction force caused by movements of the stage bodies 14A and 14B in a first direction, and the first and second stators are moved by a reaction force caused by the movements of the stage bodies 14A and 14B in a second direction.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a stage apparatus in which a stage main body holding a substrate moves in a plurality of directions, and an exposure apparatus which performs an exposure process using a mask and a substrate held by the stage apparatus. In particular, the present invention relates to a stage apparatus and an exposure apparatus suitable for use in a lithography process when manufacturing devices such as semiconductor integrated circuits and liquid crystal displays.

[0002]

2. Description of the Related Art Conventionally, in a lithography process, which is one of manufacturing processes of semiconductor devices, a wafer to which a circuit pattern formed on a mask or a reticle (hereinafter referred to as a reticle) is coated with a resist (photosensitive agent). Alternatively, various exposure apparatuses that transfer onto a substrate such as a glass plate are used. For example, as an exposure apparatus for a semiconductor device, a reticle pattern is formed on a wafer by using a projection optical system according to the miniaturization of the minimum line width (device rule) of the pattern accompanying the recent high integration of integrated circuits. A reduction projection exposure apparatus that performs reduction transfer is mainly used.

This reduction projection exposure apparatus is a step-and-repeat static exposure reduction projection exposure apparatus (so-called stepper) for sequentially transferring a reticle pattern onto a plurality of shot areas (exposure areas) on a wafer.
Or an improved version of this stepper.
No. 043 publication and the like, a reticle and a wafer are synchronously moved in a one-dimensional direction to transfer a reticle pattern to each shot area on the wafer. A step-and-scan type scanning exposure type exposure apparatus (so-called Scanning stepper) is known.

In these reduction projection exposure apparatuses, as a stage device, a base plate serving as a reference of the device is first installed on the floor surface, and a reticle stage and a wafer are mounted on the base plate via a vibration isolation table for blocking floor vibration. A main body column that supports a stage, a projection optical system (projection lens), and the like is often used. In a recent stage device, an air mount whose internal pressure is controllable, an actuator such as a voice coil motor, and the like are attached to the main body column (main frame) as the vibration isolation table.
For example, an active anti-vibration stand is used that controls the vibration of the main body column by controlling the voice coil motor and the like based on the measured values of six accelerometers.

However, in the above stepper or the like, after exposing a certain shot area on the wafer, the other shot areas are successively exposed, so that the wafer stage (in the case of a stepper) or the reticle stage and The reaction force generated by the acceleration and deceleration movements of the wafer stage (in the case of a scanning stepper) causes a vibration of the main body column, which causes a relative position error between the projection optical system and the wafer.

The above-mentioned relative position error at the time of alignment or exposure causes image blur (pattern line width) when a pattern is transferred to a position different from the design value on the wafer or the position error includes a vibration component. However, there is an inconvenience that it may cause an increase in

Therefore, in order to suppress such inconvenience,
It is necessary to sufficiently damp the vibration of the main body column using the above-mentioned active vibration isolation table or the like. For example, in the case of a stepper, it is necessary to wait for the wafer stage to be positioned at a desired position and be sufficiently settled before starting the alignment operation and the exposure operation. Further, in the case of a scanning stepper, it is necessary to perform exposure with a sufficient synchronization settling between the reticle stage and the wafer stage being ensured. Therefore, it has been a factor of deteriorating the throughput (productivity).

In order to improve such inconvenience, the reaction force generated by the movement of the wafer stage is mechanically floored by using a frame member, as described in, for example, Japanese Patent Laid-Open No. 8-166475. There is an invention of releasing to the ground (ground) or an invention of mechanically releasing the reaction force generated by the movement of the reticle stage to the floor (ground) by using a frame member, as described in, for example, JP-A-8-330224. Are known.

[0009]

However, the conventional stage apparatus and exposure apparatus as described above have the following problems. With the recent increase in the size of reticles and wafers, both stages have increased in size, and even when the inventions described in JP-A-8-166475 and JP-A-8-330224 are used, the floor side is transmitted through the frame member. The frame member itself vibrates due to the reaction force that escapes to, or the reaction force that escapes to the floor is transmitted to the main body column (main body) that holds the projection optical system via the vibration isolation table and vibrates it. So-called swinging back may occur. Therefore, it is difficult to perform high-precision exposure while ensuring throughput to some extent.

Therefore, for example, Japanese Unexamined Patent Publication No. 8-63231 discloses a technique in which a stage main body which is floated and supported on a base and a drive frame are provided, and the drive frame is retracted by a reaction force accompanying the forward movement of the stage main body. Has been done. According to this technique, the law of conservation of momentum acts between the stage body and the drive frame, and the position of the center of gravity of the device on the base is maintained, so that the influence of vibration on the frame member can be reduced. However, in the above stepper and scanning stepper, the stage moves in two directions of the X direction and the Y direction. Therefore, with respect to the movement in one direction, even if the drive frame moves and the influence of the reaction force can be removed, The influence of the reaction force cannot be excluded with respect to the movement in the direction.

The present invention has been made in consideration of the above points, and even when the stage body moves in a plurality of directions, the influence of the reaction force due to the movement is eliminated to eliminate the influence of the stage body. It is an object of the present invention to provide a stage device that improves position controllability, and an exposure device that can perform highly accurate exposure using a stage device that has excellent position controllability.

[0012]

In order to achieve the above object, the present invention employs the following configurations associated with FIGS. 1 to 5 showing an embodiment. The stage device of the present invention has a stage device (14A, 14B) that moves in a first direction (X axis direction) and a second direction (Y axis direction) different from the first direction (X axis direction) ( WS
In (T), the stage main body (14A, 14) has the first mover (24A, 24B) and the first stator (25).
B) has a first drive device (22A, 22B) for driving in the first direction (X-axis direction), a second mover (21b) and a second stator (21a), and has a stage body (14A, 14
B) is driven in the second direction (Y-axis direction) with a second drive device (21A, 21B), and the stage body (14A,
14B) moves the first stator (25) by the reaction force generated by the movement of the stage main body (14A, 14B) in the second direction (Y-axis direction). Arranging the first stator (25) and the second stator (21a) so that the first stator (25) and the second stator (21a) are moved by the reaction force generated by the movement. It is a feature.

Therefore, in the stage device of the present invention, the first
The drive devices (22A, 22B) are activated to operate the first mover (2
4A, 24B) moves in the first direction (X-axis direction) together with the stage body (14A, 14B), the first stator (25) moves along the first direction (X-axis direction) due to the reaction force associated with this movement. Move in the opposite direction to the stage body (14A, 14B). In addition, the second drive device (21A, 21B) is activated and the second mover moves to the stage body (14A, 14B).
When the second stator (21a) and the first stator (25) are moved in the second direction (Y-axis direction) along with the second main body (21a) and the first stator (25) by the reaction force caused by the movement, 14A, 14B). for that reason,
The stage body (14A, 14B) is in the first direction or the second
In any of the directions, the influence of the reaction force due to the movement can be eliminated.

Further, in the exposure apparatus of the present invention, the pattern of the mask (R1) held on the mask stage (RST) is set on the substrate (W1, W1) held on the substrate stage (WST).
2) in an exposure apparatus for exposing the mask stage (R
The stage device (WST) according to any one of claims 1 to 6 is used as at least one of the ST) and the substrate stage (WST).

Therefore, in the exposure apparatus of the present invention, the mask stage (RST) or the substrate stage (WST) is the first.
In either direction (X-axis direction) or second direction (Y-axis direction), the influence of the reaction force due to the movement can be eliminated, and the mask (R1) or the substrate (W1, W2) can be eliminated.
The position controllability with respect to is improved. Therefore, the mask (R
The alignment accuracy between 1) and the substrates (W1, W2) is improved, and highly accurate exposure can be performed.

[0016]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of a stage apparatus and an exposure apparatus of the present invention will be described below with reference to FIGS. Here, as the exposure apparatus, a step-and-scan method or a step-and-stitch method is used in which the circuit pattern of the semiconductor device formed on the reticle is transferred onto the wafer while the reticle and the wafer are moved synchronously. An example of using a scanning exposure type exposure apparatus will be described. Further, in this exposure apparatus, the stage device of the present invention is applied to the wafer stage.

FIG. 1 is a schematic configuration diagram of an exposure apparatus. Most of the exposure apparatus shown in this figure is installed, for example, in a clean room on a floor 1 of a semiconductor manufacturing factory, and an exposure light source 3 is installed on a floor 2 in a semi-clean room of a machine room below that floor.

The exposure light IL as an exposure beam emitted from the exposure light source 3 at the time of exposure is guided to the floor 1 through the beam matching unit (BMU) 4. The exposure light IL emitted from the BMU 4 is set on the floor 1 and
It is incident on the first illumination system 5 including a beam shaping optical system, an optical integrator (uniformizer or homogenizer) for uniforming the illuminance distribution, a light quantity monitor, a variable aperture stop, a relay lens system and the like.

The exit surface of the first illumination system 5 is almost conjugate with the pattern surface of the reticle as the object to be illuminated, and the movable field diaphragm 6A is arranged on this exit surface. The movable field stop 6A plays a role of opening and closing the field of view so that a pattern other than the original circuit pattern is not exposed at the start and end of the scanning exposure for each shot area of the wafer as the substrate to be exposed. Since the first illumination system 5 in which the movable field diaphragm 6A that may generate vibration when opening and closing the field of view is arranged is supported separately from the exposure main body, the exposure accuracy (superposition) in the exposure main body Accuracy, transfer accuracy, etc.) are improved.

The movable field stop 6A not only opens and closes the field of view at the start and end of the scanning exposure, that is, changes the width of the field of view in the scanning direction, but also prior to the scanning exposure, changes the circuit pattern of the transfer target. The width of the field of view in the non-scanning direction can be changed according to the size in the non-scanning direction.

Exposure light IL which has passed through the movable field stop 6A
Is the second illumination system 7 attached to the column of the exposure main body.
Light incident surface, that is, the fixed field stop 6B arranged on the surface defocused by a predetermined amount from the reticle pattern surface. The fixed field stop 6B has an opening for defining an illumination area on the pattern surface of the reticle as an elongated slit-shaped area in the non-scanning direction orthogonal to the scanning direction. The exposure light IL that has passed through the fixed field stop 6B is
The illumination area on the pattern surface of the reticle R1 as a mask is illuminated through the relay lens system, the mirror for bending the optical path, the condenser lens system, and the like in the illumination system 7.

Under the exposure light IL, the pattern image in the illumination area of the reticle R1 is projected through the projection optical system PL at a projection magnification β (β is 1/4 times or 1/5 times), It is projected onto a slit-shaped exposure region on the wafer W1 (or W2) as a substrate coated with the photoresist. In this state, the pattern image of the reticle R1 is transferred to one shot area on the wafer W1 by synchronously moving the reticle R1 and the wafer W1 in the predetermined scanning direction with the projection magnification β as the speed ratio. Here, the wafers W1 and W2 are, for example, semiconductors (such as silicon) or SOI (Silicon On Ins).
It is a disk-shaped substrate such as an ulator).

As the projection optical system PL, for example, Japanese Patent Application No.
No. 0-370143 or Japanese Patent Application No. 11-66769, a plurality of refracting lenses are arranged along one optical axis, and two concave mirrors each having an opening near the optical axis are arranged. Straight tube type catadioptric system configured by
It is possible to use a straight-tube type refracting system or the like configured by disposing refracting lenses along one optical axis. Further, a twin-tube type catadioptric type may be used as the projection optical system PL. Hereinafter, the Z axis is taken parallel to the optical axis AX of the projection optical system PL, and the reticle R1 and the wafer W1 at the time of scanning exposure in a plane perpendicular to the Z axis (which substantially coincides with the horizontal plane in this embodiment). The X-axis is taken along the non-scanning direction (the left-right direction of the paper surface of FIG. 1) orthogonal to the scanning direction of FIG.
The Y-axis will be taken along the direction (perpendicular to the paper surface) of FIG.
That is, in the present invention, the first direction is the X-axis direction and the second direction is the Y-axis direction.

First, the overall structure of the exposure main body including the reticle stage (mask stage) RST that supports the reticle R1, the projection optical system PL, and the wafer stage (substrate stage, stage device) WST that supports the wafers W1 and W2. explain.

Located on the floor 1 at the apex of a substantially equilateral triangle 3
The base plate 12 having high rigidity is installed via the vibration-isolating bases 11A, 11B, and 11C at some locations.
An electric level 9A is installed above. Vibration isolation table 1
Each of 1A to 11C is an active type that includes a mechanical damper such as an air damper or a hydraulic damper that withstands a large weight and an electromagnetic damper including an electromagnetic actuator such as a voice coil motor. It is a vibration isolation device. As an example, three vibration-isolating bases 11A are provided so that the inclination angle (the inclination angle around two axes) of the upper surface of the base plate 12 detected by the level 9A falls within an allowable range.
The electromagnetic dampers in 11C are driven, and the air pressure or hydraulic pressure of the mechanical dampers is controlled as necessary. In this case, the mechanical damper damps high-frequency vibrations from the floor before they are transmitted to the exposure body, and the remaining low-frequency vibrations are damped by the electromagnetic dampers. Instead of the spirit level 9A (similarly for other spirit levels), for example, a detector or the like for detecting the inclination of an optically corresponding member may be used.

On the upper surface of the base plate 12, three first columns 59A are arranged so as to be located at the vertices of a substantially equilateral triangle.
59B and 59C (59C is not shown) are fixed, and a support plate 66 having an opening for passing the exposure light IL in the center is fixed to the upper surfaces of the first columns 59A to 59C. A support plate 68 is fixed on the support plate 66 via a spacer 67, and the second illumination system 7 is attached to the support plate 68. Further, in the convex portions 60A, 60B, 60C (60C not shown) fixed to the inner surfaces of the first columns 59A to 59C, variable mount portions 61A, 61B, 61C (61C not shown) as attitude control members, respectively. Is fixed. As the variable mount portions 61A to 61C,
It is possible to use a piezoelectric element such as a piezo element, or a drive element that has a large rigidity and can be expanded and contracted in the Z direction at a high response speed (eg, an amplitude of about several μm and a frequency of about 10 Hz to 1 kHz) like a magnetostrictive element. is there. In addition, as the variable mount portions 61A to 61C, a drive mechanism that performs displacement in the Z direction by a small cam mechanism can also be used.

A reticle base 62 as a base member is fixed on the variable mount portions 61A to 61C, and an opening for passing the exposure light IL is formed in the central portion of the reticle base 62. The upper surface of the reticle base 62 is processed into a guide surface having extremely good flatness, and a fine movement stage 63 as a movable stage on the reticle side is smoothly and two-dimensionally slidably mounted on the guide surface via an air bearing. Placed. The reticle R1 is held on the fine movement stage 63 by vacuum suction or the like. Another reticle R2 (not shown) is held in a region adjacent to the reticle R1 on the fine movement stage 63 in the scanning direction, and is configured such that double exposure or the like can be efficiently performed.

Further, an electric level 9D is installed at the end of the guide surface of the reticle base 62. As an example, the inclination angle of the guide surface detected by the level 9D with respect to the horizontal plane (around two axes). That is, the expansion / contraction amounts (or displacement amounts) of the three variable mount portions 61A to 61C are controlled so that the inclination angles around the X-axis and the Y-axis) fall within the allowable range. At this time, since it is sufficient to control the tilt angle around the two axes at a minimum, for example, three variable mount portions 61 are provided.
One of A to 61C may be a spacer whose height is fixed.

Further, a rectangular frame-shaped coarse movement stage 64 is arranged so as to surround the fine movement stage 63, and a pair of Y axes are arranged in parallel along the Y direction on the bottom surface of the support plate 66 above it. Drive devices 65YA and 65YB are attached. A coarse movement stage 64 is connected to the Y-axis drive devices 65YA and 65YB. The coarse movement stage 64 is not in contact with the reticle base 62, and the coarse movement stage 64 and the fine movement stage 63 move the fine movement stage 63 with respect to the coarse movement stage 64 in a predetermined narrow range in the X direction and the Y direction.
They are connected via an actuator that drives a minute amount in the rotational and rotational directions. Then, the Y-axis drive device 65Y
A and 65YB are the coarse movement stage 64 by the linear motor method.
Is moved in the + Y direction and the −Y direction alternately at a constant speed.

That is, the coarse movement stage 64 includes the support plate 6
While being held so as to be suspended from 6, the fine movement stage 63 is driven at a constant speed in the Y direction, and the fine movement stage 63 is relatively moved with respect to the coarse movement stage 64 so as to correct the remaining synchronization error. Driven. The two-dimensional position and rotation angle of the fine movement stage 63, and the position of the coarse movement stage 64 in the Y direction are measured with high accuracy by a laser interferometer (not shown), and the position of the fine movement stage 63 is measured based on this measurement result. And the speed is controlled.
In the present embodiment, reticle stage device RST is composed of reticle base 62, fine movement stage 63, coarse movement stage 64 and the like.

Next, on the upper surface of the base plate 12, inside the first columns 59A, 59B and 59C (59C is not shown), three second columns 5 are provided at the positions of the vertices of a substantially equilateral triangle.
1A, 51B, 51C (51C is not shown) is fixed,
On the upper surfaces of the second columns 51A to 51C, variable mount parts 52A, 52B, 52C as attitude control members are respectively provided.
(52C is not shown) is fixed. The variable mount portions 52A to 52C are the variable mount portions 61A described above.
A drive element using a piezoelectric element or the like similar to the above, or a cam type drive mechanism can be used.

A support plate 53 as a base member is fixed on the variable mount portions 52A to 52C. The projection optical system PL is installed in the U-shaped cutout portion provided in the support plate 53 via the flange portion 54, and the open end of the cutout portion is closed by the cover 55. Also,
An electric level 9B is installed at the end of the upper surface of the support plate 53, and as an example, the inclination angle (inclination around two axes) of the upper surface detected by the level 9B with respect to the horizontal plane is within an allowable range. 3 variable mount parts 52A-
The expansion / contraction amount (or displacement amount) of 52C is controlled. Also in this case, since it is only necessary to control the tilt angles around the two axes at a minimum, one of the three variable mount portions 52A to 52C may be a spacer having a fixed height.

Further, between the flange portion 54 which holds the projection optical system PL and the support plate 53, there are three substantially equal angular intervals.
A piezoelectric element such as a piezo element or a magnetostrictive element as an attitude control member is provided at a location and has high rigidity in the Z direction (optical axis AX
A drive element 56 that is expandable and contractible is attached in the direction (1).
An electric level 9C is installed at the end of the upper surface of the flange 54, and as an example, the inclination angle (inclination angle around two axes) of the upper surface detected by the level 9C with respect to the horizontal plane is 3 drive elements 5 to fit within the allowable range
The expansion / contraction amount of 6 is controlled. Also in this case, since it is only necessary to control the tilt angles around the two axes at a minimum, one of the three driving elements 56 may be a spacer whose height is fixed. Thus, in addition to the variable mount parts 52A to 52C for suppressing the vibration of the support plate 53, the projection optical system P
Since the drive element 56 for suppressing the vibration of L itself is provided, the vibration of the cylindrical projection optical system PL is highly suppressed, and the imaging characteristics are maintained well.

Further, in order to perform wafer alignment, alignment sensors 38A and 38B of off-axis imaging type are fixed to the side surfaces of the lower end of the projection optical system PL in the −X direction and the + X direction. . Although not shown, a reticle alignment microscope is arranged on the bottom surface of the support plate 66 located above the reticle R1 for aligning the reticle.

Further, three second columns 51A, 51B, 51C (51C is not shown) are provided on the upper surface of the base plate 12.
The wafer stage WST is
Is installed. The wafer stage WST includes a surface plate 13, movable stages (stage bodies) 14A and 14B,
Sample stands (wafer holders) 15A and 15B, and scan linear motors (second drive devices) 21A and 2 shown in FIG.
1B, step linear motor (first drive device) 22A,
This is a double stage system mainly composed of 22B. For example, the wafer W2 can be exchanged and aligned on the movable stage 14B side during scanning exposure of the wafer W1 on the movable stage 14A side.

The surface plate 13 is fixed on the base plate 12, and the upper surface thereof is processed into a guide surface having extremely good flatness. On this guide surface, a movable stage 14A is levitationally supported so as to be smoothly slidable via an air bearing and movable along a guide bar 23A extending in the Y direction. A first sample table (wafer holder) 15A is placed on the movable stage 14A.
The first wafer W1 is held on 5A by vacuum suction or the like.

The sample stage 15A can be finely moved in the X-direction, the Y-direction, and the rotation directions around the Z-axis with respect to the movable stage 14A, and the displacement in the Z-direction and the rotation around the two-axes for performing the leveling and focusing. It is configured so that it can be tilted (that is, around the X axis and the Y axis).

A movable stage 14 is mounted on the surface plate 13.
A movable stage 14B together with A is slidable via an air bearing, and a guide bar 23 extends in the Y direction.
It is floatably supported along B. The wafer W2 is held on the movable stage 14B by vacuum suction or the like via a sample stage 15B for leveling and focusing.

The scan linear motor 21A drives the movable stage 14A in the Y direction which is the scanning direction (scanning direction), and as shown in FIG. 3, the stator (embedded in the guide bar 23A ( 2nd stator) 21a
And a movable element (second movable element) 21b provided on the movable stage 14A and driven in the Y direction by electromagnetic interaction with the stator 21a. Similarly,
The scan linear motor 21B drives the movable stage 14B in the Y direction, and includes a stator (second stator; not shown) embedded in the guide bar 23B and a stator provided on the movable stage 14B. And a mover (second mover; not shown) driven in the Y direction by an electromagnetic interaction between the two.

The step linear motor 22A drives the movable stage 14A in the X direction, which is the step movement direction, and as shown in FIG. 3, a mover (first movable member) provided at both ends of the guide bar 23A. Child) 24A, 24A
And extending in the X direction on one side surface of the counter masses 26, and protrudingly provided so as to face the mover 24A.
It is composed of stators (first stators) 25, 25 for driving the movers 24A, 24A in the X direction by electromagnetic interaction with A, 24A. Similarly, the step linear motor 22B drives the movable stage 14B in the X direction, and includes movers (first movers) 24B and 24B provided at both ends of the guide bar 23B and counter masses 26 and 26. And the movable elements 24B, 24B by electromagnetic interaction with the movable elements 24B, 24B.
It is composed of the stators 25 and 25 for driving B in the X direction. That is, the stators 25, 25 function as stators for both the movers 24A, 24B.
The EI core (electromagnet) 3 is sandwiched between the -Y side counter mass 26 and the -Y side movers 24A and 24B.
4A and 34B are provided.

The counter masses 26, 26 are mounted on both sides of the base plate 12 in the Y direction on the surface plates 27, 27 via air bearings (not shown) such as air pads, and XY.
It is levitationally supported so as to be movable along a plane.
A rectangular guide hole 28 is formed through each counter mass 26 along the X direction. A frame member 29 having a rectangular cross section is inserted through the guide hole 28 to guide the movement of the counter masses 26, 26 in the X direction.

The frame member 29 is used for the movable stage 14
Guides 29X and 29X extending along the X direction and guides 29Y and 29Y extending along the Y direction are operated as counter masses when A and 14B move in the Y direction. And are formed in a rectangular shape in a plan view connected to each other in a rectangular shape (see FIG. 2).
Guide portions 29X, 29X are movably inserted in the guide holes 28 of the.

Further, the guide portion 29 of the frame member 29
Y and 29Y are inserted into the holding members 30 and 30.
The holding members 30, 30 are fixed to both sides in the X direction on the base plate 12, and like the counter masses 26, 26, rectangular guide holes 31, 31 are formed along the Y direction, respectively. The guide portions 29Y, 29Y are movably held in the guide holes 31, 31.

On the other hand, the frame member 29 includes a step trim motor (motion amount correction device) 32 and a scan trim motor (second motion amount correction device, rotation correction device).
33 is provided. The step trim motor 32 is
The counter mass 26 is driven in the X direction with respect to the guide part 29X to correct the movement amount (momentum) of the counter mass 26, and the guide part 29X of the frame member 29,
29X are provided so that they can be independently driven.

The scan trim motor 33 has the holding member 3
The frame member 29 is driven in the Y direction with respect to 0 to correct the movement amount (momentum amount) of the frame member 29 (and the counter mass 26). The guide portions 29Y and 29Y of the frame member 29 are independent of each other. It is provided so that it can be driven.

A movable mirror 35 extending in the Y direction and a movable mirror 36 extending in the X direction are fixed to the side edges of the sample table 15A. Then, the laser interferometer 37 irradiates the measuring beam toward the reflecting surface of the movable mirror 35, and the reflected light is received to measure the relative displacement with respect to the reference surface, whereby the movable stage 14A (and thus the wafer W).
The position in the X direction of 1) is measured with high accuracy. Further, laser interferometers 39A and 39B, which are arranged at a predetermined interval in the X direction, respectively irradiate the measuring surface with respect to the reflecting surface of the movable mirror 36, and at the same time, receive the reflected light to the reference surface. By measuring the relative displacement, the position of the movable stage 14A (and thus the wafer W1) in the Y direction and the position in the θZ (rotation around the Z axis) direction are measured with high accuracy. Although not shown, the movable stage 14B
A laser interferometer for measuring the X-direction position, the Y-direction position, and the θZ-direction position of (the wafer W2) is separately provided.

Further, the laser interferometers 40A and 40B irradiate the measurement beams on the -X side end faces of the counter masses 26 and 26, respectively, and the reflected light is received to measure the relative displacement with respect to the reference plane. Thus, the position in the X direction is measured with high accuracy for each counter mass 26. Further, laser interferometers 41A and 41B, which are arranged at a predetermined interval in the X direction, respectively irradiate a measurement beam to the -Y side guide portion 29Y of the frame member 29 and receive the reflected light thereof. By measuring the relative displacement with respect to the reference surface, the position of the frame member 29 in the Y direction and the position of the θZ direction are measured with high accuracy.

FIG. 4 is a control block diagram of the present exposure apparatus. As shown in this figure, laser interferometers 37, 39A,
The measurement results of 39B, 40A, 40B, 41A, and 41B are output to the control unit 42. The control unit 42 controls the scan linear motors 21A and 21B that drive the movable stages 14A and 14B and the step linear motors 22A and 22B based on the input measurement results, and the step trim motor that drives the counter masses 26 and 26. Three
2. Control the scan trim motor 33 that drives the frame member 29.

Next, of the exposure apparatus having the above structure, the operation of wafer stage WST will be described first. For example, the step linear motor 22A operates to move the mover 24.
When the movable stage 14A moves in the + X direction together with the sample stage 15A (and the wafer W1) due to the relative movement of A with respect to the stator 25, the counter masses 26, 26 are guided by the frame member 29 by the reaction force due to this movement. Part 2
Using 9X as a guide, move relative to the -X direction.

Here, when the friction between the movable stage 14A and the surface plate 13, between the guide portion 29X and the counter mass 26, and between the counter mass 26 and the surface plate 27 is zero, the momentum is saved. In principle, the counter masses 26, 26 are movable on the movable stage 14A side (sample table 15).
A, wafer W1, movable mirrors 35 and 36, guide bar 23A
(Including etc.) and move according to the weight ratio.

However, since the mover 24A and the stator 25 are coupled to each other, when they move relative to each other, a force to stop them at the original position acts. The mover 24A moves to a predetermined position because the laser interferometer 37 measures the position of the movable stage 14A and a predetermined voltage is applied to the coil of the linear motor 22A.
5 (ie counter mass 26) will stop before reaching the position to be moved. Therefore, in the present embodiment, the control unit 42 drives the step trim motors 32, 32 based on the measurement results of the laser interferometers 40A, 40B so that the counter masses 26, 26 reach a predetermined position. , The movement amount (movement amount) of the counter masses 26, 26 is corrected.

As a result, the reaction force of the movable stage 14A during acceleration and deceleration in the X direction is absorbed by the movement of the counter masses 26, 26, and the momentum given to the base plate 12 theoretically becomes zero, and the position of the center of gravity of the wafer stage WST is determined. Are substantially fixed in the X direction. The step linear motor 22B operates to move the movable stage 14B.
Also moves in the X direction.

On the other hand, when the scan linear motor 21A operates to move the movable stage 14A together with the sample stage 15A (and the wafer W1) in the + Y direction, for example, the reaction bar due to this movement causes the guide bar 23 having the stator 21a.
A, the counter masses 26, 26, and the frame member 2
9 relatively moves in the −Y direction along the guide hole 31 of the holding member 30. In this case as well, the control unit 42 controls the laser interferometer 4
By driving the scan trim motors 33 and 33 based on the measurement results of 1A and 41B, the frame member 29 is moved so that the frame member 29 (and the guide bar 23A and the counter masses 26 and 26) reaches a predetermined position. Correct the amount.

Further, as shown in FIG. 2, the movable stage 14A is connected to the frame member 29 (that is, the base plate 1).
If it is eccentric to the center of 2), the movable stage 1
A rotational moment about the Z axis is applied to the frame member 29 with the movement of 4A. Therefore, the control unit 42 individually controls the drive of the scan trim motors 33, 33 according to the position of the movable stage 14A to correct this moment. Specifically, as shown in FIG. 2, the movable stage 1
When 4A is located on the −X side of the center of the frame member 29, a larger reaction force is applied to the −X side of the frame member 29. Therefore, the control unit 42 controls the movable stage 14A.
Depending on the position of, the −X side trim motor 33 is driven with a larger force than the + X side trim motor 33 to correct the moment applied to the frame member 29.

As a result, the reaction force of the movable stage 14A during acceleration / deceleration in the Y direction is absorbed by the movement of the frame member 29 (and the guide bar 23A and the counter masses 26, 26), and the momentum given to the base plate 12 is theoretical. Becomes zero, and the position of the center of gravity on wafer stage WST is substantially fixed also in the Y direction. Further, it is possible to avoid applying a moment about the Z axis to the base plate 12. The same operation is performed when the scan linear motor 21B operates and the movable stage 14B moves in the Y direction.

As described above, in wafer stage WST, even if movable stages 14A and 14B move in either the scan movement direction or the step movement direction,
It is possible to absorb the reaction force caused by the movement and suppress the occurrence of vibration.

Subsequently, the two movable stages 14A, 14
The parallel processing by B will be described. In the present embodiment, for example, the movable stage 14A (that is, the sample table 15)
During the exposure operation of the upper wafer W1 via the projection optical system PL, the wafer is exchanged on the movable stage 14B, and the alignment operation and the auto focus / auto leveling are performed subsequent to the wafer exchange.

While the above-mentioned wafer exchange and alignment operations are being performed on the movable stage 14B side, on the movable stage 14A side, two reticles R1 and R2 (R2 is not shown) are used to change the exposure conditions. However, double exposure is continuously performed by the step-and-scan method. Two
In the exposure sequence and the wafer exchange / alignment sequence which are performed in parallel on the two movable stages 14A and 14B, the wafer stage that has been completed first is in a waiting state, and when both operations are completed, the movable stage 14A and
14B is controlled to move. The wafer W1 on the movable stage 14A for which the exposure sequence has been completed is subjected to wafer exchange at the loading position, and the wafer W2 on the movable stage 14B (that is, the sample table 15B) for which the alignment sequence has been completed is under the projection optical system PL. The exposure sequence is performed.

As described above, while the wafer exchange and the alignment operation are performed on one movable stage side, the exposure operation is performed on the other movable stage side, and when both operations are completed, the mutual operation is performed. By switching, the throughput can be significantly improved.

In the stage apparatus and the exposure apparatus of this embodiment, when the movable stages 14A and 14B move in the X direction, the counter masses 26 and 26 move by their reaction force,
When the movable stages 14A and 14B move in the Y direction, the guide bars 23A and 23B having the stator 21a, the counter masses 26 and 26, and the frame member 29 move due to the reaction force thereof. Also, it is possible to prevent the adverse effects of the reaction force due to the movement of the movable stages 14A and 14B, such as the occurrence of vibration, from reaching the base plate 12, the surface plate 13, and the like. Therefore, the movable stages 14A and 14B
Position controllability is improved, and it is possible to perform highly accurate exposure processing.

Further, in the prior art, although the counter masses 26, 26 and the frame member 29 may not reach a predetermined position in the reaction force movement due to the coupling between the stator and the mover, in the present embodiment, the control unit is used. Since 42 corrects these momentums via the step trim motor 32 and the scan trim motor 33, the relation of conservation of momentum is maintained and movement of the center of gravity in wafer stage WST can be prevented.

Further, in the present embodiment, by controlling the driving of the scan trim motors 33, 33 individually, it is possible to correct the rotational moment generated in the frame member 29 according to the positions of the movable stages 14A, 14B. It is possible to avoid applying a moment about the Z axis to the base plate 12 and the surface plate 13.

Further, since the exposure apparatus of the present embodiment adopts the double stage system in which two movable stages are provided, while performing the wafer exchange and the alignment operation on one movable stage side, The waiting time can be reduced by performing the exposure operation on the other movable stage side, and the throughput can be greatly improved.

In the above embodiment, the counter masses 26, 26 have a square cross section and the frame member 29 has a rectangular cross section. However, the present invention is not limited to this, and is shown in FIG. 5, for example. As described above, the counter mass 26 having an E-shaped cross section and the frame member 29 having a U-shaped cross section may be combined. In this figure, the same components as those of the embodiment shown in FIGS. 2 and 3 are designated by the same reference numerals.

Further, in the above embodiment, the example of the double stage type in which two movable stages are provided is used, but the present invention is not limited to this, and one movable stage or three or more movable stages are provided. It may be configured to be. Also,
In the above-described embodiment, the stage device of the present invention is applied to wafer stage WST, but the present invention is not limited to this and can be applied to reticle stage RST.

Further, in the above embodiment, the stage device of the present invention is applied to the wafer stage of the exposure apparatus. However, in addition to the exposure apparatus, a transfer mask drawing apparatus, a mask pattern position coordinate measuring apparatus, etc. It can also be applied to precision measuring equipment.

As the substrate of this embodiment, not only the semiconductor wafers W1 and W2 for semiconductor devices but also glass substrates for liquid crystal display devices, ceramic wafers for thin film magnetic heads, or exposure apparatuses are used. A mask or reticle master plate (synthetic quartz, silicon wafer) or the like is applied.

As the exposure apparatus, the reticles R1 and R2 and the wafers W1 and W2 are moved synchronously to move the reticles R1 and R2.
Step-and-scan type scanning exposure device that scans and exposes the pattern (scanning stepper; US
P5,473,410), a step-and-repeat type projection exposure apparatus (stepper) that exposes the patterns of the reticles R1 and R2 while the reticle R and the wafers W1 and W2 are stationary, and sequentially moves the wafer W in steps. ) Can also be applied to.

The types of exposure apparatus are wafers W1 and W.
2 is not limited to an exposure apparatus for manufacturing a semiconductor device that exposes a semiconductor device pattern to an exposure apparatus for manufacturing a liquid crystal display element, an exposure apparatus for manufacturing a thin film magnetic head, an image sensor (CCD), a reticle, or the like. Is also widely applicable.

Further, as a light source of exposure illumination light, a bright line (g line (436 nm), h
Line (404.7 nm), i line (365 nm)), KrF
Not only excimer laser (248 nm), ArF excimer laser (193 nm) and F ₂ laser (157 nm), but also charged particle beams such as X-rays and electron beams can be used. For example, when an electron beam is used, thermionic emission type lanthanum hexaboride (LaB ₆ ) or tantalum (Ta) can be used as the electron gun. Further, when the electron beam is used, the reticle R may be used, or the pattern may be directly formed on the wafer without using the reticle R. Alternatively, a high frequency wave such as a YAG laser or a semiconductor laser may be used.

The magnification of the projection optical system PL may be not only a reduction system but also a unity magnification system or an enlargement system. As the projection optical system PL, a material that transmits far ultraviolet rays such as quartz or fluorite is used as a glass material when using deep ultraviolet rays such as an excimer laser, and a catadioptric system when using F ₂ laser or X-rays. A refraction-type optical system is used (a reticle R also uses a reflection type), and when an electron beam is used, an electron optical system including an electron lens and a deflector may be used as the optical system. Needless to say, the optical path through which the electron beam passes is in a vacuum state.

A linear motor (USP5,623,853 or USP5,528,1) is used for wafer stage WST and reticle stage RST.
18)), either an air levitation type using an air bearing or a magnetic levitation type using Lorentz force or reactance force may be used. Further, each stage WST, RST may be a type that moves along a guide, or may be a guideless type that does not have a guide. Further, the step trim motor 32 and the scan trim motor 33 may be provided with or without a guide.

As a driving mechanism of each stage WST, RST, a magnet unit (permanent magnet) having a two-dimensionally arranged magnet and an armature unit having a two-dimensionally arranged coil are opposed to each other, and each stage WST, A planar motor that drives the RST may be used. In this case, one of the magnet unit and the armature unit is connected to the stage WS.
It is connected to T and RST, and the other side of the magnet unit and armature unit is the moving surface side (base) of the stages WST and RST.
Should be provided in.

As described above, the exposure apparatus according to the embodiment of the present application has various subsystems including the constituent elements recited in the claims of the present application, with predetermined mechanical accuracy, electrical accuracy, and
It is manufactured by assembling so as to maintain optical accuracy. Before and after this assembly, adjustments to achieve optical precision for various optical systems, adjustments to achieve mechanical precision for various mechanical systems, and various electrical systems to ensure these various types of precision are made. Are adjusted to achieve electrical accuracy. The process of assembling the exposure apparatus from the various subsystems includes mechanical connection, electrical circuit wiring connection, air pressure circuit pipe connection, and the like between the various subsystems. It goes without saying that there is an individual assembly process for each subsystem before the assembly process from these various subsystems to the exposure apparatus. When the process of assembling the various subsystems into the exposure apparatus is completed, comprehensive adjustment is performed to ensure various accuracies of the exposure apparatus as a whole. It is desirable that the exposure apparatus be manufactured in a clean room where the temperature and cleanliness are controlled.

Microdevices such as semiconductor devices are
As shown in FIG. 6, step 201 of designing the function / performance of the microdevice, step 202 of manufacturing a mask (reticle) based on this design step, step 203 of manufacturing a wafer from a silicon material, and the step of the above-described embodiment. It is manufactured through an exposure processing step 204 of exposing a reticle pattern onto a wafer by an exposure apparatus, a device assembly step (including a dicing step, a bonding step, a packaging step) 205, an inspection step 206, and the like.

[0076]

As described above, in the stage device according to the first aspect, the first stator is moved by the reaction force generated by the movement of the stage body in the first direction, and
The first stator and the second stator are arranged so that the first stator and the second stator are moved by the reaction force generated by the movement of the stage main body in the second direction.
As a result, in this stage device, even if the stage body moves in either the first direction or the second direction, the adverse effect of the reaction force due to the movement is eliminated, and the position controllability of the stage body is improved. Is obtained.

In the stage apparatus according to the second aspect, the momentum correcting device corrects the momentum of the first stator during movement based on the momentum of the stage body during movement. As a result, in this stage device, even when the stage body moves in the first direction, the effect of preserving the momentum is maintained and the movement of the center of gravity can be prevented.

According to the third aspect of the present invention, the stage device guides the first stator which is moved by the reaction force generated by the movement of the stage body in the first direction, and is guided by the reaction force generated by the movement of the stage body in the second direction. It is configured to have a frame member that moves together with the first stator and the second stator. As a result, in this stage device, the frame member guides the first stator and moves in the second direction along with the first stator and the second stator, thereby eliminating the adverse effect of the reaction force due to the movement. The effect that the position controllability of the stage body is improved is obtained.

In the stage device according to the fourth aspect, the second momentum correction device is configured to correct the momentum when the frame member moves based on the momentum when the stage body moves. As a result, in this stage apparatus, even when the stage main body moves in the second direction, the effect of preserving the momentum is maintained and the movement of the center of gravity can be prevented.

In the stage device according to the fifth aspect, the second momentum correction device corrects the rotation of the frame member around the axis extending in the direction substantially orthogonal to the first direction and the second direction based on the position of the stage body. It is configured to do. As a result, in this stage device, it is possible to obtain the effect that it is possible to avoid applying a rotational moment to the base plate and the surface plate.

In the stage apparatus according to the sixth aspect, a plurality of stage bodies are provided so as to be movable independently of each other. As a result, this stage device has the effect of significantly improving throughput.

According to a seventh aspect of the present invention, the stage device according to any one of the first to sixth aspects is used as at least one of the mask stage and the substrate stage. As a result, in this stage apparatus, even if the stage body moves in either the first direction or the second direction, the adverse effect of the reaction force due to the movement is eliminated, and the position controllability of at least one of the mask and the substrate is eliminated. As a result, the effect that a highly accurate exposure process is realized can be obtained.

[Brief description of drawings]

FIG. 1 is a diagram showing an embodiment of the present invention, which is a schematic configuration diagram of an exposure apparatus.

FIG. 2 is a plan view of a wafer stage that constitutes the exposure apparatus.

FIG. 3 is a sectional view of FIG.

FIG. 4 is a control block diagram of the exposure apparatus.

FIG. 5 is a partial cross-sectional view showing another embodiment of the wafer stage.

FIG. 6 is a flowchart showing an example of a semiconductor device manufacturing process.

[Explanation of symbols]

R1 reticle (mask) W1, W2 wafer (substrate) RST reticle stage (mask stage) WST wafer stage (substrate stage, stage device) 14A, 14B movable stage (stage body) 21A, 21B scan linear motor (second drive device) 22A, 22B step linear motor (first drive device) 24A, 24B mover (first mover) 25 stator (first stator) 29 frame member 32 step trim motor (momentum correction device) 33 scan trim motor (first 2 momentum correction device,
Rotation correction device)

   ─────────────────────────────────────────────────── ─── Continued front page    F term (reference) 2F078 CA02 CA08 CB09 CB12 CB13                       CC11                 5F031 CA02 CA05 HA13 HA55 HA57                       JA02 JA06 KA06 LA08 MA27                       PA18 PA30                 5F046 BA04 BA05 CC01 CC02 CC19

Claims (7)

[Claims] 1. A stage device having a stage body that moves in a first direction and a second direction different from the first direction, the stage device having a first mover and a first stator, A first drive device that drives in one direction, a second drive device that includes a second mover and a second stator, and drives the stage body in the second direction, The first stator is moved by the reaction force generated by the movement in one direction, and the first stator and the second stator are moved by the reaction force generated by the movement of the stage body in the second direction. The first stator and the second stator are arranged so as to move the stage device. 2. The stage apparatus according to claim 1, further comprising a momentum correction device that corrects the momentum of the first stator during movement based on the momentum of the stage body during movement. apparatus. 3. The stage apparatus according to claim 1, wherein the first stator is moved by a reaction force generated by the movement of the stage main body in the first direction, and the second stator of the stage main body is guided. A stage device comprising: a frame member that moves together with the first stator and the second stator by a reaction force generated by movement in a direction. 4. The stage device according to claim 3, further comprising a second momentum correction device that corrects the momentum of the frame member during movement based on the momentum of the stage body during movement. Stage device. 5. The stage device according to claim 4, wherein the second momentum correction device is based on a position of the stage main body and is configured around an axis extending in a direction substantially orthogonal to the first direction and the second direction. A stage device for correcting the rotation of the frame member. 6. The stage device according to claim 1, wherein a plurality of the stage bodies are provided so as to be movable independently of each other. 7. An exposure apparatus for exposing a pattern of a mask held by a mask stage onto a substrate held by a substrate stage, wherein at least one of the mask stage and the substrate stage is used as a stage. An exposure apparatus, wherein the stage device described in any one of the above is used.