WO2004038913A1 - 平衡−不平衡型マルチバンドフィルタモジュール - Google Patents
平衡−不平衡型マルチバンドフィルタモジュール Download PDFInfo
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- WO2004038913A1 WO2004038913A1 PCT/JP2003/013718 JP0313718W WO2004038913A1 WO 2004038913 A1 WO2004038913 A1 WO 2004038913A1 JP 0313718 W JP0313718 W JP 0313718W WO 2004038913 A1 WO2004038913 A1 WO 2004038913A1
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Classifications
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
- H04B1/005—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission adapting radio receivers, transmitters andtransceivers for operation on two or more bands, i.e. frequency ranges
- H04B1/0053—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission adapting radio receivers, transmitters andtransceivers for operation on two or more bands, i.e. frequency ranges with common antenna for more than one band
- H04B1/0057—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission adapting radio receivers, transmitters andtransceivers for operation on two or more bands, i.e. frequency ranges with common antenna for more than one band using diplexing or multiplexing filters for selecting the desired band
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P1/00—Auxiliary devices
- H01P1/10—Auxiliary devices for switching or interrupting
- H01P1/15—Auxiliary devices for switching or interrupting by semiconductor devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P1/00—Auxiliary devices
- H01P1/20—Frequency-selective devices, e.g. filters
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P1/00—Auxiliary devices
- H01P1/20—Frequency-selective devices, e.g. filters
- H01P1/213—Frequency-selective devices, e.g. filters combining or separating two or more different frequencies
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P5/00—Coupling devices of the waveguide type
- H01P5/08—Coupling devices of the waveguide type for linking dissimilar lines or devices
- H01P5/10—Coupling devices of the waveguide type for linking dissimilar lines or devices for coupling balanced lines or devices with unbalanced lines or devices
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H11/00—Networks using active elements
- H03H11/02—Multiple-port networks
- H03H11/32—Networks for transforming balanced signals into unbalanced signals and vice versa, e.g. baluns
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H11/00—Networks using active elements
- H03H11/02—Multiple-port networks
- H03H11/34—Networks for connecting several sources or loads working on different frequencies or frequency bands, to a common load or source
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H7/00—Multiple-port networks comprising only passive electrical elements as network components
- H03H7/01—Frequency selective two-port networks
- H03H7/0123—Frequency selective two-port networks comprising distributed impedance elements together with lumped impedance elements
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H7/00—Multiple-port networks comprising only passive electrical elements as network components
- H03H7/42—Networks for transforming balanced signals into unbalanced signals and vice versa, e.g. baluns
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H7/00—Multiple-port networks comprising only passive electrical elements as network components
- H03H7/46—Networks for connecting several sources or loads, working on different frequencies or frequency bands, to a common load or source
- H03H7/463—Duplexers
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders or supports
- H03H9/0538—Constructional combinations of supports or holders with electromechanical or other electronic elements
- H03H9/0566—Constructional combinations of supports or holders with electromechanical or other electronic elements for duplexers
- H03H9/0571—Constructional combinations of supports or holders with electromechanical or other electronic elements for duplexers including bulk acoustic wave [BAW] devices
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders or supports
- H03H9/0538—Constructional combinations of supports or holders with electromechanical or other electronic elements
- H03H9/0566—Constructional combinations of supports or holders with electromechanical or other electronic elements for duplexers
- H03H9/0576—Constructional combinations of supports or holders with electromechanical or other electronic elements for duplexers including surface acoustic wave [SAW] devices
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
- H04B1/005—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission adapting radio receivers, transmitters andtransceivers for operation on two or more bands, i.e. frequency ranges
- H04B1/0053—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission adapting radio receivers, transmitters andtransceivers for operation on two or more bands, i.e. frequency ranges with common antenna for more than one band
- H04B1/006—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission adapting radio receivers, transmitters andtransceivers for operation on two or more bands, i.e. frequency ranges with common antenna for more than one band using switches for selecting the desired band
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
- H04B1/38—Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
- H04B1/40—Circuits
- H04B1/403—Circuits using the same oscillator for generating both the transmitter frequency and the receiver local oscillator frequency
- H04B1/406—Circuits using the same oscillator for generating both the transmitter frequency and the receiver local oscillator frequency with more than one transmission mode, e.g. analog and digital modes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15313—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a land array, e.g. LGA
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
Definitions
- the present invention relates to a balanced-unbalanced multiband filter module used in a high-frequency circuit for a multi-pand communication device such as a mobile phone that can use different access methods.
- TDMA Time Division Multiple Access
- the main communication methods that adopt this TDMA method are PDC (Personal Digital Cellular) in Japan, GSM (Global System for Mobile Communications) mainly in Europe and DCS1800 (Digital Cellular System 1800), mainly in the United States. PCS (Personal Communications Service) etc.
- CDMA Code Division Multiple Access
- a typical standard is the IS-95 (Interim Standard-95) centered on the United States, which is also serviced in the PCS (Personal Communications Service) frequency band.
- W-CDMA Wideband CDMA
- W-CDMA Wideband CDMA
- the frequency passband combining the bandpass filters 20a, 20 and the phase shifters 40a, 40b, 70a, 70b is 950 MHz and 1.9 GHz.
- a frequency splitter 200 is disclosed.
- high-frequency components are used in high-frequency circuits of multiband mobile phones, it has been found that there are several problems.
- a conventional high-frequency component 200 is used for a transmission-side circuit and a reception-side circuit to form a high-frequency circuit for a multiband mobile phone, for example, the circuit shown in FIG.
- Figure 21 shows a dual-band mobile phone that can use two communication systems: GSM850 (transmission frequency 824 to 849 MHz, reception frequency 869 to 894 MHz) and GSM900 (transmission frequency 880 to 915 MHz, reception frequency 925 to 960 MHz).
- GSM850 transmission frequency 824 to 849 MHz, reception frequency 869 to 894 MHz
- GSM900 transmission frequency 880 to 915 MHz, reception frequency 925 to 960 MHz.
- the high frequency circuit is shown.
- the receiving side circuit includes balanced high-frequency components (low noise amplifier 266, mixer 268, etc.) having two signal lines in order to lower the noise figure and increase the receiving sensitivity. For this reason, a balanced-unbalanced conversion circuit is required to connect the high-frequency component and the low-noise amplifier. Further, the input impedance of the low noise amplifier 266 is set to about 50 ⁇ to 300 ⁇ , and an impedance conversion circuit is required. Therefore, it is conceivable to use balanced-unbalanced conversion transformers (Parans) 262 and 263 as circuit elements having functions of a balanced-unbalanced conversion circuit and an impedance conversion circuit.
- balanced high-frequency components low noise amplifier 266, mixer 268, etc.
- the switching of the connection between the antenna 269 and the transmission / reception circuit is generally performed by the switch circuit 264.
- the switch circuit 264 a GaAsFET or a diode is used as a switching element.
- leakage (isolation) of high-frequency signals between the transmitter circuit and the receiver circuit occurs at about 20 to 30 dB. Therefore, high-frequency signals leak into the mutual circuits, albeit slightly.
- GSM850 and GSM900 When extremely close frequency bands are used in the communication system, the reception frequency band and the transmission frequency band overlap as shown in Fig. 22.
- the reception signal of GSM850 is input to the low noise amplifier 266 via the bandpass filter 252 that is in contact with it.
- the GSM850 received signal from the antenna is input to the amplifier 265 via the bandpass filter 251 that handles the GSM900 transmission signal. In either case, the call quality is degraded.
- a first object of the present invention is to provide a balanced-unbalanced multipand filter module that can cope with a plurality of communication methods and access methods and suppresses an increase in insertion loss.
- the second object of the present invention is to pass a high frequency signal of a communication method or access method to be handled in a multi-pand mobile phone of a communication method or access method using a very close frequency band.
- the high-frequency signal of the system is to provide a balanced-unbalanced multipand filter module that blocks.
- a third object of the present invention is to provide a small high-frequency component having such a balanced / unbalanced multiband filter module.
- a fourth object of the present invention is to provide a multi-pand cellular phone having a powerful balanced-unbalanced multi-band filter module. Disclosure of the invention
- the first balanced-unbalanced multiband filter module of the present invention includes three high-frequency switches each having a switching element, and two balanced-unbalanced bandpass filters having different pass frequency bands. ,
- the first high frequency switch includes a first port connected to the unbalanced port of the module, a second port connected to the unbalanced port of the first balanced-unbalanced bandpass filter, and a second balanced unbalanced. Unbalanced port of balanced bandpass filter And a third port to connect with
- a second high-frequency switch comprising: a first port connected to the first balanced port of the module; a second port connected to the first balanced port of the first balanced-unbalanced bandpass filter; A third port connected to the first balanced port of the one unbalanced bandpass filter;
- a third high-frequency switch a first port connected to the second balanced port of the module; a second port connected to the second balanced port of the first balanced-unbalanced bandpass filter; -A third port connected to the second balanced port of the unbalanced bandpass filter,
- the first to third high-frequency switches are switched according to the high-frequency signal passing through, and the high-frequency signal input to the unbalanced port of the module is output from the first and second balanced ports, or the first And a high-frequency signal input to the second balanced port is output from the unbalanced port of the module.
- the second balanced-unbalanced multi-pan filter module of the present invention includes two balanced-unbalanced bandpass filters having different pass frequency bands and six balanced / unbalanced bandpass filters connected to the balanced-unbalanced bandpass filter.
- a phase shifter
- the first phase shifter has a first port connected to the unbalanced port of the module, and a second port connected to the unbalanced port of the first balanced-unbalanced bandpass filter,
- the second phase shifter has a first port connected to the unbalanced port of the module, and a second port connected to the unbalanced port of the second balanced-unbalanced bandpass filter,
- the third phase shifter has a first port connected to the first balanced port of the first balanced one-unbalanced bandpass filter, and a second port connected to the first balanced port of the module.
- the fourth phase shifter has a first port connected to the second balanced port of the first balanced-unbalanced bandpass filter, and a second port connected to the second balanced port of the module.
- the fifth phase shifter is the first balanced position of the second balanced-unbalanced bandpass filter.
- a first port connected to the first port, and a second port connected to the first balanced port of the module,
- the sixth phase shifter has a first port connected to the second balanced port of the second balanced-unbalanced bandpass filter, and a second port connected to the second balanced port of the module.
- a high frequency signal input to the unbalanced port of the module is output from the first and second balanced ports, or a high frequency signal input to the first and second balanced ports is output from the unbalanced port of the module.
- Balanced-unbalanced multipand filter module characterized by output.
- the first, third, and fourth phase shifters are connected to the first balanced-unbalanced bandpass filter and passed through the second bandpass filter.
- the impedance when the first balanced-unbalanced bandpass filter side is viewed from the unbalanced port or the second and second balanced ports of the module is high impedance.
- the second, fifth and sixth phase shifters are connected to the second balanced one-unbalanced bandpass filter, and in the pass frequency band of the first bandpass filter, The impedance seen from the second balanced port to the second balanced-unbalanced bandpass filter is high impedance.
- Fig. 19 (a) is a Smith chart showing an example of impedance characteristics seen from the balanced port of a balanced-unbalanced bandpass filter
- Fig. 19 (b) is an unbalanced graph of the balanced-unbalanced bandpass filter.
- This is a Smith chart showing an example of the impedance characteristics seen from the balanced port.
- This balanced and unbalanced bandpass filter is a SAW filter with the GSM850 as the pass frequency band.
- the marker indicates the frequency
- marker 1 is 869 MHz
- marker 2 is 894 MHz
- marker 3 is 925 MHz
- marker 4 is 960 MHz
- the GSM850 reception frequency band is between markers 1 and 2.
- the space between cars 3 is the GSM900 reception frequency band.
- the impedance of the balanced port is in the region of approximately 50 ⁇ in the GSM850 reception frequency band.
- the impedance is almost open (high impedance )
- the impedance of the unbalanced port is in the region of 50 ⁇ in the GSM850 reception frequency band, and in the region outside the open area in the GSM900 reception frequency band.
- the shaded area from the right end is the open area.
- the impedance of the balanced port is almost open in the GSM900 reception frequency band, so it does not substantially absorb high-frequency signals in the GSM900 reception frequency band. Very little if any.
- the phase adjuster is used to adjust the phase so that the impedance of the unbalanced port is almost open.
- the phase shifter is formed of a transmission line having a line length that is almost open (high impedance), or a single pass filter or a high pass filter having an inductance element and a capacitance element.
- the inductance element of the one-pass filter is formed of a transmission line, the line length can be shortened compared to the case where the phase shifter is formed of only the transmission line.
- the high-frequency signal that should pass through the first balanced-unbalanced bandpass filter is prevented from leaking to the second balanced-unbalanced bandpass filter, and the second balanced- The high-frequency signal that should pass through the unbalanced band-pass filter is prevented from leaking to the first balanced one-unbalanced band-pass filter, and high isolation characteristics can be obtained, so that the insertion loss characteristics are not impaired. .
- a third balanced-unbalanced multi-pan filter module includes a high-frequency switch having a switching element, two balanced single-unbalanced bandpass filters having different pass frequency bands, and the balanced-unbalanced band. With four phasers connected to the pass filter,
- the high frequency switch is connected to a first port connected to the unbalanced port of the module, and to an unbalanced port of the first balanced-unbalanced bandpass filter.
- a second port and a third port connected to the unbalanced port of the second balanced-unbalanced bandpass filter;
- the first phase shifter has a first port connected to the first balanced port of the first balanced-unbalanced bandpass filter, and a second port connected to the first balanced port of the module.
- the second phase shifter has a first port connected to the second balanced port of the first balanced-unbalanced bandpass filter, and a second port connected to the second balanced port of the module.
- the third phase shifter has a first port connected to the first balanced port of the second balanced-unbalanced bandpass filter, and a second port connected to the first balanced port of the module.
- the fourth phase shifter has a first port connected to the second balanced port of the second balanced one-unbalanced bandpass filter, and a second port connected to the second balanced port of the module.
- the first high-frequency switch is switched according to the high-frequency signal passing through, and the high-frequency signal input to the unbalanced port of the module is output from the first and second balanced ports, or the first and second balanced ports are A high-frequency signal input to the port is output from the unbalanced port of the module.
- the first and second phase shifters are connected to the first balanced-unbalanced bandpass filter and balanced in the pass frequency band of the second bandpass filter.
- the first and second phase shifters may be constituted by a single-pass filter or a high-pass filter having an inductance element and a capacitance element.
- the third and fourth phase shifters are connected to the second balanced-unbalanced bandpass filter, and the first and second balanced-unbalanced multiband filter modules are connected in the pass frequency band of the first bandpass filter.
- the impedance when looking at the second balanced one-unbalanced bandpass filter side from the two balanced ports becomes high impedance.
- the transmission line has a long line length.
- the third and fourth phase shifters may be constituted by a single-pass filter or a high-pass filter having an inductance element and a capacitance element, similarly to the first and second phase shifters.
- the fourth balanced-unbalanced multi-band filter module of the present invention includes two high-frequency switches having switching elements, two balanced-unbalanced band-pass filters having different pass frequency bands, and the balanced-unbalanced filter module.
- the first phase shifter has a first port connected to the unbalanced port of the module, and a second port connected to the unbalanced port of the first balanced-unbalanced bandpass filter,
- the second phase shifter has a first port connected to the unbalanced port of the module, and a second port connected to the unbalanced port of the second balanced-unbalanced bandpass filter,
- the first high-frequency switch includes a first port connected to the first balanced port of the module, a second port connected to the first balanced port of the first balanced one-unbalanced bandpass filter, and a second balanced -A third port connected to the first balanced port of the unbalanced bandpass filter,
- a second high-frequency switch comprising: a first port connected to the second balanced port of the module; a second port connected to the second balanced port of the first balanced-unbalanced bandpass filter; -A third port connected to the second balanced port of the unbalanced bandpass filter,
- the first and second high-frequency switches are switched according to the high-frequency signal passing through, and the high-frequency signal input to the unbalanced port of the module is output from the first and second balanced ports, or the first And a high-frequency signal input to the second balanced port is output from the unbalanced port of the module.
- the first phase shifter is connected to the first balanced-unbalanced bandpass filter, and is balanced-unbalanced in the pass frequency band of the second bandpass filter.
- Impedance of the balanced multi-pan filter module as seen from the unbalanced port side of the first balanced-unbalanced bandpass filter Is formed of a transmission line having a line length such that becomes high impedance.
- the first phase shifter may be constituted by an mouth pass filter or a high pass filter having an inductance element and a capacitance element.
- the second phase shifter is connected to the second balanced-unbalanced bandpass filter, and is connected to the first balanced band-unbalanced multiband filter module from the unbalanced port in the pass frequency band of the first bandpass filter. It is formed of a transmission line having a line length such that the impedance seen from the two balanced-unbalanced bandpass filter side is high impedance.
- the second phase shifter may be composed of a single-pass filter or a high-pass filter having an inductance element and a capacitance element, like the first phase shifter.
- the first and second balanced-unbalanced bandpass filters have different input impedance Zi and output impedance Zo, and thus have an impedance conversion function. Is preferred.
- the output impedance Zo is preferably larger than the input impedance Zi.
- the output impedance Zo is preferably smaller than the input impedance Zi.
- the bandpass filter may be composed of an LC circuit of an inductance element and a capacitance element, but is preferably a SAW (Surface Acoustic Wave) filter or an FBAR (Film Bulk Acoustic Resonator) filter, and those with different input and output impedances. More preferred.
- SAW Surface Acoustic Wave
- FBAR Fin Bulk Acoustic Resonator
- the first to fourth balanced-unbalanced multiband filter modules are constituted by a laminate composed of a plurality of dielectric layers having electrode patterns, and at least a part of the phase shifter and the high-frequency switch is formed on the electrode pattern.
- the balanced line-unbalanced band-pass filter (SAW filter, FBAR filter, etc.) and the switching element constituting the high-frequency switch are mounted on the laminate.
- An inductance element and a capacitance element constituting the phase shifter and Z or the high-frequency switch can also be formed on the dielectric layer by an electrode pattern.
- other high frequency components such as other high frequency switches and filters,
- a width device, a duplexer, a duplexer, and the like may be integrally formed in the laminate.
- the multi-band mobile phone of the present invention is characterized by comprising a high-frequency circuit having first to fourth balanced-unbalanced multi-band filter modules.
- FIG. 1 is a schematic view showing a filter module of the present invention.
- FIG. 2 is a block diagram showing a filter module according to one embodiment of the present invention
- FIG. 3 is a block diagram showing a filter module according to another embodiment of the present invention.
- FIG. 4 is a block diagram showing a filter module according to still another embodiment of the present invention.
- FIG. 5 is a block diagram showing a filter module according to still another embodiment of the present invention.
- FIG. 6 is a diagram showing an example of an equivalent circuit of a high-frequency switch used in the finalore module of the present invention.
- FIG. 7 is a diagram showing another example of an equivalent circuit of a high-frequency switch used in the filter module of the present invention.
- FIG. 8 is a diagram showing another example of an equivalent circuit of a high-frequency switch used in the filter module of the present invention.
- FIG. 9 is a diagram showing another example of an equivalent circuit of a high-frequency switch used in the filter module of the present invention.
- FIG. 10 is a diagram showing still another example of an equivalent circuit of a high-frequency switch used in the filter module of the present invention.
- FIG. 11 (a) is a perspective view showing the surface of the filter module according to one embodiment of the present invention.
- FIG. 11 (b) is a perspective view showing the back surface of the filter module according to one embodiment of the present invention.
- FIG. 12 is an exploded view of a multilayer substrate constituting a filter module according to an embodiment of the present invention.
- FIG. 13 is a diagram showing an equivalent circuit of a filter module according to an embodiment of the present invention.
- FIG. 14 is an exploded view of a multilayer substrate constituting a filter module according to an embodiment of the present invention.
- FIG. 15 is a block diagram showing a high-frequency circuit for a multiband mobile phone having a filter module according to another embodiment of the present invention.
- FIG. 16 is a block diagram showing a high-frequency circuit of a multi-pand mobile phone having a filter module according to an embodiment of the present invention.
- Fig. 17 is a block diagram showing the SPT5T switch used for a multi-pand mobile phone.
- FIG. 18 is a diagram showing an equivalent circuit of a high-frequency circuit for a multiband mobile phone including a filter module according to an embodiment of the present invention.
- Figure 19 (a) is a Smith chart showing the impedance characteristics of the bandpass filter seen from the Hirago ⁇ port.
- Figure 19 (b) is a Smith chart showing the impedance characteristics of the bandpass filter as seen from the unbalanced port.
- FIG. 20 is a block diagram showing a conventional dual frequency demultiplexing circuit.
- FIG. 21 is a block diagram showing a high-frequency circuit for a multiband mobile phone having a conventional dual-frequency branching circuit.
- FIG. 22 is a diagram showing transmission / reception frequencies in GSM850 and GSM900. BEST MODE FOR CARRYING OUT THE INVENTION
- the balanced-unbalanced multiband filter module of the present invention (hereinafter sometimes simply referred to as “filter module”) includes a high-frequency switch or phase shifter and a balanced-unbalanced bandpass filter having different pass frequency bands. Main structure.
- a balanced-unbalanced multiband filter module as shown in Fig. 1, a three-terminal network having an unbalanced port P1 and balanced ports P2-1, P2-2 will be described in detail below.
- the present invention is not limited to this.
- First embodiment Figure 2 shows a filter module 1 that mainly consists of a high-frequency switch and a balanced-unbalanced bandpass filter.
- the first high-frequency switch 10a includes a first port 100a connected to the unbalanced port P1, a second port 100b connected to the unbalanced port 110a of the first balanced-unbalanced bandpass filter 20a, and a second port 100b. It has a third port 100c connected to the unbalanced port 120a of the balanced one-unbalanced bandpass filter 20b.
- a second high-frequency switch 10b and a third high-frequency switch 10c having three ports are connected to the first and second balanced-unbalanced bandpass filters 20a and 20b, respectively.
- the first port 130a of the second high-frequency switch 10b is connected to the first balanced port P2-1 of the filter module 1, and the second port 130b is the first balanced port of the first balanced one-unbalanced bandpass filter 20a. 110b, and the third port 130c is connected to the first balanced port 120b of the second balanced one-unbalanced bandpass filter 20b.
- the first port 150a of the third high-frequency switch 10c is connected to the second balanced port P2-2 of the filter module 1, and the second port 150b is the second balanced of the first balanced-unbalanced bandpass filter 20a.
- the third port 150c is connected to the second balanced port 120c of the second balanced-unbalanced bandpass filter 20b.
- the bandpass filters 20a and 20b are constituted by balanced-unbalanced SAW filters.
- the balanced-unbalanced SAW filter has an impedance conversion function and a balanced-unbalanced conversion function. By adjusting the crossing width, arrangement, and coupling of the electrode fingers, the input impedance and the output impedance are made different and balanced. -Perform unbalance conversion. '
- the second and third high-frequency switches 10b, 10c connected to the balanced ports 110b, 110c, 120b, 120c of the balanced-unbalanced SAW filters 20a, 20b are connected to the impedances of the SAW filters 20a, 20b for matching. Have approximately equal characteristic impedance.
- an inductance element may be connected between the balanced ports.
- An FBAR (Film Bulk Acoustic Resonator) filter can be used instead of the SAW filter.
- 6 to 10 show examples of equivalent circuits of the first to third high-frequency switches 10a, 10b, and 10c. In each figure, the symbol of the first high-frequency switch 10a is given to each port as an example, but the same applies to the second and third high-frequency switches 10b and 10c.
- the switch circuit in Fig. 6 is a single-pole double-throw (SPDT) switch, which mainly consists of a transmission line and a diode. Specifically, this switch circuit has a transmission line LSI between the port 100a and the port 100c, a diode DDI and a capacitor for DC cutting CS1 between the transmission line LSI and the ground on the port 100c side, A control port VC1 is provided between the diode DDI and the DC cut capacitor CS1. Capacitor CS1 forms a series resonant circuit with the inductance component during diode and DDI operation, and is in a short state during diode DDI operation.
- SPDT single-pole double-throw
- the switch circuit further includes a diode DD2 connected in series with the diode DDI via a transmission line LSI between the port 100a and the port 100b, and a high-frequency choke coil LS2 between the port 100b and the ground. Yes.
- the high frequency choke coil LS2 may be a high impedance line using a transmission line.
- the diodes DD1 and DD2 are turned ON / OFF by the control voltage supplied from the control port VC1 to switch the connection between the ports 100a and 100b and between the ports 100a and 100c.
- a DC cut capacitor (not shown) is appropriately arranged in each port 100a, 100b, 100c.
- FIG. 7 and 8 show a single-pole single-throw (SPST) switch as another switch circuit.
- the high-frequency switch in FIG. 7 differs from the switch circuit in FIG. 6 in that a transmission line LS3 is provided instead of the diode DD2 between the port 100a and the port 100b.
- Transmission line LS3 functions as a phase shifter, and the impedance of balanced-unbalanced bandpass filter 20a connected to port 100b is changed to the pass frequency of balanced-unbalanced bandpass filter 20b connected to port 100c. Adjust the phase shift angle so that the band is almost open (high impedance).
- FIG. 8 shows a modification of the high frequency switch shown in FIG. 7, in which the high frequency choke coil LS2 is arranged on the port 100a side of the transmission line LS3. Also in this high-frequency switch, the transmission line LS3 functions as a phase shifter.
- GaAsFET may be used for the switching element of the high-frequency switch. If GaAsFET is used, not only the power consumption is lower than that of the diode switch, but also various circuit configurations such as connecting multiple GaAsFETs in series to suppress distortion can be taken.
- the filter module is configured, and the first to third high-frequency switches 10a to LOc are appropriately switched depending on the voltage from each control port according to the high-frequency signal to be passed.
- unbalanced port P1 is connected to balanced ports ⁇ 2-1 and ⁇ 2-2 via balanced-unbalanced bandpass filter 20a
- the connection between ports 100a and 100b of first high-frequency switch 10a Connect the port 130a and the port 130b of the second high-frequency switch 10b, and connect the port 150a and the port 150b of the third high-frequency switch 10c.
- the connection between unbalanced port P1 and balanced ports P2-1 and P2-2 via balanced-unbalanced bandpass filter 20b connect between ports 100a and 100c of first high-frequency switch 10a. Then, the port 130a and the port 130c of the second high-frequency switch 10b are connected, and the port 150a and the port 150c of the third high-frequency switch 10c are connected.
- the high-frequency signal input to the unbalanced port P1 of the filter module is output from the balanced ports P2-l and P2-2, and the high-frequency signal input to the balanced ports P2-l and P2-2 is not. Output from balanced port P1.
- the high frequency switches 10a, 10b, and 10c can provide excellent isolation characteristics between the bandpass filters 20a and 20b, and can substantially prevent leakage of high frequency signals to the other circuit side. .
- FIG. 3 shows a filter module 1 according to a second embodiment of the present invention.
- This filter module mainly consists of a phase shifter and a balanced-unbalanced bandpass filter.
- the first port 180 of the first phase shifter 40a and the first port 180d of the second phase shifter 40b are connected to the unbalanced port P1 of the filter module, and the first port 180c of the first phase shifter 40a is connected to the first port 180c of the first phase shifter 40a.
- the unbalanced port 110a of the balanced-unbalanced bandpass filter 20a is connected, and the unbalanced port 120a of the first balanced-unbalanced bandpass filter 20b is connected to the second port 180e of the second phase shifter 40b. doing.
- the first balanced port 110b of the first balanced-unbalanced bandpass filter 20a is connected to the first port 160b of the third phase shifter 50a, and the first balanced port P2 of the filter module is connected to the second port 160c. -1 is connected.
- the second balanced port 110c of the first balanced-unbalanced bandpass filter 20a is connected to the first port 170b of the fourth phase shifter 50b, and the second balanced port P2 of the filter module is connected to the second port 170c. -2 is connected.
- the first balanced port 120b of the second balanced-unbalanced bandpass filter 20a is connected to the first port 160d of the fifth phase shifter 60a, and the first balanced port P2 of the filter module is connected to the second port 160e. -1 is connected.
- the second balanced port 120c of the second balanced-unbalanced bandpass filter 20a is connected to the first port 170d of the sixth phase shifter 60b, and the second balanced port P2 of the filter module is connected to the second port 170e. -2 is connected.
- Each phase shifter can be composed of a transmission line filter, and the phase shift angle is adjusted to make the impedance including the balanced-unbalanced bandpass filter almost open (high impedance).
- the first, third, and fourth phase shifters are connected to the first balanced-unbalanced bandpass filter so that the second balanced one-unbalanced bandpass filter has a high pass frequency band.
- the second, fifth, and sixth phase shifters are connected with the second bandpass filter to obtain a high impedance in the pass frequency band of the first balanced one-unbalanced bandpass filter, Demultiplexing the high-frequency signal, the force to output the high-frequency signal input to the unbalanced port P1 of the filter module from the balanced ports P2-l and P1-2, Output signal from unbalanced port P1.
- the filter module When used in mobile phones, power consumption can be reduced.
- the filter module 1 according to the third embodiment of the present invention shown in FIG. 4 includes a plurality of high-frequency switches having switching elements, a balanced-unbalanced bandpass filter having different pass frequency bands, and a balanced-unbalanced type.
- the phase shifter connected to the bandpass filter is the main component.
- the first port 100a of the first high-frequency switch 10a is connected to the unbalanced port P1 of the switch module 1, and the unbalanced port 110a of the first balanced-unbalanced bandpass filter 20a is connected to the second port 100b.
- the unbalanced port 120a of the second balanced-unbalanced bandpass filter 20b is connected to the third port 100c.
- the first balanced port 110b of the first balanced-unbalanced bandpass filter 20a is connected to the first port 160b of the first phase shifter 50a, and the first balanced port of the filter module 1 is connected to the second port 160c. P2-1 is connected.
- the second balanced port 110c of the first balanced-unbalanced bandpass filter 20a is connected to the first port 170b of the second phase shifter 50b, and the second balanced port of the filter module 1 is connected to the second port 170c. P2-2 is connected.
- the first balanced port 120b of the second balanced-unbalanced bandpass filter 20b is connected to the first port 160d of the third phase shifter 60a, and the first of the filter module 1 is connected to the second port 160e.
- One balanced port P2-1 is connected.
- the second balanced port 120c of the second balanced-unbalanced bandpass filter 20b is connected to the first port 170d of the fourth phase shifter 60b, and the second balanced port of the filter module is connected to the second port 170e. Connected.
- the first and second phase shifters 50a and 50b are connected to the first balanced-unbalanced bandpass filter 20a to provide a high impedance in the pass frequency band of the second balanced-unbalanced bandpass filter 20b.
- the third and fourth phase shifters 60a and 60b are connected to the second balanced and unbalanced ⁇ type bandpass filter 20b to obtain high impedance in the pass frequency band of the first balanced and unbalanced type bandpass filter 20a.
- each circuit element Since the function of each circuit element is the same as that of the above embodiment, its description is omitted. Also in this embodiment, since the isolation between the band pass filters can be secured by the high frequency switch and the phase shifter, the leakage of the high frequency signal from other circuits can be substantially prevented.
- the filter module 1 according to the fourth embodiment of the present invention shown in FIG. 5 also has a plurality of high-frequency switches having switching elements, and a balanced-unbalanced type having different pass frequency bands.
- the main components are a bandpass filter and a phase shifter connected to a balanced-unbalanced bandpass filter.
- the first port 180b of the first phase shifter 40a and the first port 180d of the second phase shifter 40b are connected to the unbalanced port P1 of the filter module 1 and connected to the second port 180c of the first phase shifter 40a.
- the unbalanced port 110a of the first balanced-unbalanced bandpass filter 20a is connected, and the unbalanced port 120a of the second balanced-unbalanced bandpass filter 20b is connected to the second port 180e of the second phase shifter 40b. Is connected.
- a first high-frequency switch 10b and a second high-frequency switch 10c having three ports are connected to the first and second balanced-unbalanced bandpass filters 20a and 20b.
- the first balanced port P2-1 of the filter module is connected to the first port 130a of the first high-frequency switch, and the first balanced port 110b of the first balanced-unbalanced bandpass filter 20a is connected to the second port 130b.
- the first balanced port 120b of the second balanced-unbalanced bandpass filter 20b is connected to the third port 130c.
- the second balanced port P2-2 of the filter module is connected to the first port 150a of the second high-frequency switch, and the second balanced port 110c of the first balanced-unbalanced bandpass filter 20a is connected to the second port 150b.
- the second balanced port 120c of the second balanced-unbalanced bandpass filter 20b is connected to the third port 150c.
- the first phase shifter 40a is connected to the first balanced-unbalanced band-pass filter 20a so as to have a high impedance in the pass frequency band of the second balanced-unbalanced band-pass filter 20b.
- 40b second balanced-unbalanced bandpass filter By connecting to 20b and setting high impedance in the pass frequency band of the first balanced-unbalanced bandpass filter 20a, and switching the first and second high-frequency switches 10b and 10c according to the high-frequency signal to be passed
- the high-frequency signal input to the unbalanced port P1 of the filter module 1 is output from the balanced ports P2-l and P2-2, and the high-frequency signal input to the balanced port P2-l and P2-2 is output from the unbalanced port P1.
- the function of each circuit element is the same as that of the above embodiment, its description is omitted. Also in this embodiment, the isolation between the bandpass filters can be ensured by the switching switch, so that leakage of high frequency signals from other circuits can be substantially prevented.
- the filter module 1 of the third embodiment (FIG. 4) was formed in a plurality of ceramic layers and laminated to constitute a high-frequency component.
- FIGS. 11 (a) and 11 (b) show the front and back surfaces of the high-frequency component
- FIG. 12 shows the configuration of each layer of the laminate 200 constituting the filter module 1
- FIG. 13 shows the equivalent circuit of the filter module 1. Show.
- a diode switch using a Pin diode is employed as a switching element of the first high-frequency switch 10a.
- the diode switch is mainly composed of a transmission line and a diode. Between the connection points 100a and 100c, the transmission line LSI formed in the multilayer body 200 is connected to the ground at the connection point 100c side of the transmission line LSI. Between the diode DDI and the DC cut capacitor CS1 arranged between the diode DDI and the capacitor CS1, there is a control port VC1 formed between the diode DDI and the capacitor CS1. Capacitor CS1 forms a series resonance circuit with the inductance component during diode DDI operation, and is shorted during diode DDI operation.
- connection point 100a and the connection point 100b the diode DD2 connected in series with the diode DDI via the transmission line LSI is arranged, and the high frequency choke coil LS2 is arranged between the connection point 100b and the ground Has been.
- inductor LS3 is connected in parallel with diode DD2, and capacitor CS2 is connected in series with this.
- ⁇ Frequency choke coil LS2 is composed of a chip inductor. Or transmission line The high impedance line used may be used.
- the diodes DD1 and DD2 are turned ON / OFF by the control voltage supplied from the control port VC1 to switch the connection between the connection point 100a and the connection point 100b and between the connection point 100a and the connection point 100c. .
- a DC cut capacitor CS3 is arranged on the connection point 100a side.
- capacitors may be placed on the connection points 100b and 100c as appropriate depending on the type of bandpass filter.
- a SAW filter is used as the bandpass filter, there is a gap between input and output. It is not necessary because it is cut off by direct current.
- circuit elements other than the transmission line LSI are mounted as chip parts on a land Lpp formed on the surface of the multilayer substrate.
- first and second balanced-unbalanced bandpass filters 20a and 20b surface mount type unbalanced input car balanced output SAW filters were used.
- the balance is 180 between the balanced output terminals P2-1 and P2-2.
- Inductance elements LF1 and LF2 are connected so that The SAW filter may be mounted on the surface of the laminate 200 in a bare chip state, or may be mounted on the bottom surface of the cavity formed on the laminate 200 and sealed with resin.
- Unbalanced input car balanced output Phase shifters 50a, 50b, 60a, 60b connected to the balanced output end of the SAW filter were formed as transmission lines Lgl, Lg2, Lg3, Lg4 on the laminate 200 with line electrodes.
- the inductance element, the capacitance element, and the like can be appropriately formed with electrode patterns on the multilayer substrate.
- a magnetic metal cap (not shown) such as SPCC that has been plated is disposed on the main surface of the laminate 200 on which the chip components are mounted so as to cover the chip components.
- a resin sealing material may be used instead of the metal cap.
- the resin sealing material an epoxy resin, amine-based, catalyst-based, acid anhydride-based liquid curing agent, a material that adjusts the linear expansion coefficient to about 5 to 8 ppm, a material that adjusts the elastic modulus, etc.
- the added liquid resin sealing material is preferable.
- the laminated body 200 is made of a ceramic dielectric material that can be sintered at a low temperature of 1000 ° C or less, for example, and has a thickness of 10 ⁇ ! Print a conductive paste such as Ag or Cu with a low resistivity on a green sheet of ⁇ 200 ⁇ to form a predetermined electrode pattern, and then laminate and sinter multiple green sheets together Can be manufactured.
- Dielectric materials include, for example, Al, Si, Sr, etc. as main components, Ti, Bi, Cu, Mn, Na, K Etc., materials containing Al, Si, Sr, etc. as main components, materials containing Ca, Pb, Na, K, etc. as multiple components, materials containing Al, Mg, Si, Gd, etc.
- a material containing Si, Zr, Mg, etc. can be used.
- the dielectric constant of the dielectric material is preferably about 5-15.
- a resin substrate or a substrate made of a composite material of resin and ceramic dielectric powder may be used.
- the HTCC to have use of the (high-temperature co-fired ceramic) technology, A1 2 0 3 system with using a ceramic substrate, be formed a transmission of a refractory metal such as tungsten or molybdenum lines, etc. According,.
- a wide area ground electrode E1 is formed on the upper surface of the lowermost green sheet 1 of the laminate 200, and a terminal electrode for mounting on a circuit board is formed on the back surface.
- the terminal electrode consists of an unbalanced input port IN (P1), a balanced output port OUT (P2-l, P2-2), a Darland port, and a control port VC for switch circuit control. Each is connected by via holes (indicated by black circles) formed on the green sheet.
- the terminal arrangement shown in the figure is an arrangement when viewed from the back surface side, the upper and lower positions are interchanged with those when viewed from the upper surface side.
- a force BGA Bit Grid Array
- terminal electrodes are LGA (Land Grid Array)
- one or more catching terminal electrodes Nd may be formed on the same surface as the terminal electrode so as to further strengthen the connection with the circuit board.
- connection lines SL for connecting the phase shifters Lgl and Lg3 and the phase shifters Lg2 and Lg4 are formed.
- connection lines SL are connected to the phase shifters Lgl, Lg2, Lg3, and Lg4, the line SL and the via hole become slightly longer. Therefore, it can be said that the connecting line SL and the via hole also constitute a part of the phase shifter.
- the green sheet 3 stacked on the green sheet 2 includes transmission lines Lgld, Lg2d, Lg3d, and Lg4d that constitute the phase shifters Lgl, Lg2, Lg3, and Lg4, and a transmission line LSld that constitutes the first switch 10a. It is formed with a via hole.
- the transmission lines Lgld, Lg2d, Lg3d, and Lg4d that make up the phase shifter and the transmission line LSld that makes up the first high-frequency switch 10a are spiral, but may be meandered if they have enough area. Transmission lines Lgld to Lg4d constituting the phase shifter were formed on the green sheet 2 It is connected to the transmission line SL via a via hole.
- the green sheet 4 laminated on the green sheet 3 includes transmission lines Lglc, Lg2c, Lg3c, Lg4c constituting the phase shifters Lgl, Lg2, Lg3, and Lg4, and a transmission line constituting the first switch lOa.
- LSlc is formed with via holes.
- Transmission line Lglc to Lg4c constituting the phase shifter and the transmission line LSlc constituting the first switch 10a constitute the transmission lines Lgld, Lg2d, Lg3d, Lg4d and the first switch 10a formed on the green sheet 3. It is connected to the transmission line LSld through a via hole.
- the green sheets 5 and 6 stacked on the green sheet 4 are also connected to the transmission lines Lglb ⁇ ; Lg4b, Lgla ⁇ Lg4a and the first switch 10a constituting the phase shifters Lgl, Lg2, Lg3, and Lg4.
- Transmission lines LSlb and LSla are formed, and each line electrode is connected via a via hole.
- a large-area Durand electrode E2 is formed on the green sheet ⁇ ⁇ laminated on the green sheet 6.
- the ground electrode E2 is connected to the ground electrode E1 through a via hole, and sandwiches the transmission line constituting the phase shifters Lgl, Lg2, Lg3, and Lg4 and the transmission line constituting the first switch 10a, and electromagnetic interference Is reduced as much as possible.
- the transmission lines constituting the phase shifters Lgl, Lg2, Lg3, and Lg4 and the transmission lines constituting the first switch 10a are arranged so as not to overlap in the stacking direction in order to prevent mutual interference. Also, when connecting the transmission lines that make up the phase shifters Lgl, Lg2, Lg3, and Lg4, for example, even if the connection line SL may partially overlap the line electrode of the green sheet 3 It is preventing.
- connection lines for connecting circuit elements such as chip parts and transmission lines are formed on the green sheet 8 laminated on the green sheet 7.
- the connection line Lv is a connection line from the control terminal VC1 to the resistor R.
- the Darland electrode E2 prevents interference between the transmission line constituting the phase shifter on the green sheet 6 and the connection line on the green sheet 8.
- the ground electrode E2 is less likely to malfunction even if the voltage of the control power supply fluctuates.
- connection lines Lfl and Lf2 connect the first switch 10a and the first and second bandpass filters 20a and 20b.
- Connection line Lfl, Lf2 makes the first switch It is also possible to perform impedance matching between 10a and the first and second band-pass filters 20a and 20.
- the green sheet 9 laminated on the green sheet 8 has a plurality of land electrodes Lpp on which chip components are mounted, and the chip components are connected to connection lines and circuit elements formed in the laminate 200 through via holes. To do. On the main surface of the laminate 200, lands Lcp for fixing the metal case are formed at positions along two long sides and one short side.
- the switching elements (diodes, FETs, etc.) and SAW filters mounted on the land electrode Lpp are bare and can be sealed with resin or pipe.
- the filter module is a laminated body, a small size can be achieved.
- other switches, amplifiers, etc. can be combined on the laminated substrate.
- the filter module of the unbalanced input car balanced output has been described for the sake of simplicity of explanation, but the balanced input terminal having the terminal P1 as the unbalanced output terminal and the terminal P2 as the balanced input terminal is described.
- unbalanced output filter modules are also within the scope of the present invention.
- the filter module of the present embodiment allows a high-frequency signal (for example, to pass) by the voltage from the control circuit connected to the port VC1 of the first high-frequency switch.
- GSM850 and GSM900 can be selected.
- the control circuit connected to the first high-frequency switch is shown in Table 1. Control each mode and change each mode. Since the high-frequency switch and the phase shifter can provide isolation between the bandpass filters, it is possible to substantially prevent leakage of high-frequency signals from other circuits.
- FIG. 14 shows each layer of the laminate 200 constituting the filter module of the fifth embodiment. Since the equivalent circuit and appearance of this filter module are almost the same as those of the fifth embodiment, description thereof is omitted.
- the laminated body of this example will be described focusing on the differences from the fifth example.
- a SAW filter having impedance characteristics shown in FIGS. 19 (a) and 19 (b) was used as the first balanced-unbalanced bandpass filter.
- the impedance of the balanced port of this SAW filter is in the region of 50 ⁇ in the GSM850 reception frequency band as described above, and is in the open region (high impedance) in the reception frequency band of GSM900. Therefore, the phase shifter required in the fifth embodiment
- the first balanced one unbalanced bandpass filter is a balanced port through the connection line and via hole
- the phase also changes as the line length increases due to the connection line or via hole.
- the increase in the line length is negligible, so the impedance characteristics do not change substantially. Then it is almost in the open area. Therefore, the filter module of this embodiment performs the same function as that of the fifth embodiment.
- the catching terminal electrode Nd formed on the same plane as the terminal electrode is connected to the ground electrode E1 (on the green sheet 1) through a via hole.
- the ground potential of the ground electrode E1 can be made uniform, and the adhesion strength between the auxiliary terminal electrode Nd and the multilayer substrate can be improved. Also in this embodiment, since the isolation between the band pass filters can be obtained by the high frequency switch and the phase shifter, the leakage of the high frequency signal from other circuits can be substantially prevented.
- FIG. 15 shows the high-frequency circuit of a dual-pand mobile phone.
- two communication methods GSM850 and GSM900, are taken as an example.
- the unbalanced port P1 of the filter module 1 of the present invention is connected to the reception port of the high-frequency switch 264 that switches the connection between the antenna ANT and the transmission system circuit and the reception system circuit.
- the balanced ports P2-1 and P2-2 of the filter module 1 are connected to the balanced port of the low noise amplifier LNA.
- the unbalanced port P1 of the filter module 1 of the present invention is connected to the transmission port of the high-frequency switch 264 via a low-pass filter 72 and a high-frequency amplifier PA.
- the high-frequency switch 264 and the low-pass filter 72 known ones such as a GaAs switch, a diode switch, and a ⁇ -type filter can be used.
- a high-frequency circuit is configured as in the present embodiment, a paran is not required, and battery consumption of the mobile phone can be reduced.
- the filter module 1 is configured to have at least one high-frequency switch, even if different communication methods such as GSM850 and GSM900 are used due to the isolation characteristics of the high-frequency switch, Since the leakage of high-frequency signals can be significantly reduced, the call quality of multi-pand mobile phones is not degraded.
- the filter module of the present invention is arranged on the transmission side and the reception side of the high-frequency circuit, respectively, but may be arranged on either the transmission side or the reception side as necessary. Naturally, it is within the scope of the present invention.
- FIG. 16 shows a high-frequency circuit of a multi-pan mobile phone having a plurality of filter modules.
- This high-frequency circuit can be used with four different communication systems with transmission and reception frequencies shown in Table 2, GSM850, GSM900, DCS1800, and PCS.
- the SP5T switch 300 is connected to the antenna ANT, port 510f, GSM850 and GSM900 transmission signal input port 510a, DCS1800 and PCS transmission signal input port 510b, GSM850 and GSM900 reception signal output port 510e, It has six input / output terminals: port 510c, which outputs DCS1800 reception signals, and port 510d, which outputs PCS reception signals.
- Figure 17 shows the circuit block for the SP5T switch.
- the port 510f is connected to a branching circuit 550 including a low-pass filter that passes high-frequency signals of GSM850 and GSM900 and a high-pass filter that passes high-frequency signals of DCS1800 and PCS.
- the demultiplexing circuit 550 is a combination of a bandpass filter, a low-pass filter, a low-pass filter, a SAW filter, etc., mainly composed of an inductance element and a capacitance element, and demultiplexes a high-frequency signal into two or more systems. It consists of a multiplexer.
- the low pass filter of the demultiplexing circuit 550 is connected to a high frequency switch 560 for switching the connection between the transmission circuit and the reception circuit of the GSM850 and GSM900.
- the high-frequency switch 570 for switching the connection between the DCS 1800 and PCS transmission circuit and the reception circuit is connected to the low pass filter of the demultiplexing circuit 550.
- Low-pass filters 72 and 75 are connected to the transmission circuit side of the high-frequency switches 560 and 570, respectively.
- a GaAs switch 580 is connected to the receiving circuit side of the high-frequency switch 560, and switches between the receiving circuit of the DCS1800 and the receiving circuit of the PCS.
- FIG. 18 shows an equivalent circuit when the filter module 1 is connected to the port 510e of the SP5T switch 300 having such a configuration.
- the filter module 1 is the same as the circuit shown in FIG. 5, and includes first and second phase shifters LSla and LSlb, first and second balanced-unbalanced bandpass filters 60 and 65, and four switching units. It consists of a first high-frequency switch with elements FETla to FET4a and a second high-frequency switch with four switching elements FETlb to FET4b.
- the mode of the filter module of this embodiment is switched as shown in Table 3 according to the control voltage from the control circuit connected to each control port.
- the filter module 1 when transmitting by GSM900, even if a part of the high-frequency signal from the amplifier PA leaks to the terminal 510e via the switch 570, the leaked high-frequency signal is blocked by the filter module 1. Therefore, it does not flow into the RF-IC350 including the low noise amplifier.
- the GSM850 or GSM900 received signal coming from the antenna ANT is input to the RF-IC350 as a balanced signal whose impedance is converted by removing spurious components (noise) such as sidebands by a bandpass filter. For this reason, the call quality of the mobile phone is not degraded.
- the equivalent circuit shown in FIG. 18 can also function as a high-frequency circuit of a triple-band mobile phone such as GSM8501 GSM9001 DCS1800 except for the high-frequency switch 580.
- the filter module 1 can be connected in place of the high frequency switch 580.
- the balanced-unbalanced multipand filter module of the present invention suppresses an increase in insertion loss, and in a communication method or access method that uses a very close frequency band, a high frequency of a communication method or access method to be handled. Passing signal However, it can block high-frequency signals from other communication systems or access systems.
- the balanced / unbalanced multiband filter module of the present invention is used in a high-frequency communication device such as a multi-band mobile phone, the battery consumption is small, the communication quality is hardly deteriorated, and the number of components of the high-frequency circuit is reduced. You can also.
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Abstract
Description
Claims
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP03758945A EP1557944A4 (en) | 2002-10-25 | 2003-10-27 | MULTIBAND FILER MODULE OF SYMMETRIC UNSYMMETRIC TYPE |
US10/532,239 US7242268B2 (en) | 2002-10-25 | 2003-10-27 | Unbalanced-balanced multiband filter module |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002-310876 | 2002-10-25 | ||
JP2002310876 | 2002-10-25 |
Publications (1)
Publication Number | Publication Date |
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WO2004038913A1 true WO2004038913A1 (ja) | 2004-05-06 |
Family
ID=32171063
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2003/013718 WO2004038913A1 (ja) | 2002-10-25 | 2003-10-27 | 平衡−不平衡型マルチバンドフィルタモジュール |
Country Status (4)
Country | Link |
---|---|
US (1) | US7242268B2 (ja) |
EP (1) | EP1557944A4 (ja) |
CN (1) | CN100536328C (ja) |
WO (1) | WO2004038913A1 (ja) |
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Also Published As
Publication number | Publication date |
---|---|
US7242268B2 (en) | 2007-07-10 |
CN1708899A (zh) | 2005-12-14 |
US20060044080A1 (en) | 2006-03-02 |
EP1557944A4 (en) | 2008-03-05 |
CN100536328C (zh) | 2009-09-02 |
EP1557944A1 (en) | 2005-07-27 |
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