WO2004064643A1 - 超音波深触子及び超音波診断装置 - Google Patents
超音波深触子及び超音波診断装置 Download PDFInfo
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- WO2004064643A1 WO2004064643A1 PCT/JP2004/000610 JP2004000610W WO2004064643A1 WO 2004064643 A1 WO2004064643 A1 WO 2004064643A1 JP 2004000610 W JP2004000610 W JP 2004000610W WO 2004064643 A1 WO2004064643 A1 WO 2004064643A1
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- piezoelectric layer
- ultrasonic
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- piezoelectric
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- 239000000523 sample Substances 0.000 title claims abstract description 44
- 239000000463 material Substances 0.000 claims description 35
- 230000000994 depressogenic effect Effects 0.000 claims description 3
- 238000002604 ultrasonography Methods 0.000 claims description 3
- 230000005540 biological transmission Effects 0.000 description 13
- 230000007423 decrease Effects 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 229920005989 resin Polymers 0.000 description 5
- 239000011347 resin Substances 0.000 description 5
- 238000000926 separation method Methods 0.000 description 5
- 239000000919 ceramic Substances 0.000 description 4
- 238000005259 measurement Methods 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 230000003321 amplification Effects 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 229920001971 elastomer Polymers 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000003199 nucleic acid amplification method Methods 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 239000005060 rubber Substances 0.000 description 2
- 239000002033 PVDF binder Substances 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- 229920002614 Polyether block amide Polymers 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 230000002301 combined effect Effects 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000003745 diagnosis Methods 0.000 description 1
- -1 flux Polymers 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000002923 metal particle Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920002981 polyvinylidene fluoride Polymers 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 210000003371 toe Anatomy 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G10—MUSICAL INSTRUMENTS; ACOUSTICS
- G10K—SOUND-PRODUCING DEVICES; METHODS OR DEVICES FOR PROTECTING AGAINST, OR FOR DAMPING, NOISE OR OTHER ACOUSTIC WAVES IN GENERAL; ACOUSTICS NOT OTHERWISE PROVIDED FOR
- G10K11/00—Methods or devices for transmitting, conducting or directing sound in general; Methods or devices for protecting against, or for damping, noise or other acoustic waves in general
- G10K11/18—Methods or devices for transmitting, conducting or directing sound
- G10K11/26—Sound-focusing or directing, e.g. scanning
- G10K11/32—Sound-focusing or directing, e.g. scanning characterised by the shape of the source
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
- B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
- B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
- B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
- B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
- B06B1/0607—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements
- B06B1/0622—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements on one surface
Definitions
- the present invention relates to an ultrasonic probe that transmits and receives ultrasonic waves to and from a subject and an ultrasonic diagnostic apparatus equipped with the probe. More specifically, the present invention relates to changing the diameter in the minor axis direction. Ultrasonic probes that can be used.
- an ultrasonic transducer is configured by arranging a pair of electrodes with a layer made of a piezoelectric material (hereinafter, referred to as a piezoelectric layer) interposed therebetween. The child is composed. Then, a predetermined number of transducers in the long axis direction in which a plurality of transducers are arranged are set as apertures, and the plurality of transducers belonging to the apertures are driven to converge the ultrasonic beam to a measurement site in the subject. It has a function of receiving the reflected echo of ultrasonic waves emitted from the subject by a plurality of transducers belonging to the aperture and converting the reflected echo into an electric signal.
- a piezoelectric layer a layer made of a piezoelectric material
- Patent Document 1 Japanese Patent Application Laid-Open No. 7-107595.
- the ultrasonic probe of Patent Document 1 has a high response to high frequencies at the center by forming the piezoelectric layer at the center thinner along the short axis direction and thicker toward the ends. , And a high response to low frequency is obtained at the end in the short axis direction, so that a wide frequency characteristic can be obtained.
- the diameter of the aperture in the minor axis direction of the ultrasonic probe changes in inverse proportion to the frequency, so that a fine beam diameter can be formed from a shallow depth to a deep depth.
- An object of the present invention is to equalize the frequency response of an ultrasonic probe to low frequencies in the short axis direction.
- the present invention solves the above problems by means described below.
- the present invention relates to an ultrasonic probe formed by arranging a plurality of ultrasonic transducers each including a piezoelectric layer and a pair of electrodes provided with the piezoelectric layer interposed therebetween, wherein the piezoelectric layer is a common electrode. And a second piezoelectric layer disposed on the side opposite to the ultrasonic wave emitting side, and a second piezoelectric layer disposed on the opposite side. It has a low-frequency response distribution that is uniform over the entire diameter in the axial direction, and a high-frequency response distribution at the center in the short-axis direction.
- Such a frequency response distribution can be specifically realized by the following means (1) to (9).
- the first piezoelectric layer is formed such that the thickness of the end portion in the short axis direction is smaller than the thickness of the center portion, and the second piezoelectric layer is formed such that the thickness of the end portion is thicker than the center portion.
- the surfaces of the first piezoelectric layer and the second piezoelectric layer that are in contact with the pair of electrodes are each formed in a plane, and the boundary surface between the first piezoelectric layer and the second piezoelectric layer is located at the center in the minor axis direction. Formed in a mountain shape with a ridgeline at
- the surfaces of the first piezoelectric layer and the second piezoelectric layer that are in contact with the pair of electrodes are each formed in a plane, and the boundary surface between the first piezoelectric layer and the second piezoelectric layer is located at the center in the short axis direction.
- the surface of the first piezoelectric layer on the ultrasonic wave emitting side is formed as a concave surface
- the surface of the second piezoelectric layer on the ultrasonic wave reflecting side is formed as a convex surface
- the first piezoelectric layer and the second piezoelectric layer are The boundary surface of the first piezoelectric layer is formed to be concave toward the second piezoelectric layer side with a curvature larger than the curvature of the surface of the first piezoelectric layer on the ultrasonic wave emission side
- the surface of the first piezoelectric layer on the ultrasonic wave emitting side is formed as a concave surface
- the surface of the second piezoelectric layer on the ultrasonic wave reflecting side is formed as a convex surface
- the first piezoelectric layer and the second piezoelectric layer The boundary surface of which is formed in a mountain shape having a ridge line at the center in the short axis direction
- the first piezoelectric layer and the second piezoelectric layer are each formed to have a constant thickness, and the first piezoelectric layer has a density of a piezoelectric material constituting the piezoelectric layer from the center to the end in the short axis direction. And the second piezoelectric layer is formed such that the density of the piezoelectric material forming the piezoelectric layer increases from the center to the end in the short axis direction.
- an adjustment layer having an acoustic impedance close to that of the piezoelectric material forming the piezoelectric layer is provided on the side of the second piezoelectric layer where the ultrasonic waves are reflected.
- the adjustment layer is formed such that the thickness in the short-axis direction gradually increases from the center to the end.
- the piezoelectric layer has a two-layer structure, and the characteristics of the first piezoelectric layer and the second piezoelectric layer in terms of the frequency in the minor axis direction and the sound pressure are compensated for each other. It is characterized by equalizing the frequency response to low frequencies in the minor axis direction. In other words, the thickness of the second piezoelectric layer is formed so as to increase from the center to the end in the direction perpendicular to the arrangement direction of the ultrasonic transducers (hereinafter, referred to as the short axis direction). The part has excellent high-frequency response.
- the thickness of the first piezoelectric layer is reduced from the center toward the end in the direction of the short axis, so that the center has an excellent low-frequency response.
- the frequency response characteristics of the first piezoelectric layer and the second piezoelectric layer it is possible to equalize the response characteristics in the short axis direction to low frequencies. Therefore, according to the ultrasonic probe of the present invention, a high-frequency high response can be obtained at the center of the transducer in the short-axis direction, and a low-frequency uniform response can be obtained at all apertures.
- Ultrasonic beam diameter can be formed from shallow to deep position, High resolution can be realized.
- the adjustment layer having the configuration of (8) has an acoustic impedance close to that of the piezoelectric material, the difference in acoustic impedance between the adjustment layer and the backing layer provided on the anti-piezoelectric layer side is usually large. Therefore, the ultrasonic wave is effectively reflected by the adjustment layer, and the frequency characteristic of the reflection depends on the thickness. As a result, the response characteristics of the vibrator in the short axis direction with respect to the low frequency can be further equalized.
- high-frequency components of the ultrasonic waves emitted from the oscillator to the rear side are reflected by the thin adjustment layer at the center of the oscillator and returned to the ultrasonic emission surface side. As a result, the high-frequency sound pressure emitted from the center portion of the ultrasonic probe in the short-axis direction to the subject increases, and a high-frequency response can be obtained at the center of the transducer in the short-axis direction.
- the backing layer is made of a material whose acoustic impedance is very small compared to the acoustic impedance of the piezoelectric layer and whose attenuation rate is high.
- the frequency characteristics can be changed in the short axis direction, and the aperture variable function according to the frequency can be realized.
- the thickness distribution of the adjustment layer in the minor axis direction is set to a frequency characteristic so as to obtain a desired high-frequency response distribution.
- the first piezoelectric layer and the second piezoelectric layer are each formed to have a constant thickness, and the piezoelectric layer is provided on the back surface of the electrode in contact with the second piezoelectric layer.
- An adjustment layer made of a material having an acoustic impedance close to that of the piezoelectric material is provided. The thickness of the adjustment layer is gradually increased from the center in the axial direction of the ultrasonic transducer toward the end. It can be.
- the response characteristics of the vibrator in the short axis direction with respect to the low frequency can be equalized, and the high-frequency High response can be obtained.
- an ultrasonic diagnostic apparatus of the present invention uses the ultrasonic probe of the present invention, and a transmitting unit that supplies an ultrasonic signal for driving the vibrator of the ultrasonic probe according to a control instruction.
- the reception processing means having a function of supplying an ultrasonic signal having the adjusted frequency to the ultrasonic probe, Has the function of selecting and receiving the reflected echo signal of
- a high-frequency response can be obtained at the center of the vibrator in the short-axis direction, and the frequency characteristics in the short-axis direction for low frequencies can be equalized.
- the sound beam beam diameter can be reduced, and high resolution can be realized.
- FIG. 1 is a perspective view of a main part of an ultrasonic probe according to one embodiment of the present invention.
- FIG. 2 is an overall configuration diagram of an ultrasonic diagnostic apparatus according to one embodiment of the present invention.
- FIG. 3 is a cross-sectional view of a portion related to the piezoelectric layer of the embodiment of FIG.
- FIG. 4 is a graph showing the frequency characteristics of the embodiment of FIG.
- FIG. 5 is a diagram illustrating the relationship between the frequency and the depth of focus in the embodiment of FIG.
- FIG. 6 is a diagram illustrating the relationship between the frequency and the relative sound pressure in the embodiment of FIG.
- FIG. 7 is a cross-sectional view of a portion related to the piezoelectric layer according to the second embodiment of the present invention.
- FIG. 8 is a sectional view of a portion related to the piezoelectric layer according to the third embodiment of the present invention.
- FIG. 9 is a sectional view of a portion related to the piezoelectric layer according to the fourth embodiment of the present invention.
- FIG. 10 is a sectional view of a portion related to the piezoelectric layer according to the fifth embodiment of the present invention.
- FIG. 11 is a cross-sectional view of a portion related to the piezoelectric layer according to the sixth embodiment of the present invention.
- FIG. 12 is a cross-sectional view of a portion related to the piezoelectric layer according to the seventh embodiment of the present invention.
- FIG. 13 is a sectional view of a portion related to the piezoelectric layer according to the eighth embodiment of the present invention.
- FIG. 14 is a cross-sectional view of a portion related to the piezoelectric layer of the ninth embodiment of the present invention.
- FIG. 15 is a sectional view of a portion related to the piezoelectric layer of the tenth embodiment of the present invention.
- FIG. 16 is a cross-sectional view of a portion related to the piezoelectric layer of the eleventh embodiment of the present invention.
- FIG. 1 is a perspective view of a main part of an ultrasonic probe according to one embodiment of the present invention
- FIG. 2 is an ultrasonic diagnostic apparatus according to one embodiment of the present invention
- FIG. 3 is a cross-sectional view of a portion related to the piezoelectric layer of the present embodiment.
- the ultrasonic pulse output from the ultrasonic pulse generation circuit 31 is input to the transmission means 32, where transmission processing such as transmission focus processing and amplification processing is performed, and the transmission pulse is transmitted through the transmission / reception separation unit 33. And supplied to the ultrasonic probe 1.
- the reflected echo signal received by the ultrasonic probe 1 is input to the reception processing means 35 via the transmission / reception separation unit 33, where reception processing such as amplification processing and reception phasing processing is performed. .
- the reflected echo signal output from the reception processing means 35 is input to the image processing means 36, where predetermined image reconstruction processing is performed.
- the ultrasound image reconstructed by the image processing means 36 is displayed on the monitor 37.
- the above-described ultrasonic pulse generation circuit 31, transmission means 32, reception processing means 35, and image processing means 36 are controlled based on control commands from control means 38 constituted by a computer or the like. It has become. Further, the control means 38 executes various settings and controls based on a command input from the input means 39.
- the control means 38 controls an aperture selection switch (not shown) to select a configuration for scanning the ultrasonic beam.
- a part of the reception processing means 35 and the image processing means 36 can be constituted by a computer or the like.
- the ultrasonic probe 1 of the present embodiment includes a piezoelectric layer 2, an acoustic matching layer 3 disposed on the ultrasonic emission surface side of the piezoelectric layer 2, and a back side of the piezoelectric layer 2. And an acoustic lens 5 disposed on the ultrasonic emission side of the acoustic matching layer 3.
- the piezoelectric layer 2 and the acoustic matching layer 3 are separated into a plurality by a plurality of separation layers 6 arranged along the longitudinal direction of the ultrasonic probe 1, and each is configured to function as a transducer. ing. A part of the backing layer 4 on the side in contact with the piezoelectric layer 2 is also divided into a plurality by the plurality of separation layers 6.
- the acoustic lens 5 is for focusing in the short-axis direction, and is formed of a material such as silicone rubber having an acoustic impedance close to that of a living body and a sound velocity lower than that of the living body.
- the acoustic matching layer 3 has a two-layer structure, and each plays a role as a 1/4 wavelength plate for the center frequency.
- the material of the lower layer of the acoustic matching layer 3 is, for example, ceramics whose acoustic impedance is smaller than that of the piezoelectric layer 2. You can.
- the upper layer of the acoustic matching layer 3 is formed of a resin or the like whose acoustic impedance is closer to that of a living body than the lower layer.
- the piezoelectric layer 2 is formed using a piezoelectric ceramic PZT, PZLT, a piezoelectric single crystal PZN-PT, ⁇ ⁇ ⁇ ⁇ , or an organic piezoelectric material PVDF, or a composite piezoelectric layer composed of them and a resin.
- the backing layer 4 is formed using a material that has a high attenuation rate of ultrasonic waves and attenuates ultrasonic waves emitted toward the back of the piezoelectric layer 2.
- the separation layer 6 is formed of a material having a large ultrasonic attenuation (for example, a material equivalent to a vacuum).
- FIG. 3 is a cross-sectional view of a portion of the piezoelectric layer 2 and the backing layer 4 of the present embodiment.
- FIG. 3 is a cross-sectional view of the piezoelectric layer 2 in a short axis direction orthogonal to the long axis direction.
- the piezoelectric layer 2 has a two-layer structure in which a first piezoelectric layer 2-1 and a second piezoelectric layer 2-2 are stacked.
- a pair of electrodes 7-1 and 7-2 are arranged on the ultrasonic emission surface of the first piezoelectric layer 2-1 and the back surface of the second piezoelectric layer 2-2.
- a common electrode 8 is provided at a boundary between the first piezoelectric layer 2-1 and the second piezoelectric layer 2-2.
- Electrodes 7-1, 7-2, and 8 are formed of a metal such as silver, platinum, gold, copper, and nickel to a thickness of 10 or less.
- the first piezoelectric layer 2-1 is formed in a flat-convex shape in which the ultrasonic wave emitting surface is flat and the back surface is convex. The central portion is formed to have the largest thickness Tlmax, the thickness is reduced toward both ends, and the minimum thickness Tlmin is formed at the ends.
- the second piezoelectric layer 2-2 is formed as a concave-flat type having a concave back surface for emitting ultrasonic waves and a flat back surface.
- the central portion is formed to have the thinnest thickness T 2 min, the thickness is increased toward both ends, and the end portion is formed to have the maximum thickness T 2 max. Therefore, the surfaces of the piezoelectric layer 2 that are in contact with the electrodes 7-1 and 7-2 are formed as planes parallel to each other, and the boundary surface between the first piezoelectric layer 2-1 and the second piezoelectric layer 2-2 is the second piezoelectric layer.
- the control means 38 calculates the control means 38 in accordance with the depth of the measurement site.
- the measurement site can be input and set by the operator via the input means 39.
- the control means 38 sends a command to the ultrasonic pulse generation circuit 31 and the transmission means 32 according to the depth of the measurement site to be set, and the frequency and focus position of the transmission signal are set. You. Further, the control means 38 sends a command to the reception processing means 35 to set the frequency and the focus position of the reflection echo signal to be received according to those of the transmission signal.
- the piezoelectric layer 2-2 By driving the ultrasonic probe in this way, an ultrasonic wave is generated in the piezoelectric layer 2, and the ultrasonic wave is emitted from the surface on the electrode 7-1 side.
- the piezoelectric layer 2-2 since the piezoelectric layer 2-2 is of a concave and flat type, it resonates at the end at a low frequency as in the prior art, and the low-frequency sound pressure becomes strong.
- the piezoelectric layer 2-1 has a flat-convex shape and a small thickness near the end, so that the low-frequency sound pressure at the end is small. As a result, by stacking the piezoelectric layer 2-1 and the piezoelectric layer 2-2, it is possible to suppress the emphasis on the edge sound pressure at low frequencies.
- FIG. 4 shows a graph of the frequency characteristic of the present embodiment
- FIG. 5 is a diagram illustrating the relationship between the frequency and the depth of focus of the present embodiment
- FIG. 6 shows the relationship between the frequency and the relative sound pressure of the present embodiment.
- the horizontal axis represents frequency
- the vertical axis represents relative sound pressure
- the solid line 11 represents the frequency characteristic curve at the center in the short axis direction
- the dashed line 12 represents the frequency characteristic at the intermediate position between the center and the end.
- the curve, dotted line 13 shows the frequency characteristic curve at the end.
- f center is the center frequency of the high frequency f high and the low frequency flQW .
- the high frequency f high resonates at the center and the low frequency f lc) w resonates from the end to the center.
- the aperture becomes smaller at the high frequency f high , and a narrow beam can be formed near the probe.
- the aperture becomes large at low frequency f lf , w with small attenuation, and a narrow beam can be obtained in the deep part.
- the horizontal axis represents the short-axis direction of the piezoelectric layer 2, and the vertical axis represents the depth. Therefore, as shown in Fig. 6, even at low frequency flQW , the sound pressure at the end is higher than that at the center. Because the sound pressure distribution is uniform, the SZN ratio does not decrease, and high-resolution images can be obtained from near to deep areas.
- the conventional technology without the piezoelectric layer 2-1 the low frequency component resonates strongly at both ends in the short axis direction of the ultrasonic probe. Therefore, as shown by the dashed line in the characteristic diagram of low-frequency DW in Fig. 6, the relative sound pressure distribution is such that the sound pressure at the end in the axial direction increases and the sound pressure at the center decreases. Therefore, the S / N ratio decreases.
- FIG. 7 shows a sectional view of a piezoelectric layer portion of a second embodiment of the ultrasonic probe according to the present invention.
- This embodiment is different from the first embodiment in that the piezoelectric layer 2 has a two-layer structure, and that an adjustment layer 9 is provided on the back surface of the piezoelectric layer 2.
- the piezoelectric layer 2 is formed by laminating two identically formed flat-plate-shaped piezoelectric layers 2_3 and 2-4.
- the adjustment layer 9 provided on the back surface of the piezoelectric layer 2-4 is a material having an acoustic impedance close to that of the piezoelectric layer 2, and is formed using a material such as ceramics or a metal such as aluminum or copper.
- the backing layer 4 is made of a material having an acoustic impedance much smaller than that of the adjustment layer 9 and having a large attenuation rate.
- a material having an acoustic impedance much smaller than that of the adjustment layer 9 and having a large attenuation rate for example, a mixture of rubber or resin and metal particles (for example, tungsten particles), or a material obtained by mixing beads or microballoons containing gas in rubber or resin or the like is used.
- the adjustment layer 9 of the present embodiment has a flat surface in contact with the piezoelectric layers 2-4 and a concave surface on the opposite side. That is, it is characterized in that it is formed so that the thickness is the thinnest at the center in the minor axis direction and gradually increases toward the end.
- the ultrasonic waves are effectively reflected on the adjustment layer 9 and the frequency characteristics of the reflection are reduced in thickness. Will depend on As a result, the ultrasonic probe according to the present embodiment can obtain frequency characteristics depending on the thickness of the adjustment layer 9 in the short axis direction, and can obtain the frequency characteristics shown in FIGS.
- the effect of the characteristic can be obtained.
- the large diameter responses from the high frequency f high in the central portion is reduced can be formed narrow beam in the vicinity of the beam at low frequencies 1 QW at all caliber have uniform sound pressure in the short axis direction, focus deep Is done.
- the resolution from near to deep Image with high image quality can be obtained.
- FIG. 8 shows a sectional view of a piezoelectric layer portion of a third embodiment of the ultrasonic probe according to the present invention.
- This embodiment is different from the first embodiment in that an adjustment layer 9 is provided on the back surface of the piezoelectric layer 2.
- it is a combination of the features of the first and second embodiments.
- the combined effects of the first and second embodiments can be obtained. In other words, it has an even sound in the short-axis direction at low frequencies, and it is possible to realize a narrower diameter variable function at each frequency.
- FIG. 9 shows a sectional view of a piezoelectric layer portion of a fourth embodiment of the ultrasonic probe according to the present invention.
- This embodiment differs from the first embodiment in that the cross-sectional shape of the piezoelectric layer 2 is concave as shown in the figure, and the cross section of the acoustic matching layer 3 is concave along the cross-sectional shape. That is, the piezoelectric layer 2 is formed so that the ultrasonic emission surface and the back surface are parallel concave surfaces, and the emission-side piezoelectric layer 2-1 is the thickest at the center, becomes thinner at both ends, and becomes thinner at both ends. It is formed with the thinnest structure in the part.
- the piezoelectric layer 2-2 on the back side is formed so as to be thinnest at the center and thicker toward both ends and thickest at the ends.
- the packing layer 4 has a shape along the concave surface on the back surface of the piezoelectric layer 2_2.
- the acoustic lens is removed, and the cover material 10 is formed using a material whose acoustic impedance and sound velocity are close to those of a living body, such as polyurethane, flux, butadiene rubber, and polyether block amide. ing.
- this shape is made to be a convex shape, so that contact with a living body can be improved.
- a short-axis variable focusing function is provided, and the beam can be focused by the concave piezoelectric layer 2.
- the beam can be focused without using an acoustic lens, the attenuation of ultrasonic waves can be reduced and a highly sensitive image can be obtained.
- FIG. 10 shows a sectional view of a piezoelectric layer portion of a fifth embodiment of the ultrasonic probe according to the present invention.
- This embodiment is different from the second embodiment in that the cross-sectional shape of the piezoelectric layer 2 is concave as shown in the figure, and the cross section of the acoustic matching layer 3 is concave along the cross-sectional shape.
- the piezoelectric layer 2 is formed so that the ultrasonic emission surface and the back surface are parallel concave surfaces, and furthermore, the adjustment layer 9 is disposed on the back surface of the piezoelectric layer 2, and the thickness of the adjustment layer 9 is set at the center.
- the structure is thinnest, thicker at both ends, and thickest at the ends.
- the structure is such that a cover material 10 is provided instead of the acoustic lens.
- the materials of the adjustment layer 9 and the cover material 10 are the same as in the fourth embodiment.
- the short-axis variable focus function is provided, and the beam can be focused by the concave piezoelectric layer 2. As a result, the beam can be focused without using an acoustic lens, so that the attenuation of ultrasonic waves can be reduced and a highly sensitive image can be obtained.
- FIG. 11 shows a sectional view of a piezoelectric layer portion of a sixth embodiment of the ultrasonic probe according to the present invention.
- This embodiment is a combination of the fourth and fifth embodiments, and provides an effect combining the effects of the two embodiments. In other words, it has a uniform sound pressure in the short axis direction at a low frequency, and it is possible to realize a thinner variable aperture function of the beam at each frequency. Also, since no lens is used, attenuation can be reduced and a highly sensitive image can be obtained.
- FIG. 12 is a cross-sectional view of a piezoelectric layer portion of an ultrasonic probe according to a seventh embodiment of the present invention.
- the first piezoelectric layer 2-1 is formed in a flat-convex shape in which the ultrasonic wave emitting surface is flat and the back surface is convex.
- the second piezoelectric layer 2_2 is formed in a concave flat shape with a concave back surface for emitting ultrasonic waves and a flat back surface.
- the boundary between the first piezoelectric layer 2-1 and the second piezoelectric layer 2-2 is formed in a mountain shape having a ridge at the center in the minor axis direction, and the shared electrode 8 is provided on this boundary.
- the sound pressure at the end is not higher than that at the center, and the sound pressure distribution is uniform, so the S / N ratio Does not decrease, and an image with high resolution can be obtained from near to deep.
- the adjustment layer 9 of FIG. 7 can be provided on the back side of the second piezoelectric layer 2-2. (Eighth embodiment)
- FIG. 13 is a cross-sectional view of a piezoelectric layer portion of an ultrasonic probe according to an eighth embodiment of the present invention.
- the structure of the first piezoelectric layer 2-1 and the second piezoelectric layer 2_2 in the embodiment of FIG. 11 is similar to that of FIG. It is shaped like a mountain with ridges.
- no lens since no lens is used, attenuation can be reduced and a highly sensitive image can be obtained.
- the adjustment layer 9 in FIG. 7 can be provided on the back side of the second piezoelectric layer 2_2.
- FIG. 14 shows a cross-sectional view of a piezoelectric layer portion of a ninth embodiment of the ultrasonic probe according to the present invention.
- an acoustic matching layer 3 is provided on the ultrasonic wave emitting side of the piezoelectric layer 2 in the embodiment of FIG. 12, and the shape of the acoustic lens 5 is changed to a concave acoustic lens 11.
- the concave acoustic lens 11 there is a difference in sound pressure between the thin part and the thick part of the lens.
- the ultrasonic beam becomes thinner in the short axis direction, and the low frequency ultrasonic beam becomes thinner due to the coupling with the structure of the piezoelectric layer 2. Therefore, the variable term function of the beam which is thinner at each frequency is provided. Can be realized.
- This concave acoustic lens 11 can be applied to other embodiments. Further, also in the present embodiment, the adjustment layer 9 of FIG. 7 can be provided on the back side of the second piezoelectric layer 2-2.
- FIG. 15 is a sectional view of a piezoelectric layer portion of a tenth embodiment of the ultrasonic probe according to the present invention.
- the first piezoelectric layer 12-1 is formed in a flat-convex shape in which the ultrasonic wave emitting surface is flat and the back surface is convex.
- the second piezoelectric layer 12-2 is formed in a concave and flat shape with a concave back surface for emitting ultrasonic waves and a flat back surface.
- the boundary between the first piezoelectric layer 12-1 and the second piezoelectric layer 12-2 has a flat portion protruding toward the second piezoelectric layer at the center in the short axis direction, and a first piezoelectric layer at both ends. layer And a flat portion formed so as to protrude to the side, and a shared electrode 8 is provided on this boundary surface.
- the sound pressure at the end does not become higher than that at the center, and the SZN ratio is uniform because the sound pressure distribution is uniform.
- An image with high resolution can be obtained from the vicinity to the deep part without lowering.
- the adjustment layer 9 of FIG. 7 can be provided on the back side of the second piezoelectric layer 12-2.
- FIG. 16 is a cross-sectional view of the piezoelectric layer portion of the first embodiment of the ultrasonic probe according to the present invention.
- the piezoelectric layer 13 is composed of a first piezoelectric layer 13-1 and a second piezoelectric layer 13-2 formed to have a constant thickness, respectively, and the first piezoelectric layer 13-1
- the second piezoelectric layer is formed such that the density of the piezoelectric material decreases from the center in the short-axis direction to the end, and the density of the piezoelectric material increases in the direction from the center to the end in the short-axis direction. Is formed.
- the first piezoelectric layer 13-1 has a large frequency constant from the center to both ends
- the second piezoelectric layer 13-2 has a small frequency constant from the center to both ends, and the frequency in the short axis direction is small.
- the response characteristics can be adjusted.
- the density of the piezoelectric material can be adjusted by changing the porosity of the piezoelectric material such as the piezoelectric ceramic described above. It can be adjusted by mixing resin and the like.
- the adjustment layer 9 of FIG. 7 is provided on the back side of the second piezoelectric layer 13-2, the piezoelectric layer is formed in a concave shape as shown in FIG.
- the characteristic technology of other embodiments can be adopted as appropriate, such as providing a concave acoustic lens 11.
- the same effect can be obtained by adjusting the elastic constant of the piezoelectric material instead of adjusting the density of the piezoelectric material in the present embodiment.
- the first piezoelectric layer 13-1 is formed so that the elastic constant is small at the central portion in the short axis direction and the elastic constant increases toward the end, and the second piezoelectric layer is formed at the central portion in the short axis direction. It is formed so that the elastic constant is large and the elastic constant decreases toward the end.
- the frequency response characteristic changes from the center in the short axis direction to the end, and the center has a wide band from low frequency to high frequency.
- the section can have the characteristic of having a narrow band in which the high-frequency response is small.
- the sound pressure at both ends does not increase, and uniform sound pressure can be obtained from the center to the ends.
- the response from the center increases, and at low frequencies the image is focused deeper by the response of the whole aperture at low frequencies, and an image with high resolution is obtained.
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Multimedia (AREA)
- Transducers For Ultrasonic Waves (AREA)
- Ultra Sonic Daignosis Equipment (AREA)
Abstract
Description
Claims
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP04704768A EP1591067A4 (en) | 2003-01-23 | 2004-01-23 | ULTRASONIC PROBE AND ULTRASONIC DIAGNOSTIC DEVICE |
JP2005508127A JP4310586B2 (ja) | 2003-01-23 | 2004-01-23 | 超音波探触子及び超音波診断装置 |
US10/543,322 US7678054B2 (en) | 2003-01-23 | 2004-01-23 | Ultrasonic probe and ultrasonic diagnosing device |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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JP2003014586 | 2003-01-23 | ||
JP2003-14586 | 2003-01-23 |
Publications (1)
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WO2004064643A1 true WO2004064643A1 (ja) | 2004-08-05 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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PCT/JP2004/000610 WO2004064643A1 (ja) | 2003-01-23 | 2004-01-23 | 超音波深触子及び超音波診断装置 |
Country Status (5)
Country | Link |
---|---|
US (1) | US7678054B2 (ja) |
EP (1) | EP1591067A4 (ja) |
JP (2) | JP4310586B2 (ja) |
CN (2) | CN101422376B (ja) |
WO (1) | WO2004064643A1 (ja) |
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- 2004-01-23 US US10/543,322 patent/US7678054B2/en not_active Expired - Fee Related
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JP2008142356A (ja) * | 2006-12-11 | 2008-06-26 | Ge Medical Systems Global Technology Co Llc | 超音波探触子および超音波撮像装置 |
Also Published As
Publication number | Publication date |
---|---|
JP4310586B2 (ja) | 2009-08-12 |
CN101422376A (zh) | 2009-05-06 |
JP2009101213A (ja) | 2009-05-14 |
JPWO2004064643A1 (ja) | 2006-05-18 |
CN101422376B (zh) | 2012-05-23 |
US20060142659A1 (en) | 2006-06-29 |
EP1591067A1 (en) | 2005-11-02 |
JP5011323B2 (ja) | 2012-08-29 |
CN1741770A (zh) | 2006-03-01 |
US7678054B2 (en) | 2010-03-16 |
CN100450444C (zh) | 2009-01-14 |
EP1591067A4 (en) | 2012-02-29 |
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