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WO2003058305A1 - Module d'emission/reception optique de type guide d'ondes optique et substrat concu pour le produire - Google Patents

Module d'emission/reception optique de type guide d'ondes optique et substrat concu pour le produire Download PDF

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Publication number
WO2003058305A1
WO2003058305A1 PCT/JP2002/013666 JP0213666W WO03058305A1 WO 2003058305 A1 WO2003058305 A1 WO 2003058305A1 JP 0213666 W JP0213666 W JP 0213666W WO 03058305 A1 WO03058305 A1 WO 03058305A1
Authority
WO
WIPO (PCT)
Prior art keywords
optical
substrate
waveguide type
light
optical waveguide
Prior art date
Application number
PCT/JP2002/013666
Other languages
English (en)
Japanese (ja)
Inventor
Tooru Takahashi
Nobuo Miyadera
Original Assignee
Hitachi Chemical Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co., Ltd. filed Critical Hitachi Chemical Co., Ltd.
Priority to AU2002367342A priority Critical patent/AU2002367342A1/en
Priority to JP2003558559A priority patent/JP3799611B2/ja
Publication of WO2003058305A1 publication Critical patent/WO2003058305A1/fr

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/12004—Combinations of two or more optical elements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/122—Basic optical elements, e.g. light-guiding paths
    • G02B6/125—Bends, branchings or intersections
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4246—Bidirectionally operating package structures

Definitions

  • the present invention relates to an optical waveguide type optical transmission / reception module and a substrate for manufacturing the module, and in particular, a so-called optical crosstalk in which transmission light leaks into a light receiving element of the same module to become a noise component and a minimum light receiving sensitivity is reduced.
  • the present invention relates to an optical waveguide type optical transceiver module and a substrate for manufacturing the module. Background art
  • an LD (Laser Diode) element for transmission and a PD (P hoto Diode) element for reception are integrated in one optical transceiver module.
  • LD light that is not coupled to the optical waveguide core leaks to the PD element for reception as light leakage, and this light leakage component becomes a noise component of signal light, and the optical transmission / reception module Reception sensitivity is reduced.
  • Another object of the present invention is to provide a substrate for producing an optical waveguide type optical transmission / reception module with reduced optical crosstalk.
  • the present invention provides the following optical waveguide type optical transmitting / receiving module and a substrate for manufacturing the module.
  • An optical waveguide type optical transceiver module including a substrate and an optical element formed on the surface thereof, wherein the substrate is provided with an optical crosstalk reducing means.
  • optical crosstalk reducing means includes means for absorbing and / or blocking light leakage or changing the optical path of light leakage.
  • optical crosstalk reduction means scatters light leakage by roughening the back surface and / or the surface of the substrate, thereby preventing the light from entering the light receiving element.
  • Type optical transceiver module
  • optical waveguide type optical transceiver module according to the above item 3, wherein the degree of surface roughening is JIS Rmax 6 to l2 lm.
  • optical crosstalk reducing means is a metal, ceramics, resin, or a combination of two or more of these opaque at the wavelength used.
  • an optical waveguide type optical transceiver module including a lower cladding layer, a core layer, an upper cladding layer in which the core layer is embedded, a light receiving element, and a light emitting element, at least the core layer near the light emitting element An optical waveguide type optical transceiver module, characterized in that the width of the cladding layer adjacent to the optical waveguide is 3 to 5 times the width of the core layer.
  • optical waveguide type optical transceiver module according to the above item 7, wherein the surface of the cladding layer configured to be 3 to 5 times the width of the core layer is coated with a light-impermeable material.
  • optical waveguide type optical transmission / reception module according to the above item 8, wherein the light impermeable material is a metal or a resin.
  • a substrate for producing an optical waveguide type optical transmission / reception module comprising an optical crosstalk reducing means.
  • optical crosstalk reducing means includes means for absorbing and / or blocking light leakage or changing an optical path of light leakage.
  • optical crosstalk reducing means according to the above item 10, wherein the optical crosstalk reduction means scatters light leakage by roughening the back surface and / or the surface of the substrate, and prevents the light from entering the light receiving element.
  • optical crosstalk reducing means is a substrate made of metal, ceramics, resin, or a combination of two or more of these materials opaque at the wavelength used. substrate.
  • Fig. 1 shows the present invention provided with an optical crosstalk reduction means with a sloped side surface of the substrate.
  • 3 is a drawing showing an example of the optical waveguide type optical transceiver module of FIG.
  • FIG. 2 is a plan view showing an embodiment of an optical waveguide type optical transmission / reception module of the present invention provided with an optical crosstalk reduction means.
  • FIG. 3 is a sectional view taken along line AA of FIG. BEST MODE FOR CARRYING OUT THE INVENTION
  • optical crosstalk means that when the electric crosstalk (dBm) is so small that it does not matter, the light emitting element is not operated after the optical element (light emitting element, light receiving element, filter) is mounted.
  • An optical waveguide type optical transceiver module is characterized in that an optical element is provided on a substrate, and the substrate is provided with optical crosstalk reducing means.
  • the optical waveguide type optical transceiver module of the present invention is preferably provided with a lower cladding layer, a core layer, an upper cladding layer for embedding the core layer, a light receiving element, and a light emitting element on a substrate. .
  • the optical waveguide type optical transmitting / receiving module of the present invention includes, as a substrate, an inorganic material such as glass and quartz; a semiconductor such as silicon, gallium arsenide, aluminum and titanium; and a metal material such as polyimide and polyamide.
  • An optical element such as an optical waveguide, an optical multiplexer, an optical demultiplexer, an optical attenuator, an optical diffractor, or the like is formed on these substrates by using a polymer material or a material obtained by compounding these materials.
  • Optical amplifiers optical interferometers, optical filters, optical switches, wavelength converters, light-emitting elements, light-receiving elements, or composites of these, and at least optical waveguides, light-emitting elements, and light-receiving elements It has.
  • a semiconductor element or a metal film other than the light-emitting element and the light-receiving element may be formed on the above-described substrate.
  • a silicon film may be formed, or a film of silicon nitride, aluminum oxide, aluminum nitride, tantalum oxide, or the like may be formed.
  • the first example of the most typical optical waveguide type optical transceiver module of the present invention is
  • a silicon substrate on which a polymer optical waveguide, a light emitting element and a light receiving element are mounted. More specifically, a silicon dioxide layer for protecting the substrate and adjusting the refractive index is provided on the upper surface of the silicon single crystal substrate, and the polymer optical waveguide laminate is formed thereon.
  • a typical polymer optical waveguide laminate includes a silicon substrate, an organic zirconium compound layer, a fluorine-free resin layer, a lower cladding layer, a core layer, and a core layer formed on an upper silicon dioxide layer. It has a structure in which an upper cladding layer to be embedded and a protective layer are laminated in this order.
  • the lower cladding layer, the core layer and the upper cladding layer are all formed of a polyimide resin containing fluorine, and the organic zirconium compound layer and the resin layer containing no fluorine serve to improve the adhesion between the substrate and the lower cladding layer. Are arranged to enhance.
  • the optical crosstalk reducing means provided on the substrate of the present invention will be described.
  • Preferred examples of the optical crosstalk reducing means provided on the substrate of the present invention include the following means.
  • Rough light is scattered by roughening the back surface and / or the surface of the substrate to prevent the light from entering the light receiving element.
  • the side surface of the substrate which is usually formed in a direction perpendicular to the plane of the optical waveguide, is inclined at preferably 1 ° to 60 °, more preferably 2 ° to 45 ° with respect to the vertical direction. By doing so, it is possible to prevent light leaked from the inclined surface from being incident on the light receiving element.
  • the inclined surface may be provided on the light emitting element side, or may be provided on the light receiving element side. Good, or both. When both are provided, the inclination angles may be the same or different, and accordingly, the inclination directions may be the same direction or opposite directions.
  • the substrate is made of a material consisting of metals, ceramics, resins, and combinations of two or more of them that are opaque at the wavelength used.
  • the first method is to roughen the back surface and / or front surface of the substrate to scatter light leakage and prevent the light from entering the light receiving element. For example, polishing with sandpaper with a particle size of # 100, treatment with a laser beam, or treatment with ion etching so that the surface roughness JIS Rmax is about 6 to 12 / m I just need.
  • the roughening is performed on the entire back surface or the front surface or both.
  • the second method is to tilt the substrate side surface of the optical waveguide, which is usually formed perpendicular to the optical waveguide plane, preferably by 2 ° to 45 ° with respect to this vertical direction, In order to prevent the light reflected on the inclined surface from entering the light receiving element, a desired inclined surface can be obtained when dicing a large number of optical devices formed on a substrate and separating them into individual optical devices.
  • the inclined surface may be provided on the light emitting element side, the light receiving element side, or on both sides. When both are provided, the inclination angles thereof may be the same or different. Therefore, the inclination directions may be the same direction or opposite directions. For example, the slope
  • the substrate 1 may be inclined inward from the front surface (the surface on which the optical element is mounted) toward the back surface, and conversely, from the front surface of the substrate 1 as shown in FIG. 1B. It may be inclined outward toward the back.
  • the third method is to provide a non-reflective coating layer or a light-absorbing layer on the front surface and / or the back surface of the substrate, and to absorb light leaked by the non-reflective coating layer or the light-absorbing layer to the light receiving element to prevent the incident is on the front or rear surface or both of the substrate, the S i 0 2, M g F 2, T a 2 0 5, T i 0 -reflective coating layer, such as a 2, a vacuum deposition It may be formed by electron beam evaporation or the like, or a light-absorbing resin such as epoxy, polyamide, polyimide or the like may be dissolved in a suitable solvent, applied, and dried.
  • These non-reflective coating layers or light-absorbing layers may be a single layer or a multilayer, or may be formed by combining a plurality of layers.
  • the thickness of the antireflection coating layer is appropriately determined depending on the wavelength of the light used, but is usually preferably about 0.1 to about I0 m.
  • the thickness of the light-absorbing layer is preferably from 0.3 to 10 m, for example, about 0.5 / m.
  • the substrate is made of an opaque metal at the wavelength used, for example, aluminum, copper, chromium, titanium, etc., ceramics, resin, for example, polyimide, epoxy, polyamide, phenol resin, urethane, etc., and It is composed of a material consisting of a combination of two or more of these. By configuring the substrate with a material that is opaque at such wavelengths used, it is possible to effectively attenuate the propagation of light leakage within the substrate.
  • a second example of the most typical optical waveguide type optical transmission / reception module of the present invention is shown in FIG.
  • a typical polymer optical waveguide laminate includes a silicon substrate 1, an organic zirconium compound layer, a fluorine-free resin layer, a lower cladding layer 2, a core layer 3, The upper clad layer 4 in which the core layer 3 is embedded and the protective layer are laminated in this order.
  • the lower cladding layer 2, the core layer 3, and the upper cladding layer 4 are all formed of a polyimide resin containing fluorine, and an organic zirconium compound layer and a resin layer containing no fluorine are bonded to the substrate 1 and the lower cladding layer 2. It is arranged to enhance the performance.
  • optical crosstalk reducing means provided in the optical waveguide type optical transceiver module according to the second embodiment of the present invention will be described.
  • the optical crosstalk reducing means provided in the optical waveguide type optical transceiver module of the second embodiment of the present invention comprises at least an upper part adjacent to the core layer 3 near the light emitting element 5.
  • the structure is characterized in that 111 of the cladding layer 4 is configured to be 3 to 5 times the width L 2 of the core layer 3.
  • the core layer 3 In width 1 ⁇ 3 times less than the upper cladding layer 4 having a width L 2 is the core layer 3, may waveguide loss is increased, in 5-fold greater, is insufficient optical crosstalk reduction effect.
  • the surface of the clad layer configured to be 3 to 5 times the width of the core layer is coated with a light-impermeable material.
  • a light-impermeable material examples include a layer of a metal such as aluminum, chromium, nickel, and titanium, and a layer of a resin such as polyimide and polyimide that do not contain fluorine.
  • the thickness of the metal layer is preferably about 0.05 to 1.0 m, and these can be formed by vapor deposition, sputtering, or the like.
  • the thickness of the resin layer is preferably 1.0 / m or more, and usually 3 to 10 zm.
  • the resin is more preferably dyed with a black pigment or dye.
  • the present invention relates to an optical waveguide type optical transceiver module including a lower clad layer, a core layer, an upper clad layer in which the core layer is embedded, a light receiving element, and a light emitting element, wherein at least the core layer near the light emitting element is provided.
  • the width of the adjacent cladding layer is set to be 3 to 5 times the width of the core layer.
  • a typical method of forming the layer is as follows.
  • a lower clad layer, a core layer, and an upper clad layer for embedding the core layer are formed on a substrate, and the upper clad layer, preferably, the upper clad layer and the lower clad layer are formed by, for example, dry etching, wet etching, or the like. It is removed by a method such as etching, laser ablation, milling, or sandblasting until at least the width of the cladding layer adjacent to the core layer near the light emitting element becomes 3 to 5 times the width of the core layer. I just need.
  • the surface of the cladding layer configured to be 3 to 5 times the width of the core layer may be coated with the above-described light-impermeable material, if necessary.
  • Organic zirconium chelate is applied on a silicon wafer by spin coating to a dry film thickness of 100 ⁇ , and after drying, contains fluorine No polyimide resin is applied to a dry film thickness of 0.3 zm, and after drying, a lower cladding layer (8 / m) and a core layer (6.5 m) composed of fluorine-containing polyimide resin are formed. did.
  • a silicon-containing resist is applied to the core layer to a thickness of 0.5 ⁇ m, dried, exposed and developed through a mask having a core layer pattern, and reactive ions are formed using the resist pattern as a mask. Etching was performed to form a core layer.
  • an upper cladding layer (15 / m) and a protective layer (3 ⁇ m) made of a polyimide resin containing no fluorine were formed to form a polyimide optical waveguide.
  • the surface of the silicon wafer on which the optical waveguide was not formed (the back surface of the substrate) was roughened with a water-resistant vapor equivalent to JIS # 1000 to a roughening degree of JIS Rmax 9.6 m.
  • the chip was cut out by dicing, the light receiving element and the light emitting element were attached, and the optical crosstalk of the optical waveguide was evaluated. Comparative Example 1
  • Example 2 In the same manner as in Example 1, a polyimide optical waveguide was prepared. After that, without roughening the surface of the silicon wafer where the optical waveguide is not formed (the back surface of the substrate), the chip is cut out into chips by dicing, the light receiving element and the light emitting element are attached, and optical crosstalk of the optical waveguide is reduced. evaluated.
  • Example 2 the optical stress of the module of Example 1 of the present invention in which the back surface of the substrate was roughened was clearly improved as compared with the module of Comparative Example 1.
  • Organic zirconium chelate is dried on a silicon wafer by the Sincoat method and dried to a thickness of 100 ⁇ .After drying, a fluorine-free polyimide resin is dried to a thickness of 0.3 m. After coating and drying, the lower cladding layer (8 m) and core layer (6.5 ju) made of polyimide resin containing fluorine m) formed. Next, a silicon-containing resist is applied on the core layer so as to have a thickness of 0.5, dried, exposed and developed through a core pattern, and reactive ion etching is performed using the resist pattern as a mask. A layer was formed. After stripping the resist, an upper cladding layer (15 zm) was formed to create a polyimide optical waveguide.
  • a polyimide optical waveguide was formed on a silicon wafer by a spin coating method and a reactive ion etching method, and thereafter, a chip was formed by dicing without removing the cladding layers on both sides of the core layer. The cutout was used to evaluate the optical crosstalk of the optical waveguide.
  • the substrate is provided with the optical crosstalk reducing means, the optical waveguide type optical transceiver module manufactured using this substrate has a remarkable optical crosstalk. , And a decrease in reception sensitivity can be significantly suppressed. Further, since the optical crosstalk reducing means is provided on the substrate, the manufacture thereof is easier than the conventional method of providing the optical element on the substrate with the optical crosstalk reducing means.
  • the optical waveguide type optical transceiver module of the present invention provided with the optical crosstalk reducing means has a significantly reduced optical crosstalk.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optical Integrated Circuits (AREA)

Abstract

La présente invention concerne un module d'émission/réception optique de type guide d'ondes optique, comprenant un substrat et des éléments optiques formés sur ce substrat. Le substrat est équipé de systèmes permettant de réduire la diaphonie optique. Le module d'émission/réception optique de type guide d'ondes optique selon cette invention comprend une couche de gaine inférieure, une couche de noyau, une couche de gaine supérieure, conçue pour intégrer la couche de noyau, un élément de réception de lumière et un élément d'émission de lumière. La largeur de la couche de gaine qui est adjacente à la couche de noyau au moins à proximité de l'élément d'émission de lumière est de trois à cinq fois la largeur de la couche de noyau. La présente invention concerne un substrat conçu pour produire un module d'émission/réception optique de type guide d'ondes optique, qui comprend des systèmes permettant de réduire la diaphonie optique. Le module d'émission/réception optique de type guide d'ondes optique peut réduire de manière importante la diaphonie optique et supprimer sensiblement la dégradation de la sensibilité de réception. Le fait que le substrat soit équipé des systèmes permettant de réduire la diaphonie optique permet de faciliter la fabrication par rapport à la manière classique dont les éléments optiques sont équipés de systèmes permettant de réduire la diaphonie optique sur le substrat.
PCT/JP2002/013666 2001-12-28 2002-12-26 Module d'emission/reception optique de type guide d'ondes optique et substrat concu pour le produire WO2003058305A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
AU2002367342A AU2002367342A1 (en) 2001-12-28 2002-12-26 Optical transmission/reception module of optical waveguide type, and substrate for making the same
JP2003558559A JP3799611B2 (ja) 2001-12-28 2002-12-26 光導波路型光送受信モジュール及び該モジュール作成用基板

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2001-399045 2001-12-28
JP2001-399044 2001-12-28
JP2001399044 2001-12-28
JP2001399045 2001-12-28

Publications (1)

Publication Number Publication Date
WO2003058305A1 true WO2003058305A1 (fr) 2003-07-17

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JP (1) JP3799611B2 (fr)
AU (1) AU2002367342A1 (fr)
WO (1) WO2003058305A1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8923669B2 (en) 2011-06-14 2014-12-30 Shinko Electric Industries Co., Ltd. Optical waveguide and method of manufacturing the same, and optical waveguide device
JP2018151572A (ja) * 2017-03-14 2018-09-27 Ｎｔｔエレクトロニクス株式会社 光回路及び光モジュール

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07301537A (ja) * 1994-05-09 1995-11-14 Japan Aviation Electron Ind Ltd 光ファイバジャイロ
JPH10282351A (ja) * 1997-04-11 1998-10-23 Kyocera Corp 光導波路ならびに光電子混在基板
JPH11248954A (ja) * 1998-03-06 1999-09-17 Nippon Telegr & Teleph Corp <Ntt> 光ハイブリッドモジュール

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3219781B2 (ja) * 1991-02-19 2001-10-15 日本電気株式会社 光回路
JP3721923B2 (ja) * 2000-02-22 2005-11-30 株式会社日立製作所 光モジュール

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07301537A (ja) * 1994-05-09 1995-11-14 Japan Aviation Electron Ind Ltd 光ファイバジャイロ
JPH10282351A (ja) * 1997-04-11 1998-10-23 Kyocera Corp 光導波路ならびに光電子混在基板
JPH11248954A (ja) * 1998-03-06 1999-09-17 Nippon Telegr & Teleph Corp <Ntt> 光ハイブリッドモジュール

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8923669B2 (en) 2011-06-14 2014-12-30 Shinko Electric Industries Co., Ltd. Optical waveguide and method of manufacturing the same, and optical waveguide device
JP2018151572A (ja) * 2017-03-14 2018-09-27 Ｎｔｔエレクトロニクス株式会社 光回路及び光モジュール

Also Published As

Publication number Publication date
AU2002367342A1 (en) 2003-07-24
JPWO2003058305A1 (ja) 2005-05-19
JP3799611B2 (ja) 2006-07-19

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