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WO2001048114A1 - Composition destinee au polissage d'un substrat de disque magnetique, procede de polissage, et substrat de disque magnetique poli au moyen de ladite composition - Google Patents

Composition destinee au polissage d'un substrat de disque magnetique, procede de polissage, et substrat de disque magnetique poli au moyen de ladite composition Download PDF

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Publication number
WO2001048114A1
WO2001048114A1 PCT/JP2000/009230 JP0009230W WO0148114A1 WO 2001048114 A1 WO2001048114 A1 WO 2001048114A1 JP 0009230 W JP0009230 W JP 0009230W WO 0148114 A1 WO0148114 A1 WO 0148114A1
Authority
WO
WIPO (PCT)
Prior art keywords
polishing
magnetic disk
disk substrate
composition according
polishing composition
Prior art date
Application number
PCT/JP2000/009230
Other languages
English (en)
Japanese (ja)
Inventor
Norihiko Miyata
Original Assignee
Showa Denko K.K.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Showa Denko K.K. filed Critical Showa Denko K.K.
Priority to AU22252/01A priority Critical patent/AU2225201A/en
Publication of WO2001048114A1 publication Critical patent/WO2001048114A1/fr

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • C09K3/1463—Aqueous liquid suspensions
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/84—Processes or apparatus specially adapted for manufacturing record carriers
    • G11B5/8404—Processes or apparatus specially adapted for manufacturing record carriers manufacturing base layers

Definitions

  • the present invention relates to a magnetic disk substrate polishing composition and a polishing method, and more particularly to a magnetic disk substrate polishing method capable of obtaining a highly accurate magnetic disk surface suitable for flying a magnetic head with a low flying height.
  • the present invention relates to a composition and a polishing method.
  • the present invention also relates to a magnetic disk substrate obtained using such a composition or method. Background art
  • Magnetic disks are widely used as a means of high-speed access in the external storage devices of computer-type processors.
  • a typical example of this magnetic disk is a substrate obtained by electrolessly plating NiP on the surface of an A1 alloy substrate, and after polishing this substrate surface, a Cr alloy base film, a Co alloy magnetic The film and the carbon protective film were formed sequentially by sputtering.
  • the magnetic head flying at a high speed while flying at a predetermined height will collide with the protrusion and be damaged.
  • the magnetic disk substrate has protrusions or polishing scratches, when Cr alloy base film or Co alloy magnetic film is formed, protrusions appear on the surface of those films, and defects due to polishing scratches occur.
  • the surface of the magnetic disk does not become a smooth surface with high accuracy, it is necessary to precisely polish the substrate in order to increase the accuracy of the disk surface.
  • polishing compositions which eliminate projections or reduce the height thereof as much as possible and which hardly cause polishing scratches.
  • Japanese Patent Laid-Open No. H10-2012 (using a composition obtained by adding aluminum nitrate to titania) is used to grind titanium oxide particles in the sub-micron mouth. Since they are used as particles, they achieve higher surface accuracy and higher polishing rate than conventional products. However, achieving the recently required level of surface accuracy is difficult because of the hardness of the abrasive material.
  • Japanese Patent Application Laid-Open No. Hei 9-2012 using a composition obtained by adding aluminum nitrate and an anti-gelling agent to the colloidal silica force) and The composition described in 2) uses aluminum oxide fine particles with low hardness for the abrasive grains, so that surface accuracy can be easily obtained. It was difficult to achieve a usable polishing rate.
  • the quality required of an aluminum magnetic disk substrate polishing composition that enables high-density magnetic recording is the achievement of a high-precision disk surface that enables low flying of the head.
  • a magnetic disk substrate polishing composition and a polishing method that enable this, and a magnetic disk substrate obtained using the same is a demand for a magnetic disk substrate polishing composition and a polishing method that enable this, and a magnetic disk substrate obtained using the same. Disclosure of the invention
  • an object of the present invention to provide a magnetic disk substrate capable of achieving high-density recording without causing surface roughness of the magnetic disk substrate, generating protrusions and polishing scratches, and capable of polishing at an economical speed.
  • An object of the present invention is to provide a polishing composition of the present invention.
  • Another object of the present invention is to provide a magnetic disk substrate method using such a composition.
  • Still another object of the present invention is to provide a magnetic disk substrate obtained by using such a composition or a polishing method.
  • the present inventors have conducted intensive studies on an abrasive for achieving a high-accuracy polished surface required for a low-flying-type aluminum magnetic disk.
  • the present inventors have found a polishing composition exhibiting excellent performance for polishing a disk, and have reached the present invention. That is, the present invention basically includes the following inventions.
  • a composition for polishing a magnetic disk substrate comprising water, silicon oxide, a metal coordination compound, and an oxidizing agent.
  • polishing composition according to any one of the above (1) to (6), wherein the silicon oxide is at least one selected from colloidal silica, fumed silica, and white carbon.
  • the phosphonic acid compound is at least one selected from phosphoric acid, 1-hydroxyxetane-11,1-diphosphonic acid, and aminotrimethylenephosphonic acid. Composition.
  • a method for polishing a magnetic disk substrate provided with a Ni-P plating A method for polishing a magnetic disk substrate, which suppresses conversion of trivalent Fe ions to oxides or hydroxides.
  • the silicon oxide contained as an abrasive in the polishing composition of the present invention is not particularly limited, and may be colloidal silica, fumed silica, or white carbon. These may be used alone or in combination of two or more. It is preferred that the average particle size of the secondary particles of oxide Kei element is 0. 0 3 ⁇ 0. 5 ⁇ ⁇ .
  • the average particle diameter of the secondary particles is a value measured by a laser-Doppler frequency analysis type particle size distribution analyzer, Microtrac UPA150 (manufactured by oneywe 11).
  • the average particle diameter of the secondary particles of silicon oxide contained as an abrasive in the polishing composition of the present invention is preferably in the range of 0.3 to 0.5 ⁇ , more preferably 0.03 to 0.5 ⁇ . Those having 4 to 0.2 ⁇ m are more preferable.
  • the metal coordination compound used in the present invention is a complex salt such as a metal chelate compound in a broad sense.
  • the metal chelate compound include, but are not limited to, EDTA (ethylenediaminetetraacetic acid) and N-diaminetriacetic acid hydroxy.
  • examples include metal salts having ligands such as ethylene (NHEDTA) and ammonia triacetic acid (NTA).
  • NHEDTA ethylenediaminetetraacetic acid
  • NTA ammonia triacetic acid
  • As a metal of the metal salt it has a high oxidizing ability with respect to Ni, and it can exist in at least two or more different valence states other than zero valence. A metal having an oxidation number higher than the oxidation number in another valence state is suitable, and iron (F e) is particularly preferable. The possible reasons are as follows.
  • Fe is more stable than trivalent than divalent ions, and the trivalent Fe ions oxidize Ni to become divalent Fe ions.
  • the oxidized Ni becomes a hydrate or an oxide in the presence of water. Polishing proceeds by removing the hydrate or oxide with abrasive grains.
  • the divalent Fe ion is converted to a trivalent ion by the oxidizing agent described below, and is retained as a metal chelate compound, for example, an iron salt of EDTA. It is assumed that these reactions are performed repeatedly.
  • the metal chelate compound used in the present invention is not particularly limited, but is preferably an iron salt of EDTA, and more preferably a monoammonium salt or a monosodium salt. It is effective to add a large amount of iron nitrate, iron chloride, etc. if only increasing the polishing rate. It can be tricky.
  • the oxidizing agent used in the present invention is not particularly limited, but may be an ammonium salt, a potassium salt, a sodium salt, an ammonium salt of sodium peroxoborate, a sodium salt, or a sodium salt of peroxodisulfuric acid.
  • Peroxo acid salts such as lithium salts and potassium salts, peroxides such as permanganate, dichromate, nitrate, sulfate, and hydrogen peroxide, and perchlorates, etc. Salts are preferred, and ammonium peroxodisulfate is particularly preferred. These may be used alone or in combination of two or more.
  • the oxidizing agent oxidizes not only Fe which has become divalent by oxidizing Ni but also Ni, the polishing rate is increased by a synergistic effect of these.
  • the Fe ions returned from divalent to trivalent by the oxidizing agent also change to hydroxides or oxides in the absence of a complex such as a chelate compound. In this state, the trivalent Fe ions are effectively used. Does not work.
  • the abrasive is colloidal silica
  • gelation may occur.
  • EDTA iron salt the dispersibility becomes better and gelation can be suppressed.
  • EDTA iron salt is used as the Fe source, a high polishing rate can be obtained even when the pH of the polishing composition is set to 1 to 8, so the use of EDTA iron salt is trivalent. It is very useful in terms of iron stability, gelation prevention, and pH.
  • the concentration of silicon oxide in the polishing composition of the present invention is 3% by mass. /. (Hereinafter, unless otherwise specified,% is expressed by mass./.) If it is less than 10%, the polishing rate is significantly reduced. The polishing rate increases as the concentration increases. However, when the concentration exceeds 30%, not only the polishing rate does not increase but also gelation tends to occur particularly in colloidal silica. Therefore, considering the economic efficiency, the upper limit of the silicon oxide concentration is practically 30%. Therefore, the concentration of silicon oxide in the composition is preferably in the range of 3 to 30%, more preferably 5 to 15%.
  • the amount of the metal coordination compound used in the polishing composition of the present invention is preferably from 1 to 10%, more preferably from 2 to 6%.
  • the amount of the oxidizing agent used in the polishing composition of the present invention is preferably from 1 to 10%, more preferably from 3 to 7%.
  • the amount of the oxidizing agent is less than 1%, the effect of accelerating the polishing is reduced. In addition, even if the added amount of the oxidizing agent exceeds 10%, the effect of promoting the polishing is not increased.
  • the pH adjuster used in the present invention is not particularly limited, but may be nitric acid, At least one member selected from the group consisting of sulfonic acid compounds is preferred.
  • Specific examples of the phosphonic acid compound include phosphoric acid, 1-hydroxylethane 1,1,1-diphosphonic acid (C 2 H 6 ⁇ 7 P 2) Moshiku is ⁇ Mi Roh Application Benefits Mechirenhosuho phosphate (C 2 H 1 2 ⁇ 9 P 3 N) can be exemplified. These may be used alone or in combination of two or more. These are preferably added within 2%. This allows the pH in the composition to be adjusted preferably to 1-8.
  • the concentrations of the above-mentioned components are those at the time of polishing the magnetic disk substrate.
  • the polishing composition for a magnetic disk substrate of the present invention may contain, in addition to the above components, additives usually used in the polishing composition, such as a surfactant and a preservative. However, careful attention must be paid to the type and amount of addition so as not to cause gelation.
  • the polishing composition of the present invention is prepared by suspending silicon oxide in water, adding a metal coordination compound such as iron salt of EDTA, an oxidizing agent such as ammonium peroxodisulfate, a pH adjusting agent, and the like. can do. When used, the mixture of all components may be diluted and used.However, two sets of additive components, for example, water, silicon oxide, metal coordination compound and water, oxidizing agent, pH adjustment Prepare the ingredients separately and mix the two sets.
  • the polishing composition of the present invention can be used for a substrate for high recording density (typically, a recording density of 3 Gbit / inch 2 or more, typified by a magnetic disk for magnetic head utilizing the magnetoresistance (MR) effect). However, it can also be applied to magnetic disks having a recording density lower than that, from the viewpoint of improving reliability.
  • MR magnetoresistance
  • the magnetic hard disk substrate to which the polishing composition of the present invention is applied is not particularly limited, but an aluminum (including alloy) substrate, in particular, NiP is plated by, for example, electroless plating.
  • an aluminum (including alloy) substrate in particular, NiP is plated by, for example, electroless plating.
  • the polishing method is generally a method in which a polishing pad used for a slurry-like abrasive is rubbed on a magnetic disk substrate, and the pad or the substrate is rotated while supplying slurry between the pad and the substrate.
  • a magnetic disk made from a substrate polished with the polishing composition of the present invention has a very low frequency of occurrence of minute defects such as micropits and microcracks, and has a low surface roughness (Ra). About 3 A, very excellent in smoothness.
  • Table 1 shows silicon oxide (silica) and titania used in Examples and Comparative Examples.
  • White carbon (E-150 J) manufactured by Nippon Silica Kogyo Co., Ltd. and fumed silica (AERO SIL 50) manufactured by Nihon Aerosil Co., Ltd. are pulverized by a medium stirring mill, and coarse particles are formed by sizing. After removal, silicon oxide having an average secondary particle diameter of 0.1 ⁇ m was first obtained. Next, water, EDTA iron ammonium, ammonium peroxodisulfate, and a pH adjuster were added at the ratios shown in Table 2 to prepare various aqueous polishing compositions. The polishing apparatus and polishing conditions shown below were used. Was polished. The results are shown in Table 2.
  • Polishing pad Suede type (Polytex DG, Dale mouth)
  • Polishing rate ⁇ Calculated from weight loss before and after polishing of aluminum disk
  • the depth of the polishing flaws and polishing pits was determined by three-dimensional mode analysis using a stylus-type surface analyzer P-12 (manufactured by TENCOR).
  • Table 2 shows the evaluation results of the polishing characteristics.
  • the polishing flaw A in Table 2 has a polishing flaw depth of 5 nm or less, and the pit A has a pit depth of 5 nm or less.
  • Polishing scratch B has a polishing scratch depth of 5 to 10 nm, and pit B has a pit depth of 5 to 10 nm. Those having a polishing scratch depth of more than 10 nm and those having a pit depth of more than 10 nm did not occur in both Examples and Comparative Examples. (Comparative Examples 1 to 5)
  • Titanium oxide (Super Titania F-12) manufactured by Showa Titanium Co., Ltd. is pulverized by a medium stirring mill and coarse particles are removed by sizing to obtain titanium oxide having an average secondary particle diameter of 1.3 m. Was. Next, water and aluminum nitrate were added at the ratios shown in Table 2 to prepare an aqueous polishing composition, and polished in the same manner as in the examples. The results are shown in Table 2.
  • the surface roughness of the disk can be extremely reduced, and the polishing can be performed at a high speed.
  • Magnetic disks using polished disks are useful as low-floating-type hard disks, and enable high-density recording.

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Manufacturing Of Magnetic Record Carriers (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

L'invention concerne une composition, destinée au polissage d'un substrat de disque magnétique, qui renferme de l'eau, de l'oxyde de silicium, un composé de coordination métallique et un agent d'oxydation. Ladite composition peut contenir, en outre, un agent d'équilibration du pH. L'invention concerne également un procédé de polissage de substrat de disque magnétique utilisant des compositions de ce type, ainsi qu'un substrat de disque magnétique poli au moyen desdites compositions et selon ledit procédé de polissage. L'utilisation desdites compositions ou dudit procédé permet de réduire la rugosité de surface du substrat de disque magnétique. Par conséquent, il est possible de réaliser un enregistrement haute densité sans produire ni bossage ni défauts de polissage. Le substrat du disque magnétique peut ainsi être poli à une vitesse économique.
PCT/JP2000/009230 1999-12-27 2000-12-26 Composition destinee au polissage d'un substrat de disque magnetique, procede de polissage, et substrat de disque magnetique poli au moyen de ladite composition WO2001048114A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU22252/01A AU2225201A (en) 1999-12-27 2000-12-26 Composition for polishing magnetic disk substrate and polishing method, and magnetic disk substrate polished thereby

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP11/369095 1999-12-27
JP36909599 1999-12-27
JP2000/16614 2000-01-26
JP2000016614A JP2004127327A (ja) 1999-12-27 2000-01-26 磁気ディスク基板研磨用組成物

Publications (1)

Publication Number Publication Date
WO2001048114A1 true WO2001048114A1 (fr) 2001-07-05

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PCT/JP2000/009230 WO2001048114A1 (fr) 1999-12-27 2000-12-26 Composition destinee au polissage d'un substrat de disque magnetique, procede de polissage, et substrat de disque magnetique poli au moyen de ladite composition

Country Status (3)

Country Link
JP (1) JP2004127327A (fr)
AU (1) AU2225201A (fr)
WO (1) WO2001048114A1 (fr)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006021259A (ja) * 2004-07-06 2006-01-26 Fuji Electric Device Technology Co Ltd 磁気ディスク基板の研磨方法および磁気ディスク媒体
JP2014101518A (ja) * 2014-01-06 2014-06-05 Fujimi Inc 研磨用組成物、研磨方法、及び研磨パッドの弾力性低下抑制方法
JP6480139B2 (ja) * 2014-09-30 2019-03-06 株式会社フジミインコーポレーテッド 研磨用組成物

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US5366542A (en) * 1990-08-29 1994-11-22 Fujimi Incorporated Polishing composition
WO1994028194A1 (fr) * 1993-05-26 1994-12-08 Rodel, Inc. Compositions et procedes de polissage ameliores
EP0811666A2 (fr) * 1996-06-06 1997-12-10 Cabot Corporation Suspension pour le polissage mécano-chimique contenant des additifs fluorés et méthode utilisant ladite suspension
EP0831136A2 (fr) * 1996-09-24 1998-03-25 Cabot Corporation Suspension renfermant plusieurs oxydants pour polissage mécano-chimique
JPH10102037A (ja) * 1996-10-02 1998-04-21 Kao Corp 研磨材組成物及びこれを用いた基板の製造方法
WO1998021289A1 (fr) * 1996-11-14 1998-05-22 Kao Corporation Composition abrasive utilisee dans la fabrication de la base d'un support d'enregistrement magnetique, et procede de fabrication de cette base a l'aide de cette composition
JPH10176164A (ja) * 1996-10-17 1998-06-30 Showa Denko Kk ガラス研磨用研磨材組成物およびその製造方法
JPH10219300A (ja) * 1997-02-03 1998-08-18 Mitsubishi Chem Corp 研磨液用洗浄剤組成物
JPH1121545A (ja) * 1997-06-30 1999-01-26 Fujimi Inkooporeetetsudo:Kk 研磨用組成物
JPH11188614A (ja) * 1997-12-24 1999-07-13 Kao Corp 被加工物の研磨方法
JPH11256142A (ja) * 1998-03-16 1999-09-21 Kao Corp 研磨液組成物
EP0967260A1 (fr) * 1998-06-22 1999-12-29 Fujimi Incorporated Composition de polissage et composition pour le traitement de surface
JP2000053948A (ja) * 1998-08-07 2000-02-22 Kao Corp 研磨液組成物
JP2000063806A (ja) * 1998-08-17 2000-02-29 Okamoto Machine Tool Works Ltd 研磨剤スラリ−およびその調製方法
JP2000063804A (ja) * 1998-08-25 2000-02-29 Okamoto Machine Tool Works Ltd 研磨剤スラリ−
JP2000073049A (ja) * 1998-09-01 2000-03-07 Fujimi Inc 研磨用組成物
JP2000136375A (ja) * 1998-10-30 2000-05-16 Okamoto Machine Tool Works Ltd 研磨剤スラリ−
JP2000144109A (ja) * 1998-11-10 2000-05-26 Okamoto Machine Tool Works Ltd 化学機械研磨用研磨剤スラリ−
EP1006166A1 (fr) * 1998-12-01 2000-06-07 Fujimi Incorporated Composition de polissage et procédé de polissage utilisant cette composition
JP2000252244A (ja) * 1998-12-28 2000-09-14 Hitachi Chem Co Ltd 金属用研磨液及びそれを用いた研磨方法
JP2000315667A (ja) * 1999-04-28 2000-11-14 Kao Corp 研磨液組成物
JP2000340532A (ja) * 1999-05-31 2000-12-08 Mitsubishi Materials Corp 研磨用スラリー及びこれを用いた研磨方法
JP2001031950A (ja) * 1999-07-19 2001-02-06 Tokuyama Corp 金属膜用研磨剤
JP2001049031A (ja) * 1999-06-04 2001-02-20 Asahi Chem Ind Co Ltd 無機粒子分散組成物

Patent Citations (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5366542A (en) * 1990-08-29 1994-11-22 Fujimi Incorporated Polishing composition
WO1994028194A1 (fr) * 1993-05-26 1994-12-08 Rodel, Inc. Compositions et procedes de polissage ameliores
EP0811666A2 (fr) * 1996-06-06 1997-12-10 Cabot Corporation Suspension pour le polissage mécano-chimique contenant des additifs fluorés et méthode utilisant ladite suspension
EP0831136A2 (fr) * 1996-09-24 1998-03-25 Cabot Corporation Suspension renfermant plusieurs oxydants pour polissage mécano-chimique
JPH10102037A (ja) * 1996-10-02 1998-04-21 Kao Corp 研磨材組成物及びこれを用いた基板の製造方法
JPH10176164A (ja) * 1996-10-17 1998-06-30 Showa Denko Kk ガラス研磨用研磨材組成物およびその製造方法
WO1998021289A1 (fr) * 1996-11-14 1998-05-22 Kao Corporation Composition abrasive utilisee dans la fabrication de la base d'un support d'enregistrement magnetique, et procede de fabrication de cette base a l'aide de cette composition
JPH10219300A (ja) * 1997-02-03 1998-08-18 Mitsubishi Chem Corp 研磨液用洗浄剤組成物
JPH1121545A (ja) * 1997-06-30 1999-01-26 Fujimi Inkooporeetetsudo:Kk 研磨用組成物
JPH11188614A (ja) * 1997-12-24 1999-07-13 Kao Corp 被加工物の研磨方法
JPH11256142A (ja) * 1998-03-16 1999-09-21 Kao Corp 研磨液組成物
EP0967260A1 (fr) * 1998-06-22 1999-12-29 Fujimi Incorporated Composition de polissage et composition pour le traitement de surface
JP2000053948A (ja) * 1998-08-07 2000-02-22 Kao Corp 研磨液組成物
JP2000063806A (ja) * 1998-08-17 2000-02-29 Okamoto Machine Tool Works Ltd 研磨剤スラリ−およびその調製方法
JP2000063804A (ja) * 1998-08-25 2000-02-29 Okamoto Machine Tool Works Ltd 研磨剤スラリ−
JP2000073049A (ja) * 1998-09-01 2000-03-07 Fujimi Inc 研磨用組成物
JP2000136375A (ja) * 1998-10-30 2000-05-16 Okamoto Machine Tool Works Ltd 研磨剤スラリ−
JP2000144109A (ja) * 1998-11-10 2000-05-26 Okamoto Machine Tool Works Ltd 化学機械研磨用研磨剤スラリ−
EP1006166A1 (fr) * 1998-12-01 2000-06-07 Fujimi Incorporated Composition de polissage et procédé de polissage utilisant cette composition
JP2000252244A (ja) * 1998-12-28 2000-09-14 Hitachi Chem Co Ltd 金属用研磨液及びそれを用いた研磨方法
JP2000315667A (ja) * 1999-04-28 2000-11-14 Kao Corp 研磨液組成物
JP2000340532A (ja) * 1999-05-31 2000-12-08 Mitsubishi Materials Corp 研磨用スラリー及びこれを用いた研磨方法
JP2001049031A (ja) * 1999-06-04 2001-02-20 Asahi Chem Ind Co Ltd 無機粒子分散組成物
JP2001031950A (ja) * 1999-07-19 2001-02-06 Tokuyama Corp 金属膜用研磨剤

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JP2004127327A (ja) 2004-04-22
AU2225201A (en) 2001-07-09

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