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WO1999063583A3 - Improved method and apparatus for contacting a wafer - Google Patents

Improved method and apparatus for contacting a wafer Download PDF

Info

Publication number
WO1999063583A3
WO1999063583A3 PCT/US1999/011271 US9911271W WO9963583A3 WO 1999063583 A3 WO1999063583 A3 WO 1999063583A3 US 9911271 W US9911271 W US 9911271W WO 9963583 A3 WO9963583 A3 WO 9963583A3
Authority
WO
WIPO (PCT)
Prior art keywords
wafer
lift pins
zones
location
contacting
Prior art date
Application number
PCT/US1999/011271
Other languages
French (fr)
Other versions
WO1999063583A2 (en
Inventor
Ilya Perlov
Eugene Gantvarg
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Priority to KR1020007013809A priority Critical patent/KR20010052608A/en
Priority to JP2000552710A priority patent/JP2002517900A/en
Publication of WO1999063583A2 publication Critical patent/WO1999063583A2/en
Publication of WO1999063583A3 publication Critical patent/WO1999063583A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Transmission Devices (AREA)

Abstract

An improved mechanism for contacting and moving semiconductor wafers is provided. Specifically, a mechanism having a wafer contacting surface, such as a plurality of wafer lift pins, is driven from a first location (e.g., a wafer platform location) to a wafer contact location (e.g., where the wafer is initially contacted by the wafer lift pins, or where the wafer lift pins bring the wafer in contact with a wafer platform or wafer handler, etc.) via a Geneva drive mechanism having a plurality of stationary zones, a plurality of movement zones, and a plurality of transition points between the stationary zones and movement zones. The Geneva drive mechanism is configured such that as the wafer lift pins reach the wafer contact location the Geneva drive enters a stationary zone. Thus the wafer is contacted with virtually zero velocity.
PCT/US1999/011271 1998-06-05 1999-05-21 Improved method and apparatus for contacting a wafer WO1999063583A2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
KR1020007013809A KR20010052608A (en) 1998-06-05 1999-05-21 Improved method and apparatus for contacting a wafer
JP2000552710A JP2002517900A (en) 1998-06-05 1999-05-21 Improved method and apparatus for contacting a wafer

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US9225998A 1998-06-05 1998-06-05
US09/092,259 1998-06-05

Publications (2)

Publication Number Publication Date
WO1999063583A2 WO1999063583A2 (en) 1999-12-09
WO1999063583A3 true WO1999063583A3 (en) 2000-02-10

Family

ID=22232421

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US1999/011271 WO1999063583A2 (en) 1998-06-05 1999-05-21 Improved method and apparatus for contacting a wafer

Country Status (3)

Country Link
JP (1) JP2002517900A (en)
KR (1) KR20010052608A (en)
WO (1) WO1999063583A2 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6231716B1 (en) * 1998-11-09 2001-05-15 Applied Materials, Inc. Processing chamber with rapid wafer exchange
CN108995111A (en) * 2018-07-18 2018-12-14 曲发生 A kind of foam forming machine
KR20210086748A (en) * 2019-12-30 2021-07-09 세메스 주식회사 Method for lifting substrate and apparatus for treating substrate
CN114318279B (en) * 2021-11-17 2023-09-08 北京北方华创微电子装备有限公司 Motor control device for reaction chamber and semiconductor device

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3972424A (en) * 1973-03-12 1976-08-03 The Computervision Corporation Automatic wafer loading and pre-alignment system
EP0287384A2 (en) * 1987-04-15 1988-10-19 Genus, Inc. Dial deposition and processing apparatus
US4790258A (en) * 1987-04-03 1988-12-13 Tegal Corporation Magnetically coupled wafer lift pins
EP0821404A2 (en) * 1996-07-24 1998-01-28 Applied Materials, Inc. Lift pin and support pin apparatus for a processing chamber

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3972424A (en) * 1973-03-12 1976-08-03 The Computervision Corporation Automatic wafer loading and pre-alignment system
US4790258A (en) * 1987-04-03 1988-12-13 Tegal Corporation Magnetically coupled wafer lift pins
EP0287384A2 (en) * 1987-04-15 1988-10-19 Genus, Inc. Dial deposition and processing apparatus
EP0821404A2 (en) * 1996-07-24 1998-01-28 Applied Materials, Inc. Lift pin and support pin apparatus for a processing chamber

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
"Vertical Wafer Storage System", IBM TECHNICAL DISCLOSURE BULLETIN VOL:16 NR:12 AN:NN74053917, May 1974 (1974-05-01), US, pages 3917 - 3918, XP002123980 *

Also Published As

Publication number Publication date
WO1999063583A2 (en) 1999-12-09
JP2002517900A (en) 2002-06-18
KR20010052608A (en) 2001-06-25

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