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WO1993026137B1 - High performance horizontal diffusion furnace system - Google Patents

High performance horizontal diffusion furnace system

Info

Publication number
WO1993026137B1
WO1993026137B1 PCT/US1993/005546 US9305546W WO9326137B1 WO 1993026137 B1 WO1993026137 B1 WO 1993026137B1 US 9305546 W US9305546 W US 9305546W WO 9326137 B1 WO9326137 B1 WO 9326137B1
Authority
WO
WIPO (PCT)
Prior art keywords
new
furnace
heating element
high temperature
air
Prior art date
Application number
PCT/US1993/005546
Other languages
French (fr)
Other versions
WO1993026137A1 (en
Filing date
Publication date
Priority claimed from US07/898,552 external-priority patent/US5461214A/en
Application filed filed Critical
Priority to DE69332639T priority Critical patent/DE69332639T2/en
Priority to KR1019940704560A priority patent/KR100316069B1/en
Priority to EP93916481A priority patent/EP0645072B1/en
Priority to AT93916481T priority patent/ATE231318T1/en
Priority to JP6501711A priority patent/JPH07509345A/en
Publication of WO1993026137A1 publication Critical patent/WO1993026137A1/en
Publication of WO1993026137B1 publication Critical patent/WO1993026137B1/en

Links

Abstract

Performance of a high temperature diffusion furnace (10) is enhanced by an improved multi-furnace module design (11). The furnace (10) is constructed of materials suitable for clean room environments with an adjustable leveling frame assembly (59). A side out assembly (31) and heating element alignment mechanism (85) of individual furnace tube modules (25) with a heating element hoist mechanism (22) allows for enhanced maintainability. Heat treatment performance is improved by a sealed heating element (12) with individual furnace module cooling system (15, 16, 30). Improved thermal couple (107) is positioned to enhance heat treatment process control and heating element maintainability.

Claims

- -
AMENDED CLAIMS
[received by the International Bureau on 12 January 1994 (12.01.94); original claims unchanged; new claims 10-27 added (4 pages)]
10. (New) An apparatus for enhancing the heat treatment process in a high temperature furnace, comprising: a cylindrical heating element with a load end, the cylindrical heating element having a furnace chamber surrounding a process chamber with an opening at the load end; and an element liner between the process chamber and the furnace chamber allowing for uniform heating in the process chamber.
11. (New) The apparatus of Claim 10, wherein the element liner allows for enhanced dynamic temperature responses in the process chamber.
12. (New) The apparatus of Claim 11, wherein the element liner has a width of 6 millimeters or less.
13. (New) The apparatus of Claim 12, wherein the element liner comprises a ceramic fiber and silicon carbide composite.
14. (New) The apparatus of Claim 13, wherein the element liner comprises Siconex.
15. (New) An apparatus for measuring thermal energy in a high temperature furnace having a radio frequency interference energy field, comprising: a thermal couple; and a silicon carbide layer covering at least a portion of the thermal couple removing radio frequency interference energy.
16. (New) The apparatus of Claim 46, wherein the silicon carbide layer comprises Siconex.
17. (New) An apparatus for measuring the temperature in a high temperature furnace, comprising: a cylindrical heating element having a furnace chamber; and a thermal couple sufficiently immersed in the furnace chamber allowing for precise measurements of temperature.
18. (New) The apparatus of Claim 17, wherein the cylindrical heating element includes: a furnace chamber surrounding a process chamber with a source end, the furnace chamber having a bore at the source end for inserting the thermal couple.
19. (New) The apparatus of Claim 18, wherein the cylindrical heating element having a center-line longitudinal axis and the furnace chamber bore having a center-line longitudinal axis parallel to the cylindrical heating element center-line longitudinal axis.
20. (New) An apparatus for cooling a plurality of heating elements radiating thermal energy in a high temperature furnace using a source of air, comprising: means for producing independent flows of air from the source of air over the plurality of heating elements, respectively.
21. (New) The apparatus of Claim 20, wherein the means for producing independent flows of air includes: means for extracting the source of air producing a flow of air over a first heating element radiating thermal energy which transfers the thermal energy of the first heating element to the flow of air; and means for separating the flow of air across the first heating element from a second heating element.
22. (New) The apparatus of Claim 21, wherein the means for extracting the source of air includes: an air intake vent; - 28 -
a fan positioned for extracting the source of air through the air intake vent producing a flow of air over the first heating element; and a flume for exhausting the flow of air from the high temperature furnace.
23. (New) An apparatus for allowing access to a furnace module in a high temperature furnace having a load end, an opposing end, a front side and a back side, comprising: a frame supporting the high temperature furnace; and means, coupled to the frame, for removing the furnace module laterally from a side of the high temperature furnace.
24. (New) The apparatus of the Claim 23, wherein the frame includes: a cantilever member means extending from the back side toward the front side for positioning the furnace module.
25. (New) The apparatus of Claim 24, wherein the means for removing the furnace module includes: a drawer slider coupled to the cantilever member; and a bulkhead coupling the drawer slider and the furnace module such that the furnace module may extend laterally from the front side of the high temperature furnace.
26. (New) The apparatus of Claim 24, wherein the furnace module includes a heating element and further comprises; means for transferring the heating element to or from the high temperature furnace.
27. (New) The apparatus of Claim 26, wherein the means for transferring the heating element includes: a beam coupled to the high temperature furnace; a first cable extending from the beam; means, coupled to the first cable, for attaching the first cable to the heating element; and - 29 -
means for moving the first cable allowing the heating element to be transferred to or from the high temperature furnace.
PCT/US1993/005546 1992-06-15 1993-06-09 High performance horizontal diffusion furnace system WO1993026137A1 (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
DE69332639T DE69332639T2 (en) 1992-06-15 1993-06-09 RIGHT RIGHT DIFFUSION OVEN WITH HIGH PERFORMANCE
KR1019940704560A KR100316069B1 (en) 1992-06-15 1993-06-09 High Performance Horizontal Diffusion Furnace System
EP93916481A EP0645072B1 (en) 1992-06-15 1993-06-09 High performance horizontal diffusion furnace system
AT93916481T ATE231318T1 (en) 1992-06-15 1993-06-09 HIGH PERFORMANCE HORIZONTAL DIFFUSION FURNACE
JP6501711A JPH07509345A (en) 1992-06-15 1993-06-09 High performance horizontal diffusion furnace equipment

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US898,552 1986-08-21
US07/898,552 US5461214A (en) 1992-06-15 1992-06-15 High performance horizontal diffusion furnace system

Publications (2)

Publication Number Publication Date
WO1993026137A1 WO1993026137A1 (en) 1993-12-23
WO1993026137B1 true WO1993026137B1 (en) 1994-02-17

Family

ID=25409614

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US1993/005546 WO1993026137A1 (en) 1992-06-15 1993-06-09 High performance horizontal diffusion furnace system

Country Status (8)

Country Link
US (5) US5461214A (en)
EP (1) EP0645072B1 (en)
JP (3) JPH07509345A (en)
KR (1) KR100316069B1 (en)
AT (1) ATE231318T1 (en)
DE (1) DE69332639T2 (en)
ES (1) ES2191665T3 (en)
WO (1) WO1993026137A1 (en)

Families Citing this family (303)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5960158A (en) 1997-07-11 1999-09-28 Ag Associates Apparatus and method for filtering light in a thermal processing chamber
US6063234A (en) * 1997-09-10 2000-05-16 Lam Research Corporation Temperature sensing system for use in a radio frequency environment
JP3788855B2 (en) * 1997-09-11 2006-06-21 大日本スクリーン製造株式会社 Substrate processing unit and substrate processing apparatus using the same
US5970214A (en) 1998-05-14 1999-10-19 Ag Associates Heating device for semiconductor wafers
US5930456A (en) 1998-05-14 1999-07-27 Ag Associates Heating device for semiconductor wafers
US6224678B1 (en) * 1998-08-12 2001-05-01 Advanced Micro Devices, Inc. Modified thermocouple mounting bushing and system including the same
US6210484B1 (en) 1998-09-09 2001-04-03 Steag Rtp Systems, Inc. Heating device containing a multi-lamp cone for heating semiconductor wafers
US6375081B1 (en) 1999-02-02 2002-04-23 The Standard Register Company Business form including smart card and smart card reader
US6496648B1 (en) * 1999-08-19 2002-12-17 Prodeo Technologies, Inc. Apparatus and method for rapid thermal processing
US6227140B1 (en) * 1999-09-23 2001-05-08 Lam Research Corporation Semiconductor processing equipment having radiant heated ceramic liner
US20040114665A1 (en) * 2002-12-12 2004-06-17 Sun Park Cantilevered thermocouple rake
US6857776B2 (en) * 2002-12-12 2005-02-22 Ametek, Inc. Connectorized high-temperature thermocouple
JP3910151B2 (en) * 2003-04-01 2007-04-25 東京エレクトロン株式会社 Heat treatment method and heat treatment apparatus
US6807220B1 (en) 2003-05-23 2004-10-19 Mrl Industries Retention mechanism for heating coil of high temperature diffusion furnace
US7762949B2 (en) * 2003-10-16 2010-07-27 Granit Medical Innovation, Llc Endoscope with open channels
JP4246654B2 (en) * 2004-03-08 2009-04-02 株式会社日立ハイテクノロジーズ Vacuum processing equipment
CN100383912C (en) * 2005-01-11 2008-04-23 中芯国际集成电路制造(上海)有限公司 High temperature wafer test oven
US7335864B2 (en) * 2005-06-01 2008-02-26 Mrl Industries, Inc. Magnetic field reduction resistive heating elements
US20060275933A1 (en) * 2005-06-02 2006-12-07 Applied Materials, Inc. Thermally conductive ceramic tipped contact thermocouple
US20080314892A1 (en) * 2007-06-25 2008-12-25 Graham Robert G Radiant shield
JP2010024649A (en) * 2008-07-16 2010-02-04 Oki Semiconductor Co Ltd Seismic strengthening structure and seismic strengthening method for double floor
US8394229B2 (en) * 2008-08-07 2013-03-12 Asm America, Inc. Susceptor ring
US8395096B2 (en) * 2009-02-05 2013-03-12 Sandvik Thermal Process, Inc. Precision strip heating element
US9394608B2 (en) 2009-04-06 2016-07-19 Asm America, Inc. Semiconductor processing reactor and components thereof
US8802201B2 (en) 2009-08-14 2014-08-12 Asm America, Inc. Systems and methods for thin-film deposition of metal oxides using excited nitrogen-oxygen species
US20120168143A1 (en) * 2010-12-30 2012-07-05 Poole Ventura, Inc. Thermal Diffusion Chamber With Heat Exchanger
US20130023129A1 (en) 2011-07-20 2013-01-24 Asm America, Inc. Pressure transmitter for a semiconductor processing environment
US9017481B1 (en) 2011-10-28 2015-04-28 Asm America, Inc. Process feed management for semiconductor substrate processing
US9188489B2 (en) * 2011-12-01 2015-11-17 Rosemount Inc. Twisted sensor tube
US10714315B2 (en) 2012-10-12 2020-07-14 Asm Ip Holdings B.V. Semiconductor reaction chamber showerhead
US20160376700A1 (en) 2013-02-01 2016-12-29 Asm Ip Holding B.V. System for treatment of deposition reactor
US9416731B2 (en) * 2013-10-31 2016-08-16 General Electric Company Thermocouple assembly
US11015245B2 (en) 2014-03-19 2021-05-25 Asm Ip Holding B.V. Gas-phase reactor and system having exhaust plenum and components thereof
US10858737B2 (en) 2014-07-28 2020-12-08 Asm Ip Holding B.V. Showerhead assembly and components thereof
US9890456B2 (en) 2014-08-21 2018-02-13 Asm Ip Holding B.V. Method and system for in situ formation of gas-phase compounds
US10941490B2 (en) 2014-10-07 2021-03-09 Asm Ip Holding B.V. Multiple temperature range susceptor, assembly, reactor and system including the susceptor, and methods of using the same
US10276355B2 (en) 2015-03-12 2019-04-30 Asm Ip Holding B.V. Multi-zone reactor, system including the reactor, and method of using the same
US10458018B2 (en) 2015-06-26 2019-10-29 Asm Ip Holding B.V. Structures including metal carbide material, devices including the structures, and methods of forming same
JP6075423B1 (en) * 2015-09-03 2017-02-08 株式会社明電舎 Vacuum circuit breaker
US10211308B2 (en) 2015-10-21 2019-02-19 Asm Ip Holding B.V. NbMC layers
CN105937051A (en) * 2015-11-27 2016-09-14 上海广奕电子科技股份有限公司 Safety protection device of a vertical diffusion furnace
US11139308B2 (en) 2015-12-29 2021-10-05 Asm Ip Holding B.V. Atomic layer deposition of III-V compounds to form V-NAND devices
US10529554B2 (en) 2016-02-19 2020-01-07 Asm Ip Holding B.V. Method for forming silicon nitride film selectively on sidewalls or flat surfaces of trenches
NL2016334B1 (en) * 2016-02-29 2017-09-11 Tempress Ip B V Horizontal furnace system and method for handling wafer boats, and wafer boat.
US10190213B2 (en) 2016-04-21 2019-01-29 Asm Ip Holding B.V. Deposition of metal borides
US10865475B2 (en) 2016-04-21 2020-12-15 Asm Ip Holding B.V. Deposition of metal borides and silicides
US10367080B2 (en) 2016-05-02 2019-07-30 Asm Ip Holding B.V. Method of forming a germanium oxynitride film
US11453943B2 (en) 2016-05-25 2022-09-27 Asm Ip Holding B.V. Method for forming carbon-containing silicon/metal oxide or nitride film by ALD using silicon precursor and hydrocarbon precursor
US9859151B1 (en) 2016-07-08 2018-01-02 Asm Ip Holding B.V. Selective film deposition method to form air gaps
US10612137B2 (en) 2016-07-08 2020-04-07 Asm Ip Holdings B.V. Organic reactants for atomic layer deposition
US9812320B1 (en) 2016-07-28 2017-11-07 Asm Ip Holding B.V. Method and apparatus for filling a gap
KR102532607B1 (en) 2016-07-28 2023-05-15 에이에스엠 아이피 홀딩 비.브이. Substrate processing apparatus and method of operating the same
US9887082B1 (en) 2016-07-28 2018-02-06 Asm Ip Holding B.V. Method and apparatus for filling a gap
US10643826B2 (en) 2016-10-26 2020-05-05 Asm Ip Holdings B.V. Methods for thermally calibrating reaction chambers
US11532757B2 (en) 2016-10-27 2022-12-20 Asm Ip Holding B.V. Deposition of charge trapping layers
US10714350B2 (en) 2016-11-01 2020-07-14 ASM IP Holdings, B.V. Methods for forming a transition metal niobium nitride film on a substrate by atomic layer deposition and related semiconductor device structures
US10229833B2 (en) 2016-11-01 2019-03-12 Asm Ip Holding B.V. Methods for forming a transition metal nitride film on a substrate by atomic layer deposition and related semiconductor device structures
KR102546317B1 (en) 2016-11-15 2023-06-21 에이에스엠 아이피 홀딩 비.브이. Gas supply unit and substrate processing apparatus including the same
KR20180068582A (en) 2016-12-14 2018-06-22 에이에스엠 아이피 홀딩 비.브이. Substrate processing apparatus
US11581186B2 (en) 2016-12-15 2023-02-14 Asm Ip Holding B.V. Sequential infiltration synthesis apparatus
US11447861B2 (en) 2016-12-15 2022-09-20 Asm Ip Holding B.V. Sequential infiltration synthesis apparatus and a method of forming a patterned structure
KR102700194B1 (en) 2016-12-19 2024-08-28 에이에스엠 아이피 홀딩 비.브이. Substrate processing apparatus
US10269558B2 (en) 2016-12-22 2019-04-23 Asm Ip Holding B.V. Method of forming a structure on a substrate
US10867788B2 (en) 2016-12-28 2020-12-15 Asm Ip Holding B.V. Method of forming a structure on a substrate
US11390950B2 (en) 2017-01-10 2022-07-19 Asm Ip Holding B.V. Reactor system and method to reduce residue buildup during a film deposition process
US10468261B2 (en) 2017-02-15 2019-11-05 Asm Ip Holding B.V. Methods for forming a metallic film on a substrate by cyclical deposition and related semiconductor device structures
US10529563B2 (en) 2017-03-29 2020-01-07 Asm Ip Holdings B.V. Method for forming doped metal oxide films on a substrate by cyclical deposition and related semiconductor device structures
KR102457289B1 (en) 2017-04-25 2022-10-21 에이에스엠 아이피 홀딩 비.브이. Method for depositing a thin film and manufacturing a semiconductor device
US10770286B2 (en) 2017-05-08 2020-09-08 Asm Ip Holdings B.V. Methods for selectively forming a silicon nitride film on a substrate and related semiconductor device structures
US10892156B2 (en) 2017-05-08 2021-01-12 Asm Ip Holding B.V. Methods for forming a silicon nitride film on a substrate and related semiconductor device structures
US10886123B2 (en) 2017-06-02 2021-01-05 Asm Ip Holding B.V. Methods for forming low temperature semiconductor layers and related semiconductor device structures
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US11306395B2 (en) 2017-06-28 2022-04-19 Asm Ip Holding B.V. Methods for depositing a transition metal nitride film on a substrate by atomic layer deposition and related deposition apparatus
KR20190009245A (en) 2017-07-18 2019-01-28 에이에스엠 아이피 홀딩 비.브이. Methods for forming a semiconductor device structure and related semiconductor device structures
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US11018002B2 (en) 2017-07-19 2021-05-25 Asm Ip Holding B.V. Method for selectively depositing a Group IV semiconductor and related semiconductor device structures
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US11295980B2 (en) 2017-08-30 2022-04-05 Asm Ip Holding B.V. Methods for depositing a molybdenum metal film over a dielectric surface of a substrate by a cyclical deposition process and related semiconductor device structures
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RU2684335C2 (en) * 2017-09-04 2019-04-08 Акционерное Общество "Новосибирский Завод Полупроводниковых Приборов С Окб" (Ао "Нзпп С Окб") Console device for horizontal contactless driving of semiconductor plates in diffusion furnace
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WO2019103613A1 (en) 2017-11-27 2019-05-31 Asm Ip Holding B.V. A storage device for storing wafer cassettes for use with a batch furnace
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US10872771B2 (en) 2018-01-16 2020-12-22 Asm Ip Holding B. V. Method for depositing a material film on a substrate within a reaction chamber by a cyclical deposition process and related device structures
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US12025484B2 (en) 2018-05-08 2024-07-02 Asm Ip Holding B.V. Thin film forming method
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TW202349473A (en) 2018-05-11 2023-12-16 荷蘭商Asm Ip私人控股有限公司 Methods for forming a doped metal carbide film on a substrate and related semiconductor device structures
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US10612136B2 (en) 2018-06-29 2020-04-07 ASM IP Holding, B.V. Temperature-controlled flange and reactor system including same
US10755922B2 (en) 2018-07-03 2020-08-25 Asm Ip Holding B.V. Method for depositing silicon-free carbon-containing film as gap-fill layer by pulse plasma-assisted deposition
US10388513B1 (en) 2018-07-03 2019-08-20 Asm Ip Holding B.V. Method for depositing silicon-free carbon-containing film as gap-fill layer by pulse plasma-assisted deposition
US10767789B2 (en) 2018-07-16 2020-09-08 Asm Ip Holding B.V. Diaphragm valves, valve components, and methods for forming valve components
US11053591B2 (en) 2018-08-06 2021-07-06 Asm Ip Holding B.V. Multi-port gas injection system and reactor system including same
US10883175B2 (en) 2018-08-09 2021-01-05 Asm Ip Holding B.V. Vertical furnace for processing substrates and a liner for use therein
US10829852B2 (en) 2018-08-16 2020-11-10 Asm Ip Holding B.V. Gas distribution device for a wafer processing apparatus
US11430674B2 (en) 2018-08-22 2022-08-30 Asm Ip Holding B.V. Sensor array, apparatus for dispensing a vapor phase reactant to a reaction chamber and related methods
KR102707956B1 (en) 2018-09-11 2024-09-19 에이에스엠 아이피 홀딩 비.브이. Method for deposition of a thin film
US11024523B2 (en) 2018-09-11 2021-06-01 Asm Ip Holding B.V. Substrate processing apparatus and method
US11049751B2 (en) 2018-09-14 2021-06-29 Asm Ip Holding B.V. Cassette supply system to store and handle cassettes and processing apparatus equipped therewith
CN110970344B (en) 2018-10-01 2024-10-25 Asmip控股有限公司 Substrate holding apparatus, system comprising the same and method of using the same
US11232963B2 (en) 2018-10-03 2022-01-25 Asm Ip Holding B.V. Substrate processing apparatus and method
KR102592699B1 (en) 2018-10-08 2023-10-23 에이에스엠 아이피 홀딩 비.브이. Substrate support unit and apparatuses for depositing thin film and processing the substrate including the same
KR102546322B1 (en) 2018-10-19 2023-06-21 에이에스엠 아이피 홀딩 비.브이. Substrate processing apparatus and substrate processing method
KR102605121B1 (en) 2018-10-19 2023-11-23 에이에스엠 아이피 홀딩 비.브이. Substrate processing apparatus and substrate processing method
USD948463S1 (en) 2018-10-24 2022-04-12 Asm Ip Holding B.V. Susceptor for semiconductor substrate supporting apparatus
US11087997B2 (en) 2018-10-31 2021-08-10 Asm Ip Holding B.V. Substrate processing apparatus for processing substrates
KR20200051105A (en) 2018-11-02 2020-05-13 에이에스엠 아이피 홀딩 비.브이. Substrate support unit and substrate processing apparatus including the same
US11572620B2 (en) 2018-11-06 2023-02-07 Asm Ip Holding B.V. Methods for selectively depositing an amorphous silicon film on a substrate
US11031242B2 (en) 2018-11-07 2021-06-08 Asm Ip Holding B.V. Methods for depositing a boron doped silicon germanium film
US10847366B2 (en) 2018-11-16 2020-11-24 Asm Ip Holding B.V. Methods for depositing a transition metal chalcogenide film on a substrate by a cyclical deposition process
US10818758B2 (en) 2018-11-16 2020-10-27 Asm Ip Holding B.V. Methods for forming a metal silicate film on a substrate in a reaction chamber and related semiconductor device structures
US12040199B2 (en) 2018-11-28 2024-07-16 Asm Ip Holding B.V. Substrate processing apparatus for processing substrates
US11217444B2 (en) 2018-11-30 2022-01-04 Asm Ip Holding B.V. Method for forming an ultraviolet radiation responsive metal oxide-containing film
KR102636428B1 (en) 2018-12-04 2024-02-13 에이에스엠 아이피 홀딩 비.브이. A method for cleaning a substrate processing apparatus
US11158513B2 (en) 2018-12-13 2021-10-26 Asm Ip Holding B.V. Methods for forming a rhenium-containing film on a substrate by a cyclical deposition process and related semiconductor device structures
TW202037745A (en) 2018-12-14 2020-10-16 荷蘭商Asm Ip私人控股有限公司 Method of forming device structure, structure formed by the method and system for performing the method
US11961756B2 (en) 2019-01-17 2024-04-16 Asm Ip Holding B.V. Vented susceptor
USD914620S1 (en) 2019-01-17 2021-03-30 Asm Ip Holding B.V. Vented susceptor
USD920936S1 (en) 2019-01-17 2021-06-01 Asm Ip Holding B.V. Higher temperature vented susceptor
TW202405220A (en) 2019-01-17 2024-02-01 荷蘭商Asm Ip 私人控股有限公司 Methods of forming a transition metal containing film on a substrate by a cyclical deposition process
TWI756590B (en) 2019-01-22 2022-03-01 荷蘭商Asm Ip私人控股有限公司 Substrate processing device
CN111524788B (en) 2019-02-01 2023-11-24 Asm Ip私人控股有限公司 Method for topologically selective film formation of silicon oxide
TWI845607B (en) 2019-02-20 2024-06-21 荷蘭商Asm Ip私人控股有限公司 Cyclical deposition method and apparatus for filling a recess formed within a substrate surface
JP2020136678A (en) 2019-02-20 2020-08-31 エーエスエム・アイピー・ホールディング・ベー・フェー Method for filing concave part formed inside front surface of base material, and device
US11482533B2 (en) 2019-02-20 2022-10-25 Asm Ip Holding B.V. Apparatus and methods for plug fill deposition in 3-D NAND applications
KR102626263B1 (en) 2019-02-20 2024-01-16 에이에스엠 아이피 홀딩 비.브이. Cyclical deposition method including treatment step and apparatus for same
TWI842826B (en) 2019-02-22 2024-05-21 荷蘭商Asm Ip私人控股有限公司 Substrate processing apparatus and method for processing substrate
KR20200108243A (en) 2019-03-08 2020-09-17 에이에스엠 아이피 홀딩 비.브이. Structure Including SiOC Layer and Method of Forming Same
KR20200108242A (en) 2019-03-08 2020-09-17 에이에스엠 아이피 홀딩 비.브이. Method for Selective Deposition of Silicon Nitride Layer and Structure Including Selectively-Deposited Silicon Nitride Layer
US11742198B2 (en) 2019-03-08 2023-08-29 Asm Ip Holding B.V. Structure including SiOCN layer and method of forming same
JP2020167398A (en) 2019-03-28 2020-10-08 エーエスエム・アイピー・ホールディング・ベー・フェー Door opener and substrate processing apparatus provided therewith
KR20200116855A (en) 2019-04-01 2020-10-13 에이에스엠 아이피 홀딩 비.브이. Method of manufacturing semiconductor device
US11447864B2 (en) 2019-04-19 2022-09-20 Asm Ip Holding B.V. Layer forming method and apparatus
KR20200125453A (en) 2019-04-24 2020-11-04 에이에스엠 아이피 홀딩 비.브이. Gas-phase reactor system and method of using same
KR20200130121A (en) 2019-05-07 2020-11-18 에이에스엠 아이피 홀딩 비.브이. Chemical source vessel with dip tube
KR20200130118A (en) 2019-05-07 2020-11-18 에이에스엠 아이피 홀딩 비.브이. Method for Reforming Amorphous Carbon Polymer Film
KR20200130652A (en) 2019-05-10 2020-11-19 에이에스엠 아이피 홀딩 비.브이. Method of depositing material onto a surface and structure formed according to the method
JP2020188254A (en) 2019-05-16 2020-11-19 エーエスエム アイピー ホールディング ビー.ブイ. Wafer boat handling device, vertical batch furnace, and method
JP2020188255A (en) 2019-05-16 2020-11-19 エーエスエム アイピー ホールディング ビー.ブイ. Wafer boat handling device, vertical batch furnace, and method
USD947913S1 (en) 2019-05-17 2022-04-05 Asm Ip Holding B.V. Susceptor shaft
USD975665S1 (en) 2019-05-17 2023-01-17 Asm Ip Holding B.V. Susceptor shaft
TWI845682B (en) 2019-05-22 2024-06-21 荷蘭商Asm Ip私人控股有限公司 Workpiece susceptor body
USD935572S1 (en) 2019-05-24 2021-11-09 Asm Ip Holding B.V. Gas channel plate
USD922229S1 (en) 2019-06-05 2021-06-15 Asm Ip Holding B.V. Device for controlling a temperature of a gas supply unit
KR20200141003A (en) 2019-06-06 2020-12-17 에이에스엠 아이피 홀딩 비.브이. Gas-phase reactor system including a gas detector
KR20200143254A (en) 2019-06-11 2020-12-23 에이에스엠 아이피 홀딩 비.브이. Method of forming an electronic structure using an reforming gas, system for performing the method, and structure formed using the method
USD944946S1 (en) 2019-06-14 2022-03-01 Asm Ip Holding B.V. Shower plate
USD931978S1 (en) 2019-06-27 2021-09-28 Asm Ip Holding B.V. Showerhead vacuum transport
CN114051651A (en) * 2019-07-01 2022-02-15 株式会社国际电气 Substrate processing apparatus, method for manufacturing semiconductor device, and program
KR20210005515A (en) 2019-07-03 2021-01-14 에이에스엠 아이피 홀딩 비.브이. Temperature control assembly for substrate processing apparatus and method of using same
JP7499079B2 (en) 2019-07-09 2024-06-13 エーエスエム・アイピー・ホールディング・ベー・フェー Plasma device using coaxial waveguide and substrate processing method
CN112216646A (en) 2019-07-10 2021-01-12 Asm Ip私人控股有限公司 Substrate supporting assembly and substrate processing device comprising same
KR20210010307A (en) 2019-07-16 2021-01-27 에이에스엠 아이피 홀딩 비.브이. Substrate processing apparatus
KR20210010816A (en) 2019-07-17 2021-01-28 에이에스엠 아이피 홀딩 비.브이. Radical assist ignition plasma system and method
KR20210010820A (en) 2019-07-17 2021-01-28 에이에스엠 아이피 홀딩 비.브이. Methods of forming silicon germanium structures
US11643724B2 (en) 2019-07-18 2023-05-09 Asm Ip Holding B.V. Method of forming structures using a neutral beam
KR20210010817A (en) 2019-07-19 2021-01-28 에이에스엠 아이피 홀딩 비.브이. Method of Forming Topology-Controlled Amorphous Carbon Polymer Film
TWI839544B (en) 2019-07-19 2024-04-21 荷蘭商Asm Ip私人控股有限公司 Method of forming topology-controlled amorphous carbon polymer film
CN112309843A (en) 2019-07-29 2021-02-02 Asm Ip私人控股有限公司 Selective deposition method for achieving high dopant doping
CN112309899A (en) 2019-07-30 2021-02-02 Asm Ip私人控股有限公司 Substrate processing apparatus
CN112309900A (en) 2019-07-30 2021-02-02 Asm Ip私人控股有限公司 Substrate processing apparatus
US11587815B2 (en) 2019-07-31 2023-02-21 Asm Ip Holding B.V. Vertical batch furnace assembly
US11587814B2 (en) 2019-07-31 2023-02-21 Asm Ip Holding B.V. Vertical batch furnace assembly
US11227782B2 (en) 2019-07-31 2022-01-18 Asm Ip Holding B.V. Vertical batch furnace assembly
KR20210018759A (en) 2019-08-05 2021-02-18 에이에스엠 아이피 홀딩 비.브이. Liquid level sensor for a chemical source vessel
USD965044S1 (en) 2019-08-19 2022-09-27 Asm Ip Holding B.V. Susceptor shaft
USD965524S1 (en) 2019-08-19 2022-10-04 Asm Ip Holding B.V. Susceptor support
JP2021031769A (en) 2019-08-21 2021-03-01 エーエスエム アイピー ホールディング ビー.ブイ. Production apparatus of mixed gas of film deposition raw material and film deposition apparatus
KR20210024423A (en) 2019-08-22 2021-03-05 에이에스엠 아이피 홀딩 비.브이. Method for forming a structure with a hole
USD949319S1 (en) 2019-08-22 2022-04-19 Asm Ip Holding B.V. Exhaust duct
USD940837S1 (en) 2019-08-22 2022-01-11 Asm Ip Holding B.V. Electrode
USD930782S1 (en) 2019-08-22 2021-09-14 Asm Ip Holding B.V. Gas distributor
USD979506S1 (en) 2019-08-22 2023-02-28 Asm Ip Holding B.V. Insulator
US11286558B2 (en) 2019-08-23 2022-03-29 Asm Ip Holding B.V. Methods for depositing a molybdenum nitride film on a surface of a substrate by a cyclical deposition process and related semiconductor device structures including a molybdenum nitride film
KR20210024420A (en) 2019-08-23 2021-03-05 에이에스엠 아이피 홀딩 비.브이. Method for depositing silicon oxide film having improved quality by peald using bis(diethylamino)silane
KR20210029090A (en) 2019-09-04 2021-03-15 에이에스엠 아이피 홀딩 비.브이. Methods for selective deposition using a sacrificial capping layer
KR20210029663A (en) 2019-09-05 2021-03-16 에이에스엠 아이피 홀딩 비.브이. Substrate processing apparatus
US11562901B2 (en) 2019-09-25 2023-01-24 Asm Ip Holding B.V. Substrate processing method
CN112593212B (en) 2019-10-02 2023-12-22 Asm Ip私人控股有限公司 Method for forming topologically selective silicon oxide film by cyclic plasma enhanced deposition process
KR20210042810A (en) 2019-10-08 2021-04-20 에이에스엠 아이피 홀딩 비.브이. Reactor system including a gas distribution assembly for use with activated species and method of using same
TWI846953B (en) 2019-10-08 2024-07-01 荷蘭商Asm Ip私人控股有限公司 Substrate processing device
KR20210043460A (en) 2019-10-10 2021-04-21 에이에스엠 아이피 홀딩 비.브이. Method of forming a photoresist underlayer and structure including same
US12009241B2 (en) 2019-10-14 2024-06-11 Asm Ip Holding B.V. Vertical batch furnace assembly with detector to detect cassette
TWI834919B (en) 2019-10-16 2024-03-11 荷蘭商Asm Ip私人控股有限公司 Method of topology-selective film formation of silicon oxide
US11637014B2 (en) 2019-10-17 2023-04-25 Asm Ip Holding B.V. Methods for selective deposition of doped semiconductor material
KR20210047808A (en) 2019-10-21 2021-04-30 에이에스엠 아이피 홀딩 비.브이. Apparatus and methods for selectively etching films
US11764101B2 (en) 2019-10-24 2023-09-19 ASM IP Holding, B.V. Susceptor for semiconductor substrate processing
KR20210050453A (en) 2019-10-25 2021-05-07 에이에스엠 아이피 홀딩 비.브이. Methods for filling a gap feature on a substrate surface and related semiconductor structures
KR20210053193A (en) 2019-10-29 2021-05-11 에이에스엠 아이피 홀딩 비.브이. Methods of selectively forming n-type doped material on a surface, systems for selectively forming n-type doped material, and structures formed using same
KR20210054983A (en) 2019-11-05 2021-05-14 에이에스엠 아이피 홀딩 비.브이. Structures with doped semiconductor layers and methods and systems for forming same
US11501968B2 (en) 2019-11-15 2022-11-15 Asm Ip Holding B.V. Method for providing a semiconductor device with silicon filled gaps
KR20210062561A (en) 2019-11-20 2021-05-31 에이에스엠 아이피 홀딩 비.브이. Method of depositing carbon-containing material on a surface of a substrate, structure formed using the method, and system for forming the structure
US11450529B2 (en) 2019-11-26 2022-09-20 Asm Ip Holding B.V. Methods for selectively forming a target film on a substrate comprising a first dielectric surface and a second metallic surface
CN112951697A (en) 2019-11-26 2021-06-11 Asm Ip私人控股有限公司 Substrate processing apparatus
CN112885692A (en) 2019-11-29 2021-06-01 Asm Ip私人控股有限公司 Substrate processing apparatus
CN112885693A (en) 2019-11-29 2021-06-01 Asm Ip私人控股有限公司 Substrate processing apparatus
JP7527928B2 (en) 2019-12-02 2024-08-05 エーエスエム・アイピー・ホールディング・ベー・フェー Substrate processing apparatus and substrate processing method
KR20210070898A (en) 2019-12-04 2021-06-15 에이에스엠 아이피 홀딩 비.브이. Substrate processing apparatus
US11885013B2 (en) 2019-12-17 2024-01-30 Asm Ip Holding B.V. Method of forming vanadium nitride layer and structure including the vanadium nitride layer
KR20210080214A (en) 2019-12-19 2021-06-30 에이에스엠 아이피 홀딩 비.브이. Methods for filling a gap feature on a substrate and related semiconductor structures
JP2021111783A (en) 2020-01-06 2021-08-02 エーエスエム・アイピー・ホールディング・ベー・フェー Channeled lift pin
JP2021109175A (en) 2020-01-06 2021-08-02 エーエスエム・アイピー・ホールディング・ベー・フェー Gas supply assembly, components thereof, and reactor system including the same
US11993847B2 (en) 2020-01-08 2024-05-28 Asm Ip Holding B.V. Injector
KR20210093163A (en) 2020-01-16 2021-07-27 에이에스엠 아이피 홀딩 비.브이. Method of forming high aspect ratio features
KR102675856B1 (en) 2020-01-20 2024-06-17 에이에스엠 아이피 홀딩 비.브이. Method of forming thin film and method of modifying surface of thin film
TW202130846A (en) 2020-02-03 2021-08-16 荷蘭商Asm Ip私人控股有限公司 Method of forming structures including a vanadium or indium layer
KR20210100010A (en) 2020-02-04 2021-08-13 에이에스엠 아이피 홀딩 비.브이. Method and apparatus for transmittance measurements of large articles
US11776846B2 (en) 2020-02-07 2023-10-03 Asm Ip Holding B.V. Methods for depositing gap filling fluids and related systems and devices
US11781243B2 (en) 2020-02-17 2023-10-10 Asm Ip Holding B.V. Method for depositing low temperature phosphorous-doped silicon
TW202203344A (en) 2020-02-28 2022-01-16 荷蘭商Asm Ip控股公司 System dedicated for parts cleaning
KR20210116249A (en) 2020-03-11 2021-09-27 에이에스엠 아이피 홀딩 비.브이. lockout tagout assembly and system and method of using same
KR20210116240A (en) 2020-03-11 2021-09-27 에이에스엠 아이피 홀딩 비.브이. Substrate handling device with adjustable joints
KR20210117157A (en) 2020-03-12 2021-09-28 에이에스엠 아이피 홀딩 비.브이. Method for Fabricating Layer Structure Having Target Topological Profile
KR20210124042A (en) 2020-04-02 2021-10-14 에이에스엠 아이피 홀딩 비.브이. Thin film forming method
TW202146689A (en) 2020-04-03 2021-12-16 荷蘭商Asm Ip控股公司 Method for forming barrier layer and method for manufacturing semiconductor device
TW202145344A (en) 2020-04-08 2021-12-01 荷蘭商Asm Ip私人控股有限公司 Apparatus and methods for selectively etching silcon oxide films
KR20210128343A (en) 2020-04-15 2021-10-26 에이에스엠 아이피 홀딩 비.브이. Method of forming chromium nitride layer and structure including the chromium nitride layer
US11821078B2 (en) 2020-04-15 2023-11-21 Asm Ip Holding B.V. Method for forming precoat film and method for forming silicon-containing film
US11996289B2 (en) 2020-04-16 2024-05-28 Asm Ip Holding B.V. Methods of forming structures including silicon germanium and silicon layers, devices formed using the methods, and systems for performing the methods
KR20210132605A (en) 2020-04-24 2021-11-04 에이에스엠 아이피 홀딩 비.브이. Vertical batch furnace assembly comprising a cooling gas supply
CN113555279A (en) 2020-04-24 2021-10-26 Asm Ip私人控股有限公司 Method of forming vanadium nitride-containing layers and structures including the same
KR20210132600A (en) 2020-04-24 2021-11-04 에이에스엠 아이피 홀딩 비.브이. Methods and systems for depositing a layer comprising vanadium, nitrogen, and a further element
KR20210134226A (en) 2020-04-29 2021-11-09 에이에스엠 아이피 홀딩 비.브이. Solid source precursor vessel
KR20210134869A (en) 2020-05-01 2021-11-11 에이에스엠 아이피 홀딩 비.브이. Fast FOUP swapping with a FOUP handler
JP2021177545A (en) 2020-05-04 2021-11-11 エーエスエム・アイピー・ホールディング・ベー・フェー Substrate processing system for processing substrates
KR20210141379A (en) 2020-05-13 2021-11-23 에이에스엠 아이피 홀딩 비.브이. Laser alignment fixture for a reactor system
TW202146699A (en) 2020-05-15 2021-12-16 荷蘭商Asm Ip私人控股有限公司 Method of forming a silicon germanium layer, semiconductor structure, semiconductor device, method of forming a deposition layer, and deposition system
KR20210143653A (en) 2020-05-19 2021-11-29 에이에스엠 아이피 홀딩 비.브이. Substrate processing apparatus
KR20210145078A (en) 2020-05-21 2021-12-01 에이에스엠 아이피 홀딩 비.브이. Structures including multiple carbon layers and methods of forming and using same
TW202200837A (en) 2020-05-22 2022-01-01 荷蘭商Asm Ip私人控股有限公司 Reaction system for forming thin film on substrate
TW202201602A (en) 2020-05-29 2022-01-01 荷蘭商Asm Ip私人控股有限公司 Substrate processing device
TW202212620A (en) 2020-06-02 2022-04-01 荷蘭商Asm Ip私人控股有限公司 Apparatus for processing substrate, method of forming film, and method of controlling apparatus for processing substrate
TW202218133A (en) 2020-06-24 2022-05-01 荷蘭商Asm Ip私人控股有限公司 Method for forming a layer provided with silicon
TW202217953A (en) 2020-06-30 2022-05-01 荷蘭商Asm Ip私人控股有限公司 Substrate processing method
KR102707957B1 (en) 2020-07-08 2024-09-19 에이에스엠 아이피 홀딩 비.브이. Method for processing a substrate
CN111748679A (en) * 2020-07-15 2020-10-09 郭斌 High-temperature wear-resistant and corrosion-resistant aluminum hot processing furnace
TW202219628A (en) 2020-07-17 2022-05-16 荷蘭商Asm Ip私人控股有限公司 Structures and methods for use in photolithography
TW202204662A (en) 2020-07-20 2022-02-01 荷蘭商Asm Ip私人控股有限公司 Method and system for depositing molybdenum layers
US12040177B2 (en) 2020-08-18 2024-07-16 Asm Ip Holding B.V. Methods for forming a laminate film by cyclical plasma-enhanced deposition processes
TW202212623A (en) 2020-08-26 2022-04-01 荷蘭商Asm Ip私人控股有限公司 Method of forming metal silicon oxide layer and metal silicon oxynitride layer, semiconductor structure, and system
TW202229601A (en) 2020-08-27 2022-08-01 荷蘭商Asm Ip私人控股有限公司 Method of forming patterned structures, method of manipulating mechanical property, device structure, and substrate processing system
USD990534S1 (en) 2020-09-11 2023-06-27 Asm Ip Holding B.V. Weighted lift pin
USD1012873S1 (en) 2020-09-24 2024-01-30 Asm Ip Holding B.V. Electrode for semiconductor processing apparatus
US12009224B2 (en) 2020-09-29 2024-06-11 Asm Ip Holding B.V. Apparatus and method for etching metal nitrides
KR20220045900A (en) 2020-10-06 2022-04-13 에이에스엠 아이피 홀딩 비.브이. Deposition method and an apparatus for depositing a silicon-containing material
CN114293174A (en) 2020-10-07 2022-04-08 Asm Ip私人控股有限公司 Gas supply unit and substrate processing apparatus including the same
TW202229613A (en) 2020-10-14 2022-08-01 荷蘭商Asm Ip私人控股有限公司 Method of depositing material on stepped structure
TW202217037A (en) 2020-10-22 2022-05-01 荷蘭商Asm Ip私人控股有限公司 Method of depositing vanadium metal, structure, device and a deposition assembly
TW202223136A (en) 2020-10-28 2022-06-16 荷蘭商Asm Ip私人控股有限公司 Method for forming layer on substrate, and semiconductor processing system
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USD1031676S1 (en) 2020-12-04 2024-06-18 Asm Ip Holding B.V. Combined susceptor, support, and lift system
US11946137B2 (en) 2020-12-16 2024-04-02 Asm Ip Holding B.V. Runout and wobble measurement fixtures
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US11650106B2 (en) * 2020-12-30 2023-05-16 Rosemount Inc. Temperature probe with improved response time
CN113136571A (en) * 2021-04-16 2021-07-20 江苏微导纳米科技股份有限公司 PECVD (plasma enhanced chemical vapor deposition) integrated furnace
USD980813S1 (en) 2021-05-11 2023-03-14 Asm Ip Holding B.V. Gas flow control plate for substrate processing apparatus
USD981973S1 (en) 2021-05-11 2023-03-28 Asm Ip Holding B.V. Reactor wall for substrate processing apparatus
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USD990441S1 (en) 2021-09-07 2023-06-27 Asm Ip Holding B.V. Gas flow control plate

Family Cites Families (54)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE143127C (en) *
US3098763A (en) * 1961-05-29 1963-07-23 Raytheon Co Chemical reactor
US3170977A (en) * 1961-11-16 1965-02-23 Koppers Co Inc Oxygen lance with detachable barrel
US3170016A (en) * 1962-11-23 1965-02-16 Nat Steel Corp Fluid transfer device
US3488044A (en) * 1967-05-01 1970-01-06 Nat Steel Corp Apparatus for refining metal
US3385921A (en) * 1967-06-21 1968-05-28 Electroglas Inc Diffusion furnace with high speed recovery
US3829982A (en) * 1972-06-15 1974-08-20 Thermogenics Of New York Ink curing and drying apparatus
US3811825A (en) * 1972-11-03 1974-05-21 Sowell J Semiconductor wafer transport device
US3967385A (en) * 1974-08-26 1976-07-06 National-Standard Company, Wagner-Litho Machinery Division Utilization of heat pipes for cooling radiation curing systems
CA1084235A (en) * 1976-05-24 1980-08-26 Ryo Enomoto PROCESS AND AN APPARATUS FOR PRODUCING SILICON CARBIDE CONSISTING MAINLY OF .beta.-TYPE CRYSTAL
US4246434A (en) * 1978-12-20 1981-01-20 Abar Corporation Work support for vacuum electric furnaces
DD143127A1 (en) * 1979-04-20 1980-07-30 Rolf Koenig DEVICE FOR CARRYING OVER THERMAL WORK PROCESSES, ESPECIALLY IN THE SEMICONDUCTOR INDUSTRY
US4347431A (en) * 1980-07-25 1982-08-31 Bell Telephone Laboratories, Inc. Diffusion furnace
JPS5862489A (en) * 1981-10-07 1983-04-13 株式会社日立製作所 Soft landing device
JPS5878424A (en) * 1981-11-05 1983-05-12 Toshiba Ceramics Co Ltd Mother boat for semiconductor diffusion furnace
US4412812A (en) * 1981-12-28 1983-11-01 Mostek Corporation Vertical semiconductor furnace
US4423516A (en) * 1982-03-22 1983-12-27 Mellen Sr Robert H Dynamic gradient furnace with controlled heat dissipation
US4545327A (en) * 1982-08-27 1985-10-08 Anicon, Inc. Chemical vapor deposition apparatus
JPS5977289A (en) * 1982-10-26 1984-05-02 ウシオ電機株式会社 Beam irradiating furnace
US4526534A (en) * 1983-06-01 1985-07-02 Quartz Engineering & Materials, Inc. Cantilever diffusion tube apparatus and method
US4510609A (en) * 1984-01-31 1985-04-09 The United States Of America As Represented By The Secretary Of The Army Furnace for vertical solidification of melt
US5259881A (en) * 1991-05-17 1993-11-09 Materials Research Corporation Wafer processing cluster tool batch preheating and degassing apparatus
US4543059A (en) * 1984-07-18 1985-09-24 Quartz Engineering & Materials, Inc. Slotted cantilever diffusion tube system and method and apparatus for loading
US4702694A (en) * 1984-08-31 1987-10-27 Union Oil Company Of California Furnace with modular construction
GB2164438B (en) * 1984-09-14 1988-07-27 Aisin Seiki Heat exchangers
JPS61191015A (en) * 1985-02-20 1986-08-25 Hitachi Ltd Semiconductor vapor growth and equipment thereof
US4692115A (en) * 1985-04-03 1987-09-08 Thermco Systems, Inc. Semiconductor wafer furnace door
CA1251100A (en) * 1985-05-17 1989-03-14 Richard Cloutier Chemical vapor deposition
JPS6221229A (en) * 1985-07-22 1987-01-29 Hitachi Ltd Treating device
JPS62272525A (en) * 1986-05-21 1987-11-26 Hitachi Ltd Heat treating apparatus
US4802441A (en) * 1987-01-08 1989-02-07 Btu Engineering Corporation Double wall fast cool-down furnace
US4849608A (en) * 1987-02-14 1989-07-18 Dainippon Screen Mfg. Co., Ltd. Apparatus for heat-treating wafers
DE3719952A1 (en) * 1987-06-15 1988-12-29 Convac Gmbh DEVICE FOR TREATING WAFERS IN THE PRODUCTION OF SEMICONDUCTOR ELEMENTS
US4756091A (en) * 1987-06-25 1988-07-12 Herbert Van Denend Hybrid high-velocity heated air/infra-red drying oven
KR960001160B1 (en) * 1987-07-31 1996-01-19 도오교오 에레구토론 가부시끼가이샤 Heating furnace
JPS6455821A (en) * 1987-08-26 1989-03-02 Dainippon Screen Mfg Rapid cooling type heat treating apparatus
EP0306967B1 (en) * 1987-09-11 1997-04-16 Hitachi, Ltd. Apparatus for performing heat treatment on semiconductor wafers
JPH0744159B2 (en) * 1987-09-11 1995-05-15 株式会社日立製作所 Semiconductor wafer heat treatment apparatus and heat treatment method
JP2553364B2 (en) * 1987-10-28 1996-11-13 東京エレクトロン株式会社 Heat treatment equipment
KR970008334B1 (en) * 1988-02-24 1997-05-23 Tokyo Electron Sagami Kk Method and apparatus for heat treatment method
KR960012876B1 (en) * 1988-06-16 1996-09-25 도오교오 에레구토론 사가미 가부시끼가이샤 Heat treating apparatus with cooling fluid nozzles
US5117562A (en) * 1989-04-14 1992-06-02 Robert C. Dulay Radiant energy ink drying device
US5156820A (en) * 1989-05-15 1992-10-20 Rapro Technology, Inc. Reaction chamber with controlled radiant energy heating and distributed reactant flow
US4911638A (en) * 1989-05-18 1990-03-27 Direction Incorporated Controlled diffusion environment capsule and system
US5178534A (en) * 1989-05-18 1993-01-12 Bayne Christopher J Controlled diffusion environment capsule and system
US4976612A (en) * 1989-06-20 1990-12-11 Automated Wafer Systems Purge tube with floating end cap for loading silicon wafers into a furnace
JP2764436B2 (en) * 1989-06-29 1998-06-11 東芝セラミックス株式会社 Vertical diffusion furnace
JP2958428B2 (en) * 1989-07-15 1999-10-06 東芝セラミックス株式会社 SiC protective tube for thermocouple
US5099586A (en) * 1989-09-08 1992-03-31 W. R. Grace & Co.-Conn. Reflector assembly for heating a substrate
US5155336A (en) * 1990-01-19 1992-10-13 Applied Materials, Inc. Rapid thermal heating apparatus and method
US5252807A (en) * 1990-07-02 1993-10-12 George Chizinsky Heated plate rapid thermal processor
US5072094A (en) * 1990-09-11 1991-12-10 United States Department Of Energy Tube furnace
JP2998903B2 (en) * 1990-11-14 2000-01-17 東京エレクトロン株式会社 Heat treatment equipment
US5174045A (en) * 1991-05-17 1992-12-29 Semitool, Inc. Semiconductor processor with extendible receiver for handling multiple discrete wafers without wafer carriers

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