WO1993026137B1 - High performance horizontal diffusion furnace system - Google Patents
High performance horizontal diffusion furnace systemInfo
- Publication number
- WO1993026137B1 WO1993026137B1 PCT/US1993/005546 US9305546W WO9326137B1 WO 1993026137 B1 WO1993026137 B1 WO 1993026137B1 US 9305546 W US9305546 W US 9305546W WO 9326137 B1 WO9326137 B1 WO 9326137B1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- new
- furnace
- heating element
- high temperature
- air
- Prior art date
Links
- 238000009792 diffusion process Methods 0.000 title abstract 2
- 238000010438 heat treatment Methods 0.000 claims abstract 26
- 238000001816 cooling Methods 0.000 claims abstract 2
- 230000002708 enhancing Effects 0.000 claims abstract 2
- 238000000034 method Methods 0.000 claims 6
- HBMJWWWQQXIZIP-UHFFFAOYSA-N Silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims 3
- 229910010271 silicon carbide Inorganic materials 0.000 claims 3
- 239000000919 ceramic Substances 0.000 claims 1
- 239000002131 composite material Substances 0.000 claims 1
- 230000001808 coupling Effects 0.000 claims 1
- 238000010168 coupling process Methods 0.000 claims 1
- 238000005859 coupling reaction Methods 0.000 claims 1
- 239000000835 fiber Substances 0.000 claims 1
- 238000005259 measurement Methods 0.000 claims 1
- 238000004886 process control Methods 0.000 abstract 1
Abstract
Performance of a high temperature diffusion furnace (10) is enhanced by an improved multi-furnace module design (11). The furnace (10) is constructed of materials suitable for clean room environments with an adjustable leveling frame assembly (59). A side out assembly (31) and heating element alignment mechanism (85) of individual furnace tube modules (25) with a heating element hoist mechanism (22) allows for enhanced maintainability. Heat treatment performance is improved by a sealed heating element (12) with individual furnace module cooling system (15, 16, 30). Improved thermal couple (107) is positioned to enhance heat treatment process control and heating element maintainability.
Claims
- -
AMENDED CLAIMS
[received by the International Bureau on 12 January 1994 (12.01.94); original claims unchanged; new claims 10-27 added (4 pages)]
10. (New) An apparatus for enhancing the heat treatment process in a high temperature furnace, comprising: a cylindrical heating element with a load end, the cylindrical heating element having a furnace chamber surrounding a process chamber with an opening at the load end; and an element liner between the process chamber and the furnace chamber allowing for uniform heating in the process chamber.
11. (New) The apparatus of Claim 10, wherein the element liner allows for enhanced dynamic temperature responses in the process chamber.
12. (New) The apparatus of Claim 11, wherein the element liner has a width of 6 millimeters or less.
13. (New) The apparatus of Claim 12, wherein the element liner comprises a ceramic fiber and silicon carbide composite.
14. (New) The apparatus of Claim 13, wherein the element liner comprises Siconex.
15. (New) An apparatus for measuring thermal energy in a high temperature furnace having a radio frequency interference energy field, comprising: a thermal couple; and a silicon carbide layer covering at least a portion of the thermal couple removing radio frequency interference energy.
16. (New) The apparatus of Claim 46, wherein the silicon carbide layer comprises Siconex.
17. (New) An apparatus for measuring the temperature in a high temperature furnace, comprising: a cylindrical heating element having a furnace chamber; and
a thermal couple sufficiently immersed in the furnace chamber allowing for precise measurements of temperature.
18. (New) The apparatus of Claim 17, wherein the cylindrical heating element includes: a furnace chamber surrounding a process chamber with a source end, the furnace chamber having a bore at the source end for inserting the thermal couple.
19. (New) The apparatus of Claim 18, wherein the cylindrical heating element having a center-line longitudinal axis and the furnace chamber bore having a center-line longitudinal axis parallel to the cylindrical heating element center-line longitudinal axis.
20. (New) An apparatus for cooling a plurality of heating elements radiating thermal energy in a high temperature furnace using a source of air, comprising: means for producing independent flows of air from the source of air over the plurality of heating elements, respectively.
21. (New) The apparatus of Claim 20, wherein the means for producing independent flows of air includes: means for extracting the source of air producing a flow of air over a first heating element radiating thermal energy which transfers the thermal energy of the first heating element to the flow of air; and means for separating the flow of air across the first heating element from a second heating element.
22. (New) The apparatus of Claim 21, wherein the means for extracting the source of air includes: an air intake vent;
- 28 -
a fan positioned for extracting the source of air through the air intake vent producing a flow of air over the first heating element; and a flume for exhausting the flow of air from the high temperature furnace.
23. (New) An apparatus for allowing access to a furnace module in a high temperature furnace having a load end, an opposing end, a front side and a back side, comprising: a frame supporting the high temperature furnace; and means, coupled to the frame, for removing the furnace module laterally from a side of the high temperature furnace.
24. (New) The apparatus of the Claim 23, wherein the frame includes: a cantilever member means extending from the back side toward the front side for positioning the furnace module.
25. (New) The apparatus of Claim 24, wherein the means for removing the furnace module includes: a drawer slider coupled to the cantilever member; and a bulkhead coupling the drawer slider and the furnace module such that the furnace module may extend laterally from the front side of the high temperature furnace.
26. (New) The apparatus of Claim 24, wherein the furnace module includes a heating element and further comprises; means for transferring the heating element to or from the high temperature furnace.
27. (New) The apparatus of Claim 26, wherein the means for transferring the heating element includes: a beam coupled to the high temperature furnace; a first cable extending from the beam; means, coupled to the first cable, for attaching the first cable to the heating element; and
- 29 -
means for moving the first cable allowing the heating element to be transferred to or from the high temperature furnace.
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE69332639T DE69332639T2 (en) | 1992-06-15 | 1993-06-09 | RIGHT RIGHT DIFFUSION OVEN WITH HIGH PERFORMANCE |
KR1019940704560A KR100316069B1 (en) | 1992-06-15 | 1993-06-09 | High Performance Horizontal Diffusion Furnace System |
EP93916481A EP0645072B1 (en) | 1992-06-15 | 1993-06-09 | High performance horizontal diffusion furnace system |
AT93916481T ATE231318T1 (en) | 1992-06-15 | 1993-06-09 | HIGH PERFORMANCE HORIZONTAL DIFFUSION FURNACE |
JP6501711A JPH07509345A (en) | 1992-06-15 | 1993-06-09 | High performance horizontal diffusion furnace equipment |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US898,552 | 1986-08-21 | ||
US07/898,552 US5461214A (en) | 1992-06-15 | 1992-06-15 | High performance horizontal diffusion furnace system |
Publications (2)
Publication Number | Publication Date |
---|---|
WO1993026137A1 WO1993026137A1 (en) | 1993-12-23 |
WO1993026137B1 true WO1993026137B1 (en) | 1994-02-17 |
Family
ID=25409614
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US1993/005546 WO1993026137A1 (en) | 1992-06-15 | 1993-06-09 | High performance horizontal diffusion furnace system |
Country Status (8)
Country | Link |
---|---|
US (5) | US5461214A (en) |
EP (1) | EP0645072B1 (en) |
JP (3) | JPH07509345A (en) |
KR (1) | KR100316069B1 (en) |
AT (1) | ATE231318T1 (en) |
DE (1) | DE69332639T2 (en) |
ES (1) | ES2191665T3 (en) |
WO (1) | WO1993026137A1 (en) |
Families Citing this family (303)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5960158A (en) | 1997-07-11 | 1999-09-28 | Ag Associates | Apparatus and method for filtering light in a thermal processing chamber |
US6063234A (en) * | 1997-09-10 | 2000-05-16 | Lam Research Corporation | Temperature sensing system for use in a radio frequency environment |
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US6224678B1 (en) * | 1998-08-12 | 2001-05-01 | Advanced Micro Devices, Inc. | Modified thermocouple mounting bushing and system including the same |
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US6496648B1 (en) * | 1999-08-19 | 2002-12-17 | Prodeo Technologies, Inc. | Apparatus and method for rapid thermal processing |
US6227140B1 (en) * | 1999-09-23 | 2001-05-08 | Lam Research Corporation | Semiconductor processing equipment having radiant heated ceramic liner |
US20040114665A1 (en) * | 2002-12-12 | 2004-06-17 | Sun Park | Cantilevered thermocouple rake |
US6857776B2 (en) * | 2002-12-12 | 2005-02-22 | Ametek, Inc. | Connectorized high-temperature thermocouple |
JP3910151B2 (en) * | 2003-04-01 | 2007-04-25 | 東京エレクトロン株式会社 | Heat treatment method and heat treatment apparatus |
US6807220B1 (en) | 2003-05-23 | 2004-10-19 | Mrl Industries | Retention mechanism for heating coil of high temperature diffusion furnace |
US7762949B2 (en) * | 2003-10-16 | 2010-07-27 | Granit Medical Innovation, Llc | Endoscope with open channels |
JP4246654B2 (en) * | 2004-03-08 | 2009-04-02 | 株式会社日立ハイテクノロジーズ | Vacuum processing equipment |
CN100383912C (en) * | 2005-01-11 | 2008-04-23 | 中芯国际集成电路制造(上海)有限公司 | High temperature wafer test oven |
US7335864B2 (en) * | 2005-06-01 | 2008-02-26 | Mrl Industries, Inc. | Magnetic field reduction resistive heating elements |
US20060275933A1 (en) * | 2005-06-02 | 2006-12-07 | Applied Materials, Inc. | Thermally conductive ceramic tipped contact thermocouple |
US20080314892A1 (en) * | 2007-06-25 | 2008-12-25 | Graham Robert G | Radiant shield |
JP2010024649A (en) * | 2008-07-16 | 2010-02-04 | Oki Semiconductor Co Ltd | Seismic strengthening structure and seismic strengthening method for double floor |
US8394229B2 (en) * | 2008-08-07 | 2013-03-12 | Asm America, Inc. | Susceptor ring |
US8395096B2 (en) * | 2009-02-05 | 2013-03-12 | Sandvik Thermal Process, Inc. | Precision strip heating element |
US9394608B2 (en) | 2009-04-06 | 2016-07-19 | Asm America, Inc. | Semiconductor processing reactor and components thereof |
US8802201B2 (en) | 2009-08-14 | 2014-08-12 | Asm America, Inc. | Systems and methods for thin-film deposition of metal oxides using excited nitrogen-oxygen species |
US20120168143A1 (en) * | 2010-12-30 | 2012-07-05 | Poole Ventura, Inc. | Thermal Diffusion Chamber With Heat Exchanger |
US20130023129A1 (en) | 2011-07-20 | 2013-01-24 | Asm America, Inc. | Pressure transmitter for a semiconductor processing environment |
US9017481B1 (en) | 2011-10-28 | 2015-04-28 | Asm America, Inc. | Process feed management for semiconductor substrate processing |
US9188489B2 (en) * | 2011-12-01 | 2015-11-17 | Rosemount Inc. | Twisted sensor tube |
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US20160376700A1 (en) | 2013-02-01 | 2016-12-29 | Asm Ip Holding B.V. | System for treatment of deposition reactor |
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US10872771B2 (en) | 2018-01-16 | 2020-12-22 | Asm Ip Holding B. V. | Method for depositing a material film on a substrate within a reaction chamber by a cyclical deposition process and related device structures |
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KR102596988B1 (en) | 2018-05-28 | 2023-10-31 | 에이에스엠 아이피 홀딩 비.브이. | Method of processing a substrate and a device manufactured by the same |
US11718913B2 (en) | 2018-06-04 | 2023-08-08 | Asm Ip Holding B.V. | Gas distribution system and reactor system including same |
TWI840362B (en) | 2018-06-04 | 2024-05-01 | 荷蘭商Asm Ip私人控股有限公司 | Wafer handling chamber with moisture reduction |
US11286562B2 (en) | 2018-06-08 | 2022-03-29 | Asm Ip Holding B.V. | Gas-phase chemical reactor and method of using same |
KR102568797B1 (en) | 2018-06-21 | 2023-08-21 | 에이에스엠 아이피 홀딩 비.브이. | Substrate processing system |
US10797133B2 (en) | 2018-06-21 | 2020-10-06 | Asm Ip Holding B.V. | Method for depositing a phosphorus doped silicon arsenide film and related semiconductor device structures |
US11499222B2 (en) | 2018-06-27 | 2022-11-15 | Asm Ip Holding B.V. | Cyclic deposition methods for forming metal-containing material and films and structures including the metal-containing material |
JP2021529254A (en) | 2018-06-27 | 2021-10-28 | エーエスエム・アイピー・ホールディング・ベー・フェー | Periodic deposition methods for forming metal-containing materials and films and structures containing metal-containing materials |
KR102686758B1 (en) | 2018-06-29 | 2024-07-18 | 에이에스엠 아이피 홀딩 비.브이. | Method for depositing a thin film and manufacturing a semiconductor device |
US10612136B2 (en) | 2018-06-29 | 2020-04-07 | ASM IP Holding, B.V. | Temperature-controlled flange and reactor system including same |
US10755922B2 (en) | 2018-07-03 | 2020-08-25 | Asm Ip Holding B.V. | Method for depositing silicon-free carbon-containing film as gap-fill layer by pulse plasma-assisted deposition |
US10388513B1 (en) | 2018-07-03 | 2019-08-20 | Asm Ip Holding B.V. | Method for depositing silicon-free carbon-containing film as gap-fill layer by pulse plasma-assisted deposition |
US10767789B2 (en) | 2018-07-16 | 2020-09-08 | Asm Ip Holding B.V. | Diaphragm valves, valve components, and methods for forming valve components |
US11053591B2 (en) | 2018-08-06 | 2021-07-06 | Asm Ip Holding B.V. | Multi-port gas injection system and reactor system including same |
US10883175B2 (en) | 2018-08-09 | 2021-01-05 | Asm Ip Holding B.V. | Vertical furnace for processing substrates and a liner for use therein |
US10829852B2 (en) | 2018-08-16 | 2020-11-10 | Asm Ip Holding B.V. | Gas distribution device for a wafer processing apparatus |
US11430674B2 (en) | 2018-08-22 | 2022-08-30 | Asm Ip Holding B.V. | Sensor array, apparatus for dispensing a vapor phase reactant to a reaction chamber and related methods |
KR102707956B1 (en) | 2018-09-11 | 2024-09-19 | 에이에스엠 아이피 홀딩 비.브이. | Method for deposition of a thin film |
US11024523B2 (en) | 2018-09-11 | 2021-06-01 | Asm Ip Holding B.V. | Substrate processing apparatus and method |
US11049751B2 (en) | 2018-09-14 | 2021-06-29 | Asm Ip Holding B.V. | Cassette supply system to store and handle cassettes and processing apparatus equipped therewith |
CN110970344B (en) | 2018-10-01 | 2024-10-25 | Asmip控股有限公司 | Substrate holding apparatus, system comprising the same and method of using the same |
US11232963B2 (en) | 2018-10-03 | 2022-01-25 | Asm Ip Holding B.V. | Substrate processing apparatus and method |
KR102592699B1 (en) | 2018-10-08 | 2023-10-23 | 에이에스엠 아이피 홀딩 비.브이. | Substrate support unit and apparatuses for depositing thin film and processing the substrate including the same |
KR102546322B1 (en) | 2018-10-19 | 2023-06-21 | 에이에스엠 아이피 홀딩 비.브이. | Substrate processing apparatus and substrate processing method |
KR102605121B1 (en) | 2018-10-19 | 2023-11-23 | 에이에스엠 아이피 홀딩 비.브이. | Substrate processing apparatus and substrate processing method |
USD948463S1 (en) | 2018-10-24 | 2022-04-12 | Asm Ip Holding B.V. | Susceptor for semiconductor substrate supporting apparatus |
US11087997B2 (en) | 2018-10-31 | 2021-08-10 | Asm Ip Holding B.V. | Substrate processing apparatus for processing substrates |
KR20200051105A (en) | 2018-11-02 | 2020-05-13 | 에이에스엠 아이피 홀딩 비.브이. | Substrate support unit and substrate processing apparatus including the same |
US11572620B2 (en) | 2018-11-06 | 2023-02-07 | Asm Ip Holding B.V. | Methods for selectively depositing an amorphous silicon film on a substrate |
US11031242B2 (en) | 2018-11-07 | 2021-06-08 | Asm Ip Holding B.V. | Methods for depositing a boron doped silicon germanium film |
US10847366B2 (en) | 2018-11-16 | 2020-11-24 | Asm Ip Holding B.V. | Methods for depositing a transition metal chalcogenide film on a substrate by a cyclical deposition process |
US10818758B2 (en) | 2018-11-16 | 2020-10-27 | Asm Ip Holding B.V. | Methods for forming a metal silicate film on a substrate in a reaction chamber and related semiconductor device structures |
US12040199B2 (en) | 2018-11-28 | 2024-07-16 | Asm Ip Holding B.V. | Substrate processing apparatus for processing substrates |
US11217444B2 (en) | 2018-11-30 | 2022-01-04 | Asm Ip Holding B.V. | Method for forming an ultraviolet radiation responsive metal oxide-containing film |
KR102636428B1 (en) | 2018-12-04 | 2024-02-13 | 에이에스엠 아이피 홀딩 비.브이. | A method for cleaning a substrate processing apparatus |
US11158513B2 (en) | 2018-12-13 | 2021-10-26 | Asm Ip Holding B.V. | Methods for forming a rhenium-containing film on a substrate by a cyclical deposition process and related semiconductor device structures |
TW202037745A (en) | 2018-12-14 | 2020-10-16 | 荷蘭商Asm Ip私人控股有限公司 | Method of forming device structure, structure formed by the method and system for performing the method |
US11961756B2 (en) | 2019-01-17 | 2024-04-16 | Asm Ip Holding B.V. | Vented susceptor |
USD914620S1 (en) | 2019-01-17 | 2021-03-30 | Asm Ip Holding B.V. | Vented susceptor |
USD920936S1 (en) | 2019-01-17 | 2021-06-01 | Asm Ip Holding B.V. | Higher temperature vented susceptor |
TW202405220A (en) | 2019-01-17 | 2024-02-01 | 荷蘭商Asm Ip 私人控股有限公司 | Methods of forming a transition metal containing film on a substrate by a cyclical deposition process |
TWI756590B (en) | 2019-01-22 | 2022-03-01 | 荷蘭商Asm Ip私人控股有限公司 | Substrate processing device |
CN111524788B (en) | 2019-02-01 | 2023-11-24 | Asm Ip私人控股有限公司 | Method for topologically selective film formation of silicon oxide |
TWI845607B (en) | 2019-02-20 | 2024-06-21 | 荷蘭商Asm Ip私人控股有限公司 | Cyclical deposition method and apparatus for filling a recess formed within a substrate surface |
JP2020136678A (en) | 2019-02-20 | 2020-08-31 | エーエスエム・アイピー・ホールディング・ベー・フェー | Method for filing concave part formed inside front surface of base material, and device |
US11482533B2 (en) | 2019-02-20 | 2022-10-25 | Asm Ip Holding B.V. | Apparatus and methods for plug fill deposition in 3-D NAND applications |
KR102626263B1 (en) | 2019-02-20 | 2024-01-16 | 에이에스엠 아이피 홀딩 비.브이. | Cyclical deposition method including treatment step and apparatus for same |
TWI842826B (en) | 2019-02-22 | 2024-05-21 | 荷蘭商Asm Ip私人控股有限公司 | Substrate processing apparatus and method for processing substrate |
KR20200108243A (en) | 2019-03-08 | 2020-09-17 | 에이에스엠 아이피 홀딩 비.브이. | Structure Including SiOC Layer and Method of Forming Same |
KR20200108242A (en) | 2019-03-08 | 2020-09-17 | 에이에스엠 아이피 홀딩 비.브이. | Method for Selective Deposition of Silicon Nitride Layer and Structure Including Selectively-Deposited Silicon Nitride Layer |
US11742198B2 (en) | 2019-03-08 | 2023-08-29 | Asm Ip Holding B.V. | Structure including SiOCN layer and method of forming same |
JP2020167398A (en) | 2019-03-28 | 2020-10-08 | エーエスエム・アイピー・ホールディング・ベー・フェー | Door opener and substrate processing apparatus provided therewith |
KR20200116855A (en) | 2019-04-01 | 2020-10-13 | 에이에스엠 아이피 홀딩 비.브이. | Method of manufacturing semiconductor device |
US11447864B2 (en) | 2019-04-19 | 2022-09-20 | Asm Ip Holding B.V. | Layer forming method and apparatus |
KR20200125453A (en) | 2019-04-24 | 2020-11-04 | 에이에스엠 아이피 홀딩 비.브이. | Gas-phase reactor system and method of using same |
KR20200130121A (en) | 2019-05-07 | 2020-11-18 | 에이에스엠 아이피 홀딩 비.브이. | Chemical source vessel with dip tube |
KR20200130118A (en) | 2019-05-07 | 2020-11-18 | 에이에스엠 아이피 홀딩 비.브이. | Method for Reforming Amorphous Carbon Polymer Film |
KR20200130652A (en) | 2019-05-10 | 2020-11-19 | 에이에스엠 아이피 홀딩 비.브이. | Method of depositing material onto a surface and structure formed according to the method |
JP2020188254A (en) | 2019-05-16 | 2020-11-19 | エーエスエム アイピー ホールディング ビー.ブイ. | Wafer boat handling device, vertical batch furnace, and method |
JP2020188255A (en) | 2019-05-16 | 2020-11-19 | エーエスエム アイピー ホールディング ビー.ブイ. | Wafer boat handling device, vertical batch furnace, and method |
USD947913S1 (en) | 2019-05-17 | 2022-04-05 | Asm Ip Holding B.V. | Susceptor shaft |
USD975665S1 (en) | 2019-05-17 | 2023-01-17 | Asm Ip Holding B.V. | Susceptor shaft |
TWI845682B (en) | 2019-05-22 | 2024-06-21 | 荷蘭商Asm Ip私人控股有限公司 | Workpiece susceptor body |
USD935572S1 (en) | 2019-05-24 | 2021-11-09 | Asm Ip Holding B.V. | Gas channel plate |
USD922229S1 (en) | 2019-06-05 | 2021-06-15 | Asm Ip Holding B.V. | Device for controlling a temperature of a gas supply unit |
KR20200141003A (en) | 2019-06-06 | 2020-12-17 | 에이에스엠 아이피 홀딩 비.브이. | Gas-phase reactor system including a gas detector |
KR20200143254A (en) | 2019-06-11 | 2020-12-23 | 에이에스엠 아이피 홀딩 비.브이. | Method of forming an electronic structure using an reforming gas, system for performing the method, and structure formed using the method |
USD944946S1 (en) | 2019-06-14 | 2022-03-01 | Asm Ip Holding B.V. | Shower plate |
USD931978S1 (en) | 2019-06-27 | 2021-09-28 | Asm Ip Holding B.V. | Showerhead vacuum transport |
CN114051651A (en) * | 2019-07-01 | 2022-02-15 | 株式会社国际电气 | Substrate processing apparatus, method for manufacturing semiconductor device, and program |
KR20210005515A (en) | 2019-07-03 | 2021-01-14 | 에이에스엠 아이피 홀딩 비.브이. | Temperature control assembly for substrate processing apparatus and method of using same |
JP7499079B2 (en) | 2019-07-09 | 2024-06-13 | エーエスエム・アイピー・ホールディング・ベー・フェー | Plasma device using coaxial waveguide and substrate processing method |
CN112216646A (en) | 2019-07-10 | 2021-01-12 | Asm Ip私人控股有限公司 | Substrate supporting assembly and substrate processing device comprising same |
KR20210010307A (en) | 2019-07-16 | 2021-01-27 | 에이에스엠 아이피 홀딩 비.브이. | Substrate processing apparatus |
KR20210010816A (en) | 2019-07-17 | 2021-01-28 | 에이에스엠 아이피 홀딩 비.브이. | Radical assist ignition plasma system and method |
KR20210010820A (en) | 2019-07-17 | 2021-01-28 | 에이에스엠 아이피 홀딩 비.브이. | Methods of forming silicon germanium structures |
US11643724B2 (en) | 2019-07-18 | 2023-05-09 | Asm Ip Holding B.V. | Method of forming structures using a neutral beam |
KR20210010817A (en) | 2019-07-19 | 2021-01-28 | 에이에스엠 아이피 홀딩 비.브이. | Method of Forming Topology-Controlled Amorphous Carbon Polymer Film |
TWI839544B (en) | 2019-07-19 | 2024-04-21 | 荷蘭商Asm Ip私人控股有限公司 | Method of forming topology-controlled amorphous carbon polymer film |
CN112309843A (en) | 2019-07-29 | 2021-02-02 | Asm Ip私人控股有限公司 | Selective deposition method for achieving high dopant doping |
CN112309899A (en) | 2019-07-30 | 2021-02-02 | Asm Ip私人控股有限公司 | Substrate processing apparatus |
CN112309900A (en) | 2019-07-30 | 2021-02-02 | Asm Ip私人控股有限公司 | Substrate processing apparatus |
US11587815B2 (en) | 2019-07-31 | 2023-02-21 | Asm Ip Holding B.V. | Vertical batch furnace assembly |
US11587814B2 (en) | 2019-07-31 | 2023-02-21 | Asm Ip Holding B.V. | Vertical batch furnace assembly |
US11227782B2 (en) | 2019-07-31 | 2022-01-18 | Asm Ip Holding B.V. | Vertical batch furnace assembly |
KR20210018759A (en) | 2019-08-05 | 2021-02-18 | 에이에스엠 아이피 홀딩 비.브이. | Liquid level sensor for a chemical source vessel |
USD965044S1 (en) | 2019-08-19 | 2022-09-27 | Asm Ip Holding B.V. | Susceptor shaft |
USD965524S1 (en) | 2019-08-19 | 2022-10-04 | Asm Ip Holding B.V. | Susceptor support |
JP2021031769A (en) | 2019-08-21 | 2021-03-01 | エーエスエム アイピー ホールディング ビー.ブイ. | Production apparatus of mixed gas of film deposition raw material and film deposition apparatus |
KR20210024423A (en) | 2019-08-22 | 2021-03-05 | 에이에스엠 아이피 홀딩 비.브이. | Method for forming a structure with a hole |
USD949319S1 (en) | 2019-08-22 | 2022-04-19 | Asm Ip Holding B.V. | Exhaust duct |
USD940837S1 (en) | 2019-08-22 | 2022-01-11 | Asm Ip Holding B.V. | Electrode |
USD930782S1 (en) | 2019-08-22 | 2021-09-14 | Asm Ip Holding B.V. | Gas distributor |
USD979506S1 (en) | 2019-08-22 | 2023-02-28 | Asm Ip Holding B.V. | Insulator |
US11286558B2 (en) | 2019-08-23 | 2022-03-29 | Asm Ip Holding B.V. | Methods for depositing a molybdenum nitride film on a surface of a substrate by a cyclical deposition process and related semiconductor device structures including a molybdenum nitride film |
KR20210024420A (en) | 2019-08-23 | 2021-03-05 | 에이에스엠 아이피 홀딩 비.브이. | Method for depositing silicon oxide film having improved quality by peald using bis(diethylamino)silane |
KR20210029090A (en) | 2019-09-04 | 2021-03-15 | 에이에스엠 아이피 홀딩 비.브이. | Methods for selective deposition using a sacrificial capping layer |
KR20210029663A (en) | 2019-09-05 | 2021-03-16 | 에이에스엠 아이피 홀딩 비.브이. | Substrate processing apparatus |
US11562901B2 (en) | 2019-09-25 | 2023-01-24 | Asm Ip Holding B.V. | Substrate processing method |
CN112593212B (en) | 2019-10-02 | 2023-12-22 | Asm Ip私人控股有限公司 | Method for forming topologically selective silicon oxide film by cyclic plasma enhanced deposition process |
KR20210042810A (en) | 2019-10-08 | 2021-04-20 | 에이에스엠 아이피 홀딩 비.브이. | Reactor system including a gas distribution assembly for use with activated species and method of using same |
TWI846953B (en) | 2019-10-08 | 2024-07-01 | 荷蘭商Asm Ip私人控股有限公司 | Substrate processing device |
KR20210043460A (en) | 2019-10-10 | 2021-04-21 | 에이에스엠 아이피 홀딩 비.브이. | Method of forming a photoresist underlayer and structure including same |
US12009241B2 (en) | 2019-10-14 | 2024-06-11 | Asm Ip Holding B.V. | Vertical batch furnace assembly with detector to detect cassette |
TWI834919B (en) | 2019-10-16 | 2024-03-11 | 荷蘭商Asm Ip私人控股有限公司 | Method of topology-selective film formation of silicon oxide |
US11637014B2 (en) | 2019-10-17 | 2023-04-25 | Asm Ip Holding B.V. | Methods for selective deposition of doped semiconductor material |
KR20210047808A (en) | 2019-10-21 | 2021-04-30 | 에이에스엠 아이피 홀딩 비.브이. | Apparatus and methods for selectively etching films |
US11764101B2 (en) | 2019-10-24 | 2023-09-19 | ASM IP Holding, B.V. | Susceptor for semiconductor substrate processing |
KR20210050453A (en) | 2019-10-25 | 2021-05-07 | 에이에스엠 아이피 홀딩 비.브이. | Methods for filling a gap feature on a substrate surface and related semiconductor structures |
KR20210053193A (en) | 2019-10-29 | 2021-05-11 | 에이에스엠 아이피 홀딩 비.브이. | Methods of selectively forming n-type doped material on a surface, systems for selectively forming n-type doped material, and structures formed using same |
KR20210054983A (en) | 2019-11-05 | 2021-05-14 | 에이에스엠 아이피 홀딩 비.브이. | Structures with doped semiconductor layers and methods and systems for forming same |
US11501968B2 (en) | 2019-11-15 | 2022-11-15 | Asm Ip Holding B.V. | Method for providing a semiconductor device with silicon filled gaps |
KR20210062561A (en) | 2019-11-20 | 2021-05-31 | 에이에스엠 아이피 홀딩 비.브이. | Method of depositing carbon-containing material on a surface of a substrate, structure formed using the method, and system for forming the structure |
US11450529B2 (en) | 2019-11-26 | 2022-09-20 | Asm Ip Holding B.V. | Methods for selectively forming a target film on a substrate comprising a first dielectric surface and a second metallic surface |
CN112951697A (en) | 2019-11-26 | 2021-06-11 | Asm Ip私人控股有限公司 | Substrate processing apparatus |
CN112885692A (en) | 2019-11-29 | 2021-06-01 | Asm Ip私人控股有限公司 | Substrate processing apparatus |
CN112885693A (en) | 2019-11-29 | 2021-06-01 | Asm Ip私人控股有限公司 | Substrate processing apparatus |
JP7527928B2 (en) | 2019-12-02 | 2024-08-05 | エーエスエム・アイピー・ホールディング・ベー・フェー | Substrate processing apparatus and substrate processing method |
KR20210070898A (en) | 2019-12-04 | 2021-06-15 | 에이에스엠 아이피 홀딩 비.브이. | Substrate processing apparatus |
US11885013B2 (en) | 2019-12-17 | 2024-01-30 | Asm Ip Holding B.V. | Method of forming vanadium nitride layer and structure including the vanadium nitride layer |
KR20210080214A (en) | 2019-12-19 | 2021-06-30 | 에이에스엠 아이피 홀딩 비.브이. | Methods for filling a gap feature on a substrate and related semiconductor structures |
JP2021111783A (en) | 2020-01-06 | 2021-08-02 | エーエスエム・アイピー・ホールディング・ベー・フェー | Channeled lift pin |
JP2021109175A (en) | 2020-01-06 | 2021-08-02 | エーエスエム・アイピー・ホールディング・ベー・フェー | Gas supply assembly, components thereof, and reactor system including the same |
US11993847B2 (en) | 2020-01-08 | 2024-05-28 | Asm Ip Holding B.V. | Injector |
KR20210093163A (en) | 2020-01-16 | 2021-07-27 | 에이에스엠 아이피 홀딩 비.브이. | Method of forming high aspect ratio features |
KR102675856B1 (en) | 2020-01-20 | 2024-06-17 | 에이에스엠 아이피 홀딩 비.브이. | Method of forming thin film and method of modifying surface of thin film |
TW202130846A (en) | 2020-02-03 | 2021-08-16 | 荷蘭商Asm Ip私人控股有限公司 | Method of forming structures including a vanadium or indium layer |
KR20210100010A (en) | 2020-02-04 | 2021-08-13 | 에이에스엠 아이피 홀딩 비.브이. | Method and apparatus for transmittance measurements of large articles |
US11776846B2 (en) | 2020-02-07 | 2023-10-03 | Asm Ip Holding B.V. | Methods for depositing gap filling fluids and related systems and devices |
US11781243B2 (en) | 2020-02-17 | 2023-10-10 | Asm Ip Holding B.V. | Method for depositing low temperature phosphorous-doped silicon |
TW202203344A (en) | 2020-02-28 | 2022-01-16 | 荷蘭商Asm Ip控股公司 | System dedicated for parts cleaning |
KR20210116249A (en) | 2020-03-11 | 2021-09-27 | 에이에스엠 아이피 홀딩 비.브이. | lockout tagout assembly and system and method of using same |
KR20210116240A (en) | 2020-03-11 | 2021-09-27 | 에이에스엠 아이피 홀딩 비.브이. | Substrate handling device with adjustable joints |
KR20210117157A (en) | 2020-03-12 | 2021-09-28 | 에이에스엠 아이피 홀딩 비.브이. | Method for Fabricating Layer Structure Having Target Topological Profile |
KR20210124042A (en) | 2020-04-02 | 2021-10-14 | 에이에스엠 아이피 홀딩 비.브이. | Thin film forming method |
TW202146689A (en) | 2020-04-03 | 2021-12-16 | 荷蘭商Asm Ip控股公司 | Method for forming barrier layer and method for manufacturing semiconductor device |
TW202145344A (en) | 2020-04-08 | 2021-12-01 | 荷蘭商Asm Ip私人控股有限公司 | Apparatus and methods for selectively etching silcon oxide films |
KR20210128343A (en) | 2020-04-15 | 2021-10-26 | 에이에스엠 아이피 홀딩 비.브이. | Method of forming chromium nitride layer and structure including the chromium nitride layer |
US11821078B2 (en) | 2020-04-15 | 2023-11-21 | Asm Ip Holding B.V. | Method for forming precoat film and method for forming silicon-containing film |
US11996289B2 (en) | 2020-04-16 | 2024-05-28 | Asm Ip Holding B.V. | Methods of forming structures including silicon germanium and silicon layers, devices formed using the methods, and systems for performing the methods |
KR20210132605A (en) | 2020-04-24 | 2021-11-04 | 에이에스엠 아이피 홀딩 비.브이. | Vertical batch furnace assembly comprising a cooling gas supply |
CN113555279A (en) | 2020-04-24 | 2021-10-26 | Asm Ip私人控股有限公司 | Method of forming vanadium nitride-containing layers and structures including the same |
KR20210132600A (en) | 2020-04-24 | 2021-11-04 | 에이에스엠 아이피 홀딩 비.브이. | Methods and systems for depositing a layer comprising vanadium, nitrogen, and a further element |
KR20210134226A (en) | 2020-04-29 | 2021-11-09 | 에이에스엠 아이피 홀딩 비.브이. | Solid source precursor vessel |
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USD1031676S1 (en) | 2020-12-04 | 2024-06-18 | Asm Ip Holding B.V. | Combined susceptor, support, and lift system |
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US11650106B2 (en) * | 2020-12-30 | 2023-05-16 | Rosemount Inc. | Temperature probe with improved response time |
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USD980814S1 (en) | 2021-05-11 | 2023-03-14 | Asm Ip Holding B.V. | Gas distributor for substrate processing apparatus |
USD1023959S1 (en) | 2021-05-11 | 2024-04-23 | Asm Ip Holding B.V. | Electrode for substrate processing apparatus |
USD1028913S1 (en) | 2021-06-30 | 2024-05-28 | Asm Ip Holding B.V. | Semiconductor deposition reactor ring |
USD990441S1 (en) | 2021-09-07 | 2023-06-27 | Asm Ip Holding B.V. | Gas flow control plate |
Family Cites Families (54)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE143127C (en) * | ||||
US3098763A (en) * | 1961-05-29 | 1963-07-23 | Raytheon Co | Chemical reactor |
US3170977A (en) * | 1961-11-16 | 1965-02-23 | Koppers Co Inc | Oxygen lance with detachable barrel |
US3170016A (en) * | 1962-11-23 | 1965-02-16 | Nat Steel Corp | Fluid transfer device |
US3488044A (en) * | 1967-05-01 | 1970-01-06 | Nat Steel Corp | Apparatus for refining metal |
US3385921A (en) * | 1967-06-21 | 1968-05-28 | Electroglas Inc | Diffusion furnace with high speed recovery |
US3829982A (en) * | 1972-06-15 | 1974-08-20 | Thermogenics Of New York | Ink curing and drying apparatus |
US3811825A (en) * | 1972-11-03 | 1974-05-21 | Sowell J | Semiconductor wafer transport device |
US3967385A (en) * | 1974-08-26 | 1976-07-06 | National-Standard Company, Wagner-Litho Machinery Division | Utilization of heat pipes for cooling radiation curing systems |
CA1084235A (en) * | 1976-05-24 | 1980-08-26 | Ryo Enomoto | PROCESS AND AN APPARATUS FOR PRODUCING SILICON CARBIDE CONSISTING MAINLY OF .beta.-TYPE CRYSTAL |
US4246434A (en) * | 1978-12-20 | 1981-01-20 | Abar Corporation | Work support for vacuum electric furnaces |
DD143127A1 (en) * | 1979-04-20 | 1980-07-30 | Rolf Koenig | DEVICE FOR CARRYING OVER THERMAL WORK PROCESSES, ESPECIALLY IN THE SEMICONDUCTOR INDUSTRY |
US4347431A (en) * | 1980-07-25 | 1982-08-31 | Bell Telephone Laboratories, Inc. | Diffusion furnace |
JPS5862489A (en) * | 1981-10-07 | 1983-04-13 | 株式会社日立製作所 | Soft landing device |
JPS5878424A (en) * | 1981-11-05 | 1983-05-12 | Toshiba Ceramics Co Ltd | Mother boat for semiconductor diffusion furnace |
US4412812A (en) * | 1981-12-28 | 1983-11-01 | Mostek Corporation | Vertical semiconductor furnace |
US4423516A (en) * | 1982-03-22 | 1983-12-27 | Mellen Sr Robert H | Dynamic gradient furnace with controlled heat dissipation |
US4545327A (en) * | 1982-08-27 | 1985-10-08 | Anicon, Inc. | Chemical vapor deposition apparatus |
JPS5977289A (en) * | 1982-10-26 | 1984-05-02 | ウシオ電機株式会社 | Beam irradiating furnace |
US4526534A (en) * | 1983-06-01 | 1985-07-02 | Quartz Engineering & Materials, Inc. | Cantilever diffusion tube apparatus and method |
US4510609A (en) * | 1984-01-31 | 1985-04-09 | The United States Of America As Represented By The Secretary Of The Army | Furnace for vertical solidification of melt |
US5259881A (en) * | 1991-05-17 | 1993-11-09 | Materials Research Corporation | Wafer processing cluster tool batch preheating and degassing apparatus |
US4543059A (en) * | 1984-07-18 | 1985-09-24 | Quartz Engineering & Materials, Inc. | Slotted cantilever diffusion tube system and method and apparatus for loading |
US4702694A (en) * | 1984-08-31 | 1987-10-27 | Union Oil Company Of California | Furnace with modular construction |
GB2164438B (en) * | 1984-09-14 | 1988-07-27 | Aisin Seiki | Heat exchangers |
JPS61191015A (en) * | 1985-02-20 | 1986-08-25 | Hitachi Ltd | Semiconductor vapor growth and equipment thereof |
US4692115A (en) * | 1985-04-03 | 1987-09-08 | Thermco Systems, Inc. | Semiconductor wafer furnace door |
CA1251100A (en) * | 1985-05-17 | 1989-03-14 | Richard Cloutier | Chemical vapor deposition |
JPS6221229A (en) * | 1985-07-22 | 1987-01-29 | Hitachi Ltd | Treating device |
JPS62272525A (en) * | 1986-05-21 | 1987-11-26 | Hitachi Ltd | Heat treating apparatus |
US4802441A (en) * | 1987-01-08 | 1989-02-07 | Btu Engineering Corporation | Double wall fast cool-down furnace |
US4849608A (en) * | 1987-02-14 | 1989-07-18 | Dainippon Screen Mfg. Co., Ltd. | Apparatus for heat-treating wafers |
DE3719952A1 (en) * | 1987-06-15 | 1988-12-29 | Convac Gmbh | DEVICE FOR TREATING WAFERS IN THE PRODUCTION OF SEMICONDUCTOR ELEMENTS |
US4756091A (en) * | 1987-06-25 | 1988-07-12 | Herbert Van Denend | Hybrid high-velocity heated air/infra-red drying oven |
KR960001160B1 (en) * | 1987-07-31 | 1996-01-19 | 도오교오 에레구토론 가부시끼가이샤 | Heating furnace |
JPS6455821A (en) * | 1987-08-26 | 1989-03-02 | Dainippon Screen Mfg | Rapid cooling type heat treating apparatus |
EP0306967B1 (en) * | 1987-09-11 | 1997-04-16 | Hitachi, Ltd. | Apparatus for performing heat treatment on semiconductor wafers |
JPH0744159B2 (en) * | 1987-09-11 | 1995-05-15 | 株式会社日立製作所 | Semiconductor wafer heat treatment apparatus and heat treatment method |
JP2553364B2 (en) * | 1987-10-28 | 1996-11-13 | 東京エレクトロン株式会社 | Heat treatment equipment |
KR970008334B1 (en) * | 1988-02-24 | 1997-05-23 | Tokyo Electron Sagami Kk | Method and apparatus for heat treatment method |
KR960012876B1 (en) * | 1988-06-16 | 1996-09-25 | 도오교오 에레구토론 사가미 가부시끼가이샤 | Heat treating apparatus with cooling fluid nozzles |
US5117562A (en) * | 1989-04-14 | 1992-06-02 | Robert C. Dulay | Radiant energy ink drying device |
US5156820A (en) * | 1989-05-15 | 1992-10-20 | Rapro Technology, Inc. | Reaction chamber with controlled radiant energy heating and distributed reactant flow |
US4911638A (en) * | 1989-05-18 | 1990-03-27 | Direction Incorporated | Controlled diffusion environment capsule and system |
US5178534A (en) * | 1989-05-18 | 1993-01-12 | Bayne Christopher J | Controlled diffusion environment capsule and system |
US4976612A (en) * | 1989-06-20 | 1990-12-11 | Automated Wafer Systems | Purge tube with floating end cap for loading silicon wafers into a furnace |
JP2764436B2 (en) * | 1989-06-29 | 1998-06-11 | 東芝セラミックス株式会社 | Vertical diffusion furnace |
JP2958428B2 (en) * | 1989-07-15 | 1999-10-06 | 東芝セラミックス株式会社 | SiC protective tube for thermocouple |
US5099586A (en) * | 1989-09-08 | 1992-03-31 | W. R. Grace & Co.-Conn. | Reflector assembly for heating a substrate |
US5155336A (en) * | 1990-01-19 | 1992-10-13 | Applied Materials, Inc. | Rapid thermal heating apparatus and method |
US5252807A (en) * | 1990-07-02 | 1993-10-12 | George Chizinsky | Heated plate rapid thermal processor |
US5072094A (en) * | 1990-09-11 | 1991-12-10 | United States Department Of Energy | Tube furnace |
JP2998903B2 (en) * | 1990-11-14 | 2000-01-17 | 東京エレクトロン株式会社 | Heat treatment equipment |
US5174045A (en) * | 1991-05-17 | 1992-12-29 | Semitool, Inc. | Semiconductor processor with extendible receiver for handling multiple discrete wafers without wafer carriers |
-
1992
- 1992-06-15 US US07/898,552 patent/US5461214A/en not_active Expired - Lifetime
-
1993
- 1993-06-09 ES ES93916481T patent/ES2191665T3/en not_active Expired - Lifetime
- 1993-06-09 KR KR1019940704560A patent/KR100316069B1/en not_active IP Right Cessation
- 1993-06-09 WO PCT/US1993/005546 patent/WO1993026137A1/en active IP Right Grant
- 1993-06-09 JP JP6501711A patent/JPH07509345A/en active Pending
- 1993-06-09 AT AT93916481T patent/ATE231318T1/en not_active IP Right Cessation
- 1993-06-09 EP EP93916481A patent/EP0645072B1/en not_active Expired - Lifetime
- 1993-06-09 DE DE69332639T patent/DE69332639T2/en not_active Expired - Fee Related
-
1994
- 1994-04-21 US US08/230,598 patent/US5481088A/en not_active Expired - Lifetime
- 1994-04-21 US US08/230,706 patent/US5483041A/en not_active Expired - Lifetime
- 1994-04-21 US US08/230,786 patent/US5530222A/en not_active Expired - Lifetime
-
1995
- 1995-04-27 US US08/429,799 patent/US5517001A/en not_active Expired - Lifetime
-
2003
- 2003-03-24 JP JP2003122892A patent/JP2004006848A/en active Pending
-
2007
- 2007-07-30 JP JP2007197056A patent/JP2007295005A/en active Pending
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