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USD971167S1 - Lower shield for a substrate processing chamber - Google Patents

Lower shield for a substrate processing chamber Download PDF

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Publication number
USD971167S1
USD971167S1 US29/778,108 US202129778108F USD971167S US D971167 S1 USD971167 S1 US D971167S1 US 202129778108 F US202129778108 F US 202129778108F US D971167 S USD971167 S US D971167S
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US
United States
Prior art keywords
processing chamber
substrate processing
lower shield
view
shield
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/778,108
Inventor
Sarath Babu
Ananthkrishna Jupudi
Yueh Sheng Ow
Junqi Wei
Kelvin Boh
Yuichi Wada
Kang Zhang
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Materials Inc
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Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Priority to US29/778,108 priority Critical patent/USD971167S1/en
Assigned to APPLIED MATERIALS SINGAPORE TECHNOLOGY PTE. LTD. reassignment APPLIED MATERIALS SINGAPORE TECHNOLOGY PTE. LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: OW, Yueh Sheng, BOH, Kelvin, JUPUDI, ANANTHKRISHNA, WEI, JUNQI, BABU, Sarath, KANG, ZHANG
Assigned to APPLIED MATERIALS, INC. reassignment APPLIED MATERIALS, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: WADA, YUICHI
Assigned to APPLIED MATERIALS, INC. reassignment APPLIED MATERIALS, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: APPLIED MATERIALS SINGAPORE TECHNOLOGY PTE. LTD.
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Publication of USD971167S1 publication Critical patent/USD971167S1/en
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Description

FIG. 1 is a top isometric view of a lower shield for a substrate processing chamber, according to the novel design.
FIG. 2 is a top plan view thereof.
FIG. 3 is a bottom plan view thereof.
FIG. 4 is a front elevation view thereof.
FIG. 5 is a back elevation view thereof.
FIG. 6 is a right side elevation view thereof.
FIG. 7 is a left side elevation view thereof; and,
FIG. 8 is a cross-sectional view taken along line 8-8 in FIG. 2.
The broken lines show portions of a lower shield for a substrate processing chamber that form no part of the claimed design.

Claims (1)

    CLAIM
  1. The ornamental design for a lower shield for a substrate processing chamber, as shown and described.
US29/778,108 2019-08-28 2021-04-10 Lower shield for a substrate processing chamber Active USD971167S1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US29/778,108 USD971167S1 (en) 2019-08-28 2021-04-10 Lower shield for a substrate processing chamber

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US29/703,658 USD931241S1 (en) 2019-08-28 2019-08-28 Lower shield for a substrate processing chamber
US29/778,108 USD971167S1 (en) 2019-08-28 2021-04-10 Lower shield for a substrate processing chamber

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
US29/703,658 Division USD931241S1 (en) 2019-08-28 2019-08-28 Lower shield for a substrate processing chamber

Publications (1)

Publication Number Publication Date
USD971167S1 true USD971167S1 (en) 2022-11-29

Family

ID=75378497

Family Applications (2)

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US29/703,658 Active USD931241S1 (en) 2019-08-28 2019-08-28 Lower shield for a substrate processing chamber
US29/778,108 Active USD971167S1 (en) 2019-08-28 2021-04-10 Lower shield for a substrate processing chamber

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US29/703,658 Active USD931241S1 (en) 2019-08-28 2019-08-28 Lower shield for a substrate processing chamber

Country Status (3)

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US (2) USD931241S1 (en)
JP (2) JP1683052S (en)
TW (2) TWD211584S (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD1042373S1 (en) 2022-03-18 2024-09-17 Applied Materials, Inc. Sliding ring for an interlocking process kit for a substrate processing chamber
USD1042374S1 (en) 2022-03-18 2024-09-17 Applied Materials, Inc. Support pipe for an interlocking process kit for a substrate processing chamber

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USD557226S1 (en) * 2005-08-25 2007-12-11 Hitachi High-Technologies Corporation Electrode cover for a plasma processing apparatus
USD557425S1 (en) * 2005-08-25 2007-12-11 Hitachi High-Technologies Corporation Cover ring for a plasma processing apparatus
USD559994S1 (en) * 2005-03-30 2008-01-15 Tokyo Electron Limited Cover ring
US20090188625A1 (en) 2008-01-28 2009-07-30 Carducci James D Etching chamber having flow equalizer and lower liner
US20100291319A1 (en) 2007-09-29 2010-11-18 Tokyo Electron Limited Plasma processing apparatus and plasma processing method
US20110108524A1 (en) 2009-08-31 2011-05-12 Rajinder Dhindsa Local plasma confinement and pressure control arrangement and methods thereof
US7988815B2 (en) 2007-07-26 2011-08-02 Applied Materials, Inc. Plasma reactor with reduced electrical skew using electrical bypass elements
US20110207332A1 (en) 2010-02-25 2011-08-25 Taiwan Semiconductor Manufacturing Co., Ltd. Thin film coated process kits for semiconductor manufacturing tools
US20120305185A1 (en) 2011-05-31 2012-12-06 Applied Materials, Inc. Apparatus and methods for dry etch with edge, side and back protection
WO2014014566A1 (en) 2012-07-20 2014-01-23 Applied Materials, Inc. Symmetrical inductively coupled plasma source with symmetrical flow chamber
USD720051S1 (en) * 2011-01-20 2014-12-23 Victaulic Company Pipe element
TWD167109S (en) 2013-05-15 2015-04-11 荏原製作所股份有限公司 Substrate retaining ring
USD741449S1 (en) * 2014-08-19 2015-10-20 Nuvo Residential, Llc Chemical release cartridge
USD741823S1 (en) * 2013-07-10 2015-10-27 Hitachi Kokusai Electric Inc. Vaporizer for substrate processing apparatus
USD749702S1 (en) * 2014-02-06 2016-02-16 David M. Rohn Drain pipe discharge connector
USD770992S1 (en) * 2015-06-12 2016-11-08 Hitachi High-Technologies Corporation Electrode cover for a plasma processing apparatus
TWD179672S (en) 2015-10-06 2016-11-21 荏原製作所股份有限公司 Part of the substrate retaining ring
USD784901S1 (en) * 2015-05-29 2017-04-25 Marine Town Inc. Motorwell drain
USD791090S1 (en) * 2015-09-04 2017-07-04 Hitachi Kokusai Electric Inc. Reaction tube
USD795664S1 (en) * 2012-11-07 2017-08-29 Albion Engineering Sleeve for loading bulk viscous material from a container into a dispensing device
USD798423S1 (en) * 2015-12-21 2017-09-26 Ipex Technologies Inc. Pipe with extended bell portion
USD799690S1 (en) * 2014-12-22 2017-10-10 Ebara Corporation Inner cylinder for exhaust gas treatment apparatus
US9865437B2 (en) 2014-12-30 2018-01-09 Applied Materials, Inc. High conductance process kit
US20180061618A1 (en) 2016-08-26 2018-03-01 Applied Materials, Inc. Plasma screen for plasma processing chamber
USD815516S1 (en) * 2014-09-02 2018-04-17 General Electric Company Connector joint
USD816191S1 (en) * 2016-06-13 2018-04-24 5132887 Manitoba Ltd. Plumbing fitting
USD827592S1 (en) * 2017-01-31 2018-09-04 Hitachi High-Technologies Corporation Electrode cover for a plasma processing apparatus
USD836573S1 (en) * 2017-01-31 2018-12-25 Hitachi High-Technologies Corporation Ring for a plasma processing apparatus
USD840364S1 (en) * 2017-01-31 2019-02-12 Hitachi High-Technologies Corporation Electrode cover for a plasma processing apparatus
USD840365S1 (en) * 2017-01-31 2019-02-12 Hitachi High-Technologies Corporation Cover ring for a plasma processing apparatus
USD841782S1 (en) * 2017-02-28 2019-02-26 Nitto Kohki Co., Ltd. Plug for a pipe coupling
USD849442S1 (en) * 2017-02-13 2019-05-28 Steven D. Mathison Paper towel roll core
USD852136S1 (en) * 2014-10-17 2019-06-25 Ebara Corporation Rotor for rotary electrical machine
USD861758S1 (en) * 2017-07-10 2019-10-01 Lincoln Global, Inc. Vented plasma cutting electrode
USD875053S1 (en) * 2017-04-28 2020-02-11 Applied Materials, Inc. Plasma connector liner
USD875055S1 (en) * 2017-04-28 2020-02-11 Applied Materials, Inc. Plasma connector liner
USD875054S1 (en) * 2017-04-28 2020-02-11 Applied Materials, Inc. Plasma connector liner

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070113783A1 (en) * 2005-11-19 2007-05-24 Applied Materials, Inc. Band shield for substrate processing chamber
USD642605S1 (en) * 2010-04-02 2011-08-02 Applied Materials, Inc. Lid assembly for a substrate processing chamber
USD703160S1 (en) * 2011-01-27 2014-04-22 Hitachi High-Technologies Corporation Grounded electrode for a plasma processing apparatus
USD716239S1 (en) * 2013-11-06 2014-10-28 Applied Materials, Inc. Upper chamber liner
JP1551512S (en) * 2015-06-12 2016-06-13
JP1546799S (en) * 2015-06-12 2016-03-28
JP1564934S (en) * 2016-02-26 2016-12-05
USD830981S1 (en) * 2017-04-07 2018-10-16 Asm Ip Holding B.V. Susceptor for semiconductor substrate processing apparatus
JP1598442S (en) * 2017-08-09 2018-02-26
JP1620194S (en) * 2018-01-22 2018-12-10
USD891382S1 (en) * 2019-02-08 2020-07-28 Applied Materials, Inc. Process shield for a substrate processing chamber
USD893441S1 (en) * 2019-06-28 2020-08-18 Applied Materials, Inc. Base plate for a processing chamber substrate support

Patent Citations (44)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6733620B1 (en) 1998-03-06 2004-05-11 Tokyo Electron Limited Process apparatus
US20020170881A1 (en) 2001-05-16 2002-11-21 Lam Research Hollow anode plasma reactor and method
USD467648S1 (en) * 2002-01-23 2002-12-24 Delva O'neil In-line drain trap
US20040149216A1 (en) 2002-11-13 2004-08-05 Anelva Corporation Plasma processing apparatus
USD494551S1 (en) * 2002-12-12 2004-08-17 Tokyo Electron Limited Exhaust ring for manufacturing semiconductors
JP2006060073A (en) 2004-08-20 2006-03-02 Tokyo Electron Ltd Plasma processing equipment
US20060213438A1 (en) 2005-03-28 2006-09-28 Tokyo Electron Limited Plasma enhanced atomic layer deposition system
USD559994S1 (en) * 2005-03-30 2008-01-15 Tokyo Electron Limited Cover ring
USD557226S1 (en) * 2005-08-25 2007-12-11 Hitachi High-Technologies Corporation Electrode cover for a plasma processing apparatus
USD557425S1 (en) * 2005-08-25 2007-12-11 Hitachi High-Technologies Corporation Cover ring for a plasma processing apparatus
US7988815B2 (en) 2007-07-26 2011-08-02 Applied Materials, Inc. Plasma reactor with reduced electrical skew using electrical bypass elements
US20100291319A1 (en) 2007-09-29 2010-11-18 Tokyo Electron Limited Plasma processing apparatus and plasma processing method
US20090188625A1 (en) 2008-01-28 2009-07-30 Carducci James D Etching chamber having flow equalizer and lower liner
US20110108524A1 (en) 2009-08-31 2011-05-12 Rajinder Dhindsa Local plasma confinement and pressure control arrangement and methods thereof
US20110207332A1 (en) 2010-02-25 2011-08-25 Taiwan Semiconductor Manufacturing Co., Ltd. Thin film coated process kits for semiconductor manufacturing tools
USD720051S1 (en) * 2011-01-20 2014-12-23 Victaulic Company Pipe element
US20120305185A1 (en) 2011-05-31 2012-12-06 Applied Materials, Inc. Apparatus and methods for dry etch with edge, side and back protection
WO2014014566A1 (en) 2012-07-20 2014-01-23 Applied Materials, Inc. Symmetrical inductively coupled plasma source with symmetrical flow chamber
USD795664S1 (en) * 2012-11-07 2017-08-29 Albion Engineering Sleeve for loading bulk viscous material from a container into a dispensing device
TWD167109S (en) 2013-05-15 2015-04-11 荏原製作所股份有限公司 Substrate retaining ring
USD741823S1 (en) * 2013-07-10 2015-10-27 Hitachi Kokusai Electric Inc. Vaporizer for substrate processing apparatus
USD749702S1 (en) * 2014-02-06 2016-02-16 David M. Rohn Drain pipe discharge connector
USD741449S1 (en) * 2014-08-19 2015-10-20 Nuvo Residential, Llc Chemical release cartridge
USD815516S1 (en) * 2014-09-02 2018-04-17 General Electric Company Connector joint
USD852136S1 (en) * 2014-10-17 2019-06-25 Ebara Corporation Rotor for rotary electrical machine
USD799690S1 (en) * 2014-12-22 2017-10-10 Ebara Corporation Inner cylinder for exhaust gas treatment apparatus
US9865437B2 (en) 2014-12-30 2018-01-09 Applied Materials, Inc. High conductance process kit
USD784901S1 (en) * 2015-05-29 2017-04-25 Marine Town Inc. Motorwell drain
USD770992S1 (en) * 2015-06-12 2016-11-08 Hitachi High-Technologies Corporation Electrode cover for a plasma processing apparatus
USD791090S1 (en) * 2015-09-04 2017-07-04 Hitachi Kokusai Electric Inc. Reaction tube
TWD179672S (en) 2015-10-06 2016-11-21 荏原製作所股份有限公司 Part of the substrate retaining ring
USD798423S1 (en) * 2015-12-21 2017-09-26 Ipex Technologies Inc. Pipe with extended bell portion
USD816191S1 (en) * 2016-06-13 2018-04-24 5132887 Manitoba Ltd. Plumbing fitting
US20180061618A1 (en) 2016-08-26 2018-03-01 Applied Materials, Inc. Plasma screen for plasma processing chamber
USD840364S1 (en) * 2017-01-31 2019-02-12 Hitachi High-Technologies Corporation Electrode cover for a plasma processing apparatus
USD836573S1 (en) * 2017-01-31 2018-12-25 Hitachi High-Technologies Corporation Ring for a plasma processing apparatus
USD840365S1 (en) * 2017-01-31 2019-02-12 Hitachi High-Technologies Corporation Cover ring for a plasma processing apparatus
USD827592S1 (en) * 2017-01-31 2018-09-04 Hitachi High-Technologies Corporation Electrode cover for a plasma processing apparatus
USD849442S1 (en) * 2017-02-13 2019-05-28 Steven D. Mathison Paper towel roll core
USD841782S1 (en) * 2017-02-28 2019-02-26 Nitto Kohki Co., Ltd. Plug for a pipe coupling
USD875053S1 (en) * 2017-04-28 2020-02-11 Applied Materials, Inc. Plasma connector liner
USD875055S1 (en) * 2017-04-28 2020-02-11 Applied Materials, Inc. Plasma connector liner
USD875054S1 (en) * 2017-04-28 2020-02-11 Applied Materials, Inc. Plasma connector liner
USD861758S1 (en) * 2017-07-10 2019-10-01 Lincoln Global, Inc. Vented plasma cutting electrode

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
International Search Report and Written Opinion for PCT/US2020/048303 dated Dec. 4, 2020.
Search Report for Taiwan Design Application No. 109300802, dated Aug. 5, 2020.

Also Published As

Publication number Publication date
JP1684624S (en) 2021-05-10
TWD211584S (en) 2021-05-11
JP1683052S (en) 2021-04-12
USD931241S1 (en) 2021-09-21
TWD211387S (en) 2021-05-11

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