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USD741823S1 - Vaporizer for substrate processing apparatus - Google Patents

Vaporizer for substrate processing apparatus Download PDF

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Publication number
USD741823S1
USD741823S1 US29/478,836 US201429478836F USD741823S US D741823 S1 USD741823 S1 US D741823S1 US 201429478836 F US201429478836 F US 201429478836F US D741823 S USD741823 S US D741823S
Authority
US
United States
Prior art keywords
vaporizer
processing apparatus
substrate processing
view
elevational view
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/478,836
Inventor
Hideto TATENO
Daisuke Hara
Masahisa OKUNO
Takuya JODA
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kokusai Electric Corp
Original Assignee
Hitachi Kokusai Electric Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Kokusai Electric Inc filed Critical Hitachi Kokusai Electric Inc
Assigned to HITACHI KOKUSAI ELECTRIC INC. reassignment HITACHI KOKUSAI ELECTRIC INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: HARA, DAISUKE, JODA, TAKUYA, OKUNO, MASAHISA, TATENO, HIDETO
Application granted granted Critical
Publication of USD741823S1 publication Critical patent/USD741823S1/en
Assigned to Kokusai Electric Corporation reassignment Kokusai Electric Corporation ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: HITACHI KOKUSAI ELECTRIC INC.
Active legal-status Critical Current
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Description

FIG. 1 is a front, perspective view of a vaporizer for substrate processing apparatus showing our new design;
FIG. 2 is a front, bottom perspective view thereof;
FIG. 3 is a front elevational view thereof, the back elevation view being the same therefore omitted;
FIG. 4 is a left side elevational view thereof, the right side elevation view being the same therefore omitted;
FIG. 5 is a top plan view thereof;
FIG. 6 is a bottom plan view thereof; and,
FIG. 7 is a cross-sectional view taken along line 7-7 in FIG. 5.
The back elevational view is the same as the front elevational view and has, therefore, been omitted; the right side elevational view is the same as the left side elevational view and has, therefore been omitted.

Claims (1)

    CLAIM
  1. The ornamental design for a vaporizer for substrate processing apparatus, as shown and described.
US29/478,836 2013-07-10 2014-01-09 Vaporizer for substrate processing apparatus Active USD741823S1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013-015793 2013-01-30
JP2013015793 2013-07-10

Publications (1)

Publication Number Publication Date
USD741823S1 true USD741823S1 (en) 2015-10-27

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ID=54328593

Family Applications (1)

Application Number Title Priority Date Filing Date
US29/478,836 Active USD741823S1 (en) 2013-07-10 2014-01-09 Vaporizer for substrate processing apparatus

Country Status (2)

Country Link
US (1) USD741823S1 (en)
TW (1) TWD169790S (en)

Cited By (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD795315S1 (en) * 2014-12-12 2017-08-22 Ebara Corporation Dresser disk
USD797067S1 (en) * 2015-04-21 2017-09-12 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD798248S1 (en) * 2015-06-18 2017-09-26 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD801942S1 (en) * 2015-04-16 2017-11-07 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD802545S1 (en) * 2015-06-12 2017-11-14 Hitachi High-Technologies Corporation Lower chamber for a plasma processing apparatus
USD803917S1 (en) * 2015-06-16 2017-11-28 Hitachi Kokusai Electric, Inc. Heat reflector for substrate processing apparatus
USD804556S1 (en) * 2015-06-16 2017-12-05 Hitachi Kokusai Electric Inc. Heat reflector for substrate processing apparatus
USD836572S1 (en) * 2016-09-30 2018-12-25 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD851613S1 (en) 2017-10-05 2019-06-18 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD858468S1 (en) * 2018-03-16 2019-09-03 Applied Materials, Inc. Collimator for a physical vapor deposition chamber
USD859333S1 (en) * 2018-03-16 2019-09-10 Applied Materials, Inc. Collimator for a physical vapor deposition chamber
USD868124S1 (en) 2017-12-11 2019-11-26 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD875053S1 (en) * 2017-04-28 2020-02-11 Applied Materials, Inc. Plasma connector liner
USD875054S1 (en) * 2017-04-28 2020-02-11 Applied Materials, Inc. Plasma connector liner
USD875055S1 (en) * 2017-04-28 2020-02-11 Applied Materials, Inc. Plasma connector liner
USD877101S1 (en) 2018-03-09 2020-03-03 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD908645S1 (en) 2019-08-26 2021-01-26 Applied Materials, Inc. Sputtering target for a physical vapor deposition chamber
USD923241S1 (en) * 2018-05-29 2021-06-22 Pax Labs, Inc. Vaporizer cartridge container
USD933725S1 (en) 2019-02-08 2021-10-19 Applied Materials, Inc. Deposition ring for a substrate processing chamber
USD936187S1 (en) * 2020-02-12 2021-11-16 Applied Materials, Inc. Gas distribution assembly lid
USD937329S1 (en) 2020-03-23 2021-11-30 Applied Materials, Inc. Sputter target for a physical vapor deposition chamber
USD940765S1 (en) 2020-12-02 2022-01-11 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD941372S1 (en) * 2020-03-20 2022-01-18 Applied Materials, Inc. Process shield for a substrate processing chamber
USD941371S1 (en) * 2020-03-20 2022-01-18 Applied Materials, Inc. Process shield for a substrate processing chamber
USD942516S1 (en) * 2019-02-08 2022-02-01 Applied Materials, Inc. Process shield for a substrate processing chamber
USD971167S1 (en) * 2019-08-28 2022-11-29 Applied Materials, Inc. Lower shield for a substrate processing chamber
USD997111S1 (en) 2021-12-15 2023-08-29 Applied Materials, Inc. Collimator for use in a physical vapor deposition (PVD) chamber
USD998575S1 (en) 2020-04-07 2023-09-12 Applied Materials, Inc. Collimator for use in a physical vapor deposition (PVD) chamber
USD1007449S1 (en) 2021-05-07 2023-12-12 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD1009943S1 (en) * 2022-03-22 2024-01-02 Schott Ag Air bag detonator
USD1009816S1 (en) 2021-08-29 2024-01-02 Applied Materials, Inc. Collimator for a physical vapor deposition chamber
USD1037778S1 (en) 2022-07-19 2024-08-06 Applied Materials, Inc. Gas distribution plate
USD1038901S1 (en) 2022-01-12 2024-08-13 Applied Materials, Inc. Collimator for a physical vapor deposition chamber

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US3026587A (en) * 1955-06-28 1962-03-27 Spencer William Robert Magnetic rubber tobacco priming bands
US4803948A (en) * 1986-04-14 1989-02-14 Dainippon Screen Mfg. Co., Ltd. Heat processing apparatus for semiconductor manufacturing
US4906207A (en) * 1989-04-24 1990-03-06 W. L. Gore & Associates, Inc. Dielectric restrainer
USD404372S (en) * 1997-08-20 1999-01-19 Tokyo Electron Limited Ring for use in a semiconductor wafer heat processing apparatus
USD404370S (en) * 1997-08-20 1999-01-19 Tokyo Electron Limited Cap for use in a semiconductor wafer heat processing apparatus
US20030066484A1 (en) * 2001-09-26 2003-04-10 Kawasaki Microelectronics, Inc. Electrode cover, plasma apparatus utilizing the cover, and method of fitting the cover onto the plasma electrode
US6746240B2 (en) * 2002-03-15 2004-06-08 Asm International N.V. Process tube support sleeve with circumferential channels
US6815352B1 (en) * 1999-11-09 2004-11-09 Shin-Etsu Chemical Co., Ltd. Silicon focus ring and method for producing the same
US20070113783A1 (en) * 2005-11-19 2007-05-24 Applied Materials, Inc. Band shield for substrate processing chamber
USD556704S1 (en) * 2005-08-25 2007-12-04 Hitachi High-Technologies Corporation Grounded electrode for a plasma processing apparatus
USD557226S1 (en) * 2005-08-25 2007-12-11 Hitachi High-Technologies Corporation Electrode cover for a plasma processing apparatus
USD559993S1 (en) * 2005-03-30 2008-01-15 Tokyo Electron Limited Cover ring
USD559994S1 (en) * 2005-03-30 2008-01-15 Tokyo Electron Limited Cover ring
USD588078S1 (en) * 2006-06-16 2009-03-10 Tokyo Electron Limited Heat dissipation deterrence link for semiconductor manufacture
USD600722S1 (en) * 2008-05-07 2009-09-22 Komatsu Ltd. Fan shroud for construction machinery
USD605206S1 (en) * 2008-05-07 2009-12-01 Komatsu Ltd. Fan shroud for construction machinery
US8617672B2 (en) * 2005-07-13 2013-12-31 Applied Materials, Inc. Localized surface annealing of components for substrate processing chambers
USD699199S1 (en) * 2011-09-30 2014-02-11 Tokyo Electron Limited Electrode plate for a plasma processing apparatus
USD699200S1 (en) * 2011-09-30 2014-02-11 Tokyo Electron Limited Electrode member for a plasma processing apparatus
USD703160S1 (en) * 2011-01-27 2014-04-22 Hitachi High-Technologies Corporation Grounded electrode for a plasma processing apparatus
USD709539S1 (en) * 2011-09-30 2014-07-22 Tokyo Electron Limited Focusing ring
USD709537S1 (en) * 2011-09-30 2014-07-22 Tokyo Electron Limited Focusing ring
USD709538S1 (en) * 2011-09-30 2014-07-22 Tokyo Electron Limited Focusing ring
USD709536S1 (en) * 2011-09-30 2014-07-22 Tokyo Electron Limited Focusing ring
USD711331S1 (en) * 2013-11-07 2014-08-19 Applied Materials, Inc. Upper chamber liner
USD713363S1 (en) * 2013-12-31 2014-09-16 Celadon Systems, Inc. Support for a probe test core

Patent Citations (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3026587A (en) * 1955-06-28 1962-03-27 Spencer William Robert Magnetic rubber tobacco priming bands
US4803948A (en) * 1986-04-14 1989-02-14 Dainippon Screen Mfg. Co., Ltd. Heat processing apparatus for semiconductor manufacturing
US4906207A (en) * 1989-04-24 1990-03-06 W. L. Gore & Associates, Inc. Dielectric restrainer
USD404372S (en) * 1997-08-20 1999-01-19 Tokyo Electron Limited Ring for use in a semiconductor wafer heat processing apparatus
USD404370S (en) * 1997-08-20 1999-01-19 Tokyo Electron Limited Cap for use in a semiconductor wafer heat processing apparatus
US6815352B1 (en) * 1999-11-09 2004-11-09 Shin-Etsu Chemical Co., Ltd. Silicon focus ring and method for producing the same
US20030066484A1 (en) * 2001-09-26 2003-04-10 Kawasaki Microelectronics, Inc. Electrode cover, plasma apparatus utilizing the cover, and method of fitting the cover onto the plasma electrode
US6746240B2 (en) * 2002-03-15 2004-06-08 Asm International N.V. Process tube support sleeve with circumferential channels
USD559994S1 (en) * 2005-03-30 2008-01-15 Tokyo Electron Limited Cover ring
USD559993S1 (en) * 2005-03-30 2008-01-15 Tokyo Electron Limited Cover ring
US8617672B2 (en) * 2005-07-13 2013-12-31 Applied Materials, Inc. Localized surface annealing of components for substrate processing chambers
USD557226S1 (en) * 2005-08-25 2007-12-11 Hitachi High-Technologies Corporation Electrode cover for a plasma processing apparatus
USD556704S1 (en) * 2005-08-25 2007-12-04 Hitachi High-Technologies Corporation Grounded electrode for a plasma processing apparatus
US20070113783A1 (en) * 2005-11-19 2007-05-24 Applied Materials, Inc. Band shield for substrate processing chamber
USD588078S1 (en) * 2006-06-16 2009-03-10 Tokyo Electron Limited Heat dissipation deterrence link for semiconductor manufacture
USD600722S1 (en) * 2008-05-07 2009-09-22 Komatsu Ltd. Fan shroud for construction machinery
USD605206S1 (en) * 2008-05-07 2009-12-01 Komatsu Ltd. Fan shroud for construction machinery
USD703160S1 (en) * 2011-01-27 2014-04-22 Hitachi High-Technologies Corporation Grounded electrode for a plasma processing apparatus
USD699199S1 (en) * 2011-09-30 2014-02-11 Tokyo Electron Limited Electrode plate for a plasma processing apparatus
USD699200S1 (en) * 2011-09-30 2014-02-11 Tokyo Electron Limited Electrode member for a plasma processing apparatus
USD709539S1 (en) * 2011-09-30 2014-07-22 Tokyo Electron Limited Focusing ring
USD709537S1 (en) * 2011-09-30 2014-07-22 Tokyo Electron Limited Focusing ring
USD709538S1 (en) * 2011-09-30 2014-07-22 Tokyo Electron Limited Focusing ring
USD709536S1 (en) * 2011-09-30 2014-07-22 Tokyo Electron Limited Focusing ring
USD711331S1 (en) * 2013-11-07 2014-08-19 Applied Materials, Inc. Upper chamber liner
USD713363S1 (en) * 2013-12-31 2014-09-16 Celadon Systems, Inc. Support for a probe test core

Cited By (42)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD795315S1 (en) * 2014-12-12 2017-08-22 Ebara Corporation Dresser disk
USD801942S1 (en) * 2015-04-16 2017-11-07 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD837755S1 (en) * 2015-04-16 2019-01-08 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD825504S1 (en) 2015-04-21 2018-08-14 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD797067S1 (en) * 2015-04-21 2017-09-12 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD802545S1 (en) * 2015-06-12 2017-11-14 Hitachi High-Technologies Corporation Lower chamber for a plasma processing apparatus
USD804556S1 (en) * 2015-06-16 2017-12-05 Hitachi Kokusai Electric Inc. Heat reflector for substrate processing apparatus
USD803917S1 (en) * 2015-06-16 2017-11-28 Hitachi Kokusai Electric, Inc. Heat reflector for substrate processing apparatus
USD825505S1 (en) * 2015-06-18 2018-08-14 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD798248S1 (en) * 2015-06-18 2017-09-26 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD869409S1 (en) 2016-09-30 2019-12-10 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD836572S1 (en) * 2016-09-30 2018-12-25 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD875055S1 (en) * 2017-04-28 2020-02-11 Applied Materials, Inc. Plasma connector liner
USD875054S1 (en) * 2017-04-28 2020-02-11 Applied Materials, Inc. Plasma connector liner
USD875053S1 (en) * 2017-04-28 2020-02-11 Applied Materials, Inc. Plasma connector liner
USD894137S1 (en) 2017-10-05 2020-08-25 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD851613S1 (en) 2017-10-05 2019-06-18 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD868124S1 (en) 2017-12-11 2019-11-26 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD946638S1 (en) 2017-12-11 2022-03-22 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD877101S1 (en) 2018-03-09 2020-03-03 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD902165S1 (en) 2018-03-09 2020-11-17 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD859333S1 (en) * 2018-03-16 2019-09-10 Applied Materials, Inc. Collimator for a physical vapor deposition chamber
USD858468S1 (en) * 2018-03-16 2019-09-03 Applied Materials, Inc. Collimator for a physical vapor deposition chamber
USD923241S1 (en) * 2018-05-29 2021-06-22 Pax Labs, Inc. Vaporizer cartridge container
USD942516S1 (en) * 2019-02-08 2022-02-01 Applied Materials, Inc. Process shield for a substrate processing chamber
USD933725S1 (en) 2019-02-08 2021-10-19 Applied Materials, Inc. Deposition ring for a substrate processing chamber
USD908645S1 (en) 2019-08-26 2021-01-26 Applied Materials, Inc. Sputtering target for a physical vapor deposition chamber
USD971167S1 (en) * 2019-08-28 2022-11-29 Applied Materials, Inc. Lower shield for a substrate processing chamber
USD936187S1 (en) * 2020-02-12 2021-11-16 Applied Materials, Inc. Gas distribution assembly lid
USD941372S1 (en) * 2020-03-20 2022-01-18 Applied Materials, Inc. Process shield for a substrate processing chamber
USD941371S1 (en) * 2020-03-20 2022-01-18 Applied Materials, Inc. Process shield for a substrate processing chamber
USD937329S1 (en) 2020-03-23 2021-11-30 Applied Materials, Inc. Sputter target for a physical vapor deposition chamber
USD970566S1 (en) 2020-03-23 2022-11-22 Applied Materials, Inc. Sputter target for a physical vapor deposition chamber
USD998575S1 (en) 2020-04-07 2023-09-12 Applied Materials, Inc. Collimator for use in a physical vapor deposition (PVD) chamber
USD966357S1 (en) 2020-12-02 2022-10-11 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD940765S1 (en) 2020-12-02 2022-01-11 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD1007449S1 (en) 2021-05-07 2023-12-12 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD1009816S1 (en) 2021-08-29 2024-01-02 Applied Materials, Inc. Collimator for a physical vapor deposition chamber
USD997111S1 (en) 2021-12-15 2023-08-29 Applied Materials, Inc. Collimator for use in a physical vapor deposition (PVD) chamber
USD1038901S1 (en) 2022-01-12 2024-08-13 Applied Materials, Inc. Collimator for a physical vapor deposition chamber
USD1009943S1 (en) * 2022-03-22 2024-01-02 Schott Ag Air bag detonator
USD1037778S1 (en) 2022-07-19 2024-08-06 Applied Materials, Inc. Gas distribution plate

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